Capacitor structure and chip assembly

Abstract

The invention discloses a capacitor structure and a chip assembly, and the capacitor structure is used for being installed between a first element and a second element, and comprises a structure main body which is provided with a first surface and a second surface which are away from each other; the capacitor body is arranged in the structure main body, the capacitor body is connected with a positive electrode conductive part and a negative electrode conductive part, and the positive electrode conductive part and the negative electrode conductive part both extend to the first surface and are suitable for being electrically connected with the first element; and the electric connector penetrates through the structure main body, one end of the electric connector is used for being electrically connected with the first element, and the other end of the electric connector is used for being electrically connected with the second element. According to the capacitor structure provided by the embodiment of the invention, the capacitor structure is arranged between the first element and the second element, and the positive conductive part and the negative conductive part which are connected with the capacitor body are simultaneously connected with the first element, so that the capacitor structure can play a role in filtering, and the distance between the capacitor structure and the first element can be reduced; the filtering performance of the capacitor structure is improved.

Description

Technical Field

[0001] The present invention relates to the field of chip technology, and in particular to a capacitor structure and a chip component comprising the capacitor structure. Background Art

[0002] As a solution for high-computing chip packaging, 2.5D packaging often connects a main chip and multiple memory chips to an adapter board through bumps. The chip power supply requires an external capacitor to filter high-frequency noise. The path between the chip power supply and the external capacitor introduces additional resistance and inductance, which affects the filtering performance of the capacitor. Therefore, in order to minimize the introduced resistance and inductance, the most direct way is to shorten the path between the capacitor and the chip power supply. Currently, for 2.5D packaging, deep groove capacitors can be added to the adapter board, but after the chips are stacked, the distance between the higher stacked chips and the capacitors is still large, which affects the filtering performance of the capacitors. There is room for improvement. Summary of the invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a capacitor structure, which can play a filtering role, improve the filtering performance of the capacitor structure, and improve the connection reliability between the first element and the second element.

[0004] According to the capacitor structure of the embodiment of the present invention, the capacitor structure is used to be installed between a first element and a second element, and includes: a structural body, the structural body having a first surface and a second surface that are opposite to each other; a capacitor body, the capacitor body is arranged in the structural body, the capacitor body is connected with a positive conductive part and a negative conductive part, the positive conductive part and the negative conductive part both extend to the first surface and are suitable for being electrically connected to the first element respectively; an electrical connector, the electrical connector is passed through the structural body, one end of the electrical connector extends to the first surface for being electrically connected to the first element, and the other end of the electrical connector extends to the second surface for being electrically connected to the second element.

[0005] According to the capacitor structure of the embodiment of the present invention, by arranging the capacitor structure between the first element and the second element, and connecting the positive conductive part and the negative conductive part connected to the capacitor body to the first element at the same time, the capacitor structure can play a filtering role, and can reduce the distance between the capacitor structure and the first element, thereby improving the filtering performance of the capacitor structure, and the part of the first element blocked by the capacitor structure can be connected to the second element through the electrical connector, thereby improving the connection reliability between the two.

[0006] According to some embodiments of the capacitor structure of the present invention, the structural body includes a first insulating layer, a substrate layer and a second insulating layer, the substrate layer is arranged between the first insulating layer and the second insulating layer, the surfaces of the first insulating layer and the second insulating layer facing away from each other are respectively constructed as the first surface and the second surface, the first insulating layer and the substrate layer jointly form a accommodating space, and the capacitor body is located in the accommodating space.

[0007] According to the capacitor structure of some embodiments of the present invention, the substrate layer is formed with a first accommodating groove open toward the first insulating layer, the first insulating layer is formed with a second accommodating groove connected to the first accommodating groove, a portion of the capacitor body is located in the first accommodating groove, and another portion of the capacitor body is located in the second accommodating groove to be connected to the positive conductive portion and the negative conductive portion.

[0008] According to the capacitor structure of some embodiments of the present invention, there are at least two first accommodating grooves, at least two of which are spaced apart and respectively connected to the second accommodating grooves, and the capacitor body includes at least two capacitor segments, and at least two of the capacitor segments are accommodated in at least two of the first accommodating grooves in a one-to-one correspondence.

[0009] According to the capacitor structure of some embodiments of the present invention, an insulating layer is filled between the capacitor body and the inner wall of the first receiving sink, and / or an insulating layer is filled between the capacitor body and the inner wall of the second receiving sink.

[0010] According to the capacitor structure of some embodiments of the present invention, the capacitor body includes a positive electrode layer, an intermediate insulating layer and a negative electrode layer, the positive electrode layer and the negative electrode layer are stacked and distributed, and the intermediate insulating layer is arranged between the positive electrode layer and the negative electrode layer; wherein, the positive electrode conductive parts are two and are respectively connected to the two ends of the positive electrode layer, and the negative electrode conductive parts are two and are respectively connected to the two ends of the negative electrode layer.

[0011] According to the capacitor structure of some embodiments of the present invention, the electrical connector includes a first connecting segment, an intermediate penetrating segment and a second connecting segment connected in sequence, the intermediate penetrating segment penetrates the substrate layer, the first connecting segment is located in the first insulating layer and is used to be electrically connected to the first element, and the second connecting segment is located in the second insulating layer and is used to be electrically connected to the second element.

[0012] According to some embodiments of the capacitor structure of the present invention, there are at least two electrical connectors, and at least two of the electrical connectors are located on both sides of the capacitor.

[0013] The invention also provides a chip assembly.

[0014] A chip assembly according to an embodiment of the present invention includes the capacitor structure described in any one of the above embodiments.

[0015] According to some embodiments of the present invention, the chip assembly further includes a chip and an adapter board, the capacitor structure is arranged between the chip and the adapter board, the chip is configured as the first element, and the adapter board is configured as the second element.

[0016] According to the chip assembly of some embodiments of the present invention, there are multiple chips, and the multiple chips are stacked and distributed on the same side of the adapter board; wherein the capacitor structure is provided between two adjacent chips, and the one of the two adjacent chips far away from the adapter board is constructed as the first element, and the one close to the adapter board is constructed as the second element.

[0017] The chip assembly and the above-mentioned capacitor structure have the same advantages over the prior art, which will not be described in detail here.

[0018] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0020] Figure 1 is a schematic structural diagram of a capacitor structure according to an embodiment of the present invention;

[0021] Figure 2 is a partial schematic diagram of a chip assembly according to an embodiment of the present invention Figure 1 ;

[0022] Figure 3 is a partial schematic diagram of a chip assembly according to an embodiment of the present invention Figure 2 .

[0023] Reference numerals:

[0024] Capacitor structure 100, chip component 200,

[0025] Structural body 1, first surface 11, second surface 12, first insulating layer 13, second receiving sink 131, substrate layer 14, first receiving sink 141, second insulating layer 15, receiving space 16,

[0026] Capacitor 2, positive electrode conductive part 21, negative electrode conductive part 22, capacitor segment 23, insulating layer 24, positive electrode layer 25, intermediate insulating layer 26, negative electrode layer 27,

[0027] The electrical connector 3 has a first connecting section 31, a middle penetrating section 32, and a second connecting section 33.

[0028] Chip 201 , adapter board 202 , and bump 203 . DETAILED DESCRIPTION

[0029] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0030] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0031] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0032] Reference below Figure 1-Figure 3 A capacitor structure 100 according to an embodiment of the present invention is described. By arranging the capacitor structure 100 between a first element and a second element, and connecting the positive conductive portion 21 and the negative conductive portion 22 connected to the capacitor body 2 to the first element at the same time, the capacitor structure 100 can play a filtering role, and can reduce the distance between the capacitor structure 100 and the first element, thereby improving the filtering performance of the capacitor structure 100. In addition, the portion of the first element blocked by the capacitor structure 100 can be connected to the second element through the electrical connector 3, thereby improving the connection reliability between the two.

[0033] like Figure 1 As shown, according to an embodiment of the present invention, a capacitor structure 100 is used to be installed between a first element and a second element, and includes: a structural body 1, a capacitor body 2 and an electrical connection body 3.

[0034] The structural body 1 has a first surface 11 and a second surface 12 which are opposite to each other; the capacitor body 2 is arranged in the structural body 1, and the capacitor body 2 is connected with a positive conductive part 21 and a negative conductive part 22, and the positive conductive part 21 and the negative conductive part 22 both extend to the first surface 11 and are suitable for being electrically connected to the first element respectively; the electrical connector 3 is penetrated by the structural body 1, and one end of the electrical connector 3 extends to the first surface 11 for being electrically connected to the first element, and the other end of the electrical connector 3 extends to the second surface 12 for being electrically connected to the second element.

[0035] Specifically, the capacitor structure 100 can play a filtering role. The capacitor structure 100 is installed between the first element and the second element, and the first element and the second element are stacked, so that the capacitor structure 100 is close to the first element to reduce the distance between the capacitor structure 100 and the first element, and the connection path between the capacitor structure 100 and the first element can be reduced, thereby reducing the equivalent resistance and equivalent inductance between the capacitor structure 100 and the first element, thereby improving the filtering performance of the capacitor structure 100.

[0036] The capacitor structure 100 includes a structural body 1, a capacitor body 2 and an electrical connector 3, wherein the structural body 1, as the main structure of the capacitor structure 100, can provide an installation space for the capacitor body 2 and the electrical connector 3, and can provide stable physical support for the capacitor body 2 and the electrical connector 3 to ensure that the capacitor body 2 and the electrical connector 3 can work reliably. The capacitor body 2 can provide a certain capacitance value to achieve the filtering effect of the capacitor structure 100. The capacitor body 2 is arranged in the structural body 1, and the capacitor body 2 can be installed and protected by the structural body 1. The electrical connector 3 is used to connect with the first element and the second element to achieve the connection between the part of the first element blocked by the capacitor structure 100 and the second element. The electrical connector 3 is passed through the structural body 1, and the electrical connector 3 can be installed on the structural body 1 to achieve the installation and fixation of the electrical connector 3.

[0037] In addition, the structural body 1 has a first surface 11 and a second surface 12 that are opposite to each other. The structural body 1 can be constructed into a rectangular parallelepiped, wherein a group of opposite surfaces are respectively the first surface 11 and the second surface 12, that is, the first surface 11 and the second surface 12 are spaced apart and opposite to each other. The capacitor 2 is connected with a positive conductive portion 21 and a negative conductive portion 22. The positive conductive portion 21 and the negative conductive portion 22 can be used to realize the connection between the capacitor 2 and other electronic components. The positive conductive portion 21 and the negative conductive portion 22 are both extended to the first surface 11 and are electrically connected to the first component respectively, so that the positive conductive portion 21 and the negative conductive portion 22 can be simultaneously connected to the first component to realize the connection between the capacitor 2 and the first component, and the connection between the capacitor structure 100 and the first component can be realized, so that the capacitor structure 100 can play a filtering role, and the first component can be arranged on the side where the first surface 11 is located to reduce the distance between the capacitor structure 100 and the first component, reduce the equivalent resistance and equivalent inductance between the capacitor structure 100 and the first component, and improve the filtering performance of the capacitor structure 100.

[0038] At the same time, one end of the electrical connector 3 is extended to the first surface 11 to be electrically connected to the first element, and the other end of the electrical connector 3 is extended to the second surface 12 to be electrically connected to the second element. The two ends of the electrical connector 3 can be respectively extended from the inside of the structural body 1 to the first surface 11 and the second surface 12 to be connected to the first element and the second element, and then the part of the first element blocked by the capacitor structure 100 can be connected to the second element through the electrical connector 3, which can avoid the connection reliability between the first element and the second element being reduced due to the capacitor structure 100 being arranged between the first element and the second element, and can improve the connection reliability between the first element and the second element, and the first element can be arranged on the side where the first surface 11 is located, and the second element can be arranged on the side where the second surface 12 is located, so as to facilitate the two ends of the electrical connector 3 to be respectively connected to the first element and the second element.

[0039] In such Figure 1 In the illustrated embodiment, the upper surface of the structural body 1 can be constructed as a first surface 11, and the lower surface can be constructed as a second surface 12, and the first element can be arranged above the structural body 1, and the second element can be arranged below the structural body 1, so as to facilitate connecting the electrical connection body 3 to the first element and the second element at the same time, and the distance between the first element and the capacitor structure 100 can be reduced, thereby improving the filtering performance of the capacitor structure 100.

[0040] The electrical connector 3 , the positive electrode conductive part 21 and the negative electrode conductive part 22 can all be made of metal materials such as copper to form an electrical connection.

[0041] According to the capacitor structure 100 of the embodiment of the present invention, by arranging the capacitor structure 100 between the first element and the second element, and connecting the positive conductive part 21 and the negative conductive part 22 connected to the capacitor body 2 to the first element at the same time, the capacitor structure 100 can play a filtering role, and can reduce the distance between the capacitor structure 100 and the first element, thereby improving the filtering performance of the capacitor structure 100, and the part of the first element blocked by the capacitor structure 100 can be connected to the second element through the electrical connection body 3, thereby improving the connection reliability between the two.

[0042] In some embodiments, the structural body 1 includes a first insulating layer 13, a substrate layer 14 and a second insulating layer 15, the substrate layer 14 is arranged between the first insulating layer 13 and the second insulating layer 15, the surfaces of the first insulating layer 13 and the second insulating layer 15 facing away from each other are respectively constructed as a first surface 11 and a second surface 12, the first insulating layer 13 and the substrate layer 14 jointly form a accommodating space 16, and the capacitor 2 is located in the accommodating space 16.

[0043] Specifically, the structural body 1 includes three parts, namely a first insulating layer 13, a substrate layer 14 and a second insulating layer 15. The substrate layer 14 is arranged between the first insulating layer 13 and the second insulating layer 15, that is, the first insulating layer 13, the substrate layer 14 and the second insulating layer 15 are arranged in sequence, so that the capacitor structure 100 can form a sandwich structure, and the surfaces of the first insulating layer 13 and the second insulating layer 15 facing away from each other are respectively constructed as a first surface 11 and a second surface 12, that is, the surface of the first insulating layer 13 facing away from the second insulating layer 15 is arranged upward to form the first surface 11, and the surface of the second insulating layer 15 facing away from the first insulating layer 13 is arranged downward to form the second surface 12, and then the first insulating layer 13, the substrate layer 14 and the second insulating layer 15 can be arranged in sequence from top to bottom.

[0044] Among them, the substrate layer 14 can be made of materials such as silicon and quartz, which is used to provide physical support for the capacitor 2 and the electrical connector 3 to ensure the stability and shape of the capacitor structure 100 during manufacturing and use. The first insulating layer 13 and the second insulating layer 15 can be insulating materials such as silicon dioxide and silicon nitride to play an isolation role. The surfaces of the first insulating layer 13 and the second insulating layer 15 facing away from each other are respectively constructed as the first surface 11 and the second surface 12, that is, the first insulating layer 13 and the second insulating layer 15 are respectively arranged on both sides of the capacitor structure 100, so that the first insulating layer 13 and the second insulating layer 15 can separate the electrical connection points at both ends of the capacitor structure 100 to avoid direct contact between them and causing a short circuit, and the first insulating layer 13 can also separate the positive conductive part 21 and the negative conductive part 22 extending to the first surface 11 to avoid direct contact between the positive conductive part 21 and the negative conductive part 22 and causing a short circuit, thereby causing failure of the capacitor structure 100.

[0045] In addition, the first insulating layer 13 and the substrate layer 14 jointly form a accommodating space 16, and the accommodating space 16 has a certain volume and can be used to accommodate the capacitor 2. The capacitor 2 can be disposed in the accommodating space 16 to realize the installation of the capacitor 2 in the capacitor structure 100, and the positive conductive part 21 and the negative conductive part 22 connected to the capacitor 2 can be conveniently extended from the capacitor 2 to the first surface 11, and connected to the first element at the first surface 11, so as to realize the filtering effect of the capacitor structure 100.

[0046] In some embodiments, the substrate layer 14 is formed with a first receiving groove 141 open to the first insulating layer 13, and the first insulating layer 13 is formed with a second receiving groove 131 connected to the first receiving groove 141, a portion of the capacitor body 2 is located in the first receiving groove 141, and another portion of the capacitor body 2 is located in the second receiving groove 131 to be connected to the positive conductive portion 21 and the negative conductive portion 22.

[0047] Specifically, the first accommodating groove 141 and the second accommodating groove 131 can both be used to accommodate the capacitor 2. The first accommodating groove 141 is connected to the second accommodating groove 131 so that a portion of the capacitor 2 can be located in the first accommodating groove 141, and the other portion can be located in the second accommodating groove 131, that is, the capacitor 2 can be extended from the first accommodating groove 141 to the second accommodating groove 131, so as to increase the setting length and setting area of ​​the capacitor 2, thereby increasing the capacitance of the capacitor 2 to enhance the filtering effect of the capacitor structure 100, and the first accommodating groove 141 is set in the substrate layer 14 and is open to the first insulating layer 13, and the second accommodating groove 131 is set in the first insulating layer 13, which can facilitate the connection of the first accommodating groove 141 with the second accommodating groove 131, thereby facilitating the extension of the capacitor 2 from the first accommodating groove 141 to the second accommodating groove 131.

[0048] Among them, it should be noted that the first insulating layer 13 and the substrate layer 14 jointly form a accommodating space 16, and the accommodating space 16 is used to set the capacitor body 2, and the first insulating layer 13 forms a second accommodating groove 131, and the substrate layer 14 forms a first accommodating groove 141. The first accommodating groove 141 and the second accommodating groove 131 are both used to set the capacitor body 2, that is, the accommodating space 16 includes the first accommodating groove 141 and the second accommodating groove 131, and the first accommodating groove 141 can be opened in the substrate layer 14 through an etching process, and the second accommodating groove 131 can be opened in the first insulating layer 13.

[0049] Furthermore, part of the capacitor 2 located in the second accommodating groove 131 can be connected to the positive conductive part 21 and the negative conductive part 22, and the second accommodating groove 131 is arranged in the first insulating layer 13, that is, part of the capacitor 2 located in the first insulating layer 13 can be connected to the positive conductive part 21 and the negative conductive part 22, so as to realize the connection between the capacitor 2 and the positive conductive part 21 and the negative conductive part 22, and the positive conductive part 21 and the negative conductive part 22 both extend to the first surface 11, and then it is convenient to connect the capacitor 2 to the first element through the positive conductive part 21 and the negative conductive part 22, so as to realize the connection between the capacitor structure 100 and the first element, so as to realize the filtering effect of the capacitor structure 100.

[0050] In some embodiments, there are at least two first accommodating grooves 141 , at least two of which are spaced apart and respectively connected to the second accommodating grooves 131 , and the capacitor body 2 includes at least two capacitor segments 23 , and at least two capacitor segments 23 are accommodated in at least two first accommodating grooves 141 in a one-to-one correspondence.

[0051] Specifically, the first accommodating groove 141 is used to accommodate the capacitor 2, and the first accommodating grooves 141 are set to at least two, that is, the number of the first accommodating grooves 141 can be two, three or more, so that the capacitor 2 can be accommodated through at least two first accommodating grooves 141 at the same time, which can effectively increase the setting length and setting area of ​​the capacitor 2, and then increase the capacitance of the capacitor 2 to improve the filtering effect of the capacitor structure 100. At the same time, at least two first accommodating grooves 141 are separated and connected to the second accommodating groove 131 respectively, so as to avoid interference between the at least two first accommodating grooves 141, resulting in a reduction in the setting length and setting area of ​​the capacitor 2, and it is convenient for the capacitor 2 to pass through at least two first accommodating grooves 141 in sequence. The two ends of the capacitor 2 can extend from the first first accommodating groove 141 and the last first accommodating groove 141 to the second accommodating groove 131 respectively to be connected to the positive conductive portion 21 and the negative conductive portion 22.

[0052] Furthermore, the capacitor body 2 includes at least two capacitor segments 23, that is, the number of the capacitor segments 23 can be two, three or more, so as to increase the capacitance of the capacitor body 2 through the at least two capacitor segments 23, and the at least two capacitor segments 23 are accommodated in at least two first accommodating grooves 141 in a one-to-one correspondence, that is, for each capacitor segment 23, a first accommodating groove 141 can be set to accommodate it, which can improve the reliability of accommodating the capacitor segments 23, that is, the reliability of the setting of the capacitor body 2 and the reliability of the operation of the capacitor body 2 can be improved.

[0053] For example, Figure 1As shown, the number of the first accommodating grooves 141 and the capacitor segments 23 is two, that is, the setting length and setting area of ​​the capacitor body 2 can be increased by the two capacitor segments 23, and the two first accommodating grooves 141 and the two capacitor segments 23 are set in a one-to-one correspondence to improve the reliability of the setting of the capacitor body 2 and the reliability of the operation of the capacitor body 2, and the number of the first accommodating grooves 141 and the capacitor segments 23 is not limited to that described in the present embodiment, and can be flexibly set according to specific needs and space size.

[0054] In some embodiments, an insulating layer 24 is filled between the capacitor body 2 and the inner wall of the first receiving sink 141 , and / or an insulating layer 24 is filled between the capacitor body 2 and the inner wall of the second receiving sink 131 .

[0055] Specifically, an insulating layer 24 is filled between the capacitor body 2 and the inner wall of the first receiving groove 141, that is, an insulating layer 24 can be set between the capacitor body 2 and the first receiving groove 141, and the insulating layer 24 can play a role in isolating the capacitor body 2 from the substrate layer 14, and the insulating layer 24 can be a thin film formed by insulating materials such as silicon nitride or silicon dioxide, so as to minimize the impact on the capacitor body 2 while playing an isolation role, and an insulating layer 24 is filled between the capacitor body 2 and the inner wall of the second receiving groove 131, that is, an insulating layer 24 can be set between the capacitor body 2 and the second receiving groove 131, and the insulating layer 24 can be an insulating material such as silicon dioxide, which is used to fill the first receiving groove 141 and the second receiving groove 131 to form a bright surface.

[0056] In some embodiments, the capacitor 2 includes a positive electrode layer 25, an intermediate insulating layer 26 and a negative electrode layer 27, the positive electrode layer 25 and the negative electrode layer 27 are stacked and distributed, and the intermediate insulating layer 26 is arranged between the positive electrode layer 25 and the negative electrode layer 27; wherein, there are two positive electrode conductive parts 21 and they are respectively connected to the two ends of the positive electrode layer 25, and there are two negative electrode conductive parts 22 and they are respectively connected to the two ends of the negative electrode layer 27.

[0057] Specifically, the positive electrode layer 25 and the negative electrode layer 27 can be polycrystalline silicon or metal, etc., for storing electric charges. The positive electrode layer 25 and the negative electrode layer 27 are stacked and distributed, and the intermediate insulating layer 26 is arranged between the positive electrode layer 25 and the negative electrode layer 27. The intermediate insulating layer 26 can be an insulating material with a high dielectric constant, such as hafnium dioxide, etc., which can be used to isolate the positive electrode layer 25 and the negative electrode layer 27 to ensure that the positive electrode layer 25 and the negative electrode layer 27 can work reliably. At the same time, the positive electrode layer 25, the intermediate insulating layer 26 and the negative electrode layer 27 can also be arranged in sequence along the up and down directions to reduce the space occupied by the capacitor 2 in the horizontal direction, which can help reduce the volume of the capacitor structure 100 and the setting of the capacitor structure 100.

[0058] Among them, there are two positive conductive parts 21 and they are respectively connected to the two ends of the positive electrode layer 25, that is, the two positive conductive parts 21 can be connected to the first element to improve the connection reliability between the two, and the two positive conductive parts 21 can be set apart to avoid interference between the two positive conductive parts 21, resulting in the capacitor 2 being unable to be connected to the first element or the connection reliability between the capacitor and the first element is reduced. At the same time, there are two negative conductive parts 22 and they are respectively connected to the two ends of the negative electrode layer 27, that is, the two negative conductive parts 22 can be connected to the first element to improve the connection reliability between the two, and the two negative conductive parts 22 can be set apart to avoid interference between the two negative conductive parts 22, resulting in the capacitor 2 being unable to be connected to the first element or the connection reliability between the capacitor and the first element is reduced.

[0059] Also, it should be noted that the positive electrode layer 25, the intermediate insulating layer 26 and the negative electrode layer 27 can continue to be stacked upward to form a capacitor structure 100 with a higher capacitance density, such as a structure of a negative electrode layer 27, an intermediate insulating layer 26, a positive electrode layer 25, an intermediate insulating layer 26, a negative electrode layer 27, an intermediate insulating layer 26, and a positive electrode layer 25.

[0060] In some embodiments, the electrical connector 3 includes a first connecting section 31, an intermediate penetrating section 32 and a second connecting section 33 connected in sequence, the intermediate penetrating section 32 is penetrated in the substrate layer 14, the first connecting section 31 is located in the first insulating layer 13 and is used to be electrically connected to the first element, and the second connecting section 33 is located in the second insulating layer 15 and is used to be electrically connected to the second element.

[0061] Specifically, the electrical connector 3 is used to simultaneously connect the first element and the second element to achieve connection between the portion of the first element blocked by the capacitor structure 100 and the second element. The electrical connector 3 includes a first connecting segment 31, an intermediate penetration segment 32 and a second connecting segment 33 connected in sequence. That is, the first connecting segment 31, the intermediate penetration segment 32 and the second connecting segment 33 can be arranged and connected in sequence, so that when the first element and the second element are simultaneously connected to the electrical connector 3, the connection between the first element and the second element can be achieved, and the first connecting segment 31 is arranged on the first insulating layer 13 to facilitate connecting the first connecting segment 31 to the first element to achieve connection between the electrical connector 3 and the first element, and the second connecting segment 33 is arranged on the second insulating layer 15 to facilitate connecting the second connecting segment 33 to the second element to achieve connection between the electrical connector 3 and the second element, and the intermediate penetration segment 32 is penetrated in the substrate layer 14 so that the substrate layer 14 can provide stable physical support for the electrical connector 3 to ensure that the electrical connector 3 can work reliably.

[0062] In some embodiments, there are at least two electrical connectors 3 , and at least two electrical connectors 3 are located on two sides of the capacitor 2 .

[0063] Specifically, the electrical connector 3 is used to connect the first element with the second element, and the number of electrical connectors 3 is set to be at least two, that is, the number of electrical connectors 3 can be two, three or more, so that the first element and the second element can be connected at the same time through at least two electrical connectors 3, which can improve the connection reliability between the two, and at least two electrical connectors 3 are set on both sides of the capacitor 2, that is, the at least two electrical connectors 3 are spaced apart to avoid interference between the at least two electrical connectors 3, which causes the first element and the second element to be unable to be connected or the reliability of the connection is reduced.

[0064] In such Figure 1 In the illustrated embodiment, there are four electrical connectors 3, and the four electrical connectors 3 are evenly distributed on both sides of the capacitor 2, and the two electrical connectors 3 on each side of the capacitor 2 are also spaced apart, so that the first element and the second element can be connected through the electrical connectors 3 at four positions at the same time, which can improve the connection reliability between the first element and the second element, and the number of electrical connectors 3 is not limited to that described in the present embodiment, and can be flexibly arranged according to specific needs and space size.

[0065] The present invention also provides a chip assembly 200 .

[0066] The chip assembly 200 according to an embodiment of the present invention includes a capacitor structure 100 of any of the above embodiments. By arranging the capacitor structure 100 between the first element and the second element, and connecting the positive conductive portion 21 and the negative conductive portion 22 connected to the capacitor body 2 to the first element at the same time, the capacitor structure 100 can play a filtering role, and the distance between the capacitor structure 100 and the first element can be reduced, thereby improving the filtering performance of the capacitor structure 100, and the portion of the first element blocked by the capacitor structure 100 can be connected to the second element through the electrical connector 3, thereby improving the connection reliability between the two.

[0067] In some embodiments, the chip assembly 200 further includes a chip 201 and an adapter board 202 , the capacitor structure 100 is disposed between the chip 201 and the adapter board 202 , the chip 201 is configured as a first component, and the adapter board 202 is configured as a second component.

[0068] Specifically, the chip 201 is used as a core component in the chip assembly 200 to realize data processing functions or control functions, etc. The adapter board 202 is used to realize the connection between the chip 201 and other electronic components. The capacitor structure 100 is set between the chip 201 and the adapter board 202, so that the chip 201 can be connected to the adapter board 202 through the capacitor structure 100, and the chip 201 can be connected to other electronic components through the adapter board 202. In addition, the chip 201 can be constructed as a first component and the adapter board 202 can be constructed as a second component. The chip 201, the capacitor structure 100 and the adapter board 202 can be arranged in sequence from top to bottom, and then the positive conductive part 21 and the negative conductive part 22 can be connected to the chip 201, so that the capacitor structure 100 can play a filtering role, and the distance between the capacitor structure 100 and the chip 201 can be greatly reduced, effectively reducing the equivalent resistance and equivalent inductance between the two, and improving the filtering performance of the capacitor structure 100.

[0069] Among them, Figure 2 As shown, when the capacitor structure 100 is arranged between the chip 201 and the adapter board 202, the chip 201 can be connected to the positive conductive part 21 and the negative conductive part 22 on the capacitor structure 100 through the bump 203 to achieve the filtering effect of the capacitor structure 100, and the electrical connector 3 on the capacitor structure 100 can be connected to the chip 201 and the adapter board 202 at the same time through the bump 203 to achieve the connection between the part of the chip 201 blocked by the capacitor structure 100 and the adapter board 202. At the same time, the unblocked part of the chip 201 can also be directly connected to the adapter board 202 through the bump 203 to improve the connection reliability between the chip 201 and the adapter board 202, and the bump 203 can be constructed as a Cu / Sn / Cu structure, or as a Cu / Cu structure.

[0070] In some embodiments, there are multiple chips 201, and the multiple chips 201 are stacked and distributed on the same side of the adapter board 202; wherein, a capacitor structure 100 is provided between two adjacent chips 201, and the one of the two adjacent chips 201 away from the adapter board 202 is constructed as a first element, and the one close to the adapter board 202 is constructed as a second element.

[0071] Specifically, the chip 201 can be set to be multiple, that is, the number of chips 201 set can be two, three or more, so as to improve the integration and performance of the chip component 200, and the multiple chips 201 are stacked and distributed on the same side of the adapter board 202, that is, the multiple chips 201 can be arranged in sequence from top to bottom to reduce the space occupied by the chip component 200 in the horizontal direction, which is conducive to the arrangement of the chip component 200, wherein a capacitor structure 100 is provided between two adjacent chips 201, and the connection between the two adjacent chips 201 can be achieved through the capacitor structure 100, and the one of the two adjacent chips 201 away from the adapter board 202 is constructed as a first element, and the one close to the adapter board 202 is constructed as a second element, so that both the positive conductive part 21 and the negative conductive part 22 are connected to the first element, so that the capacitor structure 100 can play a filtering role, and the distance between the capacitor structure 100 and the first element can be reduced to a large extent, thereby improving the filtering performance of the capacitor structure 100.

[0072] Among them, Figure 3 As shown, when the capacitor structure 100 is arranged between two adjacent chips 201, the first element can be connected to the positive conductive part 21 and the negative conductive part 22 on the capacitor structure 100 through the bump 203 to achieve the filtering effect of the capacitor structure 100, and the electrical connector 3 on the capacitor structure 100 can be connected to the first element and the second element at the same time through the bump 203 to achieve the connection between the part of the first element blocked by the capacitor structure 100 and the second element. At the same time, the unblocked part of the first element can also be directly connected to the second element through the bump 203 to improve the connection reliability between the chip 201 and the adapter board 202. In addition, in a structure in which multiple chips 201 are stacked, multiple capacitor structures 100 can be arranged, and the multiple capacitor structures 100 can be respectively arranged between the multiple chips 201, so that each capacitor structure 100 can be as close to the corresponding chip 201 as possible to effectively improve the filtering performance of the capacitor structure 100.

[0073] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0074] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A capacitor structure, characterized in that: The capacitor structure is used to be installed between the first element and the second element, and includes: A structural body, wherein the structural body has a first surface and a second surface facing away from each other; A capacitor, the capacitor is disposed in the structural main body, the capacitor is connected with a positive conductive part and a negative conductive part, the positive conductive part and the negative conductive part both extend to the first surface and are suitable for being electrically connected to the first element respectively; An electrical connector is disposed through the structural body, one end of the electrical connector extends to the first surface for electrical connection with the first element, and the other end of the electrical connector extends to the second surface for electrical connection with the second element.

2. The capacitor structure according to claim 1, characterized in that: The structural body includes a first insulating layer, a substrate layer and a second insulating layer, the substrate layer is arranged between the first insulating layer and the second insulating layer, the surfaces of the first insulating layer and the second insulating layer facing away from each other are respectively constructed as the first surface and the second surface, the first insulating layer and the substrate layer jointly form a accommodating space, and the capacitor is located in the accommodating space.

3. The capacitor structure according to claim 2, characterized in that: The substrate layer is formed with a first accommodating groove open to the first insulating layer, and the first insulating layer is formed with a second accommodating groove connected to the first accommodating groove, a portion of the capacitor body is located in the first accommodating groove, and another portion of the capacitor body is located in the second accommodating groove to be connected to the positive conductive part and the negative conductive part.

4. The capacitor structure according to claim 3, characterized in that: There are at least two first accommodating grooves, at least two of which are spaced apart and respectively connected to the second accommodating grooves. The capacitor body includes at least two capacitor segments, and at least two of the capacitor segments are accommodated in at least two of the first accommodating grooves in a one-to-one correspondence.

5. The capacitor structure according to claim 3, characterized in that: An insulating layer is filled between the capacitor body and the inner wall of the first accommodating trough, and / or an insulating layer is filled between the capacitor body and the inner wall of the second accommodating trough.

6. The capacitor structure according to claim 2, characterized in that: The capacitor comprises a positive electrode layer, an intermediate insulating layer and a negative electrode layer, wherein the positive electrode layer and the negative electrode layer are stacked and distributed, and the intermediate insulating layer is arranged between the positive electrode layer and the negative electrode layer; There are two positive electrode conductive parts, which are respectively connected to the two ends of the positive electrode layer, and there are two negative electrode conductive parts, which are respectively connected to the two ends of the negative electrode layer.

7. The capacitor structure according to claim 2, characterized in that: The electrical connector includes a first connecting section, an intermediate penetrating section and a second connecting section which are connected in sequence, the intermediate penetrating section penetrates the substrate layer, the first connecting section is located in the first insulating layer and is used to be electrically connected to the first element, and the second connecting section is located in the second insulating layer and is used to be electrically connected to the second element.

8. The capacitor structure according to any one of claims 1 to 6, characterized in that: There are at least two electrical connectors, and at least two of the electrical connectors are located on two sides of the capacitor.

9. A chip assembly, characterized in that: The invention comprises the capacitor structure as described in any one of claims 1 to 8.

10. The chip assembly according to claim 9, characterized in that: It also includes a chip and an adapter board, the capacitor structure is arranged between the chip and the adapter board, the chip is configured as the first element, and the adapter board is configured as the second element.

11. The chip assembly according to claim 10, characterized in that: There are multiple chips, and the multiple chips are stacked and distributed on the same side of the adapter board; The capacitor structure is provided between two adjacent chips, and the one of the two adjacent chips far from the adapter board is constructed as the first element, and the one close to the adapter board is constructed as the second element.

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