Display panel, display device and method for manufacturing display panel

Abstract

The application relates to the technical field of display, and particularly provides a display panel, a display device and a preparation method of the display panel. The display panel comprises a display area and a non-display area, the non-display area is arranged around the periphery of the display area; the non-display area comprises an array substrate, an isolation structure, a lifting layer, a first filling layer and a first encapsulation layer, the isolation structure is located on the array substrate, the isolation structure is defined with a plurality of isolation openings, and one end of the isolation structure, which is away from the array substrate, is a first end face; the lifting layer is located on the array substrate, and the lifting layer comprises a first lifting part located on the side of the isolation structure, which is away from the array substrate; the first filling layer is located on the side of the lifting layer, which is away from the array substrate, and the orthographic projection of the first filling layer on the array substrate covers the orthographic projection of the first lifting part on the array substrate; and the first encapsulation layer is located on the side of the first filling layer, which is away from the array substrate. The display panel can improve the reliability through the lifting layer and improve the use performance of the display panel.

Description

Technical Field

[0001] This application belongs to the field of display technology, and more specifically, relates to a display panel, a display device, and a method for manufacturing the display panel. Background Technology

[0002] Organic light-emitting diodes (OLEDs) and flat panel display devices based on OLED technology are widely used in various consumer electronics products such as mobile phones, televisions, laptops, and desktop computers due to their advantages such as high image quality, low power consumption, thin body, and wide range of applications, becoming the mainstream of display devices.

[0003] However, the performance of current OLED display products needs to be improved. Summary of the Invention

[0004] This application provides a display panel, a display device, and a method for manufacturing the display panel, so as to improve the performance of the display panel to at least a certain extent.

[0005] To achieve the above objectives, the technical solution adopted in this application is as follows: In a first aspect, a display panel is provided, the display panel having a display area and a non-display area, the non-display area being disposed around the outer periphery of the display area; the non-display area includes: an array substrate, an isolation structure, a lifting layer, a first filling layer, and a first encapsulation layer, the isolation structure being located on the array substrate, the isolation structure defining a plurality of isolation openings, and the end of the isolation structure facing away from the array substrate being a first end face; the lifting layer being located on the array substrate, the lifting layer including a first lifting portion located on the side of the isolation structure facing away from the array substrate; the first filling layer being located on the side of the lifting layer facing away from the array substrate, the orthographic projection of the first filling layer on the array substrate covering the orthographic projection of the first lifting portion on the array substrate; the first encapsulation layer being located on the side of the first filling layer facing away from the array substrate.

[0006] In the display panel provided in this application embodiment, the height of the corresponding area of ​​the array substrate can be effectively raised by the lifting layer, thereby forming a barrier-like structure in the non-display area. This helps to prevent moisture from the external environment from invading the display area and affecting the display effect of the display panel, thus achieving the purpose of improving the performance of the display panel.

[0007] Optionally, the lifting layer further includes a second lifting portion located within the isolation opening, the second lifting portion being connected to an adjacent first lifting portion.

[0008] Optionally, the non-display area further includes a filler layer located between the first encapsulation layer and the array substrate.

[0009] Optionally, the orthographic projection of the first filling layer on the array substrate covers the orthographic projection of the corresponding isolation opening on the array substrate, wherein the corresponding isolation opening is located on the side of the first filling layer closer to the array substrate.

[0010] Optionally, at least two of the corresponding isolation openings are arranged adjacent to each other.

[0011] Optionally, the orthographic projection of at least one of the isolation openings adjacent to the corresponding isolation openings on the array substrate is spaced apart from the orthographic projection of the first filling layer on the array substrate.

[0012] Optionally, the first filling layer includes a first filling sub-section, a second filling sub-section, and a third filling sub-section. The first filling sub-section is arranged correspondingly to the lifting layer and is located on the side of the lifting layer away from the array substrate. The second filling sub-section covers the first end face. The third filling sub-section connects the first filling sub-section and the second filling sub-section.

[0013] Optionally, a cavity is provided between the first filling layer, the lifting layer and the first end face.

[0014] Optionally, the display panel further includes a second filling layer, which is disposed within the corresponding isolation opening and located on the side of the lifting layer near the array substrate.

[0015] Optionally, the display panel further includes a third filling layer, wherein the third filling layer and the second filling layer are respectively disposed in two adjacent isolation openings and are disposed in the same layer in a direction parallel to the plane of the array substrate.

[0016] Optionally, the display area of ​​the display panel includes a light-emitting element, and the second filling layer is of the same layer and material as the light-emitting element.

[0017] Optionally, the third filler layer is made of the same material as the first filler layer.

[0018] Optionally, the second filler layer is made of a different material than the third filler layer.

[0019] Optionally, the second filling layer, the first filling layer, and the third filling layer each include a light-emitting material layer and a first electrode layer stacked sequentially.

[0020] Optionally, a portion of the first electrode layer is connected to the side of the isolation structure facing the isolation opening.

[0021] Optionally, the first electrode layer is a cathode layer.

[0022] Optionally, the non-display area further includes a pixel definition layer, which is located between the array substrate and the isolation structure. The pixel definition layer defines a plurality of pixel openings, which are arranged correspondingly to and communicate with the isolation openings.

[0023] Optionally, the non-display area further includes a second electrode layer, which is located between the array substrate and the pixel definition layer, with a portion of the second electrode layer exposed through the pixel opening.

[0024] Optionally, the second electrode layer is an anode layer.

[0025] Optionally, the isolation structure includes a first isolation portion and a second isolation portion stacked sequentially on the array substrate, the first end face being located at one end of the second isolation portion away from the first isolation portion; the orthographic projection of the first isolation portion on the array substrate is located within the orthographic projection range of the second isolation portion on the array substrate.

[0026] Optionally, the first isolation portion is a conductive structure.

[0027] Optionally, the first isolation portion includes at least two sub-support portions, wherein the orthographic projection of the sub-support portion farther from the array substrate on the array substrate is located within the orthographic projection range of the sub-support portion closer to the array substrate on the array substrate.

[0028] Optionally, the orthographic projection of the sub-support portion near the array substrate onto the array substrate is located within the orthographic projection range of the second isolation portion onto the array substrate.

[0029] Optionally, the first encapsulation layer includes a first encapsulation portion and a second encapsulation portion connected together. The first encapsulation portion is located on the side of the first filling layer away from the array substrate, and the second encapsulation portion is connected to the adjacent first encapsulation portion. The orthographic projection of the first encapsulation portion on the array substrate covers the orthographic projection of the correspondingly provided isolation opening on the array substrate, and the correspondingly provided isolation opening is located on the side of the first encapsulation portion closer to the array substrate.

[0030] Optionally, at least two of the corresponding isolation openings are arranged adjacent to each other.

[0031] Optionally, the orthographic projection of the second encapsulation portion on the array substrate covers the orthographic projection of at least one of the isolation openings adjacent to the correspondingly provided isolation openings on the array substrate.

[0032] Optionally, the second packaging portion includes a first packaging sub-portion and a second packaging sub-portion, wherein the first packaging sub-portion is located on the side of the first end face away from the array substrate and is spaced apart from the first end face, and the second packaging sub-portion connects the first packaging sub-portion and the first packaging portion.

[0033] Optionally, the non-display area may further include a second encapsulation layer covering the first encapsulation layer.

[0034] Optionally, the non-display area further includes a planarization layer located between the first encapsulation layer and the second encapsulation layer.

[0035] Optionally, the material of the planarization layer includes organic materials.

[0036] Optionally, the planarization layer includes a plurality of spaced-apart planarization units, with adjacent planarization units separated by the first encapsulation layer.

[0037] Optionally, the orthographic projection of the first lifting portion on the array substrate and the orthographic projection of the planarization unit on the array substrate are arranged at intervals.

[0038] In a second aspect, this application provides a method for manufacturing a display panel, comprising:

[0039] An isolation structure is formed on one side of the array substrate, the isolation structure encloses and forms a plurality of isolation openings, and the end of the isolation structure facing away from the array substrate is a first end face;

[0040] A lifting layer is formed on the side of a portion of the isolation structure opposite to the array substrate. The lifting layer includes a first lifting portion that covers the first end face near the isolation opening.

[0041] A filling material layer and a first encapsulation layer are formed on the side of the isolation opening and the isolation structure opposite to the array substrate;

[0042] The filling material layer covers the portion of the lifting layer that is away from the array substrate, forming a first filling layer.

[0043] Optionally, the isolation opening includes an adjacent first opening and a second opening;

[0044] The step of forming a lift layer on the side of a portion of the isolation structure opposite to the array substrate, the lift layer including a first lift portion covering the first end face near the isolation opening, includes:

[0045] A lifting layer is prepared within the first opening and on the side of the first end face facing away from the array substrate near the first opening.

[0046] Optionally, before the step of preparing the lifting layer within the first opening and on the side of the first end face facing away from the array substrate near the first opening, the method further includes:

[0047] A second filling layer is prepared within the first opening.

[0048] Optionally, the filling material layer at the portion of the second opening forms a third filling layer.

[0049] In a third aspect, this application also provides a display device, including a display panel, wherein the display panel is any of the display panels described above, or a display panel prepared by the preparation method described above.

[0050] The display device provided in this application includes the above-mentioned display panel. Therefore, the display device has the beneficial effects of including at least one or more of the above-mentioned display panels. The specific effects are as described above and will not be repeated here.

[0051] The beneficial effects of the display panel, display device, and display panel manufacturing method provided in this application are as follows: Compared with related technologies, the display panel provided in this application can increase the film thickness in some locations in the non-display area by using a lifting layer and a first filling layer, so as to form a structure with a certain blocking function outside the display area, reduce the overflow risk of the planarization layer, and at the same time improve the display panel's resistance to water vapor intrusion, and improve the packaging effect and performance of the display panel. Attached Figure Description

[0052] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0053] Figure 1 This is a schematic diagram of the planar structure of the display panel provided in an embodiment of this application;

[0054] Figure 2 for Figure 1 The image shows an enlarged view of the structure of area D in the display panel.

[0055] Figure 3 for Figure 2 Sectional view at point AA;

[0056] Figure 4 for Figure 2 Sectional view at point BB in the middle;

[0057] Figure 5 for Figure 2 A cross-sectional view of another embodiment at point AA;

[0058] Figure 6 This is a flowchart illustrating the method for manufacturing a display panel as provided in an embodiment of this application.

[0059] Figures 7A-7C This is a process diagram of the display panel manufacturing method provided in the embodiments of this application;

[0060] Figure 8 This is a schematic diagram of the planar structure of the display device provided in the embodiments of this application.

[0061] The following are the labeling elements in the figure:

[0062] 1. Array substrate; 2. Isolation structure; 201. Isolation opening; 202. First end face; 21. First isolation portion; 211. Sub-support portion; 22. Second isolation portion; 3. Lifting layer; 31. First lifting portion; 32. Second lifting portion; 4. First encapsulation layer; 41. First encapsulation portion; 42. Second encapsulation portion; 421. First encapsulation sub-part; 422. Second encapsulation sub-part; 51. Second filling layer; 52. First filling layer; 521. First filling sub-part; 522. Second filling sub-part; 523. Third filling sub-part; 53. Third filling layer; 501. Light-emitting material layer; 502. First electrode layer; 6. Pixel definition layer; 601. Pixel opening; 7. Second electrode layer; 8. Second encapsulation layer; 9. Planarization layer; 91. Planarization unit;

[0063] 100. Display device; 10. Display panel; AA. Display area; NA. Non-display area; S. Cavity. Detailed Implementation

[0064] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0065] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0066] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0067] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0068] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between components; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0069] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0070] In this application, the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0071] The term "layer" as used herein can refer to a portion of material comprising a region of thickness. A layer may extend over the entire underlying or overlying structure, or may have a extent smaller than that of the underlying or overlying structure. Furthermore, a layer may be a region of a homogeneous or non-homogeneous continuous structure, with a thickness less than that of the continuous structure. For example, a layer may be located between the top and bottom surfaces of the continuous structure, or between any pairs of lateral planes at the top and bottom surfaces. A layer may extend laterally, vertically, and / or along a tapered surface. An array substrate may be a layer, and may include one or more layers, and / or may have one or more layers located on, above, and / or below it. A layer may include multiple layers. For example, an interconnect layer may include one or more conductor and contact layers (forming contacts, interconnects, and / or vias therein) and one or more dielectric layers.

[0072] The display panel 10 can be an Organic Light Emitting Diode (OLED) display panel. This display panel 10 has a display area AA and a non-display area NA located on the outer periphery of the display area AA. The display area AA is provided with organic light-emitting material, which emits light under the influence of current to achieve image display. The non-display area NA is generally located on the outer periphery of the display area AA or is used to connect the display area AA to a perforated area within the display area AA. Besides providing some encapsulation protection and support for the display area AA, it can also be used to achieve electrical connection between the display area AA and external driving circuits and other electronic components to transmit electrical signals and realize the normal display function of the display area AA. Generally, the aforementioned non-display area NA is mostly arranged around the display area AA, that is, the edge of the display panel 10, forming a border-shaped area around the display area AA.

[0073] In the process of developing this application, the inventors discovered the following problem in the related technology: some pixel units have display abnormalities, which to some extent affect the display effect of the display panel 10 and ultimately affect its performance, reducing the reliability of the display panel 10.

[0074] Based on this, this application provides a display panel 10 to at least alleviate or improve the above-mentioned technical problems to a certain extent.

[0075] Please see Figures 1-3 The display panel 10 has a display area AA and a non-display area NA, with the non-display area NA surrounding the outer periphery of the display area AA.

[0076] Specifically, the non-display area NA includes an array substrate 1, an isolation structure 2, a lifting layer 3, a first filling layer 52, and a first encapsulation layer 4. The isolation structure 2 is located on the array substrate 1 and defines a plurality of isolation openings 201. The end of the isolation structure 2 facing away from the array substrate 1 is a first end face 202. The lifting layer 3 is located on the array substrate 1 and includes a first lifting portion 31 located on the side of the isolation structure 2 facing away from the array substrate 1. The first filling layer 52 is located on the side of the lifting layer 3 facing away from the array substrate 1, and the orthographic projection of the first filling layer 52 on the array substrate 1 covers the orthographic projection of the first lifting portion 31 on the array substrate 1. The first encapsulation layer 4 is located on the side of the isolation structure 2 facing away from the array substrate 1, and the first lifting portion 31 is located between the first end face 202 and the first encapsulation layer 4.

[0077] The content of the isolation structure 23 mentioned below can be found in patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, PCT / CN2024 / 099072, and CN. Further descriptions are provided in CN117979755A, CN117998900A, CN117062489A, CN117580403A, CN116583155A, CN116669477A, ​​CN117396039A, CN116669480A, CN116600606A, and CN117500332A for reference.

[0078] The first lifting portion 31, arranged on the first end face 202 of the isolation structure 2, can effectively increase the film thickness in that area. The isolation structure 2, the lifting layer 3, the first filling layer 52, and the first encapsulation layer 4 cooperate to form a special structure with a greater height difference on the surface of the non-display area NA facing away from the array substrate 1, thereby increasing the thickness of a portion of the non-display area NA and forming a barrier-like structure in the non-display area NA to enhance its ability to block external moisture. This helps to prevent moisture from the external environment from intruding into the display area AA and affecting the display effect of the display panel 10, thus improving the performance of the display panel 10.

[0079] In some embodiments, at least some of the isolation openings 201 are spaced apart along a first direction and / or a second direction, and the lifting layers 3 are sequentially arranged along the extension direction of the corresponding isolation openings 201 to form first lifting portions 31 arranged sequentially along the first direction and / or the second direction. The number of first filling layers 52 is the same as the number of lifting layers 3 and they are arranged in a one-to-one correspondence. The first filling layer 52 is located on the side of the first lifting portion 31 facing away from the array substrate 1, and the orthogonal projection of the first filling layer 52 on the array substrate 1 can cover the orthogonal projection of the first lifting portion 31 on the array substrate 1.

[0080] The first and second directions are parallel to the surface of the array substrate 1. The first and second directions can be orthogonal to each other or have a certain angle between them. The first lifting portion 31 can form a raised, dam-like structure on the first end face 202 of the isolation structure 2. When the first lifting portion 31 is arranged sequentially along the first and / or second directions, it can be arranged around the outer periphery of the display area AA and form a closed or semi-closed area that can surround the display area AA.

[0081] The structure formed by the distribution of the aforementioned multiple first lifting portions 31 along the non-display area NA, which surrounds the display area AA, is similar to a barrier wall. It can not only cooperate with the isolation structure 2 and the first encapsulation layer 4 to improve the encapsulation effect of the display panel 10, but also better isolate the display area AA from the external environment, preventing water, oxygen, and other substances from entering the display area AA, thereby improving the encapsulation reliability of the display panel 10. At the same time, it can also be used to limit the flow and diffusion range of other film layers covering the side of the first encapsulation layer 4 away from the array substrate 1 during the manufacturing process, helping to limit the corresponding film layer structure within the design range, so as to prevent material from overflowing into unwanted areas, thereby improving the processing yield of the display panel 10 and improving the reliability and performance of the display panel 10 to a certain extent.

[0082] For details, please refer to Figure 2 and Figure 3In the diagram, X indicates the first direction, and Y indicates the second direction, which are orthogonal to each other. Some of the isolation openings 201 are spaced apart along the first direction, and correspondingly, some of the first lifting parts 31 are spaced apart along the first direction and located in the same row; some of the isolation openings 201 are spaced apart along the second direction, and correspondingly, some of the first lifting parts 31 are spaced apart along the second direction and located in the same column.

[0083] The first lifting portions 31 located in the same row or column cooperate with each other to prevent overflow of the corresponding film layer arranged in the display area AA during the manufacturing process. The lifting layer 3 with the first lifting portion 31 is arranged at different positions along the first direction and the second direction to form a rectangular or similar rectangular structure surrounding the display area AA, which can further improve the overflow prevention function of the display panel 10.

[0084] The first filling layer 52 located on the side of the first lifting section 31 away from the array substrate 1 can further improve the overflow prevention effect of the display panel 10.

[0085] Specifically, the orthographic projection of the first filling layer 52 on the array substrate 1 covers the orthographic projection of the corresponding isolation opening 201 on the array substrate 1, and the corresponding isolation opening 201 is located on the side of the first filling layer 52 close to the array substrate 1.

[0086] In some embodiments, please refer to Figure 3 The orthographic projection of at least one isolation opening 201 adjacent to the corresponding isolation opening 201 on the array substrate 1 is spaced apart from the orthographic projection of the first filling layer 52 on the array substrate 1.

[0087] In other embodiments, please refer to Figure 4 At least two corresponding isolation openings 201 are set adjacent to each other, and at this time the two first filling layers 52 are also set adjacent to each other.

[0088] The above Figure 3 and Figure 4 The structures shown can appear simultaneously in the same display panel 10. They can be different structures set in different areas of the display panel 10, or they can be structures in the same area of ​​the display panel 10 from different viewing angles.

[0089] The orthographic projection of the first encapsulation layer 4 on the array substrate 1 covers the isolation structure 2 and the isolation opening 201.

[0090] Specifically, the non-display area NA also includes a planarization layer 9, which is located on the side of the first encapsulation layer 4 facing away from the array substrate 1. Please refer to [link / reference]. Figure 3The structure formed by the multiple first lifting portions 31 can block the planarization layer 9, reduce the possibility of overflow of the planarization layer 9 during the manufacturing process, and further improve the encapsulation effect of the display panel 10.

[0091] In some embodiments, the material of the planarization layer 9 includes an organic material. When the planarization layer 9 is made of an organic material, the organic material can be used to form the planarization layer 9 by techniques such as IJP (Ink-Jet Printing).

[0092] The planarization film layer formed by IJP technology can precisely control the film layer thickness at different positions, so that the surface of the final film layer facing away from the array substrate 1 is relatively flat, thereby improving the surface flatness of the first encapsulation layer 4. By filling the recessed parts, the surface of the display panel 10 is made flatter, avoiding affecting the display effect of the display panel 10 and helping to improve the performance of the display panel 10.

[0093] Please see Figure 3 The planarization layer 9 can be separated by the first encapsulation layer 4.

[0094] Specifically, the planarization layer 9 includes a plurality of planarization units 91 spaced apart, with adjacent planarization units 91 separated by the first encapsulation layer 4.

[0095] The orthographic projection of the first lifting portion 31 on the array substrate 1 and the orthographic projection of the planarization unit 91 on the array substrate 1 are arranged alternately. At this time, the first packaging portion 41 can separate the planarization layer 9 under the lifting action of the first lifting portion 31, so as to reduce the risk of overflow of the planarization layer 9 during the processing.

[0096] Please see Figure 3 The first lifting part 31 can cover the first end face 202 of the isolation structure 2 located at the corresponding position.

[0097] In addition to the first lifting section 31, the aforementioned lifting layer 3 also includes a second lifting section 32. The second lifting section 32 is located within the isolation opening 201 and is connected to the adjacent first lifting section 31.

[0098] Please see Figure 3 The display panel 10 has a plurality of spaced isolation openings 201, wherein the isolation opening 201 in the middle is filled with the aforementioned second lifting portion 32, and the first end face 202 of the isolation structure 2 on the periphery of the isolation opening 201 in the middle is covered with the aforementioned first lifting portion 31, and the first lifting portion 31 is connected to the second lifting portion 32.

[0099] Specifically, the lifting layer 3 formed by the cooperation of the first lifting part 31 and the second lifting part 32 constitutes the encapsulation of the corresponding isolation opening 201.

[0100] In some embodiments, in addition to the first fill layer 52, the non-display area NA also includes a second fill layer 51. (See [link to previous document]). Figure 3 .

[0101] Specifically, the second filling layer 51 is located between the lifting layer 3 and the array substrate 1. Multiple second filling layers 51 are arranged sequentially and at intervals within the corresponding isolation openings 201. Along the thickness direction of the display panel 10, the second filling layer 51 and the first filling layer 52 are arranged sequentially, with the second filling layer 51 located on the side of the lifting layer 3 closest to the array substrate 1.

[0102] Please refer to the structure of the first filling layer 52. Figure 3 .

[0103] Specifically, the first filling layer 52 includes a first filling sub-section 521, wherein the first filling sub-section 521 is arranged corresponding to the lifting layer 3 and is located on the side of the lifting layer 3 away from the array substrate 1.

[0104] In other words, the second filling layer 51 has a lifting layer 3 and a first filling sub-part 521 on the side away from the array substrate 1, that is, the first filling sub-part 521 and the lifting layer 3 are stacked on a portion of the second filling layer 51 in sequence.

[0105] Please see Figure 3 In addition to the first filling sub-part 521, the first filling layer 52 also includes a second filling sub-part 522, which covers the first end face 202.

[0106] It should be noted that the second filling sub-part 522 and the corresponding first lifting part 31 cover the same first end face 202 of the isolation structure 2.

[0107] Specifically, in the lifting layer 3 and the first filling layer 52 arranged sequentially corresponding to the same isolation opening 201, the orthographic projection of the second filling sub-part 522 on the array substrate 1 and the orthographic projection of the first lifting part 31 on the array substrate 1 are arranged alternately, or the outer contour of the orthographic projection of the second filling sub-part 522 on the array substrate 1 coincides exactly with the outer contour of the orthographic projection of the first lifting part 31 on the array substrate 1.

[0108] In some embodiments, the first filling layer 52 further includes a third filling sub-part 523, which connects the first filling sub-part 521 and the second filling sub-part 522, so that the first filling layer 52 forms a continuous film structure.

[0109] In the thickness direction of the display panel 10, there is a height difference between the end of the first filler portion 521 near the end of the second filler portion 522 and the end of the second filler portion 522. The third filler portion 523 extends along the outer edge of the lifting layer 3 to connect the first filler portion 521 and the second filler portion 522.

[0110] It should be noted that the first lifting part 31 and the first end face 202 are spaced apart, and the first lifting part 31 is suspended relative to the adjacent isolation structure 2.

[0111] Since the first filling layer 52 covers a portion of the first end face 202, the first filling layer 52 and the lifting layer 3 together form a cavity S on the first end face 202 of the isolation structure 2. Please refer to [link / reference]. Figure 3 The cavity S is a closed chamber and is not connected to the external environment.

[0112] During the preparation of the first filling layer 52, the second filling sub-part 522 in the first filling layer 52 is used to cover the first end face 202 of the isolation structure 2, and the third filling sub-part 523 in the first filling layer 52 is used to connect the second filling sub-part 522 and the first filling sub-part 521. Thus, during the preparation of the first filling layer 52, the first filling layer 52 contacts and covers the first end face 202 of the isolation structure 2 with the first lifting part 31 of the lifting layer 3, thereby closing the space between the first lifting part 31 and the first end face 202 and forming a closed chamber.

[0113] In some embodiments, please refer to Figure 3 The display panel also includes a third filling layer 53. In a direction parallel to the plane of the array substrate 1, the third filling layer 53 and the second filling layer 51 are respectively disposed in two adjacent isolation openings 201 and are disposed in the same layer.

[0114] The display area AA of the display panel 10 includes a light-emitting element, and the second filling layer 51 is the same layer and material as the light-emitting element. Correspondingly, the third filling layer 53 is also the same layer and material as the light-emitting element.

[0115] When one or more third filling layers 53 located in the adjacent display area AA are powered on, the corresponding third filling layer 53 can emit light. When not powered on, the corresponding third filling layer 53 does not emit light.

[0116] It should be noted that the first filler layer 52 and the third filler layer 53 are made of the same material. Please refer to [link / reference]. Figure 3 .

[0117] In some embodiments, the materials of the first filling layer 52 and the second filling layer 51 are different; in special cases, the materials of the first filling layer 52 and the second filling layer 51 may also be the same.

[0118] Specifically, the second filling layer, the first filling layer, and the third filling layer are all one of the first light-emitting unit, the second light-emitting unit, and the third light-emitting unit that emit different colors under energized conditions.

[0119] In some embodiments, the emitted color of at least one third filler layer 53 adjacent to the first filler layer 52 is the same as the emitted color of the corresponding first filler layer 52 and the film material is the same.

[0120] The second filling layer 51, located between the first filling layer 52 and the array substrate 1, and the third filling layer 53, which are disposed in the same layer, are prepared by different processes. Therefore, the emission color of the second filling layer 51 can be different from that of the third filling layer 53. Correspondingly, the first filling layer 52 and the third filling layer in the adjacent partial isolation opening 201 are prepared by the same process, so their emission colors are the same.

[0121] During the preparation process, the thickness of the film layer in some parts of the non-display area NA can be increased based on the film layer obtained in the previous step. At this time, the film layers prepared in the subsequent process cover different areas of the display panel 10 and form the first filling layer 52 and the third filling layer 53 respectively.

[0122] In some embodiments, each of the above-mentioned filler layers can be prepared by vapor deposition.

[0123] Specifically, the second filling layer 51 can be formed in the isolation opening 201 by vapor deposition, and the first filling layer 52 and the third filling layer can be formed on the side of the isolation structure 2 and the lifting layer 3 away from the array substrate 1 by vapor deposition.

[0124] Specifically, the second filling layer 51, the first filling layer 52, and the third filling layer 53, which emit different colors under energized conditions, all include a light-emitting material layer 501 and a first electrode layer 502 stacked sequentially.

[0125] In a direction parallel to the plane of the array substrate 1, the light-emitting material layer 501 and the first electrode layer 502 in the adjacent third filling layer 53 and first filling layer 52 are made of the same material.

[0126] In some embodiments, the emission wavelength of the first light-emitting unit may be set to be smaller than the emission wavelength of the second light-emitting unit, and the emission wavelength of the second light-emitting unit may be smaller than the emission wavelength of the third light-emitting unit.

[0127] The luminescent material layer 501 can be made of organic small molecule luminescent materials, complex luminescent materials, or polymers. Different luminescent material layers 501 can emit different colors of light when electricity is applied. In other words, the luminescent material layers 501 in the first, second, and third luminescent units are made of different materials and emit different colors of light.

[0128] Specifically, the light-emitting material layer 501 in the first light-emitting unit can be configured to emit a wavelength smaller than that of the light-emitting material layer 501 in the second light-emitting unit under energized conditions. The light-emitting material layer 501 in the second light-emitting unit can also emit a wavelength smaller than that of the light-emitting material layer 501 in the third light-emitting unit under energized conditions.

[0129] Generally, the luminescent material layer 501 in the first luminescent unit can be configured to emit blue light when energized, the luminescent material layer 501 in the second luminescent unit can emit green light when energized, and the luminescent material layer 501 in the third luminescent unit can emit red light when energized.

[0130] Please see Figure 3 In the figure, the third light-emitting unit constitutes the first filling layer 52 and the third filling layer 53. Correspondingly, the first light-emitting unit constitutes the second filling layer 51 located between the first filling layer 52 and the array substrate 1.

[0131] In other embodiments, the second filling layer 51 located between the first filling layer 52 and the array substrate 1 may also be composed of a second light-emitting unit.

[0132] Please see Figure 4 In the figure, the two adjacent isolation openings 201 are respectively filled with a second filling layer 51 and a third filling layer 53, wherein the second filling layer 51 and the third filling layer 53 are respectively composed of a first light-emitting unit and a second light-emitting unit. In addition, the second filling layer 51 is provided with a lifting layer 3 and a first filling layer 52 on the side facing away from the array substrate 1.

[0133] The second filling layer 51 is disposed inside the isolation opening 201 and is connected to the side of the isolation structure 2 facing the isolation opening 201.

[0134] Please see Figure 3 In the figure, the first electrode layer 502 of the second filling layer 51 is connected to the side wall of the isolation structure 2 facing the isolation opening 201.

[0135] Specifically, the first electrode layer 502 is a cathode layer. The first electrode layer 502 overlaps with the side of the isolation structure 2 closest to the array substrate 1.

[0136] In some embodiments, the isolation structure 2 includes a first isolation portion 21 and a second isolation portion 22 stacked in sequence, wherein the second isolation portion 22 is located on the side of the first isolation portion 21 away from the array substrate 1, and the first end face 202 is located at the end of the second isolation portion 22 away from the first isolation portion 21.

[0137] Specifically, the orthographic projection of the first isolation portion 21 on the array substrate 1 is within the orthographic projection range of the second isolation portion 22 on the array substrate 1, and at this time the isolation structure 2 presents an overall shape that is "wider at the top and narrower at the bottom".

[0138] In some embodiments, the first isolation portion 21 of the isolation structure 2 is a conductive structure, which may be a single-layer structure or a multi-layer structure.

[0139] When the first isolation section 21 has a multi-layer structure, the first isolation section 21 may be configured to include at least two sub-support sections 211 stacked in sequence.

[0140] Specifically, the orthographic projection of the sub-support portion 211 farthest from the array substrate 1 onto the array substrate 1 is located within the orthographic projection range of the sub-support portion 211 closest to the array substrate 1 onto the array substrate 1.

[0141] In some embodiments, the orthographic projection of the sub-support portion 211 near the array substrate 1 onto the array substrate 1 is located within the orthographic projection range of the second isolation portion 22 onto the array substrate 1.

[0142] The sidewall of the sub-support portion 211 far from the array substrate 1 facing the isolation opening 201 is offset in a direction away from the isolation opening 201, relative to the sidewall of the sub-support portion 211 near the array substrate 1 facing the isolation opening 201, so that the cross-sectional sidewall of the isolation structure 2 presents a roof-like shape.

[0143] Of course, in other similar embodiments, the dimensional and projection relationship between the first isolation portion 21 and the second isolation portion 22 can also be adaptively adjusted according to actual processing needs.

[0144] In some embodiments, the first isolation portion 21 and the second isolation portion 22 are similar in shape to a rectangle or a trapezoid in cross-section.

[0145] In some embodiments, the first isolation portion 21 and the second isolation portion 22 may be an integrally formed structure or may be formed by stacking different materials.

[0146] Specifically, the material of the second isolation portion 22 includes titanium metal, which is a titanium metal layer; the material of the sub-support portion 211 far from the array substrate 1 includes aluminum metal, which is an aluminum metal layer; and the material of the sub-support portion 211 close to the array substrate 1 includes at least one of molybdenum and molybdenum nitride, which is a molybdenum metal layer.

[0147] The first electrode layer 502 in the second filling layer 51 overlaps with the sidewall of the first isolation portion 21 in the isolation structure 2. Specifically, the first electrode layer 502 may overlap only with the sub-support portion 211 near the array substrate 1. Please refer to [link to relevant documentation]. Figure 3 It can also be connected to two sub-supports 211 simultaneously; please refer to [link / reference]. Figure 5 .

[0148] The non-display area NA also includes a second electrode layer 7, which is arranged correspondingly to the isolation opening 201. The second filling layer 51 can be connected to the second electrode layer 7 through the light-emitting material layer 501.

[0149] When the first electrode layer 502 is the cathode layer, the second electrode layer 7 is the anode layer; of course, the first electrode layer 502 can also be adjusted to be the anode layer as needed, in which case the second electrode layer 7 is the cathode layer.

[0150] The preparation and processing methods of the first electrode layer 502, the light-emitting material layer 501, and the second electrode layer 7 are existing technologies and will not be described in detail here.

[0151] The non-display area NA also contains a pixel definition layer 6.

[0152] Please see Figures 3-4 The pixel definition layer 6 is located between the array substrate 1 and the isolation structure 2. The pixel definition layer 6 defines a plurality of pixel openings 601, which are correspondingly disposed and connected to the isolation openings 201.

[0153] The pixel definition layer 6 is an inorganic layer that can be used to define the pixel range, ensuring that each pixel is independent of the others. It can also block moisture in the array substrate 1 and prevent external factors such as water and oxygen from eroding the relevant film layers on the side of the pixel definition section away from the array substrate 1.

[0154] Please see Figure 3 The second electrode layer 7 is located between the array substrate 1 and the pixel definition layer 6 and can be exposed relative to the pixel opening 601 and is attached to the light-emitting material layer 501.

[0155] The structure of the first encapsulation layer 4 described above is described below:

[0156] Specifically, the first encapsulation layer 4 includes a first encapsulation portion 41 and a second encapsulation portion 42 connected together. The first encapsulation portion 41 is located on the side of the first filler layer 52 facing away from the array substrate 1, and the second encapsulation portion 42 is used to connect adjacent first encapsulation portions 41. Please refer to [link to relevant documentation]. Figure 3 .

[0157] Specifically, the orthographic projection of the first packaging part 41 on the array substrate 1 covers the orthographic projection of the corresponding isolation opening 201 on the array substrate 1, and the corresponding isolation opening 201 is located on the side of the first packaging part 41 close to the array substrate 1.

[0158] Please see Figure 3 At this time, the orthographic projection of the second encapsulation portion 42 on the array substrate 1 covers the orthographic projection of at least one isolation opening 201 adjacent to the corresponding isolation opening 201 on the array substrate 1; in other embodiments, please refer to Figure 4 At least two corresponding isolation openings 201 are set adjacent to each other, and at this time the two first filling layers 52 are set adjacent to each other.

[0159] The second encapsulation portion 42 includes a first encapsulation sub-portion 421 and a second encapsulation sub-portion 422, wherein the first encapsulation sub-portion 421 is spaced apart from the first end face 202 of the adjacent isolation structure 2, i.e., it is suspended relative to the first end face 202; the second encapsulation sub-portion 422 is used to connect the first encapsulation sub-portion 421 and the first encapsulation portion 41.

[0160] Specifically, the first encapsulation sub-part 421 is located on the side of the first end face 202 away from the array substrate 1 and is suspended relative to the first end face 202. The second encapsulation sub-part 422 covers the third filling layer 53 located in the corresponding isolation opening 201. One end of the second encapsulation sub-part 422 extends through the side wall of the isolation structure 2 to connect with the first encapsulation sub-part 421, and the other end of the second encapsulation sub-part 422 extends through the side wall of the isolation structure 2 to connect with the first encapsulation sub-part 41.

[0161] It should be noted that the first encapsulation layer 4 mentioned above can be a thin film layer prepared by chemical vapor deposition (CVD) technology.

[0162] The first encapsulation layer 4 mentioned above can be prepared by CVD technology from at least one of organic and inorganic materials.

[0163] Under the action of the second encapsulation sub-part 422, the second encapsulation part 42 is connected to the first encapsulation part 41 and forms a continuous film layer structure, namely the first encapsulation layer 4 mentioned above. The first encapsulation layer 4 can be used to achieve preliminary encapsulation of the non-display area (NA) film layer.

[0164] The first encapsulation layer 4 can be used to enhance the sealing of the non-display area NA, reduce the possibility of water, oxygen and other substances in the external environment entering the display area AA through the non-display area NA, and at the same time help to improve the structural stability and mechanical strength of the display panel 10, so that the display panel 10 can better withstand external pressure and stress without deformation and damage, thereby improving the reliability and performance of the display panel 10.

[0165] In some embodiments, the lifting layer 3 and the first encapsulation layer 4 can be fabricated using the same process.

[0166] It should be noted that in this embodiment and other similar embodiments, a border area is provided outside the aforementioned non-display area NA, and a baffle is provided within the border area. The structure of the baffle has been disclosed in related technologies and will not be described in detail here.

[0167] After the non-display area NA surface is encapsulated by the first encapsulation layer 4, the planarization layer 9 and other film structures can be provided on the side of the first encapsulation layer 4 away from the array substrate 1 to further encapsulate the display panel 10.

[0168] Specifically, the non-display area NA also includes a second encapsulation layer 8 that covers the first encapsulation layer 4.

[0169] Please see Figures 3-4 The second encapsulation layer 8 covers the planarization layer 9, which is located between the first encapsulation layer 4 and the second encapsulation layer 8.

[0170] In other embodiments, the second encapsulation layer 8 can be a single-layer structure or a multi-layer structure. The second encapsulation layer 8 can be an organic encapsulation film layer or an inorganic encapsulation film layer. Of course, when the second encapsulation layer 8 is a multi-layer structure, it can also include both organic and inorganic encapsulation film layers.

[0171] In this embodiment or other similar embodiments, at least one film layer structure selected from the following can also be provided on the side of the second encapsulation layer 8 facing away from the array substrate 1: a touch layer, an organic adhesive layer, and a cover plate.

[0172] It is understood that the display panel 10 provided in this application embodiment can increase the thickness of the corresponding position of the display panel 10 by providing a first lifting part 31 outside the first end face 202 of the isolation structure 2 in the non-display area NA, thereby forming a structure similar to a barrier in the non-display area NA, which can improve the possibility of water, oxygen and other substances in the external environment invading the display area AA in the non-display area NA, thereby improving the reliability of the display panel 10 and making the display panel 10 have a better display effect; in addition, the regular arrangement of the above-mentioned first lifting part 31 can block the planarization layer 9, thereby improving the overflow failure of the planarization layer 9, helping to improve the encapsulation effect of the display panel 10, and further improving the performance of the display panel 10.

[0173] In a second aspect, embodiments of this application provide a method for manufacturing a display panel 10, the display panel 10 including a display area AA and a non-display area NA, the non-display area NA having an array substrate 1, the method comprising:

[0174] Step S1: An isolation structure 2 is formed on one side of the array substrate 1. The isolation structure 2 encloses and forms a plurality of isolation openings 201. The end of the isolation structure 2 facing away from the array substrate 1 is the first end face 202.

[0175] Step S2: A lifting layer 3 is formed on the side of the partial isolation structure 2 away from the array substrate 1. The lifting layer 3 includes a first lifting portion 31, which covers the first end face 202 near the isolation opening 201.

[0176] Step S3: A filling material layer and a first encapsulation layer 4 are formed on the side of the isolation opening 201 and the isolation structure 2 facing away from the array substrate 1.

[0177] The first filling layer 52 is formed by covering the portion of the lifting layer 3 that is away from the array substrate 1 with a filling material layer, and the first encapsulation layer 4 covers the filling material layer.

[0178] Please refer to the above preparation method. Figure 6 .

[0179] In the manufacturing method of the display panel 10 provided in this application embodiment, a barrier-like structure can be formed on the non-display area NA by covering the first lifting portion 31 and the first filling layer 52 of the first end face 202 of the array substrate 1. This barrier structure can help increase the discontinuity of the first encapsulation layer 4 covering the first lifting portion 31, the first filling layer 52, and the isolation structure 2 at different positions, thereby increasing the difficulty for moisture in the external environment to penetrate into the display area AA of the display panel 10 through the non-display area NA, improving the reliability of the display panel 10, and giving the display panel 10 better performance.

[0180] In some embodiments, a planarization layer 9 is covered on the side of the first encapsulation layer 4 that is opposite to the array substrate 1.

[0181] At this time, the structure similar to a baffle formed by the first lifting part 31, the first filling layer 52 and the first encapsulation layer 4 helps to improve the overflow problem of the planarization layer 9, helps to improve the display effect of the display panel 10, and further prevents water, oxygen and other substances from eroding the display area AA, so as to improve the performance of the display panel 10.

[0182] The aforementioned isolation opening 201 includes a first opening and a second opening, wherein the lifting layer 3 covers the first opening. The orthographic projection of the lifting layer 3 on the array substrate 1 covers the orthographic projection of the first opening on the array substrate 1, and the orthographic projection of the lifting layer 3 on the array substrate 1 and the orthographic projection of the second opening on the array substrate 1 are spaced apart.

[0183] In some embodiments, a lifting layer 3 is formed on the side of the partial isolation structure 2 facing away from the array substrate 1. The lifting layer 3 includes a first lifting portion 31. The step of the first lifting portion 31 covering the first end face 202 near the isolation opening 201 includes:

[0184] A lifting layer 3 is prepared inside the first opening and on the side surface of the first end face 202 facing away from the array substrate 1.

[0185] Before performing the above steps, the method further includes: preparing a second filling layer 51 within the first opening.

[0186] Specifically, the preparation process of the second filling layer 51 and the lifting layer 3 is as follows:

[0187] In sequence, a light-emitting material layer 501, a first electrode layer 502, and a CVD layer are prepared on the side of the isolation structure 2 and the isolation opening 201 opposite to the array substrate 1.

[0188] The above-mentioned light-emitting material layer 501, first electrode layer 502 and CVD layer are patterned to form a second filling layer 51 and a lifting layer 3 located in the corresponding isolation opening 201, wherein the first lifting portion 31 of the lifting layer 3 is located on the side of the isolation structure 2 away from the array substrate 1.

[0189] Please refer to the intermediate structure of the display panel 10 prepared as described above. Figure 7A .

[0190] In some embodiments, between steps S2 and S3, a filling material layer is prepared in the non-display area NA, namely the light-emitting material layer 501 and the first electrode layer 502 mentioned above, the filling material layer located in the second opening forms a third filling layer 53, and the filling material layer located on the side of the lifting layer 3 away from the array substrate 1 forms a first filling layer 52.

[0191] After the first filling layer 52 and the third filling layer 53 are prepared, the first encapsulation layer 4 is formed on the side of the isolation structure 2 away from the array substrate 1. The first encapsulation layer 4 covers the first filling layer 52, the third filling layer 53 and the isolation structure 2.

[0192] In some embodiments, after step S3, a planarization layer 9 and a second planarization layer 8 are sequentially stacked on the side of the first encapsulation layer 4 away from the array substrate 1, so as to planarize the surface of the display panel 10 and further improve the encapsulation effect of the display panel 10.

[0193] In this preparation method, the specific structure of the display panel 10 can refer to the structure of any embodiment of the display panel 10 described above, and will not be repeated here.

[0194] The following example illustrates the fabrication process of the non-display area NA of the display panel 10, using the example that the first filling layer 52 and the third filling layer 53 emit red light (i.e., the third light-emitting unit is used to form the first filling layer 52 and the third filling layer 53) and the second filling layer 51 emits blue light (i.e., the first light-emitting unit is used to form the second filling layer 51). This will visually demonstrate the influence of the lifting layer 3, the second filling layer 51, and the first filling layer 52, in conjunction with the first encapsulation layer 4, on the thickness of the non-display area NA film, and the principle that can improve the encapsulation performance and anti-overflow effect of the display panel 10.

[0195] During the fabrication of the lifting layer 3, each isolation opening 201 and the first end face 202 of the isolation structure 2 are provided with the aforementioned first light-emitting unit for forming the second filling layer 51, and the side of the first light-emitting unit facing away from the array substrate 1 is covered with a CVD layer. Subsequently, the first light-emitting units and CVD layers located in the first end face 202 and part of the isolation openings 201 (referring to isolation openings 201 used to accommodate light-emitting units of other colors) are removed. In this process, the correctly positioned first light-emitting units and CVD layers can remain within the corresponding isolation openings 201 under the protection of photoresist and form the second filling layer 51. At this time, the CVD layer can be used to protect the first light-emitting units located within the isolation openings 201, preventing the first light-emitting units from being etched away. The CVD layer forms the lifting layer 3.

[0196] Based on this method, we can obtain, for example Figure 7A The structure of the display panel 10 shown.

[0197] A third light-emitting unit is fabricated again on the isolation structure 2, covering all the isolation openings 201 and the first end face 202 of the isolation structure 2. Subsequently, a CVD layer is deposited on the side of the third light-emitting unit facing away from the array substrate 1, resulting in... Figure 7B The structure of the display panel 10 shown is as follows. In this process, the third light-emitting unit is separated by the isolation structure 2, wherein: the third light-emitting unit located on the side of the lifting layer 3 away from the array substrate 1 is used to form the first filling layer 52, and the third light-emitting unit located in the isolation opening 201 and attached to the second electrode layer 7 is used to form the third filling layer 53. At this time, the CVD layer covers the first filling layer 52 and the third filling layer 53 and forms the first encapsulation layer 4.

[0198] Finally, a planarization layer 9 and a second encapsulation layer 8 can be sequentially applied to the side of the first encapsulation layer 4 facing away from the array substrate 1 to obtain a display panel 10 that meets the design requirements. The structure of the display panel 10 is as follows: Figure 7C As shown.

[0199] It is important to note that Figures 7A-7CThis diagram is for illustrative purposes only. The arrangement and sequence of the light-emitting units and light-transmitting openings in the diagram are for illustrative purposes only and are not intended to limit the arrangement and layout of the above structures.

[0200] The method for manufacturing the display panel 10 provided in this embodiment can increase the thickness of a portion of the non-display area NA by patterning only the front pixels, thereby forming a barrier-like effect within the non-display area NA and creating a structure with a certain blocking function outside the display area AA. This structure can reduce the overflow risk of the planarization layer 9, improve the resistance of the display panel 10 to moisture intrusion, and improve the encapsulation effect and performance of the display panel 10.

[0201] In a fourth aspect, this application also provides a display device 100, including the display panel 10 described in any of the preceding claims. Please refer to [link to relevant documentation]. Figure 8 The display device 100 includes the display panel 10 described in any of the above-described embodiments. The display panel 10 may be the display panel 10 described above, or it may be a display panel 10 prepared by the above-described preparation method.

[0202] The display device 100 provided in this embodiment can be a mobile phone, laptop, tablet computer, smartwatch, smart bracelet, navigator, monitor, personal digital assistant (PDA), or other products or components with display functions. Since the display device 100 provided in this embodiment includes the aforementioned display panel 10, the display device 100 possesses at least the beneficial effects of any one or more of the aforementioned display panels 10. Specific effects are described in the foregoing embodiments and will not be repeated here.

[0203] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A display panel, characterized in that, The display panel (10) has a display area (AA) and a non-display area (NA), the non-display area (NA) being disposed around the outer periphery of the display area (AA); the non-display area (NA) includes: Array substrate (1); An isolation structure (2) is located on the array substrate (1). The isolation structure (2) is surrounded by a plurality of isolation openings (201). The end of the isolation structure (2) facing away from the array substrate (1) is a first end face (202). A lifting layer (3) is located on the array substrate (1). The lifting layer (3) includes a first lifting portion (31) located on the side of the isolation structure (2) away from the array substrate (1), and also includes a second lifting portion (32) located in the isolation opening (201). The second lifting portion (32) is connected to the adjacent first lifting portion (31) to form an encapsulation of the corresponding isolation opening (201). A first filling layer (52) is located on the side of the lifting layer (3) away from the array substrate (1). The orthographic projection of the first filling layer (52) on the array substrate (1) covers the orthographic projection of the first lifting portion (31) on the array substrate (1). The first filling layer (52) includes a first filling sub-part (521), a second filling sub-part (522), and a third filling sub-part (523). The first filling sub-part (521) is arranged correspondingly to the lifting layer (3) and is located on the side of the lifting layer (3) away from the array substrate (1). The second filling sub-part (522) covers the first end face (202). The third filling sub-part (523) connects the first filling sub-part (521) and the second filling sub-part (522). A cavity (S) is provided between the first filling layer (52), the lifting layer (3), and the first end face (202). The first encapsulation layer (4) is located on the side of the first filling layer (52) away from the array substrate (1).

2. The display panel according to claim 1, characterized in that, The orthographic projection of the first filling layer (52) on the array substrate (1) covers the orthographic projection of the corresponding isolation opening (201) on the array substrate (1), and the corresponding isolation opening (201) is located on the side of the first filling layer (52) close to the array substrate (1). At least two of the corresponding isolation openings (201) are arranged adjacent to each other.

3. The display panel according to claim 2, characterized in that, At least one of the isolation openings (201) adjacent to the corresponding isolation opening (201) is positioned at an interval from the orthographic projection of the first filling layer (52) on the array substrate (1).

4. The display panel according to claim 1, characterized in that, The display panel (10) further includes a second filling layer (51), which is disposed in the corresponding isolation opening (201) and located on the side of the lifting layer (3) close to the array substrate (1).

5. The display panel according to claim 4, characterized in that, The display area (AA) of the display panel (10) includes a light-emitting element, and the second filling layer (51) is of the same layer and material as the light-emitting element.

6. The display panel according to claim 4, characterized in that, The display panel (10) further includes a third filling layer (53). In a direction parallel to the plane of the array substrate (1), the third filling layer (53) and the second filling layer (51) are respectively disposed in two adjacent isolation openings (201) and are disposed in the same layer. The third filling layer (53) is made of the same material as the first filling layer (52); And / or, the second filler layer (51) is made of a different material than the third filler layer (53).

7. The display panel according to claim 6, characterized in that, The second filling layer (51), the first filling layer (52) and the third filling layer (53) each include a light-emitting material layer (501) and a first electrode layer (502) stacked sequentially.

8. The display panel according to claim 1, characterized in that, The non-display area (NA) further includes a pixel definition layer (6), which is located between the array substrate (1) and the isolation structure (2). The pixel definition layer (6) defines a plurality of pixel openings (601), which are arranged correspondingly to and communicate with the isolation openings (201). The non-display area (NA) further includes a second electrode layer (7), which is located between the array substrate (1) and the pixel definition layer (6), with a portion of the second electrode layer (7) exposed through the pixel opening (601).

9. The display panel according to claim 1, characterized in that, The isolation structure (2) includes a first isolation portion (21) and a second isolation portion (22) stacked sequentially on the array substrate (1), wherein the first end face (202) is located at the end of the second isolation portion (22) away from the first isolation portion (21); The orthographic projection of the first isolation portion (21) on the array substrate (1) is within the orthographic projection range of the second isolation portion (22) on the array substrate (1).

10. The display panel according to claim 1, characterized in that, The first encapsulation layer (4) includes a first encapsulation portion (41) and a second encapsulation portion (42) connected together. The first encapsulation portion (41) is located on the side of the first filling layer (52) away from the array substrate (1), and the second encapsulation portion (42) is connected to the adjacent first encapsulation portion (41). The orthographic projection of the first encapsulation part (41) on the array substrate (1) covers the orthographic projection of the corresponding isolation opening (201) on the array substrate (1), and the corresponding isolation opening (201) is located on the side of the first encapsulation part (41) close to the array substrate (1). At least two of the corresponding isolation openings (201) are arranged adjacent to each other; The orthographic projection of the second encapsulation portion (42) on the array substrate (1) covers the orthographic projection of at least one isolation opening (201) adjacent to the corresponding isolation opening (201) on the array substrate (1).

11. The display panel according to claim 10, characterized in that, The second encapsulation portion (42) includes a first encapsulation sub-portion (421) and a second encapsulation sub-portion (422). The first encapsulation sub-portion (421) is located on the side of the first end face (202) away from the array substrate (1) and the first encapsulation sub-portion (421) is spaced apart from the first end face (202). The second encapsulation sub-portion (422) connects the first encapsulation sub-portion (421) and the first encapsulation portion (41).

12. The display panel according to claim 1, characterized in that, The non-display area (NA) also includes a second encapsulation layer (8) covering the first encapsulation layer (4); The non-display area (NA) also includes a planarization layer (9) located between the first encapsulation layer (4) and the second encapsulation layer (8).

13. The display panel according to claim 12, characterized in that, The planarization layer (9) includes a plurality of planarization units (91) spaced apart, and two adjacent planarization units (91) are separated by the first encapsulation layer (4); The orthographic projection of the first lifting part (31) on the array substrate (1) and the orthographic projection of the planarization unit (91) on the array substrate (1) are arranged alternately.

14. A method for manufacturing a display panel, characterized in that, The display panel (10) has a display area (AA) and a non-display area (NA), the non-display area (NA) being disposed around the outer periphery of the display area (AA), and the manufacturing method comprising: An isolation structure (2) is formed on one side of the array substrate (1). The isolation structure (2) encloses and forms a plurality of isolation openings (201) located in the non-display area (NA). The end of the isolation structure (2) facing away from the array substrate (1) is a first end face (202). A lifting layer (3) is formed on the side of the isolation structure (2) away from the array substrate (1). The lifting layer (3) includes a first lifting portion (31) and a second lifting portion (32). The first lifting portion (31) covers the first end face (202) near the isolation opening (201). The second lifting portion (32) is located in the isolation opening (201) and connected to the adjacent first lifting portion (31) to form an encapsulation of the corresponding isolation opening (201). A filling material layer and a first encapsulation layer (4) are formed on the side of the isolation opening (201) and the isolation structure (2) away from the array substrate (1). The filling material layer covers the portion of the lifting layer (3) away from the array substrate (1) to form a first filling layer (52). The orthographic projection of the first filling layer (52) on the array substrate (1) covers the orthographic projection of the first lifting portion (31) on the array substrate (1). The first filling layer (52) includes a first filling sub-part (521), a second filling sub-part (522), and a third filling sub-part (523). The first filling sub-part (521) is arranged correspondingly to the lifting layer (3) and is located on the side of the lifting layer (3) away from the array substrate (1). The second filling sub-part (522) covers the first end face (202). The third filling sub-part (523) connects the first filling sub-part (521) and the second filling sub-part (522). A cavity (S) is provided between the first filling layer (52), the lifting layer (3), and the first end face (202).

15. The method for manufacturing a display panel according to claim 14, characterized in that, The isolation opening (201) includes an adjacent first opening and a second opening; The step of forming a lifting layer (3) on the side of a portion of the isolation structure (2) away from the array substrate (1), the lifting layer (3) including a first lifting portion (31) and a second lifting portion (32), the first lifting portion (31) covering the first end face (202) near the isolation opening (201), and the second lifting portion (32) located within the isolation opening (201) and connected to the adjacent first lifting portion (31) to constitute the encapsulation of the corresponding isolation opening (201) includes: A lifting layer (3) is prepared in the first opening and on the side surface of the first end face (202) near the first opening that is away from the array substrate (1).

16. The method for manufacturing a display panel according to claim 15, characterized in that, Before the step of preparing the lifting layer (3) within the first opening and on the side surface of the first end face (202) near the first opening that faces away from the array substrate (1), the method further includes: A second filling layer (51) is prepared in the first opening; The portion of the filling material layer located at the second opening forms a third filling layer (53).

17. A display device, characterized in that, Includes a display panel (10), which is the display panel (10) according to any one of claims 1-13, or a display panel (10) prepared by the preparation method according to any one of claims 14-16.

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