Bonded structure, method for producing same, conductive member for solder bonded, and structure

Abstract

A bonded structure having a first conductive member, a second conductive member, and a solder bonding portion that bonds the first conductive member and the second conductive member, in which at least one of the first conductive member and the second conductive member contains particles of a metal and a layered material containing one or more layers.

Description

Technical Field

[0001] The present disclosure relates to a joined structure and a method for manufacturing the same, a conductive member for solder joining, and a structure for solder joining. Background Art

[0002] Usually, an electronic component includes a component body and an external electrode disposed on its surface. When the electronic component is mounted on a substrate, the external electrode can be soldered to an electrode portion (e.g., a pad) formed on the substrate (in this specification, the joint formed thereby is also referred to as a "solder joint"). In solder bonding, the metal constituting the external electrode diffuses excessively due to contact with the solder material, sometimes causing so-called "solder corrosion". As a countermeasure to prevent this "solder corrosion", for example, a process of forming a barrier layer such as nickel plating on the surface of the wiring and the electrode can be cited. However, pretreatment using acid, alkali, or other liquids can reduce the adhesion strength of the conductor to the substrate, and also bring about problems such as high costs due to the additional plating process.

[0003] For example, in the case of silver, which is a metal constituting the external electrode, a silver / palladium conductor or a silver / platinum conductor to which palladium or platinum having high heat resistance is added can be used. In addition, as a technique for forming surface wiring by post-firing based on a thick film method, a conductive paste formed by adding manganese oxide, chromium oxide, and glass frit to silver / palladium can be used. However, post-firing based on a thick film method increases the cost because of the increase in man-hours.

[0004] In addition, the glass frit softens during firing and accumulates between the conductor particles. Therefore, if solder corrosion occurs on the conductor surface, the layer formed by the remaining glass is exposed, which causes problems such as repelling the solder material. In addition, since the conductor resistance of the silver / palladium conductor is high, there is a problem of large conductor loss of electrical signals in the surface wiring.

[0005] In addition, as another countermeasure, Patent Document 1 shows a conductive paste containing 0.2 to 1 parts by weight of manganese dioxide, 0.2 to 1 parts by weight of copper oxide, 0.3 to 1 parts by weight of silicon dioxide, and 3 to 5.6 parts by weight of metal powders of molybdenum and tungsten per 100 parts by weight of silver / platinum.

[0006] Prior art literature

[0007] Patent Literature

[0008] Patent Document 1: Japanese Patent Application Publication No. 2001-143527 Summary of the invention

[0009] Problems to be solved by the invention

[0010] Electrodes or wirings constituting electronic components are required to exhibit high conductivity while preventing solder corrosion. However, the structure shown in Patent Document 1 also has the problem of increased man-hours and increased costs. The present disclosure is made in view of the above circumstances, and its purpose is to provide a joint structure that prevents solder corrosion and has excellent conductivity, a method for manufacturing the joint structure at a reduced cost, a conductive member for solder joint, and a structure for solder joint.

[0011] Means for solving problems

[0012] According to one aspect of the present invention, there is provided a joint structure including a first conductive member, a second conductive member, and a solder joint portion joining the first conductive member and the second conductive member.

[0013] At least one of the first conductive member and the second conductive member includes a metal and particles of a layered material including one or more layers.

[0014] As a preferred embodiment of the present invention, there is provided a joint structure having a first conductive member, a second conductive member, and a solder joint portion joining the first conductive member and the second conductive member.

[0015] At least one of the first conductive member and the second conductive member includes:

[0016] Metal; and

[0017] One or more conductive particles selected from (i) the first conductive particles and (ii) the second conductive particles, wherein:

[0018] (i) the first conductive particles are particles comprising one or more layers of a layered material,

[0019] The above layer comprises the following formula: M m X n The layer body shown and the modification or terminal T (T is at least one selected from a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom and a hydrogen atom) present on the surface of the layer body,

[0020] (Formula M m X n Wherein, M is at least one metal of Group 3, 4, 5, 6, or 7,

[0021] X is a carbon atom, a nitrogen atom or a combination thereof,

[0022] n is greater than or equal to 1 and less than or equal to 4,

[0023] m is greater than n and less than 5),

[0024] (ii) The second conductive particle is represented by the following formula: m AX n express,

[0025] (Formula M m AX n Wherein, M is at least one metal of Group 3, 4, 5, 6, or 7,

[0026] X is a carbon atom, a nitrogen atom or a combination thereof,

[0027] A is at least one element of Group 12, 13, 14, 15, or 16,

[0028] n is greater than or equal to 1 and less than or equal to 4,

[0029] m is greater than n and less than 5).

[0030] Effects of the Invention

[0031] According to the present disclosure, a joint structure is provided, which has a first conductive member, a second conductive member, and a solder joint portion that joins the first conductive member and the second conductive member, at least one of the first conductive member and the second conductive member contains particles of a metal and a layered material containing one or more layers, preferably contains one or more conductive particles of a specified first conductive particle and a specified second conductive particle, thereby preventing solder corrosion and showing high conductivity. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 This is a schematic cross-sectional view showing a part of a conventional joint structure.

[0033] Figure 2 This is a schematic cross-sectional view showing a part of the joined structure according to the present embodiment.

[0034] Figure 3 This is a schematic cross-sectional view schematically showing MXene, which is a layered material that can be used in the bonded structure of the present embodiment.

[0035] Figure 4 This is a schematic cross-sectional view of a mounting structure in which an electronic component is mounted on a substrate, which is shown as an example of a bonding structure according to the present embodiment.

[0036] Figure 5 This is a graph showing the results of the solder corrosion test in Examples, that is, the relationship between the immersion time in the solder tank and the mass of the conductive member sample.

[0037] Figure 6 These are microscope photographs showing the appearance of samples before and after the solder corrosion test in Examples. DETAILED DESCRIPTION

[0038] (Embodiment 1: Joined structure)

[0039] Hereinafter, a joined structure in one embodiment of the present invention will be described in detail, but the present disclosure is not limited to this embodiment.

[0040] A joint structure in this embodiment includes a first conductive member, a second conductive member, and a solder joint portion that joins the first conductive member and the second conductive member.

[0041] At least one of the first conductive member and the second conductive member includes a metal and particles of a layered material including one or more layers.

[0042] As particles of a layered material containing one or more layers in the above-mentioned joint structure, for example, MXene particles described in detail below, MAX particles described in detail below, graphene, graphene oxide, silicene, black phosphorus, borane, titanium oxide nanosheets, transition metal dichalcogenides, boron nitride, etc., can be cited, and particles containing one or more of them can be cited. By at least one of the above-mentioned first conductive member and the above-mentioned second conductive member containing particles of the layered material containing one or more layers, even if the above-mentioned metal is silver, copper, etc. that easily diffuses into the solder metal (such as tin, etc.) during solder bonding, solder corrosion can be prevented. As particles of a layered material containing one or more layers in the above-mentioned joint structure, it is preferred to contain one or more particles of MXene particles and MAX particles, and / or one or more particles of graphene and graphene oxide. The particles of a layered material containing one or more layers in the above-mentioned joint structure can be one or more particles of MXene particles and MAX particles. The particles of the layered material including one or more layers in the above-mentioned bonded structure may be particles of one or more of graphene and graphene oxide. The particles of the layered material including one or more layers in the bonded structure are more preferably particles of the layered material including one or more layers, and the above-mentioned layers are of the formula described below: m X n The MXene shown and the formula described below: m AX n One or more of the MAX shown.

[0043] A preferred joint structure in this embodiment includes a first conductive member, a second conductive member, and a solder joint portion joining the first conductive member and the second conductive member.

[0044] At least one of the first conductive member and the second conductive member includes:

[0045] Metal; and

[0046] One or more conductive particles selected from (i) the first conductive particles and (ii) the second conductive particles, wherein:

[0047] (i) the first conductive particles are particles comprising one or more layers of a layered material,

[0048] The above layer comprises the following formula: M m X n The layer body shown and the modification or terminal T (T is at least one selected from a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom and a hydrogen atom) present on the surface of the layer body,

[0049] (Formula M m X n Wherein, M is at least one metal of Group 3, 4, 5, 6, or 7,

[0050] X is a carbon atom, a nitrogen atom or a combination thereof,

[0051] n is greater than or equal to 1 and less than or equal to 4,

[0052] m is greater than n and less than 5),

[0053] (ii) The second conductive particle is represented by the following formula: m AX n express,

[0054] (Formula M m AX n Wherein, M is at least one metal of Group 3, 4, 5, 6, or 7,

[0055] X is a carbon atom, a nitrogen atom or a combination thereof,

[0056] A is at least one element of Group 12, 13, 14, 15, or 16,

[0057] n is greater than or equal to 1 and less than or equal to 4,

[0058] m is greater than n and is 5 or less). The preferred bonded structure will be described in detail below.

[0059] 〔Conductive member〕

[0060] [One or more types of conductive particles among the first conductive particles (MXene particles) and the second conductive particles (MAX particles) contained in the conductive member]

[0061] In the case of the joint structure of the present embodiment, at least one of the first conductive member and the second conductive member may contain one or more conductive particles of the first conductive particle and the second conductive particle together with the metal. It should be noted that in this specification, the first conductive particle is sometimes referred to as "MXene particle" or "MXene powder", and the layered material constituting the first conductive particle is referred to as "MXene". In addition, the second conductive particle is sometimes referred to as "MAX particle", and the layered material constituting the second conductive particle is referred to as "MAX".

[0062] The bonding structure of this embodiment can prevent solder corrosion even if the metal is silver, copper, etc., which easily diffuses into the solder metal (such as tin, etc.) during solder bonding. This embodiment is not bound by any theory, but the reason why the bonding structure of this embodiment can prevent solder corrosion is explained by using Figure 1 and Figure 2 The schematic cross-sectional view of is as follows. It should be noted that Figure 1 and Figure 2 This is just a diagram for the sake of explanation. Figure 1 and Figure 2 The thickness of the solder joint, the size and arrangement of one or more conductive particles of the MXene particles and the MAX particles, etc. may be different from the actual object, and the joint structure of this embodiment is not limited to Figure 2 The form shown.

[0063] Figure 1 is a schematic cross-sectional view showing a part of a conventional joint structure. Figure 2 This is a schematic cross-sectional view showing a part of the joined structure according to the present embodiment.

[0064] In order to perform solder bonding, when a metal such as silver or copper constituting a conductive member is heated in contact with a solder metal such as tin contained in a solder material, an alloy layer (intermetallic compound) of these metals is formed as a solder joint portion by diffusion of the metal constituting the conductive member and the solder metal. By forming this alloy layer (intermetallic compound), the strength of the joint structure can be ensured, and conductivity can also be ensured. However, in the case where the metal constituting the above-mentioned conductive member is easy to diffuse into the solder metal, such as silver, Figure 1 As shown in FIG. 1 , the diffusion (diffusion into the solder metal (tin, etc.)) 39 of the silver or other metal 36 constituting the conductive member 35A becomes excessive. As a result, the silver or other metal 36 constituting the conductive member 35A is mostly used to form the alloy layer (intermetallic compound) 33, and the so-called "solder corrosion" in which the conductive member 35A disappears occurs.

[0065] However, if Figure 2As shown, it is considered that by including one or more conductive particles 37 of the first conductive particles (MXene particles) and the second conductive particles (MAX particles) in the conductive member 35B together with the metal 36, the diffusion 39 of the metal 36 such as silver constituting the conductive member 35B is hindered. As a result, it is considered that excessive diffusion to the solder metal is suppressed, and solder corrosion can be prevented. As shown in the embodiments described later, in particles of a layered material including one or more layers, according to one or more conductive particles of the conductive particles (MXene particles) and the second conductive particles (MAX particles), solder corrosion can be prevented and high conductivity can be exerted.

[0066] Hereinafter, the first conductive particles and the second conductive particles will be described separately.

[0067] The layered material constituting the first conductive particle can be understood as a layered compound, also represented by "M m X n T s ", s is an arbitrary number. In the past, x or z was sometimes used instead of s. Typically, n can be 1, 2, 3 or 4, but is not limited thereto.

[0068] In the above formula of MXene, M is preferably at least one selected from Ti, Zr, Hf, V, Nb, Ta, Cr, Mo and Mn, and more preferably at least one selected from Ti, V, Cr and Mo.

[0069] The above formula M of known MXene m X n It can be expressed as follows.

[0070] Sc2C, Ti2C, Ti2N, Zr2C, Zr2N, Hf2C, Hf2N, V2C, V2N, Nb2C, Ta2C, Cr2C, Cr2N, Mo2C, Mo 1.3 C.Cr 1.3 C, (Ti, V) 2C, (Ti, Nb) 2C, W2C, W 1.3 C, Mo2N, Nb 1.3 C.Mo 1.3 Y 0.6 C (In the above formula, "1.3" and "0.6" mean approximately 1.3 (= 4 / 3) and approximately 0.6 (= 2 / 3), respectively.),

[0071] Ti3C2, Ti3N2, Ti3(CN), Zr3C2, (Ti,V)3C2, (Ti2Nb)C2, (Ti2Ta)C2, (Ti2Mn)C2, Hf3C2, (Hf2V)C2, (Hf2Mn)C2, (V2Ti)C2, (Cr2Ti)C2, (Cr2V)C 2. (Cr2Nb)C2, (Cr2Ta)C2, (Mo2Sc)C2, (Mo2Ti)C2, (Mo2Zr)C2, (Mo2Hf)C2, (Mo2V)C2, (Mo2Nb)C2, (Mo2Ta)C2, (W2Ti)C2, (W2Zr)C2, (W2Hf)C2,

[0072] Ti4N3, V4C3, Nb4C3, Ta4C3, (Ti, Nb) 4C3, (Nb, Zr) 4C3, (Ti2Nb2) C3, (Ti2Ta2) C3, (V2Ti2) C3, (V2Nb2) C3, (V2Ta2) C3, (Nb2Ta2) C3, (Cr2Ti2) C3, (Cr2V 2) C3, (Cr2Nb2)C3, (Cr2Ta2)C3, (Mo2Ti2)C3, (Mo2Zr2)C3, (Mo2Hf2)C3, (Mo2V2)C3, (Mo2Nb2)C3, (Mo2Ta2)C3, (W2Ti2)C3, (W2Zr2)C3, (W2Hf2)C3, (Mo 2.7 V 1.3 ) C3 (In the above formula, "2.7" and "1.3" mean approximately 2.7 (= 8 / 3) and approximately 1.3 (= 4 / 3), respectively.)

[0073] Typically, in the above formula, M can be titanium or vanadium, and X can be a carbon atom or a nitrogen atom. For example, MAX phase is Ti3AlC2, and MXene is Ti3C2T s (In other words, M is Ti, X is C, n is 2, and m is 3).

[0074] It should be noted that in the present disclosure, MXene may contain a relatively small amount of residual A atoms, for example, 10% by mass or less relative to the original A atoms. The residual amount of A atoms may preferably be 8% by mass or less, more preferably 6% by mass or less. However, even if the residual amount of A atoms exceeds 10% by mass, it may not be a problem depending on the purpose and use conditions of the two-dimensional particles.

[0075] The above MXene particles include Figure 3 The MXene particles 10a are a group of MXene particles having a single layer (single-layer MXene) as schematically illustrated in FIG. m X nThe layer body shown (M m X n The MXene layer 7a is a modified or terminal MXene layer 3a, 5a existing on the surface of the layer body 1a (more specifically, at least one of the two surfaces facing each other in each layer). Therefore, the MXene layer 7a is also represented as “MXene layer 7a”. m X n T s ", s is an arbitrary number.

[0076] The above-mentioned MXene particles may include a plurality of layers of MXene together with one layer of MXene. As a plurality of layers of MXene (multilayer MXene), such as Figure 3 As schematically shown in (b), two layers of MXene 10b can be exemplified, but the present invention is not limited to these examples. Figure 3 1b, 3b, 5b, 7b in (b) and the above Figure 3 1a, 3a, 5a, and 7a of (a) are the same. Two adjacent MXene layers (e.g., 7a and 7b) of the multilayer MXene do not have to be completely separated, but may be partially in contact. The MXene 10a is a particle in which the multilayer MXene 10b is separated from each other and exists as a single layer, and may be a mixture of the single-layer MXene 10a and the multilayer MXene 10b in which the unseparated multilayer MXene 10b remains.

[0077] Although not limited to the present embodiment, the thickness of each layer of MXene (corresponding to the above-mentioned MXene layers 7a and 7b) is, for example, 0.8 nm to 5 nm, and particularly 0.8 nm to 3 nm (may vary mainly depending on the number of M atomic layers contained in each layer). For each stack of multilayer MXene that may be included, the interlayer distance (or gap size, in Figure 3 The thickness (represented by Δd in (b)) may be, for example, 0.8 nm to 10 nm, particularly 0.8 nm to 5 nm, more particularly about 1 nm, and the total number of layers may be 2 to 20,000.

[0078] The above-mentioned MXene particles can be a MXene with a small number of layers obtained by subjecting the above-mentioned multilayer MXene to an interlayer exfoliation treatment (sometimes also referred to as a delamination treatment). The above-mentioned "small number of layers" means, for example, that the number of layers of the MXene is 6 or less. In addition, the thickness of the multilayer MXene with a small number of layers in the stacking direction can be 10nm or less. Hereinafter, the "multilayer MXene with a small number of layers" is sometimes referred to as "few-layer MXene". In addition, single-layer MXene and few-layer MXene are sometimes collectively referred to as "single-layer·few-layer MXene".

[0079] The above-mentioned MXene particles may include monolayer MXene and few-layer MXene, i.e., monolayer·few-layer MXene. Regarding the proportion of monolayer·few-layer MXene with a thickness of less than 10 nm in the overall MXene particles, when the MXene particles are used in a conductive component without resin, it can be set to 10% by volume or more, and when the MXene particles are used in a conductive component containing resin, it can be set to 1% by volume or more. When used in any conductive component, the proportion of the above-mentioned monolayer·few-layer MXene can also be higher.

[0080] The ratio of one or more conductive particles of MXene particles and MAX particles (hereinafter referred to as "MXene particles / MAX particles" or simply "conductive particles") contained in at least one of the first conductive member and the second conductive member can be set to the following range, for example. That is, when the ratio of conductive particles is expressed by (mass of conductive particles) / (mass of conductive particles + mass of metal constituting the conductive member), it can be set to 0.1% by mass or more and 20% by mass or less, for example. However, it is not limited to this, and the ratio of the conductive particles can also exceed 20% by mass. On the other hand, from the viewpoint of forming an intermetallic compound of the metal contained in the conductive member and the solder and performing solder bonding well, the ratio of the conductive particles is preferably 20% by mass or less.

[0081] [Metals contained in conductive components]

[0082] The metal contained in at least one of the first conductive member and the second conductive member may be one or more selected from silver, copper, gold, nickel, zinc, tin, platinum and palladium. These metals easily diffuse into solder metals such as tin that constitute the solder material, and solder corrosion is likely to occur when these metals are used as the objects to be joined for solder joining. In addition to being pure metals of each, the metals may also be alloys each containing more than 50% by mass. In particular, the metal may be one or more of silver and copper, in particular silver. In at least one of the first conductive member and the second conductive member, for example, more than 80% by mass of the metal may be included.

[0083] 〔Solder joint〕

[0084] The solder joint portion refers to a joint portion formed between the first conductive member and the second conductive member by solder-joining the first conductive member and the second conductive member via a solder material containing a solder metal so as to be in contact with these members.

[0085] [Solder metal contained in solder joints]

[0086] "Solder metal" refers to a metal used for brazing. Examples of the solder metal include lead-free solder metals. The solder metal may contain at least tin. Examples of the solder metal containing tin (Sn) include Sn alone or Sn-based alloys. Examples of Sn-based alloys include Sn-Cu, Sn-Ag, Sn-Ag-Cu, Sn-In, Sn-Ag-In, Sn-Cu-In, Sn-Ag-Cu-In, Sn-Bi, Sn-Bi-In, Sn-Ag-Bi, Sn-Cu-Bi, Sn-Ag-Cu-Bi, Sn-Ag-Cu-Bi-In, Sn-Au, Sn-Sb, Sn-Zn, and the like.

[0087] [Resin contained in solder joints]

[0088] The solder joint portion may contain a resin according to the raw materials and joint conditions of the solder joint. The resin contained in the solder joint portion is not limited and may be a thermosetting resin or a thermoplastic resin. For example, acrylic resin, fluororesins such as polytetrafluoroethylene, vinyl resins such as polyvinyl chloride, epoxy resins, polyurethanes, melamine resins, phenolic resins, polyesters such as polyethylene terephthalate, polyamides, polyimides, polyethers, etc. may be cited. The proportion of the resin contained in the solder joint portion may be appropriately determined according to the application.

[0089] [Embodiment of the joint structure]

[0090] The joint structure of the present embodiment is obtained by soldering the first conductive member and the second conductive member. As at least any one of the first conductive member and the second conductive member, for example, an electrode or wiring can be cited. As the above-mentioned "electrode", electronic components that may cause the above-mentioned solder corrosion, internal electrodes in circuit substrates, external electrodes, pad electrodes, wiring electrodes, ground (reference potential) electrodes, shielding patterns, etc. can be cited. As the above-mentioned "wiring", signal lines, coil patterns, interlayer connection conductors (via conductors), etc. that form circuit patterns can be cited.

[0091] As an example of a bonding structure, a schematic cross-sectional view of a mounting structure obtained by mounting an electronic component on a substrate using a solder material is shown in FIG. Figure 4 .exist Figure 4 In the embodiment, the mounting structure 20 has an electronic component and solder joints 29a and 29b. In the mounting structure 20, the electronic component includes a component body 21 and external electrodes 27a and 27b provided on the surface of the component body. Figure 4In the figure, two external electrodes are shown as external electrodes, but the number of external electrodes is not particularly limited. The solder joints 29a and 29b join the substrate 23 and the electronic component, and specifically, directly join to the electrode portion 25 provided on the surface of the substrate 23.

[0092] (Embodiment 2: Method for manufacturing a joined structure)

[0093] Hereinafter, a method for producing a joined structure in an embodiment of the present invention will be described in detail, but the present disclosure is not limited to this embodiment.

[0094] The method for manufacturing a bonded structure according to the present embodiment includes:

[0095] Step (a): a step of preparing a first conductive member and a second conductive member,

[0096] At least one of the first conductive member and the second conductive member includes:

[0097] Metal; and

[0098] One or more conductive particles selected from (i) the first conductive particles and (ii) the second conductive particles, wherein:

[0099] (i) the first conductive particles are particles comprising one or more layers of a layered material,

[0100] The above layer comprises the following formula: M m X n The layer body shown and the modification or terminal T (T is at least one selected from a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom and a hydrogen atom) present on the surface of the layer body,

[0101] (Formula M m X n Wherein, M is at least one metal of Group 3, 4, 5, 6, or 7,

[0102] X is a carbon atom, a nitrogen atom or a combination thereof,

[0103] n is greater than or equal to 1 and less than or equal to 4,

[0104] m is greater than n and less than 5),

[0105] (ii) The second conductive particle is represented by the following formula: m AX n express,

[0106] (Formula M m AX n Wherein, M is at least one metal of Group 3, 4, 5, 6, or 7,

[0107] X is a carbon atom, a nitrogen atom or a combination thereof,

[0108] A is at least one element of Group 12, 13, 14, 15, or 16,

[0109] n is greater than or equal to 1 and less than or equal to 4,

[0110] m is greater than n and less than 5);

[0111] Step (b): a step of soldering the first conductive member and the second conductive member.

[0112] Hereinafter, each step will be described.

[0113] Process (a)

[0114] preparing a first conductive member and a second conductive member,

[0115] At least one of the first conductive member and the second conductive member includes:

[0116] Metal; and

[0117] (i) One or more conductive particles selected from the group consisting of the first conductive particles and the second conductive particles.

[0118] In the above (a), as a method for preparing at least one of the first conductive member and the second conductive member containing the metal and the conductive particles, the following method can be mentioned.

[0119] In the above (a), at least one of the first conductive member and the second conductive member may be prepared by a process including the following steps (sometimes referred to as "first step (a)"):

[0120] (a11) a step of preparing one or more conductive particles of (i) first conductive particles and (ii) second conductive particles, wherein:

[0121] (i) the first conductive particles are particles comprising one or more layers of a layered material,

[0122] The above layer comprises the following formula: M m X n The layer body shown and the modification or terminal T (T is at least one selected from a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom and a hydrogen atom) present on the surface of the layer body,

[0123] (Formula M m X n Wherein, M is at least one metal of Group 3, 4, 5, 6, or 7,

[0124] X is a carbon atom, a nitrogen atom or a combination thereof,

[0125] n is greater than or equal to 1 and less than or equal to 4,

[0126] m is greater than n and less than 5),

[0127] (ii) The second conductive particle is represented by the following formula: m AX n express,

[0128] (Formula M m AX n Wherein, M is at least one metal of Group 3, 4, 5, 6, or 7,

[0129] X is a carbon atom, a nitrogen atom or a combination thereof,

[0130] A is at least one element of Group 12, 13, 14, 15, or 16,

[0131] n is greater than or equal to 1 and less than or equal to 4,

[0132] m is greater than n and less than 5);

[0133] Step (a12): a step of mixing a conductive member-forming composition containing a metal constituting at least one of the first conductive member and the second conductive member, and the conductive particles to obtain a conductive member-forming mixture; and

[0134] Step (a13): a step of shaping the conductive member forming mixture and firing it at a temperature capable of sintering.

[0135] As another method of preparing the conductive member, the following method can be mentioned.

[0136] In the above (a), at least one of the first conductive member and the second conductive member may be prepared by a process including the following steps (sometimes referred to as “second step (a)”):

[0137] Step (a21): a step of preparing one or more conductive particles of (i) the first conductive particles and (ii) the second conductive particles, wherein:

[0138] (i) the first conductive particles are particles comprising one or more layers of a layered material,

[0139] The above layer comprises the following formula: M m X n The layer body shown and the modification or terminal T (T is at least one selected from a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom and a hydrogen atom) present on the surface of the layer body,

[0140] (Formula M m X n Wherein, M is at least one metal of Group 3, 4, 5, 6, or 7,

[0141] X is a carbon atom, a nitrogen atom or a combination thereof,

[0142] n is greater than or equal to 1 and less than or equal to 4,

[0143] m is greater than n and less than 5),

[0144] (ii) The second conductive particle is represented by the following formula: m AX n express,

[0145] (Formula M m AX n Wherein, M is at least one metal of Group 3, 4, 5, 6, or 7,

[0146] X is a carbon atom, a nitrogen atom or a combination thereof,

[0147] A is at least one element of Group 12, 13, 14, 15, or 16,

[0148] n is greater than or equal to 1 and less than or equal to 4,

[0149] m is greater than n and less than 5);

[0150] (a22) a step of mixing a conductive member forming composition containing a metal constituting at least one of the first conductive member and the second conductive member, the conductive particles, and a resin to obtain a conductive member forming mixture; and

[0151] (a23) A step of shaping the conductive member forming mixture and drying the mixture.

[0152] Next, the first step (a) will be described.

[0153] Process (a11)

[0154] The first conductive particles and the second conductive particles can be prepared as follows.

[0155] First, MAX constituting the second conductive particle is expressed by the following formula: m AX n (Formula M m AX nwherein M, X, n and m are as described above, A is at least one element of Groups 12, 13, 14, 15 and 16, usually an element of Group A, representatively an element of Groups IIIA and IVA, and more specifically, may include at least one selected from the group consisting of Al, Ga, In, Tl, Si, Ge, Sn, Pb, P, As, S and Cd, preferably Al), and a layer consisting of A atoms is located on a layer consisting of M m X n The MAX phase typically has a repeating unit in which one layer of X atoms is arranged between each layer of n+1 layers of M atoms (these layers are collectively referred to as "M"). m X n A layer of A atoms (“A atomic layer”) is arranged as a layer next to the n+1th layer of M atoms, but the present invention is not limited thereto.

[0156] The MAX phase can be produced by a known method. For example, TiC powder, Ti powder and Al powder are mixed in a ball mill, and the obtained mixed powder is fired in an Ar atmosphere to obtain a fired body (massive MAX phase). Then, the obtained fired body is crushed with an end mill to obtain MAX particles.

[0157] The first conductive particles (MXene particles) can be synthesized by selectively etching (removing and, if necessary, performing layer separation) A atoms (and, if necessary, part of M atoms) from the MAX.

[0158] By selectively etching (removing and layer-separating as needed) the A atoms (and as needed a part of the M atoms), the A atom layer (and as needed a part of the M atoms) is removed from the MAX, and the hydroxyl group, fluorine atom, chlorine atom, oxygen atom, hydrogen atom, etc. present in the etching solution (usually, an aqueous solution containing fluorine acid is used, but not limited thereto) modifies the exposed M atoms. m X n The surface of the layer is thereby capped.

[0159] The above etching can be performed using a - The etching solution may be used to carry out the etching, for example, a method using a mixture of lithium fluoride and hydrochloric acid, a method using hydrofluoric acid, etc. A metal compound containing a monovalent metal ion may also be included in the etching solution to perform an intercalation treatment of the monovalent metal ion simultaneously with the etching.

[0160] After the above-mentioned etching, the layer separation (delamination, separation of multilayer MXene into single-layer MXene) of MXene can also be promoted by any suitable post-treatment (such as ultrasonic treatment, manual shaking or automatic shaker, etc.). For example, a monovalent metal ion intercalation treatment can be performed, and the monovalent metal ion intercalation treatment includes a step of mixing the etched product obtained by the above-mentioned etching treatment with a metal compound containing a monovalent metal ion. It should be noted that if the shear force of the ultrasonic treatment is too large, the MXene may be destroyed. Therefore, in the case of a two-dimensional MXene with a larger aspect ratio (preferably a single-layer MXene) is desired, it is preferred to apply appropriate shear force by manual shaking or an automatic shaker.

[0161] Process (a12)

[0162] A conductive component forming composition is mixed to obtain a conductive component forming mixture, wherein the conductive component forming composition includes a metal constituting at least one of the first conductive component and the second conductive component, and the conductive particles. The metal is as described in the above [Metal contained in the conductive component]. The metal may be, for example, a metal powder. A metal paste containing the metal powder may also be used. As the metal paste, a metal paste obtained by mixing, for example, Ag powder in a varnish prepared by mixing conductive particles, a solvent and a resin (organic component) may be cited. In the case of using a metal paste containing a resin like this, the conductive component forming composition may contain a resin. The mixing method is not particularly limited, and examples include stirring with a centrifugal stirrer, kneading and dispersion treatment using a three-roll mill. In the kneading, when the fluidity is reduced, an organic solvent that can be removed in the drying process of the subsequent process, such as diethylene glycol monobutyl ether acetate used in the embodiment, may be added.

[0163] Process (a13)

[0164] The conductive member-forming mixture is molded and fired at a sinterable temperature to obtain a conductive member containing conductive particles.

[0165] The forming method is not particularly limited, and for example, the mixture can be applied to a coating object such as a substrate. The coating method is not limited, and examples thereof include a method of spray coating using a nozzle such as a single-fluid nozzle, a two-fluid nozzle, a spray gun, etc.; a coating method using a desktop coater, a comma coater, a slit coating of a rod coater, screen printing, metal mask printing, spin coating, dip coating, dripping, etc. The above-mentioned coating object can be appropriately used according to the purpose. The above-mentioned mixture can also be formed, for example, by drying it to obtain a formed object and then firing it. In the case of drying after forming, the drying conditions also depend on the shape and size of the formed object, and for example, it can be carried out in a range of 60°C to 200°C for more than 10 minutes and less than 120 minutes. As shown in the embodiments described below, forming and firing can be performed simultaneously.

[0166] The above-mentioned molded product is fired at a temperature that allows sintering. The temperature that allows sintering can be determined, for example, in the range of about 150°C to 1450°C depending on the type of metal. In addition, the firing time can be determined according to the shape and size of the molded product. The atmosphere during firing is not particularly limited. For the purpose of removing the above-mentioned binder, etc., the atmosphere during firing can be appropriately adjusted to an inert atmosphere, an oxidizing atmosphere, or a reducing atmosphere.

[0167] Next, the second step (a) will be described, and the contents overlapping with the first step (a) will be omitted.

[0168] Process (a21)

[0169] The first conductive particles and the second conductive particles can be prepared in the same manner as in the step (a11).

[0170] Process (a22)

[0171] A conductive member-forming composition including a metal constituting at least one of the first conductive member and the second conductive member, the conductive particles, and a resin is mixed to obtain a conductive member-forming mixture.

[0172] The metal is as described in the above-mentioned [Metal contained in the conductive member] and the above-mentioned step (a12).

[0173] The above-mentioned resin is not limited, and the resin described in the above-mentioned [resin contained in the solder joint] can be used. That is, it can be a thermosetting resin or a thermoplastic resin. For example, acrylic resin, fluororesins such as polytetrafluoroethylene, vinyl resins such as polyvinyl chloride, epoxy resins, polyurethanes, melamine resins, phenolic resins, polyesters such as polyethylene terephthalate, polyamides, polyimides, polyethers, etc. can be cited. Regarding the proportion of the above-mentioned resins, for example, in order to play the function as a binder, it is preferably more than 0% by mass, preferably more than 2% by mass. On the other hand, from the viewpoint of ensuring conductivity, it is preferably less than 25% by mass, and more preferably less than 12% by mass.

[0174] As the metal and the resin, a metal paste prepared by mixing them in advance can be used. The proportion of the conductive particles contained in the conductive member forming composition can be adjusted so that the proportion of the conductive particles of the obtained conductive member is within the range of 0.1 mass % or more and 20 mass % or less as shown in the above [one or more conductive particles of the first conductive particles (MXene particles) and the second conductive particles (MAX particles) contained in the conductive member].

[0175] Process (a23)

[0176] The conductive member is formed by forming the mixture, and dried to obtain a conductive member. The mixture can be formed into a molded product in the shape of an electrode or wiring before drying, and the forming method is not particularly limited. For example, the mixture can also be applied to a coating object such as a substrate. The coating method is not limited, and examples include methods such as spray coating using a single-fluid nozzle, a two-fluid nozzle, a spray gun, etc.; slit coating using a desktop coater, a comma coater, a rod coater, screen printing, metal mask printing, spin coating, dip coating, dripping, etc. The above-mentioned coating object can be appropriately used according to the purpose. Printed substrates, metal substrates, resin substrates, laminated electronic components, metal pins, metal wires, etc.

[0177] The drying conditions also depend on the shape and size of the formed mixture, but for example, the drying may be performed at a temperature within a range of 60° C. to 200° C. for 10 minutes to 120 minutes.

[0178] The above-mentioned coating and drying can be repeated as many times as necessary until a film having a desired thickness is obtained.

[0179] Process (b)

[0180] The first conductive member and the second conductive member are joined by soldering.

[0181] [Solder materials]

[0182] The solder metal contained in the solder material is as described above. The solder metal may be in powder form, for example. The solder material may contain a flux together with the solder metal. Examples of the flux include rosin, a solvent, an activator, a thickener, and the like.

[0183] Examples of the rosin include natural rosin and modified rosin. Modified rosin includes, for example, rosin obtained by reducing natural rosin (reduced rosin), polymerizing (polymerized rosin), disproportionating (disproportionated rosin), and rosin derivatives obtained by introducing substituents into natural rosin. The rosin may include one of the above rosin and rosin derivatives alone, or may include two or more of them in combination.

[0184] Examples of the activating agent include amine halides (for example, amine is cyclohexylamine, and halogen is bromine), amino acids such as glutamic acid, and organic acids such as adipic acid.

[0185] Examples of the thickener include substances soluble in organic solvents such as high molecular weight polyethylene glycol, polypropylene glycol, and ethyl cellulose, oils and fats such as hydrogenated castor oil and coconut oil, waxes of higher alcohols and higher fatty acids, saturated higher fatty acids or alcohols, esters of polyols and higher fatty acids, amides or bisamides of higher fatty acids, carnauba wax, gum arabic, tragacanth gum, guar gum, locust bean gum, arabic galactolactone, karaya gum, iris moss, gelatin, natural or semi-synthetic gums such as sodium alginate and propylene glycol alginate, and synthetic resins such as low molecular weight phenol formaldehyde resin and low molecular weight polyethylene wax.

[0186] When solder paste is used as the solder material, for example, the solder material may contain a solvent. Examples of the solvent include glycols such as ethylene glycol, propylene glycol, diethylene glycol, and dipropylene glycol, mono- or di-ethers or mono- or di-esters thereof with lower alcohols, cyclic ethers, particularly crown ethers, glycerol, pentaerythritol, trimethylolpropane, and esters thereof.

[0187] [Solder joining method]

[0188] In the present embodiment, the specific solder joining method is not particularly limited. Examples include a method of soldering an electronic circuit substrate and an electronic component as a first conductive member and a second conductive member in contact with a solder material melted by, for example, a soldering iron, and a method of placing electronic components on a printed wiring board printed with a solder paste mixed with solder alloy powder and flux, and performing solder joining by melting the solder paste in a reflow furnace.

[0189] (Embodiment 3: Conductive member for solder joining)

[0190] Hereinafter, the conductive member for solder joining in the embodiment of the present invention will be described in detail, but the present disclosure is not limited to this embodiment.

[0191] The conductive member for solder joining of the present embodiment is in contact with the solder material during solder joining, and the conductive member for solder joining includes:

[0192] Metal; and

[0193] One or more conductive particles selected from (i) the first conductive particles and (ii) the second conductive particles, wherein:

[0194] (i) the first conductive particles are particles comprising one or more layers of a layered material,

[0195] The above layer comprises the following formula: M m X n The layer body shown and the modification or terminal T (T is at least one selected from a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom and a hydrogen atom) present on the surface of the layer body,

[0196] (Formula M m X n Wherein, M is at least one metal of Group 3, 4, 5, 6, or 7,

[0197] X is a carbon atom, a nitrogen atom or a combination thereof,

[0198] n is greater than or equal to 1 and less than or equal to 4,

[0199] m is greater than n and less than 5),

[0200] (ii) The second conductive particle is represented by the following formula: m AX n express,

[0201] (Formula M m AX n Wherein, M is at least one metal of Group 3, 4, 5, 6, or 7,

[0202] X is a carbon atom, a nitrogen atom or a combination thereof,

[0203] A is at least one element of Group 12, 13, 14, 15, or 16,

[0204] n is greater than or equal to 1 and less than or equal to 4,

[0205] m is greater than n and less than 5).

[0206] The conductive member for solder joining may further contain a resin. Details of the resin are as described in the above-mentioned "Resin contained in the solder joining portion".

[0207] The details of the metal contained in the conductive member for solder joining are as described in the above-mentioned [Metal contained in the conductive member].

[0208] The conductive member for solder joining of the present embodiment may use a solder material containing tin in solder joining. If the conductive member for solder joining of the present embodiment is in contact with the solder material containing tin during solder joining, solder corrosion can be prevented.

[0209] As the conductive member for soldering, for example, electrodes or wirings for soldering can be cited. As the above-mentioned "electrodes", electronic components that may cause the above-mentioned solder corrosion, internal electrodes in circuit boards, external electrodes, pad electrodes, wiring electrodes, ground (reference potential) electrodes, shielding patterns, etc. can be cited. As the above-mentioned "wiring", signal lines forming circuit patterns, coil patterns, interlayer connection conductors (via conductors), etc. can be cited.

[0210] (Embodiment 4: Structure for Solder Joining)

[0211] The solder joint structure of the present embodiment comprises the above-mentioned conductive member for solder joint and a solder material in contact with the conductive member for solder joint. The details of the above-mentioned conductive member for solder joint and the above-mentioned solder material are as described above. The above-mentioned conductive member for solder joint and the above-mentioned solder material have a form such as at least a part of the surface of the above-mentioned conductive member for solder joint is covered by the above-mentioned solder material.

[0212] [Example]

[0213] [Example 1]

[0214] In Example 1, the conductive member sample was produced by firing, in the following Example 1-1, MXene powder was used to form the conductive member sample, and in the following Example 1-2, MAX particles were used to form the conductive member sample.

[0215] [Example 1-1]

[0216] (1) Preparation of MAX particles

[0217] TiC powder, Ti powder and Al powder (all made by Kojun Chemical Research Institute Co., Ltd.) were put into a ball mill equipped with zirconia balls at a molar ratio of 2:1:1 and mixed for 24 hours. The obtained mixed powder was fired at 1350°C for 2 hours under Ar atmosphere. The fired body (massive MAX phase) obtained was crushed to a maximum size of less than 40μm using an end mill. Thus, Ti3AlC2 particles as MAX particles were obtained.

[0218] (2) Preparation of MXene clay and MXene powder

[0219] Weigh 1g of Ti3AlC2 particles (powder) prepared by the above method, add it to 10mL of 9 mol / L hydrochloric acid together with 1g of LiF, and stir it with a stirrer at 35°C for 24 hours to obtain a solid-liquid mixture (suspension) containing solid components from Ti3AlC2 powder. Repeat the operation of washing with pure water and separating and removing the supernatant by decantation using a centrifuge for about 10 times (cleaning the remaining sediment after removing the supernatant) to obtain a clay-like substance (clay) in the form of sediment. Thus, Ti3C2T was obtained as MXene clay. x - Water dispersion clay. x - The water-dispersed clay was freeze-dried and pulverized using a mill manufactured by IKA to obtain MXene powder.

[0220] (3) Formation of conductive components

[0221] The above-mentioned MXene powder and Ag powder (size: 1μm) were blended into a ratio of 14.8% by mass and 85.2% by mass, respectively. After adding the blended powder to a plastic container, multiple ZrO2 balls with a diameter of 5mm were added and hung on a pot rack for mixing. The mixing conditions were set to 60rpm and 24 hours. Then, the ZrO2 balls were removed to obtain a mixed powder. Next, the above-mentioned mixed powder was added to the graphite mold of the SPS (Spark Plasma Sintering) device, and pressurized and heated to form a disk-shaped conductive component sample with a diameter of 10.4mm and a thickness of 2mm to 3mm was obtained as a molded product. The above-mentioned pressurization and heating conditions were set to a heating rate of 100℃ / min, a TOP temperature of 750℃, a holding time of 15min, an Ar atmosphere, and a pressurization of a maximum of 40MPa.

[0222] [Example 1-2]

[0223] A conductive member sample was obtained in the same manner as in Example 1-1(3) above, except that MAX particles obtained in the same manner as in Example 1(1) above were used instead of the MXene powder.

[0224] [Comparative Example 1]

[0225] A conductive member sample was obtained in the same manner as in Example 1-1 (3) above, except that MAX particles or MXene powder were not added.

[0226] [Solder corrosion test]

[0227] The room temperature conductive component samples obtained in the above-mentioned Example 1-1, Example 1-2 and Comparative Example 1 were put into a solder bath (SAC305 composition) heated to 350°C and melted, and immersed for 120 seconds. During the immersion, the mass per unit time of immersion was measured. During the measurement, the following operations were repeatedly performed on one conductive component sample: immersing for a specified time, taking it out and measuring the mass, immersing it again, taking it out after a specified time, and measuring the mass. The results are shown in the form of a graph showing the relationship between the immersion time and the mass of the conductive component sample. Figure 5 It should be noted that Figure 5 In the experiment, Ag-MXene and Ag-MAX appeared to have no change in weight, but after being lifted out of the solder bath, the intermetallic compound (alloy layer) with the solder with a thickness of several μm increased in mass to a level that could not be detected in the above measurement.

[0228] In addition, the appearance was observed before immersion (initial) and after immersion for 60 seconds. As a result, the microscope photos are shown in Figure 6 .exist Figure 6 In the figure, “Ag” is a microscope photograph of Comparative Example 1, “Ag-MAX” is a microscope photograph of Example 1-2, and “Ag-MXene” is a microscope photograph of Example 1-1.

[0229] according to Figure 6 As can be seen from the photograph, the conductive component sample composed of only silver as a comparative example became smaller after immersion for 60 seconds, and solder corrosion occurred. In contrast, the conductive component sample with a silver base combined with MAX or MXene did not change in size and did not undergo solder corrosion.

[0230] according to Figure 5 As can be seen from the graph, the mass of the conductive component sample formed only of silver as a comparative example decreased, and the graph also shows that solder corrosion occurred as shown in the above appearance observation results. On the other hand, the mass of the conductive component sample mixed with MAX or MXene was almost unchanged, and solder corrosion did not occur as shown in the above appearance observation results.

[0231] As mentioned above Figure 5 The chart and Figure 6As shown in the photograph, solder corrosion was not observed in the conductive component samples mixed with MAX and MXene. It is speculated that this is because the presence of MAX and MXene together with the silver constituting the conductive component inhibits excessive diffusion of silver to the tin side. In addition, MAX and MXene have high electrical conductivity, so there will be no problem of increased conductor resistance of the conductive component. In addition, in the manufacture of conductive components, MAX and MXene are only mixed with the metal powder used to form the conductive component, or further gelatinized after mixing, and no chemical liquids such as acids and alkalis are used. Therefore, there will be no problems such as reduced adhesion strength of the conductor to the substrate and increased costs due to additional plating steps. It should be noted that in this embodiment, the conductive component sample is obtained by a manufacturing method by sintering, but it is not limited to this. For example, it is also conceivable to mix Ag paste, resin and MXene powder or MAX particles obtained in the same way as in Example 1-1 (1) (2) and then print them on a substrate and dry them to obtain a conductive component sample. Thus, among particles of a layered material comprising one or more layers, one or more conductive particles selected from the group consisting of conductive particles (MXene particles) and second conductive particles (MAX particles) are useful in the manufacture of conductive components and the manufacture of joined structures, and the joined structures in which the conductive particles are included in the conductive components will not suffer from solder corrosion and can exhibit high conductivity.

[0232] Industrial Applicability

[0233] The joined structure of the present disclosure can be used for any appropriate application, and can be particularly preferably used as an electrode in an electronic component, for example.

[0234] The disclosure of this specification may include the following aspects.

[0235] <1> A joint structure comprising a first conductive member, a second conductive member, and a solder joint portion joining the first conductive member and the second conductive member.

[0236] At least one of the first conductive member and the second conductive member includes:

[0237] Metal; and

[0238] One or more conductive particles selected from (i) the first conductive particles and (ii) the second conductive particles, wherein:

[0239] (i) the first conductive particles are particles comprising one or more layers of a layered material,

[0240] The above layer comprises the following formula: M m X nThe layer body shown and the modification or terminal T (T is at least one selected from a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom and a hydrogen atom) present on the surface of the layer body,

[0241] (Formula M m X n Wherein, M is at least one metal of Group 3, 4, 5, 6, or 7,

[0242] X is a carbon atom, a nitrogen atom or a combination thereof,

[0243] n is greater than or equal to 1 and less than or equal to 4,

[0244] m is greater than n and less than 5),

[0245] (ii) The second conductive particle is represented by the following formula: m AX n express,

[0246] (Formula M m AX n Wherein, M is at least one metal of Group 3, 4, 5, 6, or 7,

[0247] X is a carbon atom, a nitrogen atom or a combination thereof,

[0248] A is at least one element of Group 12, 13, 14, 15, or 16,

[0249] n is greater than or equal to 1 and less than or equal to 4,

[0250] m is greater than n and less than 5).

[0251] <2> The joined structure according to <1>, wherein the metal contained in at least one of the first conductive member and the second conductive member is one or more selected from the group consisting of silver, copper, gold, nickel, zinc, tin, platinum and palladium.

[0252] <3> The joined structure according to <1> or <2>, wherein the solder joint portion contains tin.

[0253] <4> The joined structure according to any one of <1> to <3>, wherein the solder joint portion contains a resin.

[0254] <5> A method for manufacturing a joint structure, comprising:

[0255] Step (a): a step of preparing a first conductive member and a second conductive member,

[0256] At least one of the first conductive member and the second conductive member includes:

[0257] Metal; and

[0258] One or more conductive particles selected from (i) the first conductive particles and (ii) the second conductive particles, wherein:

[0259] (i) the first conductive particles are particles comprising one or more layers of a layered material,

[0260] The above layer comprises the following formula: M m X n The layer body shown and the modification or terminal T (T is at least one selected from a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom and a hydrogen atom) present on the surface of the layer body,

[0261] (Formula M m X n Wherein, M is at least one metal of Group 3, 4, 5, 6, or 7,

[0262] X is a carbon atom, a nitrogen atom or a combination thereof,

[0263] n is greater than or equal to 1 and less than or equal to 4,

[0264] m is greater than n and less than 5),

[0265] (ii) The second conductive particle is represented by the following formula: m AX n express,

[0266] (Formula M m AX n Wherein, M is at least one metal of Group 3, 4, 5, 6, or 7,

[0267] X is a carbon atom, a nitrogen atom or a combination thereof,

[0268] A is at least one element of Group 12, 13, 14, 15, or 16,

[0269] n is greater than or equal to 1 and less than or equal to 4,

[0270] m is greater than n and less than 5);

[0271] Step (b): a step of soldering the first conductive member and the second conductive member.

[0272] <6> The method for producing a joined structure according to <5>, wherein in the step (a), at least one of the first conductive member and the second conductive member is prepared by a process including the following steps:

[0273] Step (a11): a step of preparing one or more conductive particles of (i) the first conductive particles and (ii) the second conductive particles, wherein:

[0274] (i) the first conductive particles are particles comprising one or more layers of a layered material,

[0275] The above layer comprises the following formula: M m X n The layer body shown and the modification or terminal T (T is at least one selected from a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom and a hydrogen atom) present on the surface of the layer body,

[0276] (Formula M m X n Wherein, M is at least one metal of Group 3, 4, 5, 6, or 7,

[0277] X is a carbon atom, a nitrogen atom or a combination thereof,

[0278] n is greater than or equal to 1 and less than or equal to 4,

[0279] m is greater than n and less than 5),

[0280] (ii) The second conductive particle is represented by the following formula: m AX n express,

[0281] (Formula M m AX n Wherein, M is at least one metal of Group 3, 4, 5, 6, or 7,

[0282] X is a carbon atom, a nitrogen atom or a combination thereof,

[0283] A is at least one element of Group 12, 13, 14, 15, or 16,

[0284] n is greater than or equal to 1 and less than or equal to 4,

[0285] m is greater than n and less than 5);

[0286] Step (a12): a step of mixing a conductive member-forming composition containing a metal constituting at least one of the first conductive member and the second conductive member, and the conductive particles to obtain a conductive member-forming mixture; and

[0287] Step (a13): a step of shaping the conductive member forming mixture and firing it at a temperature capable of sintering.

[0288] <7> The method for producing a joined structure according to <6>, wherein the conductive member-forming composition further contains a resin.

[0289] <8> The method for producing a joined structure according to <5>, wherein in the step (a), at least one of the first conductive member and the second conductive member is prepared by a process including the following steps:

[0290] Step (a21): a step of preparing one or more conductive particles of (i) the first conductive particles and (ii) the second conductive particles, wherein:

[0291] (i) the first conductive particles are particles comprising one or more layers of a layered material,

[0292] The above layer comprises the following formula: M m X n The layer body shown and the modification or terminal T (T is at least one selected from a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom and a hydrogen atom) present on the surface of the layer body,

[0293] (Formula M m X n Wherein, M is at least one metal of Group 3, 4, 5, 6, or 7,

[0294] X is a carbon atom, a nitrogen atom or a combination thereof,

[0295] n is greater than or equal to 1 and less than or equal to 4,

[0296] m is greater than n and less than 5),

[0297] (ii) The second conductive particle is represented by the following formula: m AX n express,

[0298] (Formula M m AX n Wherein, M is at least one metal of Group 3, 4, 5, 6, or 7,

[0299] X is a carbon atom, a nitrogen atom or a combination thereof,

[0300] A is at least one element of Group 12, 13, 14, 15, or 16,

[0301] n is greater than or equal to 1 and less than or equal to 4,

[0302] m is greater than n and less than 5);

[0303] (a22) a step of mixing a conductive member forming composition to obtain a conductive member forming mixture, wherein the conductive member forming composition includes a metal constituting at least one of the first conductive member and the second conductive member, the conductive particles, and a resin; and

[0304] Step (a23) is a step of shaping the conductive member forming mixture and drying it.

[0305] <9> A conductive member for solder joining, which is in contact with a solder material during solder joining, the conductive member for solder joining comprising:

[0306] Metal; and

[0307] One or more conductive particles selected from (i) the first conductive particles and (ii) the second conductive particles, wherein:

[0308] (i) the first conductive particles are particles comprising one or more layers of a layered material,

[0309] The above layer comprises the following formula: M m X n The layer body shown and the modification or terminal T (T is at least one selected from a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom and a hydrogen atom) present on the surface of the layer body,

[0310] (Formula M m X n Wherein, M is at least one metal of Group 3, 4, 5, 6, or 7,

[0311] X is a carbon atom, a nitrogen atom or a combination thereof,

[0312] n is greater than or equal to 1 and less than or equal to 4,

[0313] m is greater than n and less than 5),

[0314] (ii) The second conductive particle is represented by the following formula: m AX n express,

[0315] (Formula M m AX n Wherein, M is at least one metal of Group 3, 4, 5, 6, or 7,

[0316] X is a carbon atom, a nitrogen atom or a combination thereof,

[0317] A is at least one element of Group 12, 13, 14, 15, or 16,

[0318] n is greater than or equal to 1 and less than or equal to 4,

[0319] m is greater than n and less than 5).

[0320] <10> The conductive member for solder joining according to <9>, further comprising a resin.

[0321] <11> The conductive member for solder joining according to <9> or <10>, wherein the metal is one or more selected from the group consisting of silver, copper, gold, nickel, zinc, tin, platinum and palladium.

[0322] <12> The conductive member for solder joining according to any one of <9> to <11>, wherein a solder material containing tin is used for the solder joining.

[0323] <13> A structure for solder joining, comprising the conductive member for solder joining according to any one of <9> to <12>, and a solder material in contact with the conductive member for solder joining.

[0324] The present application claims priority based on Japanese Patent Application No. 2022-156859, which is a Japanese patent application. Japanese Patent Application No. 2022-156859 is incorporated into the present specification by reference.

[0325] Description of Reference Numerals

[0326] 1a, 1b: Layer body (M m X n layer)

[0327] 3a, 5a, 3b, 5b: modified or terminal T

[0328] 7a, 7b: MXene layer

[0329] 10a, 10b: MXene particles (particles of layered materials)

[0330] 20: Install the structure

[0331] 21: Component body

[0332] 23: Substrate

[0333] 25: Electrode

[0334] 27a, 27b: External electrodes

[0335] 29a, 29b: Solder joint

[0336] 31: Solder material

[0337] 33: Solder joint (alloy layer of metal constituting the conductive member and solder alloy, intermetallic compound)

[0338] 35A: Conductive component (without MXene particles / MAX particles)

[0339] 35B: Conductive component (with MXene particles / MAX particles)

[0340] 36: Metals that constitute conductive components

[0341] 37: One or more of MXene particles and MAX particles

[0342] 38: Diffusion of solder metal

[0343] 39: Diffusion of metals constituting conductive components

Claims

1. A joint structure comprising a first conductive member, a second conductive member, and a solder joint portion joining the first conductive member and the second conductive member, At least one of the first conductive member and the second conductive member contains a metal and particles of a layered material including one or more layers.

2. The joint structure according to claim 1, wherein: At least one of the first conductive member and the second conductive member includes: Metal; and One or more conductive particles selected from (i) the first conductive particles and (ii) the second conductive particles, wherein: (i) the first conductive particles are particles comprising one or more layers of a layered material, The layer comprises the formula: M m X n The layer body shown and the modification or terminal T present on the surface of the layer body, T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom and a hydrogen atom, Formula M m X n Wherein, M is at least one metal of Group 3, 4, 5, 6, or 7, X is a carbon atom, a nitrogen atom or a combination thereof, n is greater than or equal to 1 and less than or equal to 4, m is greater than n and less than 5, (ii) The second conductive particle is represented by the following formula: m AX n express, Formula M m AX n Wherein, M is at least one metal of Group 3, 4, 5, 6, or 7, X is a carbon atom, a nitrogen atom or a combination thereof, A is at least one element of Group 12, 13, 14, 15, or 16, n is greater than or equal to 1 and less than or equal to 4, m is greater than n and is 5 or less.

3. The joint structure according to claim 1 or 2, wherein: The metal contained in at least one of the first conductive member and the second conductive member is one or more selected from the group consisting of silver, copper, gold, nickel, zinc, tin, platinum, and palladium.

4. The joined structure according to any one of claims 1 to 3, wherein The solder joint includes tin.

5. The joined structure according to any one of claims 1 to 4, wherein The solder joint portion contains resin.

6. A method for manufacturing a joint structure, comprising: Step (a): a step of preparing a first conductive member and a second conductive member, At least one of the first conductive member and the second conductive member includes: Metal; as well as One or more conductive particles selected from (i) the first conductive particles and (ii) the second conductive particles, wherein: (i) the first conductive particles are particles comprising one or more layers of a layered material, The layer comprises the formula: M m X n The layer body shown and the modification or terminal T present on the surface of the layer body, T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom and a hydrogen atom, Formula M m X n Wherein, M is at least one metal of Group 3, 4, 5, 6, or 7, X is a carbon atom, a nitrogen atom or a combination thereof, n is greater than or equal to 1 and less than or equal to 4, m is greater than n and less than 5, (ii) The second conductive particle is represented by the following formula: m AX n express, Formula M m AX n Wherein, M is at least one metal of Group 3, 4, 5, 6, or 7, X is a carbon atom, a nitrogen atom or a combination thereof, A is at least one element of Group 12, 13, 14, 15, or 16, n is greater than or equal to 1 and less than or equal to 4, m is greater than n and less than 5; Step (b): a step of soldering the first conductive member and the second conductive member.

7. The method for manufacturing a joined structure according to claim 6, wherein: In the step (a), at least one of the first conductive member and the second conductive member is prepared by a process including the following steps: Step (a11): a step of preparing one or more conductive particles of (i) the first conductive particles and (ii) the second conductive particles, wherein: (i) the first conductive particles are particles comprising one or more layers of a layered material, The layer comprises the formula: M m X n The layer body shown and the modification or terminal T present on the surface of the layer body, T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom and a hydrogen atom, Formula M m X n Wherein, M is at least one metal of Group 3, 4, 5, 6, or 7, X is a carbon atom, a nitrogen atom or a combination thereof, n is greater than or equal to 1 and less than or equal to 4, m is greater than n and less than 5, (ii) The second conductive particle is represented by the following formula: m AX n express, Formula M m AX n Wherein, M is at least one metal of Group 3, 4, 5, 6, or 7, X is a carbon atom, a nitrogen atom or a combination thereof, A is at least one element of Group 12, 13, 14, 15, or 16, n is greater than or equal to 1 and less than or equal to 4, m is greater than n and less than 5; Step (a12): a step of mixing a conductive member-forming composition to obtain a conductive member-forming mixture, wherein the conductive member-forming composition includes a metal constituting at least one of the first conductive member and the second conductive member, and the conductive particles; and Step (a13): forming the conductive member forming mixture and firing it at a temperature capable of sintering.

8. The method for manufacturing a joined structure according to claim 7, wherein: The conductive member-forming composition further includes a resin.

9. The method for manufacturing a joined structure according to claim 6, wherein: In the step (a), at least one of the first conductive member and the second conductive member is prepared by a process including the following steps: Step (a21): a step of preparing one or more conductive particles of (i) the first conductive particles and (ii) the second conductive particles, wherein: (i) the first conductive particles are particles comprising one or more layers of a layered material, The layer comprises the formula: M m X n The layer body shown and the modification or terminal T present on the surface of the layer body, T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom and a hydrogen atom, Formula M m X n Wherein, M is at least one metal of Group 3, 4, 5, 6, or 7, X is a carbon atom, a nitrogen atom or a combination thereof, n is greater than or equal to 1 and less than or equal to 4, m is greater than n and less than 5, (ii) The second conductive particle is represented by the following formula: m AX n express, Formula M m AX n Wherein, M is at least one metal of Group 3, 4, 5, 6, or 7, X is a carbon atom, a nitrogen atom or a combination thereof, A is at least one element of Group 12, 13, 14, 15, or 16, n is greater than or equal to 1 and less than or equal to 4, m is greater than n and less than 5; Step (a22): a step of mixing a conductive member forming composition to obtain a conductive member forming mixture, wherein the conductive member forming composition includes a metal constituting at least one of the first conductive member and the second conductive member, the conductive particles, and a resin; and Step (a23): a step of shaping the conductive member forming mixture and drying it.

10. A conductive member for solder joining, which is in contact with a solder material during solder joining, the conductive member for solder joining comprising: Metal; and One or more conductive particles selected from (i) the first conductive particles and (ii) the second conductive particles, wherein: (i) the first conductive particles are particles comprising one or more layers of a layered material, The layer comprises the formula: M m X n The layer body shown and the modification or terminal T present on the surface of the layer body, T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom and a hydrogen atom, Formula M m X n Wherein, M is at least one metal of Group 3, 4, 5, 6, or 7, X is a carbon atom, a nitrogen atom or a combination thereof, n is greater than or equal to 1 and less than or equal to 4, m is greater than n and less than 5, (ii) The second conductive particle is represented by the following formula: m AX n express, Formula M m AX n Wherein, M is at least one metal of Group 3, 4, 5, 6, or 7, X is a carbon atom, a nitrogen atom or a combination thereof, A is at least one element of Group 12, 13, 14, 15, or 16, n is greater than or equal to 1 and less than or equal to 4, m is greater than n and is 5 or less. The conductive member for solder joining according to claim 10 , further comprising a resin.

12. The conductive member for solder joining according to claim 10 or 11, wherein The metal is one or more selected from the group consisting of silver, copper, gold, nickel, zinc, tin, platinum and palladium.

13. The conductive member for solder joining according to any one of claims 10 to 12, wherein The solder bonding uses a solder material containing tin. 14 . A structure for solder joining, comprising the conductive member for solder joining according to claim 10 , and a solder material in contact with the conductive member for solder joining.

15. The joined structure according to any one of claims 1 to 5, wherein At least one of the first conductive member and the second conductive member includes: Metal; and Particles of a layered material including one or more layers include particles of one or more selected from the group consisting of graphene and graphene oxide.

Images