Test arrangement for over-the-air transmission (OTA) testing of angled device under test using carrier structure having opening

Abstract

The present invention relates to a test arrangement for performing an over-the-air transmission (OTA) test on an angled device under test, where the test arrangement comprises a carrier structure and a socket of the device under test, the socket of the device under test being coupled with the carrier structure. The receptacle of the device under test is configured to establish an electrical connection with an inner surface of the angled device under test or with a connector disposed on the inner surface of the angled device under test. The carrier structure includes an opening extending away from the receptacle of the device under test in a direction of an outward surface normal to the first outer surface of the angled device under test.

Description

Technical Field

[0001] Embodiments according to the invention relate to a test arrangement for over-the-air (OTA) testing, in particular using a carrier structure with an opening.

[0002] Embodiments according to the present invention are directed to a socket for over-the-air (OTA) testing of an L-type antenna in a packaged module using automated test equipment. Background Art

[0003] The test arrangement can be used to test a device under test (e.g., an antenna in a packaged device) that is capable of receiving and / or emitting electromagnetic radiation. Typically, the device under test has a planar shape with two opposing surfaces so that, for example, the device under test can be mounted in a socket of the device under test (e.g., an over-the-air (OTA) socket for radiated near-field testing of a packaged antenna device) so that one of the surfaces faces the socket of the device under test and the other surface faces away from the socket of the device under test. For example, the device under test can be oriented so that the surface of the device under test with the antenna faces away from the socket of the device under test.

[0004] However, the shape of the device under test may not be a plane. For example, the device under test may have an angled shape, such as an L-shape. In addition, the angled device may be configured to transmit and / or receive electromagnetic radiation at at least one outer surface. For example, the angled device under test may have one or more antenna arrays (or other antennas) on one or two outer surfaces. Therefore, the flexibility of the available orientation of the outer surface of the device under test may be reduced. For example, arranging an angle test device in a socket may require a specific orientation in order to adapt to the shape. In addition, when one outer surface is oriented away from the bearing structure supporting the socket, the other outer surface may have to be oriented at a certain angle relative to the bearing structure. However, the carrier structure may interfere with the electromagnetic radiation received and / or emitted by the outer surface. When the outer surface is oriented at a certain angle relative to the carrier structure, the interference may increase.

[0005] Angled DUTs present challenges in terms of DUT orientation and interference with the carrier structure, which can impact test efficiency, accuracy, and repeatability.

[0006] Therefore, there is a need for a testing arrangement that improves the trade-off between testing efficiency, accuracy and repeatability. Summary of the invention

[0007] Embodiments of the present invention relate to a test arrangement for performing over-the-air (OTA) testing of an angled (e.g., L-shaped) device under test (e.g., an L-shaped packaged antenna device under test), wherein the test arrangement includes a carrier structure (e.g., a printed circuit board (PCB) test fixture or a load board), wherein the test arrangement includes a socket of the device under test, the socket of the device under test being coupled to the carrier structure (e.g., the PCB test fixture or the load board) (e.g., directly, or with an extender assembly and / or a PCB interposer between the carrier structure and the socket of the device under test), wherein the socket of the device under test is configured To establish electrical contact with an inner surface of an angled (e.g., L-shaped) device under test (e.g., an inner surface of the angled device under test opposite to a second outer surface of the angled device under test) or a connector, the connector being arranged on the inner surface of the angled (e.g., L-shaped) device under test, wherein a carrier structure (e.g., a test fixture PCB or a load board) includes an opening (e.g., a hole or a cutout), the opening extending away from a socket of the device under test in a direction of an outward surface normal of a first outer surface of the angled device under test (e.g., a main radiation direction of an antenna structure on the first outer surface of the device under test is away from the socket of the device under test).

[0008] The socket of the device under test allows coupling of an angled device under test to the test arrangement. Furthermore, the electrical contacts allow transmission between the test arrangement and the device under test coupled to the socket of the device under test of at least one of: electrical energy, one or more control signals, one or more measurement signals, or generally one or more electrical or optical signals.

[0009] The opening of the carrier structure reduces interference with the electromagnetic field emitted or received by the device under test (when coupled with the socket of the device under test). Since the opening extends away from the direction of the outward surface normal of the first outer surface of the angled device under test, interference with the electromagnetic field emitted or received by the first outer surface of the angled device under test is reduced. Therefore, the flexibility of the choice of the orientation of the first outer surface is increased. In addition, the opening can be configured to receive at least part of the socket of at least one device under test, the device under test and the antenna structure for testing the first outer surface. Therefore, at least part of the electromagnetic wave transmission between the first outer surface and the antenna structure can occur in the opening (thereby reducing interference). In addition, it should be noted that such an arrangement allows the test arrangement to have a smaller construction height. For example, by providing an opening in the carrier structure, there is no need to have a large spacing between the device under test and the carrier structure. On the contrary, the device under test can be placed close to the plane of the carrier structure, and can even extend into the plane of the carrier structure. Therefore, this design is particularly advantageous in the case where the spacing between the carrier structure and the operator is very limited. Furthermore, the arrangement is well suited for testing a device under test having two antennas on both sides, since the antenna, which is approximately parallel to the carrier structure, can be placed closer to the carrier structure when compared to a conventional socket arrangement, which leaves more space between the device under test antenna and the associated test antenna without increasing the required height of the overall arrangement including the test antenna. The other antenna, which may be approximately perpendicular to the carrier structure, can still be well testable, since the opening in the carrier structure, which may be arranged in or close to the main radiation direction of the other antenna, reduces distortion of the measurement results.

[0010] In summary, the test arrangement allows for over-the-air testing of angled DUTs using a relatively small space while providing good test accuracy by reducing the influence of the carrier structure.

[0011] The test arrangement can be used for near field testing, such as near field testing of antennas in packaged devices. The test arrangement can be used for testing electromagnetic waves in the fifth generation mobile communication technology (5G) frequency band.

[0012] According to an embodiment, the socket of the device under test is configured to position the angled device under test so that the surface normal of the first outer surface of the angled (e.g., L-shaped) device under test is parallel to the surface (e.g., main surface) of the carrier structure (e.g., load board) within an error of ±15 degrees.

[0013] Thus, the first outer surface can receive and / or emit electromagnetic radiation in a direction arranged mainly parallel to the surface of the carrier structure. Interference with the carrier structure is thus reduced by the opening in the carrier structure, and the transmission path along the electromagnetic wave varies less. In addition, this orientation also allows the second outer surface to face away from the carrier structure, thereby also reducing interference with the second outer surface.

[0014] According to an embodiment, the socket of the device under test is configured to position the angled device under test so that the second outer surface (e.g., a surface including a radiating structure) of the angled (e.g., L-shaped) device under test faces away from a carrier structure (e.g., a load board), and so that a surface normal of the second outer surface of the angled (e.g., L-shaped) device under test is perpendicular to the surface of the carrier structure (e.g., load board) within an error of ±15 degrees.

[0015] Since the second outer surface is substantially facing away from the carrier structure, interference with the carrier structure is reduced. In addition, the test antenna can be efficiently placed and aligned opposite to the second outer surface.

[0016] According to an embodiment, the opening is a hole extending through the entire thickness of the carrier structure.

[0017] Thus, the opening realizes a through hole, which further reduces interference. For example, using a hole extending through the entire thickness of the carrier structure, the device under test can be placed so that the radiation from the first outer surface (or even a significant lobe of an antenna located on the first outer surface of the device under test) extends into the plane of the carrier structure (at least in the area of ​​the carrier structure where the opening is located). Thus, in some cases, the device under test can even extend into the opening of the carrier structure. This allows a very compact test arrangement. On the other hand, if a significant lobe (e.g. a main lobe or a strong side lobe) or a significant near-field component of an antenna located on the first outer surface of the device under test extends into the plane of the carrier structure, accurate measurement results can also be obtained.

[0018] Furthermore, the opening may, for example, provide passage (eg in the form of possible routing of one or more cables) to access equipment (eg signal sources and / or signal receivers) on a side of the carrier structure facing away from the socket of the device under test.

[0019] According to an embodiment, the extension of the opening along the direction of the outward surface normal of the first outer surface of the angled device under test (for example, along the main radiation direction of the antenna structure on the first outer surface of the device under test away from the socket of the device under test) is at least 2 times the wavelength, or at least 3 times the wavelength, or at least 4 times the wavelength (for example, the wavelength in free space, or the wavelength in the medium between the first outer surface of the angled device under test and the carrier structure) at the lowest operating frequency of the angled device under test (for example, the lowest operating frequency of a packaged antenna (AiP) module constituting the device under test or included in the device under test).

[0020] It has been found that, when having an opening of the dimensions defined above, interference with the carrier structure is significantly reduced. The propagation of electromagnetic waves within the opening may be improved. For example, the opening may cover the entire near field area of ​​an antenna arranged on the first outer surface of the device under test (or at least 60% or at least 80% of the near field area), and / or may even cover part of the far field area of ​​the antenna (e.g., a distance greater than 2D from the antenna). 2 / λ, where D is the length or diameter of the antenna). Therefore, due to the presence of the opening, the carrier structure may cause less distortion to the antenna characteristics of the antenna arranged on the first outer surface of the device under test.

[0021] According to an embodiment, the extension of the opening in a direction perpendicular to the outward surface normal of the first outer surface of the angled device under test (e.g., the width of the opening in a direction parallel to the first outer surface) is greater than the extension of the radiating structure on the first outer surface of the device under test (or even greater than twice the extension of the radiating structure, or even greater than three times the extension of the radiating structure), or the extension of the opening in a direction perpendicular to the outward surface normal of the first outer surface of the angled device under test (e.g., the width of the opening in a direction parallel to the first outer surface) is greater than the extension of the device under test (or even greater than twice the extension of the device under test, or even greater than three times the extension of the device under test).

[0022] Since the extension (e.g. lateral extension or "width") of the opening is larger than the radiating structure or the device under test, interference from the walls of the opening at the ends of the extension can be reduced. For example, by choosing a suitably large extension of the opening, it can be achieved that the opening can cover the entire near-field area (or at least 60% or at least 80% of the near-field area) of an antenna arranged on the first outer surface of the device under test. Thus, even at a small distance between the device under test and the plane of the carrier structure, or even if the device under test protrudes into the plane of the carrier structure, the influence of the carrier structure can be kept small.

[0023] According to an embodiment, the extension of the opening is selected so that the distance between an edge of the angled device under test or an edge of the packaged antenna device and the carrier structure is at least one wavelength (e.g., the wavelength in free space, or the wavelength in the medium between the first outer surface of the angled device under test and the carrier structure) at the lowest operating frequency of the angled device under test (e.g., the lowest operating frequency of a packaged antenna module (AiP) constituting the device under test or included in the device under test) (while there is no material of the carrier structure within a distance of one wavelength from the edge of the angled device under test or the edge of the packaged antenna device).

[0024] It has been appreciated that at such a distance, effects on transmission and / or reception (e.g. beamforming, reflections, standing wave formation and interference) of one or more antennas which may be arranged on the first outer surface and which may be caused by the carrier structure may be significantly reduced. Furthermore, by providing an opening in the carrier structure, such a distance may be easily set while keeping the size of the test arrangement reasonably small.

[0025] According to an embodiment, the socket of the device under test is configured such that when the device under test is inserted into the socket of the device under test, at least a portion of the device under test is located in the opening (where, for example, the device under test position in the test socket extends into the opening).

[0026] Using such an arrangement, the size of the test arrangement can be kept reasonably small, while the device under test is arranged at an area with minimal interference with the carrier structure.

[0027] According to an embodiment, the receptacle of the device under test is configured such that the receptacle of the device under test extends into the opening (wherein, for example, the device under test position in the receptacle of the device under test extends into the opening).

[0028] The socket of the device under test thus allows a relatively deep insertion of the device under test into the opening. The socket of the device under test thus has a higher compatibility with devices under test of different sizes and offers more options for positioning the device under test within the opening. Furthermore, in this way a relatively small construction height can be achieved, which allows the test arrangement to be used with a small spacing between the operator and the socket of the device under test without impairing the test performance.

[0029] According to an embodiment, the test arrangement includes a first antenna or antenna structure (e.g., a single aperture antenna (e.g., dual linear polarization or circular polarization)), which is configured to receive signals radiated from a first outer surface of an angled device under test and / or is configured to transmit signals to be received at the first outer surface of the angled device under test.

[0030] The first antenna or antenna structure allows an over-the-air connection to be established with the device under test in a socket of the device under test. Thus, the first antenna or antenna structure allows the device under test to be tested. The socket of the device under test allows the device under test to be positioned in a defined manner so that the first antenna or antenna structure can be accurately oriented relative to the device under test at an angle. The opening in the carrier structure allows a relatively distortion-free wireless connection between an antenna on a first outer surface of the device under test and the first antenna or antenna structure.

[0031] According to an embodiment, the test arrangement includes a first antenna or antenna structure (e.g., a single aperture antenna (e.g., dual linear polarization or circular polarization)), wherein the aperture of the first antenna or antenna structure is arranged at a certain distance from a first outer surface of the angled device under test, so that (at least when the second antenna or antenna structure is placed in an operating position) the surface normal of the first outer surface of the angled device under test extends through the aperture of the first antenna or antenna structure.

[0032] It has been recognised that a preferred design of the socket of the device under test may allow the device under test to be carried such that a surface normal to a first outer surface of the device under test may extend through an aperture of the first antenna or antenna structure. The first outer surface (or an antenna structure on the first outer surface of the device under test) may be configured to transmit and / or receive signals (e.g., by beamforming) such that a main lobe is directed perpendicular to the first outer surface. Thus, by arranging the socket of the device under test and the first antenna such that a surface normal to the first outer surface of the device under test extends through an aperture of the first antenna or antenna structure, wireless communication between the device under test and the first antenna or antenna structure may be improved, or more generally, wireless testing of the device under test using the first antenna or antenna structure may be improved.

[0033] According to an embodiment, the first antenna or the antenna structure is at least partially arranged within the opening (eg within an open area enclosed by the carrier structure; eg in the plane of the carrier structure).

[0034] The opening increases the range in which the first antenna structure can be arranged in a direction perpendicular to the surface of the carrier structure. Thus, the carrier structure is compatible with different first antenna structures. Furthermore, if the device under test is at least partially placed inside the opening, a transmission path between the first antenna structure and the device under test can be arranged at least partially within the opening. Thus, the reduced construction height of the test arrangement can be reduced without significantly reducing the quality of the test results.

[0035] According to an embodiment, the radiating aperture of the first antenna or the antenna structure is at least partially arranged within an opening (eg within an open area enclosed by the carrier structure; eg in the plane of the carrier structure).

[0036] Such an arrangement of the radiation aperture allows electromagnetic waves emitted and / or received from the radiation aperture to travel at least partially within the opening. Thus, the spacing between the carrier structure and the operator can be kept small and distortions caused, for example, by the operator (which can be mobile at a distance from the carrier structure) can be kept within acceptable limits.

[0037] According to an embodiment, the first antenna or antenna structure is mounted to have a fixed position relative to the socket of the device under test.

[0038] This fixed position allows for testing and repeated coupling of multiple angled devices under test, so that multiple angled devices under test have the same or similar geometric relationship with the first antenna or antenna structure. Therefore, the accuracy and repeatability of the test can be improved.

[0039] According to an embodiment, the first antenna or antenna structure is mechanically attached to an arm of an operator (the arm being configured to insert the angled device under test into a socket of the device under test) such that the first antenna or antenna structure is movable (wherein, when the operator pushes the angled device under test into the test socket, the first antenna or antenna structure is at least partially arranged within the opening).

[0040] The arm allows the first antenna or antenna structure to be movable, which makes it possible to remove the first antenna or antenna structure (for example, to more easily couple an angled device under test to a socket of the device under test), or to readjust the first antenna or antenna structure. In the case where the operator is configured to insert the angled device under test into the socket of the device under test, the operator facilitates coupling and positioning the first antenna or antenna structure during coupling the angled device under test to the socket of the device under test. For example, the first antenna or antenna structure can maintain a fixed positional relationship with a push rod that pushes the device under test into the socket of the device under test. As an example, the push rod can be directly connected to the first antenna or antenna device. Therefore, accordingly, a very stable and well repeatable positional alignment between the first antenna or antenna structure and the device under test can be achieved.

[0041] According to an embodiment, the first antenna or antenna structure is configured to be connected to a signal source and / or a signal receiver via a blind-mate microwave connection (e.g., via a blind-mate (hollow) waveguide connection) when an operator places the first antenna or antenna structure in an operating position (or equivalently, when the operator has inserted an angled device under test into a test socket, or when the operator pushes the device under test into the test socket).

[0042] The signal source enables the first antenna or antenna structure to transmit a signal (e.g., to be received by the antenna array of the angled device under test), and / or the signal receiver allows evaluation of a received signal (e.g., transmitted by the antenna or antenna array of the angled device under test and received by the first antenna or antenna structure), so that both the signal source and the signal receiver facilitate testing of the angled device under test. The blind-mate microwave connection facilitates (e.g., manual and / or automatic) coupling between the signal source and / or the signal receiver and the first antenna or antenna structure. Thus, even in configurations where the first antenna or antenna structure is movable (as described above), efficient testing is possible.

[0043] According to an embodiment, the test arrangement includes a second antenna or antenna structure (e.g., a single aperture antenna (e.g., dual linear polarization or circular polarization)), which is configured to (at least when the second antenna or antenna structure is placed in an operating position) (or equivalently, when an operator inserts the angled device under test into the test socket, or when the operator pushes the device under test into the test socket) receive signals radiated from a second outer surface of the angled device under test and / or transmit signals to be received at the second outer surface of the angled device under test.

[0044] The second antenna or antenna structure allows testing of an antenna structure on a second outer surface of the device under test. The second antenna or antenna structure benefits from the orientation of the second outer surface defined by the socket of the device under test. Using signals transmitted and / or received by the antennas or antenna structures on the first and second outer surfaces of the device under test, the first antenna or antenna structure and the second antenna or antenna structure can test the device under test (e.g., simultaneously or sequentially) without re-coupling the angled device under test in a different orientation (e.g., or in a different socket of the device under test). Therefore, high test throughput can be achieved.

[0045] According to an embodiment, the test arrangement includes a second antenna or antenna structure (e.g., a single aperture antenna (e.g., dual linear polarization or circular polarization)), wherein the aperture of the second antenna or antenna structure is arranged at a certain distance from the second outer surface of the angled device under test, so that (at least when the second antenna or antenna structure is placed in the operating position) (or equivalently, when the operator inserts the angled device under test into the test socket, or when the operator pushes the device under test into the test socket) the surface normal of the second outer surface of the angled device under test extends through the aperture of the second antenna or antenna structure.

[0046] It has been recognised that a preferred design of the socket of the device under test may allow the device under test to be carried such that a surface normal to a second outer surface of the device under test may extend through an aperture of a second antenna or antenna structure. The second outer surface (or the antenna structure of the second outer surface of the device under test) may be configured (e.g. by beamforming) to transmit and / or receive such that a main lobe is directed perpendicular to the second outer surface. Thus, by arranging the socket of the device under test and the second antenna or antenna structure such that a surface normal to the second outer surface of the device under test extends through an aperture of the second antenna or antenna structure, wireless communication between the device under test and the second antenna or antenna structure may be improved, or generally speaking, wireless testing of the device under test using the second antenna or antenna structure may be improved.

[0047] According to an embodiment, the second antenna or antenna structure is mechanically attached to an arm of the operator (the arm is configured to insert and / or push the angled device under test into a socket of the device under test) so that the second antenna or antenna structure is movable. The first antenna or antenna structure and the second antenna or antenna structure can, for example, be attached to the same / common operator, or can be attached to respective operators.

[0048] The arm allows the second antenna or antenna structure to be movable, which makes it possible to remove the second antenna or antenna structure (for example, for easier coupling of an angled device under test to a socket of the device under test), or to readjust the second antenna or antenna structure. In the case where the operator is configured to insert the angled device under test into the socket of the device under test, the operator facilitates coupling and positioning the first antenna or antenna structure during coupling the angled device under test to the socket of the device under test. In the case of a common operator, the first antenna and the second antenna structure can be arranged in a predefined orientation to facilitate directional orientation of the first antenna and the second antenna structure relative to the first and second outer surfaces. In the case of using respective arms, customized orientation of the first antenna and the second antenna structure can be achieved. In addition, it should be noted that the second antenna or antenna structure may maintain a fixed positional relationship with the push rod that pushes the device under test into the socket of the device under test. Therefore, the relative position between the device under test and the second antenna or antenna structure can be very precise and well repeatable, which improves the repeatability of the test. For example, the push rod that pushes the device under test into the socket of the device under test can be directly (mechanically) connected to the second antenna or antenna structure, thereby achieving particularly high accuracy.

[0049] According to an embodiment, the second antenna or antenna structure is part of a push rod for pushing the angled device under test into the socket of the device under test, or the second antenna or antenna structure is configured to be movable together with the push rod for pushing the angled device under test into the socket of the device under test (for example, wherein the push rod is arranged so that when the device under test is inserted into the socket of the device under test, the push rod or a portion of the push rod is located between the second antenna or antenna structure and the second outer surface of the angled device under test) (wherein, for example, the push rod is arranged so that when the angled device under test is inserted into the socket of the device under test, the push rod or a portion of the push rod is located between the first antenna or antenna structure and the first outer surface of the angled device under test).

[0050] Thus, the second antenna or antenna structure is movable with the push rod so that it can be moved (e.g., for easier coupling of the angled device under test to the socket of the device under test) or readjusted (e.g., its orientation). Since the push rod is configured to push the angled device under test into the socket of the device under test, the push rod helps to facilitate the coupling and positioning of the second antenna or antenna structure during the coupling of the angled device under test to the socket of the device under test. Using this arrangement, good positioning accuracy can be achieved. In addition, mechanical conflicts between the push rod and the second antenna or antenna structure can be reliably avoided.

[0051] According to an embodiment, the second antenna or antenna structure is configured to be connected to a signal source and / or signal receiver via a blind-mate microwave connection (e.g., via a blind-mate (hollow) waveguide connection) when the operator places the second antenna or antenna structure in an operating position (or equivalently, when the operator has inserted an angled device under test into a test socket, or when the operator pushes the device under test into the test socket).

[0052] The signal source enables the second antenna or antenna structure to transmit a signal (e.g., to be received by the antenna array of the angled device under test), and / or the signal receiver allows evaluation of a received signal (e.g., transmitted by the antenna or antenna array of the angled device under test and received by the second antenna or antenna structure), so that both the signal source and the signal receiver facilitate testing of the angled device under test. A blind-mate microwave connection can facilitate (e.g., manual and / or automatic) coupling between the signal source and / or the signal receiver and the second antenna or antenna structure. Thus, even in configurations where the second antenna or antenna structure is movable (as described above), efficient testing is possible.

[0053] According to an embodiment, the socket of the device under test includes an angled recess or an angled notch configured to support and / or align the angled device under test. The angled recess or angled notch may have side walls at one or both ends thereof.

[0054] The angled recess or angled notch has two (or more) abutment surfaces (e.g., angled) that can abut a first outer surface and a second outer surface of the device under test, respectively. These abutment surfaces can (at least partially) achieve a predefined orientation and / or position of the angled device under test. The predefined orientation and / or position of the angled device under test helps to establish an electrical connection and improve the repeatability and accuracy of the test. One or more optional side walls can further limit the lateral movement of the angled device under test, while generally allowing the device under test to be well guided and smoothly inserted into the socket of the device under test.

[0055] According to an embodiment, a socket of the device under test includes one or more coaxial spring probes (e.g., the coaxial spring pins may, for example, extend from a lower surface of the socket of the device under test that contacts a PCB test fixture or a load board to an upper surface of the socket of the device under test that contacts a second inner surface of the angled device under test) so as to establish an electrical connection between the PCB test fixture or the load board and the angled device under test (e.g., wherein a first end of the coaxial spring probe may contact a pad on the PCB test fixture or the load board, and, for example, wherein a second end of the spring probe may contact a pad on the angled device under test or a connector of the angled device under test).

[0056] Spring probes are typically depressible and allow the socket of the device under test to establish a reliable electrical connection with the device under test when the device under test is coupled to the socket of the device under test (e.g., when an operator / push rod is pushed into the socket of the device under test). For example, a coaxial spring (or spring-loaded probe) can achieve a high-frequency interconnection with the socket of the device under test.

[0057] According to an embodiment, the test arrangement includes at least two sockets of the devices under test, which are configured to carry respective angled devices under test (e.g., two identical devices under test), wherein the sockets of the at least two devices under test are arranged (e.g., back to back) to position the respective angled devices under test such that the respective first outer surfaces of the respective angled devices under test are aligned in opposite (facing away) directions.

[0058] A test arrangement with at least two sockets of the devices under test allows testing of more than one device under test at one time (e.g., simultaneously (or sequentially), for example, within one operation cycle in which an operator places the device under test in the socket of the device under test). In addition, since the respective first outer surfaces of the respective angled devices under test are aligned in opposite (facing away) directions, interference between signals transmitted and / or received at the respective first outer surfaces is reduced.

[0059] According to an embodiment, the test arrangement includes at least two rows (e.g., parallel rows) of sockets of the devices under test, wherein the sockets of the devices under test are configured to respectively carry respective angled devices under test, wherein the sockets of the devices under test in at least two rows are arranged (e.g., back to back; for example, the sides of the sockets of the devices under test where the first outer surfaces of the devices under test are located face away from each other) to position the respective angled devices under test such that the respective first outer surfaces of the respective angled devices under test are aligned in opposite (facing away) directions.

[0060] This arrangement improves the trade-off between arranging a plurality of devices under test at a high density and reducing interference between signals transmitted and / or received at the respective first outer surfaces.

[0061] According to an embodiment, the carrier structure includes at least two openings with a solid middle portion (e.g., a solid strip) therebetween, wherein sockets of two or more devices under test are arranged on the solid middle portion between the openings, and the device under test positions of the sockets of one or more of the devices under test are aligned toward a first opening of the at least two openings, and the device under test positions of the sockets of one or more of the devices under test are aligned toward a second opening of the at least two openings (such that the devices under test inserted into the sockets of two devices under test arranged back to back on the solid middle portion are aligned toward different openings).

[0062] This arrangement improves the compromise between arranging multiple devices under test with high density and reducing the interference between the signals transmitted and / or received at the respective first outer surface. In addition, the first opening and / or the second opening can form a common opening for multiple devices under test, which may produce less interference than the multiple openings for each device under test. In other words, the opening can be extended so that the opening is associated with multiple devices under test. Therefore, the lobes of the antennas or antenna structures of multiple devices under test can extend into a common opening. However, if the sidelobe level of the adjacent device under test of the shared common opening is low enough, or if adjacent devices under test are tested at sufficiently different frequencies, multiple devices under test can be tested simultaneously. In addition, there is no conductive or dielectric material in the (common) opening, which can help reduce the crosstalk between adjacent devices under test.

[0063] Embodiments of the present invention are directed to a test arrangement for performing over-the-air (OTA) testing of an angled (e.g., L-shaped) device under test (e.g., an L-shaped packaged antenna device under test), wherein the test arrangement includes a carrier structure (e.g., a PCB test fixture or a load board); wherein the test arrangement includes a socket of the device under test, the socket of the device under test being coupled to the carrier structure (e.g., a PCB test fixture or a load board) (e.g., directly coupled or coupled using an extender component and / or a PCB interposer between the carrier structure and the socket of the device under test), wherein the socket of the device under test is configured to establish an electrical connection with an inner surface of the angled (e.g., L-shaped) device under test (e.g., an inner surface of the angled device under test opposite to a second outer surface of the angled device under test) or a connector arranged on the inner surface of the angled (e.g., L-shaped) device under test, and wherein The socket of the device under test is configured to position the angled device under test such that a surface normal of a first outer surface of the angled (e.g., L-shaped) device under test is parallel to a surface (e.g., a major surface) of a load board within ±15 degrees, and such that a second outer surface (e.g., a surface including a radiating structure) of the angled (e.g., L-shaped) device under test faces away from the load board, and such that a surface normal of the second outer surface of the angled (e.g., L-shaped) device under test is perpendicular to the surface of the load board within ±15 degrees, wherein a carrier structure (e.g., a test fixture PCB or the load board) includes an opening (e.g., a hole or a cutout) that extends away from the socket of the device under test in a direction of an outward surface normal of the first outer surface of the angled device under test (e.g., away from the socket of the device under test along a major radiation direction of an antenna structure on the first outer surface of the device under test).

[0064] This test arrangement combines many of the advantages mentioned above. BRIEF DESCRIPTION OF THE DRAWINGS

[0065] The accompanying drawings are not necessarily drawn to scale, and emphasis is generally placed on illustrating the principles of the invention. In the following description, various embodiments of the invention are described in conjunction with the following accompanying drawings, in which:

[0066] Figure 1 A schematic cross-sectional view showing an example of a test arrangement for over-the-air (OTA) testing of an angled device under test;

[0067] Figure 2A A schematic cross-sectional view of a first example of an angled device under test is shown;

[0068] Figure 2B A schematic cross-sectional view of a second example of an angled device under test is shown;

[0069] Figure 3 shows a perspective view of an angled device under test;

[0070] Figure 4 Shows Figure 3 Simulation results of far fields emitted by antenna elements of a first antenna array on a first exterior surface of a device under test depicted in;

[0071] Figure 5 shows a perspective view of an angled device under test;

[0072] Figure 6 Shows Figure 5 Simulation results of far fields emitted by antenna elements of a first antenna array on a first exterior surface of a device under test depicted in;

[0073] Fig. 7A A perspective view showing an example of a device under test;

[0074] Figure 7B Shows Fig. 7A Different perspective views of the device under test depicted in;

[0075] Figure 8 A schematic top view showing an example of a test arrangement;

[0076] Fig. 9 A schematic cross-sectional view showing an example of a test arrangement with a carrier structure, a socket of a device under test with a device under test;

[0077] Fig.10 A perspective view showing an example of a socket of a device under test;

[0078] Fig.11A A schematic cross-sectional view showing an example of a test arrangement with a carrier structure, a socket of a device under test with a device under test;

[0079] Fig. 11B Shows Fig.11A A perspective view of the test arrangement shown;

[0080] Fig.12 A schematic top view showing another example of a test arrangement with multiple devices under test; and

[0081] Fig.13 A schematic top view of another example of a test arrangement with a plurality of devices under test is shown. DETAILED DESCRIPTION

[0082] In the following description, the same or equivalent elements or elements having the same or equivalent functions will be denoted by the same or equivalent reference numerals even if they appear in different drawings.

[0083] In the following description, a large amount of details are provided to more fully explain the embodiments of the present invention. However, it is obvious to those skilled in the art that the embodiments of the present invention can be implemented without these specific details. In other cases, in order not to obscure the embodiments of the present invention, known structures and devices are shown in block diagram form rather than in detailed form. In addition, unless otherwise specified, the features of the different embodiments described herein can be selectively combined with each other.

[0084] Figure 1 A cross-sectional schematic diagram of an example of a test arrangement 100 for over-the-air (OTA) testing of an angled device under test 140 is shown.

[0085] The test arrangement includes a carrier structure 110 and a socket 130 of a device under test coupled to the carrier structure 110. The socket 130 of the device under test is configured to be connected to an inner surface 142 of an angled device under test 140 or to a connector ( Figure 1 The carrier structure comprises an opening 120 extending away from the socket 130 of the device under test in the direction of an outward surface normal 143a of the first outer surface 141a of the angled device under test 140.

[0086] The carrier structure 110 may be (or include) a printed circuit board (PCB) test fixture or a load board. The carrier structure 110 may, for example, include an area having a flat surface. The socket 130 of the device under test may be arranged on top of the carrier structure 110 (e.g., on a flat surface), or may be coupled to the carrier structure 110 via one or more intermediate devices or structures.

[0087] Figure 1 The test arrangement 100 shown in FIG. 1 can be used, for example, to test the angled device under test 140 by itself (e.g., without an antenna structure that detects electromagnetic radiation emitted by the angled device under test), or to test the angled device under test 140 in combination with one or more additional antennas. For example, the test arrangement 100 can be used to test power consumption of the device under test 140 or interference between antennas of the device under test 140. Alternatively, the test arrangement 100 can be configured to test one or more antenna structures of the device under test wirelessly.

[0088] Since the socket 130 of the device under test is configured to contact the inner surface 142 of the device under test, the outer surface of the device under test 140 is completely (or at least mostly) away from the socket 130 of the device under test and the carrier 110. Therefore, the impact of the socket 130 of the device under test and / or the carrier structure 110 on the radiation emitted (and / or received) by the outer surface of the device under test 140 (and the testing thereof) is reduced. In addition, the opening 120 reduces the impact of the carrier structure 110 on the device under test, and thus reduces the impact on the test results.

[0089] The angled device under test 140 may, for example, be (or include) an antenna in package (AiP) device. The angled device under test 140 may, for example, have an L-shape (e.g. Figure 1 ). For example, the device under test can be a device in which a first board 141a is connected to a second board 141b, wherein the angle between the first board 141a and the second board 141b is at least substantially 90 degrees (e.g., within ±15 degrees). The angled device under test 140 may include a first outer surface 144a (e.g., of the first board 141a) and a second outer surface 144b (e.g., of the second board 141b), wherein, for example, the angle between the first outer surface 144a and the second outer surface 144b is at least substantially 270 degrees (e.g., within ±15 degrees). The inner surface 142 of the angled device under test 140 may include a first inner surface 142a (e.g., of the first board 141a) and a second inner surface 142b (e.g., of the second board 141b), wherein, for example, the angle between the first inner surface 142a and the second inner surface 142b is at least substantially 90 degrees (e.g., within ±15 degrees). The first inner surface 142a and the first outer surface 144a may be, for example, arranged parallel to each other. The second inner surface 142b and the second outer surface 144b may be, for example, arranged parallel to each other.

[0090] The socket 130 of the device under test can be configured to position the angled device under test 140 so that the second outer surface 144b of the angled device under test 140 faces away from the carrier structure 110. The socket 130 of the device under test can be configured to position the angled device under test 140 so that the surface normal 143b of the second outer surface 144b of the angled device under test is perpendicular to the surface 112 of the carrier structure 110 within ±15 degrees. The second outer surface 144b can be arranged to be parallel to the surface 112 of the carrier structure 110.

[0091] Figure 2A A cross-sectional view of a first example angled device under test 240 is shown, which may be an alternative to angled device under test 140 .

[0092] The device under test 240 includes a first plate 241a and a second plate 241b, the angle between which is 90 degrees (eg, within ±15 degrees). The first plate 241a includes a first outer surface 244a and a first inner surface 242a, and the second plate 241b includes a second outer surface 244b and a second inner surface 242b.

[0093] exist Figure 2A In the example shown, the first outer surface 244a includes a first antenna array 246a, and the first antenna array 246a has four antenna elements. However, the first outer surface 244a can (additionally or alternatively) include any other form of antenna (e.g., a single antenna and / or a circularly polarized antenna) and any number of antenna elements or antenna arrays. Alternatively, the second outer surface 244b can include the first antenna array 246a. The first antenna array 246a can be configured to receive and / or transmit electromagnetic radiation.

[0094] The device under test 240 may also include a connector 248, such as an array connector. Figure 2A In the example shown, the (array) connector 248 is arranged on the second inner surface 242b. Alternatively, the (array) connector 248 can be arranged on the first inner surface 242a or (for example, in the case of multiple (array) connectors 248) on the first inner surface 242a and the second inner surface 242b. The (array) connector 248 is electrically connected to at least one antenna element (of all antenna elements) of the first antenna array 246a. Therefore, an electrical signal applied to the (array) connector 248 can cause the first antenna array 246a to emit electromagnetic radiation. Alternatively or additionally, the electromagnetic radiation received by the first antenna array 246a can generate an electrical signal at the (array) connector 248. The (array) connector 248 can be or include one or more solder balls. The (array) connector 248 can be configured to connect the device under test 140 (for example, a packaged antenna module) to a system (for example, a mobile phone or a socket 130 of the device under test) and can transmit signals such as power signals, digital signals, radio frequency (RF) signals or intermediate frequency (IF) signals.

[0095] The first antenna array 246a may be directly electrically connected to the (array) connector 248, or may be indirectly coupled to the (array) connector 248 using other electrical components therebetween. For example, these other electrical components may include at least one amplifier, filter, switch, resistor, capacitor, and integrated circuit. Figure 2AIn the example shown, other electrical components include antenna circuit 249 (e.g., a silicon chip). Antenna circuit 249 can be configured to convert an intermediate frequency (IF) signal to a millimeter wave signal (e.g., a 5G frequency band, such as in the range of 24 GHz to 53 GHz) and / or vice versa. Alternatively or additionally, antenna circuit 249 can be configured to (at least partially) control the beamforming of the first antenna array 246a.

[0096] Figure 2B A cross-sectional view of a second example angled device under test 240 a is shown, which may be substituted for angled device under test 140 .

[0097] The second example of an angled device under test 240a is essentially the same as Figure 2A 244b, and thus like elements will be designated with like reference numerals, but further includes a second antenna array 246b on a second outer surface 244b. The second antenna array 246b may have similar characteristics to the first antenna array 246a. The second antenna array 246b may also be electrically connected to at least one (array) connector 248 and an antenna circuit 249. Alternatively, the second antenna array 246b may be electrically connected to a separate (array) connector and / or a separate antenna circuit.

[0098] The DUT receptacle 130 may be configured to position the angled DUT 140 (e.g., angled DUT 240 or angled DUT 240a) such that a first outer surface 144a of the angled DUT 140 (e.g., first outer surface 244a) is spaced apart from the surface 112 of the carrier structure 110. The DUT receptacle 120 may be configured to position the angled DUT 140 such that a surface normal 143a of the first outer surface 144a of the angled DUT 140 is parallel to the surface 112 of the carrier structure 110 (e.g., first outer surface 244a). Figure 1 The first outer surface 144 a may be arranged perpendicular to the surface 112 of the carrier structure 110 .

[0099] The socket 120 of the device under test can be configured to position the angled device under test 140 so that the spacing (e.g., first distance 114) between the first outer surface 144a of the angled device under test 140 and the carrier structure 110 (e.g., its surface 112) is at least two wavelengths (or at least 10 mm, at least 30 mm, or at least 45 mm) at the lowest operating frequency of the angled device under test. The angled device under test 140 can operate within a frequency band of the 5G standard, such as in the range of 24 GHz to 53 GHz (e.g., band 2). In this case, the lowest operating frequency can be 24 GHz with a wavelength of 12.5 mm. The space between the first outer surface 144a and the surface 112 of the carrier structure 110 can be, for example, 25 mm or greater (i.e., twice 12.5 mm).

[0100] Figure 3 A perspective view of an angled device under test 340 is shown, which can replace the angled device under test 140. The device under test 340 includes a first outer surface 344a having a first antenna array and a second outer surface 344b having a second antenna array, the first antenna array having four antenna elements and the second antenna array having four antenna elements. At least one antenna element can include at least one parasitic patch. Figure 3 In the example shown, each antenna element has four parasitic patches surrounding a central antenna structure. The first outer surface 344a includes two central antenna arrays 345a and 345b. There are no metallized surfaces around the device under test 340.

[0101] Figure 4 Shows Figure 3 The simulation results of the far field emitted by the antenna element (e.g., antenna element 345a or 345b) of the first antenna array of the first outer surface 344a of the device under test 340 are depicted. It should be noted that for simplicity, Figure 3 The simulation of the far field depicted in is from the center of the antenna array of the first outer surface 344a (e.g., between the central antenna elements 345a and 345b). However, the simulation of the far field may have substantially the same shape when starting from the center of one of the central antenna elements 345a or 345b. The far field shows significant lobes that are oriented perpendicular to the two central antenna elements 345a and 345b of the first outer surface 344a (however, when the device under test 340 is used in a system, such as in a system that provides a metallized backplane, reverse radiation may be reduced or suppressed).

[0102] Figure 5A perspective view of an angled device under test 540 is shown, which can replace the angled device under test 140. The device under test 540 includes a first outer surface 544a having a first antenna array and a second outer surface 544b having a second antenna array, the first antenna array having four antenna elements and the second antenna array having four antenna elements. The first antenna array of the first outer surface 544a includes two central antenna elements 545a and 545b. There is a metal (e.g., copper) surface 551 at a distance of 2 mm from the first outer surface 544a.

[0103] Figure 6 Shows Figure 5 Simulation results of the far field emitted by the antenna elements (e.g., antenna elements 545a or 545b) of the first antenna array of the first external surface antenna array 544a of the device under test 530 (preferably considering the metal surface 550). Figure 4 Compared to the results depicted in , the far field shows less noticeable radiation from the two central antenna elements oriented perpendicular to the first outer surface 544a. Instead, the intensity of the far field is more evenly distributed around the device under test 540, with separate main lobes in two directions that are different from the direction of the surface normal on the first outer surface 544a. The results indicate that nearby metallized surfaces can affect the far field emitted by the device under test 540, thereby reducing the accuracy and / or repeatability of the test. For example, the metallized surfaces may reduce the spatial selectivity of the beamforming antenna array and / or change the direction of the main lobe.

[0104] Thus, openings in the carrier structure and optionally spacing as described above (e.g., at least two wavelengths, or at least 10 mm, or at least 30 mm, or at least 45 mm) can improve the accuracy and / or repeatability of testing.

[0105] Fig. 7A 1 shows a perspective view of an example of a device under test 740. The device under test 740 includes a first inner surface 742a and a second inner surface 742b. Fig. 7AIn the example shown, the device under test includes a first plate 741a and a second plate 741b, the first plate 741a having a first inner surface 742a, and the second plate 741b having a second inner surface 742b. The first plate 741a and the second plate 741b are mechanically (and optionally electrically) connected by a flexible conductive structure (e.g., three flexible printed circuits 747a, b, c). The first plate 741a and the second plate 741b are movable (e.g., rotatable or bendable) relative to each other, for example, to facilitate assembly or manufacturing in a system. However, in some cases, the movability of the plate may facilitate coupling with the socket of the device under test, but may also complicate testing in some cases. Alternatively, the first plate 741a and the second plate 741b can be fixedly arranged relative to each other.

[0106] The device under test 740 includes a silicon chip 749 (or any other antenna circuit) and a connector or array connector 748 on the second inner surface 742b. The silicon chip 749 can be electrically contacted indirectly via the array connector 748, or via the electrical contacts of the silicon chip 749 itself ( Fig. 7A The socket of the device under test described herein is configured to establish electrical contact with the inner surface of the device under test 740 (eg, with the array connector 748 on the second inner surface 742b).

[0107] Figure 7B Shows Fig. 7A Different perspective views of the device under test 740 depicted in . The device under test 740 includes a first outer surface 744a (on a first plate 741a) and a second outer surface 744b (on a second plate 741b). The first outer surface 744a and the second outer surface 744b (or, for example, respective antennas or antenna structures formed or arranged on the first and second outer surfaces) are configured to transmit and / or receive electromagnetic radiation. To this end, antenna elements (e.g., antenna arrays) can be arranged at least partially on the first surface 744a and / or the second surface 744b, or can be arranged at least partially within the first plate 741a and / or the second plate 741b. In Figure 7B In the example shown, the first outer surface 744a and the second outer surface 744b are configured to emit and / or receive electromagnetic radiation. Alternatively, only the first outer surface 744a or only the second outer surface 744b may be configured to emit and / or receive electromagnetic radiation.

[0108] exist Figure 1In the example shown, the socket 130 of the device under test can be configured to position the angled device under test 140 (or, for example, the angled device under test 740, which may, for example, replace the angled device under test 140) so that the surface normal 143a of the first outer surface 141a (or the first outer surface 741a) of the angled (e.g., L-shaped) device under test is parallel to the surface (e.g., the main surface) of the carrier structure (e.g., the load board) within ±15 degrees. Alternatively, the socket 130 of the device under test is configured to position the angled device under test 140 (or the angled device under test 740) at any other angle.

[0109] exist Figure 1 In the example shown, the socket 130 of the device under test is configured to position the angled device under test 140 (or the angled device under test 740) so that the second outer surface 144b (e.g., the surface including the radiating structure) (or the second outer surface 744b) of the angled (e.g., L-shaped) device under test 140 faces away from the carrier structure 110 (e.g., the load board), and so that the surface normal 143b of the second outer surface 144b of the angled (e.g., L-shaped) device under test 140 is perpendicular to the surface of the carrier structure (e.g., the load board) within an error of ±15 degrees.

[0110] exist Figure 1 In the example shown, the opening 110 forms a blind hole that does not extend through the entire thickness of the carrier structure 110. The blind hole can reduce the risk of the component falling (e.g., during installation). Alternatively, the opening 110 can be a through hole that extends through the entire thickness of the carrier structure 110. The through hole can reduce interference caused by the carrier structure 110 and help guide the electrical connection to the side of the carrier structure opposite the socket 130 of the device under test (e.g., a signal source and / or a signal receiver).

[0111] The opening extends 121 in the direction of the outward surface normal 143a of the first outer surface 144a of the angled device under test 140 (e.g., along the main radiation direction of the antenna structure of the first outer surface of the device under test away from the socket 130 of the device under test, at Figure 1In the example of the angled device under test 140 being parallel to the x-axis, for example in the negative x-direction) may be at least 2 wavelengths, at least 3 wavelengths, or at least 4 wavelengths (e.g., the free space wavelength, or the wavelength in the medium between the first outer surface of the angled device under test and the carrier structure) at the lowest operating frequency of the angled device under test (e.g., the lowest operating frequency of a packaged antenna module constituting or included in the device under test). For example, the angled device under test 140 may operate within a frequency band of the 5G standard, for example in the frequency range of 24 GHz to 53 GHz (e.g., band 2). In this case, the lowest operating frequency may be 24 GHz, with a (free space) wavelength of (approximately) 12.5 mm. The extension 121 of the opening in the direction of the outward surface normal 143a of the first outer surface 144a may, for example, be 25 mm or more (i.e., twice 12.5 mm).

[0112] Figure 8 8 shows a schematic top view of an example of a test arrangement 800. When viewed from the top, Figure 1 The test arrangement 100 depicted in FIG. 1 may be at least as good as Figure 8 In other words, any features, functions, and details described with respect to the test arrangement 800 may be selectively used in (or implemented in) the test arrangement 100, and vice versa.

[0113] The test arrangement 800 includes a carrier structure 810 having an opening 820 and a socket 830 of a device under test, in which a device under test 840 can be placed. The opening 820 is rectangular. However, the opening 820 can also be other shapes, such as circular, elliptical or polygonal. The opening 820 can include one or more rounded corners.

[0114] The opening includes an extension 821 (at Figure 8 B), or equivalently, in the direction of the outward surface normal of the surface of the test socket, which is configured to extend approximately to the first inner surface of the angled device under test 840. The extension 821 can be, for example, greater than two wavelengths, three wavelengths, or four wavelengths (e.g., free space wavelengths) at the lowest operating frequency of the antenna of the device under test.

[0115] The opening 820 extends 822 in a direction perpendicular to the outward surface normal 843a of the first outer surface 844a of the angled device under test 840 (eg, the opening 820 extends in a direction parallel to the first outer surface 844a, for example, in Figure 8The width of the antenna 822 in the direction parallel to the y-axis is, for example, greater than the extension 823 of the device under test 840 (or, for example, greater than the extension 823 of the radiating structure on the first outer surface 844a of the device under test). The extension 822 can be, for example, greater than two wavelengths, three wavelengths, or four wavelengths (e.g., the free space wavelength) at the lowest operating frequency of the antenna of the device under test.

[0116] Using such opening extensions 821 and 822 , wireless testing of the device under test may have good electromagnetic characteristics, for example, if the antenna or antenna structure of the device under test radiates in the direction of the surface normal 823 , or if the device under test receives radiation in the direction of the surface normal 823 .

[0117] Fig. 9 A schematic cross-sectional view of an example of a test arrangement 900 is shown having a carrier structure 910 and a socket 930 of a device under test, which socket 930 of the device under test may be configured to carry a device under test 940. The carrier structure 910 includes an opening 920 extending away from the socket 930 of the device under test in the direction of an outward surface normal 843a of a first outer surface 944a of the angled device under test 940 (or equivalently, in the direction of an outward surface normal of a first surface of the socket of the device under test that is adapted to fit to a first inner surface of the angled device under test 940). Fig. 9 In the example shown, the opening 920 is a hole that extends through the entire thickness of the carrier structure 910. Alternatively, the opening 930 may be a blind hole.

[0118] The socket 930 of the device under test is configured such that when the device under test 940 is inserted into the socket 930 of the device under test, at least a portion of the device under test 940 is located in the opening 920. Fig. 9 In the example shown, the socket 930 of the device under test is configured such that the socket 930 of the device under test extends into the opening 920 (e.g., partially or completely through the opening 920). Therefore, a portion of the device under test 940 inserted into the socket 930 of the device under test may extend into the opening 920. Alternatively, the socket 930 of the device under test may be completely disposed above the opening 920 (i.e., not extending into the opening 920), and the size of the device under test 940 is designed such that when the device under test 940 is inserted into the socket 930 of the device under test, the device under test 940 extends into the opening 920. However, in other embodiments, the device under test may not extend into the opening 920.

[0119] According to an embodiment, the test arrangement includes a first antenna or antenna structure (e.g., a single-aperture antenna (e.g., a dual-linear polarization or circular polarization antenna)) configured to receive signals radiated from a first outer surface of an angled device under test and / or to transmit signals to be received at the first outer surface of the angled device under test.

[0120] The extension of opening 920 may be selected so that an angled edge of the device under test (eg, Fig. 9 The distance 924 between the first outer surface 944a of the angled device under test or the edge of the packaged antenna device and the carrier structure 910 (for example, the distance between the edge of the angled device under test or the edge of the packaged antenna device and the nearest edge of the opening) is at least one wavelength (for example, a free space wavelength, or a wavelength in the medium between the first outer surface of the angled device under test and the carrier structure) at the lowest operating frequency of the angled device under test 940 (for example, the lowest operating frequency of a packaged antenna module (AiP) constituting the device under test 940 or included in the device under test 940) (while there is no material of the carrier structure 910 within one wavelength from the edge of the angled device under test 940 or the edge of the packaged antenna device).

[0121] The socket 930 of the device under test includes one or more coaxial spring probes 932 to establish an electrical connection between the carrier structure 910 (e.g., a PCB test fixture or a load board of the carrier structure 910) and the angled device under test 940. For example, the spring probes 932 can extend from the lower surface of the socket 930 of the device under test (which can contact the PCB test fixture or the load board of the carrier structure 910) to the upper surface of the socket 930 of the device under test (which can contact the second inner surface 942b of the angled device under test 940). For example, the first end of the coaxial spring probe 932 can contact a pad on the load board or PCB test fixture (e.g., of the carrier structure 930). The second end of the spring probe 932 can contact a pad on the angled device under test 940 or a connector of the angled device under test 940. The spring probe 932 may, for example, extend beyond an upper surface of the device under test receptacle 930 , wherein the spring probe 932 is configured to shorten when the device under test 940 is inserted into the device under test receptacle 930 .

[0122] exist Fig. 9 In the example shown, the test arrangement 900 includes a first antenna or antenna structure 950 and a second antenna or antenna structure 952. However, the test arrangement 900 may include only one of the first antenna or antenna structure 950 and the second antenna or antenna structure 952.

[0123] The first antenna or antenna structure 950 (e.g., a single aperture antenna (e.g., a dual linear polarized or circularly polarized antenna)) is configured to receive signals radiated from the first outer surface 944a of the angled device under test 940 (or, more precisely, from an antenna or antenna structure disposed in or on the first outer surface 944a) and / or is configured to transmit signals to be received at the first outer surface 944a of the angled device under test 940 (or, more precisely, an antenna or antenna structure disposed in or on the first outer surface 944a). To this end, the first antenna or antenna structure 950 can be placed at a distance from the first outer surface 944a of the angled device under test 940 such that a surface normal of the first outer surface 944a of the angled device under test 940 (or, equivalently, a surface normal of a first surface of a socket of the device under test abutting against a first inner surface of the device under test) extends through an aperture of the first antenna or antenna structure 950. Alternatively, the first antenna or antenna structure 950 can be arranged in a different position and / or orientation.

[0124] The first antenna or antenna structure 940 is at least partially arranged in the opening (eg, within an open area surrounded by the carrier structure 910; eg, within the plane of the carrier structure 910). Fig. 9 In the example shown, the first outer surface 944a and the aperture of the first antenna or antenna structure 950 are arranged so that the transmission path between them is arranged offset relative to the central plane of the carrier structure 910 (in a direction perpendicular to the surface of the carrier structure 910). Alternatively, the transmission path between the first outer surface 944a and the aperture of the first antenna or antenna structure 950 can be arranged in the central plane of the carrier structure 910.

[0125] exist Fig. 9 In the example shown, the radiation aperture 951a of the first antenna or antenna structure 950 is arranged outside the opening 920. Alternatively, the radiation aperture 951a of the first antenna or antenna structure 950 may be arranged at least partially within the opening 920 (e.g., within an open area surrounded by the carrier structure 910; e.g., within the plane of the carrier structure 910).

[0126] The first antenna or antenna structure 950 can be mounted to have a fixed position relative to the socket 930 of the device under test. Alternatively, the first antenna or antenna structure 950 can be configured to be movable relative to the socket 930 of the device under test. The movable first antenna or antenna structure 952 can increase the accessibility to the socket 930 of the device under test (e.g., for inserting the device under test 940).

[0127] For example, the first antenna or antenna structure 950 can be mechanically attached to an arm of the manipulator such that the first antenna or antenna structure 950 is movable. The manipulator can be configured to insert the angled device under test 940 into the test device receptacle 930. For example, when the manipulator pushes the angled device under test 950 into the test receptacle 930, the first antenna or antenna structure 950 can be at least partially disposed in the opening 920.

[0128] exist Fig. 9 In the example shown, the first antenna or antenna structure 950 includes (or is connected to) a first coaxial cable 953a, which is connected (or connectable) to a first signal source and / or a first signal receiver 956a. However, any other form of electrical signal transmission (e.g., a hollow waveguide structure) may also be used. Alternatively or additionally, the first antenna or antenna structure 950 may be connected to any other device (which, for example, may be configured to perform or support testing of a device under test). For example, the first coaxial cable 953a may extend through the opening 920. Alternatively, the coaxial cable 953a may extend through an opening different from the opening 920, or may not extend through any opening (e.g., extending on the same side of the carrier structure as the socket 940 of the device under test and / or the first antenna or antenna structure 950).

[0129] Alternatively, the first antenna or antenna structure 950 can be configured to connect to the signal source and / or the first signal receiver 956a via a blind-mate microwave connection (e.g., via a blind-mate (hollow) waveguide connection) when the operator places the first antenna or antenna structure 950 in an operating position (or equivalently, when the operator inserts the angled device under test 940 into the test socket 930, or when the operator pushes the device under test 940 into the test socket 930).

[0130] The second antenna or antenna structure 952 (e.g., a single-hole antenna (e.g., a dual-linear or circularly polarized antenna)) is configured to receive (at least when the second antenna or antenna structure 952 is placed in the operating position) (or equivalently, when the operator has inserted the angled device under test 940 into the test socket 930, or when the operator pushes the device under test 940 into the test socket 930) signals radiated from the second outer surface 944b of the angled device under test 940 (or, more precisely, from an antenna or antenna structure arranged on or in the second outer surface) and / or signals emitted to be received at the second outer surface 944b of the angled device under test 940 (or, more precisely, an antenna or antenna structure arranged on or in the second outer surface 944b).

[0131] The aperture 951b of the second antenna or antenna structure 952 is arranged at a certain distance from the second outer surface 944b of the angled device under test 940 so that (at least when the second antenna or antenna structure 952 is placed in the operating position) (or equivalently, when the operator has inserted the angled device under test 940 into the test socket 930, or when the operator pushes the device under test 940 into the test socket 930) the surface normal of the second outer surface 944b of the angled device under test 940 extends through the aperture 951b of the second antenna or antenna structure 952.

[0132] The second antenna or antenna structure 952 is mechanically attached to an arm of the manipulator (which may be configured to insert and / or push the angled device under test 940 into the device under test receptacle 930) such that the second antenna or antenna structure 952 is movable.

[0133] It should be noted that Fig. 9 Examples of antenna structures are shown, which can be used with or without an operator. Alternatively, neither or both of the first antenna structure 950 and the second antenna structure 952 are coupled / attached to an operator. The first antenna or antenna structure 950 and the second antenna or antenna structure 952 can be attached to the same / common operator, or can each be attached to a separate operator.

[0134] The second antenna or antenna structure 952 can be coupled to a push rod for pushing the angled device under test 940 into the socket 930 of the device under test, or the second antenna or antenna structure 952 can, for example, be configured to be movable with the push rod for pushing the angled device under test 940 into the socket 930 of the device under test (wherein, for example, the push rod is arranged such that, when the device under test 940 is inserted into the socket 930 of the device under test, the push rod or a portion of the push rod is between the second antenna or antenna structure 952 and the second outer surface 944b of the angled device under test 940) (and / or where, for example, the push rod is arranged such that when the angled device under test 940 is inserted into the socket 930 of the device under test, the push rod or a portion of the push rod is between the first antenna or antenna structure 950 and the first outer surface 944a of the angled device under test 940).

[0135] The second antenna or antenna structure 952 is configured to be connected to a second signal source and / or a second signal receiver 956b via a blind-mate microwave connection (e.g., a blind-mate (hollow) waveguide connection) when the operator has placed the second antenna or antenna structure 952 in the operating position (or equivalently, when the operator has inserted the angled device under test 940 into the test socket 930, or when the operator pushes the device under test 940 into the test socket 930).

[0136] exist Fig. 9 In the example shown, the second antenna or antenna structure 952 includes (or is connected to) a second coaxial cable 953b, which is connected (or connectable) to a second signal source and / or signal receiver 956b. However, any other form of electrical signal transmission may be used. Alternatively or additionally, the second antenna or antenna structure 952 may be connected to any other device. The second coaxial cable 953b may extend through the opening 920. Alternatively, the second coaxial cable 953b may extend through an opening different from the opening 920 (e.g., Fig. 9 ), or does not pass through any opening (eg, extending on the same side as the receptacle 940 and / or first antenna or antenna structure 950 of the device under test).

[0137] It should be noted that Fig. 9 The test arrangement 900 shown in FIG. 1 has two independent signal sources and / or signal receivers 956 a, b. However, the test arrangement 900 may have only a common (e.g., single) signal source and / or a single signal receiver that may be connected to the first and second antennas or antenna structures 950, 952 via separate or common electrical connections (e.g., coaxial cables).

[0138] In short, according to Fig. 9 The test arrangement allows efficient testing of the device under test, wherein the socket of the device under test and the first antenna 950 are partially placed within the opening 920, which helps to reduce the structural height. However, even if the socket of the device under test and / or the first antenna or antenna structure are not partially placed within the opening, the test arrangement can still achieve a relatively small structural height, because the opening allows the socket of the device under test and the first antenna or antenna structure to be placed close to the plane of the carrier structure.

[0139] Fig.10A stereogram of an example of a socket 1030 of a device under test is shown, and the socket 1030 of the device under test can be used, for example, in any embodiment disclosed herein. The socket 1030 of the device under test can be configured to receive any device under test described herein, and can be part of any test arrangement described herein. The socket 1030 of the device under test includes an angled recess or angled notch 1060, which is configured to support and / or align the angled device under test. The angled recess or angled notch 1060 includes a first abutment surface 1062a and a second abutment surface 1062b, the first abutment surface 1062a is used to abut with a first inner surface of the device under test (e.g., first inner surface 142a, 242a), and the second abutment surface 1062b is used to abut with a second inner surface of the device under test (e.g., second inner surface 142b, 242b or 942b). The first abutment surface 1062a and the second abutment surface 1062b may be arranged at an abutment surface angle, wherein the sum of the abutment surface angle (e.g., 270 degrees) and the angle between the first inner surface and the second inner surface of the device under test (e.g., 90 degrees) is at least substantially 360 degrees. For example, if the first inner surface and the second inner surface of the device under test are arranged at an angle of 90 degrees, the abutment surface angle may be 270 degrees (the sum of 90 degrees and 270 degrees is 360 degrees).

[0140] Any surface of the socket 1030 of the device under test can be configured to establish electrical contact with the inner surface of the device under test. For example, the first abutment surface 1062a and / or the second abutment surface 1062b can be configured to establish electrical contact with the inner surface of the device under test, and / or provide a ground plane for the antenna structure of the device under test. To this end, the first abutment surface 1062a and / or the second abutment surface 1062b can include or can be made of a conductive material (e.g., at least one of gold, copper, iron and nickel). Alternatively, the first abutment surface and / or the second abutment surface can include a dielectric (non-conductive) material (e.g., a wear-resistant material) or be made of a dielectric (non-conductive) material (e.g., a wear-resistant material). Optionally, the first abutment surface 1062a and / or the second abutment surface 1062b can include one or more (local) socket connectors 1065 (or other contact structures for contacting the device under test, such as conductive pads, spring pins, spring-loaded contacts, etc.). The socket connector 1065 is arranged so that when the device under test is arranged in the socket 1060 of the device under test, the connector 1065 establishes an electrical connection with the inner surface of the device under test or its connector (eg, array connector 248, 748).

[0141] The socket 1030 of the device under test includes a support body 1064, which includes a main socket structure 1064a and a leg socket structure 1064b. Both the main socket structure 1064a and the leg socket structure 1064b have an outer shape of a rectangular parallelepiped (optionally with rounded edges), wherein at least two edges of the leg socket structure 1064b are smaller (shorter) than two edges (e.g., corresponding edges) of the main socket structure 1064a. The main socket structure 1064a and the leg socket structure 1064b can, for example, have the same height. The side surface 1061 of the leg socket structure 1064b is arranged to be flush with the side surface of the main socket structure 1064a, while the other three side surfaces of the leg socket structure 1064b are recessed relative to the other three (corresponding) side surfaces of the main socket structure 1064a. Thus, for example, the leg socket structure 1064b may be received by an opening in the carrier structure (or other structure therebetween) such that lateral movement of the socket 1030 of the device under test is limited by side surfaces of the leg socket structure 1064b.

[0142] The socket 1030 of the device under test may additionally or alternatively include one or more protrusions 1066 extending from the support body 1064 (e.g., from the main socket structure 1064a) in a direction toward the carrier structure. The protrusion 1066 may be or include a (e.g., cylindrical) shaft. The protrusion 1066 may be received by a recess of the carrier structure (or other structures therebetween). Alternatively or additionally, the socket 1030 of the device under test may include one or more through holes for receiving attachment elements, such as pins or screws.

[0143] exist Fig.10 In the example shown, the angled recess or angled notch 1060 extends into both the main socket structure 1064a and the leg socket structure 1064b. Alternatively, the angled recess or angled notch 1060 may extend only into the main socket structure 1064a.

[0144] The angled recess or angled notch 1060 has corresponding side walls 1068a, b at its two ends (the side walls 1068a, b are Fig.10 Only one of them is directly visible). The side walls 1068a, b face each other and are arranged at least substantially parallel to each other (ignoring the optional taper). Fig.10In the example shown, the side walls 1068a, b are oriented vertically or at least substantially vertically relative to the first abutment surface 1062a and the second abutment surface 1062b. The side walls 1068a, b can limit lateral movement of the device under test within the angled recess or angled notch 1060, while still allowing the device under test to be smoothly and well inserted into the angled recess or angled notch 860, and also allowing the device under test to be smoothly removed. Alternatively, the angled recess or angled notch 1060 includes only one side wall, for example, to increase flexibility with respect to positioning.

[0145] The angled recess or angled notch 1060 may include at least one taper, for example, such that the cross-section (e.g., parallel to the first abutment surface 1062a or the second abutment surface 1062b) decreases in a direction from the outside toward the first or second abutment surface 1062b. Fig.10 In the example shown, the angled recess or angled notch 1060 includes a first and a second taper. According to the first taper, the distance between the side walls 1068a, b decreases toward the first abutment surface 1062a. According to the second taper, the cross-section of the three side walls of the main socket structure 1064a surrounding the second abutment surface 1062b decreases toward the second abutment surface 1062b. The taper can have a self-centering function and facilitate the insertion of the device under test into the angled recess or angled notch 1060.

[0146] The socket 1030 of the device under test may have adjacent openings 1069 that intersect the angled recess or angled notch 1060. Fig.10 In the example shown, the socket 1030 of the device under test includes four adjacent openings 1069, and the adjacent openings 1069 are arranged near the corners of the second abutment surface 1062b. Alternatively, the socket 1030 of the device under test can include any other number of adjacent openings 1069 at any other position, and these positions are located adjacent to the second abutment surface 1062b (and / or the first abutment surface 1062a). For example, adjacent openings can be adapted to prevent the device under test from tilting when the device under test is inserted into the socket 1030. However, adjacent openings can also help to remove the device under test from the socket 1030.

[0147] The angled recess or angled notch 1060 may include additional recesses or elevations, for example, to conform to the shape of the device under test. Fig.10 The angled recess or angled notch 1060 shown in the figure includes a step 1067 in the first abutment surface 1062a. The step 1067 can, for example, accommodate a structural feature of the first inner surface, or provide a support surface for the device under test to form a space below (e.g., for gripping the device under test).

[0148] The socket 1030 of the device under test may include a blind mate interface. Fig.10 In the example shown, the main socket structure 1064a includes two (blind) mating recesses 1061a, b. Alternatively, the main socket structure 1064a may include any other number of mating recesses. The mating recesses 1061a, b are configured to receive a (blind) mating protrusion of a push rod or an operator (e.g., operator 754). Alternatively or additionally, the main socket structure 1064a may include one or more (blind) mating protrusions, for example, which are configured to be received by a (blind) mating recess of a push rod or an operator (e.g., operator 754).

[0149] In summary, the socket 1030 can receive an angled device under test and can establish an electrical connection with the angled device under test. The device under test can be positioned (aligned) within the angled recess or angled notch 1060, making it possible to use the antenna structure or antenna on the two outer surfaces of the angled device under test to perform air testing on the device under test. The device under test is well aligned in the socket, which helps to position the device under test in a compact arrangement. In addition, the socket can keep the radiation characteristics of the antenna or antenna structure of the device under test reasonably small. The socket can be easily attached to the carrier structure and can be used in any embodiment disclosed herein.

[0150] Fig.11A A schematic cross-sectional view of an example of a test arrangement 1100 is shown having a carrier structure 1110 (e.g., a printed circuit board test fixture or a load board), and a device under test socket 1130 with a device under test 1140 (e.g., an L-shaped device under test). The carrier structure 1110 includes an opening 1120 extending away from the device under test socket 1130 in the direction of an outward surface normal 1143a of a first outer surface 1144a of the angled device under test 1140 (or equivalently, in the direction of an outward surface normal of a first surface of the device under test socket abutting a first inner surface of the device under test). The test arrangement 1100 includes a first antenna or antenna structure 1150 for receiving signals radiated from a first outer surface 1144a of the angled device under test 1140 (or, more precisely, from an antenna or antenna structure disposed on or in the first outer surface 1144a) and / or for transmitting signals received at (or, more precisely, received by) an antenna or antenna structure disposed on or in the first outer surface 1144a of the angled device under test 1140. The socket 1130 of the device under test is configured such that the socket 1130 of the device under test extends into the opening 1120.

[0151] Fig. 11B Shown Fig.11AA perspective view of a test arrangement 1100 is shown in FIG. A first antenna or antenna structure 1150 is partially arranged within the opening 1120 (eg, one or more electrical connectors of the first antenna or antenna structure are arranged, for example, below the carrier structure 1110 ).

[0152] An extension 1122 (e.g., width) of the opening 1120 along a direction perpendicular to an outward surface normal 1143a of a first outer surface 1144a of the angled device under test 1140 (or equivalently, perpendicular to an outward surface normal of a socket of the device under test abutting the first inner surface of the device under test) is greater than an extension 1123 of the device under test 1140 (e.g., along the same direction).

[0153] The opening 1120 has a larger size on the side opposite to the socket 1130 of the device under test (in other words, in the portion surrounding the first antenna or antenna structure 1150). Therefore, the opening 1120 provides sufficient space for the first antenna or antenna structure 1150. In particular, the opening 1120 has a rectangular basic shape (optionally with rounded corners) having a wider portion on the side opposite to the socket 1130 of the device under test. For example, the opening widens from the socket of the device under test toward the first antenna or antenna structure (for example, in a step-like manner).

[0154] like Fig. 11B In the example shown, the carrier structure 1110 may include other openings in addition to the opening 1120 .

[0155] Fig.12 A schematic top view of another example test arrangement 1200 is shown, which has a plurality of devices under test 1240a, b, c, d. The test arrangement 1200 includes a carrier structure 1210 (which may include any carrier structure described herein) (e.g., a printed circuit board test fixture or a load board), and four (e.g., four identical or different) sockets 1230a, b, c, d for the devices under test (which may be any sockets for the devices under test described herein). However, the test arrangement 1200 may also include any other number of sockets for the devices under test (e.g., two, three, five, six, or more).

[0156] The carrier structure 1210 includes an opening 1220 that extends away from the receptacles 1230a-d of the device under test in the direction of an outward surface normal of a first outer surface of the angled device under test 1240 (or equivalently, in the direction of an outward surface normal of a first surface of the receptacle of the device under test that abuts the first inner surface of the device under test). Thus, multiple devices 1240a-d share a common opening. The common opening can reduce interference caused by the carrier structure 1210 (e.g., compared to multiple openings with individual boundaries that may cause interference), and can also reduce crosstalk between different devices under test.

[0157] The socket 1230 of the device under test is arranged along the edge of the opening 1220. The socket 1230 of the device under test may be arranged so as to be spaced apart from the opening 1220, so as to be flush with the opening 1220, or so as to overlap with the opening 1220 (eg, when viewed from the top).

[0158] Multiple devices under test 1240a-d may be arranged in a row 1215a, such as Fig.12 As depicted. In addition, the respective first antennas 1250a to 1250d of a row 1215b can be arranged opposite to the device under test (and facing the respective device under test). The test arrangement 1200 allows multiple devices under test 1240a-d to be tested, so the test efficiency can be improved. The tests can be performed simultaneously, for example, to improve time efficiency. Alternatively, the tests can be performed sequentially to reduce crosstalk between the devices under test 1240a-d.

[0159] The device under test receptacles 1230a-d are arranged to position the respective angled devices under test 1240a-d such that the respective first outer surfaces (at the Fig.12 In the example, the first outer surface 1244a of the first device under test 1240a is aligned in the same direction (for example, Fig.12 Alignment in the same direction allows for close packing of the receptacles 1230a-d of the devices under test while keeping crosstalk between adjacent devices under test reasonably small.

[0160] The test arrangement 1200 includes four first antennas or antenna structures 1250a, b, c, d (which may be any first antennas or antenna structures described herein) (e.g., side measurement antennas). However, the test arrangement 1200 may include any other number of first antennas or antenna structures 1250a-d, for example, the same number as the number of sockets 1230a-d of the device under test. Fig.12In the example shown, each of the sockets 1230a-d of the device under test is assigned to a corresponding one of the first antennas or antenna structures 1250a-d (or vice versa). Each of the first antennas or antenna structures 1250a-d is configured to receive signals radiated from the first outer surface of the assigned angled device under test 1240a-d (or more precisely, from the antenna or antenna structure disposed on or in the corresponding first outer surface) and / or is configured to transmit signals received at the first outer surface of the assigned angled device under test 1240a-d (or more precisely, received by the antenna or antenna structure disposed on or in the corresponding first outer surface).

[0161] The aperture of at least one first antenna or antenna structure 1250a-d can be arranged at a certain distance from a corresponding first outer surface of the angled device under test 1240a-d, so that the surface normal of the first outer surface of the corresponding angled device under test 1240a-d (or equivalently, the surface normal of the first surface of the socket of the corresponding device under test that abuts the first inner surface of the corresponding device under test) extends through the aperture of the corresponding first antenna or antenna structure 1250a-d.

[0162] exist Fig.12 In the example shown, the test arrangement 1200 does not include a second antenna or antenna structure to avoid obstructing the devices under test 1240a-d. However, the test arrangement 1200 may include only a first antenna or antenna structure (i.e., without a second antenna or antenna structure), only a second antenna or antenna structure (i.e., without a first antenna or antenna structure), or both a first antenna or antenna structure and a second antenna or antenna structure.

[0163] The carrier structure 1210 may define a board stop 1213 (eg, an operator docking board stop) that defines an area (eg, a rectangular frame) that surrounds an area supporting the receptacles 1230a-d to which the device under test is mounted.

[0164] In summary, by providing a common opening for the sockets of multiple devices under test, the test arrangement 1200 supports efficient testing (e.g., simultaneous testing) of multiple angled devices under test, wherein a small structural height can be achieved and crosstalk between different devices under test can be kept reasonably small. The presence of the opening in the carrier structure helps achieve these goals.

[0165] Fig.13A schematic top view of another example test arrangement 1300 is shown, with a plurality of devices under test 1340. The test arrangement 1300 includes a carrier structure 1310 (which may include any of the carrier structures described herein) (e.g., a printed circuit board test fixture or a load board), and eight (which may be eight identical) sockets 1330 for devices under test (which may be sockets for any of the devices under test described herein). However, the test arrangement 1300 may include any other number of sockets for devices under test (e.g., two, three, five, six, or more).

[0166] At least two sockets 1330 of the devices under test are arranged (e.g., back to back) to position corresponding angled devices under test 1340 so that corresponding first outer surfaces 1344a of the corresponding angled devices under test are aligned in opposite (facing away) directions (or equivalently, are arranged so that corresponding first surfaces of the sockets of two adjacent devices under test are aligned in opposite directions and corresponding first surfaces of the sockets of two adjacent devices under test abut against corresponding first inner surfaces of the corresponding devices under test).

[0167] For ease of observation, Fig.13 Only the leftmost device under test socket 1330 is discussed in the present invention and is therefore labeled with reference numerals 1330a, b. However, the same principles apply to the remaining device under test sockets 1330. The first device under test socket 1330a is configured to arrange the corresponding device under test 1340 so that its corresponding first outer surface 1344a faces a first direction (e.g., in the Fig.13 The socket 1330b of the second device under test is configured to arrange the corresponding device under test 1340 so that its corresponding first outer surface 1344a faces a second direction opposite to (eg, anti-parallel to) the first direction (eg, in the negative x direction). Fig.13oriented in the positive x-direction). Therefore, the respective first outer surfaces 1344a, 1344b of the devices under test 1340a, 1340b arranged in the socket 1330a of the first device under test and the socket 1330b of the second device under test face in opposite directions. Therefore, the first antennas or antenna structures 1350a, 1350b assigned to the socket 1330a, 1330b of the respective first device under test and the second device under test may be arranged in opposite orientations (e.g., in separate openings of the carrier structure). Furthermore, the first antennas or antenna structures 1350a, 1350b assigned to the sockets 1330a, b of the respective first and second devices under test may be arranged such that the sockets 1330a, b of the first and second devices under test are arranged between the assigned first antennas or antenna structures 1350a, 1350b (e.g., sandwiched between the first antennas or antenna structures 1350a, 1350b at a certain distance). This arrangement reduces the risk of crosstalk between the devices under test 1340a, 1340b coupled to the sockets 1330a, b of the first and second devices under test.

[0168] The test arrangement 1300 includes two rows (e.g., parallel rows) 1315a, b of sockets 1330 of devices under test, wherein the sockets 1330 of the devices under test are configured to carry corresponding angled devices under test 1340, wherein the sockets 1340 of the devices under test of at least two rows 1315a, b are arranged (e.g., back-to-back; e.g., the sides of the sockets 1330 of the devices under test are facing away from each other, wherein the first outer surfaces 1344a of the devices under test 1340 are located on the sides of the sockets 1330 of the devices under test) to position the corresponding angled devices under test 1340 so that the corresponding first outer surfaces 1344a of the corresponding angled devices under test 1340 are aligned in opposite (facing away) directions. In addition, there are two rows 1316a, 1316b of first antennas, wherein the two rows 1315a, 1315b are arranged between the first antennas or first antenna structures of the two rows 1316a, 1316b. For example, the first (common) opening 1320a is arranged between the sockets of the devices under test in the first row 1315a and the first antennas in the first row 1316a, and the second (common) opening 1320b is arranged between the sockets of the devices under test in the second row 1315b and the first antennas in the second row 1316b. This arrangement improves the trade-off between reducing crosstalk and increasing layout density.

[0169] The carrier structure 1310 includes two openings 1320a, b, with a solid middle portion 1325 (e.g., a solid strip) between the two openings 1320a, b, wherein, for example, eight sockets 1330 of the devices under test are arranged on the solid middle portion 1325 between the two openings 1320a, b. For example, the device under test positions of the sockets 1330 of four devices under test are oriented toward the first opening 1320a of the two openings 1320a, b. For example, the device under test positions of the sockets 1330 of the other four devices under test are oriented toward the second opening 1320b of the two openings 1320a, b. Fig.13 In the example shown, devices under test 1340 inserted into the receptacles 1330 of devices under test arranged back-to-back on the solid middle portion 1325 are aligned toward different openings 1320a, b.

[0170] For example, at least two distances between the sockets 1330 of the device under test can be at least substantially the same. For example, the distances between the sockets 1330 of all devices under test can be equal (e.g., the spacing between the sockets is regular). Therefore, it is more convenient to insert the device under test 1340. Insertion may require rotating the device under test 180° before insertion.

[0171] In summary, by having two parallel openings, the test arrangement 1300 is well suited for achieving high test efficiency, since many devices under test can be tested simultaneously in a structure with a small structure height, and crosstalk is low.

[0172] Alternative implementation:

[0173] Although some aspects are described in the context of an apparatus, it is clear that these aspects also represent a description of the corresponding method, where a module or device corresponds to a method step or a feature of a method step. Similarly, aspects described in the context of a method step also represent a description of a corresponding module or feature of the corresponding apparatus.

[0174] The embodiments described above are only used to illustrate the principles of the present invention. It is understood that modifications and variations of the arrangements and details described herein will be apparent to those skilled in the art. Therefore, the scope of the present invention is limited only by the claims of the patents to be filed, and is not limited by the specific details presented by describing and explaining the embodiments herein.

Claims

1. A device for measuring an angled device (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340) a test arrangement (100; 800; 900; 1100; 1200; 1300) for conducting an over-the-air transmission test, wherein the test arrangement comprises a carrier structure (110; 810; 910; 1110; 1210; 1310); wherein the test arrangement comprises a socket (130; 830; 930; 1030; 1130; 1230a-d; 1330) of a device under test, the socket of the device under test being coupled to the carrier structure (110; 810; 910; 1110; 1210; 1310), wherein the socket (130; 830; 930; 1030; 1130; 1230a-d; 1330) of the device under test is configured to be aligned with the angled device under test (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340) or an inner surface (142) of a device under test (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340) establishing electrical contact with a connector (248; ​​748) on said inner surface (142); and The carrier structure (110; 810; 910; 1110; 1210; 1310) comprises an opening (120; 820; 920; 1120; 1220; 1320a, b) along the angled device under test (140; 240; 340; 540; 740; 840; 940; 1140; an outward surface normal (143a; 843a; 1240a-d; 1340) of a first outer surface (144a; 244a; 344a; 544a; 744a; 844a; 944a; 1144a; 1244a; 1344a) thereof. 1143a) in a direction extending away from the socket (130; 830; 930; 1030; 1130; 1230a-d; 1330) of the device under test.

2. The test arrangement (100; 800; 900; 1100; 1200; 1300) according to claim 1, wherein the device under test receptacle (130; 830; 930; 1030; 1130; 1230a-d; 1330) is configured to position the angled device under test (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340), The angled device under test (140; 240; 340; 540; 740; 840; 940; 1140; a surface normal (143a; 843a; 1240a-d; 1340) of a first outer surface (144a; 244a; 344a; 544a; 744a; 844a; 944a; 1144a; 1244a; 1344a) of the ... 1143a) is parallel to the surface of the carrier structure (110; 810; 910; 1110; 1210; 1310) with an error within ±15 degrees.

3. The test arrangement (100; 800; 900; 1100; 1200; 1300) according to claim 1 or 2, wherein the device under test receptacle (130; 830; 930; 1030; 1130; 1230a-d; 1330) is configured to position the angled device under test (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340), The angled device under test (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340) having a second outer surface (144b; 244b; 344b; 544b; 744b; 944b) facing away from the carrier structure (110; 810; 910; 1110; 1210; 1310), and The angled device under test (140; 240; 340; 540; 740; 840; 940; 1140; The surface normal (143b) of the second outer surface (144b; 244b; 344b; 544b; 744b; 944b) of the support structure (110; 810; 910; 1110; 1210; 1310) is perpendicular to the surface of the support structure (110; 810; 910; 1110; 1210; 1310), with an error within ±15 degrees.

4. The test arrangement (100; 800; 900; 1100; 1200; 1300) according to one of claims 1 to 3, wherein the openings (120; 820; 920; 1120; 1220; 1320a, b) are holes extending through the entire thickness of the carrier structure (110; 810; 910; 1110; 1210; 1310).

5. The test arrangement (100; 800; 900; 1100; 1200; 1300) according to one of claims 1 to 4, wherein the opening (120; 820; 920; 1120; 1220; 1320a, b) is arranged along the angled device under test (140; 240; 340; 540; 740; 840; 940; 1140; an outward surface normal (143a; 843a; 1240a-d; 1340) of the first outer surface (144a; 244a; 344a; 544a; 744a; 844a; 944a; 1144a; 1244a; 1344a) of the first outer surface (144a; 244a; 344a; 544a; 744a; 844a; 944a; 1144a; 1244a; 1344a) thereof. 1143a) direction extension (121; 821) is the angled device under test (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340) at least 2 times the wavelength, or at least 3 times the wavelength, or at least 4 times the wavelength at the lowest operating frequency.

6. The test arrangement (100; 800; 900; 1100; 1200; 1300) according to one of claims 1 to 5, wherein the opening (120; 820; 920; 1120; 1220; 1320a, b) is arranged along a line perpendicular to the angled device under test (140; 240; 340; 540; 740; 840; 940; 1140; an outward surface normal (143a; 843a; 1240a-d; 1340) of the first outer surface (144a; 244a; 344a; 544a; 744a; 844a; 944a; 1144a; 1244a; 1344a) of the first outer surface (144a; 244a; 344a; 544a; 744a; 844a; 944a; 1144a; 1244a; 1344a) thereof. 1143a) is greater than the extension (822; 1122) in the direction of the device under test (140; 240; 340; 540; 740; 840; 940; 1140; an extension of a radiating structure on said first outer surface (144a; 244a; 344a; 544a; 744a; 844a; 944a; 1144a; 1244a; 1344a) of said first outer surface (1240a-d; 1340), or wherein the opening is perpendicular to the angled device under test (140; 240; 340; 540; 740; 840; 940; 1140; an outward surface normal (143a; 843a; 1240a-d; 1340) of the first outer surface (144a; 244a; 344a; 544a; 744a; 844a; 944a; 1144a; 1244a; 1344a) of the first outer surface (144a; 244a; 344a; 544a; 744a; 844a; 944a; 1144a; 1244a; 1344a) thereof. 1143a) in a direction (822; 1122) that is larger than the device under test (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340) is an extension of (823; 1123).

7. The test arrangement (100; 800; 900; 1100; 1200; 1300) according to one of claims 1 to 6, wherein the extension (924) of the opening (120; 820; 920; 1120; 1220; 1320a, b) is selected so that the angled device under test (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340) or an edge of the packaged antenna device and the carrier structure (110; 810; 910; 1110; 1210; 1310) are at least a distance of the angled device under test (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340) at one wavelength at the lowest operating frequency.

8. The test arrangement (100; 800; 900; 1100; 1200; 1300) according to one of claims 1 to 7, The socket (130; 830; 930; 1030; 1130; 1230a-d; 1330) of the device under test is configured so that the socket (130; 830; 930; 1030; 1130; 1230a-d; 1330) of the device under test (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340) is inserted into the socket (130; 830; 930; 1030; 1130; 1230a-d; 1330) of the device under test, the device under test (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340) is at least partially located in the opening (120; 820; 920; 1120; 1220; 1320a, b).

9. The test arrangement (100; 800; 900; 1100; 1200; 1300) according to one of claims 1 to 8, The socket (130; 830; 930; 1030; 1130; 1230a-d; 1330) of the device under test is configured so that the socket (130; 830; 930; 1030; 1130; 1230a-d; 1330) of the device under test extends into the opening (120; 820; 920; 1120; 1220; 1320a, b).

10. The test arrangement (100; 800; 900; 1100; 1200; 1300) according to one of claims 1 to 9, The test arrangement comprises a first antenna or antenna structure (950; 1150; 1250a-d; 1350) configured to receive signals from the angled device under test (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340) of the first outer surface (144a; 244a; 344a; 544a; 744a; 844a; 944a; 1144a; 1244a; 1344a) of the device, and / or is configured to transmit a signal radiated at the angled device (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340) at the first outer surface (144a; 244a; 344a; 544a; 744a; 844a; 944a; 1144a; 1244a; 1344a) of the device.

11. The test arrangement (100; 800; 900; 1100; 1200; 1300) according to one of claims 1 to 10, wherein the test arrangement comprises a first antenna or antenna structure (950; 1150; 1250a-d; 1350), wherein an aperture (951a) of the first antenna or antenna structure (950; 1150; 1250a-d; 1350) is arranged at a distance of 100 m from the angled device under test (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340) at a distance from the first outer surface (144a; 244a; 344a; 544a; 744a; 844a; 944a; 1144a; 1244a; 1344a) of the device under test (140; 240; 340; 540; 740; 840; 940; 1140; a surface normal (143a; 843a; 1240a-d; 1340) of the first outer surface (144a; 244a; 344a; 544a; 744a; 844a; 944a; 1144a; 1244a; 1344a ... 1143a) extends through the aperture (951a) of the first antenna or antenna structure (950; 1150; 1250a-d; 1350).

12. The test arrangement (100; 800; 900; 1100; 1200; 1300) according to one of claims 1 to 11, The first antenna or antenna structure (950; 1150; 1250a-d; 1350) is at least partially arranged in the opening (120; 820; 920; 1120; 1220; 1320a, b).

13. The test arrangement (100; 800; 900; 1100; 1200; 1300) according to one of claims 9 to 12, The radiation aperture (951a) of the first antenna or antenna structure (950; 1150; 1250a-d; 1350) is at least partially arranged in the opening (120; 820; 920; 1120; 1220; 1320a, b).

14. The test arrangement (100; 800; 900; 1100; 1200; 1300) according to one of claims 9 to 13, The first antenna or antenna structure (950; 1150; 1250a-d; 1350) is mounted to have a fixed position relative to the socket (130; 830; 930; 1030; 1130; 1230a-d; 1330) of the device under test.

15. The test arrangement (100; 800; 900; 1100; 1200; 1300) according to one of claims 9 to 13, Wherein the first antenna or antenna structure (950; 1150; 1250a-d; 1350) is mechanically attached to an arm of an operator (954) such that the first antenna or antenna structure (950; 1150; 1250a-d; 1350) is movable.

16. The test arrangement (100; 800; 900; 1100; 1200; 1300) according to one of claims 9 to 15, The first antenna or antenna structure (950; 1150; 1250a-d; 1350) is configured to be connected to a signal source and / or to a signal receiver (956a, b) via a blind-mate microwave connection when the operator (954) has placed the first antenna or antenna structure (950; 1150; 1250a-d; 1350) in an operating position.

17. The test arrangement (100; 800; 900; 1100; 1200; 1300) according to one of claims 1 to 16, wherein the test arrangement comprises a second antenna or antenna structure (952) configured to receive a signal from the angled device under test (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340) of the second outer surface (144b; 244b; 344b; 544b; 744b; 944b), and / or transmits a signal radiated at the angled device under test (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340) at the second outer surface (144b; 244b; 344b; 544b; 744b; 944b) to be received.

18. The test arrangement (100; 800; 900; 1100; 1200; 1300) according to one of claims 1 to 17, wherein the test arrangement comprises a second antenna or antenna structure (952), wherein an aperture (951b) of the second antenna or antenna structure (952) is arranged at a distance of 140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340) at a distance from a second outer surface (144b; 244b; 344b; 544b; 744b; 944b) such that the angled device under test (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340) has a surface normal (143b) of the second outer surface extending through an aperture (951b) of the second antenna or antenna structure (952).

19. The test arrangement (100; 800; 900; 1100; 1200; 1300) according to one of claims 17 to 18, Wherein the second antenna or antenna structure (952) is mechanically attached to an arm of an operator (954) such that the second antenna or antenna structure (952) is movable.

20. The test arrangement (100; 800; 900; 1100; 1200; 1300) according to one of claims 18 to 19, wherein the second antenna or antenna structure (952) is part of a push rod (954) for moving the angled device under test (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340) is pushed into the socket (130; 830; 930; 1030; 1130; 1230a-d; 1330) of the device under test, or wherein the second antenna or antenna structure (952) is configured to be movable together with a push rod (954) for moving the angled device under test (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340) is pushed into the socket (130; 830; 930; 1030; 1130; 1230a-d; 1330) of the device under test.

21. The test arrangement (100; 800; 900; 1100; 1200; 1300) according to one of claims 17 to 20, Wherein when the operator (954) has placed the second antenna or antenna structure (952) in an operating position, the second antenna or antenna structure (952) is configured to be connected to a signal source and / or to a signal receiver (956a, b) via a blind-mate microwave connection.

22. The test arrangement (100; 800; 900; 1100; 1200; 1300) according to one of claims 1 to 20, The socket (130; 830; 930; 1030; 1130; 1230a-d; 1330) of the device under test includes an angled recess or an angled notch (1060), and the angled recess or angled notch (1060) is configured to support and / or align the angled device under test (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340).

23. The test arrangement according to one of claims 1 to 22, The socket (130; 830; 930; 1030; 1130; 1230a-d; 1330) of the device under test includes one or more coaxial spring probes (932) to establish an electrical connection between a PCB test fixture or load board and the angled device under test (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340).

24. The test arrangement (100; 800; 900; 1100; 1200; 1300) according to one of claims 1 to 23, The test arrangement comprises at least two device under test sockets (130; 830; 930; 1030; 1130; 1230a-d; 1330), wherein the at least two device under test sockets (130; 830; 930; 1030; 1130; 1230a-d; 1330) are configured to carry respective angled devices under test (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340), wherein the at least two device under test sockets (130; 830; 930; 1030; 1130; 1230a-d; 1330) are arranged to position corresponding angled devices under test (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340), so that the corresponding angled device under test (140; 240; 340; 540; 740; 840; 940; 1140; The corresponding first outer surfaces (144a; 244a; 344a; 544a; 744a; 844a; 944a; 1144a; 1244a; 1344a) of the respective first outer surfaces (1240a-d; 1340) are aligned in opposite directions.

25. The test arrangement (100; 800; 900; 1100; 1200; 1300) according to one of claims 1 to 24, wherein the test arrangement comprises at least two rows (1315a, b) of sockets (130; 830; 930; 1030; 1130; 1230a-d; 1330) of a device under test, The socket (130; 830; 930; 1030; 1130; 1230a-d; 1330) of the device under test is configured to carry a corresponding angled device under test (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340), wherein the at least two rows (1315a, b) of device under test sockets (130; 830; 930; 1030; 1130; 1230a-d; 1330) are arranged to position corresponding angled devices under test (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340), so that the corresponding angled device under test (140; 240; 340; 540; 740; 840; 940; 1140; The corresponding first outer surfaces (144a; 244a; 344a; 544a; 744a; 844a; 944a; 1144a; 1244a; 1344a) of the respective first outer surfaces (1240a-d; 1340) are aligned in opposite directions.

26. The test arrangement (100; 800; 900; 1100; 1200; 1300) according to one of claims 1 to 25, wherein the carrier structure (110; 810; 910; 1110; 1210; 1310) comprises at least two openings (120; 820; 920; 1120; 1220; 1320a, b), wherein a solid middle portion (1325) is provided between the at least two openings (120; 820; 920; 1120; 1220; 1320a, b), wherein the two or more sockets (130; 830; 930; 1030; 1130; 1230a-d; 1330) of the device under test are arranged on a solid middle portion (1325) located between the openings (1320a, b), The device under test position of one or more of the sockets (130; 830; 930; 1030; 1130; 1230a-d; 1330) of the device under test is aligned toward a first opening (1320a) of the at least two openings (1320a, b), The device under test position of one or more of the device under test sockets (130; 830; 930; 1030; 1130; 1230a-d; 1330) is aligned toward the second opening (1320b) of the at least two openings (1320a, b).

27. A device for measuring an angled device (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340) a test arrangement (100; 800; 900; 1100; 1200; 1300) for conducting an air test, wherein the test arrangement comprises a carrier structure (110; 810; 910; 1110; 1210; 1310); wherein the test arrangement comprises a socket (130; 830; 930; 1030; 1130; 1230a-d; 1330) of a device under test, the socket (130; 830; 930; 1030; 1130; 1230a-d; 1330) of the device under test being coupled to the carrier structure (110; 810; 910; 1110; 1210; 1310); wherein the socket (130; 830; 930; 1030; 1130; 1230a-d; 1330) of the device under test is configured to be aligned with the angled device under test (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340) or the inner surface of the device under test (140; 240; 340; 540; 740; 840; 940; 1140; arranged at the angle. 1240a-d; 1340) to establish electrical contact with a connector on an inner surface; and wherein the device under test receptacle (130; 830; 930; 1030; 1130; 1230a-d; 1330) is configured to position the angled device under test (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340), The surface normal (143a; 843a; 1143a) is parallel to the surface of the load plate within ±15 degrees; and The angled device under test (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340) having a second outer surface (144b; 244b; 344b; 544b; 744b; 944b) facing away from the load plate; and The surface normal (143b) of the second outer surface (144b; 244b; 344b; 544b; 744b; 944b) of the angled device under test is perpendicular to the surface of the load plate within an error of ±15 degrees; The carrier structure (110; 810; 910; 1110; 1210; 1310) comprises an opening (120; 820; 920; 1120; 1220; 1320a, b) arranged along the angled device under test (140; 240; 340; 540; 740; 840; 940; 1140; an outward surface normal (143a; 843a; 1240a-d; 1340) of a first outer surface (144a; 244a; 344a; 544a; 744a; 844a; 944a; 1144a; 1244a; 1344a) thereof. 1143a) in a direction extending away from the socket (130; 830; 930; 1030; 1130; 1230a-d; 1330) of the device under test.

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