System and method for a three-channel electrical isolator for an inverter for an electric vehicle

Abstract

A system includes an inverter configured to convert DC power from a battery to AC power to drive a motor, where the inverter includes: an upper phase multi-chip module including: a low voltage upper phase controller; a high voltage upper phase A controller; an upper phase A electrical isolator that connects the low voltage upper phase controller to the high voltage upper phase A controller; a high voltage upper phase B controller; an upper phase B electrical isolator that connects the low voltage upper phase controller to the high voltage upper phase B controller; a high voltage upper phase C controller; and an upper phase C electrical isolator that connects the low voltage upper phase controller to the high voltage upper phase C controller.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the benefit of priority to U.S. Provisional Patent Application No. 63 / 377,486 filed on September 28, 2022, U.S. Provisional Patent Application No. 63 / 377,501 filed on September 28, 2022, U.S. Provisional Patent Application No. 63 / 377,512 filed on September 28, 2022, U.S. Provisional Patent Application No. 63 / 378,601 filed on October 6, 2022, and U.S. Non-Provisional Patent Application No. 18 / 168,146 filed on February 13, 2023, the entire contents of which are incorporated herein by reference. Technical Field

[0003] Various embodiments of the present disclosure generally relate to systems and methods for three-channel galvanic isolators for inverters for electric vehicles, and more particularly to systems and methods for three-channel galvanic isolators for integrated gate drivers of power device switches for inverters for electric vehicles. Background Art

[0004] Inverters, such as those used to drive motors in electric vehicles, are responsible for converting high voltage direct current (HVDC) to alternating current (AC) to drive the motor. In the inverter, the gate drivers for the power device switches may operate in a high voltage and electrically noisy environment, which may affect the operation of the gate drivers and / or the power device switches, and therefore may affect the operation of the inverter.

[0005] The present disclosure is directed to overcoming one or more of these aforementioned challenges. Summary of the invention

[0006] In some aspects, the technology described herein relates to a system comprising: an inverter configured to convert DC power from a battery into AC power to drive a motor, wherein the inverter comprises: an upper phase multi-chip module, the upper phase multi-chip module comprising: a low voltage upper phase controller; a high voltage upper phase A controller; an upper phase A electrical isolator, the upper phase A electrical isolator connecting the low voltage upper phase controller to the high voltage upper phase A controller; a high voltage upper phase B controller; an upper phase B electrical isolator, the upper phase B electrical isolator connecting the low voltage upper phase controller to the high voltage upper phase B controller; a high voltage upper phase C controller; and an upper phase C electrical isolator, the upper phase C electrical isolator connecting the low voltage upper phase controller to the high voltage upper phase C controller.

[0007] In some aspects, the technology described herein relates to a system wherein the inverter further includes: a point-of-use upper phase A controller, which is configured to be connected to a high voltage upper phase A controller; a point-of-use upper phase B controller, which is configured to be connected to the high voltage upper phase B controller; and a point-of-use upper phase C controller, which is configured to be connected to the high voltage upper phase C controller.

[0008] In some aspects, the technology described herein relates to a system wherein the inverter further comprises: an upper phase A power switch connected to a point-of-use upper phase A controller and configured to connect to a positive terminal connection of a battery and a phase A connection of a motor; an upper phase B power switch connected to a point-of-use upper phase B controller and configured to connect to a positive terminal connection of a battery and a phase B connection of a motor; and an upper phase C power switch connected to a point-of-use upper phase C controller and configured to connect to a positive terminal connection of a battery and a phase C connection of a motor.

[0009] In some aspects, the technology described herein relates to a system wherein the inverter further comprises: a lower phase multi-chip module comprising: a low voltage lower phase controller; a high voltage lower phase A controller; a lower phase A electrical isolator connecting the low voltage lower phase controller to the high voltage lower phase A controller; a high voltage lower phase B controller; a lower phase B electrical isolator connecting the low voltage lower phase controller to the high voltage lower phase B controller; a high voltage lower phase C controller; and a lower phase C electrical isolator connecting the low voltage lower phase controller to the high voltage lower phase C controller.

[0010] In some aspects, the technology described herein relates to a system wherein the inverter further includes: a point-of-use lower phase A controller, which is configured to be connected to a high voltage lower phase A controller; a point-of-use lower phase B controller, which is configured to be connected to a high voltage lower phase B controller; and a point-of-use lower phase C controller, which is configured to be connected to a high voltage lower phase C controller.

[0011] In some aspects, the technology described herein relates to a system wherein the inverter further comprises: a lower phase A power switch connected to a point-of-use lower phase A controller and configured to connect to a negative terminal connection of a battery and a phase A connection of a motor; a lower phase B power switch connected to a point-of-use lower phase B controller and configured to connect to a negative terminal connection of a battery and a phase B connection of a motor; and a lower phase C power switch connected to a point-of-use lower phase C controller and configured to connect to a negative terminal connection of a battery and a phase C connection of a motor.

[0012] In some aspects, the technology described herein relates to a system wherein the inverter further includes: a phase A power module configured to be connected to a high voltage upper phase A controller; a phase B power module configured to be connected to a high voltage upper phase B controller; and a phase C power module configured to be connected to a high voltage upper phase C controller.

[0013] In some aspects, the technology described herein relates to a system that further includes a battery configured to supply DC power to an inverter and a motor configured to receive AC power from the inverter to drive the motor.

[0014] In some aspects, the technology described herein relates to a system comprising: a multi-chip module, the multi-chip module being directed to an inverter, the multi-chip module comprising: a low voltage controller; a first high voltage controller; a first electrical isolator, the first electrical isolator connecting the low voltage controller to the first high voltage controller; a second high voltage controller; a second electrical isolator, the second electrical isolator connecting the low voltage controller to the second high voltage controller; a third high voltage controller; and a third electrical isolator connecting the low voltage controller to the third high voltage controller.

[0015] In some aspects, the techniques described herein relate to a system in which a low voltage controller is configured to communicate with a pulse width modulation controller of an inverter.

[0016] In some aspects, the technology described herein relates to a system wherein: a first high voltage controller is configured to communicate with a first point-of-use controller on a first power module of an inverter; a second high voltage controller is configured to communicate with a second point-of-use controller on a second power module of the inverter; and a third high voltage controller is configured to communicate with a third point-of-use controller on a third power module of the inverter.

[0017] In some aspects, the technology described herein relates to a system wherein: a low voltage controller is configured to receive a first control signal from a pulse width modulation controller and send a first gate control signal to a first high voltage controller via a first electrical isolator based on the first control signal; the low voltage controller is configured to receive a second control signal from the pulse width modulation controller and send a second gate control signal to a second high voltage controller via a second electrical isolator based on the second control signal; and the low voltage controller is configured to receive a third control signal from the pulse width modulation controller and send a third gate control signal to a third high voltage controller via a third electrical isolator based on the third control signal.

[0018] In some aspects, the technology described herein relates to a system wherein: a first high voltage controller is configured to send a first gate control signal to a first point-of-use controller on a first power module of an inverter; a second high voltage controller is configured to send a second gate control signal to a second point-of-use controller on a second power module of the inverter; and a third high voltage controller is configured to send a third gate control signal to a third point-of-use controller on a third power module of the inverter.

[0019] In some aspects, the technology described herein relates to a system wherein: a first high voltage controller is configured to receive a first feedback signal from a first point-of-use controller on a first power module of an inverter and send the first feedback signal to a low voltage controller; a second high voltage controller is configured to receive a second feedback signal from a second point-of-use controller on a second power module of the inverter and send the second feedback signal to the low voltage controller; and a third high voltage controller is configured to receive a third feedback signal from a third point-of-use controller on a third power module of the inverter and send the third feedback signal to the low voltage controller.

[0020] In some aspects, the technology described herein relates to a system comprising: an inverter configured to convert DC power from a battery into AC power to drive a motor, wherein the inverter comprises: an upper phase controller comprising a low voltage upper phase controller, a first high voltage upper phase controller, a second high voltage upper phase controller, and a third high voltage upper phase controller; a lower phase controller comprising a low voltage lower phase controller, a first high voltage lower phase controller, a second high voltage lower phase controller, and a third high voltage lower phase controller; a first power module comprising a first upper phase point-of-use controller, a first upper phase switching element, a first lower phase point-of-use controller, and a first lower phase switching element; a second power module comprising a second upper phase point-of-use controller, a second upper phase switching element, a second lower phase point-of-use controller, and a second lower phase switching element; and a third power module comprising a third upper phase point-of-use controller, a third upper phase switching element, a third lower phase point-of-use controller, and a third lower phase switching element.

[0021] In some aspects, the technology described herein relates to a system wherein: an upper phase controller is configured to communicate with a pulse width modulation controller of an inverter and is configured to communicate with a lower phase controller, and the lower phase controller is configured to communicate with a pulse width modulation controller of the inverter and is configured to communicate with the upper phase controller.

[0022] In some aspects, the technology described herein relates to a system wherein: a first high voltage upper phase controller includes a first upper phase electrical isolator connected to a low voltage upper phase controller; a second high voltage upper phase controller includes a second upper phase electrical isolator connected to the low voltage upper phase controller; a third high voltage upper phase controller includes a third upper phase electrical isolator connected to the low voltage upper phase controller; a first high voltage lower phase controller includes a first lower phase electrical isolator connected to the low voltage lower phase controller; a second high voltage lower phase controller includes a second lower phase electrical isolator connected to the low voltage lower phase controller; and a third high voltage lower phase controller includes a third lower phase electrical isolator connected to the low voltage lower phase controller.

[0023] In some aspects, the technology described herein relates to a system wherein: a first high voltage upper phase controller is configured to be connected to a first upper phase point-of-use controller; a second high voltage upper phase controller is configured to be connected to a second upper phase point-of-use controller; a third high voltage upper phase controller is configured to be connected to a third upper phase point-of-use controller; a first high voltage lower phase controller is configured to be connected to a first lower phase point-of-use controller; a second high voltage lower phase controller is configured to be connected to a second lower phase point-of-use controller; and a third high voltage lower phase controller is configured to be connected to a third lower phase point-of-use controller.

[0024] In some aspects, the technology described herein relates to a system wherein: a first upper phase usage point controller is configured to control a first upper phase switching element based on one or more first upper phase signals from a first high voltage upper phase controller; a second upper phase usage point controller is configured to control a second upper phase switching element based on one or more second upper phase signals from a second high voltage upper phase controller; a third upper phase usage point controller is configured to control a third upper phase switching element based on one or more third upper phase signals from a third high voltage upper phase controller; a first lower phase usage point controller is configured to control a first lower phase switching element based on one or more first lower phase signals from a first high voltage lower phase controller; a second lower phase usage point controller is configured to control a second lower phase switching element based on one or more second lower phase signals from a second high voltage lower phase controller; and a third lower phase usage point controller is configured to control a third lower phase switching element based on one or more third lower phase signals from a third high voltage lower phase controller.

[0025] In some aspects, the technology described herein relates to a system wherein: a first upper phase switch is configured to connect to a positive terminal connector of a battery and a first phase connector of a motor; a second upper phase switch is configured to connect to a positive terminal connector of a battery and a second phase connector of a motor; a third upper phase switch is configured to connect to a positive terminal connector of a battery and a third phase connector of a motor; a first lower phase switch is configured to connect to a negative terminal connector of a battery and a first phase connector of a motor; a second lower phase switch is configured to connect to a negative terminal connector of a battery and a second phase connector of a motor; and a third lower phase switch is configured to connect to a negative terminal connector of a battery and a third phase connector of a motor.

[0026] Other objects and advantages of the disclosed embodiments will be described in part in the following description, and in part will be obvious from the description, or can be understood by practicing the disclosed embodiments. The objects and advantages of the disclosed embodiments will be realized and achieved by means of the elements and combinations particularly pointed out in the appended claims.

[0027] It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosed embodiments, as claimed. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate various exemplary embodiments and, together with the description, serve to explain the principles of the disclosed embodiments.

[0029] Figure 1 An exemplary system infrastructure for a vehicle including a combined inverter and converter is depicted according to one or more embodiments.

[0030] Figure 2 Depicted is a method for providing a point-of-use switching controller according to one or more embodiments. Figure 1 An exemplary system infrastructure of a combined inverter and converter.

[0031] Figure 3 Describes a method for Figure 2 An exemplary system infrastructure for a controller of FIG.

[0032] Figure 4 Describes a method for Figure 2 An exemplary system infrastructure for a point-of-use switching controller.

[0033] Figure 5 Describes a method for Figure 4 An exemplary system infrastructure of an upper power module.

[0034] Figure 6 Depicted is an exemplary block diagram for a system including a three-channel galvanic isolator and an integrated gate driver architecture in accordance with one or more embodiments.

[0035] Figure 7 Depicted is an exemplary connection diagram for a system including a three-channel galvanic isolator and an integrated gate driver architecture in accordance with one or more embodiments. DETAILED DESCRIPTION

[0036] Both the foregoing general description and the following detailed description are exemplary and explanatory only and do not constrain the claimed features. As used herein, the terms "comprises," "comprising," "has," "having," "includes," "including," or other variations thereof are intended to encompass non-exclusive inclusions such that a process, method, article, or device that includes a series of elements includes not only those elements, but may also include other elements that are not explicitly listed or inherent to such process, method, article, or device. In the present disclosure, unless otherwise stated, relative terms (such as, for example, "about," "substantially," and "approximately") are used to indicate possible ±10% variations in the stated values. In the present disclosure, unless otherwise stated, any numerical value may include possible ±10% variations in the stated values.

[0037] The terms used below may be interpreted in their broadest reasonable manner, although they are being used in conjunction with a detailed description of certain specific examples of the present disclosure. Indeed, certain terms may even be emphasized below; however, any term intended to be interpreted in any constrained manner will be explicitly and specifically defined as such in this detailed description. For example, in the context of the present disclosure, a switching device may be described as a switching element or device, but may refer to any device for controlling power flow in a circuit. For example, a switching element may be, for example, a metal oxide semiconductor field effect transistor (MOSFET), a bipolar junction transistor (BJT), an insulated gate bipolar transistor (IGBT) or a relay, or any combination thereof, but is not limited thereto.

[0038] Various embodiments of the present disclosure generally relate to systems and methods for three-channel galvanic isolators for inverters for electric vehicles, and more particularly to systems and methods for three-channel galvanic isolators for integrated gate drivers of power device switches for inverters for electric vehicles.

[0039] Inverters (such as those used to drive motors in electric vehicles) are responsible for converting high voltage direct current (HVDC) into alternating current (AC) to drive the motor. A three-phase inverter may include a bridge having six power device switches (e.g., power transistors such as IGBTs or MOSFETs) that are controlled by pulse width modulation (PWM) signals generated by a controller. The inverter may include three half-H-bridge switches to control phase voltages, upper and lower gate drivers to control the switches, a PWM controller, and glue logic between the PWM controller and the gate driver. The PWM controller may generate signals to define the expected state of the system. The gate driver may send signals from the PWM controller to the half-H-bridge switches. The half-H-bridge switches may drive the phase voltages. The inverter may include an isolation barrier between a low voltage plane and a high voltage plane. The signal may be passed from the PWM controller to the half-H-bridge switch by passing through the isolation barrier, which may employ optical, converter-based, or capacitor-based isolation. The PWM signal may be distorted when passing through the glue logic, which may include resistive, capacitive, or other types of filtering. Due to the electrical isolation barrier and other delays within the gate driver, the PWM signal may be distorted when passing through the gate driver. The PWM signal may be distorted when the signal is processed by the half-H switching element via the gate driver output.

[0040] Gate drivers withstand common-mode transients that occur during field effect transistor (FET) switching and when one side of a floating high voltage terminal is shorted to ground or subjected to electrostatic discharge. These voltage transients can cause fast edges that can form common-mode current bursts through electrical isolation. Gate drivers may need to demonstrate common-mode transient immunity (CMTI) in order to be effective and safe.

[0041] The gate driver may have a high voltage domain in common with the voltage plane of the associated FET. Further, the high voltage plane may be supplied by a flyback converter, which may be isolated from the low voltage plane by a transformer. The high voltage domain power supply may be used to provide power to such a circuit that sources and sinks gate current to drive the FET and can detect FET faults, thereby acting on the faults and / or transmitting the faults to the low voltage domain. The gate driver may include an electrical channel dedicated to FET commands, and one or more bidirectional or unidirectional electrical channels dedicated to FET communications.

[0042] High current switching transients can form strong electromagnetic (EM) fields that can couple into nearby metal traces. The magnitude and frequency of the coupled current can depend on the layout of the FET packaging solution and the direction and length of the metal traces between the FET and the control integrated circuit (IC). For example, a typical value for the coupled current can be up to 1A at an AC frequency of up to 100MHz. Typically, within the circuit, the gate driver IC can be placed far enough away from the FET so that the high EM field is not directly coupled into the internal metal traces within the gate driver IC. The gate driver is placed at a distance from the EM field so that the induced current within the circuit is below the level that will cause the gate driver to malfunction, or a metal shield is placed between the gate driver and the source of the EM field to protect the gate driver circuit. The output terminals of the gate driver connected to the FET are exposed to the EM field at a point where the output terminals are no longer covered by the shield. The gate driver switches large currents (e.g., such as 5A to 15A) through these exposed terminals. The large currents switched are usually larger in magnitude than the EM induced current. The gate driver can overdrive the induced current to maintain control of the FET. The gate driver and the high side of the FET may share a common ground and gate control signal trace, both of which may be susceptible to coupled currents.

[0043] The gate driver can turn on low resistance switches to source and sink gate current. Sometimes a series resistor can be added to limit the gate current. The switched gate current can be greater than the coupling current in order to maintain control of their respective FETs.

[0044] The gate driver may be able to sense the FET operating voltage or current in order to provide feedback and react to faults. An overcurrent fault may typically be detected by sensing the FET drain to source voltage and comparing the sensed voltage to a reference value. The sensed voltage may be heavily filtered to reject coupled currents. Filtering may slow the response to a fault condition, causing a delay in response. For example, the rate of current increase due to a low resistance short may reach damaging levels before being detected by a heavily filtered drain to source voltage detection strategy. The resulting short may damage the FET or the vehicle before being detected and cut off.

[0045] According to one or more embodiments, a FET driver circuit may provide fast overcurrent detection by shunt current sensing, or by diverting a portion of the load current through a parallel FET that may have a current sensing circuit. Utilizing either strategy may require a "point of use IC" in which the sensing circuit is very close to the FET. Even if the point of use IC and the remote controller are resistant to EM fields, the communication between the point of use IC and the remote controller is still susceptible to induced currents. Point of use ICs have been implemented in low EM field applications, such as smart FETs for automotive applications. However, point of use ICs have not yet been used in high EM field applications. High EM fields can be fields that (i) induce a current within the IC that exceeds the operating current of the IC and causes a malfunction, or (ii) induce a differential voltage within the IC that exceeds the operating differential voltage and causes a malfunction. High EM fields can be, for example, fields greater than about 10A or about 100V.

[0046] An isolated gate driver may include two or more integrated circuits (ICs) in a single package. For example, in a dual-IC implementation, the first IC is referenced to chassis ground, and the second IC is referenced to a floating power supply that is referenced to the source of the FET or IGBT being driven. In a triple-IC implementation, the first IC is referenced to chassis ground, the second IC is referenced to a floating power supply that is referenced to the source of the first FET or IGBT (such as the high side of a phase switch), and the third IC is referenced to a floating power supply that is referenced to the source of the second FET or IGBT (such as the low side of a phase switch). A low voltage IC (LVIC) may interface with circuits referenced to chassis ground in a low voltage domain, and other ICs, such as a high voltage IC (HVIC), may interface with circuits referenced to one or more high voltage domains. Some isolated gate drivers may include one LVIC and one or two HVICs. Internal wire bonding may connect the LVIC and HVIC within the package. These internal wire bonds can be connected to high voltage components (such as transformers or capacitors) in one or both of the LVIC and HVIC to form electrical isolation between the low voltage domain and the high voltage domain. The AC signal passes through the high voltage component to provide a communication path between the low voltage domain and the high voltage domain. The communication path provides electrical isolation as required by the safety components of the system.

[0047] Some systems have one isolated gate driver per power switch, and the isolated gate driver is located away from the power module. Some power switches include silicon carbide (SiC) FETs, and the isolated gate driver is located away from the SiC FETs in the power switch. Due to parasitic inductance in the gate and source traces (which cause induced voltages across the gate and source traces), the wiring from the isolated gate driver to the power switch may make it difficult to accurately sense the gate-to-source voltage of the SiC FET during SiC FET turn-on and turn-off events. Some isolated gate drivers measure the power switch temperature remotely by using an onboard sensor (such as a diode or thermistor) of the power switch. The sensor itself can provide a point temperature measurement that is very different from the actual SiC temperature, which has further errors caused by noise caused by the long trace or lead length from the sensor to the isolated gate driver. In an isolated gate driver system, after the SiC FET has been fully enhanced, a desaturation circuit can provide short circuit protection by sensing when the voltage across the power switch is too large. The short circuit protection may cause large current and / or temperature transients within the SiC die, which may stress the SiC die. The short circuit protection may require significant external components to protect and bias the drain sensing circuit of the isolated gate driver. Using one LVIC and two HVICs to drive the gate driver of a half-H element (both the upper and lower phases) may compromise system safety because both the upper and lower drivers may be damaged in a failure event. Some systems may include six electrically isolated gate drivers for a typical three-phase inverter, which may consume significant board area.

[0048] One or more embodiments may integrate a gate driver into a power switch as an integrated gate driver or a point-of-use controller. For example, the integrated gate driver may be an application specific integrated circuit (ASIC). A phase switch power module including two switches may incorporate two integrated gate drivers, with a gate driver for each switch. One or more embodiments may locally sense the current of a SiC die by sensing a voltage drop across a source metallization. One or more embodiments may include local accurate thermal sensing of a SiC die and a SiC die environment without the need for integration on a die temperature sensing circuit, which may provide improved die thermal performance or lower die cost. One or more embodiments may tightly couple a gate drive circuit to a SiC bare die constituting a power switch, which may reduce switching losses. One or more embodiments may include a gate drive curve as a function of one or more of a SiC FET gate-to-source voltage, temperature, or a known gate-to-source voltage threshold that may change during the life of the SiC FET. One or more embodiments may measure specific SiC device features and store them in a memory (e.g., such as an EEPROM) of an integrated gate driver, and may provide a customized gate drive curve based on the stored SiC device features. One or more embodiments may use a two-wire bus for communication, which may reduce the number of connections to electrically isolated devices. One or more embodiments may use a first multi-chip module for the upper switching piece of a three-phase bridge and a second multi-chip module for the lower switching piece of a three-phase bridge to provide three HVICs to one LVIC.

[0049] One or more embodiments may provide a single multi-chip module package component with three electrically isolated channels that interface between a low voltage chassis reference ground domain and each of three integrated gate drivers located in a high voltage battery domain. The three-channel configuration may provide an architecture in which one package component controls three upper phase switching elements or three lower phase switching elements of a three-phase inverter. One or more embodiments may provide an improved arrangement from a functional safety perspective because a safety response to the inverter may include a three-phase short circuit of the upper or lower switching elements or a disconnection condition of six switching elements. For example, a single point failure affecting a multi-chip module that controls the three upper switching elements may allow a lower multi-chip module to enter a safe state by performing a three-phase short circuit on the lower three switching elements. One or more embodiments may reduce the number of packaged electrical isolators placed in a system from six required by some systems in the case of a three-phase system to two multi-chip modules. One or more embodiments may reduce the number of serial peripheral interface (SPI) connectors used to control the three-phase switching elements.

[0050] One or more embodiments may provide a single package three channel configuration that can drive an upper phase or lower phase switch. One or more embodiments may provide significant advantages over some single isolation gate drive configurations for each switch. A first advantage may be shared circuitry between three isolation channels in a low voltage or chassis ground reference integrated circuit compared to reworking circuitry on each of the three separate isolation gate drivers' low voltage or chassis ground reference integrated circuits. A second advantage may be a single SPI interface to a microprocessor for the three upper phase or lower phase switches compared to duplicate SPI interfaces for the three separate isolation gate drivers. A third advantage may be reduced test time for a single channel three package configuration compared to three single channel isolation gate drivers. A fourth advantage may be a reduced footprint for a printed circuit board layout for a single channel three package configuration compared to three single channel isolation gate drivers.

[0051] One or more embodiments may provide direct current sensing, which may provide less stress on SiC devices in the event of a short circuit event. One or more embodiments may provide accurate temperature measurement, which may allow operation at higher average temperatures for system optimization. One or more embodiments may reduce switching losses due to one or more of a tightly coupled layout, use of SiC device features, use of temperature, and use of previous circulating currents. Reduced switching losses may provide increased electric vehicle range. Reduced switching losses may provide higher power switching or module current output. One or more embodiments may provide safety independence as required for active short circuit discharge during device failure in permanent magnet motors.

[0052] Figure 1 An exemplary system infrastructure for a vehicle including a combined inverter and converter according to one or more embodiments is depicted. In the context of the present disclosure, the combined inverter and converter may be referred to as an inverter. Figure 1 As shown, the electric vehicle 100 may include an inverter 110, a motor 190, and a battery 195. The inverter 110 may include a component for receiving electric power from an external source and outputting electric power to charge the battery 195 of the electric vehicle 100. For example, the inverter 110 may convert DC power from the battery 195 in the electric vehicle 100 into AC power to drive the motor 190 of the electric vehicle 100, but the embodiment is not limited thereto. For example, the inverter 110 may be bidirectional and may convert DC power into AC power, or convert AC power into DC power, such as during regenerative braking. The inverter 110 may be a three-phase inverter, a single-phase inverter, or a multi-phase inverter.

[0053] Figure 2Depicted is a method for providing a point-of-use switching controller according to one or more embodiments. Figure 1 The electric vehicle 100 may include an inverter 110, a motor 190, and a battery 195. The inverter 110 may include an inverter controller 300 ( Figure 3 14). The inverter 110 may include a low voltage upper phase controller 120 separated from a high voltage upper phase controller 130 by an electrical isolator 150, and an upper phase power module 140. The upper phase power module 140 may include a point-of-use upper phase controller 142 and an upper phase switch 144. The inverter 110 may include a low voltage lower phase controller 125 separated from a high voltage lower phase controller 135 by an electrical isolator 150, and a lower phase power module 145. The lower phase power module 145 may include a point-of-use lower phase controller 146 and a lower phase switch 148. The upper phase switch 144 and the lower phase switch 148 may be connected to a motor 190 and a battery 195. The electrical isolator 150 may be one or more of optical, converter-based, or capacitor-based isolation. For example, the electrical isolator 150 may be one or more capacitors having a value from about 20 fF to about 100 fF, having a breakdown voltage from about 6 kV to about 12 kV. The electrical isolator 150 may include a pair of capacitors, wherein one capacitor in the pair carries an inverted data signal from the other capacitor in the pair to form a differential signal that is rejected for common mode noise. The electrical isolator 150 may include more than one capacitor in series. The electrical isolator 150 may include one capacitor located on a first IC, or may include a first capacitor located on a first IC and a second capacitor located on a second IC that communicates with the first IC.

[0054] The inverter 110 may include a low voltage region (e.g., where the voltage is typically less than 5V) and a high voltage region (e.g., where the voltage may exceed 500V). The low voltage region may be separated from the high voltage region by an electrical isolator 150. The inverter controller 300 may be in the low voltage region of the inverter 110, and may send a signal to and receive a signal from the low voltage upper phase controller 120. The low voltage upper phase controller 120 may be in the low voltage region of the inverter 110, and may send a signal to and receive a signal from the high voltage upper phase controller 130. The low voltage upper phase controller 120 may send a signal to and receive a signal from the low voltage lower phase controller 125. The high voltage upper phase controller 130 may be in the high voltage region of the inverter 110. Therefore, the signal between the low voltage upper phase controller 120 and the high voltage upper phase controller 130 passes through the electrical isolator 150. The high voltage upper phase controller 130 may send signals to and receive signals from a point-of-use upper phase controller 142 in the upper phase power module 140. The point-of-use upper phase controller 142 may send signals to and receive signals from an upper phase switch 144. The upper phase switch 144 may be connected to a motor 190 and a battery 195. For example, the upper phase switch 144 and the lower phase switch 148 may be used to transfer energy from the motor 190 to the battery 195, from the battery 195 to the motor 190, from an external source to the battery 195, or from the battery 195 to an external source. The lower phase system of the inverter 110 may be similar to the upper phase system described above.

[0055] Figure 3 Describes a method for Figure 2 FIG. 3 is an exemplary system infrastructure of an inverter controller 300 . The inverter controller 300 may include one or more controllers.

[0056] The inverter controller 300 may include a set of instructions that can be executed to cause the inverter controller 300 to perform any one or more of the methods or computer-based functions disclosed herein. The inverter controller 300 may operate as a standalone device, or may be connected to other computer systems or peripheral devices, for example using a network.

[0057] In a networked deployment, the inverter controller 300 can operate in the capacity of a server, or as a client in a server-client user network environment, or as a peer computer system in a peer (or distributed) network environment. The inverter controller 300 can also be implemented as or incorporated into various devices, such as a personal computer (PC), a tablet PC, a set-top box (STB), a personal digital assistant (PDA), a mobile device, a palmtop computer, a laptop computer, a desktop computer, a communication device, a wireless phone, a landline phone, a control system, a camera, a scanner, a fax machine, a printer, a pager, a personal trusted device, a network device, a network router, a switch or bridge, or any other machine capable of executing a set of instructions (sequentially or otherwise) (the set of instructions specifies the actions to be taken by the machine). In a specific implementation, the inverter controller 300 can be implemented using an electronic device that provides voice, video or data communication. Further, although the inverter controller 300 is illustrated as a single system, the term “system” should also be understood to include any collection of systems or subsystems that individually or jointly execute one or more sets of instructions to perform one or more computer functions.

[0058] like Figure 3 As shown, the inverter controller 300 may include a processor 302, such as a central processing unit (CPU), a graphics processing unit (GPU), or both. The processor 302 may be a component in a variety of systems. For example, the processor 302 may be part of a standard inverter. The processor 302 may be one or more general-purpose processors, digital signal processors, application-specific integrated circuits, field programmable gate arrays, servers, networks, digital circuits, analog circuits, combinations thereof, or other devices now known or later developed for analyzing and processing data. The processor 302 may implement a software program, such as a manually generated (i.e., programmed) code.

[0059] The inverter controller 300 may include a memory 304 that can communicate via a bus 308. The memory 304 may be a main memory, a static memory, or a dynamic memory. The memory 304 may include, but is not limited to, computer-readable storage media, such as various types of volatile and non-volatile storage media, including but not limited to random access memory, read-only memory, programmable read-only memory, electrically programmable read-only memory, electrically erasable read-only memory, flash memory, tape or disk, optical media, etc. In one specific implementation, the memory 304 includes a cache or random access memory for the processor 302. In an alternative specific implementation, the memory 304 is separated from the processor 302, such as a cache memory, system memory, or other memory of the processor. The memory 304 may be an external storage device or database for storing data. Examples include a hard drive, a compact disk ("CD"), a digital video disk ("DVD"), a memory card, a memory stick, a floppy disk, a universal serial bus ("USB") storage device, or any other device operable to store data. The memory 304 is operable to store instructions that can be executed by the processor 302. The functions, actions, or tasks illustrated in the figures or described herein may be performed by the processor 302 executing instructions stored in the memory 304. The functions, actions, or tasks are not related to a particular type of instruction set, storage medium, processor, or processing strategy, and may be performed by software, hardware, integrated circuits, firmware, microcode, etc. operating alone or in combination. Likewise, processing strategies may include multi-processing, multi-tasking, parallel processing, etc.

[0060] As shown, the inverter controller 300 may further include a display 310, such as a liquid crystal display (LCD), an organic light emitting diode (OLED), a flat panel display, a solid state display, a cathode ray tube (CRT), a projector, a printer, or other display devices known now or later developed for outputting the determined information. The display 310 may serve as an interface for a user to view the operation of the processor 302, or specifically serve as an interface with the software stored in the memory 304 or in the drive unit 306.

[0061] Additionally or alternatively, the inverter controller 300 may include an input device 312 configured to allow a user to interact with any of the components of the inverter controller 300. The input device 312 may be a numeric keypad, a keyboard or a cursor control device (such as a mouse or a joystick), a touch screen display, a remote control, or any other device operable to interact with the inverter controller 300.

[0062] The inverter controller 300 may also or alternatively include a drive unit 306 implemented as a disk or optical drive. The drive unit 306 may include a computer-readable medium 322 in which one or more sets of instructions 324 (e.g., software) may be embedded. Further, the instructions 324 may embody one or more of the methods or logics described herein. The instructions 324 may reside completely or partially within the memory 304 and / or within the processor 302 during execution by the inverter controller 300. The memory 304 and the processor 302 may also include computer-readable media as described above.

[0063] In some systems, the computer-readable medium 322 includes instructions 324 or receives and executes instructions 324 in response to a propagated signal, so that a device connected to the network 370 can transmit voice, video, audio, images, or any other data through the network 370. Further, the instructions 324 can be transmitted or received through the network 370 and / or using the bus 308 via the communication port or interface 320. The communication port or interface 320 can be part of the processor 302 or can be an independent component. The communication port or interface 320 can be formed in software or can be a physical connector in hardware. The communication port or interface 320 can be configured to connect to the network 370, external media, display 310, or any other component in the inverter controller 300, or a combination thereof. The connection to the network 370 can be a physical connection (such as a wired Ethernet connection) or can be established wirelessly, as described below. Similarly, additional connections to other components of the inverter controller 300 can be physical connections or can be established wirelessly. The network 370 can alternatively be directly connected to the bus 308.

[0064] Although the computer-readable medium 322 is shown as a single medium, the term "computer-readable medium" may include a single medium or multiple media (such as a centralized or distributed database and / or associated caches and servers) that store one or more sets of instructions. The term "computer-readable medium" may also include any medium capable of storing, encoding, or carrying a set of instructions for execution by a processor or causing a computer system to perform any one or more of the methods or operations disclosed herein. The computer-readable medium 322 may be non-transitory and may be tangible.

[0065] Computer readable medium 322 may include solid-state memory, such as a memory card or other package that accommodates one or more non-volatile read-only memories. Computer readable medium 322 may be random access memory or other volatile rewritable memory. Additionally or alternatively, computer readable medium 322 may include magneto-optical or optical media, such as a disk or tape or other storage device for capturing carrier signals (such as signals transmitted through a transmission medium). Digital file attachments to emails or other self-contained information archives or archive sets may be considered distribution media as tangible storage media. Therefore, the present disclosure is considered to include any one or more of computer-readable media or distribution media and other equivalents and successor media in which data or instructions may be stored.

[0066] In alternative implementations, dedicated hardware implementations (such as application specific integrated circuits, programmable logic arrays, and other hardware devices) may be constructed to implement one or more of the methods described herein. Applications that may include the apparatus and systems of various implementations may broadly include a variety of electronic and computer systems. One or more implementations described herein may use two or more specific interconnected hardware modules or devices with associated control and data signals that may be transmitted between and through the modules or as part of an application specific integrated circuit to implement functionality. Thus, the present system encompasses software, firmware, and hardware implementations.

[0067] The inverter controller 300 may be connected to a network 370. The network 370 may define one or more networks, including wired or wireless networks. The wireless network may be a cellular telephone network, an 802.11, 802.16, 802.20, or WiMAX network. Further, such networks may include public networks (such as the Internet), private networks (such as intranets), or combinations thereof and may utilize a variety of networking protocols that are now available or later developed, including but not limited to TCP / IP-based networking protocols. The network 370 may include a wide area network (WAN) (such as the Internet), a local area network (LAN), a campus area network, a metropolitan area network, a direct connection (such as through a universal serial bus (USB) port), or any other network that allows data communication. The network 370 may be configured to couple one computing device to another computing device to enable data communication between devices. The network 370 may generally be enabled to use any form of machine-readable media to transmit information from one device to another. The network 370 may include a communication method by which information can travel between computing devices. The network 370 may be divided into subnetworks. A subnetwork may allow access to all other components connected to it, or a subnetwork may restrict access between components. Network 370 may be considered a public or private network connection and may include, for example, a virtual private network or encryption or other security mechanisms employed over the public Internet.

[0068] According to various implementations of the present disclosure, the methods described herein may be implemented by a software program that can be executed by a computer system. Further, in an exemplary non-limiting implementation, the implementation may include distributed processing, component or object distributed processing, and parallel processing. Alternatively, a virtual computer system process may be constructed to implement one or more of the methods or functionalities described herein.

[0069] Although this specification describes components and functions that can be implemented in a specific implementation with reference to specific standards and protocols, the present disclosure is not limited to such standards and protocols. For example, standards for Internet and other packet-switched network transmissions (e.g., TCP / IP, UDP / IP, HTML, HTTP) represent examples of the prior art. Such standards are periodically replaced by faster or more efficient equivalents having substantially the same functionality. Therefore, alternative standards and protocols having the same or similar functionality as those disclosed herein are considered equivalents thereof.

[0070] It will be appreciated that, in one embodiment, the operations of the methods discussed are performed by an appropriate processor (or processors) of a processing (i.e., computer) system executing instructions (computer readable code) stored in a storage device. It will also be appreciated that the present disclosure is not limited to any particular implementation or programming technique, and that the present disclosure may be implemented using any suitable technique for implementing the functionality described herein. The present disclosure is not limited to any particular programming language or operating system.

[0071] Figure 4 Describes a method for Figure 2 An exemplary system infrastructure of a point-of-use switching controller. For a three-phase inverter, each of the upper phase and the lower phase may include three phases related to phases A, B, and C. For example, the upper phase power module 140 may include an upper phase power module 140A for upper phase A, an upper phase power module 140B for upper phase B, and an upper phase power module 140C for upper phase C. The upper phase power module 140A may include a point-of-use upper phase A controller 142A and an upper phase A switching element 144A. The upper phase power module 140B may include a point-of-use upper phase B controller 142B and an upper phase B switching element 144B. The upper phase power module 140C may include a point-of-use upper phase C controller 142C and an upper phase C switching element 144C. Each of the upper phase A switching member 144A, the upper phase B switching member 144B, and the upper phase C switching member 144C may be connected to the motor 190 and the battery 195 . Figure 4 Details of the upper phase power module 140 are depicted. Although not shown, the lower phase power module 145 may include a similar structure as the upper phase power module 140 for the lower phases A, B, and C.

[0072] Figure 5 Describes a method for Figure 4 Example system infrastructure for the upper power module. For example, Figure 5 Additional details of upper phase power module 140A are provided. Although not shown, upper phase power module 140B, upper phase power module 140C, and respective lower phase power modules of lower phase power module 145 may include components related to Figure 5 The upper phase power module 140A shown in FIG. 1 is similar in structure to the upper phase power module 140A shown in FIG. 1. In addition, the terms "upper", "lower", "northern", and "southern" as used in this disclosure are used for reference only, do not limit the elements to a particular orientation, and are generally interchangeable throughout the text. For example, the upper phase power module 140 may be referred to as a lower phase power module, a northern phase power module, a southern phase power module, a first phase power module, or a second phase power module.

[0073] The upper phase power module 140A may include a point-of-use upper phase A controller 142A and an upper phase A switch 144A. The upper phase A switch 144A may include one or more sets of switches. Figure 5 As shown, the upper phase A switch 144A may include an upper phase A north switch 144A-N and an upper phase A south switch 144A-S. The point-of-use upper phase A controller 142A may include one or more memories, controllers, or sensors. For example, the point-of-use upper phase A controller 142A may include a communication manager 405, a functional safety controller 410, a test interface and controller 415, a north thermal sensor 420A, a south thermal sensor 420B, a self-test controller 425, a command manager 430, a waveform adjuster 435, a memory 440, a north switch control and diagnostic controller 450N, and a south switch control and diagnostic controller 450S. The point-of-use upper phase A controller 142A may include a controller 405, a functional safety controller 410, a test interface and controller 415, a north thermal sensor 420A, a south thermal sensor 420B, a self-test controller 425, a command manager 430, a waveform adjuster 435, a memory 440, a north switch control and diagnostic controller 450N, and a south switch control and diagnostic controller 450S. Figure 5 More or fewer components than those shown. For example, the point-of-use upper phase A controller 142A may include more or less than two switch controls and diagnostic controllers, and may include more than two thermal sensors.

[0074] The communication manager 405 may control inter-controller communications to and from the point-of-use upper phase A controller 142A and / or may control intra-controller communications between components of the point-of-use upper phase A controller 142A. The functional safety controller 410 may control safety functions of the point-of-use upper phase A controller 142A. For example, the test interface and controller 415 may control test functions of the point-of-use upper phase A controller 142A, such as end-of-line testing in manufacturing. The north thermal sensor 420A may sense the temperature at a first location in the point-of-use upper phase A controller 142A, and the south thermal sensor 420B may sense the temperature at a second location in the point-of-use upper phase A controller 142A. For example, the self-test controller 425 may control self-test functions of the point-of-use upper phase A controller 142A, such as during initialization of the point-of-use upper phase A controller 142A after an inverter 110 power-on event. The command manager 430 may control commands received from the communication manager 405 and issued to the north switch control and diagnostic controller 450N and the south switch control and diagnostic controller 450S. The waveform adjuster 435 may control the waveform timing and shape of the commands received from the communication manager 405 and issued to the north switch control and diagnostic controller 450N and the south switch control and diagnostic controller 450S. The memory 440 may include one or more volatile and non-volatile storage media for the operation of the point-of-use upper phase A controller 142A. The north switch control and diagnostic controller 450N may send one or more signals to the north switch 144A-N to control the operation of the north switch 144A-N, and may receive one or more signals from the north switch 144A-N that provide information about the north switch 144A-N. The south switch control and diagnostic controller 450S may send one or more signals to the south switches 144A-S to control the operation of the south switches 144A-S, and may receive one or more signals from the south switches 144A-S providing information about the south switches 144A-S. As described above, the terms "north" and "south" are used for reference only, and the north switch control and diagnostic controller 450N may send one or more signals to the south switches 144A-S, and the south switch control and diagnostic controller 450S may send one or more signals to the south switches 144A-N.

[0075] Figure 6 Depicted is an exemplary block diagram for a system 710 including a three-channel galvanic isolator and an integrated gate driver architecture in accordance with one or more embodiments. Figure 7 Depicted is an exemplary connection diagram for a system 710 including a three-channel galvanic isolator and an integrated gate driver architecture according to one or more embodiments.

[0076] like Figure 6 and Figure 7As shown, the system 710 may include an upper phase multi-chip module 711U, a lower phase multi-chip module 711L, a phase A power module 712A, a phase B power module 712B, and a phase C power module 712C. The upper phase multi-chip module 711U may include a low voltage upper phase controller 720, a high voltage upper phase A controller 730A, a high voltage upper phase B controller 730B, and a high voltage upper phase C controller 730C. The lower phase multi-chip module 711L may include a low voltage lower phase controller 725, a high voltage lower phase A controller 735A, a high voltage lower phase B controller 735B, and a high voltage lower phase C controller 735C.

[0077] like Figure 7 As shown, the phase A power module 712A may include a positive power connection (HVDC+), a negative power connection (HVDC-), a phase A connection (PH_A), a lower phase A controller 746A at the point of use, a lower phase A power switch 748A, an upper phase A controller 742A at the point of use, and an upper phase A power switch 744A. The phase B power module 712B may include a positive power connection (HVDC+), a negative power connection (HVDC-), a phase B connection (PH_B), a lower phase B controller 746B at the point of use, a lower phase B power switch 748B, an upper phase B controller 742B at the point of use, and an upper phase B power switch 744B. The phase C power module 712C may include a positive power connector (HVDC+), a negative power connector (HVDC-), a phase C connector (PH_C), a point-of-use lower phase C controller 746C, a lower phase C power switch 748C, a point-of-use upper phase C controller 742C, and an upper phase C power switch 744C.

[0078] For example, system 710 may be a specific implementation of a portion of inverter 110. For example, upper phase multi-chip module 711U may be a specific implementation of low voltage upper phase controller 120, high voltage upper phase controller 130, and electrical isolator (such as electrical isolator 150). For example, lower phase multi-chip module 711L may be a specific implementation of low voltage lower phase controller 125, high voltage lower phase controller 135, and electrical isolator (such as electrical isolator 150). For example, phase A power module 712A may be a specific implementation of upper phase power module 140 and lower phase power module 145. For example, phase B power module 712B may be a specific implementation of upper phase power module 140 and lower phase power module 145. For example, phase C power module 712C may be a specific implementation of upper phase power module 140 and lower phase power module 145.

[0079] For example, point-of-use upper phase A controller 742A may be a specific implementation of controller 142A. For example, point-of-use upper phase B controller 742B may be a specific implementation of point-of-use upper phase B controller 142B. For example, point-of-use upper phase C controller 742C may be a specific implementation of point-of-use upper phase C controller 142C. Similarly, point-of-use lower phase A controller 746A, point-of-use lower phase B controller 746B, and point-of-use lower phase C controller 746C may be specific implementations of individual phase controllers in point-of-use lower phase controller 146.

[0080] For example, the upper phase A power switch 744A can be a specific implementation of the upper phase A switch 144A. For example, the upper phase B power switch 744B can be a specific implementation of the upper phase B switch 144B. For example, the upper phase C power switch 744C can be a specific implementation of the upper phase C switch 144C. Similarly, the lower phase A power switch 748A, the lower phase B power switch 748B, and the lower phase C power switch 748C can be specific implementations of separate phase power switches in the lower phase switch 148.

[0081] The low voltage upper phase controller 720 of the upper phase multi-chip module 711U may communicate with one or more of a safety controller, a PWM controller (e.g., such as the inverter controller 300), or a low voltage lower phase controller 725 of the lower phase multi-chip module 711L. Based on this communication, the low voltage upper phase controller 720 may communicate with the high voltage upper phase A controller 730A via the upper phase A electrical isolator 750U-A, communicate with the high voltage upper phase B controller 730B via the upper phase A electrical isolator 750U-B, and communicate with the high voltage upper phase C controller 730C via the upper phase A electrical isolator 750U-C.

[0082] Based on the communication with the low voltage upper phase controller 720, the high voltage upper phase A controller 730A may communicate with the point-of-use upper phase A controller 742A. For example, based on this communication with the high voltage upper phase A controller 730A, the point-of-use upper phase A controller 742A may control the upper phase A power switch 744A to control the current between the positive power connection (HVDC+) and the phase A connection (PH_A) of the phase A power module 712A, which may control the current between the positive terminal of the battery 195 and the phase A of the motor 190. The point-of-use upper phase A controller 742A may provide information about the upper phase A power switch 744A to the high voltage upper phase A controller 730A, which may transmit the information to the low voltage upper phase controller 720, which may transmit the information to one or more of the safety controller, the PWM controller, or the low voltage lower phase controller 725 of the lower phase multi-chip module 711L.

[0083] Based on the communication with the low voltage upper phase controller 720, the high voltage upper phase B controller 730B may communicate with the point-of-use upper phase B controller 742B. For example, based on this communication with the high voltage upper phase B controller 730B, the point-of-use upper phase B controller 742B may control the upper phase B power switch 744B to control the current between the positive power connection (HVDC+) and the phase B connection (PH_B) of the phase B power module 712B, which may control the current between the positive terminal of the battery 195 and the phase B of the motor 190. The point-of-use upper phase B controller 742B may provide information about the upper phase B power switch 744B to the high voltage upper phase B controller 730B, which may transmit the information to the low voltage upper phase controller 720, which may transmit the information to one or more of the safety controller, the PWM controller, or the low voltage lower phase controller 725 of the lower phase multi-chip module 711L.

[0084] Based on the communication with the low voltage upper phase controller 720, the high voltage upper phase C controller 730C may communicate with the point-of-use upper phase C controller 742C. For example, based on this communication with the high voltage upper phase C controller 730C, the point-of-use upper phase C controller 742C may control the upper phase C power switch 744C to control the current between the positive power connection (HVDC+) and the phase C connection (PH_C) of the phase C power module 712C, which may control the current between the positive terminal of the battery 195 and the phase C of the motor 190. The point-of-use upper phase C controller 742C may provide information about the upper phase C power switch 744C to the high voltage upper phase C controller 730C, which may transmit the information to the low voltage upper phase controller 720, which may transmit the information to one or more of the safety controller, the PWM controller, or the low voltage lower phase controller 725 of the lower phase multi-chip module 711L.

[0085] The low voltage lower phase controller 725 of the lower phase multi-chip module 711L may communicate with one or more of a safety controller, a PWM controller (e.g., such as the inverter controller 300), or the low voltage upper phase controller 720 of the upper phase multi-chip module 711U. Based on this communication, the low voltage lower phase controller 725 may communicate with the high voltage lower phase A controller 735A via the lower phase A electrical isolator 750L-A, communicate with the high voltage lower phase B controller 735B via the lower phase A electrical isolator 750L-B, and communicate with the high voltage lower phase C controller 735C via the lower phase A electrical isolator 750L-C.

[0086] Based on the communication with the low voltage lower phase controller 725, the high voltage lower phase A controller 735A may communicate with the point-of-use lower phase A controller 746A. For example, based on this communication with the high voltage lower phase A controller 735A, the point-of-use lower phase A controller 746A may control the lower phase A power switch 748A to control the current between the negative power connection (HVDC-) of the phase A power module 712A and the phase A connection (PH_A), which may control the current between the negative terminal of the battery 195 and the phase A of the motor 190. The point-of-use lower phase A controller 746A may provide information about the lower phase A power switch 748A to the high voltage lower phase A controller 735A, which may transmit the information to the low voltage lower phase controller 725, which may transmit the information to one or more of the safety controller, the PWM controller, or the low voltage upper phase controller 720 of the upper phase multi-chip module 711U.

[0087] Based on the communication with the low voltage lower phase controller 725, the high voltage lower phase B controller 735B may communicate with the point-of-use lower phase B controller 746B. For example, based on this communication with the high voltage lower phase B controller 735B, the point-of-use lower phase B controller 746B may control the associated lower phase B power switch 748B to control the current between the negative power connection (HVDC-) and the phase B connection (PH_B) of the phase B power module 712B, which may control the current between the negative terminal of the battery 195 and the phase B of the motor 190. The point-of-use lower phase B controller 746B may provide information about the lower phase B power switch 748B to the high voltage lower phase B controller 735B, which may transmit the information to the low voltage lower phase controller 725, which may transmit the information to one or more of the safety controller, the PWM controller, or the low voltage upper phase controller 720 of the upper phase multi-chip module 711U.

[0088] Based on the communication with the low voltage lower phase controller 725, the high voltage lower phase C controller 735C may communicate with the point-of-use lower phase C controller 746C. For example, based on this communication with the high voltage lower phase C controller 735C, the point-of-use lower phase C controller 746C may control the lower phase C power switch 748C to control the current between the negative power connection (HVDC-) and the phase C connection (PH_C) of the phase C power module 712C, which may control the current between the negative terminal of the battery 195 and the phase C of the motor 190. The point-of-use lower phase C controller 746C may provide information about the lower phase C power switch 748C to the high voltage lower phase C controller 735C, which may transmit the information to the low voltage lower phase controller 725, which may transmit the information to one or more of the safety controller, the PWM controller, or the low voltage upper phase controller 720 of the upper phase multi-chip module 711U.

[0089] The system 710 may integrate the point-of-use upper phase B controller 742B into, for example, a phase B power module 712B. For example, the point-of-use upper phase B controller 742B may be an application specific integrated circuit (ASIC). The phase B power module 712B may include an upper phase B power switch 744B and a lower phase B power switch 748B, and may incorporate the point-of-use upper phase B controller 742B and the point-of-use lower phase B controller 746B to control the upper phase B power switch 744B and the lower phase B power switch 748B, respectively. One or more of the upper phase B power switch 744B and the lower phase B power switch 748B may include one or more SiC grains. For example, the point-of-use upper phase B controller 742B may locally sense the current of the SiC grain by sensing the voltage drop across the source metallization. The point-of-use upper phase B controller 742B may include localized accurate thermal sensing of the SiC die and the SiC die environment without the need for integration on the die temperature sensing circuit, which may provide improved die thermal performance or lower die cost. The phase B power module 712B may tightly couple the gate drive circuitry of the point-of-use upper phase B controller 742B to, for example, one or more SiC bare dies constituting the upper phase B power switch 744B, which may reduce switching losses.

[0090] The point-of-use upper phase B controller 742B may include a gate drive curve as a function of one or more of the SiC FET gate-to-source voltage, temperature, or a known gate-to-source voltage threshold that may change during the service life of the SiC FET. The point-of-use upper phase B controller 742B may measure and store specific SiC device characteristics in the memory of the integrated gate driver, and may provide a customized gate drive curve based on the stored SiC device characteristics. The point-of-use upper phase B controller 742B may communicate using a two-wire bus, which may reduce the number of connections to electrically isolated devices. The system 710 may provide three HVICs to one LVIC using an upper phase multi-chip module 711U for the upper switching element of a three-phase bridge and a lower phase multi-chip module 711L for the lower switching element of a three-phase bridge.

[0091] The point-of-use upper phase B controller 742B can provide direct current sensing, which can provide less stress on the SiC device in the event of a short circuit. The point-of-use upper phase B controller 742B can provide accurate temperature measurement, which can allow operation at a higher average temperature for system optimization. The point-of-use upper phase B controller 742B can reduce switching losses due to one or more of a tightly coupled layout, use of SiC device features, use of temperature, and use of previous circulating currents. Reduced switching losses can provide increased electric vehicle mileage. Reduced switching losses can provide higher power switching or module current output. The system 710 can provide safety independence as required for active short-circuit discharge during device failure in a permanent magnet motor. The above description uses the phase B power module 712B and the point-of-use upper phase B controller 742B as an example, and similar descriptions may also apply to the phase A power module 712A and the phase C power module 712C and associated components.

[0092] One or more embodiments may integrate a gate driver into a power switch as an integrated gate driver or a point-of-use controller. For example, the integrated gate driver may be an application specific integrated circuit (ASIC). A phase switch power module including two switches may incorporate two integrated gate drivers. One or more embodiments may locally sense the current of a SiC die by sensing a voltage drop across a source metallization. One or more embodiments may include local accurate thermal sensing of a SiC die and a SiC die environment without the need for integration on a die temperature sensing circuit, which may provide improved die thermal performance or lower die cost. One or more embodiments may tightly couple a gate drive circuit to a SiC bare die constituting a power switch, which may reduce switching losses. One or more embodiments may include a gate drive curve as a function of one or more of a SiC FET gate-to-source voltage, temperature, or a known gate-to-source voltage threshold that may change during the life of the SiC FET. One or more embodiments may measure specific SiC device features and store them in a memory (e.g., such as an EEPROM) of an integrated gate driver, and may provide a customized gate drive curve based on the stored SiC device features. One or more embodiments may use a two-wire bus for communication, which may reduce the number of connections to electrically isolated devices. One or more embodiments may use a first multi-chip module for the upper switching piece of a three-phase bridge and a second multi-chip module for the lower switching piece of a three-phase bridge to provide three HVICs to one LVIC.

[0093] One or more embodiments may provide direct current sensing, which may provide less stress on SiC devices in the event of a short circuit event. One or more embodiments may provide accurate temperature measurement, which may allow operation at higher average temperatures for system optimization. One or more embodiments may reduce switching losses due to one or more of a tightly coupled layout, use of SiC device features, use of temperature, and use of previous circulating currents. Reduced switching losses may provide increased electric vehicle range. Reduced switching losses may provide higher power switching or module current output. One or more embodiments may provide safety independence as required for active short circuit discharge during device failure in permanent magnet motors.

[0094] One or more embodiments may provide a single multi-chip module package component with three electrically isolated channels that interface between a low voltage chassis reference ground domain and each of three integrated gate drivers located in a high voltage battery domain. The three-channel configuration may provide an architecture in which one package component controls three upper phase switching elements or three lower phase switching elements of a three-phase inverter. One or more embodiments may provide an improved arrangement from a functional safety perspective because a safety response to the inverter may include a three-phase short circuit of the upper or lower switching elements or a disconnection condition of six switching elements. For example, a single point failure affecting a multi-chip module that controls the three upper switching elements may allow a lower multi-chip module to enter a safe state by performing a three-phase short circuit on the lower three switching elements. One or more embodiments may reduce the number of packaged electrical isolators placed in a system from six required by some systems in the case of a three-phase system to two multi-chip modules. One or more embodiments may reduce the number of serial peripheral interface (SPI) connectors used to control the three-phase switching elements.

[0095] Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. It is intended that the specification and examples be considered exemplary only, with the true scope and spirit of the invention being indicated by the following claims.

Claims

1. A system comprising: An inverter configured to convert DC power from a battery into AC power to drive a motor, wherein the inverter comprises: An upper phase multi-chip module, the upper phase multi-chip module comprising: Low voltage upper phase controller; High voltage upper phase A controller; an upper phase A galvanic isolator connecting the low voltage upper phase controller to the high voltage upper phase A controller; High voltage upper phase B controller; an upper phase B galvanic isolator connecting the low voltage upper phase controller to the high voltage upper phase B controller; a high voltage upper phase C controller; and An upper phase C galvanic isolator connecting the low voltage upper phase controller to the high voltage upper phase C controller.

2. The system according to claim 1, wherein the inverter further comprises: a point-of-use upper phase A controller configured to be connected to the high voltage upper phase A controller; a point-of-use upper phase B controller configured to be connected to the high voltage upper phase B controller; as well as A point-of-use upper phase C controller is configured to be connected to the high voltage upper phase C controller.

3. The system according to claim 2, wherein the inverter further comprises: an upper phase A power switch connected to the point-of-use upper phase A controller and configured to connect to the positive connection of the battery and the phase A connection of the motor; an upper phase B power switch connected to the point-of-use upper phase B controller and configured to connect to the positive connection of the battery and the phase B connection of the motor; as well as An upper phase C power switch connected to the point-of-use upper phase C controller and configured to connect to the positive connection of the battery and the phase C connection of the motor.

4. The system according to claim 1, wherein the inverter further comprises: A lower phase multi-chip module, the lower phase multi-chip module comprising: Low voltage lower phase controller; High voltage lower phase A controller; a lower phase A electrical isolator connecting the low voltage lower phase controller to the high voltage lower phase A controller; High voltage lower phase B controller; a lower phase B electrical isolator connecting the low voltage lower phase controller to the high voltage lower phase B controller; High voltage lower phase C controller; and A lower phase C galvanic isolator connects the low voltage lower phase controller to the high voltage lower phase C controller.

5. The system of claim 4, wherein the inverter further comprises: a point-of-use lower phase A controller configured to be connected to the high voltage lower phase A controller; a point-of-use lower phase B controller configured to be connected to the high voltage lower phase B controller; and A point-of-use lower phase C controller is configured to be connected to the high voltage lower phase C controller.

6. The system of claim 5, wherein the inverter further comprises: a lower phase A power switch connected to the point-of-use lower phase A controller and configured to connect to the negative connection of the battery and the phase A connection of the motor; a lower phase B power switch connected to the point-of-use lower phase B controller and configured to connect to the negative connection of the battery and the phase B connection of the motor; and A lower phase C power switch is connected to the point-of-use lower phase C controller and is configured to connect to the negative connection of the battery and the phase C connection of the motor.

7. The system of claim 1, wherein the inverter further comprises: a phase A power module configured to be connected to the high voltage upper phase A controller; a phase B power module configured to be connected to the high voltage upper phase B controller; as well as A phase C power module is configured to be connected to the high voltage upper phase C controller.

8. The system of claim 1, further comprising: the battery, the battery being configured to supply the DC power to the inverter; as well as The motor is configured to receive the AC power from the inverter to drive the motor.

9. A system comprising: A multi-chip module, the multi-chip module is for an inverter, and the multi-chip module comprises: Low voltage controller; a first high voltage controller; a first electrical isolator connecting the low voltage controller to the first high voltage controller; a second high voltage controller; a second electrical isolator connecting the low voltage controller to the second high voltage controller; a third high voltage controller; and A third electrical isolator connects the low voltage controller to the third high voltage controller.

10. The system of claim 9, wherein the low voltage controller is configured to communicate with a pulse width modulation controller of the inverter.

11. The system of claim 10, wherein: The first high voltage controller is configured to communicate with a first point-of-use controller on a first power module of the inverter; the second high voltage controller being configured to communicate with a second point-of-use controller on a second power module of the inverter; and The third high voltage controller is configured to communicate with a third point-of-use controller on a third power module of the inverter.

12. The system of claim 11, wherein: The low voltage controller is configured to receive a first control signal from the pulse width modulation controller and send a first gate control signal to the first high voltage controller via the first electrical isolator based on the first control signal; The low voltage controller is configured to receive a second control signal from the pulse width modulation controller and send a second gate control signal to the second high voltage controller via the second electrical isolator based on the second control signal; and The low voltage controller is configured to receive a third control signal from the pulse width modulation controller and send a third gate control signal to the third high voltage controller via the third electrical isolator based on the third control signal.

13. The system of claim 12, wherein: The first high voltage controller is configured to send the first gate control signal to the first point-of-use controller on the first power module of the inverter; The second high voltage controller is configured to send the second gate control signal to the second point-of-use controller on the second power module of the inverter; and The third high voltage controller is configured to send the third gate control signal to the third point-of-use controller on the third power module of the inverter.

14. The system of claim 13, wherein: The first high voltage controller is configured to receive a first feedback signal from the first point-of-use controller on the first power module of the inverter and send the first feedback signal to the low voltage controller; The second high voltage controller is configured to receive a second feedback signal from the second point-of-use controller on the second power module of the inverter and send the second feedback signal to the low voltage controller; and The third high voltage controller is configured to receive a third feedback signal from the third point-of-use controller on the third power module of the inverter and send the third feedback signal to the low voltage controller.

15. A system comprising: An inverter configured to convert DC power from a battery into AC power to drive a motor, wherein the inverter comprises: an upper phase controller, the upper phase controller comprising a low voltage upper phase controller, a first high voltage upper phase controller, a second high voltage upper phase controller and a third high voltage upper phase controller; a lower phase controller, the lower phase controller comprising a low voltage lower phase controller, a first high voltage lower phase controller, a second high voltage lower phase controller and a third high voltage lower phase controller; a first power module, the first power module comprising a first upper phase point-of-use controller, a first upper phase switching element, a first lower phase point-of-use controller, and a first lower phase switching element; a second power module comprising a second upper phase point-of-use controller, a second upper phase switching element, a second lower phase point-of-use controller, and a second lower phase switching element; and A third power module includes a third upper phase usage point controller, a third upper phase switching element, a third lower phase usage point controller and a third lower phase switching element.

16. The system of claim 15, wherein: The upper phase controller is configured to communicate with a pulse width modulation controller of the inverter and is configured to communicate with the lower phase controller, and The lower phase controller is configured to communicate with the pulse width modulation controller of the inverter and is configured to communicate with the upper phase controller.

17. The system of claim 15, wherein: the first high voltage upper phase controller comprising a first upper phase electrical isolator connected to the low voltage upper phase controller; the second high voltage upper phase controller comprising a second upper phase electrical isolator connected to the low voltage upper phase controller; the third high voltage upper phase controller comprising a third upper phase electrical isolator connected to the low voltage upper phase controller; the first high voltage lower phase controller comprising a first lower phase electrical isolator connected to the low voltage lower phase controller; the second high voltage lower phase controller comprises a second lower phase electrical isolator connected to the low voltage lower phase controller; and The third high voltage lower phase controller includes a third lower phase electrical isolator connected to the low voltage lower phase controller.

18. The system of claim 17, wherein: the first high voltage upper phase controller being configured to be connected to the first upper phase point-of-use controller; the second high voltage upper phase controller being configured to be connected to the second upper phase point-of-use controller; the third high voltage upper phase controller being configured to be connected to the third upper phase point-of-use controller; the first high voltage lower phase controller being configured to be connected to the first lower phase point-of-use controller; the second high voltage lower phase controller being configured to be connected to the second lower phase point-of-use controller; and The third high voltage lower phase controller is configured to be connected to the third lower phase point-of-use controller.

19. The system of claim 18, wherein: the first upper phase point-of-use controller being configured to control the first upper phase switching element based on one or more first upper phase signals from the first high voltage upper phase controller; the second upper phase point-of-use controller being configured to control the second upper phase switching element based on one or more second upper phase signals from the second high voltage upper phase controller; The third upper phase point-of-use controller is configured to control the third upper phase switching element based on one or more third upper phase signals from the third high voltage upper phase controller; the first lower phase point-of-use controller being configured to control the first lower phase switching element based on one or more first lower phase signals from the first high voltage lower phase controller; The second lower phase point-of-use controller is configured to control the second lower phase switching element based on one or more second lower phase signals from the second high voltage lower phase controller; and The third lower phase point-of-use controller is configured to control the third lower phase switching element based on one or more third lower phase signals from the third high voltage lower phase controller.

20. The system of claim 15, wherein: The first upper phase switch is configured to connect to a positive connection of the battery and a first phase connection of the motor; the second upper phase switch being configured to connect to a positive connection of the battery and a second phase connection of the motor; The third upper phase switch is configured to connect to the positive connection of the battery and the third phase connection of the motor; The first lower phase switch is configured to connect to a negative connection of the battery and the first phase connection of the motor; The second lower phase switch is configured to connect to a negative connection of the battery and the second phase connection of the motor; and The third lower phase switch is configured to connect to a negative connection of the battery and the third phase connection of the motor.

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