Ultrasonic probe, backing structure and manufacturing method of backing structure

Abstract

The invention discloses an ultrasonic probe, a backing structure and a manufacturing method of the backing structure. The manufacturing method comprises the following steps: preparing a liquid backing base material; manufacturing a heat conduction structural member, wherein the heat conduction structural member is a one-dimensional structural member or a two-dimensional structural member; mixing and stirring the backing base material and the heat conduction structural members, wherein the number of the heat conduction structural members is multiple; the backing base material is solidified to form a three-dimensional structure, heat conduction can be conducted between at least two heat conduction structural parts in the multiple heat conduction structural parts, and a three-dimensional heat conduction channel in the three-dimensional structure is formed through the multiple heat conduction structural parts; the three-dimensional structure forms the backing structure. According to the manufacturing method, the backing structure with the three-dimensional heat conduction channel can be formed. Through the three-dimensional heat conduction channels in other entity parts (the solidified part of the backing base material) of the backing structure, the heat conduction effect of the backing structure is effectively improved, and then the heat dissipation effect of the piezoelectric wafer (the transducer array element) is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of ultrasonic equipment, and in particular to an ultrasonic probe, a backing structure and a method for manufacturing the backing structure. Background Art

[0002] Ultrasonic probe is an important component of ultrasonic diagnostic imaging equipment.

[0003] At present, the ultrasonic probe includes a housing and an acoustic stack, which mainly includes an acoustic lens, a matching layer, a piezoelectric layer and a backing structure stacked in sequence. Among them, the backing structure in the ultrasonic probe is in contact with the piezoelectric layer to conduct away the heat generated by the piezoelectric chip (transducer array element) of the piezoelectric layer.

[0004] Therefore, how to improve the thermal conductivity of the backing structure is an urgent problem to be solved by those skilled in the art. Summary of the invention

[0005] In view of this, the present invention provides a method for manufacturing a backing structure to improve the thermal conductivity of the backing structure. The present invention also provides a backing structure manufactured by the method for manufacturing the backing structure and an ultrasonic probe having the backing structure.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] A method for manufacturing a backing structure, comprising:

[0008] preparing a liquid backing substrate;

[0009] Manufacturing a heat-conducting structural member, wherein the heat-conducting structural member is a one-dimensional structural member or a two-dimensional structural member;

[0010] Mixing and stirring the backing substrate and the thermally conductive structural member, wherein the number of the thermally conductive structural members is multiple;

[0011] The backing substrate solidifies to form a three-dimensional structure, and heat can be conducted between at least two of the plurality of heat-conducting structural members, so that a three-dimensional heat-conducting path is formed in the three-dimensional structure through the plurality of heat-conducting structural members;

[0012] The three-dimensional structure forms the backing structure.

[0013] Optionally, in the above-mentioned manufacturing method, in the step of mixing and stirring the backing substrate and the thermally conductive structural member, the stirring rate is between 100 rpm and 4000 rpm.

[0014] Optionally, in the above-mentioned manufacturing method, in the step of mixing and stirring the backing substrate and the thermally conductive structural component, the mass ratio of the backing substrate to the thermally conductive structural component ranges from 1:0.05 to 1:15.

[0015] Optionally, in the above manufacturing method, the heat-conducting structural member is a strip-shaped structure;

[0016] The value range of the diameter of the circumscribed circle of the cross section of the thermally conductive structural component is 10nm~50μm; and / or the value range of the aspect ratio of the thermally conductive structural component is 10~10000, wherein the aspect ratio of the thermally conductive structural component is the ratio of the diameter of the circumscribed circle of the cross section of the thermally conductive structural component to the length of the thermally conductive structural component.

[0017] Optionally, in the above-mentioned manufacturing method, in the step of forming the backing structure from the three-dimensional structure, the three-dimensional structure formed by solidifying the backing substrate is machined to form the backing structure;

[0018] Alternatively, in the step of solidifying the backing substrate to form a three-dimensional structure, a mold for forming the backing structure is used to hold a mixture of the backing substrate and the thermally conductive structural component; in the step of forming the backing structure from the three-dimensional structure, the backing structure is formed by demolding the three-dimensional structure.

[0019] The present invention also provides another method for making a backing structure, comprising:

[0020] preparing a liquid backing substrate;

[0021] Constructing one-dimensional structural parts and / or two-dimensional structural parts into three-dimensional frame structural parts to form heat-conducting structural parts;

[0022] The liquid backing substrate is infiltrated into the thermally conductive structural member by pouring;

[0023] The backing substrate solidifies to form a three-dimensional structure, and the heat-conducting structural member forms a three-dimensional heat-conducting path within the three-dimensional structure;

[0024] The three-dimensional structure forms the backing structure.

[0025] Optionally, in the above manufacturing method, the number of the thermally conductive structural member is one; when the backing substrate is solidified to form a three-dimensional structure, the thermally conductive structural member serves as a three-dimensional thermally conductive path of the three-dimensional structure;

[0026] Or, in the step of pouring the liquid backing substrate into the thermally conductive structural component, there are multiple thermally conductive structural components; when the backing substrate solidifies to form a three-dimensional structure, heat can be conducted between at least two of the multiple thermally conductive structural components, so that the multiple thermally conductive structural components form a three-dimensional heat conductive path of the three-dimensional structure.

[0027] Optionally, in the above-mentioned manufacturing method, in the step of forming the backing structure from the three-dimensional structure, the three-dimensional structure formed by solidifying the backing substrate is processed to form the backing structure;

[0028] Alternatively, in the step of solidifying the backing substrate to form a three-dimensional structure, a mold for forming the backing structure is used to hold a mixture of the backing substrate and the thermally conductive structural component; in the step of forming the backing structure from the three-dimensional structure, the backing structure is formed by demolding the three-dimensional structure.

[0029] Optionally, in the above manufacturing method, the heat-conducting structural component is a metal material component.

[0030] Optionally, in the above manufacturing method, the heat-conducting structural member is an iron, copper, aluminum, silver or tungsten structural member.

[0031] Optionally, in the above manufacturing method, the heat-conducting structural component is a non-metallic material component.

[0032] Optionally, in the above manufacturing method, the thermally conductive structural component is a carbon fiber, a carbon nanotube, a graphene aerogel component, a transition metal carbonitride superstructure component or a thermally conductive ceramic component.

[0033] Optionally, in the above-mentioned preparation method, the backing substrate is any one of epoxy resin, polyurethane, polyamide polymer or their precursors, or a mixture of several of them.

[0034] Optionally, in the above-mentioned production method, the step of preparing the liquid backing substrate further includes adding a modifier into the backing substrate.

[0035] Optionally, in the above-mentioned preparation method, the modifier is a metal, non-metal compound powder, a chain extender or a plasticizer.

[0036] The present invention also provides an ultrasonic probe, comprising:

[0037] An acoustic stack, the acoustic stack comprising an acoustic lens, a matching layer, a piezoelectric layer and a backing structure arranged in sequence, the piezoelectric layer having a piezoelectric chip that dissipates heat in a working state, and the backing structure connected to the piezoelectric layer;

[0038] A housing having a cavity, wherein at least a portion of the acoustic stack is located within the cavity;

[0039] in,

[0040] The backing structure is manufactured by any of the manufacturing methods described above, and the three-dimensional heat conduction path of the backing structure is thermally connected to the piezoelectric layer.

[0041] The present invention also provides a backing structure, which is manufactured using any of the above-mentioned manufacturing methods.

[0042] It can be seen from the above technical solutions that the method for manufacturing the backing structure provided by the present invention can form a backing structure with a three-dimensional heat conduction path. Among them, the three-dimensional heat conduction path in the other solid part of the backing structure (the part where the backing substrate is solidified) effectively improves the heat conduction effect of the backing structure, thereby improving the heat dissipation effect of the piezoelectric chip (transducer array element).

[0043] The backing structure provided by the present invention is manufactured using the above-mentioned manufacturing method and has the same technical effects as described above, which will not be described in detail here.

[0044] The ultrasonic probe provided by the present invention has a backing structure manufactured by the manufacturing method of the above-mentioned backing structure. Since the backing structure manufactured by the manufacturing method of the above-mentioned backing structure has the above-mentioned technical effects, the ultrasonic probe provided by the present invention should also have the same technical effects, which will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0046] Figure 1 A schematic flow chart of a method for manufacturing a first backing structure provided by an embodiment of the present invention;

[0047] Figure 2 A schematic flow chart of a method for manufacturing a second backing structure provided by an embodiment of the present invention;

[0048] Figure 3 A schematic diagram of the operation of the method for manufacturing the backing structure provided by an embodiment of the present invention;

[0049] Figure 3 middle,

[0050] 1-heat-conducting structural parts; 2-backing substrate; 3-three-dimensional structure. DETAILED DESCRIPTION

[0051] The invention discloses a method for manufacturing a backing structure to improve the heat conduction effect of the backing structure. The invention also provides a backing structure manufactured by the method for manufacturing the backing structure and an ultrasonic probe having the backing structure.

[0052] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0053] like Figure 1 and Figure 3 As shown, an embodiment of the present invention provides a method for manufacturing a backing structure, comprising:

[0054] S1: preparing a liquid backing substrate 2;

[0055] The backing substrate 2 may be composed of one or a mixture of polymers such as epoxy resin, polyurethane, polyamide and their precursors. During the preparation process, the backing substrate 2 is in liquid state due to the preparation environment (temperature).

[0056] S2: manufacturing a heat-conducting structural component 1, wherein the heat-conducting structural component 1 is a one-dimensional structural component or a two-dimensional structural component;

[0057] The heat-conducting structural member 1 can be a metal material, such as iron, copper, aluminum, silver or tungsten structural members, etc.; it can also be a carbon fiber, carbon nanotube, graphene aerogel, transition metal carbonitride superstructure or heat-conducting ceramic member. The thermal conductivity of the heat-conducting structural member 1 is higher than the thermal conductivity of the backing substrate 2 after solidification.

[0058] The one-dimensional structural member may be a granular or spherical structure, or a strip structure, which may specifically be a straight strip or an arc-shaped member. The two-dimensional structural member may be a frame structure, such as a four-frame or no frame, or a sheet structure formed by connecting multiple one-dimensional structural members. Among them, the one-dimensional structural member and the two-dimensional structural member are solid structural members that can form a three-dimensional frame structural member. Multiple one-dimensional structural members can be connected to form a two-dimensional structural member, and the one-dimensional structural member and / or the two-dimensional structural member can be built into a three-dimensional frame structural member.

[0059] S3: mixing and stirring the backing substrate 2 and the thermally conductive structural component 1, wherein the number of the thermally conductive structural components 1 is multiple;

[0060] The plurality of thermally conductive structural members 1 are added into the backing substrate 2 and mixed, or the backing substrate 2 is poured into the plurality of thermally conductive structural members 1 and mixed; and the positions of the plurality of thermally conductive structural members 1 in the backing substrate 2 are adjusted by stirring.

[0061] S4: the backing substrate 2 solidifies to form a three-dimensional structure 3, and heat conduction can be conducted between at least two of the plurality of heat-conducting structural members 1, so that a three-dimensional heat-conducting path is formed in the three-dimensional structure 3 through the plurality of heat-conducting structural members 1;

[0062] As the backing substrate 2 solidifies into a three-dimensional structure 3, the positions of the multiple heat-conducting structural members 1 in the three-dimensional structure 3 are fixed, wherein heat conduction can be conducted between at least two heat-conducting structural members 1 (through contact or non-contact, and in a non-contact state, the distance between the two heat-conducting structural members 1 that can conduct heat is within a certain range), so that the multiple heat-conducting structural members 1 can form a three-dimensional structural member with a spatial structure, that is, a frame structure, so that the multiple heat-conducting structural members 1 form a three-dimensional heat-conducting path.

[0063] S5: The three-dimensional structure 3 forms a backing structure.

[0064] The backing structure is formed by processing the three-dimensional structure 3 (including the plurality of heat-conducting structural members 1 therein).

[0065] The method for manufacturing the backing structure provided by the embodiment of the present invention can form a backing structure with a three-dimensional heat conduction path. The three-dimensional heat conduction path in the other solid part of the backing structure (the solidified part of the backing substrate 2) effectively improves the heat conduction effect of the backing structure, thereby improving the heat dissipation effect of the piezoelectric chip (transducer array element).

[0066] Since the three-dimensional heat conduction path is a heat conduction frame structure formed in other solid parts of the backing structure (the solidified part of the backing substrate 2), it has high impedance, thereby improving the impedance performance of the backing structure, effectively reducing the risk of interference caused by the back ultrasonic signal of the piezoelectric chip being reflected back to the piezoelectric chip. The attenuation performance requirements of the backing substrate 2 are reduced, which is conducive to improving the performance of the transducer.

[0067] Furthermore, in the step S3 (mixing and stirring the backing substrate 2 and the thermally conductive structure 1), the stirring rate is between 100 rpm and 4000 rpm. By stirring, the uniform dispersion of the plurality of thermally conductive structures 1 in the three-dimensional structure 3 can be improved, and it is also easy to make the two thermally conductive structures 1 contact each other and get close. The stirring rate can be uniform, or it can be reduced as the solidification degree of the backing substrate 2 increases.

[0068] In the step S3 (mixing and stirring the backing substrate and the thermally conductive structure 1), the mass ratio of the backing substrate 2 to the thermally conductive structure 1 is in the range of 1:0.05 to 1:15. That is, when the mass ratio of the backing substrate 2 to the thermally conductive structure 1 is within the above value range, the stirring can enable heat conduction between the multiple thermally conductive structures 1, effectively improving the thermal conductivity stability of the three-dimensional thermally conductive path formed by the multiple thermally conductive structures 1.

[0069] In this embodiment, preferably, the heat-conducting structure 1 is a strip structure; wherein the value range of the diameter of the circumscribed circle of the cross section of the heat-conducting structure 1 is 10nm to 50μm. That is, the heat-conducting structure 1 can be a cuboid structure, whose cross section is a rectangle, and the value range of the diameter of the circumscribed circle of the rectangle is 10nm to 50μm; the heat-conducting structure 1 can also be a cylindrical structure, whose cross section is a circle, and the value range of the diameter of the circle (the diameter of the circumscribed circle is its diameter) is 10nm to 50μm; the heat-conducting structure 1 can also be a triangular prism structure or a pentagonal prism structure, etc.

[0070] Furthermore, the aspect ratio of the heat-conducting structure 1 is in the range of 10 to 10000, wherein the aspect ratio of the heat-conducting structure 1 is the ratio of the diameter of the circumscribed circle of the cross section of the heat-conducting structure 1 to the length of the heat-conducting structure 1. Taking the heat-conducting structure 1 as a rectangular parallelepiped structure as an example, the ratio of the diameter of the circumscribed circle of its cross section (rectangle) to the length of the rectangular parallelepiped structure is in the range of 10 to 10000. Through the above arrangement, it is ensured that the distance between the two ends of the heat-conducting structure 1 (the two ends in the length direction of the heat-conducting structure 1) is increased on the basis of a certain volume, so that multiple heat-conducting structures 1 can form a framework structure of a three-dimensional structure 3.

[0071] In the step of forming the backing structure from the three-dimensional structure 3, the three-dimensional structure 3 formed by solidifying the backing substrate 2 is machined to form the backing structure. The three-dimensional structure 3 formed by solidifying the backing substrate 2 can be processed into the backing structure by cutting, turning, etc. The volume of the three-dimensional structure 3 can be increased by increasing the amount of the backing substrate 2 and the thermal conductive structure 1, so that one three-dimensional structure 3 can be processed into multiple backing structures; the amount of the backing substrate 2 and the thermal conductive structure 1 can also be controlled so that a single three-dimensional structure 3 can be processed into one backing structure.

[0072] The method of forming the backing structure may also be changed. For example, in step S4 (the backing substrate 2 solidifies to form a three-dimensional structure), a mold for forming the backing structure is used to hold the mixture of the backing substrate 2 and the thermal conductive structure 1; in the step of forming the backing structure from the three-dimensional structure 3, the backing structure is formed by demolding the three-dimensional structure 3.

[0073] The heat-conducting structural member 1 may be made of a metal material. Since metal materials generally have a high thermal conductivity, the heat-conducting effect of the heat-conducting structural member 1 can be effectively ensured by making the heat-conducting structural member 1 of a metal material.

[0074] Specifically, the heat-conducting structural member 1 is a structural member made of iron, copper, aluminum, silver or tungsten. Of course, the heat-conducting structural member 1 can also be made of other metal materials.

[0075] The heat-conducting structural member 1 may also be made of non-metallic material. Since some non-metallic materials also have high thermal conductivity, using corresponding materials to make the heat-conducting structural member 1 can further improve the impedance.

[0076] Specifically, the heat-conducting structural component 1 is a carbon fiber, a carbon nanotube, a graphene aerogel component, a transition metal carbonitride superstructure component or a heat-conducting ceramic component.

[0077] In the method for manufacturing the backing structure provided by the embodiment of the present invention, the backing substrate 2 is any one of epoxy resin, polyurethane, polyamide polymer or their precursors or a mixture of several of them.

[0078] Furthermore, the step of preparing the liquid backing substrate 2 also includes adding a modifier into the backing substrate 2. The modifier is a material added mainly to overcome the disadvantages of the backing substrate 2 and improve its performance, including but not limited to metal, non-metal compound powder, chain extender and plasticizer.

[0079] like Figure 2 and Figure 3 As shown, the present invention also provides a method for manufacturing a backing structure, comprising:

[0080] S11: preparing a liquid backing substrate 2;

[0081] Similarly, the backing substrate 2 can be composed of one or a mixture of polymers such as epoxy resin, polyurethane, polyamide and their precursors. During the preparation process, the backing substrate 2 is in liquid state due to the preparation environment (temperature).

[0082] S12: constructing the one-dimensional structural member and / or the two-dimensional structural member into a three-dimensional frame structural member to form a heat-conducting structural member 1;

[0083] The heat-conducting structural member 1 can be a metal material, such as iron, copper, aluminum, silver or tungsten structural members, etc.; it can also be a carbon fiber, carbon nanotube, graphene aerogel, transition metal carbonitride superstructure or heat-conducting ceramic member. The thermal conductivity of the heat-conducting structural member 1 is higher than the thermal conductivity of the backing substrate 2 after solidification.

[0084] The one-dimensional structural member may be a granular or spherical structure, or a strip structure, which may specifically be a straight strip or an arc-shaped member. The two-dimensional structural member may be a frame structure, such as a four-frame or no frame, or a sheet structure formed by connecting multiple one-dimensional structural members. Among them, the one-dimensional structural member and the two-dimensional structural member are solid structural members that can form a three-dimensional frame structural member. Multiple one-dimensional structural members can be connected to form a two-dimensional structural member, and the one-dimensional structural member and / or the two-dimensional structural member can be built into a three-dimensional frame structural member.

[0085] There is no order relationship between the above step S11 and step S12, and they can be performed simultaneously, or S11 can be performed first and then S12, or S12 can be performed first and then S11.

[0086] S13: the liquid backing substrate 2 is infiltrated into the thermally conductive structural component 1 by pouring;

[0087] Since the heat-conducting structural member 1 is a three-dimensional frame structural member, the liquid backing substrate 2 flows through the gaps of the three-dimensional frame structural member, so that the liquid backing substrate 2 fills the gaps of the three-dimensional frame structural member and forms a solid structure. In this process, the backing substrate 2 is made liquid by adjusting the operating environment (temperature) to ensure that the liquid backing substrate 2 fills the gaps of the three-dimensional frame structural member.

[0088] S14: the backing substrate 2 solidifies to form a three-dimensional structure 3, and the thermal conductive structural component 1 forms a three-dimensional thermal conductive path in the three-dimensional structure 3;

[0089] As the backing substrate 2 solidifies into the three-dimensional structure 3, the position of the thermal conductive structure 1 in the three-dimensional structure 3 is fixed, wherein the three-dimensional frame structure forms a three-dimensional thermal conductive path.

[0090] S15: The three-dimensional structure 3 forms a backing structure.

[0091] The backing structure is formed by processing the three-dimensional structure 3 (including the plurality of heat-conducting structural members 1 therein).

[0092] The method for manufacturing the backing structure provided in the embodiment of the present invention can also form a backing structure with a three-dimensional heat conduction path. The three-dimensional heat conduction path in the other solid part of the backing structure (the solidified part of the backing substrate 2) effectively improves the heat conduction effect of the backing structure, thereby improving the heat dissipation effect of the piezoelectric chip (transducer array element).

[0093] Similarly, since the three-dimensional heat conduction path is a heat conduction frame structure formed in other solid parts of the backing structure (the solidified part of the backing substrate 2), it has high impedance, thereby improving the impedance performance of the backing structure, effectively reducing the risk of interference caused by the back ultrasonic signal of the piezoelectric chip being reflected back to the piezoelectric chip. The attenuation performance requirements of the backing substrate 2 are reduced, which is conducive to improving the performance of the transducer.

[0094] In the manufacturing method provided by the embodiment of the present invention, the number of the heat-conducting structure 1 is one; when the backing substrate 2 solidifies to form the three-dimensional structure 3, the heat-conducting structure 1 serves as a three-dimensional heat-conducting path of the three-dimensional structure 3;

[0095] It is also possible that in step S13 (liquid backing substrate 2 is poured into thermally conductive structural component 1 ), there are multiple thermally conductive structural components 1 .

[0096] In order to further improve the thermal conductivity effect, when the backing substrate 2 solidifies to form a three-dimensional structure 3, heat can be conducted between at least two of the multiple thermally conductive structural components 1, so that the multiple thermally conductive structural components 1 form a three-dimensional thermal conductive path of the three-dimensional structure 3.

[0097] Of course, multiple heat-conducting structural components 1 may also be relatively independent.

[0098] Specifically, in the step of forming the backing structure from the three-dimensional structure 3, the three-dimensional structure 3 formed by solidifying the backing substrate 2 is machined to form the backing structure. The three-dimensional structure 3 formed by solidifying the backing substrate 2 can be processed into the backing structure by cutting, turning, etc. The volume of the three-dimensional structure 3 can be increased by increasing the amount of the backing substrate 2 and the thermal conductive structure 1, so that one three-dimensional structure 3 can be processed into multiple backing structures; the amount of the backing substrate 2 and the thermal conductive structure 1 can also be controlled so that a single three-dimensional structure 3 can be processed into one backing structure.

[0099] Other processing methods may also be changed, that is, in step S14 (the backing substrate 2 solidifies to form a three-dimensional structure), a mold for forming a backing structure is used to hold the mixture of the backing substrate 2 and the thermal conductive structure 1; in the step of forming the backing structure from the three-dimensional structure 3, the backing structure is formed by demolding the three-dimensional structure 3.

[0100] The heat-conducting structural member 1 may be made of a metal material. Since metal materials generally have a high thermal conductivity, the heat-conducting effect of the heat-conducting structural member 1 can be effectively ensured by making the heat-conducting structural member 1 of a metal material.

[0101] Specifically, the heat-conducting structural member 1 is a structural member made of iron, copper, aluminum, silver or tungsten. Of course, the heat-conducting structural member 1 can also be made of other metal materials.

[0102] The heat-conducting structural member 1 may also be made of non-metallic material. Since some non-metallic materials also have high thermal conductivity, using corresponding materials to make the heat-conducting structural member 1 can further improve the impedance.

[0103] Specifically, the heat-conducting structural component 1 is a carbon fiber, a carbon nanotube, a graphene aerogel component, a transition metal carbonitride superstructure component or a heat-conducting ceramic component.

[0104] In the method for manufacturing the backing structure provided by the embodiment of the present invention, the backing substrate 2 is any one of epoxy resin, polyurethane, polyamide polymer or their precursors or a mixture of several of them.

[0105] Furthermore, the step of preparing the liquid backing substrate 2 also includes adding a modifier into the backing substrate 2. The modifier is a material added mainly to overcome the disadvantages of the backing substrate 2 and improve its performance, including but not limited to metal, non-metal compound powder, chain extender and plasticizer.

[0106] The above two methods for manufacturing the backing structure can both effectively improve the thermal conductivity of the backing structure and further improve the impedance performance of the backing structure.

[0107] The specific size of the heat-conducting structural component 1 is determined according to the actual material.

[0108] In the first embodiment, the heat-conducting structural member 1 is preferably a metal wire (a two-dimensional structural member made of metal material). The backing substrate 2 is a resin.

[0109] The mass ratio of the heat-conducting structure 1 to the backing substrate 2 (liquid) and other modifiers (such as metal, non-metal compound powder, chain extender or plasticizer, etc.) is 1:3:8, and the three-dimensional heat-conducting path is formed before the glue is poured, that is, after the one-dimensional structure and / or the two-dimensional structure are constructed into a three-dimensional frame structure (heat-conducting structure 1), the liquid backing substrate 2 is poured into the heat-conducting structure 1. After the backing substrate 2 (resin) is cured, the acoustic impedance of the material can reach 6 Mrayl, and the thermal conductivity is higher than 2.0W / m 2 / K.

[0110] like Figure 2 As shown, in the second embodiment, the heat-conducting structural member 1 is preferably a metal wire (a two-dimensional structural member made of metal material). The backing substrate 2 is a resin.

[0111] The mass ratio of the heat-conducting structural part 1 to the backing substrate 2 (liquid) and other modifiers (such as metal, non-metal compound powder, chain extender or plasticizer, etc.) is 1:2:9. The three-dimensional heat-conducting path is formed after the glue is poured, that is, the one-dimensional structural part or the two-dimensional structural part is used as the heat-conducting structure and mixed with the liquid backing substrate 2. After the backing substrate 2 (resin) is cured, the acoustic impedance of the modified material can reach 6.5 Mrayl and the thermal conductivity is higher than 1.0 W / m 2 / K.

[0112] The present invention also provides an ultrasonic probe, comprising an acoustic stack and a housing. The acoustic stack comprises an acoustic lens, a matching layer, a piezoelectric layer and a backing structure arranged in sequence, the piezoelectric layer has a piezoelectric chip that dissipates heat in a working state, and the backing structure is connected to the piezoelectric layer; the housing has a cavity, and at least part of the structure of the acoustic stack is located in the cavity; wherein the backing structure is manufactured by any of the above-mentioned manufacturing methods, and the three-dimensional heat conduction path of the backing structure is heat-conductively connected to the piezoelectric layer.

[0113] Since the above-mentioned ultrasonic probe has a backing structure made by any of the above-mentioned manufacturing methods, the backing structure made by the above-mentioned manufacturing method has the above-mentioned technical effects, and the ultrasonic probe having the above-mentioned backing structure should also have the same technical effects, which will not be repeated here one by one.

[0114] The present invention also provides a backing structure, which is manufactured by any of the above manufacturing methods. Therefore, the backing structure has the same technical effect.

[0115] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0116] The above description of the disclosed embodiments enables one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A method for manufacturing a backing structure, characterized in that: include: preparing a liquid backing substrate; Manufacturing a heat-conducting structural member, wherein the heat-conducting structural member is a one-dimensional structural member or a two-dimensional structural member; Mixing and stirring the backing substrate and the thermally conductive structural component, wherein the number of the thermally conductive structural components is multiple; The backing substrate solidifies to form a three-dimensional structure, and heat can be conducted between at least two of the plurality of heat-conducting structural members, so that a three-dimensional heat-conducting path is formed in the three-dimensional structure through the plurality of heat-conducting structural members; The three-dimensional structure forms the backing structure.

2. The method according to claim 1, characterized in that: In the step of mixing and stirring the backing substrate and the thermally conductive structure, the stirring rate is between 100 rpm and 4000 rpm.

3. The method according to claim 1, characterized in that: In the step of mixing and stirring the backing substrate and the thermally conductive structural component, the mass ratio of the backing substrate to the thermally conductive structural component ranges from 1:0.05 to 1:

15.

4. The method according to claim 1, characterized in that: The heat-conducting structural member is a strip-shaped structure; The value range of the circumscribed circle diameter of the cross section of the heat-conducting structural member is 10 nm to 50 μm; And / or, the aspect ratio of the heat conductive structure is in the range of 10 to 10000, wherein the aspect ratio of the heat conductive structure is the ratio of the diameter of the circumscribed circle of the cross section of the heat conductive structure to the length of the heat conductive structure.

5. The method according to claim 1, characterized in that: In the step of forming the backing structure from the three-dimensional structure, the three-dimensional structure formed by solidifying the backing substrate is machined to form the backing structure; Alternatively, in the step of solidifying the backing substrate to form a three-dimensional structure, a mold for forming the backing structure is used to hold a mixture of the backing substrate and the thermally conductive structural component; in the step of forming the backing structure from the three-dimensional structure, the backing structure is formed by demolding the three-dimensional structure.

6. A method for manufacturing a backing structure, characterized in that: include: preparing a liquid backing substrate; Constructing one-dimensional structural parts and / or two-dimensional structural parts into three-dimensional frame structural parts to form heat-conducting structural parts; The liquid backing substrate is infiltrated into the thermally conductive structural member by pouring; The backing substrate solidifies to form a three-dimensional structure, and the heat-conducting structural member forms a three-dimensional heat-conducting path within the three-dimensional structure; The three-dimensional structure forms the backing structure.

7. The method according to claim 6, characterized in that: The number of the heat-conducting structural member is one; when the backing substrate is solidified to form a three-dimensional structure, the heat-conducting structural member serves as a three-dimensional heat-conducting path of the three-dimensional structure; Or, in the step of pouring the liquid backing substrate into the thermally conductive structural component, there are multiple thermally conductive structural components; when the backing substrate solidifies to form a three-dimensional structure, heat can be conducted between at least two of the multiple thermally conductive structural components, so that the multiple thermally conductive structural components form a three-dimensional heat conductive path of the three-dimensional structure.

8. The method according to claim 6, characterized in that: In the step of forming the backing structure from the three-dimensional structure, the three-dimensional structure formed by solidifying the backing substrate is processed to form the backing structure; Alternatively, in the step of solidifying the backing substrate to form a three-dimensional structure, a mold for forming the backing structure is used to hold a mixture of the backing substrate and the thermally conductive structural component; in the step of forming the backing structure from the three-dimensional structure, the backing structure is formed by demolding the three-dimensional structure.

9. The production method according to any one of claims 1 to 8, characterized in that: The heat-conducting structural component is made of metal material.

10. The manufacturing method according to claim 9, characterized in that: The heat-conducting structural member is an iron, copper, aluminum, silver or tungsten structural member.

11. The production method according to any one of claims 1 to 8, characterized in that: The heat-conducting structural component is made of non-metallic material.

12. The manufacturing method according to claim 13, characterized in that: The heat-conducting structural component is a carbon fiber, a carbon nanotube, a graphene aerogel component, a transition metal carbonitride superstructure component or a heat-conducting ceramic component.

13. The production method according to any one of claims 1 to 8, characterized in that: The backing substrate is any one of epoxy resin, polyurethane, polyamide polymer or their precursors or a mixture of several of them.

14. The method according to claim 13, characterized in that: The step of preparing the liquid backing substrate also includes adding a modifier into the backing substrate.

15. The manufacturing method according to claim 14, characterized in that: The modifier is a metal or non-metal compound powder, a chain extender or a plasticizer.

16. An ultrasonic probe, characterized in that: include: An acoustic stack, the acoustic stack comprising an acoustic lens, a matching layer, a piezoelectric layer and a backing structure arranged in sequence, the piezoelectric layer having a piezoelectric chip that dissipates heat in a working state, and the backing structure connected to the piezoelectric layer; A housing having a cavity, wherein at least a portion of the acoustic stack is located within the cavity; in, The backing structure is manufactured by the manufacturing method according to any one of claims 1 to 15, and the three-dimensional heat-conducting path of the backing structure is thermally connected to the piezoelectric layer.

17. A backing structure, characterized in that: The backing structure is manufactured using the manufacturing method described in any one of claims 1-15.

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