Wafer cleaning tank body structure

Abstract

The invention relates to a wafer cleaning tank structure, and belongs to the technical field of wafer production equipment. According to the wafer cleaning tank body structure, the air injection tank is arranged in the overflow tank, impurities which are sprayed by the air injection tank and float on the liquid surface can be blown to the other side, the impurities floating on the treatment liquid are prevented from floating on the liquid surface all the time, the impurities can flow into the overflow tank along with water flow, and the wafer cleaning effect is improved.

Description

Technical Field

[0001] The present application belongs to the technical field of wafer production equipment, and in particular, relates to a wafer cleaning tank structure. Background Art

[0002] In the semiconductor wafer production process, it is often necessary to use a processing liquid to treat the wafer, which is often called cleaning. Tank cleaning equipment is a common wafer chemical cleaning equipment. In various common cleaning process configurations, hydrofluoric acid or various hydrofluoric acid ratios and ultrapure water to form mixed hydrofluoric acid with different relative concentrations are often used as cleaning liquids, such as HF, DHF, BOE and other diluted hydrofluoric acid solutions to clean wafers.

[0003] Common cleaning tanks include a main tank and an overflow tank. After the treatment liquid fills the main tank, it will flow out from the overflow tanks on both sides of the main tank. However, during the cleaning process, some impurity particles will float to the liquid surface. Since the treatment liquid is introduced into the main tank and flows out from both sides of the main tank, the impurities on the liquid surface, especially in the middle of the liquid surface, are difficult to flow away with the water flow, resulting in low cleanliness of the treatment liquid and poor cleaning effect. Summary of the invention

[0004] The technical problem to be solved by the present invention is to solve the deficiencies in the prior art and thus provide a wafer cleaning tank structure with better cleaning effect.

[0005] The technical solution adopted by the present invention to solve its technical problem is:

[0006] A wafer cleaning tank structure, comprising:

[0007] The main tank is used to hold wafers and can contain processing liquid to process the wafers in the main tank; the processing liquid here can be various cleaning liquids, process liquids or clean water, drying liquid;

[0008] Overflow tanks are arranged on both sides of the main tank and are used to receive the treatment liquid overflowing from the main tank;

[0009] An air jet groove is arranged in the overflow groove, and an air jet port is opened on the side wall of the main groove, and the air jet port is connected to the air jet groove. The air jet groove located on one side of the overflow groove is used to spray gas to blow impurities floating on the surface of the treatment liquid in the main groove to the other side of the overflow groove, so that the impurities flow out of the main groove through the overflow groove on the other side.

[0010] Preferably, in the wafer cleaning tank structure of the present invention, the top surface of the side wall between the main tank and the overflow tank is a slope, the top surface of the side wall is lower on the side close to the overflow tank and higher on the side close to the main tank, and the top surface of the jet tank is coplanar with the slope.

[0011] Preferably, in the wafer cleaning tank structure of the present invention, the bottom of the jet tank is connected to a vent pipe, and the vent pipe passes through the bottom of the overflow tank and is connected to an external gas generating device.

[0012] Preferably, in the wafer cleaning tank structure of the present invention, the gas injection slots are arranged in the overflow slots on both sides of the main tank, and the gas injection slots on both sides spray gas alternately, that is, the gas injection slots on both sides usually cannot spray gas at the same time.

[0013] Preferably, in the wafer cleaning tank structure of the present invention, the gas jets blow out gas obliquely upwards, aiming at the middle of the main tank and the area close to one side of the gas jet slot.

[0014] Preferably, in the wafer cleaning tank structure of the present invention, a negative pressure tank is provided outside the overflow tank, and the negative pressure tank is connected to a vacuum device so that negative pressure is maintained in the negative pressure tank to extract some gas overflowing from both sides of the main tank.

[0015] Preferably, in the wafer cleaning tank structure of the present invention, the overflow tank and the negative pressure tank extend to one side to form an extension portion, which exceeds the length of the main tank, and the extension portion is provided with an exhaust hole and an emptying port, the exhaust hole is connected to the negative pressure tank, and the emptying port is arranged at the bottom of the overflow tank, the bottom of the overflow tank is an inclined surface, and the emptying port is arranged at the lowest point of the bottom surface of the overflow tank.

[0016] Preferably, the wafer cleaning tank body structure of the present invention further comprises a liquid level tube, wherein the liquid level tube is connected to the liquid level tube connecting port at the bottom of the main tank, and a plurality of liquid level sensors are arranged on the liquid level tube to sense the liquid level in the main tank, and one end of the liquid level tube is an open port, and the height of the open port is greater than the height of the processing liquid level in the main tank, thereby ensuring that the liquid level in the liquid level tube is always at the same height as the liquid level in the main tank.

[0017] Preferably, in the wafer cleaning tank structure of the present invention, the bottom of the main tank further comprises a treatment liquid inlet and a treatment liquid outlet, the treatment liquid inlet is connected to the nozzle in the main tank, and the treatment liquid can be injected into the main tank through the treatment liquid inlet.

[0018] The beneficial effects of the present invention are:

[0019] The wafer cleaning tank structure of the present invention is provided with an air jet slot in the overflow slot. The air jetted from the air jet slot can blow the impurities floating on the liquid surface to the other side, preventing the impurities floating on the processing liquid from floating on the liquid surface all the time, so that the impurities can flow into the overflow slot with the water flow, thereby improving the wafer cleaning effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The technical solution of the present application is further described below in conjunction with the accompanying drawings and embodiments.

[0021] Figure 1 is a structural schematic diagram of a wafer cleaning tank structure according to an embodiment of the present application;

[0022] Figure 2 It is a structural schematic diagram of a wafer cleaning tank structure when a liquid level tube is provided;

[0023] Figure 3 It is a structural schematic diagram of the rear end of the wafer cleaning tank structure of an embodiment of the present application;

[0024] Figure 4 is a longitudinal cross-sectional view of the wafer cleaning tank structure of an embodiment of the present application;

[0025] Figure 5 It is a three-dimensional cross-sectional view of the wafer cleaning tank structure of an embodiment of the present application.

[0026] The reference numerals in the figure are:

[0027] 1 main slot;

[0028] 2 overflow tank;

[0029] 3 Liquid level tube;

[0030] 21 extension;

[0031] 22 overflow space;

[0032] 23 jet slots;

[0033] 24 negative pressure tank;

[0034] 110 treatment liquid inlet;

[0035] 111 treatment liquid outlet;

[0036] 112 Liquid level pipe connection port;

[0037] 211 air extraction hole;

[0038] 212 drain port;

[0039] 231 jet;

[0040] 232 Ventilation pipe. DETAILED DESCRIPTION

[0041] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application may be combined with each other.

[0042] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the scope of protection of the present application. In addition, the terms "first", "second", etc. are used only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the invention, unless otherwise specified, "multiple" means two or more.

[0043] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood by specific circumstances.

[0044] The technical solution of the present application will be described in detail below with reference to the accompanying drawings and in combination with embodiments.

[0045] Example

[0046] This embodiment provides a wafer cleaning tank structure, such as Figure 1 As shown, including:

[0047] The main tank 1 is used to accommodate wafers and can contain a processing liquid to process the wafers in the main tank 1; the processing liquid here can be various cleaning liquids, process liquids or clean water, drying liquid;

[0048] Overflow tanks 2 are arranged on both sides of the main tank 1 and are used to receive the treatment liquid overflowing from the main tank 1;

[0049] The overflow tank 2 is provided with an air jet slot 23, and the side wall of the main tank 1 is provided with an air jet port 231, which is connected to the air jet slot 23. The air jet slot 23 located on one side of the overflow tank 2 is used to eject gas to blow impurities floating on the surface of the treatment liquid in the main tank 1 to the other side of the overflow tank 2, so that the impurities flow out of the main tank 1 through the overflow tank 2 on the other side. When overflowing, the treatment liquid must pass through the overflow space 22.

[0050] The wafer cleaning tank structure of this embodiment is provided with a jet tank 23 in the overflow tank 2. The jets ejected from the jet tank 23 can blow the impurities floating on the liquid surface to the other side, preventing the impurities floating on the processing liquid from floating on the liquid surface all the time, so that the impurities can flow into the overflow tank 2 with the water flow, thereby improving the wafer cleaning effect.

[0051] Preferably, the top surface of the side wall between the main tank 1 and the overflow tank 2 is an inclined surface, the top surface of the side wall is lower on the side close to the overflow tank 2, and higher on the side close to the main tank 1, and the top surface of the jetting tank 23 is coplanar with the inclined surface, so that the treatment liquid entering the overflow tank 2 can flow down smoothly. The jetting tank 23 and the main tank 1 share the side wall of the main tank 1.

[0052] Preferably, the bottom of the jetting slot 23 is connected to a vent pipe 232, and the vent pipe 232 passes through the bottom of the overflow slot 2 and is connected to an external gas generating device. The vent pipe 232 and the bottom of the overflow slot 2 are sealed.

[0053] Preferably, the gas injection slots 23 are arranged in the overflow slots 2 on both sides of the main slot 1, and the gas injection slots 23 on both sides spray gas alternately, that is, the gas injection slots 23 on both sides usually cannot spray gas at the same time.

[0054] Preferably, if Figure 4 As shown by the dotted line, the jet port 231 blows gas obliquely upward, aiming at the middle of the main groove 1 and the area close to one side of the jet groove 23, generally located at the midline position, which is more conducive to the impurities in the middle of the main groove 1 being carried away by the water flow generated by the airflow.

[0055] Preferably, a negative pressure groove 24 is provided outside the overflow groove 2, and the negative pressure groove 24 is connected to the exhaust device to maintain negative pressure in the negative pressure groove 24, so as to extract some gas overflowing from both sides of the main groove 1. It should be noted here that the cover body will cover the main groove 1, but the cover body cannot be completely sealed, and some gas generated by the treatment liquid will overflow from both sides of the cover body, so the negative pressure groove 24 can prevent some pollutant gases from being emitted into the air.

[0056] Preferably, the overflow groove 2 and the negative pressure groove 24 extend to one side to form an extension portion 21, which exceeds the length of the main groove 1. The extension portion 21 is provided with an air suction hole 211 and an emptying port 212. The air suction hole 211 is connected to the negative pressure groove 24, and the emptying port 212 is arranged at the bottom of the overflow groove 2. The bottom of the overflow groove 2 is an inclined surface, and the emptying port 212 is arranged at the lowest point of the bottom surface of the overflow groove 2.

[0057] Preferably, the wafer cleaning tank structure also includes a liquid level tube 3, which is connected to the liquid level tube connection port 112 at the bottom of the main tank 1. A plurality of liquid level sensors are arranged on the liquid level tube 3 to sense the liquid level in the main tank 1. One end of the liquid level tube 3 is an open port, and the height of the open port is greater than the height of the processing liquid level in the main tank 1, thereby ensuring that the liquid level in the liquid level tube 3 is always at the same height as the liquid level in the main tank 1.

[0058] like Figure 3 As shown, the bottom of the main tank 1 also has a treatment liquid inlet 110 and a treatment liquid outlet 111 . The treatment liquid inlet 110 is connected to the nozzle in the main tank 1 , and the treatment liquid can be injected into the main tank 1 through the treatment liquid inlet 110 .

[0059] It should be noted that, in order to prevent the processing liquid from entering the gas injection slot 23 , the gas injection slot 23 is in a state of ejecting gas when the processing liquid is added to the main tank 1 .

[0060] Based on the above ideal embodiments of this application, the relevant staff can make various changes and modifications without departing from the technical concept of this application through the above description. The technical scope of this application is not limited to the content in the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A wafer cleaning tank structure, characterized in that: include: A main tank (1) is used to accommodate wafers and can contain a processing liquid to process the wafers in the main tank (1); The treatment liquid here can be various cleaning liquids, process liquids or clean water, drying liquid; Overflow troughs (2) are arranged on both sides of the main trough (1) and are used to receive the treatment liquid overflowing from the main trough (1); An air jet groove (23) is arranged in the overflow groove (2), and an air jet port (231) is opened on the side wall of the main groove (1). The air jet port (231) is connected to the air jet groove (23). The air jet groove (23) located on one side of the overflow groove (2) is used to eject gas to blow impurities floating on the surface of the treatment liquid in the main groove (1) to the other side of the overflow groove (2), so that the impurities flow out of the main groove (1) through the overflow groove (2) on the other side.

2. The wafer cleaning tank structure according to claim 1, characterized in that: The top surface of the side wall between the main groove (1) and the overflow groove (2) is an inclined surface, the top surface of the side wall is lower on the side close to the overflow groove (2) and higher on the side close to the main groove (1), and the top surface of the air jet groove (23) is coplanar with the inclined surface.

3. The wafer cleaning tank structure according to claim 1, characterized in that: The bottom of the jet groove (23) is connected to a vent pipe (232), and the vent pipe (232) passes through the bottom of the overflow groove (2) and is connected to an external gas generating device.

4. The wafer cleaning tank structure according to claim 1, characterized in that: The gas injection slots (23) are arranged in the overflow slots (2) on both sides of the main slot (1), and the gas injection slots (23) on both sides spray gas alternately, that is, the gas injection slots (23) on both sides usually cannot spray gas at the same time.

5. The wafer cleaning tank structure according to claim 1, characterized in that: The gas jet (231) blows out gas obliquely upward, aiming at the middle of the main slot (1) and the area close to one side of the gas jet slot (23).

6. The wafer cleaning tank structure according to claim 1, characterized in that: A negative pressure groove (24) is arranged outside the overflow groove (2), and the negative pressure groove (24) is connected to a gas extraction device so that negative pressure is maintained in the negative pressure groove (24) to extract some gas overflowing from both sides of the main groove (1).

7. The wafer cleaning tank structure according to claim 1, characterized in that: The overflow groove (2) and the negative pressure groove (24) extend to one side to form an extension portion, which exceeds the length of the main groove (1); the extension portion is provided with an air suction hole (211) and an emptying port (212); the air suction hole (211) is connected to the negative pressure groove (24); the emptying port (212) is arranged at the bottom of the overflow groove (2); the bottom of the overflow groove (2) is an inclined surface; the emptying port (212) is arranged at the lowest point of the bottom surface of the overflow groove (2).

8. The wafer cleaning tank structure according to claim 1, characterized in that: The wafer cleaning tank structure also includes a liquid level tube (3), which is connected to a liquid level tube connection port (112) at the bottom of the main tank (1). A plurality of liquid level sensors are arranged on the liquid level tube (3) to sense the liquid level in the main tank (1). One end of the liquid level tube (3) is an open port, and the height of the open port is greater than the height of the processing liquid level in the main tank (1), thereby ensuring that the liquid level in the liquid level tube (3) is always at the same height as the liquid level in the main tank (1).

9. The wafer cleaning tank structure according to claim 1, characterized in that: The bottom of the main tank (1) is also provided with a treatment liquid inlet (110) and a treatment liquid outlet (111); the treatment liquid inlet (110) is connected to a nozzle in the main tank (1); and the treatment liquid can be injected into the main tank (1) through the treatment liquid inlet (110).

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