Semiconductor silicon wafer outer edge R angle chamfering device

Abstract

The invention relates to the technical field of silicon wafer production devices, in particular to a semiconductor silicon wafer outer edge R angle chamfering device which comprises a supporting seat, a moving structure, a placing structure, a fixing structure, a positioning structure, a blocking structure, a blow-drying structure, an angle lapping structure, a cooling structure, a protective cover, a positioning column, a nut and a water storage box. After the silicon wafer is placed on the placing structure, the fixing structure can move towards the silicon wafer, the blocking structure can drive the positioning structure to position the silicon wafer in the process that the fixing structure moves towards the silicon wafer, and after the silicon wafer is chamfered, the fixing structure can continue to move to fix the other side of the silicon wafer. According to the chamfering device for the silicon wafer, the silicon wafer can be fixed more firmly, the silicon wafer is prevented from moving in the chamfering process, the chamfering stability is effectively improved, water on the surface of the silicon wafer can be automatically dried through the blow-drying structure after chamfering is finished, manual wiping is avoided, and therefore the use convenience is improved.

Description

Technical Field

[0001] The invention relates to the technical field of silicon wafer production devices, in particular to a semiconductor silicon wafer outer edge R corner chamfering device. Background Art

[0002] Semiconductor silicon wafers, also known as silicon chips or wafers, are thin slices or round pieces made of high-purity single crystal silicon, usually used to manufacture integrated circuits (ICs) and other electronic components. Silicon wafers need to be chamfered during the production process. Chamfering the edges of silicon wafers can reduce the number, size and distribution of edge particles / traces, reduce stress concentration at the edges of silicon wafers, avoid edge cracks and chip device breakage, thereby improving the reliability of the chip.

[0003] However, when chamfering the silicon wafer, the traditional semiconductor silicon wafer is placed on a metal tray, and then the semiconductor silicon wafer is adsorbed on the tray by negative pressure to fix the semiconductor silicon wafer. When there is dust or water on the semiconductor silicon wafer and the metal tray, the fixation by negative pressure is prone to loose fixation, which will cause the silicon wafer to move during the chamfering process. Therefore, the fixation stability is poor. In the chamfering process, cooling water will flow through the chamfered part to cool the silicon wafer. The cooling water will flow on the surface of the silicon wafer during the chamfering process, so that more water will gather on the surface of the silicon wafer after the chamfering is completed. Therefore, when removing the silicon wafer, in order to avoid water on the surface of the silicon wafer dripping everywhere, the water on the silicon wafer needs to be wiped, resulting in poor operation convenience. Summary of the invention

[0004] In view of the problems in the prior art, the present invention provides a device for chamfering the outer edge R corner of a semiconductor silicon wafer.

[0005] The technical solution adopted by the present invention to solve its technical problem is: a semiconductor silicon wafer outer edge R corner chamfering device, including a support seat, a moving structure is provided on the support seat, a placing structure is provided on the moving structure, a fixed structure is provided on the placing structure, a positioning structure is provided on the fixed structure, a resisting structure is provided on the fixed structure, a drying structure is provided on the placing structure, an angle grinding structure is provided on the support seat, a cooling structure is provided on the support seat, a plurality of positioning columns are fixedly connected to the support seat, a plurality of positioning columns pass through the same protective cover, a nut is threadedly connected to the positioning column, the nut conflicts with the protective cover, and a water storage box is placed on the support seat;

[0006] The fixing structure includes a connecting cylinder and a first guide groove, the placing structure is connected to the connecting cylinder, the connecting cylinder is provided with a first guide groove, the interior of the connecting cylinder is slidably connected to a rotating cylinder, the rotating cylinder is fixedly connected to a first guide shaft, the first guide shaft extends to the interior of the first guide groove and is slidably connected to the connecting cylinder, the interior of the rotating cylinder is rotatably connected to a rotating block, the bottom end of the rotating block is fixedly connected to a second electric push rod, the top end of the rotating cylinder is fixedly connected to a connecting rod, one end of the connecting rod is fixedly connected to a connecting disk, and the connecting disk is rotatably connected to a pressing sleeve.

[0007] Specifically, both ends of the first guide groove are in a vertical structure, the middle portion of the first guide groove is in a spiral structure, and the cross-section of the connecting rod is in an L-shaped structure.

[0008] Specifically, the movable structure includes a slide rail and a first electric push rod. The support seat is fixedly connected to the slide rail, the first electric push rod is installed on the slide rail, the slide rail is slidably connected to a slide rod, and one end of the first electric push rod is fixedly connected to the slide rod.

[0009] Specifically, the placement structure includes a connecting sleeve and a tray, one end of the sliding rod is fixedly connected to the connecting sleeve, the tray is rotatably connected to the connecting sleeve, a first connecting tube is fixedly connected to the tray, the first connecting tube is rotatably connected to the second connecting tube, a first air pipe joint is installed at the bottom end of the second connecting tube, and the second connecting tube is fixedly connected to the connecting sleeve.

[0010] Specifically, the connecting sleeve is fixedly connected to a tow rod, a first motor is installed on the tow rod, a first synchronous wheel is fixedly connected to the output shaft of the first motor, a second synchronous wheel is fixedly connected to the tray, a synchronous belt is wound between the first synchronous wheel and the second synchronous wheel, a second electric push rod is installed on the tow rod, and a connecting tube is fixedly connected to the tow rod.

[0011] Specifically, the positioning structure includes a slider and a positioning shaft, three sliders are slidably connected to the connecting disk, a positioning shaft is fixedly connected to the slider, a first spring is fixedly connected between the slider and the connecting disk, a second guide shaft is fixedly connected to the slider, a turntable is rotatably connected to the connecting rod, a second guide groove is provided on the turntable, one end of the second guide shaft extends to the interior of the adjacent second guide groove and is slidably connected to the turntable, and the three positioning shafts are distributed in a circular array about the middle of the connecting disk.

[0012] Specifically, the resisting structure includes a slide and a block, the slide is fixedly connected to the connecting tube, the block is slidably connected to the slide, a second spring is fixedly connected between the block and the slide, and a rotating wheel is rotatably connected to one of the slide blocks.

[0013] Specifically, the drying structure includes a support plate and a third connecting pipe, the support plate is fixedly connected to the drag rod, the third connecting pipe is fixedly connected to the support plate, a plurality of nozzles are installed on the third connecting pipe, and a second air pipe joint is installed at the bottom end of the third connecting pipe.

[0014] Specifically, the angle grinding structure includes a connecting seat and a second motor, the connecting seat is fixedly connected to the support seat, the second motor is installed on the connecting seat, the connecting seat is rotatably connected to a rotating shaft, the output shaft of the second motor is fixedly connected to the rotating shaft, an angle grinding disk is clamped on the rotating shaft, a bolt is threadedly connected to the rotating shaft, and a pressure plate is abutted between the bolt and the angle grinding disk.

[0015] Specifically, the cooling structure includes a support plate and a bamboo tube, the support seat is fixedly connected to the support plate, the support plate is fixedly connected to the bamboo tube, one end of the bamboo tube is installed with a water spray head, and the other end of the bamboo tube is installed with a water pipe joint.

[0016] The beneficial effects of the present invention are:

[0017] (1) The semiconductor silicon wafer outer edge R corner chamfering device described in the present invention can place the silicon wafer on the placement structure for placement during chamfering. After the silicon wafer is placed, the fixed structure can move toward the silicon wafer. During the movement of the fixed structure toward the silicon wafer, the resisting structure will drive the positioning structure to position the silicon wafer, so that the position of the silicon wafer before chamfering remains unchanged, avoiding the position of the silicon wafer to shift and affect the quality of chamfering. After the chamfering of the silicon wafer is completed, one side of the silicon wafer can be fixed by the placement structure, and then the fixed structure will continue to move to fix the other side of the silicon wafer, thereby achieving a more secure fixation of the silicon wafer, avoiding the movement of the silicon wafer during the chamfering process, and effectively improving the stability of the chamfering.

[0018] (2) The semiconductor silicon wafer outer edge R corner chamfering device described in the present invention can drive the placement structure to move toward the grinding structure through the moving structure after the silicon wafer is fixed, so that the silicon wafer contacts the grinding structure, and then the silicon wafer can be chamfered by the grinding structure. During the chamfering process, the chamfered part can be cooled by the cooling structure, so as to avoid the silicon wafer being damaged by frictional heat, thereby improving the safety of chamfering.

[0019] (3) The semiconductor silicon wafer outer edge R corner chamfering device described in the present invention can not only fix the silicon wafer through the fixing structure during the chamfering process, but also can shield the parts of the silicon wafer that do not need to be chamfered, thereby preventing water from flowing to the surface of the silicon wafer over a large area. When the chamfering is completed, the water on the surface of the silicon wafer can be automatically blown dry through the blowing structure, thereby avoiding the need for manual wiping, thereby improving the convenience of use. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0021] Figure 1 A schematic diagram of the overall structure of a preferred embodiment of the semiconductor silicon wafer outer edge R corner chamfering device provided by the present invention;

[0022] Figure 2 for Figure 1 An enlarged schematic diagram of part A is shown;

[0023] Figure 3 It is a schematic diagram of the connection structure between the slide rail and the first electric push rod of the present invention;

[0024] Figure 4 for Figure 3 An enlarged schematic diagram of part B is shown;

[0025] Figure 5 for Figure 4 An enlarged schematic diagram of part C is shown;

[0026] Figure 6 It is a schematic diagram of the connection structure between the third connecting pipe and the spray head of the present invention;

[0027] Figure 7 It is a schematic diagram of the connection structure between the connection sleeve and the tray of the present invention;

[0028] Figure 8 It is a structural schematic diagram of the rotating shaft of the present invention.

[0029] In the figure: 1, support seat; 2, moving structure; 201, slide rail; 202, first electric push rod; 203, slide rod; 3, placement structure; 301, connecting sleeve; 302, tray; 303, first connecting pipe; 304, second connecting pipe; 305, first air pipe joint; 306, drag rod; 307, first motor; 308, first synchronous wheel; 309, synchronous belt; 310, second synchronous wheel; 4, fixed structure; 401, connecting cylinder; 402, first guide groove; 403, first guide shaft; 404, rotating cylinder; 405, rotating block; 406, second electric push rod; 407, connecting rod; 408, connecting plate; 409, pressing sleeve; 5, positioning structure; 501, slider; 502, Positioning shaft; 503, first spring; 504, second guide shaft; 505, second guide groove; 506, turntable; 6, resisting structure; 601, slide seat; 602, block; 603, second spring; 604, rotating wheel; 7, drying structure; 701, support plate; 702, third connecting pipe; 703, jet nozzle; 704, second air pipe joint; 8, grinding structure; 801, connecting seat; 802, second motor; 803, rotating shaft; 804, grinding disk; 805, bolt; 806, pressing sheet; 9, cooling structure; 901, supporting plate; 902, bamboo tube; 903, water spray head; 904, water pipe joint; 10, protective cover; 11, positioning column; 12, nut; 13, water storage box. DETAILED DESCRIPTION

[0030] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below in conjunction with specific implementation methods.

[0031] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 As shown, the semiconductor silicon wafer outer edge R angle chamfering device described in the present invention comprises a support seat 1, a moving structure 2 is provided on the support seat 1, a placing structure 3 is provided on the moving structure 2, a fixed structure 4 is provided on the placing structure 3, a positioning structure 5 is provided on the fixed structure 4, a resisting structure 6 is provided on the fixed structure 4, a drying structure 7 is provided on the placing structure 3, an angle grinding structure 8 is provided on the support seat 1, a cooling structure 9 is provided on the support seat 1, a plurality of positioning columns 11 are fixedly connected to the support seat 1, a plurality of the positioning columns 11 pass through the same protective cover 10, a nut 12 is threadedly connected to the positioning column 11, the nut 12 is in conflict with the protective cover 10, and a water storage box 13 is placed on the support seat 1;

[0032] like Figure 1 , Figure 2 , Figure 3, Figure 4 , Figure 5 , Figure 6 and Figure 7As shown, the fixed structure 4 includes a connecting cylinder 401 and a first guide groove 402, the placement structure 3 is connected to the connecting cylinder 401, the connecting cylinder 401 is provided with a first guide groove 402, the interior of the connecting cylinder 401 is slidably connected to a rotating cylinder 404, the rotating cylinder 404 is fixedly connected to a first guide shaft 403, the first guide shaft 403 extends to the interior of the first guide groove 402 and is slidably connected to the connecting cylinder 401, the interior of the rotating cylinder 404 is rotatably connected to a rotating block 405, the bottom end of the rotating block 405 is fixedly connected to a second electric push rod 406, the top of the rotating cylinder 404 is fixedly connected to a connecting rod 407, one end of the connecting rod 407 is fixedly connected to a connecting disk 408, the connecting The receiving plate 408 is rotatably connected with a pressing sleeve 409, the two ends of the first guide groove 402 are vertical structures, the middle part of the first guide groove 402 is a spiral structure, the cross-section of the connecting rod 407 is an L-shaped structure, the placement structure 3 includes a connecting sleeve 301 and a tray 302, one end of the sliding rod 203 is fixedly connected with the connecting sleeve 301, the connecting sleeve 301 is rotatably connected with the tray 302, the tray 302 is fixedly connected with a first connecting pipe 303, the first connecting pipe 303 is rotatably connected with a second connecting pipe 304, the bottom end of the second connecting pipe 304 is installed with a first air pipe joint 305, the second connecting pipe 304 is fixedly connected to the connecting sleeve 301, and the connecting sleeve 301 is fixedly connected with the tray 302. A tow bar 306 is connected, a first motor 307 is installed on the tow bar 306, a first synchronous wheel 308 is fixedly connected to the output shaft of the first motor 307, a second synchronous wheel 310 is fixedly connected to the tray 302, a synchronous belt 309 is wound between the first synchronous wheel 308 and the second synchronous wheel 310, a second electric push rod 406 is installed on the tow bar 306, a connecting tube 401 is fixedly connected to the tow bar 306, the positioning structure 5 includes a slider 501 and a positioning shaft 502, three sliders 501 are slidably connected to the connecting disk 408, the slider 501 is fixedly connected to the positioning shaft 502, a first spring 503 is fixedly connected between the slider 501 and the connecting disk 408, and the The slider 501 is fixedly connected with a second guide shaft 504, the connecting rod 407 is rotatably connected with a turntable 506, the turntable 506 is provided with a second guide groove 505, one end of the second guide shaft 504 extends to the inside of the adjacent second guide groove 505 and is slidably connected with the turntable 506, the three positioning shafts 502 are distributed in a circular array about the middle of the connecting disk 408, the resisting structure 6 includes a slide 601 and a block 602, the connecting cylinder 401 is fixedly connected with a slide 601, the slide 601 is slidably connected with a block 602, a second spring 603 is fixedly connected between the block 602 and the slide 601, one of the sliders 501 is rotatably connected with a rotating wheel 604,That is, when the silicon wafer needs to be chamfered, the silicon wafer can be placed on the tray 302. During the placement of the silicon wafer, the pressing sleeve 409 deviates from the top of the tray 302, so that the space around the tray 302 can be enlarged, thereby facilitating the placement of the silicon wafer. After the silicon wafer is placed, the second electric push rod 406 can be started, and the second electric push rod 406 extends to drive the rotating block 405 to move, and the rotating block 405 drives the rotating drum 404 to move. The movement of the rotating drum 404 will drive the first guide shaft 403 to move inside the first guide groove 402. When the first guide shaft 403 moves at the spiral position in the middle of the first guide groove 402, the rotating drum 404 will rotate, and the rotation of the rotating drum 404 will drive the connecting rod 407 to move. 07 will drive the connecting plate 408 and the pressing sleeve 409 to move toward the tray 302. When the pressing sleeve 409 is located directly above the tray 302, the first guide shaft 403 will move to the vertical position at the bottom end of the first guide groove 402. At this time, the rotating drum 404 cannot rotate. Then, as the rotating drum 404 continues to move, the rotating wheel 604 will contact the stopper 602. At this time, under the resistance of the stopper 602, one of the sliders 501 will slide on the connecting plate 408, and one of the first springs 503 will contract. The movement of one of the sliders 501 will drive one of the second guide shafts 504 to move inside one of the second guide grooves 505. At the same time, the rotating disk 506 The rotating disk 506 will rotate, and the other two second guide grooves 505 will be driven to move during the rotation, so that the three second guide grooves 505 will move at the same time. The simultaneous movement of the three second guide grooves 505 will cause the three sliders 501 to move at the same time. The simultaneous movement of the three sliders 501 will cause the three positioning shafts 502 to move toward the silicon wafer at the same time. When the three positioning shafts 502 collide with the silicon wafer at the same time, the positioning of the silicon wafer is achieved, ensuring that the position of the silicon wafer remains unchanged before each chamfering, avoiding the position shift of the silicon wafer and affecting the quality of the chamfering. When the three positioning shafts 502 collide with the silicon wafer at the same time, the slider 501 cannot move. At this time, the stopper 602 will slide a short distance on the slide seat 601, and the second spring 603 will contract, so as to avoid It avoids the occurrence of stuck situations, and improves the stability of use. As the connection disk 408 continues to move, the rotating wheel 604 will be separated from the stopper 602. When the rotating wheel 604 and the stopper 602 are separated, the three positioning shafts 502 will not contact the silicon wafer under the action of the first spring 503. Then, the tray 302 and the groove inside the silicon wafer can be evacuated by the positive air pump, thereby generating negative pressure to make one side of the silicon wafer stick to the tray 302. Then, as the connection disk 408 continues to move, the pressing sleeve 409 will conflict with the other side of the silicon wafer, thereby fixing the other side of the silicon wafer. Therefore, the silicon wafer can be fixed more firmly, avoiding the movement of the silicon wafer during the chamfering process, thereby improving the stability of the chamfering.

[0033] Specifically, Figure 1 , Figure 3 , Figure 4 and Figure 8 As shown, the angle grinding structure 8 includes a connecting seat 801 and a second motor 802, the connecting seat 801 is fixedly connected to the support seat 1, the second motor 802 is installed on the connecting seat 801, the connecting seat 801 is rotatably connected with a rotating shaft 803, the output shaft of the second motor 802 is fixedly connected to the rotating shaft 803, a grinding disc 804 is engaged on the rotating shaft 803, a bolt 805 is threadedly connected to the rotating shaft 803, a pressing sheet 806 is abutted between the bolt 805 and the grinding disc 804, the cooling structure 9 includes a supporting plate 901 and a bamboo tube 902, the supporting plate 901 is fixedly connected to the support seat 1, the supporting plate 901 A bamboo tube 902 is fixedly connected to the support seat 1, a water spray head 903 is installed at one end of the bamboo tube 902, and a water pipe joint 904 is installed at the other end of the bamboo tube 902. The mobile structure 2 includes a slide rail 201 and a first electric push rod 202. The support seat 1 is fixedly connected to the slide rail 201, and the first electric push rod 202 is installed on the slide rail 201. A slide rod 203 is slidably connected to the slide rail 201, and one end of the first electric push rod 202 is fixedly connected to the slide rod 203, that is, when the silicon wafer is fixed, the first electric push rod 202 can be started, and the first electric push rod 202 can shrink to drive the slide rod 203 to slide on the slide rail 201, and the slide rod 203 can slide on the slide rail 201. 03 movement drives the connecting sleeve 301 to move, and the silicon wafer will move toward the angle grinding disk 804 together with the connecting sleeve 301. When the silicon wafer contacts the angle grinding disk 804, the second motor 802 can be started, and the output shaft of the second motor 802 rotates to drive the rotating shaft 803 to rotate, and the rotation of the rotating shaft 803 drives the angle grinding disk 804 to rotate. When the angle grinding disk 804 rotates, the first motor 307 can be started, and the output shaft of the first motor 307 rotates the first synchronous wheel 308 to rotate. The first synchronous wheel 308 drives the second synchronous wheel 310 to rotate through the synchronous belt 309, and the second synchronous wheel 310 drives the tray 302 to rotate. The rotation of the tray 302 drives the silicon wafer to rotate. During the rotation of the sheet, its edge will rub against the grinding disk 804, thereby chamfering the silicon wafer. During the chamfering process, cooling water can enter the interior of the bamboo tube 902 from the water pipe joint 904, and finally the water will flow out from the water nozzle 903. The cooling water flowing through the chamfered part can cool the chamfered part, avoiding damage to the silicon wafer due to excessive temperature during chamfering, thereby effectively improving the safety during chamfering. Finally, the water will flow into the water storage box 13 for collection, thereby avoiding the cooling water from flowing everywhere. The grinding disk 804 can be shielded to a certain extent by the protective cover 10, avoiding the rotating grinding disk 804 from hurting people, thereby improving the safety of use.

[0034] Specifically, Figure 1 and Figure 6 As shown, the drying structure 7 includes a support plate 701 and a third connecting pipe 702, the support plate 701 is fixedly connected to the drag rod 306, the third connecting pipe 702 is fixedly connected to the support plate 701, a plurality of nozzles 703 are installed on the third connecting pipe 702, and a second air pipe joint 704 is installed at the bottom end of the third connecting pipe 702, that is: during the chamfering process, the pressing sleeve 409 will rotate together with the silicon wafer, and the pressing sleeve 409 can not only fix the silicon wafer, but also shield the parts of the silicon wafer that do not need to be chamfered, thereby avoiding water from flowing to the surface of the silicon wafer over a large area, and when the chamfering is completed, high-pressure gas can be sprayed from the two nozzles 703, so that the water on the surface of the silicon wafer can be dried, avoiding the need for manual wiping, thereby effectively improving the convenience of use.

[0035] When the present invention is in use, the cooling water pipe can be connected to the water pipe joint 904, the vacuum pump's exhaust pipe can be connected to the first air pipe joint 305, and the air pump's blowing pipe can be connected to the second air pipe joint 704. When the silicon wafer needs to be chamfered, the silicon wafer can be placed on the tray 302. During the placement of the silicon wafer, the pressing sleeve 409 deviates from the top of the tray 302, so that the space around the tray 302 can be enlarged, thereby facilitating the placement of the silicon wafer. After the silicon wafer is placed, the second electric push rod 406 can be started, and the second electric push rod 406 extends to drive the rotating block 405 to move, and the rotating block 405 drives the rotating drum 404 to move. The movement of the rotating drum 404 will drive the first guide shaft 403 to move in the first The first guide shaft 403 moves in the middle spiral position of the first guide groove 402 to make the drum 404 rotate. The rotation of the drum 404 drives the connecting rod 407 to move. The connecting rod 407 drives the connecting disk 408 and the pressing sleeve 409 to move toward the tray 302. When the pressing sleeve 409 is located directly above the tray 302, the first guide shaft 403 moves to the vertical position at the bottom end of the first guide groove 402. At this time, the drum 404 cannot rotate. Then, as the drum 404 continues to move, the rotating wheel 604 contacts the stopper 602. At this time, under the resistance of the stopper 602, one of the sliders 501 slides on the connecting disk 408, one of the first springs 503 contracts, and one of the sliders 501 moves. It will drive one of the second guide shafts 504 to move inside one of the second guide grooves 505. When one of the second guide shafts 504 moves inside one of the second guide grooves 505, the turntable 506 will rotate. During the rotation of the turntable 506, the other two second guide grooves 505 will be driven to move, so that the three second guide grooves 505 move at the same time. The simultaneous movement of the three second guide grooves 505 will cause the three sliders 501 to move at the same time. The simultaneous movement of the three sliders 501 will cause the three positioning shafts 502 to move toward the silicon wafer at the same time. When the three positioning shafts 502 collide with the silicon wafer at the same time, the positioning of the silicon wafer is achieved, ensuring that the position of the silicon wafer remains unchanged before each chamfering, and avoiding the position shift of the silicon wafer affecting the chamfering quality. When the three positioning shafts 502 collide with the silicon wafer at the same time, the slider 501 cannot move. At this time, the block 602 will slide a short distance on the slide seat 601, and the second spring 603 will contract, thereby avoiding the occurrence of jamming and improving the stability of use. As the connecting disk 408 continues to move, the rotating wheel 604 will disengage from the block 602. When the rotating wheel 604 and the block 602 are disengaged, the three positioning shafts 502 will not contact the silicon wafer under the action of the first spring 503. Then, the tray 302 and the groove inside the silicon wafer can be evacuated through the positive air pump, thereby generating negative pressure to make one side of the silicon wafer stick to the tray 302. Then, as the connecting disk 408 continues to move, the pressing sleeve 409 will collide with the other side of the silicon wafer.Thereby, the other side of the silicon wafer is fixed, so the silicon wafer can be fixed more firmly, and the movement of the silicon wafer during the chamfering process is avoided, thereby improving the stability of the chamfering;

[0036] When the silicon wafer is fixed, the first electric push rod 202 can be started. The first electric push rod 202 contracts and drives the slide bar 203 to slide on the slide rail 201. The movement of the slide bar 203 drives the connecting sleeve 301 to move. The silicon wafer will move toward the angle grinding disk 804 together with the connecting sleeve 301. When the silicon wafer contacts the angle grinding disk 804, the second motor 802 can be started. The output shaft of the second motor 802 rotates to drive the rotating shaft 803 to rotate. The rotation of the rotating shaft 803 drives the angle grinding disk 804 to rotate. When the angle grinding disk 804 rotates, the first motor 307 can be started. The output shaft of the first motor 307 rotates the first synchronous wheel 308 to rotate. The first synchronous wheel 308 drives the second synchronous wheel 310 to rotate through the synchronous belt 309. The tray 302 is driven to rotate, and the rotation of the tray 302 will drive the silicon wafer to rotate. During the rotation, the edge of the silicon wafer will rub against the grinding disk 804, thereby realizing the chamfering of the silicon wafer. During the chamfering process, cooling water can enter the inside of the bamboo tube 902 from the water pipe joint 904, and finally the water will flow out from the water nozzle 903. The cooling water flowing through the chamfered part can cool the chamfered part, avoiding damage to the silicon wafer due to excessive temperature during chamfering, thereby effectively improving the safety during chamfering. Finally, the water will flow into the water storage box 13 for collection, thereby avoiding the cooling water from flowing everywhere. The grinding disk 804 can be shielded to a certain extent by the protective cover 10, avoiding the rotating grinding disk 804 from hurting people, thereby improving the safety of use.

[0037] During the chamfering process, the pressing sleeve 409 will rotate together with the silicon wafer. The pressing sleeve 409 can not only fix the silicon wafer, but also shield the parts of the silicon wafer that do not need to be chamfered, thereby preventing water from flowing to the surface of the silicon wafer over a large area. When the chamfering is completed, high-pressure gas can enter the interior of the third connecting pipe 702 from the second air pipe joint 704 and finally be sprayed out from the two nozzles 703, so that the water on the surface of the silicon wafer can be automatically dried, avoiding the need for manual wiping, thereby effectively improving the convenience of use.

[0038] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

[0039] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A device for chamfering the outer edge of a semiconductor silicon wafer, characterized in that: The invention comprises a support base (1), wherein a movable structure (2) is provided on the support base (1), a placement structure (3) is provided on the movable structure (2), a fixed structure (4) is provided on the placement structure (3), a positioning structure (5) is provided on the fixed structure (4), a resisting structure (6) is provided on the fixed structure (4), a drying structure (7) is provided on the placement structure (3), an angle grinding structure (8) is provided on the support base (1), a cooling structure (9) is provided on the support base (1), a plurality of positioning columns (11) are fixedly connected to the support base (1), the plurality of positioning columns (11) pass through the same protective cover (10), a nut (12) is threadedly connected to the positioning column (11), the nut (12) and the protective cover (10) are in contact with each other, and a water storage box (13) is placed on the support base (1); The fixed structure (4) comprises a connecting cylinder (401) and a first guide groove (402); the placement structure (3) is connected to the connecting cylinder (401); the connecting cylinder (401) is provided with a first guide groove (402); the interior of the connecting cylinder (401) is slidably connected to a rotating cylinder (404); the rotating cylinder (404) is fixedly connected to a first guide shaft (403); the first guide shaft (403) extends to the interior of the first guide groove (402) and is slidably connected to the connecting cylinder (401); the interior of the rotating cylinder (404) is rotatably connected to a rotating block (405); the bottom end of the rotating block (405) is fixedly connected to a second electric push rod (406); the top end of the rotating cylinder (404) is fixedly connected to a connecting rod (407); one end of the connecting rod (407) is fixedly connected to a connecting disk (408); the connecting disk (408) is rotatably connected to a pressing sleeve (409).

2. The semiconductor silicon wafer outer edge R corner chamfering device according to claim 1, characterized in that: Both ends of the first guide groove (402) are in a vertical structure, the middle portion of the first guide groove (402) is in a spiral structure, and the cross-section of the connecting rod (407) is in an L-shaped structure.

3. The semiconductor silicon wafer outer edge R corner chamfering device according to claim 1, characterized in that: The movable structure (2) comprises a slide rail (201) and a first electric push rod (202); the support seat (1) is fixedly connected to the slide rail (201); the first electric push rod (202) is mounted on the slide rail (201); a slide rod (203) is slidably connected to the slide rail (201); one end of the first electric push rod (202) is fixedly connected to the slide rod (203).

4. The semiconductor silicon wafer outer edge R corner chamfering device according to claim 3, characterized in that: The placement structure (3) comprises a connecting sleeve (301) and a tray (302); one end of the sliding rod (203) is fixedly connected to the connecting sleeve (301); the tray (302) is rotatably connected to the connecting sleeve (301); a first connecting pipe (303) is fixedly connected to the tray (302); the first connecting pipe (303) is rotatably connected to the second connecting pipe (304); a first air pipe joint (305) is installed at the bottom end of the second connecting pipe (304); and the second connecting pipe (304) is fixedly connected to the connecting sleeve (301).

5. The semiconductor silicon wafer outer edge R corner chamfering device according to claim 4, characterized in that: The connecting sleeve (301) is fixedly connected to a towing rod (306), a first motor (307) is installed on the towing rod (306), a first synchronous wheel (308) is fixedly connected to the output shaft of the first motor (307), a second synchronous wheel (310) is fixedly connected to the tray (302), a synchronous belt (309) is wound between the first synchronous wheel (308) and the second synchronous wheel (310), a second electric push rod (406) is installed on the towing rod (306), and a connecting tube (401) is fixedly connected to the towing rod (306).

6. The semiconductor silicon wafer outer edge R corner chamfering device according to claim 5, characterized in that: The positioning structure (5) comprises a slider (501) and a positioning shaft (502); three sliders (501) are slidably connected to the connecting disk (408); the slider (501) is fixedly connected to the positioning shaft (502); a first spring (503) is fixedly connected between the slider (501) and the connecting disk (408); a second guide shaft (504) is fixedly connected to the slider (501); a rotating disk (506) is rotatably connected to the connecting rod (407); a second guide groove (505) is provided on the rotating disk (506); one end of the second guide shaft (504) extends to the inside of an adjacent second guide groove (505) and is slidably connected to the rotating disk (506); and the three positioning shafts (502) are distributed in a circular array about the middle of the connecting disk (408).

7. The semiconductor silicon wafer outer edge R corner chamfering device according to claim 6, characterized in that: The resisting structure (6) comprises a sliding seat (601) and a stopper (602); the sliding seat (601) is fixedly connected to the connecting tube (401); the stopper (602) is slidably connected to the sliding seat (601); a second spring (603) is fixedly connected between the stopper (602) and the sliding seat (601); and a rotating wheel (604) is rotatably connected to one of the sliding blocks (501).

8. The semiconductor silicon wafer outer edge R corner chamfering device according to claim 5, characterized in that: The drying structure (7) comprises a support plate (701) and a third connecting pipe (702); the support plate (701) is fixedly connected to the drag rod (306); the third connecting pipe (702) is fixedly connected to the support plate (701); a plurality of spray nozzles (703) are installed on the third connecting pipe (702); and a second air pipe joint (704) is installed at the bottom end of the third connecting pipe (702).

9. The semiconductor silicon wafer outer edge R corner chamfering device according to claim 1, characterized in that: The angle grinding structure (8) comprises a connecting seat (801) and a second motor (802); the connecting seat (801) is fixedly connected to the supporting seat (1); the second motor (802) is mounted on the connecting seat (801); a rotating shaft (803) is rotatably connected to the connecting seat (801); an output shaft of the second motor (802) is fixedly connected to the rotating shaft (803); an angle grinding disc (804) is engaged with the rotating shaft (803); a bolt (805) is threadedly connected to the rotating shaft (803); a pressing sheet (806) abuts against the bolt (805) and the angle grinding disc (804).

10. The semiconductor silicon wafer outer edge R corner chamfering device according to claim 1, characterized in that: The cooling structure (9) comprises a support plate (901) and a bamboo tube (902); the support base (1) is fixedly connected to the support plate (901); the support plate (901) is fixedly connected to the bamboo tube (902); a water spray head (903) is installed at one end of the bamboo tube (902); and a water pipe joint (904) is installed at the other end of the bamboo tube (902).

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