Method for processing substrate with boss array and substrate

Abstract

The invention discloses a method for processing a substrate with a boss array, which belongs to the technical field of material processing, and comprises the following steps: S1, preparing a substrate I, and cutting a groove I with a certain depth and width in the substrate I by using a grinding wheel blade I along a direction I, a second grinding wheel blade with the selected thickness 2 is used for cutting a second groove with the same depth but different widths in the second direction, and a second base plate with a boss is formed on the first base plate; s2, the top face of the boss is coated with a binding material; s3, a third substrate is prepared, and the second substrate and the third substrate are bonded together according to the bonding process conditions of the used bonding material; s4, the surface of the second substrate is removed through a plane grinding wheel until the bosses are exposed and reach the required boss height, and a fourth substrate with a boss array is formed. And the substrate with the specific boss structure, which cannot be realized by singly scribing the grinding wheel blade, is formed.

Description

Technical Field

[0001] The invention belongs to the technical field of material processing, and in particular relates to a method for processing a substrate with a boss array and the substrate. Background Art

[0002] The boss structure is widely used in electronic packaging bases (such as ceramic bases). Grooves of required depth and width are cut on the base by a grinding wheel blade at different angles to form boss arrays of different sizes and spacings.

[0003] The method of simply using a grinding wheel blade to scratch a boss array on a flat substrate at different angles cannot form the following boss structures with specific shape requirements:

[0004] (1) It cannot meet the right-angle transition requirements of the boss side to the bottom surface, because the blade wear will produce an arc transition (such as Figure 1 shown);

[0005] (2) The boss array with an inverted quadrangular pyramid structure cannot be simply cut out with a grinding wheel blade at different angles (such as Figure 2 shown);

[0006] (3) Boss structure with grooves (such as Figure 3 shown). Summary of the invention

[0007] The object of the present invention is to provide a method for processing a substrate with a boss array to solve the above-mentioned defects.

[0008] A method for processing a substrate with a boss array comprises the following steps:

[0009] S1: preparing a substrate 1, and cutting a groove 1 of a certain depth and width along direction 1 on the substrate 1 with a grinding wheel blade 1 of selected thickness 1, and then cutting a groove 2 of the same depth but different width along direction 2 with a grinding wheel blade 2 of selected thickness 2, to form a substrate 2 with a boss on the substrate 1;

[0010] S2: Applying adhesive material on the top surface of the boss;

[0011] S3: preparing a substrate three, and bonding the substrate two and the substrate three together according to the bonding process conditions of the bonding material used;

[0012] S4: using a flat grinding wheel to remove the surface of the substrate 2 until the bosses are exposed and reach the required boss height, thereby forming a substrate 4 with a boss array.

[0013] Preferably, the longitudinal section angles at the cutting edges of the grinding wheel blade 1 and the grinding wheel blade 2 are both right angles or acute angles.

[0014] Preferably, the materials of the substrate one and the substrate three are the same, and are any one of ceramic, glass, diamond, metal, and metal-based composite materials.

[0015] Preferably, the materials of the substrate one and the substrate three are different, and are any two of ceramic, glass, diamond, metal, and metal-based composite materials.

[0016] Preferably, the thickness of the grinding wheel blade three is less than the thickness of the cutting blade one, and the thickness of the grinding wheel blade four is less than the thickness of the grinding wheel blade two.

[0017] The invention also discloses a substrate with a boss array, which is manufactured by the above method.

[0018] On the basis of step S4, the present invention further discloses a method for processing a boss array substrate with grooves, comprising the following steps:

[0019] S5: preparing substrate five, and bonding substrate four and substrate five together according to bonding process conditions of the bonding material used;

[0020] S6: Use grinding wheel blade three to cut off the connected part in the middle of the boss on substrate four along direction one, and then use grinding wheel blade four to cut off the connected part in the middle of the boss on substrate four along direction two to form a boss array substrate six with grooves.

[0021] Preferably, the thickness of the grinding wheel blade three is less than the thickness of the grinding wheel blade one, and the thickness of the grinding wheel blade four is less than the thickness of the grinding wheel blade two.

[0022] Preferably, the materials of the substrate one, substrate three and substrate five are the same, and are any one of ceramic, glass, diamond, metal, and metal-based composite materials.

[0023] Preferably, the materials of the substrate one, substrate three and substrate five are different, and are any two or three of ceramic, glass, diamond, metal, and metal-based composite materials.

[0024] The invention also discloses a boss array substrate with grooves, which is manufactured by the method.

[0025] The present invention has the following beneficial effects:

[0026] The present invention integrates the method of using a grinding wheel blade to scribing and grooving combined with material bonding to form a substrate with a specific boss structure that cannot be achieved by scribing with a grinding wheel blade alone, and the overall processing technology is simple and easy to achieve. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1-3 There are three types of boss structures with specific shape requirements.

[0028] Figure 4 It is the processing flow chart of Example 1.

[0029] Figure 5 It is the processing flow chart of Example 2.

[0030] Figure 6 It is the processing flow chart of Example 3.

[0031] Figure 7 Longitudinal cross-sectional views of two different types of cutting blades.

[0032] Among them: A0-substrate one, A1-substrate two, B0-substrate three, B1-substrate four, C0-substrate five, C1-substrate six. DETAILED DESCRIPTION

[0033] In order to make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the following embodiments will help those skilled in the art to better understand the invention.

[0034] Example 1

[0035] A method for processing a substrate with a boss array comprises the following steps:

[0036] S1: prepare a substrate A0, and cut a groove A of a certain depth and width on the substrate A0 with a grinding wheel blade A along a direction A, and then cut a groove A of the same depth but different width with a grinding wheel blade B along a direction B, to form a substrate A1 with a boss on the substrate A0, wherein the longitudinal section angles of the cutting edges of the grinding wheel blades A1 and B2 are right angles, so the boss is in the shape of a right quadrangular pyramid;

[0037] S2: Applying adhesive material on the top surface of the boss;

[0038] S3: preparing a substrate three B0, and bonding the substrate two A1 and the substrate three B0 together according to the bonding process conditions of the bonding material used;

[0039] S4: Use a flat grinding wheel to remove the surface of the substrate A1 until the bosses are exposed and reach the required boss height, forming a substrate B1 with a boss array.

[0040] Through the above process, the above steps can eliminate the arc transition surface generated on the boss on the substrate A1 due to blade wear during the cutting process of the grinding wheel blade.

[0041] Example 2

[0042] A method for processing a substrate with a boss array comprises the following steps:

[0043] S1: prepare a substrate A0, and cut a groove A of a certain depth and width on the substrate A0 with a grinding wheel blade A along a direction A, and then cut a groove A of the same depth but different width with a grinding wheel blade B along a direction B, to form a substrate A1 with a boss on the substrate A0, wherein the longitudinal section angles of the cutting edges of the grinding wheel blades A1 and B2 are acute angles, so the boss is in the shape of a quadrangular pyramid;

[0044] S2: Applying adhesive material on the top surface of the boss;

[0045] S3: preparing a substrate three B0, and bonding the substrate two A1 and the substrate three B0 together according to the bonding process conditions of the bonding material used;

[0046] S4: Use a flat grinding wheel to remove the surface of the substrate A1 until the bosses are exposed and reach the required boss height, forming a substrate B1 with a boss array.

[0047] Through the above process, a substrate having an array of bosses with an inverted tetrahedral structure can be processed.

[0048] Example 3

[0049] S1: prepare a substrate A0, and cut a groove A of a certain depth and width on the substrate A0 with a grinding wheel blade A along a direction A, and then cut a groove A of the same depth but different width with a grinding wheel blade B along a direction B, to form a substrate A1 with a boss on the substrate A0, wherein the longitudinal section angles of the cutting edges of the grinding wheel blades A1 and B2 are right angles, so the boss is in the shape of a right quadrangular pyramid;

[0050] S2: Applying adhesive material on the top surface of the boss;

[0051] S3: preparing a substrate three B0, and bonding the substrate two A1 and the substrate three B0 together according to the bonding process conditions of the bonding material used;

[0052] S4: Use a flat grinding wheel to remove the surface of the substrate A1 until the boss is exposed and reaches the required boss height, forming a substrate B1 with a boss array; through the above process, the arc transition surface generated on the boss on the substrate A1 due to blade wear during the cutting process of the grinding wheel blade can be eliminated.

[0053] S5: preparing substrate five C0, and bonding substrate four B1 and substrate five C0 together according to bonding process conditions of the bonding material used;

[0054] S6: Use grinding wheel blade three to cut off the connected part in the middle of the boss on substrate four B1 along direction one, and then use grinding wheel blade four to cut off the connected part in the middle of the boss on substrate four B1 along direction two to form a boss array substrate six C1 with grooves.

[0055] Through the above process, a substrate with a boss array having a groove structure can be processed.

[0056] The specific embodiments described above further illustrate the purpose, technical solutions and beneficial effects of the present disclosure. It should be understood that the above description is only a specific embodiment of the present disclosure and is not intended to limit the present disclosure. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present disclosure should be included in the protection scope of the present disclosure.

Claims

1. A method for processing a substrate with a boss array, characterized in that: The steps include: S1: prepare a substrate 1 (A0), and cut a groove 1 of a certain depth and width along direction 1 on the substrate 1 (A0) using a grinding wheel blade 1 of selected thickness 1, and then cut a groove 2 of the same depth but different width along direction 2 using a grinding wheel blade 2 of selected thickness 2, to form a substrate 2 (A1) with a boss on the substrate 1 (A0); S2: Applying adhesive material on the top surface of the boss; S3: preparing a substrate three (B0), and bonding the substrate two (A1) and the substrate three (B0) together according to the bonding process conditions of the bonding material used; S4: Use a flat grinding wheel to remove the surface of the second substrate (A1) until the bosses are exposed and reach the required boss height, forming a fourth substrate (B1) with a boss array.

2. The method for processing a substrate with a boss array according to claim 1, characterized in that: The longitudinal section angles at the cutting edges of the grinding wheel blade 1 and the grinding wheel blade 2 are both right angles or acute angles.

3. The method for processing a substrate with an array of irregular bosses according to claim 1, characterized in that: The angle between the second direction and the first direction is between 15° and 165°.

4. The method for processing a substrate with a boss array according to claim 1, characterized in that: The materials of the substrate one (A0) and the substrate three (B0) are the same, and are any one of ceramic, glass, diamond, metal, and metal-based composite materials.

5. The method for processing a substrate with a boss array according to claim 1 is characterized in that: The materials of the substrate one (A0) and the substrate three (B0) are different and are any two of ceramic, glass, diamond, metal, and metal-based composite materials.

6. A substrate with a boss array, characterized in that: The method is prepared according to any one of claims 1 to 5.

7. The method for processing a boss array substrate with grooves according to claim 1, characterized in that: On the basis of step S4, the following steps are also included: S5: preparing substrate five (C0), and bonding substrate four (B1) and substrate five (C0) together according to bonding process conditions of the bonding material used; S6: Use grinding wheel blade three to cut off the connected part in the middle of the boss on substrate four (B1) along direction one, and then use grinding wheel blade four to cut off the connected part in the middle of the boss on substrate four (B1) along direction two to form a boss array substrate six (C1) with grooves.

8. The method for processing a boss array substrate with grooves according to claim 7, characterized in that: The thickness of the cutting blade three is smaller than that of the cutting blade one, and the thickness of the cutting blade four is smaller than that of the cutting blade two.

9. The method for processing a boss array substrate with grooves according to claim 7, characterized in that: The materials of the substrate one (A0), substrate three (B0) and substrate five (C0) are the same and are any one of ceramic, glass, diamond, metal, and metal-based composite materials.

10. The method for processing a boss array substrate with grooves according to claim 7, characterized in that: The materials of the substrate one (A0), substrate three (B0) and substrate five (C0) are different and are any two or three of ceramic, glass, diamond, metal, and metal-based composite materials.

11. A boss array substrate with grooves, characterized in that: The method is prepared according to any one of claims 7 to 10.

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