CMP (Chemical Mechanical Polishing) process of ceramic adapter plate and accompanying grinding circular ring

Abstract

The invention belongs to the technical field of ceramic adapter plate processing, and discloses a CMP process of a ceramic adapter plate and a grinding accompanying circular ring. The CMP process of the ceramic adapter plate comprises the following steps: S1, manufacturing a grinding accompanying circular ring according to the size of the ceramic adapter plate; s2, the ceramic adapter plate is embedded into the accompanying grinding circular ring, and a to-be-machined part is formed; s3, a UV film is attached to the bottom face of the to-be-machined part; s4, the workpiece to be machined is put into CMP equipment to be polished; s5, taking out a processed finished product; and S6, the UV film is subjected to film releasing treatment, and the ceramic adapter plate is taken down. The ceramic adapter plate is fixed to the accompanying grinding circular ring, the ceramic adapter plate and the accompanying grinding circular ring are fixed through the UV film and put into the CMP equipment to be polished, the situation that the ceramic adapter plate is fixed through a wax pasting technology is avoided, the difficulty of the CMP technology of the ceramic adapter plate is reduced, and the CMP technology precision of the ceramic adapter plate is improved; and the UV film can be removed cleanly, so that circuit pollution and circuit damage are avoided.

Description

Technical Field

[0001] The invention relates to the technical field of ceramic adapter plate processing, and in particular to a CMP process and a grinding ring for a ceramic adapter plate. Background Art

[0002] As the circuits of ceramic adapter boards become more and more sophisticated, more and more RDL (Redistribution Layer) circuits are being made on the surface of ceramic adapter boards, so the requirements for the roughness of the ceramic surface are also getting higher and higher. CMP (Chemical Mechanical Polishing) technology uses chemical corrosion and mechanical force to flatten silicon wafers or other substrate materials during processing. It can perfectly take into account global flattening, material surface defects and reliability, so CMP process for ceramic surfaces is indispensable.

[0003] Existing CMP equipment and processes are all performed on the surface of the wafer, so the fixed suction cups of the CMP equipment are all round, while the ceramic adapter plate is often square. The conventional practice is to stick the ceramic adapter plate to the round silicon wafer with wax for CMP processing. However, sticking the ceramic adapter plate to the silicon wafer with wax is not only complex and demanding, but also easy to cause uneven wax thickness; after the processing is completed, the ceramic adapter plate needs to be dewaxed. If the wax is not removed cleanly, it will cause circuit pollution and damage the circuit. Summary of the invention

[0004] The purpose of the present invention is to provide a CMP process and a grinding ring for a ceramic adapter plate, so as to solve the problem that in the prior art, a waxing process is used to fix a ceramic adapter plate on a circular silicon wafer for CMP processing. However, the process is complicated and has high requirements, which can easily cause uneven wax thickness. After the processing is completed, the ceramic adapter plate needs to be dewaxed. If the wax is not removed cleanly, it will cause circuit pollution and damage the circuit.

[0005] To achieve this object, the present invention adopts the following technical solutions:

[0006] In one aspect, a CMP process for a ceramic transfer plate is provided, comprising the following steps:

[0007] S1. Make a grinding ring according to the size of the ceramic adapter plate;

[0008] S2, embedding the ceramic adapter plate into the grinding ring to form a workpiece to be processed;

[0009] S3, applying a UV film to the bottom surface of the workpiece to be processed;

[0010] S4, placing the workpiece to be processed into a CMP device and polishing it;

[0011] S5, taking out the finished product;

[0012] S6, performing film removal treatment on the UV film and removing the ceramic adapter plate.

[0013] As an optional technical solution for the CMP process of the ceramic adapter plate, in step S1, making the grinding ring includes the following steps:

[0014] S1.1, design and process the mold;

[0015] S1.2, heating and melting the raw materials in the barrel to form a uniform melt;

[0016] S1.3, injecting the melt into the cavity of the mold;

[0017] S1.4, wait for the melt to solidify and then open the mold to take it out;

[0018] S1.5. Trim the excess parts.

[0019] As an optional technical solution for the CMP process of the ceramic adapter plate, in step S1.2, the raw material is plastic.

[0020] As an optional technical solution for the CMP process of the ceramic adapter plate, in step S3, applying the UV film includes the following steps:

[0021] S3.1. Clean the bottom surface of the workpiece to be processed;

[0022] S3.2, attaching the UV film to the bottom surface of the workpiece to be processed;

[0023] S3.3, removing bubbles between the UV film and the bottom surface of the workpiece to be processed.

[0024] As an optional technical solution for the CMP process of the ceramic adapter plate, in step S3.3, a scraper is used to remove bubbles between the UV film and the bottom surface of the workpiece to be processed.

[0025] As an optional technical solution for the CMP process of the ceramic adapter plate, in step S6, performing film stripping treatment on the UV film includes the following steps:

[0026] S6.1, irradiating the UV film with ultraviolet light to make the adhesive layer of the UV film lose its stickiness;

[0027] S6.2, peeling off the UV film;

[0028] S6.3. Remove excess glue.

[0029] As an optional technical solution for the CMP process of the ceramic adapter plate, in the step S6.1, the finished product is placed in a UV furnace to irradiate the UV film.

[0030] As an optional technical solution for the CMP process of the ceramic adapter plate, in step S6.3, alcohol or a detergent is used to wipe off the residual glue.

[0031] On the other hand, a grinding ring is provided for use in the CMP process of the ceramic adapter plate, comprising a main body, wherein the internal shape of the main body is the same as that of the ceramic adapter plate, and the external shape is circular.

[0032] As an optional technical solution for the grinding ring, the thickness of the main body is smaller than the thickness of the ceramic adapter plate.

[0033] Beneficial effects of the present invention:

[0034] The present application discloses a CMP process and a grinding ring for a ceramic adapter plate. The CMP process for the ceramic adapter plate includes the following steps: S1, making a grinding ring according to the size of the ceramic adapter plate; S2, embedding the ceramic adapter plate into the grinding ring to form a workpiece to be processed; S3, applying a UV film to the bottom surface of the workpiece to be processed; S4, placing the workpiece to be processed into a CMP device and polishing it; S5, taking out the finished product; S6, performing a film removal treatment on the UV film and removing the ceramic adapter plate. By fixing the ceramic adapter plate to the grinding ring, using the UV film to fix the ceramic adapter plate and the grinding ring and putting them into the CMP device for polishing, the use of a waxing process to fix the ceramic adapter plate is avoided, the difficulty of the CMP process of the ceramic adapter plate is reduced, and the CMP process accuracy of the ceramic adapter plate is improved; the UV film can be removed cleanly to avoid circuit pollution and damage. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the contents of the embodiments of the present invention and these drawings without paying any creative work.

[0036] Figure 1 is a flow chart of a CMP process for a ceramic transfer plate provided by an embodiment of the present invention;

[0037] Figure 2 is a flow chart of manufacturing the grinding ring provided by an embodiment of the present invention;

[0038] Figure 3 This is a flow chart of applying UV film provided by an embodiment of the present invention;

[0039] Figure 4 It is a flow chart of defilming of UV film provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0040] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0041] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0042] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0043] In the description of this embodiment, the terms "upper", "lower", "right", etc., directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of description and simplification of operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0044] Existing CMP equipment and processes are all performed on the surface of the wafer, so the fixed suction cups of the CMP equipment are all round, while the ceramic adapter plate is often square. The conventional practice is to stick the ceramic adapter plate to the round silicon wafer with wax for CMP processing. However, sticking the ceramic adapter plate to the silicon wafer with wax is not only complex and demanding, but also easy to cause uneven wax thickness; after the processing is completed, the ceramic adapter plate needs to be dewaxed. If the wax is not removed cleanly, it will cause circuit pollution and damage the circuit.

[0045] To solve the above problems, see Figure 1 This embodiment provides a CMP process for a ceramic transfer plate, comprising the following steps:

[0046] S1. Make a grinding ring according to the size of the ceramic adapter plate;

[0047] S2, embedding the ceramic adapter plate into the grinding ring to form a workpiece to be processed;

[0048] S3, attaching UV film to the bottom surface of the workpiece to be processed;

[0049] S4, placing the workpiece into the CMP equipment and polishing it;

[0050] S5, taking out the finished product;

[0051] S6. De-film the UV film and remove the ceramic adapter plate.

[0052] By fixing the ceramic adapter plate on the grinding ring, using UV film to fix the ceramic adapter plate and the grinding ring and putting them into the CMP equipment for polishing, the use of waxing process to fix the ceramic adapter plate is avoided, the difficulty of the CMP process of the ceramic adapter plate is reduced, and the CMP process accuracy of the ceramic adapter plate is improved; the UV film can be cleanly removed to avoid circuit pollution and damage.

[0053] Further, see Figure 2 In step S1, making the grinding ring includes the following steps:

[0054] S1.1, design and process the mold;

[0055] S1.2, heating and melting the raw materials in the barrel to form a uniform melt;

[0056] S1.3, injecting the melt into the cavity of the mold;

[0057] S1.4, wait for the melt to solidify and then open the mold to take it out;

[0058] S1.5. Trim the excess parts.

[0059] Specifically, use CAD software to design the size and shape of the grinding ring, including the cavity, gate, cooling system, etc., and use CNC machine tools and other equipment to process the mold to ensure accuracy. Install the mold on the injection molding machine to ensure stability. Set parameters such as barrel temperature, injection pressure, cooling time according to the material, preheat the barrel and nozzle of the injection molding machine to ensure uniform melting of the plastic.

[0060] Specifically, in step S1.2, the raw material is plastic. In this embodiment, the plastic material may be polyethylene (PE), polyvinyl chloride (PVC), polytetrafluoroethylene (PTFE), etc.

[0061] In other embodiments, the grinding ring can be made by machining. Specifically, after the shape and size of the grinding ring are designed, the grinding ring can be directly cut out from the plastic material. It should be noted that since the processing and manufacturing of annular workpieces is a very mature technology, other processing methods are not listed here, and those skilled in the art can select the corresponding processing method according to actual needs.

[0062] Further, see Figure 3 In step S3, applying UV film includes the following steps:

[0063] S3.1. Clean the bottom surface of the workpiece to be processed;

[0064] S3.2, attaching the UV film to the bottom surface of the workpiece to be processed;

[0065] S3.3. Remove bubbles between the UV film and the bottom surface of the workpiece to be processed.

[0066] Specifically, wipe the bottom surface of the workpiece with a cleaning cloth to remove dust and stains. If necessary, use a dust removal sticker to further remove fine dust on the bottom surface of the workpiece, and slowly lower the UV film from one end to make it naturally fit the bottom surface of the workpiece. Specifically, in step S3.3, use a scraper to remove bubbles between the UV film and the bottom surface of the workpiece.

[0067] Further, see Figure 4 In step S6, the UV film is de-filmed, including the following steps:

[0068] S6.1. Use ultraviolet rays to irradiate the UV film to make the adhesive layer of the UV film lose its stickiness;

[0069] S6.2, peeling off the UV film;

[0070] S6.3. Remove excess glue.

[0071] Specifically, in step S6.1, the finished product is placed in a UV oven to irradiate the UV film. In other embodiments, a UV lamp may also be used to irradiate the UV film. In step S6.3, alcohol or a detergent is used to wipe and remove the residual glue. Specifically, the detergent includes acetone, toluene, xylene, petroleum ether, etc. or includes ingredients such as polyethylene glycol monobutyl ether.

[0072] On the other hand, the present embodiment provides a grinding ring for use in a CMP process of a ceramic adapter plate, comprising a body, the body having an inner shape identical to that of the ceramic adapter plate and an outer shape being circular. Specifically, the thickness of the body is less than that of the ceramic adapter plate, so that the ceramic adapter plate can be directly ground without grinding the body, and the grinding ring can be repeatedly recycled.

[0073] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the protection scope of the present invention. It is not necessary and impossible to list all the embodiments here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. A CMP process for a ceramic transfer plate, characterized in that: The following steps are involved: S1. Make a grinding ring according to the size of the ceramic adapter plate; S2, embedding the ceramic adapter plate into the grinding ring to form a workpiece to be processed; S3, applying a UV film to the bottom surface of the workpiece to be processed; S4, placing the workpiece to be processed into a CMP device and polishing it; S5, taking out the finished product; S6, performing film removal treatment on the UV film and removing the ceramic adapter plate.

2. The CMP process of the ceramic transfer plate according to claim 1, characterized in that: In the step S1, making the grinding ring comprises the following steps: S1.1, design and process the mold; S1.2, heating and melting the raw materials in the barrel to form a uniform melt; S1.3, injecting the melt into the cavity of the mold; S1.4, wait for the melt to solidify and then open the mold to take it out; S1.

5. Trim the excess parts.

3. The CMP process of the ceramic transfer plate according to claim 2, characterized in that: In the step S1.2, the raw material is plastic.

4. The CMP process of the ceramic transfer plate according to claim 1, characterized in that: In step S3, applying the UV film includes the following steps: S3.

1. Clean the bottom surface of the workpiece to be processed; S3.2, attaching the UV film to the bottom surface of the workpiece to be processed; S3.3, removing bubbles between the UV film and the bottom surface of the workpiece to be processed.

5. The CMP process of the ceramic transfer plate according to claim 4, characterized in that: In the step S3.3, a scraper is used to remove bubbles between the UV film and the bottom surface of the workpiece to be processed.

6. The CMP process of the ceramic transfer plate according to claim 1, characterized in that: In the step S6, the de-filming process of the UV film includes the following steps: S6.1, irradiating the UV film with ultraviolet light to make the adhesive layer of the UV film lose its stickiness; S6.2, peeling off the UV film; S6.

3. Remove excess glue.

7. The CMP process of the ceramic transfer plate according to claim 6, characterized in that: In the step S6.1, the finished product is placed in a UV oven to irradiate the UV film.

8. The CMP process of the ceramic transfer plate according to claim 6, characterized in that: In step S6.3, alcohol or a detergent is used to wipe and remove the remaining glue.

9. A grinding ring, characterized in that: The grinding ring is applied to the CMP process of the ceramic adapter plate as described in any one of claims 1 to 8, and the grinding ring comprises a main body, the internal shape of the main body is the same as the shape of the ceramic adapter plate, and the external shape is circular.

10. The grinding ring according to claim 9, characterized in that: The thickness of the body is smaller than the thickness of the ceramic adapter plate.

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