Transfer Mold operation cooling fin product equipment

Abstract

The invention provides a Transfer Mold operation cooling fin product device which enables a cooling fin product to be free of flash black spots and ensures the quality of a finished product. The product conveying area comprises a product conveying track, a plastic packaged product placing area, a preheating table and a product conveying mechanism; the plastic package material conveying area comprises a vibration disc and a plastic package material conveying mechanism and is used for conveying granular plastic package materials; the radiating fin conveying area comprises a radiating fin conveying rail and a radiating fin conveying mechanism; the mold closing and injection molding area comprises at least one mold table and at least one set of mold mechanism, the mold table and the mold mechanism are arranged in a one-to-one correspondence mode, each mold mechanism comprises an upper mold and a lower mold, and an injection molding opening of each set of lower mold is connected to an injection molding barrel; the product conveying area, the plastic package material conveying area, the cooling fin conveying area and the mold closing and injection molding area are all located in the shell.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor equipment, and in particular to a TransferMold operation heat sink product equipment. Background Art

[0002] Currently, the two most common types of semiconductor molding equipment are transfer molding and compressing molding. The working principle of the compressing molding model is: the heat sink is placed flat on the separation membrane, and the required powder molding material is evenly sprinkled on the back of the heat sink, and then transported to the high-temperature mold through a mechanism for mold closing. Since the heat sink is not affected by the vacuum, the powder molding material may roll down and the heat sink may shift due to the effect of gravity during transportation and mold closing, resulting in abnormal overflow black spots after mold closing. Summary of the invention

[0003] In view of the above problems, the present invention provides a transfer mold operation heat sink product equipment, which makes the heat sink product free of overflow black spots and ensures the quality of the finished product.

[0004] A Transfer Mold operation heat sink product equipment, characterized in that it includes:

[0005] The product transport area includes a product transport track, a plastic-wrapped product placement area, a preheating table and a product transport mechanism;

[0006] A plastic packaging material transmission area, which includes a vibration plate and a plastic packaging material transmission mechanism, and is used for transmitting granular plastic packaging materials;

[0007] A heat sink transport area, which includes a heat sink transport track and a heat sink transport mechanism;

[0008] A mold clamping and injection molding area, which includes at least one mold table and at least one set of mold mechanisms, wherein the mold table and the mold mechanisms are arranged in a one-to-one correspondence, wherein the mold mechanisms include an upper mold and a lower mold, and the injection port of each set of lower molds is connected to an injection molding barrel;

[0009] The product transmission area, the plastic packaging material transmission area, the heat sink transmission area, the mold closing area and the injection molding area are all located inside the shell;

[0010] The product transport track is used to transport the unsealed product from the material box to the product transport mechanism, the product transport mechanism is used to transport the unsealed product from the end of the product transport track to the preheating table for preheating, transport the preheated product to the lower mold, and transport the sealed product from the lower mold to the sealed product placement area, and the preheating table is used to preheat the substrate of the product before sealing;

[0011] The vibration plate is used to store the plastic packaging material and transport the plastic packaging material to the position of the plastic packaging material transport mechanism, and the plastic packaging material transport mechanism transports the plastic packaging material to the corresponding injection molding cylinder after grabbing the plastic packaging material;

[0012] The heat sink transport track transports the heat sink from the heat sink material box to the heat sink transport mechanism, and the heat sink transport mechanism transports the heat sink to the upper mold;

[0013] The mold table is used to store the mold mechanism and heat the mold mechanism. The upper mold fixes the heat sink, and the lower mold fixes the product. After the upper mold and the lower mold are closed, the plastic cylinder is injected into the mold cavity and then the heat sink and the product are combined and plastic sealed by melting and filling.

[0014] It is further characterized by:

[0015] The heat sink transfer area transports two heat sinks to the heat sink transport mechanism at the same time according to the requirement of configuring two heat sinks per mold, and then presses the heat sinks upward by the heat sink transport mechanism to flatten them on the lower surface of the upper mold. A first vacuum hole group is configured on both sides of the bottom of the upper mold to adsorb the flattened heat sinks to corresponding positions on the lower surface of the upper mold by vacuum adsorption.

[0016] The size of the heat sink is smaller than the size of the inner frame of the mold mechanism, so that the heat sink is stably adsorbed on the lower surface of the upper mold and then raised and lowered along the upper mold;

[0017] The heat sink transport mechanism includes an upper pressing mechanism, and the upper pressing mechanism drives the heat sink to be arranged correspondingly in the effective area of ​​the upper molded sealing body;

[0018] An outer ring formed by a first vacuum hole group is respectively arranged on both sides of the lower part of the upper mold, and the vacuum holes arranged along the outer ring have the same diameter, and the spacing between adjacent vacuum holes on the same side is the same, so as to ensure that the heat sink is reliably fixed at the corresponding position of the lower surface of the upper mold by vacuum adsorption;

[0019] The upper surfaces of both sides of the lower mold are provided with second vacuum adsorption areas, and the middle part of the lower mold in the length direction is provided with a plurality of outlets for plastic injection cylinders, and the second vacuum adsorption areas are used to adsorb the bottom of the substrate of the product;

[0020] After the unsealed product, the heat sink and the sealing material are set in corresponding positions by corresponding transport mechanisms, the sealing is completed through mold closing and injection molding processes.

[0021] After adopting the structure of the present invention, the heat sink is fixed by vacuum adsorption; and granular molding compound is used instead of powder molding compound, and injection molding is used instead of separate mold closing method to avoid the granular molding compound rolling and overflowing; it makes the heat sink product have no overflow black spots, thereby ensuring the quality of the finished product. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 A structural block diagram of the Transfer Mold operation heat sink product equipment provided by the present invention;

[0023] Figure 2 It is a structural schematic diagram of an upper mold according to a specific embodiment of the present invention;

[0024] Figure 3 It is a structural schematic diagram of a lower mold according to a specific embodiment of the present invention;

[0025] Figure 4 It is a structural schematic diagram of a heat sink transport mechanism in a specific embodiment of the present invention;

[0026] The names corresponding to the serial numbers in the figure are as follows:

[0027] Product transmission area 10, product transportation track 11, plastic-sealed product placement area 12, preheating table 13, product transportation mechanism 14, plastic-sealing material transmission area 20, vibration plate 21, plastic-sealing material transportation mechanism 22, heat sink transmission area 30, heat sink transportation track 31, heat sink transportation mechanism 32, upper pressing mechanism 33, lifting platform 331, suction nozzle 332, mold closing and injection molding area 40, mold table 41, upper mold 42, positioning hole 421, lower mold 43, positioning pin 431, first vacuum hole group 44, vacuum hole 441, second vacuum adsorption area 45, injection molding cylinder 46, first flow channel 47, injection molding riser 48, second flow channel 49, shell 50 DETAILED DESCRIPTION

[0028] A transfer mold operation heat sink product equipment, see Figure 1-Figure 4 , which includes a product transmission area 10, a plastic packaging material transmission area 20, a heat sink transmission area 30, and a mold closing and injection molding area 40; the product transmission area 10, the plastic packaging material transmission area 20, the heat sink transmission area 30, the mold closing and injection molding area 40 are all located inside the housing 50;

[0029] The product transport area 10 includes a product transport track 11, a plastic-sealed product placement area 12, a preheating table 13, and a product transport mechanism 14;

[0030] The plastic packaging material transmission area 20 includes a vibration plate 21 and a plastic packaging material transportation mechanism 22, which is used for transmitting granular plastic packaging materials;

[0031] The heat sink transport area 30 includes a heat sink transport track 31 and a heat sink transport mechanism 32;

[0032] The mold clamping and injection molding area 40 includes at least one mold table 41 and at least one set of mold mechanisms, the mold mechanisms include an upper mold 42 and a lower mold 43, and the injection port of each set of lower molds 42 is connected to an injection molding barrel 46 (located in the cavity of the lower mold 43);

[0033] The product transport track 11 is used to transport the unsealed product from the material box to the product transport mechanism 14. The product transport mechanism 14 is used to transport the unsealed product from the end of the product transport track 11 to the preheating table 13 for preheating, transport the preheated product to the lower mold 43, and transport the sealed product from the lower mold 43 to the sealed product placement area 12. The preheating table 13 is used to preheat the substrate of the product before sealing, so as to achieve step-by-step heating of the product substrate and eliminate the risks of expansion and stratification caused by sudden heating.

[0034] The vibration plate 21 is used to store the granular plastic packaging material and transport the plastic packaging material to the plastic packaging material transport mechanism 22. The plastic packaging material transport mechanism 22 transports the plastic packaging material to the corresponding plastic injection cylinder 46 after grabbing the plastic packaging material.

[0035] The heat sink transport track 31 transports the heat sink from the heat sink material box to the heat sink transport mechanism 32, and the heat sink transport mechanism 32 transports the heat sink to the upper mold 42;

[0036] The mold table 41 is used to store the mold mechanism and heat the mold mechanism. The upper mold 42 fixes the heat sink, and the lower mold 43 fixes the product. After the upper mold 42 and the lower mold 43 are closed, the plastic injection cylinder 46 is injected into the mold cavity and then the heat sink and the product are combined and plastic sealed by melting and filling.

[0037] In a specific embodiment, the mold closing and injection molding area 40 includes three sets of mold tables and mold mechanisms, which improves the operating capacity of the entire equipment.

[0038] In a specific embodiment, the heat sink transporting area 30 transports two heat sinks to the heat sink transporting mechanism 32 at the same time according to the requirement of configuring two heat sinks per mold, and then the heat sink transporting mechanism 32 presses the heat sinks upward and flattens them on the lower surface of the upper mold 42 at the same time. The first vacuum hole groups 44 are configured on both sides of the bottom of the upper mold 42, and the flattened heat sinks are adsorbed to the corresponding positions on the lower surface of the upper mold 42 by vacuum adsorption.

[0039] The size of the heat sink is smaller than the inner frame size of the mold mechanism, so that the heat sink is stably adsorbed on the lower surface of the upper mold 42, and then raised and lowered along the upper mold 42;

[0040] The heat sink transport mechanism 32 includes a pressing mechanism 33, which drives the heat sink to be arranged in the effective area of ​​the upper molded package. The pressing mechanism 33 is respectively provided with a lifting platform 331 corresponding to the position of each heat sink. An array of suction nozzles 332 are arranged on the surface of each lifting platform 331. The suction nozzles 332 adsorb the lower surface of the heat sink, and then the heat sink is transferred to the lower surface of the corresponding first vacuum hole group 44 through the lifting platform 331. After the first vacuum hole group 44 completes the adsorption of the heat sink, the suction nozzles 332 release the adsorption and the lifting platform 331 descends and resets. The heat sink transport mechanism 32 is specifically a multi-axis robot, and the end of the multi-axis robot is the pressing mechanism 33.

[0041] In a specific implementation, outer circles formed by the first vacuum hole group 44 are respectively arranged on both sides of the lower part of the upper mold 42, and the diameters of the vacuum holes 441 arranged along the outer circle are the same, and the spacings between adjacent vacuum holes 441 located on the same side are the same, so as to ensure that the heat sink is reliably fixed at the corresponding position of the lower surface of the upper mold 42 by vacuum adsorption;

[0042] The upper surfaces of both sides of the lower mold 43 are respectively provided with second vacuum adsorption areas 45. The middle of the length direction of the lower mold 43 is provided with a plurality of outlets of the plastic injection tube 46, and the plastic flows to both sides through the first flow channel 47. The middle of the length direction of the upper mold 43 is provided with a plurality of injection risers 48, and the plastic flows to both sides through the second flow channel 49. The plastic sealing material formed by heating after the mold is closed enters the mold cavity through the outlet of the plastic injection tube 46 for plastic sealing. The second vacuum adsorption area 45 is used to adsorb the bottom of the substrate of the product.

[0043] After the unsealed product, the heat sink and the sealing material are set in corresponding positions by corresponding transport mechanisms, the sealing is completed through mold closing and injection molding processes.

[0044] In specific implementation, a positioning hole 421 is disposed on the periphery of the lower surface of the upper mold 42 , and a positioning pin 431 is disposed on the periphery of the upper surface of the lower mold 43 . When the molds are closed, the positioning pin 431 is inserted into the positioning hole 421 to complete the alignment.

[0045] Its beneficial effects are as follows:

[0046] 1) Developed a method for using transfer mold equipment to process heat sink products, breaking the limitations of a single device;

[0047] 2) Through the vacuum adsorption mode of the heat sink and the use of injection molding, the pain points of the current heat sink, such as overflow and black spots, are solved;

[0048] 3) The heat sink warping problem is solved by vacuum adsorption of the heat sink, and the downward pressure problem of the powder molding compound during mold closing is solved by injection molding, ultimately achieving the goal of improving the high line arc downward pressure and low line arc crossing problems.

[0049] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

[0050] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A transfer mold operation heat sink product equipment, characterized in that: It includes: The product transport area includes a product transport track, a plastic-wrapped product placement area, a preheating table and a product transport mechanism; A plastic packaging material transmission area, which includes a vibration plate and a plastic packaging material transmission mechanism, and is used for transmitting granular plastic packaging materials; A heat sink transport area, which includes a heat sink transport track and a heat sink transport mechanism; A mold clamping and injection molding area, which includes at least one mold table and at least one set of mold mechanisms, wherein the mold table and the mold mechanisms are arranged in a one-to-one correspondence, wherein the mold mechanisms include an upper mold and a lower mold, and the injection port of each set of lower molds is connected to an injection molding barrel; The product transmission area, the plastic packaging material transmission area, the heat sink transmission area, the mold closing area and the injection molding area are all located inside the shell; The product transport track is used to transport the unsealed product from the material box to the product transport mechanism, the product transport mechanism is used to transport the unsealed product from the end of the product transport track to the preheating table for preheating, transport the preheated product to the lower mold, and transport the sealed product from the lower mold to the sealed product placement area, and the preheating table is used to preheat the substrate of the product before sealing; The vibration plate is used to store the plastic packaging material and transport the plastic packaging material to the position of the plastic packaging material transport mechanism, and the plastic packaging material transport mechanism transports the plastic packaging material to the corresponding injection molding cylinder after grabbing the plastic packaging material; The heat sink transport track transports the heat sink from the heat sink material box to the heat sink transport mechanism, and the heat sink transport mechanism transports the heat sink to the upper mold; The mold table is used to store the mold mechanism and heat the mold mechanism. The upper mold fixes the heat sink, and the lower mold fixes the product. After the upper mold and the lower mold are closed, the plastic cylinder is injected into the mold cavity and then the heat sink and the product are combined and plastic sealed by melting and filling.

2. The Transfer Mold operation heat sink product equipment according to claim 1, characterized in that: The heat sink transfer area transports the two heat sinks to the heat sink transport mechanism at the same time according to the requirement of configuring two heat sinks for each mold, and then presses the heat sinks upward through the heat sink transport mechanism and flattens them on the lower surface of the upper mold. A first vacuum hole group is configured on both sides of the bottom of the upper mold, and the flattened heat sinks are adsorbed to the corresponding positions on the lower surface of the upper mold through vacuum adsorption.

3. The Transfer Mold operation heat sink product equipment according to claim 2, characterized in that: The size of the heat sink is smaller than the inner frame size of the mold mechanism, so that the heat sink is stably adsorbed on the lower surface of the upper mold and then raised and lowered along the upper mold.

4. The Transfer Mold operation heat sink product equipment according to claim 2, characterized in that: The heat sink transport mechanism includes a pressing mechanism, and the pressing mechanism drives the heat sink to be arranged correspondingly in the effective area of ​​the upper molded package.

5. The Transfer Mold operation heat sink product equipment according to claim 2, characterized in that: An outer ring formed by a first vacuum hole group is respectively arranged on both sides of the lower part of the upper mold, and the vacuum holes arranged along the outer ring have the same diameter, and the spacing between adjacent vacuum holes located on the same side is the same.

6. The Transfer Mold operation heat sink product equipment according to claim 1, characterized in that: The upper surfaces of both sides of the lower mold are provided with second vacuum adsorption areas, and the middle part of the lower mold in the length direction is provided with a plurality of outlets for plastic injection cylinders. The second vacuum adsorption areas are used to adsorb the bottom of the substrate of the product.

7. The heat sink product equipment for Transfer Mold operation according to claim 1, characterized in that: After the unsealed product, the heat sink and the sealing material are set in corresponding positions by corresponding transport mechanisms, the sealing is completed through mold closing and injection molding processes.

Images