Packaging method of semiconductor tubes and device therefor, storage medium

Abstract

The application relates to the technical field of semiconductor packaging, in particular to a semiconductor tube packaging method and device and a storage medium. The semiconductor tube packaging method provided by the application comprises the following steps: obtaining semiconductor tubes of a target packaging batch and target batch information; counting the number of missing tubes for the target packaging batch to obtain the number of missing tubes and the number of elements corresponding to each missing tube; calculating packaging parameters according to the upper limit number of tubes, the number of missing tubes, the number of elements corresponding to each missing tube, the upper limit number of elements accommodated by a single tube and the target batch information to obtain the number of elements carried by a box, a tube configuration scheme and the total number of boxes for batch packaging; and performing a packaging operation on each semiconductor tube based on the number of elements carried by a box, the tube configuration scheme and the total number of boxes for batch packaging to obtain each tube packaging box. Thus, an efficient and high-quality solution for semiconductor tube packaging is provided.

Description

Technical Field

[0001] The present application relates to the field of semiconductor packaging technology, and in particular to a packaging method for semiconductor material tubes, a device thereof, and a storage medium. Background Art

[0002] Semiconductor tubes are tubes used to hold semiconductor components. Packaged and tested semiconductor components (such as integrated circuits and chips) are packed into tubes according to specific quantities and specifications for easy storage, transportation, and use. The packaging process for semiconductor tubes is often complex and tedious, requiring manual intervention at multiple stages. This makes the entire process inefficient and prone to human error.

[0003] It's important to note that currently, there are no mature, automated packaging solutions specifically for semiconductor tubes. The complex manual process associated with semiconductor tube packaging suffers from low efficiency, high error rates, and significant quality control challenges. In particular, it's difficult to precisely determine the packaging parameters for each tube box. Therefore, achieving efficient, high-quality packaging for semiconductor tubes remains a major challenge that the industry urgently needs to address. Summary of the Invention

[0004] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes a semiconductor material tube packaging method and device, and a storage medium, which can perform high-efficiency and high-quality packaging operations on semiconductor material tubes.

[0005] A method for packaging a semiconductor tube according to the first embodiment of the present application includes:

[0006] Obtaining semiconductor tubes of a target packaging batch and target batch information corresponding to the target packaging batch, wherein the semiconductor tubes are used to accommodate semiconductor components, and each of the semiconductor tubes has the same upper limit number of components that can be accommodated in a single tube; wherein the semiconductor tubes that have reached the upper limit number of components that can be accommodated in a single tube are considered fully filled tubes, and the semiconductor tubes that have not reached the upper limit number of components that can be accommodated in a single tube are considered underfilled tubes;

[0007] Selecting the missing charging tubes for the target packaging batch and counting the number thereof to obtain the number of missing charging tubes in the batch and the number of components corresponding to each missing charging tube;

[0008] According to the preset upper limit of the number of tube roots, the number of missing tube roots of the batch, the number of elements corresponding to each missing tube root, the upper limit of the number of elements accommodated by a single tube, and the target batch information, packaging parameter calculation is performed to obtain the number of elements carried by each tube packaging box, a tube arrangement scheme, and the total number of boxes for packaging the batch;

[0009] Based on the number of elements carried by each tube packaging box, the tube arrangement scheme, and the total number of boxes for packaging the batch, packaging operations are performed on each semiconductor tube to obtain each tube packaging box corresponding to the target packaging batch.

[0010] According to some embodiments of the present application, the packaging parameter calculation according to the preset upper limit of the number of tube roots, the number of missing tube roots of the batch, the number of elements corresponding to each missing tube root, the upper limit of the number of elements accommodated by a single tube, and the target batch information includes:

[0011] The total number of elements of the batch corresponding to the target packaging batch is extracted from the target batch information;

[0012] Based on the total number of elements of the batch, the number of elements corresponding to each missing tube root, and the upper limit of the number of elements accommodated by a single tube, the number of fully loaded tube roots of the batch is determined;

[0013] According to the number of missing tube roots of the batch, the number of fully loaded tube roots of the batch, and the upper limit of the number of tube roots, the total number of boxes for packaging the batch and the tube arrangement scheme corresponding to each tube packaging box are determined;

[0014] According to the upper limit of the number of tube roots, the upper limit of the number of elements accommodated by a single tube, and the number of elements corresponding to each missing tube root, the number of elements carried by each tube packaging box is determined.

[0015] According to some embodiments of the present application, the determination of the number of fully loaded tube roots of the batch based on the total number of elements of the batch, the number of elements corresponding to each missing tube root, and the upper limit of the number of elements accommodated by a single tube includes:

[0016] The number of elements corresponding to each missing tube root is summed to calculate the total number of missing tube elements of the semiconductor elements in each missing tube;

[0017] The total number of fully loaded tube elements of the semiconductor elements in each fully loaded tube is obtained by subtracting the total number of missing tube elements from the total number of elements of the batch;

[0018] The number of fully filled tubes in the batch is determined by performing a quotient operation based on the total number of fully filled tube components and the upper limit number of components that can be accommodated in a single tube.

[0019] According to some embodiments of the present application, the material tube configuration scheme includes a conventional configuration scheme for full boxes and a specific configuration scheme for underfull boxes. Determining the total number of boxes in the batch and the material tube configuration scheme corresponding to each material tube packaging box based on the number of unfilled material tubes in the batch, the number of fully filled material tubes in the batch, and the upper limit number of material tubes in the packaging includes:

[0020] Counting full boxes according to the number of full tubes in the batch and the upper limit of the number of tubes in the package to determine the conventional configuration scheme, the number of full boxes and the remaining number of full tubes for each full box;

[0021] Counting the unfilled boxes according to the remaining number of full tubes, the number of unfilled tubes in the batch, and the upper limit number of tubes for packaging to determine the specific configuration scheme and the number of unfilled boxes for each unfilled box;

[0022] The total number of boxes in the batch is obtained by summing the number of full boxes and the number of unfull boxes.

[0023] According to some embodiments of the present application, counting full boxes according to the number of full tubes in the batch and the upper limit number of tubes in the package to determine the conventional configuration scheme, the number of full boxes, and the remaining number of full tubes for each full box includes:

[0024] Generating the conventional configuration scheme for each full box according to the number of upper-limit feeding tubes of the packaging;

[0025] A quotient operation is performed on the number of fully filled tubes in the batch and the number of tubes at the upper limit of packaging to obtain the number of full boxes and the remainder of full tubes.

[0026] According to some embodiments of the present application, counting the unfilled boxes based on the remaining number of full tubes, the number of unfilled tubes in the batch, and the upper limit number of tubes for packaging to determine the specific configuration scheme and the number of unfilled boxes for each unfilled box includes:

[0027] The sum of the remaining number of full tubes and the number of tubes without filling in the batch is determined as the underfill box calculation factor;

[0028] Performing a quotient operation on the underfill box calculation factor and the upper limit number of tubes for packaging;

[0029] In response to the fact that the unfilled box calculation factor is divisible by the upper limit number of tubes for packaging in the quotient operation, the corresponding specific configuration scheme is generated for each unfilled box, and the quotient value of the unfilled box calculation factor and the upper limit number of tubes for packaging is determined as the number of unfilled boxes.

[0030] According to some embodiments of the present application, after the modulo operation is performed on the incomplete-box calculation factor and the package upper limit of the number of tube roots, further comprising:

[0031] In response to the incomplete-box calculation factor being unable to be divided by the package upper limit of the number of tube roots in the modulo operation, generating a corresponding specific configuration scheme for each of the incomplete boxes, summing the quotient of the incomplete-box calculation factor and the package upper limit of the number of tube roots with 1 to obtain the number of incomplete boxes.

[0032] According to some embodiments of the present application, the generating a corresponding specific configuration scheme for each of the incomplete boxes comprises:

[0033] In the case that the number of tube roots in the incomplete box reaches the package upper limit of the number of tube roots, generating a corresponding specific configuration scheme for the incomplete box according to the regular package specification; wherein the regular package specification refers to a package specification of the semiconductor tube according to the regular configuration scheme.

[0034] In the case that the number of tube roots in the incomplete box does not reach the package upper limit of the number of tube roots, generating a corresponding specific configuration scheme for the incomplete box according to the number of semiconductor tubes in the incomplete box.

[0035] According to some embodiments of the present application, the generating a corresponding specific configuration scheme for the incomplete box according to the number of semiconductor tubes in the incomplete box comprises:

[0036] If the number of semiconductor tubes in the incomplete box is greater than a preset small-size specification number, generating a corresponding specific configuration scheme for the incomplete box according to the regular package specification;

[0037] If the number of semiconductor tubes in the incomplete box is less than or equal to the small-size specification number, generating a corresponding specific configuration scheme for the incomplete box according to a preset regular package specification.

[0038] According to some embodiments of the present application, the generating a corresponding specific configuration scheme for the incomplete box according to the number of semiconductor tubes in the incomplete box less than or equal to the small-size specification number, according to a preset regular package specification, comprises:

[0039] If the number of semiconductor tubes in the incomplete box is less than or equal to the small-size specification number, and the number of semiconductor tubes in the incomplete box is less than a preset shaking limit number, filling empty tubes in the incomplete box.

[0040] For the partially filled box filled with the empty filling tube, the corresponding specific configuration solution is generated according to the conventional packaging specifications.

[0041] According to some embodiments of the present application, the number of components in each tube packaging box includes the number of components in a full box and the number of components in an incomplete box;

[0042] The determining the number of components contained in each tube packaging box according to the upper limit number of tubes in the packaging, the upper limit number of components that can be accommodated in a single tube, and the number of components corresponding to each unfilled tube includes:

[0043] For each of the partially filled boxes, the number of components contained in the corresponding partially filled box is determined according to the upper limit number of components that can be accommodated by a single tube and the number of components corresponding to each of the unfilled tubes;

[0044] For each of the full boxes, the number of components contained in the corresponding full box is determined according to the upper limit number of tubes for packaging and the upper limit number of components that can be accommodated in a single tube.

[0045] According to some embodiments of the present application, for each of the partially filled boxes, determining the number of components contained in the corresponding partially filled box according to the upper limit number of components that can be accommodated by a single tube and the number of components corresponding to each of the unfilled tubes includes:

[0046] For each of the partially filled boxes, determining the corresponding fully filled tube and the underfilled tube;

[0047] For the unfilled box, summing the number of components corresponding to each of the unfilled tubes to obtain the first sub-number of the unfilled box;

[0048] For the unfilled box, summing the upper limit number of components that can be contained in a single tube corresponding to each of the fully filled tubes to obtain a second sub-number of components contained in the unfilled box;

[0049] The number of components in the unfull box is obtained by summing the first sub-number of components in the unfull box and the second sub-number of components in the unfull box corresponding to the unfull box.

[0050] According to some embodiments of the present application, before selecting the missing charging tubes for the target packaging batch and counting the number of missing charging tubes to obtain the number of missing charging tubes in the batch and the number of components corresponding to each missing charging tube, the method further includes:

[0051] Scanning a tube identification code for each semiconductor tube to obtain tube grade constraint information corresponding to each semiconductor tube;

[0052] Scanning a component identification code of each semiconductor component in each semiconductor material tube to obtain a component grade corresponding to each semiconductor component in the semiconductor material tube;

[0053] For the semiconductor components whose component grades do not satisfy the material pipe grade constraint information, the semiconductor components are sorted out from the corresponding semiconductor material pipe and marked as grade problem components.

[0054] According to some embodiments of the present application, before selecting the missing charging tubes for the target packaging batch and counting the number of missing charging tubes to obtain the number of missing charging tubes in the batch and the number of components corresponding to each missing charging tube, the method further includes:

[0055] Capturing an image of each semiconductor material tube to obtain a corresponding tube-mounted component image; wherein the tube-mounted component image is used to present each semiconductor component housed in the corresponding semiconductor material tube;

[0056] The selecting and counting the missing charging tubes for the target packaging batch to obtain the number of missing charging tubes in the batch and the number of components corresponding to each missing charging tube includes:

[0057] Based on the tube-mounted component image corresponding to each semiconductor tube, the tube-mounted component image is counted to obtain the number of tubes without loading in the batch and the number of components corresponding to each tube without loading.

[0058] According to some embodiments of the present application, before counting the number of the tube-packaged component images based on the tube-packaged component images corresponding to each semiconductor tube, the method further includes:

[0059] Performing component appearance inspection on each of the semiconductor components housed in the semiconductor material tube based on the tube-mounted component image;

[0060] The semiconductor components that do not meet the appearance qualification conditions during the component appearance inspection are sorted out from the semiconductor material tube and marked as components with appearance problems.

[0061] According to some embodiments of the present application, the semiconductor components that do not meet the appearance qualification conditions during the component appearance inspection are sorted out from the semiconductor material tube and marked as components with appearance problems, including:

[0062] In response to the presence of the semiconductor component that does not meet the appearance qualification condition in the tube-packaged component image, re-capturing the image of the semiconductor material tube to update the tube-packaged component image;

[0063] In response to the updated tube element image still having the semiconductor element that does not meet the appearance qualified condition, the semiconductor element that does not meet the appearance qualified condition is picked out from the semiconductor tube and marked as an appearance problem element.

[0064] According to some embodiments of the present application, the semiconductor tubes of the target packaging batch and the target batch information corresponding to the target packaging batch are obtained.

[0065] A target carrying box filled with a plurality of semiconductor tubes is obtained, wherein each semiconductor tube filled in the target carrying box belongs to the same target packaging batch.

[0066] A carrying box identifier configured in the target carrying box is scanned to obtain the target batch information corresponding to the target packaging batch.

[0067] In a second aspect, embodiments of the present application provide a packaging device for semiconductor tubes, comprising:

[0068] A batch information obtaining module is configured to obtain semiconductor tubes of a target packaging batch and target batch information corresponding to the target packaging batch, wherein the semiconductor tubes are used to accommodate semiconductor elements, and each semiconductor tube has the same upper limit element number of single tube accommodation; wherein a full-load tube is a semiconductor tube that reaches the upper limit element number of single tube accommodation, and an under-load tube is a semiconductor tube that does not reach the upper limit element number of single tube accommodation.

[0069] A batch number counting module is configured to count the number of under-load tubes for the target packaging batch to obtain a batch under-load tube root number and an element number corresponding to each under-load tube.

[0070] A packaging parameter calculation module is configured to calculate packaging parameters according to a preset upper limit tube root number of packaging, the batch under-load tube root number, the element number corresponding to each under-load tube, the upper limit element number of single tube accommodation, and the target batch information to obtain a box-loaded element number corresponding to each tube packaging box, a tube configuration scheme, and a total number of batch packaging boxes.

[0071] A tube packaging module is configured to perform a packaging operation on each semiconductor tube based on the box-loaded element number of each tube packaging box, the tube configuration scheme, and the total number of batch packaging boxes to obtain each tube packaging box corresponding to the target packaging batch.

[0072] In a third aspect, embodiments of the present application provide a computer-readable storage medium, wherein the storage medium stores a program, and the program is executed by a processor to implement the packaging method for semiconductor tubes according to any one of the embodiments of the first aspect of the present application.

[0073] The semiconductor tube packaging method, device, and storage medium according to the embodiments of the present application have at least the following beneficial effects:

[0074] According to the packaging method of semiconductor material tubes of the embodiment of the present application, it is necessary to first obtain semiconductor material tubes of the target packaging batch and target batch information corresponding to the target packaging batch. The semiconductor material tubes are used to accommodate semiconductor components, and each semiconductor material tube has the same upper limit number of components that can be accommodated in a single tube; wherein, the semiconductor material tubes that reach the upper limit number of components that can be accommodated in a single tube are fully filled material tubes, and the semiconductor material tubes that do not reach the upper limit number of components that can be accommodated in a single tube are underfilled material tubes; for the target packaging batch, underfilled material tubes are selected and counted to obtain the number of underfilled material tubes in the batch and the number of components corresponding to each underfilled material tube; packaging parameters are calculated based on the preset upper limit number of material tubes for packaging, the number of underfilled material tubes in the batch, the number of components corresponding to each underfilled material tube, the upper limit number of components per tube, and the target batch information to obtain the number of components on the box corresponding to each material tube packaging box, the material tube configuration plan, and the total number of packaging boxes in the batch; packaging operations are performed on each semiconductor material tube based on the number of components on the box corresponding to each material tube packaging box, the material tube configuration plan, and the total number of packaging boxes in the batch to obtain each material tube packaging box corresponding to the target packaging batch. In this way, this semiconductor tube packaging method effectively improves packaging efficiency, reduces error rates, simplifies quality control processes, and provides a high-efficiency, high-quality solution for semiconductor tube packaging through automated tube classification, unfilled tube statistics, packaging parameter calculation, and packaging operations.

[0075] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become obvious from the description below, or will be learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0076] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0077] Figure 1 A schematic flow chart of a method for packaging a semiconductor material tube according to an embodiment of the present application;

[0078] Figure 2 for Figure 1 A flow chart of step S101 in FIG.

[0079] Figure 3 A schematic diagram of a process for marking components with grade issues in an embodiment of the present application;

[0080] Figure 4 for Figure 1 A flow chart of step S102;

[0081] Figure 5 This is a schematic diagram of a process for counting the number of tubes lacking material based on images of tube-mounted components in an embodiment of the present application;

[0082] Figure 6 A schematic diagram of a process for marking components with appearance problems in an embodiment of the present application;

[0083] Figure 7 for Figure 6 A flow chart of step S602;

[0084] Figure 8 for Figure 1 A flow chart of step S103;

[0085] Figure 9 for Figure 8 A flow chart of step S802 in FIG.

[0086] Figure 10 for Figure 8 A flow chart of step S803 in FIG.

[0087] Figure 11 for Figure 10 A flow chart of step S1001 in FIG.

[0088] Figure 12 for Figure 10 A flow chart of step S1002;

[0089] Figure 13 A schematic diagram of a process for generating a corresponding specific configuration solution for each unfilled box in an embodiment of the present application;

[0090] Figure 14 for Figure 13 A flow chart of step S1302;

[0091] Figure 15 for Figure 8 A flow chart of step S804;

[0092] Figure 16 for Figure 15 A flow chart of step S1501 in FIG.

[0093] Figure 17 This is a schematic block diagram of a module of a semiconductor tube packaging device provided in an embodiment of the present application;

[0094] Figure 18 This is a schematic diagram of the hardware structure of the electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0095] The following describes in detail embodiments of the present application. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application and are not to be construed as limiting the present application.

[0096] In the description of this application, "several" means one or more, "many" means more than two, "greater than," "less than," and "exceed" are understood to exclude the number itself, while "above," "below," and "within" are understood to include the number itself. The terms "first" and "second" are used solely to distinguish technical features and are not to be construed as indicating or implying relative importance, or as implicitly specifying the number or order of the technical features indicated.

[0097] In the description of this application, it should be understood that descriptions involving orientations, such as up, down, left, right, front, and back, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on this application.

[0098] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0099] In the description of this application, it should be noted that, unless otherwise explicitly defined, terms such as "set," "install," and "connect" should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in this application based on the specific content of the technical solution. In addition, the identification of specific steps below does not represent a limitation on the order of steps and execution logic. The execution order and execution logic between each step should be understood and inferred with reference to the content described in the embodiments.

[0100] The following is an explanation of the technical terms involved in the embodiments of this application:

[0101] The packaging process of semiconductor components is aimed at loading a packaging batch of semiconductor components into corresponding semiconductor tubes, and then packaging these semiconductor tubes into tube packaging boxes according to specific packaging requirements and parameters.

[0102] Semiconductor tubes refer to tubes used to hold semiconductor components. Packaged and tested semiconductor components (such as diodes, transistors, etc.) are placed in semiconductor tubes according to certain quantities and specifications for easy storage, transportation and use.

[0103] In the semiconductor packaging field, the technical terms "batch" and "lot" are often used interchangeably. They both refer to semiconductor components grouped together during the packaging process. A batch, or lot, corresponds to a group of semiconductor components. During the semiconductor component packaging process, packaging operations are typically performed in lots.

[0104] A target packaging batch refers to a packaging batch of semiconductor components that is about to be packaged during the packaging process. The target packaging batch contains a certain number of semiconductor tubes.

[0105] The upper limit of the number of components that can be accommodated in a single tube refers to the maximum number of semiconductor components that can be accommodated in a semiconductor material tube.

[0106] A fully filled tube refers to a semiconductor tube that is already filled with components and has reached the upper limit of the number of components that can be accommodated in a single tube.

[0107] An underfilled tube refers to a semiconductor tube that has not been fully loaded with components and has not reached the upper limit of the number of components that can be accommodated in a single tube.

[0108] The total number of components in a batch refers to the total number of semiconductor components in the target packaging batch.

[0109] The total number of components in full tubes refers to the total number of components in all full tubes in a target packaging batch;

[0110] The total number of components in missing tubes refers to the total number of components in all missing tubes in a target packaging batch.

[0111] The upper limit of the number of tubes in a package refers to the maximum number of tubes that each tube packaging box can accommodate.

[0112] The number of fully filled tubes in a batch refers to the total number of fully filled tubes in the target packaging batch.

[0113] The number of missing loading tubes in a batch refers to the total number of missing loading tubes in the target packaging batch.

[0114] The tube packaging box refers to the packaging box used to package the semiconductor tubes after they are packaged.

[0115] The total number of boxes in a batch refers to the total number of tube packaging boxes formed after packaging the semiconductor tubes in the target packaging batch. The tube packaging boxes can include full boxes and partially full boxes.

[0116] A full box refers to a situation where the number of fully filled tubes in a tube packaging box reaches the upper limit of the number of tubes in the packaging.

[0117] An underfilled box refers to a situation where the number of fully filled tubes in a tube packaging box does not reach the upper limit of the number of tubes in the packaging.

[0118] The number of full boxes refers to the number of full boxes in the total number of boxes in a batch.

[0119] The number of unfilled boxes refers to the number of unfilled boxes in the total number of boxes in a batch.

[0120] The number of components in a box refers to the number of semiconductor components in a tube packaging box. The number of components in a box can include the number of components in a full box and the number of components in a partially full box.

[0121] The number of components in a full box refers to the total number of components in all the tubes in the full box.

[0122] The number of components in a partially filled box refers to the total number of components in all tubes (whether fully filled or partially filled) in the partially filled box.

[0123] The tube configuration scheme is used to describe the arrangement of semiconductor tubes in each tube packaging box.

[0124] It should be clear that in the process of packaging semiconductor material tubes for the target packaging batch, the embodiment of the present application can define multiple material tube configuration schemes for the target packaging batch, so as to facilitate the distribution of the semiconductor material tubes contained in the target packaging batch into their respective material tube packaging boxes according to the material tube configuration scheme to complete the packaging of the semiconductor material tubes.

[0125] The packaging process for semiconductor tubes involves a complex and tedious manual process, encompassing multiple steps, including visual inspection, identification verification, labeling, label application, label verification, vacuum packaging, folding cartons, and packaging in cartons. Each step requires manual intervention, making the entire packaging process inefficient and prone to human error. For example, during the visual inspection phase, operators must carefully examine the appearance of each semiconductor component within each tube. Any oversight could result in unqualified components being passed to the next stage. Similarly, identification verification and label verification rely on manual labor. Operators must ensure that each label matches the actual semiconductor component and tube. The complexity and repetitive nature of this process significantly increase the risk of error. Furthermore, manual involvement in the packaging of semiconductor tubes makes it difficult to ensure the consistency of the number and grade of components within each tube, and it is also difficult to prevent mix-ups and incorrect loading.

[0126] It is worth noting that there is currently no automated packaging line in the industry specifically for packaging semiconductor tubes, which cannot effectively reduce packaging costs and makes it difficult to achieve standardization and information management of the packaging process.

[0127] Therefore, the limitations of related technologies not only affect production efficiency, but also put forward higher requirements for the quality control and traceability of semiconductor components in tube packaging and semiconductor material tube packaging.

[0128] Overall, current technologies related to semiconductor tube packaging suffer from low efficiency, high error rates, and difficulty in quality control in complex manual operation processes. In particular, it is difficult to accurately determine the corresponding packaging parameters for each tube packaging box. There is an urgent need to improve overall packaging efficiency and quality through the introduction of automated technology.

[0129] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes a semiconductor material tube packaging method and device, and a storage medium, which can perform high-efficiency and high-quality packaging operations on semiconductor material tubes.

[0130] The following is a further explanation based on the accompanying drawings.

[0131] Reference Figure 1 The packaging method of a semiconductor material tube according to an embodiment of the present application may include:

[0132] Step S101, obtaining semiconductor tubes of a target packaging batch and target batch information corresponding to the target packaging batch;

[0133] Step S102: selecting missing charging tubes for the target packaging batch and counting the number of missing charging tubes in the batch and the number of components corresponding to each missing charging tube;

[0134] Step S103: Calculate packaging parameters based on the preset upper limit for the number of tubes, the number of tubes missing from the batch, the number of components corresponding to each missing tube, the upper limit for the number of components that can be contained in a single tube, and the target batch information to determine the number of components in each tube packaging box, the tube configuration, and the total number of boxes in the batch.

[0135] Step S104 , performing packaging operations on each semiconductor tube based on the number of components on each tube packaging box, the tube configuration scheme, and the total number of boxes in the batch packaging, to obtain tube packaging boxes corresponding to the target packaging batch.

[0136] The semiconductor material tube packaging method shown in steps S101 to S104 of the present application requires first obtaining semiconductor material tubes of a target packaging batch and target batch information corresponding to the target packaging batch. The semiconductor material tubes are used to accommodate semiconductor components, and each semiconductor material tube has the same upper limit number of components that can be accommodated in a single tube. Among them, a semiconductor material tube in which the number of semiconductor components placed in the tube reaches the upper limit number of components that can be accommodated in a single tube is a fully filled material tube, and a semiconductor material tube in which the number of semiconductor components placed in the tube does not reach the upper limit number of components that can be accommodated in a single tube is an underfilled material tube. The underfilled material tubes are selected for the target packaging batch and the number is counted. , obtaining the number of missing tubes in a batch and the number of components corresponding to each missing tube; calculating packaging parameters based on the preset upper limit of tubes, the number of missing tubes in a batch, the number of components corresponding to each missing tube, the upper limit of components that can be accommodated by a single tube, and the target batch information, to obtain the number of components in each tube packaging box, the tube configuration scheme, and the total number of boxes in the batch; and performing packaging operations on each semiconductor tube based on the number of components in each tube packaging box, the tube configuration scheme, and the total number of boxes in the batch, obtaining tube packaging boxes corresponding to the target packaging batch. This effectively improves semiconductor tube packaging efficiency, reduces error rates, simplifies quality control processes, and provides a highly efficient and high-quality solution for semiconductor tube packaging.

[0137] In some embodiments, step S101 is to obtain semiconductor tubes of a target packaging batch and target batch information corresponding to the target packaging batch;

[0138] It should be noted that during the semiconductor packaging process, each packaging batch has its own unique set of information, namely, corresponding batch information. In some embodiments, the batch information of a packaging batch may include, but is not limited to, the packaging batch number, production date, component type, component specifications, component quantity, and quality control data. In some embodiments, the batch information may be generated by the semiconductor component production management system and continuously updated and referenced during the semiconductor component production, testing, and packaging process. It should be noted that the target batch information refers to the batch information of the target packaging batch.

[0139] In some embodiments, the first step in semiconductor tube packaging is to obtain semiconductor tubes of a target packaging batch and target batch information corresponding to the target packaging batch. It should be noted that using semiconductor tubes as containers for semiconductor components can ensure that the semiconductor components can be stored safely. Each semiconductor tube has an upper limit on the number of components that can be accommodated in a single tube, which is determined by the physical size and design of the semiconductor tube. It should be noted that the upper limit on the number of components that can be accommodated in a single tube means that each semiconductor tube has a fixed capacity, which is the maximum number of semiconductor components that the semiconductor tube can accommodate.

[0140] In this step, the semiconductor tubes of the present embodiment include fully filled tubes and underfilled tubes. A fully filled tube refers to a semiconductor tube that has been fully loaded with components, reaching the upper limit of the number of components that a single tube can hold. These fully filled tubes fully utilize their capacity. In contrast, an underfilled tube refers to a semiconductor tube that has not yet been fully loaded with components, not reaching the upper limit of the number of components that a single tube can hold. These underfilled tubes may not be fully loaded due to various reasons during the production process (such as component shortages, quality control, etc.).

[0141] In some embodiments, batch information can be used to guide and verify each step of the semiconductor tube packaging process. For example, once batch information is obtained, it can be used to determine how to allocate semiconductor components to corresponding semiconductor tubes. Another example is the batch information used to determine the number of semiconductor components that each semiconductor tube should contain. Furthermore, batch information can be used for quality traceability. If a problem is discovered with a semiconductor tube or component in the future, the batch information can be used to trace the problem back to the specific step in the production process, allowing for problem diagnosis and quality improvement.

[0142] Reference Figure 2 According to some embodiments of the present application, step S101 of obtaining semiconductor tubes of a target packaging batch and target batch information corresponding to the target packaging batch includes:

[0143] Step S201, obtaining a target transport box filled with a plurality of semiconductor tubes; wherein the semiconductor tubes filled in the target transport box belong to the same target packaging batch;

[0144] Step S202 : Scan the tote identification configured on the target tote to obtain target batch information corresponding to the target packaging batch.

[0145] In some embodiments, step S201 involves obtaining a target tote containing a plurality of semiconductor tubes. It should be noted that tote boxes are used on a production line for temporary or long-term storage of semiconductor tubes. Each tote box contains semiconductor components from the same packaging batch. This storage method helps maintain batch consistency and simplifies management and tracking. The target tote box is used to store semiconductor tubes corresponding to the target packaging batch.

[0146] In step S202 of some embodiments, target batch information corresponding to a target packaging batch is obtained by scanning a tote identifier associated with the target tote. It should be noted that the tote identifier can be a barcode or a QR code, and by scanning the tote identifier, target batch information regarding the target tote and the semiconductor tubes contained therein, such as the batch number, production date, tube quantity, component type, etc., can be obtained. Scanning this tote identifier is an automated data collection process, enabling embodiments of the present application to quickly and accurately determine the target batch information to which the target tote belongs, specifically for the semiconductor tube packaging process.

[0147] Through the embodiment of the present application shown in steps S201 to S202, each semiconductor material tube and the target batch information to which it belongs can be accurately associated. This not only helps ensure accuracy during the packaging process, but also provides a basis for quality control and product traceability. It should be understood that by obtaining the target tote and scanning the tote identification, it helps to ensure that each semiconductor material tube can be correctly identified and processed, thereby achieving efficient and accurate packaging operations.

[0148] Reference Figure 3 According to some embodiments of the present application, before selecting missing charging tubes for a target packaging batch and counting the number of missing charging tubes in step S102 to obtain the number of missing charging tubes in the batch and the number of components corresponding to each missing charging tube, the following steps may also be performed:

[0149] Step S301 , scanning the tube identification code of each semiconductor tube to obtain tube grade constraint information corresponding to each semiconductor tube;

[0150] Step S302 , scanning the component identification code of each semiconductor component in each semiconductor material tube to obtain the component grade corresponding to each semiconductor component in the semiconductor material tube;

[0151] In step S303 , for semiconductor components whose component grades do not meet the material tube grade constraint information, the semiconductor components are sorted out from the corresponding semiconductor material tube and marked as grade problem components.

[0152] In some embodiments of the present application, step S102 includes a detailed inspection and verification of the semiconductor tube and its internal components. The purpose of this process is to ensure that the components in each tube meet the predetermined grade requirements, thereby ensuring the quality of the final product.

[0153] In step S301 of some embodiments, each semiconductor tube is scanned for its tube identification code. The tube identification code may include information about the semiconductor tube's specifications, grade, and other key production parameters. By scanning these tube identification codes, grade constraint information corresponding to each tube can be obtained. This grade constraint information defines the grade of components that should be included in the semiconductor tube. This step helps ensure the correct grade of components in the tube, as it provides reference data for subsequent component inspections.

[0154] In some embodiments, step S302 scans the component identification code of each semiconductor component in each semiconductor tube. The component identification code may include information such as the component model, production batch, and performance grade. By scanning the component identification code, the grade of the components in the tube can be determined, thereby verifying whether each semiconductor component in the semiconductor tube meets the grade requirements of the semiconductor tube. This step involves individually inspecting each semiconductor component to ensure that they meet the grade constraints of the corresponding semiconductor tube.

[0155] In step S303 of some embodiments, if any semiconductor components are found whose grade does not meet the material tube grade constraint information, these semiconductor components need to be sorted out from the corresponding semiconductor material tube and marked as grade-problem components. This step ensures that only components that meet grade requirements are loaded into the material tube. Sorting out and marking grade-problem components not only helps prevent unqualified products from entering downstream links but also facilitates subsequent quality review and problem tracking. These grade-problem components can be stored separately for further inspection or rework.

[0156] Steps S301 to S303 of the present embodiment constitute a meticulous quality control process, ensuring that the semiconductor components in each semiconductor tube meet the corresponding grade requirements. This automated quality control not only improves the accuracy and efficiency of the packaging process, but also helps maintain product quality and reliability, reducing potential risks and costs caused by grade mismatches.

[0157] In step S102 of some embodiments, the number of the empty component tubes is counted for the target packaging batch, to obtain the number of the empty component tubes in the batch and the number of components in each empty component tube.

[0158] It should be noted that step S102 aims to count the number of the empty component tubes in the target packaging batch. The empty component tube refers to a semiconductor tube that is not yet full of components and does not reach the upper limit of the number of components that can be accommodated in a single tube. In this step, the embodiments of the present application need to identify all the empty component tubes and count the specific number of these empty component tubes, i.e., the number of the empty component tubes in the batch. In addition, the number of components actually contained in each empty component tube also needs to be counted.

[0159] According to some embodiments of the present application, in the process of obtaining the semiconductor tubes of the target packaging batch, each semiconductor tube can be configured with a corresponding sequence. The sequence can reflect whether the semiconductor tube is an empty component tube or a full component tube. For example, the sequence of the empty component tube is in the front, and the sequence of the full component tube is in the back. Based on this, the embodiments of the present application can obtain the first semiconductor tube as the empty component tube according to the sequence. In this way, the number of the empty component tubes in the target packaging batch can be quickly counted.

[0160] In summary, step S102 counts the number of the empty component tubes and records the number of components in each empty component tube automatically. By counting the number of the empty component tubes, the number of the component tubes that are not completely full of components in the target packaging batch, i.e., the number of the empty component tubes in the batch, can be accurately mastered. Knowing the number of the empty component tubes in the batch can help to calculate how many component tube packaging boxes are needed, and in some cases, it can also help to determine the component tube configuration scheme in the subsequent steps, so as to more effectively utilize the space of the component tube packaging boxes. On the other hand, counting the number of components in each empty component tube helps to clarify the actual component distribution in the target packaging batch, so as to calculate the component tube configuration scheme of the full component tube and the empty component tube through the subsequent steps, ensuring that each component tube packaging box can be optimally configured according to the actual component distribution in the packaging process of the semiconductor tube, thereby improving the space utilization and packaging efficiency.

[0161] Referring to Figure 4 According to some embodiments of the present application, step S102 of counting the number of the empty component tubes for the target packaging batch can include:

[0162] In step S401, for each semiconductor tube of the target packaging batch, an empty component tube is selected as a current empty component tube.

[0163] Step S402, counting the number of components for the currently missing charging tube to obtain the number of components corresponding to the currently missing charging tube;

[0164] Step S403: Select a missing tube from the remaining semiconductor tubes in the target packaging batch as the current missing tube, and return to perform component counting for the current missing tube until all missing tubes in the target packaging batch are selected to obtain the component count corresponding to each missing tube.

[0165] Step S404: Count the number of missing loading tubes in the target packaging batch to obtain the number of missing loading tubes in the batch.

[0166] In some embodiments, step S401 selects a missing tube as the current missing tube for each semiconductor tube in a target packaging batch. This step can utilize a visual inspection system, a sensor, or barcode scanning technology to select the missing tube as the current missing tube.

[0167] In some embodiments, step S402 counts the number of components in the currently missing tube to determine the number of components corresponding to the currently missing tube. It should be noted that the number of components contained in each missing tube in the target packaging batch, when used as the currently missing tube, can be determined using step 402. This step helps clarify the filling status of each missing tube. The number of components corresponding to each missing tube is used in subsequent packaging parameter calculations and tube configuration decisions.

[0168] In some embodiments, step S403 continues by selecting missing tubes from the remaining tubes in the target packaging batch and repeatedly counting the number of components until all missing tubes have been counted. This loop ensures a detailed count of each missing tube, providing complete data support for packaging parameter calculation and tube configuration determination.

[0169] In some embodiments, step S404 counts all missing tubes in the target packaging batch to obtain the total number of missing tubes in the batch, i.e., the number of missing tubes in the batch. It should be noted that counting the number of missing tubes in the batch can be used to determine the number of tube packaging boxes required, how to configure these tube packaging boxes to accommodate the semiconductor tubes in the target packaging batch, and how to allocate full tubes and missing tubes.

[0170] The embodiment of the present application, illustrated through steps S401 to S404, accurately determines the number of fully filled tubes and the number of components in each underfilled tube within a target packaging batch. This data provides a basis for calculating packaging parameters and developing an effective tube configuration plan, ensuring high efficiency during the packaging process.

[0171] Reference Figure 5According to some embodiments of the present application, before selecting missing charging tubes for a target packaging batch and counting the number of missing charging tubes in step S102 to obtain the number of missing charging tubes in the batch and the number of components corresponding to each missing charging tube, the following steps may also be performed:

[0172] Step S501: Capture an image of each semiconductor tube to obtain a corresponding tube-mounted component image; wherein the tube-mounted component image is used to present each semiconductor component housed in the corresponding semiconductor tube;

[0173] In step S102, missing charging tubes are selected for the target packaging batch and counted to obtain the number of missing charging tubes in the batch and the number of components corresponding to each missing charging tube, including:

[0174] Step S502 : Based on the tube-mounted component image corresponding to each semiconductor tube, missing tubes are selected for a target packaging batch and counted to obtain the number of missing tubes in the batch and the number of components corresponding to each missing tube.

[0175] In step 501 of some embodiments, an image is captured for each semiconductor tube to obtain a corresponding tube-mounted component image. The tube-mounted component image is used to represent the semiconductor components housed within the corresponding semiconductor tube. It should be noted that the tube-mounted component image is a visual representation of the individual semiconductor components within the tube, providing an intuitive reference for subsequent component counts. Capturing an image of each semiconductor tube allows for capturing the arrangement and number of components within the tube through visual inspection methods. The resulting tube-mounted component image provides basic data for subsequent analysis.

[0176] Reference Figure 6 According to some embodiments of the present application, before step S502 of selecting missing tubes for a target packaging batch and counting the number of tube-packaged components corresponding to each semiconductor tube, the following may also be included:

[0177] Step S601 , performing a component appearance inspection on each semiconductor component housed in a semiconductor material tube based on the tube-mounted component image;

[0178] In step S602 , semiconductor components that do not meet the appearance qualification criteria during the component appearance inspection are sorted out from the semiconductor material tube and marked as components with appearance problems.

[0179] In some embodiments, step S601 performs a visual inspection of each semiconductor component housed in a semiconductor tube based on the tube-packaged component image. This step is a crucial component of quality control, as it uses automated visual inspection to inspect the appearance of each component to ensure it is free of damage, cracks, contamination, or other defects that could affect performance.

[0180] It should be noted that the component appearance inspection can specifically acquire the tube component image by using a high-resolution camera, and identify and evaluate whether there is an abnormality on the component surface in the tube component image by combining an image processing algorithm. These image processing algorithms can be compared with preset appearance standards, automatically detect appearance deviations, and mark components that do not meet the appearance qualified condition. This automatic appearance inspection greatly improves the speed and accuracy of the inspection, and reduces the subjectivity and errors that may be introduced by manual inspection.

[0181] Step S602 of some embodiments is to pick out the semiconductor components that do not meet the appearance qualified condition in the component appearance inspection from the semiconductor tube and mark them as appearance problem components. This step ensures that only the semiconductor components that meet the appearance qualified condition are retained in the semiconductor tube, and those semiconductor components with potential problems are separated out for further analysis and processing. Picking out the appearance problem components not only helps to improve the quality of the final product, but also helps to prevent these appearance problem components from causing greater losses in subsequent production or use.

[0182] Reference Figure 7 According to some embodiments of the present application, step S602 of picking out and marking the semiconductor components that do not meet the appearance qualified condition in the component appearance inspection from the semiconductor tube as appearance problem components can include:

[0183] Step S701 is to re-image the semiconductor tube to update the tube component image in response to the presence of semiconductor components that do not meet the appearance qualified condition in the tube component image.

[0184] Step S702 is to pick out the semiconductor components that do not meet the appearance qualified condition from the semiconductor tube and mark them as appearance problem components in response to the presence of semiconductor components that do not meet the appearance qualified condition in the updated tube component image.

[0185] Step S701 of some embodiments is to re-image the semiconductor tube to update the tube component image when it is detected that there are semiconductor components that do not meet the appearance qualified condition in the tube component image. It should be noted that re-imaging the semiconductor tube can be due to a variety of reasons, including unclear initial image, component position change, or missing some components during the first inspection. By re-imaging, more accurate component position and state information in the semiconductor tube can be obtained, which helps the appearance inspection and number statistics of the semiconductor components.

[0186] In step S702 of some embodiments, if the updated tube-mounted component image still shows semiconductor components that do not meet the appearance qualification conditions, a sorting operation will need to be performed to sort out these semiconductor components that do not meet the appearance qualification conditions from the semiconductor material tube and mark them as components with appearance problems. This step demonstrates the strictness of the quality control of the embodiments of the present application. That is, after re-capturing the image, all semiconductor components that do not meet the conditions will be removed to ensure that the semiconductor material tube contains only components with appearance qualifications. This strict handling of components with appearance problems not only improves product quality, but also helps to reduce problems that may arise in subsequent production processes.

[0187] Steps S701 and S702 of the present embodiment constitute an automated quality control process that ensures that the appearance of the semiconductor components in the semiconductor tube meets strict standards. By continuously updating image data and accurately sorting out components with appearance problems, the accuracy of the packaging process is improved, and product quality is better guaranteed.

[0188] Through steps S601 to S602 of the embodiment of the present application, this automated appearance inspection and problem component sorting process not only improves packaging efficiency, but also ensures that only components that meet appearance standards will be included in the final packaging, and components with appearance problems will be sorted out, thereby better ensuring product quality.

[0189] In some embodiments, step S502 selects missing tubes from a target packaging batch based on the tube-mounted component image corresponding to each semiconductor tube and performs a count to obtain the number of missing tubes in the batch and the number of components corresponding to each missing tube. It should be noted that this step utilizes image processing and pattern recognition technology to automatically identify and count the components presented in the tube-mounted component image. This image-based counting method improves statistical accuracy and efficiency by reducing errors and omissions in manual counting and speeding up processing.

[0190] The embodiment of the present application, illustrated through steps S501 and S502, constitutes an automated, image-based process for counting tube components. This provides an efficient and accurate component counting method before counting missing tubes and components. This image-based processing method not only improves the accuracy and efficiency of the packaging process, but also ensures product quality and reduces potential risks and costs associated with inaccurate counting.

[0191] In some embodiments, step S103 calculates packaging parameters based on a preset upper limit for the number of tubes to be packaged, the number of tubes missing from a batch, the number of components corresponding to each missing tube, the upper limit for the number of components that can be accommodated in a single tube, and target batch information, to determine the number of components in each tube packaging box, the tube configuration, and the total number of boxes in the batch.

[0192] In some embodiments, step S103 is the core step in the semiconductor tube packaging method, which involves the calculation of packaging parameters so as to most effectively distribute the semiconductor tubes into the tube packaging boxes in subsequent steps to improve packaging efficiency and meet specific packaging requirements.

[0193] In some embodiments, the packaging parameter calculation process may involve determining how many components each tube packaging box should contain, how to configure the tubes (including full tubes and underfilled tubes) in the tube packaging box to maximize space utilization, and how to ensure that the packaging meets specific quality standards and packaging requirements.

[0194] It's important to understand that if semiconductor tube packaging is simply packaged sequentially without precise packaging parameter calculations, the number of tubes and components in each tube box will be inconsistent. In this case, tube packaging efficiency and accuracy cannot be guaranteed, as the packaging state of each box will vary due to human factors, lacking consistency and predictability.

[0195] Therefore, to ensure packaging consistency and efficiency, all tubes and their component quantities for a target packaging batch must be comprehensively planned and uniformly calculated according to specific rules. In some cases, the primary principle of this planning is to prioritize filling full tubes, while the remaining unfilled tubes need to be distributed according to specific rules to ensure that the packaging state of each tube box is as close to the optimal state as possible.

[0196] In related technologies, in manual packaging scenarios, operators can use simple calculations and intuitive recognition to distinguish between full and underfilled tubes and package them according to a predetermined number of labels. The operator's experience and intuitive judgment play a key role in this process, allowing them to flexibly adjust the packaging plan based on actual conditions.

[0197] However, the situation becomes much more complex during automated packaging. In some embodiments of this application, it is necessary to automatically identify full and underfilled tubes, calculate the ideal packaging state for each tube packaging box, and accurately distribute them. This not only involves the physical identification and counting of semiconductor tubes, but also closely links with the subsequent actual packaging operations.

[0198] To overcome these difficulties, the embodiments of the present application automatically identify full and not full tubes and automatically determine various packaging parameters, facilitating subsequent automatic packaging of semiconductor tubes, achieving high efficiency and high quality of the entire automatic packaging process. In this way, not only the accuracy of packaging is improved, but also the possibility of human error is reduced.

[0199] It should be noted that the upper limit of the number of tubes refers to the maximum number of tubes that can be accommodated in each tube packaging box. This upper limit of the number of tubes can be preset based on the size and design of the tube packaging box to ensure that the semiconductor tubes can be safely stored and transported. The number of missing tubes in the batch and the number of elements corresponding to each missing tube provide specific information about the filling status of the missing tubes in the current batch, which is crucial for determining how to allocate full and missing tubes.

[0200] It should be emphasized that the upper limit of the number of elements per tube refers to the maximum number of semiconductor elements that can be accommodated in a semiconductor tube. This upper limit of the number of elements per tube helps to calculate the number of semiconductor elements in different tube packaging boxes, i.e., the number of elements per box. The target batch information can include the total number of elements in the target packaging batch.

[0201] In related technologies, the packaging process of semiconductor tubes mainly relies on manual operation, so it is often not necessary to accurately determine the specific tube configuration scheme of each tube packaging box. In the manual packaging process, the tubes are usually placed in the packaging box according to experience and on-site conditions, which lacks accuracy and consistency, and is inefficient and prone to errors.

[0202] In contrast, the present application provides an automatic solution by accurately calculating and generating a tube configuration scheme for each tube packaging box, and the subsequent step can place the tubes in the packaging box according to the tube configuration scheme.

[0203] Specifically, the present application first obtains the upper limit of the number of tubes, the number of missing tubes in the batch, the number of elements corresponding to each missing tube, the upper limit of the number of elements per tube, and the target batch information for the target packaging batch through an automatic manner. Further, considering various different situations such as full and not full boxes, a corresponding tube configuration scheme is generated for each situation based on the above-mentioned parameters to ensure that the embodiments of the present application can efficiently and accurately package semiconductor tubes. Subsequently, the semiconductor tubes are filled into the tube packaging box according to the generated tube configuration scheme, which can improve the packaging efficiency and accuracy.

[0204] It should be understood that the tube configuration scheme determined by the automated calculation can make each tube packaging box (whether full or not full) achieve a relatively ideal space utilization rate, which not only reduces material waste, but also helps to reduce logistics costs. In addition, the tube configuration scheme also helps to improve the automation level of the production line. Through the tube configuration scheme, the automated packaging process can accurately place each semiconductor tube into the designated tube packaging box, reducing the need for manual operation, reducing the possibility of human error, and improving the work efficiency of semiconductor tube packaging.

[0205] Based on the above various parameters, the packaging parameter calculation in step S103 will need to determine the number of box-carrying elements corresponding to each tube packaging box, the tube configuration scheme, and the total number of boxes for batch packaging. The number of box-carrying elements refers to the total number of elements that should be included in each tube packaging box, which directly affects the filling rate and space utilization efficiency of the tube packaging box. The tube configuration scheme specifies the arrangement of full tubes and missing tubes in each tube packaging box to ensure that all semiconductor tubes can be reasonably placed. The total number of boxes for batch packaging refers to the total number of tube packaging boxes formed after packaging the semiconductor tubes in the target packaging batch. Among them, the tube packaging box can include full boxes and not full boxes.

[0206] It should be understood that the embodiments of the present application can ensure high efficiency and high accuracy of the packaging process through accurate packaging parameter calculation, while reducing errors in manual operation and improving packaging consistency. In addition, the automated calculation process also helps to reduce labor costs and improve the overall performance of the production line. It can be seen that this method can provide a clear and predictable packaging scheme for semiconductor tube packaging, ensuring that each tube packaging box can meet the required packaging requirements.

[0207] Reference Figure 8 According to some embodiments of the present application, step S103 performs packaging parameter calculation according to the preset upper limit number of tubes, the number of missing tubes in the batch, the number of elements corresponding to each missing tube, the upper limit number of elements for single tube accommodation, and the target batch information, to obtain the number of box-carrying elements corresponding to each tube packaging box, the tube configuration scheme, and the total number of boxes for batch packaging, which can include:

[0208] Step S801 extracts the total number of batch elements corresponding to the target packaging batch from the target batch information;

[0209] Step S802 determines the number of full tubes in the batch based on the total number of batch elements, the number of elements corresponding to each missing tube, and the upper limit number of elements for single tube accommodation;

[0210] Step S803: Determine the total number of packaging boxes in the batch and the tube configuration plan corresponding to each tube packaging box based on the number of tubes that are unfilled in the batch, the number of tubes that are fully filled in the batch, and the upper limit number of tubes in the batch.

[0211] Step S804 , determining the number of components contained in each tube packaging box based on the upper limit number of tubes to be packaged, the upper limit number of components that can be accommodated in a single tube, and the number of components corresponding to each unfilled tube.

[0212] In some embodiments, step S801 extracts the total number of components in the batch corresponding to the target packaging batch from the target batch information. This total number of components in the batch determines the scale of components to be packaged in the entire target packaging batch. It should be noted that the total number of components in the batch is one of the key data included in the target batch information.

[0213] In step S802 of some embodiments, embodiments of the present application determine the number of fully loaded tubes in the batch based on the total number of components in the batch, the number of components corresponding to each unloaded tube, and the upper limit number of components that can be accommodated by a single tube. It should be noted that fully loaded tubes refer to tubes that are fully loaded with semiconductor components, reaching the upper limit number of components that can be accommodated by a single tube. Based on the total number of components in the batch, the number of components in the unloaded tubes, and the upper limit number of components that can be accommodated by a single tube, embodiments of the present application can calculate the number of fully loaded tubes in the batch corresponding to the fully loaded tubes in the target batch information.

[0214] Reference Figure 9 According to some embodiments of the present application, step S802 determines the number of fully loaded tubes in a batch based on the total number of components in the batch, the number of components corresponding to each unloaded tube, and the upper limit number of components that a single tube can hold, and may include:

[0215] Step S901, summing the number of components corresponding to each missing charging tube to calculate the total number of missing charging tube components of the semiconductor components in each missing charging tube;

[0216] Step S902, performing a subtraction calculation based on the total number of components in the batch and the total number of components in the unfilled tubes to obtain the total number of semiconductor components in each fully filled tube;

[0217] Step S903 , performing a quotient operation based on the total number of components in the fully filled tubes and the upper limit number of components that can be accommodated in a single tube, to determine the number of fully filled tubes in the batch.

[0218] In step S901 of some embodiments, the present invention sums the number of components corresponding to each missing tube to calculate the total number of missing tube components for all semiconductor components in the missing tubes. The present invention can calculate the total number of missing tube components by collecting the number of components for each missing tube and then adding these numbers. It should be noted that the total number of missing tube components refers to the total number of components in all missing tubes in a target packaging batch.

[0219] In step S902 of some embodiments, the present invention calculates the total number of semiconductor components in full tubes by subtracting the total number of components in the batch from the total number of components in the missing tubes. This step is accomplished through a subtraction operation: the total number of components in the missing tubes is subtracted from the total number of components in the batch of the entire target packaging batch. The result is the total number of components in all full tubes. It should be noted that the total number of components in full tubes refers to the total number of components in all full tubes in a target packaging batch.

[0220] In step S903 of some embodiments, the present invention calculates the quotient of the total number of fully filled tubes and the upper limit of the number of components that can be accommodated in a single tube to determine the number of fully filled tubes in the batch. This step is accomplished by dividing the total number of fully filled tubes by the upper limit of the number of components that can be accommodated in a single tube. The result of this division is the number of fully filled tubes in the batch, i.e., the number of tubes that are fully filled with components, reaching the upper limit of the number of components that can be accommodated in a single tube.

[0221] In some more specific embodiments, the total number of components in a batch can be expressed as X, and the upper limit number of components that can be accommodated in each semiconductor tube can be expressed as A. max The number of components corresponding to each missing loading tube can be expressed as A1, A2, A3, ..., A M , where M is the number of missing charging tubes in a batch, and the number of components corresponding to each missing charging tube is less than A max .

[0222] First, the number of components corresponding to each missing charging tube is A1, A2, A3, ..., A M Sum up and calculate the total number Y of missing charging tube components, which can be expressed as:

[0223]

[0224] Furthermore, the total number of components in the batch, X, and the total number of components in the unfilled tubes, Y, are calculated by subtracting each other to obtain the total number of components in the fully filled tubes, which can be expressed as XY.

[0225] Further, according to the total number of full loading tube elements X-Y and the upper limit number of single tube containing elements A max By performing the arithmetic operation, the number of full loading tubes Z in the batch can be determined, which can be expressed as:

[0226]

[0227] Through the steps S901 to S903 shown in the embodiments of the present application, the number of full loading tubes Z in the target packaging batch can be accurately determined, which is crucial for subsequent packaging parameter calculation and tube configuration scheme. This automated calculation method not only improves the accuracy and efficiency of calculation, but also reduces the possibility of human error, ensuring the accuracy and efficiency of the packaging process.

[0228] In step S803 of some embodiments, according to the number of under loading tubes in the batch, the number of full loading tubes in the batch, and the upper limit number of tubes for packaging, the total number of packaging boxes for the batch and the tube configuration scheme corresponding to each tube packaging box are determined. Tube packaging box refers to the packaging box used to package semiconductor tubes after packaging. The total number of packaging boxes for the batch refers to the total number of tube packaging boxes formed after packaging semiconductor tubes in the target packaging batch. The tube configuration scheme describes the arrangement of semiconductor tubes in each tube packaging box.

[0229] It should be emphasized that during the packaging process of semiconductor tubes in the target packaging batch, the embodiments of the present application can define multiple tube configuration schemes for the target packaging batch, so as to allocate the semiconductor tubes contained in the target packaging batch into the respective tube packaging boxes according to the tube configuration scheme. The upper limit number of tubes for packaging refers to the maximum number of tubes that can be accommodated in each tube packaging box. The embodiments of the present application can reasonably determine the tube configuration scheme of each tube packaging box under the premise of meeting the upper limit number of tubes for packaging. In the subsequent step, the full loading tubes and under loading tubes are allocated into different tube packaging boxes according to the tube configuration scheme, which can ensure that all semiconductor tubes can be reasonably packaged.

[0230] Referring to Figure 10 According to some embodiments of the present application, the tube configuration scheme includes a full box conventional configuration scheme and a non-full box specific configuration scheme. Step S803 determines the total number of packaging boxes for the batch and the tube configuration scheme corresponding to each tube packaging box according to the number of under loading tubes in the batch, the number of full loading tubes in the batch, and the upper limit number of tubes for packaging, which can include:

[0231] In step S1001, full box counting is performed according to the number of full loading tubes in the batch and the upper limit number of tubes for packaging to determine the conventional configuration scheme of each full box, the number of full boxes, and the full tube remainder;

[0232] Step S1002: Count the unfilled boxes based on the remaining number of full tubes, the number of tubes without material in the batch, and the upper limit of the number of tubes for packaging to determine the specific configuration scheme and the number of unfilled boxes for each unfilled box;

[0233] Step S1003 , summing the number of full boxes and the number of unfull boxes to obtain the total number of boxes in the batch.

[0234] In some embodiments of the present application, the tube configuration scheme involves how to effectively allocate full tubes and underfilled tubes to different tube packaging boxes. Specifically, the tube configuration scheme can include a conventional configuration scheme for full boxes and a specific configuration scheme for underfilled boxes, ensuring that all semiconductor tubes are properly packaged while meeting the space utilization and component protection requirements of the tube packaging box. A full box refers to a situation where the number of fully filled tubes in a tube packaging box reaches the upper limit of the number of tubes allowed for packaging, while an underfilled box refers to a situation where the number of fully filled tubes in a tube packaging box does not reach the upper limit of the number of tubes allowed for packaging.

[0235] In step S1001 of some embodiments, full boxes are counted based on the number of fully filled tubes in a batch and the upper limit of the number of tubes in the packaging. The purpose of this step is to determine the conventional configuration scheme, the number of full boxes, and the remaining number of full tubes for each full box. It should be noted that for the target packaging batch of semiconductor tubes, conventional configuration schemes and specific configuration schemes may be included. Among them, the conventional configuration scheme refers to the tube configuration scheme that completely fills the tube packaging box with fully filled tubes. The packaging specification of semiconductor tubes packaged according to the conventional configuration scheme is called the conventional packaging specification; the specific configuration scheme refers to the tube configuration scheme that fills the tube packaging box with all or part of the unfilled tubes.

[0236] The embodiment of the present application calculates the number of full material tubes and the number of material tubes that each material tube packaging box can accommodate, so as to determine how many complete full boxes can be formed and the number of full tubes remaining; wherein, the number of full tubes remaining refers to the number of full material tubes that will remain after all the full boxes of the target packaging batch are filled.

[0237] Reference Figure 11 According to some embodiments of the present application, step S1001 counts full boxes based on the number of full tubes in a batch and the upper limit of the number of tubes in a package to determine the conventional configuration scheme, the number of full boxes, and the remaining number of full tubes for each full box, which may include:

[0238] Step S1101: Generate a conventional configuration plan for each full box based on the upper limit number of tubes for packaging;

[0239] Step S1102, performing a quotient operation on the number of fully filled tubes in a batch and the number of tubes at the upper limit of packaging to obtain the number of full boxes and the remainder of full tubes.

[0240] In step S1101 of some embodiments, a standard configuration scheme is generated for each full box based on the upper limit of the number of tubes for packaging. Based on the upper limit of the number of tubes for packaging, embodiments of the present application can determine the number of fully filled tubes that should be included in each full box, thereby generating a standard standard configuration scheme. This standard configuration scheme provides a template for each full box, ensuring that all full boxes are filled according to the same standard, thereby improving packaging consistency and efficiency. For example, a tube packaging box filled according to the standard configuration scheme is required to include 7 fully filled tubes.

[0241] In step S1102 of some embodiments, a quotient operation is performed on the number of fully filled tubes in a batch and the upper limit number of tubes in the packaging to obtain the number of full boxes and the remainder of full tubes. It should be noted that the upper limit number of tubes in the packaging refers to the maximum number of tubes that can be accommodated in each tube packaging box. Based on this upper limit number of tubes in the packaging, the embodiments of the present application can determine how many tubes should be contained in each full box. Based on this, the quotient operation is performed on the number of fully filled tubes in a batch and the upper limit number of tubes in the packaging to obtain the number of full boxes in the total number of boxes in the batch packaging, as well as the remainder of full tubes of full tubes that will remain after all full boxes are formed by the full number of tubes in the batch.

[0242] In some more specific embodiments, the upper limit of the number of tubes in a package can be expressed as N, and the number of tubes fully filled in a batch can be expressed as Z. Based on this, the quotient operation of the number of tubes fully filled in a batch Z and the upper limit of the number of tubes in a package N is performed to obtain the number of full boxes P and the remainder of full tubes g, which can be expressed as:

[0243]

[0244] g=Z mod N

[0245] Where [.] represents rounding. mod represents remainder, i.e., Z mod N = g, which means "the number of fully filled tubes in a batch, Z, is divided by the upper limit number of tubes in the package, N, and the remainder is the remainder g."

[0246] In step S1002 of some embodiments, the partially filled boxes are counted based on the remaining number of full tubes, the number of tubes missing from the batch, and the upper limit of the number of tubes for packaging, as obtained in the previous step. The purpose of this step is to determine the specific configuration scheme and the number of partially filled boxes for each partially filled box. It should be noted that a partially filled box refers to a situation where the number of fully filled tubes in a tube packaging box does not reach the upper limit of the number of tubes for packaging, and a specific configuration scheme refers to a tube configuration scheme in which all or some of the missing tubes are used to fill the tube packaging. A specific configuration scheme can be a tube configuration scheme that mixes full and missing tubes for packaging, or a tube configuration scheme that specifically packages missing tubes.

[0247] Reference Figure 12According to some embodiments of the present application, step S1002 counts the unfilled boxes based on the remaining number of full tubes, the number of tubes without filling in the batch, and the upper limit of the number of tubes for packaging to determine the specific configuration scheme and the number of unfilled boxes for each unfilled box, which may include:

[0248] Step S1201, the sum of the remaining number of full tubes and the number of tubes without filling in the batch is determined as the underfill calculation factor;

[0249] Step S1202, performing a quotient operation on the underfill calculation factor and the upper limit number of tubes for packaging;

[0250] In step S1203, in response to the unfilled box calculation factor being divided by the upper limit number of tubes for packaging in the quotient operation, a corresponding specific configuration scheme is generated for each unfilled box, and the quotient of the unfilled box calculation factor and the upper limit number of tubes for packaging is determined as the number of unfilled boxes.

[0251] In some embodiments of the present application, step S1002 focuses on determining a specific configuration scheme for the underfilled boxes and the number of underfilled boxes. This step is performed after the number of full boxes and the number of full tubes remaining have been determined, in order to ensure that the underfilled tubes can also be properly packaged.

[0252] In some embodiments, step S1201 adds the remaining full tubes to the number of tubes missing from the batch to determine a non-full box calculation factor. This non-full box calculation factor is the basis for counting non-full boxes. It reflects the total number of tubes remaining after a full box is formed. The non-full box calculation factor includes the remaining full tubes and the number of tubes missing from the batch.

[0253] In some embodiments, step S1202 calculates the quotient of the underfill factor and the upper limit of the number of tubes per packaging box. This is accomplished by dividing the underfill factor by the upper limit of the number of tubes per tube packaging box. This division is used to determine how many tube packaging boxes are needed to accommodate the remaining tubes after the box is full.

[0254] In step S1203 of some embodiments, if the underfill calculation factor is evenly divisible by the upper limit of tube count in the packaging process, a specific configuration solution is generated for each underfill box, and the quotient of the underfill calculation factor and the upper limit of tube count is used as the number of underfill boxes. This means that if the total number of remaining tubes is evenly divisible by the upper limit of tube count for each tube packaging box, each underfill box will have a specific configuration solution to ensure that the semiconductor tubes are correctly loaded into the box.

[0255] According to some embodiments of the present application, after performing a quotient operation on the underfill box calculation factor and the upper limit number of tubes for packaging in step S1102, the following step S1204 may also be included.

[0256] In step S1204 of some embodiments, in response to the fact that the unfilled box calculation factor cannot be divided evenly by the upper limit number of packaging tubes in the quotient operation, a corresponding specific configuration scheme is generated for each unfilled box, and the quotient of the unfilled box calculation factor and the upper limit number of packaging tubes is summed with 1 to obtain the number of unfilled boxes.

[0257] In some embodiments of the present application, in addition to considering the case where the underfill box calculation factor can be divided evenly by the upper limit number of tubes of packaging, it is also necessary to handle the complex case where the underfill box calculation factor cannot be divided evenly by the upper limit number of tubes of packaging.

[0258] After calculating the quotient of the underfill calculation factor and the maximum number of tubes allowed for packaging, if the underfill calculation factor is not evenly divisible by the maximum number of tubes allowed for packaging, this indicates that insufficient tubes exist to fill a standard tube packaging box. To address this situation, a specific configuration is generated for each underfilled box. This specific configuration is based on the specific number and characteristics of the remaining tubes to ensure that all semiconductor tubes are efficiently packaged.

[0259] Furthermore, the quotient of the partial box calculation factor and the maximum number of tubes to be packed is added to 1 to obtain the number of partial boxes. This operation ensures that even when the number is not divisible evenly, the number of partial boxes required to accommodate all remaining tubes can be accurately calculated. The reason for adding 1 to the quotient is that even if the number of remaining tubes is not enough to fill a full tube box, an additional tube box is still required to pack the remaining tubes.

[0260] Through this meticulous processing in the embodiments of the present application, it is possible to ensure that all semiconductor tubes, whether fully filled or underfilled, are properly packaged without omission. This method improves the flexibility and adaptability of the packaging process, ensuring that the packaging task can be completed efficiently even when faced with an irregular number of remaining tubes.

[0261] In some more specific embodiments, the number of full tubes remaining can be expressed as g, and the number of tubes without filling in a batch can be expressed as M. Therefore, the calculation factor of the underfilled box can be expressed as g+M.

[0262] Furthermore, the quotient of the underfill calculation factor g+M and the upper limit number of tubes N can be expressed as:

[0263]

[0264] In response to the fact that the underfill calculation factor g+M is divisible by the upper limit number of tubes N in the packaging, that is, (g+M) mod N=0, a corresponding specific configuration solution needs to be generated for each underfill box, and the quotient of the underfill calculation factor and the upper limit number of tubes is calculated. Determine the number of unfilled boxes Q, that is,

[0265]

[0266] In response to the fact that the unfilled box calculation factor g+M cannot be divided by the upper limit number of tubes N in the packaging, that is, (g+M) mod N≠0, it is necessary to generate a corresponding specific configuration solution for each unfilled box, and calculate the quotient of the unfilled box calculation factor and the upper limit number of tubes Sum with 1 to get the number of unfilled boxes Q, which is

[0267] The embodiment of the present application, illustrated by steps S1101 to S1103, can accurately determine the number and configuration of partially filled boxes, ensuring that all semiconductor tubes, whether fully filled or underfilled, are effectively packaged. This automated counting and configuration generation process improves packaging efficiency, reduces human error, and ensures packaging consistency and reliability.

[0268] In some embodiments, step S1003 sums the number of full boxes and the number of unfull boxes to obtain the total number of boxes in the batch. This step is used to determine the total number of tube packaging boxes required to complete the entire batch. This total number of boxes in the batch is crucial information for material requirement planning, logistics planning, and cost control.

[0269] Steps S1001 to S1003 provided in this embodiment of the present application constitute a detailed tube allocation process, ensuring that both fully loaded and underfilled tubes are properly allocated to different tube packaging boxes. This automated allocation solution not only improves packaging efficiency but also ensures packaging consistency and reliability, ultimately achieving highly efficient and high-quality packaging operations.

[0270] Reference Figure 13 According to some embodiments of the present application, generating a corresponding specific configuration scheme for each unfilled box may include:

[0271] Step S1301: When the number of tubes in the unfilled box reaches the upper limit of the number of tubes to be packaged, a corresponding specific configuration scheme is generated for the unfilled box according to conventional packaging specifications; wherein the conventional packaging specifications refer to packaging specifications for semiconductor tubes according to conventional configuration schemes;

[0272] Step S1302 : When the number of tubes in the unfilled box does not reach the upper limit of the number of tubes in packaging, a corresponding specific configuration scheme is generated for the unfilled box according to the number of semiconductor tubes in the unfilled box.

[0273] In some embodiments of the present application, generating a specific configuration for each partially filled box is a critical step, ensuring that the packaging process can proceed efficiently and safely even when the tubes are partially filled. This process involves two different scenarios, corresponding to whether the number of tubes in the partially filled box has reached the maximum tube count allowed for packaging.

[0274] In step S1301 of some embodiments, if the number of material tubes in the unfilled box reaches the upper limit of the number of material tubes for packaging, a corresponding specific configuration scheme will be generated for the unfilled box according to the conventional packaging specifications. It should be emphasized that the conventional configuration scheme refers to the material tube configuration scheme that completely fills the material tube packaging box with full material tubes. The packaging specifications for packaging semiconductor material tubes according to the conventional configuration scheme are called conventional packaging specifications; the specific configuration scheme refers to the material tube configuration scheme that fills the material tube packaging box with fully or partially unfilled material tubes. In this case, although these semiconductor material tubes are not completely filled with components, their number reaches the maximum number of material tubes that the material tube packaging box can accommodate, so they can be packaged according to the standard process. This ensures the consistency and efficiency of packaging, while also ensuring that the space in the material tube packaging box is fully utilized.

[0275] In step S1302 of some embodiments, if the number of semiconductor tubes in the partially filled box does not reach the upper limit for tubes, a specific configuration scheme is generated for the partially filled box based on the actual number of semiconductor tubes in the partially filled box. In this case, a specific configuration scheme is required to accommodate tube packaging boxes with tubes that do not reach the upper limit for tubes, ensuring that all semiconductor tubes are properly placed and protected. This specific configuration scheme may involve the arrangement of the semiconductor tubes, the use of filler materials, and other protective measures to ensure the safety of the semiconductor tubes during transportation and storage.

[0276] Reference Figure 14 According to some embodiments of the present application, step S1302 generates a corresponding specific configuration scheme for the incomplete box according to the number of semiconductor tubes in the incomplete box, which may include:

[0277] Step S1401 , if the number of semiconductor tubes in the unfilled box is less than a preset sway limit, empty tubes are added to the unfilled box;

[0278] Step S1402 : For the partially filled box filled with the empty filling tube, a corresponding specific configuration scheme is generated according to conventional packaging specifications.

[0279] In step S1401 of some embodiments, if the number of semiconductor tubes in a partially filled box is not only less than or equal to the number of small-size tubes but also below a preset sway limit, embodiments of the present application will fill the partially filled box with empty tubes. The sway limit is an important parameter that defines the minimum number of tubes in a package to ensure the stability of the package during transportation and handling. If the number of tubes falls below this limit, the tubes may sway within the tube packaging box, increasing the risk of damage. Therefore, by filling the box with empty tubes, the total number of tubes in the tube packaging box can be increased, sway can be reduced, and the stability of the package and the safety of the components can be ensured.

[0280] In step S1402 of some embodiments, for partially filled boxes that contain empty tubes, embodiments of the present application generate a corresponding specific configuration according to conventional packaging specifications. This specific configuration takes into account the presence of the filling tubes and ensures that all tubes, including those containing components and empty tubes, are properly positioned and protected. Smaller configurations may include special arrangements, the use of filling materials, or other protective measures to accommodate a smaller number of tubes, including empty tubes.

[0281] Through steps S1401 and S1402, this embodiment of the present application can provide a customized solution for partially filled boxes with a small number of tubes, ensuring that these packages meet stability requirements while protecting the components inside from damage. This meticulous approach improves the adaptability and flexibility of packaging, ensuring that all tubes, regardless of quantity, can be packaged safely and efficiently.

[0282] By processing these two situations in steps S1401 and S1402, the embodiment of the present application can flexibly handle different quantities of semiconductor tubes and generate appropriate packaging solutions. This flexibility and adaptability are key to improving packaging efficiency and ensuring packaging quality. It ensures that all semiconductor tubes, regardless of quantity, can be packaged safely and efficiently, while also reducing the risk of component damage caused by improper packaging.

[0283] The embodiment of the present application, illustrated through steps S1301 to S1302, can flexibly handle varying quantities of semiconductor tubes and generate appropriate packaging solutions. This flexibility and adaptability are key to improving packaging efficiency and ensuring packaging quality. It ensures that all semiconductor tubes, regardless of quantity, are packaged safely and efficiently, while also reducing the risk of component damage due to improper packaging.

[0284] In step S804 of some embodiments, the present invention determines the number of components to be contained in each tube packaging box based on the upper limit for the number of tubes to be packaged, the upper limit for the number of components that can be contained in a single tube, and the number of components corresponding to each unfilled tube. This step requires comprehensive consideration of the number of components in each semiconductor tube and the capacity of the tube packaging box to ensure that the total number of components in each tube packaging box meets the predetermined standard.

[0285] The embodiment of the present application, illustrated through steps S801 to S804, utilizes an automated calculation method to quickly determine how to optimally utilize the space within the tube packaging box, how to properly allocate the semiconductor tubes, and how to ensure that the required number of components in each tube packaging box is met. This embodiment of the present application not only improves packaging efficiency but also reduces the possibility of human error, providing a reliable and efficient solution for semiconductor tube packaging.

[0286] Reference Figure 15 According to some embodiments of the present application, the number of components contained in each tube packaging box includes the number of components contained in a full box and the number of components contained in a partially filled box. Step S804 determines the number of components contained in each tube packaging box based on the upper limit of the number of tubes to be packaged, the upper limit of the number of components that can be accommodated in a single tube, and the number of components corresponding to each unfilled tube. This may include:

[0287] Step S1501: for each partially filled box, the number of components in the corresponding partially filled box is determined based on the upper limit of the number of components that can be accommodated by a single tube and the number of components corresponding to each unfilled tube;

[0288] Step S1502 : For each full box, determine the number of components in the corresponding full box according to the upper limit number of tubes for packaging and the upper limit number of components that can be accommodated in a single tube.

[0289] In some embodiments of the present application, the number of components contained in each tube packaging box is a key parameter. This includes both the number of components contained in a full box and the number of components contained in a partially filled box. These two numbers together determine the total number of components in the tube packaging box and are crucial for ensuring packaging efficiency and meeting customer needs.

[0290] In step S1501 of some embodiments, for each partially filled box, the present invention determines the number of components contained in the partially filled box based on the packaging limit for tubes and the number of components corresponding to each unfilled tube. Because the number of fully filled tubes in a partially filled box does not reach the packaging limit for tubes, the actual number of components in these tubes must be specifically considered.

[0291] It's important to emphasize that the "upper limit" for tubes refers to the maximum number of tubes that each tube packaging box can accommodate. The "number of components per missing tube" indicates the actual number of components in each missing tube. By combining these two parameters, the present embodiment can calculate the total number of components in each partially filled box, ensuring that even partially filled boxes can accurately record and track the number of components in the box.

[0292] Reference Figure 16 According to some embodiments of the present application, step S1501 determines the number of components in each partially filled box according to the upper limit of the number of components that can be accommodated by a single tube and the number of components corresponding to each unfilled tube, and may include:

[0293] Step S1601: for each partially filled box, determine the corresponding fully filled tube and underfilled tube;

[0294] Step S1602 , for the unfilled box, sum the number of components corresponding to each missing tube in the box to obtain the first sub-number of the unfilled box;

[0295] Step S1603 , for the partially filled box, summing the upper limit number of components that can be contained in each fully filled tube, to obtain the second sub-number of the partially filled box;

[0296] Step S1604 , summing the first sub-number of the unfull box and the second sub-number of the unfull box corresponding to the unfull box to obtain the number of components in the unfull box.

[0297] In some embodiments of the present application, step S1501 focuses on determining the number of components contained in each partially filled box. This process is a key step in ensuring packaging efficiency and accuracy, and involves detailed analysis and calculation of fully filled and underfilled tubes.

[0298] In step S1601 of some embodiments, the embodiments of the present application will determine the full material tubes and the empty material tubes contained in each unfilled box. The embodiments of the present application can provide the necessary basic data for subsequent calculations.

[0299] In step S1602 of some embodiments, the present invention sums the number of components corresponding to each missing tube in the partially filled cassette to obtain a first sub-number of components in the partially filled cassette. This step aims to calculate the total number of components corresponding to each missing tube in the partially filled cassette. The number of components contained in these missing tubes is an important component of the number of components in the partially filled cassette.

[0300] In step S1603 of some embodiments, the present invention sums the upper limit of component capacity per tube for each full tube in the less-than-full cassette to obtain a second sub-number of components in the less-than-full cassette. This step aims to calculate the total number of components in each full tube in the less-than-full cassette. The number of components contained in these full tubes is a significant component of the total number of components in the less-than-full cassette.

[0301] In step S1604 of some embodiments, the present invention sums the first sub-number of the unfilled box and the second sub-number of the unfilled box corresponding to the unfilled box to obtain the number of components in the unfilled box. This unfilled box number reflects the total number of components corresponding to all tubes (whether fully loaded or underfilled) in the current unfilled box.

[0302] Through the series of steps S1601 to S1604, the embodiment of the present application can accurately determine the number of boxes loaded that are not full. This automated calculation method not only improves the efficiency and accuracy of the packaging process, but also reduces the possibility of human error, providing a flexible and reliable solution for semiconductor tube packaging.

[0303] In some specific embodiments, fully filled tubes refer to tubes that are already fully loaded with components, reaching the upper limit of the number of components that can be accommodated in a single tube. Since fully filled tubes already meet the upper limit of the component count specified in the packaging requirements, prioritizing fully filled tubes in the packaging parameter calculation can quickly reduce the number of tubes requiring further calculation and processing, thereby improving the efficiency of the overall packaging parameter calculation. Therefore, to optimize packaging efficiency and space utilization, some embodiments prioritize fully filled tubes over underfilled tubes in the packaging parameter calculation process.

[0304] On this basis, the previous step needs to count the full boxes according to the number of full tubes in the batch and the upper limit of the number of tubes in the packaging, and the remaining number of full tubes can be obtained. It should be noted that the remaining number of full tubes refers to the number of full tubes that will remain after all the full boxes of the target packaging batch are filled. The remaining number of full tubes can be expressed as g. The upper limit of the number of tubes in the packaging can be expressed as N, and the upper limit of the number of components that can be accommodated in a single tube can be expressed as A. max If the unfilled box contains k missing tubes (k≤N), the corresponding numbers are 1, 2, ..., k, and the number of components corresponding to each missing tube can be expressed as A1, A2, A3, ..., A k .

[0305] After packing the full boxes, there is only one unfull box:

[0306] First, sum the number of components corresponding to each missing tube in the unfilled box to obtain the first sub-number H of the unfilled box. (1), which can be expressed as:

[0307] H (1) =A1+A2+...+A k

[0308] Furthermore, for the unfilled box, the sum of the upper limit number of components that can be accommodated in a single tube corresponding to each full tube is calculated to obtain the second sub-number of unfilled boxes. Since the remainder of the full tube can be expressed as g, and the number of components in each full tube is the upper limit number of components that can be accommodated in a single tube A max Based on this, the sum of the upper limit number of components that can be accommodated by each fully filled tube is calculated to obtain the second sub-number of unfilled boxes H. (2) , which can be expressed as:

[0309] H (2) =gA max

[0310] Finally, the number of components in the unfull box is obtained by summing the number of the first sub-box and the number of the second sub-box corresponding to the unfull box, which can be expressed as:

[0311] H=H (1) +H (2) =A1+A2+...+A k +gA max

[0312] It is clear that after the full boxes are packed, there is only one incomplete box, and the number of components H in the incomplete box can be calculated as above.

[0313] For the situation where after packing a full box, two or more incomplete boxes are obtained:

[0314] In some embodiments of the present application, during the packaging process of a partially filled box, priority is given to packaging of fully filled tubes, followed by packaging of insufficient tubes. Based on this, for different partially filled boxes, the number of components in the corresponding partially filled box needs to be calculated in different ways.

[0315] First, focus on the first unfilled box and sum the upper limit number of components that can be accommodated in a single tube corresponding to each full tube to obtain the second sub-number of unfilled boxes. Since the remainder of the full tube can be expressed as g, and the number of components in each full tube is the upper limit number of components that can be accommodated in a single tube A max .

[0316] Based on this, for the first unfilled box, the sum of the upper limit number of components that each full tube corresponds to is calculated to obtain the second sub-number H1 of the unfilled box. (2) , which can be expressed as:

[0317] H1 (2) =gAmax

[0318] Since the number of tubes with the upper limit of the packaging is expressed as N, for the first unfilled box, the number of components corresponding to each unfilled tube in the unfilled box is summed up to get the first sub-number H1 of the unfilled box. (1) , which can be expressed as:

[0319] H1 (1) =A1+A2+...+A N-g

[0320] For the first unfilled box, add the first sub-number H1 to the unfilled box corresponding to the unfilled box (1) and the number of the second sub-box not full H1 (2) Sum up and get the corresponding number of components H1 in the unfilled box, which can be expressed as:

[0321] H1=H1 (1) +H1 (2) =A1+A2+...+A N-g +gA max

[0322] Furthermore, the number of components is calculated for the partially packed box containing only missing tubes. Of the k missing tubes, there are k-(Ng) missing tubes remaining, and (Ng) tubes are already included in the calculation of the number of components in the first partially packed box.

[0323] For the second incomplete box, which only contains missing filling tubes, it is necessary to determine the number of components corresponding to each missing filling tube contained therein, and then add up these component numbers to obtain the number H2 of components contained in the second incomplete box.

[0324] After obtaining the number of components H2 in the second incomplete box, if there are still missing tubes, we can further determine the number of components corresponding to each missing tube in the third incomplete box, which only contains the missing tubes. Then, we need to sum up these numbers of components to obtain the number of components H3 in the third incomplete box.

[0325] This process is repeated until all k-(Ng) missing tubes are included in the calculation of the number of components, and the number of components in the i-th unfilled box is obtained. i .

[0326] In this way, it can be clearly understood that in the case where two or more incomplete boxes are obtained after a full box is packed, the number H of components contained in the incomplete boxes can be calculated as above.

[0327] In step S1502 of some embodiments, for each full box, embodiments of the present application determine the corresponding number of components contained in the full box based on the upper limit number of tubes for packaging and the upper limit number of components that can be accommodated in a single tube. A full box refers to a situation where the number of fully filled tubes in a tube packaging box reaches the upper limit number of tubes for packaging. Therefore, the number of components in each fully filled tube is known, i.e., the upper limit number of components that can be accommodated in a single tube. By multiplying the upper limit number of tubes for packaging by the upper limit number of components that can be accommodated in a single tube, embodiments of the present application can determine the total number of components in each full box, i.e., the number of components contained in the full box.

[0328] Through steps S1501 and S1502, the present embodiment can accurately determine the number of components contained in each tube packaging box, regardless of whether it is full or not. This precise calculation method not only improves the efficiency and accuracy of the packaging process, but also ensures that all semiconductor tubes, whether full or not, are accurately recorded and tracked, reducing the potential risks and costs caused by inaccurate records.

[0329] In step S104 of some embodiments, a packaging operation is performed on each semiconductor tube based on the number of components on each tube packaging box, the tube configuration scheme, and the total number of boxes in the batch packaging to obtain tube packaging boxes corresponding to the target packaging batch.

[0330] In some embodiments, step S104 marks the execution phase of the semiconductor tube packaging method. This step implements specific packaging operations based on the previously calculated number of components in the box, the tube configuration, and the total number of boxes in the batch. At this stage, embodiments of the present application accurately package each semiconductor tube based on these detailed parameters.

[0331] It's important to emphasize that the total number of boxes in a batch refers to the total number of tube packaging boxes formed after packaging the semiconductor tubes in the target packaging batch. Tube packaging boxes can include both full and partially full boxes. The number of components per box refers to the number of semiconductor components in a tube packaging box. This can include both full and partially full boxes. The tube configuration describes the arrangement of the semiconductor tubes within each tube packaging box.

[0332] During packaging operations, automated robotic systems can be used to accurately place each semiconductor tube into the designated tube packaging box based on the tube configuration plan. This process can involve precise robotic arm operation, as well as scanning and verification systems to ensure that each tube is correctly identified and placed.

[0333] In addition, packaging operations can also include sealing and labeling the tube packaging boxes. Each tube packaging box will be affixed with a label containing key information such as batch number, component model, number of components in the box, production date, etc. This information is crucial for subsequent inventory management, quality tracking and customer delivery.

[0334] It should be understood that step S104 is the actual operational stage of the semiconductor tube packaging method, ensuring that each semiconductor tube is accurately packaged into its corresponding tube packaging box according to predetermined parameters. This process not only improves packaging efficiency but also ensures packaging consistency and reliability. The resulting tube packaging boxes meet the target packaging batch requirements, ensuring the safe storage and transportation of semiconductor components.

[0335] Reference Figure 17 , an embodiment of the present application provides a semiconductor tube packaging device, which may include:

[0336] Batch information acquisition module 1701 is used to obtain semiconductor tubes of a target packaging batch and target batch information corresponding to the target packaging batch. Semiconductor tubes are used to accommodate semiconductor components, and each semiconductor tube has the same upper limit number of components that can be accommodated in a single tube. A fully filled tube is a semiconductor tube that has reached the upper limit number of components that can be accommodated in a single tube, and an underfilled tube is a semiconductor tube that has not reached the upper limit number of components that can be accommodated in a single tube.

[0337] The batch number counting module 1702 is used to select and count the missing charging tubes for the target packaging batch, and obtain the number of missing charging tubes in the batch and the number of components corresponding to each missing charging tube;

[0338] Packaging parameter calculation module 1703 is used to calculate packaging parameters based on the preset upper limit of tubes, the number of tubes missing in a batch, the number of components corresponding to each missing tube, the upper limit of components per tube, and the target batch information, to determine the number of components in each tube packaging box, the tube configuration plan, and the total number of boxes in the batch.

[0339] The tube packaging module 1704 is used to perform packaging operations on each semiconductor tube based on the number of components on each tube packaging box, the tube configuration scheme, and the total number of boxes in the batch packaging, to obtain each tube packaging box corresponding to the target packaging batch.

[0340] It can be seen that the contents of the above-mentioned semiconductor material tube packaging method embodiment are all applicable to the embodiment of the semiconductor material tube packaging device. The functions specifically implemented by the embodiment of the semiconductor material tube packaging device are the same as those of the above-mentioned semiconductor material tube packaging method embodiment, and the beneficial effects achieved are also the same as those achieved by the above-mentioned semiconductor material tube packaging method embodiment.

[0341] Reference Figure 18 , Figure 18 The hardware structure of an electronic device according to another embodiment is shown. The electronic device may include:

[0342] The processor 1801 may be implemented using a general-purpose CPU (Central Processing Unit), a microprocessor, an application-specific integrated circuit (ASIC), or one or more integrated circuits, and is configured to execute relevant programs to implement the technical solutions provided in the embodiments of the present application.

[0343] The memory 1802 can be implemented in the form of a read-only memory (ROM), a static storage device, a dynamic storage device, or a random access memory (RAM). The memory 1802 can store an operating system and other application programs. When the technical solutions provided in the embodiments of this specification are implemented through software or firmware, the relevant program code is stored in the memory 1802 and is called by the processor 1801 to execute the semiconductor tube packaging method of the embodiments of this application.

[0344] Input / output interface 1803, used to implement information input and output;

[0345] Communication interface 1804, used to implement communication interaction between this device and other devices, which can be achieved through wired means (such as USB, network cable, etc.) or wireless means (such as mobile network, Wi-Fi, Bluetooth, etc.);

[0346] Bus 1805 , which transmits information between various components of the device (e.g., processor 1801 , memory 1802 , input / output interface 1803 , and communication interface 1804 );

[0347] The processor 1801 , the memory 1802 , the input / output interface 1803 and the communication interface 1804 are connected to each other in communication within the device via the bus 1805 .

[0348] The present application also provides a computer program product, which includes a computer program. A processor of a computer device reads and executes the computer program, so that the computer device executes the above-mentioned method for packaging semiconductor tubes.

[0349] The terms "first," "second," "third," "fourth," and the like (if any) in the specification of the present disclosure and the accompanying drawings are used to distinguish similar objects and are not necessarily used to describe a particular order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, so that the embodiments of the present disclosure described herein, for example, can be implemented in orders other than those illustrated or described herein. In addition, the terms "comprises" and "comprising," and any variations thereof, are intended to cover non-exclusive inclusions, e.g., a process, method, system, product, or apparatus comprising a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such process, method, product, or apparatus.

[0350] It should be understood that in the present disclosure, "at least one (item)" refers to one or more, and "plurality" refers to two or more. "And / or" is used to describe the association relationship of associated objects, indicating that three relationships may exist. For example, "A and / or B" can mean: only A exists, only B exists, and A and B exist at the same time, where A and B can be singular or plural. The character " / " generally indicates that the previous and next associated objects are in an "or" relationship. "At least one of the following items" or similar expressions refers to any combination of these items, including any combination of single items or plural items. For example, at least one of a, b or c can mean: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, c can be single or multiple.

[0351] It should be understood that in the description of the embodiments of the present application, multiple (or multiple items) means more than two, greater than, less than, exceed, etc. are understood to exclude the number itself, and above, below, within, etc. are understood to include the number itself.

[0352] In the several embodiments provided in the present disclosure, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. For example, the device embodiments described above are merely schematic. For example, the division of units is only a logical function division. In actual implementation, there may be other division methods, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be an indirect coupling or communication connection through some interfaces, devices or units, which can be electrical, mechanical or other forms.

[0353] The units described as separate components may or may not be physically separate, and the components displayed as units may or may not be physical units, i.e., may be located in one place, or may be distributed to multiple network units. Part or all of the units can be selected according to actual needs to achieve the purpose of the embodiment scheme.

[0354] In addition, each functional unit in various embodiments of the present disclosure can be integrated into one processing unit, or each unit can exist physically, or two or more units can be integrated into one unit. The integrated unit can be realized in the form of hardware or in the form of a software functional unit.

[0355] If the integrated unit is realized in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer readable storage medium. Based on such understanding, the technical solutions of the present disclosure essentially or the part that contributes to the prior art or the whole or part of the technical solutions can be embodied in the form of a software product. The computer software product is stored in a storage medium and includes a number of instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the various embodiments of the method of the present disclosure. The aforementioned storage medium can include: a U disk, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk, and various media that can store program codes.

[0356] It should also be appreciated that the various embodiments provided by the present application can be combined in any way to achieve different technical effects.

[0357] The above is a specific description of the embodiments of the present disclosure, but the present disclosure is not limited to the above embodiments. Those skilled in the art can make various equivalent modifications or replacements without departing from the spirit of the present disclosure, and these equivalent modifications or replacements are all included in the scope defined by the claims of the present disclosure.

Claims

1. A method for packaging a semiconductor tube, characterized in that: include: Obtaining semiconductor tubes of a target packaging batch and target batch information corresponding to the target packaging batch, wherein the semiconductor tubes are used to accommodate semiconductor components, and each of the semiconductor tubes has the same upper limit number of components that can be accommodated in a single tube. A semiconductor tube that reaches the upper limit number of components that can be accommodated in a single tube is considered a fully filled tube, and a semiconductor tube that does not reach the upper limit number of components that can be accommodated in a single tube is considered an underfilled tube. Selecting the missing charging tubes for the target packaging batch and counting the number thereof to obtain the number of missing charging tubes in the batch and the number of components corresponding to each missing charging tube; The packaging parameters are calculated based on the preset upper limit number of tubes for packaging, the number of tubes missing from the batch, the number of components corresponding to each missing tube, the upper limit number of components that can be accommodated in a single tube, and the target batch information to obtain the number of components in each tube packaging box, the tube configuration plan, and the total number of boxes in the batch, including: Extracting the total number of batch components corresponding to the target packaging batch from the target batch information; Determining the number of fully filled tubes in a batch based on the total number of components in the batch, the number of components corresponding to each of the unfilled tubes, and the upper limit number of components that a single tube can hold; Determine the total number of packaging boxes in the batch and the tube configuration plan corresponding to each tube packaging box based on the number of unfilled tubes in the batch, the number of fully filled tubes in the batch, and the upper limit number of tubes in the packaging; Determining the number of components contained in each tube packaging box according to the upper limit number of tubes in the packaging, the upper limit number of components that can be accommodated in a single tube, and the number of components corresponding to each unfilled tube; Performing a packaging operation on each of the semiconductor tubes based on the number of components on each tube packaging box, the tube configuration scheme, and the total number of packaging boxes in the batch, to obtain tube packaging boxes corresponding to the target packaging batch; The determining the number of fully loaded tubes in a batch based on the total number of components in the batch, the number of components corresponding to each of the unloaded tubes, and the upper limit number of components that can be accommodated by a single tube includes: Summing up the number of components corresponding to each of the missing charging tubes to calculate the total number of missing charging tube components of the semiconductor components in each of the missing charging tubes; Calculate the difference between the total number of components in the batch and the total number of components in the unfilled tubes to obtain the total number of fully filled tube components of the semiconductor components in each fully filled tube; The number of fully filled tubes in the batch is determined by performing a quotient operation based on the total number of fully filled tube components and the upper limit number of components that can be accommodated in a single tube.

2. The method according to claim 1, characterized in that The tube configuration scheme includes a conventional configuration scheme for full boxes and a special configuration scheme for underfull boxes. The total number of boxes in a batch and the tube configuration scheme corresponding to each tube packaging box are determined based on the number of tubes missing from the batch, the number of tubes fully filled in the batch, and the upper limit number of tubes in the packaging, including: Counting full boxes according to the number of full tubes in the batch and the upper limit of the number of tubes in the package to determine the conventional configuration scheme, the number of full boxes and the remaining number of full tubes for each full box; Count the unfilled boxes based on the remaining number of full tubes, the number of unfilled tubes in the batch, and the upper limit number of tubes for packaging, so as to determine a specific configuration scheme and the number of unfilled boxes for each unfilled box; The total number of boxes in the batch is obtained by summing the number of full boxes and the number of unfull boxes.

3. The method according to claim 2, characterized in that The full box counting is performed based on the number of full tubes in the batch and the upper limit number of tubes in the package to determine the conventional configuration scheme, the number of full boxes and the remaining number of full tubes for each full box, including: Generating the conventional configuration scheme for each full box according to the number of upper-limit feeding tubes of the packaging; A quotient operation is performed on the number of fully filled tubes in the batch and the number of tubes at the upper limit of packaging to obtain the number of full boxes and the remainder of full tubes.

4. The method according to claim 2, characterized in that The method of counting unfilled boxes based on the remaining number of full tubes, the number of unfilled tubes in the batch, and the upper limit number of tubes for packaging to determine a specific configuration scheme and the number of unfilled boxes for each unfilled box includes: The sum of the remaining number of full tubes and the number of tubes without filling in the batch is determined as the underfill box calculation factor; Performing a quotient operation on the underfill box calculation factor and the upper limit number of tubes for packaging; In response to the fact that the unfilled box calculation factor is divisible by the upper limit number of tubes for packaging in the quotient operation, the corresponding specific configuration scheme is generated for each unfilled box, and the quotient value of the unfilled box calculation factor and the upper limit number of tubes for packaging is determined as the number of unfilled boxes.

5. The method according to claim 4, characterized in that After performing a quotient operation on the underfill box calculation factor and the upper limit number of packaging tubes, the method further includes: In response to the fact that the unfull box calculation factor cannot be divided evenly by the upper limit number of tubes for packaging in the quotient operation, a corresponding specific configuration scheme is generated for each unfull box, and the quotient of the unfull box calculation factor and the upper limit number of tubes for packaging is summed with 1 to obtain the number of unfull boxes.

6. The method according to claim 4 or 5, characterized in that Generating the corresponding specific configuration solution for each of the unfilled boxes includes: When the number of tubes in the unfilled box reaches the upper limit of the number of tubes in the packaging, generating the corresponding specific configuration scheme for the unfilled box according to conventional packaging specifications; wherein the conventional packaging specifications refer to the packaging specifications of the semiconductor tubes according to the conventional configuration scheme; When the number of material tubes in the incomplete box does not reach the upper limit of the number of material tubes in the packaging, the corresponding specific configuration scheme is generated for the incomplete box according to the number of the semiconductor material tubes in the incomplete box.

7. The method according to claim 6, characterized in that Generating the corresponding specific configuration scheme for the incomplete box according to the number of the semiconductor material tubes in the incomplete box includes: If the number of the semiconductor tubes in the incomplete box is greater than the preset number of small specifications, generating the corresponding specific configuration scheme for the incomplete box according to the conventional packaging specifications; If the number of the semiconductor material tubes in the incomplete box is less than or equal to the number of small specifications, the corresponding specific configuration scheme is generated for the incomplete box according to the preset conventional packaging specifications.

8. The method according to claim 7, characterized in that If the number of the semiconductor tubes in the incomplete box is less than or equal to the number of the small specifications, generating the corresponding specific configuration scheme for the incomplete box according to the preset conventional packaging specifications includes: If the number of the semiconductor tubes in the unfilled box is less than or equal to the number of small specifications, and the number of the semiconductor tubes in the unfilled box is less than a preset sway limit number, filling the unfilled box with empty tubes; For the partially filled box filled with the empty filling tube, the corresponding specific configuration solution is generated according to the conventional packaging specifications.

9. The method according to claim 1, characterized in that The number of components in each tube packaging box includes the number of components in a full box and the number of components in an incomplete box; The determining the number of components contained in each tube packaging box according to the upper limit number of tubes in the packaging, the upper limit number of components that can be accommodated in a single tube, and the number of components corresponding to each unfilled tube includes: For each of the partially filled boxes, the number of components contained in the corresponding partially filled box is determined according to the upper limit number of components that can be accommodated by a single tube and the number of components corresponding to each of the unfilled tubes; For each of the full boxes, the number of components contained in the corresponding full box is determined according to the upper limit number of tubes for packaging and the upper limit number of components that can be accommodated in a single tube.

10. The method according to claim 9, characterized in that For each of the partially filled boxes, determining the number of components in the corresponding partially filled box according to the upper limit number of components that can be accommodated in a single tube and the number of components corresponding to each of the unfilled tubes includes: For each of the partially filled boxes, determining the corresponding fully filled tube and the underfilled tube; For the unfilled box, summing the number of components corresponding to each of the unfilled tubes to obtain the first sub-number of the unfilled box; For the unfilled box, summing the upper limit number of components that can be contained in a single tube corresponding to each of the fully filled tubes to obtain a second sub-number of components contained in the unfilled box; The number of components in the unfull box is obtained by summing the first sub-number of the unfull box and the second sub-number of the unfull box corresponding to the unfull box.

11. The method according to claim 1, wherein The selecting and counting the missing charging tubes for the target packaging batch to obtain the number of missing charging tubes in the batch and the number of components corresponding to each missing charging tube includes: For each semiconductor tube of the target packaging batch, select the tube with missing material as the current tube with missing material; Counting the number of components of the currently missing charging tube to obtain the number of components of the currently missing charging tube corresponding to the currently missing charging tube; Selecting the missing tube from the remaining semiconductor tubes in the target packaging batch as the current missing tube, returning to perform component count on the current missing tube until all the missing tubes in the target packaging batch are selected, and obtaining the component count corresponding to each missing tube; The number of the missing loading tubes in the target packaging batch is counted to obtain the number of missing loading tubes in the batch.

12. The method according to claim 1, characterized in that Before counting the number of the missing charging tubes selected from the target packaging batch to obtain the number of missing charging tubes in the batch and the number of components corresponding to each missing charging tube, the method further includes: Scanning a tube identification code for each semiconductor tube to obtain tube grade constraint information corresponding to each semiconductor tube; Scanning a component identification code of each semiconductor component in each semiconductor material tube to obtain a component grade corresponding to each semiconductor component in the semiconductor material tube; For the semiconductor components whose component grades do not satisfy the material pipe grade constraint information, the semiconductor components are sorted out from the corresponding semiconductor material pipe and marked as grade problem components.

13. The method according to claim 1, wherein Before counting the number of the missing charging tubes selected from the target packaging batch to obtain the number of missing charging tubes in the batch and the number of components corresponding to each missing charging tube, the method further includes: Capturing an image of each semiconductor material tube to obtain a corresponding tube-mounted component image; wherein the tube-mounted component image is used to present each semiconductor component housed in the corresponding semiconductor material tube; The selecting and counting the missing charging tubes for the target packaging batch to obtain the number of missing charging tubes in the batch and the number of components corresponding to each missing charging tube includes: Based on the tube-mounted component image corresponding to each semiconductor tube, the tube-mounted component image is counted to obtain the number of tubes without loading in the batch and the number of components corresponding to each tube without loading.

14. The method according to claim 13, characterized in that Before counting the number of the tube-packaged component images based on the tube-packaged component images corresponding to each semiconductor tube, the method further includes: Performing component appearance inspection on each of the semiconductor components housed in the semiconductor material tube based on the tube-mounted component image; The semiconductor components that do not meet the appearance qualification conditions during the component appearance inspection are sorted out from the semiconductor material tube and marked as components with appearance problems.

15. The method according to claim 14, characterized in that The semiconductor components that do not meet the appearance qualification conditions in the component appearance inspection are sorted out from the semiconductor material tube and marked as components with appearance problems, including: In response to the presence of the semiconductor component that does not meet the appearance qualification condition in the tube-packaged component image, re-capturing the image of the semiconductor material tube to update the tube-packaged component image; In response to the semiconductor components still not meeting the appearance qualification condition in the updated tube-packaged component image, the semiconductor components not meeting the appearance qualification condition are sorted out from the semiconductor material tube and marked as components with appearance problems.

16. The method according to claim 1, characterized in that The step of obtaining semiconductor tubes of a target packaging batch and target batch information corresponding to the target packaging batch includes: Obtaining a target transport box filled with a plurality of the semiconductor tubes; wherein the semiconductor tubes filled in the target transport box belong to the same target packaging batch; The tote identification configured for the target tote is scanned to obtain the target batch information corresponding to the target packaging batch.

17. A semiconductor material tube packaging device, used for executing the semiconductor material tube packaging method according to any one of claims 1 to 16, characterized in that: include: a batch information acquisition module, configured to acquire semiconductor material tubes of a target packaging batch and target batch information corresponding to the target packaging batch, wherein the semiconductor material tubes are configured to accommodate semiconductor components, and each of the semiconductor material tubes has the same upper limit number of components that can be accommodated per tube; a batch number counting module, configured to select the missing charging tubes for the target packaging batch and perform number counting to obtain the number of missing charging tubes in the batch and the number of components corresponding to each missing charging tube; The packaging parameter calculation module is used to calculate the packaging parameters according to the preset upper limit number of material tubes, the number of missing material tubes in the batch, the number of components corresponding to each missing material tube, the upper limit number of components that can be accommodated by a single tube, and the target batch information, so as to obtain the number of components in each material tube packaging box, the material tube configuration scheme, and the total number of packaging boxes in the batch, including: extracting the total number of batch components corresponding to the target packaging batch from the target batch information; determining the number of fully filled material tubes in the batch based on the total number of batch components, the number of components corresponding to each missing material tube, and the upper limit number of components that can be accommodated by a single tube; determining the total number of packaging boxes in the batch and the material tube configuration scheme corresponding to each material tube packaging box based on the number of missing material tubes in the batch, the number of fully filled material tubes in the batch, and the upper limit number of material tubes in the batch; Determining the number of components contained in each tube packaging box based on the upper limit number of tubes in the package, the upper limit number of components that can be accommodated in a single tube, and the number of components corresponding to each of the empty tubes; determining the number of fully filled tubes in a batch based on the total number of components in the batch, the number of components corresponding to each of the empty tubes, and the upper limit number of components that can be accommodated in a single tube, includes: summing the number of components corresponding to each of the empty tubes to calculate the total number of empty tube components of the semiconductor components in each of the empty tubes; calculating the total number of fully filled tube components of the semiconductor components in each of the fully filled tubes by taking the difference between the total number of components in the batch and the total number of components in the empty tubes; and determining the number of fully filled tubes in the batch by taking the quotient of the total number of fully filled tube components and the upper limit number of components that can be accommodated in a single tube. The tube packaging module is used to perform packaging operations on each semiconductor tube based on the number of components on each tube packaging box, the tube configuration scheme, and the total number of boxes in the batch packaging, to obtain each tube packaging box corresponding to the target packaging batch.

18. A computer-readable storage medium, characterized in that The storage medium stores a program, and the program is executed by a processor to implement the semiconductor tube packaging method according to any one of claims 1 to 16.

Images