Anticorrosive coating, electronic device and manufacturing method thereof

Abstract

The invention provides an anti-corrosion coating, an electronic device and a manufacturing method of the anti-corrosion coating, the anti-corrosion coating comprises an oxide layer, a coupling agent coating and an epoxy organic coating which are sequentially formed from inside to outside in the thickness direction, and the oxide layer is formed through a thin film deposition process. The anti-corrosion coating has excellent mechanical property and anti-corrosion property.

Description

Technical Field

[0001] The present invention relates to the field of electronic devices, and in particular to an anti-corrosion coating, an electronic device and a manufacturing method thereof. Background Art

[0002] DC / DC converters have become an indispensable key component in the design and development of new energy vehicles, and power inductors are indispensable devices for DC / DC converters. They can provide large currents and high inductance, and they maintain continuous currents by accumulating and releasing energy. However, since most of the current power inductor manufacturing materials are usually susceptible to corrosion and rust; and power inductors used in automobiles also need to resist corrosion and vibration in the vehicle's working environment, the requirements for coatings are becoming increasingly high.

[0003] In the actual spraying process, due to the influence of environmental humidity, temperature and other factors, the adhesion between the paint layer and the inductor substrate after spraying is poor, which may cause blistering and peeling of the coating in the subsequent PCT test and reflow soldering reliability experiment, resulting in poor appearance and size of the finished inductor and seriously affecting the inductor product. Summary of the invention

[0004] The first object of the present invention is to provide an anti-corrosion coating with excellent mechanical properties and anti-corrosion properties.

[0005] The second object of the present invention is to provide an electronic device having the above anti-corrosion coating.

[0006] The third object of the present invention is to provide a method for manufacturing the above electronic device.

[0007] To achieve the above-mentioned first purpose, the present invention provides an anti-corrosion coating, comprising an oxide layer, a coupling agent coating and an epoxy organic coating formed sequentially from the inside to the outside along the thickness direction, and the oxide layer is formed by a thin film deposition process.

[0008] It can be seen from the above scheme that by forming an anti-corrosion coating with a three-layer structure outside the device, the anti-corrosion coating has excellent mechanical properties and anti-corrosion properties, and has high adhesion, high temperature resistance, and good corrosion resistance. After the anti-corrosion coating is used in electronic devices such as inductors, it can well solve the problem that the surface coating of the inductor is prone to blistering and falling off after PCT testing and reflow soldering, thereby effectively extending the service life of the inductor.

[0009] The oxide layer in the anti-corrosion coating is formed by a thin film deposition process. This method has no restrictions on the material of the substrate. Any substrate can grow an oxide film in situ in this way. The oxide layer generated in this way is denser and the thickness can be more accurately controlled. The thickness can range from nanometer level to submicron level. It is uniformly coated and highly conformal. The required temperature is lower than 200°C and will not affect the performance of the device. In addition, by setting an oxide layer on the surface of the device and covering the surface of the device with an inorganic nanostructure, the dense nanostructure increases the torsion of the diffusion path of the corrosive medium, which helps to prevent corrosive particles from entering the surface of the substrate.

[0010] In addition, a coupling agent coating is formed outside the oxide layer. The coupling agent coating has a modified grafting effect. The oxide layer and the epoxy organic coating are connected through the coupling agent graft coating to make the connection between the two layers tighter. The coupling agent coating not only makes the inner and outer two layers of coating tightly combined physically, but also allows the two to be connected through chemical bonds. Therefore, the bonding force between the three layers of coating is tighter, the adhesion is stronger, and the phenomenon of subsequent reflow soldering blistering can be reduced.

[0011] A preferred solution is that the material of the oxide layer is aluminum oxide, silicon oxide or chromium oxide; and / or the material of the coupling agent coating is a titanate coupling agent or a silane coupling agent; and / or a filler is added to the epoxy organic coating, and the filler is at least one of carbon black, SiO2 and dye black.

[0012] It can be seen that the addition of fillers not only improves the pressure resistance of the coating itself, but also fills the voids in the epoxy organic coating to increase its density. Moreover, the fillers can form a maze effect in the coating, thereby increasing the barrier performance of the coating against corrosive media entering the coating.

[0013] A further solution is that the titanate coupling agent is at least one of isopropyl triisostearate titanate, isopropyl dioleyl (dioctyl phosphate) titanate, isopropyl dioleyl (dioctyl phosphate) titanate, bis (dioctyl pyrophosphate) ethylene titanate, and isopropoxy tris (dioctyl pyrophosphate) titanate.

[0014] It can be seen that the coupling agent coating is prepared by a titanate solution containing amphiphilic groups, wherein one end of the amphiphilic group needs to include a hydrophilic group and the other end includes a hydrophobic group. Titanate coupling agents are not only suitable for various fillers, but also have a wider range of applications for resins, are more stable in process reactions, and produce less environmentally harmful gases.

[0015] A preferred solution is that the thickness of the oxide layer is in the range of 1 nm to 10 um; and / or the thickness of the coupling agent coating is in the range of 0.5 um to 1 um; and / or the thickness of the epoxy organic coating is in the range of 10 um to 50 um.

[0016] A preferred solution is that the oxide layer is formed by a PVD process, a CVD process or an ALD process.

[0017] A preferred solution is that the nitrogen content in the epoxy organic coating is in the range of 15 wt % to 30 wt %.

[0018] In order to achieve the above second purpose, the present invention provides an electronic device, including a component body and the above anti-corrosion coating, wherein the anti-corrosion coating is coated on the outside of the component body.

[0019] To achieve the above-mentioned third purpose, the present invention provides a method for manufacturing the above-mentioned electronic device, including: forming an oxide layer outside the component body through a thin film deposition process; coating a coupling agent on the outside of the formed oxide layer, and forming a coupling agent coating after curing; coating an epoxy organic material on the outside of the coupling agent coating, and forming an epoxy organic coating after curing.

[0020] It can be seen from the above scheme that the anti-corrosion coating with a three-layer structure outside the component body, the first layer is a dense oxide layer coated outside the component body, the dense oxide layer helps to prevent corrosion particles from entering the surface of the substrate, the second layer is a coupling agent coating coated outside the oxide layer, forming a layer of grafted substances such as titanium, so that the inductor and the organic coating are more tightly combined, not only tightly combined by mechanical force, but also connected by chemical bonds, and then the third layer of modified epoxy organic coating is coated outside the coupling agent coating to obtain a three-layer anti-corrosion coating, which has excellent mechanical properties and anti-corrosion properties, high adhesion, high temperature resistance, and good corrosion resistance. After the anti-corrosion coating is used in electronic devices such as inductors, it can well solve the problem that the surface coating of the inductor is prone to blistering and falling off after PCT testing and reflow soldering, thereby effectively extending the service life of the inductor.

[0021] A preferred solution is that the preparation method of the epoxy organic material includes: adding biphenyl phenolic epoxy resin to a first solvent to prepare a first system; dissolving polybutyrolactam and diethylenetriamine in a second solvent to prepare a second system; mixing and stirring polyimide and urethane, and adding filler to prepare a third system; mixing the first system, the second system and the third system in a mass ratio of 1:1:1 and stirring them evenly to obtain the epoxy organic material.

[0022] A preferred solution is that the first solvent and the second solvent are at least one of a ketone solvent and an alcohol solvent.

[0023] A preferred solution is that the solid content of the first system is in the range of 5% to 10%, the solid content of the second system is in the range of 10% to 15%, and the solid content of the third system is in the range of 5% to 8%; and / or the mass proportion of the filler in the third system is in the range of 0.5% to 2%. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic structural diagram of an electronic device embodiment of the present invention.

[0025] The present invention is further described below in conjunction with the accompanying drawings and embodiments. DETAILED DESCRIPTION

[0026] See also Figure 1 The electronic device in this embodiment is an inductor, and the electronic device includes a component body 1 and an anti-corrosion coating 2, and the anti-corrosion coating 2 is coated on the outside of the component body 1.

[0027] The anti-corrosion coating 2 includes an oxide layer 21, a coupling agent coating 22 and an epoxy organic coating 23 which are sequentially formed from the inside to the outside along the thickness direction. The oxide layer 21 is formed by a thin film deposition process such as a PVD process, a CVD process or an ALD process.

[0028] The material of the oxide layer 21 is aluminum oxide, silicon oxide or chromium oxide, the material of the coupling agent coating 22 is a titanate coupling agent or a silane coupling agent, and the titanate coupling agent is at least one of isopropyl triisostearate titanate, isopropyl dioleic acid acyloxy (dioctyl phosphate acyloxy) titanate, isopropyl dioleic acid acyloxy (dioctyl phosphate acyloxy) titanate, bis (dioctyl pyrophosphate acyloxy) ethylene titanate, and isopropoxy tri (dioctyl pyrophosphate acyloxy) titanate. The titanate coupling agent is not only suitable for various fillers, but also has a wider range of application for resins, is more stable in the process reaction, and produces less environmentally harmful gases.

[0029] Fillers are added to the epoxy organic coating 23, and the fillers are at least one of carbon black, SiO2 and dye black. The addition of fillers not only improves the pressure resistance of the coating itself, but also fills the voids of the epoxy organic coating 23 to increase its density. Moreover, the fillers can form a maze effect in the coating, thereby increasing the barrier performance of the coating against corrosive media entering the coating.

[0030] The thickness of the oxide layer 21 is in the range of 1 nm to 10 um, the thickness of the coupling agent coating 22 is in the range of 0.5 um to 1 um, and the thickness of the epoxy organic coating 23 is in the range of 10 um to 50 um.

[0031] The nitrogen content in the epoxy organic coating 23 is in the range of 15 wt % to 30 wt %.

[0032] The method for manufacturing an electronic device comprises the following steps:

[0033] First, the component body 1 is cleaned, and an oxide layer 21 is formed outside the component body 1 by a thin film deposition process.

[0034] Next, a coupling agent is coated on the outside of the formed oxide layer 21, and after curing, a coupling agent coating layer 22 is formed;

[0035] Next, an epoxy organic material is coated on the outside of the coupling agent coating 22, and after curing, an epoxy organic coating 23 is formed, thereby obtaining an electronic device having an anti-corrosion coating 2 with a three-layer anti-corrosion structure.

[0036] The preparation method of the above-mentioned epoxy organic material comprises the following steps:

[0037] Adding biphenyl phenolic epoxy resin into a first solvent to prepare a first system;

[0038] dissolving polybutyrolactam and diethylenetriamine in a second solvent to prepare a second system;

[0039] The polyimide and the urethane are mixed and stirred, and fillers are added to prepare a third system;

[0040] The first system, the second system and the third system are mixed in a mass ratio of 1:1:1 and stirred evenly to obtain an epoxy organic material.

[0041] The first solvent and the second solvent are both at least one of ketone solvents and alcohol solvents. The composition of the first solvent may be the same or different. The solid content of the first system is in the range of 5% to 10%, the solid content of the second system is in the range of 10% to 15%, the solid content of the third system is in the range of 5% to 8%, and the mass proportion of the filler in the third system is in the range of 0.5% to 2%.

[0042] The following embodiments are all made by the above-mentioned manufacturing method, with the same manufacturing process, the oxide layer is made of aluminum oxide material, the coupling agent coating is made of titanate coupling agent, the epoxy organic coating is made of the same epoxy organic material, and only the thickness of each coating is different. The details are as follows.

[0043] Embodiment 1:

[0044] In this embodiment, in the anti-corrosion coating, the thickness of the aluminum oxide layer is 10 nm, the thickness of the coupling agent coating is 0.5 um, and the thickness of the epoxy organic coating is 15 um.

[0045] Embodiment 2:

[0046] In this embodiment, in the anti-corrosion coating, the thickness of the aluminum oxide layer is 1 um, the thickness of the coupling agent coating is 0.5 um, and the thickness of the epoxy organic coating is 15 um.

[0047] Embodiment 3:

[0048] In this embodiment, in the anti-corrosion coating, the thickness of the aluminum oxide layer is 1 um, the thickness of the coupling agent coating is 1 um, and the thickness of the epoxy organic coating is 15 um.

[0049] Comparative Example 1:

[0050] In this comparative example, the method for manufacturing an electronic device comprises the following steps:

[0051] First, the component body is cleaned, and a 1um thick oxide layer is formed outside the component body through a thin film deposition process.

[0052] Next, an epoxy organic material is coated on the outside of the formed oxide layer, and an epoxy organic coating is formed after curing. The thickness of the epoxy organic coating is 15 um, and an electronic device with a two-layer structure anti-corrosion coating is obtained.

[0053] Comparative Example 2:

[0054] In this comparative example, the method for manufacturing an electronic device comprises the following steps:

[0055] First, the component body is cleaned, and an epoxy organic material is coated on the outside of the component body. After curing, an epoxy organic coating is formed. The thickness of the epoxy organic coating is 15um, and an electronic device with a layer of structural anti-corrosion coating is obtained.

[0056] The inductors of the above embodiments and comparative examples were tested for performance, and the results are shown in Table 1.

[0057] Table 1 Performance test results of the inductors of various embodiments and comparative examples

[0058]

[0059] As can be seen from the above, by forming an anti-corrosion coating with a three-layer structure outside the device, the anti-corrosion coating has excellent mechanical properties and anti-corrosion properties, and has high adhesion, high temperature resistance, and good corrosion resistance. After the anti-corrosion coating is used in electronic devices such as inductors, it can well solve the problem that the surface coating of the inductor is prone to blistering and falling off after PCT testing and reflow soldering, thereby effectively extending the service life of the inductor.

[0060] The oxide layer in the anti-corrosion coating is formed by a thin film deposition process. This method has no restrictions on the material of the substrate. Any substrate can grow an oxide film in situ in this way. The oxide layer generated in this way is denser and the thickness can be more accurately controlled. The thickness can range from nanometer level to submicron level. It is uniformly coated and highly conformal. The required temperature is lower than 200°C and will not affect the performance of the device. In addition, by setting an oxide layer on the surface of the device and covering the surface of the device with an inorganic nanostructure, the dense nanostructure increases the torsion of the diffusion path of the corrosive medium, which helps to prevent corrosive particles from entering the surface of the substrate.

[0061] In addition, a coupling agent coating is formed outside the oxide layer. The coupling agent coating has a modified grafting effect. The oxide layer and the epoxy organic coating are connected through the coupling agent graft coating to make the connection between the two layers tighter. The coupling agent coating not only makes the inner and outer two layers of coating tightly combined physically, but also allows the two to be connected through chemical bonds. Therefore, the bonding force between the three layers of coating is tighter, the adhesion is stronger, and the phenomenon of subsequent reflow soldering blistering can be reduced.

[0062] Finally, it should be emphasized that the above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various changes and modifications. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. Anti-corrosion coating, characterized in that: The invention comprises an oxide layer, a coupling agent coating layer and an epoxy organic coating layer which are sequentially formed from the inside to the outside along the thickness direction, and the oxide layer is formed by a thin film deposition process.

2. The anti-corrosion coating according to claim 1, characterized in that: The material of the oxide layer is aluminum oxide, silicon oxide or chromium oxide; and / or The material of the coupling agent coating is a titanate coupling agent or a silane coupling agent; and / or Fillers are added into the epoxy organic coating, and the fillers are at least one of carbon black, SiO2 and dye black.

3. The anti-corrosion coating according to claim 2, characterized in that: The titanate coupling agent is at least one of isopropyl triisostearate titanate, isopropyl dioleyloxy (dioctyl phosphate acyloxy) titanate, isopropyl dioleyloxy (dioctyl phosphate acyloxy) titanate, bis (dioctyl pyrophosphate acyloxy) ethylene titanate, and isopropoxy tri (dioctyl pyrophosphate acyloxy) titanate.

4. The anti-corrosion coating according to any one of claims 1 to 3, characterized in that: The thickness of the oxide layer is in the range of 1 nm to 10 um; and / or The thickness of the coupling agent coating is in the range of 0.5um to 1um; and / or The thickness of the epoxy organic coating is in the range of 10um to 50um.

5. The anti-corrosion coating according to any one of claims 1 to 3, characterized in that: The nitrogen content in the epoxy organic coating is in the range of 15 wt % to 30 wt %.

6. An electronic device, characterized in that It comprises a component body and the anti-corrosion coating as described in any one of claims 1 to 5, wherein the anti-corrosion coating is coated outside the component body.

7. A method for manufacturing an electronic device, characterized in that: Used to make the electronic device as claimed in claim 6; The production method comprises: Forming the oxide layer outside the component body by a thin film deposition process; Coating a coupling agent on the outside of the formed oxide layer, and forming the coupling agent coating after curing; An epoxy organic material is coated on the outside of the coupling agent coating, and the epoxy organic coating is formed after curing.

8. The method for manufacturing an electronic device according to claim 7, characterized in that: The preparation method of the epoxy organic material comprises: Adding biphenyl phenolic epoxy resin into a first solvent to prepare a first system; dissolving polybutyrolactam and diethylenetriamine in a second solvent to prepare a second system; The polyimide and the urethane are mixed and stirred, and fillers are added to prepare a third system; The first system, the second system and the second system are mixed in a mass ratio of 1:1:1 and stirred evenly to obtain the epoxy organic material.

9. The method for manufacturing an electronic device according to claim 8, characterized in that: The first solvent and the second solvent are at least one of a ketone solvent and an alcohol solvent.

10. The method for manufacturing an electronic device according to claim 8 or 9, characterized in that: The solid content of the first system is in the range of 5% to 10%, the solid content of the second system is in the range of 10% to 15%, and the solid content of the third system is in the range of 5% to 8%; and / or The filler accounts for 0.5% to 2% by mass in the third system.

Images