Ceramic cleaning solution and cleaning method of ceramic target material

Abstract

The invention provides a ceramic cleaning solution and a cleaning method of a ceramic target material. The ceramic cleaning solution comprises a surfactant, a dispersing agent, a penetrating agent, a corrosion inhibitor, an alkaline solution and water. The cleaning method comprises the following steps: (1) soaking the ceramic target material in a ceramic cleaning solution, and then carrying out ultrasonic cleaning with the cleaning solution for at least two times to obtain a first ceramic target material; (2) carrying out at least two times of pure water ultrasonic cleaning on the first ceramic target material obtained in the step (1) by adopting water to obtain a second ceramic target material; and (3) the second ceramic target material obtained in the step (2) is subjected to purging drying and vacuum drying in sequence, and the cleaned ceramic target material is obtained. According to the cleaning method, the surface of the target material can be effectively purified, and the uniformity of a sputtering film and the consistency of the quality of batch products can be improved; the market development of the ceramic target material is facilitated.

Description

Technical Field

[0001] The invention belongs to the technical field of target material preparation, and relates to a method for cleaning a ceramic target material, and in particular to a ceramic cleaning liquid and a method for cleaning a ceramic target material. Background Art

[0002] Ceramic target is a new type of sputtering target, which is mostly a mixture of two or more metal oxides. It is mainly used in the fields of microelectronics, displays, storage, etc.

[0003] In recent years, the market demand for high-purity ceramic targets has increased significantly. However, due to the complexity of the processing process of current ceramic targets, which involves powder sintering, target machining, etc., it is difficult to avoid dirt on the surface of ceramic targets, especially for pure white magnesium oxide, aluminum oxide and other ceramic targets, which not only seriously affects their appearance, but also seriously affects the requirements of high-end electronics industry for target quality. Developing a cleaning method for ceramic targets to effectively purify the surface of the target will help improve the uniformity of sputtered films and the consistency of the quality of batch products, which is conducive to the development of the ceramic target market.

[0004] CN 109022792A discloses a method for treating a target material to be treated, comprising: providing a target material to be treated; performing a first pickling treatment on the target material to be treated by a first acid solution to form an initial target material, wherein the first acid solution and the target material to be treated undergo a first chemical reaction to remove part of the target material surface material; performing a second pickling treatment on the initial target material by a second acid solution, wherein the second acid solution and the initial target material undergo a second chemical reaction to remove part of the initial target material surface material, wherein the rate of the second chemical reaction is lower than the rate of the first chemical reaction. The method focuses on the pickling treatment of waste target materials, and is mainly applicable to the cleaning of metal or alloy target materials, but not to ceramic target materials.

[0005] CN 110670083A discloses a method for cleaning a target material, comprising the following steps: coating a cleaning agent on the surface of the target material, and then scrubbing it; ultrasonically cleaning the scrubbed target material; using an inert gas to blow dry the moisture on the surface of the target material after ultrasonic cleaning, and then vacuum drying it to obtain the cleaned target material. This method uses a steel brush to clean the target material, which is likely to cause damage to the target material surface.

[0006] CN 113458036A discloses a method for cleaning a ceramic target, the method comprising the following steps: (1) wiping and cleaning the surface of the ceramic target; (2) ultrasonically cleaning the ceramic target treated in step (1) with an organic solvent; (3) sequentially purging and drying the ceramic target treated in step (2) and vacuum drying to obtain the cleaned ceramic target. The organic solvent comprises any one of isopropanol, n-propanol or anhydrous ethanol or a combination of at least two of them. The method uses an organic solvent for ultrasonic cleaning of the target, and the organic solvent is irritating to the eyes and mucous membranes and harmful to the body of the user.

[0007] In summary, providing a healthy and non-toxic ceramic cleaning solution, combined with a suitable cleaning process, can effectively improve the surface cleanliness of the ceramic target and help improve the purity of the target. Summary of the invention

[0008] In view of the shortcomings of the prior art, the purpose of the present invention is to provide a ceramic cleaning liquid and a ceramic target cleaning method. The cleaning method can effectively purify the surface of the ceramic target, help improve the uniformity of the sputtered film and the consistency of the quality of batch products, and is conducive to the development of the ceramic target market.

[0009] To achieve this object, the present invention adopts the following technical solutions:

[0010] In a first aspect, the present invention provides a ceramic cleaning solution, which includes a surfactant, a dispersant, a penetrant, a corrosion inhibitor, an alkaline solution and water.

[0011] The ceramic cleaning solution of the present invention is alkaline (PH>8), and the various components complement each other to play a synergistic effect. The ceramic cleaning solution has simple components, is easy to obtain, and is conducive to industrial application.

[0012] As a preferred technical solution of the present invention, the ceramic cleaning solution includes, by mass percentage: 2-5w% surfactant, 1-3wt% dispersant, 1-3wt% penetrant, 1-2wt% corrosion inhibitor, 2-4wt% alkaline solution and 80-90wt% water.

[0013] Exemplarily, the content of the surfactant is 2 to 5 wt%, for example, it can be 2 wt%, 3 wt%, 4 wt% or 5 wt%, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable;

[0014] The content of the dispersant is 1 to 3 wt%, for example, 1 wt%, 2 wt% or 3 wt%, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable;

[0015] The content of the penetrant is 1 to 3 wt%, for example, 1 wt%, 2 wt% or 3 wt%, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable;

[0016] The content of the corrosion inhibitor is 1-2wt%, for example, 1wt%, 1.4wt% or 1.8wt%, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable;

[0017] The content of the alkaline solution is 2-4 wt%, for example, 2.5 wt%, 3 wt%, 3.5 wt% or 4 wt%, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable;

[0018] The water content is 80-90 wt%, for example, 82 wt%, 84 wt%, 86 wt% or 88 wt%, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable.

[0019] The penetrant in the ceramic cleaning solution of the present invention can promote the decontamination chemical reaction and can be a process aid that accelerates or improves the reaction process of the decontamination substance. Too much or too little of the penetrant will lead to a poor cleaning effect. The corrosion inhibitor can be adsorbed on the clean ceramic surface to form a monomolecular film, preventing water and corrosive substances in the water from diffusing to the ceramic surface and has a corrosion inhibition effect. Too much of the penetrant can cause environmental pollution and waste of resources, while too little of the penetrant can reduce the corrosion inhibition effect. The alkaline solution has the effect of removing stubborn dirt. Too much of the penetrant can lead to an excessively high pH value, which is harmful to human health, while too little of the penetrant can lead to a poor cleaning effect. The dispersant is used to quickly disperse organic matter in water.

[0020] As a preferred technical solution of the present invention, the surfactant includes any one of long-chain fatty alcohol polyoxyethylene ether, alkylphenol polyoxyethylene ether or fatty acid polyoxyethylene ester, or a combination of at least two thereof. Typical but non-limiting combinations include a combination of long-chain fatty alcohol polyoxyethylene ether and alkylphenol polyoxyethylene ether, a combination of long-chain fatty alcohol polyoxyethylene ether and fatty acid polyoxyethylene ester, a combination of alkylphenol polyoxyethylene ether and fatty acid polyoxyethylene ester, or a combination of long-chain fatty alcohol polyoxyethylene ether, alkylphenol polyoxyethylene ether and fatty acid polyoxyethylene ester.

[0021] Preferably, the dispersant comprises polyethylene glycol 200 and / or sorbitol.

[0022] Preferably, the penetrant comprises polyoxyethylene fatty alcohol ether and / or sodium aminosulfonate.

[0023] Preferably, the corrosion inhibitor comprises any one of mercaptobenzothiazole, benzotriazole or hexadecylamine or a combination of at least two thereof, typical but non-limiting combinations include: a combination of mercaptobenzothiazole and benzotriazole, a combination of mercaptobenzothiazole and hexadecylamine, a combination of benzotriazole and hexadecylamine, or a combination of mercaptobenzothiazole, benzotriazole and hexadecylamine.

[0024] Preferably, the alkaline solution comprises sodium hydroxide and potassium hydroxide.

[0025] Preferably, the mass ratio of sodium hydroxide to potassium hydroxide is 1:(0.8-1.2), for example, 1:0.8, 1:0.9, 1:1, 1:1.1 or 1:1.2, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable.

[0026] The alkaline solution of the present invention contains sodium hydroxide and potassium hydroxide, which play a synergistic role. It is difficult to obtain the required pH value of the solution when sodium hydroxide or potassium hydroxide is used alone. Compared with the use of sodium hydroxide or potassium hydroxide alone, the mixture of sodium hydroxide and potassium hydroxide has relatively less danger and better selectivity, can selectively attack the solvent, and will not destroy the material structure of other components in the cleaning solution.

[0027] In a second aspect, the present invention provides a method for cleaning a ceramic target, the cleaning method comprising the following steps:

[0028] (1) soaking the ceramic target material in the ceramic cleaning solution provided in the first aspect, and then ultrasonically cleaning the ceramic target material at least twice to obtain a first ceramic target material;

[0029] (2) using water to perform pure water ultrasonic cleaning on the first ceramic target obtained in step (1) at least twice to obtain a second ceramic target;

[0030] (3) The second ceramic target obtained in step (2) is sequentially subjected to purge drying and vacuum drying to obtain a cleaned ceramic target.

[0031] The cleaning method of the present invention is carried out in an ultrasonic device. During the immersion process in step (1), the ceramic cleaning liquid needs to cover the heating rod of the ultrasonic device. During the ultrasonic treatment process, the ceramic target is placed on a stainless steel bracket in the slot of the ultrasonic device. After placement, the target is kept level and will not fall.

[0032] The cleaning method provided by the present invention can effectively purify the surface of the target material, help to improve the uniformity of the sputtered film and the consistency of the quality of batch products; and is beneficial to the development of the ceramic target material market.

[0033] As a preferred technical solution of the present invention, the soaking temperature in step (1) is 40-70°C, for example, it can be 45°C, 50°C, 55°C, 60°C or 65°C, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable.

[0034] Preferably, the soaking time in step (1) is 10 to 40 minutes, for example, 15 minutes, 20 minutes, 25 minutes, 30 minutes or 35 minutes, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable.

[0035] As a preferred technical solution of the present invention, the temperature of ultrasonic cleaning with the cleaning solution in step (1) is 40-70°C, for example, 45°C, 50°C, 55°C, 60°C or 65°C, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable.

[0036] Preferably, the ultrasonic cleaning time of the cleaning solution in step (1) is 10 to 40 minutes, for example, 15 minutes, 20 minutes, 25 minutes, 30 minutes or 35 minutes, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable.

[0037] Preferably, the ultrasonic power of the ultrasonic cleaning of the cleaning liquid in step (1) is 20-40 kHZ, for example, it can be 25 kHZ, 30 kHZ, 35 kHZ or 40 kHZ, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable.

[0038] When the ceramic cleaning liquid is used to treat the ceramic target material (the immersion and cleaning liquid ultrasonic cleaning process described in step (1)), the temperature of the treatment process is 40-70°C. Too high a temperature will cause the cleaning liquid to fail and waste energy. Too low a temperature will cause poor solution molecule activity and poor cleaning effect.

[0039] As a preferred technical solution of the present invention, new ceramic cleaning liquid is used in each cleaning liquid ultrasonic cleaning process.

[0040] Preferably, the ceramic target is immersed in the ceramic cleaning liquid during ultrasonic cleaning with the cleaning liquid.

[0041] It is worth noting that, in the cleaning method of the present invention, each time ultrasonic cleaning with a cleaning liquid is completed, a new, equal amount of ceramic cleaning liquid needs to be replaced the next time ultrasonic cleaning with the cleaning liquid is performed.

[0042] As a preferred technical solution of the present invention, the temperature of the pure water ultrasonic cleaning in step (2) is 40-60°C, for example, it can be 40°C, 45°C, 50°C, 55°C or 60°C, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable.

[0043] Preferably, the time for the pure water ultrasonic cleaning in step (2) is 10 to 40 minutes, for example, 15 minutes, 20 minutes, 25 minutes, 30 minutes or 35 minutes, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable.

[0044] Preferably, the ultrasonic power of the pure water ultrasonic cleaning in step (2) is 20-40 kHZ, for example, it can be 25 kHZ, 30 kHZ, 35 kHZ or 40 kHZ, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable.

[0045] Preferably, during the pure water ultrasonic cleaning in step (2), the ceramic target is immersed in water.

[0046] It is worth noting that, in the cleaning method of the present invention, each time pure water ultrasonic cleaning is completed, new water of the same amount needs to be replaced when pure water ultrasonic cleaning is performed next time.

[0047] The ultrasonic power in the ultrasonic cleaning of the present invention is 20-40 kHz. If the power is too high, the water temperature will become high, wasting energy, while if the power is too low, it will be difficult to remove the dirt solidified in the ceramic pores.

[0048] As a preferred technical solution of the present invention, the vacuum drying temperature in step (3) is 70-200°C, for example, it can be 80°C, 100°C, 120°C, 140°C, 160°C, 180°C or 200°C, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable.

[0049] Preferably, the vacuum drying time in step (3) is 1 to 2 hours, for example, 1.2 hours, 1.4 hours, 1.6 hours, 1.8 hours or 2 hours, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable.

[0050] Preferably, the vacuum drying pressure is -0.1 MPa.

[0051] As a preferred technical solution of the present invention, the cleaning method comprises the following steps:

[0052] (1) soaking the ceramic target material in the ceramic cleaning solution according to any one of claims 1 to 3 at 40 to 70° C. for 10 to 40 minutes, and then ultrasonically cleaning the ceramic target material at 40 to 70° C. and 20 to 40 kHz for at least two times for 10 to 40 minutes to obtain a first ceramic target material;

[0053] (2) using water to perform pure water ultrasonic cleaning on the first ceramic target obtained in step (1) at least twice for 10 to 40 minutes at 40 to 60° C. and 20 to 40 kHz to obtain a second ceramic target;

[0054] (3) The second ceramic target obtained in step (2) is sequentially subjected to purge drying and vacuum drying to obtain a cleaned ceramic target; the vacuum drying temperature is 100 to 150° C. and the time is 1 to 2 hours.

[0055] The numerical range described in the present invention not only includes the point values ​​listed above, but also includes any point values ​​between the above numerical ranges that are not listed. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the range.

[0056] Compared with the prior art, the present invention has the following beneficial effects:

[0057] (1) The cleaning method provided by the present invention can obtain a ceramic target material with a clean surface and no dirt or impurities;

[0058] (2) The ceramic target material obtained by the cleaning method provided by the present invention has excellent sputtering performance, which helps to improve the uniformity of the sputtered film. DETAILED DESCRIPTION

[0059] The technical solution of the present invention is further described below by specific implementation methods. It should be understood by those skilled in the art that the embodiments are only to help understand the present invention and should not be regarded as specific limitations of the present invention.

[0060] Example 1

[0061] The present embodiment provides a ceramic cleaning liquid, which includes, by mass percentage, 3.5wt% of alkylphenol polyoxyethylene ether, 2wt% of polyethylene glycol 200, 2wt% of polyoxyethylene fatty alcohol ether, 1.5wt% of mercaptobenzothiazole, 3wt% of alkaline solution and 88wt% of water.

[0062] Wherein, the alkaline solution is sodium hydroxide and potassium hydroxide in a mass ratio of 1:1.

[0063] The cleaning method of the ceramic target material described in this embodiment comprises the following steps:

[0064] (1) soaking the ceramic target in a ceramic cleaning solution at 55° C. for 25 min, and then performing ultrasonic cleaning of the cleaning solution at 55° C. and 30 kHz for 25 min three times to obtain a first ceramic target;

[0065] (2) using water to perform pure water ultrasonic cleaning on the first ceramic target obtained in step (1) for 25 min three times at 50° C. and 30 kHz to obtain a second ceramic target;

[0066] (3) The second ceramic target obtained in step (2) is sequentially subjected to purge drying and vacuum drying to obtain a cleaned ceramic target; the vacuum drying temperature is 120° C. and the time is 1.5 h.

[0067] Example 2

[0068] The present embodiment provides a ceramic cleaning solution, which includes, by mass percentage, 2wt% of long-chain fatty alcohol polyoxyethylene ether, 3wt% of sorbitol, 1wt% of sodium aminosulfonate, 2wt% of benzotriazole, 2wt% of alkaline solution and 90wt% of water.

[0069] Wherein, the alkaline solution is sodium hydroxide and potassium hydroxide in a mass ratio of 1:0.8.

[0070] The cleaning method of the ceramic target material described in this embodiment comprises the following steps:

[0071] (1) soaking the ceramic target in a ceramic cleaning solution at 40° C. for 40 min, and then ultrasonically cleaning the ceramic target twice at 40° C. and 20 kHz for 40 min to obtain a first ceramic target;

[0072] (2) using water to perform pure water ultrasonic cleaning twice for 40 min at 40° C. and 20 kHz to obtain a second ceramic target;

[0073] (3) The second ceramic target obtained in step (2) is sequentially subjected to purge drying and vacuum drying to obtain a cleaned ceramic target; the vacuum drying temperature is 100° C. and the time is 2 h.

[0074] Example 3

[0075] The present embodiment provides a ceramic cleaning solution, which includes, by mass percentage, 5wt% of polyoxyethylene fatty acid ester, 1wt% of sorbitol, 3wt% of sodium aminosulfonate, 1wt% of hexadecylamine, 4wt% of alkaline solution and 86wt% of water.

[0076] Wherein, the alkaline solution is sodium hydroxide and potassium hydroxide in a mass ratio of 1:1.2.

[0077] The cleaning method of the ceramic target material described in this embodiment comprises the following steps:

[0078] (1) soaking the ceramic target in a ceramic cleaning solution at 70° C. for 10 min, and then ultrasonically cleaning the ceramic target with the cleaning solution at 40° C. to 70° C. and 40 kHz for 10 min four times to obtain a first ceramic target;

[0079] (2) using water to perform pure water ultrasonic cleaning on the first ceramic target obtained in step (1) for 10 min three times at 60° C. and 40 kHz to obtain a second ceramic target;

[0080] (3) The second ceramic target obtained in step (2) is subjected to blow drying and vacuum drying in sequence to obtain a cleaned ceramic target; the vacuum drying temperature is 150° C. and the time is 1 hour.

[0081] Example 4

[0082] This embodiment provides a ceramic cleaning liquid, which is the same as that in Embodiment 1.

[0083] The cleaning method of the ceramic target material in this embodiment is different from that in Embodiment 1 only in that:

[0084] In this embodiment, the soaking temperature in step (1) is modified to 35°C.

[0085] Example 5

[0086] This embodiment provides a ceramic cleaning liquid, which is the same as that in Embodiment 1.

[0087] The cleaning method of the ceramic target material in this embodiment is different from that in Embodiment 1 only in that:

[0088] In this embodiment, the soaking temperature in step (1) is modified to 75°C.

[0089] Example 6

[0090] This embodiment provides a ceramic cleaning liquid, which is the same as that in Embodiment 1. The cleaning method of the ceramic target material in this embodiment differs from that in Embodiment 1 only in that:

[0091] In this embodiment, the temperature of ultrasonic cleaning with the cleaning solution in step (1) is modified to 35°C.

[0092] Example 7

[0093] This embodiment provides a ceramic cleaning liquid, which is the same as that in Embodiment 1. The cleaning method of the ceramic target material in this embodiment differs from that in Embodiment 1 only in that:

[0094] In this embodiment, the temperature of ultrasonic cleaning with the cleaning solution in step (1) is modified to 75°C.

[0095] Example 8

[0096] This embodiment provides a ceramic cleaning liquid, which is the same as that in Embodiment 1. The cleaning method of the ceramic target material in this embodiment differs from that in Embodiment 1 only in that:

[0097] In this embodiment, the power of the ultrasonic cleaning of the cleaning liquid in step (1) is modified to 15 kHz.

[0098] Example 9

[0099] This embodiment provides a ceramic cleaning liquid, which is the same as that in Embodiment 1. The cleaning method of the ceramic target material in this embodiment differs from that in Embodiment 1 only in that:

[0100] In this embodiment, the power of the ultrasonic cleaning of the cleaning liquid in step (1) is modified to 45 kHz.

[0101] Example 10

[0102] This embodiment provides a ceramic cleaning liquid, which is the same as that in Embodiment 1. The cleaning method of the ceramic target material in this embodiment differs from that in Embodiment 1 only in that:

[0103] In this embodiment, the temperature of the pure water ultrasonic cleaning in step (2) is modified to 30°C.

[0104] Embodiment 11

[0105] This embodiment provides a ceramic cleaning liquid, which is the same as that in Embodiment 1. The cleaning method of the ceramic target material in this embodiment differs from that in Embodiment 1 only in that:

[0106] In this embodiment, the temperature of the pure water ultrasonic cleaning in step (2) is modified to 70°C.

[0107] Example 12

[0108] This embodiment provides a ceramic cleaning liquid, which is different from the ceramic cleaning liquid in Embodiment 1 only in that:

[0109] In this embodiment, the content of the alkaline solution is modified to 6 wt %, and the content of water is modified to 85 wt %.

[0110] The cleaning method of the ceramic target described in this embodiment is the same as that in Embodiment 1.

[0111] Example 13

[0112] This embodiment provides a ceramic cleaning liquid, which is different from the ceramic cleaning liquid in Embodiment 1 only in that:

[0113] In this embodiment, the content of the corrosion inhibitor is modified to 3 wt %, and the content of water is modified to 86.5 wt %.

[0114] The cleaning method of the ceramic target described in this embodiment is the same as that in Embodiment 1.

[0115] Comparative Example 1

[0116] This comparative example provides a ceramic cleaning liquid, which is the same as that of Example 1.

[0117] The cleaning method of the ceramic target described in this comparative example is different from that in Example 1 only in that:

[0118] In this comparative example, the number of ultrasonic cleaning with the cleaning solution in step (1) is modified to 1 time.

[0119] Comparative Example 2

[0120] This comparative example provides a ceramic cleaning liquid, which is the same as that of Example 1.

[0121] The cleaning method of the ceramic target described in this comparative example is different from that in Example 1 only in that:

[0122] In this comparative example, the soaking process described in step (1) was omitted.

[0123] Comparative Example 3

[0124] This comparative example provides a ceramic cleaning liquid, which is the same as that of Example 1.

[0125] The cleaning method of the ceramic target described in this comparative example is different from that in Example 1 only in that:

[0126] In this comparative example, the number of times of pure water ultrasonic cleaning in step (2) is changed to 1 time.

[0127] Comparative Example 4

[0128] This comparative example provides a ceramic cleaning liquid, which is the same as that of Example 1.

[0129] The cleaning method of the ceramic target described in this comparative example is different from that in Example 1 only in that:

[0130] In this comparative example, the pure water ultrasonic cleaning described in step (2) was omitted.

[0131] The cleaned ceramic targets provided in the above embodiments and comparative examples were tested for cleanliness, and the results are shown in Table 1. The testing criteria include: heating the heating platform to 200° C. (in air) for 2 hours, and observing whether the appearance is white (taking magnesium oxide ceramics as an example).

[0132] Table 1

[0133]

[0134]

[0135] From Table 1, we can see that:

[0136] (1) Analysis of Example 1 and Examples 4-7 shows that changes in the immersion temperature and ultrasonic cleaning of the cleaning liquid will affect the activity of the surfactant, penetrant, dispersant, etc., and thus affect the cleaning rate of the ceramic target;

[0137] (2) It can be seen from the analysis of Example 1 and Examples 8-9 that the change of the ultrasonic power of the cleaning liquid ultrasonic cleaning will affect the effect of vibration to remove dirt from the ceramic surface, and further affect the cleaning rate of the ceramic target;

[0138] (3) It can be seen from the analysis of Example 1 and Examples 10-11 that the temperature change of pure water ultrasonic cleaning will affect the effect of removing impurities on the ceramic surface, and further affect the cleaning rate of the ceramic target;

[0139] (4) Analysis of Example 1 and Comparative Examples 1-4 shows that the number of times of ultrasonic cleaning with cleaning liquid and ultrasonic cleaning with pure water will affect the effect of removing residual impurities from the ceramic, and the immersion process will affect the efficiency of the cleaning liquid penetrating into the ceramic pores.

[0140] The specific embodiments described above further illustrate the objectives, technical solutions and beneficial effects of the present invention in detail. It should be understood that the above description is only a specific embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A ceramic cleaning liquid, characterized in that: The ceramic cleaning solution comprises a surfactant, a dispersant, a penetrant, a corrosion inhibitor, an alkaline solution and water.

2. The ceramic cleaning liquid according to claim 1, characterized in that: In terms of mass percentage, the ceramic cleaning solution includes 2-5wt% of a surfactant, 1-3wt% of a dispersant, 1-3wt% of a penetrant, 1-2wt% of a corrosion inhibitor, 2-4wt% of an alkaline solution and 80-90wt% of water.

3. The ceramic cleaning liquid according to claim 1 or 2, characterized in that: The surfactant includes any one or a combination of at least two of long-chain fatty alcohol polyoxyethylene ether, alkylphenol polyoxyethylene ether or fatty acid polyoxyethylene ester; Preferably, the dispersant comprises polyethylene glycol 200 and / or sorbitol; Preferably, the penetrant comprises polyoxyethylene fatty alcohol ether and / or sodium aminosulfonate; Preferably, the corrosion inhibitor comprises any one or a combination of at least two of mercaptobenzothiazole, benzotriazole or hexadecylamine; Preferably, the alkaline solution comprises sodium hydroxide and potassium hydroxide; Preferably, the mass ratio of the sodium hydroxide to potassium hydroxide is 1:(0.8-1.2).

4. A method for cleaning a ceramic target, characterized in that: The cleaning method comprises the following steps: (1) soaking the ceramic target in the ceramic cleaning solution according to any one of claims 1 to 3, and then ultrasonically cleaning the ceramic target at least twice to obtain a first ceramic target; (2) using water to perform pure water ultrasonic cleaning on the first ceramic target obtained in step (1) at least twice to obtain a second ceramic target; (3) The second ceramic target obtained in step (2) is sequentially subjected to purge drying and vacuum drying to obtain a cleaned ceramic target.

5. The cleaning method according to claim 4, characterized in that: The soaking temperature in step (1) is 40-70° C. Preferably, the soaking time in step (1) is 10 to 40 minutes.

6. The cleaning method according to claim 4, characterized in that: The temperature of the ultrasonic cleaning of the cleaning solution in step (1) is 40 to 70° C. Preferably, the ultrasonic cleaning time of the cleaning solution in step (1) is 10 to 40 minutes; Preferably, the ultrasonic power of the ultrasonic cleaning with the cleaning liquid in step (1) is 20 to 40 kHz.

7. The cleaning method according to any one of claims 4 to 6, characterized in that: A new ceramic cleaning solution is used in each ultrasonic cleaning process; Preferably, the ceramic target is immersed in the ceramic cleaning liquid during ultrasonic cleaning with the cleaning liquid.

8. The cleaning method according to any one of claims 4 to 7, characterized in that: The temperature of the pure water ultrasonic cleaning in step (2) is 40-60° C. Preferably, the time of the pure water ultrasonic cleaning in step (2) is 10 to 40 minutes; Preferably, the ultrasonic power of the pure water ultrasonic cleaning in step (2) is 20 to 40 kHz; Preferably, during the pure water ultrasonic cleaning in step (2), the ceramic target is immersed in water.

9. The cleaning method according to any one of claims 4 to 8, characterized in that: The vacuum drying temperature in step (3) is 100-150° C. Preferably, the vacuum drying time in step (3) is 1 to 2 hours.

10. The cleaning method according to any one of claims 4 to 9, characterized in that: The cleaning method comprises the following steps: (1) soaking the ceramic target material in the ceramic cleaning solution according to any one of claims 1 to 3 at 40 to 70° C. for 10 to 40 minutes, and then ultrasonically cleaning the ceramic target material at 40 to 70° C. and 20 to 40 kHz for at least two times for 10 to 40 minutes to obtain a first ceramic target material; (2) using water to perform pure water ultrasonic cleaning on the first ceramic target obtained in step (1) at least twice for 10 to 40 minutes at 40 to 60° C. and 20 to 40 kHz to obtain a second ceramic target; (3) The second ceramic target obtained in step (2) is sequentially subjected to purge drying and vacuum drying to obtain a cleaned ceramic target; the vacuum drying temperature is 100 to 150° C. and the time is 1 to 2 hours.

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