Device and method for eliminating scattered electrons and secondary electrons of electron beam evaporation equipment
By installing the anode plate in the electron beam evaporation device to absorb scattered electrons and secondary electrons, the damage problem of these electrons to the substrate is solved, and the film formation quality of the coating is improved.
Patent Information
- Application Number
- CN202311434274.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-10-31
- Publication Date
- 2025-05-02
AI Technical Summary
During the electron beam evaporation process, some electrons are converted into scattered electrons and secondary electrons, which may cause thermal damage and electron damage to the substrate and affect the film formation quality.
An anode plate is arranged in the electron beam evaporation device, surrounded by a crucible to absorb scattered electrons and secondary electrons, and a water-cooled baffle can be used as the anode plate to apply a positive voltage to enhance the absorption effect.
By absorbing scattered electrons and secondary electrons, the possibility of these electrons being reflected onto the substrate is reduced, thereby improving the film formation quality of the coating.
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Figure CN119913458A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of vacuum coating equipment technology, and in particular to a device and method for eliminating scattered electrons and secondary electrons in electron beam evaporation equipment. Background Art
[0002] Physical vapor deposition technology refers to the technology of using physical methods under vacuum conditions to vaporize the surface of the material source (solid or liquid) into gaseous atoms or molecules, or partially ionize it into ions, and deposit a thin film with certain special functions on the surface of the substrate through a low-pressure gas process. Physical vapor deposition is one of the main surface treatment technologies, among which electron beam evaporation is one of the physical vapor deposition technologies.
[0003] Electron beam evaporation uses accelerated electrons to bombard the coating material. The kinetic energy of the electrons is converted into heat energy to heat the coating material and evaporate it to form a film. Unlike traditional evaporation methods, electron beam evaporation uses the coordination of electromagnetic fields to accurately use high-energy electrons to bombard the target material in the crucible, causing it to melt and then deposit on the substrate, thereby depositing high-purity and high-precision thin films.
[0004] The electron beam evaporation equipment recorded in the related art includes an electron gun, a crucible and a main drum. The electron gun is used to emit an electron beam into the crucible, the crucible is used to place the coating material, and the main drum is used to wind the substrate. Of course, usually when the crucible is working, the electron beam emitted by the electron gun bombards the coating material in the crucible, so that the coating material is heated and evaporated, and finally a coating is formed on the substrate of the main drum. Usually, the main drum can rotate evenly to ensure the uniformity of film formation. However, during the electron beam evaporation coating process, the electrons bombarded on the evaporation material are not completely converted into heat for heating the evaporation material, and some electrons will be converted into scattered electrons and secondary electrons. On the one hand, scattered electrons and secondary electrons may directly bombard the surface of the substrate, causing thermal damage and electronic damage to the substrate; on the other hand, high-energy scattered electrons and secondary electrons may be reflected twice or multiple times by the protective plate around the crucible onto the surface of the substrate, which will also cause thermal damage and electronic damage to the substrate. Once the surface of the substrate is thermally damaged or electronically damaged, this will greatly affect the film quality of the substrate. Summary of the invention
[0005] In order to reduce the possibility of scattered electrons and secondary electrons being reflected onto a substrate and to improve the film-forming quality of the substrate, the present application provides a device and method for eliminating scattered electrons and secondary electrons in an electron beam evaporation device.
[0006] The present application provides a device and method for eliminating scattered electrons and secondary electrons in an electron beam evaporation device, which adopts the following technical solutions: A device for eliminating scattered electrons and secondary electrons in an electron beam evaporation device comprises an anode plate, wherein the anode plate is arranged between a main drum and a crucible, the anode plate is arranged around the periphery of the crucible, at least one and at most three anode plates are arranged away from the electron beam, and the anode plate is used to absorb scattered electrons and secondary electrons.
[0007] By adopting the above technical solution, by surrounding the anode plate between the main drum and the crucible, the scattered electrons and secondary electrons can be absorbed to reduce the number of scattered electrons and secondary electrons reflected to the substrate. Therefore, when electron beam evaporation is performed, the electron gun excites the electron beam, and the electron beam bombards the coating material in the crucible, causing the coating material to heat and evaporate, and at the same time the anode plate absorbs the scattered electrons and secondary electrons, so that only the coating material can be evaporated to the surface of the substrate. The use of the anode plate reduces the possibility of scattered electrons and secondary electrons reflecting on the substrate, thereby improving the coating quality.
[0008] Optionally, an electron shielding net is further included, which is arranged above the crucible and below the main drum, and is used to block scattered electrons and secondary electrons from passing through.
[0009] By adopting the above technical solution, the electronic shielding mesh is insulated from the evaporation chamber, and the pores of the mesh allow most of the coating materials to pass through, thereby achieving the purpose of blocking and screening.
[0010] Optionally, the electron shielding mesh can absorb electrons flowing toward the substrate or reflect electrons flowing toward the substrate back.
[0011] By adopting the above technical solution, positive pressure or negative pressure can be applied to the electronic shielding net according to actual conditions to achieve different processing effects.
[0012] Optionally, a surface structure is formed on one side of the anode plate close to the crucible, so as to reduce the number of scattered electrons and secondary electrons directly reflected to the surface of the substrate or to diffusely reflect the scattered electrons and secondary electrons.
[0013] By adopting the above technical solution and increasing the surface structure, the absorption effect of scattered electrons and secondary electrons can be improved, thereby achieving a better elimination effect.
[0014] Optionally, the side of the anode plate close to the crucible is formed into a concave mirror shape, a tile shape, or the anode plate is tilted.
[0015] By adopting the above technical solution, scattered electrons and secondary electrons can be scattered in a direction away from the substrate, thereby reducing the number of scattered electrons and secondary electrons reflected toward the substrate.
[0016] Optionally, a groove or a pyramid structure is formed on a side of the anode plate close to the crucible.
[0017] By adopting the above technical solution, the groove structure and the pyramid structure diffusely reflect the scattered electrons and secondary electrons incident on the anode plate, and the energy of some scattered electrons and secondary electrons is reduced after multiple collisions, and some scattered electrons and secondary electrons are scattered to positions deviating from the substrate.
[0018] Optionally, the anode plate is a water-cooled baffle or an auxiliary anode plate arranged on a side of the water-cooled baffle close to the crucible.
[0019] By adopting the above technical solution, according to actual conditions, the water-cooled baffle can be directly used as the anode plate, or an additional auxiliary anode plate can be added.
[0020] Optionally, the auxiliary anode plate is arranged close to the inner wall of the water-cooling baffle or is arranged at a distance from the water-cooling baffle.
[0021] By adopting the above technical solution, the position of the auxiliary anode plate can be selectively determined according to actual conditions, with high flexibility.
[0022] Optionally, the crucible is electrically insulated and a positive potential is applied to the crucible.
[0023] By adopting the above technical solution, the crucible is electrically insulated and a positive potential is applied. At this time, the crucible itself acts as an anode plate, which can absorb part of the scattered electrons and secondary electrons, directly reducing the scattered electrons and secondary electrons flowing to the main drum from the source.
[0024] Optionally, a method for eliminating scattered electrons and secondary electrons in an electron beam evaporation device comprises: The water-cooled baffle is used as an anode plate, and a positive voltage is applied to the water-cooled baffle; An auxiliary anode plate is added on the side of the water-cooled baffle close to the crucible; Design the position or surface structure of the auxiliary anode plate; An electron shielding net is arranged above the crucible and below the main drum; The crucible was electrically insulated and a positive potential was applied to the crucible.
[0025] By adopting the above technical solution, an anode plate is arranged around the crucible to absorb scattered electrons and secondary electrons, thereby reducing the possibility of scattered electrons and secondary electrons being reflected on the substrate and improving the coating quality. In addition, an electron shielding net is arranged above the crucible and below the main drum, and the electron shielding net absorbs electrons flowing to the substrate by applying positive pressure or reflects electrons flowing to the substrate by applying negative pressure, and the crucible is electrically insulated, and a positive potential is applied to the crucible to reduce the number of scattered electrons and secondary electrons flowing to the main drum.
[0026] In summary, the present application includes at least one of the following beneficial technical effects: 1. In the present application, an anode plate is arranged around the crucible of the electron beam evaporation equipment, and the anode plate can be in the following forms: 1) A water-cooled baffle is generally arranged around the crucible for thermal insulation, and one or more water-cooled baffles are electrically insulated from the chamber. The electrical insulation treatment method includes padding an insulating block at the connection or adding an insulating coating. The water-cooled baffle is used as an anode plate, and a positive voltage is applied to the water-cooled baffle to absorb scattered electrons and secondary electrons, thereby reducing the possibility of thermal damage and electronic damage caused by the electrons reflected by the crucible hitting the substrate. 2) An additional layer of anode plate is arranged in any one or more of the three surfaces. The anode plate can be installed on the inner wall or inner side of the water-cooled baffle. The material, shape and installation angle of the anode plate can be set according to the angle of the reflected electrons. This solution can achieve flexible angle configuration and stronger adjustability while meeting the conditions of absorbing scattered electrons and secondary electrons.
[0027] 2. The anode plate in the present application reduces the number of scattered electrons and secondary electrons directly reflected onto the surface of the substrate through a special position design or anode plate surface structure design, or diffusely reflects the scattered electrons and secondary electrons to reduce the number of scattered electrons and secondary electrons reflected onto the surface of the substrate. The placement position or surface structure includes but is not limited to the following forms: 1) The anode plate is made into a tile-like structure to scatter electrons in a direction deviating from the substrate; 2) The anode plate is made into a concave mirror shape to reduce the number of electrons reflected toward the substrate; 3) The anode plate is tilted to reduce the number of electrons reflected toward the substrate; 4) A groove structure is made on the surface of the anode plate facing the evaporation zone. The groove structure diffusely reflects the electrons incident on the anode plate. The energy of some electrons is reduced after multiple collisions in the groove, and some electrons are scattered by the groove to a position deviating from the substrate; 5) A pyramid structure is made on the surface of the anode plate to achieve the purpose of diffuse reflection of electrons; 3. In the present application, an electron shielding net is also provided. The electron shielding net is arranged above the crucible and below the main drum. The electron shielding net is insulated from the evaporation chamber. The pores of the mesh allow most of the target materials to pass through. The electron shielding net absorbs electrons flowing toward the substrate by applying positive pressure or reflects electrons flowing toward the substrate by applying negative pressure. BRIEF DESCRIPTION OF THE DRAWINGS
[0028] Figure 1 It is a schematic diagram of the structure of a device for eliminating scattered electrons and secondary electrons in an electron beam evaporation device using a water-cooled baffle as an anode plate in the present application; Figure 2 It is a schematic structural diagram of a device for eliminating scattered electrons and secondary electrons in an electron beam evaporation device with an auxiliary anode plate added in the present application; Figure 3It is a side view of a device for eliminating scattered electrons and secondary electrons in an electron beam evaporation device in which a water-cooled baffle is used as an anode plate in the present application; Figure 4 It is a side view of a device for eliminating scattered electrons and secondary electrons in an electron beam evaporation device with a water-cooled baffle disposed obliquely in the present application; Figure 5 It is a side view of a device for eliminating scattered electrons and secondary electrons in an electron beam evaporation device with another inclined form of a water-cooled baffle in the present application; Figure 6 It is a side view of a device for eliminating scattered electrons and secondary electrons in an electron beam evaporation device with a water-cooled baffle-molded concave mirror structure in the present application; Figure 7 It is a side view of a device for eliminating scattered electrons and secondary electrons in an electron beam evaporation device having a water-cooled baffle forming groove structure in the present application; Figure 8 It is a side view of a device for eliminating scattered electrons and secondary electrons in an electron beam evaporation device with a water-cooled baffle-shaped pyramid structure in the present application.
[0029] Explanation of the reference numerals: 1. Main drum; 2. Crucible; 3. Electron gun; 4. Water-cooled baffle; 5. Auxiliary anode plate; 6. Electron shielding net. DETAILED DESCRIPTION
[0030] The following is combined with Figure 1-8 This application is described in further detail.
[0031] The present application embodiment discloses a device for eliminating scattered electrons and secondary electrons in an electron beam evaporation device, referring to Figure 1 and Figure 2 The device for eliminating scattered electrons and secondary electrons in the electron beam evaporation equipment includes an anode plate, which is arranged between the main drum 1 and the crucible 2. The anode plate is arranged around the crucible 2. There are at least one and at most three anode plates, and the anode plates are used to absorb scattered electrons and secondary electrons.
[0032] When electron beam evaporation coating is performed, the electron gun 3 excites the electron beam, and the electron beam bombards the coating material in the crucible 2, causing the coating material to heat and evaporate. At the same time, the anode plate absorbs scattered electrons and secondary electrons, thereby reducing the possibility of scattered electrons and secondary electrons being reflected onto the substrate, thereby improving the coating quality.
[0033] Specifically, refer to Figure 2 and Figure 3, the water-cooled baffle 4 can be used directly as the anode plate, or an auxiliary anode plate 5 can be added to the side of the water-cooled baffle 4 close to the crucible 2. When the water-cooled baffle 4 is selected as the anode plate, one or more water-cooled baffles 4 need to be electrically insulated from the evaporation chamber, and then a positive voltage is applied to the water-cooled baffle 4, so that the water-cooled baffle 4 can be used as the anode plate. This method can fully utilize the water-cooled baffle 4, that is, the water-cooled baffle 4 not only achieves the cooling purpose, but also achieves the purpose of absorbing scattered electrons and secondary electrons, and this method can ensure that the anode plate area is maximized.
[0034] It should be noted that the electrical insulation between the water-cooling baffle 4 and the evaporation chamber can be achieved in the following manners: by placing an insulating block at the connection or by adding an insulating coating.
[0035] Reference Figure 1 and Figure 2 When the anode plate is an auxiliary anode plate 5 added to the side of the water-cooled baffle 4 close to the crucible 2, the auxiliary anode plate 5 can be set close to the inner wall of the water-cooled baffle 4, or it can be set at a distance from the water-cooled baffle 4. Of course, the installation position of the auxiliary anode plate 5 needs to be determined according to actual conditions. Both methods can meet work requirements and have high flexibility.
[0036] Since the installation position of the anode plate is not determined by the water-cooled baffle 4 or other components, the material, shape and installation angle of the auxiliary anode plate 5 can be set according to the angle of the reflected scattered electrons and secondary electrons. In this way, the method of adding an auxiliary anode plate 5 has high flexibility, and the corresponding auxiliary anode plate 5 can be adjusted according to the angle of the reflected scattered electrons and secondary electrons or even the position of the electron gun 3, which is more practical.
[0037] It should be noted that, whether the water-cooled baffle 4 is selected as the anode plate, or an auxiliary anode plate 5 is added, at least one water-cooled baffle 4 or an auxiliary anode plate 5 is provided, and at most three are provided. In order to achieve the best absorption effect, three are preferably used. It is understandable that when three water-cooled baffles 4 or auxiliary anode plates 5 are provided, the water-cooled baffles 4 or auxiliary anode plates 5 need to be set away from the electron beam, that is, the position of the electron gun 3 should be located at the opening of the whole surrounded by the water-cooled baffles 4 or auxiliary anode plates 5. Similarly, when one or two water-cooled baffles 4 or auxiliary anode plates 5 are provided, it is also necessary to ensure that the electron beam accurately bombards the coating material in the crucible 2. The specific number of water-cooled baffles 4 or auxiliary anode plates 5 can be determined according to actual conditions.
[0038] The materials of the auxiliary anode plate 5 include graphite, carbon fiber, copper, aluminum, stainless steel, tantalum, molybdenum, tungsten, nickel and alloys thereof. Of course, the material of the auxiliary anode plate 5 only needs to meet the working requirements. In actual use, other materials may also be used.
[0039] In particular, whether the water-cooled baffle plate 4 is directly used as the anode plate or an auxiliary anode plate 5 is added, a special position design or surface structure design can be used to reduce the number of scattered electrons and secondary electrons directly reflected to the substrate surface or to diffusely reflect the scattered electrons and secondary electrons, thereby reducing the number of scattered electrons and secondary electrons reflected to the substrate surface. In this embodiment, only the water-cooled baffle plate 4 is used as an example for illustration.
[0040] Specifically, refer to Figure 4 and Figure 5 , through special position design or surface structure design, reducing the number of scattered electrons and secondary electrons directly reflected to the surface of the substrate includes the following forms: first, the anode plate can be tilted, that is, the water-cooled baffle 4 or the auxiliary anode plate 5 is tilted. In this embodiment, when the anode plate is tilted, two anode plates are provided, and the two anode plates are arranged at an angle. The opening direction of the two anode plates is toward the direction of the electron gun 3. In order to improve the effect, one of the anode plates is preferably arranged horizontally. In this way, the scattered electrons and secondary electrons can be scattered in a direction away from the substrate by using the tilted anode plate, thereby achieving the protection of the substrate.
[0041] Secondly, refer to Figure 6 , a concave mirror shape or a tile shape can be formed on the surface of the anode plate. In this way, by using a special surface structure, scattered electrons and secondary electrons can be scattered in a direction away from the substrate to reduce the number of scattered electrons and secondary electrons reflected toward the substrate. It can be understood that the form of reducing the number of scattered electrons and secondary electrons directly reflected toward the substrate surface through special position design or surface structure design includes but is not limited to the above-mentioned form. According to actual conditions, other position designs that meet the requirements or other surface structures that meet the requirements can be used.
[0042] Reference Figure 7 and Figure 8 , through special position design or surface structure design, the scattered electrons and secondary electrons are diffusely reflected, including the following forms: a groove structure or a pyramid structure can be formed on the surface of the anode plate. In this way, using this special structure, the scattered electrons and secondary electrons incident on the anode plate are diffusely reflected, and some scattered electrons and secondary electrons have reduced energy after multiple collisions in the grooves and cannot reach the surface of the substrate. It can be understood that through special position design or surface structure design, the forms of diffuse reflection of scattered electrons and secondary electrons include but are not limited to the above forms, and other surface structures that meet the requirements can be used according to actual conditions.
[0043] Reference Figure 1 and Figure 2An electron shielding net 6 can also be arranged above the crucible 2 and below the main drum 1. The electron shielding net 6 is insulated from the evaporation chamber. The pores of the mesh allow most of the coating material to pass through. The electron shielding net 6 can block the passage of scattered electrons and secondary electrons, reducing the possibility of scattered electrons and secondary electrons being reflected onto the substrate.
[0044] Specifically, the electron shielding net 6 absorbs the electrons flowing toward the substrate by applying positive pressure or reflects the electrons flowing toward the substrate by applying negative pressure, and the appropriate pressure can be selected according to the actual situation. Of course, the insulation method can adopt the method of adding an insulating block or an insulating coating at the connection. In this embodiment, the number of meshes of the electron shielding net 6 is not limited.
[0045] In addition, the crucible 2 itself can also be used as an anode plate. Specifically, the crucible 2 is electrically insulated, and a positive potential is applied to the crucible 2 to reduce the number of scattered electrons and secondary electrons flowing to the main drum 1. In this way, the scattered electrons and secondary electrons flowing to the main drum 1 are directly reduced from the source, which is more targeted. It should be noted that in this embodiment, the potential range is 0-1000V, and the specific potential value can be selected according to actual conditions.
[0046] In this embodiment, the anode plate includes the following forms: a water-cooled baffle 4 as the anode plate, an auxiliary anode plate 5 is installed, an electron shielding net 6 is set, and the crucible 2 itself is used as the anode plate. Of course, the form of the anode plate includes but is not limited to the above four types. According to actual conditions, the anode plate can also adopt other forms that meet the requirements.
[0047] The implementation principle of the device for eliminating scattered electrons and secondary electrons in an electron beam evaporation device of the embodiment of the present application is as follows: by arranging an anode plate around the crucible 2 to absorb scattered electrons and secondary electrons, the possibility of scattered electrons and secondary electrons being reflected on the substrate is reduced, and the coating quality is improved. Specifically, the water-cooled baffle 4 can be directly used as the anode plate, and a positive voltage can be applied to the water-cooled baffle 4, and the water-cooled baffle 4 can be directly used to absorb scattered electrons or secondary electrons; an auxiliary anode plate 5 can also be arranged on the side of the water-cooled baffle 4 close to the crucible 2 to achieve the absorption of scattered electrons or secondary electrons; in order to further improve the absorption effect, the position and surface structure of the auxiliary anode plate 5 can be specially designed; an electron shielding net 6 can also be added above the crucible 2 and below the main drum 1 to achieve the purpose of absorbing or reflecting scattered electrons or secondary electrons; the crucible 2 can also be directly electrically insulated and a positive potential can be applied, so as to directly reduce the number of scattered electrons and secondary electrons flowing to the main drum 1 from the source.
[0048] The present application also discloses a method for eliminating scattered electrons and secondary electrons using an electron beam evaporation device. The method for eliminating scattered electrons and secondary electrons using an electron beam evaporation device includes: The water-cooled baffle 4 is used as an anode plate; Specifically, the following steps are included: One or more water-cooling baffles 4 are electrically insulated from the chamber: the electrical insulation treatment method may be to place an insulating block at the connection or to add an insulating coating; A positive voltage is applied to the water-cooled baffle 4 .
[0049] Adding an auxiliary anode plate 5: the material, shape and installation angle of the auxiliary anode plate 5 can be set according to the angle of reflected electrons; Add electronic shielding net 6; The electron shielding net 6 is arranged above the crucible 2 and the main drum 1. The electron shielding net 6 is insulated from the evaporation chamber. The electron shielding net 6 absorbs electrons flowing toward the substrate by applying positive pressure or reflects electrons flowing toward the substrate by applying negative pressure.
[0050] The crucible 2 is electrically insulated: a positive potential is applied to the crucible 2 .
[0051] The crucible 2 can also be electrically insulated by placing insulating blocks at the joints or adding insulating coatings.
[0052] It should be noted that the four methods of eliminating scattered electrons and secondary electrons, namely, using the water-cooled baffle 4 as an anode plate, adding an auxiliary anode plate 5, adding an electron shielding net 6, and adding an electron shielding net 6, do not have a clear order of precedence when used. In this embodiment, only the above-mentioned order of use is used as an example for explanation.
[0053] Of course, according to the actual situation, the four methods of eliminating scattered electrons and secondary electrons, namely, using the water-cooled baffle 4 as an anode plate, adding an auxiliary anode plate 5, adding an electron shielding net 6, and adding an electron shielding net 6, can be used selectively, that is, only any one of them can be selected, or any two of them can be selected and used in combination, or any three of them can be selected and used in combination, and of course these four methods can also be used in combination.
[0054] The implementation principle of a method for eliminating scattered electrons and secondary electrons in an electron beam evaporation device of an embodiment of the present application is as follows: first, a water-cooled baffle 4 is used as an anode plate, and a positive voltage is applied to the water-cooled baffle 4 to absorb scattered electrons and secondary electrons. This method directly uses the water-cooled baffle 4 as an anode plate to maximize the area of the anode plate; secondly, an auxiliary anode plate 5 can be added to the side of the water-cooled baffle 4 close to the crucible 2, and the material, shape and installation angle of the auxiliary anode plate 5 can be adjusted according to the angle of the reflected electrons, which has strong flexibility; in addition, the auxiliary anode plate 5 can be specially designed or surface structured to improve the absorption effect; then, an electron shielding net 6 is added above the crucible 2 and below the main drum 1 to allow most of the coating material to pass through, and a voltage is applied to the metal net to rebound or absorb the scattered electrons and secondary electrons to reduce the number of electrons radiated to the substrate; finally, the crucible 2 itself can be used as an anode to absorb part of the scattered electrons and secondary electrons, and reduce the scattered electrons and secondary electrons flowing to the main drum 1. In this way, the possibility of scattered electrons and secondary electrons being reflected on the substrate is reduced, and the coating quality is improved.
[0055] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.
Claims
1. A device for eliminating scattered electrons and secondary electrons in an electron beam evaporation device, characterized in that: The invention comprises an anode plate, wherein the anode plate is arranged between a main drum (1) and a crucible (2), the anode plate is arranged around the periphery of the crucible (2), at least one and at most three anode plates are arranged away from the electron beam, and the anode plate is used to absorb scattered electrons and secondary electrons.
2. The device for eliminating scattered electrons and secondary electrons in electron beam evaporation equipment according to claim 1, characterized in that: It also comprises an electron shielding net (6), which is arranged above the crucible (2) and below the main drum (1), and is used to block scattered electrons and secondary electrons from passing through.
3. The device for eliminating scattered electrons and secondary electrons in electron beam evaporation equipment according to claim 2, characterized in that: The electron shielding net (6) can absorb the electrons flowing toward the substrate or reflect the electrons flowing toward the substrate back.
4. The device for eliminating scattered electrons and secondary electrons in electron beam evaporation equipment according to claim 1, characterized in that: A surface structure is formed on one side of the anode plate close to the crucible (2) to reduce the number of scattered electrons and secondary electrons directly reflected to the surface of the substrate or to diffusely reflect the scattered electrons and secondary electrons.
5. The device for eliminating scattered electrons and secondary electrons in electron beam evaporation equipment according to claim 4, characterized in that: The side of the anode plate close to the crucible (2) is formed into a concave mirror shape, a tile shape, or the anode plate is arranged tilted.
6. The device for eliminating scattered electrons and secondary electrons in electron beam evaporation equipment according to claim 4, characterized in that: A groove or a pyramid structure is formed on a side of the anode plate close to the crucible (2).
7. The device for eliminating scattered electrons and secondary electrons in electron beam evaporation equipment according to claim 1, characterized in that: The anode plate is a water-cooled baffle (4) or an auxiliary anode plate (5) arranged on a side of the water-cooled baffle (4) close to the crucible (2).
8. The device for eliminating scattered electrons and secondary electrons in electron beam evaporation equipment according to claim 7, characterized in that: The auxiliary anode plate (5) is arranged close to the inner wall of the water-cooling baffle (4) or is arranged at a distance from the water-cooling baffle (4).
9. The device for eliminating scattered electrons and secondary electrons in electron beam evaporation equipment according to claim 1, characterized in that: The crucible (2) is electrically insulated and a positive potential is applied to the crucible (2).
10. A method for eliminating scattered electrons and secondary electrons in an electron beam evaporation device, characterized in that: include: The water-cooled baffle (4) is used as an anode plate, and a positive voltage is applied to the water-cooled baffle (4); An auxiliary anode plate (5) is provided on a side of the water-cooling baffle (4) close to the crucible (2); Performing position design or surface structure design on the auxiliary anode plate (5); An electron shielding net (6) is arranged above the crucible (2) and below the main drum (1); The crucible (2) is electrically insulated and a positive potential is applied to the crucible (2).