Chamber body, chamber apparatus, semiconductor processing system, and method of manufacturing chamber body
By using subtractive manufacturing technology to form the upper wall of the ceramic welded parts during the manufacturing process of the quartz product chamber, and forming the side wall and the lower wall through welding, the influence of human factors during the welding process is solved, the strength and optical characteristics of the welded parts are improved, the manufacturing process is simplified and the cost is reduced.
Patent Information
- Application Number
- CN202411509204.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-10-31
- Filing Date
- 2024-10-28
- Publication Date
- 2025-05-02
AI Technical Summary
Prior Art When manufacturing quartz product chambers, the welding process is prone to introduce human factors such as bubbles, inclusions and residual stresses, which leads to the impact of the optical properties and strength of the welded parts and increases the complexity and cost of the manufacturing process.
The upper wall of the ceramic welded piece is formed by a single ceramic workpiece by welding the side wall to the upper wall to form the side wall and the lower wall, and the unwelded rib-like area covers the channel to limit the deformation and optical effects of the welded piece.
It reduces the influence of human factors during welding, improves the strength and optical characteristics of the welded parts, simplifies the manufacturing process, reduces costs, and improves the dimensional consistency of the welded parts.
Smart Images

Figure CN119913482A_ABST
Abstract
Description
[0001] CROSS-REFERENCE TO RELATED APPLICATIONS
[0002] This application claims priority to and the benefit of U.S. Provisional Patent Application No. 63 / 546,606, U.S. Provisional Patent Application No. 63 / 546,608 filed on October 31, 2023, and U.S. Provisional Patent Application No. 63 / 546,611, all of which were filed on October 31, 2023, and the contents of each of which are also incorporated herein by reference in their entirety. Technical Field
[0003] The present disclosure relates generally to chamber bodies and, more particularly, to methods of making chamber bodies, such as chamber bodies formed at least in part from a ceramic material such as quartz. Background Art
[0004] Quartz articles, such as chambers used to deposit material layers in semiconductor processing systems, are often formed using welding techniques. For example, a cold wall chamber used to deposit material layers using chemical vapor deposition techniques often includes walls defining a processing volume, with structural members joined to the walls by welding. The structural members are often welded to the walls, such as using hydrogen gas welding techniques, so that the processing volume contained within the chamber walls can be maintained at a relatively low pressure relative to the external environment during deposition of the material layer onto a substrate supported within the chamber.
[0005] One challenge with welded quartz articles is that the welding process can easily introduce artifacts into the chamber weld during fabrication. For example, bubbles and / or inclusions formed from non-native materials can infiltrate the weld structure during welding, potentially altering the optical properties of the weld and / or the strength of the weld. The localized nature of the heating employed during the welding process and subsequent cooling can impart residual stresses into the weld structure, potentially limiting the strength of the weld and increasing the risk of fracture of the weld during subsequent handling and / or fabrication processes. The heat used during the welding process can cause the shape of the weld to deform during welding, thereby deviating dimensionally from the dimensions of the intended weld, potentially altering the characteristics of the final weld.
[0006] There are various countermeasures to limit the introduction of artifacts into welds and / or remove artifacts from welds after the welding process. For example, welding can be done in an environmentally controlled workspace to limit the introduction of contaminants. The welded components can be further cleaned before welding, also limiting the risk of contaminants being introduced into welds during welding. The residual stresses generated by the welding process can be eliminated (at least partially) by annealing the welds after the welding process, and uniform heating and subsequent controlled cooling limit stresses that would otherwise limit the strength of the welds. And during the heating process, the heating of the joined articles can be carefully controlled to limit the deformation of the shape defined by the resulting weld, so that the weld is more likely to meet the dimensional requirements of the application in which the weld is used. Although this technology generally meets its intended purpose, it increases the cost and complexity of quartz product manufacturing. For example, a weld formed by multiple welds may require multiple annealing operations because the residual stress introduced during the previous welding operation needs to be removed before the subsequent welding operation is performed, thereby extending the manufacturing process.
[0007] Such chambers and methods of manufacturing chambers using welding techniques are generally considered suitable for their intended purposes. However, there is still a need in the art for improved chamber bodies, chamber devices, and semiconductor processing systems including chamber bodies, and related methods of manufacturing chamber bodies. The present disclosure provides a solution to this need. Summary of the invention
[0008] A chamber body including a ceramic welded part is provided. The ceramic welded part has an upper wall, a side wall, a lower wall, and a lower wall rib segment. The side wall is coupled to the upper wall by side wall-to-upper wall welding, the lower wall is coupled to the side wall by side wall-to-lower wall welding and defines a channel, and the lower wall rib segment is coupled to the lower wall plate by lower wall rib segment welding. The upper wall has an upper wall plate portion and an upper wall rib portion, which define an upper wall unwelded rib-shaped area covering the channel, and is formed using a single ceramic workpiece using a subtractive manufacturing technique.
[0009] In addition to or as an alternative to one or more of the features described above, further examples of the chamber body may include an un-welded ribbed region of an upper wall of the ceramic weldment separated from the passage by an interior of the ceramic weldment.
[0010] In addition to or as an alternative to one or more of the features described above, further examples of the chamber body may include an un-welded ribbed region of an upper wall of the ceramic weldment separated from the passage by an interior of the ceramic weldment.
[0011] In addition to one or more of the above features, or as an alternative, a further example of a chamber body can include a ceramic weldment including an injection end flange and a discharge end flange. The injection end flange can be coupled to the upper wall plate portion. The discharge end flange can be coupled to the upper wall plate portion and separated from the injection end flange by an upper wall unwelded ribbed area of an upper wall of the ceramic weldment.
[0012] In addition to or as an alternative to one or more of the features described above, further examples of chamber bodies may include a tube body coupled to the lower wall plate at the passage. The tube body may separate the injection end flange from the discharge end flange of the ceramic weldment.
[0013] In addition to or in lieu of one or more of the features described above, further examples of the chamber body may include an injection end flange and a discharge end flange that may separate an upper wall unwelded ribbed region of the ceramic weldment from a lower wall rib segment.
[0014] In addition to or as an alternative to one or more of the above features, a further example of the chamber body may include that the lower wall rib segment is one of two or more lower wall rib segments coupled to the ceramic weldment. The ceramic weldment may also include two or more first side rib segments, each disposed between the upper wall unwelded rib segment and the plurality of lower wall rib segments, and two or more second side rib segments, each disposed between the upper wall unwelded rib segment and the plurality of lower wall rib segments. The upper wall unwelded rib-shaped region of the ceramic weldment may separate the two or more first side rib segments from the two or more second side rib segments.
[0015] In addition to or as an alternative to one or more of the above features, further examples of the chamber body may include two or more lower wall rib segments connected to the lower wall plate by welding. The two or more lower wall rib segments may be separated from the upper wall unwelded rib region by the lower wall plate of the ceramic weldment.
[0016] In addition to one or more of the above features, or as an alternative, a further example of the chamber body can include a ceramic welded part further including an injection end flange coupled to the upper wall plate portion of the upper wall by welding the injection end flange to the upper wall plate portion, and a discharge end flange coupled to the upper wall plate portion of the upper wall by welding the discharge end flange to the upper wall plate portion. The upper wall unwelded ribbed area can separate the injection end flange from the upper wall plate portion welding and the discharge end flange from the upper wall plate portion welding without any intervening welding therebetween.
[0017] In addition to one or more of the above features, or as an alternative, a further example of the chamber body may include that the side wall of the ceramic welded part is a first side wall, the side wall and the upper wall welding is the first side wall and the upper wall plate portion welding, and the ceramic welded part further includes a second side wall and the second side wall and the upper wall plate portion welding. The second side wall may be laterally opposite to the first side wall and separate the lower wall plate of the ceramic welded part from the upper wall of the ceramic welded part. The welding of the second side wall and the upper wall plate portion may connect the second side wall to the upper wall plate portion. The upper wall unwelded ribbed area may separate the welding of the first side wall and the upper wall from the welding of the second side wall and the upper wall without any intervening welding therebetween.
[0018] In addition to or as an alternative to one or more of the features described above, further examples of chamber bodies may include an upper wall un-welded ribbed region of the ceramic weldment having a width greater than at least 300 mm. The ceramic weldment may consist essentially of a ceramic material such as quartz.
[0019] In addition to or as an alternative to one or more of the features described above, further examples of the chamber body may include upper wall unwelded ribs in the ceramic weld area covering lower wall rib segments welded to the ceramic weld.
[0020] A chamber device is provided. The chamber device includes a chamber body as described above, wherein the upper wall unwelded ribbed area has a width greater than at least 300 mm, a divider located within the interior of the chamber body and having a divider hole, and a substrate support member arranged in the divider hole and supported to rotate about a rotation axis therein. The upper wall unwelded ribbed area of the ceramic welded member covers the substrate support member and the divider of the chamber device.
[0021] In addition to or in lieu of one or more of the features described above, further examples of chamber apparatus can include a substrate pyrometer supported above an upper wall of the ceramic weldment and along a substrate pyrometer optical axis that intersects the substrate support. An unwelded ribbed region of the upper wall of the ceramic weldment can optically couple the substrate pyrometer to an interior of the ceramic weldment.
[0022] In addition to or in lieu of one or more of the features described above, a further example of a chamber apparatus can include a chamber pyrometer supported above an upper wall of a ceramic weldment and along a chamber pyrometer optical axis that intersects a substrate support or divider. An unwelded ribbed region of an upper wall of the ceramic weldment can be optically coupled to the chamber pyrometer.
[0023] In addition to or in lieu of one or more of the features described above, further examples of chamber arrangements can include two or more upper heater elements supported above an upper wall of a ceramic weldment. Unwelded ribbed regions of the upper wall of the ceramic weldment can optically couple the upper heater elements to a substrate support or a divider of the chamber arrangement.
[0024] A semiconductor processing system is provided. The semiconductor processing system includes a chamber device, the chamber device includes a chamber body as described above, wherein the unwelded rib-shaped area of the upper wall of the ceramic weldment has a width greater than at least 300 mm. A precursor source including a silicon-containing material layer precursor can be connected to the injection end of the chamber body, and an exhaust source including a vacuum pump can be connected to the exhaust end of the chamber body and connected to the precursor source through the chamber body.
[0025] A method for manufacturing a chamber body weldment is provided. The method includes forming an upper wall having an upper wall plate portion and an upper wall rib portion extending from the upper wall plate portion from a single ceramic workpiece using a subtractive manufacturing technique, coupling the side wall to the upper wall using side wall-to-upper wall welding, coupling a lower wall plate defining a channel to the side wall using side wall-to-lower wall welding so that an unwelded rib-shaped area of the upper wall covers the channel, and coupling the lower wall rib segment to the lower wall plate using lower wall rib segment welding.
[0026] In addition to one or more of the above-mentioned features, or as an alternative, further examples of the method may include using the injection end flange to weld to the upper wall plate portion to connect the injection end flange to the upper wall plate portion of the upper wall, using the discharge end flange to weld to the upper wall plate portion to connect the discharge end flange to the upper wall plate portion, using multiple first side rib segments to weld to the ceramic welded part to connect the multiple first side rib segments to the ceramic welded part, and using multiple second side rib segments to weld to the ceramic welded part to connect the multiple second side rib segments to the ceramic welded part.
[0027] In addition to or instead of one or more of the features described above, a further example of the method may include aligning the tube body to a channel defined in the lower wall panel, and coupling the tube body to the lower wall panel at the channel using welding of the tube body to the lower wall panel.
[0028] In addition to or in lieu of one or more of the features described above, further examples of the method may include that the subtractive manufacturing techniques used to form the ribbed portion of the upper wall of the weldment may include one or more of milling, core drilling, and sawing.
[0029] In addition to or in lieu of one or more of the features described above, a semiconductor processing system may include a chamber assembly having a chamber body fabricated using the method described above.
[0030] The present invention summary is provided to introduce some concepts in a simplified form. These concepts are further described in detail in the detailed description of the examples of the following disclosure. The present invention summary is not intended to identify the key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter. BRIEF DESCRIPTION OF THE DRAWINGS
[0031] These and other features, aspects and advantages of the present invention disclosed herein are described below with reference to the accompanying drawings of certain embodiments, which are intended to illustrate rather than to limit the present invention.
[0032] Figure 1 is a schematic diagram of a semiconductor processing system including a chamber arrangement according to the present disclosure, showing a material layer being deposited onto a substrate while positioned within a chamber body including a ceramic weldment;
[0033] Figure 2 According to the example of the present disclosure Figure 1 a cross-sectional side view of a chamber body showing an upper wall formed using subtractive manufacturing techniques and coupled to a ceramic weldment by welding;
[0034] Figures 3 to 6 According to an example of the present invention Figure 1 A plan view and a side view of a ceramic weldment showing an unwelded ribbed area of an upper wall defined by a subtractive manufacturing technique and welding to form the weldment;
[0035] Figure 7 Based on the example Figure 1 An exploded perspective view of a ceramic weldment of FIG. 1 , showing an upper wall formed using a subtractive technique and components of the ceramic weldment connected using a welding technique; and
[0036] Figure 8 is a process flow diagram of a method of manufacturing a ceramic weldment for a chamber body for a semiconductor processing system showing operations of the method according to illustrative and non-limiting examples of the method.
[0037] It should be understood that the elements in the drawings are shown for simplicity and clarity and are not necessarily drawn to scale. For example, the relative sizes of some elements in the drawings may be exaggerated relative to other elements to help improve the understanding of the illustrated embodiments of the present disclosure. DETAILED DESCRIPTION
[0038] Reference will now be made to the drawings, wherein like reference numerals represent similar structural features or aspects of the subject disclosure. For purposes of explanation and illustration, and not limitation, Figure 1 A partial view of an example of a semiconductor processing system including a chamber apparatus having a chamber body according to the present disclosure is shown in FIG. 1 and is generally indicated by the reference numeral 100 . Figure 2-8 Other examples of chamber bodies, chamber arrangements, and semiconductor processing systems including chamber bodies according to the present disclosure are provided in, as well as related methods of manufacturing chamber bodies and depositing material layers onto substrates supported in chamber bodies according to the present disclosure, or aspects thereof, as will be described. The systems and methods of the present disclosure may be used to manufacture and use chamber bodies for depositing material layers onto substrates, such as silicon-containing epitaxial material layers deposited using chemical vapor deposition techniques in a chamber arrangement having a lateral flow architecture, although the present disclosure is generally not limited to any particular deposition technique or chamber structure.
[0039] refer to Figure 1, a semiconductor processing system 100 is shown. The semiconductor processing system 100 includes a precursor source 102, a chamber arrangement 200 including a chamber body 300, an exhaust source 104, and a controller 106. The precursor source 102 is connected to the chamber arrangement 200 via a precursor supply conduit 108, and is configured to provide a flow of a material layer precursor 10 to the chamber arrangement 200. The chamber arrangement 200 is connected to the exhaust source 104, and is configured to expose a substrate 2 supported within the chamber arrangement 200 to the material layer precursor 10 under selected environmental conditions (e.g., temperature and pressure) so that a material layer 4 is deposited onto an upper surface 6 of the substrate 2. The exhaust source 104 is connected to the chamber arrangement 200 via an exhaust conduit 110, is fluidically coupled to an external environment 8 outside the semiconductor processing system 100 (e.g., via a vacuum pump 112 and / or an abatement device such as a scrubber), and is configured to convey a flow of residual material layer precursors and / or reaction products 12 to the external environment 8.
[0040] It is contemplated that the controller 106 may be operably connected to one or more of the precursor source 102, the chamber apparatus 200, and the exhaust source 104 to control the deposition of the material layer 4 onto the substrate 2. In this regard, the controller 106 may be connected to one or more of the precursor source 102, the chamber apparatus 200, and the exhaust source 104 via a wired or wireless link 114 to control the temperature of the substrate 2 and / or the pressure within the chamber body 300. For example, the temperature of the substrate 2 may be controlled using a heater element and / or a temperature sensor included in the chamber apparatus 200 and operably associated with and / or in communication with the controller 106. The pressure within the chamber body 300 may be controlled using a vacuum pump 112.
[0041] In some examples, the material layer precursor 10 may include one or more silicon-containing material layer precursors. Examples of suitable silicon-containing material layer precursors include non-halogenated silicon-containing material layer precursors, such as silane (SiH4) and disilane (Si2H6), and halogenated silicon-containing material layer precursors, such as dichlorosilane (H2SiCl2) and trichlorosilane (HCl3Si). According to some examples, the material layer precursor 10 may include alloy components, such as germanium-containing material layer precursors, such as germanium (GeH4), gallium-containing material layer precursors, such as triethylgallium Ga(C2H5)3, or indium-containing material layer precursors, such as trimethylindium ((CH3)3In). It is conceivable that in some examples, the material layer precursor 10 may include one or more dopant-containing material layer precursors. Examples of suitable dopant-containing material layer precursors include p-type dopants such as boron (B) and arsenic (As) and n-type dopants such as phosphorus (P) and antimony (Sb). It is contemplated that the material layer precursor 10 may be co-flowed with a diluent / carrier gas such as hydrogen (H2) or nitrogen (N2) and / or an etchant such as hydrochloric acid (HCl) or chlorine (Cl2), according to some examples.
[0042] As used herein, the term "substrate" may refer to any one or more underlying materials, including any one or more underlying materials that can be modified or on which a device, circuit or membrane can be formed. The substrate can be continuous or non-continuous; rigid or flexible; solid or porous; and combinations thereof. The substrate can be in any form, such as (but not limited to) powder, plate or workpiece. The substrate in plate form can include wafers of various shapes and sizes, including, for example, 300 mm wafers. The substrate can be formed of semiconductor materials, including, for example, silicon (Si), silicon germanium (SiGe), silicon oxide (SiO2), gallium arsenide (GaAs), gallium nitride (GaN) and silicon carbide (SiC). The substrate can include a pattern or can be unpatterned, such as a so-called blanket substrate. For example, a substrate in powder form can be used in drug manufacturing. The porous substrate can include one or more polymers. Examples of workpieces can include medical devices (such as stents and syringes), jewelry, tool equipment, components for battery manufacturing (such as anodes, cathodes or separators), or components of photovoltaic cells, etc. The continuous substrate can extend beyond the boundaries of the processing chamber where the deposition process occurs. In some processes, the continuous substrate can be moved through the processing chamber so that the process continues until the end of the substrate is reached. The continuous substrate can be provided from a continuous substrate feeding system to allow the continuous substrate to be manufactured and output in any suitable form. Non-limiting examples of continuous substrates may include thin sheets, nonwoven films, rolls, foils, nets, flexible materials, bundled continuous filaments or fibers (e.g., ceramic fibers or polymer fibers). The continuous substrate may also include a carrier or thin sheet on which one or more non-continuous substrates are mounted.
[0043] refer to Figure 2 , a chamber arrangement 200 is shown. In the example shown, the chamber arrangement 200 includes a chamber body 300, an injection flange 202, and an exhaust flange 204. In the example shown, the chamber arrangement 200 also includes an upper heater element array 206, a lower heater element array 208, a substrate pyrometer 210, a chamber pyrometer 212, and a lift and rotation module 214. Although shown and described herein as having certain elements and a particular architecture, such as a single substrate cross-flow architecture, it should be understood and appreciated that semiconductor processing systems having chamber arrangements including other elements and / or excluding elements may also benefit from the present disclosure.
[0044] The chamber body 300 may be formed from a ceramic material 302. The chamber body 300 may include a ceramic weldment 324 (e.g., Figure 3304, a first sidewall 308 and a second sidewall 310. The upper wall 304 may extend longitudinally between an injection end 312 and a longitudinally opposite discharge end 314 of the chamber body 300. The upper wall 304 may also have an upper wall interior surface 360 that defines an interior 316 of the chamber body 300 and / or the ceramic weld 324. The lower wall 306 may be separated from the upper wall 304 by the interior 316 of the chamber body 300. The lower wall 306 may be substantially parallel to the upper wall 304 of the chamber body 300. The first sidewall 308 may couple the lower wall 306 to the upper wall 304 of the chamber body 300.
[0045] The first sidewall 308 can extend longitudinally between the injection end 312 and the discharge end 314 of the chamber body 300. The first sidewall 308 can be substantially orthogonal relative to either (or both) of the lower wall 306 and the upper wall 304 of the chamber body 300. The second sidewall 310 can be similar to the first sidewall 308 and additionally be laterally separated from the first sidewall 308 by the lateral width of the interior 316 of the chamber body 300. It is contemplated that the chamber body 300 can have a plurality of external ribs 318. The plurality of external ribs 318 can extend laterally around the exterior surfaces of the upper wall 304, the lower wall 306, the first sidewall 308, and the second sidewall 310 of the chamber body 300. The plurality of external ribs 318 can also be longitudinally spaced apart from each other along the length of the chamber body 300 between the injection end 312 and the discharge end 314 of the chamber body 300. Although shown and described herein as having a particular number and spacing (e.g., pitch) of external ribs 318, it should be understood and appreciated that the chamber body 300 may have fewer or more external ribs than shown and described herein and / or have different spacing and still be within the scope of the present disclosure.
[0046] The injection flange 202 can abut the injection end 312 of the chamber body 300 and couple the precursor supply conduit 108 to the chamber body 300. The exhaust flange 204 can similarly abut the exhaust end 314 of the chamber body 300 at a longitudinally opposite position to the injection flange 202 and further couple the chamber body 300 to the exhaust conduit 110. It is contemplated that the gate valve 216 can be coupled to the injection flange 202 and in turn couple the substrate transfer robot 218 to the chamber body 300. In some examples, the ceramic material 302 can include a transparent material, such as a ceramic material that is transparent to electromagnetic radiation in the infrared band. According to some examples, in this regard, the chamber body 300 or a ceramic weldment 324 included in the chamber body can consist of or consist essentially of the ceramic material 302. Non-limiting examples of suitable transparent materials include quartz, fused silica, and sapphire.
[0047] The upper heater element array 206 is configured to heat the substrate 2 (e.g., using electromagnetic radiation in the infrared band) during deposition of the material layer 4 onto the upper surface 6 of the substrate 2, and in this regard may be supported above the chamber body 300. The upper heater element array 206 may be optically coupled to the interior 316 of the chamber body 300 through the upper wall 304 of the chamber body 300, and includes a plurality of upper heater elements 220. The plurality of upper heater elements 220 may each include a linear filament. The plurality of upper heater elements 220 may extend laterally above the upper wall 304 of the chamber body 300 and between the first side wall 308 and the second side wall 310. The plurality of upper heater elements 220 may be longitudinally spaced apart from each other between the injection end 312 and the discharge end 314 of the chamber body 300.
[0048] The lower heater element array 208 can be similar to the upper heater element array 206 and additionally supported below the chamber body 300. The lower heater element array 208 can also include a plurality of lower heater elements 222. The plurality of lower heater elements 222 can extend longitudinally between an injection end 312 and a discharge end 314 of the chamber body 300. The plurality of lower heater elements 222 can be laterally spaced apart from each other between a first sidewall 308 and a second sidewall 310 of the chamber body 300. In some examples, the plurality of lower heater elements 222 can be substantially orthogonal relative to the plurality of upper heater elements 220. According to some examples, either (or both) of the upper heater element array 206 and the lower heater element array 208 can include a bulb-type lamp and still be within the scope of the present disclosure.
[0049] The substrate pyrometer 210 may be configured to obtain temperature measurements of the substrate 2 during deposition of the material layer 4 onto the upper surface 6 of the substrate 2, and in this regard may be supported above the chamber body 300. The substrate pyrometer 210 may be arranged along a substrate pyrometer optical axis 224. The substrate pyrometer optical axis 224 may intersect a substrate support 226 disposed within the interior 316 of the chamber body 300 and configured to seat the substrate 2 thereon. The substrate pyrometer 210 may also be optically coupled to the interior 316 of the chamber body 300 through the upper wall 304 of the chamber body 300, for example, through an unwelded ribbed region 340 of the upper wall (e.g., Figure 4304 ), which may be weld-free. The substrate pyrometer 210 may utilize electromagnetic radiation emitted by either (or both) the substrate 2 and the material layer 4 during deposition onto the upper surface 6 of the substrate 2 to obtain temperature measurements of the substrate 2, and the electromagnetic radiation is transmitted along the substrate pyrometer optical axis 224 through the ceramic material 302 forming the upper wall 304 of the chamber body 300. In this regard, the upper wall unwelded ribbed region 340 may optically couple the substrate pyrometer 210 to the interior 316 of the chamber body 300. In some examples, the substrate pyrometer 210 may cooperate with one or more second substrate pyrometers that are supported above the upper wall 304 of the chamber body 300 and arranged so that one or more second optical axes intersect the substrate support 226. Examples of suitable substrate pyrometers include those shown and described in U.S. Patent Application Publication No. 2022 / 0298672A1 to M'Saad, filed on March 17, 2022, the contents of which are incorporated herein by reference in their entirety.
[0050] The chamber pyrometer 212 can be configured to obtain temperature measurements of the chamber body 300. In this regard, it is contemplated that the chamber pyrometer 212 is configured to obtain temperature measurements of the upper wall 304 of the chamber body 300 using electromagnetic radiation emitted by the upper wall 304 of the chamber body 300. The chamber pyrometer 212 can be supported above the chamber body 300 and optically coupled to the chamber body 300 via a chamber pyrometer optical axis 228. The chamber pyrometer optical axis 228 can be offset from the substrate support 226, such as longitudinally offset. The chamber pyrometer optical axis 228 can be substantially parallel to the substrate pyrometer optical axis 224. It is contemplated that the chamber pyrometer 212 can be configured to communicate with the controller 106 ( Figure 1 ) communications, such as controlling the mass flow rate of coolant circulating around the chamber body 300 to control the temperature of the chamber body 300. Examples of suitable chamber pyrometers include those shown and described in U.S. Patent No. 11,390,950, issued to Kim et al. on July 19, 2022, the contents of which are incorporated herein by reference in their entirety.
[0051] In some examples of the present disclosure, the chamber apparatus 200 may include a divider 230, a support member 232, and an axis member 234. The divider 230 may be formed of an opaque material 236, such as a material that is opaque to electromagnetic radiation within the infrared band. The divider 230 may be located within the interior 316 of the chamber body 300. The divider 230 may divide the interior 316 into an upper chamber 238 and a lower chamber 240. The divider 230 may further define a divider hole 242, through which the upper chamber 238 is coupled to the lower chamber 240. The substrate support 226 may be supported within the divider hole 242 for rotation R about a rotation axis 244, and may be formed of an opaque material 246, such as a material that is opaque to electromagnetic radiation within the infrared band. The substrate support 226 can be operably associated with the lift and rotate module 214 via a support member 232 and an axis member 234 for rotating the substrate 2 during deposition of the material layer 4 thereon and / or for positioning and removing the substrate 2. In this regard, the support member 232 can be disposed within the lower chamber 240 of the chamber body 300 along a rotation axis 244. The support member 232 can further be rotationally fixed relative to the substrate support 226.
[0052] The shaft member 234 can be arranged along the rotation axis 244, extending through the channel 320 defined in the lower wall 306 of the chamber body 300. The shaft member 234 can be (at least partially) arranged in the tube body 322 ( Figure 5 306 of the chamber body 300 and is substantially coaxial with the rotation axis 244. In some examples, the rotation axis 244 can be substantially parallel to either (or both) of the substrate pyrometer optical axis 224 and the chamber pyrometer optical axis 228. According to some examples, the opaque material 236 and / or the opaque material 246 can include a carbonaceous material and / or a ceramic material. Examples of suitable carbonaceous materials include graphite and pyrolytic carbon. Examples of suitable ceramic materials include bulk silicon carbide and silicon carbide coatings.
[0053] As described above, certain manufacturing techniques used to manufacture the chamber body may introduce artifacts into the structure of the chamber body. For example, welding techniques such as hydrogen (H2) gas welding may impose residual stresses into the weld formed using the welding technique due to the local characteristics of the heating used to form the weld. The welding technique may also cause the weld to deviate in size from the expected geometry of the weld formed using the welding technique, such as by changing the flatness and / or contour of the resulting fillet formed using the welding technique. Residual stresses can usually be eliminated using a post-weld annealing operation, although at the expense of additional manufacturing cycle time, typically corresponding to the number of welds that require post-weld annealing. Dimensional deviations may be more difficult to correct after welding, requiring dimensional tolerances to be expanded to reflect the processing capabilities of the welding technique used to manufacture the chamber body and / or higher scrap rates due to dimensional inconsistencies. And even so, some material layer deposition processes may be sensitive to welding artifacts, such as welding artifacts generated in the chamber structure where external heating elements and / or temperature sensors are optically coupled to the substrate during processing. In order to limit (or eliminate) such human factors from affecting the reliability of the chamber device 200, the chamber body 300 includes a ceramic weldment 324 (such as Figure 3 shown).
[0054] Reference Figure 3-6 , a ceramic weld 324 is shown. The ceramic weld 324 may include an upper wall 304, a lower wall 306, a first side wall 308, and a second side wall 310. The ceramic weld 324 may also include an injection end flange 326, a discharge end flange 328, a plurality of first side rib segments 330, and a plurality of second side rib segments 332. Although shown and described herein as including specific elements and having a specific arrangement, it should be understood and appreciated that the ceramic weld 324 may include other elements and / or exclude elements shown and described herein, and / or have a different arrangement than shown and described in other examples and implementations herein, and still be within the scope of the present disclosure.
[0055] Reference Figure 3 , a portion of a ceramic weldment 324 including an upper wall 304 is shown. The upper wall 304 may be made of a ceramic material 302 (e.g. Figure 2 304 is formed (e.g., by or consisting essentially of) and has an upper wall plate portion 334 and an upper wall rib portion 336 extending therefrom. It is contemplated that the upper wall 304 is formed from a single ceramic workpiece 338 (e.g., by casting) using a subtractive manufacturing technique (e.g., not casting). Figure 7The upper wall 304 is integrally formed with the upper wall plate portion 334 and the upper wall rib portion 336 of the upper wall 304, thereby both defining an upper wall unwelded rib region 340, and the upper wall 304 also has an integral single-piece structure and is integrally formed from the ceramic material 302. In view of the present disclosure, those skilled in the art will appreciate that using subtractive manufacturing techniques to form the upper wall 304 can simplify the manufacture of the ceramic weld 324, such as eliminating the welding operation required to connect the rib segments to the ceramic weld 324. Advantageously, using subtractive manufacturing techniques to form the upper wall 304 can also impart sufficient lateral rigidity to the upper wall 304 to limit (or eliminate) deformation within the ceramic weld 324 during the connection of the parts with welding, and also simplify the manufacture of the ceramic weld 324. Further advantageously, forming the upper wall 304 can limit (or eliminate) optical effects associated with connecting parts to the ceramic weld 324, such as when an external device (such as an upper heater element and / or a pyrometer) is optically connected to the interior 316 ( Figure 2 ), which otherwise may exist within the upper wall unwelded ribbed area 340. As used herein, the term "unwelded ribbed area" refers to an integral single-piece structure with no intervening welds and no welding or casting artifacts that may alter the size or optical properties of the unwelded ribbed area.
[0056] The upper panel portion 334 of the upper wall 304 can have an upper panel portion injection edge 342, an upper panel portion discharge edge 344, an upper panel portion first longitudinal edge 346, and an upper panel portion second longitudinal edge 348. The upper panel portion injection edge 342 can be longitudinally offset from the upper wall rib portion 336 of the upper wall 304. The upper panel portion discharge edge 344 can be longitudinally opposite the upper panel portion injection edge 342 and separated therefrom by the upper wall rib portion 336. The upper panel portion injection edge 342 and the upper panel portion discharge edge 344 can define an upper wall interior surface 360 (e.g., Figure 2 344). The upper panel portion first longitudinal edge 346 and the upper panel portion second longitudinal edge 348 may extend longitudinally between the upper panel portion injection edge 342 and the upper panel portion discharge edge 344. The upper panel portion first longitudinal edge 346 and the upper panel portion second longitudinal edge 348 may couple the upper panel portion injection edge 342 to the upper panel portion discharge edge 344. In some examples, the upper panel portion first longitudinal edge 346 and the upper panel portion second longitudinal edge 348 may be substantially orthogonal relative to either (or both) of the upper panel portion injection edge 342 and the upper panel portion discharge edge 344. According to some examples, the upper panel portion first longitudinal edge 346 and the upper panel portion second longitudinal edge 348 may be parallel relative to each other.
[0057] The upper wall rib portion 336 of the upper wall 304 can define one or more upper wall rib segments, such as a plurality of upper wall rib segments 350. It is contemplated that the plurality of upper wall rib segments 350 extend transversely between the upper wall panel portion first longitudinal edge 346 and the upper wall panel portion second longitudinal edge 348. The plurality of upper wall rib segments 350 can further extend from the upper wall panel portion 334 along a line that is aligned with the upper wall interior surface 360 (e.g., Figure 2 The plurality of upper wall rib segments 350 may correspond in number and / or longitudinal position to (e.g., match) the plurality of lower wall rib segments 352 (e.g., Figure 4 In some examples, a plurality of upper wall rib segments 350 can couple the upper wall panel portion first longitudinal edge 346 to the upper wall panel portion second longitudinal edge 348 of the upper wall 304 .
[0058] The upper wall unwelded ribbed area 340 may cover the lower wall 306 (eg, Figure 2 300). In some examples, the upper wall unwelded ribbed area 340 can extend around the channel 320. According to some examples, the upper wall unwelded ribbed area 340 can have a width 303 greater than about 300 mm. In view of this disclosure, those skilled in the art will appreciate that setting the size of the upper wall unwelded ribbed area 340 to at least 300 mm can limit the use of the upper heater element array 206 ( Figure 2 ) to heat the substrate 2 ( Figure 2 ) and / or the effects of soldering artifacts on the temperature measurements obtained using the substrate pyrometer 210 and the chamber pyrometer 212, thereby improving the accuracy of the temperature measurement used to deposit the material layer 4 ( Figure 1 Control of the deposition process of depositing (as shown) onto the substrate 2.
[0059] The injection end flange 326 is configured to receive the injection flange 202 ( Figure 2 ), and may be made of ceramic material 302 ( Figure 2 308 (shown in FIG. 309 ), the injection end flange 326 may be formed of (e.g., consist of or consist essentially of) an upper wall panel portion 334 of the upper wall 304. The injection end flange 326 may be separated from the upper wall panel portion discharge edge 344 by an upper wall rib portion 336. The injection end flange 326 may be coupled to the upper wall 304 by an injection end flange and upper wall panel portion weld 354. The injection end flange and upper wall panel portion weld 354 may, in turn, extend laterally along the upper wall panel portion injection edge 342. The injection end flange and upper wall panel portion weld 354 may be formed of (e.g., consist of or consist essentially of) an upper wall panel portion 334 of the upper wall 304. The injection end flange and upper wall panel portion weld 354 may be formed of (e.g., consist of or consist essentially of) an upper wall panel portion 334 of the upper wall 304. The injection end flange and upper wall panel portion weld 354 may be formed of Figure 2 shown) and the second side wall 310 ( Figure 2As used herein, the term "welding" refers to a thermal bond, connection or structure that joins two elements by a process involving softening or melting a ceramic material within at least one element, such that the materials of the elements are fixed to each other when cooled, and the welded elements are thus structurally fixed to each other due to cooling. As used herein, the term "welding" refers to a thermal bond, connection or structure that joins two elements by a process involving softening or melting a ceramic material within at least one element, such that the materials of the elements are fixed to each other when cooled, and the welded elements are thus structurally fixed to each other due to cooling.
[0060] The discharge end flange 328 is configured to receive the discharge flange 204 (eg, Figure 2 ), and may similarly be made of ceramic material 302 (such as Figure 2 The discharge end flange 328 may be formed (e.g., composed of or substantially composed of the ceramic material 302) of the upper wall 304. The discharge end flange 328 may be longitudinally adjacent to the upper wall plate portion 334 of the upper wall 304. The discharge end flange 328 may be separated from the upper wall plate portion discharge edge 344 by the upper wall rib portion 336 of the upper wall 304. The discharge end flange 328 may be longitudinally opposite the injection end flange 326. It is contemplated that the discharge end flange 328 is coupled to the upper wall plate portion 334 by a discharge end flange and upper wall plate portion weld 356. The discharge end flange and upper wall plate portion weld 356 may, in turn, extend transversely along the upper wall plate portion discharge edge 344. The discharge end flange and upper wall plate portion weld 356 may extend transversely between the first side wall 308 and the second side wall 310. In some examples, the discharge end flange and upper wall plate portion weld 356 may extend continuously and uninterruptedly between the first side wall 308 and the second side wall 310. According to some examples, the upper wall unwelded ribbed region 340 may extend continuously and uninterruptedly (eg, without any intervening welds) between the injection end flange and upper wall panel portion weld 354 and the discharge end flange and upper wall panel portion weld 356 .
[0061] Reference Figure 4 , a portion of a ceramic weldment 324 including a lower wall 306 is shown. The lower wall 306 may be made of a ceramic material 302 (e.g. Figure 2 The lower wall 306 may include a lower wall panel 358 and one or more lower rib segments, such as a plurality of lower wall rib segments 352. The lower wall panel 358 has a lower wall interior surface 364 (such as Figure 2The lower wall panel 358 may further include a lower wall panel injection edge 368, a lower wall panel discharge edge 370, a lower wall panel first longitudinal edge 372, and a lower wall panel second longitudinal edge 374. The lower wall interior surface 364 may be substantially planar in shape, extending longitudinally between the lower wall panel injection edge 368 and the lower wall panel discharge edge 370, and further extending transversely between the lower wall panel first longitudinal edge 372 and the lower wall panel second longitudinal edge 374. The lower wall exterior surface 366 may be substantially planar in shape, and extending longitudinally between the lower wall panel injection edge 368 and the lower wall panel discharge edge 370. The lower wall exterior surface 366 may extend transversely between the lower wall panel first longitudinal edge 372 and the lower wall panel second longitudinal edge 374 of the lower wall panel 358.
[0062] In some examples, the lower panel discharge edge 370 can be substantially parallel to the lower panel injection edge 368 of the lower panel 358. The lower panel second longitudinal edge 374 can be substantially parallel to the lower panel first longitudinal edge 372. In some examples, the lower panel first longitudinal edge 372 can be substantially orthogonal relative to either (or both) of the lower panel injection edge 368 and the lower panel discharge edge 370. According to some examples, the lower panel second longitudinal edge 374 can be substantially orthogonal relative to either (or both) of the lower panel injection edge 368 and the lower panel discharge edge 370.
[0063] The plurality of lower wall rib segments 352 may be made of a ceramic material 302 (eg Figure 2 The plurality of lower wall rib segments 352 may be formed of (e.g., consist of or consist essentially of) a lower wall exterior surface 366 as shown. The plurality of lower wall rib segments 352 may be coupled to the lower wall exterior surface 366 by a plurality of lower wall rib segment welds 362. The plurality of lower wall rib segments 352 extend transversely between a lower wall panel first longitudinal edge 372 and a lower wall panel second longitudinal edge 374 of the lower wall panel 358. In some examples, the plurality of lower wall rib segments 352 may be substantially orthogonal relative to the lower wall panel first longitudinal edge 372 and / or the lower wall panel second longitudinal edge 374. According to some examples, the plurality of lower wall rib segments 352 may be substantially parallel to the lower wall panel injection edge 368 and / or the lower wall panel discharge edge 370 of the lower wall panel 358. In some examples, the plurality of lower wall rib segments 352 may couple (e.g., transversely span) the lower wall panel first longitudinal edge 372 to the lower wall panel second longitudinal edge 374 of the lower wall panel 358.
[0064] It is contemplated that the injection end flange 326 can be coupled to the lower panel injection edge 368 via an injection end flange to lower panel weld 376. The injection end flange to lower panel weld 376 can extend between the lower panel first longitudinal edge 372 and the lower panel second longitudinal edge 374 of the lower panel 358. In some examples, the injection end flange to lower panel weld 376 can extend continuously and uninterruptedly between the lower panel first longitudinal edge 372 and the lower panel second longitudinal edge 374 of the lower panel 358.
[0065] It is also contemplated that the discharge end flange 328 can be coupled to a lower panel discharge edge 370 of the lower panel 358. In this regard, the discharge end flange 328 can be coupled to the lower panel 358 via a discharge end flange to lower panel weld 378. The discharge end flange to lower panel weld 378 can extend between a lower panel first longitudinal edge 372 and a lower panel second longitudinal edge 374. In some examples, the discharge end flange to lower panel weld 378 can extend continuously and uninterruptedly between the lower panel first longitudinal edge 372 and the lower panel second longitudinal edge 374 of the lower panel 358.
[0066] Reference Figure 5 , a portion of a ceramic weldment 324 including a first sidewall 308 is shown. The first sidewall 308 may be made of a ceramic material 302 (e.g. Figure 2 The first side wall 308 may further include an upper wall 304 (such as Figure 2 ) is connected to the lower wall 306 of the ceramic weldment 324 (as shown Figure 2 More specifically, the first side wall 308 may include an upper wall plate portion 334 ( Figure 2 306 of the ceramic weldment 324. Specifically, the first side wall 308 can connect the upper wall plate portion 334 of the upper wall 304 to the lower wall plate 358 of the lower wall 306 (as shown in FIG. Figure 3 34). It is contemplated that the first side wall 308 may be coupled to the upper wall panel portion 334 via a first side wall to upper wall panel portion weld 380. It is also contemplated that the first side wall 308 may be coupled to the lower wall panel 358 via a first side wall to lower wall panel weld 382. The first side wall to upper wall panel portion weld 380 may extend continuously and uninterruptedly between the injection end flange to upper wall panel portion weld 344 and the discharge end flange to upper wall panel portion weld 356. In some examples, the first side wall to lower wall panel weld 382 may extend continuously and within a discontinuity between the injection end flange to lower wall panel weld 376 and the discharge end flange to lower wall panel weld 378.
[0067] The injection end flange 326 and the discharge end flange 328 are connected by the first side wall 308 by welding. In this regard, the injection end flange 326 can be connected to the first side wall 308 by the injection end flange and first side wall weld 384. On the other hand, the discharge end flange 328 can be connected to the first side wall 308 by the discharge end flange and first side wall weld 386. The discharge end flange and first side wall weld 386 can be longitudinally separated by the pipe body 322 and the injection end flange and first side wall weld 384. In some examples, the injection end flange and first side wall weld 384 can extend longitudinally continuously and uninterruptedly between the injection end flange and lower wall plate weld 376 and the injection end flange and upper wall plate portion weld 354. According to some examples, the discharge end flange and first side wall weld 386 can extend continuously and uninterruptedly between the discharge end flange and lower wall plate weld 378 and the discharge end flange and upper wall plate portion weld 356. It is contemplated that the tube body 322 may include (or consist of or consist essentially of) the ceramic material 302 (e.g. Figure 2 shown).
[0068] The plurality of first side rib segments 330 are welded 388 (eg, Figure 3 324. In this regard, it is contemplated that each of the first side rib segment to ceramic weld 388 may couple a corresponding one of the plurality of first side rib segments 330 to the ceramic weld 324. On the other hand, one or more of the plurality of first side rib segments 330 may be coupled to the plurality of lower wall rib segments 352 ( Figure 3 In these aspects, it is contemplated that the plurality of first side rib segments 330 cooperate with the plurality of upper wall rib segments 350 defined by the upper wall rib portion 336 of the upper wall 304 and the plurality of lower wall rib segments 352 of the lower wall panel 358 coupled to the lower wall 306 to form a plurality of first side rib segments 330 and a plurality of first side rib segments 350 and a plurality of first side rib segments 352 of the lower wall panel 358 of the lower wall 306 to form a plurality of first side rib segments 330 and a plurality of first side rib segments 350 and a plurality of first side rib segments 350 and a plurality of first side rib segments 352 of the lower wall panel 358 coupled to the lower wall 306 to form a plurality of first side rib segments 330 and a plurality of first side rib segments 350 and a plurality of first side rib segments 350 Figure 1 A plurality of external ribs 318 (shown) extending Figure 2 In some examples, the plurality of first side rib segments and the ceramic weldment weld 388 may be as shown and described in U.S. Patent Application No. 99 / 999,999 filed on the same date, the contents of which are hereby incorporated by reference in their entirety.
[0069] Reference Figure 6 , a portion of the ceramic weldment 324 including the second side wall 310 is shown in another side view. The second side wall 310 may be similar to the first side wall 308 (eg, Figure 2 ), and in this regard, the upper wall 304 of the ceramic weldment 324 (as shown) can be similarly Figure 2 ) is connected to the lower wall 306 of the ceramic weldment 324 (as shown Figure 2More specifically, the second side wall 310 may be connected to the upper wall plate portion 334 (such as Figure 4 306 of the ceramic weld 324. Specifically, the second side wall 310 can connect the upper wall plate portion 334 of the upper wall 304 to the lower wall plate 358 of the lower wall 306 of the ceramic weld 324 (as shown). Figure 3 On the other hand, the second side wall 310 can be made of a ceramic material 302 (such as Figure 2 , as shown) is formed by (e.g., consists of or consists essentially of).
[0070] It is contemplated that the connection of the upper wall 304 to the lower wall 306 via the second side wall 310 may be achieved by welding the second side wall to the lower wall plate 390. The second side wall to the lower wall plate welding 390 may be parallel to the first side wall to the lower wall plate welding 382 (eg, Figure 5 The second side wall and the lower wall plate weld 390 may extend parallel to the first side wall and the upper wall plate portion weld 380 (as shown). Figure 5 In some examples, the second side wall and the lower wall plate weld 390 can be welded to the lower wall plate at the injection end flange 376 ( Figure 4 ) to the discharge end flange and welded to the lower wall plate 378 ( Figure 4 ) between the upper wall 304 and the lower wall 306. It is conceivable that the connection of the upper wall 304 to the lower wall 306 through the second side wall 310 can be further achieved by welding the second side wall to the upper wall plate portion 392. The second side wall to the upper wall plate portion weld 392 can extend parallel to the second side wall to the lower wall plate weld 390. In some examples, the second side wall to the upper wall plate portion weld 392 can extend continuously and uninterruptedly between the injection end flange to the upper wall plate portion weld 354 and the discharge end flange to the upper wall plate portion weld 356. According to some examples, the upper wall 304 ( Figure 2 The upper wall of the unwelded ribbed area 340 (shown) Figure 3 As shown) the first side wall and the upper wall plate can be partially welded 380 ( Figure 5 As shown) and the second side wall and the upper wall panel portion weld 392 extend continuously and uninterruptedly.
[0071] The injection end flange 326 and the discharge end flange 328 may be coupled to the second side wall 310 by welding. In this regard, the injection end flange 326 may be coupled to the second side wall 310 by the injection end flange to second side wall weld 394. On the other hand, the discharge end flange 328 may be coupled to the second side wall 310 by the discharge end flange to second side wall weld 396. The injection end flange to second side wall weld 394 and the discharge end flange to second side wall weld 396 may be similar to the injection end flange to first side wall weld 384 and the discharge end flange to first side wall weld 386, respectively, the injection end flange to second side wall weld 394 being substantially parallel to the injection end flange to first side wall weld 384, and the discharge end flange to second side wall weld 396 being substantially parallel to the discharge end flange to first side wall weld 386. Advantageously, the dimensional consistency imparted to upper wall 304 by the subtractive manufacturing process used to form upper wall 304 of ceramic weld 324 may also limit deflection of the aforementioned welds relative to one another, also improving the yield of the process used to manufacture ceramic weld 324 .
[0072] The plurality of second side rib segments 332 may be similar to the plurality of first side rib segments 330 (eg, Figure 5 As shown), and this aspect can be achieved by welding a plurality of second side rib segments to a ceramic welding member 398 (as shown Figure 4 324. In this regard, it is contemplated that each of the plurality of second side rib segments 332 may cooperate with each of the plurality of lower wall rib segments 352, the plurality of upper wall rib segments 350, and the plurality of first side rib segments 330 to form the chamber body 300 ( Figure 1 The outer rib 318 (shown) Figure 2 As described above, the dimensional consistency imparted to the upper wall 304 of the ceramic weld 324 by the subtractive manufacturing process used to form the upper wall 304 of the ceramic weld 324 can limit (or eliminate) the possibility of misalignment of the rib segments forming any of the plurality of external ribs 318, thereby improving the yield of the manufacturing process used to manufacture the ceramic weld 324. In view of the present disclosure, those skilled in the art will understand that limiting the possibility of misalignment can also improve the yield of the process used to manufacture the ceramic weld 324 because it will reduce the skill level of the manufacturer used to manufacture the ceramic weld, thereby limiting the cost and time required to manufacture the ceramic weld 324.
[0073] refer to Figure 7, the ceramic weld 324 is shown assembled in an exploded view. As indicated by arrow A, it is contemplated that the upper wall 304 is formed from a single ceramic workpiece 338 using subtractive manufacturing techniques. In this regard, it is contemplated that material is removed from a monolithic ceramic workpiece (e.g., a quartz workpiece) to define an upper wall plate portion 334 and an upper wall rib portion 336 without using welding techniques to couple the upper rib to the upper wall 304. In some examples, the upper wall 304 may be formed using a machining operation. Examples of suitable machining operations that may be used to form the upper wall 304 include milling, grinding, cutting and lapping, and using certain rotary lapping tools. Advantageously, forming the upper wall 304 using subtractive techniques may limit the time required to manufacture the ceramic weld 324, increase the yield of the process for manufacturing the ceramic weld 324, and / or limit the necessary skill level of the manufacturer for manufacturing the ceramic weld 324. In view of the present disclosure, those skilled in the art will appreciate that this may limit the cost of the ceramic weld 324 and / or limit the cycle time associated with the manufacture of the ceramic weld 324. Subtractive manufacturing techniques used to form the ribbed portion of the weldment upper wall may include one or more of milling, core drilling, and sawing.
[0074] As shown by arrows B and C, the first side wall 308 and the second side wall 310 can be coupled to the upper wall 304 using welding. In this regard, it is contemplated that the first side wall 308 is welded proximate the upper wall panel portion first longitudinal edge 346 (e.g., Figure 3 The position of the first side wall is aligned to the upper wall inner surface 360. Once aligned, the first side wall is partially welded to the upper wall panel 380 ( Figure 5 304 of the ceramic weld 324. It is contemplated that the first side wall and upper wall plate portion weld 380 may be formed longitudinally at the upper wall plate portion injection edge 342 (e.g. Figure 3 ) and the upper wall panel portion discharge edge 344 (as shown Figure 3 The second side wall 310 may similarly be aligned to the upper wall interior surface 360 (as shown) at a location proximate to the second longitudinal edge 348 of the upper wall panel portion. Figure 2 Then, a second side wall to upper wall panel section weld 392 may be formed at a longitudinal position between the upper wall panel section injection edge 342 and the upper wall panel section discharge edge 344.
[0075] As shown by arrows D and E, the injection end flange 326 and the discharge end flange 328 can be coupled to the ceramic weldment 324 using welding techniques. In this regard, it is contemplated that the injection end flange 326 can be aligned to the upper wall plate portion injection edge 342 (e.g., the upper wall plate portion 334 of the upper wall 304) of the upper wall plate portion 334. Figure 3 Once aligned, the injection end flange 326 can be welded to the upper wall portion by forming an injection end flange to upper wall portion weld 354 (as shown in FIG. 1 ) between the injection edge 342 of the upper wall portion and the injection end flange 326. Figure 3 By forming an injection end flange and first side wall weld 384 ( Figure 5 As shown), and further forming an injection end flange and second side wall weld 394 between the second side wall 310 and the injection end flange 326 ( Figure 6 The injection end flange 326 may be further coupled to the first side wall 308. The discharge end flange 328 may be similarly aligned to the upper wall panel portion discharge edge 344 of the upper wall panel portion 334 of the upper wall 304 (as shown). Figure 3 The discharge end flange 328 and the upper wall plate portion discharge edge 344 are formed between the discharge end flange and the upper wall plate portion weld 356 (as shown in FIG. Figure 3 As shown), and the discharge end flange and the first side wall weld 386 (formed between the discharge end flange 328 and the first side wall 308 and the second side wall 310, respectively Figure 5 as shown) and the discharge end flange is welded to the second side wall 396 ( Figure 6 shown).
[0076] As shown by arrows F and G, the lower wall plate 358 can be coupled to the ceramic weld 324 such that the lower wall plate 358 is registered to one or more of the first side wall 308, the second side wall 310, the injection end flange 326, and the discharge end flange 328. Once registered, a weld can be formed between the lower wall plate 358 and the ceramic weld 324. In this regard, it is contemplated that the first side wall and lower wall plate weld 382 ( Figure 5 ) is formed on the lower wall plate 358 and the first side wall 308 ( Figure 5 On the other hand, the second side wall is welded to the lower wall plate 390 ( Figure 6 As shown) can be formed between the lower wall plate 358 and the second side wall 310, and the injection end flange is welded to the lower wall plate 376 ( Figure 4 As shown) can be formed at the injection end flange 326 and the lower wall plate injection edge 368 ( Figure 4 As shown), the discharge end flange is welded to the lower wall plate 378 ( Figure 4 324) is formed between the discharge end flange 328 and the lower wall plate. Advantageously, the aforementioned dimensional stability (e.g., resistance to deformation associated with localized heating) provided by the subtractive manufacturing techniques used to form the upper wall 304 can simplify the formation of the weld that couples the lower wall plate 358 to the ceramic weldment 324, such as limiting (or eliminating) the need to remove native material to achieve registration and / or fill gaps associated with dimensional variations.
[0077] Once the lower wall plate 358 has been coupled to the ceramic weld 324, the plurality of lower wall rib segments 352 may be coupled to the lower wall plate 358. In this regard, as indicated by arrows H and I, the plurality of lower wall rib segments 352 may be sequentially registered to the ceramic weld 324 and the plurality of lower wall rib segment welds 362 ( Figure 4 362). The registration can be achieved at a location below the upper wall rib portion 336 of the upper wall 304, which is used as a template to inform the manufacturer where any of the multiple lower wall rib segments 352 should be positioned prior to welding. The upper wall rib portion 336 can also be used as a post-weld indicator to indicate whether the expected position of any of the multiple lower wall rib segments 352 has been disturbed by the formation of one or more of the multiple lower wall rib segment welds 362. In view of the present disclosure, those skilled in the art will understand that the use of the upper wall 304 as a go / no-go gauge can further limit the variation in the predetermined position relative to each lower wall rib segment 352 within the ceramic weld 324, which is due to the aforementioned lateral stiffness of the upper wall 304, and also improves the yield of the manufacturing process used to manufacture the ceramic weld 324.
[0078] As indicated by arrow J, a drilling operation may be used to define a channel 320 in the lower wall 306 at a location between two (2) longitudinally adjacent upper wall rib segments of the plurality of upper wall rib segments 350 (eg, Figure 4 The channel 320 may be defined in the upper wall unwelded ribbed region 340 (eg Figure 3 Once the channel 320 is defined, the tube body 322 can be aligned to the channel 320 and the tube body and lower wall plate weld 301 (as shown) formed between the tube body 322 and the lower wall plate 358. Figure 4 ), also as shown by arrow K. In view of the present disclosure, those skilled in the art will appreciate that the subtractive manufacturing process used to form the lower wall 306 can simplify the formation of the channel 320 and the formation of the pipe body and the lower wall plate weld 301 due to the rigidity of the upper wall 304 provided by the integral single-piece structure of the upper wall 304 and the dimensional stability brought about by the absence of welding between the plurality of upper wall rib segments 350 and the upper wall plate portion 334 of the lower wall 306 ( Figure 5 Any one (or both) of the above.
[0079] As indicated by arrows L and M, the coupling of the plurality of first side rib segments 330 and the plurality of second side rib segments 332 may be achieved by registering each of the plurality of first side rib segments 330 to the ceramic weld 324 at a location that each spans a corresponding one of the plurality of upper wall rib segments 350 and a corresponding one of the plurality of lower wall rib segments 352 of the upper wall 304. Once registered, a corresponding one of the plurality of first side rib segment and ceramic weld welds 388 may be formed between one of the plurality of first side rib segments 330 and the ceramic weld 324, and the aforementioned registration and welding operations are repeated to sequentially couple each of the plurality of first side rib segments 330 to the ceramic weld 324. The coupling of the plurality of second side rib segments 332 may similarly be achieved by registering each of the plurality of second side rib segments 332 at a location that each spans a corresponding one of the plurality of upper wall rib segments 350 and a corresponding one of the plurality of lower wall rib segments 352, and thereafter forming a corresponding one of the plurality of second side rib segment and ceramic weld welds 398 therebetween. Notably, the above-described templating and associated improvements in processing capabilities relative to the positioning of the plurality of upper wall rib segments 350 attributable to the subtractive manufacturing process used to form the upper wall 304 may also simplify the manufacture of the ceramic weld 324, increase production yields and / or reduce the necessary skill level of a manufacturer assembling the ceramic weld 324.
[0080] Reference Figure 8 , showing the manufacture of a ceramic weldment such as ceramic weldment 324 ( Figure 2 4. The method 400 generally includes forming an upper wall having an upper wall plate portion and an upper wall rib portion extending therefrom using a subtractive manufacturing technique, such as having an upper wall plate portion 334 (such as Figure 4 as shown) and the upper wall rib portion 336 (as shown Figure 4 The upper wall 304 (as shown) Figure 2 As shown in block 402. It is contemplated that the upper wall is formed using a subtractive manufacturing technique that defines an upper wall unwelded ribbed region along the upper wall, such as upper wall unwelded ribbed region 340 (as shown in block 403). Figure 4), as shown in box 404. Advantageously, forming the upper wall using subtractive manufacturing techniques can improve the time required to manufacture the ceramic weldment by avoiding the need to connect the upper wall rib segments to the ceramic weldment. More advantageously, forming the upper wall using subtractive manufacturing techniques can also limit the necessary skill level of personnel used to manufacture the ceramic weldment, for example by replacing (at least in part) the experience of individuals skilled in welding ceramic materials with the repeatability and precision of a computer numerical control process. Unexpectedly, the applicant has also discovered that the material layer deposited within the ceramic weldment having unwelded ribbed areas can also exhibit smaller variations within the material layer, which is believed to be due to the absence of welding artifacts and deformations within the ceramic chamber having welded ribbed areas that connect the heater element and / or optical temperature sensor to the interior of the ceramic weldment. Non-limiting examples of suitable subtractive manufacturing techniques that can be used to form the ceramic weldment include milling, grinding, lapping, and cutting.
[0081] The method 400 may include coupling the sidewall to an upper wall portion of the ceramic weldment, such as the first sidewall 308 (eg, Figure 2 as shown) and the second side wall 310 (as shown Figure 2 As shown in block 406. The first side wall can be welded to the upper wall plate portion by forming the first side wall using a welding technique, for example, the first side wall is welded to the upper wall plate portion 380 (as shown in block 406). Figure 5 406. The second side wall can be welded to the upper wall plate portion by forming the second side wall using welding technology, such as the second side wall and the upper wall plate portion welded 392 (as shown in FIG. Figure 6 As shown in FIG. 406 , the first side wall and the lower wall portion are welded and / or the second side wall and the lower wall portion are welded. The welding technique may be performed using hydrogen (H 2 ) gas welding, as further shown in FIG. 406 .
[0082] In some examples, method 400 may include coupling the injection end flange and the discharge end flange to a ceramic weldment, such as injection end flange 326 ( Figure 3 ) and the discharge end flange 328 ( Figure 3 ), as shown in box 408 and box 410. In this regard, the injection end flange is welded to the upper wall plate portion by using a welding technique, such as the injection end flange and the upper wall plate portion weld 354 (as shown in box 408 and box 410). Figure 3 The injection end flange can be connected to the upper wall plate portion, as shown in block 408. The injection end flange and the first side wall weld and the injection end flange and the second side wall weld are formed by using welding technology, such as the injection end flange and the first side wall weld 384 ( Figure 5 ) and the injection end flange is welded to the second side wall 394 ( Figure 6 ), the injection end flange may be further coupled to the first side wall and the second side wall, as further shown in block 408 .
[0083] The discharge end flange can be connected to the lower wall panel portion by forming a discharge end flange and lower wall weld using welding techniques, such as discharge end flange and lower wall weld 378 (such as Figure 3 As shown in block 410, the discharge end flange is welded to the first side wall and the discharge end flange is welded to the second side wall by using welding technology, for example, the discharge end flange is welded to the first side wall 386 ( Figure 5 ) and the discharge end flange is welded to the second side wall 396 ( Figure 6 ), the discharge end flange may be further coupled to the first sidewall and the second sidewall, as further shown in block 410. It is contemplated that one or more welds coupling the injection end flange and the discharge end flange to the ceramic weldment may be formed using hydrogen (H2) gas welding techniques.
[0084] The method 400 may also include coupling a lower wall plate to a ceramic weldment, such as the lower wall plate 358 (eg, Figure 3 412). In this regard, it is contemplated that, for either or both of the first side wall and the second side wall, the lower wall plate is coupled to the side wall of the ceramic weldment, also as shown in block 412. Coupling the lower wall plate to the ceramic weldment may include forming a first side wall to lower wall plate weld and a second side wall to lower wall plate weld using a welding technique, such as the first side wall to lower wall plate weld 382 (as shown in FIG. Figure 3 As shown) and the second side wall is welded to the lower wall plate 39 (as shown Figure 4 ), as further shown in block 412. Connecting the lower wall plate to the ceramic weldment may also include using welding techniques to form an injection end flange to the lower wall plate weld and a discharge end flange to the lower wall plate weld, such as a discharge end flange to the lower wall plate weld 378 (as shown in FIG. Figure 4 As shown) and the discharge end flange is welded to the lower wall plate 378 (as shown Figure 4 ), as further shown in block 412. One or both of the first side wall to lower wall plate weld and the second side wall to lower wall plate weld may be formed using hydrogen (H2) gas welding techniques.
[0085] It is also contemplated that the method 400 may include coupling a plurality of lower wall rib segments to the ceramic weldment, such as the plurality of lower wall rib segments 352 (eg, Figure 3 ), as shown in block 414. The plurality of lower wall rib segments may be welded to the lower wall plate by using a plurality of lower wall rib segments formed by welding techniques, such as a plurality of lower wall rib segment welds 362 (as shown in block 414). Figure 3 ), as also shown in block 414. It is contemplated that method 400 includes defining a channel, such as channel 320 (as shown in FIG. Figure 2416. Once the channel is formed, the tube body can be aligned to the channel (e.g., such that the tube body extends around it) and then coupled to the lower wall at the channel, also as shown in block 414. It is also contemplated that the tube body can be welded to the lower wall plate, such as the tube body welded to the lower wall plate 301 (e.g., Figure 5 ), the pipe body is connected to the lower wall plate portion, as shown in box 418. Hydrogen (H2) gas welding technology can be used to form the pipe body and the lower wall plate portion welded, as also shown in box 418.
[0086] In some examples, the method 400 may also include coupling a plurality of first side rib segments to the ceramic weldment, such as the plurality of first side rib segments 330 (eg, Figure 3 ), as shown in block 420. In this regard, the plurality of first side rib segments can be coupled to the weldment by welding the plurality of first side rib segments to the ceramic weldment, for example, using the plurality of first side rib segments to the ceramic weldment welding 388 (as shown in block 420). Figure 3 ), as also shown in block 420. According to some examples, the method 400 may further include coupling a plurality of second side rib segments to the ceramic weldment, the plurality of second side rib segments 332 (such as Figure 3 ), as shown in block 422. In such an example, the plurality of second side rib segments can be connected to the weldment by welding the plurality of second side rib segments formed using a welding technique to the ceramic weldment, for example, welding the plurality of second side rib segments to the ceramic weldment 398 (as shown in block 422). Figure 3 As shown in box 420 and box 422, as shown in the above, one or more of the welding of the plurality of first side rib segments to the ceramic welding parts and the welding of the plurality of second side rib segments to the ceramic welding parts can be formed using hydrogen (H2) gas welding technology, as shown in box 420 and box 422.
[0087] Ceramic weldments for chamber bodies may be formed by joining discrete parts to ceramic weldments. While generally satisfactory for its intended purpose, welding may be time consuming and may require specialized skills and experience, such as in ceramic weldments where external ribs are used to provide structural support and where the ceramic weldments are evacuated due to use. Welding may also require post-weld annealing to remove residual stresses in the ceramic weldment associated with the welding process, adding time and cost to the manufacturing process. Welding may further introduce dimensional changes and / or changes in the optical properties of the ceramic, potentially limiting the yield of the manufacturing process used to manufacture the ceramic weldment, and / or in the case of ceramic weldments used to deposit a layer of material onto a substrate, resulting in changes in the layer of material due to the effects of the optical changes on the performance of an external device optically coupled through the wall of the ceramic weldment.
[0088] In an example of the present disclosure, the upper wall of the ceramic weld is formed using subtractive manufacturing techniques. Using subtractive manufacturing techniques to form the upper wall of the ceramic weld can limit the time required to manufacture the ceramic weld, for example by limiting the time required to weld discrete parts upper rib segments to the ceramic weld. Using subtractive manufacturing techniques to form the upper wall will limit the necessary skill level required to manufacture the ceramic weld, limiting (or eliminating) the tendency for the skill level of manufacturers used to manufacture ceramic welds to limit the ability to manufacture ceramic welds. And, in an example in which the ceramic weld is used to deposit material onto a substrate using an external device optically connected through the wall of the ceramic weld, using subtractive manufacturing techniques to form the upper wall of the ceramic weld can limit variations in the deposited material layer by limiting (or eliminating) variations in the size and / or optical properties potentially imparted to the ceramic weld by the welding process that would otherwise be used to attach the rib segments to the ceramic weld.
[0089] The term "approximately" is intended to include the degree of error associated with the measurement of a particular quantity based on the equipment available at the time the application is filed. To the extent shown and described herein in a particular order in the inclusion method, the operations may be altered from the order shown and described herein and remain within the scope of the present disclosure. Furthermore, the method including the operations shown and described herein may include additional operations and / or exclude certain operations shown and described herein and still be within the scope of the present disclosure.
[0090] The terms used herein are intended only to describe specific embodiments and are not intended to limit the present invention. As used herein, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will also be understood that the terms "include" and / or "comprises" when used in this specification specify the presence of stated features, integers, steps, operations, elements, and / or parts, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts, and / or combinations thereof.
[0091] Although the present disclosure has been described with reference to one or more exemplary embodiments, it will be appreciated by those skilled in the art that various changes may be made and elements thereof may be replaced with equivalents without departing from the scope of the present disclosure. In addition, many modifications may be made to adapt specific situations or materials to the teachings of the present disclosure without departing from the substantive scope of the present disclosure. Therefore, it is intended that the present disclosure is not limited to the specific embodiments disclosed as the best mode for implementing the present disclosure, but that the present disclosure will include all embodiments falling within the scope of the claims.
Claims
1. A chamber body, comprising: Ceramic welding parts, including: upper wall; A side wall connected to the upper wall by welding the side wall to the upper wall; A lower wall plate connected to the side wall by welding the side wall and the lower wall, the lower wall plate defining a channel; A lower wall rib segment connected to the lower wall plate by welding the lower wall rib segment; and The upper wall has an upper wall plate portion and an upper wall rib portion, which define an upper wall non-welded rib-shaped area covering the channel and are formed from a single ceramic workpiece using a subtractive manufacturing technique.
2. The chamber body according to claim 1, wherein: The un-welded rib-shaped area of the upper wall is separated from the channel by the interior of the ceramic welded part.
3. The chamber body according to claim 1, wherein The un-welded rib-shaped area of the upper wall is separated from the channel by the interior of the ceramic welded part.
4. The chamber body according to claim 1, wherein The ceramic welding part also includes: an injection end flange coupled to the upper wall panel portion; and The discharge end flange is coupled to the upper wall plate portion and is separated from the injection end flange by an upper wall non-welded rib region of the upper wall.
5. The chamber body according to claim 4, further comprising a pipe mounting body coupled to the lower wall plate at the passage and separating an injection end flange and a discharge end flange of the ceramic weldment.
6. The chamber body according to claim 4, wherein: The injection end flange and the discharge end flange separate the un-welded rib-shaped area of the upper wall of the ceramic welded part from the rib section of the lower wall of the ceramic welded part.
7. The chamber body according to claim 1, wherein The lower wall rib segment is one of a plurality of lower wall rib segments, and the ceramic welded part further comprises: a plurality of first side rib segments, each disposed between the upper wall unwelded ribbed region and the plurality of lower wall rib segments; a plurality of second side rib segments, each disposed between the upper wall unwelded ribbed region and the plurality of lower wall rib segments; and The un-welded rib-shaped area of the upper wall separates the plurality of first side rib segments from the plurality of second side rib segments.
8. The chamber body according to claim 7, wherein The lower wall rib segment is one of a plurality of lower wall rib segments, and the ceramic weldment further comprises a plurality of lower rib segment welds, which couple the plurality of lower wall rib segments to the lower wall plate and are separated from the upper wall un-welded rib region by the lower wall plate.
9. The chamber body according to claim 7, wherein: The ceramic welding part also includes: An injection end flange is connected to the upper wall plate portion of the upper wall by welding the injection end flange and the upper wall plate portion; a discharge end flange coupled to the upper wall plate portion of the upper wall by welding the discharge end flange to the upper wall plate portion; and The un-welded ribbed area of the upper wall separates the welding of the injection end flange and the upper wall plate portion from the welding of the discharge end flange and the upper wall plate portion, without any intervening welding in between.
10. The chamber body according to claim 1, wherein The side wall is a first side wall, and the welding of the side wall and the upper wall is the welding of the first side wall and the upper wall plate, and the ceramic welding part further includes: a second side wall that is laterally opposite to the first side wall and separates the lower wall plate of the ceramic welded component from the upper wall of the ceramic welded component; and A second side wall to upper wall panel portion is welded to couple the second side wall to the upper wall panel portion, wherein an upper wall unwelded ribbed region separates the first side wall to upper wall weld from the second side wall to upper wall weld without any intervening welds therebetween.
11. The chamber body according to claim 1, wherein The un-welded ribbed region of the upper wall has a width greater than at least 300 mm, wherein the ceramic weldment consists essentially of quartz.
12. The chamber body according to claim 1, wherein The un-welded rib-shaped area of the upper wall covers the lower wall rib section welding of the ceramic welding part.
13. A chamber device comprising: The chamber body of claim 1, wherein the un-welded ribbed area of the upper wall has a width greater than at least 300 mm; a divider positioned within the interior of the chamber body and having a divider aperture; a substrate support disposed within the divider aperture and supported for rotation about an axis of rotation therein; and The un-welded rib-shaped area of the upper wall covers the substrate support and the separator of the chamber arrangement.
14. The chamber arrangement of claim 13, further comprising a substrate pyrometer supported above an upper wall of the ceramic weldment and along a substrate pyrometer optical axis intersecting the substrate support, wherein The upper wall un-welded ribbed region optically couples the substrate pyrometer to the interior of the ceramic weldment.
15. The chamber apparatus of claim 13 further comprising a chamber pyrometer supported above an upper wall of the ceramic weldment and along a chamber pyrometer optical axis that intersects the substrate support or divider, wherein The upper wall un-welded ribbed region is optically coupled to the chamber pyrometer.
16. The chamber arrangement of claim 13, further comprising a plurality of upper heater elements supported above an upper wall of the ceramic weldment, wherein: The upper wall un-welded ribbed region optically couples the upper heater element to a substrate support or separator of the chamber arrangement.
17. A semiconductor processing system comprising: A chamber device comprising a chamber body as claimed in claim 1, wherein the unwelded ribbed area of the upper wall of the ceramic weldment has a width greater than at least 300 mm; a precursor source including a silicon-containing material layer precursor coupled to an injection end of the chamber body; and An exhaust source including a vacuum pump is coupled to an exhaust end of the chamber body and coupled through the chamber body to a precursor source.
18. A method for manufacturing a ceramic welded part, comprising: forming an upper wall having an upper wall plate portion and an upper wall rib portion extending from the upper wall plate portion from a single ceramic workpiece using a subtractive manufacturing technique; Connecting the side wall to the upper wall by welding the side wall to the upper wall; coupling a lower wall panel defining a channel to the side wall using side wall and lower wall welding so that an unwelded ribbed area of the upper wall covers the channel; as well as The lower wall rib segment is coupled to the lower wall plate using lower wall rib segment welding.
19. The method according to claim 18, further comprising: Connecting the injection end flange to the upper wall plate portion of the upper wall by welding the injection end flange to the upper wall plate portion; Connecting the discharge end flange to the upper wall plate portion of the upper wall by welding the discharge end flange to the upper wall plate portion; Using the plurality of first side rib segments to weld with the ceramic welding member, the plurality of first side rib segments are connected to the ceramic welding member; as well as The plurality of second side rib segments are coupled to the ceramic welding member using welding of the plurality of second side rib segments to the ceramic welding member.
20. The method of claim 18, further comprising: aligning a tube mounting body to a passage defined in the lower wall panel; as well as The pipe-mounting body is connected to the lower wall plate by welding the pipe-mounting body and the lower wall plate at the channel.
21. The method according to claim 18, wherein: The subtractive manufacturing techniques include one or more of milling, core drilling and sawing.
22. A chamber apparatus for a semiconductor processing system having a chamber body manufactured using the method of claim 18.