Laminating device and process of electrostatic chuck

Abstract

The invention provides a novel electrostatic chuck attaching device and method. The novel electrostatic chuck attaching device comprises a vacuum operation cavity, an upper pressing panel, a lower pressing panel, an upper telescopic device, a lower telescopic device and a vacuum glue injection device. An electrostatic chuck to be attached is placed in the vacuum operation cavity, an equal-height fixing block is placed between a metal base and a dielectric layer of the electrostatic chuck, the height of the equal-height fixing block needs to be equal to the thickness of a bonding layer, and a pouring opening is reserved in the outer edge of the bonding layer. And the filling port is externally connected with a vacuum glue injection device for filling an adhesive into the adhesive layer in the vacuum operation cavity through the filling port. The electrostatic chuck manufactured by the laminating device and method has the characteristics of high bonding strength, no bubble and the like, and the special-shaped cavity structures contained in the bonding layers can be filled with the adhesive; the heat conductivity coefficients of the edge and the interior are consistent, the temperature uniformity of the electrostatic chuck is not influenced, and the defect of large-area bonding is well controlled.

Description

Technical Field

[0001] The invention relates to the field of electrostatic chucks, and in particular to a new electrostatic chuck laminating process and device. Background Art

[0002] The electrostatic chuck is a carrier for wafer precision processing equipment. It is a key semiconductor component that uses electrostatic adsorption to clamp the wafer flat and evenly. It is mainly used in etching, CVD, PVD, IMP and other process flows. According to Moore's Law, the continuous updating of semiconductor technology has increased the integration of devices on the surface of the wafer, and the size of the devices is small and precise, so the electrostatic chuck supporting the wafer is required to have higher and higher processing accuracy and better uniformity, and the variable temperature electrostatic chuck has come into being. The variable temperature electrostatic chuck generally has a built-in heater, and can be heated and temperature controlled in different zones. The electrostatic chuck can be divided into up to 196 temperature zones for temperature control. The variable temperature electrostatic chuck is integrated by bonding between various components such as a metal base, a heater, and a ceramic component. In addition, the high-end electrostatic chucks on the market currently need to have a thicker intermediate glue layer to provide enough space to operate the welding leads. A large number of studies have found that the presence of micrometer- and millimeter-sized bubbles in the bonding layer will lead to reduced heat transfer, reduced bonding strength, and increased dielectric loss, which is not conducive to the application of electrostatic chucks in high-temperature environments, plasma, and high-energy ion implantation.

[0003] The semi-cured colloid bonding process is used to integrate the electrostatic suction cup. The material of the colloid itself is silicone resin and inorganic filler, and the viscosity is about 30000-50000CP. However, the colloid of this bonding process is in a semi-cured state, and the adhesion between the colloid and the insulating layer is poor. There are disadvantages such as poor adhesion between the colloid and the insulating layer, low hardness after curing of the colloid, and easy wrinkling of the colloid during the bonding process, resulting in bonding failure. In addition, the electrostatic suction cup is integrated by the glue brushing and gluing bonding process. The colloid is evenly distributed on the base by printing or coating process, and then the insulating layer is bonded, and finally placed in a vacuum press to complete the bonding. The material of the colloid itself is silicone resin and inorganic filler, and the viscosity is about 6000-30000CP. This bonding process can only achieve bonding of thinner adhesive layers. If the adhesive layer is too thick, it is difficult to control the thickness uniformity of the entire adhesive layer, and it is difficult to ensure zero defects during the bonding process. It will have the disadvantages of being unable to perform bonding processes for thicker adhesive layers, high requirements for colloid viscosity, more complicated operations, high operating requirements for operators, and defects in the adhesive layer during the bonding process.

[0004] Based on this, it is necessary to provide a new electrostatic chuck bonding process that can solve the above problems, especially to provide a new electrostatic chuck bonding process for the thick glue layer required for high-end electrostatic chucks. Summary of the invention

[0005] The purpose of the present invention is to provide a novel electrostatic chuck bonding method and device, especially an integration method for electrostatic chucks with special-shaped structures on the bonding surface of certain dielectric layers.

[0006] In order to achieve the above object, the present invention adopts the following technical solutions:

[0007] A first aspect of the present invention provides an electrostatic chuck laminating device, characterized in that it comprises:

[0008] Vacuum operating chamber, gas system, upper pressing panel, lower pressing panel, upper telescopic device, lower telescopic device, vacuum glue injection device;

[0009] The top of the upper telescopic device is connected to the inner top surface of the vacuum operation chamber, and the bottom of the upper telescopic device is connected to the top of the upper pressing panel; the bottom of the lower telescopic device is connected to the inner bottom surface of the vacuum operation chamber, and the top of the lower telescopic device is connected to the bottom of the lower pressing panel; an electrostatic suction cup is fixed between the upper pressing panel and the lower pressing panel, the bottom of the upper pressing panel is fixedly connected to the top of the dielectric layer of the electrostatic suction cup, and the top of the lower pressing panel is fixedly connected to the bottom of the metal base of the electrostatic suction cup,

[0010] The pipeline of the vacuum glue injection device passes through the vacuum operation chamber, one end of the pipeline is located outside the vacuum operation chamber, and the other end is located on the side of the metal base and the dielectric layer; the interior of the vacuum glue injection device is sealed and connected to the vacuum operation chamber;

[0011] The gas system is in communication with the vacuum operation chamber.

[0012] Furthermore,

[0013] The gas system includes a first vacuum mechanical pump, a second vacuum molecular pump, an inflation pipeline, an exhaust pipeline and a vacuum pipeline; one end of the vacuum pipeline is connected to the vacuum operation chamber; one end of the inflation pipeline is connected to the vacuum operation chamber, and the other end is connected to the vacuum pipeline; the exhaust pipeline is connected between the inflation pipeline and the vacuum pipeline, and the first vacuum mechanical pump and the second vacuum molecular pump are arranged between the vacuum pipeline and the exhaust pipeline; an inflation valve is arranged at one end of the inflation pipeline close to the vacuum operation chamber, a vacuum valve is arranged at one end of the vacuum pipeline close to the vacuum operation chamber, and an exhaust valve is arranged on the exhaust pipeline.

[0014] Furthermore,

[0015] A visual observation port is provided on the upper surface of the vacuum operation chamber;

[0016] And / or, the vacuum operation chamber is provided with a pressure gauge and a vacuum gauge.

[0017] Furthermore,

[0018] There are uniformly distributed fixed blocks of equal height between the metal base and the dielectric layer; further,

[0019] The vacuum glue injection devices are two or four evenly distributed;

[0020] Furthermore,

[0021] The upper and lower laminated panels maintain a flatness of less than 20 μm.

[0022] And / or, the upper and lower pressed panels maintain a parallelism of less than 0.5°.

[0023] And / or, the upper and lower pressing plates can be raised and lowered, and the raising and lowering distance is controllable.

[0024] Furthermore, the equal height fixed blocks can have a fixed deformation under a certain pressure;

[0025] Furthermore, the number of the equal-height fixing blocks is 4, and the equal-height fixing blocks are evenly distributed on the outer edge of the space between the metal base and the dielectric layer;

[0026] A second aspect of the present invention provides a method for manufacturing an electrostatic chuck using the electrostatic chuck laminating device, characterized in that it comprises the following steps:

[0027] Shielding protection:

[0028] The non-bonding areas of the components of the electrostatic chuck to be bonded are covered with a mask to reserve bonding positions;

[0029] The step of placing equal height fixing blocks: placing the vacuum chuck to be bonded in an atmospheric environment, fixing the metal base of the electrostatic chuck on the lower pressing panel, and fixing the dielectric layer of the electrostatic chuck on the upper pressing panel, placing equal height fixing blocks between the metal base and the dielectric layer of the electrostatic chuck, and sealing the space between the metal base and the dielectric layer, with a filling port reserved on the side of the closed space;

[0030] Glue injection steps: put the adhesive into the pipeline of the vacuum glue injection device, and there must be no bubbles in the adhesive; then, evacuate the inside of the cavity, connect the entire inside of the syringe with the vacuum operation cavity and maintain the vacuum, after the vacuum is completed, use the vacuum glue injection device to inject the adhesive into the adhesive layer, and the adhesive is poured into the adhesive layer through the injection port;

[0031] Pressing step: After the glue injection is completed, the vacuum operating chamber is exhausted into the atmosphere through the gas system, and then high-pressure gas is introduced through the gas system to compress the upper and lower pressing panels. The upper and lower pressing panels compress the components of the electrostatic chuck to make them fit tightly together;

[0032] Curing step: turning on the heating function of the upper and lower pressed panels to allow the adhesive to cure;

[0033] Cooling and removal steps: After the adhesive is cured, the vacuum operation chamber is exhausted into the atmosphere, the laminating device is opened, and the electrostatic suction cup is removed.

[0034] Furthermore,

[0035] In the glue injection step, when adhesive overflow is observed in the corresponding hole in the visual observation window, it is determined that the adhesive layer has been completely filled with adhesive.

[0036] Preferably, the silicon-based adhesive is silica gel;

[0037] Preferably, the vacuum operation chamber is evacuated to a pressure lower than 10Pa.

[0038] and / or,

[0039] In the pressing step, gas having a pressure higher than the standard atmospheric pressure is filled into the vacuum operation chamber through the filling valve of the gas system.

[0040] and / or,

[0041] The curing step comprises: heating the adhesive to 80-150° C. for curing, wherein the adhesive has a viscosity of 10,000-20,000 CP;

[0042] Preferably, the binder is cured at 100-150°C.

[0043] Furthermore,

[0044] In the step of placing equal height fixed blocks,

[0045] The equal-height fixing blocks are evenly distributed on the adhesive layer; preferably, the equal-height fixing blocks are evenly distributed on the outer edge of the adhesive layer, and more preferably, the number of the equal-height fixing blocks is 4, which are placed on the outer edge of the adhesive layer at 3 o'clock, 6 o'clock, 9 o'clock and 12 o'clock directions;

[0046] Furthermore, the material of the equal height fixing blocks is preferably an elastomer, a flexible metal material, etc.;

[0047] Furthermore, the thickness of the adhesive layer is between 1.00 mm and 2.00 mm.

[0048] Beneficial effects:

[0049] Compared with the prior art, the integrated device and manufacturing method of the electrostatic chuck of the present invention have the following beneficial effects:

[0050] 1. The bonding device and method of the present invention can achieve a bonding layer thickness greater than 1 mm, high bonding strength, and high hardness after the colloid is cured, and can be used to manufacture high-end electrostatic chucks with a thick glue layer; while the brushing glue coating process in the prior art cannot obtain a thick glue layer; therefore, the bonding device and method of the present invention can be applied to the process of manufacturing high-end electrostatic chucks with a thick glue layer, and the operation is simple.

[0051] 2. The bonding device and method of the present invention can achieve uniform and bubble-free bonding for the bonding layer with heterogeneous structure. The heterogeneous cavity structure contained in the bonding layer can be filled with adhesive, and the thermal conductivity of the edge and the interior is consistent, which will not affect the temperature uniformity of the electrostatic suction cup. Compared with the prior art of brushing glue and coating bonding process, it can achieve fewer large-area bonding defects, good heat transfer, high bonding strength, and small dielectric loss, which is beneficial to the application of electrostatic chucks in high temperature environments, plasma, and high-energy ion injection. BRIEF DESCRIPTION OF THE DRAWINGS

[0052] Figure 1 It is a schematic diagram of the structure of a variable temperature electrostatic chuck;

[0053] Figure 2 The picture of the irregular cavity on the dielectric layer ceramic plate corresponding to the upper surface of the bonding layer;

[0054] Figure 3 This is a schematic diagram of the distribution of equal-height blocks;

[0055] Figure 4 It is a schematic diagram of the structure of the electrostatic chuck integrated device;

[0056] Figure 5 It is a schematic diagram of the structure of the gas system in the electrostatic chuck integrated device;

[0057] Figure 6 A flow chart of a method for manufacturing an electrostatic chuck;

[0058] Figure 7 Ultrasonic flaw detection pictures of the embodiment;

[0059] Among them, 110-dielectric layer, 120-adhesive layer, 130-metal base, 410-vacuum operation chamber, 480-gas system, 430-upper pressing panel, 435-lower pressing panel, 420-upper telescopic device, 425-lower telescopic device, 440-dielectric layer, 450-first vacuum glue injection device, 455-second vacuum glue injection device, 460-equal height fixing block, 470-metal base, 480-gas system, 510-first vacuum mechanical pump, 520-second vacuum molecular pump, 530-inflating pipeline, 540-exhaust pipeline, 550-vacuum pipeline, 560-inflating valve, 570-exhaust valve, 580-vacuum valve, 590-gas tank DETAILED DESCRIPTION

[0060] In order to make the purpose, technical solution and advantages of the embodiment of the present invention clearer, the technical solution of the embodiment of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiment of the present invention. Obviously, the described embodiment is a part of the embodiment of the present invention, not all of the embodiments. Based on the described embodiment of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0061] Unless otherwise defined, the technical terms or scientific terms used in the present invention should be understood by people with ordinary skills in the field to which the present disclosure belongs. The words "first", "second" and similar words used in the present invention do not indicate any order, quantity or importance, but are only used to distinguish different components. The words "include" or "comprise" and similar words mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

[0062] The following is a further detailed description of some embodiments disclosed in the present invention. In the specification disclosed in the present invention, the plane where the bonding layer is located is taken as the horizontal plane, perpendicular to the plane of the bonding layer, the direction of movement from the bonding layer to one side of the dielectric layer is called the "up" direction, and the direction of movement from the bonding layer to the metal base is called the "down" direction. Thus, the various positional relationships modified by "up" and "down", or "top" and "bottom" have clear meanings. The direction from the edge of the bonding layer to the center is called the "inward" direction, and the direction from the center of the bonding layer to the edge is called the "outward" direction. Therefore, the relative positional relationships modified by "inside" and "outside" also have clear meanings. In addition, it should be noted that the above terms indicating orientation are merely exemplary and represent the phase position relationship of each component. The combination of parts or the entire device or equipment in the various devices or equipment disclosed in the present invention can be rotated as a whole by a certain angle.

[0063] In the present invention, the electrostatic chuck is a variable temperature electrostatic chuck with a built-in heater, such as Figure 1 As shown, it includes a dielectric layer 110, an adhesive layer 120 and a metal base 130. The dielectric layer includes a heating electrode and an adsorption electrode, and the adhesive layer is provided with uniformly distributed equal-height fixed blocks, which cannot affect the bonding effect and temperature uniformity. The equal-height fixed blocks can have a fixed deformation under a certain pressure, so as to achieve a uniform thickness of the adhesive layer. The number of equal-height fixed blocks should not be too many to control the thickness and uniformity of the adhesive layer. In principle, it can be composed of any material. Considering the simple and applicable materials, elastomers, flexible metal materials, etc. are preferred.

[0064] In some examples, there is a special-shaped cavity on the dielectric layer corresponding to the upper surface of the adhesive layer, such as Figure 2 shown.

[0065] In some examples, the number of equal-height fixing blocks is 4, evenly distributed on the outer edge of the adhesive layer. Figure 3 As shown, the equal-height blocks are evenly distributed on the outer edge of the bonding layer and are placed at the 3 o'clock direction, the 6 o'clock direction, the 9 o'clock direction and the 12 o'clock direction.

[0066] The adhesive layer also includes an adhesive, which will affect heat transfer, so the thermal conductivity of an ideal adhesive is close to that of metal. The thermal conductivity of the adhesive is closely related to the material, the preparation process of the adhesive layer, etc. The main component of the adhesive is organic matter, and the heat transfer mechanism limits it from having the thermal conductivity of metals such as metal Al and Cu. Adding inorganic non-metallic thermal conductive particles can help enhance its thermal conductivity. In the present invention, the adhesive needs to be cured at 80-150°C, preferably at 100-150°C; the viscosity of the adhesive is 10000-20000CP; in the present invention, the thickness of the adhesive layer is the same as the height of the isoheight block and the thickness of the adhesive, and the thickness is between 1.00mm-2.00mm.

[0067] In one embodiment of the present invention, the electrostatic suction cup bonding device includes a vacuum operation chamber 410, a gas system 480, an upper pressing panel 430, a lower pressing panel 435, an upper telescopic device 420, a lower telescopic device 425, a first vacuum glue injection device 450, and a second vacuum glue injection device 455; the top of the upper telescopic device 420 is connected to the inner top surface of the vacuum operation chamber 410, and the bottom is connected to the top of the upper pressing panel 430; the bottom of the lower telescopic device 425 is connected to the inner bottom surface of the vacuum operation chamber 410, and the top is connected to the bottom of the lower pressing panel 435; the bottom of the upper pressing panel 420 is connected to the electrostatic suction cup bonding device. The top of the disk dielectric layer 440 is fixedly connected, the top of the lower pressing panel 435 is fixedly connected to the bottom of the electrostatic chuck metal base 470, and the metal base 470 and the dielectric layer 440 are fixed by an equal height fixing block 460; one end of the first vacuum glue injection device 450 is located outside the vacuum operation chamber 410, and the other end is located inside the vacuum operation chamber 410, and is located on the side of the metal base 470 and the dielectric layer 440; one end of the second vacuum glue injection device 455 is located outside the vacuum operation chamber 410, and the other end is located inside the vacuum operation chamber 410, and is located on the side of the metal base 470 and the dielectric layer 440. The first vacuum glue injection device 450 and the second vacuum glue injection device 455 are arranged opposite to each other. The interior of the vacuum glue injection device is sealed and connected to the vacuum operation chamber 410; the gas system 480 is connected to the interior of the vacuum operation chamber 410, and the vacuum operation chamber 410 is provided with a barometer and a vacuum gauge.

[0068] The metal base 470 of the electrostatic suction cup is bonded to the dielectric layer 440 via an adhesive layer, the adhesive layer includes an equal height fixing block 460 and an adhesive, the thickness of the adhesive layer is equal to the height of the equal height fixing block 460, and is also equal to the thickness of the adhesive in the adhesive layer. The outer edge of the adhesive layer has a closed structure, and a perfusion port is reserved on the closed structure. The perfusion port is connected to a vacuum glue injection device, and the space between the vacuum glue injection device and the perfusion port is also closed. The upper and lower pressed panels can be raised and lowered, and the lifting distance is controllable.

[0069] In some examples, the upper lamination panel 430 and the lower lamination panel 435 maintain a parallelism of less than 0.5° and a flatness of less than 20 μm.

[0070] In some examples, the straight line where the first vacuum glue injection device 450 and the second vacuum glue injection device 455 are located passes through the center of the adhesive layer, such as Figure 4 In some other examples, a third vacuum glue injection device and a fourth vacuum glue injection device may also be included, and the straight line where the third vacuum glue injection device and the fourth vacuum glue injection device are located also passes through the center of the adhesive layer, and the four vacuum glue injection devices are evenly distributed in the circumferential direction of the adhesive layer. Injecting glue in this way can ensure the uniformity of injection, so that the adhesive fills the entire cavity evenly and avoids bubbles. In particular, for the adhesive layer with heterogeneous cavities, the injection effect is better.

[0071] In some examples, a visual observation port is provided on the upper surface of the vacuum operation chamber 410 for observing and determining whether the adhesive in the adhesive layer has been completely filled during the glue injection process.

[0072] In some examples, the gas system 480 includes a first vacuum mechanical pump 510, a second vacuum molecular pump 520, an inflation pipeline 530, an exhaust pipeline 540 and a vacuum pipeline 550; one end of the vacuum pipeline 550 is connected to the vacuum operating chamber 410; one end of the inflation pipeline 530 is connected to the vacuum operating chamber 410, and the other end is connected to the vacuum pipeline 550; the exhaust pipeline 540 is connected between the inflation pipeline 530 and the vacuum pipeline 550, and the first vacuum mechanical pump 510 and the second vacuum molecular pump 520 are arranged between the vacuum pipeline 550 and the exhaust pipeline 540; an inflation valve 560 is arranged at one end of the inflation pipeline 530 close to the vacuum operating chamber 410, a vacuum valve 580 is arranged at one end of the vacuum pipeline 550 close to the vacuum operating chamber 410, and an exhaust valve 570 is arranged on the exhaust pipeline 540.

[0073] In one embodiment, in combination Figure 6 , the manufacturing method of the electrostatic chuck, the process is as follows:

[0074] Masking and protection steps: First, the non-bonding areas of the components of the electrostatic chuck to be bonded are masked with masks to reserve bonding positions.

[0075] Step of placing equal height fixing blocks: placing the vacuum chuck to be bonded in the atmospheric environment, fixing the metal base 470 of the electrostatic chuck on the lower pressing panel 435, and fixing the dielectric layer 440 of the electrostatic chuck on the upper pressing panel 430, placing equal height fixing blocks 460 between the metal base 470 and the dielectric layer 440; and closing the space between the metal base 470 and the dielectric layer 440, with a filling port reserved on the side of the closed space;

[0076] Glue injection steps: Before vacuuming, put the adhesive into the pipes of the first vacuum glue injection device 450 and the second vacuum glue injection device 455. There should be no bubbles in the adhesive. Start to vacuum the inside of the cavity. The entire inside of the syringe is connected to the vacuum operation cavity and maintains vacuum. After the vacuuming is completed, use the first vacuum glue injection device 450 and the second vacuum glue injection device 455 to inject the adhesive. The adhesive is poured into the space between the metal base 470 and the dielectric layer 440 through the injection port; when the adhesive overflows from the corresponding channel in the visual observation window, it is determined that the adhesive has completely filled the space to form an adhesive layer.

[0077] Pressing step: After the glue injection is completed, the vacuum operating chamber 410 is exhausted into the atmosphere through the gas system 480, and then high-pressure gas is introduced through the gas system 480 to compress the upper and lower pressing panels. The upper and lower pressing panels compress the components of the electrostatic suction cup to make them fit tightly together.

[0078] Curing step: Turn on the heating function of the upper and lower pressed panels to allow the injected adhesive to complete curing.

[0079] Cooling and removing step: After the adhesive is cured, the vacuum operation chamber 410 is exhausted into the atmosphere, the laminating device is opened, and the electrostatic suction cup is removed.

[0080] The electrostatic chuck made by the laminating device comprises a single adhesive layer, the interior of which is filled with adhesive, and the thickness of the adhesive layer is controlled between 1.00 mm and 2.00 mm.

[0081] In some examples, the adhesive is silicone;

[0082] In some examples, the vacuum operation chamber is evacuated to a pressure below 10 Pa;

[0083] In some examples, the high pressure gas is a gas at a pressure higher than standard atmospheric pressure;

[0084] In some examples, the adhesive is cured by heating to 80-150°C, preferably 100-150°C.

[0085] In some examples, the adhesive viscosity is 10000-20000 CP;

[0086] The working principle of the gas system is: turn on the vacuum pump, and the gas in the vacuum operation cavity is pumped out to form a vacuum; open the inflation valve to inflate the cavity through the inflation pipeline; open the exhaust valve to exhaust the cavity into the atmosphere.

[0087] Combination Figure 7 As shown, the electrostatic suction cup manufactured by the above-mentioned bonding process and bonding device has the characteristics of high bonding strength and no bubbles, and the heterogeneous cavity structures contained in each bonding layer can be filled with adhesive; the thermal conductivity coefficients of the edge and the interior are consistent, which will not affect the temperature uniformity of the electrostatic suction cup, and the defects of large-area bonding are better controlled.

[0088] There are a few points to note:

[0089] (1) In the drawings of the embodiments disclosed in the present invention, only the structures related to the embodiments disclosed in the present invention are involved, and other structures can refer to the general design.

[0090] (2) In the absence of conflict, the features of the same embodiment and different embodiments disclosed in the present invention may be combined with each other.

[0091] The above description is only an exemplary embodiment of the present invention and is not intended to limit the scope of protection of the present invention, which is determined by the appended claims. Without departing from the design spirit of the present invention, various modifications and improvements made by ordinary technicians in this field to the technical solution of the present invention should fall within the scope of protection determined by the claims of the present invention.

Claims

1. An electrostatic chuck laminating device, characterized in that: It includes a vacuum operating chamber, a gas system, an upper pressing panel, a lower pressing panel, an upper telescopic device, a lower telescopic device, and a vacuum glue injection device; The top of the upper telescopic device is connected to the inner top surface of the vacuum operation chamber, the bottom of the upper telescopic device is connected to the top of the upper pressing panel, the bottom of the lower telescopic device is connected to the inner bottom surface of the vacuum operation chamber, and the top of the lower telescopic device is connected to the bottom of the lower pressing panel; an electrostatic chuck is fixed between the upper pressing panel and the lower pressing panel, the bottom of the upper pressing panel is fixedly connected to the top of the dielectric layer of the electrostatic chuck, and the top of the lower pressing panel is fixedly connected to the bottom of the metal base of the electrostatic chuck; The pipeline of the vacuum glue injection device passes through the vacuum operation chamber, one end of the pipeline is located outside the vacuum operation chamber, and the other end is located on the side of the metal base and the dielectric layer; the interior of the vacuum glue injection device is sealed and connected to the vacuum operation chamber; The gas system is communicated with the vacuum operation chamber, and a visual observation port is provided on the upper surface of the vacuum operation chamber.

2. According to the electrostatic suction cup bonding device according to claim 1, the gas system includes a first vacuum mechanical pump, a second vacuum molecular pump, an inflation pipeline, an exhaust pipeline and a vacuum pipeline; one end of the vacuum pipeline is connected to the vacuum operating chamber; one end of the inflation pipeline is connected to the vacuum operating chamber, and the other end is connected to the vacuum pipeline; the exhaust pipeline is connected between the inflation pipeline and the vacuum pipeline, and a first vacuum mechanical pump and a second vacuum molecular pump are arranged between the vacuum pipeline and the exhaust pipeline; an inflation valve is arranged at one end of the inflation pipeline close to the vacuum operating chamber, a vacuum valve is arranged at one end of the vacuum pipeline close to the vacuum operating chamber, and an exhaust valve is arranged on the exhaust pipeline.

3. According to the electrostatic chuck bonding device according to claim 1 or 2, the vacuum operation chamber is provided with a pressure gauge and a vacuum gauge.

4. According to the electrostatic suction cup bonding device according to any one of claims 1 to 3, there are two or four vacuum glue injection devices evenly distributed.

5. According to the electrostatic suction cup bonding device according to any one of claims 1-4, the upper and lower pressing plates can be raised and lowered, and the lifting distance is controllable; and / or the upper and lower pressing panels maintain a parallelism of less than 0.5°; and / or the upper and lower pressing panels maintain a flatness of less than 20μm.

6. A method for manufacturing an electrostatic chuck using the electrostatic chuck laminating device according to any one of claims 1 to 5, characterized in that: The following steps are involved: Masking and protection step: mask the non-bonding areas of the components of the electrostatic chuck to be bonded with a masking material to reserve bonding positions; The step of placing equal height fixing blocks: placing the vacuum chuck to be bonded in an atmospheric environment, fixing the metal base of the electrostatic chuck on the lower pressing panel, and fixing the dielectric layer of the electrostatic chuck on the upper pressing panel, placing equal height fixing blocks between the metal base and the dielectric layer of the electrostatic chuck, and sealing the space between the metal base and the dielectric layer, with a filling port reserved on the side of the closed space; Glue injection steps: put the adhesive into the pipeline of the vacuum glue injection device, and there must be no bubbles in the adhesive; then, the inside of the cavity is evacuated through the gas system, and the entire inside of the syringe is connected to the vacuum operation cavity and maintained in vacuum. After the vacuum is completed, the vacuum glue injection device is used to inject the adhesive, and the adhesive is poured into the space between the metal base and the dielectric layer through the injection port to form an adhesive layer; Pressing step: After the glue injection is completed, the vacuum operating chamber is exhausted into the atmosphere through the gas system, and then high-pressure gas is introduced through the gas system to compress the upper and lower pressing panels. The upper and lower pressing panels compress the components of the electrostatic chuck to make them fit tightly together; Curing step: turning on the heating function of the upper and lower pressed panels to allow the adhesive to cure; Cooling and removal steps: After the adhesive is cured, the vacuum operation chamber is exhausted into the atmosphere, the laminating device is opened, and the electrostatic suction cup is removed.

7. The manufacturing method according to claim 6, characterized in that: In the glue injection step, the vacuum operating chamber is evacuated to a pressure lower than 10Pa; and / or, in the glue injection step, two or four vacuum glue injection devices are used to inject adhesive simultaneously; and / or, in the glue injection step, when adhesive overflow is observed in the corresponding channel through the visual observation window, it is determined that the adhesive has been completely filled; and / or, in the pressing step, gas higher than the standard atmospheric pressure is filled into the vacuum operating chamber through the inflation valve of the gas system.

8. The manufacturing method according to claim 6 or 7, characterized in that: In the curing step, the adhesive is heated to 80-150° C. for curing, preferably 100-150° C. for curing.

9. The manufacturing method according to any one of claims 6 to 8, characterized in that: The adhesive is a silicon-based adhesive, preferably an elastic silicone material; and / or the viscosity of the adhesive is 10000-20000CP.

10. The manufacturing method according to any one of claims 6 to 9, wherein the equal-height fixing blocks are evenly distributed on the outer edge of the adhesive layer; and / or the thickness of the adhesive layer is controlled between 1.00 mm and 2.00 mm.

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