Scribing saw height measuring device and height measuring method

Abstract

The invention provides a scribing machine height measurement device and method, and the device comprises a height measurement loop, a height measurement controller and a Z-axis driver, and the Z-axis driver is configured to drive a Z axis to descend so as to drive a main shaft and a blade to descend synchronously. When the blade is in contact with the scribing table, the height measurement loop is conducted, the height measurement loop sends a conduction signal to the Z-axis driver, a probe module of the Z-axis driver is triggered to read the height value of the Z axis, and the Z-axis driver is triggered to stop driving the Z axis; the height measurement controller receives a probe signal which is sent by a probe module of the Z-axis driver and comprises a Z-axis height value, and sends a height measurement ending signal to the Z-axis driver; and the Z-axis driver drives the Z axis to return after receiving the height measurement ending signal, so that the blade leaves the scribing table. According to the scribing machine height measuring device, driving of the Z axis is finished while the height measuring action is implemented, the height measuring accuracy is improved, and meanwhile the situation that a blade continues to descend, and consequently the blade cracks and the scribing table is damaged is avoided.

Description

Technical Field

[0001] The present application relates to the field of integrated circuit production, and more specifically to a height measurement device and a height measurement method for a dicing machine. Background Art

[0002] like Figure 1 As shown, the dicing machine consists of an X-axis, a Y-axis, a Z-axis, a T-axis, a spindle 1, a blade 2 mounted on the spindle 1, and a dicing table 3. During the dicing process, the spindle 1 rotates at a high speed, and the X-axis, Y-axis, and T-axis cooperate to drive the spindle 1 and the blade 2 to move to the dicing position. The Z-axis then drives the spindle 1 and the blade 2 down to a specified height, and then the X-axis moves along a specified path to complete the dicing of the workpiece. Then the Z-axis is lifted up, and the X-axis, Y-axis, and T-axis move to the specified position again. The Z-axis drives the spindle 1 and the blade 2 down to the specified height again, and the cycle continues until the workpiece is completed.

[0003] The descending height (knife lowering height) of the spindle 1 and blade 2 driven by the Z axis is a very important process parameter, which directly determines the cutting depth of the blade on the workpiece. If the cutting depth is not enough, the workpiece cannot be cut open. If the cutting depth is too large, it may cut into the dicing table, causing the blade to crack and the tooling table to be damaged. Therefore, before dicing, it is necessary to measure the height of the blade, and then set the knife lowering height according to the blade height measurement value.

[0004] In addition, the blade of the dicing machine will wear during the dicing process, and its wear value is related to the material of the workpiece. When the blade is worn, it is necessary to measure the blade height to correct the Z-axis descent height so that the blade's dicing depth meets the dicing process requirements.

[0005] The traditional height measurement method is: the Z-axis moves downward, driving the spindle and the blade to move downward synchronously. When the blade contacts the dicing table, the height measurement circuit is turned on, and the height measurement circuit sends signals to the height measurement controller and the Z-axis driver at the same time. After receiving the signal, the Z-axis driver reads the height of the Z-axis. After receiving the height measurement signal sent by the Z-axis driver, the height measurement controller sends a stop command to the Z-axis driver, and the Z-axis stops descending. The Z-axis driver then controls the Z-axis to lift upward.

[0006] It can be seen that in the traditional height measurement method, after the blade contacts the scribing table and turns on the height measurement circuit, the height measurement circuit sends signals to the height measurement controller and the Z-axis driver at the same time. The Z-axis driver reads the height of the Z-axis (i.e., measures the height), and the height measurement controller sends a stop command to the Z-axis driver after receiving the signal. In other words, the time for the height measurement controller to send the stop signal lags behind the height measurement process. The consequence of this is that the blade will continue to descend for a certain distance after contacting the scribing table, and then stop descending, eventually causing the blade to crack and the scribing table to be damaged. In addition, during the height measurement process, the Z-axis and the blade continue to descend, so the height value of the Z-axis obtained by the Z-axis driver is not the actual height value of the Z-axis when the blade contacts the scribing table, thereby reducing the height measurement accuracy. Summary of the invention

[0007] In order to solve the above technical problems, the present application provides a method for measuring the height of a dicing knife, which adopts the following technical solutions:

[0008] A height measuring device for a dicing machine includes a height measuring circuit, a height measuring controller and a Z-axis driver, wherein:

[0009] The Z-axis driver is configured to drive the Z-axis to descend so as to drive the spindle and the blade to descend synchronously, and the Z-axis driver is provided with a probe module;

[0010] When the blade contacts the dicing table, the height measurement circuit is turned on, and the height measurement circuit is configured to send a turn-on signal to the Z-axis driver, triggering the probe module of the Z-axis driver to read the height value of the Z-axis, and triggering the Z-axis driver to stop driving the Z-axis;

[0011] The height measurement controller is configured to receive a probe signal including a Z-axis height value sent by a probe module of the Z-axis driver, and send a height measurement end signal to the Z-axis driver;

[0012] The Z-axis driver is configured to drive the Z-axis to return to its original position after receiving a height measurement end signal, so that the blade leaves the dicing table and the height measurement circuit is disconnected.

[0013] In some embodiments, in some embodiments, the probe of the Z-axis driver is connected to the height measurement controller via a bus, and the probe signal is sent to the height measurement controller via the bus.

[0014] In some embodiments, the Z-axis drive is a servo motor.

[0015] In some embodiments, the height measurement circuit includes a blade circuit, a scribing table circuit and a height measurement circuit board, wherein: the blade circuit includes a blade and a first wire, and the blade is connected to the height measurement circuit board through the first wire; the scribing table circuit includes a scribing table and a second wire, and the scribing table is connected to the height measurement circuit board through the second wire; when the blade contacts the conductive surface of the scribing table, the height measurement circuit board generates a conduction signal and sends the conduction signal to the Z-axis driver.

[0016] The dicing machine height measuring device provided in the present application has a Z-axis driver with a probe. When the blade contacts the dicing table and the height measuring circuit is turned on, the height measuring circuit sends a turn-on signal to the Z-axis driver, thereby triggering the probe module to read the height value of the Z-axis. At the same time, the Z-axis driver stops driving the Z-axis.

[0017] The probe signal is obtained based on the hardware triggering method. Once the probe signal is triggered, the Z-axis driver can be immediately triggered to stop driving the Z-axis. In this way, it can be ensured that the height measuring device of the dicing machine of the present application stops driving the Z-axis while performing the height measuring action, thereby improving the height measuring accuracy and preventing the blade from continuing to descend and causing the wafer to crack and the dicing table to be damaged.

[0018] The present application also provides a dicing blade height measurement method, which is implemented by the dicing machine height measurement device described in any one of the above items, and the dicing blade height measurement method includes:

[0019] Control the blade to move above the current height measurement point of the dicing table;

[0020] The Z-axis driver drives the Z-axis to descend to drive the spindle and the blade to descend synchronously. When the blade contacts the dicing table, the height measurement circuit is turned on and sends a conduction signal to the Z-axis driver.

[0021] The Z-axis driver stops driving the Z-axis, and the probe module of the Z-axis driver reads the height value of the Z-axis and sends the height value of the Z-axis to the height measurement controller;

[0022] After receiving the probe signal including the Z-axis height value sent by the probe module of the Z-axis driver, the height measurement controller sends a height measurement end signal to the Z-axis driver;

[0023] After receiving the height measurement end signal, the Z-axis driver drives the Z-axis to rise and return to its original position, so that the blade leaves the dicing table and the height measurement circuit is disconnected;

[0024] The above process is repeated until the height measurement of N predetermined height measurement points on the dicing table is completed.

[0025] In some embodiments, the Z-axis driver drives the Z-axis to descend to drive the spindle and the blade to descend synchronously, including: the Z-axis driver drives the Z-axis to descend to a predetermined height at a first speed; the Z-axis driver drives the Z-axis to continue to descend at a second speed until the blade contacts the dicing table and the height measurement circuit is turned on; the first speed is greater than the second speed.

[0026] In some embodiments, the method for measuring the height of a dicing knife further includes: predetermining N height measuring points on the surface of the dicing table, and the N height measuring points are evenly arranged in rows and columns on the surface of the dicing table, wherein the spacing between each height measuring point in the same row is equal to the spacing between each height measuring point in the same column; and the height measuring points located on the periphery maintain a predetermined safety distance from the edge of the dicing table.

[0027] The present application provides a dicing machine height measurement method, in which the Z-axis driver is equipped with a probe module. When the blade contacts the dicing table and the height measurement circuit is turned on, the height measurement circuit sends a conduction signal to the Z-axis driver, thereby triggering the probe module to read the height value of the Z-axis. At the same time, the Z-axis driver stops driving the Z-axis.

[0028] The probe signal is obtained based on the hardware triggering method. Once the probe signal is triggered, the Z-axis driver can be immediately triggered to stop driving the Z-axis. In this way, it can be ensured that the height measuring device of the dicing machine of the present application stops driving the Z-axis while performing the height measuring action, thereby improving the height measuring accuracy and preventing the blade from continuing to descend and causing the wafer to crack and the dicing table to be damaged. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 This is a schematic diagram of the structure of the dicing machine after omitting the X-axis, Y-axis, Z-axis, T-axis and other components;

[0030] Figure 2 It is a logic block diagram of the height measuring device of the dicing machine in the embodiment of the present application;

[0031] Figure 3 1 is a flowchart of the execution of the dicing knife height measurement method in the embodiment of the present application;

[0032] Figure 4 Schematic diagram of the distribution of N height measurement points on the dicing table in the embodiment of the present application. DETAILED DESCRIPTION

[0033] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0034] The technical solution of the present application will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present application.

[0035] In addition, the technical features involved in the different embodiments of the present application described below can be combined with each other as long as they do not conflict with each other.

[0036] The blade is generally round and is mounted on the spindle and located above the dicing table. The spindle drives the blade to move under the coordinated drive of the X-axis, Y-axis, Z-axis, and T-axis. The spindle can also drive the blade to rotate at high speed.

[0037] As described in the background technology section, in the traditional height measurement method, after the blade contacts the scribing table and turns on the height measurement circuit, the height measurement circuit sends a signal to the height measurement controller and the Z-axis driver at the same time. The Z-axis driver reads the height of the Z-axis (i.e., measures the height), and the height measurement controller sends a stop command to the Z-axis driver after receiving the signal. The consequence of this is that the blade will continue to drop a certain distance after contacting the scribing table, and then stop dropping, eventually causing the blade to crack and the scribing table to be damaged. In addition, during the height measurement process, the Z-axis and the blade continue to drop, so the height value of the Z-axis obtained by the Z-axis driver is not the actual height value of the Z-axis when the blade contacts the scribing table, thereby reducing the height measurement accuracy.

[0038] To this end, the present application provides a device for measuring the height of a dicing machine. Figure 2 As shown, the dicing machine height measuring device in the embodiment of the present application includes a height measuring circuit 4, a height measuring controller 6, and a Z-axis driver 5, wherein:

[0039] The Z-axis driver 5 is configured to drive the Z-axis to descend so as to drive the main shaft and the blade to descend synchronously. The Z-axis driver is provided with a probe module.

[0040] When the blade contacts the dicing table, the height measurement circuit 4 is turned on, and the height measurement circuit 4 is configured to send a conduction signal to the Z-axis driver 5, triggering the probe module of the Z-axis driver 5 to read the height value of the Z-axis (i.e., height measurement), and triggering the Z-axis driver 5 to stop driving the Z-axis.

[0041] The height measurement controller 6 is configured to receive a probe signal including a Z-axis height value sent by a probe module of the Z-axis driver 5 , and send a height measurement end signal to the Z-axis driver 5 .

[0042] The Z-axis driver 5 is configured to drive the Z-axis to return to its original position after receiving the height measurement end signal, so that the blade leaves the dicing table and the height measurement circuit is disconnected.

[0043] The dicing machine height measuring device in the embodiment of the present application has a Z-axis driver 5 with a probe module. When the blade contacts the dicing table and the height measuring circuit is turned on, the height measuring circuit sends a turn-on signal to the Z-axis driver 5, thereby triggering the probe to read the height value of the Z-axis (height measurement). At the same time, the Z-axis driver stops driving the Z-axis.

[0044] The probe signal is obtained based on the hardware triggering method, and after the probe signal is triggered, the Z-axis driver 5 can be triggered to stop driving the Z-axis. In this way, it can be ensured that the dicing machine height measuring device in the embodiment of the present application stops driving the Z-axis while performing the height measuring action, thereby improving the height measurement accuracy and preventing the blade from continuing to descend, causing the wafer to crack and the dicing table to be damaged.

[0045] Optionally, the probe module of the Z-axis driver 5 is connected to the height measurement controller 6 via a bus, and the probe signal is sent to the height measurement controller 6 via the bus.

[0046] Optionally, the Z-axis driver 5 is a servo motor with a probe function. After receiving the on signal, the probe module can read the operating parameters of the servo motor, including the height value of the Z-axis, to complete the height measurement. At the same time, the servo motor stops driving the Z-axis.

[0047] Optionally, the height measurement circuit includes a blade circuit, a scribing table circuit and a height measurement circuit board, wherein: the blade circuit includes a blade and a first wire, and the blade is connected to the height measurement circuit board through the first wire. The scribing table circuit includes a scribing table and a second wire, and the scribing table is connected to the height measurement circuit board through the second wire.

[0048] The height measurement circuit board has a signal sending function. When the blade contacts the conductive surface of the scribing table, the blade circuit, the scribing table circuit and the height measurement circuit board form a closed circuit, so that the height measurement circuit board generates a conduction signal and sends the conduction signal to the Z-axis driver.

[0049] Based on the same application concept, the present application also provides a method for measuring the height of a dicing blade, which can be implemented by the dicing machine height measuring device in any of the above embodiments. Figure 3 As shown, the dicing knife height measurement method in the embodiment of the present application includes:

[0050] S1. Control the blade to move above the current height measurement point of the dicing table.

[0051] S2, the Z-axis driver drives the Z-axis to descend to drive the spindle and the blade to descend synchronously. When the blade contacts the dicing table, the height measurement circuit is turned on and sends a conduction signal to the Z-axis driver.

[0052] S3, the Z-axis driver stops driving the Z-axis, and the probe module of the Z-axis driver reads the height value of the Z-axis and sends the height value of the Z-axis to the height measurement controller.

[0053] S4, after receiving the probe signal including the Z-axis height value sent by the probe module of the Z-axis driver, the height measurement controller sends a height measurement end signal to the Z-axis driver;

[0054] S5. After receiving the height measurement end signal, the Z-axis driver drives the Z-axis to rise and return to its original position, so that the blade leaves the dicing table and the height measurement circuit is disconnected.

[0055] The above process is repeated until the height measurement of N predetermined height measurement points on the dicing table is completed.

[0056] The dicing machine height measurement method in the embodiment of the present application has a Z-axis driver with a probe module. When the blade contacts the dicing table and the height measurement circuit is turned on, the height measurement circuit sends a conduction signal to the Z-axis driver, thereby triggering the probe module to read the height value of the Z-axis. At the same time, the Z-axis driver stops driving the Z-axis.

[0057] The probe signal is obtained based on the hardware triggering method. Once the probe signal is triggered, the Z-axis driver can be immediately triggered to stop driving the Z-axis. In this way, it can be ensured that the height measuring device of the dicing machine of the present application stops driving the Z-axis while performing the height measuring action, thereby improving the height measuring accuracy and preventing the blade from continuing to descend and causing the wafer to crack and the dicing table to be damaged.

[0058] Optionally, the Z-axis driver in step S2 drives the Z-axis to descend to drive the spindle and the blade to descend synchronously, including:

[0059] The Z-axis driver drives the Z-axis to descend to a predetermined height at a first speed.

[0060] The Z-axis driver drives the Z-axis to continue to descend at the second speed until the blade contacts the dicing table and the height measurement circuit is turned on; the first speed is greater than the second speed.

[0061] That is, first, the Z-axis driver drives the spindle and the blade to a predetermined height close to the scribing table at a faster first speed, and then the Z-axis driver drives the spindle and the blade to continue to descend toward the scribing table at a slower second speed until the blade contacts the conductive table with the scribing table.

[0062] In this way, it can be ensured that the blade can descend and contact the conductive table of the dicing table in a shorter time, so as to improve the height measurement efficiency, reduce the contact force between the blade and the conductive table, and reduce the risk of damage to the blade and the conductive table.

[0063] Optionally, the dicing blade height measurement method in the embodiment of the present application further includes: predetermining N height measurement points on the table of the dicing table, and the N height measurement points are evenly arranged in rows and columns on the table of the dicing table, wherein the spacing between the height measurement points in the same row is equal to the spacing between the height measurement points in the same column. The height measurement points located at the periphery maintain a predetermined safety distance from the edge of the dicing table.

[0064] For example Figure 4As shown, 100 height measurement points are pre-determined on the table of the scribing table, and the 100 height measurement points are scattered in the height measurement area in 10 rows and 10 columns, and the spacing between each position point in the same row and the spacing between each position point in the same column are set to the same predetermined value. In this way, the height measurement path can be simplified, so that the X-axis, Y-axis, Z-axis, and T-axis can more accurately drive the blade to move to each height measurement point in turn to implement height measurement. In addition. Since the N height measurement points are evenly arranged on the table of the scribing table, they can better characterize the height measurement value and improve the height measurement effect.

[0065] In addition, since the height measurement point located at the periphery maintains a predetermined safety distance from the edge of the scribing table, it can be prevented that the blade touches the edge of the scribing table during the height measurement process, causing damage to the blade.

[0066] The present application is described in sufficient detail above with certain particularity. It should be understood by those skilled in the art that the description in the embodiments is merely exemplary, and all changes made without departing from the true spirit and scope of the present application should fall within the scope of protection of the present application. The scope of protection claimed in the present application is defined by the claims, rather than by the above description in the embodiments.

Claims

1. A height measuring device for a dicing machine, characterized in that: The dicing machine height measuring device includes a height measuring circuit, a height measuring controller and a Z-axis driver, wherein: The Z-axis driver is configured to drive the Z-axis to descend so as to drive the spindle and the blade to descend synchronously, and the Z-axis driver is provided with a probe module; When the blade contacts the dicing table, the height measurement circuit is turned on, and the height measurement circuit is configured to send a turn-on signal to the Z-axis driver, trigger the probe module of the Z-axis driver to read the height value of the Z-axis, and trigger the Z-axis driver to stop driving the Z-axis; The height measurement controller is configured to receive a probe signal including a Z-axis height value sent by a probe module of the Z-axis driver, and send a height measurement end signal to the Z-axis driver; The Z-axis driver is configured to drive the Z-axis to return to its original position after receiving the height measurement end signal, so that the blade leaves the dicing table and the height measurement circuit is disconnected.

2. The height measuring device for a dicing machine according to claim 1, characterized in that: The probe module of the Z-axis driver is connected to the height measurement controller via a bus, and the probe signal is sent to the height measurement controller via the bus.

3. The height measuring device for a dicing machine according to claim 1, characterized in that: The Z-axis driver is a servo motor.

4. The height measuring device for a dicing machine according to claim 1, characterized in that: The height measurement circuit includes a blade circuit, a dicing table circuit and a height measurement circuit board, wherein: The blade loop includes a blade and a first wire, and the blade is connected to the height measurement circuit board through the first wire; The scribing stage loop includes a scribing stage and a second wire, and the scribing stage is connected to the height measuring circuit board via the second wire; When the blade contacts the conductive surface of the dicing table, the height measurement circuit board generates a conduction signal and sends the conduction signal to the Z-axis driver.

5. A method for measuring the height of a dicing knife, characterized in that: The method is implemented by the dicing machine height measuring device according to any one of claims 1 to 4, characterized in that the dicing knife height measuring method comprises: Control the blade to move above the current height measurement point of the dicing table; The Z-axis driver drives the Z-axis to descend to drive the spindle and the blade to descend synchronously. When the blade contacts the dicing table, the height measurement circuit is turned on and sends a conduction signal to the Z-axis driver. The Z-axis driver stops driving the Z-axis, and the probe module of the Z-axis driver reads the height value of the Z-axis and sends the height value of the Z-axis to the height measurement controller; After receiving the probe signal including the Z-axis height value sent by the probe module of the Z-axis driver, the height measurement controller sends a height measurement end signal to the Z-axis driver; After receiving the height measurement end signal, the Z-axis driver drives the Z-axis to rise and return to its original position, so that the blade leaves the dicing table and the height measurement circuit is disconnected; The above process is repeated until the height measurement of N predetermined height measurement points on the dicing table is completed.

6. The method for measuring the height of a dicing knife according to claim 5, wherein: The Z-axis driver drives the Z-axis down to drive the spindle and the blade to descend synchronously, including: The Z-axis driver drives the Z-axis to descend to a predetermined height at a first speed; The Z-axis driver drives the Z-axis to continue to descend at the second speed until the blade contacts the dicing table and the height measurement circuit is turned on; The first speed is greater than the second speed.

7. The method for measuring the height of a dicing knife according to claim 5, wherein: The dicing knife height measurement method further comprises: Predetermine N height measurement points on the table of the scribing table, and the N height measurement points are evenly arranged in rows and columns on the table of the scribing table, wherein the spacing between the height measurement points in the same row is equal to the spacing between the height measurement points in the same column; The height measuring point located at the periphery maintains a predetermined safety distance from the edge of the dicing table.

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