Sensor module and electronic device

Abstract

The invention provides a sensor module and an electronic apparatus. The sensor module includes: a first substrate; a second substrate; a connection portion electrically connecting the first substrate and the second substrate; a first sensor device provided on the first substrate and configured to detect a physical quantity of a first axis; and a second sensor device provided on the second substrate and configured to detect a physical quantity of the first axis.

Description

Technical Field

[0001] The invention relates to a sensor module and an electronic device. Background Art

[0002] Patent Document 1 describes a sensor module that achieves high accuracy of X-axis angular velocity data by mounting two X-axis angular velocity sensor devices on the side surfaces of the same substrate.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2019-163955 Summary of the invention

[0004] In a sensor module including a plurality of sensor devices for one detection axis, further improvements are required in terms of effectiveness and reliability with respect to high precision.

[0005] A sensor module involved in one embodiment of the present application comprises: a first substrate; a second substrate; a connecting portion electrically connecting the first substrate and the second substrate; a first sensor device, arranged on the first substrate, for detecting a physical quantity of a first axis; and a second sensor device, arranged on the second substrate, for detecting a physical quantity of the first axis.

[0006] A sensor module involved in one embodiment of the present application comprises: a first substrate; a second substrate, arranged on one side of the first substrate; a third substrate, arranged on the one side of the first substrate; a first connecting portion, electrically connecting the first substrate and the second substrate; a second connecting portion, electrically connecting the first substrate and the third substrate; a first sensor device, arranged on the second substrate, for detecting a physical quantity of a first axis; and a second sensor device, arranged on the third substrate, for detecting a physical quantity of the first axis.

[0007] An electronic device according to one aspect of the present application includes the above-described sensor module. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 This is a perspective view showing a state where the sensor module according to Embodiment 1 is fixed to a mounting surface.

[0009] Figure 2 The diagram is shown when viewed from the mounting surface side. Figure 1 A three-dimensional diagram of the state of the sensor module.

[0010] Figure 3 This is an exploded perspective view of the sensor module.

[0011] Figure 4 This is an expanded view of the base unit.

[0012] Figure 5This is an expanded view of the base unit.

[0013] Figure 6 It is a stereogram of a fixed frame.

[0014] Fig. 7A It is along Figure 4 Cross-sectional view along line AA.

[0015] Figure 7B It is along Figure 4 Cross-sectional view along line AA.

[0016] Figure 8 It is a structural diagram of the sensor device.

[0017] Fig. 9 This is a development view of the substrate unit according to the second embodiment.

[0018] Fig.10 This is a development view of the substrate unit according to the second embodiment.

[0019] Fig.11 This is a perspective view of a fixing frame according to the second embodiment.

[0020] Fig.12 This is a perspective view showing an example of an electronic device according to the third embodiment.

[0021] Fig.13 This is a perspective view showing another example of the electronic device according to the third embodiment.

[0022] Description of Reference Numerals

[0023] 1… vibrator; 2… supporting substrate; 3, 3a, 3b… sensor element; 4… circuit element; 5… base; 6… cover; 7… package; 8a, 8b… internal terminal; 8c… external terminal; 9… bonding wire; 10… sensor unit; 11a, 11b, 11c, 11d, 12a, 12b, 12c, 12d, 13a, 13b, 13c, 13d… sensor device; 14… operation circuit; 15… connector; 16… memory; 17… power supply circuit ; 18...temperature sensor; 20...substrate unit; 21, 22, 23, 24, 25, 26, 27, 221, 222, 231, 232, 241, 242, 251, 252, 261, 262...substrate; 30...inner housing; 31...opening; 32...side wall; 33...recess; 34...upper surface; 40...connecting portion; 41, 42, 43, 44, 45, 46, 411, 412, 421, 422, 431, 432, 4 41, 442, 451, 452…flexible substrate; 50…housing body; 52…threaded hole; 53…inner side; 54…side wall; 55…bottom surface; 57…upper surface; 58…lower surface; 60…fixing frame; 61…upper surface; 62…lower surface; 63, 64, 65, 66…side surface; 68…opening; 70…screw; 71…mounted surface; 81…driving circuit; 82…detecting circuit; 91…base; 92a, 92b…connecting arm; 93, 94…driving electrode; 95, 96…detection electrode; 97…ground electrode; 98a, 98b, 98c, 98d…driving arm; 99a, 99b…detection arm; 100…sensor module; 110…smartphone; 111…control unit; 130…car; 131…body; 132…body posture control device; 133…wheel; C1, C2, C3…arrow; D1, D2…detection data; S1, S2…detection signal; DS…drive signal; DG…feedback signal. DETAILED DESCRIPTION

[0024] In order to make each component easier to see, each drawing may be shown with different dimensional ratios depending on the component.

[0025] In each of the drawings, the X-axis, the Y-axis, and the Z-axis are orthogonal to each other.

[0026] In the following description, “X-axis direction” indicates a direction parallel to the X-axis, “Y-axis direction” indicates a direction parallel to the Y-axis, and “Z-axis direction” indicates a direction parallel to the Z-axis.

[0027] In the following description, the “positive side” indicates the front end side in the arrow direction of each axis of XYZ, and the “negative side” indicates the rear end side in the arrow direction.

[0028] In the following description, “plan view” means viewing from the Z-axis direction with respect to a plane including the X-axis and the Y-axis, and “cross-sectional view” means viewing from the X-axis direction or the Y-axis direction with respect to a cross-section including the Z-axis.

[0029] In the following description, the term "upper surface of a certain structure" refers to the surface of the structure on the positive side in the Z-axis direction. For example, "upper surface of a substrate" refers to the surface of the substrate on the positive side in the Z-axis direction.

[0030] In the following description, the term “bottom surface” of a certain structure refers to a surface of the structure on the negative side in the Z-axis direction.

[0031] In the following description, the term “left side surface” of a certain structure refers to a surface on the negative side in the X-axis direction of the structure.

[0032] In the following description, the term “right side surface” of a certain structure refers to a surface on the positive side in the X-axis direction of the structure.

[0033] 1. Implementation Method 1

[0034] Figures 1 to 8 A sensor module 100 according to Embodiment 1 is shown.

[0035] Figure 1 It is a perspective view showing a state where the sensor module 100 is fixed to a mounting surface 71 of a car or the like. Figure 2 is a diagram showing the structure of the device when viewed from the mounting surface 71 side. Figure 1 A stereoscopic diagram of a state of the sensor module 100 . Figure 3 is an exploded perspective view of the sensor module 100 . Figure 4 It is a development view of the substrate unit 20 . Figure 5 It is a development view of the substrate unit 20 . Figure 6 It is a perspective view of the fixing frame 60 . Fig. 7A It is along Figure 4 A cross-sectional view taken along line AA of FIG. 1 shows an example of the sensor device 11 b . Figure 7B It is along Figure 4 A cross-sectional view taken along line AA of FIG. 1 shows another example of the sensor device 11 b . Figure 8 It is an explanatory diagram showing the internal structure of a sensor device.

[0036] In this embodiment, the sensor module 100 is an inertial measurement unit (IMU) that detects the posture and behavior of an assembly device such as a car or a robot. Here, the assembly device can be referred to as a moving body, and the behavior can be referred to as an inertial motion amount.

[0037] like Figure 1As shown, the sensor module 100 has an outer shell 50 that is substantially square in plan view and rectangular in three-dimensional view. Regarding the size of the sensor module 100, for example, the length of one side of the square is about 24 mm, and the thickness is about 10 mm.

[0038] The substrate unit 20 on which a plurality of sensor devices are mounted is accommodated in the outer casing 50. The substrate unit 20 will be described later.

[0039] Screw holes 52 are formed on the lower surface 58 of the outer case 50. By inserting screws 70 through the two screw holes 52, the sensor module 100 is fixed to a mounting surface 71 of a mounting device such as an automobile and used.

[0040] like Figure 2 As shown, the inner housing 30 is housed inside the upper surface 53 of the outer housing 50. An opening 31 is formed on the upper surface 34 of the inner housing 30. Inside the opening 31, the plug-type connector 15 is arranged.

[0041] The connector 15 has a plurality of pins. A socket-type connector (not shown) is connected from a mounted device to the connector 15. The sensor module 100 receives power from a power circuit of the mounted device via the connector 15, and transmits an electrical signal such as detection data to the mounted device.

[0042] 1.1.Sensor module structure

[0043] Figure 3 yes Figure 2 An exploded perspective view of the sensor module 100 is shown.

[0044] like Figure 3 As shown, the sensor module 100 is composed of an outer case 50 and a sensor unit 10 accommodated in the outer case 50 . The sensor unit 10 is composed of an inner case 30 and a substrate unit 20 accommodated in the inner case 30 .

[0045] The outer shell 50 is a base formed by cutting aluminum into a box shape. The material is not limited to aluminum, and other metals such as zinc and stainless steel, resin, or a composite material of metal and resin may be used.

[0046] The outer housing 50 is in the shape of a box without a lid, and an inner side 53 thereof constitutes an inner space surrounded by a bottom surface 55 and side walls 54 .

[0047] The sensor unit 10 is housed in the internal space of the outer housing 50 via a joint member.

[0048] The sensor unit 10 is composed of an inner case 30 and a substrate unit 20 .

[0049] The inner housing 30 is a component for holding the substrate unit 20, and is shaped to be accommodated in the inner side 53 of the outer housing 50. The inner housing 30 is an octagonal shape formed by chamfering the corners of the four vertices of a square in a plan view, and an opening 31 as a through hole is formed on its upper surface, and a recess 33 is formed inside.

[0050] The height of the side wall 32 of the inner shell 30 is lower than the height of the side wall 54 of the outer shell 50. Figure 2 As shown, the upper surface 34 of the inner case 30 is lower than the upper surface 57 of the outer case 50. Although not shown, guide pins and a support surface for positioning the substrate unit 20 are formed inside the inner case 30.

[0051] The substrate unit 20 is positioned by the guide pins and the support surface, and is fixed to the inner side of the inner housing 30 by a joining member.

[0052] 1.2. Structure of the base unit

[0053] Figure 4 This is a plan view of the substrate unit 20 in a developed state as viewed from the negative side in the Z-axis direction. Figure 5 This is a plan view of the substrate unit 20 in a developed state as viewed from the positive side in the Z-axis direction.

[0054] like Figure 3 and Figure 6 As shown, the substrate unit 20 is used in an assembled state. In the present embodiment, the substrate unit 20 is supported by the fixing frame 60 and assembled into a substantially rectangular parallelepiped shape.

[0055] like Figure 4 and Figure 5 As shown, in this embodiment, the substrate unit 20 includes substrates 21, 22, 23, 24, 25, 26, flexible substrates 41, 42, 43, 44, 45, sensor devices 11a, 11b, 12a, 12b, 13a, 13b, an operation circuit 14, a connector 15, a memory 16, a power supply circuit 17 and a temperature sensor 18.

[0056] The substrates 21, 22, 23, 24, 25, and 26 are hard substrates called rigid substrates, and are specifically glass epoxy substrates. The substrates 21, 22, 23, 24, 25, and 26 may also be rigid substrates such as composite substrates and ceramic substrates. The substrates 21, 22, 23, 24, 25, and 26 may also be multi-layer or single-layer structures.

[0057] The flexible substrates 41, 42, 43, 44, 45 are softer than the substrates 21, 22, 23, 24, 25, 26, and in the present embodiment, are an example of the connection portion 40. The connection portion 40 may also be a flexible wiring cable, wiring cord, or wire such as a flat cable or a flat cord. The connection portion 40 may also include a connector, solder, a conductive adhesive, or a crimping terminal.

[0058] The flexible substrate 41 electrically connects the substrate 21 and the substrate 22. The flexible substrate 42 electrically connects the substrate 21 and the substrate 23. The flexible substrate 43 electrically connects the substrate 21 and the substrate 24. The flexible substrate 44 electrically connects the substrate 21 and the substrate 25. The flexible substrate 45 electrically connects the substrate 23 and the substrate 26.

[0059] The substrates 21, 22, 23, 24, 25, 26 and the flexible substrates 41, 42, 43, 44, 45 may also be rigid-flexible substrates having a plurality of rigid portions and a plurality of flexible portions. In the case of a rigid-flexible substrate, the plurality of rigid portions correspond to the substrates 21, 22, 23, 24, 25, 26 of the present embodiment, and the plurality of flexible portions correspond to the flexible substrates 41, 42, 43, 44, 45 of the present embodiment.

[0060] The sensor devices 11a, 11b, 12a, 12b, 13a, and 13b are angular velocity sensors, and more specifically, are vibration gyro sensors that use a crystal as a vibrator and detect angular velocity based on the Coriolis force applied to the vibrator.

[0061] In this embodiment, the driving frequencies of the oscillators of the sensor devices 11a, 11b, 12a, 12b, 13a, and 13b are all the same. The oscillator is not limited to crystal. For example, the oscillator may be a MEMS (Micro Electro Mechanical Systems) oscillator formed using a silicon substrate.

[0062] In this embodiment, the sensor devices 11a and 11b are Z-axis angular velocity sensors for detecting angular velocity around the Z axis, the sensor devices 12a and 12b are Y-axis angular velocity sensors for detecting angular velocity around the Y axis, and the sensor devices 13a and 13b are X-axis angular velocity sensors for detecting angular velocity around the X axis.

[0063] In this embodiment, the sensor module 100 includes two X-axis angular velocity sensors, two Y-axis angular velocity sensors, and two Z-axis angular velocity sensors. According to the structure in which two angular velocity sensors are provided on each axis of XYZ, the operation circuit 14 calculates the average value of the statistic of the angular velocity data based on the angular velocity data from the two angular velocity sensors on each axis of XYZ, thereby achieving high precision of the angular velocity data on each axis.

[0064] like Figure 4 As shown, a sensor device 11a is mounted on the lower surface of substrate 21. A sensor device 12a is mounted on the lower surface of substrate 22. A sensor device 12b is mounted on the lower surface of substrate 23. A sensor device 13a is mounted on the lower surface of substrate 24. A sensor device 13b is mounted on the lower surface of substrate 25. A sensor device 11b is mounted on the lower surface of substrate 26.

[0065] In this way, the sensor devices 11a, 11b, 12a, 12b, 13a, 13b are mounted on different substrates 21, 22, 23, 24, 25, 26. In addition, the substrates are connected via the flexible substrates 41, 42, 43, 44, 45. Therefore, even if the sensor devices 11a, 11b, 12a, 12b, 13a, 13b are operated simultaneously, the flexible substrates 41, 42, 43, 44, 45 can suppress the occurrence of mechanical or electrical interference between the sensor devices.

[0066] like Figure 5 As shown, the calculation circuit 14, the connector 15, the memory 16, the power supply circuit 17, and the temperature sensor 18 are mounted on the upper surface of the substrate 21. Other electronic components may also be mounted on the upper surface of the substrate 21.

[0067] The calculation circuit 14 is a main controller for the sensor devices 11a, 11b, 12a, 12b, 13a, and 13b. The calculation circuit 14 is an integrated circuit device and can be realized by a processor such as an MPU (Micro Processor Unit) or a CPU (central processing unit).

[0068] The calculation circuit 14 includes a digital interface. The digital interface is a circuit that performs digital interface processing based on a communication standard such as SPI or I2C.

[0069] The calculation circuit 14 receives the detection data output from the sensor devices 11a, 11b, 12a, 12b, 13a, and 13b, performs various processes, and transmits the output data to the outside via the connector 15. In the present embodiment, the calculation circuit 14 is an example of a processing unit.

[0070] The various processing performed by the operation circuit 14 includes calculating the average value of the detection data of the angular velocities around the Z axis from the sensor device 11a and the sensor device 11b, calculating the average value of the detection data of the angular velocities around the Y axis from the sensor device 12a and the sensor device 12b, calculating the average value of the detection data of the angular velocities around the X axis from the sensor device 13a and the sensor device 13b, performing temperature correction, zero point correction, etc. on each of the calculated average values, sensitivity adjustment processing, filtering processing, and outputting the processed data from the connector 15.

[0071] The connector 15 is a plug-type connector and has two rows of connection terminals arranged at equal intervals in the X-axis direction. In the present embodiment, the connector 15 has connection terminals with ten pins in one row and twenty pins in total, but the number of terminals may be appropriately changed according to design specifications.

[0072] The memory 16 stores a program for executing various processes performed by the arithmetic circuit 14 , a program for embedding processed detection data into packet data, and data necessary for executing the program, such as table data used in temperature correction processing.

[0073] The power circuit 17 receives power from the mounted device, and supplies necessary power to the sensor devices 11 a , 11 b , 12 a , 12 b , 13 a , 13 b , the calculation circuit 14 , and the like.

[0074] The temperature sensor 18 outputs temperature information used in the temperature correction process to the calculation circuit 14 .

[0075] 1.3. About fixed frame

[0076] Figure 6 FIG. 2 is a perspective view of the fixing frame 60, showing the fixing frame 60 in a state where the substrate unit 20 is mounted. Figure 6 In the figure, the substrate 21 is omitted for convenience of explanation.

[0077] The fixing frame 60 has an octagonal cylindrical shape in a plan view, and has openings 68 at portions where the substrates 21, 22, 23, 24, 25, 26 are mounted. The openings 68 function as retreat portions for the sensor devices 11a, 11b, 12a, 12b, 13a, 13b.

[0078] The substrates 21, 22, 23, 24, 25, 26 are mounted on the fixing frame 60 so that the sensor devices 11a, 11b, 12a, 12b, 13a, 13b are located inside. Therefore, since the sensor devices 11a, 11b, 12a, 12b, 13a, 13b do not protrude outward, the size of the substrate unit 20 can be reduced, and the sensor module 100 can be miniaturized.

[0079] The fixing frame 60 is formed of, for example, resin.

[0080] The elastic modulus of the fixing frame 60 is preferably smaller than that of the substrates 21 , 22 , 23 , 24 , 25 , and 26 , and larger than that of the flexible substrates 41 , 42 , 43 , 44 , and 45 .

[0081] By making the elastic modulus of the fixing frame 60 smaller than that of the substrates 21, 22, 23, 24, 25, 26, it is possible to suppress mechanical or electrical interference caused by the simultaneous operation of the sensor devices 11a, 11b, 12a, 12b, 13a, 13b. By making the elastic modulus of the fixing frame 60 larger than that of the flexible substrates 41, 42, 43, 44, 45, it is possible to fix the substrates 21, 22, 23, 24, 25, 26 at desired positions corresponding to the detection axes of the mounted sensor devices, thereby suppressing deviation from the desired positions.

[0082] The substrate 21 (not shown) is fixed to the upper surface 61 of the fixing frame 60, and the substrate 26 is fixed to the lower surface 62. In other words, the substrate 21 on which the sensor device 11a for detecting the angular velocity around the Z axis is mounted and the substrate 26 on which the sensor device 11b for detecting the angular velocity around the Z axis is mounted are arranged to face each other.

[0083] The substrate 22 is fixed to the side surface 63 of the fixing frame 60, and the substrate 23 is fixed to the side surface 64. In other words, the substrate 22 on which the sensor device 12a for detecting the angular velocity around the Y axis is mounted and the substrate 23 on which the sensor device 12b for detecting the angular velocity around the Y axis is mounted are arranged to face each other.

[0084] The substrate 24 is fixed to the side surface 65 of the fixing frame 60, and the substrate 25 is fixed to the side surface 66. In other words, the substrate 24 on which the sensor device 13a for detecting the angular velocity around the X axis is mounted and the substrate 25 on which the sensor device 13b for detecting the angular velocity around the X axis is mounted are arranged to face each other.

[0085] In the present embodiment, the substrate unit 20 is fixed to the fixing frame 60 during assembly, but the substrate unit 20 is not limited to the method using the fixing frame 60. For example, the substrate unit 20 may be directly fixed to the inner case 30 without using the fixing frame 60.

[0086] 1.4. About sensor devices

[0087] 1.4.1. Encapsulation

[0088] Fig. 7A and Figure 7B It is a cross-sectional view for explaining the packaging of the sensor device 11 b.

[0089] In this embodiment, Fig. 7A The sensor device 11b is a physical quantity sensor that detects angular velocity with the Z axis as a detection axis. Figure 7B The sensor device 11b is a composite physical quantity sensor that detects angular velocity with the Z axis as a detection axis and acceleration with the Z axis as a detection axis.

[0090] like Fig. 7A and Figure 7B As shown, the sensor device 11b includes a package 7, a sensor element 3 and a circuit element 4 housed in the package 7, or sensor elements 3a, 3b and a circuit element 4. Although not shown, the sensor devices 11a, 12a, 12b, 13a, 13b also have the same structure as the sensor device 11b.

[0091] The package 7 includes a base 5 having a recessed portion opened in the upper surface, and a cover 6 bonded to the upper surface of the base 5 via a bonding member so as to close the opening of the recessed portion. An internal space S is formed inside the package 7 by the recessed portion.

[0092] The package 7 is, for example, a ceramic package. The base 5 is made of ceramic such as alumina, and the lid 6 is made of ceramic such as alumina or a metal material such as kovar.

[0093] Fig. 7A The sensor device 11b accommodates a sensor element 3 and a circuit element 4 in an internal space S. The sensor element 3 is an angular velocity sensor for detecting an angular velocity around the Z axis, and includes a vibrator 1 and a support substrate 2. The vibrator 1 is a crystal vibrator. The circuit element 4 includes a detection circuit described later and the like.

[0094] The internal space S is airtight and is in a reduced pressure state, preferably a state closer to a vacuum. This improves the vibration characteristics of the vibrator 1. However, the atmosphere of the internal space S is not particularly limited.

[0095] The vibrator 1 , the support substrate 2 , and the circuit element 4 are arranged to overlap each other in a plan view in the internal space S. The plan view area of ​​the package 7 can be suppressed from expanding in the direction along the X-axis and / or the Y-axis, and miniaturization can be achieved.

[0096] A plurality of internal terminals 8 a and 8 b are provided in the recess of the base 5 , and a plurality of external terminals 8 c are provided on the lower surface of the base 5 .

[0097] These internal terminals 8 a and 8 b and the external terminal 8 c are electrically connected to wiring (not shown) formed in the base 5 and the substrate 26 .

[0098] The internal terminal 8 a is electrically connected to the sensor element 3 via a conductive bonding member, and the internal terminal 8 b is electrically connected to the circuit element 4 via a bonding wire 9 .

[0099] Figure 7B The sensor device 11 b accommodates the sensor elements 3 a and 3 b and the circuit element 4 in the internal space S.

[0100] The sensor element 3 a is an angular velocity sensor that detects an angular velocity about the Z axis, and similarly to the sensor element 3 , includes a vibrator that performs bending vibration, and detects an angular velocity using the Coriolis force.

[0101] The sensor element 3b is an acceleration sensor that detects acceleration in the Z-axis direction. The sensor element 3b includes a crystal oscillator and detects acceleration by using changes in the vibration frequency of the crystal oscillator. The sensor element 3b may also be configured as a silicon MEMS having a comb-shaped fixed electrode and a movable electrode and detects acceleration by using changes in the capacitance formed therebetween.

[0102] The circuit element 4 includes a detection circuit and the like which will be described later.

[0103] exist Figure 7B In the illustrated embodiment, the sensor device 11 b includes an angular velocity sensor for detecting an angular velocity around the Z axis and an acceleration sensor for detecting acceleration in the Z axis direction, but the sensor device 11 b is not limited to this configuration.

[0104] For example, the sensor device 11 b may include an angular velocity sensor element for detecting an angular velocity around the X-axis and / or an angular velocity sensor element for detecting an angular velocity around the Y-axis in addition to the sensor elements 3 a and 3 b .

[0105] For example, the sensor device 11 b may include, in addition to the sensor elements 3 a and 3 b , an acceleration sensor element that detects acceleration in the X-axis direction and / or an acceleration sensor element that detects acceleration in the Y-axis direction.

[0106] For example, the sensor element 3 a may be a three-axis angular velocity sensor that detects angular velocity about each axis of X, Y, and Z.

[0107] For example, the sensor element 3 b may be a three-axis acceleration sensor that detects acceleration in the directions of the X, Y, and Z axes.

[0108] For example, the sensor element 3 b may be an angular velocity sensor that detects angular velocity around the Y axis and / or around the X axis, or a three-axis angular velocity sensor that detects angular velocity around each axis of XYZ.

[0109] For example, the sensor element 3a may be a three-axis angular velocity sensor that detects the angular velocity around each axis of XYZ, and the sensor element 3b may be a three-axis acceleration sensor that detects the acceleration in each axis direction of XYZ. In other words, the sensor device 11b may be a three-axis angular velocity sensor, a three-axis acceleration sensor, or a 6DoF (Six degrees of freedom) sensor.

[0110] When a ceramic package is used as the package 7, the package 7 can be referred to as a hard substrate. In this case, the sensor elements 3, 3a, and 3b can be referred to as a sensor device 11b.

[0111] When a ceramic package is used as the package 7 , the package 7 may be directly mounted on the flexible substrate 45 without the substrate 26 interposed therebetween.

[0112] 1.4.2. Structure of sensor elements and circuit elements

[0113] Figure 8 Show Fig. 7A The sensor device 11b shown is a detailed configuration example of the sensor element 3 and the circuit element 4. The sensor devices 11a, 12a, 12b, 13a, and 13b also have the same configuration.

[0114] The sensor device 11 b includes a sensor element 3 and a circuit element 4 .

[0115] The sensor element 3 includes a vibrator 1 , and the circuit element 4 includes a driving circuit 81 and a detection circuit 82 .

[0116] The driving circuit 81 may include an amplifier circuit that receives the feedback signal DG from the vibrator 1 and amplifies the signal, an AGC (Automatic Gain Control) circuit that performs automatic gain control, and an output circuit that outputs a driving signal DS to the vibrator 1. The AGC circuit automatically adjusts the gain variably so that the amplitude of the feedback signal DG from the vibrator 1 is constant. The output circuit outputs a driving signal DS of, for example, a rectangular wave to the vibrator 1.

[0117] The detection circuit 82 can include an amplifier circuit, a synchronous detection circuit, an A / D conversion circuit, etc. The amplifier circuit receives the detection signals S1 and S2 from the oscillator 1, and performs charge-voltage conversion and signal amplification of the detection signals S1 and S2 as differential signals. The synchronous detection circuit uses the synchronization signal from the drive circuit 81 to perform synchronous detection for extracting the desired wave. The A / D conversion circuit converts the analog detection signals S1 and S2 after synchronous detection into digital detection data D1, and outputs it to the operation circuit 14.

[0118] The calculation circuit 14 performs various processes such as temperature correction, zero point correction, sensitivity adjustment, and filter processing on the detection data D1 , and outputs the processed detection data D2 to the outside via the connector 15 .

[0119] In the present embodiment, the vibrator 1 is a double T-shaped vibrator. As the vibrator 1, a tuning fork type or H-shaped vibrator may be used.

[0120] The vibrator 1 includes driving arms 98a, 98b, 98c, and 98d, detection arms 99a and 99b, a base 91, and connection arms 92a and 92b.

[0121] The base 91 has a rectangular shape, and a detection arm 99 a , a detection arm 99 b , a connecting arm 92 a , and a connecting arm 92 b are provided on respective sides of the base 91 .

[0122] A driving arm 98a and a driving arm 98b are provided at the front end portion of the connecting arm 92a.

[0123] A driving arm 98c and a driving arm 98d are provided at the front end portion of the connecting arm 92b.

[0124] Weights for frequency adjustment are provided at the front ends of the driving arms 98a, 98b, 98c, 98d and the detection arms 99a, 99b.

[0125] When the Z-axis direction is set as the thickness direction of the vibrator 1 , the vibrator 1 detects the angular velocity around the Z-axis.

[0126] The driving electrodes 93 are formed on the upper and lower surfaces of the driving arms 98a and 98b. The driving electrodes 94 are formed on the right and left sides of the driving arms 98a and 98b.

[0127] The driving electrodes 94 are formed on the upper and lower surfaces of the driving arms 98c and 98d. The driving electrodes 93 are formed on the right and left sides of the driving arms 98c and 98d.

[0128] The driving electrodes 93 and 94 are electrically connected to the driving circuit 81 . The driving circuit 81 supplies a driving signal DS to the driving electrode 93 , and receives a feedback signal DG from the driving electrode 94 .

[0129] Detection electrodes 95 are formed on the upper and lower surfaces of the detection arm 99a. Ground electrodes 97 are formed on the right and left sides of the detection arm 99a.

[0130] Detection electrodes 96 are formed on the upper and lower surfaces of the detection arm 99b. Ground electrodes 97 are formed on the right and left sides of the detection arm 99b.

[0131] The detection electrodes 95 and 96 are electrically connected to the detection circuit 82. The detection circuit 82 receives the detection signals S1 and S2 from the detection electrodes 95 and 96.

[0132] 1.4.3. Operation of sensor elements and circuit elements

[0133] The sensor element 3 and the circuit element 4 operate as follows.

[0134] When the driving signal DS is applied from the driving circuit 81 to the driving electrode 93, the driving arms 98a, 98b, 98c, and 98d perform bending vibrations as indicated by the arrow C1 due to the inverse piezoelectric effect. Specifically, the front ends of the driving arms 98a and 98c repeatedly approach and separate from each other, and the front ends of the driving arms 98b and 98d also repeatedly approach and separate from each other.

[0135] In other words, the driving arms 98a, 98b, 98c, and 98d repeatedly perform the vibration posture indicated by the solid arrow C1 and the vibration posture indicated by the dotted arrow C1 at a predetermined frequency. The predetermined frequency is, for example, 49.6 kHz.

[0136] In this embodiment, the frequency of the bending vibration of the driving arms 98a, 98b, 98c, and 98d is an example of the driving frequency of the sensor device 11b. Since the frequency of the bending vibration of the driving arms 98a, 98b, 98c, and 98d is related to the frequency of the driving signal DS, the driving frequency of the sensor device 11b can also be defined by the frequency of the driving signal DS.

[0137] The bending vibration of the driving arms 98a and 98b and the bending vibration of the driving arms 98c and 98d are line-symmetrical vibrations with respect to the X-axis passing through the center of gravity of the base 91. Therefore, the base 91, the connecting arms 92a and 92b, and the detection arms 99a and 99b hardly vibrate due to the bending vibration of the driving arms 98a, 98b, 98c, and 98d.

[0138] In this state, when an angular velocity with the Z axis as the rotation axis is applied to the vibrator 1, the driving arms 98a, 98b, 98c, and 98d vibrate as indicated by the arrow C2 due to the Coriolis force. In other words, the Coriolis force in the direction of the arrow C1 and the direction of the arrow C2 orthogonal to the direction of the Z axis acts on the driving arms 98a, 98b, 98c, and 98d, thereby generating a vibration component in the direction of the arrow C2.

[0139] The vibration indicated by the arrow C2 is transmitted to the base portion 91 via the connecting arm 92a and the connecting arm 92b, whereby the detection arm 99a and the detection arm 99b perform bending vibration in the direction of the arrow C3.

[0140] The charge signals generated by the piezoelectric effect caused by the bending vibration of the detection arms 99a and 99b are input as detection signals S1 and S2 to the detection circuit 82, thereby detecting the angular velocity around the Z axis.

[0141] As described above, the sensor module 100 according to the present embodiment has the following effects.

[0142] The sensor module 100 of this embodiment includes: a substrate 21 as a first substrate; a substrate 26 as a second substrate; a connecting portion 40, which electrically connects the substrate 21 and the substrate 26; a sensor device 11a as a first sensor device, which is arranged on the substrate 21 and is used to detect the angular velocity around the Z axis as a physical quantity of the first axis; and a sensor device 11b as a second sensor device, which is arranged on the substrate 26 and is used to detect the angular velocity around the Z axis.

[0143] As described above, the sensor module 100 of this embodiment includes the sensor devices 11 a and 11 b for detecting angular velocity around the Z axis. The sensor device 11 a is mounted on the substrate 21 , and the sensor device 11 b is mounted on the substrate 26 . The substrate 21 and the substrate 26 are electrically connected via the connection portion 40 .

[0144] Therefore, the sensor module 100 of this embodiment can suppress mechanical or electrical interference caused by mounting the sensor device 11a and the sensor device 11b on the same substrate. Therefore, the sensor module 100 of this embodiment can improve the effectiveness and reliability of high-precision detection data.

[0145] In the sensor module 100 of the present embodiment, the connection portion 40 includes a flexible substrate 45 .

[0146] The flexible substrate 45 is a soft substrate. Therefore, even if the sensor device 11 a and the sensor device 11 b are operated simultaneously, the sensor module 100 of the present embodiment can suppress the occurrence of mechanical or electrical interference between the sensor device 11 a and the sensor device 11 b.

[0147] In the sensor module 100 of this embodiment, the driving frequency of the sensor device 11a is the same as the driving frequency of the sensor device 11b. The driving frequencies of the sensor devices 11a and 11b are the frequencies of the bending vibrations of the driving arms 98a, 98b, 98c, and 98d or the frequencies of the driving signal DS.

[0148] When the driving frequency of the sensor device 11a is the same as the driving frequency of the sensor device 11b, the mechanical or electrical interference caused by the sensor device 11a and the sensor device 11b being mounted on the same substrate is particularly significant. Therefore, the sensor module 100 of this embodiment is a structure particularly suitable for the case where the sensor device 11a and the sensor device 11b use devices with the same driving frequency.

[0149] Furthermore, since the sensor module 100 of the present embodiment can use the same driving frequency device in the sensor device 11a and the sensor device 11b, there is no need to prepare devices with different driving frequencies. Therefore, the sensor module 100 of the present embodiment can reduce the cost required for preparing devices with different driving frequencies in the sensor device 11a and the sensor device 11b, such as the cost in manufacturing, ordering, inventory, or assembly, and thus can improve the industrial utilization value.

[0150] The sensor module 100 of this embodiment includes a calculation circuit 14 as a processing unit. The calculation circuit 14 is provided on the substrate 21 and processes the detection data D1 as the first detection signal of the sensor device 11 a and the detection data D2 as the second detection signal of the sensor device 11 b .

[0151] The detection data D1 of the sensor device 11a and the detection data D1 of the sensor device 11b are processed by the operation circuit 14 provided on the substrate 21, respectively, and the processed detection data D2 can be obtained. Since the sensor module 100 of this embodiment suppresses the interference between the sensor device 11a and the sensor device 11b, the effectiveness of high precision is ensured, and the detection data D2 with high precision and high reliability can be obtained.

[0152] The sensor module 100 of the present embodiment includes a connector 15 . The connector 15 is provided on the substrate 21 and is electrically connected to the calculation circuit 14 .

[0153] Therefore, the sensor module 100 of the present embodiment can output highly accurate and reliable detection data D2 to the outside via the connector 15 based on the structure that ensures the effectiveness of high accuracy.

[0154] The sensor module 100 of the present embodiment includes: a substrate 23 as a third substrate; and a sensor device 12b as a third sensor device, which is arranged on the substrate 23 and is used to detect the angular velocity around the Y-axis as the physical quantity of the second axis. The substrate 21, the substrate 26 and the substrate 23 are respectively composed of glass epoxy substrates as hard substrates. The connecting part 40 is composed of a flexible substrate 42 as a first flexible substrate and a flexible substrate 45 as a second flexible substrate. One end of the flexible substrate 42 is connected to the substrate 21, and the other end is connected to the substrate 23. One end of the flexible substrate 45 is connected to the substrate 23, and the other end is connected to the substrate 26.

[0155] In this way, the sensor module 100 of this embodiment has a sensor device 11a and a sensor device 11b for detecting the angular velocity around the Z axis, and a sensor device 12b for detecting the angular velocity around the Y axis. The sensor device 11a is installed on the substrate 21, the sensor device 11b is installed on the substrate 26, and the sensor device 12b is installed on the substrate 23. The substrate 21 and the substrate 23 are electrically connected via the flexible substrate 42, and the substrate 23 and the substrate 26 are electrically connected via the flexible substrate 45.

[0156] Therefore, the sensor module 100 of this embodiment can suppress mechanical or electrical interference caused by mounting the sensor devices 11a, 11b, and 12b on the same substrate. Therefore, the sensor module 100 of this embodiment can improve the effectiveness and reliability of high-precision detection data.

[0157] In the sensor module 100 of the present embodiment, the substrate 21 and the substrate 26 are arranged to face each other.

[0158] The substrate 21 and the substrate 26 are respectively mounted with sensor devices for detecting the angular velocity around the Z axis. The sensor module 100 of this embodiment realizes high precision of the angular velocity around the Z axis by configuring the substrate 21 and the substrate 26 opposite to each other, which is an effective structure. Therefore, the sensor module 100 of this embodiment can improve the effectiveness of high precision of the angular velocity around the Z axis.

[0159] The sensor module 100 of the present embodiment includes a fixing frame 60 as a fixing portion, and the substrate 21 and the substrate 26 are fixed to the fixing frame 60 .

[0160] The substrate 21 and the substrate 26 are respectively fixed to the fixing frame 60. Therefore, the sensor module 100 of this embodiment can easily and reliably fix the substrate 21 and the substrate 26. Therefore, the sensor module 100 of this embodiment can improve the effectiveness and reliability of high-precision detection data.

[0161] The sensor module 100 of the present embodiment includes an inner case 30 and / or an outer case 50 as a case, and the substrate 21 , the substrate 26 , and the connection portion 40 are accommodated in the inner case 30 and / or the outer case 50 .

[0162] Therefore, since the sensor module 100 of the present embodiment is housed in the inner case 30 and / or the outer case 50 , it is possible to block influences from the outside, thereby improving the effectiveness and reliability of the high-precision detection data.

[0163] 2. Implementation Method 2

[0164] Figures 9 to 11 A sensor module 100 according to the second embodiment is shown.

[0165] Fig. 9 2 is a development view of the substrate unit 20 , and is a plan view of the substrate unit 20 in a developed state as viewed from the negative side in the Z-axis direction. Fig.10 2 is a development view of the substrate unit 20 , and is a plan view of the substrate unit 20 in a developed state as viewed from the positive side in the Z-axis direction. Fig.11 FIG. 2 is a perspective view of the fixing frame 60, showing the fixing frame 60 in a state where the substrate unit 20 is mounted. Fig.11 In the figure, the substrate 21 is omitted for convenience of explanation.

[0166] In Embodiment 2, the same reference numerals are given to the same structures as those in Embodiment 1, and the description thereof may be omitted.

[0167] 2.1. Structure of the base unit

[0168] In embodiment 2, the substrate unit 20 includes substrates 21, 221, 222, 231, 232, 241, 242, 251, 252, 261, 262, 27, flexible substrates 411, 412, 421, 422, 431, 432, 441, 442, 451, 452, 46, sensor devices 11a, 11b, 11c, 11d, 12a, 12b, 12c, 12d, 13a, 13b, 13c, 13d, an operation circuit 14, a connector 15, a memory 16, a power supply circuit 17, and a temperature sensor 18.

[0169] The substrates 21 , 221 , 222 , 231 , 232 , 241 , 242 , 251 , 252 , 261 , 262 , and 27 are rigid substrates such as glass epoxy substrates, composite substrates, or ceramic substrates.

[0170] The flexible substrates 411 , 412 , 421 , 422 , 431 , 432 , 441 , 442 , 451 , 452 , and 46 are examples of the connection portion 40 .

[0171] The flexible substrate 411 electrically connects the substrate 21 to the substrate 221. The flexible substrate 412 electrically connects the substrate 21 to the substrate 222. The flexible substrate 421 electrically connects the substrate 21 to the substrate 231. The flexible substrate 422 electrically connects the substrate 21 to the substrate 232. The flexible substrate 431 electrically connects the substrate 21 to the substrate 241. The flexible substrate 432 electrically connects the substrate 21 to the substrate 242. The flexible substrate 441 electrically connects the substrate 21 to the substrate 251. The flexible substrate 442 electrically connects the substrate 21 to the substrate 252. The flexible substrate 451 electrically connects the substrate 231 to the substrate 261. The flexible substrate 452 electrically connects the substrate 232 to the substrate 262. The flexible substrate 46 electrically connects the substrate 221 to the substrate 27.

[0172] The substrates 21, 221, 222, 231, 232, 241, 242, 251, 252, 261, 262, 27 and the flexible substrates 411, 412, 421, 422, 431, 432, 441, 442, 451, 452, 46 may also be rigid-flexible substrates.

[0173] The sensor devices 11a, 11b, 11c, 11d, 12a, 12b, 12c, 12d, 13a, 13b, 13c, and 13d are angular velocity sensors, specifically, vibration gyro sensors using crystal as a vibrator.

[0174] In Embodiment 2, the driving frequencies of the oscillators of the sensor devices 11a, 11b, 11c, 11d, 12a, 12b, 12c, 12d, 13a, 13b, 13c, and 13d are all the same. The oscillator is not limited to crystal. For example, the oscillator may be a MEMS oscillator formed using a silicon substrate.

[0175] In Embodiment 2, the sensor devices 11a, 11b, 11c, and 11d are Z-axis angular velocity sensors that detect angular velocity around the Z axis. The sensor devices 12a, 12b, 12c, and 12d are Y-axis angular velocity sensors that detect angular velocity around the Y axis. The sensor devices 13a, 13b, 13c, and 13d are X-axis angular velocity sensors that detect angular velocity around the X axis.

[0176] In Embodiment 2, the sensor module 100 includes four X-axis angular velocity sensors, four Y-axis angular velocity sensors, and four Z-axis angular velocity sensors. According to the structure in which four angular velocity sensors are provided on each of the XYZ axes, the operation circuit 14 calculates the average value of the statistic of the angular velocity data based on the angular velocity data from the four angular velocity sensors for each of the XYZ axes, thereby achieving high precision of the angular velocity data of each axis.

[0177] like Fig. 9As shown, a sensor device 11a is mounted on the lower surface of substrate 21. A sensor device 12a is mounted on the lower surface of substrate 221. A sensor device 12b is mounted on the lower surface of substrate 222. A sensor device 12c is mounted on the lower surface of substrate 231. A sensor device 12d is mounted on the lower surface of substrate 232. A sensor device 13a is mounted on the lower surface of substrate 241. A sensor device 13b is mounted on the lower surface of substrate 242. A sensor device 13c is mounted on the lower surface of substrate 251. A sensor device 13d is mounted on the lower surface of substrate 252. A sensor device 11c is mounted on the lower surface of substrate 261. A sensor device 11d is mounted on the lower surface of substrate 262. A sensor device 11b is mounted on the lower surface of substrate 27.

[0178] like Fig.10 As shown, the calculation circuit 14 , the connector 15 , the memory 16 , the power supply circuit 17 , and the temperature sensor 18 are mounted on the upper surface of the substrate 21 .

[0179] The calculation circuit 14 is a controller that serves as a main controller for the sensor devices 11a, 11b, 11c, 11d, 12a, 12b, 12c, 12d, 13a, 13b, 13c, and 13d.

[0180] The calculation circuit 14 receives detection data output from the sensor devices 11 a , 11 b , 11 c , 11 d , 12 a , 12 b , 12 c , 12 d , 13 a , 13 b , 13 c , and 13 d , performs various processes, and transmits output data to the outside via the connector 15 .

[0181] The various processing performed by the operation circuit 14 includes a processing for calculating the average value of the detection data of the angular velocities around the Z axis from the sensor device 11a, the sensor device 11b, the sensor device 11c and the sensor device 11d, a processing for calculating the average value of the detection data of the angular velocities around the Y axis from the sensor device 12a, the sensor device 12b, the sensor device 12c and the sensor device 12d, a processing for calculating the average value of the detection data of the angular velocities around the X axis from the sensor device 13a, the sensor device 13b, the sensor device 13c and the sensor device 13d, a processing for performing temperature correction, zero point correction and the like on each of the calculated average values, a sensitivity adjustment processing, a filtering processing, and a processing for outputting the processed data from the connector 15.

[0182] 2.2. About fixed frame

[0183] Fig.11 FIG. 2 is a perspective view of the fixing frame 60, showing the fixing frame 60 in a state where the substrate unit 20 is mounted. Fig.11In the figure, the substrate 21 is omitted for convenience of explanation.

[0184] The substrate unit 20 is supported by the fixing frame 60 during assembly and is assembled into a substantially rectangular parallelepiped shape.

[0185] The fixing frame 60 has an octagonal cylindrical shape in a plan view, and openings 68 are provided in portions where the substrates 21 , 221 , 222 , 231 , 232 , 241 , 242 , 251 , 252 , 261 , 262 , and 27 are mounted.

[0186] The substrates 21, 221, 222, 231, 232, 241, 242, 251, 252, 261, 262, 27 are mounted on the fixing frame 60 such that the sensor devices 11a, 11b, 11c, 11d, 12a, 12b, 12c, 12d, 13a, 13b, 13c, 13d are located inside.

[0187] The substrate 21 (not shown) is fixed to the upper surface 61 of the fixing frame 60, and the substrates 261, 262, 27 are fixed to the lower surface 62. In other words, sensor devices for detecting angular velocity around the Z axis are mounted on the substrates 21, 261, 262, 27, respectively, and the substrate 21 is arranged opposite to the substrates 261, 262, 27.

[0188] The substrates 221 and 222 are fixed to the side 63 of the fixing frame 60, and the substrates 231 and 232 are fixed to the side 64. In other words, sensor devices for detecting angular velocity around the Y axis are mounted on the substrates 221, 222, 231, 232, respectively, and the substrates 221, 222, 231, 232 are arranged on the opposite side 63 and side 64.

[0189] The substrates 241 and 242 are fixed to the side 65 of the fixing frame 60, and the substrates 251 and 252 are fixed to the side 66. In other words, sensor devices for detecting angular velocity around the X-axis are mounted on the substrates 241, 242, 251, 252, respectively, and the substrates 241, 242, 251, 252 are arranged on the opposite side 65 and side 66.

[0190] In the above-mentioned embodiments, examples in which the number of sensor devices for each of the XYZ axes is two and four are described, but the number of sensor devices for each of the XYZ axes may be three or five or more.

[0191] In the above-mentioned embodiment, an example is described in which the number of sensor devices in each axis of XYZ is the same in each axis, but the number of sensor devices in each axis may be different. For example, the number of sensor devices in the X axis may be two, the number of sensor devices in the Y axis may be two, and the number of sensor devices in the Z axis may be four.

[0192] In the above-mentioned embodiment, an example is described in which there are multiple sensor devices for each axis of XYZ, but the number of sensor devices may be multiple only for a specific axis. For example, the number of sensor devices for the X axis may be one, the number of sensor devices for the Y axis may be one, and the number of sensor devices for the Z axis may be two.

[0193] As described above, the sensor module 100 according to the second embodiment has the following effects in addition to the effects of the first embodiment.

[0194] The sensor module 100 of embodiment 2 comprises: a substrate 21 as a first substrate; a substrate 261 as a second substrate; a connecting portion 40, electrically connecting the substrate 21 and the substrate 261; a sensor device 11a as a first sensor device, arranged on the substrate 21, for detecting the angular velocity around the Z axis as a physical quantity of the first axis; and a sensor device 11c as a second sensor device, arranged on the substrate 261, for detecting the angular velocity around the Z axis.

[0195] Thus, the sensor module 100 of this embodiment includes the sensor device 11a and the sensor device 11c for detecting the angular velocity around the Z axis, the sensor device 11a is mounted on the substrate 21, the sensor device 11c is mounted on the substrate 261, and the substrate 21 and the substrate 261 are electrically connected via the connection portion 40. Therefore, the sensor module 100 of the second embodiment can suppress the mechanical or electrical interference generated by the sensor device 11a and the sensor device 11c being mounted on the same substrate. Therefore, the sensor module 100 of the second embodiment can improve the effectiveness and reliability of the high-precision detection data.

[0196] 3. Implementation Method 3

[0197] In the third embodiment, an electronic device including the sensor module 100 will be described.

[0198] Hereinafter, as examples of electronic devices, examples of portable devices such as smartphones and examples of mobile objects such as cars will be described.

[0199] 3.1. Overview of portable devices

[0200] Fig.12 It is a perspective view of a portable device as an electronic device according to Embodiment 3, and is a diagram showing a structure of a smartphone 110 as an example of the portable device.

[0201] The smartphone 110 is equipped with the sensor module 100 .

[0202] The output data of the sensor module 100 is received by the control unit 111. The control unit 111 can recognize the posture and behavior of the smartphone 110 based on the received detection signal, thereby changing the display image displayed on the display unit, or issuing a warning sound or effect sound, or driving the vibration motor to vibrate the main body.

[0203] The sensor module 100 may also be mounted on other portable devices other than the smartphone 110. For example, the sensor module 100 may also be mounted on portable devices such as smart watches, portable activity meters, HMDs (Head Mounted Displays), mobile PCs (Personal Computers), tablet PCs, cameras, and PDAs (Personal Digital Assistants). Thus, the portable device can recognize the posture and behavior of the portable device based on the output data of the sensor module 100, thereby changing the displayed image, issuing a warning sound, an effect sound, or driving a vibration motor to vibrate the main body.

[0204] As described above, in the present embodiment, the sensor module 100 is mounted on a portable device such as the smartphone 110. Therefore, according to the present embodiment, the reliability of the portable device including the sensor module 100 can be improved.

[0205] 3.2. Overview of mobile objects

[0206] Fig.13 It is a perspective view of a moving object as an electronic device according to Embodiment 3, and is a diagram showing a structure of a car 130 as an example of the moving object.

[0207] The automobile 130 is equipped with the sensor module 100 .

[0208] The sensor module 100 detects the posture of the vehicle body 131 and sends output data to the vehicle body posture control device 132. The output data includes an angular velocity signal and an acceleration signal.

[0209] When the vehicle body posture control device 132 that controls the posture of the vehicle body 131 receives the output data of the sensor module 100, it detects the posture of the vehicle body 131 based on the signal, and controls the hardness or softness of the suspension or controls the braking of each wheel 133 according to the detection result.

[0210] The output data of the sensor module 100 can also be flexibly used in ECUs (Electronic Control Units) such as keyless entry systems, engine immobilizers, car navigation systems, car air conditioners, anti-lock braking systems (ABS), airbags, TPMS (Tire Pressure Monitoring System), engine control, control equipment for inertial navigation for autonomous driving, and battery monitors for hybrid vehicles and electric vehicles.

[0211] The sensor module 100 may also be mounted on other mobile bodies other than the automobile 130. Other mobile bodies include, for example, bipedal walking robots, electric trains, radio-controlled airplanes, radio-controlled helicopters, drones, agricultural machinery, and construction machinery. The mobile body equipped with the sensor module 100 can flexibly use the output data of the sensor module 100 for posture control, position measurement, and the like of the mobile body.

[0212] As described above, in the present embodiment, the sensor module 100 is mounted on a moving object such as the automobile 130. Therefore, according to the present embodiment, the reliability of the moving object including the sensor module 100 can be improved.

[0213] Although the preferred embodiment has been described above, the present invention is not limited to the above-described embodiment. The configuration of each part of the present invention can be replaced with an arbitrary configuration that exhibits the same function as the above-described embodiment, and an arbitrary configuration can be added.

Claims

1. A sensor module, characterized in that: have: a first substrate; a second substrate; a connecting portion, electrically connecting the first substrate and the second substrate; A first sensor device, disposed on the first substrate, for detecting a physical quantity of a first axis; as well as The second sensor device is disposed on the second substrate and is used to detect the physical quantity of the first axis.

2. The sensor module according to claim 1, characterized in that: The connecting portion includes a flexible substrate.

3. The sensor module according to claim 1, characterized in that: The driving frequency of the first sensor device is the same as the driving frequency of the second sensor device.

4. The sensor module according to claim 1, characterized in that: The sensor module includes a processing unit provided on the first substrate and configured to process a first detection signal of the first sensor device and a second detection signal of the second sensor device.

5. The sensor module according to claim 4, characterized in that: The sensor module includes a connector provided on the first substrate and electrically connected to the processing unit.

6. The sensor module according to claim 1, characterized in that: have: a third substrate; and A third sensor device is provided on the third substrate and is used to detect a physical quantity of the second axis. The first substrate, the second substrate and the third substrate are respectively formed of hard substrates. The connection portion is composed of a first flexible substrate and a second flexible substrate, wherein one end of the first flexible substrate is connected to the first substrate and the other end is connected to the third substrate, and one end of the second flexible substrate is connected to the third substrate and the other end is connected to the second substrate.

7. The sensor module according to claim 1, characterized in that: The first substrate and the second substrate are arranged opposite to each other.

8. The sensor module according to claim 1, characterized in that: The sensor module includes a fixing portion, and the first substrate and the second substrate are fixed to the fixing portion.

9. The sensor module according to claim 1, characterized in that: The sensor module includes a housing in which the first substrate, the second substrate, and the connecting portion are accommodated.

10. A sensor module, characterized in that: have: a first substrate; A second substrate, disposed on one side of the first substrate; A third substrate, disposed on one side of the first substrate; a first connecting portion, electrically connecting the first substrate and the second substrate; a second connecting portion, electrically connecting the first substrate and the third substrate; A first sensor device, disposed on the second substrate, for detecting a physical quantity of a first axis; as well as The second sensor device is disposed on the third substrate and is used to detect the physical quantity of the first axis.

11. The sensor module according to claim 10, characterized in that: The first connection portion is formed by a first flexible substrate, one end of the first flexible substrate is connected to the second substrate, and the other end of the first flexible substrate is connected to the side of the first substrate. The second connection portion is formed by a second flexible substrate, one end of the second flexible substrate is connected to the third substrate, and the other end of the second flexible substrate is connected to the one side of the first substrate.

12. The sensor module according to claim 10, characterized in that: have: a fourth substrate, opposite to the first substrate; a fifth substrate, opposite to the first substrate; a third connecting portion, electrically connecting the fourth substrate to the second substrate; a fourth connecting portion, electrically connecting the fifth substrate to the third substrate; A third sensor device, disposed on the fourth substrate, for detecting a physical quantity of the second axis; as well as The fourth sensor device is disposed on the fifth substrate and is used to detect the physical quantity of the second axis.

13. The sensor module according to claim 12, characterized in that: The first connection portion is formed by a first flexible substrate, one end of the first flexible substrate is connected to the second substrate, and the other end of the first flexible substrate is connected to the side of the first substrate. The second connection portion is formed by a second flexible substrate, one end of the second flexible substrate is connected to the third substrate, and the other end of the second flexible substrate is connected to the side of the first substrate. The third connection portion is composed of a third flexible substrate, one end of the third flexible substrate is connected to the second substrate, and the other end of the third flexible substrate is connected to the fourth substrate. The fourth connection portion is formed by a fourth flexible substrate, one end of the fourth flexible substrate is connected to the third substrate, and the other end of the fourth flexible substrate is connected to the fifth substrate.

14. The sensor module according to claim 10, characterized in that: The driving frequency of the first sensor device is the same as the driving frequency of the second sensor device.

15. The sensor module according to claim 10, characterized in that: The sensor module includes a processing unit provided on the first substrate and configured to process a first detection signal of the first sensor device and a second detection signal of the second sensor device.

16. The sensor module according to claim 15, characterized in that: The sensor module includes a connector provided on the first substrate and electrically connected to the processing unit.

17. The sensor module according to claim 10, characterized in that: The sensor module includes a fixing portion to which the first substrate, the second substrate, and the third substrate are fixed.

18. The sensor module according to claim 10, characterized in that: The sensor module includes a housing in which the first substrate, the second substrate, the third substrate, the first connection portion, and the second connection portion are accommodated.

19. An electronic device, characterized in that: A sensor module according to any one of claims 1 to 18 is provided.

Images