Material taking platform of photoetching machine

Abstract

The invention discloses a photoetching machine material taking platform, and relates to the technical field of photoetching machines, the photoetching machine material taking platform comprises a material moving seat and a lead screw sliding table capable of controlling the material moving seat to move along a linear path, a mask plate carrying plate and a silicon wafer carrying plate which are distributed in parallel are arranged above the material moving seat, and when the material moving seat slides to a material taking position, the silicon wafer carrying plate is driven by the lead screw sliding table to move along the linear path. And the mask support plate and the silicon wafer support plate can rotate to two sides of the material moving seat in opposite directions. A first material taking seat and a second material taking seat which can ascend and descend are arranged on the two sides of the material moving seat respectively, and the mask plate and the silicon wafer can be ejected to the positions above the mask plate carrier plate and the silicon wafer carrier plate respectively along with ascending of the first material taking seat and the second material taking seat. When the mask plate carrier plate and the silicon wafer carrier plate are located at the material taking station, the mask plate carrier plate and the silicon wafer carrier plate can rotate to the two sides of the material moving base in the opposite directions, so that the mask plate and the silicon wafer are fully exposed, meanwhile, material taking and feeding operation is carried out on the mask plate carrier plate and the silicon wafer carrier plate, hindrance in the material taking and feeding operation process is reduced, and the material changing operation efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of photolithography machines, and in particular to a material taking platform for a photolithography machine. Background Art

[0002] The photolithography machine, also known as the mask alignment exposure machine, exposure system, photolithography system, etc., is a key equipment for manufacturing micro-electromechanical, optoelectronic, and diode large-scale integrated circuits. The photolithography machine can be divided into two types: stepper projection photolithography machine and scanning projection photolithography machine. The main performance indicators are: the size range of the supported substrate, resolution, alignment accuracy, exposure method, light source wavelength, light intensity uniformity, production efficiency, etc. In the actual operation of the photolithography machine, the photolithography machine needs to dynamically adjust the wafer position through a precise focusing and alignment system to ensure that it is within the focusing range of the optical system. For example, the stepper scanning photolithography machine needs to synchronously control the movement of the mask and the wafer during dynamic scanning. At this time, the distance between the two needs to be kept stable to avoid imaging errors.

[0003] In the existing photolithography machines, during the processing, the carriers carrying the mask and the carriers carrying the silicon wafer are mostly distributed in parallel. During the material replacement operation, if it is necessary to perform material replacement operations on the mask and the silicon wafer at the same time, it is necessary to manually move the carrier carrying the mask out, and then perform manual material removal and loading operations on the silicon wafer carrier and the mask carrier in sequence. After the material replacement operation is completed, the mask carrier is reset to align the mask on the mask station with the silicon wafer on the silicon wafer station. In this process, the efficiency of successively carrying out material removal and replacement at the two stations is low, the time consumed by manual operation is long, and the material body is more likely to be damaged due to errors during the manual material removal and loading process. Therefore, the present invention provides a photolithography machine material removal platform to meet the needs. Summary of the invention

[0004] In view of the above problems, the present invention provides a material retrieving platform for a photolithography machine.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a photolithography machine material picking platform, comprising a material moving seat and a lead screw slide which can control the material moving seat to move along a straight path, a mask carrier and a silicon wafer carrier which are distributed in parallel are arranged above the material moving seat, when the material moving seat slides to the material picking position, the mask carrier and the silicon wafer carrier can rotate in opposite directions to the two sides of the material moving seat.

[0006] The two sides of the material transfer seat are respectively provided with a material pick-up seat 1 and a material pick-up seat 2 which can rise and fall. As the material pick-up seat 1 and the material pick-up seat 2 rise, the mask and the silicon wafer can be respectively ejected to above the mask carrier and the silicon wafer carrier.

[0007] An intercepting seat is provided at one end of the lead screw slide, and two limiting brackets symmetrically distributed along a straight path are provided on one side of the intercepting seat close to the material transfer seat. When the mask carrier and the silicon wafer carrier slide to the processing position with the material transfer seat, the mask carrier and the silicon wafer carrier both slide into the inner side of the limiting bracket.

[0008] Furthermore, the bottom ends of the mask carrier and the silicon wafer carrier are respectively fixed with a connecting seat 1 and a connecting seat 2, and the connecting seat 1 is fixedly installed with a same-direction rotating wheel, and the same-direction rotating wheel is connected to a driving rotating wheel distributed parallel to it through a synchronous ruler.

[0009] The second connecting seat is fixedly installed with a reverse gear, and the reverse gear is meshed and connected with a driving gear distributed parallel to it. The driving wheel and the driving gear are distributed from top to bottom and are connected through the same driving shaft. A motor that can control its rotation is provided at the bottom end of the driving shaft. When the driving wheel and the driving gear rotate in the same direction, the same-direction wheel and the reverse gear rotate in opposite directions.

[0010] Furthermore, a support frame is fixed on the material transfer seat, the driving wheel and the driving gear are installed on the inner side of the support frame through the driving shaft, and the same-direction wheel and the reverse gear are installed on the inner side of the support frame from top to bottom through the rotating shaft respectively.

[0011] Furthermore, the bottom ends of the material picking seat 1 and the material picking seat 2 are respectively provided with guide arm 1 and guide arm 2, and one side of the guide arm 1 and the guide arm 2 is provided with vertically arranged teeth, and the teeth located on both sides of the material moving seat are meshed and connected with synchronous gears.

[0012] Furthermore, the two synchronous gears located on both sides of the material moving seat are connected by the same linkage shaft, and the linkage shaft is rotatably installed on the material moving seat through a bearing seat, and the linkage shaft passes under the silicon wafer carrier. A motor that can control the rotation of the linkage shaft and the synchronous gear is fixedly installed on one side of the material moving seat.

[0013] Furthermore, both sides of the material transfer seat are provided with limit seats, and the guide arm 1 and the guide arm 2 are slidably mounted on the limit seats.

[0014] Furthermore, a partition plate distributed along a straight path is fixed at the inner center position of the limiting bracket, and pressure plates are provided on the upper and lower parts of the partition plate. The pressure plates distributed from top to bottom are connected by multiple connecting rods passing through the partition plate, and two pressure springs distributed from top to bottom are provided outside the connecting rods, one end of the pressure spring is fixed to the partition plate, and the other end is fixed to the pressure plate.

[0015] The plate surface of the pressure plate away from the partition plate is fixed with pressure rollers distributed along a straight path. When the mask carrier and the silicon wafer carrier slide into the inner side of the limiting bracket, the two groups of pressure rollers respectively resist the mask carrier and the silicon wafer carrier.

[0016] Furthermore, two groups of limiting rollers distributed from top to bottom are provided on the inner side wall of the limiting bracket. When the mask carrier and the silicon wafer carrier slide into the inner side of the limiting bracket, the two groups of limiting rollers respectively abut against the edges of the mask carrier and the silicon wafer carrier.

[0017] Furthermore, the intercepting seat is provided with two guide frames symmetrically distributed along a straight path on the side opposite to the material transfer seat, and two groups of guide rollers distributed from top to bottom are provided on the inner side of the guide frame. The material transfer seat is provided with a storage cavity for accommodating the guide frame and the guide rollers. When the material transfer seat slides to the processing position, the storage cavity slides and docks with the guide frame and the guide rollers.

[0018] In summary, the technical effects and advantages of the present invention are as follows: 1. When the mask carrier and the silicon wafer carrier in the present invention are located at the material taking station, they can be rotated in opposite directions to the two sides of the material transfer seat, so that the mask and the silicon wafer are fully exposed, and the mask carrier and the silicon wafer carrier are simultaneously subjected to material taking and loading operations, thereby reducing obstacles during the material taking and loading operations and improving the efficiency of the material changing operation.

[0019] 2. The present invention can enable the mask and the silicon wafer to be quickly separated from the mask carrier and the silicon wafer carrier by arranging the material picking seat 1 and the material picking seat 2 on the material picking station, thereby reducing the friction damage to the carrier caused by manually picking up the mask and the silicon wafer. While having a protective effect on the mask and the silicon wafer, it also improves the portability during the material picking operation, which is conducive to the implementation of manual material picking and placing operations. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without paying any creative work.

[0021] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention.

[0022] Figure 2 This is a schematic diagram of the structure from a second angle of the present invention.

[0023] Figure 3 It is a structural schematic diagram of the mask carrier and the silicon wafer carrier of the present invention in the material removal state.

[0024] Figure 4 It is a schematic diagram of the second angle structure of the mask carrier and the silicon wafer carrier in the material removal state of the present invention.

[0025] Figure 5 It is a schematic diagram of the structure of the material taking seat of the present invention.

[0026] Figure 6 This is a schematic diagram of the state when the material taking seat of the present invention moves to the processing position.

[0027] Figure 7 It is a schematic diagram of the positions of the limiting bracket and the guide frame of the present invention.

[0028] Figure 8 For the present invention Figure 7 Enlarged structural diagram at A in the middle.

[0029] Fig. 9 It is a schematic diagram of the local state when the mask carrier and the silicon wafer carrier of the present invention slide into the interior of the limiting bracket.

[0030] Fig.10 For the present invention Fig. 9 Enlarged structural diagram at B in the middle.

[0031] In the figure: 1. Screw slide; 2. Material transfer seat; 3. Mask carrier; 31. Connecting seat 1; 32. Material pick-up seat 1; 33. Guide arm 1; 4. Wafer carrier; 41. Connecting seat 2; 42. Material pick-up seat 2; 43. Guide arm 2; 5. Same direction wheel; 6. Reverse gear; 7. Driving wheel; 8. Synchronous scale belt; 9. Driving gear; 10. Support frame; 11. Synchronous gear; 12. Linkage shaft; 13. Limit seat; 14. Intercepting seat; 15. Guide frame; 16. Guide roller; 17. Limit bracket; 18. Partition plate; 19. Pressure plate; 20. Connecting rod; 21. Pressure spring; 22. Pressure roller; 23. Limit roller. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0033] Example 1: Reference Figure 1 , Figure 2 The material retrieving platform of a photolithography machine shown in the figure comprises a material transfer seat 2 and a screw slide 1 which can control the material transfer seat 2 to move along a straight path. A mask carrier 3 and a silicon wafer carrier 4 are arranged above the material transfer seat 2 in parallel. In the present invention, the movement starting end of the material transfer seat 2 located on the screw slide 1 is directly opposite to the material retrieving station, and the movement end is directly opposite to the processing station of the photolithography machine. When the mask carrier 3 and the silicon wafer carrier 4 are synchronously moved to the processing station, the photolithography processing operation can be performed on the mask carrier 3 and the silicon wafer carrier 4. See Figure 3 , Figure 4As shown, after the processing is completed, the mask carrier 3 and the silicon wafer carrier 4 move to the material taking station along with the material transfer seat 2. At this time, the mask carrier 3 and the silicon wafer carrier 4 can rotate in opposite directions to the two sides of the material transfer seat 2.

[0034] When the mask carrier 3 and the silicon wafer carrier 4 are rotated in opposite directions to the two sides of the material transfer seat 2, the mask and silicon wafer in the mask carrier 3 and the silicon wafer carrier 4 can be fully exposed, and then the material taking and loading operations can be performed on the mask carrier 3 and the silicon wafer carrier 4 at the same time, which reduces the obstacles in the material taking and loading operations, improves the efficiency of the material changing operation, and enables the lithography machine to quickly perform lithography processing operations on the replaced mask and silicon wafer.

[0035] like Figure 3 , Figure 4 As shown, the two sides of the material transfer seat 2 are respectively provided with a material pick-up seat 1 32 and a material pick-up seat 2 42 that can move up and down. When the mask carrier 3 and the silicon wafer carrier 4 rotate in opposite directions to the two sides of the material transfer seat 2, the mask carrier 3 and the silicon wafer carrier 4 correspond to the material pick-up seat 1 32 and the material pick-up seat 2 42 respectively. With the rise of the material pick-up seat 1 32 and the material pick-up seat 2 42, the mask and the silicon wafer can be ejected to the top of the mask carrier 3 and the silicon wafer carrier 4 respectively.

[0036] After the mask and silicon wafer are ejected to the top of the mask carrier 3 and the silicon wafer carrier 4, the mask and silicon wafer can be directly removed, which is conducive to manual material collection and discharge operations. Before the material collection and discharge operations are performed, the mask and silicon wafer can be quickly separated from the mask carrier 3 and the silicon wafer carrier 4, reducing the friction damage caused by the mask and silicon wafer to the carrier during the manual collection process, which has a protective effect on the mask and silicon wafer and improves the portability during the material collection operation.

[0037] like Figure 6 As shown, in order to maintain the accuracy of the position distribution of the mask carrier 3 and the silicon wafer carrier 4 when they are moved to the processing station of the photolithography machine, an interception seat 14 is provided at one end of the lead screw slide 1, and two limit brackets 17 symmetrically distributed along a straight path are provided on the side of the interception seat 14 close to the material transfer seat 2. When the mask carrier 3 and the silicon wafer carrier 4 slide to the processing position with the material transfer seat 2, the mask carrier 3 and the silicon wafer carrier 4 both slide into the inner side of the limit bracket 17 accurately.

[0038] Specifically, Figure 5 , Figure 6 As shown, the bottom ends of the mask carrier 3 and the silicon wafer carrier 4 are respectively fixed with a connecting seat 1 31 and a connecting seat 2 41, and the connecting seat 1 31 is fixedly installed with a same-direction rotating wheel 5, and the same-direction rotating wheel 5 is connected to a driving rotating wheel 7 distributed parallel to it through a synchronous ruler belt 8.

[0039] In order to enable the same-direction rotating wheel 5 and the driving rotating wheel 7 to rotate in opposite directions by carrying the connecting seat 1 31 and the connecting seat 2 41, in the present invention, the connecting seat 2 41 is fixedly mounted with a reverse gear 6, and the reverse gear 6 is meshedly connected with a driving gear 9 distributed parallel thereto. The driving rotating wheel 7 and the driving gear 9 are distributed from top to bottom and are connected by the same driving shaft, and a motor is provided at the bottom end of the driving shaft to control its rotation.

[0040] See also Figure 3 , Figure 4 As shown, when the motor drives the driving shaft to rotate, the driving wheel 7 and the driving gear 9 can be made to rotate in the same direction, so as to achieve the purpose of driving the same-direction wheel 5 and the reverse gear 6 to rotate in opposite directions, until the connecting seat 1 31 and the connecting seat 2 41 respectively carry the mask carrier 3 and the silicon wafer carrier 4 to rotate in opposite directions.

[0041] Furthermore, in order to maintain the stability of the connecting seat 1 31 and the connecting seat 2 41 during the rotation of the mask carrier 3 and the silicon wafer carrier 4, a support frame 10 is fixed on the material transfer seat 2, and the driving wheel 7 and the driving gear 9 are installed on the inner side of the support frame 10 through the driving shaft, and the same-direction wheel 5 and the reverse gear 6 are installed on the inner side of the support frame 10 from top to bottom through the rotating shaft.

[0042] Embodiment 2: Based on embodiment 1, Figure 5 As shown, the bottom ends of the material picking seat 1 32 and the material picking seat 2 42 are provided with a guide arm 1 33 and a guide arm 2 43, respectively. One side of the guide arm 1 33 and the guide arm 2 43 are provided with teeth arranged vertically, and the teeth located on both sides of the material moving seat 2 are meshed and connected with the synchronous gear 11. When the synchronous gear 11 rotates, under the meshing action of itself and the teeth, the guide arm 1 33 and the guide arm 2 43 can respectively carry the material picking seat 1 32 and the material picking seat 2 42 to rise, so as to achieve the purpose of ejecting the mask and the silicon wafer to the top of the mask carrier 3 and the silicon wafer carrier 4.

[0043] It is worth noting that in the present invention, since the heights of the mask carrier 3 and the silicon wafer carrier 4 are different, the heights of the material picker seat 1 32 and the material picker seat 2 42 are also different, and the lengths of the guide arms 1 33, the guide arms 2 43 and the teeth arranged on their sides are also adaptively adjusted according to the heights of the material picker seat 1 32 and the material picker seat 2 42.

[0044] like Figure 5As shown, the two synchronous gears 11 located on both sides of the material transfer seat 2 are connected through the same linkage shaft 12, and the linkage shaft 12 is rotatably mounted on the material transfer seat 2 through a bearing seat, and the linkage shaft 12 passes under the silicon wafer carrier 4, and a motor that can control the linkage shaft 12 and the synchronous gear 11 to rotate is fixedly mounted on one side of the material transfer seat 2. When the motor is running, under the connection of the linkage shaft 12, the two synchronous gears 11 located on both sides of the material transfer seat 2 can be rotated synchronously, so as to achieve the purpose of synchronously rising the meshing guide arm 1 33 and the guide arm 2 43, so that the material picker seat 1 32 and the material picker seat 2 42 can eject the mask and the silicon wafer, further improving the transfer efficiency of the mask and the silicon wafer.

[0045] like Figure 5 As shown, in order to maintain the stability of guide arm 1 33 and guide arm 2 43 during movement, limit seats 13 having a limiting effect on guide arm 1 33 and guide arm 2 43 are provided on both sides of the material transfer seat 2, and guide arm 1 33 and guide arm 2 43 are both slidably installed with the limit seats 13.

[0046] Embodiment 3: Based on Embodiment 1 and Embodiment 2, Figure 6 , Figure 7 and Figure 8 As shown, when the mask carrier 3 and the silicon wafer carrier 4 are synchronously moved to the processing station, slight shaking is likely to occur during the movement. In order to keep the mask carrier 3 and the silicon wafer carrier 4 in a stationary state when they are moved to the processing station, in the present invention, a partition plate 18 distributed along a straight path is fixed at the center position of the inner side of the limit bracket 17, and a pressure plate 19 is provided above and below the partition plate 18. The pressure plates 19 distributed from top to bottom are connected by multiple connecting rods 20 that penetrate the partition plate 18. Two pressure springs 21 distributed from top to bottom are provided outside the connecting rods 20, and one end of the pressure spring 21 is fixed to the partition plate 18, and the other end is fixed to the pressure plate 19.

[0047] Further, such as Fig. 9 , Fig.10 As shown, the plate surface of the pressure plate 19 away from the partition plate 18 is fixed with pressure rollers 22 distributed along a straight path. When the mask carrier 3 and the silicon wafer carrier 4 slide into the inner side of the limiting bracket 17, the mask carrier 3 and the silicon wafer carrier 4 are in sliding contact with the pressure rollers 22. When the mask carrier 3 and the silicon wafer carrier 4 stop sliding, the two groups of pressure rollers 22 are respectively against the mask carrier 3 and the silicon wafer carrier 4.

[0048] The combination of the pressure roller 22, the pressure plate 19, and the pressure spring 21 can effectively buffer the shaking force of the mask carrier 3 and the silicon wafer carrier 4 when the mask carrier 3 and the silicon wafer carrier 4 slide into the inner side of the limit bracket 17, ensuring that the mask carrier 3 and the silicon wafer carrier 4 can maintain a stable state when they stop sliding, so as to achieve the purpose of quickly stabilizing the mask carrier 3 and the silicon wafer carrier 4. In this process, the influence of the shaking force on the photolithography process can be reduced, the accuracy of the position distribution of the mask carrier 3 and the silicon wafer carrier 4 on the processing station is guaranteed, and the accuracy of the photolithography process is guaranteed.

[0049] It is worth mentioning that, in the present invention, the combination of the pressure roller 22, the pressure plate 19, and the pressure spring 21 has a plane correction function for the mask carrier 3 and the silicon wafer carrier 4, ensuring that the mask carrier 3 and the silicon wafer carrier 4 can maintain a horizontal state when they stop sliding. This prevents the mask carrier 3 and the silicon wafer carrier 4 from tilting during long-term use, which affects the photolithography operation, and further ensures the accuracy of the photolithography.

[0050] like Figure 8 As shown, two groups of limit rollers 23 are arranged on the inner side wall of the limit bracket 17 from top to bottom. When the mask carrier 3 and the silicon wafer carrier 4 slide into the inner side of the limit bracket 17, the two groups of limit rollers 23 respectively abut against the edges of the mask carrier 3 and the silicon wafer carrier 4. The setting of the limit rollers 23 can further improve the smoothness of the mask carrier 3 and the silicon wafer carrier 4 during sliding.

[0051] like Figure 6 , Fig. 9 As shown, the intercepting seat 14 is provided with two guide frames 15 symmetrically distributed along a straight path on one side facing the material transfer seat 2, and two sets of guide rollers 16 are provided inside the guide frames 15 distributed from top to bottom, and a storage cavity for accommodating the guide frames 15 and the guide rollers 16 is provided on the material transfer seat 2. When the material transfer seat 2 slides to the processing position, the storage cavity and the guide frames 15 and the guide rollers 16 are slidably docked, so that the material transfer seat 2, the mask carrier 3 and the silicon wafer carrier 4 can be accurately positioned. The setting of the guide rollers 16 can improve the smoothness of the sliding docking between the storage cavity and the guide frame 15.

[0052] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A material retrieving platform for a photolithography machine, comprising a material transfer seat (2) and a lead screw slide (1) capable of controlling the material transfer seat (2) to move along a straight path, characterized in that: A mask carrier (3) and a silicon wafer carrier (4) are arranged in parallel above the material transfer seat (2); when the material transfer seat (2) slides to a material taking position, the mask carrier (3) and the silicon wafer carrier (4) can rotate in opposite directions to two sides of the material transfer seat (2); The two sides of the material transfer seat (2) are respectively provided with a material pick-up seat 1 (32) and a material pick-up seat 2 (42) which can be raised and lowered. As the material pick-up seat 1 (32) and the material pick-up seat 2 (42) rise, the mask and the silicon wafer can be respectively ejected to the top of the mask carrier (3) and the silicon wafer carrier (4); An interception seat (14) is provided at one end of the lead screw slide (1), and two limit brackets (17) are symmetrically distributed along a straight path on one side of the interception seat (14) close to the material transfer seat (2); when the mask carrier (3) and the silicon wafer carrier (4) slide to a processing position with the material transfer seat (2), the mask carrier (3) and the silicon wafer carrier (4) both slide into the inner side of the limit brackets (17).

2. The lithography machine material retrieving platform according to claim 1, characterized in that: A first connection seat (31) and a second connection seat (41) are fixed to the bottom ends of the mask carrier (3) and the silicon wafer carrier (4), respectively; a same-direction rotating wheel (5) is fixedly mounted on the first connection seat (31); and the same-direction rotating wheel (5) is connected to a driving rotating wheel (7) which is distributed parallel thereto via a synchronous ruler (8); The second connecting seat (41) is fixedly mounted with a reverse gear (6), and the reverse gear (6) is meshedly connected with a driving gear (9) arranged in parallel therewith. The driving wheel (7) and the driving gear (9) are arranged from top to bottom and are connected via a common driving shaft. A motor for controlling the rotation of the driving shaft is arranged at the bottom end. When the driving wheel (7) and the driving gear (9) rotate in the same direction, the same-direction wheel (5) and the reverse gear (6) rotate in opposite directions.

3. The lithography machine material retrieving platform according to claim 2, characterized in that: A support frame (10) is fixed on the material transfer seat (2); the driving wheel (7) and the driving gear (9) are mounted on the inner side of the support frame (10) via a driving shaft; and the same-direction wheel (5) and the reverse gear (6) are mounted on the inner side of the support frame (10) from top to bottom via rotating shafts.

4. The lithography machine material retrieving platform according to claim 1, characterized in that: A guide arm 1 (33) and a guide arm 2 (43) are respectively provided at the bottom ends of the material picking seat 1 (32) and the material picking seat 2 (42); one side of the guide arm 1 (33) and the guide arm 2 (43) are provided with vertically arranged teeth; the teeth located on both sides of the material moving seat (2) are meshedly connected with a synchronous gear (11).

5. The material retrieving platform of the photolithography machine according to claim 4, characterized in that: The two synchronous gears (11) located on both sides of the material transfer seat (2) are connected via a common linkage shaft (12); the linkage shaft (12) is rotatably mounted on the material transfer seat (2) via a bearing seat, and the linkage shaft (12) passes through the bottom of the silicon wafer carrier (4); and a motor capable of controlling the rotation of the linkage shaft (12) and the synchronous gear (11) is fixedly mounted on one side of the material transfer seat (2).

6. The material retrieving platform of the photolithography machine according to claim 5, characterized in that: Limiting seats (13) are provided on both sides of the material transfer seat (2), and the first guide arm (33) and the second guide arm (43) are slidably mounted on the limiting seats (13).

7. The material retrieving platform of the photolithography machine according to claim 1, characterized in that: A partition plate (18) distributed along a straight path is fixed at the center position of the inner side of the limiting bracket (17), and pressure plates (19) are provided above and below the partition plate (18). The pressure plates (19) distributed from top to bottom are connected via a plurality of connecting rods (20) penetrating the partition plate (18), and two pressure springs (21) are provided outside the connecting rods (20) distributed from top to bottom, and one end of the pressure spring (21) is fixed to the partition plate (18), and the other end is fixed to the pressure plate (19); The plate surface of the pressure plate (19) away from the partition plate (18) is fixed with pressure rollers (22) distributed along a straight path, and when the mask carrier (3) and the silicon wafer carrier (4) both slide into the inner side of the limiting bracket (17), the two groups of pressure rollers (22) respectively abut against the mask carrier (3) and the silicon wafer carrier (4).

8. The material retrieving platform of the photolithography machine according to claim 7, characterized in that: Two groups of limit rollers (23) are arranged on the inner side wall of the limit bracket (17) and are distributed from top to bottom. When the mask carrier (3) and the silicon wafer carrier (4) slide into the inner side of the limit bracket (17), the two groups of limit rollers (23) respectively abut against the edges of the mask carrier (3) and the silicon wafer carrier (4).

9. The material retrieving platform of the photolithography machine according to claim 1, characterized in that: The intercepting seat (14) is provided with two guide frames (15) symmetrically distributed along a straight path on one side facing the material transfer seat (2); two groups of guide rollers (16) are provided inside the guide frames (15) distributed from top to bottom; a storage cavity for accommodating the guide frames (15) and the guide rollers (16) is provided on the material transfer seat (2); when the material transfer seat (2) slides to the processing position, the storage cavity slides and docks with the guide frames (15) and the guide rollers (16).

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