Semiconductor process chamber and air inlet assembly thereof

Abstract

The invention discloses a semiconductor process chamber and an air inlet assembly thereof, and belongs to the technical field of semiconductors. The air inlet assembly comprises an air inlet pipeline, an air injection part and an air injection connecting piece, the air injection connecting piece and the air injection part are sequentially arranged in the vertical direction, an air inlet channel is formed in the air injection connecting piece, an air injection channel is formed in the air injection part, and the air injection channel is used for being communicated with the interior of a cavity body of the semiconductor process cavity; the air inlet pipeline is connected with the air injection connecting piece, the air inlet pipeline, the air inlet channel and the air injection channel are sequentially communicated, the air inlet channel extends in a first plane, and the first plane intersects with the vertical direction. The semiconductor process chamber comprises a chamber body, an upper electrode assembly and the air inlet assembly, a mounting hole is formed in the top wall of the chamber body, and the air injection component is arranged at the mounting hole. Thus, the height of the air inlet pipeline is reduced, the upper electrode assembly is separated from the air inlet pipeline, and the maintenance process of the upper electrode assembly is prevented from being affected.

Description

Technical Field

[0001] The present application belongs to the field of semiconductor technology, and specifically relates to a semiconductor process chamber and an air intake component thereof. Background Art

[0002] In the field of semiconductor technology, a semiconductor process chamber generally includes a chamber body and a base arranged in the chamber body. The base is used to support wafers. Process gas is introduced into the chamber body by an air intake assembly. Under the excitation of radio frequency power, the process gas is ionized to form plasma, and the plasma processes the wafer on the base.

[0003] In the related art, the air intake assembly includes an air intake pipeline, an air jet component and an air circuit connector. The air jet component is installed on the top wall of the chamber body, the air circuit connector is arranged above the air jet component, and the air circuit connector is connected to the air intake pipeline. An air intake channel is provided inside the air circuit connector, and the air jet component is provided with a jet channel. The air intake pipeline, the air intake channel and the jet channel are connected in sequence, and the jet channel is directly connected to the interior of the chamber body. In this way, the process gas flows through the air intake pipeline, the air intake channel and the jet channel in sequence into the chamber body.

[0004] Since the gas path connector is located above the jet component, and the air inlet channel and the jet channel usually extend in the vertical direction, the air inlet assembly is relatively high in the vertical direction, and the air inlet pipeline is also relatively high in the vertical direction. The upper electrode assembly used to provide RF power is also located above the chamber body, so the air inlet pipeline is located above the upper electrode assembly. When the upper electrode assembly needs to be maintained, the upper electrode assembly moves upward, which will affect the air inlet assembly. Therefore, the air inlet assembly needs to be disassembled before the upper electrode maintenance process can be performed, which makes the upper electrode assembly inconvenient to maintain. Moreover, since the process gas is corrosive, the air inlet pipeline is usually made of stainless steel, so the air inlet pipeline and the upper electrode assembly are prone to form a current loop, affecting the RF uniformity. Summary of the invention

[0005] The purpose of the embodiments of the present application is to provide a semiconductor process chamber and an air intake assembly thereof, which can solve the problem in the related art that the air intake pipeline affects the maintenance process of the upper electrode assembly and affects the RF uniformity.

[0006] In a first aspect, an embodiment of the present application provides an air intake assembly for a semiconductor process chamber, comprising an air intake pipeline, an air jet component and an air jet connector, wherein the air jet connector and the air jet component are arranged in sequence along a vertical direction, an air intake channel is provided inside the air jet connector, and a air jet channel is provided inside the air jet component, and the air jet channel is used to communicate with the interior of a chamber body of the semiconductor process chamber; the air intake pipeline is connected to the air jet connector, and the air intake pipeline, the air intake channel and the air jet channel are connected in sequence, and the air intake channel extends in a first plane, and the first plane intersects with the vertical direction.

[0007] In a second aspect, an embodiment of the present application also provides a semiconductor process chamber, comprising a chamber body, an upper electrode assembly and the above-mentioned air intake assembly, wherein the top wall of the chamber body is provided with a mounting hole, the jet component is arranged at the mounting hole, and the upper electrode assembly is located above the air intake pipeline.

[0008] In the embodiment of the present application, although the jet connector and the jet component are arranged in sequence in the vertical direction, the air inlet channel extends in the first plane, that is, the air inlet channel does not extend in the vertical direction, so the height of the jet connector in the vertical direction is relatively small, and the air inlet pipeline is connected to the air inlet channel, so the height of the air inlet pipeline is also relatively small. By reducing the height of the air inlet pipeline, the upper electrode assembly can be located above the air inlet pipeline, so the upper electrode assembly is separated from the air inlet pipeline to avoid affecting the air inlet pipeline during the movement of the upper electrode assembly for maintenance. In addition, the upper electrode assembly is prevented from contacting the air inlet pipeline, effectively preventing the air inlet pipeline and the upper electrode assembly from forming a current loop, and will not affect the RF uniformity. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 It is a schematic diagram of the structure of the air intake assembly and the upper cover disclosed in the embodiment of the present application;

[0010] Figure 2 is an exploded view of the air intake assembly and the upper cover disclosed in the embodiment of the present application;

[0011] Figure 3 is a top view of the air intake assembly and the upper cover disclosed in the embodiment of the present application;

[0012] Figure 4 yes Figure 3 Sectional view at AA in the middle;

[0013] Figure 5 yes Figure 3 Sectional view at the middle BB;

[0014] Figure 6 yes Figure 3 Sectional view at CC;

[0015] Figure 7 is a schematic structural diagram of a first arc-shaped fixing member disclosed in an embodiment of the present application;

[0016] Figure 8 is a schematic diagram of the structure of the jet connector disclosed in the embodiment of the present application;

[0017] Fig. 9 is a top view of the jet connector disclosed in the embodiment of the present application;

[0018] Fig.10 It is a schematic diagram of the structure of the jetting component disclosed in the embodiment of the present application;

[0019] Fig.11 is a schematic structural diagram of a semiconductor process chamber disclosed in an embodiment of the present application;

[0020] Fig.12 It is a schematic diagram of the structure of a semiconductor process chamber when maintaining an upper electrode assembly disclosed in an embodiment of the present application.

[0021] Description of reference numerals:

[0022] 100-chamber body, 110-upper cover, 111-mounting hole, 111a-step surface, 112-first annular groove, 113-second annular groove, 101-upper surface, 102-outer peripheral surface, 120-chamber body,

[0023] 200-jet component, 210-jet channel, 211-first jet channel, 212-second jet channel, 220-raised shoulder,

[0024] 300-jet connector, 310-intake channel, 311-first intake channel, 312-second intake channel, 320-gas equalizing groove, 321-first gas equalizing groove, 322-second gas equalizing groove, 330-first sealing groove, 340-second sealing groove, 350-third sealing groove,

[0025] 400-intake pipe, 410-first pipe section, 420-second pipe section,

[0026] 510-first jet fixing part, 511-annular protrusion, 512-first protrusion, 501-first arc fixing part, 502-second arc fixing part,

[0027] 520-second jet fixing member, 521-second protrusion,

[0028] 530-Fasteners,

[0029] 610-first seal, 620-second seal, 630-third seal,

[0030] 700-Inlet connection block,

[0031] 800-air supply pipe,

[0032] 900 - upper electrode assembly, 910 - coil, 920 - coil fixing part, 930 - top cover. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the present application to clearly describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the present application belong to the scope of protection of this application.

[0034] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0035] The semiconductor process chamber and its air inlet assembly provided by the embodiments of the present application are described in detail below through specific embodiments and their application scenarios in conjunction with the accompanying drawings.

[0036] Please refer to Figure 1-Figure 12 The gas inlet assembly of the semiconductor process chamber disclosed in the embodiment of the present application includes an inlet pipeline 400, an air jet component 200 and an air jet connector 300, wherein the air jet component 200 is installed on the chamber body 100 of the semiconductor process chamber, the air jet component 200 is used to directly inject process gas into the chamber body 100, and the air jet connector 300 is used to connect the inlet pipeline 400 and the air jet component 200. Optionally, the top wall of the chamber body 100 is provided with a mounting hole 111, and the air jet component 200 is arranged at the mounting hole 111. Further optionally, the chamber body 100 includes an upper cover 110, and the mounting hole 111 is arranged on the upper cover 110. The embodiment of the present application does not specifically limit the structure of the air jet component 200, and it is sufficient to enable the air jet component 200 to be installed on the chamber body 100, so that the air jet component 200 and the chamber body 100 are relatively fixed.

[0037] refer to Figure 4 and Figure 6As shown, the jet connector 300 and the jet component 200 are arranged in sequence along the vertical direction, that is, the jet connector 300 is arranged above the jet component 200. Optionally, the jet connection structure can be a ceramic structural member, the jet connector 300 is provided with an inlet channel 310, and the jet component 200 is provided with an inlet channel 210, and the jet channel 210 is used to communicate with the inside of the chamber body 100 of the semiconductor process chamber; the inlet pipeline 400 is connected to the jet connector 300, and the inlet pipeline 400, the inlet channel 310 and the jet channel 210 are connected in sequence, so that the external process gas enters the chamber body 100 through the inlet pipeline 400, the inlet channel 310 and the jet channel 210 in sequence. Moreover, the inlet channel 310 extends in a first plane, and the first plane intersects with the vertical direction. That is to say, the air intake passage 310 does not extend in the vertical direction, so the height of the jet connector 300 in the vertical direction is relatively small, and the height of the air intake pipeline 400 connected to the jet connector 300 is also relatively small.

[0038] Optionally, the number of the air intake channel 310 may be one, and the air intake channel 310 extends along a certain direction in the first plane; or the number of the air intake channel 310 may be multiple, and each air intake channel 310 extends along a different direction in the first plane.

[0039] In the embodiment of the present application, the air inlet passage 310 does not extend in the vertical direction, so the height of the jet connector 300 in the vertical direction is relatively small, and the height of the air inlet pipeline 400 is also relatively small. By reducing the height of the air inlet pipeline 400, the upper electrode assembly 900 can be located above the air inlet pipeline 400, so the upper electrode assembly 900 is separated from the air inlet pipeline 400, avoiding the upper electrode assembly 900 from affecting the air inlet pipeline 400 during the movement for maintenance, ensuring that the upper electrode assembly 900 can smoothly perform the maintenance process. In addition, the upper electrode assembly 900 is prevented from contacting the air inlet pipeline 400, effectively preventing the air inlet pipeline 400 and the upper electrode assembly 900 from forming a current loop, and will not affect the RF uniformity.

[0040] In an optional embodiment, the first plane is a horizontal plane, that is, Figure 4 and Figure 6 As shown, the air inlet passage 310 extends directly in the horizontal direction. In this way, the height of the jet connector 300 in the vertical direction is further reduced, and the height of the air inlet pipe 400 is further reduced, which is more conducive to separating the air inlet pipe 400 from the upper electrode assembly 900, avoiding the upper electrode assembly 900 from being affected by the air inlet pipe 400 during movement, further avoiding the upper electrode assembly 900 from contacting the air inlet pipe 400, and more effectively avoiding the air inlet pipe 400 and the upper electrode assembly 900 from forming a current loop, thereby ensuring RF uniformity.

[0041] Of course, in other embodiments, the first plane may not be a horizontal plane, that is, the first plane may be an inclined plane.

[0042] In an alternative embodiment, reference Figure 2 As shown, the air intake pipeline 400 includes a first pipe section 410 and a second pipe section 420 connected to each other. The air intake passage 310, the first pipe section 410 and the second pipe section 420 are sequentially connected. The first pipe section 410 extends in the radial direction of the jet connector 300, and the second pipe section 420 extends in the circumferential direction of the jet connector 300. Optionally, when a plurality of air intake passages 310 are provided, the first pipe sections 410 are connected to the air intake passages 310 in a one-to-one correspondence, and each first pipe section 410 extends in a different radial direction of the jet connector 300.

[0043] In this way, the first pipe section 410 and the second pipe section 420 are respectively arranged adjacent to the chamber body 100, and the space occupied by the air intake pipe 400 in the height direction is further reduced, which is beneficial to lowering the height of the air intake pipe 400 relative to the jet connector 300, avoiding the problem of occupying a large space in the height direction due to the setting method of the air intake pipe 400, avoiding the upper electrode assembly 900 from being affected by the air intake pipe 400 during maintenance, avoiding contact between the two, and ensuring RF uniformity.

[0044] Of course, in other embodiments, the first pipe section 410 and the second pipe section 420 of the air intake pipeline 400 may also extend along other directions.

[0045] In an optional embodiment, the number of the intake pipes 400 is at least two, and the first pipe sections 410 of each intake pipe 400 extend in the first plane, that is, each first pipe section 410 extends in the first plane along different radial directions of the jet connector 300, and two adjacent first pipe sections 410 intersect. Optionally, the number of the intake pipes 400 is four, and each intake pipe 400 is evenly distributed in the circumferential direction of the jet connector 300, so that any two adjacent first pipe sections 410 are perpendicular to each other. Of course, the intake pipes 400 can be set to other numbers, and two adjacent first pipe sections 410 can intersect but not be perpendicular; each second pipe section 420 also extends in the same plane.

[0046] In another embodiment, there is a height difference between the second pipe sections 420 of two adjacent air intake pipelines 400, that is, the second pipe sections 420 of two adjacent air intake pipelines 400 do not extend in the same plane. It should be noted that "two adjacent air intake pipelines 400" refer to the air intake pipelines 400 corresponding to two adjacent first pipe sections 410, that is, there is a height difference between the second pipe sections 420 connected to the two adjacent first pipe sections 410. In this way, the second pipe sections 420 of two adjacent air intake pipelines 400 are staggered in the vertical direction, which is convenient for installing each second pipe section 420, and also convenient for supplying air to the two adjacent air intake pipelines 400 from different height positions, so as to avoid the air intake ends of the second pipe sections 420 of the two adjacent air intake pipelines 400 from affecting each other, which is conducive to improving the air intake efficiency.

[0047] Optionally, there is a height difference between the second pipe sections 420 connected to any two adjacent first pipe sections 410, and the height of each second pipe section 420 is smaller than the height of the first plane, so that each second pipe section 420 can take in air from a lower position.

[0048] In an optional embodiment, the number of the air intake pipeline 400, the air intake channel 310 and the air injection channel 210 are all one.

[0049] In another embodiment, the number of the air inlet pipeline 400, the air inlet channel 310 and the jet channel 210 are all multiple, and each air inlet pipeline 400 is arranged at intervals in the circumferential direction of the jet connector 300. In this way, when the air inlet pipeline 400 adopts a metal structure, the formation of a circuit loop that affects the RF uniformity is avoided; each air inlet channel 310 is also arranged at intervals in the circumferential direction of the jet connector 300, and the air inlet pipeline 400 is connected to the air inlet channel 310 in a one-to-one correspondence. Each jet channel 210 is arranged at intervals in the circumferential direction of the jet component 200, and the air inlet channel 310 can be connected to the jet channel 210 in a one-to-one correspondence. Optionally, the number of the air inlet pipeline 400 and the air inlet channel 310 are both four. Of course, the air inlet pipeline 400 and the air inlet channel 310 can also be set to other numbers.

[0050] In yet another embodiment, Figure 4-Figure 6As shown, the jet connector 300 is also provided with a uniform gas groove 320, which is an annular structure, and the uniform gas groove 320 is respectively connected with each inlet channel 310 and each jet channel 210. Optionally, the uniform gas groove 320 is arranged on the side of the jet connector 300 facing the jet component 200, the axis of the uniform gas groove 320 is collinear with the axis of the jet component 200, the lower end of the uniform gas groove 320 is directly opposite to each jet channel 210, so that the uniform gas groove 320 is connected with each jet channel 210, and the upper end of the uniform gas groove 320 is respectively connected with each inlet channel 310. With this embodiment, when multiple inlet channels 310 flow through the process gas at the same time, multiple streams of process gas enter the uniform gas groove 320 at the same time for mixing, which is conducive to uniform mixing of the process gas, and the mixed process gas is further sprayed into the chamber body 100 through multiple jet channels 210, which is conducive to improving the uniformity of spraying and making the plasma in the chamber body 100 more uniform.

[0051] In an optional embodiment, the air intake assembly further includes at least two air supply pipes 800 , the air supply pipes 800 are connected to the air intake pipelines 400 in a one-to-one correspondence, and the air supply pipes 800 are connected to the second pipe sections 420 of the air intake pipelines 400 in a one-to-one correspondence.

[0052] In another embodiment, the second pipe sections 420 of two opposite air intake pipelines 400 extend in the same plane, and the second pipe sections 420 of the two opposite air intake pipelines 400 are connected to the same air supply pipe 800. In this way, each air supply pipe 800 is respectively connected to at least two air intake pipelines 400, and each air supply pipe 800 can supply air to at least two air intake pipelines 400 at the same time, which is conducive to reducing the number of air supply pipes 800 and the number of air supply devices, and simplifying the structure of the air intake assembly. In addition, there is a height difference between the air supply pipes 800 connected by two adjacent air intake pipelines 400, that is, there is a height difference between the air supply pipes 800 connected by the corresponding second pipe sections 420 of the two adjacent first pipe sections 410. Specifically, there is a height difference between the second pipe sections 420 of the two adjacent air intake pipelines 400, and each air supply pipe 800 extends in the same plane with the corresponding second pipe section 420, so there is also a height difference between the air supply pipes 800 connected by the two adjacent air intake pipelines 400. In this way, the air supply pipes 800 connected to two adjacent air intake pipes 400 are staggered in the vertical direction, which is convenient for installing each air supply pipe 800 from different heights, and also convenient for supplying air to the air supply pipes 800 from different heights, avoiding mutual influence between the air supply pipes 800 and improving air supply efficiency.

[0053] Optionally, the number of the air intake pipelines 400 and the air intake channels 310 are both four, and the air intake pipelines 400 are evenly distributed along the circumference of the jet connector 300. The number of the air supply pipes 800 is two, and the air supply pipes 800 extend in the horizontal direction, and the two air supply pipes 800 are perpendicular to each other. The number of the air intake pipelines 400 and the air intake channels 310 can also be six, and the number of the air supply pipes 800 can be three; of course, the air intake pipelines 400, the air intake channels 310, and the air supply pipes 800 can also be set to other numbers.

[0054] In an optional embodiment, if Figure 1-Figure 6 As shown, the air intake assembly further includes a plurality of air intake connection blocks 700, and the air intake pipelines 400 are connected to the air intake connection blocks 700 in a one-to-one correspondence, and each air intake pipeline 400 is connected to the jet connector 300 through the corresponding air intake connection block 700. Further optionally, the end of the air intake pipeline 400 is connected to the air intake connection block 700, and the air intake connection block 700 and the jet connector 300 are fixedly connected by screws or other threaded fasteners. Specifically, the air intake connection block 700 is provided with a first through hole, and the jet connector 300 is provided with a first threaded hole. The threaded fastener penetrates the first through hole and extends into the first threaded hole to connect the air intake connection block 700 to the jet connector 300.

[0055] In an optional embodiment, in combination with Figure 4 and Figure 6 As shown, the plurality of air inlet channels 310 include a plurality of first air inlet channels 311 and a plurality of second air inlet channels 312, and the first air inlet channels 311 and the second air inlet channels 312 are alternately distributed in the circumferential direction of the jet connection 300. Optionally, two first air inlet channels 311 and two second air inlet channels 312 are provided, and the two first air inlet channels 311 are arranged opposite to each other, and the two second air inlet channels 312 are arranged opposite to each other; Fig.10 As shown, the plurality of jet channels 210 include a plurality of first jet channels 211 and a plurality of second jet channels 212, each of the first jet channels 211 and each of the second jet channels 212 are spaced apart in the circumferential direction of the jet component 200, and each of the first jet channels 211 surrounds the outside of the area formed by each of the second jet channels 212. Optionally, the number of the first jet channels 211 is greater than the number of the first air inlet channels 311, and the number of the second jet channels 212 is greater than the number of the second air inlet channels 312.

[0056] like Figure 8As shown, the number of the gas-homogenizing grooves 320 is at least two, including a first gas-homogenizing groove 321 and a second gas-homogenizing groove 322. The first gas-homogenizing groove 321 is arranged around the second gas-homogenizing groove 322, and the first gas-homogenizing groove 321 is located at the periphery of the second gas-homogenizing groove 322. The first gas-homogenizing groove 321 is respectively connected to each first air inlet channel 311 and each first jet channel 211, and the second gas-homogenizing groove 322 is respectively connected to each second air inlet channel 312 and each second jet channel 212. Specifically, as Figure 4 As shown, the upper ends of the first gas-uniform grooves 321 are respectively connected to the first air inlet channels 311, and the lower ends of the first gas-uniform grooves 321 are respectively opposite to and connected to the first air-jet channels 211; Figure 6 As shown, the upper ends of the second air-homogenizing grooves 322 are respectively communicated with the second air inlet channels 312 , and the lower ends of the second air-homogenizing grooves 322 are respectively opposite to and communicated with the second air-jet channels 212 .

[0057] In this embodiment, the first gas equalizing groove 321 evenly mixes the process gases delivered by the multiple first air inlet channels 311. At the same time, the second gas equalizing groove 322 evenly mixes the process gases delivered by the multiple second air inlet channels 312. Therefore, by setting at least two gas equalizing grooves 320, multiple process gases can be fully mixed in different gas equalizing grooves 320, which is beneficial to improving the mixing efficiency and improving the mixing uniformity.

[0058] Optionally, each first air inlet channel 311 is evenly distributed along the circumference of the first air uniforming groove 321, which is beneficial for the first air uniforming groove 321 to fully mix the process gas transported by each first air inlet channel 311, improve the mixing efficiency, and enhance the mixing uniformity; each second air inlet channel 312 is evenly distributed along the circumference of the second air uniforming groove 322, which is beneficial for the second air uniforming groove 322 to fully mix the process gas transported by each second air inlet channel 312, improve the mixing efficiency, and enhance the mixing uniformity.

[0059] Of course, in other embodiments, the jet connector 300 may only be provided with multiple first air inlet channels 311 and first air uniforming grooves 321, and the jet component 200 may only be provided with multiple first jet channels 211; or, the jet connector 300 may only be provided with multiple second air inlet channels 312 and second air uniforming grooves 322, and the jet component 200 may only be provided with multiple second jet channels 212.

[0060] In an alternative embodiment, reference Figure 4-Figure 6As shown, the air intake assembly further includes at least one of a first seal 610, a second seal 620 and a third seal 630, wherein the first seal 610 and the second seal 620 are both arranged between the jet component 200 and the jet connector 300, and the first seal 610 is located between the first gas-uniform groove 321 and the second gas-uniform groove 322, and the second seal 620 and the third seal 630 are both located at the periphery of the second gas-uniform groove 322. Optionally, the third seal 630 is arranged between the chamber body 100 and the jet connector 300. Optionally, the air intake assembly may be provided with one of the first seal 610, the second seal 620 and the third seal 630, or may be provided with two of the first seal 610, the second seal 620 and the third seal 630, or may be provided with the first seal 610, the second seal 620 and the third seal 630 at the same time.

[0061] In this way, the first gas uniforming groove 321 and the second gas uniforming groove 322 can be isolated by the first seal 610 to avoid gas cross-talk between the first gas uniforming groove 321 and the second gas uniforming groove 322; the second seal 620 seals the first gas uniforming groove 321 to prevent leakage of process gas in the first gas uniforming groove 321; the third seal 630 is used to seal the overall structure of the jet connector 300.

[0062] Optionally, the first sealing member 610, the second sealing member 620 and the second sealing member 620 are all sealing rings, and the sealing rings may be rubber sealing rings. Figure 8 As shown, the jet connector 300 is further provided with a first annular sealing groove 330, a second sealing groove 340 and a third sealing groove 350, wherein the first sealing groove 330 is used to place the first sealing member 610, the second sealing groove 340 is used to place the second sealing member 620, and the third sealing groove 350 is used to place the third sealing member 630. The first sealing groove 330 is located between the first gas-uniform groove 321 and the second gas-uniform groove 322, the second sealing groove 340 is located at the periphery of the second gas-uniform groove 322, and the third sealing groove 350 is located at the periphery of the second sealing groove 340. In this way, the structure in which the sealing groove and the sealing member cooperate is adopted, so that the corresponding sealing member can be conveniently installed and removed as needed.

[0063] Of course, in other embodiments, the air inlet assembly may not be provided with the first seal 610, the second seal 620 and the third seal 630, and the jet connector 300 and the jet component 200 may use other structures to achieve a tight fit, thereby avoiding the risk of leakage of process gas between the first gas uniforming groove 321 and the second gas uniforming groove 322, and other structures may also be used to achieve a tight fit between the jet connector 300 and the chamber body 100.

[0064] In an optional embodiment, if Fig.10As shown, the outer surface of the gas injection component 200 is provided with a raised shoulder 220, which is used to cooperate with the step surface 111a of the chamber body 100 disposed in the semiconductor process chamber in the vertical direction, and the gas injection connector 300 can press the raised shoulder 220 against the step surface 111a. Figure 4-Figure 6 As shown, the mounting hole 111 is a stepped hole, and the hole wall of the stepped hole includes a stepped surface 111a perpendicular to the axis of the stepped hole, and the raised shoulder 220 is in upper limit contact with the stepped surface 111a in the vertical direction, that is, the raised shoulder 220 is directly overlapped with the stepped surface 111a; the upper end surface of the jet component 200 is flush with the upper surface 101 of the chamber body 100, and when the jet connector 300 is arranged on the upper surface 101 of the chamber body 100, the jet connector 300 directly presses the jet component 200.

[0065] Optionally, the step surface 111 a and the raised shoulder 220 are both annular structures, so that the step surface 111 a and the raised shoulder 220 do not need to be specifically aligned, which facilitates the injection component 200 to extend into the step hole.

[0066] In this embodiment, the jet component 200 and the chamber body 100 are directly limited by the step surface 111a and the raised shoulder 220, so that the jet component 200 is fixed relative to the chamber body 100. The structure is simple and there is no need to separately set up a structural part connecting the jet component 200 and the chamber body 100.

[0067] Of course, in other embodiments, the mounting hole 111 may not be provided with the step surface 111 a , the jet component 200 may not be provided with the raised shoulder 220 , and the jet component 200 may be mounted on the upper cover 110 of the chamber body 100 in other ways.

[0068] In an optional embodiment, the jet connector 300 and the chamber body 100 may be fixedly connected by welding or other methods.

[0069] In another embodiment, the air intake assembly further includes a first jet fixing member 510 and a second jet fixing member 520, and the first jet fixing member 510, the jet connection member 300 and the second jet fixing member 520 are arranged in sequence in the vertical direction, that is, the first jet fixing member 510 is located below the jet connection member 300, and the second jet fixing member 520 is located above the jet connection member 300. The first jet fixing member 510 is used to connect the chamber body 100 of the semiconductor process chamber, and the first jet fixing member 510 and the second jet fixing member 520 are connected by a fastener 530 to fix the jet connection member 300. This embodiment does not limit the structure of the first jet fixing member 510 and the second jet fixing member 520, and the jet connection member 300 can be clamped and fixed between the two. Among them, the fastener 530 can be a threaded fastener such as a screw. Optionally, the second jet fixing member 520 is provided with a second through hole, the first jet fixing member 510 is provided with a second threaded hole, and the fastener 530 passes through the second through hole and extends into the second threaded hole.

[0070] According to the present embodiment, the first jet fixing member 510 and the second jet fixing member 520 are directly used to clamp and fix the jet connector 300. There is no need to perform welding or other connection operations on the jet connector 300 and the chamber body 100, and the connection method is simple. Moreover, the connection is achieved through the fastener 530, and the jet connector 300 can be installed or removed by screwing as needed.

[0071] In an optional embodiment, Figure 2 As shown, the first jet fixing member 510 includes a first arc-shaped fixing member 501 and a second arc-shaped fixing member 502 connected to each other. The first arc-shaped fixing member 501 and the second arc-shaped fixing member 502 form an annular structure, and the annular structure is arranged around the jet component 200. The inner wall surface of the first arc-shaped fixing member 501 and the inner wall surface of the second arc-shaped fixing member 502 are both provided with an arc-shaped protrusion 511, and the arc-shaped protrusion 511 is used to cooperate with the chamber body 100 in the upper limit direction in the vertical direction.

[0072] Alternatively, if Figure 2 As shown, the outer wall of the chamber body 100 is provided with a first annular groove 112, and the first arc-shaped fixing member 501 and the second arc-shaped fixing member 502 extend into the first annular groove 112 respectively. Figure 4-Figure 6 As shown, the side wall of the first annular groove 112 is further provided with a second annular groove 113, the arc-shaped protrusion 511 of the first arc-shaped fixing member 501 and the arc-shaped protrusion 511 of the second arc-shaped fixing member 502 extend into the second annular groove 113, and the arc-shaped protrusion 511 and the groove wall surface of the second annular groove 113 are matched in the upper limit position in the arrangement direction of the jet component 200 and the jet connector 300. Optionally, the arc-shaped protrusion 511 and the chamber body 100 are in upper limit position contact in the arrangement direction of the jet component 200 and the jet connector 300.

[0073] According to this embodiment, the arc-shaped protrusion 511 is used to realize that the first arc-shaped fixing member 501 and the second arc-shaped fixing member 502 are respectively limitedly matched with the chamber body 100 at any position along their circumference, thereby ensuring the connection stability of the first jet fixing member 510. Moreover, the structure for fixing the first jet fixing member 510 is simple, and there is no need to separately set a structural member connecting the first jet fixing member 510 and the chamber body 100, nor is there any need to perform welding or other connection operations on the first jet fixing member 510 and the chamber body 100.

[0074] In an optional embodiment, Figure 2 As shown, the first jet fixing member 510 includes a first arc-shaped fixing member 501 and a second arc-shaped fixing member 502 connected to each other. The first arc-shaped fixing member 501 and the second arc-shaped fixing member 502 form an annular structure, and the annular structure is arranged around the jet component 200. One of the first arc-shaped fixing member 501 and the second arc-shaped fixing member 502 is provided with a first protrusion 512, and the second jet fixing member 520 is provided with a second protrusion 521. The first protrusion 512 and the second protrusion 521 are connected to each other by a fastener 530.

[0075] In another embodiment, the first arc-shaped fixing member 501 and the second arc-shaped fixing member 502 are respectively provided with a plurality of first protrusions 512 at intervals along their own circumferences, and the second jet fixing member 520 is provided with a plurality of second protrusions 521 at intervals along their own circumferences, and the first protrusions 512 correspond to the second protrusions 521 one by one, and each first protrusion 512 is respectively connected to the corresponding second protrusion 521 through a fastener 530. Optionally, the first protrusion 512 protrudes from the upper end surface of the first arc-shaped fixing member 501 or the second arc-shaped fixing member 502, and the second protrusion 521 protrudes from the lower end surface of the second jet fixing member 520, and an avoidance groove is provided on the edge of the jet connecting member 300, and the first protrusion 512 and the second protrusion 521 can extend into the avoidance groove, and the avoidance groove corresponds to the second protrusion 521 one by one.

[0076] According to the present embodiment, by providing a plurality of first protrusions 512 and a plurality of second protrusions 521, the first jet fixing member 510 and the second jet fixing member 520 can be connected by a plurality of fasteners 530, that is, different positions of the first jet fixing member 510 are respectively connected to different positions of the second jet fixing member 520, which is conducive to clamping and fixing various positions of the jet connecting member 300, ensuring the stability of the jet connecting member 300, and further ensuring that the jet connecting member 300 is fixed relative to the jet component 200.

[0077] Based on the gas inlet assembly disclosed in the present application, the present application embodiment also discloses a semiconductor process chamber, and the semiconductor process equipment includes a chamber body 100, an upper electrode assembly, and the semiconductor process chamber in the above embodiment. Among them, the chamber body 100 serves as the installation base of the gas inlet assembly and the upper electrode assembly 900, the chamber body 100 is used to provide the process environment required for the etching process gas, the gas inlet assembly is used to provide the process gas to the inside of the chamber body 100, and the upper electrode assembly 900 is used to generate an electric field to excite the process gas in the chamber body 100 to generate plasma, and the surface of the wafer is etched using the plasma.

[0078] The top of the chamber body 100 is provided with a mounting hole 111, and the jet component 200 is arranged at the mounting hole 111. Optionally, the chamber body 100 includes an upper cover 110, and the mounting hole 111 is arranged on the upper cover 110. The mounting hole 111 can be located at the center of the upper cover 110, and the upper cover 110 has an upper surface 101 and an outer peripheral surface 102. The first pipe section 410 of the air intake pipeline 400 is arranged adjacent to the upper surface 101, and the first pipe section 410 extends in a direction parallel to the upper surface 101, that is, the first pipe section 410 extends in a horizontal direction; the second pipe section 420 is located at the periphery of the outer peripheral surface 102, and the second pipe section 420 extends along the circumference of the outer peripheral surface 102.

[0079] Further optionally, if Fig.11 and Fig.12 As shown, the chamber body 100 further includes a chamber body 120 , an upper end of the chamber body 120 is provided with an opening, and an upper cover 110 is disposed at the opening to close the chamber body 120 .

[0080] It should be noted that the portion where the air intake pipe 400 is connected to the jet connector 300 usually extends in a horizontal direction, so the height of the inlet end of the air intake channel 310 determines the height of this portion of the air intake pipe 400. If the height of this portion of the air intake pipe 400 is relatively large, the air intake pipe 400 will easily affect the maintenance process of the upper electrode assembly 900; if the height of this portion of the air intake pipe 400 is relatively small, the air intake pipe 400 will not easily affect the maintenance process of the upper electrode assembly 900.

[0081] refer to Fig.11 and Fig.12As shown, the upper electrode assembly 900 is located above the chamber body 100, and the upper electrode assembly 900 includes a coil 910, and the coil 910 is located above the air intake pipe 400. Optionally, the upper electrode assembly 900 also includes a top cover 930 and a coil fixing member 920, the coil fixing member 920 is arranged on the top cover 930, and the coil 910 is installed on the coil fixing member 920. When the upper electrode assembly 900 needs maintenance, the upper electrode assembly 900 moves up relative to the chamber body 100. At this time, due to the small height of the air intake pipe 400, the upper electrode assembly 900 is not easily affected during the upward movement, ensuring that the upper electrode assembly 900 can be smoothly maintained.

[0082] In this way, by changing the structure of the air intake assembly, the upper electrode assembly 900 of the semiconductor process chamber is separated from the air intake pipeline 400. Even if the upper electrode assembly 900 is moved upward for maintenance, it will not affect the air intake pipeline 400, ensuring that the upper electrode assembly 900 can be smoothly maintained. In addition, the upper electrode assembly 900 is prevented from contacting the air intake pipeline 400, effectively preventing the air intake pipeline 400 and the upper electrode assembly 900 from forming a current loop, and will not affect the RF uniformity.

[0083] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. An air intake assembly for a semiconductor process chamber, characterized in that: The invention comprises an air intake pipeline (400), an air injection component (200) and an air injection connector (300), wherein the air injection connector (300) and the air injection component (200) are arranged in sequence along the vertical direction, an air intake channel (310) is provided inside the air injection connector (300), and an air injection channel (210) is provided inside the air injection component (200), and the air injection channel (210) is used to communicate with the inside of a chamber body (100) of the semiconductor process chamber; the air intake pipeline (400) is connected to the air injection connector (300), and the air intake pipeline (400), the air intake channel (310) and the air injection channel (210) are connected in sequence, and the air intake channel (310) extends in a first plane, and the first plane intersects with the vertical direction.

2. The air intake assembly according to claim 1, characterized in that: The air intake pipeline (400) comprises a first pipe section (410) and a second pipe section (420) which are connected to each other. The air intake channel (310), the first pipe section (410) and the second pipe section (420) are connected in sequence. The first pipe section (410) extends in the radial direction of the air jet connector (300), and the second pipe section (420) extends in the circumferential direction of the air jet connector (300).

3. The air intake assembly according to claim 2, characterized in that: The number of the air intake pipelines (400) is at least two, each of the first pipe sections (410) extends in the first plane, and two adjacent first pipe sections (410) intersect, and there is a height difference between the second pipe sections (420) of two adjacent air intake pipelines (400).

4. The air intake assembly according to claim 3, characterized in that: The air intake assembly further comprises at least two air supply pipes (800), the second pipe sections (420) of the two opposite air intake pipelines (400) extending in the same plane, and the second pipe sections (420) of the two opposite air intake pipelines (400) being connected to the same air supply pipe (800), and there being a height difference between the air supply pipes (800) connected to the two adjacent air intake pipelines (400).

5. The air intake assembly according to claim 1, characterized in that: The number of the air intake pipeline (400), the air intake channel (310) and the jet channel (210) are all multiple, and the air intake pipelines (400) and the air intake channels (310) are arranged at intervals in the circumferential direction of the jet connector (300). The air intake pipelines (400) are connected to the air intake channels (310) in a one-to-one correspondence, and the jet channels (210) are arranged at intervals in the circumferential direction of the jet component (200). The jet connection piece (300) is further provided with an air-homogenizing groove (320), the air-homogenizing groove (320) being an annular structure, and the air-homogenizing groove (320) is respectively connected to each of the air inlet channels (310) and each of the jet channels (210).

6. The air intake assembly according to claim 5, characterized in that The plurality of air inlet channels (310) include a plurality of first air inlet channels (311) and a plurality of second air inlet channels (312), the first air inlet channels (311) and the second air inlet channels (312) being alternately distributed in the circumferential direction of the air jet connector (300), the plurality of air jet channels (210) include a plurality of first air jet channels (211) and a plurality of second air jet channels (212), each of the first air jet channels (211) and each of the second air jet channels (212) being spaced apart in the circumferential direction of the air jet component (200), and each of the first air jet channels (211) surrounds the outside of an area formed by each of the second air jet channels (212), The number of the gas homogenizing grooves (320) is at least two, including a first gas homogenizing groove (321) and a second gas homogenizing groove (322); the first gas homogenizing groove (321) is arranged around the second gas homogenizing groove (322); the first gas homogenizing groove (321) is respectively connected to each of the first air inlet channels (311) and each of the first jet channels (211); and the second gas homogenizing groove (322) is respectively connected to each of the second air inlet channels (312) and each of the second jet channels (212).

7. The air intake assembly according to claim 6, characterized in that: The air intake assembly further comprises at least one of a first seal (610), a second seal (620) and a third seal (630), wherein: The first seal (610) and the second seal (620) are both arranged between the jet component (200) and the jet connector (300), and the first seal (610) is located between the first gas uniformizing groove (321) and the second gas uniformizing groove (322), and the second seal (620) and the third seal (630) are both located on the periphery of the second gas uniformizing groove (322).

8. The air intake assembly according to claim 1, characterized in that The outer surface of the gas injection component (200) is provided with a raised shoulder (220), and the raised shoulder (220) is used to cooperate with a step surface (111a) of a chamber body (100) arranged in the semiconductor process chamber in a vertical limit direction, and the gas injection connector (300) can press the raised shoulder (220) against the step surface (111a).

9. The air intake assembly according to claim 1, characterized in that: The air intake assembly further comprises a first jet fixing member (510) and a second jet fixing member (520), wherein the first jet fixing member (510), the jet connecting member (300) and the second jet fixing member (520) are arranged in sequence in a vertical direction, wherein the first jet fixing member (510) is used to connect the chamber body (100) of the semiconductor process chamber, and the first jet fixing member (510) and the second jet fixing member (520) are connected to each other via a fastener (530) to fix the jet connecting member (300).

10. The air intake assembly according to claim 9, characterized in that The first jet fixing member (510) includes a first arc-shaped fixing member (501) and a second arc-shaped fixing member (502) connected to each other, wherein the first arc-shaped fixing member (501) and the second arc-shaped fixing member (502) form an annular structure, and the annular structure is arranged around the jet component (200). The inner wall surface of the first arc-shaped fixing member (501) and the inner wall surface of the second arc-shaped fixing member (502) are both provided with an arc-shaped protrusion (511), and the arc-shaped protrusion (511) is used to cooperate with the chamber body (100) in the upper limit direction in the vertical direction.

11. The air intake assembly according to claim 9, characterized in that: The first jet fixing member (510) comprises a first arc-shaped fixing member (501) and a second arc-shaped fixing member (502) connected to each other, wherein the first arc-shaped fixing member (501) and the second arc-shaped fixing member (502) form an annular structure, wherein the annular structure is arranged around the jet component (200), and the first arc-shaped fixing member (501) and the second arc-shaped fixing member (502) are respectively provided with a plurality of first protrusions (512) spaced apart along their own circumferences, and the second jet fixing member (520) is provided with a plurality of second protrusions (521) spaced apart along their own circumferences, wherein the first protrusions (512) correspond to the second protrusions (521) one by one, and each of the first protrusions (512) is respectively connected to the corresponding second protrusion (521) through the fastener (530).

12. The air intake assembly according to claim 1, characterized in that The first plane is a horizontal plane.

13. A semiconductor process chamber, characterized in that: It comprises a chamber body (100), an upper electrode assembly (900) and an air intake assembly according to any one of claims 1 to 12, wherein the top wall of the chamber body (100) is provided with a mounting hole (111), and the jet component (200) is arranged at the mounting hole (111); the upper electrode assembly (900) is located above the air intake pipeline (400).

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