Semiconductor process chamber and gas inlet assembly therefor

Abstract

This application discloses a semiconductor process chamber and its air intake assembly, belonging to the field of semiconductor technology. The air intake assembly includes an air intake pipe, a jetting component, and a jetting connector. The jetting connector and the jetting component are arranged sequentially in a vertical direction. The jetting connector has an air intake channel inside, and the jetting component has a jetting channel inside, which communicates with the interior of the semiconductor process chamber body. The air intake pipe is connected to the jetting connector, and the air intake pipe, air intake channel, and jetting channel are sequentially connected. The air intake channel extends in a first plane, which intersects the vertical direction. The semiconductor process chamber includes a chamber body, an upper electrode assembly, and the aforementioned air intake assembly. The top wall of the chamber body has a mounting hole, and the jetting component is disposed at the mounting hole. This reduces the height of the air intake pipe and separates the upper electrode assembly from the air intake pipe, avoiding interference with the maintenance process of the upper electrode assembly.

Description

Technical Field

[0001] This application belongs to the field of semiconductor technology, specifically relating to a semiconductor process chamber and its air intake assembly. Background Technology

[0002] In the field of semiconductor technology, a semiconductor process chamber typically includes a chamber body and a base disposed within the chamber body. The base is used to support the wafer. Process gas is introduced into the chamber body using an inlet assembly. Under the excitation of radio frequency power, the process gas is ionized to form plasma, which processes the wafer on the base.

[0003] In related technologies, the air intake assembly includes an air intake pipe, an air jet component, and an air path connector. The air jet component is installed on the top wall of the chamber body, and the air path connector is located above the air jet component and connected to the air intake pipe. The air path connector has an air intake channel inside, and the air jet component has an air jet channel. The air intake pipe, air intake channel, and air jet channel are connected in sequence, and the air jet channel is directly connected to the interior of the chamber body. In this way, the process gas flows through the air intake pipe, air intake channel, and air jet channel in sequence into the chamber body.

[0004] Because the gas path connectors are located above the jet components, and the intake and jet channels typically extend vertically, the intake assembly and intake piping are both quite tall vertically. Since the upper electrode assembly, which provides RF power, is also located above the chamber body, the intake piping is positioned above it. When maintenance of the upper electrode assembly is required, it must be moved upwards, which affects the intake assembly. Therefore, the intake assembly must be disassembled before maintenance of the upper electrode assembly can be performed, making maintenance inconvenient. Furthermore, because the process gases are corrosive, and the intake piping is typically made of stainless steel, a current loop can easily form between the intake piping and the upper electrode assembly, affecting RF uniformity. Summary of the Invention

[0005] The purpose of this application is to provide a semiconductor process chamber and its air intake assembly, which can solve the problems in the related art where the air intake pipeline affects the maintenance process of the upper electrode assembly and affects radio frequency uniformity.

[0006] In a first aspect, embodiments of this application provide an air intake assembly for a semiconductor process chamber, including an air intake pipe, an air jet component, and an air jet connector. The air jet connector and the air jet component are arranged sequentially in a vertical direction. The air jet connector has an air intake channel inside, and the air jet component has an air jet channel inside. The air jet channel is used to communicate with the interior of the chamber body of the semiconductor process chamber. The air intake pipe is connected to the air jet connector, and the air intake pipe, the air intake channel, and the air jet channel are connected sequentially. The air intake channel extends in a first plane, and the first plane intersects the vertical direction.

[0007] Secondly, embodiments of this application also provide a semiconductor process chamber, including a chamber body, an upper electrode assembly, and the aforementioned air intake assembly. The top wall of the chamber body is provided with a mounting hole, the jetting component is disposed at the mounting hole, and the upper electrode assembly is located above the air intake pipe.

[0008] In this embodiment, although the jet connector and the jet component are arranged sequentially in the vertical direction, the air intake channel extends within the first plane, meaning it does not extend vertically. Therefore, the height of the jet connector in the vertical direction is relatively small. Since the air intake pipe is connected to the air intake channel, its height is also relatively small. By reducing the height of the air intake pipe, the upper electrode assembly can be positioned above the air intake pipe, thus separating the upper electrode assembly from the air intake pipe and preventing it from affecting the air intake pipe during maintenance. Furthermore, preventing the upper electrode assembly from contacting the air intake pipe effectively avoids the formation of a current loop between the air intake pipe and the upper electrode assembly, thus not affecting radio frequency uniformity. Attached Figure Description

[0009] Figure 1 This is a schematic diagram of the air intake assembly and the top cover disclosed in the embodiments of this application;

[0010] Figure 2 This is an exploded view of the air intake assembly and the top cover disclosed in the embodiments of this application;

[0011] Figure 3 This is a top view of the air intake assembly and the top cover disclosed in the embodiments of this application;

[0012] Figure 4 yes Figure 3 Sectional view at point AA;

[0013] Figure 5 yes Figure 3 Sectional view at point BB;

[0014] Figure 6 yes Figure 3 Sectional view at CC;

[0015] Figure 7 This is a schematic diagram of the structure of the first arc-shaped fastener disclosed in the embodiments of this application;

[0016] Figure 8 This is a schematic diagram of the structure of the jet connector disclosed in the embodiments of this application;

[0017] Figure 9 This is a top view of the jet connector disclosed in the embodiments of this application;

[0018] Figure 10 This is a schematic diagram of the structure of the jet component disclosed in the embodiments of this application;

[0019] Figure 11 This is a schematic diagram of the structure of the semiconductor process chamber disclosed in the embodiments of this application;

[0020] Figure 12 This is a schematic diagram of the structure of the semiconductor process chamber when maintaining the upper electrode assembly, as disclosed in the embodiments of this application.

[0021] Explanation of reference numerals in the attached figures:

[0022] 100 - Chamber body, 110 - Top cover, 111 - Mounting hole, 111a - Stepped surface, 112 - First annular slot, 113 - Second annular slot, 101 - Upper surface, 102 - Outer peripheral surface, 120 - Chamber body

[0023] 200 - Jet component, 210 - Jet passage, 211 - First jet passage, 212 - Second jet passage, 220 - Protruding shoulder

[0024] 300 - Jet connector; 310 - Intake channel; 311 - First intake channel; 312 - Second intake channel; 320 - Air distribution groove; 321 - First air distribution groove; 322 - Second air distribution groove; 330 - First sealing groove; 340 - Second sealing groove; 350 - Third sealing groove.

[0025] 400 - Intake pipe, 410 - First pipe section, 420 - Second pipe section

[0026] 510 - First jet fixing component, 511 - Annular protrusion, 512 - First protrusion, 501 - First arc-shaped fixing component, 502 - Second arc-shaped fixing component.

[0027] 520 - Second jet fixing element, 521 - Second protrusion,

[0028] 530-Fasteners

[0029] 610 - First seal, 620 - Second seal, 630 - Third seal

[0030] 700-Intake Connector Block

[0031] 800-Gas supply pipe

[0032] 900 - Upper electrode assembly, 910 - Coil, 920 - Coil holder, 930 - Top cover. Detailed Implementation

[0033] The technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application are within the scope of protection of this application.

[0034] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0035] The semiconductor process chamber and its air intake assembly provided in this application will be described in detail below with reference to the accompanying drawings, through specific embodiments and application scenarios.

[0036] Please refer to Figures 1-12 The gas inlet assembly of the semiconductor process chamber disclosed in this application includes an gas inlet pipe 400, a jetting component 200, and a jetting connector 300. The jetting component 200 is installed on the chamber body 100 of the semiconductor process chamber and is used to directly inject process gas into the chamber body 100. The jetting connector 300 is used to connect the gas inlet pipe 400 and the jetting component 200. Optionally, the top wall of the chamber body 100 is provided with a mounting hole 111, and the jetting component 200 is disposed at the mounting hole 111. Further optionally, the chamber body 100 includes a top cover 110, and the mounting hole 111 is disposed on the top cover 110. This application does not impose specific limitations on the structure of the jetting component 200; it is sufficient that the jetting component 200 is installed on the chamber body 100, achieving relative fixation between the jetting component 200 and the chamber body 100.

[0037] refer to Figure 4 and Figure 6As shown, the jet connector 300 and the jet component 200 are arranged sequentially in the vertical direction, that is, the jet connector 300 is positioned above the jet component 200. Optionally, the jet connection structure can be a ceramic structural component. The jet connector 300 has an air inlet channel 310 inside, and the jet component 200 has an air inlet channel 210 inside. The air inlet channel 210 is used to communicate with the interior of the chamber body 100 of the semiconductor process chamber. The air inlet pipe 400 is connected to the jet connector 300, and the air inlet pipe 400, the air inlet channel 310, and the jet channel 210 are connected sequentially. In this way, the external process gas enters the chamber body 100 sequentially through the air inlet pipe 400, the air inlet channel 310, and the jet channel 210. Moreover, the air inlet channel 310 extends in a first plane, and the first plane intersects the vertical direction. In other words, since the air intake passage 310 does not extend in a vertical direction, the height of the jet connector 300 in the vertical direction is relatively small, and the height of the air intake pipe 400 connected to the jet connector 300 is also relatively small.

[0038] Optionally, the number of intake channels 310 can be one, which extends along a certain direction in the first plane; or, the number of intake channels 310 can be multiple, with each intake channel 310 extending along different directions in the first plane.

[0039] In this embodiment, the air intake channel 310 does not extend vertically. Therefore, the height of the jet connector 300 in the vertical direction is relatively small, and the height of the air intake pipe 400 is also relatively small. By reducing the height of the air intake pipe 400, the upper electrode assembly 900 can be located above the air intake pipe 400. Thus, the upper electrode assembly 900 is separated from the air intake pipe 400, preventing the upper electrode assembly 900 from affecting the air intake pipe 400 during maintenance and ensuring the smooth maintenance process of the upper electrode assembly 900. Moreover, by preventing the upper electrode assembly 900 from contacting the air intake pipe 400, a current loop is effectively avoided between the air intake pipe 400 and the upper electrode assembly 900, thus not affecting radio frequency uniformity.

[0040] In an optional embodiment, the first plane is a horizontal plane, i.e., as shown below. Figure 4 and Figure 6 As shown, the intake channel 310 extends directly in the horizontal direction. In this way, the height of the jet connector 300 in the vertical direction is further reduced, and the height of the intake pipe 400 is also further reduced. This is more conducive to separating the intake pipe 400 from the upper electrode assembly 900, avoiding the influence of the intake pipe 400 on the upper electrode assembly 900 during its movement, further preventing the upper electrode assembly 900 from contacting the intake pipe 400, and more effectively preventing the intake pipe 400 from forming a current loop with the upper electrode assembly 900, thus ensuring radio frequency uniformity.

[0041] Of course, in other embodiments, the first plane may not be a horizontal plane, that is, the first plane may be an inclined plane.

[0042] In an optional embodiment, refer to Figure 2 As shown, the intake pipe 400 includes a first pipe section 410 and a second pipe section 420 connected together. The intake passage 310, the first pipe section 410, and the second pipe section 420 are sequentially connected. The first pipe section 410 extends radially along the jet connector 300, and the second pipe section 420 extends circumferentially along the jet connector 300. Optionally, when multiple intake passages 310 are provided, the first pipe section 410 is connected to each intake passage 310 in a one-to-one correspondence, and each first pipe section 410 extends radially along a different direction of the jet connector 300.

[0043] Thus, the first pipe section 410 and the second pipe section 420 are respectively arranged adjacent to the chamber body 100, and the space occupied by the air intake pipe 400 in the height direction is further reduced. This helps to reduce the height of the air intake pipe 400 relative to the jet connector 300, avoids the problem of occupying a large space in the height direction due to the arrangement of the air intake pipe 400, avoids the upper electrode assembly 900 being affected by the air intake pipe 400 during maintenance, avoids contact between the two, and ensures radio frequency uniformity.

[0044] Of course, in other embodiments, the first section 410 and the second section 420 of the intake pipe 400 may also extend in other directions.

[0045] In one optional embodiment, there are at least two intake pipes 400, and the first pipe segment 410 of each intake pipe 400 extends in a first plane, that is, each first pipe segment 410 extends in the first plane along different radial directions of the jet connector 300, and adjacent two first pipe segments 410 intersect. Optionally, there are four intake pipes 400, and each intake pipe 400 is evenly distributed in the circumferential direction of the jet connector 300, such that any two adjacent first pipe segments 410 are perpendicular. Of course, the number of intake pipes 400 can be set to other numbers, and adjacent two first pipe segments 410 may intersect but not be perpendicular; each second pipe segment 420 also extends in the same plane.

[0046] In another embodiment, there is a height difference between the second pipe segments 420 of two adjacent intake pipes 400, meaning that the second pipe segments 420 of two adjacent intake pipes 400 do not extend in the same plane. It should be noted that "two adjacent intake pipes 400" refers to the intake pipes 400 corresponding to two adjacent first pipe segments 410, meaning there is a height difference between the second pipe segments 420 connected to the two adjacent first pipe segments 410. Thus, the second pipe segments 420 of two adjacent intake pipes 400 are vertically staggered, facilitating the installation of each second pipe segment 420 and allowing air to be supplied to the two adjacent intake pipes 400 from different height positions. This avoids mutual interference between the intake ends of the second pipe segments 420 of the two adjacent intake pipes 400, which helps improve intake efficiency.

[0047] Optionally, there is a height difference between any two adjacent first pipe sections 410 connected to the second pipe sections 420, and the height of each second pipe section 420 is less than the height of the first plane, so that each second pipe section 420 can take in air from a lower position.

[0048] In one optional embodiment, the number of intake pipe 400, intake passage 310 and jet passage 210 is one.

[0049] In another embodiment, there are multiple intake pipes 400, intake channels 310, and jet channels 210. Each intake pipe 400 is spaced apart circumferentially around the jet connector 300. This arrangement avoids the formation of circuit loops that could affect radio frequency uniformity, especially when the intake pipes 400 are metal. Each intake channel 310 is also spaced apart circumferentially around the jet connector 300, with each intake pipe 400 and intake channel 310 corresponding to and connected to the other. Similarly, each jet channel 210 is spaced apart circumferentially around the jet component 200, and each intake channel 310 can correspond to and connect to the other. Optionally, there are four intake pipes 400 and four intake channels 310. Of course, other numbers of intake pipes 400 and intake channels 310 can also be used.

[0050] In another embodiment, such as Figures 4-6As shown, the jet connector 300 is also provided with a gas equalization groove 320, which is an annular structure and is connected to each air inlet channel 310 and each jet channel 210. Optionally, the gas equalization groove 320 is located on the side of the jet connector 300 facing the jet component 200, the axis of the gas equalization groove 320 is collinear with the axis of the jet component 200, the lower end of the gas equalization groove 320 is directly opposite to each jet channel 210, realizing the connection between the gas equalization groove 320 and each jet channel 210, and the upper end of the gas equalization groove 320 is connected to each air inlet channel 310. In this embodiment, when multiple air inlet channels 310 simultaneously flow with process gas, multiple streams of process gas simultaneously enter the gas equalization groove 320 for mixing, which is beneficial for uniform mixing of process gas. The mixed process gas is further injected into the chamber body 100 through multiple jet channels 210, which is beneficial for improving the uniformity of injection and making the plasma in the chamber body 100 more uniform.

[0051] In one optional embodiment, the air intake assembly further includes at least two air supply pipes 800, which are connected one-to-one with the air intake pipe 400, and are connected one-to-one with the second pipe segment 420 of the air intake pipe 400.

[0052] In another embodiment, the second segments 420 of two opposing air intake pipes 400 extend in the same plane, and the second segments 420 of the two opposing air intake pipes 400 are connected to the same air supply pipe 800. Thus, each air supply pipe 800 is connected to at least two air intake pipes 400, and each air supply pipe 800 can simultaneously supply air to at least two air intake pipes 400. This helps reduce the number of air supply pipes 800 and the number of air supply devices, simplifying the structure of the air intake assembly. Furthermore, there is a height difference between the air supply pipes 800 connected to adjacent air intake pipes 400; that is, there is a height difference between the air supply pipes 800 connected to adjacent first segments 410 through their corresponding second segments 420. Specifically, there is a height difference between the second segments 420 of adjacent air intake pipes 400, and each air supply pipe 800 extends in the same plane with its corresponding connected second segment 420; therefore, there is also a height difference between the air supply pipes 800 connected to adjacent air intake pipes 400. In this way, the air supply pipes 800 connected to the two adjacent air intake pipes 400 are staggered in the vertical direction, which makes it convenient to install each air supply pipe 800 from different height positions, and also makes it convenient to supply air to the air supply pipes 800 from different height positions, avoiding mutual interference between the air supply pipes 800 and improving the air supply efficiency.

[0053] Optionally, there are four intake pipes 400 and four intake channels 310. The intake pipes 400 are evenly distributed around the circumference of the jet connector 300. There are two air supply pipes 800, which extend horizontally and are perpendicular to each other. Alternatively, there can be six intake pipes 400 and six intake channels 310, and three air supply pipes 800. Of course, the number of intake pipes 400, intake channels 310, and air supply pipes 800 can also be set to other quantities.

[0054] In optional embodiments, such as Figures 1-6 As shown, the intake assembly also includes multiple intake connection blocks 700. Each intake pipe 400 is connected to one intake connection block 700, and each intake pipe 400 is connected to the jet connector 300 via a corresponding intake connection block 700. Further optionally, the end of the intake pipe 400 is connected to the intake connection block 700, and the intake connection block 700 and the jet connector 300 are fixedly connected using screws or other threaded fasteners. Specifically, the intake connection block 700 has a first through hole, and the jet connector 300 has a first threaded hole. The threaded fastener passes through the first through hole and extends into the first threaded hole, thus connecting the intake connection block 700 and the jet connector 300.

[0055] In an optional embodiment, combined with Figure 4 and Figure 6 As shown, the plurality of air intake channels 310 include a plurality of first air intake channels 311 and a plurality of second air intake channels 312. The first air intake channels 311 and the second air intake channels 312 are alternately distributed in the circumferential direction of the jet connector 300. Optionally, two of each of the first air intake channels 311 and the second air intake channels 312 are provided, with the two first air intake channels 311 arranged opposite each other and the two second air intake channels 312 arranged opposite each other; as shown Figure 10 As shown, the plurality of jet channels 210 includes a plurality of first jet channels 211 and a plurality of second jet channels 212. Each first jet channel 211 and each second jet channel 212 is distributed at intervals in the circumferential direction of the jet component 200, and each first jet channel 211 surrounds the area formed by each second jet channel 212. Optionally, the number of first jet channels 211 is greater than the number of first air intake channels 311, and the number of second jet channels 212 is greater than the number of second air intake channels 312.

[0056] like Figure 8As shown, there are at least two equalizing troughs 320, including a first equalizing trough 321 and a second equalizing trough 322. The first equalizing trough 321 is arranged around the second equalizing trough 322, and is located on the periphery of the second equalizing trough 322. The first equalizing trough 321 is connected to each of the first air intake channels 311 and each of the first jet channels 211, respectively. The second equalizing trough 322 is connected to each of the second air intake channels 312 and each of the second jet channels 212, respectively. Specifically, as... Figure 4 As shown, the upper end of the first air distribution groove 321 is connected to each of the first air intake channels 311, and the lower end of the first air distribution groove 321 is opposite to and connected to each of the first jet channels 211; as shown Figure 6 As shown, the upper end of the second air distribution groove 322 is connected to each of the second air intake channels 312, and the lower end of the second air distribution groove 322 is opposite to and connected to each of the second jet channels 212.

[0057] In this embodiment, the first gas equalization tank 321 uniformly mixes the process gases delivered by the multiple first gas inlet channels 311, while the second gas equalization tank 322 uniformly mixes the process gases delivered by the multiple second gas inlet channels 312. Therefore, by setting at least two gas equalization tanks 320, multiple process gases can be fully mixed in different gas equalization tanks 320, which is beneficial to improving mixing efficiency and mixing uniformity.

[0058] Optionally, each of the first air intake channels 311 is evenly distributed along the circumference of the first air equalization groove 321. This facilitates the first air equalization groove 321 to fully mix the process gas conveyed by each of the first air intake channels 311, thereby improving mixing efficiency and mixing uniformity. Similarly, each of the second air intake channels 312 is evenly distributed along the circumference of the second air equalization groove 322. This facilitates the second air equalization groove 322 to fully mix the process gas conveyed by each of the second air intake channels 312, thereby improving mixing efficiency and mixing uniformity.

[0059] Of course, in other embodiments, the jet connector 300 may only have multiple first air intake channels 311 and first air equalization grooves 321, and the jet component 200 may only have multiple first jet channels 211; or, the jet connector 300 may only have multiple second air intake channels 312 and second air equalization grooves 322, and the jet component 200 may only have multiple second jet channels 212.

[0060] In an optional embodiment, refer to Figures 4-6As shown, the air intake assembly further includes at least one of a first seal 610, a second seal 620, and a third seal 630. The first seal 610 and the second seal 620 are both disposed between the jet component 200 and the jet connector 300. The first seal 610 is located between the first air distribution groove 321 and the second air distribution groove 322, while the second seal 620 and the third seal 630 are both located around the second air distribution groove 322. Optionally, the third seal 630 is disposed between the chamber body 100 and the jet connector 300. Optionally, the air intake assembly may include one of the first seal 610, the second seal 620, and the third seal 630, or two of the first seal 610, the second seal 620, and the third seal 630, or all three seals simultaneously.

[0061] Thus, the first sealing member 610 can isolate the first gas equalization groove 321 and the second gas equalization groove 322, preventing gas from flowing between the first gas equalization groove 321 and the second gas equalization groove 322; the second sealing member 620 seals the first gas equalization groove 321 to prevent the process gas in the first gas equalization groove 321 from leaking; the third sealing member 630 is used to seal the overall structure of the jet connection member 300.

[0062] Optionally, the first seal 610, the second seal 620, and the second seal 620 are all sealing rings, which can be rubber sealing rings. Further optionally, such as... Figure 8 As shown, the jet connector 300 also includes an annular first sealing groove 330, a second sealing groove 340, and a third sealing groove 350. The first sealing groove 330 is used to house the first sealing element 610, the second sealing groove 340 is used to house the second sealing element 620, and the third sealing groove 350 is used to house the third sealing element 630. The first sealing groove 330 is located between the first air-regulating groove 321 and the second air-regulating groove 322, the second sealing groove 340 is located around the second air-regulating groove 322, and the third sealing groove 350 is located around the second sealing groove 340. This structure, where the sealing grooves and sealing elements mate, facilitates the installation and removal of the corresponding sealing elements as needed.

[0063] Of course, in other embodiments, the air intake assembly may not be provided with the first seal 610, the second seal 620 and the third seal 630. The jet connector 300 and the jet component 200 may be tightly fitted using other structures, thereby avoiding the risk of leakage of process gas from the first gas equalization groove 321 and the second gas equalization groove 322. The jet connector 300 and the chamber body 100 may also be tightly fitted using other structures.

[0064] In optional embodiments, such as Figure 10As shown, the outer surface of the jet component 200 is provided with a raised shoulder 220. The raised shoulder 220 is used to engage vertically with the stepped surface 111a of the chamber body 100 disposed in the semiconductor process chamber, and the jet connector 300 can press the raised shoulder 220 against the stepped surface 111a. Optionally, as Figures 4-6 As shown, the mounting hole 111 is a stepped hole, and the hole wall of the stepped hole includes a stepped surface 111a perpendicular to the axis of the stepped hole. The protruding shoulder 220 is in upper limit contact with the stepped surface 111a in the vertical direction, that is, the protruding shoulder 220 directly overlaps the stepped surface 111a. The upper end face of the jet component 200 is flush with the upper surface 101 of the chamber body 100. When the jet connector 300 is disposed on the upper surface 101 of the chamber body 100, the jet connector 300 directly presses against the jet component 200.

[0065] Optionally, both the stepped surface 111a and the raised shoulder 220 are annular structures, so that the stepped surface 111a and the raised shoulder 220 do not need to be specially aligned, making it easier for the jet component 200 to extend into the stepped hole.

[0066] In this embodiment, the jet component 200 and the chamber body 100 are directly matched through the stepped surface 111a and the protruding shoulder 220, so that the jet component 200 is fixed relative to the chamber body 100. The structure is simple and there is no need to set up a separate structural component to connect the jet component 200 and the chamber body 100.

[0067] Of course, in other embodiments, the mounting hole 111 may not have a stepped surface 111a, the jet component 200 may not have a protruding shoulder 220, and the jet component 200 may be mounted on the upper cover 110 of the chamber body 100 in other ways.

[0068] In one optional embodiment, the jet connector 300 and the chamber body 100 can be fixedly connected by welding or other means.

[0069] In another embodiment, the air intake assembly further includes a first jet fixing member 510 and a second jet fixing member 520. The first jet fixing member 510, the jet connector 300, and the second jet fixing member 520 are arranged sequentially in the vertical direction. That is, the first jet fixing member 510 is located below the jet connector 300, and the second jet fixing member 520 is located above the jet connector 300. The first jet fixing member 510 is used to connect the chamber body 100 of the semiconductor process chamber, and the first jet fixing member 510 and the second jet fixing member 520 are connected by a fastener 530 to fix the jet connector 300. This embodiment does not limit the structure of the first jet fixing member 510 and the second jet fixing member 520, as long as it can clamp and fix the jet connector 300 between them. The fastener 530 can be a screw or other threaded fastener. Optionally, the second jet fixing member 520 is provided with a second through hole, and the first jet fixing member 510 is provided with a second threaded hole. The fastener 530 passes through the second through hole and extends into the second threaded hole.

[0070] In this embodiment, the jet connector 300 is directly clamped and fixed by the first jet fixing component 510 and the second jet fixing component 520, eliminating the need for welding or other connection operations between the jet connector 300 and the chamber body 100, making the connection method simple. Moreover, the connection is achieved through the fastener 530, and the jet connector 300 can be installed or removed by screwing as needed.

[0071] In one alternative embodiment, such as Figure 2 As shown, the first jet fixing member 510 includes a first arc-shaped fixing member 501 and a second arc-shaped fixing member 502 connected together. The first arc-shaped fixing member 501 and the second arc-shaped fixing member 502 form an annular structure. The annular structure is arranged around the jet component 200. The inner wall surface of the first arc-shaped fixing member 501 and the inner wall surface of the second arc-shaped fixing member 502 are provided with arc-shaped protrusions 511. The arc-shaped protrusions 511 are used to engage with the chamber body 100 in the vertical direction.

[0072] Optionally, such as Figure 2 As shown, the outer wall of the chamber body 100 is provided with a first annular groove 112, and the first arc-shaped fixing member 501 and the second arc-shaped fixing member 502 respectively extend into the first annular groove 112. Moreover, as Figures 4-6 As shown, the sidewall of the first annular slot 112 is also provided with a second annular slot 113. The arc-shaped protrusion 511 of the first arc-shaped fixing member 501 and the arc-shaped protrusion 511 of the second arc-shaped fixing member 502 extend into the second annular slot 113, and the arc-shaped protrusion 511 and the groove wall surface of the second annular slot 113 are in upper limit engagement with each other in the arrangement direction of the jet component 200 and the jet connector 300. Optionally, the arc-shaped protrusion 511 is in upper limit contact with the chamber body 100 in the arrangement direction of the jet component 200 and the jet connector 300.

[0073] In this embodiment, the arc-shaped protrusion 511 enables the first arc-shaped fixing member 501 and the second arc-shaped fixing member 502 to respectively engage with the chamber body 100 at any position along their circumference, ensuring the connection stability of the first jet fixing member 510. Moreover, the structure for fixing the first jet fixing member 510 is simple, requiring no separate structural components to connect the first jet fixing member 510 and the chamber body 100, and eliminating the need for welding or other connection operations between the first jet fixing member 510 and the chamber body 100.

[0074] In one alternative embodiment, such as Figure 2 As shown, the first jet fixing member 510 includes a first arc-shaped fixing member 501 and a second arc-shaped fixing member 502 connected together. The first arc-shaped fixing member 501 and the second arc-shaped fixing member 502 form an annular structure, which surrounds the jet component 200. One of the first arc-shaped fixing member 501 and the second arc-shaped fixing member 502 is provided with a first protrusion 512, and the second jet fixing member 520 is provided with a second protrusion 521. The first protrusion 512 and the second protrusion 521 are connected by a fastener 530.

[0075] In another embodiment, the first arc-shaped fixing member 501 and the second arc-shaped fixing member 502 are respectively provided with a plurality of first protrusions 512 at intervals along their circumference, and the second jet fixing member 520 is provided with a plurality of second protrusions 521 distributed at intervals along its circumference. The first protrusions 512 and the second protrusions 521 correspond one-to-one, and each first protrusion 512 is connected to the corresponding second protrusion 521 by a fastener 530. Optionally, the first protrusions 512 protrude from the upper end surface of the first arc-shaped fixing member 501 or the second arc-shaped fixing member 502, and the second protrusions 521 protrude from the lower end surface of the second jet fixing member 520. The edge of the jet connector 300 is provided with a relief groove, and the first protrusions 512 and the second protrusions 521 can extend into the relief groove, and the relief groove corresponds one-to-one with the second protrusions 521.

[0076] In this embodiment, by providing multiple first protrusions 512 and multiple second protrusions 521, the first jet fixing member 510 and the second jet fixing member 520 can be connected by multiple fasteners 530. That is, different positions of the first jet fixing member 510 are connected to different positions of the second jet fixing member 520, which is beneficial for clamping and fixing the various positions of the jet connector 300, ensuring the stability of the jet connector 300, and thus ensuring that the jet connector 300 is fixed relative to the jet component 200.

[0077] Based on the air intake assembly disclosed in this application, embodiments of this application also disclose a semiconductor process chamber. The semiconductor process equipment includes a chamber body 100, an upper electrode assembly, and the semiconductor process chamber described in the above embodiments. The chamber body 100 serves as the mounting base for the air intake assembly and the upper electrode assembly 900. The chamber body 100 provides the process environment required for etching process gases. The air intake assembly supplies process gases into the interior of the chamber body 100. The upper electrode assembly 900 generates an electric field to excite the process gases within the chamber body 100 to generate plasma, which is then used to etch the surface of the wafer.

[0078] The top of the chamber body 100 is provided with a mounting hole 111, and the jet component 200 is disposed at the mounting hole 111. Optionally, the chamber body 100 includes a top cover 110, the mounting hole 111 is disposed on the top cover 110, the mounting hole 111 may be located at the center of the top cover 110, and the top cover 110 has an upper surface 101 and an outer peripheral surface 102. The first pipe section 410 of the intake pipe 400 is disposed adjacent to the upper surface 101, and the first pipe section 410 extends in a direction parallel to the upper surface 101, that is, the first pipe section 410 extends in a horizontal direction; the second pipe section 420 is located on the periphery of the outer peripheral surface 102, and the second pipe section 420 extends circumferentially along the outer peripheral surface 102.

[0079] Further optional, such as Figure 11 and Figure 12 As shown, the chamber body 100 also includes a chamber body 120, the upper end of which is provided with an opening, and a cover 110 is provided at the opening to close the chamber body 120.

[0080] It should be noted that the part connecting the intake pipe 400 and the jet connector 300 usually extends horizontally. Therefore, the height of the inlet end of the intake channel 310 determines the height of this part of the intake pipe 400. If the height of this part of the intake pipe 400 is large, the intake pipe 400 may easily affect the maintenance process of the upper electrode assembly 900; if the height of this part of the intake pipe 400 is small, the intake pipe 400 may not easily affect the maintenance process of the upper electrode assembly 900.

[0081] refer to Figure 11 and Figure 12As shown, the upper electrode assembly 900 is located above the chamber body 100. The upper electrode assembly 900 includes a coil 910, which is located above the intake pipe 400. Optionally, the upper electrode assembly 900 also includes a top cover 930 and a coil fixing member 920. The coil fixing member 920 is disposed on the top cover 930, and the coil 910 is mounted on the coil fixing member 920. When the upper electrode assembly 900 needs maintenance, the upper electrode assembly 900 moves upward relative to the chamber body 100. At this time, because the height of the intake pipe 400 is relatively small, the upper electrode assembly 900 is not easily affected during the upward movement, ensuring that the upper electrode assembly 900 can be maintained smoothly.

[0082] This configuration, by altering the structure of the intake assembly, separates the upper electrode assembly 900 of the semiconductor process chamber from the intake pipe 400. Even if the upper electrode assembly 900 is moved upwards for maintenance, it will not be affected by the intake pipe 400, ensuring the smooth maintenance process of the upper electrode assembly 900. Furthermore, by preventing the upper electrode assembly 900 from contacting the intake pipe 400, a current loop is effectively avoided between the two, thus preventing any impact on RF uniformity.

[0083] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. An air intake assembly for a semiconductor process chamber, characterized in that, The device includes an air intake pipe (400), a jet component (200), and a jet connector (300). The jet connector (300) and the jet component (200) are arranged sequentially in the vertical direction. The jet connector (300) has an air intake channel (310) inside, and the jet component (200) has a jet channel (210) inside. The jet channel (210) is used to communicate with the interior of the chamber body (100) of the semiconductor process chamber. The air intake pipe (400) is connected to the jet connector (300), and the air intake pipe (400), the air intake channel (310), and the jet channel (210) are connected sequentially. The air intake channel (310) extends in a first plane, which intersects the vertical direction, so that the air intake pipe (400) is located below the upper electrode assembly (900) of the semiconductor process chamber.

2. The intake assembly according to claim 1, characterized in that, The intake pipe (400) includes a first pipe section (410) and a second pipe section (420) connected together. The intake passage (310), the first pipe section (410) and the second pipe section (420) are connected in sequence. The first pipe section (410) extends radially along the jet connector (300), and the second pipe section (420) extends circumferentially along the jet connector (300).

3. The intake assembly according to claim 2, characterized in that, The number of intake pipes (400) is at least two, each of the first pipe segments (410) extends in the first plane, and two adjacent first pipe segments (410) intersect, and there is a height difference between the second pipe segments (420) of two adjacent intake pipes (400).

4. The intake assembly according to claim 3, characterized in that, The air intake assembly further includes at least two air supply pipes (800), the second pipe segments (420) of the two opposite air intake pipes (400) extend in the same plane, and the second pipe segments (420) of the two opposite air intake pipes (400) are connected to the same air supply pipe (800), and there is a height difference between the air supply pipes (800) connected to the two adjacent air intake pipes (400).

5. The intake assembly according to claim 1, characterized in that, There are multiple intake pipes (400), intake channels (310), and jet channels (210). Each intake pipe (400) and each intake channel (310) is spaced apart circumferentially on the jet connector (300). Each intake pipe (400) and each intake channel (310) is connected in a one-to-one correspondence. Each jet channel (210) is spaced apart circumferentially on the jet component (200). The jet connector (300) is also provided with a uniform air groove (320), which is an annular structure and is connected to each of the air inlet channels (310) and each of the jet channels (210).

6. The intake assembly according to claim 5, characterized in that, The plurality of air intake channels (310) include a plurality of first air intake channels (311) and a plurality of second air intake channels (312), the first air intake channels (311) and the second air intake channels (312) being alternately distributed in the circumferential direction of the jet connector (300). The plurality of jet channels (210) include a plurality of first jet channels (211) and a plurality of second jet channels (212), each of the first jet channels (211) and each of the second jet channels (212) being spaced apart in the circumferential direction of the jet component (200), and each of the first jet channels (211) surrounding the area formed by each of the second jet channels (212). The number of the air equalization grooves (320) is at least two, including a first air equalization groove (321) and a second air equalization groove (322). The first air equalization groove (321) is arranged around the second air equalization groove (322). The first air equalization groove (321) is connected to each of the first air intake channels (311) and each of the first air jet channels (211). The second air equalization groove (322) is connected to each of the second air intake channels (312) and each of the second air jet channels (212).

7. The intake assembly according to claim 6, characterized in that, The intake assembly further includes at least one of a first seal (610), a second seal (620), and a third seal (630), wherein: The first seal (610) and the second seal (620) are both disposed between the jet component (200) and the jet connector (300), and the first seal (610) is located between the first gas equalization groove (321) and the second gas equalization groove (322), while the second seal (620) and the third seal (630) are both located on the periphery of the second gas equalization groove (322).

8. The intake assembly according to claim 1, characterized in that, The outer surface of the jet component (200) is provided with a raised shoulder (220), which is used to engage with the stepped surface (111a) of the chamber body (100) disposed in the semiconductor process chamber in the vertical direction, and the jet connector (300) can press the raised shoulder (220) against the stepped surface (111a).

9. The intake assembly according to claim 1, characterized in that, The air intake assembly further includes a first jet fixing member (510) and a second jet fixing member (520). The first jet fixing member (510), the jet connector (300) and the second jet fixing member (520) are arranged sequentially in the vertical direction. The first jet fixing member (510) is used to connect the chamber body (100) of the semiconductor process chamber, and the first jet fixing member (510) and the second jet fixing member (520) are connected by fasteners (530) to fix the jet connector (300).

10. The intake assembly according to claim 9, characterized in that, The first jet fixing member (510) includes a first arc-shaped fixing member (501) and a second arc-shaped fixing member (502) connected together. The first arc-shaped fixing member (501) and the second arc-shaped fixing member (502) form an annular structure. The annular structure surrounds the jet component (200). The inner wall surface of the first arc-shaped fixing member (501) and the inner wall surface of the second arc-shaped fixing member (502) are provided with arc-shaped protrusions (511). The arc-shaped protrusions (511) are used to engage with the chamber body (100) in the vertical direction.

11. The intake assembly according to claim 9, characterized in that, The first jet fixing member (510) includes a first arc-shaped fixing member (501) and a second arc-shaped fixing member (502) connected together. The first arc-shaped fixing member (501) and the second arc-shaped fixing member (502) form an annular structure. The annular structure surrounds the jet component (200). The first arc-shaped fixing member (501) and the second arc-shaped fixing member (502) are respectively provided with a plurality of first protrusions (512) spaced apart along their own circumference. The second jet fixing member (520) is provided with a plurality of second protrusions (521) spaced apart along its own circumference. The first protrusions (512) correspond one-to-one with the second protrusions (521). Each first protrusion (512) is connected to the corresponding second protrusion (521) through the fastener (530).

12. The intake assembly according to claim 1, characterized in that, The first plane is a horizontal plane.

13. A semiconductor process chamber, characterized in that, The device includes a chamber body (100), an upper electrode assembly (900), and an air intake assembly as described in any one of claims 1-12. The top wall of the chamber body (100) is provided with a mounting hole (111), and the jet component (200) is disposed at the mounting hole (111). The upper electrode assembly (900) is located above the air intake pipe (400).

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