A packaging method and device for a self-regulating chip

Abstract

The present invention relates to the technical field of chip packaging, and specifically provides a packaging method and device for a self-adjusting chip, including: providing a packaging device, obtaining the initial coordinate values of the chip on the fixture platform, and obtaining the surface features of the chip, combining the initial coordinate values and surface features to obtain first positioning data; controlling the spraying component to perform spraying treatment on the chip and adjusting the spraying path; controlling the rotating platform to rotate by a preset angle, and obtaining second positioning data after the chip rotates; controlling the heat curing component to perform heat curing treatment around the chip based on the second positioning data to form a packaging protective layer; performing performance testing and adjustment on the packaging protective layer until the packaging protective layer reaches a preset packaging effect. This application effectively solves the problems of insufficient accuracy and poor packaging in the existing packaging methods, and improves the stability and reliability of the packaging process.

Description

Technical Field

[0001] The present invention relates to the technical field of chip packaging, and in particular to a packaging method and device for a self-regulating chip. Background Art

[0002] With the continuous advancement of semiconductor technology, the functions of integrated circuit chips are becoming increasingly powerful, and the degree of integration is constantly improving. In this context, chip packaging technology has also developed rapidly. Packaging plays a role in protecting chips from external environmental influences and provides functions such as electrical connection and heat dissipation. A self-regulating chip is an intelligent chip that can automatically adjust its performance or behavior according to changes in the external environment or internal working conditions. How to achieve efficient packaging of such chips has become an important topic in the field of packaging technology. Self-regulating chips have a high degree of integration, complex structure, and sensitive surface features, so the requirements for accuracy and reliability during their packaging process are relatively stringent.

[0003] The existing chip packaging method is a fixed packaging path and parameter setting, but due to factors such as chip surface irregularities, position errors, and temperature fluctuations, the existing packaging process is often difficult to achieve precise consistency, which can easily lead to poor packaging or unstable performance. For example, there may be tiny defects or unevenness on the chip surface, which will cause deviations during the spraying or thermal curing process, thereby affecting the quality of the packaging protective layer. In addition, as the size of self-adjusting chips decreases and packaging requirements increase, the existing manual adjustment and control methods cannot effectively solve these problems.

[0004] Therefore, how to dynamically adjust packaging parameters during the chip packaging process, especially the spraying path and thermal curing angle, has become a difficult problem that needs to be solved urgently in the technical field. Summary of the invention

[0005] The main purpose of the present invention is to provide a packaging method for a self-regulating chip, aiming to overcome the technical problem that the prior art cannot adjust the packaging parameters according to the surface characteristics of the chip.

[0006] In order to achieve the above-mentioned invention problem, the present invention proposes a packaging method of a self-regulating chip, the method comprising:

[0007] A packaging device is provided, the packaging device comprising a rotating platform, a spraying component and a heat curing component, the rotating platform comprises a plurality of fixture platforms, the spraying component and the heat curing component are arranged above the fixture platforms at intervals;

[0008] Acquire the initial coordinate value of the chip on the fixture platform, and acquire the surface features of the chip, and combine the initial coordinate value and the surface features to obtain first positioning data;

[0009] Control the spraying component to spray the chip, obtain the position offset of the chip during the spraying process based on the first positioning data, and adjust the spraying path based on the position offset;

[0010] Control the rotating platform to rotate by a preset angle, and obtain the new coordinate values and new surface features of the chip after rotation to obtain the second positioning data;

[0011] Based on the second positioning data, control the thermal curing component to perform thermal curing treatment around the chip to form a packaging protective layer;

[0012] Perform performance testing on the packaging protective layer. If the packaging protective layer does not reach the preset packaging effect, adjust the thermal curing angle of the thermal curing component until the packaging protective layer reaches the preset packaging effect.

[0013] Further, the step of obtaining the initial coordinate values of the chip on the jig platform, obtaining the surface features of the chip, and combining the initial coordinate values and surface features to obtain the first positioning data includes:

[0014] Perform positioning processing on the chip to obtain the initial coordinate values of the chip on the jig platform. The initial coordinate values include the coordinate values of the chip on the X, Y, and Z axes;

[0015] According to the initial coordinate values of the chip, calculate the relative positions between the chip and the jig platforms on the jig platform to generate a relative position matrix;

[0016] Perform scanning processing on the chip surface to obtain surface feature data of the chip surface. The surface feature data includes but is not limited to the undulation height and surface roughness of the chip surface;

[0017] Fuse the undulation height and surface roughness to generate an influence coefficient matrix;

[0018] Perform comprehensive processing on the relative position matrix and the influence coefficient matrix to obtain the first positioning data, where the first positioning data includes the optimized coordinate values of the chip.

[0019] Further, the step of controlling the spraying component to spray the chip, obtaining the position offset of the chip during the spraying process based on the first positioning data, and adjusting the spraying path based on the position offset includes:

[0020] Initialize the spraying path of the spraying component according to the first positioning data, and spray the chip according to the spraying path;

[0021] During the spraying process, detect the actual position of the chip, obtain the difference between the actual position of the chip and the initial coordinate values to obtain the position offset;

[0022] Perform weighted calculations on the position offsets in the X, Y, and Z axis directions to obtain the corrected spraying path;

[0023] Control the spraying component to perform spraying treatment on the chip according to the corrected spraying path until the spraying is completed.

[0024] Further, the step of controlling the rotating platform to rotate a preset angle and obtaining the new coordinate values and new surface features of the chip after rotation to obtain the second positioning data includes:

[0025] Set the angle of the rotating platform, and control the rotating platform to perform rotation processing according to the preset angle to obtain the rotation angle and rotation angle change information of the chip after rotation;

[0026] Obtain the relative position change amount of the chip after rotation based on the rotation angle change information to obtain the coordinate offset of the chip after rotation;

[0027] Calculate the new coordinate values of the chip after rotation according to the coordinate offset of the chip after rotation, and perform calibration processing on the new coordinate values to obtain the new coordinate values;

[0028] Obtain the surface feature change information of the chip after spraying treatment, including the new undulation height and new surface roughness of the chip surface, and generate a new influence coefficient matrix;

[0029] Perform comprehensive processing on the new coordinate values and the new influence coefficient matrix to obtain the second positioning data, where the second positioning data includes the optimized coordinate values of the chip after rotation and the feature change information of the chip surface.

[0030] Further, the step of controlling the thermal curing component to perform thermal curing treatment around the chip based on the second positioning data to form a packaging protective layer includes:

[0031] Analyze the second positioning data to obtain the curing temperature range required for the chip during thermal curing;

[0032] Determine the rotation angle of the thermal curing component required during the thermal curing process according to the curing temperature range to obtain the target thermal curing rotation angle;

[0033] Control the rotation angle of the thermal curing component according to the target thermal curing rotation angle, so that the thermal curing component performs thermal curing treatment around the chip, and maintains the temperature within a preset time to form an initial protective layer;

[0034] After the thermal curing process ends, gradually reduce the temperature of the chip surface to form the protective layer.

[0035] Further, the step of determining the rotation angle of the thermal curing component required during the thermal curing process according to the curing temperature range to obtain the target thermal curing rotation angle includes:

[0036] Subdivide the curing temperature range to obtain a plurality of temperature intervals;

[0037] For each of the temperature intervals, based on historical experimental data, obtain the optimal thermal curing angle of the chip within each temperature interval;

[0038] Generate a thermal curing angle curve according to the optimal thermal curing angle;

[0039] Select the peak angle in the thermal curing angle curve as the target thermal curing rotation angle.

[0040] Further, the step of performing a performance test on the encapsulation protective layer, and if the encapsulation protective layer does not reach the preset encapsulation effect, adjusting the thermal curing angle of the thermal curing component until the encapsulation protective layer reaches the preset encapsulation effect includes:

[0041] Perform a surface inspection on the encapsulation protective layer, and use a surface scanning device to scan the thickness flatness of the encapsulation protective layer to obtain the surface data of the encapsulation protective layer;

[0042] Calculate the defect index of the encapsulation protective layer based on the thickness flatness data and compare it with the preset encapsulation standard to obtain a defect evaluation result;

[0043] If the defect evaluation result indicates the existence of defects, calculate an angle adjustment value according to the difference between the defect index and the encapsulation standard;

[0044] Control the thermal curing component to move according to the angle adjustment value to perform secondary thermal curing to obtain a new encapsulation protective layer;

[0045] Repeat the testing process and the thermal curing process until the encapsulation protective layer reaches the preset encapsulation effect.

[0046] The present invention also provides a packaging device for self-adjusting chips, including:

[0047] A substrate;

[0048] A rotating platform, the rotating platform is connected to the substrate through a rotating shaft, and a plurality of fixture platforms are provided on the rotating platform;

[0049] A spraying component, the spraying component is connected to the substrate through a first bracket, and the spraying port of the spraying component is arranged opposite to the fixture platform for spraying encapsulation material onto the chips on the fixture platform;

[0050] A thermal curing component, which is connected to a substrate through a second bracket. The heating port of the thermal curing component is arranged opposite to a jig platform, and the thermal curing component rotates around the second bracket to achieve all-round thermal curing treatment of the chip.

[0051] Further, the second bracket includes a slide bar, a driving member, and a rotating shaft. The slide bar is vertically connected to the substrate, and one end of the slide bar away from the substrate is connected to the driving member to enable the driving member to slide up and down along the slide bar.

[0052] The rotating shaft is parallel to the substrate and connected to the driving member. One end of the rotating shaft away from the driving member is connected to the thermal curing component. The driving member drives the rotating shaft to rotate, so that the thermal curing component rotates around the rotating shaft, thereby adjusting the position of the thermal curing component and achieving thermal curing treatment of different parts of the chip.

[0053] Further, the spraying component includes a spray head, a spray pump, and a spray controller. The spray head is connected to the spray pump and is used to eject the encapsulation material from the spray head. The spray pump is used to provide the pressure required for spraying and evenly spray the encapsulation material onto the chip on the jig platform from the spray head. The spray controller is used to control the spraying speed and spraying amount of the spray head.

[0054] Beneficial effects:

[0055] A self-adjusting chip encapsulation method proposed in this application adopts an encapsulation device combining a rotating platform, a spraying component, and a thermal curing component, which can dynamically adjust the encapsulation parameters in real time during the encapsulation process. By obtaining the initial coordinate values and surface features of the chip and combining them to obtain positioning data, it can accurately control the spraying path and ensure that the position offset during the spraying process is corrected in a timely manner, thereby avoiding encapsulation deviations caused by surface irregularities or position errors. Further, through the preset angle control of the rotating platform and combining the obtained new coordinate values and new surface features, it can further accurately adjust the thermal curing angle during the thermal curing process, ensure the uniformity and accuracy of the thermal curing treatment, thereby forming a uniform encapsulation protection layer, improving the adaptive ability during the encapsulation process, and avoiding problems such as tiny defects on the chip surface, position deviations, and temperature fluctuations that cannot be handled by the fixed paths and parameter settings in traditional encapsulation methods. It can effectively improve the stability and consistency of the encapsulation effect. If the encapsulation protection layer does not reach the preset effect, the system can automatically adjust the thermal curing angle until the encapsulation requirements are met, improving the encapsulation quality of the self-adjusting chip and enhancing the production efficiency.

[0056] In summary, the present application can effectively solve the problems of insufficient precision and poor encapsulation existing in the existing encapsulation methods. Especially for self-adjusting chips with complex structures and sensitive surface features, it can significantly improve the stability and reliability of the encapsulation process. BRIEF DESCRIPTION OF THE DRAWINGS

[0057] Figure 1 is a schematic diagram of the steps of a method for encapsulating a self-adjusting chip according to an embodiment of the present invention;

[0058] Figure 2 is a schematic block diagram of the overall structure of an encapsulation device for a self-adjusting chip according to an embodiment of the present invention;

[0059] Figure 3 is a schematic top view block diagram of an encapsulation device for a self-adjusting chip according to an embodiment of the present invention;

[0060] Figure 4 is a schematic block diagram of the structure of a spraying component of an encapsulation device for a self-adjusting chip according to an embodiment of the present invention.

[0061] Among them, the reference numerals are: 1, substrate; 2, rotating platform; 21, rotating shaft; 3, jig platform; 4, spraying component; 41, spraying head; 42, spraying pump; 43, spraying controller; 5, thermal curing component; 6, first bracket; 7, second bracket; 71, sliding rod; 72, driving member; 73, rotating shaft; 8, measuring component; 9, scanning component.

[0062] The realization, functional features and advantages of the objectives of the present invention will be further described with reference to the embodiments and the accompanying drawings. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0063] In order to make the objectives, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0064] Those skilled in the art can understand that, unless specifically stated, the singular forms "a", "an", "above-mentioned" and "the" used herein may also include the plural forms. It should be further understood that the term "including" used in the description of the present invention means the presence of features, integers, steps, operations, elements, modules and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, modules, components and / or their groups. It should be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to other elements, or there may also be intermediate elements. In addition, the "connection" or "coupling" used herein may include wireless connection or wireless coupling. The phrase "and / or" used herein includes all or any one of the one or more associated listed items and all combinations.

[0065] Those skilled in the art can understand that, unless otherwise defined, all terms used herein (including technical terms and scientific terms) have the same meaning as the general understanding of those of ordinary skill in the art to which the present invention belongs. It should also be understood that terms such as those defined in a general dictionary should be understood as having a meaning consistent with the meaning in the context of the prior art, and will not be interpreted with an idealized or overly formal meaning unless specifically defined as herein.

[0066] Referring to Figure 1 , an embodiment of the present invention provides a packaging method for a self-adjusting chip, and the method includes:

[0067] S1: Provide a packaging device, the packaging device includes a rotating platform 2, a spraying component 4 and a heat curing component 5, the rotating platform 2 includes a plurality of fixture platforms 3, and the spraying component 4 and the heat curing component 5 are arranged at intervals above the fixture platform 3;

[0068] In step S1, a packaging device is provided. The packaging device includes a rotating platform 2, and a plurality of fixture platforms 3 are arranged on the rotating platform 2. The fixture platforms 3 are used to fix the chip and ensure that it can rotate stably during the packaging process. During the packaging process, the chip needs to rotate so that the spraying component 4 and the heat curing component 5 can uniformly process each surface of the chip. The function of the spraying component 4 is to perform spraying treatment on the chip surface. It is located above the rotating platform 2 and is arranged at intervals from the heat curing component 5. The spraying component 4 forms a preliminary protective layer on the chip surface by spraying a suitable material. The heat curing component 5 is used to perform heat curing treatment after the chip spraying treatment to ensure the formation of a stable packaging protective layer. The heat curing component 5 is located above the rotating platform 2 and provides uniform heating for the chip through its rotation and heat treatment functions to ensure the smooth progress of the hardening process of the packaging layer.

[0069] S2: Obtain the initial coordinate value of the chip on the fixture platform 3, and obtain the surface features of the chip. Combine the initial coordinate value and the surface features to obtain the first positioning data;

[0070] In step S2, during the encapsulation process, obtaining the initial positioning of the chip can be based on an optical sensor, a distance sensor, or other high-precision measurement components 8 integrated on the rotating platform 2, which can capture the position of the chip in real time. There will be tiny protrusions, depressions, stains, or other defects on the chip surface, and these factors will affect the uniformity of spraying and the effect of thermal curing. Through high-precision sensors (such as surface scanners, laser scanners, etc.), the tiny features on the chip surface can be obtained in real time, and even the irregular shape of the surface can be modeled. This surface feature information can help the subsequent spraying component 4 and thermal curing component 5 to make necessary adjustments to adapt to chips with different surface conditions. The initial coordinate value provides the spatial position of the chip, and the surface features provide detailed information about the chip surface state. After combining the initial coordinate value and the surface features to form the first positioning data, the encapsulation device can perform precise operations on the chip based on this data in subsequent steps.

[0071] S3: Control the spraying component 4 to perform spraying treatment on the chip, obtain the position offset of the chip during the spraying process based on the first positioning data, and adjust the spraying path based on the position offset;

[0072] In step S3, when the spraying component 4 performs the spraying task, according to the initial position and surface features of the chip, a spraying path is formed, which is determined according to the first positioning data. The first positioning data includes the initial coordinate value of the chip and the surface feature information. The spraying component 4 controls the starting position of spraying and makes preliminary spraying by adjusting parameters such as the angle of the nozzle and the spraying distance. In the actual encapsulation process, due to tiny errors or surface irregularities, the chip may have a slight displacement during the spraying process. At this time, a position feedback mechanism is adopted, and the movement trajectory of the chip is monitored in real time through a sensor or a camera system and compared with the preset path. If it is found that there is a deviation between the actual position of the chip and the preset spraying path, the spraying component 4 will make adjustments according to the position offset and re-plan the spraying path, which can ensure the uniformity of spraying and improve the stability and consistency of the encapsulation process

[0073] S4: Control the rotating platform 2 to rotate a preset angle, and obtain the new coordinate value and new surface features of the chip after rotation to obtain the second positioning data;

[0074] In step S4, the rotating platform 2 rotates the chip at a specific angle in three-dimensional space. There are multiple fixture platforms 3 on the rotating platform 2, and the chip is fixed on these fixture platforms 3, and the position of the chip is adjusted by the rotation of the rotating platform 2. In step S4, the rotating platform 2 rotates according to a preset angle, which can be 45 degrees, 90 degrees or other specific angles, aiming to rotate the chip under the thermal curing component 5. The rotated chip will form new coordinate data and surface features. The new coordinate values are obtained by real-time monitoring of the rotation position and coordinate changes of the chip, and combined with the first positioning data before rotation, the second positioning data is generated. This new positioning data is obtained based on the rotation angle of the chip and the changes in its surface features. Similar to step S3, the new surface features of the chip after spraying are obtained, and these features can include the coating thickness, uniformity and possible defects after spraying.

[0075] S5: Control the thermal curing component 5 to perform thermal curing treatment around the chip based on the second positioning data, forming a packaging protection layer;

[0076] In step S5, the thermal curing component 5 is controlled to perform thermal curing treatment around the chip by obtaining the second positioning data. The thermal curing component 5 is composed of multiple heating elements, and these heating elements will generate sufficient heat during the thermal curing process to help the packaging material cure. According to the second positioning data, the thermal curing component 5 will precisely adjust its heating area and heating intensity according to the specific position and surface features of the chip. To ensure uniform thermal curing treatment, the thermal curing component 5 can rotate or adjust around different parts of the chip, so as to ensure that each angle can be fully heated, so as to ensure that each angle can be fully heated. The adjustment of the thermal curing angle is a dynamic process, which optimizes the thermal curing angle and path according to the real-time position and surface features of the chip. For example, if the surface of a certain area of the chip is more complex or irregular, the thermal curing component 5 may need to make fine adjustments according to the second positioning data, so that the heating element can perform thermal curing at a specific angle for this area, so as to achieve a uniform coverage effect. After the thermal curing treatment is completed, a firm and uniform packaging protection layer will be formed on the chip surface, and the packaging layer can effectively protect the chip from the influence of the external environment, such as temperature, humidity and physical impact, etc.

[0077] S6: Perform performance testing on the packaging protection layer. If the packaging protection layer does not reach the preset packaging effect, adjust the thermal curing angle of the thermal curing component 5 until the packaging protection layer reaches the preset packaging effect.

[0078] In step S6, performance testing is carried out on the already formed encapsulation protection layer to evaluate the quality of the encapsulation protection layer, including aspects such as its thickness uniformity, degree of curing, hardness, heat resistance, moisture resistance, and protection ability against external physical impacts. The performance testing of the encapsulation protection layer can be carried out through various methods. For example, the surface quality of the encapsulation layer can be inspected by a scanning electron microscope (SEM), or the physical properties such as the hardness and strength of the encapsulation layer can be measured by using other precision instruments. These test results will directly affect whether subsequent adjustments need to be made to the thermal curing process to ensure that the quality of the chip encapsulation meets the design and application requirements. For example, assume that through performance testing, it is found that the thickness of the encapsulation protection layer is uneven in some areas, resulting in some parts of the encapsulation layer being too thin and possibly unable to provide sufficient protection. In this case, adjustments need to be made to the thermal curing component 5. Specifically, the angle adjustment of the thermal curing component 5 can affect the distribution mode of the heat source during the thermal curing process. If the thermal curing component 5 is not heated sufficiently in some areas, it may lead to incomplete curing of the encapsulation layer, thereby affecting its final performance. Based on the feedback of the performance testing, adjust the thermal curing angle of the thermal curing component 5 to ensure that all areas can be evenly heated and further improve the quality of the encapsulation layer. It should be noted that the adjustment process in S6 is a repeated optimization process. After the first adjustment, a new performance test may be required to verify whether the adjusted encapsulation layer meets the preset requirements. If it still does not meet the requirements, the thermal curing angle may need to be adjusted continuously until the quality of the encapsulation protection layer fully meets the requirements.

[0079] In one embodiment, the step of obtaining the initial coordinate values of the chip on the fixture platform 3 and obtaining the surface features of the chip, and combining the initial coordinate values and the surface features to obtain the first positioning data includes:

[0080] Perform positioning processing on the chip to obtain the initial coordinate values of the chip on the fixture platform 3, and the initial coordinate values include the coordinate values of the chip on the three axes of X, Y, and Z;

[0081] According to the initial coordinate values of the chip, calculate the relative positions between the chip and the fixture platforms 3 on the fixture platform 3, and generate a relative position matrix;

[0082] Perform scanning processing on the chip surface to obtain surface feature data of the chip surface, and the surface feature data includes but is not limited to the undulation height and surface roughness of the chip surface;

[0083] Fuse the undulation height and surface roughness to generate an influence coefficient matrix;

[0084] Perform comprehensive processing on the relative position matrix and the influence coefficient matrix to obtain the first positioning data, where the first positioning data includes the optimized coordinate values of the chip.

[0085] In the above embodiment, the initial coordinate values of the chip on the fixture platform 3 are obtained, that is, the coordinates of the chip in the X, Y, and Z axis directions on the fixture platform 3. These coordinate values represent the position of the chip in three-dimensional space. In actual operation, the accurate position of the chip on the fixture can be obtained based on the measurement component 8 integrated on the rotating platform 2 and converted into precise numerical coordinates. Based on the initial coordinate values of the chip, the relative position between the chip and the fixture platform 3 is calculated to generate a relative position matrix, clarifying the spatial relationship between the chip and the fixture. This matrix contains the deviations of the chip relative to multiple coordinate points on the fixture platform 3. Specifically, assuming there are multiple fixed fixture points or reference points on the fixture platform 3, the relative positions between the chip and these points can be calculated to form a matrix containing the deviations between each reference point and the chip. After obtaining the initial coordinates and relative position matrix of the chip, the surface of the chip is scanned to obtain the surface feature data of the chip. The surface feature data of the chip mainly includes the undulation height and surface roughness of the chip surface. The acquisition of the surface feature data can be achieved through high-precision surface scanning technology, such as by means of the scanning component 9 integrated in the spraying component 4, etc., which can comprehensively scan the chip surface and obtain detailed information about its surface microstructure. The surface roughness reflects the smoothness of the chip surface microstructure, and the surface roughness is obtained to calculate the influence coefficient matrix. The influence coefficient matrix fuses feature data such as undulation height and surface roughness to obtain a comprehensive influence coefficient, which reflects the degree of influence of the chip surface features on the encapsulation process. For example, when the surface undulation is large or the surface roughness is high, the influence coefficient will be high. The relative position matrix and the influence coefficient matrix are comprehensively processed to obtain the first positioning data. In this step, considering the relative position between the chip and the fixture and the influence of the surface features, an optimized coordinate value is calculated. This optimized coordinate value is the best placement position of the chip on the fixture platform 3, enabling the chip to be in the most stable and accurate position during the encapsulation process. By comprehensively processing the relative position matrix and the influence coefficient matrix and performing positioning through the initial coordinates, and also considering the influence of the surface features on the positioning, more accurate encapsulation positioning is achieved. This optimized coordinate value is the first positioning data to ensure the optimization of the encapsulation quality and chip performance.

[0086] In another embodiment, the calculation formula for the above steps is:

[0087] ;

[0088] Among them, FPD is the first positioning data; RPM is the relative position matrix, which represents the spatial deviation of the chip relative to multiple reference points on the fixture platform and is calculated through the initial coordinate values (X, Y, Z), reflecting the spatial relationship between the chip and the fixture. Assuming there are n reference points on the fixture platform, RPM is an n×3 matrix, and each row corresponds to the deviation between a reference point and the chip; ICM is the influence coefficient matrix, which integrates the undulation height and roughness of the chip surface and quantifies the influence degree of surface features on packaging positioning. The larger the value of ICM, the greater the interference of surface features on positioning; λ is the attenuation factor, which is used to control the influence degree of ICM on overall positioning. By means of the exponential function introduces a non-linear effect, making the influence of surface features smoothly decay with the increase of λ, and it is a positive real number (such as 0.1~1.0); is the exponential decay term, which is used to smooth the influence of ICM. When ICM is large, this term approaches 0, reducing the excessive interference of surface features. When ICM is small, this term approaches 1, retaining the original influence; is the surface feature weight factor, which is used to adjust the contribution of the undulation height of the surface to the positioning data. The larger σ is, the more significant the influence of the undulation height, and the range is 0.5~2.0; is the undulation height gradient, which is the spatial gradient of the undulation height (H) of the chip surface and represents the severity of the surface height change, calculated through the scanning data; is the roughness parameter of the chip surface, which is the arithmetic mean roughness and reflects the smoothness of the surface microstructure; is the roughness distribution density, which describes the uniformity of the roughness distribution on the chip surface and is a local density function; is the surface roughness integral term, which performs an area integral on the roughness Ra and the distribution density δ of the chip surface to calculate the overall influence of the surface roughness. The integration range S is the chip surface area.

[0089] In one embodiment, the steps of controlling the spraying component 4 to spray the chip, obtaining the position offset of the chip during the spraying process based on the first positioning data, and adjusting the spraying path based on the position offset include:

[0090] Initialize the spraying path of the spraying component 4 according to the first positioning data, and spray the chip according to the spraying path;

[0091] During the spraying process, detect the actual position of the chip, obtain the difference between the actual position of the chip and the initial coordinate value, and obtain the position offset;

[0092] Perform weighted calculation on the position offsets in the X, Y, and Z axis directions to obtain the corrected spraying path;

[0093] Control the spraying component 4 to spray the chip according to the corrected spraying path until the spraying is completed.

[0094] In the above embodiment, the spraying path is initialized according to the first positioning data. The spraying path refers to the trajectory that the spraying device needs to follow on the chip surface. This path will spray on the chip surface to cover all the areas that need to be sprayed on the chip. The spraying component 4 starts to spray the chip according to the preset spraying path. During this process, the actual position of the chip is monitored, and the difference between the actual position and the initial coordinates is obtained. This difference is the position offset. In fact, during the spraying process, due to possible slight deformations, temperature changes, mechanical errors or other external factors on the chip surface, the chip may experience a slight offset. After obtaining the position offset, the position offsets in the X, Y, and Z axis directions are weighted and calculated to obtain a corrected spraying path. The specific method of weighted calculation depends on the influence of the offsets in different directions on the final spraying effect. For example, in some cases, the offset in the X axis may have a more significant impact on the spraying quality than the Z axis. In this case, more weight is given to the X axis offset. By weighting the position offsets in each direction, a new spraying path can be calculated, enabling the spraying device to operate precisely according to the corrected path until the spraying process is completed. In this way, the spraying device can respond in real time to changes in the chip position, make necessary path adjustments, and ensure that each spraying position can accurately cover the target area on the chip. This self-adjusting control method not only improves the spraying accuracy but also reduces spraying defects caused by position errors, thereby enhancing the quality and reliability of the packaging.

[0095] In one embodiment, the step of controlling the rotating platform 2 to rotate by a preset angle and obtaining the new coordinate values and new surface features of the chip after rotation to obtain the second positioning data includes:

[0096] Set the angle of the rotating platform 2, control the rotating platform 2 to rotate according to the preset angle, and obtain the rotation angle and rotation angle change information of the chip after rotation;

[0097] Based on the rotation angle change information, obtain the relative position change amount of the chip after rotation to obtain the coordinate offset of the chip after rotation;

[0098] According to the coordinate offset of the chip after rotation, calculate the new coordinate values of the chip after rotation, and perform calibration processing on the new coordinate values to obtain the new coordinate values;

[0099] Obtain the surface feature change information of the chip after spraying treatment, including the new undulation height and new surface roughness of the chip surface, and generate a new influence coefficient matrix;

[0100] The new coordinate values and the new influence coefficient matrix are comprehensively processed to obtain second positioning data, where the second positioning data includes the optimized coordinate values of the chip after rotation and the characteristic change information on the chip surface.

[0101] In the above embodiment, the angle of the rotation platform 2 is set to control the platform to rotate at a preset angle, adjusting the position and angle of the chip. Specifically, the rotation platform 2 starts to rotate according to the set preset angle. During the rotation process, the angle change of the platform will affect the position of the chip. In particular, the center coordinates and surface characteristics of the chip may change due to rotation. By measuring the change in the rotation angle, the relative position change amount of the chip after rotation can be obtained, and these change amounts are the coordinate offset amounts of the chip after rotation. This offset amount reflects the difference between the original coordinates and the actual coordinates of the chip after rotation, and is an important basis for correcting the chip positioning in the subsequent steps. Based on this offset amount, the new coordinate values of the chip after rotation are calculated. The new coordinate values describe the accurate position of the chip after rotation. There may be certain errors in the calculated new coordinate values, and calibration processing is performed on the new coordinate values to correct possible errors and ensure the accuracy of the positioning data. After the spraying process, the surface characteristics of the chip will change. The spraying process will change some microscopic structures on the surface. By measuring the surface characteristics, new surface undulation height and roughness data can be obtained, and these data will form a new influence coefficient matrix. The influence coefficient matrix is a mathematical model used to describe how the change in the chip surface characteristics affects the entire packaging process. The newly calculated coordinate values and the new influence coefficient matrix are comprehensively processed to obtain the second positioning data. The second positioning data is a comprehensive description of the final position and surface characteristics of the chip after rotation. It includes the optimized coordinate values of the chip after rotation and the characteristic change information on the chip surface. The optimized coordinate values enable the subsequent packaging operations to be carried out more precisely, and the characteristic change information on the surface helps subsequent devices such as spraying equipment and chip mounters to make appropriate adjustments to ensure the stability of the packaging quality.

[0102] In one embodiment, the step of controlling the thermal curing component 5 to perform thermal curing treatment around the chip based on the second positioning data to form a packaging protective layer includes:

[0103] Analyze the second positioning data to obtain the curing temperature range required for the chip during the thermal curing process;

[0104] According to the curing temperature range, determine the rotation angle of the thermal curing component 5 required during the thermal curing process to obtain the target thermal curing rotation angle;

[0105] Control the rotation angle of the thermal curing component 5 according to the target thermal curing rotation angle, so that the thermal curing component 5 performs thermal curing treatment around the chip and maintains the temperature within a preset time to form an initial protective layer;

[0106] After the thermal curing process ends, gradually reduce the temperature on the surface of the chip to form the protective layer.

[0107] In the above embodiment, by analyzing the second positioning data to obtain the curing temperature range required by the chip during the thermal curing process, the thermal curing temperature range required by the chip can be determined. For example, the surface of the chip has a high roughness, and a part of the area is exposed to direct heat source, while the other part is farther away. According to the surface feature data, the temperature ranges required for different regions on the chip surface can be calculated by analyzing the roughness and the heat conduction performance of different materials. Optimize the thermal curing process through the rotation angle of the thermal curing component 5 to ensure that the encapsulation protective layer covers the entire chip evenly and smoothly. During the chip encapsulation process, the thermal curing component 5 rotates around the chip to achieve a uniform thermal curing effect and ensure the stability of the protective layer. By calculating the required rotation angle, the problem of uneven thermal curing caused by improper angle can be avoided, thus ensuring the high quality of chip encapsulation. The determination of the target thermal curing rotation angle can be carried out according to the surface characteristics of the chip and the requirements of the predetermined encapsulation process. Control the rotation of the thermal curing component 5 according to this angle to perform uniform heat treatment around the chip within the specified angle. By controlling the rotation angle of the component, it can cover the entire chip during the thermal curing process and maintain a constant temperature within a preset time. As the thermal curing process progresses, the initial encapsulation protective layer is gradually formed, and measures are taken to gradually reduce the temperature on the chip surface, and non-linear cooling is carried out according to the characteristics of specific materials to avoid damage to the chip and the protective layer caused by thermal stress due to too fast cooling.

[0108] In one embodiment, the step of determining the rotation angle of the thermal curing component 5 required during the thermal curing process according to the curing temperature range to obtain the target thermal curing rotation angle includes:

[0109] Subdivide the curing temperature range to obtain a plurality of temperature intervals;

[0110] For each of the temperature intervals, based on historical experimental data, obtain the optimal thermal curing angle of the chip within each temperature interval;

[0111] Generate a thermal curing angle curve according to the optimal thermal curing angle;

[0112] Select the peak angle in the thermal curing angle curve as the target thermal curing rotation angle.

[0113] In the above embodiments, the curing temperature range is subdivided into multiple temperature intervals to control the influence of temperature on the chip in different intervals, because different temperature levels will have different degrees of influence on the curing effect of the chip. For example, certain areas may require a higher temperature to accelerate the curing process, while other areas may require a lower temperature to avoid chip damage caused by overheating. By subdividing the temperature range, the curing effect of each temperature interval can be more precisely controlled, thus ensuring the uniformity and effect of the entire curing process. According to the characteristics of each temperature interval, the optimal thermal curing angle of the chip within each temperature interval is obtained based on historical experimental data. By summarizing past experiments, the optimal rotation angle of the chip under different temperature intervals can be obtained. Such an angle can ensure uniform heat distribution of the chip and optimize the curing effect on the chip surface. For example, in certain temperature intervals, the chip may need to be rotated at a certain angle to ensure uniform heat transfer due to uneven surface, avoiding uneven curing caused by local overheating or overcooling. In other temperature intervals, good heat transfer effect may be achieved by slightly adjusting the rotation angle. Based on the obtained optimal thermal curing angle data, a thermal curing angle curve is generated, which can be formed by connecting the optimal angles corresponding to multiple temperature intervals, aiming to show the change trend of the angle at different temperatures. By selecting the peak angle in the thermal curing angle curve as the target thermal curing rotation angle, the peak angle here is usually the angle with the best effect during the thermal curing process, that is, within a certain specific temperature interval, the angle that can maximize the heat transfer efficiency and ensure uniform heating of each part of the chip. In practical applications, the peak angle can be the result of experimental data, representing the rotation angle with the best thermal curing effect under certain experimental conditions. For example, if historical data shows that when the temperature range is between 150°C and 180°C and the rotation angle is 45 degrees, the curing effect of the chip is the best, then this angle will be selected as the target thermal curing rotation angle. Through such a process, the rotation angles corresponding to different temperature intervals in the entire thermal curing process are optimized, ensuring that the curing effect of each interval can meet the expected target.

[0114] In one embodiment, the step of performing a performance test on the encapsulation protective layer and adjusting the thermal curing angle of the thermal curing component 5 until the encapsulation protective layer reaches the preset encapsulation effect if the encapsulation protective layer does not reach the preset encapsulation effect includes:

[0115] Perform a surface inspection on the encapsulation protective layer, and use a surface scanning device to scan the thickness flatness of the encapsulation protective layer to obtain the surface data of the encapsulation protective layer;

[0116] Calculate the defect index of the encapsulation protective layer based on the thickness flatness data, and compare it with the preset encapsulation standard to obtain a defect evaluation result;

[0117] If the defect assessment result shows that there are defects, calculate the angle adjustment value according to the difference between the defect index and the encapsulation standard;

[0118] Control the thermal curing component 5 to move according to the angle adjustment value, and perform secondary thermal curing treatment to obtain a new encapsulation protective layer;

[0119] Repeat the testing process and the thermal curing process until the encapsulation protective layer achieves the preset encapsulation effect.

[0120] In the above embodiments, a surface scanning device is used to scan the thickness flatness of the encapsulation protective layer to obtain the surface data of the encapsulation protective layer, and the defect index of the encapsulation protective layer is calculated based on the thickness flatness data obtained from these scans. The defect index is a comprehensive index used to measure the surface quality of the encapsulation protective layer, reflecting surface non-uniformity, thickness variation, and possible defects such as bubbles and cracks. When calculating the defect index, the surface data is compared with a preset encapsulation standard, which can be set according to different application requirements. The defect assessment result is obtained by comparing the actual scan data with the preset standard to determine the defect degree of the encapsulation protective layer. If the defect index is greater than the preset standard, it indicates that there are defects in the encapsulation protective layer, and the angle adjustment value is calculated based on the difference between the defect index and the encapsulation standard. The angle adjustment value is determined by analyzing the nature and severity of the defects. For example, if the uniformity of the surface thickness is poor, it may be due to uneven temperature distribution or improper rotation angle during the thermal curing process. At this time, by calculating the difference in the defect index, the required adjustment angle for thermal curing can be determined. For example, if it is found that the thickness on one side of the chip is thinner, the thermal curing angle on that side may need to be increased to ensure that heat can be evenly distributed over the entire encapsulation protective layer to achieve the required flatness and thickness. After calculating the angle adjustment value, the thermal curing component 5 is controlled to move according to this angle adjustment value, thereby realizing the secondary thermal curing process. At this time, the angle of the thermal curing component 5 will be precisely adjusted according to the calculated adjustment value to optimize the thermal curing effect and ensure that the encapsulation protective layer undergoes more uniform heat treatment. The secondary thermal curing process is usually further refined based on the original curing conditions to ensure that the encapsulation layer of the chip can achieve a more ideal effect. The secondary thermal curing process may involve fine adjustments to the original angle, and even a more precise control system can be used to monitor and adjust the angle in real time to ensure that each round of heat treatment can meet the high-standard encapsulation requirements. After completing the second thermal curing process, the quality of the encapsulation protective layer still needs to be detected again. Usually, the surface detection and defect assessment processes are repeated to ensure that the adjusted encapsulation protective layer has achieved the preset effect. If the encapsulation layer after the secondary thermal curing process still fails to meet the standard, the difference between the defect index and the preset standard will be calculated again, and the thermal curing angle will be readjusted according to the difference for a new thermal curing process. This process can be continuously cycled until the final encapsulation protective layer meets the preset quality standard.

[0121] Refer to Figures 2 to 4, in one embodiment, a packaging device for a self-adjusting chip includes: a substrate 1; a rotating platform 2, the rotating platform 2 is connected to the substrate 1 through a rotating shaft 21, and a plurality of fixture platforms 3 are arranged on the rotating platform 2; a spraying assembly 4, the spraying assembly 4 is connected to the substrate 1 through a first bracket 6, and the spraying port of the spraying assembly 4 is arranged opposite to the fixture platform 3 for spraying packaging materials onto the chips on the fixture platform 3; a thermal curing assembly 5, the thermal curing assembly 5 is connected to the substrate 1 through a second bracket 7, the heating port of the thermal curing assembly 5 is arranged opposite to the fixture platform 3, and the thermal curing assembly 5 rotates around the second bracket 7 to achieve all-round thermal curing treatment of the chips.

[0122] In this embodiment, the substrate 1 is the basic platform of the entire device, providing support and stability, and can also be effectively connected to other components. The substrate 1 is connected to the rotating platform 2 through the rotating shaft 21, enabling the rotating platform 2 to rotate relative to the substrate 1. The presence of the rotating platform 2 allows multiple fixture platforms 3 to be evenly distributed and participate in the chip packaging process. The fixture platform 3 is used to place the chips, and in conjunction with the rotational movement of the rotating platform 2, it can achieve processing of the chips in multiple directions, ensuring that each chip can receive uniform spraying materials and thermal curing treatment. The connection between the rotating platform 2 and the substrate 1 is achieved through the rotating shaft 21, allowing the rotating platform 2 to rotate precisely on the substrate 1, enabling each chip to be aligned with the spraying assembly 4 and the thermal curing assembly 5 at an appropriate angle, thereby improving the processing efficiency. The spraying assembly 4 is connected to the substrate 1 through the first bracket 6, and at the same time, the spraying port is kept in alignment with the fixture platform 3, enabling the spraying process to efficiently and evenly spray the packaging materials onto the chips. The relative arrangement of the spraying port of the spraying assembly 4 and the fixture platform 3 ensures that during the rotation of the rotating platform 2, the spraying materials can be evenly covered on the chips, avoiding packaging defects caused by uneven material coating. The thermal curing assembly 5 is connected to the substrate 1 through the second bracket 7, and the heating port is arranged opposite to the fixture platform 3. At this time, the thermal curing assembly 5 rotates around the second bracket 7 to achieve all-round thermal curing treatment of the chips. Through the rotational movement of the thermal curing assembly 5, it can ensure that the packaging materials are evenly heated and cured on the chip surface, avoiding hot spots or cold spots during the heating process, thereby improving the thermal curing effect and the overall quality of the packaging.

[0123] In one embodiment, the second bracket 7 includes a sliding rod 71, a driving member 72, and a rotating shaft 73. The sliding rod 71 is vertically connected to the substrate 1. One end of the sliding rod 71 away from the substrate 1 is connected to the driving member 72, so that the driving member 72 can slide up and down along the sliding rod 71. The rotating shaft 73 is connected to the driving member 72 in parallel with the substrate 1. One end of the rotating shaft 73 away from the driving member 72 is connected to the heat curing assembly 5. The driving member 72 drives the rotating shaft 73 to rotate, so that the heat curing assembly 5 rotates around the rotating shaft 73, thereby adjusting the position of the heat curing assembly 5 and realizing the heat curing treatment of different parts of the chip.

[0124] In the above embodiment, the vertical connection between the sliding rod 71 and the substrate 1 provides the stability of the entire bracket structure. When the device is started, the sliding rod 71 provides a fixed sliding track. By connecting the driving member 72 to one end of the sliding rod 71 away from the substrate 1, the driving member 72 can slide up and down under the guidance of the sliding rod 71, enabling the driving member 72 to precisely control the position of the heat curing assembly 5 according to requirements, thereby adjusting the relative position between the heat curing assembly 5 and the chip. When the device is working, the up and down sliding of the driving member 72 enables the heat curing assembly 5 to move within the required height range. At the same time, the rotating shaft 73 is connected to the driving member 72 in parallel with the substrate 1, ensuring the stability of the heat curing assembly 5 during rotation and avoiding shaking or offset caused by rotation. The driving member 72 drives the rotation of the rotating shaft 73, realizing the rotation of the heat curing assembly 5 around the rotating shaft 73. This rotation design not only enables the heat curing assembly 5 to flexibly adjust its position to meet the packaging requirements of different chips, but also ensures uniform heat distribution during the heat curing process, avoiding packaging quality problems caused by uneven heat distribution. Through the precise control of the driving member 72, the heat curing assembly 5 can rotate at an appropriate speed and angle, thereby realizing the heat curing treatment of different parts of the chip and ensuring the accuracy and efficiency of the entire packaging process.

[0125] In one embodiment, the spraying assembly 4 includes a spraying head 41, a spraying pump 42, and a spraying controller 43. The spraying head 41 is connected to the spraying pump 42 and is used to spray the encapsulation material from the spraying head 41. The spraying pump 42 is used to provide the pressure required for spraying and uniformly spray the encapsulation material from the spraying head 41 onto the chip on the fixture platform 3. The spraying controller 43 is used to control the spraying speed and spraying amount of the spraying head 41.

[0126] In the above embodiments, the encapsulation material is loaded into the spraying pump 42. When the device receives a spraying instruction, the spraying pump 42 starts to work, and the encapsulation material is pushed to the spraying head 41 by generating a certain pressure. The spraying head 41 has a fine nozzle design, which can ensure that the encapsulation material is ejected in a uniform and fine mist. This can not only improve the utilization rate of the encapsulation material, but also ensure that the encapsulation material can uniformly cover the chip surface, avoiding the generation of bubbles or accumulation phenomena. The spraying controller 43 precisely adjusts the spraying speed and spraying amount of the spraying head 41 according to the preset parameters or the information feedback in real time. By adjusting the spraying speed, the deposition rate of the encapsulation material on the chip can be controlled, so as to achieve precise control of the thickness of the encapsulation layer; and by adjusting the spraying amount, it can be ensured that the amount of the encapsulation material sprayed each time is appropriate, neither wasting materials nor resulting in poor encapsulation effects due to insufficient materials. This fine spraying control provides a strong guarantee for the encapsulation quality of the chip.

[0127] In another embodiment, two circular movable plates are arranged between the spraying head 41 and the spraying pump 42. A plurality of circular through holes are arranged on the circular movable plates, and several cylinders are installed between the two circular movable plates in a staggered manner. The two ends of the cylinders are respectively fixedly connected to the two circular movable plates. When the spraying pump 42 works, the pressure generated pushes the encapsulation material to flow through the cylinders between the two circular movable plates. Due to the staggered installation of the cylinders, the encapsulation material is disturbed to a certain extent during the flowing process, further promoting the uniform dispersion of the encapsulation material and enhancing the uniformity of the encapsulation material.

[0128] The above are only the preferred embodiments of the present invention, and do not limit the patent scope of the present invention accordingly. Any equivalent structure or equivalent process transformation made by using the content of the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, shall be equally included in the patent protection scope of the present invention.

Claims

1. A packaging method for a self-regulating chip, characterized in that: The method comprises: A packaging device is provided, the packaging device comprising a rotating platform, a spraying component and a heat curing component, the rotating platform comprises a plurality of fixture platforms, the spraying component and the heat curing component are arranged above the fixture platforms at intervals; Acquire the initial coordinate value of the chip on the fixture platform, and acquire the surface features of the chip, and combine the initial coordinate value and the surface features to obtain first positioning data; Controlling the spraying assembly to spray the chip, acquiring a position offset of the chip during the spraying process based on the first positioning data, and adjusting a spraying path based on the position offset; Controlling the rotating platform to rotate a preset angle, and obtaining new coordinate values ​​and new surface features of the chip after rotation, to obtain second positioning data; Based on the second positioning data, control the thermal curing component to perform thermal curing around the chip to form a packaging protection layer; The performance test is performed on the encapsulation protection layer. If the encapsulation protection layer does not achieve the preset encapsulation effect, the thermal curing angle of the thermal curing component is adjusted until the encapsulation protection layer achieves the preset encapsulation effect.

2. The packaging method of the self-regulating chip according to claim 1, characterized in that: The step of obtaining the initial coordinate value of the chip on the fixture platform, obtaining the surface features of the chip, and combining the initial coordinate value and the surface features to obtain the first positioning data includes: Positioning the chip to obtain the initial coordinate value of the chip on the fixture platform, wherein the initial coordinate value includes the coordinate value of the chip in the three axes of X, Y, and Z; According to the initial coordinate value of the chip, the relative position between the chip and each fixture platform on the fixture platform is calculated to generate a relative position matrix; Scanning the chip surface to obtain surface feature data of the chip surface, wherein the surface feature data includes but is not limited to the undulation height and surface roughness of the chip surface; The undulation height and the surface roughness are combined to generate an influence coefficient matrix; The relative position matrix and the influence coefficient matrix are processed comprehensively to obtain first positioning data, wherein the first positioning data includes the optimized coordinate values ​​of the chip.

3. The packaging method of the self-regulating chip according to claim 1, characterized in that: The step of controlling the spraying assembly to spray the chip, acquiring the position offset of the chip during the spraying process based on the first positioning data, and adjusting the spraying path based on the position offset includes: Initializing a spraying path of a spraying component according to the first positioning data, and performing spraying processing on the chip according to the spraying path; During the spraying process, the actual position of the chip is detected, and the difference between the actual position of the chip and the initial coordinate value is obtained to obtain the position offset; Perform weighted calculation on the position offset in the X, Y, and Z axis directions to obtain the corrected spray path; The spraying assembly is controlled according to the corrected spraying path to spray the chip until the spraying is completed.

4. The packaging method of the self-regulating chip according to claim 1, characterized in that: The step of controlling the rotating platform to rotate by a preset angle, and obtaining new coordinate values ​​and new surface features of the chip after rotation, to obtain second positioning data includes: Setting the angle of the rotating platform, controlling the rotating platform to rotate according to the preset angle, and obtaining the rotation angle and rotation angle change information of the chip after rotation; Based on the rotation angle change information, a relative position change amount of the chip after rotation is acquired to obtain a coordinate offset amount of the chip after rotation; According to the coordinate offset of the chip after rotation, the new coordinate value of the chip after rotation is calculated, and the new coordinate value is calibrated to obtain the new coordinate value; Obtain the surface feature change information of the chip after the spraying treatment, including the new undulation height and new surface roughness of the chip surface, and generate a new influence coefficient matrix; The new coordinate values ​​and the new influence coefficient matrix are processed comprehensively to obtain second positioning data, wherein the second positioning data includes the optimized coordinate values ​​of the chip after rotation and characteristic change information of the chip surface.

5. The packaging method of the self-regulating chip according to claim 1, characterized in that: The step of controlling the thermal curing component to perform thermal curing around the chip based on the second positioning data to form a packaging protection layer includes: Analyzing the second positioning data to obtain a curing temperature range required for the chip during thermal curing; According to the curing temperature range, determining the rotation angle of the heat curing component required in the heat curing process to obtain a target heat curing rotation angle; According to the target thermal curing rotation angle, controlling the rotation angle of the thermal curing component, so that the thermal curing component performs thermal curing around the chip and maintains the temperature within a preset time to form an initial protective layer; After the thermal curing process is completed, the temperature of the chip surface is gradually reduced to form the protective layer.

6. The packaging method of the self-regulating chip according to claim 5, characterized in that: The step of determining the rotation angle of the heat curing component required in the heat curing process according to the curing temperature range to obtain the target heat curing rotation angle comprises: Subdividing the curing temperature range to obtain a plurality of temperature intervals; For each of the temperature intervals, based on historical experimental data, obtaining the optimal thermal curing angle of the chip in each temperature interval; generating a thermal curing angle curve according to the optimal thermal curing angle; The peak angle in the thermal curing angle curve is selected as the target thermal curing rotation angle.

7. The packaging method of the self-regulating chip according to claim 1, characterized in that: The step of performing a performance test on the encapsulation protection layer and adjusting the thermal curing angle of the thermal curing component until the encapsulation protection layer achieves the preset encapsulation effect if the encapsulation protection layer does not achieve the preset encapsulation effect comprises: Performing surface inspection on the encapsulation protection layer, scanning the thickness and flatness of the encapsulation protection layer using a surface scanning device to obtain surface data of the encapsulation protection layer; Calculating a defect index of the packaging protective layer based on the surface data, and comparing it with a preset packaging standard to obtain a defect evaluation result; If the defect assessment result is that a defect exists, calculating an angle adjustment value according to a difference between the defect index and the packaging standard; Controlling the heat curing component to move according to the angle adjustment value, performing secondary heat curing treatment, and obtaining a new encapsulation protection layer; The testing process and the heat curing process are repeated until the encapsulation protection layer achieves a preset encapsulation effect.

8. A packaging device for a self-regulating chip, applied to the method according to any one of claims 1 to 7, characterized in that: include: substrate(1); A rotating platform (2), the rotating platform (2) being connected to the substrate (1) via a rotating shaft (21), and a plurality of fixture platforms (3) being arranged on the rotating platform (2); A spraying component (4), the spraying component (4) being connected to the substrate (1) via a first bracket (6), and a spraying port of the spraying component (4) being arranged opposite to the fixture platform (3) and being used for spraying packaging material onto the chip on the fixture platform (3); A heat curing component (5), the heat curing component (5) being connected to the substrate (1) via a second bracket (7), a heating port of the heat curing component (5) being arranged opposite to the fixture platform (3), and the heat curing component (5) rotating around the second bracket (7) to achieve all-round heat curing treatment of the chip.

9. The packaging device of the self-regulating chip according to claim 8, characterized in that: The second bracket (7) comprises a sliding rod (71), a driving member (72) and a rotating shaft (73); the sliding rod (71) is vertically connected to the base plate (1); an end of the sliding rod (71) away from the base plate (1) is connected to the driving member (72) so that the driving member (72) slides up and down along the sliding rod (71); The rotating shaft (73) is connected to the driving member (72) parallel to the substrate (1); one end of the rotating shaft (73) away from the driving member (72) is connected to the thermal curing component (5); the driving member (72) drives the rotating shaft (73) to rotate, thereby causing the thermal curing component (5) to rotate around the rotating shaft (73), thereby adjusting the position of the thermal curing component (5) and achieving thermal curing treatment of different parts of the chip.

10. The packaging device of the self-regulating chip according to claim 8, characterized in that: The spraying assembly (4) comprises a spraying head (41), a spraying pump (42) and a spraying controller (43); the spraying head (41) is connected to the spraying pump (42) and is used to spray the packaging material from the spraying head (41); the spraying pump (42) is used to provide the pressure required for spraying, so as to evenly spray the packaging material from the spraying head (41) onto the chip on the fixture platform (3); and the spraying controller (43) is used to control the spraying speed and spraying amount of the spraying head (41).

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