Dispatching system, method and device and computer readable storage medium

By implementing a dispatch system on the measurement machine to determine the wafer type and machine status, the problem that the measurement machine cannot obtain the wafer measurement time in advance is solved, and the effect of reducing waiting time and shortening the production cycle is achieved.

CN119920714APending Publication Date: 2025-05-02SIEN (QINGDAO) INTEGRATED CIRCUITS CO LTD
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Patent Information

Application Number
CN202311429009.X
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2023-10-31
Publication Date
2025-05-02

AI Technical Summary

Technical Problem

In the prior art, the measurement machine cannot obtain the measurement time of the wafer to be dispatched in advance, resulting in the product wafer waiting time or the production cycle increases, and the yield decreases.

Method used

Design a dispatch system, including a type judgment unit, a dispatch condition judgment unit and a dispatch unit, determine whether the dispatch conditions are met by judging the type and machine status of the current batch of wafers, and then decide which machine to send the wafer to.

Benefits of technology

Effectively reduce the waiting time of emergency batch wafers in the station, control the production rhythm of special batch wafers, and thus shorten the production cycle of the entire batch.

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Abstract

The invention provides a dispatching system, method and device and a computer readable storage medium, and the system comprises a type judgment unit, a dispatching condition judgment unit and a dispatching unit, the type judgment unit is used for judging the type of a wafer of a current batch, and the dispatching condition judgment unit is used for judging the type of the wafer of the current batch; the dispatching condition judgment unit is used for judging whether the state of the current machine table meets the dispatching condition of the current batch of wafers or not according to the type of the current batch of wafers, and the dispatching unit is used for dispatching the current batch of wafers to the current machine table when the state of the current machine table meets the dispatching condition of the current batch of wafers. The waiting time of emergency batch wafers at the current station can be reduced, so that the production cycle of the whole batch is reduced.
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Description

Technical Field

[0001] The present invention relates to the field of semiconductor process technology, and in particular to a work dispatching system, method, device and computer-readable storage medium. Background Art

[0002] Due to the parallel of R&D needs and production measurement, the measurement machine needs to measure both product wafers and experimental wafers. Usually, 9 or 13 points are measured on a mass production wafer, and the measurement time is about ten minutes. Because the process conditions of experimental wafers are unstable, sometimes hundreds of points need to be measured to collect a large amount of data to find the best production conditions, and the measurement time varies from 1 to 6 hours.

[0003] Due to the lack of adaptive dynamic scheduling equipment for the production line, it is impossible to obtain the measurement time of the wafers to be dispatched in advance. If the time node for measuring special experimental wafers is not controlled when dispatching, the product wafers will have to wait too long for measurement at this site or the time to complete this processing step will exceed the processing time limit specified by the process (due to process requirements, some processing steps specify an upper limit on the time from step A to step B), thereby increasing the production cycle of the product wafers and reducing the yield.

[0004] Therefore, it is necessary to provide a new type of work dispatching system, method, device and computer-readable storage medium to solve the above-mentioned problems existing in the prior art. Summary of the invention

[0005] The object of the present invention is to provide a dispatching system, method, device and computer-readable storage medium to reduce the waiting time of urgent batches of wafers at the current station, perform special management and control on special batches of wafers, thereby reducing the production cycle of the entire batch.

[0006] To achieve the above-mentioned purpose, the dispatching system of the present invention includes a type judgment unit, a dispatching condition judgment unit and a dispatching unit. The type judgment unit is used to judge the type of the current batch of wafers. The dispatching condition judgment unit is used to judge whether the state of the current machine meets the dispatching conditions of the current batch of wafers according to the type of the current batch of wafers. The dispatching unit is used to dispatch the current batch of wafers to the current machine when the state of the current machine meets the dispatching conditions of the current batch of wafers.

[0007] Optionally, the type of the current batch of wafers includes a special batch, a normal batch or an emergency batch, and the dispatch condition judgment unit includes a first dispatch condition judgment module, which is used to judge whether there is a special batch of wafers under the current machine after the type judgment unit judges that the type of the current batch of wafers is an emergency batch, so as to judge whether the status of the current machine meets the first dispatch condition of the current batch of wafers; if there is no special batch of wafers under the current machine, it is judged that the status of the current machine meets the first dispatch condition of the current batch of wafers; if there is a special batch of wafers under the current machine, it is judged that the status of the current machine does not meet the first dispatch condition of the current batch of wafers, and the current batch of wafers are dispatched to other available machines in the same group as the current machine.

[0008] Optionally, the dispatch condition judgment unit also includes a second dispatch condition judgment module, which is used to judge whether the number of available machines in the current machine group is greater than or equal to the machine number threshold after the type judgment unit judges that the type of the current batch of wafers is a special batch, so as to judge whether the status of the current machine meets the second dispatch condition of the current batch of wafers; if the number of available machines in the current machine group is greater than or equal to the machine number threshold, then it is judged that the status of the current machine meets the second dispatch condition of the current batch of wafers; if the number of available machines in the current machine group is less than the machine number threshold, then it is judged that the status of the current machine does not meet the second dispatch condition of the current batch of wafers, and it is re-judged whether the status of the current machine meets the second dispatch condition of the current batch of wafers.

[0009] Optionally, the dispatch condition judgment unit also includes a third dispatch condition judgment module, which is used to judge whether the number of wafers to be dispatched in the current machine group is greater than the threshold number of wafers to be dispatched after the second dispatch condition judgment module judges that the state of the current machine meets the second dispatch condition of the current batch of wafers, so as to judge whether the state of the current machine meets the third dispatch condition of the current batch of wafers; if the number of wafers to be dispatched in the current machine group is less than the threshold number of wafers to be dispatched, then it is judged that the state of the current machine meets the third dispatch condition of the current batch of wafers; if the number of wafers to be dispatched in the current machine group is greater than or equal to the threshold number of wafers to be dispatched, then it is judged that the state of the current machine does not meet the third dispatch condition of the current batch of wafers, and it is re-judged whether the state of the current machine meets the third dispatch condition of the current batch of wafers.

[0010] Optionally, the dispatch condition judgment unit also includes a fourth dispatch condition judgment module, which is used to judge whether the number of machines in the current machine group that do not run special batches of wafers is greater than or equal to the threshold number of machines for special batches after the third dispatch condition judgment module judges that the state of the current machine meets the third dispatch condition of the current batch of wafers. If the number of machines in the current machine group that do not run special batches of wafers is greater than or equal to the threshold number of machines for special batches, then it is judged that the state of the current machine meets the fourth dispatch condition of the current batch of wafers; if the number of machines in the current machine group that do not run special batches of wafers is less than the threshold number of machines for special batches, then it is judged that the state of the current machine does not meet the fourth dispatch condition of the current batch of wafers, and it is re-judged whether the state of the current machine meets the fourth dispatch condition of the current batch of wafers.

[0011] The present invention also provides a method for dispatching work, comprising:

[0012] Determine the type of wafers in the current batch;

[0013] Determine whether the current machine status meets the dispatching conditions of the current batch of wafers according to the type of the current batch of wafers;

[0014] If the status of the current machine meets the dispatching conditions of the current batch of wafers, the current batch of wafers will be dispatched to the current machine.

[0015] Optionally, the type of the current batch of wafers includes a special batch, a normal batch, and an emergency batch, and the determining the type of the current batch of wafers includes:

[0016] Determine whether the wafer type of the current batch is a special batch, a normal batch, or an emergency batch.

[0017] Optionally, if the type of the current batch of wafers is determined to be an emergency batch, it is determined whether there are wafers of a special batch under the current machine to determine whether the state of the current machine meets the first dispatching condition of the current batch of wafers.

[0018] Optionally, if there is no special batch of wafers under the current machine, it is determined that the state of the current machine meets the first dispatching condition of the current batch of wafers; if there is a special batch of wafers under the current machine, it is determined that the state of the current machine does not meet the first dispatching condition of the current batch of wafers, and the current batch of wafers are dispatched to other available machines in the same group as the current machine.

[0019] Optionally, if the type of the current batch of wafers is determined to be a special batch, it is determined whether the number of available machines in the current machine group is greater than or equal to a machine number threshold to determine whether the status of the current machine meets the second dispatching condition for the current batch of wafers.

[0020] Optionally, if the number of available machines in the current machine group is greater than or equal to the machine number threshold, it is judged that the state of the current machine meets the second dispatching condition of the current batch of wafers; if the number of available machines in the current machine group is less than the machine number threshold, it is judged that the state of the current machine does not meet the second dispatching condition of the current batch of wafers, and it is re-judged whether the state of the current machine meets the second dispatching condition of the current batch of wafers.

[0021] Optionally, if it is determined that the status of the current machine meets the second dispatching condition of the current batch of wafers, it is determined whether the number of wafers to be dispatched in the current machine group is greater than a threshold value of the number of wafers to be dispatched to determine whether the status of the current machine meets the third dispatching condition of the current batch of wafers.

[0022] Optionally, if the number of wafers to be dispatched in the current machine group is less than the threshold number of wafers to be dispatched, it is judged that the state of the current machine meets the third dispatching condition of the current batch of wafers; if the number of wafers to be dispatched in the current machine group is greater than or equal to the threshold number of wafers to be dispatched, it is judged that the state of the current machine does not meet the third dispatching condition of the current batch of wafers, and it is re-judged whether the state of the current machine meets the third dispatching condition of the current batch of wafers.

[0023] Optionally, if it is determined that the status of the current machine meets the third dispatching condition for the current batch of wafers, it is determined whether the number of machines in the current machine group that are not running special batches of wafers is greater than or equal to the threshold value of the number of machines for the special batch, so as to determine whether the status of the current machine meets the fourth dispatching condition for the current batch of wafers.

[0024] Optionally, if the number of machines in the current machine group that do not run special batches of wafers is greater than or equal to the threshold number of machines for the special batch, then it is judged that the state of the current machine meets the fourth dispatch condition for the current batch of wafers; if the number of machines in the current machine group that do not run special batches of wafers is less than the threshold number of machines for the special batch, then it is judged that the state of the current machine does not meet the fourth dispatch condition for the current batch of wafers, and it is re-judged whether the state of the current machine meets the fourth dispatch condition for the current batch of wafers.

[0025] Optionally, if it is determined that the type of the current batch of wafers is a normal batch, it is determined that the state of the current machine meets the dispatching conditions of the current batch of wafers.

[0026] The present invention also provides a device, comprising:

[0027] processor;

[0028] a memory for storing processor-executable instructions;

[0029] Wherein, when the processor is configured to execute instructions in the memory, the dispatching method is implemented.

[0030] The present invention also provides a computer-readable storage medium, characterized in that it includes computer instructions, and when the computer instructions are executed by a processor, the work dispatching method is implemented.

[0031] The beneficial effects of the present invention are as follows: the type judgment unit judges the type of the current batch of wafers, the dispatch condition judgment unit judges whether the state of the current machine meets the dispatch conditions of the current batch of wafers according to the type of the current batch of wafers, and the dispatch unit dispatches the current batch of wafers to the current machine when the state of the current machine meets the dispatch conditions of the current batch of wafers, which can reduce the waiting time of emergency batch wafers at the current station, control the rhythm of special batch wafers on the machine, and thus reduce the production cycle of the entire batch. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a structural block diagram of a work dispatching system in some embodiments of the present invention;

[0033] Figure 2 A flowchart of a method for dispatching work in some embodiments of the present invention;

[0034] Figure 3 The figure is a flowchart of the method for dispatching work in some specific embodiments of the present invention. DETAILED DESCRIPTION

[0035] In order to make the purpose, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention. Unless otherwise defined, the technical terms or scientific terms used herein should be understood by people with general skills in the field to which the present invention belongs. "Including" and similar words used in this article mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

[0036] In view of the problems existing in the prior art, an embodiment of the present invention provides a work dispatching system. Figure 1The dispatching system includes a type judgment unit 101, a dispatching condition judgment unit 102 and a dispatching unit 103. The type judgment unit 101 is used to judge the type of the current batch of wafers. The dispatching condition judgment unit 102 is used to judge whether the state of the current machine meets the dispatching conditions of the current batch of wafers according to the type of the current batch of wafers. The dispatching unit 103 is used to dispatch the current batch of wafers to the current machine when the state of the current machine meets the dispatching conditions of the current batch of wafers.

[0037] In some embodiments, the type of the current batch of wafers includes a special batch, a normal batch or an emergency batch, and the dispatch condition judgment unit includes a first dispatch condition judgment module, which is used to judge whether there is a special batch of wafers under the current machine after the type judgment unit judges that the type of the current batch of wafers is an emergency batch, so as to judge whether the status of the current machine meets the first dispatch condition of the current batch of wafers; if there is no special batch of wafers under the current machine, it is judged that the status of the current machine meets the first dispatch condition of the current batch of wafers; if there is a special batch of wafers under the current machine, it is judged that the status of the current machine does not meet the first dispatch condition of the current batch of wafers, and the current batch of wafers are dispatched to other available machines in the same group as the current machine.

[0038] In some embodiments, the dispatch condition judgment unit also includes a second dispatch condition judgment module, which is used to judge whether the number of available machines in the current machine group is greater than or equal to the machine number threshold after the type judgment unit judges that the type of the current batch of wafers is a special batch, so as to judge whether the status of the current machine meets the second dispatch condition of the current batch of wafers. If the number of available machines in the current machine group is greater than or equal to the machine number threshold, then it is judged that the status of the current machine meets the second dispatch condition of the current batch of wafers; if the number of available machines in the current machine group is less than the machine number threshold, then it is judged that the status of the current machine does not meet the second dispatch condition of the current batch of wafers, and it is re-judged whether the status of the current machine meets the second dispatch condition of the current batch of wafers.

[0039] In some embodiments, the dispatch condition judgment unit also includes a third dispatch condition judgment module, which is used to judge whether the number of wafers to be dispatched in the current machine group is greater than a threshold number of wafers to be dispatched after the second dispatch condition judgment module judges that the state of the current machine meets the second dispatch condition of the current batch of wafers, so as to judge whether the state of the current machine meets the third dispatch condition of the current batch of wafers; if the number of wafers to be dispatched in the current machine group is less than the threshold number of wafers to be dispatched, then it is judged that the state of the current machine meets the third dispatch condition of the current batch of wafers; if the number of wafers to be dispatched in the current machine group is greater than or equal to the threshold number of wafers to be dispatched, then it is judged that the state of the current machine does not meet the third dispatch condition of the current batch of wafers, and it is re-judged whether the state of the current machine meets the third dispatch condition of the current batch of wafers.

[0040] In some embodiments, the dispatch condition judgment unit also includes a fourth dispatch condition judgment module, which is used to judge whether the number of machines in the current machine group that do not run special batches of wafers is greater than or equal to the threshold number of machines for special batches after the third dispatch condition judgment module judges that the state of the current machine meets the third dispatch condition of the current batch of wafers, so as to judge whether the state of the current machine meets the fourth dispatch condition of the current batch of wafers; if the number of machines in the current machine group that do not run special batches of wafers is greater than or equal to the threshold number of machines for special batches, then it is judged that the state of the current machine meets the fourth dispatch condition of the current batch of wafers; if the number of machines in the current machine group that do not run special batches of wafers is less than the threshold number of machines for special batches, then it is judged that the state of the current machine does not meet the fourth dispatch condition of the current batch of wafers, and it is re-judged whether the state of the current machine meets the fourth dispatch condition of the current batch of wafers.

[0041] Figure 2 The following is a flow chart of the method for dispatching work in some embodiments of the present invention. Figure 2 The work dispatching method is implemented by the work dispatching system, and the work dispatching method includes the following steps:

[0042] S1: Determine the type of the current batch of wafers, which includes special batches, normal batches, and emergency batches. Specifically, determine whether the current batch of wafers is a special batch based on the characters of the process recipe of the current batch of wafers. For example, determine that the batch of wafers with special characters such as "FM" and "OPCC" in the process recipe is a special batch. Usually, compared with the process steps of other wafer batches of the same product, the number of measurement points for each wafer in this processing step is greatly increased, and the measurement time is greatly extended. Determine that the current batch of wafers has no processing completion time threshold or has a processing completion time threshold, but the remaining processing time is much greater than the specified processing completion time threshold or the priority is lower than the priority threshold. Wafers of the batch are normal batches. Determine that the current batch of wafers has a processing completion time threshold, and the remaining processing completion time is slightly greater than the specified processing completion time threshold. If the wafers of the batch that continue to wait have a risk of exceeding the specified processing completion time threshold or the priority is higher than the priority threshold, they are emergency batches, for example, the remaining processing completion time is less than 6 hours, or the priority is 1-0 or 1-1.

[0043] S2: judging whether the state of the current machine meets the dispatching conditions of the current batch of wafers according to the type of the current batch of wafers;

[0044] S3: If the status of the current machine meets the dispatching conditions of the current batch of wafers, the current batch of wafers are dispatched to the current machine.

[0045] Figure 3 Schematic diagram of the process of dispatching work in some specific embodiments of the present invention. Figure 3 , determine the type of wafers in the current batch.

[0046] Reference Figure 3 If the type of the current batch of wafers is determined to be an emergency batch, it is determined whether there are wafers of a special batch under the current machine to determine whether the status of the current machine meets the first dispatching condition of the wafers of the current batch. If there are no wafers of a special batch under the current machine, it is determined that the status of the current machine meets the first dispatching condition of the wafers of the current batch, and the wafers of the current batch are dispatched to the current machine; if there are wafers of a special batch under the current machine, it is determined that the status of the current machine does not meet the first dispatching condition of the wafers of the current batch, and the wafers of the current batch are dispatched to other available machines in the same group of machines as the current machine.

[0047] Reference Figure 3, if it is determined that the type of the current batch of wafers is a special batch, then determine whether the number of available machines in the current machine group is greater than or equal to the machine number threshold, and the available machines are idle or are processing other wafer batches (the machine is lent to the process engineer (Process Engineer, PE) for use or the machine needs to wait for equipment maintenance and is considered to be unavailable). To determine whether the status of the current machine meets the second dispatching condition of the current batch of wafers. If the number of available machines in the current machine group is greater than or equal to the machine number threshold, then determine that the status of the current machine meets the second dispatching condition of the current batch of wafers; if the number of available machines in the current machine group is less than the machine number threshold, then determine that the status of the current machine does not meet the second dispatching condition of the current batch of wafers, the current batch of wafers is not allowed to be dispatched, and re-determine whether the status of the current machine meets the second dispatching condition of the current batch of wafers. Specifically, the machine number threshold is 2.

[0048] Reference Figure 3 If it is determined that the state of the current machine meets the second dispatching condition of the current batch of wafers, then it is determined whether the number of wafers to be dispatched (WIP, work in process) in the current machine group is greater than the threshold number of wafers to be dispatched, so as to determine whether the state of the current machine meets the third dispatching condition of the current batch of wafers. If the number of wafers to be dispatched in the current machine group is less than the threshold number of wafers to be dispatched, then it is determined that the state of the current machine meets the third dispatching condition of the current batch of wafers; if the number of wafers to be dispatched in the current machine group is greater than or equal to the threshold number of wafers to be dispatched, then it is determined that the state of the current machine does not meet the third dispatching condition of the current batch of wafers, and the wafers of the current batch are not allowed to be dispatched, and it is re-determined whether the state of the current machine meets the third dispatching condition of the current batch of wafers.

[0049] Reference Figure 3 , if it is determined that the status of the current machine meets the third dispatching condition of the current batch of wafers, then it is determined whether the number of machines in the current machine group that do not run special batches of wafers is greater than or equal to the threshold number of machines in the special batch, so as to determine whether the status of the current machine meets the fourth dispatching condition of the current batch of wafers. If the number of machines in the current machine group that do not run special batches of wafers is greater than or equal to the threshold number of machines in the special batch, then it is determined that the status of the current machine meets the fourth dispatching condition of the current batch of wafers, and the wafers of the special batch are allowed to be dispatched to the current machine; if the number of machines in the current machine group that do not run special batches of wafers is less than the threshold number of machines in the special batch, then it is determined that the status of the current machine does not meet the fourth dispatching condition of the current batch of wafers, and the wafers of the current batch are not allowed to be dispatched, and it is re-determined whether the status of the current machine meets the fourth dispatching condition of the current batch of wafers, until the number of machines in the current machine group that do not run special batches of wafers is greater than or equal to the threshold number of machines in the special batch. Specifically, the threshold number of machines in the special batch is 2.

[0050] Reference Figure 3 If the type of the current batch of wafers is determined to be a normal batch, then the current machine status is determined to meet the dispatching conditions for the current batch of wafers, and normal batch wafers are allowed to be dispatched.

[0051] In some specific embodiments, the machines in the current machine group include a first machine, a second machine and a third machine, and the first machine, the second machine and the third machine are all idle; it is determined that the type of the wafer with lot number "Lot 1" is a special batch, and the number of machines in the current machine group is 3, which is greater than the machine number threshold value 2, and it is determined that the wafer with lot number "Lot 1" meets the first dispatching condition; the number of finished wafers in the current machine group is 100, which is less than the wafer number threshold value 200 to be dispatched, and it is determined that the wafer with lot number "Lot 1" meets the second dispatching condition; the number of machines in the current machine group that does not run special batches of wafers is 3, which is greater than the special batch machine number threshold value 2, and it is determined that the wafer with lot number "Lot 1" meets the third dispatching condition, then the wafer with lot number "Lot 1" is allowed to be dispatched to the first machine, the second machine or the third machine. If the wafers with the lot number "Lot 2" are determined to be an emergency lot, and there are no wafers with a special lot under the first machine, the second machine, and the third machine, the wafers with the lot number "Lot 2" are allowed to be dispatched to the first machine, the second machine, or the third machine. If the wafers with the lot number "Lot 2" are determined to be a normal lot, the wafers with the lot number "Lot 3" are allowed to be dispatched to the first machine, the second machine, or the third machine.

[0052] In some other specific embodiments, the machines in the current machine group include a first machine, a second machine and a third machine, the third machine is idle, and the first machine and the second machine are in the process flow of a special batch of wafers; it is judged that the type of the wafers with lot number "Lot 1" is a special batch, the number of machines in the current machine group is 3, which is greater than the machine number threshold value 2, and the wafers with lot number "Lot 1" are judged to meet the first dispatching condition; the number of finished wafers in the current machine group is 100, which is less than the threshold number of wafers to be dispatched 200, and the wafers with lot number "Lot 1" are judged to meet the second dispatching condition; the number of machines in the current machine group that are not running special batches of wafers is 1, which is less than the threshold number of machines for special batches 2, and it is judged that the wafers with lot number "Lot 1" do not meet the third dispatching condition, then the wafers with lot number "Lot 1" are not allowed to be dispatched. If it is determined that the type of wafers with lot number "Lot 2" is an emergency batch, the first machine and the second machine have wafers of special batches in the process flow, and the third machine is idle, then the wafers with lot number "Lot 2" are only allowed to be dispatched to the third machine. If it is determined that the type of wafers with lot number "Lot 3" is a normal batch, then the wafers with lot number "Lot 3" are allowed to be dispatched to the first machine, the second machine, or the third machine.

[0053] In some other embodiments, the machines in the current machine group include the first machine, the second machine and the third machine, the first machine is in the process of a special batch of wafers, and the second machine and the third machine are idle; it is judged that the type of the wafer with the lot number "Lot 1" is a special batch, the number of machines in the current machine group is 3, which is greater than the machine number threshold 2, and the wafer with the lot number "Lot 1" is judged to meet the first dispatching condition; the number of finished wafers in the current machine group is 200, which is greater than the threshold number of wafers to be dispatched 100, and it is judged that the wafer with the lot number "Lot 1" does not meet the second dispatching condition, then the wafer with the lot number "Lot 1" is not allowed to be dispatched. It is judged that the type of the wafer with the lot number "Lot2" is an emergency batch, the first machine is in the process of a special batch of wafers, and the second machine and the third machine are idle, then the wafer with the lot number "Lot 2" is only allowed to be dispatched to the second machine and the third machine. If it is determined that the type of the wafer with the lot number “Lot 3” is a normal batch, the wafer with the lot number “Lot 3” is allowed to be dispatched to the first machine, the second machine or the third machine.

[0054] The present invention also provides a device, comprising:

[0055] processor;

[0056] a memory for storing processor-executable instructions;

[0057] Wherein, when the processor is configured to execute instructions in the memory, the dispatching method is implemented.

[0058] The present invention also provides a computer-readable storage medium, characterized in that it includes computer instructions, and when the computer instructions are executed by a processor, the work dispatching method is implemented.

[0059] Computer readable storage media can be, for example, but not limited to, electrical, magnetic, optical, electromagnetic, infrared, or semiconductor systems, devices or components, or any combination thereof. More specific examples of computer readable storage media include: an electrical connection with one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read only memory (ROM), an erasable programmable read only memory (EPROM) or flash memory, an optical fiber, a portable compact disk read only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination thereof. In this document, a computer readable storage medium can be any tangible medium containing or storing a program that can be used by or in conjunction with an instruction execution system, device, or device.

[0060] The program code contained on the computer-readable storage medium may be transmitted using any appropriate medium, including but not limited to wireless, wire, optical cable, or any suitable combination of the foregoing.

[0061] Computer program code for performing the operations of the present specification may be written in one or more programming languages ​​or a combination thereof, such as Java, Smalltalk, C++, C, etc. The program code may execute entirely on the user's computer, partially on the user's computer, as a stand-alone software package, partially on the user's computer and partially on a remote computer, or entirely on the remote computer or server.

[0062] Although the embodiments of the present invention are described in detail above, it is obvious to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations are within the scope and spirit of the present invention as described in the claims. Moreover, the present invention described herein may have other embodiments and may be implemented or realized in a variety of ways.

Claims

1. A work dispatching system, characterized in that: It includes a type judgment unit, a dispatch condition judgment unit and a dispatch unit. The type judgment unit is used to judge the type of the current batch of wafers. The dispatch condition judgment unit is used to judge whether the state of the current machine meets the dispatch conditions of the current batch of wafers according to the type of the current batch of wafers. The dispatch unit is used to dispatch the current batch of wafers to the current machine when the state of the current machine meets the dispatch conditions of the current batch of wafers.

2. The work dispatching system according to claim 1, characterized in that: The type of the current batch of wafers includes a special batch, a normal batch or an emergency batch. The dispatch condition judgment unit includes a first dispatch condition judgment module. The first dispatch condition judgment module is used to judge whether there are wafers of a special batch under the current machine after the type judgment unit judges that the type of the current batch of wafers is an emergency batch, so as to judge whether the state of the current machine meets the first dispatch condition of the current batch of wafers. If there are no wafers of a special batch under the current machine, it is judged that the state of the current machine meets the first dispatch condition of the current batch of wafers. If there are wafers of a special batch under the current machine, it is determined that the state of the current machine does not meet the first dispatching condition of the wafers of the current batch, and the wafers of the current batch are dispatched to other available machines in the same group as the current machine.

3. The work dispatching system according to claim 2, characterized in that: The dispatch condition judgment unit also includes a second dispatch condition judgment module, which is used to judge whether the number of available machines in the current machine group is greater than or equal to the machine number threshold after the type judgment unit judges that the type of the current batch of wafers is a special batch, so as to judge whether the status of the current machine meets the second dispatch condition of the current batch of wafers. If the number of available machines in the current machine group is greater than or equal to the machine number threshold, it is judged that the status of the current machine meets the second dispatch condition of the current batch of wafers; if the number of available machines in the current machine group is less than the machine number threshold, it is judged that the status of the current machine does not meet the second dispatch condition of the current batch of wafers, and it is re-judged whether the status of the current machine meets the second dispatch condition of the current batch of wafers.

4. The work dispatching system according to claim 3, characterized in that: The dispatch condition judgment unit also includes a third dispatch condition judgment module, which is used to judge whether the number of wafers to be dispatched in the current machine group is greater than the threshold number of wafers to be dispatched after the second dispatch condition judgment module judges that the state of the current machine meets the second dispatch condition of the current batch of wafers, so as to judge whether the state of the current machine meets the third dispatch condition of the current batch of wafers; if the number of wafers to be dispatched in the current machine group is less than the threshold number of wafers to be dispatched, it is judged that the state of the current machine meets the third dispatch condition of the current batch of wafers; if the number of wafers to be dispatched in the current machine group is greater than or equal to the threshold number of wafers to be dispatched, it is judged that the state of the current machine does not meet the third dispatch condition of the current batch of wafers, and it is re-judged whether the state of the current machine meets the third dispatch condition of the current batch of wafers.

5. The work dispatching system according to claim 4, characterized in that: The dispatch condition judgment unit also includes a fourth dispatch condition judgment module, which is used to judge whether the number of machines in the current machine group that do not run special batches of wafers is greater than or equal to the threshold number of machines for special batches after the third dispatch condition judgment module judges that the state of the current machine meets the third dispatch condition of the current batch of wafers, so as to judge whether the state of the current machine meets the fourth dispatch condition of the current batch of wafers; if the number of machines in the current machine group that do not run special batches of wafers is greater than or equal to the threshold number of machines for special batches, then it is judged that the state of the current machine meets the fourth dispatch condition of the current batch of wafers; if the number of machines in the current machine group that do not run special batches of wafers is less than the threshold number of machines for special batches, then it is judged that the state of the current machine does not meet the fourth dispatch condition of the current batch of wafers, and it is re-judged whether the state of the current machine meets the fourth dispatch condition of the current batch of wafers.

6. A method for dispatching work, characterized in that: include: Determine the type of wafers in the current batch; Determine whether the current machine status meets the dispatching conditions of the current batch of wafers according to the type of the current batch of wafers; If the status of the current machine meets the dispatching conditions of the current batch of wafers, the current batch of wafers will be dispatched to the current machine.

7. The method for dispatching work according to claim 6, characterized in that: The types of the current batch of wafers include special batch, normal batch, and emergency batch. The determining the type of the current batch of wafers includes: Determine whether the wafer type of the current batch is a special batch, a normal batch, or an emergency batch.

8. The method for dispatching work according to claim 7, characterized in that: If the type of the current batch of wafers is determined to be an emergency batch, it is determined whether there are wafers of a special batch under the current machine to determine whether the state of the current machine meets the first dispatching condition of the current batch of wafers.

9. The method for dispatching work according to claim 8, characterized in that: If there is no special batch of wafers under the current machine, it is determined that the status of the current machine meets the first dispatching conditions of the current batch of wafers; if there is a special batch of wafers under the current machine, it is determined that the status of the current machine does not meet the first dispatching conditions of the current batch of wafers, and the current batch of wafers are dispatched to other available machines in the same group as the current machine.

10. The method for dispatching work according to claim 7, characterized in that: If the type of the current batch of wafers is determined to be a special batch, it is determined whether the number of available machines in the current machine group is greater than or equal to the machine number threshold to determine whether the status of the current machine meets the second dispatching condition for the current batch of wafers.

11. The method for dispatching work according to claim 10, characterized in that: If the number of available machines in the current machine group is greater than or equal to the machine number threshold, then it is judged that the status of the current machine meets the second dispatching condition of the current batch of wafers; if the number of available machines in the current machine group is less than the machine number threshold, then it is judged that the status of the current machine does not meet the second dispatching condition of the current batch of wafers, and it is re-judged whether the status of the current machine meets the second dispatching condition of the current batch of wafers.

12. The method for dispatching work according to claim 11, characterized in that: If it is determined that the status of the current machine meets the second dispatching condition of the current batch of wafers, then it is determined whether the number of wafers to be dispatched in the current machine group is greater than the threshold number of wafers to be dispatched to determine whether the status of the current machine meets the third dispatching condition of the current batch of wafers.

13. The method for dispatching work according to claim 12, characterized in that: If the number of wafers to be dispatched in the current machine group is less than the threshold number of wafers to be dispatched, then it is judged that the state of the current machine meets the third dispatching condition of the current batch of wafers; if the number of wafers to be dispatched in the current machine group is greater than or equal to the threshold number of wafers to be dispatched, then it is judged that the state of the current machine does not meet the third dispatching condition of the current batch of wafers, and it is re-judged whether the state of the current machine meets the third dispatching condition of the current batch of wafers.

14. The method for dispatching work according to claim 13, characterized in that: If it is determined that the status of the current machine meets the third dispatching condition for the current batch of wafers, then it is determined whether the number of machines in the current machine group that are not running special batches of wafers is greater than or equal to the threshold value of the number of machines for the special batch, so as to determine whether the status of the current machine meets the fourth dispatching condition for the current batch of wafers.

15. The method for dispatching work according to claim 14, characterized in that: If the number of machines in the current machine group that do not run special batches of wafers is greater than or equal to the threshold number of machines for special batches, then it is judged that the status of the current machine meets the fourth dispatch condition for the current batch of wafers; if the number of machines in the current machine group that do not run special batches of wafers is less than the threshold number of machines for special batches, then it is judged that the status of the current machine does not meet the fourth dispatch condition for the current batch of wafers, and it is re-judged whether the status of the current machine meets the fourth dispatch condition for the current batch of wafers.

16. The method for dispatching work according to claim 7, characterized in that: If it is determined that the type of the current batch of wafers is a normal batch, it is determined that the state of the current machine meets the dispatching conditions of the current batch of wafers.

17. A device, characterized in that: include: processor; a memory for storing processor-executable instructions; Wherein, when the processor is configured to execute the instructions of the memory, the work dispatching method as described in any one of claims 6 to 16 is implemented.

18. A computer-readable storage medium, characterized in that: It includes computer instructions, and when the computer instructions are executed by a processor, the work dispatching method described in any one of claims 6 to 16 is implemented.