Position teaching device and position teaching method

Abstract

The invention provides a position teaching device and a position teaching method. The position teaching device is used for teaching the position of a wafer transmission mechanism for placing a wafer in a wafer chuck, and comprises a wafer simulation disc; when the feedback element is in contact with the second positioning surface, the detection loops output first feedback signals; when the feedback element is not in contact with the second positioning surface, the detection loop outputs a second feedback signal; and the control device is configured to control the wafer transmission mechanism to hold the wafer simulation disc, adjust the position of the wafer simulation disc in the wafer chuck, enable each detection loop to output a second feedback signal, enable each feedback element and the wafer chuck to be in a non-contact state, generate the position of the center of the wafer simulation disc in the state, and send the position of the center of the wafer simulation disc to the wafer chuck. And the position of the center of the wafer simulation disc is used as a teaching position of the wafer transmission mechanism for placing the wafer in the wafer chuck. The demonstration device is used for demonstrating the position of the wafer transmission mechanism for placing the wafer in the wafer chuck so as to ensure that the center of the wafer is accurately aligned with the center of the wafer chuck.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor integrated circuit manufacturing, and particularly relates to a position teaching device and a position teaching method. Background Art

[0002] In the semiconductor integrated circuit manufacturing process, the chemical plating process of the wafer is a very critical process. In the process of wafer chemical plating, in order to ensure the stability of the wafer plating quality, when the wafer is placed in the wafer chuck, it is necessary to ensure that the center of the wafer is aligned with the center of the wafer chuck. If the center of the wafer deviates from the center of the wafer chuck when the wafer is placed in the wafer chuck, it will affect the wafer plating effect and may even cause wafer fragments, so the accuracy of the wafer placement is particularly critical.

[0003] At present, the alignment between the center of the wafer and the center of the wafer chuck is obtained through the naked eye observation of the staff. The error of naked eye judgment is large, and it is easy to have a large error in human judgment. At the same time, the manual observation method is inefficient, which affects the production efficiency of the wafer. If the center of the wafer deviates greatly from the center of the wafer chuck, the wafer is easy to scratch the inner surface of the wafer chuck when it is placed in the wafer chuck. Scratches can easily cause particles to enter the plating solution and pollute the plating solution. Once the particles are electroplated on the wafer during electroplating, it will cause quality problems in the wafer electroplating. In severe cases, scratches can also cause wafer fragments, causing significant losses. Summary of the invention

[0004] In order to avoid a large deviation between the center of the wafer and the center of the wafer chuck when the wafer transfer mechanism transfers the wafer to the wafer chuck, the present invention proposes a position teaching device and a position teaching method.

[0005] In one aspect, the present invention provides a position teaching device for teaching a wafer transport mechanism to place a wafer in a wafer chuck, wherein the wafer chuck has a second positioning surface, and includes:

[0006] The wafer simulation plate has a first positioning surface, and when the wafer simulation plate is placed in the wafer chuck, the second positioning surface surrounds the outer side of the first positioning surface;

[0007] A plurality of detection loops, each detection loop comprising a feedback element, wherein the plurality of feedback elements are arranged on a first positioning surface of the wafer simulation disk and are spaced apart along a circumferential direction of the wafer simulation disk, wherein when the feedback element contacts the second positioning surface, the detection loop where the feedback element is located outputs a first feedback signal; and when the feedback element is not in contact with the second positioning surface, the detection loop where the feedback element is located outputs a second feedback signal;

[0008] The control device is configured to control the wafer transfer mechanism to hold the wafer simulation disk, adjust the position of the wafer simulation disk in the wafer chuck, make each detection circuit output the second feedback signal, so that each feedback element and the wafer chuck are in a non-contact state, and generate the position of the center of the wafer simulation disk in this state, and use the position of the center of the wafer simulation disk as the teaching position for the wafer transfer mechanism to place the wafer in the wafer chuck.

[0009] According to a specific implementation method of the embodiment of the present application, when the wafer simulation disk is built into the wafer chuck, the distance between the edge of the wafer simulation disk and the inner circumference of the wafer chuck does not exceed 0.1 mm.

[0010] According to a specific implementation of the embodiment of the present application, the distribution range of the plurality of feedback elements on the circumference of the wafer simulation disk is greater than one half of the circumference of the wafer simulation disk.

[0011] According to a specific implementation of the embodiment of the present application, the feedback element includes a moving contact, and the second positioning surface of the wafer chuck is provided with a stationary contact;

[0012] When the moving contact is in contact with the stationary contact, the detection circuit outputs a first feedback signal; when the moving contact is not in contact with the stationary contact, the detection circuit outputs a second feedback signal.

[0013] According to a specific implementation of the embodiment of the present application, the moving contact is a metal conductive layer.

[0014] According to a specific implementation of the embodiment of the present application, the feedback element includes a force-sensitive element;

[0015] When the force sensitive element contacts the second positioning surface of the wafer chuck, the detection circuit where the force sensitive element is located outputs a first feedback signal; when the force sensitive element is not in contact with the second positioning surface of the wafer chuck, the detection circuit where the force sensitive element is located outputs a second feedback signal.

[0016] According to a specific implementation of the embodiment of the present application, the feedback element includes a photosensitive element;

[0017] When the photosensitive element contacts the second positioning surface of the wafer chuck, the detection circuit where the photosensitive element is located outputs a first feedback signal; when the photosensitive element is not in contact with the second positioning surface of the wafer chuck, the detection circuit where the photosensitive element is located outputs a second feedback signal.

[0018] According to a specific implementation of the embodiment of the present application, each of the detection circuits further includes a signal display element.

[0019] According to a specific implementation of the embodiment of the present application, the signal display element includes: one or more combinations of an ammeter, a voltmeter, and a display light.

[0020] According to a specific implementation of an embodiment of the present application, the wafer simulation disk is made of insulating material.

[0021] In a second aspect, the present application proposes a position teaching device for teaching a wafer transfer mechanism the position of placing a wafer in a wafer chuck, wherein the wafer chuck has a second positioning surface, including:

[0022] The wafer simulation plate has a first positioning surface, and when the wafer simulation plate is placed in the wafer chuck, the second positioning surface surrounds the outer side of the first positioning surface;

[0023] A plurality of detection circuits, each detection circuit comprising a feedback element, wherein the plurality of feedback elements are arranged on the first positioning surface of the wafer simulation disk, wherein when the feedback element contacts the second positioning surface, the detection circuit where the feedback element is located outputs a first feedback signal; and when the feedback element is not in contact with the second positioning surface of the wafer chuck, the detection circuit where the feedback element is located outputs a second feedback signal;

[0024] The control device is configured to control the wafer transfer mechanism to hold the wafer simulation disk, adjust the position of the wafer simulation disk in the wafer chuck, and obtain the contact point position of each feedback element with the second positioning surface of the wafer chuck based on the position of each feedback element when each detection circuit outputs the first feedback signal, and calculate the center position of the circle where the multiple contact points are located based on the multiple contact point positions, and use the position of the center of the wafer simulation disk as the teaching position for the wafer transfer mechanism to place the wafer in the wafer chuck.

[0025] According to a specific implementation of the embodiment of the present application, the number of the detection loops is at least 3.

[0026] In a third aspect, the present application proposes a position teaching method for teaching a wafer transfer mechanism the position of placing a wafer in a wafer chuck, comprising:

[0027] The wafer transfer mechanism carries a wafer simulation plate having a first positioning surface;

[0028] The wafer transfer mechanism supports and transports the wafer simulation plate to a wafer chuck having a second positioning surface. When the wafer simulation plate is placed in the wafer chuck, the second positioning surface surrounds the outer side of the first positioning surface.

[0029] A plurality of detection circuits are used to detect the relative position of the wafer simulation disk and the wafer chuck; each detection circuit includes a feedback element, and a plurality of the feedback elements are arranged on the first positioning surface of the wafer simulation disk and are spaced apart along the circumferential direction of the wafer simulation disk, wherein when the feedback element contacts the second positioning surface, the detection circuit where the feedback element is located outputs a first feedback signal; when the feedback element is not in contact with the second positioning surface of the wafer chuck, the detection circuit where the feedback element is located outputs a second feedback signal;

[0030] A control device is used to control the wafer transfer mechanism to hold the wafer simulation disk, and adjust the position of the wafer simulation disk in the wafer chuck, so that each detection circuit outputs the second feedback signal, so that each feedback element and the wafer chuck are in a non-contact state, and the position of the center of the wafer simulation disk in this state is generated, and the position of the center of the wafer simulation disk is used as the teaching position for the wafer transfer mechanism to place the wafer in the wafer chuck and is stored.

[0031] In a fourth aspect, the present application proposes a position teaching method for teaching a wafer transfer mechanism the position of placing a wafer in a wafer chuck, comprising:

[0032] The wafer transfer mechanism carries a wafer simulation plate having a first positioning surface;

[0033] The wafer transfer mechanism supports and transports the wafer simulation plate to a wafer chuck having a second positioning surface. When the wafer simulation plate is placed in the wafer chuck, the second positioning surface surrounds the outer side of the first positioning surface.

[0034] A plurality of detection circuits are used to detect the relative position of the wafer simulation disk and the wafer chuck; each detection circuit includes a feedback element, and a plurality of the feedback elements are arranged on a first positioning surface of the wafer simulation disk, wherein when the feedback element contacts the second positioning surface, the detection circuit where the feedback element is located outputs a first feedback signal; when the feedback element is not in contact with the second positioning surface of the wafer chuck, the detection circuit where the feedback element is located outputs a second feedback signal;

[0035] The control device is used to control the wafer transfer mechanism to hold the wafer simulation disk, adjust the position of the wafer simulation disk in the wafer chuck, and based on the position of each feedback element when each detection circuit outputs the first feedback signal, obtain the contact point position of each feedback element and the second positioning surface of the wafer chuck, and calculate the center position of the circle where the multiple contact points are located based on the multiple contact point positions, and use the center position as the teaching position for the wafer transfer mechanism to place the wafer in the wafer chuck.

[0036] The position teaching device and position teaching method of the present invention are used to teach the wafer transfer mechanism the position of placing the wafer in the wafer chuck to ensure that the center of the wafer can be accurately aligned with the center of the wafer chuck when the wafer enters the wafer chuck. Other features and advantages of the present invention will be described in the subsequent description, and partly become obvious from the description, or can be understood by practicing the present invention. The objects and other advantages of the present invention can be realized and obtained by the structures indicated in the description, claims and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0038] Figure 1 A cross-sectional structural diagram of an exemplary electroplating device to which the present invention is applied is shown;

[0039] Figure 2a A schematic structural diagram showing a state in which the center of a wafer and the center of a wafer chuck are not aligned with each other according to an embodiment of the present invention;

[0040] Figure 2b A schematic structural diagram showing a state in which the center of a wafer and the center of a wafer chuck are aligned in accordance with an embodiment of the present invention;

[0041] Figure 3 A schematic diagram of the structure of a position teaching device according to Embodiment 1 of the present invention is shown;

[0042] Figure 4 A schematic diagram of the flow of the position teaching method of embodiment 1 of the present invention is shown;

[0043] Figure 5 A schematic diagram showing the relative positions of the wafer simulation plate and the wafer chuck after the teaching is completed in Embodiment 1 of the present invention is shown;

[0044] Figure 6 A schematic diagram of the flow chart of the position teaching method according to Embodiment 2 of the present invention is shown;

[0045] Figure 7a A schematic structural diagram is shown when the wafer simulation plate and the wafer chuck contact at point P1 according to Embodiment 2 of the present invention;

[0046] Figure 7b A schematic diagram showing the structure of the wafer simulation plate and the wafer chuck in contact at point P2 according to Embodiment 2 of the present invention; and

[0047] Figure 7cA schematic structural diagram is shown when the wafer simulation plate and the wafer chuck of Example 2 of the present invention are in contact at point P3. DETAILED DESCRIPTION

[0048] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0049] Please refer to Figure 1 , Figure 1 A cross-sectional structural diagram of an exemplary electroplating device to which the present invention is applied is shown. The electroplating device includes a wafer holding device 100, which is configured to clamp a wafer 20. The wafer holding device 100 includes a wafer chuck 110 of a cup-shaped structure, and the wafer chuck 110 has a second positioning surface 1101. In the present embodiment, the second positioning surface 1101 is the inner circumferential surface of the wafer chuck 110. During the electroplating process, the wafer 20 is positioned in the wafer chuck 110. The wafer holding device 100 also includes a clamping plate 120 and a driving mechanism 130, and the driving mechanism 130 drives the clamping plate 120 to move up and down. The clamping plate 120 can be lowered into the wafer chuck 110 under the drive of the driving mechanism 130 to clamp the wafer 20 in the wafer chuck 110. Before the electroplating process starts, the wafer transfer mechanism 300 transports the wafer 20 to the wafer chuck 110, and then the driving mechanism 130 drives the clamp 120 to apply a vertical downward force to the wafer 20 to clamp the wafer 20, and then the wafer holding device 100 holding the wafer 20 enters the electroplating chamber 200 containing the electroplating solution to carry out the electroplating process.

[0050] In the process of the wafer transfer mechanism 300 transferring the wafer 20 to the wafer chuck 110, it is desired that the center A of the wafer 20 is aligned with the center B of the wafer chuck 110 (i.e., when viewed along the center line of the wafer chuck, the center A coincides with the center B, such as Figure 2b As shown), it is not desirable that the center A of the wafer 20 is misaligned with the center B of the wafer chuck 110 (i.e., when viewed along the center line of the wafer chuck, the center A does not coincide with the center B, as shown in FIG. Figure 2aAs shown). If the center A of the wafer 20 is not aligned with the center B of the wafer chuck 110 during the placement of the wafer 20 on the wafer chuck 110, on the one hand, the edge of the wafer 20 will collide with the inner circumference of the wafer chuck 110 to generate particles, and the particles will fall into the electroplating solution and pollute the electroplating solution. During electroplating, the particles may be electroplated onto the wafer 20, affecting the quality of electroplating of the wafer 20; on the other hand, the wafer 20 may be placed in the wafer chuck 110 at an angle. When the driving mechanism 130 drives the clamping plate 120 to apply a vertical downward force to the wafer 20 to clamp the wafer 20, the wafer 20 may be easily crushed, resulting in a significant increase in production costs. Therefore, it is necessary to place the wafer 20 in a Figure 2b In the position state in the middle, the center A of the wafer 20 coincides with the center B of the wafer chuck 110.

[0051] Based on this, the present application proposes a position teaching device and a position teaching method, which are used to teach the wafer transfer mechanism the position of placing the wafer in the wafer chuck, so as to ensure that when the wafer enters the wafer chuck, the center of the wafer can be accurately aligned with the center of the wafer chuck. Next, the position teaching device and the teaching method of the present application are described in detail.

[0052] Example 1

[0053] Please refer to Figure 3 , Figure 3 The schematic diagram of the structure of the position teaching device according to the embodiment of the present invention is shown. The position teaching device comprises: a wafer simulation disk 410, a plurality of detection circuits and a control device.

[0054] The wafer simulation plate 410 replaces the wafer transfer mechanism 300 in the process of determining the teaching position. Figure 1 The wafer 20 in the wafer chuck 110 is carried and moved by the wafer transfer mechanism 300. When the wafer simulation disk 410 is placed in the wafer chuck 110, the distance between the side wall of the wafer simulation disk 410 and the inner peripheral surface of the wafer chuck 110 (i.e., the second positioning surface 1101) does not exceed the preset value. The wafer simulation disk 410 has a first positioning surface 411. In this embodiment, the first positioning surface 411 is the side wall of the wafer simulation disk 410. When the wafer simulation disk 410 is placed in the wafer chuck 110, the second positioning surface 1101 surrounds the outside of the first positioning surface 411. It should be understood that when the wafer transfer mechanism 300 is used to move the wafer simulation disk 410 into the wafer chuck 110, move it out of the wafer chuck 110, and move it in a small range inside the wafer chuck 110, the wafer transfer mechanism 300 does not limit the fixing method of the wafer simulation disk 410, and can adopt adsorption fixing or non-adsorption fixing.

[0055] Furthermore, the size and shape of the wafer simulation disk 410 can be selected to be the same as the wafer 20 during the electroplating process to better simulate the wafer 20 during the electroplating process. When the size and shape of the wafer simulation disk 410 are the same as the wafer 20 during the electroplating process, when the wafer simulation disk 410 is placed in the wafer chuck 110, the maximum distance between the side wall of the wafer simulation disk 410 and the inner circumference of the wafer chuck 110 does not exceed the preset value, and the preset value can be any value in the range of 0.01mm-3mm. Exemplarily, the preset value in the embodiment of the present application is 0.1mm. It is worth noting that the size and shape of the wafer simulation disk 410 are not required to be exactly the same as the wafer 20, and can be designed according to actual needs to meet the teaching needs. The manufacturing material of the wafer simulation disk 410 in the embodiment of the present invention is an insulating material.

[0056] In this embodiment, the distribution range of the feedback elements 421 of the multiple detection circuits on the circumference of the wafer simulation disk 410 is greater than one-half of the circumference of the wafer simulation disk 410. Furthermore, the multiple feedback elements 421 are arranged on the first positioning surface 411 of the wafer simulation disk 410, and are spaced apart along the circumferential direction of the wafer simulation disk 410. Among them, when the feedback element 421 is in contact with the second positioning surface 1101, its corresponding detection circuit outputs a first feedback signal; when the feedback element 421 is not in contact with the second positioning surface 1101, its corresponding detection circuit outputs a second feedback signal, and the first feedback signal is different from the second feedback signal. Among them, the feedback element 421 can be selected from but not limited to conductive contacts, force-sensitive elements, photosensitive elements, etc.

[0057] Furthermore, the detection circuit also includes a signal display element, which includes one or more combinations of an ammeter, a voltmeter, and a display light. As long as the display element can display the feedback signal output by the detection circuit, it is applicable to the protection scope of this application.

[0058] The control device is configured to control the wafer transfer mechanism 300 to hold the wafer simulation disk 410, adjust the position of the wafer simulation disk 410 in the wafer chuck 110, and make each detection circuit output a second feedback signal, so that each feedback element 421 and the second positioning surface 1101 of the wafer chuck 110 are in a non-contact state, and generate the position of the center of the wafer simulation disk 410 in this state, and use it as the teaching position for the wafer transfer mechanism 300 to place the wafer in the wafer chuck 110.

[0059] Exemplarily, in this embodiment, the wafer simulation disk 410 is made of insulating material and the size and shape of the wafer simulation disk 410 are the same as the wafer 20 in the actual electroplating process; the feedback element 421 in each detection circuit includes a moving contact, and each detection circuit also includes a conductive member 422, a power supply 423 and a static contact, and the static contact is arranged on the second positioning surface 1101 of the wafer chuck 110, wherein the power supply 423, the moving contact and the static contact form a series circuit through the conductive member 422. During the movement of the wafer simulation disk 410 in the wafer chuck 110, when the moving contact contacts the static contact, the detection circuit is turned on and outputs a first feedback signal; when the moving contact is not in contact with the static contact, the detection circuit is disconnected and outputs a second feedback signal. Exemplarily, in this embodiment, the signal display element can select a display light 424 connected in series in the detection circuit. During the teaching process, if a detection circuit outputs a first feedback signal, it indicates that the moving contact and the stationary contact are in contact. At this time, the detection circuit is turned on, and the first feedback signal output by the detection circuit is expressed as the display light 424 being in a lighted state; and when the moving contact and the stationary contact are not in contact, the detection circuit is disconnected, and the output second feedback signal is expressed as the display light 424 being in a non-lighted state. When the control device controls the wafer transfer mechanism 300 to hold the wafer simulation disk 410 and adjusts the position of the wafer simulation disk 410 in the wafer chuck 110, each detection circuit outputs a second feedback signal, that is, the display light 424 is in a non-lighted state, indicating that each feedback element 421 is in a non-contact state with the second positioning surface 1101 of the wafer chuck 110. At this time, because the size and shape of the wafer simulation disk 410 are the same as the wafer 20 in the electroplating process, the maximum distance between the edge of the wafer simulation disk 410 and the inner circumference of the wafer chuck 110 does not exceed the preset value of 0.1 mm. It can be basically considered that when the actual wafer 20 is placed in this position, it is safe and the electroplating quality can be guaranteed. Then the control device generates the position of the center of the wafer simulation disk 410 in this state, and uses this position as the teaching position for the wafer transfer mechanism 300 to place the wafer in the wafer chuck 110. It should be understood that in this embodiment, the signal display element can also select one or more combinations of an ammeter, a voltmeter, and a display light connected in series in the detection circuit.

[0060] It should be noted that the inner circumference of the wafer chuck 110 is generally made of conductive material, so in this embodiment, the static contact can be the entire inner circumference of the wafer chuck 110. The moving contact is a metal conductive layer that is as thin as possible to reduce the interference of the thickness of the metal conductive layer on the teaching position. When teaching, because the moving contact is set on the first positioning surface 411 of the wafer simulation disk 410, the thickness of the moving contact itself can also be regarded as a part of the wafer simulation disk 410 itself, and the distance between the wafer simulation disk 410 and the inner circumference of the wafer chuck 110 is already very small. If the thickness of the metal conductive layer is too thick, when teaching, it will cause the distance between the first positioning surface 411 provided with the feedback element 421 and the second positioning surface 1101 of the wafer chuck 110 to be greatly different from the distance between the first positioning surface 411 without the feedback element 421 and the second positioning surface 1101 of the wafer chuck 110, and it is impossible to ensure that the distance between the first positioning surface 411 and the second positioning surface 1101 is basically uniform. Therefore, in order to reduce the interference of the thickness of the metal conductive layer on the teaching position, the metal conductive layer can be plated on the first positioning surface 411 of the wafer simulation plate 410 .

[0061] In another embodiment, the feedback element 421 includes a force-sensitive element. The pressure between the first positioning surface 411 of the wafer simulation disk 410 and the second positioning surface 1101 of the wafer chuck 110 changes significantly when the two are in contact and not in contact. Therefore, the characteristic of the force-sensitive element that changes in response to external pressure changes can be used to make the detection circuit output different feedback signals, so as to accurately judge the contact state between the wafer simulation disk 410 and the wafer chuck 110. Specifically, when the force-sensitive element is in contact with the second positioning surface 1101 of the wafer chuck 110, the detection circuit outputs a first feedback signal; when the force-sensitive element is not in contact with the second positioning surface 1101 of the wafer chuck 110, the detection circuit outputs a second feedback signal. Exemplarily, force-sensitive elements include but are not limited to resistive, capacitive, piezoelectric, etc. Take a force-sensitive resistor as a force-sensitive element and an ammeter connected in series in a detection circuit as a signal display element as an example. When the force-sensitive resistor contacts the second positioning surface 1101 of the wafer chuck 110, the force-sensitive resistor has a first resistance value, and the ammeter outputs a first current value, and the first current value is used as the first feedback signal output by the detection circuit. Similarly, when the force-sensitive resistor is not in contact with the second positioning surface 1101 of the wafer chuck 110, the force-sensitive resistor has a second resistance value, and the ammeter outputs a second current value, and the second current value is used as the second feedback signal output by the detection circuit. Based on this, the control device can obtain the center position of the wafer simulation disk when each detection circuit outputs the second current value as the teaching position of the wafer transfer mechanism.

[0062] In another embodiment, the feedback element 421 includes a photosensitive element. The brightness of the light between the first positioning surface 411 of the wafer simulation disk 410 and the second positioning surface 1101 of the wafer chuck 110 is significantly different when the two are in contact and not in contact. Therefore, the characteristic of the photosensitive element that changes with the brightness of the light can be used to make the detection circuit output different feedback signals, so as to accurately judge the contact state between the wafer simulation disk 410 and the wafer chuck 110. Specifically, when the photosensitive element is in contact with the second positioning surface of the wafer chuck, the photosensitive element cannot receive the light, and at this time, the detection circuit outputs the first feedback signal; when the photosensitive element is not in contact with the second positioning surface of the wafer chuck, the photosensitive element can receive the light, and the detection circuit outputs the second feedback signal. Exemplarily, photosensitive elements include but are not limited to resistive, capacitive, piezoelectric, etc. In one example, a photoresistor can be selected as the feedback element 421, and an ammeter can be selected as the signal display element. The ammeter is connected in series in the corresponding detection circuit. The working principle of this example is similar to the example of using a force-sensitive resistor as the feedback element 421 and an ammeter as the signal display element. Please refer to the relevant description above and will not be repeated here.

[0063] It should be noted that the signal display element can be selected according to the specific type of the feedback element, and the line connection relationship of the signal display element in the detection circuit can be designed according to the specific type of the signal display element. For example, when a force-sensitive capacitor is used as a feedback element, a voltmeter can be selected as the signal display element, and the voltmeter is connected in parallel with the force-sensitive capacitor to display the voltage value of the force-sensitive capacitor, and the voltage value is used as the feedback signal output by the detection circuit.

[0064] In addition, it should be noted that the feedback element may also be a sensor including a force-sensitive element or a light-sensitive element, such as a pressure sensor or a light-sensitive sensor. In this case, the corresponding detection value displayed by the sensor can be directly used as a feedback signal output by the detection circuit, so that the control device controls the action of the wafer simulation disk 410 according to the detection value.

[0065] This embodiment is matched with a position teaching method for teaching the wafer transfer mechanism the position of placing the wafer in the wafer chuck, such as Figure 4 As shown, the position teaching method includes:

[0066] Step S410: The wafer transport mechanism carries a wafer simulation plate having a first positioning surface;

[0067] Step S420: The wafer transfer mechanism supports and transfers the wafer simulation plate to a wafer chuck having a second positioning surface. When the wafer simulation plate is placed in the wafer chuck, the second positioning surface surrounds the outer side of the first positioning surface.

[0068] Step S430: Detect the relative position of the wafer simulation disk and the wafer chuck using a plurality of detection circuits; each detection circuit includes a feedback element, and the plurality of feedback elements are arranged on the first positioning surface of the wafer simulation disk and are spaced apart along the circumferential direction of the wafer simulation disk, wherein when the feedback element contacts the second positioning surface, the detection circuit outputs a first feedback signal; when the feedback element does not contact the second positioning surface of the wafer chuck, the detection circuit outputs a second feedback signal;

[0069] Step S440: Using the control device to control the wafer transfer mechanism to hold the wafer simulation disk, adjust the position of the wafer simulation disk in the wafer chuck, so that each detection circuit outputs a second feedback signal, so that each feedback element and the wafer chuck are in a non-contact state, such as Figure 5 As shown, the position of the center of the wafer simulation disk in this state is generated and stored as the teaching position for the wafer transfer mechanism to place the wafer in the wafer chuck.

[0070] Example 2

[0071] This embodiment provides a position teaching device, the structure of which is basically the same as that of the position teaching device in Embodiment 1, except that the number of feedback elements in this embodiment is at least 3, and the control device is configured to control the wafer transfer mechanism 300 to hold the wafer simulation disk 410, and adjust the position of the wafer simulation disk 410 in the wafer chuck 110, and obtain the contact point position of each feedback element 410 and the second positioning surface 1101 of the wafer chuck 110 based on the position of each feedback element 410 when each detection circuit outputs the first feedback signal, and calculate the center position of the circle where the multiple contact points are located according to the multiple contact point positions, and use the center position as the teaching position for the wafer transfer mechanism 300 to place the wafer in the wafer chuck 110. The teaching position can ensure that in the actual process, the wafer 20 transferred by the wafer transfer mechanism 300 is accurately aligned with the wafer chuck 110, and prevent the problem of particle contamination or debris caused by the placement deviation of the wafer 20 and the collision with the wafer chuck 110.

[0072] At the same time, this embodiment also provides a position teaching method for teaching the wafer transfer mechanism the position of placing the wafer in the wafer chuck, such as Figure 6 As shown, the position teaching method of this embodiment includes:

[0073] Step S610: enabling a wafer transport mechanism to carry a wafer simulation plate having a first positioning surface;

[0074] Step S620: The wafer transfer mechanism supports and transfers the wafer simulation plate to a wafer chuck having a second positioning surface. When the wafer simulation plate is placed in the wafer chuck, the second positioning surface surrounds the outer side of the first positioning surface.

[0075] Step S630: Detecting the relative position of the wafer simulation plate and the wafer chuck using a plurality of detection circuits; each detection circuit includes a feedback element, and the plurality of feedback elements are arranged on the first positioning surface of the wafer simulation plate, wherein when the feedback element contacts the second positioning surface, the detection circuit outputs a first feedback signal; when the feedback element does not contact the second positioning surface of the wafer chuck, the detection circuit outputs a second feedback signal;

[0076] Step S640: Use the control device to control the wafer transfer mechanism to hold the wafer simulation disk, adjust the position of the wafer simulation disk in the wafer chuck, and based on the position of each feedback element when each detection circuit outputs a first feedback signal, obtain the contact point position of each feedback element and the second positioning surface of the wafer chuck, and calculate the center position of the circle where the multiple contact points are located based on the multiple contact point positions, and use the center position as the teaching position for the wafer transfer mechanism to place the wafer in the wafer chuck.

[0077] For details, please refer to Figure 7a , Figure 7b and Figure 7cWhen the control device controls the wafer transfer mechanism 300 to hold the wafer simulation disk 410 and drives the wafer simulation disk 410 to move in the wafer chuck 110, the control device first controls the wafer transfer mechanism 300 to drive the wafer simulation disk 410 to move in the direction closest to the feedback element 421A, so that the feedback element 421A is tangent to the second positioning surface of the wafer chuck 110, and the contact point when tangent is P1 (x1, y1); then the control device controls the wafer transfer mechanism 300 to drive the wafer simulation disk 410 to move in the direction closest to the feedback element 421B, so that the feedback element 421B is tangent to the second positioning surface of the wafer chuck 110, and the contact point when tangent is P1 (x1, y1); The contact point at that time is P2(x2,y2); then the wafer transfer mechanism is controlled to drive the wafer simulation disk 410 to move in the direction closest to the feedback element 421C, so that the feedback element 421C is tangent to the second positioning surface of the wafer chuck 110, and the contact point at that time is P3(x3,y3); the three contact points P1(x1,y1), P2(x2,y2) and P3(x3,y3) are all on the second positioning surface of the wafer chuck 110, and the control device calculates the center coordinates of the circle where the three contact points are located according to the coordinates of the three contact points determined, and the center coordinates are the center coordinates of the wafer chuck 110. In the actual process, if the wafer transfer mechanism 300 places the center of the carried wafer 20 at the center coordinates, the accuracy of wafer placement can be guaranteed. Therefore, the coordinates of the center of the circle are used as the teaching position for the wafer transfer mechanism 300 to place the wafer in the wafer chuck 110. When the wafer transfer mechanism 300 transfers the wafer 20 to the wafer chuck 110 in the actual process, the center of the wafer 20 is directly aligned with the obtained teaching position, so as to ensure the accuracy of the placement of the wafer 20. Through the position teaching device and teaching method of this embodiment, the position of the wafer transfer mechanism when placing the wafer can be determined more accurately, thereby preventing the risk of collision, scratches or fragments caused by the wafer being placed off-center. The teaching position obtained by the device and method of this embodiment is more accurate, thereby ensuring that when the wafer 20 enters the electroplating chamber, it can be more accurately aligned with the wafer chuck 110, avoiding the phenomenon that particles generated by the scratches between the wafer and the wafer chuck 110 contaminate the electroplating solution, thereby further improving the working efficiency of the electroplating process while ensuring the quality of electroplating.

[0078] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein; and these modifications or substitutions do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A position teaching device for teaching a wafer transfer mechanism the position of placing a wafer in a wafer chuck, wherein the wafer chuck has a second positioning surface, characterized in that: include: The wafer simulation plate has a first positioning surface, and when the wafer simulation plate is placed in the wafer chuck, the second positioning surface surrounds the outer side of the first positioning surface; A plurality of detection loops, each detection loop comprising a feedback element, wherein the plurality of feedback elements are arranged on a first positioning surface of the wafer simulation disk and are spaced apart along a circumferential direction of the wafer simulation disk, wherein when the feedback element contacts the second positioning surface, the detection loop where the feedback element is located outputs a first feedback signal; and when the feedback element is not in contact with the second positioning surface, the detection loop where the feedback element is located outputs a second feedback signal; The control device is configured to control the wafer transfer mechanism to hold the wafer simulation disk, adjust the position of the wafer simulation disk in the wafer chuck, make each detection circuit output the second feedback signal, so that each feedback element and the wafer chuck are in a non-contact state, and generate the position of the center of the wafer simulation disk in this state, and use the position of the center of the wafer simulation disk as the teaching position for the wafer transfer mechanism to place the wafer in the wafer chuck.

2. The position teaching device according to claim 1, characterized in that: When the wafer simulation disk is built into the wafer chuck, the distance between the edge of the wafer simulation disk and the inner circumference of the wafer chuck does not exceed 0.1 mm.

3. The position teaching device according to claim 1, characterized in that: The distribution range of the plurality of feedback elements on the circumference of the wafer simulation disk is greater than one half of the circumference of the wafer simulation disk.

4. The position teaching device according to claim 1, characterized in that: The feedback element comprises a moving contact, and the second positioning surface of the wafer chuck is provided with a stationary contact; When the moving contact contacts the static contact, the detection circuit outputs a first feedback signal; When the moving contact is out of contact with the static contact, the detection circuit outputs a second feedback signal.

5. The position teaching device according to claim 4, characterized in that: The moving contact is a metal conductive layer.

6. The position teaching device according to claim 1, characterized in that: The feedback element includes a force-sensitive element; When the force sensitive element contacts the second positioning surface of the wafer chuck, the detection circuit where the force sensitive element is located outputs a first feedback signal; when the force sensitive element is not in contact with the second positioning surface of the wafer chuck, the detection circuit where the force sensitive element is located outputs a second feedback signal.

7. The position teaching device according to claim 1, characterized in that: The feedback element includes a photosensitive element; When the photosensitive element contacts the second positioning surface of the wafer chuck, the detection circuit where the photosensitive element is located outputs a first feedback signal; when the photosensitive element is not in contact with the second positioning surface of the wafer chuck, the detection circuit where the photosensitive element is located outputs a second feedback signal.

8. The position teaching device according to claim 1, characterized in that: Each of the detection circuits further includes a signal display element.

9. The position teaching device according to claim 8, characterized in that: The signal display element includes: one or more combinations of an ammeter, a voltmeter, and a display light.

10. The position teaching device according to claim 1, characterized in that: The wafer simulation disk is made of insulating material.

11. A position teaching device for teaching a wafer transfer mechanism the position of placing a wafer in a wafer chuck, wherein the wafer chuck has a second positioning surface, characterized in that: include: The wafer simulation plate has a first positioning surface, and when the wafer simulation plate is placed in the wafer chuck, the second positioning surface surrounds the outer side of the first positioning surface; A plurality of detection circuits, each detection circuit comprising a feedback element, wherein the plurality of feedback elements are arranged on the first positioning surface of the wafer simulation disk, wherein when the feedback element contacts the second positioning surface, the detection circuit where the feedback element is located outputs a first feedback signal; and when the feedback element is not in contact with the second positioning surface of the wafer chuck, the detection circuit where the feedback element is located outputs a second feedback signal; The control device is configured to control the wafer transfer mechanism to hold the wafer simulation disk, adjust the position of the wafer simulation disk in the wafer chuck, and obtain the contact point position of each feedback element with the second positioning surface of the wafer chuck based on the position of each feedback element when each detection circuit outputs the first feedback signal, and calculate the center position of the circle where the multiple contact points are located based on the multiple contact point positions, and use the position of the center of the wafer simulation disk as the teaching position for the wafer transfer mechanism to place the wafer in the wafer chuck.

12. The position teaching device according to claim 11, characterized in that: The number of the detection loops is at least 3.

13. A position teaching method for teaching a wafer transfer mechanism the position of placing a wafer in a wafer chuck, characterized in that: include: The wafer transfer mechanism carries a wafer simulation plate having a first positioning surface; The wafer transfer mechanism supports and transports the wafer simulation plate to a wafer chuck having a second positioning surface. When the wafer simulation plate is placed in the wafer chuck, the second positioning surface surrounds the outer side of the first positioning surface. A plurality of detection circuits are used to detect the relative position of the wafer simulation disk and the wafer chuck; each detection circuit includes a feedback element, and a plurality of the feedback elements are arranged on the first positioning surface of the wafer simulation disk and are spaced apart along the circumferential direction of the wafer simulation disk, wherein when the feedback element contacts the second positioning surface, the detection circuit where the feedback element is located outputs a first feedback signal; when the feedback element is not in contact with the second positioning surface of the wafer chuck, the detection circuit where the feedback element is located outputs a second feedback signal; A control device is used to control the wafer transfer mechanism to hold the wafer simulation disk, and adjust the position of the wafer simulation disk in the wafer chuck, so that each detection circuit outputs the second feedback signal, so that each feedback element and the wafer chuck are in a non-contact state, and the position of the center of the wafer simulation disk in this state is generated, and the position of the center of the wafer simulation disk is used as the teaching position for the wafer transfer mechanism to place the wafer in the wafer chuck and is stored.

14. A position teaching method for teaching a wafer transfer mechanism the position of placing a wafer in a wafer chuck, characterized in that: include: The wafer transfer mechanism carries a wafer simulation plate having a first positioning surface; The wafer transfer mechanism supports and transports the wafer simulation plate to a wafer chuck having a second positioning surface. When the wafer simulation plate is placed in the wafer chuck, the second positioning surface surrounds the outer side of the first positioning surface. A plurality of detection circuits are used to detect the relative position of the wafer simulation disk and the wafer chuck; each detection circuit includes a feedback element, and a plurality of the feedback elements are arranged on a first positioning surface of the wafer simulation disk, wherein when the feedback element contacts the second positioning surface, the detection circuit where the feedback element is located outputs a first feedback signal; when the feedback element is not in contact with the second positioning surface of the wafer chuck, the detection circuit where the feedback element is located outputs a second feedback signal; The control device is used to control the wafer transfer mechanism to hold the wafer simulation disk, adjust the position of the wafer simulation disk in the wafer chuck, and based on the position of each feedback element when each detection circuit outputs the first feedback signal, obtain the contact point position of each feedback element and the second positioning surface of the wafer chuck, and calculate the center position of the circle where the multiple contact points are located based on the multiple contact point positions, and use the center position as the teaching position for the wafer transfer mechanism to place the wafer in the wafer chuck.

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