Automatic feeding and discharging silicon-based ferroelectric and piezoelectric film preparation production equipment

Abstract

The invention discloses automatic feeding and discharging silicon-based ferroelectric and piezoelectric film preparation production equipment which comprises an orbit determination bearing table used for supporting other devices. The wafer storage device is used for storing the to-be-coated silicon wafers and enabling the plurality of to-be-coated silicon wafers to be arranged in the vertical direction, and gaps are formed among the plurality of to-be-coated silicon wafers; the wafer fork and positioning device is used for taking out the silicon wafer to be coated from the wafer storage device and moving the silicon wafer to the automatic coating device for centering and positioning; the automatic film coating device is used for fixing the to-be-coated silicon wafer and coating the to-be-coated silicon wafer with a film to prepare a to-be-annealed silicon wafer; and the to-be-annealed silicon wafer is transferred into the annealing device for annealing and tempering operation, and the thin film is obtained.According to the silicon-based ferroelectric and piezoelectric thin film preparation process, through reasonable design of the whole process of feeding, film coating, annealing and discharging, the silicon-based ferroelectric and piezoelectric thin film preparation process is more perfect.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor chip production, and in particular to a preparation and production device for silicon-based ferroelectric and piezoelectric films with automatic loading and unloading. Background Art

[0002] In the production and preparation of various types of semiconductor chips (silicon wafers), the preparation of silicon-based ferroelectric and piezoelectric films is a very important process. The silicon-based ferroelectric and piezoelectric film preparation and production equipment currently used in the market has a low degree of automation, poor stability, and low efficiency, and cannot accurately control the annealing temperature and annealing time of the annealing process. Most silicon-based ferroelectric and piezoelectric film preparation and production equipment are expensive, large in size, and energy-intensive, and cannot be mass-produced. At this stage, there is still a lack of silicon-based ferroelectric and piezoelectric film preparation and production equipment with high degree of automation, controllable process, high efficiency, and high cost performance, which can automatically load and unload materials. In response to the above problems, a solution is proposed below. Summary of the invention

[0003] The purpose of the present invention is to provide a preparation and production equipment for silicon-based ferroelectric and piezoelectric films with automatic loading and unloading, which solves the technical problems that it is impossible to realize automatic control of the entire process of loading, coating, annealing and unloading, and it is impossible to accurately control the annealing temperature and annealing time.

[0004] The above technical objectives of the present invention are achieved through the following technical solutions: A silicon-based ferroelectric and piezoelectric film preparation and production equipment with automatic loading and unloading, comprising A track-fixing load-bearing platform, which is used to support other devices; A wafer storage device, wherein the wafer storage device is used to store silicon wafers to be coated, and to arrange a plurality of silicon wafers to be coated in a vertical direction with gaps between the plurality of silicon wafers to be coated; A sheet fork and a positioning device, wherein the sheet fork and the positioning device are used to take out the silicon wafer to be coated from the sheet storage device and move it to the automatic coating device; An automatic coating device, the automatic coating device is used to fix the silicon wafer to be coated and coat the silicon wafer to be coated to obtain the silicon wafer to be annealed; The annealing device removes the silicon wafer to be annealed from the automatic film coating device, performs annealing and tempering operations on it, and obtains a thin film.

[0005] Preferably, the wafer storage device comprises a silicon wafer box, in which silicon wafers to be coated are contained, and limiting grooves are provided on both sides of the cavity of the silicon wafer box, and both sides of the silicon wafer to be coated are clamped in the limiting grooves, and a plurality of the limiting grooves support a plurality of silicon wafers to be coated, so that there are gaps between the plurality of silicon wafers to be coated.

[0006] Preferably, the wafer storage device also includes a cylinder, a lifting platform and a plurality of guide rails, wherein the plurality of guide rails are vertically fixed on the frame, the lifting platform is provided with a plurality of guide holes, the guide holes are sleeved on the plurality of guide rails and are slidably connected to the guide rails, the silicon wafer box is fixed on the upper end surface of the lifting platform, the cylinder is fixed on the fixed rail load-bearing platform, and the cylinder is located below the lifting platform, and the output shaft of the cylinder is fixedly connected to the lower end surface of the lifting platform.

[0007] Preferably, the fork and positioning device include a mounting seat, a second motor, a screw rod and a fork, the mounting seat being fixed on the fixed rail load-bearing platform and being located at a rear position above the positioning load-bearing platform, the mounting seat being provided with a mounting groove, a slide rail being fixedly provided on the side wall of the mounting groove, a slider being provided on the slider, the second motor being located at one end of the mounting groove, the output shaft of the second motor being connected to a screw rod, one side of the slider being threadedly connected to the screw rod, a fork arm being provided on one side of the fork, the fork arm being arranged perpendicular to the fork in the horizontal direction, and the end of the fork arm away from the fork being connected to the slider.

[0008] Preferably, the fork and positioning device also include a positioning clamp controller and two clamp arms, one end of the two clamp arms is connected to the positioning clamp controller, the positioning clamp controller is used to control the movement of the two clamp arms, and a clamp block is provided at one end of the clamp arm away from the positioning clamp controller.

[0009] Preferably, the automatic coating device includes a coating machine, a glue dripping mechanism and a displacement device. The coating machine is provided with a wafer support, which is an adsorbable wafer support and is used to fix the silicon wafer to be coated. The glue dripping mechanism is connected to the displacement device, and the displacement device controls the movement of the glue dripping mechanism so that the glue dripping mechanism completes the glue dripping on the silicon wafer to be coated.

[0010] Preferably, the displacement device includes a base, a displacement platform and a slide rail connecting block, the base is fixed on the fixed rail load-bearing platform, the displacement platform is fixed on the base, a displacement groove is provided on the displacement platform, a slide rail three is fixed on the side wall of the displacement groove, a slider three is provided on the slide rail three, the slider three is slidably connected to the slide rail three, a motor three is fixed in the displacement groove, a screw rod two is connected to the output shaft of the motor three, one side of the slider three is threadedly connected to the screw rod two, the screw rod two is used to drive the slider three to move, the slide rail connecting block is fixed on the upper end of the slider three, the upper end of the slide rail connecting block is connected to the slide rail two, the slide rail two is provided with a slider two, the slider two is slidably connected to the slide rail two, and the glue dripping mechanism is fixed on the slider two.

[0011] Preferably, the glue dripping mechanism includes a glue dripping block, a servo and a glue dripping head, the glue dripping block is fixedly connected to the second slider, the servo is fixed to the upper end surface of the glue dripping block, the glue dripping head is located below one side of the glue dripping block, the glue dripping head is connected to a glue dripping connecting arm, the glue dripping connecting arm longitudinally penetrates the glue dripping block and is slidably connected to the glue dripping block, one side of the glue dripping block is provided with teeth, the gear on the output shaft of the servo is meshed with the teeth on one side of the glue dripping block, and the glue dripping head is located directly in front of the third slider.

[0012] Preferably, the annealing device comprises an inlet conveyor belt, an in-furnace conveyor belt, an outlet conveyor belt, an annealing furnace, a loading platform and a unloading platform. The lower end of the loading platform is connected to a second cylinder, and the output shaft of the second cylinder is vertically arranged upward. A small wafer holder is connected to the output shaft of the second cylinder, and the small wafer holder is used to adsorb the silicon wafer to be annealed. A silicon wafer tray is also provided on the loading platform, and a center hole is opened at the center of the silicon wafer tray. The second cylinder controls the small wafer holder to pass through the center hole. The loading platform is also provided with a There is a cylinder three, and the cylinder three is used to push the silicon wafer tray on the loading platform to the input conveyor belt. The input conveyor belt, the furnace conveyor belt and the output conveyor belt are all fixed on the fixed track load-bearing platform, and the three parts of the conveyor belt are connected end to end in sequence. The furnace conveyor belt is located in the annealing furnace, and the unloading platform includes a return platform and a loading platform. The return platform and the loading platform are located on both sides of the same position of the fixed track load-bearing platform. The return platform is provided with a cylinder four, and the cylinder four is used to push the film to move the film to the loading platform.

[0013] Preferably, the fixed-track load-bearing platform is provided with upwardly protruding conveying walls on both sides of the positions of the inlet conveyor belt and the outlet conveyor belt, the height of the conveying wall is higher than the position of the silicon wafer tray, and the conveying wall is provided with a downwardly recessed unloading port at the position of the unloading platform, and the height of the conveying wall at the unloading port is consistent with the height of the silicon wafer tray.

[0014] The beneficial effects of the present invention are as follows: the equipment can realize full automation of the entire silicon-based ferroelectric and piezoelectric film preparation process; by arranging a silicon wafer limit groove on the wafer fork, the silicon wafer is prevented from slipping or falling off when the wafer fork starts or pauses quickly; a silicone head is arranged on the positioning clamp to protect the silicon wafer from being clamped during the positioning process; by designing an adsorbable wafer support, the stability of the silicon wafer during coating is improved; by designing a two-link mechanism, the function of the silicon wafer tray to load and unload materials together with the tray can be realized; by designing an annealing furnace device, the annealing time and annealing temperature of the silicon wafer can be accurately controlled. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a structural schematic diagram of an embodiment; Figure 2 It is a schematic diagram of the structure of the film storage device, the film fork and the positioning device and the automatic film coating device of the embodiment; Figure 3for Figure 2 Enlarged view of area A in the middle; Figure 4 It is a structural schematic diagram of the automatic film coating device of the embodiment; Figure 5 It is a structural schematic diagram of a silicon wafer box in an embodiment; Figure 6 It is a structural schematic diagram of the mounting seat of the embodiment.

[0016] Figure numerals: 1, track-fixed load-bearing platform; 2, wafer storage device; 21, silicon wafer box; 22, silicon wafer to be coated; 23, limit groove; 24, cylinder 1; 25, lifting platform; 26, guide rail; 3, film fork and positioning device; 31, mounting seat; 32, motor 2; 33, screw rod 1; 34, film fork; 35, slide rail 1; 36, slider 1; 37, fork arm; 38, positioning clamp controller; 39, clamp arm; 4, automatic film coating device; 41, film coating machine; 411, film support; 42, glue dripping mechanism; 421, glue dripping block; 422, steering gear; 423, glue dripping head; 424, glue dripping connecting arm; 43 , displacement device; 431, base; 432, displacement platform; 433, slide rail connecting block; 434, slide rail three; 435, slider three; 436, motor three; 437, screw rod two; 438, slide rail two; 439, slider two; 5, annealing device; 51, inlet conveyor belt; 52, conveyor belt in furnace; 53, outlet conveyor belt; 54, annealing furnace; 55, loading platform; 551, cylinder two; 552, small wafer tray; 553, silicon wafer tray; 554, cylinder three; 56, unloading platform; 561, unloading platform; 562, loading platform; 563, cylinder four; 57, transmission wall; 58, unloading port. DETAILED DESCRIPTION

[0017] The following is only a preferred embodiment of the present invention, and the protection scope is not limited to this embodiment. All technical solutions under the concept of the present invention should belong to the protection scope of the present invention. The same parts are represented by the same figure marks. It should be noted that the words "front", "rear", "left", "right", "up" and "down" used in the following description refer to the directions in the drawings, and the words "bottom" and "top", "inside" and "outside" refer to the directions toward or away from the geometric center of a specific component, respectively.

[0018] like Figures 1 to 6As shown, a preparation and production equipment for silicon-based ferroelectric and piezoelectric films with automatic loading and unloading includes a fixed track load-bearing platform 1, a film storage device 2, a film fork and positioning device 3, an automatic film coating device 4 and an annealing device 5, wherein the film storage device 2 is used to store the silicon wafers 22 to be coated, the fixed track load-bearing platform 1 serves as a support, and the remaining devices are arranged on the fixed track load-bearing platform 1. The general process flow of this equipment is that the film fork and positioning device 3 take out the silicon wafers 22 to be coated from the film storage device 2, and after cooperating with the automatic film coating device 4 to complete the centering and positioning of the silicon wafers 22 to be coated, the silicon wafers 22 to be coated are placed on the automatic film coating device 4. The automatic film coating device 4 drips glue and coats the silicon wafers 22 to be coated to obtain silicon wafers to be annealed. After that, the silicon wafers to be annealed are sent to the annealing device 5 through the film fork and positioning device 3 for annealing and tempering operations, and finally the desired film is obtained.

[0019] The wafer storage device 2 includes a wafer box 21, a cylinder 24, a lifting platform 25 and a plurality of guide rails 26. In this design, there are four guide rails 26, which are respectively located at the four corners of the lifting platform 25. The four guide rails 26 are vertically fixed on the frame, and the lifting platform 25 is sleeved on the four guide rails 26 through the guide holes opened at the four corners, and is slidably connected with the guide rails 26. The wafer box 21 is fixed on the upper end surface of the lifting platform 25, and the cylinder 24 is located on the lower end surface of the lifting platform 25. The cylinder 24 is fixedly connected to the fixed rail load-bearing platform 1, and the output shaft of the cylinder 24 is vertically upward and fixedly connected to the lower end surface of the lifting platform 25. The cylinder 24 can adjust the height of the wafer box 21 by driving the lifting platform 25 to move. Limiting grooves 23 are provided on both sides of the cavity of the silicon wafer box 21. Both sides of the silicon wafer 22 to be coated are stuck in the limiting grooves 23. Several limiting grooves 23 support several silicon wafers 22 to be coated, so that there are gaps between the several silicon wafers 22 to be coated in the silicon wafer box 21.

[0020] The fork and positioning device 3 includes a mounting seat 31, a motor 32, a screw 33, a fork 34, a positioning clamp controller 38 and two clamp arms 39. The mounting seat 31 is fixed on the fixed rail load-bearing platform 1, and a mounting slot is provided on the mounting seat 31. The motor 32 is located at one end of the mounting slot. The output shaft of the motor 32 is connected to the screw 33, and the other end of the screw 33 is connected to the bearing installed at the other end of the mounting slot, so that the screw 33 can rotate smoothly. A slide rail 35 is fixed on the side wall of the mounting slot, and a slider 36 is provided on the slide rail 35. The slider 36 is slidably connected to the slide rail 35, and one side of the slider 36 protrudes outward, and a threaded hole is opened at the protruding position. The slider 36 is threadedly connected to the screw 33 through the threaded hole, so that the motor 32 and the screw 33 can drive the slider 36 to move. A fork arm 37 is provided on one side of the fork 34, and the fork arm 37 is arranged vertically with the fork 34 in the horizontal direction, and one end of the fork arm 37 away from the fork 34 is connected to the slider 1 36. When the slider 1 36 moves, it will drive the fork 34 to move synchronously.

[0021] The positioning clamp controller 38 and the two clamp arms 39 are mainly used to realize the positioning of the silicon wafer 22 to be coated. The positioning clamp controller 38 is fixed on the mounting seat 31. The positioning clamp controller 38 is a device that can make the output shafts at both ends move out or retract synchronously, such as a double-headed electric push rod, or two electric push rods are fixed in reverse and controlled by the same controller. The two clamp arms 39 are respectively fixed on the two output shafts of the positioning clamp controller 38. The positioning clamp controller 38 can control the two clamp arms 39 to move closer or farther away from each other. The position of the positioning clamp controller 38 remains fixed, and the two clamp arms 39 move in opposite directions and at the same speed when moving. A clamp block is provided at the end of the clamp arm 39 away from the positioning clamp controller 38, and a silicone head is arranged on the clamp block to protect the silicon wafer from being clamped during the positioning process.

[0022] The automatic coating device 4 includes a coating machine 41, a glue dripping mechanism 42 and a displacement device 43. The coating machine 41 is provided with a wafer support 411. The wafer support 411 is an adsorbable wafer support 411, that is, it can provide downward suction to fix the silicon wafer 22 to be coated placed on the wafer support 411. The source of the suction can be a vacuum machine or other equipment.

[0023] The displacement device 43 includes a base 431, a displacement platform 432 and a slide rail connection block 433. The base 431 is fixed on the fixed rail load-bearing platform 1, and the displacement platform 432 is fixed on the base 431. A displacement groove is provided on the displacement platform 432, and a motor 3 436 is fixed in the displacement groove. A screw 2 437 is connected to the output shaft of the motor 3 436, and the other end of the screw 2 437 is fixed in the bearing in the displacement groove. A slide rail 3 434 is fixed on the side wall of the displacement groove, and a slider 3 435 is provided on the slide rail 3 434. The slider 3 435 is slidably connected to the slide rail 3 434, and one side of the slider 3 435 is threadedly connected to the screw 2 437.

[0024] The slide rail connection block 433 is fixed to the upper end of the slider 3 435. The upper end of the slide rail connection block 433 is connected to the slide rail 2 438. The slide rail 2 438 and the slide rail 3 434 are both arranged horizontally. If the slide rail 3 434 is oriented in the Y-axis direction, the slide rail 2 438 is oriented in the X-axis direction. The slide rail 2 438 is provided with a slider 2 439. The slider 2 439 is slidably connected to the slide rail 2 438. In a normal state, the slider 2 439 is locked on the slide rail 2 438 by fasteners such as bolts so that it does not slide. When the position needs to be adjusted, the fasteners are manually loosened, and then the position of the slider 2 439 is manually adjusted.

[0025] The glue dripping mechanism 42 is fixed on the slider 439 and moves with the slider 439. The glue dripping mechanism 42 includes glue dripping, a steering gear 422 and a glue dripping head 423. The glue dripping block 421 is fixedly connected to the slider 439, and the steering gear 422 is fixed to the upper end surface of the glue dripping block 421. The glue dripping head 423 is connected with a glue dripping connecting arm 424, which vertically penetrates the glue dripping block 421 and is slidably connected to the glue dripping block 421. One side of the glue dripping block 421 is provided with teeth, and the gear on the output shaft of the steering gear 422 meshes with the teeth on one side of the glue dripping block 421. After the steering gear 422 is started, the height of the glue dripping head 423 in the vertical direction can be adjusted. The glue dripping head 423 is located in front of the slider 3 435 to facilitate the control of the position of the glue dripping head 423. After the glue dripping and coating of the silicon wafer 22 to be coated are completed, the silicon wafer to be annealed is obtained.

[0026] The annealing device 5 includes an inlet conveyor belt 51, an in-furnace conveyor belt 52, an outlet conveyor belt 53, an annealing furnace 54, a loading platform 55, and an unloading platform 56. The inlet conveyor belt 51, the in-furnace conveyor belt 52, and the outlet conveyor belt 53 are all fixed on the fixed track load-bearing platform 1, and the three parts of the conveyor belts are connected end to end in sequence, and the in-furnace conveyor belt 52 is located in the annealing furnace 54. The fixed track load-bearing platform 1 is provided with upwardly protruding conveying walls 57 on both sides of the positions of the inlet conveyor belt 51 and the outlet conveyor belt 53. The height of the conveying wall 57 is higher than the position of the silicon wafer tray 553 to prevent the objects on the inlet conveyor belt 51 and the outlet conveyor belt 53 from falling.

[0027] The loading platform 55 is located on one side of the inlet conveyor belt 51. The lower end of the loading platform 55 is connected to a cylinder 2 551. The output shaft of the cylinder 2 551 is vertically arranged upward. The output shaft of the cylinder 2 551 is connected to a small wafer holder 552, which is used to adsorb the silicon wafer to be annealed. The loading platform 55 is also provided with a silicon wafer tray 553. There are multiple silicon wafer trays 553, which will move in the order of loading platform 55-inlet conveyor belt 51-furnace conveyor belt 52-outlet conveyor belt 53-loading platform 55. The silicon wafer tray 553 is used to support the silicon wafer to be annealed. A center hole is opened at the center of the silicon wafer tray 553, and the cylinder 2 551 controls the small wafer holder 552 to pass through the center hole. The loading platform 55 is also provided with a cylinder 3 554, which is used to push the silicon wafer tray 553 on the loading platform 55 onto the inlet conveyor belt 51.

[0028] The unloading platform 56 includes a material unloading platform 561 and a material loading platform 562. The material unloading platform 561 and the material loading platform 562 are located on both sides of the same position of the fixed track bearing platform 1. The conveying wall 57 is provided with a downwardly concave unloading port 58 at the position of the unloading platform 56. The height of the conveying wall 57 at the unloading port 58 is consistent with the height of the silicon wafer tray 553. The unloading platform 561 is provided with a cylinder 4 563, and the cylinder 4 563 is used to push the silicon wafer tray 553 so that the silicon wafer tray 553 moves to the material loading platform 562. In order to facilitate the pushing of the silicon wafer tray 553 and the film, a push plate with an L-shaped cross section is provided on the output shafts of the cylinder 3 554 and the cylinder 4 563.

[0029] Working principle: The cylinder 1 24 starts working, driving the lifting platform 25 to rise and fall along the guide rail 26, driving the silicon wafers 22 to be coated in the silicon wafer box 21 to rise and fall. The cylinder 1 24 drives the silicon wafers 22 to be coated to a predetermined height, waiting for the wafers to be taken out. In the wafer storage device 2, the silicon wafers 22 to be coated are arranged vertically in the silicon wafer box 21, and continuous wafer preparation can be achieved by changing the height of the silicon wafer box 21. The silicon wafer box 21 is easy to install and replace, which improves work efficiency and work stability.

[0030] The wafer storage device 2 is ready to take out the wafer, and the motor 2 32 starts working, driving the screw 1 33 to work. The slider 1 36 fixedly connected to the screw 1 33 and the fork 34 indirectly fixedly connected to the screw 1 33 move to the right synchronously with the screw 1 33. After the empty fork 34 moves to the right below the silicon wafer 22 to be coated in the silicon wafer box 21, the motor 2 32 stops working. The motor 1 starts working, driving the silicon wafer box 21 to descend. After the silicon wafer 22 to be coated is just completely forked by the fork 34, the motor 1 stops working, and the silicon wafer box 21 stops moving.

[0031] Motor 2 32 starts working, drives the silicon wafer 22 to be coated to move to the left with the fork 34 to the top of the coating machine 41, then motor 2 32 stops working and the fork 34 stops moving. Coating machine 41 starts working, the sheet support 411 inside coating machine 41 slowly rises and passes through the middle of the fork 34, lifts up and adsorbs the silicon wafer 22 to be coated from below the silicon wafer, and after the silicon wafer completely leaves the fork 34, coating machine 41 stops working and the sheet support 411 stops moving. Motor 2 32 starts working, drives the empty fork 34 to move to the left until it completely leaves the top of coating machine 41, then motor 2 32 stops working and the empty fork 34 stops moving. Coating machine 41 starts working, the sheet support 411 adsorbs the silicon wafer 22 to be coated and slowly rises to the same level as clamp 2, coating machine 41 stops working, sheet support 411 stops moving and adsorbing.

[0032] The positioning clamp controller 38 starts working, and the clamp blocks synchronously approach the silicon wafer 22 to be coated. When the silicone heads on the clamp blocks on both sides just touch the silicon wafer at the same time, the positioning clamp controller 38 stops working and the clamp blocks are released. After the silicon wafer 22 to be coated is positioned, the coating machine 41 starts working, and the wafer holder 411 absorbs the silicon wafer 22 to be coated and waits for coating.

[0033] The coating machine 41 starts working, and the wafer holder 411 absorbs the positioned silicon wafer 22 to be coated and slowly descends to the initial position in the coating machine 41, and the coating machine 41 stops working. The motor 3 436 drives the screw 2 437 to drive the glue drop head 423 to move to the center of the silicon wafer 22 to be coated. After the steering gear 422 drives the glue drop head 423 to descend to a specified height, the glue drop head 423 starts to drip glue, and the coating machine 41 applies film.

[0034] After the coating is completed, the motor three 436 starts working, drives the screw two 437 to move the glue head 423 to the initial position, and the motor three 436 stops working, and the glue head 423 stops moving. After the wafer support 411 absorbs the coated silicon wafer and slowly rises to the set height, the coating machine 41 stops working. The motor two 32 starts working, drives the empty wafer fork 34 to move to the right to the bottom of the coated silicon wafer, and the motor two 32 stops working, and the empty wafer fork 34 stops moving. The coating machine 41 starts working, and the wafer support 411 stops adsorbing while the annealed silicon wafer slowly descends, and the coated silicon wafer is picked up by the wafer fork 34. After the wafer support 411 continues to descend to the initial position in the coating machine 41, the coating machine 41 stops working. The motor two 32 starts working, drives the coated silicon wafer to move to the left with the wafer fork 34 to the top of the silicon wafer tray 553, and the motor two 32 stops working, and the wafer fork 34 stops moving. The coated silicon wafer waits for tempering The second cylinder 551 starts working, driving the small wafer support 552 to slowly rise, and the small wafer support 552 passes through the middle of the wafer fork 34, lifts up and adsorbs the silicon wafer to be annealed from below the silicon wafer, and after the silicon wafer completely leaves the wafer fork 34, the second cylinder 551 stops working, and the small wafer support 552 stops moving. The second motor 32 starts working, driving the empty wafer fork 34 to move to the left until it completely leaves the area above the silicon wafer tray 553, and the second motor 32 stops working, and the empty wafer fork 34 stops moving.

[0035] Cylinder 2 551 starts working, and the silicon wafer to be annealed slowly descends with the small wafer tray 552. When the silicon wafer to be annealed enters the silicon wafer limiting groove 23 on the silicon wafer tray 553, the small wafer tray 552 stops adsorption and descends to the initial position, and cylinder 2 551 stops working, and the silicon wafer waits for annealing in the silicon wafer tray 553.

[0036] After the cylinder 3 554 starts working and pushes the silicon wafer tray 553 to move forward along the predetermined track on the fixed track bearing platform 1 to the conveyor belt entering the annealing furnace 54, the cylinder 3 554 returns to the initial position and stops working. The silicon wafers to be annealed on the silicon wafer tray 553 are conveyed from the conveyor belt entering the annealing furnace 54 to the conveyor belt 52 in the furnace along with the silicon wafer tray 553, and the silicon wafer tray 553 with the silicon wafers to be annealed enters the annealing furnace 54 along the conveyor belt 52 in the furnace for annealing. After the first annealing is completed, the silicon wafers and the silicon wafer tray 553 are conveyed along the conveyor belt 52 in the furnace to the conveyor belt exiting the annealing furnace 54, and finally conveyed to the fixed track bearing platform 1.

[0037] Cylinder three 554 starts working, pushing the silicon wafer tray 553 forward along the predetermined track on the fixed track bearing platform 1 to the initial position of the silicon wafer tray 553, waiting for the next annealing. After the entire annealing process is completed, when the silicon wafer runs with the disc on the conveyor belt out of the annealing furnace 54 to the unloading port 58, cylinder three 554 starts working and drives the push rod to push the disc. When the silicon wafer is pushed from the unloading port 58 to the unloading platform 56 with the disc, the push rod returns to the initial position, and cylinder three 554 stops working, and the film preparation is completed.

[0038] The specific embodiments described above further illustrate the technical problems, technical solutions and beneficial effects solved by the present invention. It should be understood that the above are only specific embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A silicon-based ferroelectric and piezoelectric thin film preparation and production equipment with automatic loading and unloading, characterized in that: include A track-fixing load-bearing platform (1), wherein the track-fixing load-bearing platform (1) is used to support other devices; A wafer storage device (2), the wafer storage device (2) being used to store silicon wafers (22) to be coated, and arranging a plurality of silicon wafers (22) to be coated in a vertical direction with gaps between the plurality of silicon wafers (22) to be coated; A sheet fork and a positioning device (3), wherein the sheet fork and the positioning device (3) are used to take out the silicon wafer (22) to be coated from the sheet storage device (2), move it to the automatic coating device (4) and align and position it; An automatic coating device (4), the automatic coating device (4) being used to fix the silicon wafer (22) to be coated and to coat the silicon wafer (22) to be coated, thereby obtaining a silicon wafer to be annealed; The annealing device (5) removes the silicon wafer to be annealed from the automatic film coating device (4), performs annealing and tempering operations on the wafer to obtain a thin film.

2. The automatic loading and unloading silicon-based ferroelectric and piezoelectric thin film production equipment according to claim 1 is characterized in that: The wafer storage device (2) comprises a wafer box (21), wherein the wafer box (21) contains a wafer to be coated (22), and limiting grooves (23) are provided on both sides of the cavity of the wafer box (21), and both sides of the wafer to be coated (22) are clamped in the limiting grooves (23), and a plurality of the limiting grooves (23) support a plurality of wafers to be coated (22), so that there are gaps between the wafers to be coated (22).

3. The automatic loading and unloading silicon-based ferroelectric and piezoelectric thin film production equipment according to claim 2, characterized in that: The wafer storage device (2) further comprises a cylinder (24), a lifting platform (25) and a plurality of guide rails (26), wherein the plurality of guide rails (26) are vertically fixed on the frame, the lifting platform (25) is provided with a plurality of guide holes, the guide holes are sleeved on the plurality of guide rails (26) and are slidably connected to the guide rails (26), the wafer box (21) is fixed on the upper end surface of the lifting platform (25), the cylinder is fixed on the fixed rail load-bearing platform (1), and the cylinder is located below the lifting platform (25), and the output shaft of the cylinder is fixedly connected to the lower end surface of the lifting platform (25).

4. The automatic loading and unloading silicon-based ferroelectric and piezoelectric film preparation and production equipment according to claim 1, characterized in that: The fork and positioning device (3) comprises a mounting seat (31), a second motor (32), a screw rod (33) and a fork (34). The mounting seat (31) is fixed on the fixed rail bearing platform (1) and is located at a rear position above the positioning bearing platform. The mounting seat (31) is provided with a mounting groove. A slide rail (35) is fixedly provided on the side wall of the mounting groove. A slider (36) is provided on the slider (35). The second motor (32) is located at one end of the mounting groove. The output shaft of the second motor (32) is connected to the screw rod (33). One side of the slider (36) is threadedly connected to the screw rod (33). One side of the fork (34) is provided with a fork arm (37). The fork arm (37) is arranged vertically with the fork (34) in the horizontal direction. The end of the fork arm (37) away from the fork (34) is connected to the slider (36).

5. The automatic loading and unloading silicon-based ferroelectric and piezoelectric thin film production equipment according to claim 4, characterized in that: The fork and positioning device (3) further comprises a positioning clamp controller (38) and two clamp arms (39), one end of the two clamp arms (39) being connected to the positioning clamp controller (38), the positioning clamp controller (38) being used to control the movement of the two clamp arms (39), and a clamp block being provided at one end of the clamp arm (39) away from the positioning clamp controller (38).

6. The automatic loading and unloading silicon-based ferroelectric and piezoelectric thin film production equipment according to claim 1, characterized in that: The automatic film coating device (4) comprises a film coating machine (41), a glue dripping mechanism (42) and a displacement device (43). The film coating machine (41) is provided with a wafer support (411). The wafer support (411) is an adsorbable wafer support (411). The wafer support (411) is used to fix the silicon wafer (22) to be coated. The glue dripping mechanism (42) is connected to the displacement device (43). The displacement device (43) controls the movement of the glue dripping mechanism (42) so that the glue dripping mechanism (42) completes the glue dripping on the silicon wafer (22) to be coated.

7. The automatic loading and unloading silicon-based ferroelectric and piezoelectric film preparation and production equipment according to claim 6, characterized in that: The displacement device (43) comprises a base (431), a displacement platform (432) and a slide rail connection block (433); the base (431) is fixed on the fixed rail load-bearing platform (1); the displacement platform (432) is fixed on the base (431); a displacement groove is provided on the displacement platform (432); a slide rail three (434) is fixed on the side wall of the displacement groove; a slider three (435) is provided on the slide rail three (434); the slider three (435) is slidably connected to the slide rail three (434); a motor three (436) is fixed in the displacement groove; the motor three (436) 6), a screw rod 2 (437) is connected to the output shaft, one side of the slider 3 (435) is threadedly connected to the screw rod 2 (437), the screw rod 2 (437) is used to drive the slider 3 (435) to move, the slide rail connecting block (433) is fixed to the upper end of the slider 3 (435), the upper end of the slide rail connecting block (433) is connected to the slide rail 2 (438), the slide rail 2 (438) is provided with a slide rail 2 (439), the slide rail 2 (439) is slidably connected to the slide rail 2 (438), and the glue dripping mechanism (42) is fixed on the slide rail 2 (439).

8. The automatic loading and unloading silicon-based ferroelectric and piezoelectric thin film production equipment according to claim 7, characterized in that: The glue dripping mechanism (42) comprises a glue dripping block (421), a steering gear (422) and a glue dripping head (423); the glue dripping block (421) is fixedly connected to a second slider (439); the steering gear (422) is fixed to an upper end surface of the glue dripping block (421); the glue dripping head (423) is located below one side of the glue dripping block (421); a glue dripping connecting arm (424) is connected to the glue dripping head (423); the glue dripping connecting arm (424) longitudinally penetrates the glue dripping block (421) and is slidably connected to the glue dripping block (421); teeth are provided on one side of the glue dripping block (421); a gear on an output shaft of the steering gear (422) meshes with the teeth on one side of the glue dripping block (421); and the glue dripping head (423) is located directly in front of the third slider (435).

9. The automatic loading and unloading silicon-based ferroelectric and piezoelectric film preparation and production equipment according to claim 1, characterized in that: The annealing device (5) comprises an inlet conveyor belt (51), an in-furnace conveyor belt (52), an outlet conveyor belt (53), an annealing furnace (54), a loading platform (55) and a unloading platform (56). The lower end of the loading platform (55) is connected to a second cylinder (551). The output shaft of the second cylinder (551) is vertically arranged upward. A small wafer support (552) is connected to the output shaft of the second cylinder (551). The small wafer support (552) is used to absorb the silicon wafer to be annealed. The loading platform (55) is also provided with a silicon wafer tray (553). A center hole is opened at the center of the silicon wafer tray (553). The second cylinder (551) controls the small wafer support (552) to pass through the center hole. The loading platform (55) is also provided with a third cylinder (55 4), the cylinder three (554) is used to push the silicon wafer tray (553) on the loading platform (55) onto the inlet conveyor belt (51), the inlet conveyor belt (51), the furnace conveyor belt (52) and the outlet conveyor belt (53) are all fixed on the fixed track load-bearing platform (1), and the three parts of the conveyor belt are connected end to end in sequence, the furnace conveyor belt (52) is located in the annealing furnace (54), the unloading platform (56) includes a return platform (561) and a loading platform (562), the return platform (561) and the loading platform (562) are located on both sides of the same position of the fixed track load-bearing platform (1), and the return platform (561) is provided with a cylinder four (563), and the cylinder four (563) is used to push the film so that the film moves to the loading platform (562).

10. The automatic loading and unloading silicon-based ferroelectric and piezoelectric film preparation and production equipment according to claim 9, characterized in that: The fixed track load-bearing platform (1) is provided with an upwardly protruding conveying wall (57) on both sides of the positions where the inlet conveyor belt (51) and the outlet conveyor belt (53) are located, and the height of the conveying wall (57) is higher than the position of the silicon wafer tray (553). The conveying wall (57) is provided with a downwardly recessed unloading port (58) at the position where the unloading platform (56) is located, and the height of the conveying wall (57) at the unloading port (58) is consistent with the height of the silicon wafer tray (553).

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