Wafer bonding jig and wafer bonding method

Abstract

The invention provides a wafer bonding jig and a wafer bonding method. The jig comprises a first mold, a plurality of limiting connecting pieces, a magnetic attraction unit, a second mold and a magnetic positioning piece. The first mold is further provided with a magnetic attraction unit fixing groove; the limiting connecting piece is arranged on the first mold, the first mold and the second mold are detachably connected through the limiting connecting piece, the magnetic attraction unit is located in the magnetic attraction unit fixing groove, the magnetic positioning piece is arranged on the first mold and corresponds to the magnetic attraction unit, and the limiting connecting piece is matched with the magnetic positioning piece. The limiting device is used for limiting the wafer and the substrate between the first mold and the second mold.

Description

Technical Field

[0001] The present disclosure relates to the semiconductor field, and in particular to a wafer bonding jig and a wafer bonding method. Background Art

[0002] Wafer bonding is a key process in the manufacturing process of vertical structure light emitting diode (LED) chips. During bonding, a wafer bonding fixture can be used to complete the wafer bonding operation.

[0003] The related technology provides a wafer bonding jig, including a first mold, a plurality of limiting connectors, and a second mold. The first mold and the second mold have a plurality of mounting holes, and the positions of the plurality of mounting holes of the lower mold and the upper mold correspond to each other. One end of the limiting connector is inserted into the mounting hole of the first mold, and the other end is inserted into the mounting hole of the second mold.

[0004] In the above-mentioned wafer bonding fixture, although the wafer can be bonded, wafer displacement and rotational misalignment are prone to occur during the bonding operation, which greatly increases the difficulty of subsequent laser stripping, exposure and other processes of the wafer and affects the product yield. Summary of the invention

[0005] The embodiments of the present disclosure provide a wafer bonding jig and a wafer bonding method, which can improve the displacement and rotational misalignment of the bonded wafer and substrate, and improve the yield of the product. The technical solution is as follows:

[0006] In one aspect, a wafer bonding jig is provided, the jig comprising:

[0007] A first mold, a plurality of position-limiting connectors, a magnetic unit, a second mold and a magnetic positioning member, wherein the first mold further comprises a magnetic unit fixing groove;

[0008] The limiting connecting piece is arranged on the first mold, and the first mold and the second mold are detachably connected through the limiting connecting piece. The magnetic unit is located in the magnetic unit fixing groove. The magnetic positioning piece is arranged on the first mold, and the magnetic positioning piece is arranged corresponding to the magnetic unit. The limiting connecting piece cooperates with the magnetic positioning piece to limit the chip and the substrate between the first mold and the second mold.

[0009] Optionally, the first mold and the second mold each have N mounting holes, the positions of the N mounting holes of the first mold and the second mold correspond to each other, and the N mounting holes are evenly spaced and distributed along the edges of the first mold and the second mold, and N is an integer greater than 2;

[0010] The fixture includes N-1 limiting connectors, the N-1 limiting connectors are arranged in N-1 adjacent mounting holes, and the magnetic positioning member is arranged at the Nth mounting hole.

[0011] Optionally, a projection of the magnetic unit fixing groove on the bottom surface of the first mold is located outside the projections of the N mounting holes on the bottom surface of the first mold.

[0012] Optionally, one side of the wafer and the substrate is a straight line notch, and the magnetic positioning piece is a rectangle.

[0013] Optionally, the magnetic positioning member is an iron sheet.

[0014] Optionally, the thickness of the iron sheet is greater than the thickness of the wafer and less than the sum of the thicknesses of the wafer and the substrate.

[0015] Optionally, the size of the magnetic unit is consistent with the size of the magnetic unit fixing groove.

[0016] In another aspect, a wafer bonding method is provided, the method comprising:

[0017] Placing the wafer and substrate required for bonding between the plurality of limiting connectors of the first mold;

[0018] Aligning the wafer and the substrate, and limiting their positions by means of the magnetic positioning member;

[0019] Connecting the first mold and the second mold through the plurality of limiting connectors;

[0020] The wafer and the substrate are bonded.

[0021] Optionally, the first mold and the second mold each have N mounting holes, and the N mounting holes are evenly spaced and distributed along the edges of the first mold and the second mold;

[0022] The fixture includes N-1 limiting connectors, the N-1 limiting connectors are arranged in N-1 adjacent mounting holes, and the magnetic positioning member is arranged at the Nth mounting hole.

[0023] Optionally, one side of the wafer and the substrate is a straight notch, and the magnetic positioning member is a rectangle; aligning the wafer and the substrate and limiting the position by the magnetic positioning member comprises:

[0024] Aligning the linear notches of the wafer and the substrate with the Nth mounting hole;

[0025] The side edges of the magnetic positioning member are fitted with the linear notches of the wafer and the substrate.

[0026] The technical solution provided by the embodiments of the present disclosure has the following beneficial effects:

[0027] In the disclosed embodiment, the first mold and the second mold are detachably connected by a limiting connector, thereby forming a space for bonding the wafer and the substrate. The first mold is equipped with a magnetic suction unit, which can generate a strong magnetic suction force on the magnetic positioning member to fix the position of the magnetic positioning member. The magnetic positioning member can limit the wafer and the substrate, avoiding displacement and rotational misalignment of the wafer and the substrate, reducing the difficulty of wafer operation in subsequent laser stripping, exposure and other processes, and improving product yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0029] Figure 1 It is a structural schematic diagram of a wafer bonding jig provided by an embodiment of the present disclosure;

[0030] Figure 2 is a flow chart of a wafer bonding method provided by an embodiment of the present disclosure;

[0031] Figure 3 This is a schematic diagram of a wafer bonding jig provided by an embodiment of the present disclosure before bonding;

[0032] Figure 4 It is a schematic diagram after bonding using a wafer bonding jig provided by an embodiment of the present disclosure.

[0033] The reference numerals are as follows:

[0034] 10: first mold; 20: limit connector; 30: magnetic unit; 40: second mold;

[0035] 101: mounting hole; 102: magnetic unit fixing slot;

[0036] 201: Magnetic positioning element;

[0037] 301: wafer; 302: substrate. DETAILED DESCRIPTION

[0038] In order to make the objectives, technical solutions and advantages of the present disclosure more clear, the embodiments of the present disclosure will be further described in detail below with reference to the accompanying drawings.

[0039] In traditional wafer bonding jigs, it is impossible to align and fix the epitaxial wafer and substrate, which will cause displacement and rotational misalignment of the epitaxial wafer and substrate during the bonding operation. This will greatly increase the difficulty of subsequent laser peeling, exposure and other processes of the wafer, and will affect the product yield.

[0040] Figure 1 is a schematic diagram of the structure of a wafer bonding fixture provided by an embodiment of the present disclosure, see Figure 1 The wafer bonding fixture includes: a first mold 10, a plurality of limiting connectors 20, a magnetic unit 30, a second mold 40 and a magnetic positioning member 201. The first mold 10 also has a magnetic unit fixing groove 102.

[0041] Among them, the limiting connection part 20 is arranged on the first mold 10, the first mold 10 and the second mold 40 are connected through the limiting connection part 20, the magnetic unit 30 is located in the magnetic unit fixing groove 102, the magnetic positioning part 201 is arranged on the first mold 10, and the magnetic positioning part 201 is arranged corresponding to the magnetic unit 30, the limiting connection part 20 cooperates with the magnetic positioning part 201 to limit the chip 301 and the substrate 302 between the first mold 10 and the second mold 40.

[0042] In the disclosed embodiment, the first mold and the second mold are detachably connected by a limiting connector, thereby forming a space for bonding the wafer and the substrate. The first mold is equipped with a magnetic suction unit, which can generate a strong magnetic suction force on the magnetic positioning member to fix the position of the magnetic positioning member. The magnetic positioning member can limit the wafer and the substrate, avoiding displacement and rotational misalignment of the wafer and the substrate, reducing the difficulty of wafer operation in subsequent laser stripping, exposure and other processes, and improving product yield.

[0043] In the embodiment of the present disclosure, the first mold 10 and the second mold 40 respectively have N mounting holes 101, the positions of the N mounting holes 101 of the first mold 10 and the second mold 40 correspond, and the N mounting holes 101 are evenly spaced and distributed along the edges of the first mold 10 and the second mold 40, and N is an integer greater than 2. The mounting holes are evenly spaced and distributed along the edges of the first mold and the second mold, so that the limiting connectors can be evenly spaced and arranged, which is more conducive to limiting the wafer and the substrate.

[0044] In the embodiment of the present disclosure, the fixture includes N-1 limiting connectors 20, and the N-1 limiting connectors 20 are arranged in N-1 adjacent mounting holes 101. The magnetic positioning member 201 is arranged at the Nth mounting hole 101. The magnetic positioning member and the N-1 limiting connectors can form a stable structure, which is beneficial to the positioning of the chip and the substrate. The magnetic positioning member is arranged at the Nth mounting hole to facilitate the determination of the placement position of the magnetic positioning member.

[0045] Exemplarily, the first mold 10 and the second mold 40 respectively have four mounting holes 101, the positions of the four mounting holes 101 of the first mold 10 and the second mold 40 correspond, and the four mounting holes 101 are evenly spaced along the edges of the first mold 10 and the second mold 40. The fixture includes three limiting connectors 20, the three limiting connectors 20 are arranged in three adjacent mounting holes 101, and the magnetic positioning member 201 is arranged at the fourth mounting hole 101.

[0046] In other embodiments, the fixture may include more mounting holes and limiting connectors, for example, 5 mounting holes and 4 limiting connectors, which is not limited.

[0047] In the embodiment of the present disclosure, the projection of the magnetic unit fixing groove 102 on the bottom surface of the first mold 10 is located outside the projection of the N mounting holes 101 on the bottom surface of the first mold 10. The magnetic unit fixing groove is arranged outside the projection of the multiple mounting holes on the bottom surface of the first mold, and can be staggered with the mounting holes. In addition, the magnetic unit can be better aligned with the magnetic positioning member to increase the magnetic force.

[0048] In the disclosed embodiment, one side of the wafer 301 and the substrate 302 is a straight notch, and the magnetic positioning member 201 is a rectangle. The straight notch of the wafer and the substrate fits with one side of the rectangular magnetic positioning member to better fix the wafer and the substrate. At the same time, the circular side of the wafer and the substrate abuts against the limiting connector 20, and the limiting connector 20 cooperates with the magnetic positioning member to limit the wafer and the substrate, making it difficult for them to move.

[0049] In other embodiments, the notches of the chip 301 and the substrate 302 may be in other shapes, such as a triangle. Accordingly, one side of the magnetic positioning member 201 may have a threshold-matched triangle to better limit the chip and the substrate.

[0050] In the embodiment of the present disclosure, the magnetic positioning member 201 can be an iron sheet or other magnetic material positioning member. The magnetic positioning member is fixed by the magnetic field attraction between the magnetic positioning member and the magnetic attraction unit, and the magnetic positioning member is not easily displaced.

[0051] In the disclosed embodiment, the thickness of the iron sheet is greater than the thickness of the wafer 301, and less than the sum of the thicknesses of the wafer 301 and the substrate 302. The thickness of the iron sheet is greater than the thickness of the wafer, so that the flat edge of the iron sheet can fit the edge of the wafer and the substrate, making it difficult for the wafer and the substrate to be displaced. The thickness of the iron sheet is less than the sum of the thicknesses of the wafer and the substrate, so that the second jig will not be lifted, making the placement of the wafer and the substrate more stable. The thickness of the iron sheet is less than the sum of the thicknesses of the wafer and the substrate, so that there is no contact with the second mold during the bonding process. The iron sheet can be easily taken out before the bonding process is carried out, and can also be taken out together with the wafer and the substrate after the bonding process is completed.

[0052] In the disclosed embodiment, the size of the magnetic unit 30 is consistent with the size of the magnetic unit fixing slot 102. Setting the size of the magnetic unit to be consistent with the size of the magnetic unit fixing slot can make the magnetic unit fit more closely with the magnetic unit fixing slot, less likely to move, and make the magnetic positioning piece more firmly positioned.

[0053] In other embodiments, the size of the magnetic unit 30 may be smaller than the magnetic unit fixing slot 102 .

[0054] In the embodiment of the present disclosure, the thickness of the wafer 301 may be 200-700 um.

[0055] Exemplarily, the thickness of the wafer 301 is 500 um.

[0056] In the embodiment of the present disclosure, the wafer 301 may be a wafer having a sapphire temporary substrate and a metal bonding layer.

[0057] In the embodiment of the present disclosure, the thickness of the substrate 302 may be 300-1000 um.

[0058] In the embodiment of the present disclosure, the substrate 302 may be a silicon wafer and have a metal bonding layer.

[0059] Exemplarily, the thickness of the substrate 302 is 500 um.

[0060] In the embodiment of the present disclosure, the wafer 301 may be located above the substrate 302 or below the substrate 302 .

[0061] Illustratively, the wafer 301 is located above the substrate 302 .

[0062] For example, the thickness of the iron sheet may be greater than the thickness of the substrate 302 and less than the thickness of the substrate 302 plus the thickness of the wafer 301. In the embodiment of the present disclosure, the first mold 10 and the second mold 40 are cylindrical.

[0063] In other examples, the first mold 10 and the second mold 40 may also be square or rectangular, which is not limited in the present disclosure.

[0064] In the embodiment of the present disclosure, the first mold 10 and the second mold 40 may be made of graphite material.

[0065] In the disclosed embodiment, the position-limiting connector 20 may be made of a material that is relatively stable in thermal expansion.

[0066] Exemplarily, the limiting connector 20 is made of graphite material.

[0067] In the disclosed embodiment, the limiting connector 20 may be cylindrical.

[0068] In other examples, the limiting connector 20 may also be in a prism shape.

[0069] In the disclosed embodiment, the mounting hole 101 may be a circular hole.

[0070] In other examples, the mounting hole 101 may also be a prism-shaped hole.

[0071] In the disclosed embodiment, the magnetic attraction unit 30 may be a magnet.

[0072] In other examples, the magnetic unit 30 may also be other units with a magnetic attraction function.

[0073] In the embodiment of the present disclosure, the magnetic unit 30 may be rectangular.

[0074] In other examples, the magnetic unit 30 may also be circular.

[0075] Figure 2 is a flow chart of a wafer bonding method provided by an embodiment of the present disclosure. Figure 2 The method steps include:

[0076] S11, placing the wafer and substrate required for bonding between the multiple limiting connectors of the first mold.

[0077] In the disclosed embodiment, the first mold has N mounting holes, and the N mounting holes are evenly spaced along the edge of the first mold, where N is an integer greater than 2. The mounting holes are evenly spaced along the edge of the first mold, and the limiting connectors can be evenly spaced, which is more conducive to limiting the wafer and the substrate.

[0078] In the embodiment of the present disclosure, the fixture includes N-1 limiting connectors, and the N-1 limiting connectors are arranged in N-1 adjacent mounting holes. The N-1 limiting connectors can form a stable structure, which is beneficial for limiting the chip and the substrate, and the magnetic positioning member is arranged at the Nth mounting hole to facilitate determining the placement position of the magnetic positioning member.

[0079] Exemplarily, the first mold has four mounting holes, and the four mounting holes are evenly spaced apart along the edge of the first mold.

[0080] The fixture comprises three limiting connectors, and the three limiting connectors are arranged in three adjacent mounting holes.

[0081] In other embodiments, the fixture may include more mounting holes and limiting connectors, for example, 5 mounting holes and 4 limiting connectors, which is not limited to this.

[0082] In the embodiment of the present disclosure, the first mold is cylindrical.

[0083] In other examples, the first mold may also be a square or a rectangle, which is not limited in the present disclosure.

[0084] In the embodiment of the present disclosure, the first mold may be made of graphite material.

[0085] In the disclosed embodiment, the limiting connector may be made of a material that is relatively stable in thermal expansion.

[0086] Exemplarily, the limiting connector is made of graphite material.

[0087] In the disclosed embodiment, the limiting connecting piece may be cylindrical.

[0088] In other examples, the limiting connector may also be in the shape of a prism.

[0089] In the disclosed embodiment, the mounting hole may be a circular hole.

[0090] In other examples, the mounting hole may also be a prism-shaped hole.

[0091] Step S11 includes:

[0092] Install N-1 limit connectors in adjacent N-1 mounting holes;

[0093] The wafer and substrate required for bonding are placed between the N-1 limiting connectors of the first mold.

[0094] S12, aligning the wafer and the substrate, and limiting their positions by means of the magnetic positioning member.

[0095] In semiconductor manufacturing, alignment refers to the precise alignment of different manufacturing steps, such as bonding, to ensure that newly added structural layers properly match the previous ones.

[0096] Limiting refers to the device or mechanism used to ensure the precise positioning and fixation of semiconductor materials during processing, so as to improve processing accuracy and efficiency and ensure product quality.

[0097] In the disclosed embodiment, one side of the wafer and the substrate is a straight notch, and the magnetic positioning piece is a rectangle. The straight notch of the wafer and the substrate fits with one side of the rectangle of the magnetic positioning piece to better fix the wafer and the substrate and prevent displacement.

[0098] In other embodiments, the notches of the wafer and the substrate may be in other shapes, such as a triangle. Accordingly, one side of the magnetic positioning member may have a threshold-matched triangle, so as to better limit the position of the wafer and the substrate.

[0099] In other embodiments, the magnetic positioning member may be in any shape with one side being a straight notch.

[0100] In the embodiment of the present disclosure, the magnetic positioning member can be an iron sheet or other magnetic material positioning member. The magnetic positioning member is fixed by the magnetic field attraction between the magnetic positioning member and the magnetic attraction unit, and the magnetic positioning member is not easily displaced.

[0101] In the disclosed embodiment, the thickness of the iron sheet is greater than the thickness of the wafer and less than the sum of the thickness of the wafer and the substrate. The thickness of the iron sheet is greater than the thickness of the wafer so that the flat edge of the iron sheet can fit the edge of the wafer and the substrate, making it difficult for the wafer and the substrate to be displaced. The thickness of the iron sheet is less than the sum of the thickness of the wafer and the substrate so that the placement of the wafer and the substrate is more stable. The thickness of the iron sheet is less than the sum of the thickness of the wafer and the substrate so that there is no contact with the second mold during the bonding process. The iron sheet can be easily taken out before the bonding process is carried out, and can also be taken out together with the wafer and the substrate after the bonding process is completed.

[0102] In the embodiment of the present disclosure, the thickness of the wafer may be 200-700 um.

[0103] Exemplarily, the thickness of the wafer is 500 um.

[0104] In the embodiment of the present disclosure, the wafer may be a bonded wafer having a sapphire temporary substrate and having a metal bonding layer.

[0105] In the embodiment of the present disclosure, the thickness of the substrate may be 300-1000 um.

[0106] In the embodiment of the present disclosure, the substrate may be a silicon wafer and have a metal bonding layer.

[0107] Exemplarily, the thickness of the substrate is 500 um.

[0108] In the disclosed embodiments, the wafer may be located above the substrate or below the substrate.

[0109] Illustratively, a wafer is located above the substrate.

[0110] Exemplarily, the thickness of the iron sheet may be greater than the thickness of the substrate and less than the thickness of the substrate plus the thickness of the wafer.

[0111] S13, connecting the first mold and the second mold through the multiple limiting connectors.

[0112] In the disclosed embodiment, the second mold has N mounting holes, the positions of the N mounting holes of the first mold and the second mold correspond to each other, and the N mounting holes are evenly spaced along the edge of the second mold. The evenly spaced distribution of the mounting holes along the edge of the second mold can make the limiting connectors evenly spaced, which is more conducive to limiting the rear wafer and the substrate.

[0113] In the embodiment of the present disclosure, the fixture includes N-1 limiting connectors, the N-1 limiting connectors are arranged in N-1 adjacent mounting holes, and the magnetic positioning member is arranged at the Nth mounting hole. The magnetic positioning member and the N-1 limiting connectors can form a stable structure, which is beneficial to limiting the chip and the substrate, and the magnetic positioning member is arranged at the Nth mounting hole to facilitate determining the placement position of the magnetic positioning member.

[0114] Exemplarily, the second mold has four mounting holes, the positions of the four mounting holes of the first mold and the second mold correspond to each other, and the four mounting holes are evenly spaced along the edge of the second mold.

[0115] The fixture comprises three limiting connectors, which are arranged in three adjacent mounting holes, and a magnetic positioning member is arranged at the fourth mounting hole.

[0116] In other embodiments, the fixture may include more mounting holes and limiting connectors, for example, 5 mounting holes and 4 limiting connectors, which is not limited.

[0117] In the embodiment of the present disclosure, the second mold is cylindrical.

[0118] In other examples, the second mold may also be a square or a rectangle, which is not limited in the present disclosure.

[0119] In the embodiment of the present disclosure, the second mold may be made of graphite material.

[0120] Step S13 includes:

[0121] Install the N-1 limiting connectors on the first mold into the corresponding N-1 mounting holes of the second mold.

[0122] S14, bonding the wafer and the substrate.

[0123] In the disclosed embodiment, one side of the wafer and the substrate is a straight notch, and the magnetic positioning piece is a rectangle. The straight notch of the wafer and the substrate fits with one side of the rectangle of the magnetic positioning piece to better fix the wafer and the substrate and prevent displacement.

[0124] In the disclosed embodiment, a metal alloy is used as a bonding material to bond wafers on a substrate.

[0125] S15, peeling off the wafer after bonding.

[0126] In the disclosed embodiment, laser is used to peel off the wafer after bonding.

[0127] In the disclosed embodiment, the Al2O3 substrate and the GaN-LED chip are separated by utilizing the laser decomposition principle of the GaN material of the buffer layer.

[0128] The effect of wafer bonding will affect the effect of laser lift-off to a certain extent, and will also have an impact on subsequent processes, so wafer bonding is a key process in the vertical structure LED chip process.

[0129] In the disclosed embodiment, the first mold and the second mold are detachably connected by a limiting connector, thereby forming a space for bonding the wafer and the substrate. The first mold is equipped with a magnetic suction unit, which can generate a strong magnetic suction force on the magnetic positioning member to fix the position of the magnetic positioning member. The magnetic positioning member can limit the wafer and the substrate, avoiding displacement and rotational misalignment of the wafer and the substrate, reducing the difficulty of wafer operation in subsequent laser stripping, exposure and other processes, and improving product yield.

[0130] Figure 3 This is a schematic diagram of a wafer bonding jig provided by an embodiment of the present disclosure before bonding. Figure 4 Schematic diagram of a wafer bonding jig after bonding using an embodiment of the present disclosure. Figure 3 and Figure 4 The overlapping position of the wafer and the substrate can clearly show that the wafer and substrate bonded by the wafer bonding fixture provided by the embodiment of the present disclosure are more accurately aligned, avoiding displacement and rotational misalignment.

[0131] The above description is only an optional embodiment of the present disclosure and is not intended to limit the present disclosure. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present disclosure shall be included in the protection scope of the present disclosure.

Claims

1. A wafer bonding jig, characterized in that: The fixture comprises: a first mold (10), a plurality of position-limiting connectors (20), a magnetic unit (30), a second mold (40) and a magnetic positioning member (201); the first mold (10) further comprises a magnetic unit fixing groove (102); The limiting connecting member (20) is arranged on the first mold (10), and the first mold (10) and the second mold (40) are detachably connected via the limiting connecting member (20); the magnetic unit (30) is located in the magnetic unit fixing groove (102); the magnetic positioning member (201) is arranged on the first mold (10), and the magnetic positioning member (201) is arranged corresponding to the magnetic unit (30); the limiting connecting member (20) cooperates with the magnetic positioning member (201) to limit the chip (301) and the substrate (302) between the first mold (10) and the second mold (40).

2. The wafer bonding jig according to claim 1, characterized in that: The first mold (10) and the second mold (40) respectively have N mounting holes (101), the positions of the N mounting holes (101) of the first mold (10) and the second mold (40) correspond to each other, and the N mounting holes (101) are evenly spaced and distributed along the edges of the first mold (10) and the second mold (40), and N is an integer greater than 2; The fixture comprises N-1 position-limiting connecting members (20), wherein the N-1 position-limiting connecting members (20) are arranged in N-1 adjacent mounting holes (101), and the magnetic positioning member (201) is arranged at the Nth mounting hole (101).

3. The wafer bonding jig according to claim 2, characterized in that: The projection of the magnetic attraction unit fixing groove (102) on the bottom surface of the first mold (10) is located outside the projection of the N mounting holes (101) on the bottom surface of the first mold (10).

4. The wafer bonding jig according to any one of claims 1 to 3, characterized in that: One side of the wafer (301) and the substrate (302) is a straight line notch, and the magnetic positioning member (201) is rectangular.

5. The wafer bonding jig according to claim 4, characterized in that: The magnetic positioning member (201) is an iron sheet.

6. The wafer bonding jig according to claim 5, characterized in that: The thickness of the iron sheet is greater than the thickness of the wafer (301) and less than the sum of the thicknesses of the wafer (301) and the substrate (302).

7. The wafer bonding jig according to any one of claims 1 to 3, characterized in that: The size of the magnetic unit (30) is consistent with the size of the magnetic unit fixing groove (102).

8. A wafer bonding method, characterized in that: The method is based on the fixture according to claim 1, and the method comprises: Placing the wafer and substrate required for bonding between the plurality of limiting connectors of the first mold; Aligning the wafer and the substrate, and limiting their positions by means of the magnetic positioning member; Connecting the first mold and the second mold through the plurality of limiting connectors; The wafer and the substrate are bonded.

9. The method according to claim 8, characterized in that The first mold and the second mold each have N mounting holes, and the N mounting holes are evenly spaced and distributed along the edges of the first mold and the second mold; The fixture includes N-1 limiting connectors, the N-1 limiting connectors are arranged in N-1 adjacent mounting holes, and the magnetic positioning member is arranged at the Nth mounting hole.

10. The method according to claim 9, characterized in that One side of the wafer and the substrate is a straight notch, and the magnetic positioning piece is a rectangle; the wafer and the substrate are aligned and limited by the magnetic positioning piece, including: Aligning the linear notches of the wafer and the substrate with the Nth mounting hole; The side edges of the magnetic positioning member are fitted with the linear notches of the wafer and the substrate.

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