Chain type cleaning equipment for removing phosphorosilicate glass of silicon wafer

Abstract

The invention relates to the technical field of cleaning, and discloses chain type cleaning equipment for removing phosphorosilicate glass of a silicon wafer, which comprises a cleaning tank, a chain type cleaning device and a chain type cleaning device, the rack is fixed on the cleaning tank; the gear set is rotationally mounted on the inner side of the rack to form a fluctuating structure, and a conveying chain is connected to the gear set; the mounting block is rotationally mounted on one side of the conveying chain, and the lower end of the mounting block is provided with a clamping assembly for clamping a silicon wafer; by arranging the gear set, the conveying chain, the mounting block and the clamping assembly which are designed in a fluctuating mode, the device can automatically place silicon wafers into the groove bodies containing different cleaning solutions, operation is easy and convenient, adjustment can be conducted according to the outer diameters, the thicknesses and the cleaning depths of the different silicon wafers, the cleaning effect on the silicon wafers of different sizes is improved, the structure is simple, and practicability is high. Drying can be automatically carried out after cleaning, and inconvenience caused by additional drying is reduced.

Description

Technical Field

[0001] The invention relates to the field of cleaning technology, and in particular to a chain cleaning device for removing phosphorus silicon glass from silicon wafers. Background Art

[0002] During the diffusion process of silicon wafer production, phosphorus will be introduced into the surface of the silicon wafer to form phosphosilicate glass. If the edge of the silicon wafer is affected by the diffusion of phosphorus, the phosphorus may diffuse along the edge of the silicon wafer and even reach the back of the PN junction, causing current leakage or short circuit, thereby affecting the electrical performance and reliability of the chip. When processing phosphosilicate glass, it is generally cleaned in a hydrofluoric acid solution, a water tank, or an alkaline tank to remove impurities on the phosphosilicate glass and the silicon wafer. Sometimes, in order to improve the cleaning effect, an ultrasonic cleaning machine will be vibrated to allow the cleaning liquid to accelerate the cleaning efficiency of the silicon wafer surface.

[0003] In the prior art, when multiple cleaning liquids are used to remove phosphosilicate glass or impurities on the surface of silicon wafers, the multiple cleaning liquid tanks are not interconnected, and the cleaned silicon wafers need to be manually transferred from one cleaning liquid tank to another cleaning liquid tank to achieve the cleaning treatment of the silicon wafer surface with different cleaning liquids. This is troublesome and time-consuming, and the manual labor intensity is high. It is not possible to achieve automated cleaning well to reduce the manual labor intensity. For this reason, we propose a chain cleaning equipment for removing phosphosilicate glass from silicon wafers. Summary of the invention

[0004] The purpose of the present invention is to provide a chain cleaning device for removing phosphosilicate glass from silicon wafers, so as to solve the problem raised in the above background technology that when placing silicon wafers in a tank containing different cleaning liquids, the silicon wafers need to be moved manually, which is time-consuming and inconvenient for automated cleaning and movement.

[0005] To achieve the above object, the present invention provides the following technical solution: a chain cleaning device for removing phosphorus silicon glass from silicon wafers, comprising:

[0006] A cleaning tank, wherein a partition is provided inside the cleaning tank to separate the internal space thereof;

[0007] A frame, fixed on the cleaning tank;

[0008] A gear set is rotatably mounted on the inner side of the frame to form an undulating structure, and a conveying chain is connected to the gear set;

[0009] A mounting block is rotatably mounted on one side of the conveying chain, and a clamping assembly for clamping the silicon wafer is provided at the lower end of the mounting block;

[0010] A driving motor is arranged on a side wall of the frame, and a transmission shaft for driving the gear set to rotate is arranged at the output end of the driving motor;

[0011] The hot air component is arranged at one end of the inner side of the frame to dry the cleaned silicon wafers.

[0012] Preferably, the gear set includes a first gear, a second gear and a third gear, the first gear and the second gear are arranged alternately up and down along a long side of the frame, at least two third gears are symmetrically arranged at both ends of the inner side of the frame, and the outer diameter of the third gear is larger than the outer diameters of the second gear and the first gear.

[0013] Preferably, the outer diameter of the first gear is smaller than the outer diameter of the second gear, and one of the first gears is fixed to the transmission shaft.

[0014] Preferably, the clamping assembly includes a transverse plate, an adjustment block, a transverse adjustment bolt, a placement plate, a support block and a pressure block. The transverse plate is fixed to the lower surface of the mounting block. Adjustment blocks are provided on the sliding sleeves at both ends of the outer surface of the transverse plate. The adjustment block has transverse adjustment bolts that interfere with the transverse plate. One side wall of the adjustment block is connected to the placement plate through an upper and lower adjustment structure. A support block is fixed to the lower end of the placement plate. A pressure block for clamping the silicon wafer is provided on one side wall of the placement plate corresponding to the support block.

[0015] Preferably, a slide groove is provided on the inner side of the placement plate, an adjusting slider is provided on the inner side of the slide groove, and the adjusting slider is fixed to the pressure block, and a clamping spring is provided on the adjusting slider.

[0016] Preferably, the up and down adjustment structure includes a longitudinal adjustment screw and a longitudinal adjustment nut, a longitudinal adjustment screw is fixed to one side wall of the placement plate, an adjustment groove for the longitudinal adjustment screw to slide up and down is opened on the other side wall of the adjustment block, and a longitudinal adjustment nut that contacts the adjustment block is connected to the longitudinal adjustment screw through a threaded portion.

[0017] Preferably, the placement plate is symmetrically arranged at two locations along the center of the long side of the mounting block.

[0018] Preferably, the partitions are arranged at three locations, and the three partitions are evenly distributed along the long side of the cleaning tank.

[0019] Preferably, the hot air assembly includes an air guide tube and an air inlet duct, the air guide tube is fixed to a side wall of the frame, and a plurality of air outlets are provided on the lower surface of the air guide tube, and one end of the air guide tube passes through the frame to be connected to the air inlet duct for taking in hot air.

[0020] Preferably, the cleaning groove is rectangular, and the width of the cleaning groove is greater than the width of the clamping assembly.

[0021] Compared with the prior art, the present invention has the following beneficial effects:

[0022] The present invention is provided with a gear set, a conveying chain, a mounting block and a clamping assembly with an undulating design, so as to avoid the need to manually place the silicon wafers into tanks containing different cleaning liquids when cleaning the phosphorus silicon glass on the surfaces of multiple silicon wafers, which is troublesome, time-consuming and labor-intensive. The device can automatically place the silicon wafers into tanks containing different cleaning liquids, is easy to operate, and can be adjusted according to the outer diameter, thickness and cleaning depth of different silicon wafers, thereby improving the cleaning effect of silicon wafers of different sizes. The structure is simple, and the device can be automatically dried after cleaning, thereby reducing the inconvenience of additional drying and increasing the practicality of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a structural schematic diagram of the present invention;

[0024] Figure 2 It is a schematic diagram of the conveyor chain structure of the present invention;

[0025] Figure 3 It is a schematic diagram of the structure of the driving motor of the present invention;

[0026] Figure 4 It is a schematic diagram of the gear set structure of the present invention;

[0027] Figure 5 It is a schematic diagram of the structure of the clamping assembly of the present invention;

[0028] Figure 6 It is a schematic diagram of the installation structure of the placement plate of the present invention;

[0029] Figure 7 It is a schematic diagram of the structure of the compression spring of the present invention.

[0030] In the figure: 1. cleaning tank; 101. partition; 2. frame; 3. gear set; 301. first gear; 302. second gear; 303. third gear; 4. conveyor chain; 5. mounting block; 6. clamping assembly; 601. cross plate; 602. adjustment block; 6021. transverse adjustment bolt; 603. placement plate; 6031. support block; 6032. longitudinal adjustment screw; 6033. compression spring; 6034. longitudinal adjustment nut; 604. pressure block; 6041. adjustment slider; 701. air guide tube; 702. air inlet duct; 8. drive motor; 9. transmission shaft. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0032] See also Figure 1-Figure 7 The present invention provides a technical solution: a chain cleaning device for removing phosphorus silicon glass from silicon wafers, comprising:

[0033] A cleaning tank 1, wherein a partition 101 is provided inside the cleaning tank 1 to separate the internal space thereof, so as to facilitate the placement of different cleaning liquids to remove the phosphorus silicon glass on the surface of the silicon wafer;

[0034] A frame 2 is fixed on the cleaning tank 1;

[0035] The gear set 3 is rotatably mounted on the inner side of the frame 2 to form an undulating structure, which is convenient for driving the silicon wafer into the tank containing different cleaning liquids through the undulation. The gear set 3 is connected with a conveying chain 4 to drive the silicon wafer to move;

[0036] The mounting block 5 is rotatably mounted on one side of the conveying chain 4, and the lower end of the mounting block 5 is provided with a clamping assembly 6 for clamping the silicon wafer, so as to facilitate rapid fixing of the silicon wafer for subsequent cleaning;

[0037] The driving motor 8 is arranged on a side wall of the frame 2, and a transmission shaft 9 for driving the gear set 3 to rotate is arranged at the output end of the driving motor 8, so as to drive the conveying chain 4 to move;

[0038] The hot air component is arranged at one end of the inner side of the frame 2 to dry the cleaned silicon wafers, which is convenient for drying the cleaned silicon wafers.

[0039] Preferably, the gear set 3 includes a first gear 301, a second gear 302 and a third gear 303. The first gear 301 and the second gear 302 are alternately arranged up and down along a long side of the frame 2. At least two third gears 303 are symmetrically arranged at both ends of the inner side of the frame 2, and the outer diameter of the third gear 303 is larger than the outer diameters of the second gear 302 and the first gear 301, so as to drive the conveying chain 4 to move up and down so that the silicon wafers can enter and exit the tank containing different cleaning liquids.

[0040] Preferably, the outer diameter of the first gear 301 is smaller than the outer diameter of the second gear 302 , and one of the first gears 301 is fixed to the transmission shaft 9 .

[0041] Preferably, the clamping assembly 6 includes a transverse plate 601, an adjustment block 602, a transverse adjustment bolt 6021, a placement plate 603, a support block 6031 and a pressure block 604. The transverse plate 601 is fixed to the lower surface of the mounting block 5. Adjustment blocks 602 are slidingly sleeved at both ends of the outer surface of the transverse plate 601. The adjustment block 602 has transverse adjustment bolts 6021 that are in conflict with the transverse plate 601, which are convenient for adjustment according to the outer diameter of the silicon wafer. A side wall of the adjustment block 602 is connected to the placement plate 603 through an up and down adjustment structure, which is convenient for adjustment according to the required cleaning depth. A support block 6031 is fixed to the lower end of the placement plate 603. A pressure block 604 that clamps the silicon wafer is provided on one side wall of the placement plate 603 and the support block 6031, which is convenient for pressing and fixing the silicon wafer.

[0042] Preferably, a slide groove is opened on the inner side of the placement plate 603, an adjusting slider 6041 is arranged on the inner side of the slide groove, and the adjusting slider 6041 is fixed to the pressing block 604. The adjusting slider 6041 has a clamping spring 6033, which is convenient for quickly clamping and fixing the silicon wafer to prevent the silicon wafer from moving randomly during cleaning.

[0043] Preferably, the up and down adjustment structure includes a longitudinal adjustment screw 6032 and a longitudinal adjustment nut 6034. The longitudinal adjustment screw 6032 is fixed to one side wall of the placement plate 603, and the other side wall of the adjustment block 602 is provided with an adjustment groove for the longitudinal adjustment screw 6032 to slide up and down, and the longitudinal adjustment screw 6032 is connected to the longitudinal adjustment nut 6034 that contacts the adjustment block 602 through a threaded portion, so as to facilitate the adjustment of the height of the placement plate 603.

[0044] Preferably, the placement plate 603 is symmetrically arranged at two locations along the center of the long side of the mounting block 5 to better support the silicon wafer to be cleaned.

[0045] Preferably, three partitions 101 are provided, and the three partitions 101 are evenly distributed along the long side of the cleaning tank 1 .

[0046] Preferably, the hot air assembly includes an air guide tube 701 and an air inlet pipe 702. The air guide tube 701 is fixed to a side wall of the frame 2, and a plurality of air outlets are provided on the lower surface of the air guide tube 701. One end of the air guide tube 701 passes through the frame 2 to connect to the air inlet pipe 702 for letting in hot air, so as to facilitate rapid drying of the silicon wafers after cleaning the phosphosilicate glass.

[0047] Preferably, the cleaning tank 1 is rectangular, so as to facilitate the placement of a variety of cleaning liquids along the long side of the cleaning tank 1 , and the width of the cleaning tank 1 is greater than the width of the clamping assembly 6 .

[0048] The working principle and use process of the present invention are as follows: when in use, according to the outer diameter of the silicon wafer, the transverse adjustment bolt 6021 is loosened to make the adjustment block 602 slide on the transverse plate 601 to adjust the two adjustment blocks 602 to match the outer diameter of the silicon wafer, and then according to the required cleaning depth, the longitudinal adjustment nut 6034 is loosened to adjust the height of the placement plate 603, and the adjustment is tightened, and then the silicon wafer is placed on the support block 6031. At this time, the elastic force of the clamping spring 6033 pushes the pressing block 604 downward to cooperate with the support block 6031 to clamp the silicon wafer. The inner side of the cleaning tank 1 is divided into multiple independent tank bodies by the partition 101. In the multiple tanks, Hydrofluoric acid liquid, water liquid, alkali liquid and water liquid are placed in the body in sequence. At this time, the driving motor 8 drives the two first gears 301 to rotate through the transmission shaft 9, thereby driving the two conveying chains 4 to move. The conveying chain 4 drives the silicon wafer to move through the mounting block 5 and the clamping assembly 6. According to the undulating gear set 3, the silicon wafer passes through the multiple troughs on the inside of the cleaning tank 1 in sequence for cleaning, and the phosphorus silicon glass impurities on the surface are removed, and finally moved to one end of the frame 2. The air inlet pipe 702 is connected to the hot air pipe. The hot air flows out through the multiple air outlets on the lower surface of the air guide tube 701 to dry the silicon wafer, and then the silicon wafer is removed from the clamping assembly 6 to complete the cleaning.

[0049] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A chain cleaning device for removing phosphosilicate glass from silicon wafers, characterized in that: include: A cleaning tank (1), wherein a partition (101) is provided inside the cleaning tank (1) to separate the internal space thereof; A frame (2) is fixed on the cleaning tank (1); A gear set (3) is rotatably mounted on the inner side of the frame (2) to form an undulating structure, and a conveying chain (4) is connected to the gear set (3); A mounting block (5) is rotatably mounted on one side of the conveying chain (4), and a clamping assembly (6) for clamping the silicon wafer is provided at the lower end of the mounting block (5); A driving motor (8) is arranged on a side wall of the frame (2), and a transmission shaft (9) for driving the gear set (3) to rotate is arranged at the output end of the driving motor (8); A hot air component is arranged at one end of the inner side of the frame (2) to dry the cleaned silicon wafers.

2. The chain cleaning device for removing phosphosilicate glass from silicon wafers according to claim 1, characterized in that: The gear set (3) comprises a first gear (301), a second gear (302) and a third gear (303); the first gear (301) and the second gear (302) are arranged alternately up and down along a long side of the frame (2); at least two third gears (303) are symmetrically arranged at two ends of the inner side of the frame (2); and the outer diameter of the third gear (303) is greater than the outer diameters of the second gear (302) and the first gear (301).

3. The chain cleaning device for removing phosphosilicate glass from silicon wafers according to claim 2, characterized in that: The outer diameter of the first gear (301) is smaller than the outer diameter of the second gear (302), and one of the first gears (301) is fixed to the transmission shaft (9).

4. The chain cleaning device for removing phosphosilicate glass from silicon wafers according to claim 1, characterized in that: The clamping assembly (6) comprises a transverse plate (601), an adjustment block (602), a transverse adjustment bolt (6021), a placement plate (603), a support block (6031) and a pressure block (604); the transverse plate (601) is fixed to the lower surface of the mounting block (5); the adjustment blocks (602) are slidably sleeved at both ends of the outer surface of the transverse plate (601); the adjustment block (602) is provided with a transverse adjustment bolt (6021) which contacts the transverse plate (601); a side wall of the adjustment block (602) is connected to the placement plate (603) via an upper and lower adjustment structure; a support block (6031) is fixed to the lower end of the placement plate (603); and a pressure block (604) for clamping the silicon wafer is provided on one side wall of the placement plate (603) and the support block (6031) in correspondence.

5. The chain cleaning device for removing phosphosilicate glass from silicon wafers according to claim 4, characterized in that: A slide groove is provided on the inner side of the placement plate (603), an adjusting slider (6041) is provided on the inner side of the slide groove, and the adjusting slider (6041) is fixed to the pressing block (604), and a pressing spring (6033) is provided on the adjusting slider (6041).

6. The chain cleaning device for removing phosphosilicate glass from silicon wafers according to claim 4, characterized in that: The up-and-down adjustment structure comprises a longitudinal adjustment screw (6032) and a longitudinal adjustment nut (6034); a longitudinal adjustment screw (6032) is fixed to one side wall of the placement plate (603); an adjustment groove for the longitudinal adjustment screw (6032) to slide up and down is provided on the other side wall of the adjustment block (602); and a longitudinal adjustment nut (6034) that contacts the adjustment block (602) is connected to the longitudinal adjustment screw (6032) via a threaded portion.

7. The chain cleaning device for removing phosphosilicate glass from silicon wafers according to claim 6, characterized in that: The placement plates (603) are symmetrically arranged at two locations along the center of the long side of the installation block (5).

8. The chain cleaning device for removing phosphosilicate glass from silicon wafers according to claim 1, characterized in that: The partitions (101) are arranged at three locations, and the three partitions (101) are evenly distributed along the long side of the cleaning tank (1).

9. The chain cleaning device for removing phosphosilicate glass from silicon wafers according to claim 1, characterized in that: The hot air assembly comprises an air guide tube (701) and an air inlet pipe (702); the air guide tube (701) is fixed to a side wall of the frame (2); a plurality of air outlets are provided on the lower surface of the air guide tube (701); one end of the air guide tube (701) passes through the frame (2) to be connected to the air inlet pipe (702) for introducing hot air.

10. The chain cleaning device for removing phosphosilicate glass from silicon wafers according to claim 1, characterized in that: The cleaning tank (1) is rectangular, and the width of the cleaning tank (1) is greater than the width of the clamping assembly (6).

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