Method, apparatus, equipment and storage medium for wafer slapping of graphite boat

Abstract

The embodiment of the present application discloses a method, device, equipment and storage medium for wafer tapping of a graphite boat, belonging to the technical field of wafer production. The method includes: performing tapping processing on a first warped wafer area at a first tapping frequency; determining a second warped wafer area based on the first warped wafer area after the tapping processing; and performing tapping processing on the second warped wafer area at a second tapping frequency. An automated tapping method for a graphite boat is provided in the present application, which does not require manual flattening of the wafers, reduces the labor cost in the wafer production process, improves the tapping success rate through multiple tapping, and improves the flexibility of tapping.

Description

Technical Field

[0001] This application relates to the technical field of silicon wafer production, and particularly to a method, device, equipment and storage medium for slapping silicon wafers on a graphite boat. Background Art

[0002] With the progress of technology and the development of society, the demand for silicon wafers has gradually increased. In related technologies, silicon wafers can be placed on a graphite boat during the production process, and subsequent processing of the silicon wafers can be carried out on the basis of the graphite boat.

[0003] However, in the above-mentioned related technologies, silicon wafers processed from a high-temperature furnace are very likely to warp. If directly given to a robotic arm for insertion and suction in the next process, the silicon wafers will be crushed. Therefore, it is necessary for workers to slap the silicon wafers flat and let them fall into a fixed card slot, resulting in high labor costs. Summary of the Invention

[0004] Embodiments of this application provide a method, device, equipment and storage medium for slapping silicon wafers on a graphite boat, which can reduce the labor cost during the production process of silicon wafers. The technical solutions are as follows:

[0005] On the one hand, embodiments of this application provide a method for slapping silicon wafers on a graphite boat, and the method includes:

[0006] Performing a slapping process on a first warped wafer area at a first slapping frequency; wherein, the first warped wafer area refers to an area including at least one warped silicon wafer obtained based on the graphite boat;

[0007] Determining a second warped wafer area based on the first warped wafer area after the slapping process; wherein, the second warped wafer area includes at least one warped silicon wafer;

[0008] Performing a slapping process on the second warped wafer area at a second slapping frequency.

[0009] On the other hand, embodiments of this application provide a device for slapping silicon wafers on a graphite boat, and the device includes:

[0010] A slapping process module, configured to perform a slapping process on a first warped wafer area at a first slapping frequency; wherein, the first warped wafer area refers to an area including at least one warped silicon wafer obtained based on the graphite boat;

[0011] An area determination module, configured to determine a second warped wafer area based on the first warped wafer area after the slapping process; wherein, the second warped wafer area includes at least one warped silicon wafer;

[0012] The slapping process module is further configured to perform a slapping process on the second warped wafer area at a second slapping frequency.

[0013] In another aspect, an embodiment of the present application provides a computer device, which includes a processor and a memory. A computer program is stored in the memory and is loaded and executed by the processor to implement the above-mentioned method for slapping wafers on a graphite boat.

[0014] In yet another aspect, an embodiment of the present application provides a non-transitory computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the above-mentioned method for slapping wafers on a graphite boat is implemented.

[0015] In still another aspect, an embodiment of the present application provides a computer program product. When the computer program product runs, it causes a computer device to execute the above-mentioned method for slapping wafers on a graphite boat.

[0016] The technical solutions provided by the embodiments of the present application can bring the following beneficial effects:

[0017] An automated method for slapping wafers on a graphite boat is provided, which does not require manual flattening of the wafers, reducing the labor cost in the wafer production process. After slapping the first warped wafer area, the second warped wafer area is determined based on the first warped wafer area, and the slapping process is continued for the second warped wafer area. Multiple slapping operations improve the slapping success rate. Different slapping frequencies are used for different warped wafer areas, improving the flexibility of slapping. In the specific production process, the slapping frequency can be flexibly set and adjusted according to different production beats. A high production beat corresponds to a high slapping frequency to improve the matching degree between the slapping process and the production process, and a low production beat corresponds to a low slapping frequency to reduce the slapping energy consumption and save resources. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0019] Figure 1 is a schematic diagram of a wafer slapping system for a graphite boat provided by an embodiment of the present application;

[0020] Figure 2 Exemplarily shows a schematic diagram of a slapping robot;

[0021] Figure 3 is a flowchart of a method for slapping wafers on a graphite boat provided by an embodiment of the present application;

[0022] Figure 4 is a flowchart of a method for slapping wafers on a graphite boat provided by another embodiment of the present application;

[0023] Figure 5 is a flowchart of a method for slapping silicon wafers on a graphite boat provided by another embodiment of the present application;

[0024] Figure 6 Exemplarily shows a schematic diagram of a way to slap silicon wafers on a graphite boat;

[0025] Figure 7 is a block diagram of a device for slapping silicon wafers on a graphite boat provided by an embodiment of the present application;

[0026] Figure 8 is a block diagram of a device for slapping silicon wafers on a graphite boat provided by another embodiment of the present application. Detailed implementation manners

[0027] To make the objectives, technical solutions, and advantages of the present application clearer, the following will further describe the embodiments of the present application in detail with reference to the accompanying drawings.

[0028] Please refer to Figure 1 , which shows a schematic diagram of a system for slapping silicon wafers on a graphite boat provided by an embodiment of the present application. The system for slapping silicon wafers on the graphite boat may include: a computer device 10. Among them, the computer device 10 includes a slapping unit 11 and a moving unit 12.

[0029] The slapping unit 11 is used to perform a slapping process on the graphite boat. In the embodiment of the present application, after determining the area to be slapped on the graphite boat, the slapping unit 11 performs a slapping process on the area to be slapped. Optionally, the slapping unit 11 determines the slapping frequency according to the number of slapping times and the number of warped silicon wafers, and then uses the corresponding slapping frequency to perform a slapping process on the area to be slapped. Exemplarily, in order to reduce the silicon wafer fragments after the slapping process, the slapping unit 11 may use a material with a soft texture to slap the graphite boat, such as using a silicone rubber slapper to slap the graphite boat.

[0030] The moving unit 12 is used to control the movement of the above-mentioned slapping unit 11. In the embodiment of the present application, if the area to be slapped exceeds the slapping range of the slapping unit 11, the moving unit 12 controls the slapping unit 11 to move to the position corresponding to the area to be slapped, so that the area to be slapped is within the slapping range of the slapping unit 11, and then the slapping unit 11 performs a slapping process on the area to be slapped. Optionally, the moving unit 12 determines the moving speed and moving direction according to the position between the area to be slapped and the slapping unit 11, and then the moving unit 12 controls the slapping unit 11 to move to the position corresponding to the area to be slapped according to the moving speed and moving direction. Among them, the above-mentioned slapping range may be the best slapping range with the best slapping effect.

[0031] In an exemplary embodiment, as Figure 1As shown, the wafer tapping system 10 of the above-mentioned graphite boat further includes an image unit 13, which is used to collect and process images of the graphite boat. In the embodiment of the present application, before the wafer warping is tapped, the image unit 13 is used to collect and process the image of the graphite boat to obtain the graphite boat image, and the image detection process is performed on the graphite boat image. Further, in the case where there is a warped wafer in the graphite boat image, the position of the warped wafer is obtained to determine the area to be tapped on the graphite boat. Optionally, the image detection process refers to performing image detection on the graphite boat image based on a pre-trained neural network model.

[0032] It should be noted that the above introduction to the computer device 10 and the wafer tapping system of the graphite boat is only exemplary and explanatory. In actual applications, the units included in the computer device 10 and the devices included in the wafer tapping system of the graphite boat can be flexibly set and adjusted according to the actual environment. For example, the image unit 13 can be split into an image acquisition unit and an image processing unit. The image acquisition unit acquires images, and the image processing unit processes the acquired images. For another example, a control unit is configured in the computer device 10 to determine the tapping parameters for the graphite boat (such as tapping frequency, moving speed, and moving direction, etc.). For still another example, the computer device 10 only includes: a tapping unit 11, a moving unit 12, and an image processing unit, and the image acquisition unit is configured in other devices of the wafer tapping system of the graphite boat.

[0033] Optionally, the above-mentioned computer device 10 can be an electronic device such as a mobile phone, a tablet computer, a wearable device, a background server, or a PC (Personal Computer), and the embodiment of the present application does not limit this.

[0034] Optionally, a tapping robot is used to tap the graphite boat. Exemplarily, as Figure 2 shown, the tapping robot includes a robotic arm 21, a silica gel tapping hand 22, an electrical cabinet 23, a mobile robot 24, and a charging pile 25. During the tapping process, the graphite boat image is collected by the image device around the graphite boat and processed to determine the area to be tapped. Further, the moving direction, moving speed, and tapping frequency are determined. Then, the mobile robot 24 controls the tapping robot to move to the position corresponding to the area to be tapped according to the moving direction and moving speed. Further, the robotic arm 21 and the silica gel tapping hand 22 tap the area to be tapped at the corresponding tapping frequency. Optionally, during the tapping process, the robotic arm 21 can control the silica gel tapping hand 22 to move in the area to be tapped, and further control the position of the silica gel tapping hand 22 in the area to be tapped so that the silica gel tapping hand 22 can perform tapping.

[0035] Optionally, in the embodiments of the present application, the above-mentioned wafer tapping area can also be referred to as the fin area, such as the first fin area and the second fin area in the following text.

[0036] Please refer to Figure 3 , which shows a flowchart of a wafer tapping method for a graphite boat provided by an embodiment of the present application. This method is applied to Figure 1 the computer device 10 in the wafer tapping system of the graphite boat shown. This method may include the following steps (301~303):

[0037] Step 301, perform wafer tapping on the first fin area at the first tapping frequency.

[0038] The first fin area refers to an area including at least one wafer fin obtained based on the graphite boat. Optionally, the computer device collects an image around the graphite boat, generates a first graphite boat image, and performs image detection processing on the first graphite boat image, and then determines the area where the wafer fins exist on the graphite boat as the first fin area.

[0039] The first tapping frequency is used to indicate the tapping speed for the first fin area.

[0040] In a possible implementation manner, the first tapping frequency is a fixed value. Exemplarily, after a large number of experiments and calculations by developers, the optimal frequency that can ensure the tapping efficiency is determined, and then this optimal frequency is determined as the first tapping frequency.

[0041] In another possible implementation manner, the first tapping frequency is obtained in real time according to the actual situation. Exemplarily, in order to improve the tapping efficiency of the computer device in different environments, the computer device obtains the number of wafer fins in the first fin area, and then determines the first tapping frequency based on the corresponding relationship between the number of fins and the tapping frequency. Optionally, the number of wafer fins in the first fin area can be obtained in real time, or can be obtained through the above-mentioned first graphite boat image when determining the second fin area. The embodiments of the present application do not limit this. Among them, the "corresponding relationship between the number of fins and the tapping frequency" used when determining the first tapping frequency can be referred to as the first corresponding relationship. Optionally, the number of fins and the tapping frequency are directly proportional, that is, the more the number of fins, the greater the corresponding tapping frequency, and the fewer the number of fins, the smaller the corresponding tapping frequency. Exemplarily, the above-mentioned first corresponding relationship is a corresponding relationship determined according to practice and calculation and stored in advance.

[0042] In the embodiments of the present application, after the computer device determines the first fin area and the first tapping frequency, it performs wafer tapping on the first fin area at the first tapping frequency.

[0043] Step 302: Determine a second fin area based on the first fin area after paddle processing.

[0044] The second fin area includes at least one silicon wafer fin. In the embodiments of the present application, after the computer device performs paddle processing on the first fin area, it determines the second fin area based on the first fin area after paddle processing. Optionally, for the graphite boat after paddle processing, the computer device collects images around the graphite boat, generates a second graphite boat image, and performs image detection processing on the second graphite boat image, and then determines the area with silicon wafer fins on the graphite boat as the second fin area.

[0045] In a possible implementation manner, in order to improve the image acquisition efficiency, the computer device collects images in the first fin area on the graphite boat, generates a second graphite boat image, and performs image detection processing on the second graphite boat image, and then determines the area with silicon wafer fins in the first fin area as the second fin area. In this case, the image acquisition range when obtaining the second graphite boat image is only in the first fin area, that is, the image acquisition range corresponding to the second graphite boat image is smaller than the image acquisition range corresponding to the first graphite boat image.

[0046] In another possible implementation manner, in order to improve the image acquisition accuracy, the computer device collects images around the graphite boat, generates a second graphite boat image, and performs image detection processing on the second graphite boat image, and then determines the area with silicon wafer fins on the graphite boat as the second fin area. In this case, the image acquisition range corresponding to the second graphite boat image is the same as the image acquisition range corresponding to the first graphite boat image.

[0047] Step 303: Perform paddle processing on the second fin area at a second paddle frequency.

[0048] The second paddle frequency is used to indicate the paddle speed for the second fin area.

[0049] In a possible implementation manner, the second paddle frequency is a fixed value. Exemplarily, after a large number of experiments and calculations by developers, the optimal frequency that can ensure the paddle efficiency is determined, and then this optimal frequency is determined as the second paddle frequency.

[0050] In another possible implementation, the second wafer patting frequency is obtained in real time according to the actual situation. Exemplarily, in order to improve the wafer patting efficiency of the computer device in different environments, the computer device obtains the number of wafers in the second fin area, and then determines the second wafer patting frequency based on the corresponding relationship between the number of wafers and the wafer patting frequency. Among them, the "corresponding relationship between the number of wafers and the wafer patting frequency" used when determining the second wafer patting frequency can be called the second corresponding relationship. Optionally, there is a direct proportion between the number of wafers and the wafer patting frequency, that is, the larger the number of wafers, the larger the corresponding wafer patting frequency, and the smaller the number of wafers, the smaller the corresponding wafer patting frequency. Exemplarily, the above second corresponding relationship is a corresponding relationship determined according to actual situations and calculations and stored in advance.

[0051] In the embodiment of the present application, after the computer device determines the above-mentioned second fin area, it uses the second wafer patting frequency to perform wafer patting processing on the second fin area.

[0052] In a possible implementation, there is no relationship between the second wafer patting frequency and the first wafer patting frequency; that is, the second corresponding relationship and the first corresponding relationship can be the same corresponding relationship or different corresponding relationships.

[0053] In another possible implementation, in order to improve the wafer patting efficiency, the second wafer patting frequency is greater than the first wafer patting frequency. In this case, the minimum wafer patting frequency recorded in the second corresponding relationship is greater than the maximum wafer patting frequency recorded in the first corresponding relationship.

[0054] In summary, in the technical solution provided by the embodiment of the present application, an automated wafer patting method for a graphite boat is provided, which does not require manual flattening of the wafers, reducing the labor cost in the wafer production process; after performing wafer patting processing on the first fin area, the second fin area is determined based on the first fin area, and wafer patting processing is continued on the second fin area. Multiple wafer pattings improve the success rate of wafer patting; different wafer patting frequencies are used to perform wafer patting on different fin areas, improving the flexibility of wafer patting. In the specific production process, the wafer patting frequency can be flexibly set and adjusted according to different production beats. A high production beat corresponds to a high wafer patting frequency to improve the matching degree between the wafer patting process and the production process, and a low production beat corresponds to a low wafer patting frequency to reduce the wafer patting energy consumption and save resources.

[0055] In addition, when performing wafer patting processing on the second fin area, the second wafer patting frequency is greater than the first wafer patting frequency. Increasing the wafer patting frequency during the second wafer patting improves the wafer patting efficiency of the second wafer patting. Further, if there are still wafer warps after the second wafer patting, due to the improved wafer patting efficiency before, the saved time can be used to continue the third wafer patting, thereby improving the overall wafer patting efficiency and the overall wafer patting success rate for the graphite boat.

[0056] Next, the method of wafer transfer for the first fin region will be introduced.

[0057] Optionally, the first fin region includes at least one first fin sub-region, and the first fin sub-region includes at least one silicon wafer fin. In an exemplary embodiment, step 301 above includes the following steps:

[0058] 1. For the unprocessed first target sub-region adjacent to the processed first adjacent sub-region in the first fin region, obtain the distance between the first adjacent sub-region and the first target sub-region.

[0059] The first target sub-region refers to any unprocessed first fin sub-region. The first adjacent sub-region refers to the processed first fin sub-region closest to the first target sub-region. In the embodiments of the present application, after the wafer transfer of the first adjacent sub-region is completed, the computer device obtains the positional relationship between the first adjacent sub-region and each unprocessed first fin sub-region, determines the first target sub-region based on this positional relationship, and obtains the distance between the first adjacent sub-region and the first target sub-region.

[0060] In a possible implementation manner, in order to ensure data real-time performance, the computer device obtains the above positional relationship in real time before performing wafer transfer processing on the first target sub-region. In another possible implementation manner, when the computer device determines the first fin region, it records the positional relationship between each first fin sub-region, thereby improving the subsequent wafer transfer efficiency.

[0061] 2. Determine the first moving speed based on the distance between the first adjacent sub-region and the first target sub-region.

[0062] The first moving speed refers to the average speed at which the wafer transfer device moves to the first target sub-region. Optionally, the wafer transfer device can be a computer device or other devices other than the computer device in the silicon wafer transfer system of the graphite boat. In the embodiments of the present application, after the computer device obtains the distance between the first adjacent sub-region and the first target sub-region, it determines the first moving speed based on the distance between the first adjacent sub-region and the first target sub-region. The distance between sub-regions can be the distance between the edges of the sub-regions or the distance between the center points of the sub-regions. The embodiments of the present application do not limit this.

[0063] Optionally, the distance between the first adjacent sub-region and the first target sub-region is proportional to the first moving speed. The farther the distance, the greater the first moving speed; the closer the distance, the smaller the first moving speed.

[0064] In a possible implementation, the computer device pre-stores the correspondence between the sub-region distance and the first moving speed. Then, when determining the distance between the first adjacent sub-region and the first target sub-region, the first moving speed is determined based on the above-mentioned correspondence between the sub-region distance and the first moving speed. In another possible implementation, the computer device pre-stores the correspondence between the sub-region distance and the first moving time. Then, when determining the distance between the first adjacent sub-region and the first target sub-region, the first moving speed is determined based on the above-mentioned correspondence between the sub-region distance and the first moving time. Among them, the above-mentioned first moving time can be a numerical value, such as 0.10s, 0.11s or 0.12s, etc.; it can also be a period range, such as 0.05s - 0.10s, 0.11s - 0.12s or 0.12s - 0.17s, etc. Optionally, if the above-mentioned first moving time is a period range, the computer device can determine the first moving speed based on its own state. For example, when its own state is busy, the first moving speed is determined based on the shortest moving time indicated by the first moving time; when its own state is leisurely, the first moving speed is determined based on the longest moving time indicated by the first moving time; when its own state is moderate, the first moving speed is determined based on the average moving time indicated by the first moving time; and so on.

[0065] 3. When moving to the first target sub-region, the first target sub-region is subjected to the boat patting process using the first boat patting frequency.

[0066] Optionally, after the computer device determines the first moving speed, it moves to the position corresponding to the first target sub-region according to the first moving speed. In the embodiments of the present application, when moving to the first target sub-region, the computer device uses the first boat patting frequency to perform the boat patting process on the first target sub-region.

[0067] 4. From the first fin region, the first fin sub-region that is adjacent to the first target sub-region and has not been boat patted is determined as the second adjacent sub-region.

[0068] The second adjacent sub-region refers to the first fin sub-region that is closest to the first target sub-region and has not been boat patted. In the embodiments of the present application, after the boat patting of the first target sub-region is completed this time, the second adjacent sub-region is determined according to the positional relationship between the first target sub-region and each first fin sub-region that has not been boat patted.

[0069] 5. The second adjacent sub-region is determined as the new first target sub-region, and the steps of obtaining the distance between the first adjacent sub-region and the target sub-region are repeated until the first fin region does not include any first fin sub-regions that have not been boat patted.

[0070] In an embodiment of the present application, after the computer device obtains the above-mentioned second adjacent sub-region, it determines the second adjacent sub-region as a new first target sub-region, and then repeats the step of obtaining the distance between the first adjacent sub-region and the target sub-region until the first fin region does not include un-boated first fin sub-regions, and determines that the boat paddling for the first fin region is completed this time.

[0071] It should be noted that, in a possible implementation manner, if the first target sub-region is the first fin sub-region in the first fin region to perform the boat paddling operation, at this time, there is no corresponding first adjacent sub-region for the first target sub-region. Optionally, in this case, the computer device obtains the distance between the first target sub-region and the boat paddling device; then, based on the distance between the first target sub-region and the boat paddling device, determines the above-mentioned first moving speed; after that, when moving to the first target sub-region, the first target sub-region is processed by boat paddling at the first boat paddling frequency. Optionally, in this case, the first target sub-region is the first fin sub-region closest to the boat paddling device.

[0072] In summary, in the technical solution provided by the embodiment of the present application, the moving speed of the computer device is determined by the distance between adjacent regions to be boat paddled during the boat paddling process, which improves the flexibility of movement during the boat paddling process; moreover, a large distance corresponds to a high speed, reducing the time consumed by the movement of the computer device, and a small distance corresponds to a low speed, reducing the power consumed by the movement of the computer device.

[0073] In addition, for the problem of large distance and long moving time between adjacent sub-regions in the long production line production scenario, by adjusting the moving speed according to different distances, when the distance between un-boated adjacent sub-regions is far, the moving speed is increased to quickly move to the adjacent sub-region, reducing the time waste during the movement, improving the adaptability of the computer device to the long production line, and further improving the environmental adaptability of the computer device during the boat paddling process.

[0074] Similar to the boat paddling method for the first fin region above, below, the boat paddling method for the second fin region will be introduced.

[0075] In an exemplary embodiment, step 303 above includes the following steps:

[0076] 1. Determine the second boat paddling frequency based on the number of fins of the silicon wafer in the second fin region.

[0077] In an embodiment of the present application, after the computer device determines the above-mentioned second fin area, it determines the second paddle frequency based on the number of fins of the wafers in the second fin area. The number of fins of the wafers in the second fin area can be obtained in real time, or can be obtained through the above-mentioned second graphite boat image when determining the second fin area. The embodiments of the present application do not limit this.

[0078] In a possible implementation manner, in order to improve the paddle efficiency, after the computer device obtains the number of fins of the wafers in the second fin area, according to the corresponding relationship between the number of fins and the paddle frequency, it determines the second paddle frequency based on the number of fins of the wafers in the second fin area. Optionally, there is a direct proportion between the number of fins and the paddle frequency, that is, the greater the number of fins of the wafers in the second fin area, the greater the corresponding second paddle frequency, and the smaller the number of fins of the wafers in the second fin area, the smaller the corresponding second paddle frequency.

[0079] In another possible implementation manner, in order to improve the paddle efficiency and the paddle success rate, after the computer device obtains the number of fins of the wafers in the second fin area, it determines the second paddle frequency based on the number of fins of the wafers in the second fin area and the number of fins of the wafers in the first fin area. Optionally, the computer device obtains the ratio between the number of fins of the wafers in the second fin area and the number of fins of the wafers in the first fin area, and then determines the second paddle frequency according to the corresponding relationship between the ratio and the paddle frequency. Among them, the above ratio is used to indicate the paddle success rate of the first fin area after paddle processing the first fin area with the first paddle frequency. Exemplarily, there is an inverse proportion between the ratio and the paddle success rate; the higher the ratio, the lower the paddle success rate, and the lower the ratio, the higher the paddle success rate. Exemplarily, there is an inverse proportion between the paddle success rate and the paddle frequency, the higher the paddle success rate, the lower the paddle frequency, and the lower the paddle success rate, the higher the paddle frequency.

[0080] 2. Perform paddle processing on the second fin area with the second paddle frequency.

[0081] In an embodiment of the present application, after the computer device determines the above-mentioned second paddle frequency, it performs paddle processing on the second fin area with the second paddle frequency.

[0082] Optionally, the second fin area includes at least one second fin sub-area, and the second fin sub-area includes at least one wafer fin.

[0083] In an exemplary embodiment, when the computer device performs the boat paddling process on the second fin region, for the second target sub-region in the second fin region that has not been boat paddled and is adjacent to the third adjacent sub-region that has been boat paddled, the computer device obtains the distance between the third adjacent sub-region and the second target sub-region. Exemplarily, after the boat paddling of the third adjacent sub-region is completed, the computer device obtains the positional relationship between the third adjacent sub-region and each non-boat-paddled second fin sub-region, determines the second target sub-region based on this positional relationship, and obtains the distance between the third adjacent sub-region and the second target sub-region. In one possible implementation manner, in order to ensure data real-time performance, the computer device obtains the above-mentioned positional relationship in real time before performing the boat paddling process on the second target sub-region. In another possible implementation manner, when the computer device determines the second fin region, it records the positional relationship between each second fin sub-region, thereby improving the subsequent boat paddling efficiency.

[0084] In an exemplary embodiment, after the computer device obtains the distance between the third adjacent sub-region and the second target sub-region, based on the distance between the third adjacent sub-region and the second target sub-region, it determines the second moving speed, where the second moving speed refers to the average speed at which the boat paddling device moves to the second target sub-region. Optionally, the boat paddling device can be the computer device or other devices in the silicon wafer boat paddling system of the graphite boat other than the computer device. Among them, the distance between sub-regions can be the distance between the edges of the sub-regions or the distance between the center points of the sub-regions, and the embodiments of the present application do not limit this. Optionally, the distance between the third adjacent sub-region and the second target sub-region is proportional to the above-mentioned second moving speed. The farther the distance, the greater the second moving speed, and the closer the distance, the smaller the second moving speed.

[0085] In a possible implementation, the computer device prestores the correspondence between the sub-region distance and the second moving speed. Then, when determining the distance between the third adjacent sub-region and the second target sub-region, the second moving speed is determined based on the above correspondence between the sub-region distance and the second moving speed. In another possible implementation, the computer device prestores the correspondence between the sub-region distance and the second moving time. Then, when determining the distance between the third adjacent sub-region and the second target sub-region, the second moving speed is determined based on the above correspondence between the sub-region distance and the second moving time. Wherein, the above second moving time can be a numerical value; it can also be a period range. Optionally, if the above second moving time is a period range, the computer device can determine the second moving speed based on its own state. For example, when its own state is busy, the second moving speed is determined based on the shortest moving time indicated by the second moving time; when its own state is leisurely, the second moving speed is determined based on the longest moving time indicated by the second moving time; when its own state is moderate, the second moving speed is determined based on the average moving time indicated by the second moving time; and so on.

[0086] In a possible implementation, when the distance between the adjacent sub-region and the target sub-region is the same, the above second moving speed is the same as the above first moving speed; in another possible implementation, in order to improve the boat patting efficiency, when the distance between the adjacent sub-region and the target sub-region is the same, the above second moving speed is greater than the above first moving speed.

[0087] In an exemplary embodiment, after determining the second moving speed, the computer device moves to the position corresponding to the second target sub-region according to the second moving speed. In the embodiment of the present application, when moving to the second target sub-region, the computer device performs boat patting processing on the second target sub-region at the second boat patting frequency.

[0088] In an exemplary embodiment, after the computer device finishes patting the second target sub-region this time, from the second fin region, the second fin sub-region that is adjacent to the second target sub-region and has not been patted is determined as the fourth adjacent sub-region. The fourth adjacent sub-region refers to the second fin sub-region that has not been patted and is closest to the second target sub-region. Optionally, the computer device determines the fourth adjacent sub-region according to the positional relationship between the above second target sub-region and each unpatted second fin sub-region.

[0089] In an embodiment of the present application, after the computer device obtains the above-mentioned fourth adjacent sub-region, it determines the fourth adjacent sub-region as the new second target sub-region; and, starting from the step of obtaining the distance between the third adjacent sub-region and the second target sub-region, it repeats the execution until the second fin region does not include un-boated second fin sub-regions.

[0090] It should be noted that, in a possible implementation manner, if the second target sub-region is the first second fin sub-region in the second fin region to perform the boat-patting operation, at this time, there is no corresponding third adjacent sub-region for the second target sub-region. Optionally, in this case, the computer device obtains the distance between the second target sub-region and the boat-patting device; then, based on the distance between the second target sub-region and the boat-patting device, it determines the above-mentioned second moving speed; afterwards, when moving to the second target sub-region, it performs boat-patting processing on the second target sub-region at the second boat-patting frequency. Optionally, in this case, the second target sub-region is the second fin sub-region closest to the boat-patting device.

[0091] In summary, in the technical solution provided by the embodiment of the present application, the boat-patting frequency is determined by the number of fins, which improves the flexibility of the computer device during the boat-patting process. When the number of fins is large, the boat-patting frequency is increased, improving the boat-patting efficiency.

[0092] In addition, for the problem of large distance and long moving time between adjacent sub-regions in the long production line production scenario, by adjusting the moving speed according to different distances, when the distance between un-boated adjacent sub-regions is far, the moving speed is increased to quickly move to the adjacent sub-region, reducing the time waste during the moving process, improving the adaptability of the computer device to the long production line, and further improving the environmental adaptability of the computer device during the boat-patting process.

[0093] Next, the method for obtaining the fin region will be introduced.

[0094] For the first fin region, in an exemplary embodiment, before the above step 301, the following steps are further included:

[0095] 1. Obtain a first graphite boat image based on the graphite boat.

[0096] The first graphite boat image is used to record the states of at least one silicon wafer on the graphite boat. Among them, the states of the silicon wafer include at least one of the following: silicon wafer warping, silicon wafer edge chipping, silicon wafer fragmentation, silicon wafer missing pieces, etc. In an embodiment of the present application, before the computer device obtains the first fin region, it obtains the first graphite boat image based on the graphite boat.

[0097] In a possible implementation, the first graphite boat image is a directly acquired static image. Optionally, the computer device acquires a static image of the graphite boat at a certain moment to obtain the first graphite boat image. Herein, the certain moment can be any moment, and the embodiments of the present application do not limit this.

[0098] In another possible implementation, since the wafers in the graphite boat may change their states over time, in order to ensure as much as possible that the state of the wafers recorded in the first graphite boat image is the final state of the wafers before the boat shooting process, the first graphite boat image is a static image extracted from a dynamic image. Optionally, the computer device acquires a dynamic image of the graphite boat within a certain time period. The dynamic image includes a plurality of consecutive static images. Further, the computer device performs image comparison processing on each static image in the dynamic image. When it is determined that the states of the wafers in p consecutive static images do not change, any one of the p consecutive static images is obtained as the first graphite boat image. Herein, p is any integer greater than 1, such as 5, 10, or 33, etc., and the embodiments of the present application do not limit this.

[0099] Optionally, the computer device acquires the first graphite boat image from the graphite boat through an image acquisition device. The number and / or shooting range of the image acquisition device can be flexibly set and adjusted according to the actual situation. For example, the computer device acquires the first graphite boat image from the graphite boat through an image acquisition device with a shooting range greater than the first target range value; or the computer device acquires the first graphite boat image from the graphite boat through a plurality of image acquisition devices with a shooting range less than or equal to the first target range value. Optionally, the image acquisition device can be a camera, a camera, a scanner, or a mobile terminal equipped with a camera, etc., and the embodiments of the present application do not limit this. Herein, the above first target range value can be any value, and the first target range value can be flexibly set and adjusted according to the actual situation, and the embodiments of the present application do not limit this.

[0100] 2. When there are warped wafers in the first graphite boat image, determine the positions of each warped wafer.

[0101] In the embodiments of the present application, after the computer device acquires the above first graphite boat image, when there are warped wafers in the graphite boat image, determine the positions of each warped wafer. Optionally, the computer device performs image detection processing on the first graphite boat image, and then determines the positions of each warped wafer on the first graphite boat image. Exemplarily, the image detection processing refers to performing image detection on the first graphite boat image based on a pre-trained first neural network model.

[0102] 3. Based on the positions of the warped wafers on each silicon wafer, determine the position of the unmarked first target warped silicon wafer as the first position; and mark the first target warped silicon wafer.

[0103] The first target warped silicon wafer refers to any warped silicon wafer in the first graphite boat image. In the embodiments of the present application, after the computer device determines the positions of the warped silicon wafers in the first graphite boat, based on the positions of these warped silicon wafers, determine the position of the unmarked first target warped silicon wafer as the first position; and mark the first target warped silicon wafer.

[0104] In a possible implementation manner, there are marked warped silicon wafers in the first graphite boat image. Optionally, when the marking of the first adjacent warped silicon wafers is completed, the computer device determines the silicon wafer that is closest to the first adjacent warped silicon wafer and is unmarked as the above-mentioned first target warped silicon wafer based on the positions of the warped silicon wafers in the first graphite boat. Among them, the above-mentioned first adjacent warped silicon wafers can be the warped silicon wafers in the j-th first warped sub-region, or the warped silicon wafers in the (j - 1)-th first warped sub-region. It should be noted that if the first adjacent warped silicon wafers are the warped silicon wafers in the (j - 1)-th first warped sub-region, then the first adjacent warped silicon wafers are the last marked warped silicon wafers in the (j - 1)-th first warped sub-region, and its position is the final first position in the (j - 1)-th first warped sub-region; correspondingly, the first target warped silicon wafer is the first marked warped silicon wafer in the j-th first warped sub-region, and its position is the initial first position in the j-th first warped sub-region.

[0105] In another possible implementation manner, there are no marked warped silicon wafers in the first graphite boat image, that is, the first target warped silicon wafer is the first warped silicon wafer to be marked in the first graphite boat image. Optionally, the computer device takes the silicon wafer closest to the edge point of the graphite boat as the above-mentioned first silicon wafer based on the positions of the warped silicon wafers in the first graphite boat. Optionally, the above-mentioned edge point can be any point on the edge of the graphite boat; for example, the first warped region without the boat image is rectangular, and the edge point can be the upper left vertex, the lower right vertex, or the center point of the lower side edge, etc., and the embodiments of the present application do not limit this. It should be noted that in this case, the j-th first warped sub-region in the following text is the first first warped sub-region, and the position of the first target warped silicon wafer is the initial first position in the first first warped sub-region.

[0106] Optionally, the marking of the warped silicon wafers based on the first graphite boat image can also be referred to as the first marking.

[0107] 4. Taking the first position as a reference, determine the position of the silicon wafer that is closest to the first position and is unmarked as the first target position; and mark the silicon wafer that is closest to the first position and is unmarked.

[0108] In an embodiment of the present application, after the computer device determines the above-mentioned first position, taking the first position as a reference, it determines the position of the silicon wafer warpage that is closest to the first position and unmarked as the first target position; and marks the silicon wafer warpage that is closest to the first position and unmarked. The distance between the silicon wafer warpages may be the distance between any point (such as the center point, the upper left vertex, or the center point of the upper side edge, etc.) on the silicon wafer warpage, and the embodiments of the present application do not limit this.

[0109] 5. Determine the first target position as the new first position; and start repeating the step of determining the position of the silicon wafer warpage that is closest to the first position and unmarked as the first target position with the first position as a reference until the distance between the new first position and the initial first position is greater than the first threshold.

[0110] In an embodiment of the present application, after the computer device obtains the above-mentioned first target position, it determines the first target position as the new first position; further, it starts repeating the step of determining the position of the silicon wafer warpage that is closest to the first position and unmarked as the first target position with the first position as a reference until the distance between the new first position and the initial first position is greater than the first threshold.

[0111] Optionally, in order to improve the success rate of subsequent boat patting, the above-mentioned first threshold is determined based on the optimal boat patting range of the computer device. Exemplarily, if the optimal boat patting range is a rectangle, the first threshold is the length of the short side of the distance; if the optimal boat patting range is a trapezoid, the first threshold is the height of the trapezoid; and so on. It should be noted that the above-mentioned optimal boat patting range can be determined by multiple experimental tests, and the embodiments of the present application do not limit the specific shape and specific area of the optimal boat patting range.

[0112] 6. Determine the j-th first warpage sub-region based on the final first position and the initial first position.

[0113] In an embodiment of the present application, when the distance between the new first position and the initial first position is greater than the first threshold, the computer device determines the new first position as the final first position, and determines the j-th first warpage sub-region based on the final first position and the initial first position. Wherein, j is an integer greater than or equal to 1; there are m first warpage sub-regions in the above-mentioned first warpage region, and m is an integer greater than or equal to j; the above-mentioned initial first position refers to the position of the first marked silicon wafer warpage after the (j - 1)-th first warpage sub-region is determined.

[0114] In summary, in the technical solution provided by the embodiment of the present application, by dividing the fin area into multiple fin sub-areas, and the distance between the silicon wafer fins in a single fin sub-area does not exceed a threshold, the silicon wafer fins in each fin sub-area can be concentratedly distributed, reducing the adverse impact of the scattered distribution of the silicon wafer fins on the success rate of boat loading, thereby improving the success rate of boat loading.

[0115] For the second fin area, in an exemplary embodiment, step 302 further includes the following steps:

[0116] 1. When there are silicon wafer fins in the first fin area after boat loading processing, determine the positions of each silicon wafer fin.

[0117] In the embodiment of the present application, after the computer device performs boat loading processing on the first fin area, it determines whether there are silicon wafer fins in the first fin area after boat loading processing. When there are silicon wafer fins in the first fin area after boat loading processing, it determines the positions of each silicon wafer fin. Optionally, the computer device obtains a second graphite boat image based on the first fin area after boat loading processing, and then determines the positions of each silicon wafer fin when there are silicon wafer fins in the second graphite boat image.

[0118] 2. Based on the positions of each silicon wafer fin, determine the position of the unmarked second target silicon wafer fin as the second position; and mark the second target silicon wafer fin.

[0119] The second target silicon wafer fin refers to any silicon wafer fin in the first fin area after boat loading processing. In the embodiment of the present application, after the computer device determines the positions of each silicon wafer fin in the first fin area after boat loading processing, based on the positions of each silicon wafer fin, it determines the position of the unmarked second target silicon wafer fin as the second position; and marks the second target silicon wafer fin.

[0120] In a possible implementation, there are marked silicon wafer warps in the first warp region after the boat slapping process. Optionally, when the marking of the second adjacent silicon wafer warps is completed, the computer device determines, based on the positions of the respective silicon wafer warps, the silicon wafer warp that is closest to the second adjacent silicon wafer warp and has not been marked as the second target silicon wafer warp. Among them, the second adjacent silicon wafer warp can be the silicon wafer warp in the i-th second warp sub-region or the silicon wafer warp in the (i - 1)-th second warp sub-region. It should be noted that if the second adjacent silicon wafer warp is the silicon wafer warp in the (i - 1)-th second warp sub-region, then the second adjacent silicon wafer warp is the last marked silicon wafer warp in the (i - 1)-th second warp sub-region, and its position is the final first position in the (i - 1)-th second warp sub-region; correspondingly, the second target silicon wafer warp is the first marked silicon wafer warp in the i-th second warp sub-region, and its position is the initial first position in the i-th second warp sub-region.

[0121] In another possible implementation, there are no marked silicon wafer warps in the first warp region after the boat slapping process, that is, the second target silicon wafer warp is the first silicon wafer warp to be marked in the first warp region after the boat slapping process. Optionally, the computer device determines, based on the positions of the respective silicon wafer warps, the silicon wafer warp that is closest to the edge point of the first warp region after the boat slapping process as the second target silicon wafer warp. Optionally, the above-mentioned edge point can be any point on the edge of the first warp region after the boat slapping process; for example, when the first warp region after the boat slapping process is a rectangle, the edge point can be the upper left vertex, the lower right vertex, or the center point of the lower side edge, etc., and the embodiments of the present application do not limit this. It should be noted that in this case, the i-th second warp sub-region in the following text is the first second warp sub-region, and the position of the second target silicon wafer warp is the initial first position in the first second warp sub-region.

[0122] Optionally, the marking of the silicon wafer warps based on the first warp region after the boat slapping process can also be referred to as the second marking.

[0123] 3. Taking the second position as a reference, determine the position of the silicon wafer warp that is closest to the second position and has not been marked as the second target position; and mark the silicon wafer warp that is closest to the second position and has not been marked.

[0124] In the embodiments of the present application, after the computer device determines the above-mentioned second position, taking this second position as a reference, it determines the position of the silicon wafer warp that is closest to the second position and has not been marked as the second target position; and marks the silicon wafer warp that is closest to the second position and has not been marked. Among them, the distance between the silicon wafer warps can be the distance between any point (such as the center point, the upper left vertex, or the center point of the upper side edge, etc.) on the silicon wafer warps, and the embodiments of the present application do not limit this.

[0125] 4. Determine the second target position as the new second position; and, starting from the step of determining the position of the silicon wafer warpage that is closest to the second position and unmarked with the second position as the reference, repeat the execution until the distance between the new second position and the initial second position is greater than the second threshold.

[0126] In the embodiment of the present application, after the computer device obtains the above-mentioned second target position, it determines the second target position as the new second position; further, starting from the step of determining the position of the silicon wafer warpage that is closest to the second position and unmarked with the second position as the reference, repeat the execution until the distance between the new second position and the initial second position is greater than the second threshold.

[0127] Optionally, the above-mentioned second threshold and the above-mentioned first threshold may be the same or different, and the embodiment of the present application does not limit this. In one possible implementation manner, similar to the first threshold, the second threshold is determined based on the optimal paddle range of the computer device. Exemplarily, if the optimal paddle range is a rectangle, the second threshold is the length of the short side of the distance; if the optimal paddle range is a trapezoid, the second threshold is the height of the trapezoid; and so on. In another possible implementation manner, in order to improve the paddle success rate, the second threshold is less than the first threshold, and the computer device determines the second threshold based on the first threshold.

[0128] 5. Determine the i-th second warpage sub-region based on the final second position and the initial second position.

[0129] In the embodiment of the present application, when the distance between the new second position and the initial second position is greater than the second threshold, the computer device determines the new second position as the final second position, and determines the i-th second warpage sub-region based on the final second position and the initial second position. Wherein, i is an integer greater than or equal to 1; there are n second warpage sub-regions in the above-mentioned second warpage region, and n is an integer greater than or equal to i; the above-mentioned initial second position refers to the position of the first marked silicon wafer warpage after the (i - 1)-th second warpage sub-region is determined.

[0130] In summary, in the technical solution provided by the embodiment of the present application, by dividing the warpage region into multiple warpage sub-regions, and the distance between the silicon wafer warpages in a single warpage sub-region does not exceed the threshold, the silicon wafer warpages in each warpage sub-region can be concentratedly distributed, reducing the adverse impact of the scattered distribution of the silicon wafer warpages on the paddle success rate, thereby improving the paddle success rate.

[0131] Please refer to Figure 4 , which shows the flowchart of the silicon wafer paddle method of the graphite boat provided by another embodiment of the present application. This method is applied to Figure 1in the computer device 10 in the silicon wafer slapping system of the graphite boat shown. The method may include the following steps (401-406):

[0132] Step 401, perform slapping processing on the first warped wafer area at the first slapping frequency.

[0133] The above step 401 is similar to Figure 3 step 301 in the embodiment. For details, please refer to Figure 3 the embodiment and will not be elaborated here.

[0134] Step 402, obtain a second graphite boat image based on the first warped wafer area after slapping processing.

[0135] The second graphite boat image is used to record the state of at least one silicon wafer in the first warped wafer area after slapping processing. In the embodiments of the present application, before obtaining the second warped wafer area, the computer device obtains the second graphite boat image based on the first warped wafer area after slapping processing.

[0136] In a possible implementation manner, the second graphite boat image is a directly obtained static image. Optionally, the computer device collects a static image of the first warped wafer area after slapping processing from the graphite boat at a certain moment to obtain the second graphite boat image. Among them, the certain moment can be any moment, and the embodiments of the present application do not limit this.

[0137] In another possible implementation manner, since the state of the silicon wafers in the graphite boat may change over time, in order to ensure as much as possible that the state of the silicon wafers recorded in the second graphite boat image is the final state of the silicon wafers before the determination of the second warped wafer area, the second graphite boat image is a static image extracted from a dynamic image. Optionally, the computer device collects a dynamic image of the graphite boat within a certain time period. The dynamic image includes a plurality of consecutive static images. Further, the computer device performs image comparison processing on each static image in the dynamic image. When it is determined that the state of the silicon wafers does not change in q consecutive static images, any one of the q consecutive static images is obtained as the second graphite boat image. Among them, q is any integer greater than 1, such as 6, 10, or 34, etc., and the embodiments of the present application do not limit this. It should be noted that the above q and the above p may be the same or different in value, and the embodiments of the present application do not limit this.

[0138] Optionally, the computer device obtains a second graphite boat image from the first fin area after boat patting through an image acquisition device. The number and / or shooting range of the image acquisition device can be flexibly set and adjusted according to the actual situation. For example, the computer device obtains the second graphite boat image from the first fin area after boat patting through an image acquisition device with a shooting range greater than the second target range value; or, the computer device obtains the second graphite boat image from the first fin area after boat patting through multiple image acquisition devices with a shooting range less than or equal to the second target range value. The second target range value can be any value, and can be flexibly set and adjusted according to the actual situation, and the embodiments of the present application do not limit this.

[0139] It should be noted that the image acquisition device used to obtain the second graphite boat image can be the same as or different from the image acquisition device used to obtain the first graphite boat image, and the embodiments of the present application do not limit this.

[0140] Step 403, perform image detection processing on the second graphite boat image to obtain an image processing result.

[0141] In the embodiments of the present application, after the computer device obtains the second graphite boat image, it performs image detection processing on the second graphite boat image, and then obtains an image processing result.

[0142] In a possible implementation manner, the computer device performs image detection on the second graphite boat image using a pre-trained second neural network model. The second neural network model can be the same neural network model as or different from the first neural network model, and the embodiments of the present application do not limit this. In another possible implementation manner, the computer device uses the first graphite boat image to perform image detection processing on the second graphite boat image through image comparison.

[0143] In the embodiments of the present application, after the computer device obtains the image processing result, it determines whether there is a wafer warp in the first fin area after boat patting. Then, in the case where the image processing result indicates that there is a wafer warp in the first fin area after boat patting, the following steps 404 and 405 are executed; in the case where the image processing result indicates that there is no wafer warp in the first fin area after boat patting, the following step 406 is executed.

[0144] Step 404, determine a second fin area based on the first fin area after boat patting.

[0145] Step 405, perform boat patting on the second fin area using a second boat patting frequency.

[0146] The above steps 404 and 405 are similar to Figure 3 steps 302 and 303 in the Figure 3 embodiment. For details, refer to

[0147] the embodiment and no further elaboration will be provided here.

[0148] In the embodiment of the present application, when the computer device determines that there is no wafer warping in the first fin area after the paddle treatment, it determines that the paddle treatment for the first fin area is completed. After that, the paddle treatment continues for the subsequent new fin area. Among them, the new fin area does not overlap with the above-mentioned first fin area.

[0149] In summary, in the technical solution provided by the embodiment of the present application, by performing image detection processing on the first fin area after the paddle treatment, and then continuing the paddle treatment when there is still wafer warping in the first fin area after the paddle treatment, the paddle success rate for the entire graphite boat is improved.

[0150] Please refer to Figure 5 , which shows a flowchart of a method for wafer paddle treatment of a graphite boat provided by another embodiment of the present application. This method is applied to Figure 1 the computer device of the wafer paddle system of the graphite boat shown. This method may include the following steps (501~507):

[0151] Step 501, perform paddle treatment on the first fin area at the first paddle frequency.

[0152] The above step 501 is similar to Figure 3 step 301 in the Figure 3 embodiment. For details, refer to

[0153] Step 502, obtain a second graphite boat image based on the first fin area after the paddle treatment.

[0154] The above step 502 is similar to Figure 4 step 402 in the Figure 4 embodiment. For details, refer to

[0155] Step 503, perform image detection processing on the second graphite boat image to obtain an image processing result.

[0156] For the specific image detection processing process, refer to step 403 of the above Figure 4 embodiment and no further elaboration will be provided here.

[0157] In the embodiments of the present application, when the computer device determines that there is a wafer warp in the first fin area after the paddle boat process, it obtains the total number of paddle boat operations for the first fin area. Then, when the total number of paddle boat operations for the first fin area is less than the target value, the following steps 504 and 505 are executed; when the total number of paddle boat operations for the first fin area is greater than the target value, the following step 506 is executed. Optionally, when the total number of paddle boat operations for the first fin area is equal to the target value, the following steps 504 and 505 are still executed. Herein, the target value can be any value, and it can be flexibly set and adjusted according to the actual situation. The embodiments of the present application do not limit this.

[0158] It should be noted that one paddle boat operation is from the determination of the first fin area to the acquisition of the second graphite boat image. That is to say, the total number of paddle boat operations for the first fin area can be obtained by adding one to the historical total number of paddle boat operations for the first fin area. Herein, the historical total number of paddle boat operations refers to the total number of paddle boat operations for the fin area containing the first fin area before the acquisition of the first fin area.

[0159] In the embodiments of the present application, when the computer device determines that there is no wafer warp in the first fin area after the paddle boat process, the following step 507 is executed.

[0160] Step 504: Based on the first fin area after the paddle boat process, determine the second fin area.

[0161] Step 505: Perform paddle boat processing on the second fin area at the second paddle boat frequency.

[0162] The above steps 504 and 505 are similar to Figure 3 steps 302 and 303 in the Figure 3 embodiment. For details, refer to the

[0163] embodiment and will not be elaborated herein.

[0164] The warning message is used to indicate manual intervention for the wafer warp in the first fin area. In the embodiments of the present application, when the computer device determines that there is a wafer warp in the first fin area after the paddle boat process and the total number of paddle boat operations for the first fin area is greater than the target value, a warning message is sent to the user terminal to remind the user to perform manual intervention on the wafer warp in the first fin area.

[0165] Optionally, the warning message includes the position information of the first fin area and / or the position information of each wafer warp in the first fin area.

[0166] Step 507: Determine that the paddle boat operation for the first fin area is completed.

[0167] The above step 507 is similar to Figure 4 step 406 in the Figure 4 embodiment. For details, please refer to

[0168] the embodiment and will not be elaborated here.

[0169] In summary, in the technical solution provided by the embodiment of the present application, by detecting the total number of wafer tapping times, a preview message is sent when the total number of wafer tapping times exceeds the target value, so as to perform manual intervention subsequently, reduce the number of ineffective wafer tapping times, and further reduce the loss of computer equipment caused by multiple ineffective wafer tapping times.

[0170] Exemplarily, as Figure 6 shown, after the computer device determines the target wafer region based on the graphite boat, the target wafer region is tapped at the target tapping frequency. After this tapping is completed, it is judged whether there are warped wafers in the target wafer region after the tapping process. Further, when there are warped wafers in the target wafer region after the tapping process by the computer device, it is judged whether the total number of tapping times for the target wafer region exceeds the target value. If the total number of tapping times for the target wafer region does not exceed the target value, a new target wafer region is obtained from the target wafer region after the tapping process, the target tapping frequency is increased, and the new target wafer region is tapped at the increased target tapping frequency. The above steps are repeated until there are no warped wafers in the target wafer region after the tapping process, or a warning message is sent when the total number of tapping times for the target wafer region exceeds the target value.

[0171] The following is an embodiment of the device of the present application, which can be used to execute the method embodiment of the present application. For details not disclosed in the device embodiment of the present application, please refer to the method embodiment of the present application.

[0172] Please refer to Figure 7, which shows a block diagram of a wafer slapping device of a graphite boat provided by an embodiment of the present application. This device has the function of implementing the wafer slapping method of the above-mentioned graphite boat, and this function can be implemented by hardware or by hardware executing corresponding software. This device can be a computer device in the wafer slapping system of the graphite boat, or can be set in the computer device in the wafer slapping system of the graphite boat. The device 700 may include: a boat slapping processing module 710 and a region determination module 720.

[0173] The boat slapping processing module 710 is used to perform boat slapping processing on the first warped wafer region at a first boat slapping frequency; wherein, the first warped wafer region refers to a region including at least one warped wafer obtained based on the graphite boat.

[0174] The region determination module 720 is used to determine a second warped wafer region based on the first warped wafer region after boat slapping processing; wherein, the second warped wafer region includes at least one warped wafer.

[0175] The boat slapping processing module 710 is further used to perform boat slapping processing on the second warped wafer region at a second boat slapping frequency.

[0176] In an exemplary embodiment, the second boat slapping frequency is greater than the first boat slapping frequency.

[0177] In an exemplary embodiment, as Figure 8 shown, the boat slapping processing module 710 includes: a frequency determination sub-module 711 and a boat slapping processing sub-module 712.

[0178] The frequency determination sub-module 711 is used to determine the second boat slapping frequency based on the number of warped wafers of the wafers in the second warped wafer region.

[0179] The boat slapping processing sub-module 712 is used to perform boat slapping processing on the second warped wafer region at the second boat slapping frequency.

[0180] In an exemplary embodiment, the frequency determination sub-module 711 is used to determine the second boat slapping frequency according to the corresponding relationship between the number of warped wafers and the boat slapping frequency, with the number of warped wafers of the wafers in the second warped wafer region as a reference; or, based on the number of warped wafers of the wafers in the second warped wafer region and the number of warped wafers of the wafers in the first warped wafer region, determine the second boat slapping frequency.

[0181] In an exemplary embodiment, the second warped wafer region includes at least one second warped sub-region, and the second warped sub-region includes at least one warped wafer; the boat slapping processing sub-module 712 is used to:

[0182] For a second target sub-region that is not patted in the second fin region and is adjacent to a third adjacent sub-region that has been patted, obtain the distance between the third adjacent sub-region and the second target sub-region;

[0183] Based on the distance between the third adjacent sub-region and the second target sub-region, determine a second moving speed, where the second moving speed refers to the average speed of moving to the second target sub-region;

[0184] When moving to the second target sub-region, perform a patting process on the second target sub-region using the second patting frequency;

[0185] From the second fin region, determine an un-patted second fin sub-region adjacent to the second target sub-region as a fourth adjacent sub-region;

[0186] Determine the fourth adjacent sub-region as a new second target sub-region; and, start repeating from the step of obtaining the distance between the third adjacent sub-region and the second target sub-region until the second fin region does not include the un-patted second fin sub-region.

[0187] In an exemplary embodiment, the first fin region includes at least one first fin sub-region, and the first fin sub-region includes at least one silicon wafer fin; the patting processing sub-module 712 is further configured to:

[0188] For a first target sub-region that is not patted in the first fin region and is adjacent to a first adjacent sub-region that has been patted, obtain the distance between the first adjacent sub-region and the first target sub-region;

[0189] Based on the distance between the first adjacent sub-region and the first target sub-region, determine a first moving speed, where the first moving speed refers to the average speed of moving to the first target sub-region;

[0190] When moving to the first target sub-region, perform a patting process on the first target sub-region using the first patting frequency;

[0191] From the first fin region, determine an un-patted first fin sub-region adjacent to the first target sub-region as a second adjacent sub-region;

[0192] Determine the second adjacent sub-region as a new first target sub-region; and, start repeating from the step of obtaining the distance between the first adjacent sub-region and the first target sub-region until the first fin region does not include the un-patted first fin sub-region.

[0193] In an exemplary embodiment, as Figure 8As shown, the region determination module 720 includes: a position determination sub-module 721 and a region determination sub-module 722.

[0194] The position determination sub-module 721 is configured to determine the positions of respective wafer warps in the case where there are wafer warps in the first warp region after the boat processing.

[0195] The position determination sub-module 721 is further configured to determine the position of an unmarked second target wafer warp as a second position based on the positions of the respective wafer warps; and mark the second target wafer warp.

[0196] The position determination sub-module 721 is further configured to determine the position of the wafer warp that is closest to the second position and unmarked as a second target position with the second position as a reference; and mark the wafer warp that is closest to the second position and unmarked.

[0197] The position determination sub-module 721 is further configured to determine the second target position as a new second position; and start repeating the step of determining the position of the wafer warp that is closest to the second position and unmarked as the second target position with the second position as a reference until the distance between the new second position and the initial second position is greater than a second threshold.

[0198] The region determination sub-module 722 is configured to determine an i-th second warp sub-region based on the final second position and the initial second position, where i is an integer greater than or equal to 1; wherein, there are n second warp sub-regions in the second warp region, and n is an integer greater than or equal to i.

[0199] In an exemplary embodiment, as Figure 8 shown, the device 700 further includes: an image acquisition module 730.

[0200] The image acquisition module 730 is configured to acquire a first graphite boat image based on the graphite boat.

[0201] The position determination sub-module 721 is further configured to determine the positions of respective wafer warps in the case where there are wafer warps in the first graphite boat image.

[0202] The position determination sub-module 721 is further configured to determine the position of an unmarked first target wafer warp as a first position based on the positions of the respective wafer warps; and mark the first target wafer warp.

[0203] The position determination sub-module 721 is further configured to determine the position of the wafer warp that is closest to the first position and unmarked as a first target position with the first position as a reference; and mark the wafer warp that is closest to the first position and unmarked.

[0204] The position determination sub-module 721 is further configured to determine the first target position as the new first position; and, starting from the step of determining, based on the first position, the position of the silicon wafer warpage that is closest to the first position and unmarked as the first target position, repeat the execution until the distance between the new first position and the initial first position is greater than the first threshold;

[0205] The area determination sub-module 722 is further configured to determine the j-th first warpage sub-area based on the final first position and the initial first position, where j is an integer greater than or equal to 1; wherein, the first warpage area includes m first warpage sub-areas, and m is an integer greater than or equal to j.

[0206] In an exemplary embodiment, as Figure 8 shown, the device 700 further includes: an image processing module 740 and a boat patting completion module 760.

[0207] The image acquisition module 730 is configured to acquire a second graphite boat image based on the first warpage area after boat patting processing.

[0208] The image processing module 740 is configured to perform image detection processing on the second graphite boat image to obtain an image processing result.

[0209] The area determination module 720 is further configured to, when the image processing result indicates that there is a silicon wafer warpage in the first warpage area after boat patting processing, execute the step of determining the second warpage area based on the first warpage area after boat patting processing.

[0210] The boat patting completion module 760 is configured to determine that the boat patting for the first warpage area is completed when the image processing result indicates that there is no silicon wafer warpage in the first warpage area after boat patting processing.

[0211] In an exemplary embodiment, as Figure 8 shown, the device 700 further includes: an information sending module 750.

[0212] The area determination module 720 is further configured to, when the total number of boat patting times for the first warpage area is less than the target value, execute the step of determining the second warpage area based on the first warpage area after boat patting processing.

[0213] The information sending module 750 is configured to send a warning message when the total number of boat patting times is greater than the target value, and the warning message is used to indicate manual intervention for the silicon wafer warpage in the first warpage area.

[0214] In summary, in the technical solution provided by the embodiments of the present application, an automated wafer tapping method for a graphite boat is provided, which does not require manual flattening of wafers, reducing the labor cost in the wafer production process; after tapping the first warped wafer area, the second warped wafer area is determined based on the first warped wafer area, and the tapping process is continued for the second warped wafer area. Multiple tapping operations improve the tapping success rate; different tapping frequencies are used for different warped wafer areas, improving the flexibility of tapping. In the specific production process, the tapping frequency can be flexibly set and adjusted according to different production rhythms. A high production rhythm corresponds to a high tapping frequency to improve the matching degree between the tapping process and the production process, and a low production rhythm corresponds to a low tapping frequency to reduce the tapping energy consumption and save resources.

[0215] In an exemplary embodiment, a computer device is further provided. The computer device includes a processor and a memory. A computer program is stored in the memory and is loaded and executed by the processor to implement the above-mentioned wafer tapping method for a graphite boat.

[0216] In an exemplary embodiment, a non-transitory computer-readable storage medium is further provided, on which a computer program is stored. When the computer program is executed by a processor, the above-mentioned wafer tapping method for a graphite boat is implemented.

[0217] In an exemplary embodiment, a computer program product is further provided. When the computer program product runs, a computer device is enabled to execute the above-mentioned wafer tapping method for a graphite boat.

[0218] The above embodiments are only used to illustrate the technical concept and characteristics of the present invention. The purpose is to enable those familiar with this technology to understand the content of the present invention and implement it accordingly, and it should not be used to limit the protection scope of the present invention. For those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or basic characteristics of the present invention. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present invention is defined by the appended claims rather than the above description. Therefore, it is intended to include all changes falling within the meaning and scope of the equivalent elements of the claims in the invention.

[0219] It should be understood that the "plurality" mentioned herein refers to two or more. "And / or" describes the association relationship of associated objects and indicates that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone. The character " / " generally represents an "or" relationship between the associated objects before and after. In addition, the step numbers described herein only exemplarily show a possible execution sequence between steps. In some other embodiments, the above steps may not be executed in the order of the numbers. For example, two steps with different numbers can be executed simultaneously, or two steps with different numbers can be executed in the reverse order of the illustration. The embodiments of the present application do not make any limitations in this regard.

[0220] The above are only exemplary embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A method for beating a silicon wafer in a graphite boat, characterized in that: The method comprises: Using a first boat beating frequency, performing a boat beating process on a first warped wafer area; wherein the first warped wafer area refers to an area including at least one warped wafer of a silicon wafer obtained based on a graphite boat, the first warped wafer area includes at least one first warped wafer sub-area, and the first warped wafer sub-area includes at least one warped wafer of a silicon wafer; Based on the first warped chip area after the boat-beating process, determining a second warped chip area; wherein the second warped chip area includes at least one silicon wafer warped chip; Performing a boat beating process on the second warp film region using a second boat beating frequency, wherein the second boat beating frequency is greater than the first boat beating frequency; The step of using the first boat-beating frequency to perform boat-beating processing on the first warping region includes: For a first unpatched target sub-region in the first warp region that is adjacent to a first adjacent sub-region that has been photographed, acquiring a distance between the first adjacent sub-region and the first target sub-region; determining a first moving speed based on a distance between the first adjacent sub-region and the first target sub-region, where the first moving speed refers to an average speed of moving to the first target sub-region; When moving to the first target sub-region, performing a boat beating process on the first target sub-region using the first boat beating frequency; From the first warping film area, determine an unpatched first warping film sub-area adjacent to the first target sub-area as a second adjacent sub-area; determining the second adjacent sub-region as a new first target sub-region; and repeating the step of obtaining the distance between the first adjacent sub-region and the first target sub-region until the first warping film region does not include the first warping film sub-region that has not been filmed.

2. The method according to claim 1, characterized in that: The step of performing a boat beating process on the second warp chip area using a second boat beating frequency includes: determining the second boat-beating frequency based on the number of warped wafers in the second warped wafer area; The second flap area is flapped using the second flap frequency.

3. The method according to claim 2, characterized in that The determining the second boat-beating frequency based on the number of wafers in the second wafer region includes: According to the corresponding relationship between the number of chip warps and the boat-beating frequency, the second boat-beating frequency is determined based on the number of chip warps in the second chip warp area; or, The second boat-beating frequency is determined based on the number of warped silicon wafers in the second warped region and the number of warped silicon wafers in the first warped region.

4. The method according to claim 2, characterized in that: The second warping region includes at least one second warping sub-region, and the second warping sub-region includes at least one silicon wafer warping; The step of performing a boat beating process on the second warp chip area using the second boat beating frequency includes: For a second target sub-region in the second warp region that is not photographed and is adjacent to a photographed third adjacent sub-region, acquiring a distance between the third adjacent sub-region and the second target sub-region; determining a second moving speed based on the distance between the third adjacent sub-region and the second target sub-region, where the second moving speed refers to an average speed of moving to the second target sub-region; When moving to the second target sub-region, performing a boat-beating process on the second target sub-region using the second boat-beating frequency; From the second warping film area, determine the unpatched second warping film sub-area adjacent to the second target sub-area as a fourth adjacent sub-area; determining the fourth adjacent sub-region as a new second target sub-region; and repeating the step of obtaining the distance between the third adjacent sub-region and the second target sub-region until the second warping film region does not include the second warping film sub-region that is not filmed.

5. The method according to claim 1, characterized in that The determining of the second warping region based on the first warping region after the boat-beating process includes: In the case where there are warped silicon wafers in the first warped wafer area after the boat beating process, determining positions of each warped silicon wafer; Based on the positions of each wafer warp, determining the position of a second target wafer warp that is not marked as a second position; and marking the second target wafer warp; Taking the second position as a reference, determining the position of the unmarked wafer warp closest to the second position as the second target position; and marking the unmarked wafer warp closest to the second position; Determine the second target position as a new second position; and repeat the step of determining the position of the unmarked wafer warp closest to the second position as the second target position based on the second position until the distance between the new second position and the initial second position is greater than a second threshold; The i-th second tilting piece sub-region is determined based on the final second position and the initial second position, where i is an integer greater than or equal to 1; wherein the second tilting piece region includes n second tilting piece sub-regions, where n is an integer greater than or equal to i.

6. The method according to claim 1, characterized in that Before the first flapping frequency is used to perform the flapping process on the first warping region, the method further includes: acquiring a first graphite boat image based on the graphite boat; In the case where there are warped silicon wafers in the first graphite boat image, determining positions of each warped silicon wafer; Based on the positions of each wafer warp, determining the position of an unmarked first target wafer warp as a first position; and marking the first target wafer warp; Taking the first position as a reference, determining the position of the unmarked wafer warp closest to the first position as a first target position; and marking the unmarked wafer warp closest to the first position; Determine the first target position as a new first position; and repeat the step of determining the position of the unmarked wafer warp closest to the first position as the first target position based on the first position until the distance between the new first position and the initial first position is greater than a first threshold; The jth first tilting piece sub-region is determined based on the final first position and the initial first position, where j is an integer greater than or equal to 1; wherein the first tilting piece region includes m first tilting piece sub-regions, where m is an integer greater than or equal to j.

7. The method according to any one of claims 1 to 6, characterized in that: Before determining the second warping region based on the first warping region after the boat-scanning process, the method further includes: Acquire a second graphite boat image based on the first warped film area after the boat-beating process; performing image detection processing on the second graphite boat image to obtain an image processing result; When the image processing result indicates that there is wafer warping in the first warping area after the boat-beating process, performing the step of determining the second warping area based on the first warping area after the boat-beating process; When the image processing result indicates that there is no wafer warpage in the first warped region after the boat-capturing process, it is determined that the boat-capturing process for the first warped region is completed.

8. The method according to claim 7, characterized in that In the case where the image processing result indicates that there is wafer warping in the first warping area after the boat processing, the method further includes: When the total number of times of boat beating for the first warping film area is less than the target value, the step of determining the second warping film area based on the first warping film area after boat beating is performed; When the total number of boat beatings is greater than the target value, an early warning message is sent, where the early warning message is used to instruct manual intervention to be performed on the wafer warping of the first wafer warping area.

9. A silicon wafer boat beating device for a graphite boat, characterized in that: The silicon wafer boat beating device of the graphite boat is used to implement the method according to any one of claims 1 to 8, and the device comprises: A boat-beating processing module, used to perform a boat-beating processing on a first warped wafer area using a first boat-beating frequency; wherein the first warped wafer area refers to an area including at least one warped silicon wafer obtained based on a graphite boat; A region determination module, configured to determine a second warping region based on the first warping region after the boat-beating process; wherein the second warping region includes at least one silicon wafer warping; The boat-beating processing module is further used to perform boat-beating processing on the second warp chip area by using a second boat-beating frequency.

10. A computer device, characterized in that: The computer device comprises a processor and a memory, wherein a computer program is stored in the memory, and the computer program is loaded and executed by the processor to implement the method according to any one of claims 1 to 8.

11. A non-transitory computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the method according to any one of claims 1 to 8 is implemented.

Images