Electronic package and fabrication method thereof

Abstract

The invention discloses an electronic package and a manufacturing method thereof. The manufacturing method comprises the following steps: arranging or heterogeneously integrating at least one first electronic component, at least one second electronic component and an optical engine module on a first circuit structure so as to be electrically connected with the first circuit structure respectively; furthermore, the first circuit structure is arranged on the bearing structure, so that the bearing structure bears the first circuit structure and the first electronic component, the second electronic component and the optical engine module on the first circuit structure, and the first electronic component, the second electronic component and the optical engine module are electrically connected to the bearing structure through the first circuit structure. Therefore, the data transmission efficiency of the electronic package can be improved, the insertion loss / power loss can be reduced, or the warping problem can be reduced.

Description

Technical Field

[0001] The present invention relates to an electronic packaging technology, and more particularly to an electronic packaging component capable of heterogeneously integrating a plurality of electronic components and a light engine module and a manufacturing method thereof. Background Art

[0002] In response to the huge demand for data transmission, silicon photonic packaging (Co-Package Optic, referred to as CPO) has become an inevitable development trend. At the same time, the general silicon photonic structure is to design the switch chip (switch die) and the optical engine (Optical Engine, referred to as OE) module in a side-by-side manner, so that the switch chip and the optical engine (OE) module are respectively arranged on the left and right sides of the upper surface of the packaging substrate.

[0003] Figure 1 FIG. 1 is a cross-sectional schematic diagram of a semiconductor package 1 of the prior art. Figure 1 As shown, the light engine module 11 of the semiconductor package 1 mainly includes a photonic chip (Photonic IC, PIC) 12 and an electronic integrated circuit (EIC) chip 13, and the conversion chip 10 and the light engine module 11 are directly arranged on the left and right sides of the upper surface of the packaging substrate 14 in a side-by-side manner, and a plurality of solder balls 15 are configured on the lower surface of the packaging substrate 14.

[0004] However, the semiconductor package 1 of the prior art can only provide the conversion chip 10 and the light engine module 11 and cannot heterogeneously integrate more electronic components, so it is difficult to improve the data transmission performance of the semiconductor package 1. Furthermore, the conversion chip 10 and the light engine module 11 of the semiconductor package 1 of the prior art are directly arranged adjacent to each other on the left and right sides of the upper surface of the package substrate 14, which will cause the package substrate 14 to have warpage and other problems such as difficulty in controlling. In addition, the spacing A between the conversion chip 10 and the light engine module 11 of the semiconductor package 1 is too large, which is easy to cause large insertion loss and power loss under high-speed computing.

[0005] Therefore, how to overcome any of the above-mentioned problems in the prior art has become a topic that needs to be solved urgently. Summary of the invention

[0006] In view of the various deficiencies of the above-mentioned prior art, the present invention provides an electronic package, comprising: a first circuit structure; at least one first electronic component, at least one second electronic component and a light engine module, all of which are arranged on or heterogeneously integrated on the first circuit structure, and the first electronic component, the second electronic component and the light engine module are electrically connected to the first circuit structure respectively; and a supporting structure, which supports the first circuit structure and the first electronic component, the second electronic component and the light engine module on the first circuit structure, and the first electronic component, the second electronic component and the light engine module are all electrically connected to the supporting structure through the first circuit structure.

[0007] The present invention also provides a method for manufacturing an electronic package, comprising: disposing or heterogeneously integrating at least one first electronic component, at least one second electronic component and a light engine module on a first circuit structure, and the first electronic component, the second electronic component and the light engine module are electrically connected to the first circuit structure respectively; and disposing the first circuit structure on a supporting structure to support the first circuit structure and the first electronic component, the second electronic component and the light engine module on the first circuit structure through the supporting structure, and the first electronic component, the second electronic component and the light engine module are electrically connected to the supporting structure through the first circuit structure.

[0008] In the aforementioned electronic package and its manufacturing method, the first circuit structure includes at least one insulating layer and at least one circuit redistribution layer disposed on the insulating layer to electrically connect the first electronic component, the second electronic component and the light engine module to the circuit redistribution layer of the first circuit structure respectively.

[0009] In the aforementioned electronic package and its manufacturing method, the first electronic component is a high-bandwidth memory chip, the second electronic component is a conversion chip or a specific application integrated circuit, and the first electronic component, the second electronic component and the light engine module are all heterogeneously integrated on the first circuit structure.

[0010] In the aforementioned electronic package and its manufacturing method, the light engine module has a photon element, and the photon element is connected to the bus bar of the optical fiber or the optical fiber cable.

[0011] In the aforementioned electronic package and its manufacturing method, the light engine module has a photon element, a control element and a second circuit structure, and the photon element is electrically connected to the control element through the second circuit structure.

[0012] In the aforementioned electronic package and its manufacturing method, the light engine module has a photon element, a second circuit structure and a plurality of conductive pillars, and the photon element is electrically connected to the first circuit structure through the second circuit structure and the plurality of conductive pillars in sequence.

[0013] In the aforementioned electronic package and its manufacturing method, the first electronic component, the second electronic component and the light engine module are all arranged on the first circuit structure in a staggered manner.

[0014] In the aforementioned electronic package and its manufacturing method, the first electronic component and the light engine module are disposed on the first circuit structure in a staggered arrangement, and the first electronic component is adjacent to the light engine module.

[0015] In the aforementioned electronic package and its manufacturing method, the second electronic component and the light engine module are arranged on the first circuit structure in a staggered arrangement, and the distance between the second electronic component and the light engine module is less than 1400 micrometers (μm).

[0016] The aforementioned electronic package and its manufacturing method also include a stepped heat sink having a first step portion and a second step portion being arranged on a supporting structure, wherein the second step portion of the stepped heat sink is higher than the first step portion, the first step portion of the stepped heat sink contacts the first electronic component and the second electronic component respectively, and the second step portion of the stepped heat sink contacts the light engine module.

[0017] As can be seen from the above, in the electronic package and its manufacturing method of the present invention, at least one first electronic component (such as a high-bandwidth memory chip), at least one second electronic component (such as a conversion chip / specific application integrated circuit) and an optical engine module (such as including photonic components and control components) are all arranged on or heterogeneously integrated on a first circuit structure, so as to greatly improve or double the data transmission efficiency of the electronic package, and also improve or increase the electrical performance of the electronic package.

[0018] At the same time, the present invention arranges or heterogeneously integrates the first electronic component, the second electronic component and the light engine module on the first circuit structure, so that the spacing between the first electronic component, the second electronic component and the light engine module is reduced. Therefore, the electronic package can reduce insertion loss and power loss during high-speed computing, and can reduce warpage problems during manufacturing.

[0019] Furthermore, the present invention can arrange the first electronic component, the second electronic component and the light engine module, or any two of them, in a staggered arrangement on the first circuit structure, which is beneficial for shortening the distance between the first electronic component, the second electronic component and the light engine module to reduce insertion loss and power loss.

[0020] In addition, the present invention makes the first step and the second step of the stepped heat sink contact the first / second electronic component and the light engine module respectively, so as to effectively dissipate the heat energy generated by the first / second electronic component and the light engine module through the stepped heat sink, and also avoid overheating of the first / second electronic component and the light engine module to improve the operating efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 The figure is a cross-sectional schematic diagram of a semiconductor package in the prior art.

[0022] FIG. 2A to FIG. 2D It is a cross-sectional schematic diagram of a method for manufacturing an electronic package of the present invention. Figure 2B 'for Figure 2B Schematic top view of .

[0023] Main component symbols

[0024] 1 Semiconductor Package

[0025] 10 Conversion Chip

[0026] 11 Light Engine Module

[0027] 12 Photonic Chip

[0028] 13 Electronic integrated circuit chips

[0029] 14 Package substrate

[0030] 15 Solder Balls

[0031] 2 Electronic packaging

[0032] 20 Bearing

[0033] 21 Release layer

[0034] 30 First Line Structure

[0035] 31,631,661 Insulation layer

[0036] 32,632 redistribution layers

[0037] 33,633 Electrical contact pads

[0038] 40 First Electronic Components

[0039] 41,51,621 Electrode pads

[0040] 42,52,622 Conductors

[0041] 50 Second electronic component

[0042] 60 Light Engine Module

[0043] 61 Photonic Components

[0044] 611 Fiber Optic

[0045] 62 Control elements

[0046] 623 Bonding layer

[0047] 624 Protective film

[0048] 63 Second Line Structure

[0049] 64,662,71 Conductive elements

[0050] 641,70,72 Primer

[0051] 65 Conductive column

[0052] 651 Coating

[0053] 66 Wiring Structure

[0054] 80 Load-bearing structure

[0055] 81 First side

[0056] 82 Second side

[0057] 83 Solder balls

[0058] 90 Stepped heat sink

[0059] 91 First Stage

[0060] 92 Second Stage

[0061] A, B spacing. DETAILED DESCRIPTION

[0062] The following describes the implementation of the present invention through specific embodiments. Those skilled in the art can easily understand other advantages and technical effects of the present invention from the contents disclosed in this specification.

[0063] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings attached to this specification are only used to match the contents disclosed in the specification for the understanding and reading of those skilled in the art, and are not used to limit the limiting conditions for the implementation of the present invention, so they have no substantial technical significance. Any modification of the structure, change in the proportional relationship, or adjustment of the size should still fall within the scope of the technical content disclosed by the present invention without affecting the technical effects and purposes that can be achieved by the present invention. At the same time, the terms such as "upper", "lower", "one", "two", "first", "second", "third", etc. cited in this specification are only for the convenience of description, and are not used to limit the scope of the implementation of the present invention. The change or adjustment of their relative relationship should also be regarded as the scope of the implementation of the present invention without substantially changing the technical content.

[0064] FIG. 2A to FIG. 2D is a cross-sectional schematic diagram of a method for manufacturing an electronic package 2 of the present invention, Figure 2B 'for Figure 2BMeanwhile, the term "at least one" in the present invention means more than one (such as one, two or three), and "plurality" means more than two (such as two, three, four or ten or more).

[0065] like Figure 2A As shown, a first circuit structure 30 is first formed on a carrier 20 .

[0066] In one embodiment, the carrier 20 may be a plate made of semiconductor material (such as silicon or glass), and a release layer 21 is formed on the carrier 20 by coating, so that the first circuit structure 30 is disposed on the release layer 21 of the carrier 20 .

[0067] In one embodiment, the first circuit structure 30 includes a plurality of insulating layers 31 and a plurality of redistribution layers (RDL) 32 disposed on the plurality of insulating layers 31, and a portion of the outermost (such as the topmost) redistribution layer 32 is exposed to serve as an electrical contact pad 33. Alternatively, the first circuit structure 30 may also include only a single insulating layer 31 and a single redistribution layer 32 disposed on the single insulating layer 31. That is, the first circuit structure 30 may include at least one (such as multiple) insulating layers 31 and at least one (such as multiple) redistribution layers 32 disposed on the insulating layer 31, and the redistribution layer 32 of the first circuit structure 30 may be, for example, a fan-out type redistribution layer.

[0068] In one embodiment, the material of the insulating layer 31 is a dielectric material such as polybenzoxazole (PBO), polyimide (PI), prepreg (PP), or a solder mask such as green paint or ink, and the material of the circuit redistribution layer 32 is copper, but is not limited thereto.

[0069] like Figure 2B As shown, at least one (such as multiple) first electronic component 40, at least one (such as multiple) second electronic component 50 and a light engine module 60 are all arranged on or heterogeneously integrated on the first circuit structure 30, and the first electronic component 40, the second electronic component 50 and the light engine module 60 are respectively electrically connected to the circuit redistribution layer 32 of the first circuit structure 30.

[0070] In one embodiment, the first electronic component 40 may be, for example, a first chip or a high bandwidth memory (HBM) chip, and the second electronic component 50 may be, for example, a second chip, a switch die, or an application specific integrated circuit (ASIC), but is not limited thereto. In other embodiments, the first electronic component 40 and the second electronic component 50 may also be other functional chips.

[0071] In one embodiment, the first electronic component 40 may have a plurality of electrode pads 41, and the second electronic component 50 may have a plurality of electrode pads 51, so that the plurality of electrode pads 41 of the first electronic component 40 may be electrically connected to the circuit redistribution layer 32 of the first circuit structure 30 in a flip-chip manner through a plurality of conductors 42, and the plurality of electrode pads 51 of the second electronic component 50 may be electrically connected to the circuit redistribution layer 32 of the first circuit structure 30 in a flip-chip manner through a plurality of conductors 52. Alternatively, the plurality of electrode pads 41 of the first electronic component 40 may be electrically connected to the circuit redistribution layer 32 of the first circuit structure 30 in a wire bonding manner through a plurality of wires (not shown), and the plurality of electrode pads 51 of the second electronic component 50 may be electrically connected to the circuit redistribution layer 32 of the first circuit structure 30 in a wire bonding manner through a plurality of wires (not shown). There are many ways for the first electronic component 40 or the second electronic component 50 to be electrically connected to the circuit redistribution layer 32 of the first circuit structure 30, which are not limited to the above.

[0072] In one embodiment, the conductor 42 or the conductor 52 is a spherical shape such as a conductive line, a solder ball, or a columnar shape of a metal material such as a copper column, a conductive bump, a solder bump, or a stud conductive member made by a wire bonding machine, but is not limited thereto.

[0073] In one embodiment, the light engine module 60 may have a photon element 61 (or optoelectronic element), a control element 62, and a second circuit structure 63, so as to electrically connect the photon element 61 to the control element 62 through the second circuit structure 63. For example, the photon element 61 may be a photon chip (PIC or optoelectronic chip), etc., and the control element 62 may be a control chip or an electronic integrated circuit (EIC) chip, etc.

[0074] In one embodiment, the photonic element 61 of the optical engine module 60 may be connected to the optical fiber 611 or the bus of the optical fiber cable, so that the photonic element 61 can quickly transmit the optical signal through the optical fiber 611 or the bus of the optical fiber cable.

[0075] In one embodiment, the control element 62 of the light engine module 60 may have a plurality of electrode pads 621, so the plurality of electrode pads 621 of the control element 62 may be electrically connected to the circuit redistribution layer 632 of the second circuit structure 63 through a plurality of conductors 622. For example, the conductor 622 may be a conductive circuit, a spherical solder ball, or a columnar metal material such as a copper column, a conductive bump, a solder bump, or a stud conductive member made by a wire bonding machine, but is not limited thereto.

[0076] In one embodiment, the control element 62 of the light engine module 60 may have an active surface and an inactive surface opposite to each other. The control element 62 is bonded or adhered to the wiring structure 66 via a bonding layer 623 at its inactive surface, and the plurality of electrode pads 621 on the active surface of the control element 62 are covered with a protective film 624 such as a passivation material, and the plurality of conductors 622 are disposed in the protective film 624.

[0077] In one embodiment, the second circuit structure 63 of the light engine module 60 includes a plurality of insulating layers 631 and a plurality of circuit redistribution layers 632 disposed on the plurality of insulating layers 631, the outermost (such as the topmost) insulating layer 631 can be used as a solder mask, and a portion of the outermost (such as the topmost) circuit redistribution layer 632 is exposed from the solder mask to serve as an electrical contact pad 633. Alternatively, the second circuit structure 63 may also include only a single insulating layer 631 and a single circuit redistribution layer 632. That is, the second circuit structure 63 may include at least one (such as multiple) insulating layers 631 and at least one (such as multiple) circuit redistribution layers 632, and the circuit redistribution layer 632 may be, for example, a fan-out type circuit redistribution layer.

[0078] In one embodiment, the material of the insulating layer 631 is a dielectric material such as poly(p-oxadiazole) (PBO), polyimide (PI), prepreg material (PP), or a solder mask material such as green paint or ink, and the material of the circuit redistribution layer 632 is copper, but is not limited thereto.

[0079] In one embodiment, the light engine module 60 may have a plurality of conductive elements 64 and a primer 641, so as to electrically connect the photon element 61 to the plurality of electrical contact pads 633 of the second circuit structure 63 through the plurality of conductive elements 64, and then the primer 641 is formed between the photon element 61 and the second circuit structure 63 to cover the plurality of conductive elements 64. For example, the conductive element 64 may be a copper pillar or a solder ball.

[0080] In one embodiment, the light engine module 60 may have a plurality of conductive posts 65, a coating layer 651, a wiring structure 66, and an insulating layer 661, so that the wiring redistribution layer 632 of the second wiring structure 63 and the wiring structure 66 are electrically connected through the plurality of conductive posts 65, and the plurality of conductive posts 65 and the control element 62 are coated by the coating layer 651. Meanwhile, the coating layer 651 may have an upper surface and a lower surface opposite to each other, so that the coating layer 651 is bonded to the insulating layer 661 with its lower surface, and the upper end surfaces of the plurality of conductive posts 65 and the plurality of conductors 622 are exposed on the upper surface of the coating layer 651.

[0081] In one embodiment, the conductive pillar 65 is made of a copper metal material or a solder material, the coating layer 651 is an insulating material, such as polyimide (PI), dry film, or a packaging colloid or molding compound such as epoxy, and the insulating layer 661 is made of a dielectric material such as poly(p-oxadiazole benzene) (PBO), polyimide (PI), prepreg material (PP), or a solder mask such as green paint or ink. For example, the coating layer 651 can be formed on the insulating layer 661 by a process such as liquid compound, injection, lamination, or compression molding.

[0082] In one embodiment, a flattening process may be performed to make the upper end surface of the conductor 622, the upper surface of the protection film 624, the upper end surface of the conductive pillar 65, and the upper surface of the coating layer 651 all flush or coplanar, so that the upper end surface of the conductor 622 and the upper end surface of the conductive pillar 65 are respectively exposed on the upper surface of the protection film 624 and the upper surface of the coating layer 651. For example, a part of the material of the conductor 622, the part of the material of the protection film 624, the part of the material of the conductive pillar 65, and the part of the material of the coating layer 651 are removed by a flattening process (such as a grinding method). In addition, the lower end surface of the conductive pillar 65 and the lower surface of the coating layer 651 may also be flush or coplanar.

[0083] However, in other embodiments, the upper end surface of the conductor 622, the upper surface of the protective film 624, the upper end surface of the conductive column 65 and the upper surface of the coating layer 651 may also be non-flush or non-coplanar, and the lower end surface of the conductive column 65 and the lower surface of the coating layer 651 may also be non-flush or non-coplanar.

[0084] In one embodiment, the light engine module 60 may have a plurality of conductive elements 662 to electrically connect the photon element 61 to the redistribution layer 32 of the first circuit structure 30 in sequence through a plurality of conductive elements 64, a second circuit structure 63, a plurality of conductive pillars 65, a wiring structure 66, and a plurality of conductive elements 662. For example, the conductive element 662 may be a copper pillar or a solder ball.

[0085] Then, a base glue 70 is formed on the first circuit structure 30, between the first circuit structure 30 and the first electronic component 40, between the first circuit structure 30 and the second electronic component 50, and between the first circuit structure 30 and the light engine module 60, so as to cover multiple conductors 42, multiple conductors 52 and multiple conductive elements 662 of the light engine module 60 through the base glue 70.

[0086] like Figure 2B 'As shown, the first electronic component 40, the second electronic component 50 and the light engine module 60, or any two of them, are arranged on the first circuit structure 30 in a staggered arrangement, and the spacing B between the second electronic component 50 and the light engine module 60 is less than 1400 microns (μm) to reduce insertion loss and power loss.

[0087] In one embodiment, the first electronic component 40 (such as a first chip / high bandwidth memory chip) and the second electronic component 50 (such as a second chip / conversion chip / application-specific integrated circuit) are arranged on the first circuit structure 30 in a staggered arrangement, and the first electronic component 40 is adjacent to the second electronic component 50. Alternatively, the first electronic component 40 and the light engine module 60 are arranged on the first circuit structure 30 in a staggered arrangement, and the first electronic component 40 is adjacent to the light engine module 60. Alternatively, the second electronic component 50 and the light engine module 60 are arranged on the first circuit structure 30 in a staggered arrangement, and the second electronic component 50 is adjacent to the light engine module 60. Therefore, the present invention can shorten the spacing between the first electronic component 40, the second electronic component 50 and the light engine module 60 to reduce insertion loss and power loss.

[0088] In other words, the first electronic component 40, the second electronic component 50 and the light engine module 60, or any two of them, can be arranged on the first circuit structure 30 in a staggered arrangement, so as to shorten the distance between the first electronic component 40, the second electronic component 50 and the light engine module 60 and reduce insertion loss and power loss. For example, the first electronic component 40, the second electronic component 50 and the light engine module 60 are not arranged in a straight line, the first electronic component 40 is not arranged between the second electronic component 50 and the light engine module 60, and the second electronic component 50 is not arranged between the first electronic component 40 and the light engine module 60.

[0089] like Figure 2C As shown, remove Figure 2B The carrier 20 and the release layer 21 thereon expose the first circuit structure 30, and then a plurality of conductive elements 71 are combined with the first circuit structure 30. For example, the conductive elements 71 may be copper pillars or solder balls.

[0090] like Figure 2D As shown, the first circuit structure 30 can be arranged on a supporting structure 80 to support the first circuit structure 30 and the first electronic component 40, the second electronic component 50 and the light engine module 60 on the first circuit structure 30 through the supporting structure 80, and the first electronic component 40, the second electronic component 50 and the light engine module 60 can all be electrically connected to the supporting structure 80 through the first circuit structure 30 and multiple conductive elements 71 to obtain the electronic package 2 of the present invention.

[0091] In one embodiment, the first electronic component 40 can be electrically connected to the supporting structure 80 in sequence through multiple conductors 42, the circuit redistribution layer 32 of the first circuit structure 30 and multiple conductive elements 71, the second electronic component 50 can be electrically connected to the supporting structure 80 in sequence through multiple conductors 52, the circuit redistribution layer 32 of the first circuit structure 30 and multiple conductive elements 71, and the light engine module 60 can be electrically connected to the supporting structure 80 in sequence through the circuit redistribution layer 32 of the first circuit structure 30 and multiple conductive elements 71.

[0092] In one embodiment, the supporting structure 80 may be in the form of a substrate and have a first side 81 and a second side 82 opposite to each other, so that the first circuit structure 30 is disposed on the first side 81 of the supporting structure 80. For example, the supporting structure 80 is a package substrate having a core layer and a circuit structure, or a coreless circuit structure, wherein the circuit structure includes at least one insulating layer and at least one circuit layer combined with the insulating layer, and the circuit layer may be a fan-out type redistribution layer (RDL). It should be understood that the supporting structure 80 may also be other plates, such as a lead frame, a wafer, or other carriers with metal routing, etc., and is not limited to the above.

[0093] In one embodiment, a plurality of solder balls 83 may be disposed on the second side 82 of the supporting structure 80 , so that the supporting structure 80 can be connected to an electronic device (not shown) such as a circuit board through the plurality of solder balls 83 .

[0094] Next, a primer 72 is formed between the first circuit structure 30 (insulating layer 31 ) and the first side 81 of the supporting structure 80 , so as to cover the plurality of conductive elements 71 with the primer 72 .

[0095] Then, a stepped heat sink 90 having a first step portion 91 and a second step portion 92 can be disposed on the first side 81 of the supporting structure 80, wherein the second step portion 92 of the stepped heat sink 90 is higher than the first step portion 91, and the stepped heat sink 90 can contact the surfaces of the first electronic component 40, the second electronic component 50 and the light engine module 60 (such as all or part of the upper surfaces of the three).

[0096] In one embodiment, the first step 91 of the stepped heat sink 90 can contact the surfaces (such as the upper surface or the inactive surface) of the first electronic component 40 and the second electronic component 50 respectively, and the second step 92 of the stepped heat sink 90 can contact the surface (such as the upper surface) of the light engine module 60 (photonic component 61), so as to effectively dissipate the heat energy generated by the electronic package 2, the first electronic component 40, the second electronic component 50 and the light engine module 60 through the stepped heat sink 90, and also avoid overheating of the electronic package 2, the first electronic component 40, the second electronic component 50 and the light engine module 60 to improve the operating efficiency.

[0097] In addition, in other manufacturing method embodiments, the first circuit structure 30 can be first disposed on the supporting structure 80, and then the first electronic component 40, the second electronic component 50 and the light engine module 60 can be all disposed on the first circuit structure 30, so that the first circuit structure 30 and the first electronic component 40, the second electronic component 50 and the light engine module 60 on the first circuit structure 30 can be supported by the supporting structure 80, so that the first electronic component 40, the second electronic component 50 and the light engine module 60 can all be electrically connected to the supporting structure 80 through the first circuit structure 30 and multiple conductive elements 71.

[0098] The present invention also provides an electronic package 2, including: a first circuit structure 30; at least one first electronic component 40, at least one second electronic component 50 and a light engine module 60, all of which are arranged on or heterogeneously integrated on the first circuit structure 30, and the first electronic component 40, the second electronic component 50 and the light engine module 60 are electrically connected to the first circuit structure 30 respectively; and a supporting structure 80, supporting the first circuit structure 30 and the first electronic component 40, the second electronic component 50 and the light engine module 60 on the first circuit structure 30, and the first electronic component 40, the second electronic component 50 and the light engine module 60 are all electrically connected to the supporting structure 80 through the first circuit structure 30.

[0099] In one embodiment, the first circuit structure 30 may include at least one insulating layer 30 and at least one circuit redistribution layer 32 disposed on the insulating layer 30, and the first electronic component 40, the second electronic component 50 and the light engine module 60 are respectively electrically connected to the circuit redistribution layer 32 of the first circuit structure 30.

[0100] In one embodiment, the first electronic component 40 may be a high-bandwidth memory chip, the second electronic component 50 may be a conversion chip or an application-specific integrated circuit, and the first electronic component 40 , the second electronic component 50 and the light engine module 60 are all integrated on the first circuit structure 30 .

[0101] In one embodiment, the light engine module 60 may have a photonic element 61 , and the photonic element 61 is connected to an optical fiber 611 or a bus bar of an optical fiber cable.

[0102] In one embodiment, the light engine module 60 may include a photon element 61 , a control element 62 , and a second circuit structure 63 , and the photon element 61 is electrically connected to the control element 62 through the second circuit structure 63 .

[0103] In one embodiment, the light engine module 60 may include a photon element 61 , a second circuit structure 63 and a plurality of conductive pillars 65 , and the photon element 61 is electrically connected to the first circuit structure 30 via the second circuit structure 63 and the plurality of conductive pillars 65 in sequence.

[0104] In one embodiment, the first electronic component 40 , the second electronic component 50 and the light engine module 60 are all disposed on the first circuit structure 30 in a staggered arrangement.

[0105] In one embodiment, the first electronic component 40 and the light engine module 60 are disposed on the first circuit structure 30 in a staggered arrangement, and the first electronic component 40 is adjacent to the light engine module 60 .

[0106] In one embodiment, the second electronic component 50 and the light engine module 60 are disposed on the first circuit structure 30 in a staggered arrangement, and a spacing B between the second electronic component 50 and the light engine module 60 is less than 1400 micrometers (μm).

[0107] In one embodiment, the electronic package 2 may include a stepped heat sink 90 having a first step portion 91 and a second step portion 92, which is disposed on a supporting structure 80, wherein the second step portion 92 of the stepped heat sink 90 is higher than the first step portion 91, the first step portion 91 of the stepped heat sink 90 contacts the first electronic component 40 and the second electronic component 50 respectively, and the second step portion 92 of the stepped heat sink 90 contacts the light engine module 60.

[0108] In summary, the electronic package and the method for manufacturing the same of the present invention have at least the following features, advantages or technical effects.

[0109] 1. Since silicon photonic packaging (CPO) is the main technology for the next generation of data centers and high-speed computing applications, it is a necessary trend to integrate the packaging type of the first electronic component (such as a high-bandwidth memory chip), the second electronic component (such as a conversion chip) and the optical engine module. Therefore, the present invention makes good use of, for example, the fan-out multi-chip module (Fan-Out Multi-Chip-Module, referred to as FO-MCM) technology to electrically connect the first circuit structure to the first electronic component (such as a high-bandwidth memory chip), the second electronic component (such as a conversion chip) and the optical engine module, so as to use a flexible architecture and lower cost to meet various silicon photonic terminal applications.

[0110] Second, the present invention uses a fan-out multi-chip module (FO-MCM) as an architecture, and makes good use of the concept of integrating a first electronic component (such as a high-bandwidth memory chip), a second electronic component (such as a conversion chip) and an optical engine module into a chip module, so that the electronic package can significantly reduce insertion loss and power loss, and also has the advantage of meeting all silicon photonic terminal applications.

[0111] 3. The present invention can place at least one first electronic component (such as a high-bandwidth memory chip), at least one second electronic component (such as a conversion chip / specific application integrated circuit) and an optical engine module (such as including photonic components and control components) on a first circuit structure, so as to greatly improve or double the data transmission efficiency of the electronic package, and also improve or increase the electrical performance of the electronic package.

[0112] Fourth, the present invention arranges the first electronic component, the second electronic component and the light engine module on the first circuit structure, so that the spacing between the first electronic component, the second electronic component and the light engine module is reduced. Therefore, the electronic package can reduce insertion loss and power loss during high-speed computing, and can reduce warpage problems during manufacturing.

[0113] 5. The semiconductor package of the prior art directly arranges the conversion chip and the light engine module on the left and right sides of the package substrate in a side-by-side manner, which leads to the problem of difficult warpage control. In contrast, the electronic package of the present invention arranges the first electronic component, the second electronic component and the light engine module on the first circuit structure, and further arranges them on the bearing structure (such as the package substrate), which is conducive to improving the problem of difficult warpage control in the prior art.

[0114] 6. The present invention can arrange the first electronic component, the second electronic component and the light engine module, or any two of them, in a staggered arrangement on the first circuit structure, so as to shorten the distance between the first electronic component, the second electronic component and the light engine module, thereby reducing insertion loss and power loss.

[0115] 7. The present invention can arrange the first electronic component, the second electronic component and the light engine module, or any two of them, on the first circuit structure in a staggered arrangement, and the spacing between the second electronic component and the light engine module can be less than 1400 micrometers (μm) to reduce insertion loss and power loss.

[0116] 8. The photonic components of the optical engine module of the present invention can be connected to the bus of optical fibers or optical fiber cables, so that the photonic components can quickly transmit optical signals through the bus of optical fibers or optical fiber cables.

[0117] 9. The present invention can make the first step and the second step of the stepped heat sink contact the first / second electronic component and the light engine module respectively, so as to effectively dissipate the heat energy generated by the first / second electronic component and the light engine module through the stepped heat sink, and can also prevent the first / second electronic component and the light engine module from overheating to improve the operating efficiency.

[0118] The above embodiments are only used to illustrate the principles and technical effects of the present invention, and are not used to limit the present invention. Any person skilled in the art may modify the above embodiments without violating the inventive concept and scope of the present invention. Therefore, the scope of protection of the present invention should be as listed in the claims.

Claims

1. An electronic package, comprising: a first circuit structure; A first electronic component, a second electronic component and a light engine module are all disposed on the first circuit structure, and the first electronic component, the second electronic component and the light engine module are electrically connected to the first circuit structure respectively; as well as A supporting structure supports the first circuit structure and the first electronic component, the second electronic component and the light engine module on the first circuit structure, and the first electronic component, the second electronic component and the light engine module are all electrically connected to the supporting structure through the first circuit structure.

2. The electronic package according to claim 1, wherein: The first circuit structure includes an insulating layer and a circuit redistribution layer disposed on the insulating layer, and the first electronic component, the second electronic component and the light engine module are electrically connected to the circuit redistribution layer of the first circuit structure respectively.

3. The electronic package of claim 1, wherein: The first electronic component is a high-bandwidth memory chip, the second electronic component is a conversion chip or a specific application integrated circuit, and the first electronic component, the second electronic component and the light engine module are all heterogeneously integrated on the first circuit structure.

4. The electronic package of claim 1, wherein: The optical engine module has a photon element, and the photon element is connected to a bus bar of an optical fiber or an optical fiber cable.

5. The electronic package of claim 1, wherein: The light engine module has a photon element, a control element and a second circuit structure, and the photon element is electrically connected to the control element through the second circuit structure.

6. The electronic package of claim 1, wherein: The light engine module has a photon element, a second circuit structure and a plurality of conductive pillars, and the photon element is electrically connected to the first circuit structure through the second circuit structure and the plurality of conductive pillars in sequence.

7. The electronic package of claim 1, wherein: The first electronic element, the second electronic element and the light engine module are all arranged on the first circuit structure in a staggered arrangement.

8. The electronic package of claim 1, wherein: The first electronic component and the light engine module are arranged on the first circuit structure in a staggered arrangement, and the first electronic component is adjacent to the light engine module.

9. The electronic package of claim 1, wherein: The second electronic component and the light engine module are arranged on the first circuit structure in a staggered arrangement, and the distance between the second electronic component and the light engine module is less than 1400 micrometers.

10. The electronic package of claim 1, wherein: The electronic package also includes a stepped heat sink having a first step and a second step, which is disposed on the supporting structure, wherein the second step of the stepped heat sink is higher than the first step, the first step of the stepped heat sink contacts the first electronic component and the second electronic component respectively, and the second step of the stepped heat sink contacts the light engine module.

11. A method for manufacturing an electronic package, comprising: The first electronic component, the second electronic component and a light engine module are all disposed on a first circuit structure, and the first electronic component, the second electronic component and the light engine module are electrically connected to the first circuit structure respectively; as well as The first circuit structure is disposed on a supporting structure so as to support the first circuit structure and the first electronic component, the second electronic component and the light engine module on the first circuit structure through the supporting structure, and the first electronic component, the second electronic component and the light engine module are all electrically connected to the supporting structure through the first circuit structure.

12. The method for manufacturing an electronic package according to claim 11, wherein: The first circuit structure includes an insulating layer and a circuit redistribution layer disposed on the insulating layer, and the first electronic component, the second electronic component and the light engine module are electrically connected to the circuit redistribution layer of the first circuit structure respectively.

13. The method for manufacturing an electronic package according to claim 11, wherein: The first electronic component is a high-bandwidth memory chip, the second electronic component is a conversion chip or a specific application integrated circuit, and the first electronic component, the second electronic component and the light engine module are all heterogeneously integrated on the first circuit structure.

14. The method for manufacturing an electronic package according to claim 11, wherein: The optical engine module has a photon element, and the photon element is connected to a bus bar of an optical fiber or an optical fiber cable.

15. The method for manufacturing an electronic package according to claim 11, wherein: The light engine module has a photon element, a control element and a second circuit structure, and the photon element is electrically connected to the control element through the second circuit structure.

16. The method for manufacturing an electronic package according to claim 11, wherein: The light engine module has a photon element, a second circuit structure and a plurality of conductive pillars, and the photon element is electrically connected to the first circuit structure through the second circuit structure and the plurality of conductive pillars in sequence.

17. The method for manufacturing an electronic package according to claim 11, wherein: The first electronic element, the second electronic element and the light engine module are all arranged on the first circuit structure in a staggered arrangement.

18. The method for manufacturing an electronic package according to claim 11, wherein: The first electronic component and the light engine module are arranged on the first circuit structure in a staggered arrangement, and the first electronic component is adjacent to the light engine module.

19. The method for manufacturing an electronic package according to claim 11, wherein: The second electronic component and the light engine module are arranged on the first circuit structure in a staggered arrangement, and the distance between the second electronic component and the light engine module is less than 1400 micrometers.

20. The method for manufacturing an electronic package according to claim 11, wherein: The manufacturing method also includes disposing a stepped heat sink having a first step and a second step on the supporting structure, wherein the second step of the stepped heat sink is higher than the first step, the first step of the stepped heat sink contacts the first electronic component and the second electronic component respectively, and the second step of the stepped heat sink contacts the light engine module.

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