Circuit board, preparation method thereof and electronic equipment

Abstract

The embodiment of the invention provides a circuit board, a preparation method thereof and electronic equipment, the circuit board is applied to the electronic equipment, the circuit board comprises a core board and a cable, and the core board is provided with a wiring groove along the thickness direction; the cable comprises a first section and a second section, the first section is connected with the second section, the first section is limited in the wiring groove, and the end, away from the second section, of the first section is used for being electrically connected with a first electronic component of the electronic equipment. And the second section is used for being electrically connected with a second electronic component of the electronic equipment. According to the technical scheme of the embodiment of the invention, the loss of the signal in the transmission process can be reduced, so that the transmission quality of the high-speed signal is ensured.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of circuit boards, and in particular to a circuit board and a method for preparing the same, and an electronic device. Background Art

[0002] With the rise of big data, cloud computing and artificial intelligence (AI), the computing requirements of electronic devices are getting higher and higher. The signal transmission rate between electronic devices and other components is also getting higher and higher. How to ensure the quality of signal transmission while transmitting signals at high speed so that the signal loss meets the application conditions is a problem that needs to be solved urgently. Summary of the invention

[0003] The embodiments of the present application provide a circuit board and a method for manufacturing the same, and an electronic device, which can reduce signal loss during transmission, thereby ensuring the transmission quality of high-speed signals.

[0004] In a first aspect, an embodiment of the present application provides a circuit board, which is applied to an electronic device, including:

[0005] A core plate, wherein the core plate is provided with wiring grooves along the thickness direction thereof; and

[0006] A cable, the cable comprising a first section and a second section, the first section being connected to the second section, the first section being confined within the wiring groove, the end of the first section away from the second section being used for electrically connecting to a first electronic component of the electronic device, and the second section being used for electrically connecting to a second electronic component of the electronic device.

[0007] It can be understood that the core board of the circuit board provided in the embodiment of the present application is provided with a wiring groove and the cable is at least partially confined in the wiring groove, and the cable is electrically connected to the first electronic component and the second electronic component respectively, so that the high-speed signal between the first electronic component and the second electronic component can be transmitted through the cable, reducing the signal loss during the transmission process, and thereby improving the transmission quality of the high-speed signal.

[0008] In addition, the present application directly installs the cable into the wiring slot, avoiding the need to connect the cable to the circuit board through a connector, reducing the loss of the high-speed signal transmission process at the connection between the cable and the connector, thereby ensuring the accuracy and stability of the high-speed signal during the transmission process, so that the high-speed signal can meet the working requirements of the electronic equipment.

[0009] In a possible implementation manner, the circuit board further includes a first pressing plate and a second pressing plate, and the first pressing plate and the second pressing plate are respectively arranged on opposite sides of the core board in a thickness direction.

[0010] It can be understood that the first pressing plate and the second pressing plate can enhance the overall structural stability of the circuit board and improve the structural strength of the circuit board.

[0011] In a possible implementation, the second section is located outside the wiring groove, a cable opening is provided on a side of the core board, the wiring groove is communicated with the cable opening, and the second section extends out of the core board through the cable opening.

[0012] It can be understood that the core plate has two opposite side surfaces in a direction perpendicular to its thickness direction, and the cable opening can be opened on any one of the two opposite side surfaces.

[0013] It is understandable that the second section of the cable can be connected to a second electronic component in the electronic device that needs to be electrically connected.

[0014] In a possible implementation manner, the circuit board includes a first circuit board and a second circuit board, the first circuit board is provided with a first wiring groove, the first circuit board is used to provide an installation position for the first electronic component, the second circuit board is provided with a second wiring groove, the second circuit board is used to provide an installation position for the second electronic component;

[0015] The cable further includes a third section, wherein the first section, the third section and the second section are connected in sequence;

[0016] The first section is located in the first wiring groove, and the end of the first section away from the third section is used to be electrically connected to the first electronic component. The second section is located in the second wiring groove, and the end of the second section away from the third section is used to be electrically connected to the second electronic component connected to the second circuit board. The third section is located outside the wiring groove, and the third section is connected between the first circuit board and the second circuit board.

[0017] It is understandable that, since the cable is a flexible structure, the third section can be bent and deformed, so that the relative position of the first circuit board and the second circuit board can be changed. When the installation space in the box is small, the third section can be bent so that the first circuit board can be stacked with the second circuit board or the first circuit board can be tilted relative to the second circuit board, so that the circuit boards can adapt to different installation spaces.

[0018] In addition, since the first circuit board and the second circuit board are hard boards, the first circuit board and the second circuit board can provide installation space for other components of the electronic device. For example, when the circuit board is used as the main board of the server, the main board has the function of electrically connecting electronic components and supporting, and each electronic component in the electronic device is connected to the main board, and various electronic signals are transmitted through the main board to achieve communication connection. The main board can be equipped with a circuit system. The circuit system includes one or more components such as a BIOS chip, an I / O control first chip, a keyboard and panel control switch interface, an indicator light connector, an expansion slot, a main board and a DC power supply connector for a plug-in card. The main board can control the system memory, storage devices and other I / O devices through the circuit system.

[0019] In a possible implementation manner, the wiring groove penetrates the core board along the thickness direction of the core board.

[0020] It is understandable that the wiring grooves that penetrate the core board are easy to process, and the width of the wiring grooves only needs to be set according to the diameter of the cable. Simplifying the processing of the wiring grooves can improve the yield rate of the core board, thereby reducing the number of defective circuit boards and rework costs.

[0021] In a possible implementation manner, the cross-sectional shape of the wiring groove is semicircular, and the cross-sectional shape of the cable located in the wiring groove is elliptical;

[0022] Alternatively, the cross-sectional shape of the wiring groove is triangular, and the cross-sectional shape of the cable located in the wiring groove is circular;

[0023] Alternatively, the cross-sectional shape of the wiring groove is sawtooth, and the cross-sectional shape of the cable in the wiring groove is rectangular.

[0024] It can be understood that the cross-sectional shape of the wiring groove is the cross-sectional shape of the wiring groove in the thickness direction of the core plate. In addition, the wiring groove is formed by any surface depression of the core plate along the thickness direction.

[0025] In a possible embodiment, the circuit board also includes a first conductive hole, which passes through the first pressure plate, the core plate and the second pressure plate along the thickness direction of the circuit board, the first pressure plate includes a first insulating layer and a first conductive layer, the first conductive layer, the first insulating layer and the core plate are stacked in sequence, the first conductive layer is provided with a first conductive structure, the first conductive structure is used to be electrically connected to the second electronic component, and the first conductive structure is electrically connected to the end of the second segment away from the first segment through the first conductive hole.

[0026] It can be understood that, since the core board has a conductive structure and the first insulating layer is located between the core board and the first conductive layer, a short circuit between the conductive structure of the core board and the first conductive structure of the first conductive layer can be avoided.

[0027] In a possible embodiment, the circuit board also includes a second conductive hole, which passes through the first pressure plate, the core plate and the second pressure plate along the thickness direction of the circuit board, the second pressure plate includes a second insulating layer and a second conductive layer, the second insulating layer is located on the side of the core plate away from the first insulating layer, the second conductive layer is located on the side of the second insulating layer away from the core plate, the second conductive layer is provided with a second conductive structure, the second conductive structure is used to be electrically connected to the first electronic component, and the second conductive structure is electrically connected to the end of the first segment away from the second segment through the second conductive hole.

[0028] It can be understood that, since the core board has a conductive structure, the second insulating layer is located between the core board and the second conductive layer, which can avoid a short circuit between the conductive structure of the core board and the second conductive structure of the second conductive layer.

[0029] In a possible implementation, the cable includes two signal wires, the two signal wires include a protective layer and an inner core, the protective layer is coated on the outer circumference of the inner core, and the material of the inner core of the signal wire includes silver-plated copper wire.

[0030] It is understandable that silver-plated copper wire has better signal transmission effect and can reduce signal transmission loss.

[0031] In a second aspect, an embodiment of the present application further provides an electronic device, comprising a first electronic component and the circuit board as described above, wherein the first electronic component is arranged on the circuit board.

[0032] In a possible implementation, the electronic device further includes the second electronic component, which is connected to the core board, the first section and the second section are both located in the wiring groove, the end of the first section away from the second section is electrically connected to the first electronic component, and the end of the second section away from the first section is electrically connected to the second electronic component.

[0033] It is understandable that the cable can also connect the first electronic component transmitting high-speed signals on the circuit board to the electronic components.

[0034] In a third aspect, an embodiment of the present application further provides a method for preparing a circuit board, the method comprising:

[0035] Provide core board;

[0036] forming a wiring groove on the core board;

[0037] Laying the cable along the extension direction of the wiring trough to form a core structure, the cable comprising a first section and a second section, the first section being connected to the second section, and the first section being confined within the wiring trough; and

[0038] The core layer structure is pressed together to form the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the implementation will be briefly introduced below. Obviously, the drawings described below are only some implementation methods of the present application. For ordinary technicians in this field, other drawings can be obtained like these drawings without paying creative work.

[0040] Figure 1 is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application;

[0041] Figure 2 is a cross-sectional schematic diagram of a circuit board and a first electronic component provided in an embodiment of the present application;

[0042] Figure 3 yes Figure 2 A schematic diagram of a structure of the cable shown;

[0043] Figure 4 yes Figure 2 Another structural schematic diagram of the cable shown;

[0044] Figure 5 is another cross-sectional schematic diagram of a circuit board and a first electronic component provided in an embodiment of the present application;

[0045] Figure 6 yes Figure 5 A schematic diagram of a portion of the structure of the circuit board shown;

[0046] Figure 7 is another cross-sectional schematic diagram of the circuit board and the first electronic component provided in the embodiment of the present application;

[0047] Figure 8 is a cross-sectional schematic diagram of an implementation method of a circuit board and a first electronic component provided in an embodiment of the present application;

[0048] Fig. 9 is a cross-sectional schematic diagram of another implementation of the circuit board, the first electronic component, and the second electronic component provided in an embodiment of the present application;

[0049] Fig.10is a cross-sectional schematic diagram of another implementation of the circuit board, the first electronic component, and the second electronic component provided in the embodiment of the present application;

[0050] Fig.11 It is a schematic diagram of a process of manufacturing a circuit board provided in an embodiment of the present application;

[0051] Fig.12 It is a cross-sectional schematic diagram of a core board formed after S100 in the method for preparing a circuit board;

[0052] Fig.13 It is a cross-sectional schematic diagram of a core board formed after S200 in the method for preparing a circuit board;

[0053] Fig.14 It is a cross-sectional schematic diagram of a core board and a cable formed after S300 in a method for preparing a circuit board;

[0054] Fig.15 is another schematic flow chart of a method for preparing a circuit board provided in an embodiment of the present application;

[0055] Fig.16 It is a cross-sectional schematic diagram of a first pressing plate and a second pressing plate formed after S500 in the method for preparing a circuit board;

[0056] Fig.17 It is a schematic cross-sectional view of a circuit board formed after S600 in the method for preparing the circuit board. DETAILED DESCRIPTION

[0057] For ease of understanding, the terms involved in the embodiments of the present application are first explained.

[0058] And / or: It is just a way to describe the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone.

[0059] Multiple: refers to two or more than two.

[0060] Connection: should be understood in a broad sense. For example, A and B are connected, which can be either direct or indirect through an intermediary.

[0061] The specific implementation of the present application will be clearly described below in conjunction with the accompanying drawings.

[0062] Server: A high-performance computer that runs corresponding application software in a network environment, provides shared information resources and various services to online users, and provides various shared services and other applications to terminal users. The server may include a central processing unit, memory, hard disk, various buses, etc., and has high-speed computing capabilities, long-term reliability, and strong external data throughput capabilities.

[0063] Workstation: Based on personal computers and distributed network computing, it is oriented towards professional application fields and has powerful data calculation, graphics and image processing capabilities. It is a high-performance computer designed and developed to meet the needs of professional fields such as engineering design, animation production, scientific research, software development, financial management, information services, simulation, etc.

[0064] The motherboard, also known as the main board, system board, or motherboard, is used to connect the various components in the server. The motherboard is used to transmit various electronic signals and preliminarily process some peripheral data.

[0065] Basic input and output system (BIOS) chip: It carries the computer's basic input and output programs, the self-test program after powering on, and the system startup program. It can provide the computer with the lowest-level and most direct hardware settings and controls. The BIOS chip can also provide some system parameters to the operating system.

[0066] Central processing unit (CPU): As the computing and control core of the information processing system, it is the execution unit for information processing and program running.

[0067] Dual inline memory module (DIMM): A memory module is used to provide operating space for information processing systems and software, and is also used to temporarily store CPU calculation data and data exchanged with external storage devices such as hard disks. The CPU can address the memory through the data bus and perform read and write operations on the memory.

[0068] The platform controller hub (PCH) can also be called a bridge chip or a south bridge chip. The south bridge chip is used to process low-speed signals and communicate with the CPU through the north bridge chip. The north bridge chip is set close to the CPU and is mainly responsible for controlling the data exchange between the accelerated graphics port (AGP) graphics card, memory and the CPU; the south bridge chip is set close to the peripheral component interconnect (PCI) slot and is mainly responsible for the data exchange between the floppy drive, hard disk, keyboard and add-on card. The south bridge chip and the north bridge chip are connected through the PCI bus to form a motherboard chipset architecture.

[0069] The baseboard management controller (BMC) is used to perform operations such as upgrading the machine firmware and checking the machine equipment when the machine is not turned on.

[0070] Management signals are transmitted between BMC and PCH, such as intelligent platform management interface (IPMI) signals, universal serial bus (USB) signals, video graphics array (VGA) signals, etc. BMC and PCH can realize functions such as power on and off, log acquisition, image display, virtual media, etc.

[0071] Peripheral Component Interconnect Express (PCIe): is a high-speed serial computer expansion bus standard used to implement high-speed serial point-to-point, dual-channel, high-bandwidth transmission. PCIe mainly supports active power management, error reporting, end-to-end reliable transmission, and hot plugging. PCIe is a multi-layer protocol involving the conversation layer, data exchange layer, and physical layer.

[0072] PCIe card: A card that complies with the PCIe standard.

[0073] Link: It is a point-to-point communication channel between two PCIe ports, which can also be called interconnection. Two PCIe ports communicate through the link.

[0074] Power supply unit (PSU): also known as a power supply, is a power supply that converts electrical energy (different from a battery-powered power supply) and is used to convert standard AC power into low-voltage stable DC power, and provide DC power to other devices.

[0075] Input / output (I / O): usually refers to the input and output of data between the server's internal information processing system and external devices.

[0076] I / O interface: used to connect external devices to the server's internal information processing system.

[0077] Serial port: It can also be called serial interface, serial communication interface or serial communication interface. It is an expansion interface that uses serial communication.

[0078] Network interface card (NIC): Also known as a network adapter or network interface card. It is generally used to connect servers to network devices such as switches. Servers generally require two or more network cards.

[0079] The electronic device of the embodiment of the present application includes an information and communications technology (ICT) product. ICT products may refer to devices that enable people and organizations to enter the digital world, including switches, routers, network transmission equipment, servers and other electronic devices. ICT products may have communication functions to achieve data transmission; ICT products may also have data processing functions to analyze and process data.

[0080] The electronic device of the embodiment of the present application is described by taking the specific structure of the server as an example. The server provided in the present application can be a server of various shapes. The present application does not limit the type of server. For example, the server can be a rack server, a blade server, a tower server or a whole cabinet server, etc.

[0081] See also Figure 1 , Figure 1 : is a schematic diagram of the structure of an electronic device 1000 provided in an embodiment of the present application. The electronic device 1000 includes a housing 100, a circuit board 200, a first electronic component 230, and a second electronic component 300. The housing 100 may be a metal shell, and the housing 100 may be omitted in some electronic devices 1000. The circuit board 200 is accommodated inside the housing 100. The first electronic component 230 is connected to the surface of the circuit board 200. The first electronic component 230 and the circuit board 200 may be electrically connected. The second electronic component 300 of the electronic device 1000 is electrically connected to the circuit board 200. The second electronic component 300 may be directly mounted on the board body ( Figure 1The first electronic component 230 may be a switch chip, a network card chip, or a PCIe switch chip. The first electronic component 230 may be a first electronic component 230, a second electronic component 300, or a second electronic component 300 may be disposed separately from the board body of the circuit board 200. The circuit board 200 may be, but is not limited to, a mainboard of a server, a network card of a server, a mainboard in a switch, a mainboard in a router, a mainboard in an optical transmission network, or a backplane of other electronic devices 1000. The present application does not limit the specific application scenarios of the circuit board 200. The first electronic component 230 may be a switch chip, a network card chip, or a PCIe switch chip. The present application does not limit the specific application scenarios of the first electronic component 230. The first electronic component 230 may be used to send or receive high-speed signals. The second electronic component 300 includes, but is not limited to, connectors, CPU chips, DIMMs, PCHs, BMCs, PCIe cards, PSUs, I / O interfaces, and other components. Among them, the connector may be, for example, a quad small form-factor pluggable (QSFP) connector. The second electronic component 300 may be used to receive or transmit a high-speed signal from the first electronic component 230 , or the second electronic component 300 may be used to send a high-speed signal to the first electronic component 230 .

[0082] It should be noted that Figure 1 The purpose is only to schematically describe the connection relationship between the box 100, the circuit board 200 and the second electronic component 300, and it does not specifically limit the connection position, specific structure and quantity of each device. The structure illustrated in the embodiment of the present application does not constitute a specific limitation on the electronic device 1000. In other embodiments of the present application, the electronic device 1000 includes Figure 1 More or fewer components may be shown, or some components may be combined or separated, or the components may be arranged differently. Figure 1 The components shown may be implemented in hardware, software or a combination of software and hardware.

[0083] See also Figure 2 , Figure 2 1 is a schematic cross-sectional view of a circuit board 200 and a first electronic component 230 provided in an embodiment of the present application, wherein the cross-sectional direction is along the width direction of the wiring groove. The circuit board 200 includes a board body 210 and a cable 220. A wiring groove 2100 is provided inside the board body 210. At least part of the cable 220 is located in the wiring groove 2100. The first electronic component 230 is connected to the surface of the board body 210. One end of the cable 220 is electrically connected to the first electronic component 230, and the other end of the cable 220 can be used to electrically connect to the second electronic component 300. The cable 220 can electrically connect the first electronic component 230 to the second electronic component 300.

[0084] Exemplarily, the circuit board 200 may be, but is not limited to, a mainboard of a server, a circuit board of a network card, a mainboard in a switch, a mainboard in a router, a mainboard in an optical transmission network, or a backplane of other electronic devices 1000. The first electronic component 230 may be a chip of a switch, a chip of a network card, or a switch chip of PCIe. For ease of understanding, the present application provides examples of application scenarios of the first electronic component 230 and the second electronic component 300. When the first electronic component 230 is a chip of a switch, the second electronic component 300 may be a network card. The chip of the switch may be electrically connected to the network card through a cable. Alternatively, when the first electronic component 230 is a switch chip of PCIe, the second electronic component 300 may be a CPU chip. The switch chip may be electrically connected to the CPU chip through a cable. When the circuit board 200 is a circuit board of a network card, the first electronic component 230 may be a chip of the network card. The second electronic component 300 may be a connector. The cable 220 may connect the chip of the network card to the connector.

[0085] Among them, the cable 220 can be an electrical cable or an optical cable. Specifically, when the cable 220 is a single-core cable, it includes a signal line. The signal line includes a protective layer and an inner core. The protective layer is coated on the outer periphery of the inner core. The inner core in the signal line can be a silver-plated copper wire. When the cable 220 is a multi-core cable, it includes multiple signal lines. Exemplarily, the number of signal lines of the multi-core cable can be two. The multi-core cable can be a flat cable.

[0086] The cable 220 may further include a grounding layer. The grounding layer may be connected to one side of the signal line 221. Alternatively, the grounding layer may be connected to two opposite sides of the signal line 221. Alternatively, the grounding layer may be wrapped around the periphery of the signal line 221. The grounding layer is used to electrically connect to the grounding trace of the board, thereby ensuring that the housing 100 of the electronic device 1000 and the ground are conductive.

[0087] The cable 220 may also include at least one ground wire 222. Figure 3 and Figure 4 , Figure 3 yes Figure 2 A schematic structural diagram of a cable 220 is shown. Figure 4 yes Figure 2 Another structural schematic diagram of the cable 220 is shown. Specifically, the cable 220 may include a ground wire 222. Alternatively, the cable 220 may include two ground wires 222. The ground wire 222 may be used to ensure that the metal housing of the electronic device 1000 and the ground are conductive. In some other implementations, the cable 220 may not include the ground wire 222.

[0088] Please refer to Figure 2In some implementations, the board body 210 includes a core board 211, a first pressing plate 212, and a second pressing plate 213. The core board 211 is provided with a wiring groove 2100. At least part of the cable 220 is located in the wiring groove 2100. The first pressing plate 212 and the second pressing plate 213 are respectively connected to opposite sides of the thickness direction of the core board 211. The first pressing plate 212, the core board 211, and the second pressing plate 213 are stacked in sequence. The first electronic component 230 can be connected to the surface of the second pressing plate 213 away from the core board 211. Exemplarily, the core board 211, the first pressing plate 212, and the second pressing plate 213 are all provided with a conductive structure. The conductive structure can be the first conductive structure, the second conductive structure, or the third conductive structure described below. The conductive structure includes a ground trace and a conductive trace. The ground trace can be connected to the ground wire 222 of the cable 220. The conductive trace can be electrically connected to the signal line 221 of the cable 220.

[0089] In other implementations, see Figure 5 , Figure 5 It is another cross-sectional schematic diagram of the circuit board 200 and the first electronic component 230 provided in an embodiment of the present application, wherein the cross-sectional direction is along the width direction of the wiring groove 2100. The first pressing plate 212 includes a first insulating layer 2121 and a first conductive layer 2122. The first insulating layer 2121 and the first conductive layer 2122 are stacked. The first conductive layer 2122 is provided with a first conductive structure. The first insulating layer 2121 is connected to the core plate 211, and the first conductive layer 2122 is located on the side of the first insulating layer 2121 away from the core plate 211. The first conductive layer 2122, the first insulating layer 2121 and the core plate 211 are stacked in sequence.

[0090] It can be understood that the core board 211 can be provided with a third conductive structure. Since the core board 211 has the third conductive structure, the first insulating layer 2121 is located between the core board 211 and the first conductive layer 2122, which can avoid a short circuit between the third conductive structure of the core board 211 and the first conductive structure of the first conductive layer 2122.

[0091] The second pressing plate 213 includes a second insulating layer 2131 and a second conductive layer 2132. The second insulating layer 2131 and the second conductive layer 2132 are stacked. The second conductive layer 2132 is provided with a second conductive structure. The second insulating layer 2131 is connected to a side of the core plate 211 away from the first insulating layer 2121. The second conductive layer 2132 is located on a side of the second insulating layer 2131 away from the core plate 211. The first conductive layer 2122, the first insulating layer 2121, the core plate 211, the second insulating layer 2131 and the second conductive layer 2132 are stacked in sequence.

[0092] It is understandable that since the core board 211 has a third conductive structure, the second insulating layer 2131 is located between the core board 211 and the second conductive layer 2132 to avoid a short circuit between the third conductive structure of the core board 211 and the second conductive structure of the second conductive layer 2132.

[0093] For example, please refer to Figure 5 and Figure 6 , Figure 6 yes Figure 5 Schematic diagram of a partial structure of the circuit board 200 shown. The circuit board 200 also includes a first conductive hole 2001 and a second conductive hole 2002. The first conductive hole 2001 and the second conductive hole 2002 both penetrate the first pressing plate 212, the core plate 211 and the second pressing plate 213 along the thickness direction of the circuit board 200. The first conductive structure can be electrically connected to one end of the cable 220 through the first conductive hole 2001 and / or the second conductive hole 2002. The second conductive structure can also be electrically connected to the other end of the cable 220 through the first conductive hole 2001 and / or the second conductive hole 2002. The first electronic component 230 can be electrically connected to the cable 220 through the first conductive structure and / or the second conductive structure, and the second electronic component 300 can be electrically connected to the cable 220 through the first conductive structure and / or the second conductive structure.

[0094] Exemplarily, the second electronic component 300 is electrically connected to the first conductive structure. The first conductive structure is electrically connected to one end of the cable 220 through the first conductive hole 2001. The first electronic component 230 is connected to the second conductive structure, and the second conductive structure is electrically connected to the other end of the cable 220 through the second conductive hole 2002. Alternatively, the second electronic component 300 and the first electronic component 230 are both connected to the second conductive structure. The second electronic component 300 is electrically connected to one end of the cable 220 through the second conductive structure and the first conductive hole 2001. The first electronic component 230 is electrically connected to the other end of the cable 220 through the second conductive structure and the second conductive hole 2002. That is, the first electronic component 230 and the second electronic component 300 can be located on the same side of the board 210, or the first electronic component 230 and the second electronic component 300 can be located on different sides of the board 210. The present application does not limit whether the first electronic component 230 and the second electronic component 300 are specifically connected to the first conductive structure or the second conductive structure. The specific connection method of the first electronic component 230 and the second electronic component 300 can be set according to the requirements of the electronic device 1000 in actual use.

[0095] In some other implementations, see Figure 7 , Figure 72 is another cross-sectional schematic diagram of the circuit board 200 and the first electronic component 230 provided in the embodiment of the present application, wherein the cross-sectional direction is along the width direction of the wiring groove 2100. The wiring groove 2100 can be formed by the surface of the core plate 211 facing the second pressing plate 213 or the first pressing plate 212 being recessed into the core plate 211. The wiring groove 2100 does not penetrate the core plate 211 in the thickness direction of the core plate 211. The cross-sectional shape of the wiring groove 2100 can be a triangle (such as Figure 7 As shown in A), semicircular (as shown in Figure 7 B) or a sawtooth shape (or a W shape) (as shown in FIG. Figure 7 The cross-sectional shape of the wiring trough 2100 can be adaptively changed according to the structure of the cable 220. It should be noted that the cross-sectional shape of the wiring trough 2100 is one or all of a triangle, a semicircle or a sawtooth shape, such as Figure 7 As shown, the circuit board 200 may include three wiring grooves 2100, and the cross-sectional shapes of the three wiring grooves 2100 may be triangular, semicircular or sawtooth, respectively. The wiring groove 2100 includes a groove sidewall 2101. The groove sidewall 2101 is connected to the surface of the core plate 211 facing the first pressing plate 212. The opening of the wiring groove 2100 faces the first pressing plate 212. Alternatively, the groove sidewall 2101 is connected to the surface of the core plate 211 facing the second pressing plate 213. The opening of the wiring groove 2100 faces the second pressing plate 213. The present application does not limit the opening direction of the wiring groove 2100.

[0096] The cable 220 is laid along the extension direction of the wiring trough 2100. The groove side wall 2101 of the wiring trough 2100 limits the cable 220, thereby preventing the cable 220 from coming out of the wiring trough 2100. When the cross-sectional shape of the wiring trough 2100 of the core plate 211 is triangular, the wiring trough 2100 can be used to accommodate a single-core cable, and the cross-sectional shape of the single-core cable can be circular. When the cross-sectional shape of the wiring trough 2100 of the core plate 211 is semicircular or sawtooth, the wiring trough 2100 can be used to accommodate a multi-core cable, and the cross-sectional shape of the multi-core cable can be rectangular or elliptical. When the cross-sectional shape of the wiring trough 2100 is semicircular, the cross-sectional shape of the cable 220 located in the wiring trough 2100 can be elliptical. When the cross-sectional shape of the wiring trough 2100 is sawtooth, the cross-sectional shape of the cable 220 located in the wiring trough 2100 can be rectangular.

[0097] For other implementations, see Figure 2, the wiring groove 2100 may penetrate the core plate 211. The cross-sectional shape of the wiring groove 2100 may be rectangular. Alternatively, the wiring groove 2100 may also penetrate the side of the core plate 211 along the length direction or the width direction of the plate body 210, and does not penetrate the surface of the core plate 211 facing the second pressing plate 213 and the first pressing plate 212. The cross-sectional shape of the wiring groove 2100 may be any of the shapes mentioned above.

[0098] It is understandable that the wiring groove 2100 that penetrates the core board 211 is easy to process, and the width of the wiring groove 2100 only needs to be set according to the diameter of the cable 220. Simplifying the processing of the wiring groove 2100 can improve the yield rate of the core board 211, thereby reducing the number of defective products and rework costs of the circuit board 200.

[0099] The cross-sectional width of the wiring trough 2100 can be adapted to the diameter setting of the cable 220. The cable 220 provided in the embodiment of the present application can adopt the following models: the cable 220 with a wire gauge (AWG) model of 30 has a diameter of about 0.25 mm; the cable 220 with a wire gauge (AWG) model of 34 has a diameter of about 0.17 mm; the cable 220 with a wire gauge (AWG) model of 36 has a diameter of about 0.13 mm. It should be noted that the models of the above-mentioned cables 220 are only exemplary descriptions and do not constitute a limitation on the models of the cables 220 of the present application.

[0100] It is understandable that with the rise of big data, cloud computing and artificial intelligence (AI), the computing requirements of electronic devices are getting higher and higher. The signal transmission rate between electronic devices and other components is also getting higher and higher. How to ensure the quality of signal transmission while transmitting signals at high speed so that the signal loss meets the application conditions is a problem that needs to be solved urgently.

[0101] For example, the exchange rate between computing nodes and networks is currently evolving from 25G to 224G. The high-speed signal transmission process requires the signal loss to be 0.9dB@56Ghz / inch. Traditional circuit board design cannot meet the use requirements of computing nodes (such as server nodes) with a network exchange rate of 224G.

[0102] The circuit board 200 provided in the embodiment of the present application is applied to a computing node, and its core board 211 is provided with a wiring groove 2100. The cable 220 is arranged in the wiring groove 2100, and the cable 220 is electrically connected to the first electronic component 230 and the second electronic component 300 respectively, so that the high-speed signal between the first electronic component 230 and the second electronic component 300 can be transmitted through the cable 220, thereby reducing the signal loss during the transmission process, and thus improving the transmission quality of the high-speed signal.

[0103] In addition, the present application directly sets the cable 220 in the wiring groove 2100, avoiding the need for the circuit board to be connected to the cable 220 through a connector, reducing the loss of the connection between the cable 220 and the connector during the high-speed signal transmission process, thereby ensuring the accuracy and stability of the high-speed signal during the transmission process. The high-speed signal can meet the working requirements of the electronic device 1000.

[0104] The present application also provides three implementation methods to illustrate different installation methods of the cable 220 and the board body 210. In the three implementation methods of the circuit board 200 described below, the board body 210 of the circuit board 200 can be any one or any multiple implementation methods of the board body 210 described above.

[0105] For the first possible implementation, see Figure 8 , Figure 8 1 is a cross-sectional schematic diagram of an implementation method of the circuit board 200 and the first electronic component 230 provided in an embodiment of the present application, wherein the cross-sectional direction is along the length direction of the wiring groove 2100. Part of the cable 220 is located inside the board body 210, and another part of the cable 220 is located outside the board body 210. Specifically, the cable 220 includes a first section 2210 and a second section 2220. The first section 2210 is directly connected to the second section 2220. The first section 2210 and the second section 2220 are arranged in sequence along the length direction of the cable. The first section 2210 of the cable 220 can be connected to the board body 210. The first section 2210 of the cable 220 is located in the wiring groove 2100. The first section 2210 of the cable 220 can be electrically connected to the first electronic component 230 through the conductive structure of the board body 210. A cable opening 2114 is provided on the side of the core board 211, and the wiring groove 2100 is connected to the cable opening 2114, and the second section 2220 extends out of the core board 211 through the cable opening 2114. The second section 2220 of the cable 220 is located outside the board body 210. The second section 2220 of the cable 220 is used to connect with the second electronic component 300 of the electronic device 1000. The second electronic component 300 of the electronic device 1000 can electrically connect the circuit board 200 with other components or peripheral devices. For example, in a server network system, the second electronic component 300 can be a connector arranged on the backplane side, and the circuit board 200 is a single board of a switch or a single board of a high-speed network card. The cable 220 in the circuit board 200 provided in the embodiment of the present application can reduce the loss in the transmission process of the high-speed signal and avoid the loss of the connector on the circuit board side.

[0106] It should be noted that when the prepared circuit board 200 does not need to transmit high-speed signals but only needs to transmit low-speed signals, this part of the circuit board 200 can be designed according to the traditional etching method. There is no need to set the cable 220 at the position where only low-speed signals need to be transmitted. Fig. 9, Fig. 9 2 is a cross-sectional schematic diagram of another implementation of the circuit board 200, the first electronic component 230 and the second electronic component 300 provided in the embodiment of the present application, wherein the cross-sectional direction is along the length direction of the wiring groove 2100. Different from the first implementation, the first section 2210 and the second section 2220 of the cable 220 are both located in the wiring groove 2100 of the board body 210. The second electronic component 300 is connected to the surface of the board body 210. One end of the cable 220 is electrically connected to the first electronic component 230 through a conductive structure, and the other end of the cable 220 is electrically connected to the second electronic component 300 through a conductive structure. Alternatively, one end of the cable 220 is directly electrically connected to the first electronic component 230, and the other end of the cable 220 is directly electrically connected to the second electronic component 300. The circuit board 200 is a hard board. Exemplarily, the rigid circuit board 200 can be used as a single board of a high-speed network card.

[0107] It is understandable that since the circuit board 200 needs to provide installation locations for multiple components in the electronic device 1000 and has a certain supporting stability, setting the entire body 210 of the circuit board 200 as a hard board can provide more installation space for the second electronic components 300 of the electronic device 1000.

[0108] The hard board may be a copper clad laminate (CCL), which may be a plate-shaped material made by impregnating a reinforcing material with resin, coating one or both sides with copper foil, and hot pressing. Exemplarily, the reinforcing material of the copper clad laminate may be paper, glass fiber, ceramic, silicon dioxide, boron nitride, metal, resin, and composite material. The material of the board 210 may be selected based on the requirements of the required specifications, high-speed signals, flow capacity, cost, etc., and the embodiments of the present application do not strictly limit this.

[0109] In the third possible implementation, different from the second possible implementation, the circuit board 200 may be a hard-soft board, for example, a flexible printed circuit board (FPCB). Fig.10 , Fig.10 2 is a cross-sectional schematic diagram of another implementation of the circuit board and the first and second electronic components provided in the embodiment of the present application, wherein the cross-sectional direction is along the length direction of the wiring groove 2100. Different from the above two implementations, the two ends of the cable 220 are located inside the board 210, and the middle part of the cable 220 is located outside the board 210.

[0110] Specifically, the core plate 211 includes a first sub-plate 2112 and a second sub-plate 2113, and the first sub-plate 2112 and the second sub-plate 2113 are two parts separated from the core plate 211. The first sub-plate 2112 and the second sub-plate 2113 are both provided with a wiring groove 2100. The wiring groove 2100 of the first sub-plate 2112 is a first wiring groove. The wiring groove 2100 of the second sub-plate 2113 is a second wiring groove. The first pressing plate 212 includes a third sub-plate 2123 and a fourth sub-plate 2124, and the third sub-plate 2123 and the fourth sub-plate 2124 are two parts separated from the first pressing plate 212. The second pressing plate 213 includes a fifth sub-plate 2133 and a sixth sub-plate 2134. The fifth sub-plate 2133 and the sixth sub-plate 2134 are two parts separated from the second pressing plate 213. Among them, the third sub-plate 2123, the first sub-plate 2112 and the fifth sub-plate 2133 are stacked in sequence to form the first circuit board 2110. The first circuit board 2110 is a hard board. The fourth sub-board 2124, the second sub-board 2113 and the sixth sub-board 2134 are stacked in sequence to form the second circuit board 2120. The second circuit board 2120 is a hard board.

[0111] The first electronic component 230 may be connected to the first circuit board 2110, and the second electronic component 300 may be connected to the second circuit board 2120. The first circuit board 2110 and the second circuit board 2120 are both provided with a wiring groove 2100.

[0112] The cable 220 includes a first section 2230, a third section 2240, and a second section 2250. The first section 2230, the third section 2240, and the second section 2250 are connected in sequence. The first section 2230 is connected to the first circuit board 2110, and the first section 2230 is located in the wiring groove 2100 of the first circuit board 2110. The first section 2230 is electrically connected to the first electronic component 230. The second section 2250 is connected to the second circuit board 2120, and the second section 2250 is located in the wiring groove 2100 of the second circuit board 2120. The second section 2250 is electrically connected to the second electronic component 300. The third section 2240 is located between the first circuit board 2110 and the second circuit board 2120. The third section 2240 is located outside the first circuit board 2110 and the second circuit board 2120 of the board body 210.

[0113] It is understandable that, since the cable 220 is a flexible structure, the third section 2240 can be bent and deformed, so that the relative position of the first circuit board 2110 and the second circuit board 2120 of the board body 210 can be changed. When the installation space in the box 100 is small, the third section 2240 can be bent to adjust the relative position of the first circuit board 2110 and the second circuit board 2120, so that the first circuit board 2110 can partially overlap with the second circuit board 2120 or the first circuit board 2110 can be tilted relative to the second circuit board 2120, so that the circuit board 200 can adapt to different installation spaces.

[0114] In addition, since the first circuit board 2110 and the second circuit board 2120 are hard boards, the first circuit board 2110 and the second circuit board 2120 can provide installation space for other components of the electronic device 1000. For example, when the circuit board 200 is used as the main board of the server, the main board has the function of electrically connecting and supporting electronic components, and each second electronic component 300 in the electronic device 1000 is connected to the main board, and various electronic signals are transmitted through the main board to achieve communication connection. The main board can be equipped with a circuit system. The circuit system includes one or more components such as a BIOS chip, an I / O control chip, a keyboard and a panel control switch interface, an indicator light connector, an expansion slot, a main board and a DC power supply connector for a plug-in card. The main board can control the system memory, storage devices and other I / O devices through the circuit system.

[0115] In actual use, the first circuit board 2110 and the second circuit board 2120 can be used as separate circuit boards, and the first circuit board 2110 and the second circuit board 2120 can be respectively arranged in two electronic devices. That is, the first circuit board 2110 can be the circuit board 200 of one electronic device, and the second circuit board 2120 can be the circuit board 200 of another electronic device. Accordingly, the cable 220 can directly electrically connect the circuit boards of the two electronic devices, the first section 2230 of the cable 220 can be used to electrically connect with the first electronic component / second electronic component of one electronic device, and the second section 2250 can be used to electrically connect with the second electronic component / first electronic component of another electronic device, so that the two electronic devices can directly transmit signals through the cable 220.

[0116] The above three implementations of the circuit board 200 are merely examples of how the cable 220 is installed on the board 210 of the circuit board 200. In actual use, two or three of the above three installation methods of the cable 220 on the board 210 may be used simultaneously. That is, a board 210 may have multiple wiring grooves, and multiple cables 220 may be connected to the board 210 through any one, two or three of the above three implementation methods.

[0117] The present application also provides a method for preparing a circuit board 200. Fig.11 , Fig.11 2 is a schematic diagram of a method for preparing a circuit board 200 provided in an embodiment of the present application. Figure 1-Figure 10 The above description, regarding the improvement of the circuit board 200, can be applied to the above description of the circuit board 200 without conflict, and the method includes:

[0118] S100: providing a core board 211 .

[0119] For some possible implementations, see Fig.12 , Fig.12 2 is a cross-sectional schematic diagram of a core board 211 formed after S100 in the method for preparing a circuit board 200. The core board 211 may be a signal layer of the circuit board 200, and the signal layer is a main layer structure for connecting various components of the circuit board. On the signal layer, conductive structures including circuits, signal transmission lines, power lines, ground lines, and other wiring are usually arranged.

[0120] S200 : forming a wiring groove 2100 on the core substrate 211 .

[0121] In some possible implementations, the wiring groove 2100 may be formed by etching the core board 211. The wiring groove 2100 may extend in the plane where the length and width of the core board 211 are located. Fig.13 , Fig.13 It is a cross-sectional schematic diagram of the core board 211 formed after S200 in the method for preparing the circuit board 200. The wiring groove 2100 can penetrate the core board 211. The wiring groove 2100 is spaced apart from the conductive structure on the core board 211.

[0122] S300 : Laying the cable 220 along the extension direction of the wiring trough 2100 to form a core structure 2111 ; the cable 220 includes a first section and a second section, the first section is connected to the second section, and the first section is limited in the wiring trough 2100 .

[0123] It can be understood that the end of the first section away from the second section is used to be electrically connected to the first electronic component 230 , and the second section is used to be electrically connected to the second electronic component 300 .

[0124] For some possible implementations, see Fig.14 , Fig.14It is a cross-sectional schematic diagram of the core board 211 and the cable 220 formed after S300 in the method for preparing the circuit board 200. After the cable 220 is connected to the core board 211, a core layer structure 2111 of the circuit board 200 can be formed. The core layer structure 2111 can constitute the circuit board 200 alone, or the core layer structure 2111 can also be a part of the layer structure in the circuit board 200.

[0125] S400 , pressing the core layer structure 2111 to form the circuit board 200 .

[0126] In addition, in some implementations, S400 may further include steps S500 and S600, see Fig.15 , Fig.15 1 is another schematic flow chart of a method for preparing a circuit board 200 provided in an embodiment of the present application.

[0127] S500: Provide a first pressing plate 212 and a second pressing plate 213 .

[0128] For some possible implementations, see Fig.16 , Fig.16 2 is a cross-sectional schematic diagram of the first pressing plate 212 and the second pressing plate 213 formed after S500 in the method for preparing the circuit board 200. The first pressing plate 212 includes a first insulating layer 2121 and a first conductive layer 2122. The first insulating layer 2121 and the first conductive layer 2122 are stacked. The first conductive layer 2122 is etched and electroplated to form a first conductive structure 2125 on the side away from the first insulating layer 2121. The second pressing plate 213 includes a second insulating layer 2131 and a second conductive layer 2132. The second insulating layer 2131 and the second conductive layer 2132 are stacked. The second conductive layer 2132 is etched and electroplated to form a second conductive structure 2135 on the side away from the second insulating layer 2131. The specific structures of the first pressing plate 212 and the second pressing plate 213 can refer to the above description.

[0129] S600 : Pressing the first pressing plate 212 and the second pressing plate 213 together with the core layer structure 2111 to form the circuit board 200 .

[0130] For some possible implementations, see Fig.17 , Fig.17 2 is a schematic cross-sectional view of the circuit board 200 formed after S600 in the method for preparing the circuit board 200 . The first insulating layer 2121 of the first pressing plate 212 faces the core structure 2111 . The second insulating layer 2131 of the second pressing plate 213 faces the core structure 2111 .

[0131] It is understandable that integrating the cable 220 with the board body 210 to form the circuit board 200 can eliminate the need for connecting the cable 220 and the second electronic component 300 and / or the pad in the traditional way, thereby simplifying the connection process between the circuit board 200 and the cable 220 .

[0132] In addition, the present application improves the transmission quality of high-speed signals by eliminating the connection socket connecting the wiring and the cable 220 on the circuit board 200, thereby avoiding the plug-in loss caused by the plugging of the cable 220 and the connection socket. In addition, since the wiring formed by the electroplated conductive structure on the circuit board 200 has a large loss in transmitting high-speed signals, the present application further reduces the transmission loss of high-speed signals by inserting the cable 220 into the board body 210, thereby replacing the conductive structure on the circuit board 200 with the cable 220. As a result, the transmission loss of high-speed signals can meet the working requirements of server nodes with a transmission rate of 224G.

[0133] It should be noted that when the prepared circuit board 200 does not need to transmit high-speed signals but only needs to transmit low-speed signals, this part of the circuit board 200 is designed according to the traditional etching method. There is no need to set cables at the position where only low-speed signals need to be transmitted.

[0134] The embodiments of the present application are introduced in detail above. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method and core idea of ​​the present application. At the same time, for general technical personnel in this field, according to the idea of ​​the present application, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A circuit board, applied to electronic equipment, characterized in that: include: A core plate, wherein the core plate is provided with wiring grooves along the thickness direction thereof; and A cable, the cable comprising a first section and a second section, the first section being connected to the second section, the first section being confined within the wiring groove, the end of the first section away from the second section being used for electrical connection to a first electronic component of an electronic device, and the second section being used for electrical connection to a second electronic component of the electronic device.

2. The circuit board according to claim 1, characterized in that: The circuit board further includes a first pressing plate and a second pressing plate, wherein the first pressing plate and the second pressing plate are respectively arranged on opposite sides of the core board in the thickness direction.

3. The circuit board according to claim 1 or 2, characterized in that: The second section is located outside the wiring groove, a cable opening is provided on the side of the core board, the wiring groove is communicated with the cable opening, and the second section extends out of the core board through the cable opening.

4. The circuit board according to claim 1 or 2, characterized in that: The circuit board includes a first circuit board and a second circuit board, the first circuit board is provided with a first wiring groove, the first circuit board is used to provide a mounting position for the first electronic component, the second circuit board is provided with a second wiring groove, the second circuit board is used to provide a mounting position for the second electronic component; The cable further includes a third section, wherein the first section, the third section and the second section are connected in sequence; The first section is located in the first wiring groove, and the end of the first section away from the third section is used to be electrically connected to the first electronic component. The second section is located in the second wiring groove, and the end of the second section away from the third section is used to be electrically connected to the second electronic component connected to the second circuit board. The third section is located outside the wiring groove, and the third section is connected between the first circuit board and the second circuit board.

5. The circuit board according to any one of claims 1 to 4, characterized in that: The wiring groove penetrates the core plate along a thickness direction of the core plate.

6. The circuit board according to any one of claims 1 to 4, characterized in that: The cross-sectional shape of the wiring groove is semicircular, and the cross-sectional shape of the cable located in the wiring groove is elliptical; Alternatively, the cross-sectional shape of the wiring groove is triangular, and the cross-sectional shape of the cable located in the wiring groove is circular; Alternatively, the cross-sectional shape of the wiring groove is sawtooth, and the cross-sectional shape of the cable in the wiring groove is rectangular.

7. The circuit board according to any one of claims 2 to 4, characterized in that: The circuit board further comprises a first conductive hole, wherein the first conductive hole penetrates the first pressing plate, the core plate and the second pressing plate along the thickness direction of the circuit board; The first pressure plate includes a first insulating layer and a first conductive layer, and the first conductive layer, the first insulating layer and the core plate are stacked in sequence; the first conductive layer is provided with a first conductive structure, and the first conductive structure is used to be electrically connected to the second electronic component, and the first conductive structure is electrically connected to the end of the second section away from the first section through the first conductive hole.

8. The circuit board according to claim 7, characterized in that: The circuit board further comprises a second conductive hole, wherein the second conductive hole penetrates the first pressing plate, the core plate and the second pressing plate along the thickness direction of the circuit board; The second pressure plate includes a second insulating layer and a second conductive layer, the second insulating layer is located on the side of the core plate away from the first insulating layer, and the second conductive layer is located on the side of the second insulating layer away from the core plate; the second conductive layer is provided with a second conductive structure, the second conductive structure is used to be electrically connected to the first electronic component, and the second conductive structure is electrically connected to the end of the first segment away from the second segment through the second conductive hole.

9. An electronic device, characterized in that: The method comprises the first electronic component and the circuit board as claimed in any one of claims 1 to 8, wherein the first electronic component is arranged on the circuit board.

10. A method for preparing a circuit board, characterized in that: The method comprises: Provide core board; forming a wiring groove on the core board; Laying the cable along the extension direction of the wiring trough to form a core structure, the cable comprising a first section and a second section, the first section being connected to the second section, and the first section being confined within the wiring trough; and The core layer structure is pressed together to form the circuit board.

Images