Method for preventing embedded device from falling off and PCB

Abstract

The invention provides a method for preventing an embedded device from falling off and a PCB (Printed Circuit Board). The method comprises the following steps: S1, mounting the device on the PCB through an SMT (Surface Mount Technology); s2, sealing the welding end of the device on the PCB; s3, performing browning and pressing process treatment on the PCB after the sealing treatment; according to the invention, after the device is mounted on the PCB through the SMT technology and solidified, the welding end of the device on the PCB is sealed, so that the solder paste at the welding end of the device is not affected by browning treatment, the device can be effectively prevented from falling off, the functional integrity of the device after mounting and pressing is ensured, the surface of the device can be normally browned, and the service life of the device is prolonged. And the binding force among all layers of boards of the PCB is not influenced, so that the product quality is ensured, and the production efficiency is improved.

Description

Technical Field

[0001] The present application belongs to the technical field of PCB boards, and specifically relates to a method for preventing embedded components from falling off and a PCB board. Background Art

[0002] The resistor packaging process is a commonly used process in the electronics industry. In circuits, resistors are a widely used component used to control current and voltage. The resistor packaging process is to package resistor devices into components of different shapes and sizes to meet the needs of various circuits. The purpose of the resistor packaging process is to protect the resistor devices and prevent them from being affected by the external environment and causing circuit failures. At the same time, resistor packaging can also improve the reliability and stability of the circuit. Resistor devices come in a variety of packaging forms, mainly including surface mount, plug-in, chip, and network types. Among them, surface mount resistor devices are currently the most widely used packaging form. Surface mount resistor devices have the characteristics of small size, light weight, and easy automated production. They can meet the needs of high-density circuit boards, so they are widely used in the electronics industry.

[0003] Surface Mount Technology (SMT) is also called surface mounting or surface mounting technology. It is a circuit assembly technology that mounts pinless or short-lead surface mount components (abbreviated as SMC / SMD, called chip components in Chinese) on the surface of a printed circuit board (PCB) or other substrate, and assembles them by soldering through reflow soldering or dip soldering.

[0004] In the prior art, the copper surface of the PCB needs to be browned before lamination to ensure the bonding strength with PP after lamination. However, the SMT process uses solder paste, which will react and dissolve with the acidic components in the browning solution during browning, causing the solder paste that acts as a bonding agent under the device to dissolve, ultimately resulting in poor bonding between the device and the pad, causing the device to fall off, affecting product quality; without browning, the bonding strength between the PCB layers cannot be met, resulting in delamination and explosion. Therefore, these two points are contradictory and cannot be met at the same time, becoming a major problem in the application of SMT process PCB products. Summary of the invention

[0005] In view of the problems existing in the prior art, the present application provides a method for preventing embedded components from falling off and a PCB board.

[0006] The present application provides a method for preventing an embedded device from falling off, comprising:

[0007] S1. Mount the device on the PCB board through SMT technology;

[0008] S2, sealing the welding ends of the components on the PCB board;

[0009] S3, the PCB board after the sealing process is subjected to browning and pressing process.

[0010] Furthermore, the sealing process of the welding end of the device on the PCB board includes:

[0011] The solder paste position of the device pins is wrapped and sealed with special packaging glue;

[0012] The PCB board with completed glue sealing is sent into the curing oven, and the special packaging glue is dried and cured in the curing oven.

[0013] Furthermore, the sealing process of the welding end of the device on the PCB board includes:

[0014] The cured PCB board is pickled.

[0015] Furthermore, the sealing process of the welding end of the device on the PCB board includes:

[0016] The solder paste position of the device pins is sealed with glue using a glue dispenser equipped with special packaging glue.

[0017] Furthermore, mounting the device on the PCB board by SMT technology includes:

[0018] Select the appropriate size of PCB board, clean and dry it;

[0019] Attach the PCB board to the lower surface of the steel stencil, and use a screen printer to print the solder paste onto the pads of the PCB board;

[0020] Use a placement machine to mount the device to a fixed position on the PCB;

[0021] The PCB board after patching is reflowed in a reflow oven to solidify the solder paste.

[0022] Furthermore, the curing temperature in the curing oven is 100-150°C.

[0023] Furthermore, the relevant parameters of the special packaging glue must be the same as the resin system of PP used for PCB board pressing, and the performance parameters must be similar.

[0024] The present application also provides a PCB board, and the components on the PCB board are soldered by the above-mentioned method for preventing the embedded components from falling off.

[0025] The present application also provides an electronic device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements a method for preventing an embedded device from falling off as described in any one of the above items when executing the computer program.

[0026] The present application also provides a computer-readable storage medium having a computer program stored thereon, wherein the computer program, when executed by a processor, implements the method for preventing an embedded device from falling off as described in any of the above items.

[0027] The above-mentioned technical scheme provided by the embodiment of the present application has the following advantages compared with the prior art: the present application mounts the device on the PCB board through the SMT technology, and seals the welding end of the device on the PCB board, so that the solder paste at the welding end of the device is not affected by the browning treatment, which can effectively prevent the device from falling off, ensure the functionality of the device after mounting and pressing, and ensure that the device surface can be browned normally, without affecting the bonding strength between the various layers of the PCB, thereby ensuring the quality of the product and improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the application and, together with the description, serve to explain the principles of the invention.

[0029] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0030] In the attached picture:

[0031] Figure 1 A schematic flow chart of a method for preventing embedded components from falling off provided in the present application. DETAILED DESCRIPTION

[0032] In order to have a clearer understanding of the technical features, purposes and effects of the present invention, the specific embodiments of the present invention are now described in detail with reference to the accompanying drawings. In the following description, it should be understood that the directions or positional relationships indicated by "front", "back", "up", "down", "left", "right", "longitudinal", "horizontal", "vertical", "horizontal", "top", "bottom", "inside", "outside", "head", "tail", etc. are based on the directions or positional relationships shown in the accompanying drawings, are constructed and operated in a specific direction, and are only for the convenience of describing the present technical solution, rather than indicating that the mechanism or element referred to must have a specific direction, and therefore cannot be understood as a limitation to the present invention.

[0033] It should also be noted that, unless otherwise clearly specified and limited, the terms such as "installed", "connected", "connected", "fixed", "set" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. When an element is referred to as being "on" or "under" another element, the element can be "directly" or "indirectly" located on the other element, or there may be one or more intermediate elements. The terms "first", "second", "third", etc. are only for the convenience of describing the present technical solution, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first", "second", "third", etc. can explicitly or implicitly include one or more of the features. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.

[0034] In the following description, specific details such as specific system structures, technologies, etc. are provided for the purpose of illustration rather than limitation, so as to provide a thorough understanding of the embodiments of the present invention. However, it should be clear to those skilled in the art that the present invention may be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, mechanisms, circuits, and methods are omitted to prevent unnecessary details from obstructing the description of the present invention.

[0035] Figure 1 A flow chart of a method for preventing embedded components from falling off provided in this application, such as Figure 1 As shown, the present application provides a method for preventing an embedded device from falling off, comprising:

[0036] S1. Mount the device on the PCB board through SMT technology;

[0037] S2, sealing the welding ends of the components on the PCB board;

[0038] S3, the PCB board after the sealing process is subjected to browning and pressing process.

[0039] Specifically, the present application uses SMT technology to mount the device on the PCB board, and seals the welding end of the device on the PCB board, so that the solder paste on the welding end of the device is not affected by the browning treatment, which can effectively prevent the device from falling off, ensure the functionality of the device after mounting and pressing, and ensure that the device surface can be browned normally without affecting the bonding strength between the various layers of the PCB, thereby ensuring the quality of the product and improving production efficiency.

[0040] Furthermore, sealing the welding end of the device on the PCB board includes:

[0041] The solder paste position of the device pin is sealed by wrapping with special packaging glue; specifically, the solder paste position of the device pin is sealed by a dispensing machine equipped with special packaging glue; the relevant parameters of the special packaging glue must be the same as the resin system of PP used for PCB board pressing, and the performance parameters are similar;

[0042] The PCB board after the glue sealing is sent into the curing oven, and the special packaging glue is dried and cured by the curing oven; the curing temperature in the curing oven is 100-150°C;

[0043] The cured PCB board is pickled.

[0044] In this embodiment, the encapsulation glue is a special encapsulation glue for PCB products. The relevant parameters of the special encapsulation glue must be the same as the resin system of PP used for PCB board pressing, and the performance parameters must be similar to prevent parameter mismatch from causing delamination and board explosion; after the device is mounted, a dispensing machine is used to dispense glue on the left and right pins of the device to completely seal and wrap the solder paste position of the device pins. After the glue is sealed at the device pins, it is dried and cured in a curing furnace. After curing, the PCB board is pickled to remove the deep oxidation of the board surface caused by the mounting process; the PCB process flow is normally carried out to brown the device surface and then press it, the device is embedded in the inside of the PCB and then the browning process is carried out to ensure that the graphic surface outside the device is fully browned and the bonding strength between the pressed PP and the graphic parts is ensured; this embodiment can ensure that during browning, the solder paste at the device pins will not be attacked by the acidic solution in the browning solution, to ensure that the solder paste under the device will not decompose, the bonding strength between the device and the pad will not be affected, and the device will not fall off.

[0045] Furthermore, mounting the device on the PCB board by SMT technology specifically includes:

[0046] Select the appropriate size of PCB board, clean and dry it;

[0047] Attach the PCB board to the lower surface of the steel stencil, and use a screen printer to print the solder paste onto the pads of the PCB board;

[0048] Use a placement machine to mount the device to a fixed position on the PCB;

[0049] The PCB board after patching is reflowed in a reflow oven to solidify the solder paste.

[0050] Specifically, select a PCB board of appropriate size, clean and dry it, check the components to ensure the quality of the components; attach the PCB board to the lower surface of the steel mesh board, and use a screen printer to print solder paste on the pads of the PCB board to prepare for the soldering of the components; use a patch machine to install the components in a fixed position on the PCB board after silk screen printing. After the patch is completed, the PCB board is transported to a reflow oven for reflow soldering. The solder paste melts, so that the components on the surface are firmly bonded to the PCB board.

[0051] This application is applicable to products in which devices of the specified size are embedded inside PCBs after welding. By protecting the solder paste at the device position, the stability of the device after welding is ensured, and the copper surface of the product after mounting can be browned normally, ensuring the bonding strength between the dielectric layer and the copper surface after pressing, and ensuring that there will be no reliability problems in the finished product after the device is embedded in the PCB.

[0052] The present application also provides a PCB board, and the components on the PCB board are soldered by the above-mentioned method for preventing the embedded components from falling off.

[0053] The present application also provides an electronic device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements a method for preventing an embedded device from falling off as described in any one of the above items when executing the computer program.

[0054] The present application also provides a computer-readable storage medium having a computer program stored thereon, wherein the computer program, when executed by a processor, implements the method for preventing an embedded device from falling off as described in any of the above items.

[0055] Those skilled in the art will appreciate that the embodiments of the present application may be provided as methods, systems, or computer program products. Therefore, the present application may take the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware. Moreover, the present application may take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code. The schemes in the embodiments of the present application may be implemented in various computer languages, such as C language, VHDL language, Verilog language, object-oriented programming language Java, and interpreted scripting language JavaScript, etc. These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing device to work in a specific manner, so that the instructions stored in the computer-readable memory produce a manufactured product including an instruction device, which is implemented in a box Figure 1These computer program instructions can also be loaded onto a computer or other programmable data processing device, so that a series of operation steps are executed on the computer or other programmable device to produce a computer-implemented process, so that the instructions executed on the computer or other programmable device provide the functions specified in the box. Figure 1 The steps for the functions specified in one or more boxes.

[0056] Although the preferred embodiments of the present application have been described, those skilled in the art may make additional changes and modifications to these embodiments once they are aware of the basic creative concepts. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present application.

[0057] Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is also intended to include these modifications and variations.

Claims

1. A method for preventing an embedded device from falling off, characterized in that: include: S1. Mount the device on the PCB board through SMT technology; S2, sealing the welding ends of the components on the PCB board; S3, the PCB board after the sealing process is subjected to browning and pressing process.

2. A method for preventing embedded components from falling off according to claim 1, characterized in that: The sealing process of the welding end of the device on the PCB board includes: The solder paste position of the device pins is wrapped and sealed with special packaging glue; The PCB board with completed glue sealing is sent into the curing oven, and the special packaging glue is dried and cured in the curing oven.

3. A method for preventing an embedded device from falling off according to claim 2, characterized in that The sealing process of the welding end of the device on the PCB board includes: The cured PCB board is pickled.

4. A method for preventing embedded components from falling off according to claim 2, characterized in that: The sealing process of the welding end of the device on the PCB board includes: The solder paste position of the device pins is sealed with glue using a glue dispenser equipped with special packaging glue.

5. A method for preventing embedded components from falling off according to claim 1, characterized in that: The method of mounting the device on the PCB board by using the SMT technology includes: Select the appropriate size of PCB board, clean and dry it; Attach the PCB board to the lower surface of the steel stencil, and use a screen printer to print the solder paste onto the pads of the PCB board; Use a placement machine to mount the device to a fixed position on the PCB; The PCB board after patching is reflowed in a reflow oven to solidify the solder paste.

6. A method for preventing embedded components from falling off according to claim 2, characterized in that: The curing temperature in the curing oven is 100-150°C.

7. A method for preventing embedded components from falling off according to claim 2, characterized in that: The relevant parameters of the special packaging glue must be the same as the resin system of PP used for PCB board pressing, and the performance parameters must be similar.

8. A PCB board, characterized in that: The components on the PCB board are soldered by the method for preventing embedded components from falling off as described in any one of claims 1 to 7.

9. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein: When the processor executes the computer program, the method for preventing the embedded device from falling off as described in any one of claims 1 to 7 is implemented.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the method for preventing the embedded device from falling off as claimed in any one of claims 1 to 7 is implemented.

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