Radiator

Abstract

The invention discloses a radiator which is suitable for being thermally coupled to a heat source and comprises a heat conduction base. The heat conduction base is provided with a first face, a second face, a flow guide face and a containing groove. The second surface is opposite to the first surface. The two opposite sides of the flow guide face are connected to the first face and the second face respectively, and the flow guide face is not perpendicular to the first face and the second face. The containing groove is located on the first face, and the heat conduction base is provided with a groove bottom face and an annular groove side face which surround the containing groove. The annular groove side face is connected to the periphery of the groove bottom face. The accommodating groove is used for accommodating a heat source, and the groove bottom surface is used for being thermally coupled to the heat source.

Description

Technical Field

[0001] The invention relates to a radiator, in particular to a radiator with a flow guide surface. Background Art

[0002] With the rapid development of technology, the computing performance of various electronic components has increased significantly, and a large amount of heat will be generated at the same time. When the heat generated by electronic components is too high, it is easy to cause damage to the electronic components, thereby affecting the reliability of the electronic components. Therefore, it is necessary to install a heat dissipation device on the electronic components to dissipate the excessive heat.

[0003] For example, electronic components can be cooled by a spray liquid cooling system to maintain the performance and service life of the electronic components. The so-called spray liquid cooling system refers to the heat dissipation of the heat source by spraying coolant on the heat source through a high-pressure nozzle. At this time, the coolant will flow vertically along the heat dissipation device of the spray liquid cooling system to form falling film cooling (Falling Film Cooling). However, the heat dissipation device of the current spray liquid cooling system is only attached to the top of the heat source, which can easily cause dry burning and overheating of the heat source. In addition, in the spray liquid cooling system, when the coolant flows vertically and hits the heat dissipation device, it will cause the coolant to splash outward, and the cooling fluid cannot be fully utilized and the heat dissipation efficiency is reduced. Therefore, how to improve the heat dissipation efficiency of the radiator is one of the problems that R&D personnel should solve. Summary of the invention

[0004] The present invention provides a radiator to improve the heat dissipation efficiency of the radiator.

[0005] The heat sink disclosed in one embodiment of the present invention is suitable for thermal coupling to a heat source and includes a thermally conductive base. The thermally conductive base has a first surface, a second surface, a guide surface and a receiving groove. The second surface is opposite to the first surface. The opposite sides of the guide surface are respectively connected to the first surface and the second surface, and the guide surface is not perpendicular to the first surface and the second surface. The receiving groove is located on the first surface, and the thermally conductive base has a groove bottom surface and an annular groove side surface surrounding the receiving groove. The annular groove side surface is connected to the periphery of the groove bottom surface. The receiving groove is used to accommodate the heat source, and the groove bottom surface is used to thermally couple to the heat source.

[0006] According to the heat sink of the above embodiment, since the heat conductive base of the heat sink covers the heat source and the heat sink is provided with an inclined flow guiding surface, the flow guiding surface can be used to guide the wall flow formed by the cooling fluid to flow through the second surface of the heat sink to effectively dissipate the heat from the heat source, and the chance of the cooling fluid splashing outward due to impacting the heat sink can be reduced, so as to further fully utilize the cooling fluid. In this way, the heat dissipation efficiency of the heat sink can be improved.

[0007] The above description of the content of the present invention and the following description of the embodiments are used to demonstrate and explain the principles of the present invention, and to provide further explanation of the scope of the claims of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 It is a three-dimensional schematic diagram of a heat sink according to an embodiment of the present invention.

[0009] Figure 2 for Figure 1 Another three-dimensional schematic diagram of the radiator.

[0010] Figure 3 for Figure 1 Schematic cross-sectional view of a heat sink.

[0011] Figure 4 for Figure 1 Another schematic cross-sectional view of a heat sink.

[0012] Figure 5 For cooling fluid to flow through Figure 1 Schematic cross-sectional view of a heat sink.

[0013] Wherein, the reference numerals are:

[0014] 10: Radiator

[0015] 11: Thermal base

[0016] 111: First side

[0017] 112: Side 2

[0018] 113: guide surface

[0019] 114: Groove bottom

[0020] 115: Side of annular groove

[0021] 1151: Plane segment

[0022] 1152: arc segment

[0023] 116: First side

[0024] 117: Second side

[0025] 118: First piercing

[0026] 119: Second piercing

[0027] 12: Heat dissipation structure

[0028] 20: Heat Source

[0029] 30: Circuit Board

[0030] A~D: Direction

[0031] L: Cooling fluid

[0032] M: Angle

[0033] R: Accommodating groove DETAILED DESCRIPTION

[0034] See also Figure 1 and Figure 2 . Figure 1 It is a three-dimensional schematic diagram of a heat sink according to an embodiment of the present invention. Figure 2 for Figure 1 Another three-dimensional schematic diagram of the radiator.

[0035] The heat sink 10 of this embodiment is, for example, disposed on a circuit board (not shown) standing upright in a server, and is suitable for thermal coupling to a heat source (not shown) disposed on the circuit board. The heat source is, for example, a chip. The so-called thermal coupling refers to thermal contact or connection through other heat-conducting media. The heat sink 10 includes a heat-conducting base 11 and a plurality of heat-dissipating structures 12. The heat-conducting base 11 has a first surface 111, a second surface 112, a guide surface 113, and an accommodating groove R.

[0036] Please also read Figure 3 . Figure 3 for Figure 1 A cross-sectional schematic diagram of a heat sink. The second surface 112 is opposite to the first surface 111 and the heat source. The guide surface 113 is, for example, a plane, and is used to guide the flow of a cooling fluid (not shown). The cooling fluid is, for example, an electronic fluoride liquid. The opposite sides of the guide surface 113 are respectively connected to the first surface 111 and the second surface 112. The angle M between the guide surface 113 and the first surface 111 is, for example, an acute angle, and is greater than or equal to 0 degrees, and less than or equal to 45 degrees. For example, the angle M between the guide surface 113 and the first surface 111 is 28.3 degrees. In addition, the guide surface 113 is not perpendicular to the second surface 112. In this way, the guide surface 113 can guide the cooling fluid to flow to the second surface 112.

[0037] Please also read Figure 4 . Figure 4 for Figure 1 Another cross-sectional schematic diagram of a heat sink. The accommodating groove R is located on the first surface 111 of the thermal conductive base 11. In detail, the thermal conductive base 11 has a groove bottom surface 114 and an annular groove side surface 115 surrounding the accommodating groove R. The annular groove side surface 115 is connected to the periphery of the groove bottom surface 114. The annular groove side surface 115 includes a plurality of plane sections 1151 and a plurality of arc surface sections 1152. These arc surface sections 1152 are respectively located at the corners of the accommodating groove R. These plane sections 1151 are respectively connected to these arc surface sections 1152, so that these plane sections 1151 and these arc surface sections 1152 surround the accommodating groove R together.

[0038] The receiving groove R is used to accommodate the heat source so that the heat conductive base 11 covers the heat source. In addition, the groove bottom surface 114 is used for thermal coupling with the heat source. These heat dissipation structures 12 are, for example, heat conductive protrusions, and are, for example, in the shape of square columns. These heat dissipation structures 12 protrude from the second surface 112 of the heat conductive base 11 to transfer the heat of the heat source to the cooling fluid.

[0039] In the present embodiment, the cooling fluid will flow through the upright heat sink 10 along the wall of the circuit board, thereby forming a wall flow. Compared with a general upright heat sink, the heat sink does not cover the heat source so that the wall flow will not flow through the second surface of the heat sink, thereby reducing the cooling efficiency, and there is no inclined guide surface so that when the wall flow flows to the heat sink, the cooling fluid hits the heat sink and splashes outward, which not only causes a waste of cooling fluid, but also reduces the cooling efficiency. In the present embodiment, the heat conductive base 11 of the heat sink 10 covers the heat source, and the heat sink 10 is provided with a guide surface 113. The advantage is that the guide surface 113 can be used to guide the wall flow formed by the cooling fluid to flow through the second surface 112 of the heat sink 10. In addition, the inclined guide surface 113 can also reduce the chance of the cooling fluid splashing outward due to hitting the heat sink 10, so as to further make full use of the cooling fluid. In this way, the heat dissipation efficiency of the heat sink 10 can be improved.

[0040] In this embodiment, the thermal conductive base 11 may further have a first side surface 116, a first through hole 118, a second side surface 117, and a second through hole 119. The opposite sides of the first side surface 116 are respectively connected to the first surface 111 and the second surface 112, and the first side surface 116 and the guide surface 113 are, for example, respectively located at adjacent sides of the thermal conductive base 11. The first through hole 118 is respectively connected to the first side surface 116 and the annular groove side surface 115.

[0041] The opposite sides of the second side surface 117 are respectively connected to the first surface 111 and the second surface 112. The second side surface 117 and the first side surface 116 are respectively located on different sides of the thermal conductive base 11, and the second side surface 117 and the flow guide surface 113 are respectively located on opposite sides of the thermal conductive base 11. The second through hole 119 is respectively connected to the second side surface 117 and the annular groove side surface 115.

[0042] In this embodiment, the guide surface 113 is a plane, but the invention is not limited thereto. In other embodiments, the guide surface may also be a curved surface.

[0043] In this embodiment, the heat dissipation structures 12 are in the shape of square columns, but the present invention is not limited thereto. In other embodiments, the heat dissipation structures 12 may also be in the shape of cylinders.

[0044] See also Figure 5 . Figure 5 For cooling fluid to flow through Figure 1Schematic cross-sectional view of a heat sink. In the present embodiment, the heat sink 10 is disposed on an upright circuit board 30. First, the cooling fluid L flows on the wall surface of the circuit board 30 to form a wall flow, and flows along direction A to the guide surface 113 of the heat-conducting base 11 in the heat sink 10. Then, the cooling fluid L flows to the guide surface 113, and is guided by the guide surface 113 to flow along direction B to the second surface 112 of the heat-conducting base 11 in the heat sink 10. Then, the cooling fluid L flows along direction C on the second surface 112, and at this time, the heat source 20 disposed on the circuit board 30 and located in the accommodating groove R transfers heat to the cooling fluid L through the second surface 112 and these heat dissipation structures 12. Then, the cooling fluid L that absorbs the heat flows along direction D and leaves the heat sink 10.

[0045] According to the heat sink of the above embodiment, since the heat conductive base of the heat sink covers the heat source and the heat sink is provided with an inclined flow guiding surface, the flow guiding surface can be used to guide the wall flow formed by the cooling fluid to flow through the second surface of the heat sink to effectively dissipate the heat from the heat source, and the chance of the cooling fluid splashing outward due to impacting the heat sink can be reduced, so as to further fully utilize the cooling fluid. In this way, the heat dissipation efficiency of the heat sink can be improved.

[0046] Of course, the present invention may have many other embodiments. Without departing from the spirit and essence of the present invention, technicians familiar with the field may make various corresponding changes and deformations based on the present invention, but these corresponding changes and deformations should all fall within the scope of protection of the claims of the present invention.

Claims

1. A heat sink, suitable for thermally coupling to a heat source, characterized in that: The heat sink contains: A heat-conducting base has a first surface, a second surface, a guide surface and a receiving groove, the second surface is opposite to the first surface, the opposite sides of the guide surface are respectively connected to the first surface and the second surface, and the guide surface is not perpendicular to the first surface and the second surface, the receiving groove is located on the first surface, and the heat-conducting base has a groove bottom surface and an annular groove side surface surrounding the receiving groove, the annular groove side surface is connected to the periphery of the groove bottom surface, the receiving groove is used to accommodate the heat source, and the groove bottom surface is used to thermally couple to the heat source.

2. The heat sink according to claim 1, characterized in that: It further comprises a plurality of heat dissipation structures, wherein the heat dissipation structures protrude from the second surface of the thermal conductive base.

3. The heat sink according to claim 2, characterized in that: The heat dissipation structure is in the shape of a square column.

4. The heat sink according to claim 1, characterized in that: The guide surface is a plane, and the angle between the guide surface and the first surface is an acute angle.

5. The heat sink according to claim 4, characterized in that: The included angle between the guide surface and the first surface is greater than or equal to 0 degrees and less than or equal to 45 degrees.

6. The heat sink according to claim 1, characterized in that The flow guide surface is a curved surface.

7. The heat sink according to claim 1, characterized in that: The side surface of the annular groove includes a plurality of plane segments and a plurality of arc segments, wherein the arc segments are respectively located at the corners of the accommodating groove, and the plane segments are respectively connected to the arc segments so that the plane segments and the arc segments together surround the accommodating groove.

8. The heat sink according to claim 1, characterized in that The thermal conductive base further has a first side surface and a first through hole. The two opposite sides of the first side surface are respectively connected to the first surface and the second surface, and the first side surface and the guide surface are respectively located on different sides of the thermal conductive base. The first through hole is respectively connected to the first side surface and the side surface of the annular groove.

9. The heat sink according to claim 8, characterized in that: The thermal conductive base further has a second side surface and a second through hole. The opposite sides of the second side surface are respectively connected to the first surface and the second surface, and the second side surface, the first side surface and the guide surface are respectively located on different sides of the thermal conductive base. The second through hole is respectively connected to the second side surface and the side surface of the annular groove.

10. The heat sink according to claim 9, characterized in that The first side surface and the flow-conducting surface are respectively located on adjacent sides of the heat-conducting base.

11. The heat sink according to claim 9, characterized in that The second side surface and the flow guiding surface are respectively located at opposite sides of the heat conducting base.

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