Heat dissipation type case based on flight simulation data processing

Abstract

The invention provides a heat dissipation type case based on flight simulation data processing, and belongs to the technical field of electronic equipment heat dissipation, the heat dissipation type case comprises a case body and a liquid cooling heat dissipation system, a mounting cavity is formed in the front end in the case body, a cavity is formed in the rear end in the case body, a through groove is formed in the rear wall of the cavity, and a through hole is formed in the through groove; a mounting frame is fixedly mounted in the mounting cavity; the liquid cooling heat dissipation system comprises a heat conduction plate fixedly installed on the rear wall of the installation frame and further comprises a radiator fixedly installed on the front wall of the cavity, a heat conduction pipe is fixedly installed in the heat conduction plate, and the output end of the heat conduction pipe penetrates through the rear wall of the installation cavity and extends into the cavity to be communicated with the radiator. And radiating fins are movably mounted at the rear end of the radiator. According to the invention, the contradiction between the dust deposition problem and low heat dissipation efficiency caused by the design of the ventilation opening in the traditional heat dissipation mode is solved, and the comprehensive optimization of efficient heat dissipation and intelligent dust prevention in the flight simulation data processor box is realized.

Description

Technical Field

[0001] The invention relates to the technical field of heat dissipation of electronic equipment, in particular to a heat dissipation type chassis based on flight simulation data processing. Background Art

[0002] With the development of aviation technology, flight simulators play an important role in pilot training, flight mission planning, and aircraft performance testing. Flight simulators provide pilots with a realistic training environment by collecting, processing, and analyzing a large amount of flight data. However, during the flight simulation data processing, the electronic equipment inside the chassis will continue to run and generate a lot of heat. If the heat cannot be dissipated in a timely and effective manner, it is easy to cause the equipment to overheat, which in turn affects the data processing speed, system stability, and the service life of the equipment.

[0003] Most of the existing flight simulation data processing chassis use the traditional air cooling method, which usually requires opening a vent on one side of the chassis to allow air circulation and timely discharge of heat. However, this design brings significant technical defects: the setting of the vents can easily lead to dust accumulation inside the chassis, and electronic equipment is extremely sensitive to dust, and dust accumulation can cause equipment performance degradation or even failure. At the same time, if air cooling is not used to avoid dust accumulation, that is, if vents are not opened, the heat inside the chassis will be difficult to dissipate effectively, resulting in extremely poor heat dissipation, thereby affecting the normal operation of the electronic equipment and the stability of the system. Therefore, there is an obvious contradiction between the heat dissipation efficiency and dustproof performance in the prior art, and it is difficult to meet the needs of the flight simulation data processing chassis for efficient heat dissipation and reliable operation. Summary of the invention

[0004] The purpose of this section is to summarize some aspects of embodiments of the present invention and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section and the specification abstract and the invention title of this application to avoid blurring the purpose of this section, the specification abstract and the invention title, and such simplifications or omissions cannot be used to limit the scope of the present invention.

[0005] In view of the above problems and / or the problems existing in the prior art, the present invention is proposed.

[0006] Therefore, the technical problem to be solved by the present invention is: to provide a liquid cooling system with efficient heat dissipation and dustproof function in a flight simulation data processing chassis, and to improve the heat dissipation efficiency and reliability of the system by dynamically adjusting the extension structure of the cooling fins, while reducing dust accumulation and noise.

[0007] In order to solve the above technical problems, the present invention provides the following technical solutions: a heat dissipation chassis based on flight simulation data processing, comprising:

[0008] A chassis, wherein a mounting cavity is formed at the front end of the chassis, a cavity is formed at the rear end of the chassis, a through slot is formed on the rear wall of the cavity, and a mounting frame is fixedly installed in the mounting cavity; and

[0009] A liquid cooling heat dissipation system comprises a heat conducting plate fixedly mounted on the rear wall of the mounting frame, and also comprises a radiator fixedly mounted on the front wall of the cavity, a heat conducting pipe fixedly mounted inside the heat conducting plate, an output end of the heat conducting pipe passes through the rear wall of the mounting cavity and extends into the cavity to communicate with the radiator, a heat dissipation fin is movably mounted on the rear end of the radiator, and the rear end of the heat dissipation fin passes through the through slot and extends to the outside of the chassis, a telescopic module is transmission-connected to the top end of the heat dissipation fin, a temperature control module is arranged at the front end of the telescopic module, and the telescopic module and the temperature control module are both arranged in the top wall of the chassis.

[0010] As a preferred solution of the heat dissipation chassis based on flight simulation data processing described in the present invention, wherein: the radiator includes a mounting shell fixedly mounted on the front wall of the cavity, a flow channel is opened at the front end inside the mounting shell, cooling fins are fixedly mounted on the outer surface of the flow channel, and the cooling fins are slidably connected to the outer surface of the cooling fins, a liquid inlet is opened at the top end of the flow channel, a liquid outlet is opened at the bottom end of the flow channel, and the upper and lower ends of the heat pipe are respectively connected to the liquid inlet and liquid outlet of the flow channel.

[0011] As a preferred solution of the heat dissipation chassis based on flight simulation data processing described in the present invention, the heat pipe and the flow channel both have an "S"-shaped curved structure, and coolant is arranged inside the heat pipe, and micro pumps are arranged at the connection between the top and bottom ends of the heat pipe and the liquid inlet and outlet of the flow channel.

[0012] As a preferred solution of the heat dissipation chassis based on flight simulation data processing described in the present invention, a telescopic slot is provided at the top of the cavity, and the telescopic module includes an electric cylinder fixedly mounted on the inner top wall of the chassis, a telescopic rod is movably connected inside the electric cylinder, an output end of the telescopic rod passes through the inner wall of the chassis and extends to the telescopic slot and is fixedly connected with a telescopic plate, a push plate is fixedly mounted on the bottom end of the telescopic plate, and the bottom end of the push plate is fixedly connected to the upper surface of the heat dissipating fin through a connecting rod.

[0013] As a preferred solution of the heat dissipation chassis based on flight simulation data processing described in the present invention, wherein: the temperature control module includes a temperature sensor fixedly installed on the top wall of the installation cavity, the output end of the temperature sensor is connected to the input end of a microcontroller fixedly installed in the chassis through a wire, and the output end of the microcontroller is connected to the driving end of the electric cylinder through a wire.

[0014] As a preferred solution of the heat dissipation chassis based on flight simulation data processing described in the present invention, a limiting groove is opened inside the heat dissipation fin, and there are three limiting grooves in total, the insides of the three limiting grooves are all slidably connected to limiting blocks, and the left and right sides of the three limiting blocks are fixedly connected to the inner wall of the heat dissipation fin.

[0015] As a preferred solution of the heat dissipation chassis based on flight simulation data processing described in the present invention, wherein: a total of multiple heat dissipation fins are provided, and a corresponding number of heat dissipation fins, connecting rods and through slots are also provided, the top ends of the multiple connecting rods are fixedly connected to the bottom surface of the push plate, the bottom ends of the multiple connecting rods are respectively fixedly connected to the upper surfaces of the multiple heat dissipation fins, the multiple heat dissipation fins are respectively slidably connected to the multiple heat dissipation fins through limit blocks, and the rear ends of the multiple heat dissipation fins respectively pass through the multiple through slots and extend to the outside of the chassis.

[0016] As a preferred solution of the heat dissipation chassis based on flight simulation data processing described in the present invention, brushes are installed on both sides of the left and right sides of the through grooves, and the cleaning surfaces of the brushes on both sides are in close contact with the outer surfaces of the heat dissipation fins.

[0017] Beneficial effects of the present invention:

[0018] (1) The present invention solves the problems of low air-cooling efficiency, severe dust accumulation and high noise in the prior art by innovatively combining liquid cooling technology with a dynamic cooling fin retractable structure. By designing the heat pipe and the flow channel as an "S"-shaped curved structure and providing a micro pump at the connection, the coolant can circulate efficiently, significantly improving the efficiency of heat conduction and dissipation, and effectively solving the hot spot problem. At the same time, the dynamic cooling fins can automatically extend or retract according to the internal temperature of the chassis, increasing the heat dissipation area when running at high loads, and reducing energy consumption and preventing dust accumulation when running at low loads. This dynamic adjustment design breaks through the limitations of traditional fixed heat dissipation structures and significantly improves the adaptability and intelligence level of the heat dissipation system.

[0019] (2) The present invention innovatively arranges brush structures on both sides of the through slot, which work in conjunction with the dynamic fins, effectively solving the problem of dust accumulation on the outside of the heat sink fins affecting the heat dissipation performance. By integrating the telescopic module and the temperature control module inside the top wall of the chassis, the present invention achieves a compact layout and efficient heat dissipation management, while taking into account efficient heat dissipation, dust prevention and noise reduction, and ensuring the long-term stability and reliability of the system. Compared with traditional technologies, the present invention not only completely solves the contradiction between heat dissipation and dust prevention, but also provides an intelligent, efficient and innovative heat dissipation solution for the flight simulation data processing chassis, which has significant technical advantages and practical value. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. Among them:

[0021] Figure 1 It is a three-dimensional diagram of the overall structure of the present invention;

[0022] Figure 2 is a side sectional view of the present invention;

[0023] Figure 3 It is a front cross-sectional view of the present invention;

[0024] Figure 4 For the present invention Figure 2 A schematic diagram of the structure enlargement at the center A;

[0025] Figure 5 For the present invention Figure 3 A schematic diagram of the structure enlarged at B in the middle;

[0026] Figure 6 It is a three-dimensional diagram of the liquid cooling and heat dissipation system of the present invention;

[0027] Figure 7 A three-dimensional diagram of the connection state of the heat pipe and the flow channel of the present invention;

[0028] Figure 8 It is a three-dimensional cross-sectional view of the heat dissipation fin of the present invention;

[0029] Fig. 9 It is a three-dimensional rear cross-sectional view of the chassis of the present invention. DETAILED DESCRIPTION

[0030] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below in conjunction with the accompanying drawings.

[0031] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0032] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The term "in one embodiment" that appears in different places in this specification does not necessarily refer to the same embodiment, nor does it refer to a separate or selective embodiment that is mutually exclusive with other embodiments.

[0033] Example

[0034] Reference Figures 1 to 9 , which is the first embodiment of the present invention, provides a heat dissipation chassis based on flight simulation data processing, including a chassis 100 and a liquid cooling system 200 installed inside the chassis 100. The liquid cooling system 200 solves the problem of internal dust accumulation caused by the vent design in the traditional air cooling method, and significantly improves the heat dissipation efficiency. Combined with the dynamically adjustable heat dissipation fins 204, the liquid cooling system can dynamically adjust the heat dissipation area according to the internal temperature of the chassis, achieve rapid heat dissipation under high load, reduce energy consumption and prevent dust accumulation under low load, thereby optimizing the comprehensive performance of heat dissipation, dust prevention and operation stability.

[0035] Specifically, the front end of the chassis 100 is provided with an installation cavity 101 for accommodating the installation frame 104 and related components, and providing a fixed installation position for the liquid cooling heat dissipation system 200; the rear end of the chassis 100 is provided with a cavity 102 for installing the radiator 202 and related components, and providing space for the movement of the heat dissipation fins 204; the rear wall of the cavity 102 is provided with a through groove 103, which not only allows the rear end of the heat dissipation fins 204 to extend to the outside of the chassis for heat dissipation, but also provides a brush (not described in detail) to The surface of the heat dissipation fin 204 is cleaned to further improve the heat dissipation performance and extend the life of the equipment; a mounting frame 104 is fixedly installed inside the mounting cavity 101, and the mounting frame 104 provides a stable support structure for the heat conducting plate 201 to ensure that heat can be efficiently conducted. At the same time, the front end of the mounting frame 104 is designed to be a position for installing high-heat generating electronic components, so that these components are located just in front of the heat conducting plate 201, which facilitates the direct transfer of heat to the heat conducting plate 201, thereby significantly improving the heat dissipation efficiency and optimizing the utilization of the internal space of the chassis.

[0036] The liquid cooling system 200 includes a heat conducting plate 201 fixedly mounted on the rear wall of the mounting frame 104, which is used to directly contact the high heat area in the chassis and transfer the heat to the radiator 202 through the heat conducting pipe 203; a heat conducting pipe 203 is fixedly mounted inside the heat conducting plate 201, and the heat conducting pipe 203 is filled with coolant. The heat conduction path and contact area are increased through the "S"-shaped design, so that the heat can be efficiently transferred. The output end of the heat conducting pipe 203 passes through the rear wall of the mounting cavity 101 and extends into the cavity 102, and is connected to the radiator 202 fixedly mounted on the front wall of the cavity 102. The radiator 202 further diffuses the heat through the flow channel and the heat dissipation fin structure, and transfers the heat to the heat dissipation fins 204 movably mounted at the rear end. The heat dissipation fins 204 are slidably connected to the surface of the heat dissipation fins, and can be driven by the telescopic module 205 according to the temperature monitored by the temperature control module 206 to achieve dynamic extension or retraction adjustment. The dynamic adjustment of the heat dissipation fins 204 not only improves the heat dissipation efficiency, but also prevents dust accumulation under low load conditions, and cooperates with the brush of the cavity slot 103 to keep the surface clean, thereby optimizing the heat dissipation and dustproof performance of the entire chassis. The telescopic module 205 is fixedly installed in the top wall of the chassis 100, and the precise position control of the heat dissipation fins 204 is achieved through the electric cylinder, while the temperature control module 206 monitors the internal temperature of the chassis in real time, and realizes dynamic control and intelligent heat dissipation management through the microcontroller to ensure the stability and energy efficiency of the chassis operation.

[0037] More specifically, the heat sink 202 includes a mounting shell 202a fixedly mounted on the front wall of the cavity 102. A flow channel 202b is provided at the front end of the mounting shell 202a. The flow channel 202b is used to accommodate the circulation of the coolant. The flow channel 202b is connected to the heat pipe 203 to achieve efficient heat transfer and cyclic heat dissipation. To further improve the heat dissipation efficiency, a heat dissipation fin 202c is fixedly mounted on the outer surface of the flow channel 202b. The heat dissipation fin 202c quickly diffuses the heat transferred from the coolant from the heat pipe 203 to a larger surface area through its high thermal conductivity and large-area fin structure.

[0038] In order to achieve dynamic heat dissipation adjustment, the outer surface of the heat dissipation fin 202c is slidably connected with the heat dissipation fin 204, and the heat dissipation fin 204 can slide on the surface of the heat dissipation fin 202c. The extension or retraction of the heat dissipation fin 204 is achieved by driving the telescopic module 205, and the heat dissipation area is dynamically adjusted to adapt to the temperature change in the chassis 100. The heat dissipation fin 202c is provided with a limiting groove 202c1 inside, and a total of three limiting grooves 202c1 are provided. The limiting block 208 is slidably connected inside, and the limiting block 208 is fixedly connected to the inner wall of the heat dissipation fin 204, ensuring that the heat dissipation fin 204 is in a stable position during the sliding process, and does not deviate or get stuck, further improving the reliability of the heat dissipation system.

[0039] The heat pipe 203 and the flow channel 202b are both in an "S"-shaped curved structure. This design increases the flow path length of the coolant and the contact area with the wall, thereby improving the heat conduction and heat exchange efficiency. The interior of the heat pipe 203 is filled with a coolant with high thermal conductivity. The coolant is driven to circulate in the heat pipe 203 and the flow channel 202b through a micro pump 207 connected to the top and bottom of the heat pipe 203 and the connection between the liquid inlet 202d and the liquid outlet 202e of the flow channel 202b, so as to efficiently transfer the heat generated by the high-heat-generating electronic components in the chassis 100 to the radiator 202.

[0040] A telescopic slot 105 is provided at the top of the cavity 102 for accommodating some components of the telescopic module 205. The telescopic module 205 includes an electric cylinder 205a fixedly mounted on the inner top wall of the chassis 100. A telescopic rod 205b is movably connected inside the electric cylinder 205a. The output end of the telescopic rod 205b passes through the inner wall of the chassis 100 and extends to the telescopic slot 105, where a telescopic plate 205c is fixedly connected thereto. A push plate 205d is fixedly mounted on the bottom end of the telescopic plate 205c. The push plate 205d is fixedly connected to the upper surface of the heat sink fin 204 through a connecting rod 205e. Through the telescopic action of the electric cylinder 205a, the push plate 205d can drive multiple heat sink fins 204 to slide on the surface of the heat sink fin 202c, thereby realizing dynamic adjustment of the heat sink fin 204.

[0041] More specifically, the temperature control module 206 is used to achieve intelligent temperature regulation, which includes a temperature sensor 206a fixedly installed on the top wall of the installation cavity 101. The temperature sensor 206a detects the temperature inside the chassis 100 in real time, and transmits the temperature signal to the microcontroller 206b fixedly installed in the chassis 100 through a wire. The temperature sensor 206a and the microcontroller 206b are electronic components with mature existing technologies, wherein the temperature sensor 206a can be in the form of a thermistor, a thermocouple or a digital temperature sensor, etc., for high-precision monitoring of temperature changes inside the chassis. The microcontroller 206b has data processing and control functions, and has an integrated input and output interface and a control algorithm, which can quickly receive temperature signals and make judgments based on preset temperature threshold logic.

[0042] The microcontroller 206b determines the current temperature condition based on the signal transmitted by the temperature sensor 206a, and sends a control signal to the driving end of the electric cylinder 205a through a wire to adjust the action of the telescopic module 205, thereby driving the heat dissipation fins 204 to extend or retract according to the temperature requirements, thereby dynamically optimizing the heat dissipation performance. In addition, the microcontroller 206b can also cooperate with other temperature control modules to perform multi-point monitoring and linkage control, further improving the intelligence level of the heat dissipation system. The specific structure of the above-mentioned temperature sensor 206a and microcontroller 206b is a prior art and will not be described in detail here to avoid repetition and technical redundancy.

[0043] In addition, in order to keep the surface of the heat sink 204 clean, brushes 106 are installed on the left and right sides of the inner part of the multiple through grooves 103. The cleaning surfaces of the brushes 106 on both sides are in close contact with the outer surface of the heat sink 204, and the heat sink 204 is automatically cleaned when it is extended or retracted, effectively avoiding the decrease in heat dissipation efficiency caused by dust accumulation.

[0044] The plurality of heat dissipation fins 202c, the heat dissipation fins 204, the connecting rods 205e and the through slots 103 are all arranged in a corresponding relationship, the top ends of the plurality of connecting rods 205e are fixedly connected to the bottom surface of the push plate 205d, and the bottom ends are respectively fixedly connected to the upper surfaces of the plurality of heat dissipation fins 204. The heat dissipation fins 204 are respectively slidably connected to the heat dissipation fins 202c through the limit blocks 208, and the rear ends thereof respectively penetrate the through slots 103 and extend to the outside of the chassis 100, thereby realizing dynamic heat dissipation adjustment under multi-point coordinated action.

[0045] Through the above structural design, the present invention realizes an efficient heat dissipation system combining liquid cooling and dynamic heat dissipation. The "S"-shaped design of the heat pipe 203 and the flow channel 202b improves the heat conduction efficiency of the coolant. The dynamically retractable heat dissipation fins 204 cooperate with the temperature control module 206 to intelligently adjust the heat dissipation area according to the temperature demand, and prevent dust accumulation through the brush 106. The overall system has a compact structure and coordinated functions, taking into account heat dissipation efficiency, dustproof performance and system stability, and provides an efficient and reliable heat dissipation solution for flight simulation data processing equipment.

[0046] Importantly, it should be noted that the construction and arrangement of the present application shown in a plurality of different exemplary embodiments are only exemplary. Although only a few embodiments are described in detail in this disclosure, it should be readily understood by those who refer to this disclosure that many modifications are possible (e.g., the size, scale, structure, shape and proportion of various elements, and parameter values ​​(e.g., temperature, pressure, etc.), installation arrangement, use of materials, color, directional changes, etc.) without substantially departing from the novel teachings and advantages of the subject matter described in the application. For example, the element shown as integrally formed can be composed of multiple parts or elements, the position of the element can be inverted or otherwise changed, and the nature or number or position of the discrete element can be changed or changed. Therefore, all such modifications are intended to be included in the scope of the present invention. The order or sequence of any process or method steps can be changed or reordered according to alternative embodiments. In the claims, any "device plus function" clause is intended to cover the structure of performing the function described herein, and is not only structurally equivalent but also equivalent structure. Without departing from the scope of the present invention, other replacements, modifications, changes and omissions can be made in the design, operating conditions and arrangement of the exemplary embodiments. Therefore, the invention is not limited to a specific embodiment, but extends to several modifications still falling within the scope of the appended claims.

[0047] Additionally, in order to provide a concise description of exemplary embodiments, all features of an actual embodiment (ie, those features that are not relevant to the best mode presently contemplated for carrying out the invention or those that are not relevant to implementing the invention) may not be described.

[0048] It will be appreciated that in the development of any actual implementation, as in any engineering or design project, numerous implementation-specific decisions may be made. Such a development effort may be complex and time-consuming, but will be a routine task of design, fabrication, and production for those of ordinary skill having the benefit of this disclosure without undue experimentation.

[0049] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should all be included in the scope of the claims of the present invention.

Claims

1. A heat dissipation chassis based on flight simulation data processing, characterized in that: include, A chassis (100), wherein a mounting cavity (101) is provided at the front end of the chassis (100), a cavity (102) is provided at the rear end of the chassis (100), a through slot (103) is provided on the rear wall of the cavity (102), and a mounting frame (104) is fixedly installed inside the mounting cavity (101); and, The liquid cooling heat dissipation system (200) comprises a heat conducting plate (201) fixedly mounted on the rear wall of the installation frame (104), and also comprises a heat sink (202) fixedly mounted on the front wall of the cavity (102); a heat conducting pipe (203) is fixedly mounted inside the heat conducting plate (201); an output end of the heat conducting pipe (203) passes through the rear wall of the installation cavity (101) and extends into the cavity (102) to communicate with the heat sink (202); and the heat sink ( A heat dissipation fin (204) is movably mounted at the rear end of the chassis (102), and the rear end of the heat dissipation fin (204) passes through the through slot (103) and extends to the outside of the chassis (100), the top end of the heat dissipation fin (204) is transmission-connected to a telescopic module (205), the front end of the telescopic module (205) is provided with a temperature control module (206), and the telescopic module (205) and the temperature control module (206) are both arranged in the top wall of the chassis (100).

2. The heat dissipation chassis based on flight simulation data processing as claimed in claim 1, characterized in that: The heat sink (202) comprises a mounting shell (202a) fixedly mounted on the front wall of the cavity (102); a flow channel (202b) is provided at the front end of the mounting shell (202a); a heat sink fin (202c) is fixedly mounted on the outer surface of the flow channel (202b); and the heat sink fin (204) is slidably connected to the outer surface of the heat sink fin (202c); a liquid inlet (202d) is provided at the top end of the flow channel (202b); a liquid outlet (202e) is provided at the bottom end of the flow channel (202b); and the upper and lower ends of the heat conduction pipe (203) are respectively connected to the liquid inlet (202d) and the liquid outlet (202e) of the flow channel (202b).

3. The heat dissipation chassis based on flight simulation data processing as claimed in claim 2, characterized in that: The heat conducting pipe (203) and the flow channel (202b) both present an "S"-shaped curved structure, and a cooling liquid is provided inside the heat conducting pipe (203). Micro pumps (207) are provided at the connection points between the top and bottom ends of the heat conducting pipe (203) and the liquid inlet (202d) and the liquid outlet (202e) of the flow channel (202b).

4. The heat dissipation chassis based on flight simulation data processing as claimed in claim 3, characterized in that: A telescopic slot (105) is provided at the top of the cavity (102); the telescopic module (205) comprises an electric cylinder (205a) fixedly mounted on the inner top wall of the chassis (100); a telescopic rod (205b) is movably connected to the inside of the electric cylinder (205a); an output end of the telescopic rod (205b) passes through the inner wall of the chassis (100) and extends to the telescopic slot (105) and is fixedly connected to a telescopic plate (205c); a push plate (205d) is fixedly mounted on the bottom end of the telescopic plate (205c); and the bottom end of the push plate (205d) is fixedly connected to the upper surface of the heat dissipation fin (204) via a connecting rod (205e).

5. The heat dissipation chassis based on flight simulation data processing as claimed in claim 4, characterized in that: The temperature control module (206) comprises a temperature sensor (206a) fixedly mounted on the top wall of the mounting cavity (101); the output end of the temperature sensor (206a) is connected to the input end of a microcontroller (206b) fixedly mounted in the chassis (100) via a wire; and the output end of the microcontroller (206b) is connected to the driving end of the electric cylinder (205a) via a wire.

6. The heat dissipation chassis based on flight simulation data processing as claimed in claim 5, characterized in that: The heat dissipation fin (202c) is provided with a limiting groove (202c1) inside, and there are three limiting grooves (202c1) in total. The insides of the three limiting grooves (202c1) are all slidably connected to limiting blocks (208), and the left and right sides of the three limiting blocks (208) are fixedly connected to the inner wall of the heat dissipation fin (204).

7. The heat dissipation chassis based on flight simulation data processing as claimed in claim 6, characterized in that: There are a plurality of heat dissipation fins (202c) in total, and there are also a plurality of heat dissipation fins (204), connecting rods (205e) and through slots (103) correspondingly arranged. The top ends of the plurality of connecting rods (205e) are fixedly connected to the bottom surface of the push plate (205d), and the bottom ends of the plurality of connecting rods (205e) are respectively fixedly connected to the upper surfaces of the plurality of heat dissipation fins (204). The plurality of heat dissipation fins (204) are respectively slidably connected to the plurality of heat dissipation fins (202c) through limit blocks (208), and the rear ends of the plurality of heat dissipation fins (204) respectively pass through the plurality of through slots (103) and extend to the outside of the chassis (100).

8. The heat dissipation chassis based on flight simulation data processing as claimed in claim 7, characterized in that: Brushes (106) are installed on both left and right sides of the through slots (103), and the cleaning surfaces of the brushes (106) on both sides are in close contact with the outer surface of the heat dissipation fins (204).

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