Semiconductor package and electronic device

Abstract

Provided is a semiconductor package in which a substrate is bonded to a support body by an adhesive, in which the adhesive is suppressed from flowing out of a designated region. The semiconductor package includes a substrate, a semiconductor chip, a support, and a first adhesive. In the semiconductor package, a semiconductor chip is placed on a substrate plane of a substrate and electrically connected to the substrate. In addition, in the semiconductor package, a portion of the first adhesive flows into a gap between the substrate plane and the semiconductor chip and bonds the substrate to the support.

Description

Technical Field

[0001] The present technology relates to a semiconductor package, and more particularly to a semiconductor package for bonding a substrate to a support, and an electronic device. Background Art

[0002] Conventionally, adhesives are generally used to seal semiconductor chips in semiconductor packages. For example, a semiconductor package has been proposed in which a semiconductor chip is mounted on a substrate by wire bonding, and when the substrate is bonded to a support, leads and bonding terminals are sealed with an adhesive (for example, see Patent Document 1).

[0003] Reference List

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2012-095177 Summary of the invention

[0006] Problems to be solved by the present invention

[0007] In the above-mentioned prior art, in order to prevent moisture from entering the wiring connection part, the wiring and the bonding terminal are sealed with an adhesive. However, when the semiconductor chip is tilted during bonding, the adhesive may flow out of the predetermined area.

[0008] The present technology has been made in view of such circumstances, and an object of the present technology is to suppress outflow of an adhesive to the outside of a prescribed area of ​​a semiconductor package in which a substrate is bonded to a support member by an adhesive.

[0009] Solution to the problem

[0010] The present technology has been made to solve the above-mentioned problems, and its first aspect is a semiconductor package, which includes: a substrate; a semiconductor chip placed on a substrate flat surface of the substrate and electrically connected to the substrate; a support; and a first adhesive that partially flows into a gap between the substrate flat surface and the semiconductor chip to bond the substrate to the support. Thereby, an effect of suppressing the adhesive from flowing out of a specified area is achieved.

[0011] Furthermore, in the first aspect, the grooves may be formed on the flat surface of the substrate. This brings about an effect that the adhesive flows into the grooves.

[0012] Furthermore, in the first aspect, the trench may be formed on a base material of the substrate. This brings about an effect of forming a deep trench.

[0013] Furthermore, in the first aspect, the groove may be formed by solder resist. This brings about an effect of forming a groove having a complex shape and high precision by photolithography.

[0014] Furthermore, in the first aspect, the groove may include a conductor pattern. This brings about an effect that a groove having a complex shape and high precision can be formed by photolithography.

[0015] Furthermore, in the first aspect, the grooves can be formed by silk screen printing, which brings about the effect of forming the grooves by a simple method.

[0016] Furthermore, in the first aspect, the semiconductor package may further include a die bonding resin containing a filler and bonding the semiconductor chip to the flat surface of the substrate. This has an effect of suppressing the inclination of the semiconductor chip.

[0017] In addition, in the first aspect, the semiconductor package may further include: a second adhesive; and glass, wherein one of the two surfaces of the support body is bonded to the substrate using the first adhesive, and the other surface is bonded to the glass using the second adhesive. This brings about an effect of fixing the glass.

[0018] In addition, in the first aspect, the semiconductor package may further include a silicone resin, the support body may include an opening, protrusions protruding toward the semiconductor chip are formed around the openings on both sides of the support body, and the silicone resin is disposed between the protrusions and the semiconductor chip. This has the effect of suppressing the adhesive from flowing out onto the semiconductor chip.

[0019] Furthermore, in the first aspect, the first slit may be formed on one of the two surfaces of the support member. This brings about an effect of preventing the first adhesive from flowing out.

[0020] Furthermore, in the first aspect, the first slit may include: a plurality of first slit portions parallel to or perpendicular to the side of the support member; and a plurality of second slit portions formed in an inclined direction. This brings about an effect of preventing the first adhesive from flowing out.

[0021] In the first aspect, a second slit may be formed on the other of the two surfaces of the support body. This has the effect of suppressing outflow of the second adhesive.

[0022] In the first aspect, a through hole may be formed in the support body, which has the effect of suppressing the first and second adhesives from flowing out.

[0023] In addition, a second aspect of the present technology is an electronic device including: a substrate; a semiconductor chip placed on a substrate flat surface of the substrate and electrically connected to the substrate; a support member; a first adhesive partially flowing into a gap between the substrate flat surface and the semiconductor chip to bond the substrate to the support member; and an optical portion guiding light to the semiconductor chip. Thus, an effect of suppressing the adhesive from flowing out of a specified area of ​​the electronic device is exerted. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 is a block diagram showing a configuration example of an electronic device according to a first embodiment of the present technology.

[0025] Figure 2 is an example of a cross-sectional view of a semiconductor package according to the first embodiment of the present technology.

[0026] Figure 3 It is a view for explaining the effect of providing the groove of the semiconductor package according to the first embodiment of the present technology.

[0027] Figure 4 are examples of a top view and a cross-sectional view of a substrate in which a through hole is formed according to the first embodiment of the present technology.

[0028] Figure 5 are examples of a top view and a cross-sectional view of a substrate having a groove formed thereon according to the first embodiment of the present technology.

[0029] Figure 6 are examples of a top view and a cross-sectional view of a substrate coated with a die bonding resin according to the first embodiment of the present technology.

[0030] Figure 7 are examples of top views and cross-sectional views of a semiconductor package in which a sensor chip according to the first embodiment of the present technology is die-bonded.

[0031] Figure 8 are examples of top views and cross-sectional views of a semiconductor package on which wire bonding is performed according to the first embodiment of the present technology.

[0032] Fig. 9 are examples of a bottom view and a cross-sectional view of a support member to which an adhesive is applied according to the first embodiment of the present technology.

[0033] Fig.10 are examples of a top view and a cross-sectional view of a semiconductor package on which a support member is placed according to the first embodiment of the present technology.

[0034] Fig.11are examples of top views and cross-sectional views of a semiconductor package in which a substrate is pressure-contacted according to a first embodiment of the present technology.

[0035] Fig.12 are examples of top views and cross-sectional views of a semiconductor package to which glass according to the first embodiment of the present technology is bonded.

[0036] Fig.13 is a flowchart showing an example of a method for manufacturing a semiconductor package according to the first embodiment of the present technology.

[0037] Fig.14 It is a diagram for explaining a method of forming a groove having a solder resist according to the first embodiment of the present technology.

[0038] Fig.15 It is a diagram for explaining a method of forming a groove by a conductor pattern according to the first embodiment of the present technology.

[0039] Fig.16 It is a diagram for explaining a method of forming a groove by grinding a substrate according to the first embodiment of the present technology.

[0040] Fig.17 is an example of a cross-sectional view of a semiconductor package according to a second embodiment of the present technology.

[0041] Fig.18 is an example of a top view and a cross-sectional view of a substrate in which a through hole is formed according to a second embodiment of the present technology.

[0042] Fig.19 is an example of a top view and a cross-sectional view of a substrate coated with a die bonding resin according to the second embodiment of the present technology.

[0043] Fig. 20 are examples of top views and cross-sectional views of a semiconductor package in which a sensor chip is die-bonded according to a second embodiment of the present technology.

[0044] Fig.21 is an example of a top view and a cross-sectional view of a substrate according to a third embodiment of the present technology.

[0045] Fig. 22 are examples of top views and cross-sectional views of a semiconductor package according to a third embodiment of the present technology.

[0046] Fig.23 are examples of cross-sectional views and enlarged views of a semiconductor package according to a fourth embodiment of the present technology.

[0047] Fig.24is an example of a bottom view and a cross-sectional view of a support member to which an adhesive is applied according to a fourth embodiment of the present technology.

[0048] Fig.25 is an example of a bottom view and a cross-sectional view of a carrier coated with silicone resin according to a fourth embodiment of the present technology.

[0049] Fig.26 It is a diagram showing an example of the shape of a protrusion according to a fourth embodiment of the present technology.

[0050] Fig. 27 : is a diagram for explaining a method for curing a silicone resin according to a fourth embodiment of the present technology.

[0051] Fig.28 are examples of top views and bottom views of a support member according to a fifth embodiment of the present technology.

[0052] Fig.29 is an example of a bottom view and a cross-sectional view of a support member coated with an adhesive according to a fifth embodiment of the present technology.

[0053] Fig.30 is an example of a top view and a cross-sectional view of a semiconductor package where a support member is placed according to a fifth embodiment of the present technology.

[0054] Fig.31 are examples of top views and cross-sectional views of a semiconductor package in which a substrate is pressure-contacted according to a fifth embodiment of the present technology.

[0055] Fig.32 1 is an example of a top view and a cross-sectional view of a semiconductor package to which glass is bonded according to a fifth embodiment of the present technology.

[0056] Fig.33 is a plan view showing another pattern of slits in the lower surface of the support according to the fifth embodiment of the present technology.

[0057] Fig.34 is a plan view showing a pattern of grooves on the upper surface of a substrate according to a fifth embodiment of the present technology.

[0058] Fig.35 It is an example of a top view and a bottom view of a support member in a modification example of the fifth embodiment of the present technology.

[0059] Fig.36 is an example of a cross-sectional view of a semiconductor package 200 according to a modified example of the fifth embodiment of the present technology.

[0060] Fig.37 is a block diagram showing a schematic configuration example of a vehicle control system.

[0061] Fig.38 It is an explanatory diagram showing an example of the installation position of the imaging section. DETAILED DESCRIPTION

[0062] Hereinafter, modes for carrying out the present technology (hereinafter referred to as embodiments) will be described.

[0063] The explanation will be given in the following order.

[0064] 1. First Embodiment (Example of Forming a Groove in a Substrate)

[0065] 2. Second Embodiment (Example of Using Die Bonding Resin Containing Filler)

[0066] 3. Third Embodiment (Example in which a groove is formed in a substrate and a die bonding resin containing a filler is used)

[0067] 4. Fourth Embodiment (Example in which Grooves are Formed in a Substrate and Protrusions are Formed in a Support Member)

[0068] 5. Fifth Embodiment (Example of Forming Grooves in a Substrate and Forming Slits in a Support Member)

[0069] 6. Application examples for mobile objects

[0070] <1. First Embodiment>

[0071] [Configuration example of electronic device]

[0072] Figure 1 1 is a block diagram showing a configuration example of an electronic device 100 according to a first embodiment of the present technology. The electronic device 100 is a device for capturing image data, and includes an optical unit 110, a sensor chip 230, and a digital signal processing (DSP) circuit 120. The electronic device 100 also includes a display unit 130, an operation unit 140, a bus 150, a frame memory 160, a storage unit 170, and a power supply unit 180. For example, the electronic device 100 is assumed to be a digital camera such as a digital still camera, a smartphone, a personal computer, a car camera, etc.

[0073] The optical unit 110 collects light from the object and guides the light to the sensor chip 230. The sensor chip 230 generates image data by photoelectric conversion in synchronization with a vertical synchronization signal. Here, the vertical synchronization signal is a periodic signal of a predetermined frequency indicating imaging timing. The sensor chip 230 provides the generated image data to the DSP circuit 120. The sensor chip 230 is, for example, a CMOS image sensor (CIS).

[0074] The DSP circuit 120 performs predetermined signal processing on the image data from the sensor chip 230. The DSP circuit 120 outputs the processed image data to the frame memory 160 or the like via the bus 150.

[0075] The display unit 130 displays image data. The display unit 130 is assumed to be, for example, a liquid crystal panel or an organic electroluminescence (EL) panel. The operation unit 140 generates an operation signal according to a user's operation.

[0076] The bus 150 is a common path through which the optical unit 110 , the sensor chip 230 , the DSP circuit 120 , the display unit 130 , the operation unit 140 , the frame memory 160 , the storage unit 170 , and the power supply unit 180 exchange data with one another.

[0077] The frame memory 160 holds image data. The storage unit 170 stores various data such as image data. The power supply unit 180 supplies power to the sensor chip 230, the DSP circuit 120, the display unit 130, and the like.

[0078] In the above configuration, for example, the sensor chip 230 is mounted in a semiconductor package.

[0079] [Configuration example of semiconductor package]

[0080] Figure 2 is an example of a cross-sectional view of a semiconductor package 200 according to a first embodiment of the present technology. The semiconductor package 200 includes a glass 210, a support 220, a sensor chip 230, and a substrate 240. In the drawings, arrows indicate incident directions of incident light from an optical unit 110 (not shown).

[0081] Hereinafter, an axis parallel to the optical axis is defined as a Z axis, and a predetermined axis perpendicular to the Z axis is defined as an X axis. An axis perpendicular to the X axis and the Z axis is defined as a Y axis. In addition, a direction toward the optical unit 110 is defined as an upward direction. The accompanying drawings are cross-sectional views when viewed from the Y axis direction.

[0082] The sensor chip 230 is placed on the chip mounting area on the upper surface of the substrate 240 and bonded by a die bond resin (not shown). In addition, the sensor chip 230 is electrically connected to the substrate 240 by a wire 261 such as Au (gold). In the figure, coordinates X2 and X5 represent the coordinates of the left and right ends of the chip mounting area. In addition, a light receiving portion 231 in which a plurality of pixels are arranged is provided on the upper surface (in other words, light receiving surface) of the sensor chip 230. Note that the sensor chip 230 is an example of a semiconductor chip described in the claims.

[0083] In addition, a through hole penetrating the substrate 240 is formed in the central portion of the substrate flat surface of the substrate 240. In the figure, X3 and X4 represent the coordinates of the left and right ends of the through hole. By forming the through hole, gas is exhausted from the through hole when the substrate 240 is bonded, and the generation of voids can be prevented.

[0084] Then, grooves are formed in the path from the outside of the chip mounting area to the through hole on the upper surface of the substrate 240. In the figure, grooves are formed in the path from coordinate X1 to coordinate X3 and in the path from coordinate X4 to coordinate X6. These grooves cause steps at coordinates X1 and X6.

[0085] The support 220 is a frame-shaped member for supporting the glass 210. The glass 210 is bonded to the upper surface of the support 220 with an adhesive 252. In addition, the adhesive 251 bonds the substrate 240 on which the sensor chip 230 is mounted to the support 220, and the wire 261 and its periphery. Note that the adhesive 251 is an example of the first adhesive described in the claims, and the adhesive 252 is an example of the second adhesive described in the claims.

[0086] Figure 3 It is a view for explaining the effect of providing the groove of the semiconductor package according to the first embodiment of the present technology.

[0087] Here, a configuration in which no groove is formed on the upper surface of the substrate 240 is assumed as a comparative example. In the figure, a represents a cross-sectional view of the comparative example. As described above, the substrate 240 on which the sensor chip 230 is mounted is bonded to the support 220 by an adhesive 251. During this bonding, the sensor chip 230 may be tilted relative to the flat surface of the substrate due to changes in equipment accuracy, flatness of the substrate 240, physical properties of the resin, etc. When the sensor chip 230 is tilted, the gap between the sensor chip 230 and the substrate 240 also changes. If the gap is too narrow, the adhesive 251 may flow out to the outside of the specified area (outside the semiconductor package 200 and the light receiving part 231) in the comparative example. Alternatively, a gap may be generated in the adhesive 251. The portion surrounded by the dotted line a in the figure represents a portion where the adhesive 251 flows out of the specified area or a portion where a gap is generated.

[0088] On the other hand, in the case where a groove is formed on the upper surface of the substrate 240 as exemplified in b in the figure, even if the sensor chip 230 is tilted during bonding, a sufficient gap can be stably ensured between the sensor chip 230 and the substrate 240. Since a portion of the adhesive 251 easily flows into the gap, it is possible to suppress the adhesive from flowing out of the designated area and the generation of voids. By preventing the outflow, a small semiconductor package 200 and an electronic device 100 can be easily realized.

[0089] [Method for manufacturing a semiconductor package]

[0090] Next, we will refer to Figures 4 to 12 A method for manufacturing the semiconductor package 200 is described.

[0091] Figure 4 1 is an example of a top view and a cross-sectional view of a substrate 240 in which a through hole is formed according to the first embodiment of the present technology. In the drawings, a shows a top view of the substrate 240, and b shows a cross-sectional view of the substrate 240 when cut along the thick dashed line of a in the drawing. In the drawings, c shows a cross-sectional view of the substrate 240 when cut along the dot-dash line of a in the drawing.

[0092] Furthermore, when viewed from above, the substrate 240 is rectangular, and Figure 4 The thick dashed lines in a are drawn along the diagonals of the rectangle. The axes parallel to the diagonals correspond to Figure 1 The X-axis in . Figure 4 The dot-dash line of a in FIG. 2 is drawn parallel to one side of the substrate 240, and the axis parallel to the side is defined as the x-axis. An axis perpendicular to the x-axis and the z-axis is defined as the y-axis. Similarity applies to subsequent drawings.

[0093] As shown in a of the drawing, a through hole 243 is formed at the center of the upper surface of the substrate 240. In addition, a predetermined number of terminals 241 are arranged around a chip mounting region 242 surrounded by a thin dotted line.

[0094] Figure 5 2 is an example of a top view and a cross-sectional view of a substrate 240 in which a groove 244 is formed according to the first embodiment of the present technology. In the drawings, a shows a top view of the substrate 240, and b shows a cross-sectional view of the substrate 240 when cut along the thick dashed line of a in the drawing. In the drawings, c shows a cross-sectional view of the substrate 240 when cut along the dot-dash line of a in the drawing.

[0095] As shown in a in the figure, after the through hole 243 is formed, the groove 244 is formed along the diagonal line in the path from the outside of the chip mounting area 242 to the through hole 243. The details of the method for forming the groove 244 will be described later. Note that although the groove 244 is formed to have a cross shape along the diagonal line, the shape of the groove 244 is not limited to the shape shown in the figure as long as a sufficient gap can be ensured.

[0096] As shown in b in the figure, the groove 244 generates a step in the XZ cross section. On the other hand, as shown in c in the figure, since there is no groove 244 in the XZ cross section, no step is generated.

[0097] Figure 61 is an example of a top view and a cross-sectional view of a substrate 240 coated with a die bonding resin 253 according to the first embodiment of the present technology. In the drawings, a shows a top view of the substrate 240, and b shows a cross-sectional view of the substrate 240 when cut along the thick dashed line of a in the drawing. In the drawings, c shows a cross-sectional view of the substrate 240 when cut along the dot-dash line of a in the drawing.

[0098] As shown in a of the figure, after the groove 244 is formed, the inside of the chip mounting area 242 is coated with a die bonding resin 253. The die bonding resin 253 does not contain a filler described later.

[0099] As shown in Figures a, b and c, the die bonding resin 253 is applied while avoiding the trench 244.

[0100] Figure 7 1 is an example of a top view and a cross-sectional view of a semiconductor package 200 to which a sensor chip 230 according to the first embodiment of the present technology is die-bonded. In the drawings, a shows a top view of the semiconductor package 200, and b shows a cross-sectional view of the semiconductor package 200 when cut along the thick dashed line of a in the drawing. In the drawings, c shows a cross-sectional view of the semiconductor package 200 when cut along the dot-dash line of a in the drawing.

[0101] As shown in c in the figure, after the die bonding resin 253 is applied, the sensor chip 230 is placed on the chip mounting area 242 and die bonding is performed.

[0102] Figure 8 1 is an example of a top view and a cross-sectional view of a semiconductor package 200 on which wire bonding is performed according to the first embodiment of the present technology. In the drawings, a shows a top view of the semiconductor package 200, and b shows a cross-sectional view of the semiconductor package 200 when cut along the thick dashed line of a in the drawing. In the drawings, c shows a cross-sectional view of the semiconductor package 200 when cut along the dot-dash line of a in the drawing.

[0103] As shown in a and c in the figure, the sensor chip 230 and the substrate 240 are electrically connected by a wire 261. That is, wire bonding is performed. The substrate 240 on which the sensor chip 230 is mounted by wire bonding as described above is hereinafter referred to as a "substrate with a sensor chip".

[0104] Fig. 9 is an example of a bottom view and a cross-sectional view of a support member 220 to which an adhesive 251 according to the first embodiment of the present technology is applied. In the drawings, a shows a bottom view of the support member 220 , and b shows a cross-sectional view of the support member 220 .

[0105] As illustrated in a of the drawings, the support 220 is a frame-shaped member having a rectangular opening. Adhesive 251 is applied so as to surround the opening. This process is performed by vertically inverting the support 220. In addition, Fig. 9 The processing shown can be combined with Figures 4 to 8 The processing shown can be performed in parallel or in Figure 8 Then execute.

[0106] Fig.10 2 is an example of a top view and a cross-sectional view of a semiconductor package 200 on which a support member 220 is placed according to a first embodiment of the present technology. In the drawings, a shows a top view of the semiconductor package 200, and b shows a cross-sectional view of the semiconductor package 200 when cut along a thick dashed line in the drawing. In the drawings, c shows a cross-sectional view of the semiconductor package 200 when cut along a dashed line in the drawing.

[0107] As shown in a, b and c, after applying the adhesive 251, the support 220 is placed on the substrate 240 with the sensor chip. Then, the support 220 is aligned so that the light receiving portion 231 of the sensor chip 230 is located in the opening of the support 220.

[0108] Note that in this figure, for ease of description, parts with the same pattern are generated, but for parts with the same pattern, the same material is not necessarily used. For example, although the support member 220 and the die bonding resin 253 in c in the figure have the same pattern, the materials used are different. Similarity applies to the following figures.

[0109] Fig.11 1 is an example of a top view and a cross-sectional view of a semiconductor package 200 in which a substrate 240 is crimped according to the first embodiment of the present technology. In the drawings, a shows a top view of the semiconductor package 200, and b shows a cross-sectional view of the semiconductor package 200 when cut along the thick dashed line of a in the drawing. In the drawings, c shows a cross-sectional view of the semiconductor package 200 when cut along the dot-dash line of a in the drawing.

[0110] As shown in a, b, and c in the figure, after alignment, the substrate 240 with the sensor chip is in pressure contact with the support member 220. At this time, since the adhesive 251 that flows by being crushed also flows into the groove 244, outflow from the adhesive 251 to the outside of the semiconductor package 200 or to unnecessary parts such as the light receiving part 231 is suppressed. The thick dotted line in a in the figure indicates the boundary of the expansion area of ​​the adhesive 251. As particularly illustrated by the inner dotted line, a part of the adhesive 251 also flows into the gap between the sensor chip 230 and the substrate 240.

[0111] Fig.121 is an example of a top view and a cross-sectional view of a semiconductor package 200 bonded to a glass 210 according to a first embodiment of the present technology. In the drawings, a shows a top view of the semiconductor package 200, and b shows a cross-sectional view of the semiconductor package 200 when cut along a thick dashed line in the drawing. In the drawings, c shows a cross-sectional view of the semiconductor package 200 when cut along a dashed line in the drawing.

[0112] As shown in a, b and c, after the substrate 240 with the sensor chip is crimped, an adhesive 252 is applied to the upper surface of the support 220 and the glass 210 is bonded. Figure 2 The semiconductor package 200 shown in FIG. Figures 4 to 12 obtained through process.

[0113] Fig.13 1 is a flowchart showing an example of a method for manufacturing a semiconductor package 200 according to the first embodiment of the present technology. The manufacturing system of the semiconductor package 200 forms a through hole in the substrate 240 (step S901) and forms a groove (step S902). Then, the manufacturing system applies a die bonding resin to the substrate 240 (step S903), and performs die bonding (step S904) and wire bonding (step S905) of the sensor chip 230.

[0114] Furthermore, the manufacturing system applies an adhesive to the support member 220 (step S906 ), places the support member 220 on the substrate 240 using the sensor chip, and performs alignment (step S907 ).

[0115] Then, the manufacturing system brings the substrate 240 with the sensor chip into pressure contact with the support 220 (step S908 ), bonds the glass 210 (step S909 ), and ends the manufacturing process.

[0116] Next, refer to Figure 14-16 A method for forming the groove 244 will be described.

[0117] Fig.14 It is a diagram for explaining a method of forming the groove 244 with the solder resist according to the first embodiment of the present technology.

[0118] For example, as shown in a of the drawing, a conductor 245 is formed on the upper surface of a substrate 240, and a solder resist 246 is applied. At least a portion of the conductor 245 is electrically connected and used as a wiring. A portion of the conductor 245 may be used as a ground.

[0119] Then, as illustrated in b in the figure, a pattern of the solder resist 246 is formed by photolithography. Thus, the groove 244 is formed. In the case where the solder resist 246 on the wiring is patterned, a step of about 5 to 10 micrometers (μm) can be formed generally.

[0120] As described above, in the method of forming the groove 244 by the solder resist 246, there is no need to add a new process because the solder resist 246 is a component that originally exists for wiring protection and insulation of the surface of the substrate 240. In addition, since the pattern is formed by photolithography, this method has high accuracy and freedom in position and shape, and is suitable for the case where a step requires a complex shape and high accuracy.

[0121] Note that, as shown in c in the figure, the groove 244 can be further provided by further forming the solder resist 247 in an overlapping manner after a in the figure. Therefore, the groove 244 can be formed without providing design restrictions while avoiding exposure of the conductor 245.

[0122] In addition to the method shown in the figure, the groove 244 can also be formed by a conductor pattern.

[0123] Fig.15 It is a view for explaining a method of forming the groove 244 by the conductor pattern according to the first embodiment of the present technology.

[0124] For example, as shown in a of the drawing, a conductor 245 is formed on the upper surface of a substrate 240, and a solder resist 246 is applied.

[0125] Then, as illustrated in b of the figure, a pattern of the solder resist 246 is formed by photolithography.

[0126] In addition, as shown in c in the figure, a pattern of the conductor 245 is formed by photolithography. At least a portion of the pattern of the conductor 245 is electrically connected and serves as a wiring pattern. In addition, the groove 244 is formed by the pattern of the conductor 245.

[0127] As described above, in the method of forming groove 244 using conductor pattern, because surface wiring is the component that exists originally, there is no need to add new process. In addition, since the pattern is formed by photolithography, this method has high precision and freedom in position and shape, and is suitable for the case where the step requires complex shape and high precision.

[0128] Apart from Fig.14 and 15 In addition to the method shown, the trench 244 may also be formed by grinding the substrate 240 .

[0129] Fig.162 is a diagram for explaining a method of forming a groove 244 by grinding a substrate 240 according to the first embodiment of the present technology.

[0130] For example, as shown in a of the drawing, a conductor 245 is formed on the upper surface of a substrate 240, and a solder resist 246 is applied.

[0131] Then, as shown in b in the figure, a pattern of the solder resist 246 is formed. Furthermore, a pattern of the conductor 245 is formed as exemplified in c in the figure.

[0132] Subsequently, as shown in d of the drawing, a portion of the upper surface of the substrate 240 is grounded by a routing process or the like to form a trench 244 .

[0133] As described above, the method of forming the groove 244 by grinding the substrate 240 is suitable for the case of forming a relatively deep step such as 0.1 millimeter (mm) or more because mechanical grinding is performed.

[0134] Note that except Figures 14 to 16 In addition to the method shown, the groove 244 can also be formed by silk printing.

[0135] As described above, according to the first embodiment of the present technology, since the groove 244 is formed in the substrate 240, the adhesive 251 can be suppressed from flowing out to the outside of the specified area when the substrate 240 with the sensor chip is bonded. In addition, the generation of voids can also be suppressed.

[0136] <2. Second Embodiment>

[0137] In the above-described first embodiment, the groove 244 is formed on the upper surface of the substrate 240 to suppress outflow from the adhesive 251, but with this configuration, it is difficult to prevent the sensor chip 230 from tilting. The semiconductor package 200 according to the second embodiment is different from the semiconductor package of the first embodiment in that the sensor chip 230 and the substrate 240 are bonded by a die bonding resin containing a filler.

[0138] Fig.17 is an example of a cross-sectional view of a semiconductor package 200 according to a second embodiment of the present technology. Fig.17 The semiconductor package 200 of the second embodiment is different from the semiconductor package of the first embodiment in that the groove 244 is not formed on the upper surface of the substrate 240, and a die bonding resin 270 containing a filler 271 is used instead of a die bonding resin 253 not containing a filler.

[0139] Next, we will refer to Figures 18 to 20 A method for manufacturing the semiconductor package 200 of the second embodiment is described.

[0140] Fig.18 2 is an example of a top view and a cross-sectional view of a substrate 240 in which a through hole 243 is formed according to a second embodiment of the present technology. In the drawings, a shows a top view of the substrate 240, and b shows a cross-sectional view of the substrate 240 when cut along the thick dashed line of a in the drawing. In the drawings, c shows a cross-sectional view of the substrate 240 when cut along the dashed line of a in the drawing.

[0141] As shown in a, b, and c in the figure, through holes 243 and terminals 241 are formed in the same manner as in the first embodiment.

[0142] Fig.19 2 is an example of a top view and a cross-sectional view of a substrate coated with a die bonding resin 270 according to a second embodiment of the present technology. In the drawings, a shows a top view of the substrate 240, and b shows a cross-sectional view of the substrate 240 when cut along a thick dashed line in the drawing. In the drawings, c shows a cross-sectional view of the substrate 240 when cut along a dashed line in the drawing.

[0143] As shown in a and b of the drawings, a die bonding resin 270 in which the maximum diameter of a filler 271 is controlled to a predetermined size is applied in the chip mounting region 242 .

[0144] Fig. 20 2 is an example of a top view and a cross-sectional view of a semiconductor package 200 to which a sensor chip 230 according to a second embodiment of the present technology is die-bonded. In the drawings, a shows a top view of the semiconductor package 200, and b shows a cross-sectional view of the semiconductor package 200 when cut along the thick dashed line of a in the drawing. In the drawings, c shows a cross-sectional view of the semiconductor package 200 when cut along the dot-dash line of a in the drawing.

[0145] As shown in a in the figure, after the die bonding resin 270 is applied, the sensor chip 230 is placed on the chip mounting area 242 and the die is bonded. At this time, the die bonding resin 270 is not squeezed to a diameter smaller than the filler diameter by the filler 271 in the die bonding resin 270. Therefore, it is possible to suppress the sensor chip 230 from tilting in the subsequent pressing process. In addition, a gap equal to or larger than the filler diameter can be ensured between the sensor chip 230 and the substrate 240. As a result, it is possible to suppress the outflow from the adhesive 251 to the outside of the specified area and the generation of voids.

[0146] Similarly to the second embodiment, Fig. 20After the process shown in , as in the first embodiment, the processes of wire bonding, application of adhesive 251, alignment, pressure contact, and adhesion of glass are performed. These processes are the same as those in the first embodiment, and thus illustration is omitted.

[0147] As described above, according to the second embodiment of the present technology, since the sensor chip 230 and the substrate 240 are bonded by the die bonding resin 270 containing the filler 271, the sensor chip 230 can be suppressed from tilting. In addition, the adhesive 251 can be suppressed from flowing out of the designated area and the generation of voids.

[0148] <3. Third Embodiment>

[0149] In the above-mentioned second embodiment, the gap is ensured by the die bonding resin 270 containing the filler 271, but in this configuration, it is difficult to further increase the volume of the gap. The semiconductor package 200 according to the third embodiment is different from the semiconductor package of the second embodiment in that the groove 244 is formed in the substrate 240.

[0150] Fig.21 2 is an example of a top view and a cross-sectional view of a substrate 240 according to a third embodiment of the present technology. In the drawings, a shows a top view of the substrate 240, and b shows a cross-sectional view of the substrate 240 when cut along the thick dashed line of a in the drawing. In the drawings, c shows a cross-sectional view of the substrate 240 when cut along the dashed line of a in the drawing.

[0151] As shown in a of the figure, a groove 244 is formed on the upper surface of the substrate 240. Unlike the first embodiment, the groove 244 is formed in a + shape along the x-axis direction and the y-axis direction.

[0152] The volume of the gap between the sensor chip 230 and the substrate 240 can be further increased by combining the groove 244 and the die bonding resin 270 containing the filler 271. Note that the layout and shape of the groove 244 on the flat surface of the substrate can be appropriately changed in consideration of the arrangement of the terminal 241, the position where the adhesive 251 easily flows out, etc.

[0153] Furthermore, the depth of the trench 244 is preferably greater than the diameter of the filler 271 in the die bonding resin 270 .

[0154] Fig. 22 1 is an example of a top view and a cross-sectional view of a semiconductor package 200 according to a third embodiment of the present technology. In the accompanying drawings, a shows a top view of the semiconductor package 200, and b shows a cross-sectional view of the semiconductor package 200 when cut along the thick dashed line of a in the figure. In the accompanying drawings, c shows a cross-sectional view of the semiconductor package 200 when cut along the dot-dash line of a in the figure.

[0155] As shown in b and c of the drawings, a groove 244 and a die bonding resin 270 including a filler 271 are provided.

[0156] As described above, according to the third embodiment of the present technology, since the groove 244 and the die bonding resin 270 including the filler 271 are used, the volume of the gap between the sensor chip 230 and the substrate 240 can be further increased.

[0157] <4. Fourth Embodiment>

[0158] In the first embodiment described above, the groove 244 suppresses the adhesive 251 from flowing out of the designated area, but in this configuration, the adhesive 251 may flow out to the light receiving portion 231 according to various conditions. The semiconductor package 200 according to the fourth embodiment is different from the semiconductor package of the first embodiment in that a protruding portion is provided on the support member 220 and silicone resin is filled between the protruding portion and the sensor chip 230.

[0159] Fig.23 1 is an example of a cross-sectional view and an enlarged view of a semiconductor package 200 according to a fourth embodiment of the present technology. In the figure, a shows a cross-sectional view of the semiconductor package 200, and b shows an enlarged view in which a thick frame in a is enlarged.

[0160] As shown in a and b in the figure, the support member 220 of the fourth embodiment is different from the support member of the first embodiment in that the protrusion protruding toward the sensor chip 230 is formed around the opening on the lower surface. In the figure, the X7 and X8 coordinates are the coordinates of the left and right ends of the protrusion, and the Z1 and Z2 coordinates are the coordinates of the upper and lower ends of the protrusion. In addition, the silicone resin 254 is filled between the protrusion and the sensor chip 230. The protrusion and the silicone resin 254 can physically prevent the adhesive 251 from flowing out to the upper surface of the sensor chip 230. In addition, by using the silicone resin 254 for preventing outflow, the chip can be prevented from being damaged even when the resin itself contacts the sensor chip 230.

[0161] Fig.24 2 is an example of a bottom view and a cross-sectional view of a support member 220 to which an adhesive 251 according to a fourth embodiment of the present technology is applied. In the drawings, a shows a bottom view of the support member 220, and b shows a cross-sectional view of the support member 220. In addition, in the fourth embodiment, the adhesive 251 is applied similarly to the first embodiment.

[0162] Note that the processing up to wire bonding in the fourth embodiment is similar to that in the first embodiment.

[0163] Fig.25is an example of a bottom view and a cross-sectional view of a support 220 coated with a silicone resin 254 according to a fourth embodiment of the present technology. In the drawings, a shows a bottom view of the support 220 , and b shows a cross-sectional view of the support 220 .

[0164] As shown in a and b in the figure, silicone 254 is applied to the protruding portion of the support 220. Here, as shown in a in the figure, a protrusion is formed along the side to surround the opening of the support 220, but there is no protrusion on a part of the periphery of the opening, and the silicone 254 is not applied, and this part is a slit 225. When the substrate 240 is bonded, the generation of voids can be suppressed by exhausting gas through the slit 225 of the support 220 and the through hole 243 of the substrate 240. The slit 225 is preferably provided at two or more positions.

[0165] Fig.26 1 is a diagram showing an example of the shape of a protrusion according to a fourth embodiment of the present technology. As shown in a in the figure, the cross-sectional shape of the protrusion is, for example, a rectangle.

[0166] Note that the cross-sectional shape of the protrusion is not limited to a rectangular shape, and may be a semi-elliptical shape as exemplified by b in the figure. Alternatively, as shown in c in the figure, the cross-sectional shape of the protrusion may be a stepped shape.

[0167] Fig. 27 dZ is a diagram for explaining a method of curing the silicone resin 254 according to the fourth embodiment of the present technology. The gap between the projection and the lower surface of the sensor chip 230 at the end of curing is represented by dZ.

[0168] For example, as shown in a in the figure, the silicone resin 254 is applied at substantially the same height as dZ, and after the sensor chip 230 is placed, the silicone resin 254 is finally cured by ultraviolet rays, heating, a curing agent, or the like.

[0169] Alternatively, as shown in b in the figure, a silicone resin 254 having a higher value than dZ may be applied and temporarily cured, and as shown in c in the figure, the sensor chip 230 may be completely cured after the sensor chip 230 is placed. For example, in the case where the silicone resin 254 is reduced during the main curing, a two-stage curing method is used.

[0170] Note that the fourth embodiment can also be applied to the second and third embodiments.

[0171] As described above, according to the fourth embodiment of the present technology, since the protrusion is formed in the support member 220 and the silicone resin 254 is provided between the protrusion and the sensor chip 230 , it is possible to reliably prevent the adhesive 251 from flowing out to the sensor chip 230 .

[0172] <5. Fifth embodiment>

[0173] In the first embodiment described above, the groove 244 is provided in the substrate 240 to suppress the outflow of the adhesive 251, but when the amount of the adhesive 251 exceeds the expected amount, there is a possibility that the outflow cannot be sufficiently suppressed. The semiconductor package 200 of the fifth embodiment is different from the semiconductor package of the first embodiment in that the slit is provided in the support member 220.

[0174] Fig.28 1 is an example of a top view and a bottom view of a support member 220 according to a fifth embodiment of the present technology. In the drawings, a is an example of a top view of a support member 220, and b in the drawings is an example of a bottom view of a support member 220.

[0175] As illustrated in a of the figure, the support member 220 of the fifth embodiment is different from the support member of the first embodiment in that a slit 222 is formed on the upper surface. Note that the slit 222 is an example of a second slit described in the claims of the present disclosure.

[0176] In addition, as shown in b in the figure, the support member 220 of the fifth embodiment is different from the support member of the first embodiment in that a slit 221 is formed on the lower surface. The shape of the slit 221 is a shape in which the portions formed at the four corners in the inclined direction and the portions formed parallel to the side of the support member 220 are connected. The portion surrounded by the thick dotted line b in the figure represents the slit portion in the inclined direction. Note that the slit 221 is an example of the first slit described in the claim of the present disclosure.

[0177] The shapes of the slits 221 and 222 are not particularly limited and may be any shape that can be formed by processing. By providing the slits 221 on the lower surface of the support 220, a portion of the adhesive 251 that wet-spreads during pressure contact is captured and is not guided by the slits 221 to protrude from the support 220. In addition, by providing the slits 222 on the upper surface of the support 220, when the glass 210 is bonded to the support 220, excess adhesive 252 is captured and does not protrude to an unnecessary portion.

[0178] Furthermore, as will be described later, through holes may be provided in the support member 220 instead of the slits 221 and 222 .

[0179] The cross-sectional shape of the slits 221 and 222 and the through hole may be, for example, linear, but preferably trapezoidal, and preferably has a structure that allows the gas generated during bonding to be discharged and squeezed out. As a result, the generation of voids in the adhesives 251 and 252 can be suppressed.

[0180] In addition, a concave portion having a predetermined area may be formed as a portion of the resin reservoir area or the through hole in the slits 221 and 222. Thus, in the case where the adhesive 251, 252 is excessive, the resin attachment area can function as a buffer.

[0181] In addition, the slits 221 and 222 do not penetrate the support member 220 in a and b of the drawings, but these slits may penetrate the support member 220. In addition, the number of slits is not limited as long as mechanical processing is possible.

[0182] In addition, slits 221 and 222 are formed as openings surrounding the support member 220 as exemplified in a and b of the drawings.

[0183] In addition, as will be described later, through holes may be further formed in at least a portion of the slits 221 and 222, and these slits may be connected. Therefore, even when either the upper adhesive 251 or the lower adhesive 252 is excessive, the common through hole may be used as a contraction area.

[0184] In addition, since the adhesive 251 tends to accumulate at the four corners, the adhesive 251 can be prevented from protruding from the four corners by forming slit portions in an inclined direction at the four corners, as shown in b in the figure. In addition, the strength of the support member 220 can be prevented from being reduced due to the increase in the bonding area.

[0185] In b of the drawing, the portions of the four corners in the inclined direction and the portions parallel to the side surfaces of the support 220 are connected, but these portions may be divided as described later. In this case, the slits parallel to the side surfaces may be arranged in a staggered manner.

[0186] In addition, the processing of the slits 221 and 222 is preferably performed by a mold. However, regarding the processing of the fine slits, sublimation processing can also be performed directly on the bracket 220 using a laser or the like. In addition, as long as the interval between the slits and the depth of the slits can be processed.

[0187] Furthermore, in order to reduce the risk of generating voids when bonding the support member 220, pressure bonding is preferably performed under vacuum conditions.

[0188] Fig.29 2 is an example of a bottom view and a cross-sectional view of a support member 220 to which an adhesive 251 is applied according to a fifth embodiment of the present technology. In the drawings, a shows a bottom view of the support member 220, and b shows a cross-sectional view of the support member 220 when cut along the thick dashed line of a in the drawing. In the drawing, c shows a cross-sectional view of the support member 220 when cut along the dot-dash line of a in the drawing.

[0189] As shown in b of the figure, slits in an oblique direction are formed at four corners, and these portions are referred to as slit portions 221 - 2 .

[0190] As shown in c in the figure, the slits are formed parallel to the side surfaces, and these portions are referred to as slit portions 221-1. As illustrated in the bottom view in a in the figure, the slit portion 221-1 and the slit portion 221-2 are connected.

[0191] Fig.30 1 is an example of a top view and a cross-sectional view of a semiconductor package 200 in which a support member 220 is placed according to a fifth embodiment of the present technology. In the drawings, a shows a top view of the semiconductor package 200, and b shows a cross-sectional view of the semiconductor package 200 when cut along the thick dashed line of a in the drawing. In the drawings, c shows a cross-sectional view of the semiconductor package 200 when cut along the dot-dash line of a in the drawing.

[0192] As shown in a, b and c, after applying the adhesive 251, the support 220 is placed on the substrate 240 with the sensor chip.

[0193] Fig.31 1 is an example of a top view and a cross-sectional view of a semiconductor package 200 in which a substrate 240 is crimped according to a fifth embodiment of the present technology. In the drawings, a shows a top view of the semiconductor package 200, and b shows a cross-sectional view of the semiconductor package 200 when cut along the thick dashed line of a in the drawing. In the drawings, c shows a cross-sectional view of the semiconductor package 200 when cut along the dot-dash line of a in the drawing.

[0194] As shown in a, b and c in the figures, after alignment, the substrate 240 with the sensor chip is in pressure contact with the support member 220. At this time, the crushed and flowing adhesive 252 flows into the groove 244, and further flows into the slit 221 on the lower surface of the support member 220. Therefore, the adhesive 251 is prevented from flowing out to an unnecessary portion.

[0195] Fig.32 1 is an example of a top view and a cross-sectional view of a semiconductor package 200 bonded to glass 210 according to a fifth embodiment of the present technology. In the drawings, a shows a top view of the semiconductor package 200, and b shows a cross-sectional view of the semiconductor package 200 when cut along the thick dashed line of a in the figure.

[0196] As shown in a and b in the figure, after the substrate 240 is brought into pressure contact with the sensor chip, the adhesive 252 is applied to the upper surface of the support member 220, and the glass 210 is bonded. At this time, since a part of the adhesive 252 flows into the slit 222 on the upper surface of the support member 220, it is possible to suppress the adhesive 252 from flowing out to unnecessary portions.

[0197] Fig.33 is a plan view showing another pattern of the slits 221 on the lower surface of the support 220 according to the fifth embodiment of the present technology.

[0198] As shown in a of the figure, the slit portions 221-1 parallel to the side and the slit portions 221-2 in the oblique direction can be divided. At this time, the slit portions 221-1 can be arranged in a staggered manner.

[0199] Alternatively, as shown in b in the figure, the slit portion 221 - 1 may be formed perpendicular to the side.

[0200] Regarding the difference between a and b in the drawings, focus on one side of the area between two adjacent slit portions 221-2 in the tilt direction. The bold lines a and b in the drawings indicate the focus side. In a of the drawings, the slit portion 221-2 between two adjacent slit portions 221-1 in the tilt direction is formed parallel to the focus side, but in b of the drawings, the slit portion is formed perpendicular to the focus side.

[0201] Note that in b in the drawing, the slit portion 221 - 1 and the slit portion 221 - 2 may be divided.

[0202] Fig.34 244-1, and the part in the oblique direction is defined as the groove part 244-2.

[0203] Note that the fifth embodiment can also be applied to each of the second embodiment, the third embodiment, and the fourth embodiment.

[0204] As described above, according to the fifth embodiment of the present technology, since the slits 221 and 222 are formed in the support member 220 , the adhesives 251 and 252 can be prevented from flowing out.

[0205] [Modifications]

[0206] In the fifth embodiment described above, the slits 221 and 222 are formed in the support member 220. However, in the case where the amount of adhesives 251 and 252 is greater than expected, there is a possibility that outflow cannot be sufficiently suppressed. The semiconductor package 200 according to the modification of the fifth embodiment is different from the semiconductor package of the fifth embodiment in that a through hole is formed in the support member 220.

[0207] Fig.351 is an example of a top view and a bottom view of a support member 220 according to a modification of the fifth embodiment of the present technology. In the drawings, a is an example of a top view of a support member 220, and b in the drawings is an example of a bottom view of a support member 220.

[0208] As illustrated in a of the figure, in a modification of the fifth embodiment, the slit 222 is not formed on the upper surface of the support member 220. In addition, as shown in a and b of the figure, through holes 223 are formed near the four corners of the support member 220. By forming the through holes 223, it is possible to prevent the adhesives 251, 252 from flowing out.

[0209] It should be noted that the slits 222 may be further formed on the upper surface of the support member 220 , and the slits 221 and the through holes 223 on the lower surface may be connected.

[0210] Fig.36 2 is an example of a cross-sectional view of a semiconductor package 200 according to a modification of the fifth embodiment of the present technology. In the drawings, a is an example of a cross-sectional view of the semiconductor package 200 when bonding using an adhesive 251. As shown in a in the figure, the cross-sectional shape of the through hole 223 is, for example, a straight line shape.

[0211] In addition, as shown in b in the figure, the cross-sectional shape of the through hole 223 may also be a trapezoid, so that the adhesive 251 can be easily pushed out.

[0212] As described above, according to the modification of the fifth embodiment of the present technology, since the through hole 223 is formed in the support member 220 , the adhesives 251 and 252 can be guided to the through hole 223 to prevent the adhesives 251 and 252 from flowing out.

[0213] <6. Application examples of mobile objects>

[0214] The technology according to the present disclosure (the present technology) can be applied to various products. For example, the technology according to the present disclosure can be implemented in the form of a device installed on any kind of mobile body (such as a car, an electric vehicle, a hybrid electric vehicle, a motorcycle, a bicycle, personal mobility, an airplane, a drone, a ship, or a robot).

[0215] Fig.37 is a block diagram showing a schematic configuration example of a vehicle control system which is an example of a moving body control system to which the technology according to the present disclosure can be applied.

[0216] The vehicle control system 12000 includes a plurality of electronic control units connected to each other via a communication network 12001. Fig.37In the example shown, the vehicle control system 12000 includes a drive system control unit 12010, a body system control unit 12020, an external information detection unit 12030, an internal information detection unit 12040, and an integrated control unit 12050. In addition, a microcomputer 12051, a sound / image output unit 12052, and an in-vehicle network interface (I / F) 12053 are shown as functional components of the integrated control unit 12050.

[0217] The drive system control unit 12010 controls the operation of devices related to the drive system of the vehicle according to various programs. For example, the drive system control unit 12010 serves as a control device for generating a driving force generating device (such as an internal combustion engine, a drive motor, etc.) for generating a vehicle, a driving force transmitting mechanism for transmitting the driving force to the wheels, a steering mechanism for adjusting the steering angle of the vehicle, a braking device for generating a braking force for the vehicle, and the like.

[0218] The body system control unit 12020 controls the operation of various devices provided on the vehicle body according to various programs. For example, the body system control unit 12020 is used as a control device for a keyless entry system, a smart key system, a power window device, or various lights such as a headlight, a backup light, a brake light, a turn signal, a fog light, etc. In this case, a radio wave transmitted from a mobile device as a substitute for a key or a signal of various switches may be input to the body system control unit 12020. The body system control unit 12020 receives these input radio waves or signals, and controls the door lock device, the power window device, the lights, etc. of the vehicle.

[0219] The vehicle exterior information detection unit 12030 detects information outside the vehicle including the vehicle control system 12000. For example, the vehicle exterior information detection unit 12030 is connected to an imaging unit 12031. The vehicle exterior information detection unit 12030 causes the imaging unit 12031 to capture an image outside the vehicle and receives the captured image. In addition, the vehicle exterior information detection unit 12030 may also detect objects such as people, vehicles, obstacles, signs, and text on the road surface, or detect their distances, based on the received image.

[0220] The imaging unit 12031 is an optical sensor that receives light and outputs an electrical signal corresponding to the amount of light received. The imaging unit 12031 may output the electrical signal as an image, or may output the electrical signal as information about the measured distance. In addition, the light received by the imaging unit 12031 may be visible light, or may be invisible light such as infrared rays.

[0221] The in-vehicle information detection unit 12040 detects information about the interior of the vehicle. The in-vehicle information detection unit 12040 is connected to, for example, a driver state detection unit 12041 that detects the state of the driver. The driver state detection unit 12041 includes, for example, a camera that photographs the driver. Based on the detection information input from the driver state detection unit 12041, the in-vehicle information detection unit 12040 can calculate the driver's fatigue or the driver's concentration, or can determine whether the driver is dozing off.

[0222] The microcomputer 12051 can calculate the control target value of the driving force generation device, the steering mechanism, or the braking device based on the information about the inside or outside of the vehicle obtained by the vehicle exterior information detection unit 12030 or the vehicle interior information detection unit 12040, and output a control command to the drive system control unit 12010. For example, the microcomputer 12051 can perform cooperative control aimed at realizing the functions of the advanced driver assistance system (ADAS), which includes collision prevention or shock absorption for the vehicle, follow-up driving based on the following distance, maintaining the vehicle speed for driving, warning of vehicle collision, warning of vehicle deviation from the lane, etc.

[0223] In addition, the microcomputer 12051 can perform collaborative control for automatic driving by controlling the driving force generating device, steering mechanism, braking device, etc. based on information about outside or inside the vehicle obtained by the outside information detection unit 12030 or the inside information detection unit 12040, thereby enabling the vehicle to travel automatically without relying on the driver's operation, etc.

[0224] In addition, the microcomputer 12051 can output a control instruction to the body system control unit 12020 based on the vehicle exterior information acquired by the vehicle exterior information detection unit 12030. For example, the microcomputer 12051 can perform cooperative control for preventing glare by controlling the headlights to change from high beam to low beam based on the position of the front vehicle or the oncoming vehicle detected by the vehicle exterior information detection unit 12030.

[0225] The sound / image output unit 12052 sends an output signal of at least one of sound and image to an output device that can visually or auditorily notify the occupants of the vehicle or the outside of the vehicle of information. Fig.37 In the example of , the audio speaker 12061, the display portion 12062, and the instrument panel 12063 are illustrated as output devices. For example, the display portion 12062 may include at least one of an on-board display and a head-up display.

[0226] Fig.38 12031 is a view showing an example of the installation position of the imaging unit 12031.

[0227] exist Fig.38In the figure, the imaging unit 12031 includes imaging units 12101, 12102, 12103, 12104 and 12105.

[0228] The imaging units 12101, 12102, 12103, 12104, 12105 are provided, for example, at locations such as the front nose, side mirrors, rear bumper, rear door, and upper portion of the windshield in the interior of the vehicle 12100. The imaging unit 12101 provided at the front nose in the interior of the vehicle and the imaging unit 12105 provided at the upper portion of the windshield mainly obtain images in front of the vehicle 12100. The imaging units 12102 and 12103 provided on the side mirrors mainly obtain images of the sides of the vehicle 12100. The imaging unit 12104 provided to the rear bumper or rear door mainly obtains images of the rear portion of the vehicle 12100. The imaging unit 12105 provided at the upper portion of the windshield in the interior of the vehicle is mainly used to detect vehicles ahead, pedestrians, obstacles, signals, traffic signs, lanes, etc.

[0229] Please note that Fig.38 An example of the imaging range of the imaging units 12101 to 12104 is shown. Imaging range 12111 represents the imaging range of the imaging unit 12101 set to the front nose. Imaging ranges 12112 and 12113 respectively represent the imaging ranges of the imaging units 12102 and 12103 set to the side mirrors. Imaging range 12114 represents the imaging range of the imaging unit 12104 set to the rear bumper or the rear door. For example, a bird's-eye view image of the vehicle 12100 viewed from above is obtained by superimposing image data imaged by the imaging units 12101 to 12104.

[0230] At least one of the imaging units 12101 to 12104 may have a function of obtaining distance information. For example, at least one of the imaging units 12101 to 12104 may be a stereo camera composed of a plurality of imaging elements, or may be an imaging element having pixels for phase difference detection.

[0231] For example, the microcomputer 12051 can determine the distance to each three-dimensional object within the imaging range 12111 to 12114 and the time change of the distance (relative speed relative to the vehicle 12100) based on the distance information obtained from the imaging units 12101 to 12104, thereby extracting objects that exist on the driving path of the vehicle 12100 and are traveling in the same direction as the vehicle 12100 at a prescribed speed (e.g., equal to or greater than 0 km / hour). In addition, the microcomputer 12051 can pre-set the following distance to keep ahead of the leading vehicle, and perform automatic braking control (including follow-up stop control), automatic acceleration control (including follow-up start control), etc. As a result, coordinated control for automatic driving that allows the vehicle to travel automatically without relying on the driver's operation, etc., can be performed.

[0232] For example, the microcomputer 12051 can classify the three-dimensional object data related to the three-dimensional object into three-dimensional object data of a two-wheeled vehicle, a standard vehicle, a large vehicle, a pedestrian, a utility pole, and other three-dimensional objects based on the distance information obtained from the imaging units 12101 to 12104, extract the classified three-dimensional object data, and use the extracted three-dimensional object data for automatic obstacle avoidance. For example, the microcomputer 12051 identifies obstacles around the vehicle 12100 as obstacles that can be visually recognized by the driver of the vehicle 12100 and obstacles that are difficult for the driver of the vehicle 12100 to visually recognize. Then, the microcomputer 12051 determines a collision risk indicating the risk of collision with each obstacle. In the case where the collision risk is equal to or higher than the set value and therefore there is a possibility of collision, the microcomputer 12051 outputs a warning to the driver via the audio speaker 12061 or the display unit 12062, and performs forced deceleration or evasive steering via the driving system control unit 12010. The microcomputer 12051 can thereby assist driving to avoid collisions.

[0233] At least one of the imaging units 12101 to 12104 may be an infrared camera that detects infrared rays. The microcomputer 12051 may, for example, identify a pedestrian by determining whether a pedestrian exists in the captured images of the imaging units 12101 to 12104. This identification of a pedestrian is performed, for example, by a process of extracting feature points in the imaged images of the imaging units 12101 to 12104 as infrared cameras and by performing pattern matching processing on a series of feature points representing the outline of an object to determine whether it is a pedestrian. When the microcomputer 12051 determines that a pedestrian exists in the imaged images of the imaging units 12101 to 12104 and thus identifies the pedestrian, the sound / image output unit 12052 controls the display unit 12062 so that a square outline for emphasis is displayed as superimposed on the identified pedestrian. The sound / image output unit 12052 may also control the display unit 12062 so that an icon representing a pedestrian or the like is displayed at a desired position.

[0234] An example of a vehicle control system to which the technology according to the present disclosure can be applied has been described above. For example, in the above configuration, the technology according to the present disclosure can be applied to the imaging unit 12031. Specifically, for example, Figure 1 The electronic device 100 in the embodiment can be applied to the imaging portion 12031. By applying the technology according to the present disclosure to the imaging portion 12031, it is possible to suppress the adhesive from flowing out to the outside of the prescribed area, and it is possible to suppress the adverse effect on the system due to the adhesive flowing out.

[0235] It should be noted that the above-mentioned embodiments show examples for embodying the present technology, and the various contents in the embodiments and the various contents specifying the present invention in the claims have a corresponding relationship. Similarly, the matters specifying the present invention in the claims have a corresponding relationship with the matters with the same names in the embodiments of the present technology. However, the present technology is not limited to the embodiments, and can be embodied by making various modifications to the embodiments without departing from the scope of the present technology.

[0236] It should be noted that the effects described in this specification are merely examples and are not limiting, and other effects may also be achieved.

[0237] It should be noted that the present technology can also have the following configurations.

[0238] (1) A semiconductor package comprising:

[0239] substrate;

[0240] a semiconductor chip placed on the substrate planar surface of the substrate and electrically connected to the substrate;

[0241] Support members; and

[0242] A first adhesive partially flows into a gap between the flat surface of the substrate and the semiconductor chip to bond the substrate to the support.

[0243] (2) The semiconductor package according to (1), wherein

[0244] A trench is formed on the planar surface of the substrate.

[0245] (3) The semiconductor package according to (2), wherein

[0246] The trench is formed in the base material of the substrate.

[0247] (4) The semiconductor package according to (2), wherein

[0248] The groove is formed by solder resist.

[0249] (5) The semiconductor package according to (2), wherein

[0250] The trench includes a conductor pattern.

[0251] (6) The semiconductor package according to (2), wherein

[0252] The grooves are formed by silk screen printing.

[0253] (7) The semiconductor package according to any one of (1) to (6), further comprising:

[0254] A die bonding resin contains a filler and bonds the semiconductor chip to the substrate planar surface.

[0255] (8) The semiconductor package according to any one of (1) to (7), further comprising:

[0256] a second adhesive; and

[0257] Glass, of which

[0258] One of the two surfaces of the support is bonded to the substrate using a first adhesive, and the other surface is bonded to the glass using a second adhesive.

[0259] (9) The semiconductor package according to (8), further comprising:

[0260] Silicone resin, including

[0261] The support member has an opening,

[0262] A protrusion protruding toward the semiconductor chip is formed around the opening on one of the two surfaces of the support member, and

[0263] The silicone resin is provided between the bump and the semiconductor chip.

[0264] (10) The semiconductor package according to (8) or (9), wherein:

[0265] The first slit is formed on one of the two surfaces of the support.

[0266] (11) The semiconductor package according to (10), wherein the first slit comprises:

[0267] a plurality of first slit portions parallel to or perpendicular to one side of the support member; and

[0268] A plurality of second slit portions are formed in an oblique direction.

[0269] (12) The semiconductor package according to any one of (8) to (11), wherein

[0270] A second slit is formed on the other of the two surfaces of the support.

[0271] (13) The semiconductor package according to any one of (8) to (12), wherein:

[0272] A through hole is formed in the support member.

[0273] (14) An electronic device comprising:

[0274] substrate;

[0275] a semiconductor chip placed on the substrate planar surface of the substrate and electrically connected to the substrate;

[0276] Supports;

[0277] a first adhesive that partially flows into a gap between the flat surface of the substrate and the semiconductor chip to bond the substrate to the support; and

[0278] The optical part guides light to the semiconductor chip.

[0279] Reference Symbols List

[0280] 100 Electronic devices

[0281] 110 Optical unit

[0282] 120 DSP circuit

[0283] 130 Display unit

[0284] 140 Operating Units

[0285] 150 Bus

[0286] 160 frame memory

[0287] 170 Storage

[0288] 180 Power supply unit

[0289] 200 Semiconductor Packages

[0290] 210 Glass

[0291] 220 Support

[0292] 221,222,225 Slit

[0293] 221-1,221-2 Slit

[0294] 223,243 through holes

[0295] 230 sensor chip

[0296] 231 Light receiving unit

[0297] 240 Substrate

[0298] 241 terminal

[0299] 242 Chip mounting area

[0300] 244 Groove

[0301] 244-1,244-2 Groove

[0302] 245 conductor

[0303] 246,247 solder resist

[0304] 251,252 Adhesives

[0305] 253,270 Die Bonding Resin

[0306] 254 Silicone

[0307] 261 Wire

[0308] 271 Filler

[0309] 12031 Imaging Department.

Claims

1. A semiconductor package, comprising: substrate; a semiconductor chip placed on a substrate planar surface of the substrate and electrically connected to the substrate; Supports; as well as A first adhesive partially flows into a gap between the flat surface of the substrate and the semiconductor chip to bond the substrate to the support.

2. The semiconductor package according to claim 1, wherein: A groove is formed on the flat surface of the substrate.

3. The semiconductor package according to claim 2, wherein: The groove is formed on a base material of the substrate.

4. The semiconductor package according to claim 2, wherein: The groove is formed by solder resist.

5. The semiconductor package according to claim 2, wherein: The trench includes a conductor pattern.

6. The semiconductor package according to claim 2, wherein: The groove is formed by silk screen printing.

7. The semiconductor package according to claim 1, further comprising: A die bonding resin contains a filler and bonds the semiconductor chip to the substrate planar surface.

8. The semiconductor package according to claim 1, further comprising: a second adhesive; as well as Glass, among which One of the two surfaces of the support is bonded to the substrate using the first adhesive, and the other surface is bonded to the glass using the second adhesive.

9. The semiconductor package according to claim 8, further comprising: Silicone resin, wherein The support member has an opening, A protrusion protruding toward the semiconductor chip is formed around the opening on the one of the two surfaces of the support member, and The silicone resin is disposed between the protrusion and the semiconductor chip.

10. The semiconductor package according to claim 8, wherein: A first slit is formed on the one of the two surfaces of the support member.

11. The semiconductor package according to claim 10, wherein: The first slit comprises: a plurality of first slit portions parallel to or perpendicular to one side of the support member; and A plurality of second slit portions are formed in an oblique direction.

12. The semiconductor package according to claim 8, wherein: A second slit is formed on the other of the two surfaces of the support member.

13. The semiconductor package according to claim 8, wherein: A through hole is formed in the support member.

14. An electronic device comprising: substrate; a semiconductor chip placed on a substrate planar surface of the substrate and electrically connected to the substrate; Supports; a first adhesive that partially flows into a gap between the flat surface of the substrate and the semiconductor chip to bond the substrate to the support; as well as The optical part guides light to the semiconductor chip.

Images