Antenna assembly and device provided with the same

By designing an antenna assembly including grounding elements, feeding elements and additional elements, the problem of antenna space limitations in mobile devices is solved by using capacitive coupling and matching elements, and the antenna assembly with miniaturization, simple structure and good performance is achieved, suitable for mobile devices in high noise environments.

CN119923763APending Publication Date: 2025-05-02GOERTEK INC
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Patent Information

Application Number
CN202280100250.5
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2022-10-31
Publication Date
2025-05-02

AI Technical Summary

Technical Problem

Due to space limitations, antennas in existing mobile devices have problems such as reduced transmission range, complex matching circuits, and large radiation efficiency losses, making it difficult to achieve a built-in antenna with simple structure and good performance.

Method used

An antenna assembly is designed, including grounding elements, feeding elements and additional elements, to realize the function of the antenna through capacitive coupling, and adjust the input impedance through matching elements to ensure the good performance of the antenna assembly.

Benefits of technology

The antenna assembly is small in size, thin in thickness, simple in structure, and has good performance and efficiency, and can provide good wireless connectivity in high noise environments, making it suitable for miniaturized mobile devices.

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Abstract

An antenna assembly and an electronic device provided with the same are provided. The antenna assembly includes: a ground element configured to be electrically connected to a ground plane at a ground point; a power feeding element configured to be electrically connected to the radio signal circuit at a power feeding point; and an additional element; wherein the ground element, the feed element, and the additional element are physically separated and physically disconnected from each other, at least a first portion of the additional element extending substantially parallel to at least a portion of the ground element to provide a capacitive coupling between the additional element and the ground element during operation of the antenna assembly. The antenna assembly according to the present disclosure can be manufactured to have a small size and a thin thickness while ensuring the performance and antenna efficiency of the antenna assembly.
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Description

Technical Field

[0001] The present disclosure generally relates to an antenna device suitable for a mobile terminal, and more particularly to an antenna assembly and an electronic device including the antenna assembly. Background Art

[0002] Mobile devices such as mobile phones, personal digital assistant (PDA) devices, gaming devices, and augmented reality / virtual reality (AR / VR) devices are becoming increasingly popular. Such electronic devices typically have wireless communication capabilities and are integrated with antennas for wireless communication. Due to the smaller form factor of such mobile devices, the space for antennas in the mobile devices is limited.

[0003] In the industry, various antennas built into mobile devices are provided. For example, a planar inverted-F antenna is proposed as a multi-band built-in antenna capable of operating in multiple frequency bands. However, the common planar inverted-F antenna often has a problem of reduced transmission range due to spatial complexity.

[0004] Loop antennas are widely used in high frequency applications. Conventional loop antennas have the disadvantages of complex matching circuits, relatively large distances from the ground plane, and large losses in radiation efficiency.

[0005] For this reason, there is a need for an antenna applicable to a built-in mobile device having a simple structure and good performance. Summary of the invention

[0006] The present disclosure aims to provide an antenna assembly with small size, thin thickness, simple structure and good performance. In order to achieve the above object, at least the following technical solutions are provided.

[0007] In one aspect, an antenna assembly is provided, comprising an antenna radiator, wherein the antenna radiator comprises a ground element configured to be electrically connected to a ground plane at a ground point, a feed element configured to be electrically connected to a radio signal circuit at a feed point, and an additional element.

[0008] The ground element, the feed element and the parasitic element are physically separated and physically disconnected from one another, and at least a first portion of the parasitic element extends substantially parallel to at least a portion of the ground element to provide capacitive coupling between the parasitic element and the ground element during operation of the antenna assembly.

[0009] In one embodiment, at least a second portion of the parasitic element extends substantially parallel to at least a portion of the feed element to provide capacitive coupling between the parasitic element and the feed element during operation of the antenna assembly.

[0010] In one embodiment, the antenna assembly further includes: a first matching element configured to connect the ground element with the ground plane at the ground point; and a second matching element configured to connect the feed element with the radio signal circuit at the feed point.

[0011] In one embodiment, the first matching element extends substantially parallel to the second matching element, and a length of the first matching element is substantially the same as a length of the second matching element.

[0012] In one embodiment, the first matching element extends substantially parallel to the second matching element, and a length of the first matching element is shorter than a length of the second matching element.

[0013] In one embodiment, an angle between the first matching element and the second matching element is greater than 0 degrees and less than 30 degrees.

[0014] In one embodiment, the antenna assembly further comprises a dielectric carrier for supporting the antenna radiator.

[0015] In one embodiment, the antenna radiator is planar.

[0016] In one embodiment, the planar antenna radiator is arranged in the same plane as the ground plane.

[0017] In one embodiment, the planar antenna radiator is arranged in a plane spaced apart from and substantially parallel to the ground plane.

[0018] In one embodiment, the first matching element and the second matching element are arranged in a plane perpendicular to the ground plane.

[0019] In one embodiment, the ground point is located at a central portion of the ground plane, the antenna radiator protrudes outward relative to the ground point, and at least a portion of the antenna radiator faces the ground plane.

[0020] In one embodiment, the grounding point is located at an edge of the ground plane, and the antenna radiator protrudes to the inner side of the ground plane relative to the grounding point, with at least a portion of the antenna radiator facing the ground plane.

[0021] In one embodiment, the grounding point is located at an edge of the ground plane, and the antenna radiator protrudes outside the ground plane relative to the grounding point, with no part of the antenna radiator facing the ground plane.

[0022] In one embodiment, the ground plane and the antenna radiator are formed on different layers of the printed circuit board.

[0023] In one embodiment, the feed element is electrically connected to the radio signal circuit via an inner conductor of the coaxial cable, and the ground element is electrically connected to the ground plane via a conductive shield of the coaxial cable, wherein the conductive shield is concentric with and surrounds the inner conductor, and the inner conductor and the conductive shield are separated from each other by a dielectric insulator.

[0024] In a second aspect, an electronic device is provided, the electronic device comprising the antenna assembly according to any one of the above embodiments.

[0025] In one embodiment, the electronic device further includes a housing that serves as a ground plane to be connected to the ground element of the antenna assembly.

[0026] In the present disclosure, an antenna assembly includes a grounding element configured to be electrically connected to a ground plane at a grounding point, a feeding element configured to be electrically connected to a radio signal circuit at a feeding point, and an additional element. The grounding element, the feeding element, and the additional element are physically separated and physically disconnected from each other, and at least a first portion of the additional element extends substantially parallel to at least a portion of the grounding element to provide capacitive coupling between the additional element and the grounding element during operation of the antenna assembly. Due to the physical separation and physical disconnection between the grounding element and the feeding element, the total physical length of the antenna assembly can be reduced; and the capacitive coupling between the feeding element and the grounding element during operation of the antenna assembly helps the antenna assembly to function and ensures good performance of the antenna assembly. Therefore, the antenna assembly according to the present disclosure can be manufactured to have a small size and a thin thickness while ensuring the performance of the antenna assembly and the antenna efficiency. Therefore, the antenna assembly according to the present disclosure can provide good wireless connectivity for a device equipped with the antenna assembly, and is conducive to the miniaturization of the device. For example, in mobile devices such as gaming devices that have Bluetooth technology for communicating with wireless controllers, if the antenna performance is good, these gaming devices do not have any connection issues between the main device and the controller even in a bad environment with a high noise floor, for example, in the presence of multiple wireless devices using the same frequency (such as Bluetooth, wireless LAN, microwave ovens, etc.). BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions according to the embodiments of the present disclosure or conventional technologies, the following briefly describes the drawings used in the embodiments of the present disclosure or conventional technologies. Obviously, the drawings in the following description are only some embodiments of the present disclosure, and those skilled in the art can obtain other drawings based on the provided drawings without creative work.

[0028] Figure 1 is a schematic diagram of a pattern of an antenna assembly according to an embodiment of the present disclosure;

[0029] Figure 2 is a schematic diagram showing an exemplary electrical arrangement of an antenna assembly according to an embodiment of the present disclosure;

[0030] Figure 3 is a schematic diagram showing another exemplary electrical arrangement of an antenna assembly according to an embodiment of the present disclosure;

[0031] Figure 4a-4f is a schematic diagram of an exemplary pattern of a multi-band antenna according to other embodiments of the present disclosure;

[0032] Figure 5 is a graph showing simulated return loss of an antenna assembly provided according to an embodiment of the present disclosure;

[0033] Figure 6 is a graph showing simulated antenna efficiency of an antenna assembly provided according to an embodiment of the present disclosure;

[0034] Figure 7 is a schematic diagram showing the arrangement of an antenna assembly according to an embodiment of the present disclosure;

[0035] Figure 8 is a schematic diagram showing another arrangement of an antenna assembly according to an embodiment of the present disclosure;

[0036] Fig. 9 is a schematic diagram showing yet another arrangement of an antenna assembly according to an embodiment of the present disclosure; and

[0037] Fig.10 is a schematic diagram of a mobile device provided with an antenna assembly according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0038] The technical solutions in the embodiments of the present disclosure are described below in conjunction with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only some embodiments of the present disclosure rather than all embodiments. Any other embodiments obtained by those skilled in the art based on the embodiments of the present disclosure without creative work shall fall within the protection scope of the present disclosure.

[0039] It should be noted that terms such as "first", "second", "third", "fourth", etc. are only used herein to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply an actual relationship or order between the entities or operations. In addition, terms such as "include", "comprises", or any other variation thereof are meant to be non-exclusive. Thus, a process, method, article, or device that includes a series of elements includes not only the disclosed elements, but also other elements that are not clearly listed, or also inherent elements of the process, method, article, or device. Unless explicitly limited, the wording "includes" does not exclude the possibility that other similar elements may exist in the process, method, article, or device in addition to the listed elements.

[0040] In addition, the present invention is described in conjunction with schematic diagrams. When describing embodiments of the present invention in detail, for ease of explanation, the cross-sectional views showing the structure of the device are partially enlarged and not drawn to scale. The accompanying drawings are exemplary and are not intended to limit the scope of protection of the present invention. In addition, in actual manufacturing processes, three-dimensional dimensions, i.e., length, width, and depth, should be considered.

[0041] It should be noted that the reference in the structure or step where the first feature is "on" or "over" the second feature includes the case where the first feature and the second feature are in direct contact and the case where there are additional features between the first feature and the second feature, that is, the first feature and the second feature may not be in direct contact.

[0042] Figure 1 is a schematic diagram of a pattern of an antenna assembly according to an embodiment of the present disclosure. Figure 1 As shown, the antenna assembly 1 includes an antenna radiator 101. Specifically, the antenna radiator 101 includes a ground element 111, a feed element 121, and an additional element 131. The ground element 111 is configured to be electrically connected to a ground plane (not shown) at a ground point 104. The feed element 121 is configured to be electrically connected to a radio signal (RF) circuit at a feed point 105. The feed point 105 is located adjacent to the ground point 104.

[0043] like Figure 1 As shown, the ground element 111, the feeding element 121 and the additional element 131 are physically separated and physically disconnected from each other. In other words, there is no direct electrical connection between the ground element 111 and the additional element 131, and the additional element 131 is physically disconnected from the ground plane. Similarly, there is no direct electrical connection between the feeding element 121 and the additional element 131, and the additional element 131 is physically disconnected from the RF circuit. In addition, there is no direct electrical connection between the feeding element 121 and the ground element 111.

[0044] like Figure 1As shown, at least a portion 1111 of the ground element 111 extends substantially parallel to a portion 1311 of the additional element 131 and in the same direction. Figure 1 As shown, the portion 1111 of the ground element 111 is arranged in the vicinity of the portion 1311 of the additional element 131, with a slot or gap formed between the two portions 1111 and 1311. In this configuration, the portion 1311 of the additional element 131 is arranged to form a capacitive slot / gap, which provides capacitive coupling between the additional element 131 and the ground element 111 during operation of the antenna assembly. To this end, the width of the slot or gap between the portion 1111 and the portion 1311 is appropriately selected. In a preferred embodiment, the width of the slot or gap between the portion 1111 and the portion 1211 ranges from 0.1 mm to 5 mm.

[0045] In a preferred embodiment, the portion 1311 of the additional element 131 has a length sufficient to provide a usable coupling capacitance. In some embodiments, in addition to requiring the portion 1311 of the additional element 131 to be long enough to ensure effective coupling capacitance, the total length of the additional element 131 is preferably shorter than the shortest resonant length at the lowest operating frequency of the antenna assembly.

[0046] like Figure 1 As shown, the additional element 131 may further include a portion 1312 extending substantially parallel to a portion of the feeding element 121 in the same direction. In an optional embodiment, the portion 1312 of the additional element 131 is arranged in the vicinity of the portion of the feeding element 121, forming a slit or gap between the two portions. In this configuration, the portion 1312 of the additional element 131 is arranged to form a capacitive slit / gap, which provides capacitive coupling between the additional element 131 and the feeding element 121 during operation of the antenna assembly. To this end, the width of the slit or gap between the portion 1312 of the additional element 131 and the feeding element 121 is appropriately selected, for example, less than 5 mm.

[0047] However, it should be noted that the present disclosure is not limited in this regard; the additional element 131 may be spaced apart from the feeding element 121 by a greater distance so that no capacitive coupling is generated between the feeding element 121 and the additional element 131 .

[0048] The grounding element 111 may be in various shapes. In an embodiment, the grounding element 111 may be an elongated strip and may have a plurality of portions connected end to end. For example, the grounding element 111 may be in an L-shape, which at least includes a first portion extending in a first direction and a second portion extending in a second direction perpendicular to the first direction, such as Figure 1In other examples, the ground element 111 may further include a third portion extending in a third direction substantially parallel to the first direction and opposite to the first direction, and the resulting U-shape maintains a long antenna element, thereby maintaining the lowest resonant frequency available for the antenna assembly.

[0049] Although the grounding element 111 is Figure 1 111 is shown as including an end-to-end connection, but it should be noted that the structure of the grounding element 111 is not limited thereto, and the grounding element 111 may include more than two open ends, that is, the grounding element 111 may include one or more branches extending from the main part of the grounding element 111. Further, although the grounding element 111 is Figure 1 1 is shown as having a plurality of portions having substantially the same width, but the portions of the ground element 111 may have different widths as desired.

[0050] Similarly, the feeding element 121 may be in various shapes. For example, the feeding element 121 may be formed into a strip, such as Figure 1 As another example, the feeding element 121 may be a conductive elongated strip folded at one or more points. The feeding element 121 may be provided with one or more branches extending from a main portion of the feeding element 121 .

[0051] The additional element 131 can be formed into various shapes, as shown below. Figure 4a-4f discussed.

[0052] The ground element 111, the feed element 121 and the additional element 131 may be made of sheet metal, metal traces on a carrier, or may be made of a flexible substrate or a rigid substrate, a metalized interconnect device (MID), etc. The ground element 111, the feed element 121 and the additional element 131 may be made of various conductive materials, including but not limited to silver, copper, etc., transparent conductive oxides (e.g., indium tin oxide ITO), carbon nanotubes, graphene, etc.

[0053] By the above arrangement of the antenna radiator 101 in the antenna assembly, the size of the antenna assembly is more compact. For example, due to the physical separation and physical disconnection between the ground element and the additional element, the total physical length of the antenna assembly can be reduced; the capacitive coupling between the additional element and the ground element during the operation of the antenna assembly helps the antenna assembly to function and ensures good performance of the antenna assembly. Therefore, the antenna assembly according to the present disclosure can be manufactured to have a small size and a thin thickness while ensuring the performance of the antenna assembly and the antenna efficiency. Therefore, the antenna assembly according to the present disclosure can provide good wireless connectivity for the device on which the antenna assembly is installed, and is conducive to the miniaturization of the device.

[0054] In one embodiment, the antenna assembly may further include a first matching element 102 and a second matching element 103. The first matching element 102 is configured to connect the ground element 111 with the ground plane at the ground point 104. The second matching element 103 is configured to connect the feed element 121 with the RF circuit at the feed point 105.

[0055] The first matching element 102 and the second matching element 103 may be parallel to each other, such as Figure 1 In other embodiments, the first matching element 102 and the second matching element 103 may have an angle, for example, an angle greater than 0 degrees and less than 30 degrees. The lengths of the two matching elements 102 and 103 may be the same or different.

[0056] According to the embodiment of the present disclosure, the input impedance of the antenna assembly can be changed by adjusting the lengths of the matching elements 102 and 103 and the distance between the first matching element 102 and the second matching element 103 .

[0057] By proper placement of matching elements 102 and 103, the antenna assembly can be impedance matched when assembled for the end user environment to achieve maximum efficiency when operating in the desired frequency band. The result of optimal efficiency is maximum range, minimum power consumption, reduced heating, and reliable data throughput.

[0058] Figure 2 is a schematic diagram showing an exemplary electrical arrangement of an antenna assembly according to an embodiment of the present disclosure. Figure 2 As shown, the antenna assembly includes an antenna radiator 202 and a dielectric carrier 203 for supporting the antenna radiator 202. The dielectric carrier 203 is also used to dielectrically separate the antenna radiator from the ground plane 201.

[0059] The antenna radiator 202 includes a ground element 212, a feed element 222, and an additional element 232. The ground element 212 of the antenna assembly is connected to the ground plane 201 at a ground point 204. In addition, the feed element 222 is connected to the RF circuit at a feed point 205.

[0060] like Figure 2 As shown, the ground element 212, the feed element 222, and the additional element 232 are physically separated and physically disconnected from each other. At least a portion of the ground element 212 extends substantially parallel to a portion of the additional element 232 in the same direction, and a capacitive coupling is formed between the additional element 232 and the ground element 212 during operation of the antenna assembly.

[0061] like Figure 2As shown, the ground plane 201 and the antenna assembly are formed as a planar structure. The planar structure may be formed by etching a printed circuit board (PCB), stamping metal, or by other means.

[0062] The dielectric carrier 203 may be formed as a frame, a support platform, etc. The dielectric carrier 203 may be made of plastic, resin, ceramic, or any other suitable material.

[0063] In some embodiments, the ground plane 201 and the antenna radiator 202 are formed on different layers of a printed circuit board (PCB).

[0064] The ground element 212, the feed element 222 and the additional element 232 may be realized by a variety of different manufacturing methods, such as stamping metal parts, etching conductors on a flexible insulating layer (FPC) and attaching them to the dielectric carrier 203 using an adhesive layer, or Laser Direct Structuring (LDS) technology.

[0065] It should be noted that the Figure 2 The design parameters of the arrangement shown. For example, the lowest resonant frequency of the antenna assembly can be determined by the total length of the ground element 212, the width of the multiple portions of the ground element 212, and the distance from the ground plane 201. As an example, Figure 3 The antenna assembly depicted in the figure can provide resonance in the frequency band of 2.4 GHz to 2.48 GHz. It should be noted that the antenna assembly can be designed to operate in other frequency bands or for other communication standards, and the present disclosure is not limited in this regard. For example, the antenna assembly can operate in accordance with a wireless communication standard for a cellular network (e.g., a 2G, 3G, 4G, or 5G standard). The antenna assembly can alternatively or additionally be designed in accordance with a wireless communication standard for a cellular network in the frequency band ranging from 2.4 GHz to 2.48 GHz. wireless communication standards.

[0066] In addition, the lengths of the ground element 212 , the feeding element 222 , and the additional element 232 and the width of the capacitive gap between the additional element 232 and the ground element 212 may be appropriately determined as needed to optimize the impedance value of the antenna assembly at the resonant frequency and relative bandwidth of the antenna assembly.

[0067] Under the inventive concept proposed in the present disclosure, the antenna assembly may be connected in other ways, and these ways all fall within the scope of the present disclosure. Figure 3 is a schematic diagram illustrating another exemplary electrical arrangement of an antenna assembly according to an embodiment of the present disclosure.

[0068] Similar to Figure 2 An embodiment of Figure 3 The antenna assembly includes an antenna radiator 302 and a dielectric carrier 303 for supporting the antenna radiator 302. The antenna radiator 302 includes a ground element 312, a feeding element 322, and an additional element 332 that are physically separated and physically disconnected from each other. At least a portion of the ground element 312 extends substantially parallel to a portion of the additional element 332 in the same direction, and a capacitive coupling is formed between the additional element 332 and the ground element 312 during operation of the antenna assembly. The dielectric carrier 303 can be formed as a frame, a support platform, etc. The dielectric carrier 303 can be made of plastic, resin, ceramic, or any other suitable material.

[0069] Different from Figure 2 Examples of Figure 3 The antenna assembly shown is connected to a ground plane and an RF circuit via a transmission line. In an embodiment, the antenna assembly can be manufactured as a stand-alone device and can be connected to a ground plane and an RF circuit via a single coaxial cable 301 in a manner that still implements the physical separation of the ground element 312 and the feed element 322. Specifically, the coaxial cable 301 is composed of an inner conductor 305 surrounded by a concentric conductive shield 304, and the inner conductor 305 and the concentric conductive shield 304 are separated by a dielectric insulator; in addition, the coaxial cable 301 can also have a protective jacket or sheath. The ground element 312 is connected to the ground plane via the conductive shield 304 of the coaxial cable 301. The feed element 322 is connected to the RF circuit via the inner conductor 305. Several exemplary structures and configurations of antenna assemblies according to the present disclosure are shown above. It should be noted that several modifications can be made without departing from the essence of the present disclosure, and these modifications fall within the scope of the present disclosure. Figure 4a-4f is a schematic diagram of exemplary patterns of multi-band antennas according to other embodiments of the present disclosure.

[0070] It should be noted that the grounding element, the feeding element and the additional element may be in any shape or a combination of different shapes including square, triangle, chamfered rectangle, chamfered square, L-shape or T-shape, which is not limited here.

[0071] In some embodiments, the ground element, the feed element, and the additional element may have different widths. Figure 4c , 4e As shown in FIG. 4f, the additional element may include at least one portion that is wider than other portions. The wider portion may be formed of a metal sheet, etc. In the case of a plurality of wider portions, the wider portions may be arranged symmetrically or asymmetrically.

[0072] Figure 5 The figure is a graph showing the simulated return loss of the antenna assembly provided according to an embodiment of the present disclosure. Figure 5Characteristic troughs are shown, which represent a corresponding frequency range of about 2.4 GHz to 2.48 GHz. It should be noted that although exemplary frequency bands are shown, the present disclosure is not limited in this regard. In other words, antenna assemblies according to the present disclosure can operate in other frequency bands and can operate in accordance with other communication standards.

[0073] Figure 6 is a graph showing the simulated antenna efficiency of the antenna assembly provided according to an embodiment of the present disclosure. Figure 6 As shown, the antenna assembly proposed according to the present disclosure has good antenna efficiency.

[0074] The antenna assembly according to the present disclosure has a simple structure, a compact construction, and good multi-band antenna performance. Therefore, the antenna assembly according to the present disclosure can provide good wireless connectivity for the device. For example, in a mobile device such as a gaming device having Bluetooth technology for communicating with a wireless controller, if the antenna performance is good, even in a bad environment with high noise, for example, in the presence of multiple wireless devices using the same frequency (such as Bluetooth, wireless LAN, microwave oven, etc.), these gaming devices do not have any connection problems between the main device and the controller.

[0075] Figure 7 is a schematic diagram showing the arrangement of an antenna assembly according to an embodiment of the present disclosure. In this embodiment, the antenna radiator includes a ground element and a feeding element, and the antenna radiator is arranged on a plane different from the ground plane to form a three-dimensional structure. The ground element and the feeding element may be supported by a dielectric carrier (not shown). It should be understood that the dielectric carrier may be made of plastic, resin, ceramic or any other suitable material. The ground element and the feeding element may be implemented by a variety of different manufacturing methods. The antenna radiator (including the ground element and the feeding element) is formed together with the dielectric carrier (if any) into a planar structure located in a plane parallel to the ground plane, and a matching element is arranged between the antenna radiator and the ground plane in a plane perpendicular to the ground plane. One of the matching elements connects the ground element of the antenna radiator to the ground plane at a grounding point. Figure 7 In the illustrated structure, the ground point is located within the ground plane, i.e., away from the edge of the ground plane, and the antenna radiator protrudes outward relative to the ground point, with the edge of the antenna radiator flush with the edge of the ground plane. In this structure, the antenna radiator of the antenna assembly faces the ground plane. Figure 7 In the structure shown, due to the antenna characteristics, the height h1 measured from the antenna radiator to the ground plane needs to have a predetermined value. In addition, the height h1 may further depend on the mechanical design of the device to which the antenna assembly is to be installed. In a preferred embodiment, the height h1 is greater than 2 mm, preferably in the range of 2 mm to 10 mm.

[0076] Figure 8 Schematic diagram showing another arrangement of an antenna assembly according to an embodiment of the present disclosure. Figure 8 In the structure shown, the ground point is located at the edge of the ground plane, and the planar antenna radiator protrudes to the inner side of the ground plane relative to the ground point. In addition, the edge of the antenna radiator is flush with the edge of the ground plane, and the matching element is connected to the two edges. In addition, in this structure, the antenna radiator of the antenna assembly faces the ground plane. Figure 8 In the structure shown, due to the antenna characteristics, the height h2 measured from the antenna radiator to the ground plane needs to have a predetermined value.

[0077] Fig. 9 is a schematic diagram showing another arrangement of an antenna assembly according to an embodiment of the present disclosure. Fig. 9 In the structure shown, the ground point is located at the edge of the ground plane, and the antenna radiator protrudes outside the ground plane relative to the ground point, so that at least most of the antenna radiator does not face the ground plane. Fig. 9 In the structure shown, the height h3 measured from the antenna radiator to the ground plane can be smaller. For example, the height h3 can be smaller than h1, and the height h3 can be smaller than h2. In extreme cases, by using Fig. 9 In the arrangement shown, the antenna radiator can be located at the same height as the ground plane, ie, h2 = 0. Therefore, when the antenna assembly is assembled in the housing of the mobile device, no constraints are imposed on the thickness of the housing of the mobile device due to the antenna assembly.

[0078] Reference Fig.10 , shows an electronic device including an antenna assembly according to an embodiment of the present disclosure. Fig.10 The electronic device 1000 may be a portable computer, such as a laptop computer, a portable tablet computer, a mobile phone, a mobile phone with media player capabilities, a handheld computer, a remote control, a game console, a global positioning system (GPS) device, a desktop computer, a music player, a multi-touch electronic device, augmented reality (AR) glasses, a head mounted display (HMD: HeadMounted Display), a combination of these devices, or any other suitable electronic device. Fig.10 As shown, the electronic device 1000 may include an input-output circuit 1100 , a processor 1200 , and a memory 1300 .

[0079] The processor 1200 may be a microprocessor or other suitable integrated circuit. The processor 1200 and the memory 1300 may be configured to control the operation of the electronic device 1000. In an exemplary embodiment, the processor 1200 may run software stored in the memory 1300 of the electronic device 1000, such as operating system functions, phone call applications, Internet browsing, email applications, media playback applications, control functions for controlling RF power amplifiers and other RF transceivers, etc.

[0080] Memory 1300 may include one or more different types of memory, such as hard drive memory, non-volatile memory (e.g., flash memory or other electrically programmable read-only memory), volatile memory (e.g., static or dynamic random access memory).

[0081] The communication protocols that can be implemented by the processor 1200 include Internet protocols, cellular telephone protocols, wireless local area network protocols (e.g., IEEE 802.11 protocols, known as ), protocols for other short-range wireless communication links (e.g., Bluetooth protocol), etc.

[0082] The input-output circuit 1100 is configured to implement input and output functions of the electronic device 1000. The input-output circuit 1100 may include input-output devices and wireless communication circuits 1120. The input-output devices 1111 may be touch screens and other user input devices, such as buttons, joysticks, click wheels, scroll wheels, touch pads, keypads, keyboards, microphones, cameras, etc. In addition, the input-output devices 1111 may include displays and audio devices, such as liquid crystal display (LCD) screens, light emitting diodes (LEDs), organic light emitting diodes (OLEDs), and other components that present visual information and status data.

[0083] The wireless communication circuit 1120 may include a radio frequency (RF) transceiver circuit 1121 formed by one or more integrated circuits, power amplifier circuits, low noise input amplifiers, passive RF components, and other circuits for processing RF wireless signals. For example, the RF transceiver circuit 1121 may include a cellular transceiver circuit 1122 for processing wireless communications at cellular frequency bands (e.g., bands of 600 MHz, 850 MHz, 900 MHz, 1800 MHz, and 1900 MHz and 2100 MHz data bands). The RF transceiver circuit 1121 may further include a WIFI and Bluetooth transceiver circuit 1123 for processing wireless communications at 2.4 GHz to 2.48 GHz, 5.15 GHz to 5.85 GHz, and 5.925 GHz to 7.125 GHz bands for WiFi 6E / 7 communications, and a 2.4 GHz Bluetooth communication band. If desired, the wireless communication circuit 1120 may include circuits for other short-range and long-range wireless links. For example, wireless communications circuitry 1120 may include a global positioning system (GPS) receiver device, wireless circuitry for receiving radio and television signals, paging circuitry, and the like.

[0084] The RF transceiver circuit 1121 may be implemented using one or more integrated circuits and associated components (e.g., switching circuits, matching network components (e.g., discrete inductors, capacitors, and resistors), and integrated circuit filter networks, etc.). These devices may be mounted on any suitable mounting structure. With one suitable arrangement, the transceiver integrated circuit may be mounted on a printed circuit board.

[0085] Wireless communications circuitry 1120 may include an antenna assembly 1124, such as that described above with reference to Figure 1 , Figure 2 , Figure 3 , Figures 4a to 4f and Figures 7 to 9 Or the antenna assembly described in its variant. As described above, the antenna assembly 1124 can be a multi-band antenna. For example, a multi-band antenna can be used to cover multiple cellular phone communication bands, WiFi communication bands, Bluetooth communication bands, etc.

[0086] In addition, the wireless communication circuit 1120 may further include other circuits for implementing different communication-related functions. For example, the wireless communication circuit 1120 may include a proximity sensing circuit (not shown). In addition, the wireless communication circuit 1120 may further include a power adjustment circuit (not shown) for adjusting the power of the RF transceiver circuit 1121 in response to the detection result from the proximity sensing circuit.

[0087] The connections within RF circuit 1121 may include any suitable conductive paths over which radio frequency signals may be transmitted, including transmission line structures such as coaxial cables, microstrip transmission lines, stripline transmission lines, and the like.

[0088] During data transmission operations, control signals from processor 1200 may be transmitted to RF circuit 1121 to adjust output power in real time. For example, when data is being transmitted, RF circuit 1121 may be directed to increase or decrease the power level of the radio frequency signal provided to antenna assembly 1124 on the transmission line to ensure that regulatory limits on electromagnetic radiation emissions are met.

[0089] If the proximity sensing circuit has not detected the presence of an external object, power can be provided at a normal power controlled level. However, if the proximity measurement indicates that the user's finger or other body part or other external object is in close proximity to the antenna assembly (e.g., within 20 mm or less, within 15 mm or less, within 10 mm or less, etc.), the processor 1200 can respond accordingly by directing the RF circuit 1121 to transmit a radio frequency signal via the transmission line at a reduced power.

[0090] In addition to the components shown, the electronic device 1000 may also include other components for different functions. For example, the electronic device 1000 generally includes a housing that can be formed to serve as a ground plane for the antenna assembly 1124.

[0091] For other details of the electronic device 1000 , reference may be made to the aforementioned description of the antenna assembly according to the embodiment of the present disclosure, which will not be repeated here.

[0092] The embodiments of the present disclosure are described in a progressive manner, and each embodiment emphasizes the differences from other embodiments. Therefore, for the same or similar parts, one embodiment can refer to other embodiments. Since the methods disclosed in the embodiments correspond to the devices disclosed in the embodiments, the description of the methods is simple and can refer to the relevant parts of the devices.

[0093] Based on the description of the disclosed embodiments, those skilled in the art may implement or use the present disclosure. Various modifications to these embodiments may be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present disclosure. Therefore, the present disclosure is not limited to the embodiments described herein, but is identified as the widest scope according to the principles and novel features disclosed in the present disclosure.

Claims

1. An antenna assembly, comprising an antenna radiator, wherein: The antenna radiator comprises: a grounding element configured to be electrically connected to a ground plane at a grounding point; a feeding element configured to be electrically connected to the radio signal circuit at a feeding point; and Add-ons, wherein the ground element, the feed element and the additional element are physically separated and physically disconnected from each other, and at least a first portion of the additional element extends substantially parallel to at least a portion of the ground element to provide capacitive coupling between the additional element and the ground element during operation of the antenna assembly.

2. The antenna assembly according to claim 1, wherein: At least a second portion of the parasitic element extends substantially parallel to at least a portion of the feed element to provide capacitive coupling between the parasitic element and the feed element during operation of the antenna assembly.

3. The antenna assembly according to claim 1, further comprising: a first matching element configured to connect the ground element and the ground plane at the ground point; and a second matching element configured to connect the feeding element with the radio signal circuit at the feeding point.

4. The antenna assembly according to claim 3, wherein: The first matching element extends substantially parallel to the second matching element, and a length of the first matching element is substantially the same as a length of the second matching element.

5. The antenna assembly according to claim 3, wherein: The first matching element extends substantially parallel to the second matching element, and a length of the first matching element is shorter than a length of the second matching element.

6. The antenna assembly according to claim 3, wherein: An angle greater than 0 degrees and less than 30 degrees is formed between the first matching element and the second matching element.

7. The antenna assembly of claim 3, further comprising a dielectric carrier for supporting the antenna radiator.

8. The antenna assembly according to claim 7, wherein: The antenna radiator is planar.

9. The antenna assembly according to claim 8, wherein: The antenna radiator is arranged on the same plane as the ground plane.

10. The antenna assembly according to claim 8, wherein: The antenna radiator is arranged in a plane spaced apart from the ground plane and substantially parallel to the ground plane.

11. The antenna assembly according to claim 10, wherein: The first matching element and the second matching element are arranged in a plane perpendicular to the ground plane.

12. The antenna assembly according to claim 10, wherein: The ground point is located at a central portion of the ground plane, the antenna radiator protrudes outward relative to the ground point, and at least a portion of the antenna radiator faces the ground plane.

13. The antenna assembly according to claim 10, wherein: The grounding point is located at an edge of the ground plane, the antenna radiator protrudes to an inner side of the ground plane relative to the grounding point, and at least a portion of the antenna radiator faces the ground plane.

14. The antenna assembly according to claim 10, wherein: The grounding point is located at an edge of the ground plane, the antenna radiator protrudes to the outside of the ground plane relative to the grounding point, and no part of the antenna radiator faces the ground plane.

15. The antenna assembly according to any one of claims 1 to 14, wherein: The ground plane and the antenna radiator are formed on different layers of a printed circuit board.

16. The antenna assembly according to claim 1, wherein: The feed element is electrically connected to the radio signal circuit via an inner conductor of the coaxial cable, and the ground element is electrically connected to the ground plane via a conductive shield of the coaxial cable, wherein the conductive shield is concentric with and surrounds the inner conductor, and the inner conductor and the conductive shield are separated from each other by a dielectric insulator.

17. An electronic device comprising the antenna assembly according to any one of claims 1 to 16.

18. The electronic device according to claim 17, further comprising a housing, wherein: The housing serves as the ground plane.