Printed circuit board forming process

Abstract

The invention relates to the technical field of circuit board production, in particular to a printed circuit board forming process which uses printed circuit board forming equipment which comprises a slitting table, a slitting machine, a limiting partition plate, a suction cup rod, a power assembly, a first bearing plate and a second bearing plate. The slitting table is movably connected with a slitting machine used for cutting the circuit board. A limiting partition plate used for blocking chippings is fixedly connected to the slitting table. A plurality of suction cup rods for supporting and fixing the whole circuit board are connected to the limiting partition plate in a sliding manner; a power assembly is arranged on the slitting table; the power assembly is connected with a plurality of first bearing plates used for supporting the suction cup rods. The power assembly is connected with a plurality of second bearing plates. Each first bearing plate is attached to the upper side of the corresponding second bearing plate. And all the bearing plates I and all the bearing plates II are arranged to be in a transverse and longitudinal staggered state by taking a view from top to bottom as a reference.

Description

Technical Field

[0001] The invention relates to the technical field of circuit board production, and in particular to a printed circuit board molding process. Background Art

[0002] The circuit board slitting and forming process refers to the process of cutting a large-sized circuit board into multiple small-sized circuit boards for the convenience of subsequent assembly, testing and use. Currently, when slitting the circuit board, CNC machine tools are generally used to cut and form the circuit board.

[0003] When a CNC machine tool is used to cut and shape a whole circuit board, since the fixed base of the existing CNC machine tool is a flat plate, after the whole circuit board is fixed, the lower side of the whole circuit board is attached to the fixed base. During the process of cutting the circuit board, in order to prevent the fixed base from being cut and damaged, the cutter will not completely cut through the circuit board, so that after the whole circuit board is cut into multiple circuit boards, a separate step is required to peel the separated circuit boards from each other, which affects the overall production efficiency.

[0004] Furthermore, when the entire circuit board is cut, the debris is easily splashed into the reserved holes on the circuit board for the subsequent installation of electrical components, causing the reserved holes to be blocked by the debris, affecting the subsequent installation of the electrical components. Summary of the invention

[0005] In order to overcome the shortcomings of existing CNC machine tools that fail to completely cut through the circuit board during the cutting process, resulting in the need to separate the circuit board later, affecting the overall production efficiency, and the cut debris splashing into the reserved holes, affecting the subsequent installation of electrical components, the present invention provides a printed circuit board forming process.

[0006] The technical implementation scheme of the present invention is: a printed circuit board forming process, characterized in that it includes the following steps: Step 1: The entire circuit board is clamped by setting a fixing unit on the molding equipment, and a plurality of alternately arranged stripping units are provided in a matrix in the fixing unit to support and fix the entire circuit board; Step 2: Each time a circuit board is cut and separated, the corresponding stripping unit promptly strips the circuit board, and the stripping unit promptly strips the cut and separated circuit board; Step 3: By setting a convenient unloading unit on the molding equipment, the circuit boards that have been cut and separated are carried, so that the circuit boards that have been cut can be quickly collected and unloaded.

[0007] The molding equipment described in step 1 of the molding process includes a slitting table, a slitting machine and a suction device; the slitting table is movably connected with a slitting machine for cutting circuit boards; a cutting knife is provided on the slitting machine; a suction device for sucking cutting debris is provided outside the cutting knife of the slitting machine; it also includes a limited partition, a suction cup rod, a power component, a bearing plate 1 and a bearing plate 2; a limited partition for blocking debris is fixedly connected to the slitting table; a plurality of suction cup rods for supporting and fixing the entire circuit board are slidably connected to the limited partition; all The suction cup rods are all connected to an external air pump; a power assembly is arranged on the cutting table; a plurality of bearing plates 1 for supporting the suction cup rods are connected to the power assembly; each suction cup rod is located on the upper side of the corresponding bearing plate 1; one long side of each bearing plate 1 is arranged as an inclined surface; a plurality of bearing plates 2 are connected to the power assembly; one long side of each bearing plate 2 is arranged as an inclined surface; each bearing plate 1 is attached to the upper side of the bearing plate 2; based on looking from top to bottom, all bearing plates 1 and all bearing plates 2 are arranged in a horizontally and vertically staggered state.

[0008] As a further preferred embodiment, a ball bearing is also included; a ball bearing is rotatably connected to the lower side of each suction cup rod and is used to reduce the vibration of the suction cup rod.

[0009] As a further preferred solution, each bearing plate 1 is provided with a limiting groove 1 for enhancing the stability of the suction cup rod; each ball rolls in the corresponding limiting groove 1; and each bearing plate 2 is provided with a limiting groove 2.

[0010] As a further preferred solution, each limiting groove 1 is configured to be in an inclined state with the left side higher and the right side lower; each limiting groove 2 is configured to be in an inclined state with the rear side higher and the front side lower.

[0011] As a further preferred solution, a baffle is also included; each suction cup rod is fixed with a baffle for enhancing the stability of the circuit board; each baffle is in contact with the lower side of the circuit board; each baffle is provided with a blocking layer for blocking debris.

[0012] As a further preferred solution, the barrier layer is made of breathable material.

[0013] As a further preferred solution, it also includes a carrying frame; the slitting table is connected to a carrying frame for convenient material unloading; the carrying frame is provided with a plurality of avoidance grooves for avoiding the baffle.

[0014] As a further preferred solution, a plurality of convex strips for limiting the circuit board are arranged in the bearing frame.

[0015] As a further preferred solution, it also includes a bellows; a bellows for blocking debris is fixedly connected to the upper side of the limiting partition; each bellows is located on the outside of the corresponding suction cup rod; the upper side of each bellows is fixedly connected to the upper end of the suction cup rod.

[0016] The beneficial effects are as follows: the present invention realizes the lowering of the cut circuit board through the first and second carrier plates, so that the circuit boards are separated immediately after the cutting is completed, and there is no need to peel the circuit boards from each other later, thereby improving the overall production efficiency of the circuit board; The debris falling to the lower side of the circuit board is blocked by the limiting partition to prevent the debris from falling onto the first and second load plates, thereby avoiding affecting the separation of the circuit board; The debris carried in the airflow is intercepted by the barrier layer to prevent the debris carried in the airflow from flowing through the reserved hole from the lower side of the circuit board, thereby preventing the reserved hole from being blocked by the debris, thereby ensuring the normal assembly of the subsequent circuit board and electrical components; The circuit boards are carried by the carrying frame, so that the cut circuit boards can be quickly collected, further improving the production efficiency of the circuit boards. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a three-dimensional structural schematic diagram of the printed circuit board forming process of the present invention; Figure 2 It is a schematic diagram of the combined three-dimensional structure of the slitting table, power assembly, limiting partition and bearing frame of the present invention; Figure 3 It is a schematic diagram of the combined three-dimensional structure of the power assembly, the first bearing plate, the second bearing plate, the limit partition, the suction cup rod and the bellows of the present invention; Figure 4 It is a schematic diagram of a three-dimensional structure of a combination of a first bearing plate, a second bearing plate, a suction cup rod, a baffle plate and a bellows according to the present invention; Figure 5 It is a side view of the combination of the first bearing plate, the second bearing plate, the limiting partition plate, the suction cup rod, the ball bearing and the bellows of the present invention; Figure 6 It is a schematic diagram of the three-dimensional structure of the carrying frame of the present invention; Figure 7 It is a cross-sectional view of the carrying frame of the present invention.

[0018] The reference numbers in the figure are: 1-slitting table, 2-slitting machine, 3-suction device, 4-carrying plate one, 4001-limiting groove one, 5-carrying plate two, 5001-limiting groove two, 101-slide rail one, 102-electric slider one, 103-slide rail two, 104-electric slider two, 201-limiting partition, 202-suction cup rod, 203-ball, 204-baffle, 20401-blocking layer, 301-carrying frame, 30101-avoidance groove, 30102-convex strip, 401-corrugated pipe. DETAILED DESCRIPTION

[0019] The preferred technical solutions of the present invention are described in detail below with reference to the accompanying drawings.

[0020] Example 1 A printed circuit board forming process, characterized in that it comprises the following steps: Step 1: The entire circuit board is clamped by setting a fixing unit on the molding equipment, and a plurality of alternately arranged stripping units are provided in a matrix in the fixing unit to support and fix the entire circuit board; Step 2: After each circuit board is cut and separated, the corresponding stripping unit strips the circuit board in time. The stripping unit strips the cut and separated circuit boards in time, thereby improving the overall production efficiency of the circuit boards. Step 3: By setting a convenient unloading unit on the molding equipment, the circuit boards that have been cut and separated are carried, so that the circuit boards that have been cut can be quickly collected and unloaded.

[0021] A printed circuit board forming process, such as Figure 1-Figure 7 As shown, the molding equipment described in step 1 of the molding process comprises a slitting table 1, a slitting machine 2 and an aspirator 3; the slitting table 1 is movably connected with the slitting machine 2; the slitting machine 2 is provided with a cutter; the outside of the cutter of the slitting machine 2 is provided with an aspirator 3 for aspirating cutting debris; It also includes a limited spacer 201, a suction cup rod 202, a power assembly, a support plate 4 and a support plate 2 5; the limited spacer 201 is fixedly connected to the slitting table 1; a plurality of suction cup rods 202 in a rectangular array are slidably connected to the limited spacer 201; all suction cup rods 202 are connected to an external air pump; a power assembly is provided on the slitting table 1; a plurality of support plates 4 are connected to the power assembly; each suction cup rod 202 is located on the upper side of the corresponding support plate 4; one side long side of each support plate 4 is arranged as an inclined surface; a plurality of support plates 2 5 are connected to the power assembly; one side long side of each support plate 2 5 is arranged as an inclined surface; each support plate 1 4 is attached to the upper side of the support plate 2 5; based on the view from top to bottom, all support plates 1 4 and all support plates 2 5 are arranged in a horizontal and vertical staggered state.

[0022] The power assembly includes a slide rail 101, an electric slider 102, a slide rail 103 and an electric slider 104; two slide rails 101 that are symmetrical in front and back are fixedly connected to the cutting table 1; each slide rail 101 is slidably connected to a plurality of electric sliders 102; each of the two electric sliders 102 that are opposite to each other in the front and back are fixedly connected to a supporting plate 1 4; two slide rails 103 that are symmetrical in the left and right are fixedly connected to the cutting table 1; each slide rail 103 is slidably connected to a plurality of electric sliders 104; each of the two electric sliders 104 that are opposite to each other in the left and right are fixedly connected to a supporting plate 2 5.

[0023] It also includes a ball 203; a ball 203 is rotatably connected to the lower side of each suction cup rod 202.

[0024] A limiting groove 4001 is provided on each bearing plate 1 4 ; each ball 203 rolls in the corresponding limiting groove 4001 ; and a limiting groove 5001 is provided on each bearing plate 2 5 .

[0025] Each limiting groove 4001 is arranged to be in an inclined state with the left side higher and the right side lower; each limiting groove 5001 is arranged to be in an inclined state with the back side higher and the front side lower, which is beneficial to reducing the falling height of the suction cup rod 202 when it is separated from the supporting plate 1 4 and the supporting plate 2 5, reducing the vibration of the suction cup rod 202 after separation and falling, and enhancing the fixing effect of the suction cup rod 202 on the circuit board, so as to facilitate the subsequent supporting plate 1 4 and the supporting plate 2 5 to shovel up the suction cup rod 202 for resetting.

[0026] It also includes a baffle 204; each suction cup rod 202 is fixed with a baffle 204; each baffle 204 is in contact with the lower side of the circuit board; and each baffle 204 is provided with a blocking layer 20401.

[0027] The barrier layer 20401 is made of a breathable material, which allows the suction airflow to pass through the barrier layer 20401 to blow out the debris in the reserved holes on the circuit board, thereby preventing the debris from clogging the reserved holes on the circuit board and avoiding affecting the subsequent circuit board assembly.

[0028] It also includes a carrying frame 301 ; the carrying frame 301 is detachably connected to the slitting table 1 ; and a plurality of avoidance grooves 30101 are provided on the carrying frame 301 .

[0029] A plurality of convex strips 30102 are arranged in the carrying frame 301 .

[0030] When the whole circuit board is being formed, the staff first places the carrying frame 301 on the slitting table 1, so that the bottom of the carrying frame 301 is in contact with the upper side of the limiting partition 201, and then the staff places the whole circuit board to be cut on the upper side of all the suction cup rods 202, and each circuit single board is in contact with the upper side of a suction cup rod 202, and then controls the external air pump to suck and fix the whole circuit board through the suction cup rod 202. After the whole circuit board is fixed, the slitting machine 2 is controlled to move from back to front on the slitting table 1, so that the cutter on the slitting machine 2 cuts the whole circuit board from back to front. During the cutting process, the suction device 3 is controlled to absorb and collect the debris cut from the circuit board. At the same time, the limiting partition 201 is used to block the debris falling to the lower side of the circuit board to prevent the debris from falling onto the carrying plate 1 4 and the carrying plate 2 5, so as to avoid affecting the subsequent separation of the circuit single board; After the slitting machine 2 cuts the left side of the whole circuit board into a long circuit board composed of several single circuit boards, the electric slider 102 is controlled to drive the carrier plate 4 to move to the left on the slide rail 101, and the support of the carrier plate 4 on the left suction cup rod 202 is released, so that the left suction cup rod 202 drops on the limiting partition 201 under the action of gravity, thereby driving the cut long circuit board to drop and separate from the whole circuit board, and the left suction cup rod 202 is received by the carrier plate 25, and then the slitting machine 2 is controlled to drive the suction device 3 to move from front to back between the long circuit board and the whole circuit board. In this process, since the interval between the long circuit board and the whole circuit board increases after it drops and separates, it is convenient for airflow and debris to pass through, and the suction device 3 is sucked. When the device 3 passes by, it is beneficial to suck and collect the debris that falls on the limiting partition 201, reduce the residual debris accumulated on the lower side of the circuit board, and help to reduce the subsequent cleaning work of the equipment. When the slitting machine 2 drives the suction device 3 to move backward and reset to the rear side of the entire circuit board, the slitting machine 2 is controlled to drive the suction device 3 to move to the right, ready to cut the entire circuit board from back to front again. After each long circuit board is cut out, the electric slider 102 drives the carrier plate 4 to slide to the left on the slide rail 101, so that the suction cup rod 202 drives the cut long circuit board to descend and separate from the entire circuit board under the action of gravity, and the suction cup rod 202 is received by the carrier plate 2 5, which is convenient for the suction device 3 to suck and collect the debris.

[0031] After the whole circuit board is cut into several long circuit boards from back to front by the slitting machine 2, the slitting machine 2 is controlled to move to the left front of all the long circuit boards, and then the slitting machine 2 is controlled to move from left to right on the slitting table 1, so that the cutter on the slitting machine 2 cuts the long circuit board into several circuit boards from left to right. During the cutting process, the suction device 3 is controlled to absorb and collect the cut debris. After the slitting machine 2 cuts the long circuit board into several circuit boards, the electric slider 104 is controlled to drive the carrier plate 5 to move backward on the slide rail 103, release the bearing of the carrier plate 5 on the suction cup rod 202, and make the suction cup rod 202 drop again on the limit partition 201, thereby driving The circuit board is lowered and separated from the long circuit board, and then the slitting machine 2 is controlled to drive the suction device 3 to move from right to left between the circuit board and the long circuit board. In this process, since the interval between the circuit board and the long circuit board increases after the circuit board is lowered and separated, it is beneficial for airflow and debris to pass through, and it is convenient for the suction device 3 to absorb and collect the debris that falls on the limiting partition 201 when moving, which is beneficial to reduce the subsequent cleaning work of the equipment. At the same time, the present invention makes the cut circuit board lower through the carrier plate 1 4 and the carrier plate 2 5, so that the circuit boards are immediately separated after cutting, and there is no need to peel the circuit boards from each other subsequently, thereby improving the overall production efficiency of the circuit board.

[0032] It is also considered that, since each circuit board is provided with a reserved hole for the subsequent installation of electrical components, when the suction device 3 sucks the debris on the lower side of the circuit board, part of the airflow carries the debris from the lower side of the circuit board through the reserved hole, and there is a situation where the reserved hole is blocked by the debris, which affects the subsequent assembly of the circuit board and the electrical components. The specific solution process is as follows: When the slitting machine 2 cuts the entire circuit board, the baffle 204 is attached to the lower side of the circuit board, which is beneficial to enhance the fixing effect of the circuit board and prevent the circuit board from being skewed and offset on the suction cup rod 202, thereby improving the stability of the circuit board during the cutting process. When the suction device 3 sucks the debris on the lower side of the circuit board, the debris entrained in the airflow is intercepted by a barrier layer 20401 made of a breathable material to prevent the debris entrained in the airflow from flowing through the reserved hole from the lower side of the circuit board, thereby preventing the reserved hole from being blocked by the debris. At the same time, the airflow passes through the barrier layer 20401 and flows through the reserved hole and then blows out to the upper side of the circuit board, thereby preventing the debris splashed to the upper side of the circuit board from falling into the reserved hole, thereby preventing the reserved hole from being blocked by the debris, thereby ensuring the normal progress of the subsequent assembly of the circuit board and electrical components.

[0033] When the carrier plate 1 4 and the carrier plate 2 5 are separated from the suction cup rod 202 during movement, the friction between the carrier plate 1 4 and the carrier plate 2 5 and the lower side of the suction cup rod 202 during movement is reduced by the ball 203, and the frustration caused by the hard friction between the suction cup rod 202 and the carrier plate 1 4 and the carrier plate 2 5 during movement and separation is reduced, which is beneficial to reduce the impact on the cutting of the circuit board. At the same time, the limit groove 1 4001 is set to a left high and right low inclined state, and the limit groove is set to a rear high and front low inclined state. The second 5001 limits the ball 203, and then limits the suction cup rod 202, which improves the stabilizing effect of the support plate 1 4 and the support plate 2 5 on the suction cup rod 202 when moving. At the same time, it is beneficial to reduce the falling difference when the suction cup rod 202 is separated from the support plate 1 4 and the support plate 2 5, and reduce the vibration of the suction cup rod 202 after it is separated and falls on the support plate 1 4 and the support plate 2 5, thereby enhancing the fixing effect of the suction cup rod 202 on the circuit board and further reducing the impact on the cutting of the circuit board.

[0034] After the whole circuit board is cut into circuit boards, the slitting machine 2 is controlled to drive the suction device 3 to move to the rear of the slitting table 1, and the external air pump is stopped to fix the circuit board by the suction cup rod 202. Then the staff lifts the carrying frame 301 from the slitting table 1, so that the avoidance groove 30101 carries the circuit board after passing through the baffle 204, so as to realize the rapid collection of the cut circuit boards, further improving the production efficiency of the circuit boards. When the carrying frame 301 is used to transport the circuit boards, each circuit board is separated by the convex strips 30102 to prevent the circuit boards from stacking and rubbing against each other during transportation, and to prevent the circuit boards from being worn, thereby improving the quality of the produced circuit boards. After the board is removed from the suction cup rod 202, the electric slider 104 is controlled to drive the supporting plate 25 to slide forward, and the suction cup rod 202 is scooped up by the inclined surface on the front side of the supporting plate 25, and then the electric slider 102 is controlled to drive the supporting plate 4 to move to the right, and the suction cup rod 202 is scooped up from the supporting plate 25 for reset by the inclined surface on the right side of the supporting plate 4. In this process, by setting the limit groove 4001 in a tilted state with the left higher and the right lower, and the limit groove 25001 in a tilted state with the back higher and the front lower, the ball 203 rolls more smoothly on the supporting plate 4 and the supporting plate 25, so that the supporting plate 4 and the supporting plate 25 can scoop up the suction cup rod 202 for reset and prepare for the next circuit board cutting work.

[0035] Example 2 On the basis of Example 1, Figure 3-Figure 5 As shown, it also includes a bellows 401; the upper side of the limiting partition 201 is fixedly connected with the bellows 401; each bellows 401 is located outside the corresponding suction cup rod 202; the upper side of each bellows 401 is fixedly connected to the upper end of the suction cup rod 202.

[0036] When the slitting machine 2 cuts the entire circuit board, the outer side of the suction cup rod 202 is covered by the bellows 401 to prevent debris from adhering to the outer side of the suction cup rod 202, and to prevent the suction cup rod 202 from being stuck by the debris adhering to the outer side of the suction cup rod 202 when it descends on the limiting partition 201, thereby preventing the suction cup rod 202 from being unable to drive the circuit board to be separated from the entire circuit board, thereby ensuring the normal separation work between the circuit boards.

[0037] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A printed circuit board forming process, characterized in that: The following steps are involved: Step 1: The entire circuit board is clamped by setting a fixing unit on the molding equipment, and a plurality of alternately arranged stripping units are provided in a matrix in the fixing unit to support and fix the entire circuit board; Step 2: Each time a circuit board is cut and separated, the corresponding stripping unit promptly strips the circuit board, and the stripping unit promptly strips the cut and separated circuit board; Step 3: By setting a convenient unloading unit on the molding equipment, the circuit boards that have been cut and separated are carried, so that the circuit boards that have been cut can be quickly collected and unloaded.

2. According to the printed circuit board molding process of claim 1, the molding equipment in step 1 of the molding process is characterized in that: The forming equipment comprises a slitting table (1), a slitting machine (2) and a suction device (3); the slitting table (1) is movably connected to the slitting machine (2) for cutting a circuit board; the slitting machine (2) is provided with a cutter; the outside of the cutter of the slitting machine (2) is provided with a suction device (3) for sucking cutting debris; the equipment is characterized in that it also comprises a limiting partition (201), a suction cup rod (202), a power component, a first bearing plate (4) and a second bearing plate (5); the slitting table (1) is fixedly connected to a limiting partition (201) for blocking debris; a plurality of suction cup rods (202) for supporting and fixing the entire circuit board are slidably connected to the limiting partition (201); the The invention discloses a method for manufacturing a cutting table (1) comprising: providing a power assembly on the cutting table (1); connecting the power assembly to a plurality of bearing plates (4) for supporting the suction cup rods (202); each suction cup rod (202) is located on the upper side of the corresponding bearing plate (4); one long side of each bearing plate (4) is arranged as an inclined surface; connecting the power assembly to a plurality of bearing plates (5); one long side of each bearing plate (5) is arranged as an inclined surface; each bearing plate (4) is attached to the upper side of the bearing plate (5); and based on the view from top to bottom, all bearing plates (4) and all bearing plates (5) are arranged in a horizontal and vertical staggered state.

3. A printed circuit board forming process according to claim 2, characterized in that: It also includes a ball (203); the lower side of each suction cup rod (202) is rotatably connected to a ball (203) for reducing vibration of the suction cup rod (202).

4. A printed circuit board forming process according to claim 2, characterized in that: Each bearing plate 1 (4) is provided with a limiting groove 1 (4001) for enhancing the stability of the suction cup rod (202); each ball (203) rolls in the corresponding limiting groove 1 (4001); and each bearing plate 2 (5) is provided with a limiting groove 2 (5001).

5. A printed circuit board forming process according to claim 3, characterized in that: Each limiting groove 1 (4001) is arranged in an inclined state with the left side higher and the right side lower; each limiting groove 2 (5001) is arranged in an inclined state with the rear side higher and the front side lower.

6. A printed circuit board forming process according to claim 4, characterized in that: It also includes a baffle (204); each suction cup rod (202) is fixedly connected to a baffle (204) for enhancing the stability of the circuit board; each baffle (204) is fitted with the lower side of the circuit board; and each baffle (204) is provided with a blocking layer (20401) for blocking debris.

7. A printed circuit board forming process according to claim 5, characterized in that: The barrier layer (20401) is made of breathable material.

8. A printed circuit board forming process according to claim 6, characterized in that: It also includes a carrying frame (301); the slitting table (1) is connected to the carrying frame (301) for convenient material unloading; the carrying frame (301) is provided with a plurality of avoidance grooves (30101) for avoiding the baffle plate (204).

9. A printed circuit board forming process according to claim 7, characterized in that: A plurality of convex strips (30102) for limiting the position of the circuit board are arranged in the bearing frame (301).

10. A printed circuit board forming process according to claim 8, characterized in that: It also includes a bellows (401); the upper side of the limiting partition (201) is fixedly connected with a bellows (401) for blocking debris; each bellows (401) is located outside the corresponding suction cup rod (202); the upper side of each bellows (401) is fixedly connected to the upper end of the suction cup rod (202).

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