Scribing structure for semiconductor wafer processing

Abstract

The invention discloses a scribing structure for semiconductor wafer processing, and belongs to the technical field of wafer processing. Comprising a cutterhead frame and a dicing blade rotationally mounted on the cutterhead frame; the cutter grinding disc assembly is rotationally mounted on the cutter disc frame on one side of the dicing cutter; the cutting fluid assembly is adjustably mounted on the cutter head frame on one side of the scribing cutter and is used for spraying cutting fluid to the intersection of the scribing cutter and the wafer; the cutter grinding disc assembly comprises a rotating shaft and two symmetrical cleaning discs fixed to the rotating shaft. The edge portions of the two cleaning discs are arranged on the two sides of the blade portion of the dicing blade and used for cleaning the blade portion of the dicing blade. According to the cutting fluid assembly, the influence of machining residues on the cutting precision is avoided; the cutter grinding disc assembly rotates relative to the dicing blade, wind pressure is formed when the cutter grinding disc assembly intersects with the dicing blade, the blade part is cleaned through high-pressure airflow, the cleanliness of the blade part is ensured, the cutting precision is further improved, the interior of the wafer is prevented from being damaged, and therefore the yield is increased.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer processing, and in particular to a dicing structure for semiconductor wafer processing. Background Art

[0002] In the field of semiconductor manufacturing, wafer dicing is a key link in the chip manufacturing process, and its quality and efficiency directly affect the chip yield and production cost. In the traditional wafer dicing process, after long-term use, the dicing knife is prone to accumulate processing residues on the blade, which not only reduces the cutting accuracy, but also may cause damage to the inside of the wafer, resulting in a decrease in the yield rate. Summary of the invention

[0003] The object of the present invention is to provide a dicing structure for semiconductor wafer processing, which can realize the cleaning of the blade during the cutting process of the dicing knife.

[0004] The present invention adopts the following technical solution: a dicing structure for semiconductor wafer processing, comprising a cutter head frame and a dicing knife rotatably mounted on the cutter head frame; Also includes: A knife grinding disc assembly is rotatably mounted on a knife disc frame on one side of the dicing knife; A cutting fluid component is adjustably mounted on a blade holder on one side of the dicing blade and is used to spray cutting fluid toward the intersection of the dicing blade and the wafer; Wherein, the sharpening disc assembly includes a rotating shaft and two symmetrical cleaning discs fixed on the rotating shaft; the edges of the two cleaning discs are arranged on both sides of the blade of the dicing knife for cleaning the blade of the dicing knife.

[0005] Further, the opposing surfaces of the two cleaning discs are conical surfaces, and a plurality of radial through grooves penetrating the cleaning discs in the thickness direction of the cleaning discs are formed on the conical surfaces; A fan blade disk is arranged on one side of the two cleaning disks which are away from each other, and a plurality of radial convex strips are fixed on one side of the fan blade disk which is close to the cleaning disk, and the radial convex strips cooperate to pass through corresponding radial through grooves; The radial convex strips of the fan blade disks on both sides are opposite to each other and form a wedge-shaped structure that matches with the blade of the dicing knife.

[0006] A sleeve is fixed on one side of the two cleaning discs which is away from each other; the sleeve is sleeved on the rotating shaft, and an external thread is provided on the sleeve; The sleeve is connected with a pressure plate through threads, and the pressure plate presses the fan disc onto the cleaning disc.

[0007] An annular positioning groove is provided on one side of the two cleaning discs which are away from each other; The fan blade disc is annular and is fitted in the annular positioning groove.

[0008] The fan blade disc is broken into two symmetrical parts from the middle.

[0009] A threaded sleeve is fixed on one side of the pressure plate away from the impeller disc; the threaded sleeve is connected to the sleeve through threads, and a hexagonal plane is provided on the threaded sleeve.

[0010] One end of the rotating shaft is provided with a positioning shoulder, and the other end is provided with a fastening nut; the two cleaning discs are positioned between the positioning shoulder and the fastening nut; the radial dimensions of the positioning shoulder and the fastening nut are smaller than the radial dimensions of the sleeve.

[0011] The dicing knife is installed on the cutter head frame through a transmission shaft; the cutter head frame is connected with a moving beam, and a power device for driving the transmission shaft and the rotating shaft is installed in the cutter head frame.

[0012] The cutting fluid assembly is fixed on a mounting block, and the mounting block is fixed on the cutter head frame through a long hole and bolts.

[0013] The beneficial effects of the present invention are: The grinding disc assembly comprises a cleaning disc and a fan blade disc. The radial through grooves on the cleaning disc and the radial convex strips on the fan blade disc cooperate with each other. A wedge-shaped gap is formed between the two opposite radial convex strips. By rotating relative to the dicing knife, wind pressure is formed when they intersect. The blade is cleaned by high-pressure airflow, ensuring the cleanliness of the blade and improving the cutting quality of the wafer. The fan disc and cleaning disc adopt a separate combined structure. The fan disc is divided into two symmetrical parts from the middle. The design of the upper pressure plate makes it easy to replace and maintain the fan disc. The cutting fluid assembly can adjust the angle through the positioning screw, and adjust the position through the long hole and bolt to ensure that the cutting fluid can be accurately sprayed to the intersection of the dicing knife and the wafer, cooling the dicing knife and wafer during the cutting process, while washing away the residue to keep the cutting area clean. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0015] Figure 1 The present invention is a front view of a dicing structure for semiconductor wafer processing.

[0016] Figure 2 It is the front view of the dicing knife and sharpening disc assembly in the present invention.

[0017] Figure 3 for Figure 2 Middle AA section view.

[0018] Figure 4 It is a three-dimensional diagram of the knife sharpening disc assembly in the present invention.

[0019] Figure 5 It is an exploded view of the knife grinding disc assembly in the present invention.

[0020] Description of reference numerals: 1. Knife disc holder; 2. Slicing knife; 21. Blade; 22. Transmission shaft; 3. Sharpening disc assembly; 31. rotating shaft; 311. positioning shoulder; 312. fastening nut; 32, cleaning disc; 321, radial through groove; 322, sleeve; 323, annular positioning groove; 33. fan blade disc; 331. radial convex strip; 34, pressure plate; 341, threaded sleeve; 4. Chip fluid assembly; 41. Mounting block; 5. Wafer; 6. Moving beam; 7. Positioning table. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0022] Embodiment 1: like Figures 1 to 3 As shown, the present invention provides a semiconductor wafer processing dicing structure, which mainly includes a cutter head frame 1, a dicing knife 2, a sharpening disc assembly 3 and a cutting fluid assembly 4. The cutter head frame 1 is connected under a moving beam 6, and the movement of the cutter head frame 1 is controlled by the moving beam 6.

[0023] The dicing blade 2 is fixed on the transmission shaft 22, and the dicing blade 2 has a blade 21 around it, and the cross section of the blade 21 is wedge-shaped. The transmission shaft 22 is rotatably mounted on the blade holder 1 and connected to the power device in the blade holder 1; the dicing blade 2 is driven to rotate by the power device, which can be a servo motor.

[0024] Combination Figures 1 to 5 As shown, the sharpening disc assembly 3 mainly includes a rotating shaft 31 , two cleaning discs 32 , two fan discs 33 and two pressure discs 34 .

[0025] Two cleaning discs 32 are symmetrically mounted on the rotating shaft 31; the opposing surfaces of the two cleaning discs 32 are closely attached to each other, and the periphery of the opposing surfaces of the two cleaning discs 32 is a conical surface, on which a plurality of radial through grooves 321 evenly distributed around the rotating shaft 31 are provided, and the radial through grooves 321 penetrate the cleaning discs 32 in the thickness direction of the cleaning discs 32. A sleeve 322 is fixed to the axis of the side away from the two cleaning discs 32, and the sleeve 322 and the cleaning disc 32 are an integrated structure; the sleeve 322 is mounted on the rotating shaft 31 and is provided with an external thread. An annular positioning groove 323 is provided on the side away from the two cleaning discs 32, and the annular positioning groove 323 is coaxial with the rotating shaft 31.

[0026] The fan blade disc 33 is annular and fits in the annular positioning groove 323 on the side of the cleaning disc 32. A plurality of radial ridges 331 are fixed on the side of the fan blade disc 33 close to the cleaning disc 32. The plurality of radial ridges 331 are evenly distributed around the rotating shaft 31. The radial ridges 331 pass through the corresponding radial through grooves 321 and reach between the two cleaning discs 32. The radial ridges 331 on both sides are opposite to each other and form a wedge-shaped gap that matches with the blade 21 of the dicing knife 2. The radial ridges 331 and the blade 21 are gap-matched and used to clean the blade 21 of the dicing knife 2. The fan blade disc 33 is broken into two symmetrical parts from the middle to facilitate the replacement of the fan blade disc 33.

[0027] The pressure plate 34 is connected to the sleeve 322 by threads; the inner side of the pressure plate 34 has a slot that matches the blade disc 33 and is used to press the blade disc 33. The side of the pressure plate 34 away from the blade disc 33 has a threaded sleeve 341 that is integrated with the pressure plate 34, and the threaded sleeve 341 is connected to the sleeve 322 by threads; the threaded sleeve 341 is provided with a hexagonal plane to facilitate the disassembly and assembly of the pressure plate 34.

[0028] The rotating shaft 31 is rotatably mounted on the cutter head frame 1 and connected to the power device in the cutter head frame 1, and the rotating shaft 31 is driven to rotate by the power device. One end of the rotating shaft 31 has a positioning shoulder 311, and the other end is installed with a fastening nut 312; the two cleaning discs 32 are positioned between the positioning shoulder 311 and the fastening nut 312; wherein, the radial dimensions of the positioning shoulder 311 and the fastening nut 312 are smaller than the radial dimensions of the sleeve 322, so as to avoid interference with the movement of the pressure plate 34 to both sides.

[0029] Embodiment 2: Based on the above embodiment 1, Figure 1 , Figure 2 As shown, the cutting liquid assembly 4 is hinged on the mounting block 41, and the angle of the cutting liquid assembly 4 can be adjusted by the positioning screw. The mounting block 41 is provided with a long hole, and the mounting block 41 is fixed to the cutter head frame 1 through the long hole and the bolt, and the position of the cutting liquid assembly 4 can be adjusted up and down. The wafer 5 is fixed on the positioning table 7, and the cutting liquid assembly 4 sprays the cutting liquid to the intersection of the dicing knife 2 and the wafer 5.

[0030] Working process: The wafer 5 is fixed on the positioning table 7, and the moving beam 6 drives the blade tray 1 to drive the dicing blade 2 to move. The power device in the blade tray 1 drives the dicing blade 2 and the cleaning disk 32 to rotate. Figure 1 As shown in the figure, the dicing knife 2 and the cleaning disk 32 both rotate counterclockwise; during the process of the dicing knife 2 cutting the wafer 5, the cutting liquid component 4 sprays cutting liquid to the intersection of the dicing knife 2 and the wafer 5 to cool the dicing knife 2 and the wafer 5 and wash away the residue; the dicing knife 2 and the cleaning disk 32 rotate in opposite directions at the intersection, wherein the radial ridges 331 on the inner side of the fan disk 33 and the blade 21 of the dicing knife 2 form wind pressure when they intersect, and the blade 21 of the dicing knife 2 is cleaned by the high-pressure airflow to ensure that there is no processing residue on the blade 21 before it enters the wafer 5, thereby improving the cutting accuracy of the wafer 5, avoiding damage to the inside of the wafer 5, and improving the yield rate.

[0031] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A dicing structure for semiconductor wafer processing, comprising a cutter head frame (1) and a dicing knife (2) rotatably mounted on the cutter head frame (1); It is characterized in that Also includes: A knife grinding disc assembly (3) is rotatably mounted on the knife disc frame (1) on one side of the slicing knife (2); A cutting liquid component (4) is adjustably mounted on the blade holder (1) on one side of the dicing blade (2) and is used to spray the cutting liquid toward the intersection of the dicing blade (2) and the wafer (5); The sharpening disc assembly (3) comprises a rotating shaft (31) and two symmetrical cleaning discs (32) fixed on the rotating shaft (31); the edges of the two cleaning discs (32) are arranged on both sides of the blade (21) of the dicing knife (2) and are used to clean the blade (21) of the dicing knife (2).

2. A semiconductor wafer processing dicing structure according to claim 1, characterized in that: The opposing surfaces of the two cleaning discs (32) are conical surfaces, and a plurality of radial through grooves (321) are formed on the conical surfaces and penetrate the cleaning discs (32) in the thickness direction of the cleaning discs (32); A fan blade disk (33) is provided on one side of the two cleaning disks (32) that is away from each other. A plurality of radial convex strips (331) are fixed on one side of the fan blade disk (33) that is close to the cleaning disk (32). The radial convex strips (331) cooperate to pass through corresponding radial through slots (321). The radial convex strips (331) of the fan blade disks (33) on both sides are opposite to each other and form a wedge-shaped structure that matches with the blade portion (21) of the dicing knife (2).

3. A semiconductor wafer processing dicing structure according to claim 2, characterized in that: A sleeve (322) is fixed to the side of the two cleaning discs (32) that is away from each other; the sleeve (322) is sleeved on the rotating shaft (31), and an external thread is formed on the sleeve (322); The sleeve (322) is threadably connected to a pressure plate (34), and the pressure plate (34) presses the fan disc (33) onto the cleaning disc (32).

4. The semiconductor wafer processing dicing structure according to claim 3, characterized in that: An annular positioning groove (323) is formed on one side of the two cleaning discs (32) that is away from each other; The fan blade disc (33) is annular in shape and is fitted into the annular positioning groove (323).

5. The semiconductor wafer processing dicing structure according to claim 4, characterized in that: The fan blade disc (33) is split in the middle into two symmetrical parts.

6. The semiconductor wafer processing dicing structure according to claim 3, characterized in that: A threaded sleeve (341) is fixed to a side of the pressure plate (34) away from the impeller plate (33); the threaded sleeve (341) is connected to the sleeve (322) via threads, and a hexagonal plane is formed on the threaded sleeve (341).

7. The semiconductor wafer processing dicing structure according to claim 3, characterized in that: One end of the rotating shaft (31) has a positioning shoulder (311), and the other end is mounted with a fastening nut (312); the two cleaning discs (32) are positioned between the positioning shoulder (311) and the fastening nut (312); and the radial dimensions of the positioning shoulder (311) and the fastening nut (312) are smaller than the radial dimensions of the sleeve (322).

8. The semiconductor wafer processing dicing structure according to claim 1, characterized in that: The slicing knife (2) is mounted on the cutter head frame (1) via a transmission shaft (22); the cutter head frame (1) is connected to a movable beam (6), and a power device for driving the transmission shaft (22) and a rotating shaft (31) is installed in the cutter head frame (1).

9. The semiconductor wafer processing dicing structure according to claim 1, characterized in that: The cutting fluid assembly (4) is fixed on a mounting block (41), and the mounting block (41) is fixed on the cutter head frame (1) via a long hole and bolts.

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