Polystyrene composite thermal-insulation integrated board for wall and preparation method of polystyrene composite thermal-insulation integrated board

Abstract

The invention relates to the technical field of building materials, and provides a polystyrene composite thermal-insulation integrated board for a wall and a preparation method of the polystyrene composite thermal-insulation integrated board. A polystyrene composite thermal insulation integrated board for a wall comprises a decorative layer and a base plate which are sequentially arranged from top to bottom, and the base plate is prepared from, by weight, 30-50 parts of polystyrene, 50-70 parts of cement, 8-20 parts of filler, 15-30 parts of titanium dioxide, 2-15 parts of oxidized polyethlene wax and 40-60 parts of water; the filling agent comprises copper sulfide and boron nitride. By means of the technical scheme, the problem that in the prior art, the compressive strength of a polystyrene composite heat preservation integrated plate base plate is poor is solved.

Description

Technical Field

[0001] This invention relates to the field of building materials technology, specifically to a polystyrene composite insulation integrated panel for walls and its preparation method. Background Technology

[0002] With the continuous development of the construction industry, the performance of wall insulation materials is receiving increasing attention. Traditional wall insulation boards have gradually revealed many problems in practical applications, especially their insufficient compressive strength.

[0003] Polystyrene composite insulation panels with low compressive strength are unable to stably bear the pressure transmitted from the upper structure in buildings. Over time, the panels will deform under the pressure, causing slight displacement and deformation of the overall building structure. This not only affects the flatness of the building's appearance but may also cause cracks in the interior walls and floors, seriously threatening the stability and durability of the building structure.

[0004] In terms of thermal insulation performance, the low compressive strength of the substrate causes the internal structure of the polystyrene composite insulation panel to be damaged under pressure. The originally uniform insulation pores are squeezed, deformed, or even ruptured, increasing air circulation and significantly reducing the insulation effect. This means that the building needs to consume more energy to maintain the indoor temperature, resulting in a huge waste of energy, which is inconsistent with the current concept of energy-saving and environmentally friendly buildings.

[0005] Safety hazards are also a significant concern. In extreme situations, such as earthquakes or strong winds, polystyrene composite insulation panels with low compressive strength may fail to provide sufficient cushioning and support for the building, potentially causing the panels to detach and posing a serious threat to the safety of people and property inside. Furthermore, even minor impacts during daily use can damage the panels, increasing maintenance costs and safety risks.

[0006] Against this backdrop, it is crucial to develop a polystyrene composite insulation integrated board with a high substrate compressive strength. Summary of the Invention

[0007] This invention proposes a polystyrene composite insulation integrated board for walls and its preparation method, which solves the problem of poor compressive strength of the substrate of polystyrene composite insulation integrated board in related technologies.

[0008] The technical solution of the present invention is as follows: This invention proposes a polystyrene composite thermal insulation integrated panel for walls, comprising a decorative layer and a substrate arranged sequentially from top to bottom. The raw materials of the substrate include the following components by weight: 30-50 parts polystyrene, 50-70 parts cement, 8-20 parts filler, 15-30 parts titanium dioxide, 2-15 parts oxidized polyethylene wax, and 40-60 parts water. The filler includes copper sulfide and boron nitride.

[0009] As a further technical solution, the preparation method of the filler includes the following steps: dissolving glucose in water, adding copper sulfide and boron nitride to obtain a mixture, concentrating the mixture, and calcining it to obtain the filler.

[0010] In this invention, the compressive strength of the substrate is further improved by calcining copper sulfide and boron nitride.

[0011] As a further technical solution, the mass ratio of copper sulfide, boron nitride, and glucose is 1:1.1~1.5:0.04; The mass ratio of glucose to water is 1~3:8.

[0012] As a further technical solution, the mass ratio of copper sulfide, boron nitride, and glucose is 1:1.3:0.04.

[0013] In this invention, the compressive strength of the substrate is further improved by adjusting the mass ratio of copper sulfide, boron nitride and glucose to 1:1.3:0.04.

[0014] As a further technical solution, the calcination temperature is 200~230℃ and the time is 3.5~4.5h.

[0015] As a further technical solution, the decorative layer includes one of a ceramic layer and a water-based sand layer; The raw materials of the substrate further include at least one of the following by weight: 10-15 parts plasticizer, 5-8 parts emulsifier, 15-25 parts foaming agent, 10-20 parts diluent, and 5-10 parts thickener; The plasticizer includes one or more of dibutyl phthalate, dioctyl adipate, and epoxy fatty acid methyl ester; The emulsifier includes one of sodium dodecyl sulfate, hexadecyltrimethylammonium bromide, and dodecyl dimethylbenzylammonium chloride; The foaming agent includes one or more of n-pentane, isopentane, and cyclopentane; The diluent includes one of xylene, toluene, and carbon tetrachloride; The thickener includes one of corn starch and tapioca flour.

[0016] In this invention, when the raw materials of the substrate also include plasticizers, the flexibility of the substrate is improved by adding plasticizers.

[0017] In this invention, when the raw materials for the substrate also include an emulsifier, adding an emulsifier helps to obtain a polystyrene emulsion with uniform particle size and stable performance during the polystyrene board manufacturing process.

[0018] In this invention, when the substrate material also includes a foaming agent, the addition of the foaming agent forms a foam structure, giving the substrate better thermal insulation properties.

[0019] In this invention, when the raw materials of the substrate also include a diluent, the viscosity of the material is reduced by adding the diluent, thereby improving the processing performance.

[0020] This invention also proposes a method for preparing a polystyrene composite insulation integrated panel for walls, comprising the following steps: S1. Heat oxidized polyethylene wax to melt, add titanium dioxide and mix evenly, then cool to room temperature to obtain pretreated titanium dioxide; S2. Mix the remaining components of the substrate, add the pretreated titanium dioxide, mix and then foam to obtain the substrate; S3. Following the order of decorative layer and substrate from top to bottom, the decorative layer is placed on the surface of the substrate to obtain the polystyrene composite insulation integrated board.

[0021] In this invention, titanium dioxide is pretreated with oxidized polyethylene wax, which improves the water resistance of the substrate.

[0022] As a further technical solution, the foaming process specifically involves preheating at 60~80℃ for 1~2 hours, adding it into a mold, keeping it at 150~170℃ for 15~30 minutes, cooling it to room temperature, and then demolding it.

[0023] As a further technical solution, the mass ratio of titanium dioxide to oxidized polyethylene wax is 5~9:1.

[0024] In this invention, the water resistance of the substrate is further improved by adjusting the mass ratio of titanium dioxide to oxidized polyethylene wax to 5~9:1.

[0025] As a further technical solution, the mass ratio of titanium dioxide to oxidized polyethylene wax is 7:1.

[0026] In this invention, the water resistance of the substrate is further improved by adjusting the mass ratio of titanium dioxide to oxidized polyethylene wax to 7:1.

[0027] As a further technical solution, the heating temperature is 160~180℃.

[0028] The working principle and beneficial effects of this invention are as follows: In this invention, the filler prepared from copper sulfide and boron nitride improves the compressive strength of the substrate, making the polystyrene insulation integrated board less prone to deformation during actual use, thus enhancing safety. In addition, the internal structure of the substrate is not easily damaged, ensuring the insulation capacity of the polystyrene insulation integrated board after long-term use, which is in line with the concept of energy conservation and environmental protection. Detailed Implementation

[0029] The technical solutions of the present invention will be clearly and completely described below with reference to the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0030] In the following examples and comparative examples, the polystyrene is GPPS 251, the cement is P.O42.5 silicate cement, the copper sulfide purity is 99.9 wt%, the boron nitride purity is 99 wt%, the glucose purity is 98 wt%, the titanium dioxide particle size is 1000 mesh, the oxidized polyethylene wax is OA6, the corn starch and cassava flour particle size is 100 mesh, the hexagonal stone particle size is 1000 mesh, the acrylic emulsion is PRIMAL ST-954, and the ceramic powder is silica powder with a particle size of 1000 mesh.

[0031] Example 1 A polystyrene composite insulation integrated panel for walls includes a water-coated sand layer and a substrate arranged sequentially from top to bottom. The raw materials of the substrate include the following components by weight: 50 parts polystyrene, 70 parts cement, 20 parts filler, 15 parts titanium dioxide, 15 parts oxidized polyethylene wax, 60 parts water, 15 parts plasticizer, 8 parts emulsifier, 25 parts foaming agent, 20 parts diluent, and 10 parts thickener. The fillers include copper sulfide and boron nitride; The mass ratio of copper sulfide to boron nitride is 1:2; The plasticizer is dibutyl phthalate; The emulsifier is sodium dodecyl sulfate; The foaming agent is n-pentane; The diluent is toluene; The thickener is corn starch; The preparation method of polystyrene composite insulation integrated wall panel includes the following steps: S1. Mix the components of the substrate, preheat at 80°C for 1 hour, add to the mold, keep at 170°C for 15 minutes, cool to room temperature, demold, and obtain the substrate. S2. Following the order of water-coated sand layer and substrate from top to bottom, the water-coated sand layer is placed on the surface of the substrate to obtain a polystyrene composite insulation integrated board. The method for setting the water-coated sand layer is to mix 200 parts of hexagonal stone, 100 parts of water, and 80 parts of acrylic emulsion to form a stable suspension dispersion system, apply it to the substrate surface, and dry it.

[0032] Example 2 A polystyrene composite insulation integrated panel for walls includes a ceramic layer and a substrate arranged sequentially from top to bottom. The raw materials of the substrate include the following components by weight: 30 parts polystyrene, 50 parts cement, 8 parts filler, 30 parts titanium dioxide, 2 parts oxidized polyethylene wax, 40 parts water, 10 parts plasticizer, 5 parts emulsifier, 15 parts foaming agent, 10 parts diluent, and 5 parts thickener. The fillers include copper sulfide and boron nitride; The mass ratio of copper sulfide to boron nitride is 1:0.8; The plasticizer is dioctyl adipate; The emulsifier is hexadecyltrimethylammonium bromide; The foaming agent is isopentane; The diluent is carbon tetrachloride; The thickener is tapioca flour; The preparation method of polystyrene composite insulation integrated wall panel includes the following steps: S1. Mix the components of the substrate, preheat at 60°C for 2 hours, add to the mold, keep at 150°C for 30 minutes, cool to room temperature, demold, and obtain the substrate. S2. Following the order of ceramic layer and substrate from top to bottom, the ceramic layer is placed on the surface of the substrate to obtain a polystyrene composite insulation integrated board. The method for setting the ceramic layer is to load ceramic powder into a plasma spraying powder feeding device and spray it.

[0033] Example 3 A polystyrene composite insulation integrated panel for walls includes a water-coated sand layer and a substrate arranged sequentially from top to bottom. The raw materials of the substrate include the following components by weight: 40 parts polystyrene, 60 parts cement, 10 parts filler, 16 parts titanium dioxide, 14 parts oxidized polyethylene wax, 50 parts water, 12 parts plasticizer, 6 parts emulsifier, 20 parts foaming agent, 15 parts diluent, and 8 parts thickener. The fillers include copper sulfide and boron nitride; The mass ratio of copper sulfide to boron nitride is 1:1.8; The plasticizer is epoxy fatty acid methyl ester; The emulsifier is dodecyl dimethyl benzyl ammonium chloride; The foaming agent is cyclopentane; The diluent is xylene; The thickener is tapioca flour; The preparation method of polystyrene composite insulation integrated wall panel includes the following steps: S1. Mix the components of the substrate, preheat at 70°C for 1.5 hours, add to the mold, keep at 160°C for 20 minutes, cool to room temperature, demold, and obtain the substrate; S2. Following the order of water-coated sand layer and substrate from top to bottom, the water-coated sand layer is placed on the surface of the substrate to obtain a polystyrene composite insulation integrated board. The method for setting the water-coated sand layer is to mix 150 parts of hexagonal stone, 80 parts of water, and 70 parts of acrylic emulsion to form a stable suspension dispersion system, apply it to the substrate surface, and dry it.

[0034] Example 4 A polystyrene composite insulation integrated panel for walls includes a water-coated sand layer and a substrate arranged sequentially from top to bottom. The raw materials of the substrate include the following components by weight: 40 parts polystyrene, 60 parts cement, 10 parts filler, 16 parts titanium dioxide, 14 parts oxidized polyethylene wax, 50 parts water, 12 parts plasticizer, 6 parts emulsifier, 20 parts foaming agent, 15 parts diluent, and 8 parts thickener. The preparation method of the filler includes the following steps: dissolving glucose in water, adding copper sulfide and boron nitride to obtain a mixture, concentrating the mixture, drying it, and calcining it at 220°C for 4 hours to obtain the filler; The mass ratio of copper sulfide, boron nitride, and glucose is 1:1.8:0.04; The mass ratio of glucose to water is 1:4; The plasticizer is epoxy fatty acid methyl ester; The emulsifier is dodecyl dimethyl benzyl ammonium chloride; The foaming agent is cyclopentane; The diluent is xylene; The thickener is tapioca flour; The preparation method of polystyrene composite insulation integrated wall panel includes the following steps: S1. Mix the components of the substrate, preheat at 70°C for 1.5 hours, add to the mold, keep at 160°C for 20 minutes, cool to room temperature, demold, and obtain the substrate; S2. Following the order of water-coated sand layer and substrate from top to bottom, the water-coated sand layer is placed on the surface of the substrate to obtain a polystyrene composite insulation integrated board. The method for setting the water-coated sand layer is to mix 150 parts of hexagonal stone, 80 parts of water, and 70 parts of acrylic emulsion to form a stable suspension dispersion system, apply it to the substrate surface, and dry it.

[0035] Example 5 The only difference between this embodiment and Embodiment 4 is that the mass ratio of copper sulfide, boron nitride, and glucose in this embodiment is 1:1.0:0.04.

[0036] Example 6 The only difference between this embodiment and Embodiment 4 is that the mass ratio of copper sulfide, boron nitride, and glucose in this embodiment is 1:1.1:0.04.

[0037] Example 7 The only difference between this embodiment and Embodiment 4 is that the mass ratio of copper sulfide, boron nitride, and glucose in this embodiment is 1:1.3:0.04.

[0038] Example 8 The only difference between this embodiment and Embodiment 4 is that the mass ratio of copper sulfide, boron nitride, and glucose in this embodiment is 1:1.5:0.04.

[0039] Example 9 The only difference between this embodiment and Embodiment 3 is that the preparation method of the polystyrene composite insulation integrated panel for walls in this embodiment includes the following steps: S1. Heat oxidized polyethylene wax at 180°C until it melts, add titanium dioxide and mix evenly, then cool to room temperature to obtain pretreated titanium dioxide; S2. Mix the remaining components of the substrate, add pretreated titanium dioxide, preheat at 70°C for 1.5 hours, pour into a mold, keep at 160°C for 20 minutes, cool to room temperature, and demold to obtain the substrate. S3. Following the order of decorative layer and substrate from top to bottom, the water-coated sand layer is placed on the surface of the substrate to obtain a polystyrene composite insulation integrated board. The method for setting the water-coated sand layer is to mix 150 parts of hexagonal stone, 80 parts of water, and 70 parts of acrylic emulsion to form a stable suspension dispersion system, apply it to the substrate surface, and dry it.

[0040] Example 10 The difference between this embodiment and embodiment 9 is that the raw materials of the substrate in this embodiment include the following components by weight: 40 parts polystyrene, 60 parts cement, 10 parts filler, 28 parts titanium dioxide, 2 parts oxidized polyethylene wax, 50 parts water, 12 parts plasticizer, 6 parts emulsifier, 20 parts foaming agent, 15 parts diluent, and 8 parts thickener.

[0041] Example 11 The difference between this embodiment and embodiment 9 is that the raw materials of the substrate in this embodiment include the following components by weight: 40 parts polystyrene, 60 parts cement, 10 parts filler, 25 parts titanium dioxide, 5 parts oxidized polyethylene wax, 50 parts water, 12 parts plasticizer, 6 parts emulsifier, 20 parts foaming agent, 15 parts diluent, and 8 parts thickener.

[0042] Example 12 The difference between this embodiment and embodiment 9 is that the raw materials of the substrate in this embodiment include the following components by weight: 40 parts polystyrene, 60 parts cement, 10 parts filler, 26.25 parts titanium dioxide, 3.75 parts oxidized polyethylene wax, 50 parts water, 12 parts plasticizer, 6 parts emulsifier, 20 parts foaming agent, 15 parts diluent, and 8 parts thickener.

[0043] Example 13 The difference between this embodiment and embodiment 9 is that the raw materials of the substrate in this embodiment include the following components by weight: 40 parts polystyrene, 60 parts cement, 10 parts filler, 27 parts titanium dioxide, 3 parts oxidized polyethylene wax, 50 parts water, 12 parts plasticizer, 6 parts emulsifier, 20 parts foaming agent, 15 parts diluent, and 8 parts thickener.

[0044] Comparative Example 1 The only difference between this comparative example and Example 2 is that the raw materials of the substrate of this comparative example include the following components by weight: 30 parts polystyrene, 50 parts cement, 8 parts filler, 30 parts titanium dioxide, 2 parts oxidized polyethylene wax, 40 parts water, 10 parts plasticizer, 5 parts emulsifier, 15 parts foaming agent, 10 parts diluent, and 5 parts thickener. The filler is copper sulfide.

[0045] Comparative Example 2 The only difference between this comparative example and Example 2 is that the raw materials of the substrate of this comparative example include the following components by weight: 30 parts polystyrene, 50 parts cement, 8 parts filler, 30 parts titanium dioxide, 2 parts oxidized polyethylene wax, 40 parts water, 10 parts plasticizer, 5 parts emulsifier, 15 parts foaming agent, 10 parts diluent, and 5 parts thickener. The filler is boron nitride.

[0046] Experimental Example 1 The compressive strength of the substrates prepared in Examples 1-8 and Comparative Examples 1-2 was tested according to the method specified in GB / T 5486-2008 "Test Methods for Inorganic Rigid Thermal Insulation Products".

[0047] The compressive strength is the arithmetic mean of the experimental data of 5 specimens, accurate to 0.01 MPa.

[0048] The test results are shown in Table 1.

[0049]

[0050] Comparing Example 2 with Comparative Examples 1 and 2, it is shown that in this invention, copper sulfide and boron nitride are used as fillers, and copper sulfide and boron nitride have a synergistic effect, which improves the compressive strength of the substrate.

[0051] Comparing Examples 4-8 with Example 3, it is evident that the calcination treatment of copper sulfide, boron nitride, and glucose in this invention further improves the compressive strength of the substrate.

[0052] Experiment Example 2 The substrates obtained in Examples 1-3 and Examples 9-13 were tested for water absorption rate according to the method specified in GB / T 5486-2008 "Test Methods for Inorganic Rigid Thermal Insulation Products".

[0053] The water absorption rate is the arithmetic mean of the experimental data of three samples, accurate to 0.1.

[0054] The test results are shown in Table 2.

[0055]

[0056] Comparing Examples 9-13 with Example 3, it is evident that the present invention uses oxidized polyethylene wax to pretreat titanium dioxide, which further improves the water resistance of the substrate.

[0057] Experimental Example 3 Example 3 was tested for thermal conductivity and softening coefficient according to the method specified in JG / T 536-2017 "Thermosetting Composite Polystyrene Foam Insulation Board".

[0058] The thermal conductivity is the arithmetic mean of the experimental data of two samples, accurate to 0.001 W / (m·K). The softening coefficient is accurate to 0.1.

[0059] The test results are shown in Table 3.

[0060]

[0061] The test results of Example 3 show that the polystyrene composite insulation integrated panel for walls prepared by the present invention meets the needs of actual use.

[0062] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A polystyrene composite thermal insulation integrated board for wall, characterized in that: It comprises a decorative layer and a substrate arranged in sequence from top to bottom, wherein the raw materials of the substrate comprise the following components by weight: 30-50 parts of polystyrene, 50-70 parts of cement, 8-20 parts of filler, 15-30 parts of titanium dioxide, 2-15 parts of oxidized polyethylene wax, and 40-60 parts of water; The filler includes copper sulfide and boron nitride.

2. The polystyrene composite thermal insulation integrated board for wall according to claim 1, characterized in that: The preparation method of the filler comprises the following steps: dissolving glucose in water, adding copper sulfide and boron nitride to obtain a mixed solution, concentrating the mixed solution, and calcining to obtain the filler.

3. The polystyrene composite thermal insulation integrated board for wall according to claim 2, characterized in that: The mass ratio of copper sulfide, boron nitride and glucose is 1:1.1-1.5:0.04; The mass ratio of glucose to water is 1-3:

8.

4. The polystyrene composite thermal insulation integrated board for wall according to claim 3, characterized in that: The mass ratio of the copper sulfide, boron nitride and glucose is 1:1.3:0.

04.

5. The polystyrene composite thermal insulation integrated board for wall according to claim 2, characterized in that: The calcination temperature is 200-230° C. and the calcination time is 3.5-4.5 hours.

6. The polystyrene composite thermal insulation integrated board for wall according to claim 1, characterized in that: The decorative layer includes one of a ceramic layer and a water-covered sand layer; The raw materials of the substrate further include at least one of the following characteristics by weight: 10-15 parts of plasticizer, 5-8 parts of emulsifier, 15-25 parts of foaming agent, 10-20 parts of diluent, and 5-10 parts of thickener; The plasticizer includes one or more of dibutyl phthalate, dioctyl adipate, and epoxy fatty acid methyl ester; The emulsifier includes one of sodium lauryl sulfate, hexadecyltrimethylammonium bromide and dodecyldimethylbenzylammonium chloride; The foaming agent includes one or more of n-pentane, isopentane and cyclopentane; The diluent includes one of xylene, toluene and carbon tetrachloride; The thickener includes one of corn starch and tapioca flour.

7. The method for preparing a polystyrene composite thermal insulation integrated board for wall according to any one of claims 1 to 6, characterized in that: The following steps are involved: S1, heating the oxidized polyethylene wax until it is melted, adding titanium dioxide and mixing evenly, and cooling to room temperature to obtain pretreated titanium dioxide; S2, mixing the remaining components of the substrate, adding the pretreated titanium dioxide, and performing foaming treatment after mixing to obtain the substrate; S3. Disposing the decorative layer on the surface of the substrate in the order of the decorative layer and the substrate from top to bottom to obtain the polystyrene composite thermal insulation integrated board.

8. The method for preparing a polystyrene composite thermal insulation integrated board for wall according to claim 7, characterized in that: The mass ratio of the titanium dioxide to the oxidized polyethylene wax is 5-9:

1.

9. The method for preparing a polystyrene composite thermal insulation integrated board for wall according to claim 8, characterized in that: The mass ratio of the titanium dioxide to the oxidized polyethylene wax is 7:

1.

10. The method for preparing a polystyrene composite thermal insulation integrated board for wall according to claim 7, characterized in that: The heating temperature is 160-180°C.

Images