Acrylate resin for wafer cutting adhesive tape and preparation method thereof

Abstract

The invention discloses acrylate resin for a wafer cutting adhesive tape and a preparation method of the acrylate resin. The synthetic raw materials of the acrylate resin comprise a soft monomer, a hard monomer, a functional monomer, a solvent and an initiator. The prepared acrylate resin for the wafer cutting adhesive tape is stable in molecular weight and molecular weight distribution, and the wafer cutting adhesive tape prepared from the acrylate resin is excellent and stable in cutting performance, good in stripping force time performance and pickup performance, free of silicon powder permeation, cracking and adhesive residue problems and capable of meeting the application requirements in the field of wafer cutting.

Description

Technical Field

[0001] The invention relates to the field of semiconductor wafer dicing tape, and in particular to an acrylic resin for wafer dicing tape and a preparation method thereof. Background Art

[0002] Semiconductor chips are key components of various electronic devices. With the miniaturization and multifunctionality of electronic products, semiconductor chips have become smaller and thinner. Therefore, wafers need to be cut to meet chip size requirements. The cut wafers also need to go through processes such as expansion and picking. In the three processes of cutting-expanding-picking, wafer cutting tape is required as a carrier to protect the wafer.

[0003] Due to the complexity and high cost of chip manufacturing, wafer cutting must ensure stability and reliability. However, during the process of cutting-expanding-picking up, the wafer is prone to problems such as silicon powder penetration, cracking, residual adhesive, flying materials, and rupture. Therefore, the performance requirements of the dicing tape as a carrier are extremely high. It is necessary to provide sufficient adhesion to protect the wafer during cutting, prevent the wafer from falling off during expansion, and facilitate picking up without residual adhesive. In addition, there may be a time interval between wafer cutting and picking up, and the peeling force of the dicing tape over time is particularly important.

[0004] In summary, the cutting performance and stability of wafer dicing tape are indispensable. As the main body of wafer dicing tape, the batch stability of acrylic resin is extremely important. Summary of the invention

[0005] In order to solve the deficiencies of the prior art, the object of the present invention is to provide an acrylic resin for wafer dicing tape and a preparation method thereof.

[0006] In order to solve the above technical problems, the technical solution adopted by the present invention is:

[0007] In a first aspect, the present invention provides an acrylic resin for wafer dicing tape, wherein the synthetic raw materials include a soft monomer, a hard monomer, a functional monomer, a solvent and an initiator;

[0008] The soft monomer is selected from one or more monomers represented by formula I and / or formula II; wherein R1 is methyl or cyano, n1 is 5 to 30; or R1 is a hydrogen atom, n1 is 1 to 30; R2 is methyl or cyano, n2 is 3 to 30; or R2 is a hydrogen atom, n2 is 1 to 30;

[0009]

[0010] The hard monomer is selected from one or more of the monomers represented by formula III, the monomers represented by formula IV, vinyl acetate, 2-butenenitrile, acrylonitrile, 3-pentenenitrile, 4-pentenenitrile, 2-pentenenitrile, 3-methyl-5-phenyl-2-pentenenitrile, styrene, and acrylamide; wherein R3 is methyl or cyano, and n3 is 0 to 4; or R3 is a hydrogen atom, and n3 is 0; R4 is methyl or cyano, and n4 is 0 to 2; R4 is a hydrogen atom, and n4 is 0;

[0011]

[0012] The functional monomer is selected from one or more of acrylic acid, methacrylic acid, hydroxyethyl acrylate, hydroxyethyl methacrylate, hydroxypropyl acrylate, hydroxypropyl methacrylate, and methacrylamide.

[0013] Furthermore, the mass ratio of the soft monomer, the hard monomer and the functional monomer is (50-80): (15-45): (0.5-10).

[0014] Furthermore, the initiator is selected from one or more of azobisisobutyronitrile and dibenzoyl peroxide.

[0015] Furthermore, the amount of the initiator used is 0.05-2% of the total mass of the soft monomer, the hard monomer and the functional monomer, preferably 0.05-0.5%.

[0016] Furthermore, the solvent is selected from one or more of toluene, ethyl acetate, chloroform, cumene and xylene.

[0017] Furthermore, the amount of the solvent used is 65-235% of the total mass of the soft monomer, the hard monomer and the functional monomer.

[0018] Furthermore, the weight average molecular weight of the acrylic resin for wafer dicing tape is 100-2000KD, preferably 100-1000KD, preferably 800KD; the glass transition temperature of the acrylic resin for wafer dicing tape is -(35-10)°C.

[0019] In a second aspect, the present invention provides a method for preparing the acrylic resin for wafer dicing tape, comprising the following steps:

[0020] (1) Under the protection of inert gas, 0-10% soft monomer, 0-10% hard monomer, and 5-30% solvent are added to the reactor, and a mixture of 30-75% soft monomer, 30-75% hard monomer, 20-100% functional monomer, 5-50% solvent and 10-40% initiator is added dropwise at 65-100° C. The addition is completed within 5 hours, and the reaction is continued at the temperature for 0.1-3 hours;

[0021] (2) At 65-100° C., continue to dropwise add a mixture of 0-70% soft monomer, 0-70% hard monomer, 0-80% functional monomer, 10-45% solvent and 35-85% initiator. The addition is completed within 4 hours, and the reaction is continued at the temperature for 0.1-3 hours;

[0022] (3) At 65-100° C., continue to dropwise add a mixture of 0-70% soft monomer, 0-70% hard monomer, 0-80% functional monomer, 5-80% solvent and 1-25% initiator. Complete the addition within 4 hours, continue to keep the temperature for 0.1-3 hours, and then cool down to obtain the product.

[0023] In a third aspect, the present invention provides a wafer dicing tape, wherein the wafer dicing tape is prepared by the following method:

[0024] The synthesized acrylate resin is diluted with the solvent used to prepare the acrylate resin, a curing agent is added, the mixture is stirred evenly, and then coated on the release film, and after drying, transfer coating to the base film and aging, the wafer dicing tape is obtained.

[0025] Furthermore, the dilution ratio is 15-25% of the solid content.

[0026] Furthermore, the curing agent is one or more of toluene diisocyanate (TDI), TDI trimer, diphenylmethane diisocyanate (MDI), MDI trimer, hexamethylene diisocyanate (HDI), HDI trimer, isophorone diisocyanate (IPDI), IPDI trimer, 1,3-bis(N,N-diglycidylaminomethyl)cyclohexane and N,N,N,N'-tetraepoxypropyl-4,4'-diaminodiphenylmethane.

[0027] Furthermore, the amount of the curing agent is 0.1 to 8% of the mass of the acrylic resin.

[0028] Furthermore, the release film is one of polyethylene terephthalate and polyethylene.

[0029] Furthermore, the substrate film is one of polyethylene, polypropylene, polybutene, ethylene-vinyl acetate copolymer, ethylene-butene copolymer and polyvinyl chloride; and the thickness of the substrate film is 50 to 120 μm.

[0030] Furthermore, the substrate film is preferably subjected to corona treatment or plasma treatment; after the substrate film is subjected to corona treatment or plasma treatment, the water contact angle is 70 to 100°.

[0031] Furthermore, the drying temperature is 90-120° C.; the drying time is 60-300 s.

[0032] Furthermore, the aging temperature is 30 to 80° C.; and the aging time is 24 to 96 hours.

[0033] Furthermore, the wafer dicing tape has an adhesive layer thickness of 7 to 20 μm.

[0034] The beneficial effects of the present invention are:

[0035] The weight average molecular weight and molecular weight distribution of the acrylic resin for wafer dicing tape prepared by the present invention are stable, and the fluctuation of the same formula is 1-6%. The wafer dicing tape made of the acrylic resin has excellent and stable cutting performance, good peeling force resistance and pickup properties over time, no silicon powder penetration, cracking, and residual adhesive problems, and can meet the application requirements in the field of wafer dicing.

[0036] The method for preparing the acrylic resin for the wafer dicing tape of the present invention has high step-by-step reaction conversion rate and low monomer residue, and is conducive to reaction temperature control and ensures stable reaction. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 This is a GPC chart of the wafer dicing tape provided in Example 1 prepared three times using an acrylic resin. DETAILED DESCRIPTION

[0038] In order to understand the present invention more clearly, the present invention is further described with reference to the following examples and accompanying drawings. The examples are only used for explanation and are not intended to limit the present invention in any way. In the examples, each raw material reagent is commercially available, and the experimental methods without specifying specific conditions are conventional methods and conventional conditions well known in the art, or according to the conditions recommended by the instrument manufacturer.

[0039] Example 1

[0040] This embodiment provides an acrylic resin for wafer dicing tape, and its synthetic raw materials include, by weight:

[0041] 70 parts of isooctyl acrylate, 5 parts of vinyl acetate, 20 parts of ethyl methacrylate, 1 part of 2-butenenitrile, 4 parts of hydroxypropyl acrylate, 150 parts of ethyl acetate, and 0.2 parts of azobisisobutyronitrile.

[0042] The method for preparing the acrylic resin for wafer dicing tape in this embodiment comprises the following steps:

[0043] (1) Under the protection of inert gas, add 20% solvent to the reactor, and add dropwise 40% isooctyl acrylate, 40% vinyl acetate, 40% ethyl methacrylate, 40% 2-butenenitrile, 70% hydroxypropyl acrylate, 30% solvent and 30% azobisisobutyronitrile mixture at 75°C for 2.5 hours, and continue to keep warm for 1.5 hours;

[0044] (2) At 80° C., continue to dropwise add 35% isooctyl acrylate, 35% vinyl acetate, 35% ethyl methacrylate, 35% 2-butenenitrile, 15% hydroxypropyl acrylate, 15% solvent and 60% azobisisobutyronitrile mixture for 1 hour, and continue to keep warm for 1.5 hours;

[0045] (3) At 80°C, continue to dropwise add a mixture of 25% isooctyl acrylate, 25% vinyl acetate, 25% ethyl methacrylate, 25% 2-butenenitrile, 15% hydroxypropyl acrylate, 15% solvent and 10% azobisisobutyronitrile for 1 hour, continue to keep warm and react for 1.5 hours, cool down, add the remaining 20% ​​solvent and stir evenly to obtain an acrylate resin.

[0046] This embodiment provides a method for preparing a wafer dicing tape, which specifically includes:

[0047] 50 parts of the synthesized acrylic resin were diluted with ethyl acetate to a solid content of 20%, 3 parts of TDI trimer were added, the mixture was stirred evenly, and then coated on a PET release film. After drying at 90°C for 150s, transferred to a PVC substrate film (corona treated to a water contact angle of 80°) and aged at 40°C for 72h, a wafer dicing tape was obtained.

[0048] Example 2

[0049] This embodiment provides an acrylic resin for wafer dicing tape, and its synthetic raw materials include, by weight:

[0050] 70 parts of isooctyl acrylate, 5 parts of vinyl acetate, 20 parts of ethyl methacrylate, 4 parts of hydroxypropyl acrylate, 1 part of acrylic acid, 150 parts of ethyl acetate, and 0.25 parts of azobisisobutyronitrile.

[0051] This embodiment provides a method for preparing an acrylic resin for wafer dicing tape, comprising the following steps:

[0052] (1) Under the protection of inert gas, 15% solvent was added to the reactor, and a mixture of 45% isooctyl acrylate, 45% vinyl acetate, 45% ethyl methacrylate, 80% hydroxypropyl acrylate, 80% acrylic acid, 35% solvent and 35% azobisisobutyronitrile was added dropwise at 80°C for 2.5 hours, and the reaction was continued at the temperature for 1.5 hours;

[0053] (2) At 80°C, continue to dropwise add a mixture of 30% isooctyl acrylate, 30% vinyl acetate, 30% ethyl methacrylate, 10% hydroxypropyl acrylate, 10% acrylic acid, 15% solvent and 60% azobisisobutyronitrile for 1 hour, and continue to keep the temperature for reaction for 1.5 hours;

[0054] (3) At 80°C, continue to dropwise add a mixture of 25% isooctyl acrylate, 25% vinyl acetate, 25% ethyl methacrylate, 10% hydroxypropyl acrylate, 10% acrylic acid, 15% solvent and 5% azobisisobutyronitrile for 1 hour, continue to keep warm and react for 1.5 hours, cool down, add the remaining 20% ​​solvent and stir evenly to obtain an acrylate resin.

[0055] This embodiment provides a method for preparing a wafer dicing tape, which specifically includes:

[0056] 50 parts of the synthesized acrylic resin were diluted with ethyl acetate to a solid content of 15%, 2 parts of IPDI trimer and 0.5 parts of 1,3-bis(N,N-diglycidylaminomethyl)cyclohexane were added, the mixture was stirred evenly, and then coated on a PET release film, dried at 100°C for 90s, transferred to a PVC substrate film (corona treated to a water contact angle of 80°) and aged at 40°C for 80h to obtain a wafer dicing tape.

[0057] Example 3

[0058] This embodiment provides an acrylic resin for wafer dicing tape, and its synthetic raw materials include, by weight:

[0059] 63 parts of n-hexyl acrylate, 2 parts of isooctyl cyanoacrylate, 4 parts of vinyl acetate, 26 parts of ethyl methacrylate, 4 parts of hydroxypropyl acrylate, 1 part of methacrylic acid, 160 parts of toluene, and 0.3 parts of benzoyl peroxide.

[0060] This embodiment provides a method for preparing an acrylic resin for wafer dicing tape, comprising the following steps:

[0061] (1) Under the protection of inert gas, add 15% solvent to the reactor, and add dropwise 60% n-hexyl acrylate, 60% isooctyl cyanoacrylate, 60% vinyl acetate, 60% ethyl methacrylate, 85% hydroxypropyl acrylate, 85% methacrylic acid, 35% solvent and 20% benzoyl peroxide mixture at 85°C for 2.5 hours, and continue to keep warm for 2 hours;

[0062] (2) At 85°C, continue to dropwise add a mixture of 30% n-hexyl acrylate, 30% isooctyl cyanoacrylate, 30% vinyl acetate, 30% ethyl methacrylate, 15% hydroxypropyl acrylate, 15% methacrylic acid, 10% solvent and 70% benzoyl peroxide for 1 hour, and continue to keep warm for 2 hours;

[0063] (3) At 85°C, continue to dropwise add 10% n-hexyl acrylate, 10% isooctyl cyanoacrylate, 10% vinyl acetate, 10% ethyl methacrylate, 10% solvent and 10% benzoyl peroxide mixture for 1 hour, continue to keep warm and react for 2 hours, cool down, add the remaining 30% solvent and stir evenly to obtain acrylate resin.

[0064] This embodiment provides a method for preparing a wafer dicing tape, which specifically includes:

[0065] 50 parts of the synthesized acrylic resin were diluted with toluene to a solid content of 25%, 4 parts of MDI trimer were added, the mixture was stirred evenly, and then coated on a PE release film, dried at 115°C for 150s, transferred to a PVC substrate film (corona treated to a water contact angle of 75°) and aged at 50°C for 80h to obtain a wafer dicing tape.

[0066] Comparative Example 1

[0067] Comparative Example 1 provides an acrylic resin, and its synthetic raw materials include, by weight:

[0068] 70 parts of isooctyl acrylate, 5 parts of vinyl acetate, 20 parts of ethyl methacrylate, 0.1 parts of hydroxypropyl acrylate, 150 parts of ethyl acetate, and 0.2 parts of azobisisobutyronitrile.

[0069] Comparative Example 1 provides a method for preparing an acrylic resin for wafer dicing tape, comprising the following steps:

[0070] (1) Under the protection of inert gas, add 20% solvent to the reactor, and add dropwise 40% isooctyl acrylate, 40% vinyl acetate, 40% ethyl methacrylate, 70% hydroxypropyl acrylate, 30% solvent and 30% azobisisobutyronitrile mixture at 75°C for 2.5 hours, and continue to keep warm for 1.5 hours;

[0071] (2) At 80°C, continue to dropwise add a mixture of 35% isooctyl acrylate, 35% vinyl acetate, 35% ethyl methacrylate, 15% hydroxypropyl acrylate, 15% solvent and 60% azobisisobutyronitrile for 1 hour, and continue to keep the temperature for reaction for 1.5 hours;

[0072] (3) At 80°C, continue to dropwise add a mixture of 25% isooctyl acrylate, 25% vinyl acetate, 25% ethyl methacrylate, 15% hydroxypropyl acrylate, 15% solvent and 10% azobisisobutyronitrile for 1 hour, continue to keep warm and react for 1.5 hours, and after cooling, add the remaining 20% ​​solvent and stir evenly to obtain an acrylate resin.

[0073] Comparative Example 1 provides a method for preparing a wafer dicing tape, which specifically comprises:

[0074] 50 parts of the synthesized acrylic resin were diluted with ethyl acetate to a solid content of 20%, 0.5 parts of TDI trimer were added, the mixture was stirred evenly, and then coated on a PET release film. After drying at 90°C for 150s, it was transferred to a PVC substrate film (corona treated to a water contact angle of 80°) and aged at 40°C for 72h to obtain a tape.

[0075] Comparative Example 2

[0076] Comparative Example 2 provides an acrylic resin, the synthetic raw materials of which include, by weight:

[0077] 70 parts of isooctyl acrylate, 5 parts of vinyl acetate, 20 parts of ethyl methacrylate, 1 part of 2-butenenitrile, 4 parts of hydroxypropyl acrylate, 150 parts of ethyl acetate, and 0.2 parts of azobisisobutyronitrile.

[0078] Comparative Example 2 provides a method for preparing an acrylic resin for wafer dicing tape, comprising the following steps:

[0079] Under the protection of inert gas, add 20% solvent into the reactor, add 100% isooctyl acrylate, 100% vinyl acetate, 100% ethyl methacrylate, 100% 2-butenenitrile, 100% hydroxypropyl acrylate, 60% solvent and 100% azobisisobutyronitrile mixture dropwise at 75°C for 6 hours, continue to keep warm and react for 3 hours, add the remaining 20% ​​solvent after cooling and stir evenly to obtain acrylic resin.

[0080] Comparative Example 2 provides a method for preparing a wafer dicing tape, which specifically includes:

[0081] 50 parts of the synthesized acrylic resin were diluted with ethyl acetate to a solid content of 20%, 3 parts of TDI trimer were added, the mixture was stirred evenly, and then coated on a PET release film. After drying at 90°C for 150s, transferred to a PVC substrate film (corona treated to a water contact angle of 80°) and aged at 40°C for 72h, a wafer dicing tape was obtained.

[0082] Performance Testing

[0083] The following performance tests were conducted on the acrylate resin and the adhesive tape made of acrylate resin in the above examples and comparative examples:

[0084] Tg: tested by DSC.

[0085] Peel force: 90° peel force is tested according to GB / 2792-1998.

[0086] Residual glue: Visually check whether there is residual glue on the back of the chip.

[0087] Chipping: Randomly select 10 chips from the top, bottom, left, right and center areas of the wafer and observe them under a microscope. If the chipping on the back is less than 50μm, it is qualified.

[0088] Picking performance: 10 chips are randomly selected from the top, bottom, left, right and center areas of the wafer. If all chips are picked up successfully without chip cracking or chip scattering, they are qualified.

[0089] Silicon powder penetration: Randomly select 10 chips from each of the five areas of the wafer, and if there is no silicon powder penetration, it is qualified.

[0090] The test results of Examples 1 to 3 and Comparative Example 1 are shown in Tables 1 and 2.

[0091] Table 1. Resin properties and mechanical properties of adhesive tape in Examples 1 to 3 and Comparative Example 1

[0092]

[0093] Table 2. Tape cutting performance of Examples 1 to 3 and Comparative Example 1 (wafer diameter: 8 inches; wafer thickness: 150 μm; cutting size: 2 mm×2 mm)

[0094]

[0095] It can be seen from the test results of Table 1 and Table 2 that the molecular weight and molecular weight distribution of the acrylic resin for wafer dicing tape provided by the present invention are stable, and the wafer dicing tape made therefrom has excellent and stable cutting performance, good peeling force resistance and pickup properties over time, and no silicon powder penetration, cracking, or residual adhesive problems, thus meeting the application requirements in the field of wafer dicing.

[0096] The applicant declares that the above-mentioned embodiments are merely illustrative and are used to explain some features of the method of the present invention. However, the present invention is not limited to the above-mentioned process steps, that is, it does not mean that the present invention must rely on the above-mentioned process steps to be implemented. Those skilled in the art should understand that any improvement of the present invention, equivalent replacement of the raw materials selected by the present invention, addition of auxiliary components, selection of specific methods, etc., all fall within the scope of protection and disclosure of the present invention.

Claims

1. An acrylic resin for wafer dicing tape, characterized in that: The synthetic raw materials of the acrylic resin include: soft monomer, hard monomer, functional monomer, solvent and initiator; The soft monomer is selected from one or more monomers represented by formula I and / or formula II; wherein R1 is methyl or cyano, n1 is 5 to 30; or R1 is a hydrogen atom, n1 is 1 to 30; R2 is methyl or cyano, n2 is 3 to 30; or R2 is a hydrogen atom, n2 is 1 to 30; The hard monomer is selected from one or more of the monomers represented by formula III, the monomers represented by formula IV, vinyl acetate, 2-butenenitrile, acrylonitrile, 3-pentenenitrile, 4-pentenenitrile, 2-pentenenitrile, 3-methyl-5-phenyl-2-pentenenitrile, styrene, and acrylamide; wherein R3 is methyl or cyano, and n3 is 0 to 4; or R3 is a hydrogen atom, and n3 is 0; R4 is methyl or cyano, and n4 is 0 to 2; R4 is a hydrogen atom, and n4 is 0; The functional monomer is selected from one or more of acrylic acid, methacrylic acid, hydroxyethyl acrylate, hydroxyethyl methacrylate, hydroxypropyl acrylate, hydroxypropyl methacrylate, and methacrylamide.

2. The acrylic resin for wafer dicing tape according to claim 1, characterized in that: The mass ratio of the soft monomer, the hard monomer and the functional monomer is (50-80): (15-45): (0.5-10).

3. The acrylic resin for wafer dicing tape according to claim 1, characterized in that: The initiator is selected from one or more of azobisisobutyronitrile and dibenzoyl peroxide; Preferably, the amount of the initiator used is 0.05-2% of the total mass of the soft monomer, the hard monomer and the functional monomer.

4. The acrylic resin for wafer dicing tape according to claim 1, characterized in that: The solvent is selected from one or more of toluene, ethyl acetate, chloroform, cumene, and xylene; Preferably, the amount of the solvent used is 65-235% of the total mass of the soft monomer, the hard monomer and the functional monomer.

5. The acrylic resin for wafer dicing tape according to any one of claims 1 to 4, characterized in that: The weight average molecular weight of the acrylic resin for wafer dicing tape is 100-2000 KD; the glass transition temperature of the acrylic resin for wafer dicing tape is -(35-10)°C.

6. The method for preparing the acrylic resin for wafer dicing tape according to claim 1, characterized in that: The preparation method comprises the following steps: (1) Under the protection of inert gas, 0-10% soft monomer, 0-10% hard monomer, and 5-30% solvent are added to the reactor, and a mixture of 30-75% soft monomer, 30-75% hard monomer, 20-100% functional monomer, 5-50% solvent and 10-40% initiator is added dropwise at 65-100° C. The addition is completed within 5 hours, and the reaction is continued at the temperature for 0.1-3 hours; (2) At 65-100° C., continue to dropwise add a mixture of 0-70% soft monomer, 0-70% hard monomer, 0-80% functional monomer, 10-45% solvent and 35-85% initiator. The addition is completed within 4 hours, and the reaction is continued at the temperature for 0.1-3 hours; (3) At 65-100° C., continue to dropwise add a mixture of 0-70% soft monomer, 0-70% hard monomer, 0-80% functional monomer, 5-80% solvent and 1-25% initiator. Complete the addition within 4 hours, continue to keep the temperature for 0.1-3 hours, and then cool down to obtain the product.

7. A wafer dicing tape, characterized in that: The wafer dicing tape is prepared by the following method: The acrylate resin prepared by the preparation method of claim 6 is diluted with the solvent used to prepare the acrylate resin, a curing agent is added, mixed and stirred evenly, and then coated on the release film, and after drying, transferred to the substrate film and ripened, the wafer dicing tape is obtained.

8. The wafer dicing tape according to claim 7, characterized in that: The dilution ratio is 15-25% of the solid content.

9. The wafer dicing tape according to claim 7, characterized in that: The curing agent is one or more of toluene diisocyanate (TDI), TDI trimer, diphenylmethane diisocyanate (MDI), MDI trimer, hexamethylene diisocyanate (HDI), HDI trimer, isophorone diisocyanate (IPDI), IPDI trimer, 1,3-bis(N,N-diglycidylaminomethyl)cyclohexane and N,N,N,N'-tetraepoxypropyl-4,4'-diaminodiphenylmethane; Preferably, the amount of the curing agent is 0.1-8% of the mass of the acrylic resin.

10. The wafer dicing tape according to claim 7, characterized in that: The release film is one of polyethylene terephthalate and polyethylene; Preferably, the substrate film is one of polyethylene, polypropylene, polybutene, ethylene-vinyl acetate copolymer, ethylene-butene copolymer and polyvinyl chloride; the thickness of the substrate film is 50 to 120 μm; Preferably, the substrate film is subjected to corona treatment or plasma treatment; the water contact angle of the substrate film after the corona treatment or plasma treatment is 70 to 100°; Preferably, the drying temperature is 90-120° C.; the drying time is 60-300 s; Preferably, the aging temperature is 30 to 80° C.; the aging time is 24 to 96 hours; Preferably, the wafer dicing tape has an adhesive layer thickness of 7 to 20 μm.

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