Damping glue for bonding metal and preparation method thereof

Abstract

The invention discloses damping glue for bonding metal and a preparation method of the damping glue, and the damping glue is prepared by weighing the following raw materials in parts by weight: 10-30 parts of rubber filler, 10-30 parts of epoxy resin, 0.5-2 parts of curing agent, 0.2-1 part of tackifier, 1-3 parts of artificial fiber, 0.5-5 parts of reactive diluent, 0.1-0.4 part of curing accelerator and 30-60 parts of solvent; the preparation method comprises the following steps: putting rubber filler, epoxy resin and artificial fibers into an internal mixer for internal mixing, and then calendering by adopting an open mill to obtain sheets; and placing the sheet, a curing agent, a tackifier, an active diluent and a curing accelerator in a solvent, stirring and dissolving, and discharging to obtain the damping glue. By changing the material formula and the microstructure, effective adjustment of the wide temperature range and the wide frequency range of the damping characteristic can be achieved, and the requirements of different application scenes for the damping performance and the requirement for bonding with metal and other base materials are met.

Description

Technical Field

[0001] The invention relates to the field of damping materials, and in particular to a damping glue for bonding metals and a preparation method thereof. Background Art

[0002] With the development of modern science and technology, people have higher and higher requirements for their working and living environment, and vibration and noise control has become an urgent problem. Since viscoelastic damping materials have high damping characteristics and can suppress vibration and noise in a fairly wide frequency band, they can be used in mechanical components such as automobiles, ships, locomotives, etc. to reduce vibration and noise.

[0003] Viscoelastic damping material is an active noise reduction material, most of which are polymer materials such as rubber. At present, the preparation of high damping silicone rubber is mainly carried out through three aspects: main chain structure modification, blending structure modification, and adding damping agent modification. The main chain structure modification is mainly to increase the rigidity of the molecular chain segment and the interaction force between the molecular chains by introducing and adjusting the phenyl content in the main chain structure, thereby increasing the damping performance, but its damping loss is still small, and the damping factor improvement is very limited. The blending structure modification mainly uses silicone rubber and butyl rubber or silicone rubber and PU compound rubber or silicone rubber and acrylic rubber to blend or form an IPN interpenetrating network to improve the damping performance. Although this method can significantly improve the damping performance, the glass transition temperature distribution of the blended material becomes narrower, the damping temperature range becomes narrower, the two-phase compatibility is poor, and the physical and mechanical properties and bonding properties are poor. Adding damping agent is one of the most commonly used methods to prepare damping silicone rubber. Usually, flake fillers with damping effect, such as mica powder, graphite, silica, etc., are used together with white carbon black as fillers of silicone rubber. White carbon black mainly plays a reinforcing role. At the same time, silicone rubber and other polymer materials can be used together to obtain a better damping effect. In addition, silicone rubber is a molecular chain saturated rubber with poor adhesion, which makes its bonding performance with metal and other substrate materials poor. The above method can improve the damping performance of the rubber, but cannot improve the bonding performance of the rubber with metal at the same time. Summary of the invention

[0004] The purpose of the present invention is to address the deficiencies in the prior art and provide a damping glue for bonding metals and a preparation method thereof. By changing the material formula and microstructure, the damping characteristics can be adjusted to meet the requirements of damping performance in different application scenarios and the bonding requirements with metal and other substrates.

[0005] The purpose of the present invention is achieved through the following technical solutions:

[0006] First, the present invention provides a damping glue for bonding metals, which includes the following raw material components in parts by weight: 10 to 30 parts of rubber filler, 10 to 30 parts of epoxy resin, 0.5 to 2 parts of curing agent, 0.2 to 1 part of tackifier, 1 to 3 parts of artificial fiber, 0.5 to 5 parts of active diluent, 0.1 to 0.4 parts of curing accelerator, and 30 to 60 parts of solvent.

[0007] Furthermore, the rubber filler is at least one of butyl rubber, brominated butyl rubber, nitrile rubber, emulsion polystyrene butadiene rubber, and rare earth isoprene rubber.

[0008] Furthermore, the epoxy resin is a multifunctional bisphenol A epoxy resin with an epoxy value of 0.43 to 0.7.

[0009] Furthermore, the curing agent is at least one of ethylenediamine, hexamethylenediamine, diethylenetriamine, triethylenetetramine, diaminodiphenyl sulfone, diaminodiphenylmethane, and m-phenylenediamine.

[0010] Furthermore, the tackifier is at least one of phenolic resin, urea-formaldehyde resin, C5 petroleum resin and terpene resin.

[0011] Furthermore, the artificial fiber is at least one of glass fiber, carbon fiber, polyester fiber and asbestos fiber.

[0012] Furthermore, the active diluent is at least one of butyl glycidyl ether, benzyl glycidyl ether, isopropyl glycidyl ether, nonylphenol, and dodecylphenol.

[0013] Furthermore, the curing accelerator is 2,4,6-tris(dimethylaminomethyl)phenol DMP-30 or polyetheramine D230.

[0014] Furthermore, the solvent is at least one of methylcyclohexane, ethyl acetate and butanone.

[0015] Secondly, the present invention provides a method for preparing the damping glue for bonding metals, comprising the following steps:

[0016] (1) Weigh the following raw materials according to weight: 10-30 parts of rubber filler, 10-30 parts of epoxy resin, 0.5-2 parts of curing agent, 0.2-1 parts of tackifier, 1-3 parts of artificial fiber, 0.5-5 parts of active diluent, 0.1-0.4 parts of curing accelerator, and 30-60 parts of solvent;

[0017] (2) placing the rubber filler, epoxy resin and artificial fiber in an internal mixer for internal mixing, wherein the internal mixing temperature is controlled at 100 to 120° C., the internal mixing roller speed is controlled at 30 to 50 rpm, and the internal mixing time is 20 to 30 minutes, and then rolling out a thin sheet using an open mill;

[0018] (3) placing the flakes obtained in step (2), the curing agent, the tackifier, the reactive diluent and the curing accelerator in a solvent, stirring and dissolving them, and discharging the material.

[0019] The beneficial effects of the present invention are:

[0020] The present invention introduces rubber and artificial fiber into the preparation of glue, improves the tensile strength and damping performance, and has good adhesion to metal, high strength, high flame retardancy, excellent weather resistance and outstanding shock and noise reduction effects. The composite metal sheet after metal bonding can be post-processed by stamping, resistance welding, projection welding, riveting and other processes. In addition, it overcomes the shortcomings of the current damping gasket that it cannot take into account the bonding of complex surface metal samples and filling gaps during use, and is easy to use.

[0021] In the present invention, the rubber molecules and epoxy resin form an interpenetrating polymer network and the energy dissipation direction tends to be disordered through inorganic fibers. Adjusting the rubber ratio can not only dissipate the vibration energy through the friction heat between the rubber molecular chains, but also conduct the vibration energy to the fiber phase through the free chain ends of the rubber, and then dissipate it through the vibration and bending of the fiber. The damping glue of the present invention exhibits good damping performance in a wide frequency range, can effectively absorb and dissipate mechanical vibration energy, and reduce vibration and noise transmission; and by changing the material formula and microstructure, the wide temperature range and wide frequency range of the damping characteristics can be effectively adjusted to meet the requirements of damping performance in different application scenarios. It can still maintain stable damping performance in high temperature environment, is not prone to performance degradation, and has excellent anti-aging performance, weather resistance and corrosion resistance. It exhibits excellent bonding performance to various metal substrates, which is particularly important for high and low temperature working environments such as aerospace, ships, trains, automobiles, and rail noise reduction manufacturing. DETAILED DESCRIPTION

[0022] In order to further understand the present invention, preferred embodiments of the present invention are described below in conjunction with examples. However, it should be understood that these descriptions are only for further illustrating the features and advantages of the present invention, rather than limiting the claims of the present invention.

[0023] The reagents or instruments used in the present invention without indicating the manufacturer are all conventional products that can be purchased from the market.

[0024] Example 1

[0025] The preparation method of the damping glue in this embodiment specifically includes the following steps:

[0026] (1) Weigh the following raw materials according to weight: 20 parts of butyl rubber, 10 parts of multifunctional bisphenol A epoxy resin (epoxy value 0.5), 0.5 parts of ethylenediamine, 0.3 parts of phenolic resin, 1 part of glass fiber, 3 parts of butyl glycidyl ether, 0.3 parts of polyetheramine (D230), and 40 parts of ethyl acetate;

[0027] (2) placing butyl rubber, multifunctional bisphenol A epoxy resin and glass fiber in an internal mixer for internal mixing, wherein the internal mixing temperature is controlled at 100° C., the internal mixing roller speed is controlled at 50 rpm, and the internal mixing time is 20 minutes. Then, an open mixer is used to roll out a sheet with a thickness of 2 mm, and then the sheet is cut into 5 cm×5 cm sheets.

[0028] (3) placing the flakes obtained in step (2), ethylenediamine, phenolic resin, butyl glycidyl ether and polyetheramine D230 in ethyl acetate and stirring for 30 minutes, discharging the material, and obtaining a damping glue.

[0029] Example 2

[0030] The preparation method of the damping glue in this embodiment specifically includes the following steps:

[0031] (1) Weigh the following raw materials according to weight: 10 parts of nitrile rubber, 30 parts of multifunctional bisphenol A epoxy resin (epoxy value 0.5), 1 part of hexamethylenediamine, 0.5 parts of urea-formaldehyde resin, 2 parts of polyester fiber, 1 part of isopropyl glycidyl ether, 0.1 parts of 2,4,6-tris(dimethylaminomethyl)phenol (DMP-30), and 40 parts of butanone;

[0032] (2) placing the nitrile rubber, multifunctional bisphenol A epoxy resin, and polyester fiber in an internal mixer for internal mixing, wherein the internal mixing temperature is controlled at 100° C., the internal mixing roller speed is controlled at 40 rpm, and the internal mixing time is 30 minutes. Then, an open mixer is used to roll out a sheet with a thickness of 2 mm, and then the sheet is cut into 5 cm×5 cm sheets;

[0033] (3) placing the flakes obtained in step (2), hexamethylenediamine, urea-formaldehyde resin, isopropyl glycidyl ether and DMP-30 in butanone and stirring for 30 minutes, discharging the material, and obtaining a damping glue.

[0034] Example 3

[0035] The preparation method of the damping glue in this embodiment specifically includes the following steps:

[0036] (1) Weigh the following raw materials by weight: 10 parts of brominated butyl rubber, 20 parts of nitrile rubber, 20 parts of multifunctional bisphenol A epoxy resin (epoxy value 0.5), 1.5 parts of triethylenetetramine, 1 part of terpene resin, 3 parts of carbon fiber, 5 parts of benzyl glycidyl ether, 0.4 parts of 2,4,6-tris(dimethylaminomethyl)phenol (DMP-30), and 60 parts of methylcyclohexane;

[0037] (2) placing brominated butyl rubber, nitrile rubber, multifunctional bisphenol A epoxy resin, and carbon fiber in an internal mixer for internal mixing, wherein the internal mixing temperature is controlled at 120° C., the internal mixing roller speed is controlled at 30 rpm, and the internal mixing time is 30 minutes. Then, an open mixer is used to roll out a sheet with a thickness of 2 mm, and then the sheet is cut into 5 cm×5 cm sheets.

[0038] (3) placing the flakes obtained in step (2), triethylenetetramine, terpene resin, benzyl glycidyl ether and DMP-30 in methylcyclohexane and stirring for 30 minutes, discharging the material, and obtaining a damping glue.

[0039] Comparative Example 1

[0040] The preparation method of the damping glue in this embodiment specifically includes the following steps:

[0041] (1) Weigh the following raw materials according to weight: 30 parts of multifunctional bisphenol A epoxy resin (epoxy value 0.5), 0.5 parts of ethylenediamine, 0.3 parts of phenolic resin, 1 part of glass fiber, 3 parts of butyl glycidyl ether, 0.3 parts of polyetheramine D230, and 40 parts of ethyl acetate;

[0042] (2) placing a multifunctional bisphenol A epoxy resin and glass fiber in an internal mixer for internal mixing, wherein the internal mixing temperature is controlled at 100° C., the internal mixing roller speed is controlled at 50 rpm, and the internal mixing time is 20 minutes. Then, an open mixer is used to roll out a sheet with a thickness of 2 mm, and then the sheet is cut into 5 cm×5 cm sheets;

[0043] (3) placing the flakes obtained in step (2), ethylenediamine, phenolic resin, butyl glycidyl ether and polyetheramine D230 in ethyl acetate and stirring for 30 minutes, discharging the material, and obtaining a damping glue.

[0044] Comparative Example 2

[0045] The preparation method of the damping glue in this embodiment specifically includes the following steps:

[0046] (1) Weigh the following raw materials according to weight: 20 parts of butyl rubber, 10 parts of multifunctional bisphenol A epoxy resin (epoxy value 0.5), 0.5 parts of ethylenediamine, 0.3 parts of phenolic resin, 1 part of white carbon black, 3 parts of butyl glycidyl ether, 0.3 parts of polyetheramine D2300, and 40 parts of ethyl acetate;

[0047] (2) placing butyl rubber, multifunctional bisphenol A epoxy resin and white carbon black in an internal mixer for internal mixing, wherein the internal mixing temperature is controlled at 100° C., the internal mixing roller speed is controlled at 50 rpm, and the internal mixing time is 20 minutes. Then, an open mixer is used to roll out a sheet with a thickness of 2 mm, and then the sheet is cut into 5 cm×5 cm sheets.

[0048] (3) placing the flakes obtained in step (2), ethylenediamine, phenolic resin, butyl glycidyl ether and polyetheramine D230 in ethyl acetate and stirring for 30 minutes, discharging the material, and obtaining a damping glue.

[0049] Comparative Example 3

[0050] The preparation method of the damping glue in this embodiment specifically includes the following steps:

[0051] (1) Weigh the following raw materials by weight: 20 parts of butyl rubber, 10 parts of asphalt, 0.5 parts of ethylenediamine, 0.3 parts of phenolic resin, 1 part of glass fiber, 3 parts of butyl glycidyl ether, 0.3 parts of polyetheramine D2300, and 40 parts of ethyl acetate;

[0052] (2) placing butyl rubber, asphalt and glass fiber in an internal mixer for internal mixing, the internal mixing temperature is controlled at 100° C., the internal mixing roller speed is controlled at 50 rpm, the internal mixing time is 20 minutes, and then rolling out a sheet with a thickness of 2 mm using an open mixer, and then cutting into 5 cm×5 cm sheets;

[0053] (3) placing the flakes obtained in step (2), ethylenediamine, phenolic resin, butyl glycidyl ether and polyetheramine D230 in ethyl acetate and stirring for 30 minutes, discharging the material, and obtaining a damping glue.

[0054] Table 1 is a formula table of embodiments and comparative examples, and the units in the table are parts by weight.

[0055]

[0056]

[0057] During use, the damping glue in Examples 1 to 3 and Comparative Examples 1 to 3 is applied to the upper surface of a flat metal substrate, and the metal to be bonded is attached to the surface of the glue and then hot-pressed for curing. The curing temperature is 130° C., the curing time is 2 hours, and the pressure is 0.3 MPa.

[0058] The damping glues in Examples 1 to 3 and Comparative Examples 1 to 3 were tested, and the test results are shown in Table 2.

[0059] Table 2

[0060] Example 1 Example 2 Example 3 Comparative Example 1 Comparative Example 2 Comparative Example 3 Hardness, Shore A 50 52 49 34 46 39 Peel strength (N / mm) 121 125 129 71 83 77 Tensile strength(MPa) 8.9 9.6 10.6 9.1 6.6 3.4 Elongation at break (%) 620 580 740 220 550 480 tanδ(80℃,10Hz) 0.58 0.53 0.61 0.29 0.54 0.32 tanδ(-40℃,10Hz) 0.51 0.49 0.59 0.23 0.58 0.26 tanδ(80℃,1000Hz) 0.32 0.27 0.36 0.12 0.25 0.17 tanδ(-40℃,1000Hz) 0.27 0.23 0.29 0.06 0.11 0.08 Thermal shock test standards No shedding No shedding No shedding Shedding No shedding Shedding Salt spray test No shedding No shedding No shedding No shedding No shedding Shedding Double 85 test No shedding No shedding No shedding No shedding No shedding Shedding

[0061] Remark:

[0062] The damping glue in Examples 1 to 3 and Comparative Examples 1 to 3 is applied to the upper surface of a flat metal substrate, and the metal to be bonded is attached to the surface of the glue and then hot-pressed and cured. The thickness of the glue layer is 50 μm, the curing temperature is 130° C., the curing time is 2 hours, the pressure is 0.3 MPa, and after standing at room temperature for 72 hours, a salt spray test, a hot and cold shock test, and a double 85 test are performed.

[0063] Salt spray test: Tested in accordance with IEC68-2-11;

[0064] Thermal shock test: -40℃~125℃, 100 cycles;

[0065] Double 85 test: 1000h under the conditions of temperature 85℃ and humidity 85%;

[0066] Damping coefficient: Tested in accordance with GB / T18258-2000;

[0067] Peel strength: Tested in accordance with JC / T942-2022;

[0068] Tensile strength: Tested in accordance with GB / T 1040.3-2006;

[0069] Elongation at break: Tested in accordance with GB / T 1040.3-2006.

[0070] According to the disclosure of the above description, those skilled in the art to which the present invention belongs may also make appropriate changes and modifications to the above embodiments. Therefore, the present invention is not limited to the specific embodiments disclosed and described above, and some modifications and changes to the present invention should also fall within the scope of protection of the claims of the present invention. In addition, although some specific terms are used in this specification, these terms are only for the convenience of description and do not constitute any limitation to the present invention.

Claims

1. A damping glue for bonding metals, characterized in that: The raw material components include the following in parts by weight: 10 to 30 parts of rubber filler, 10 to 30 parts of epoxy resin, 0.5 to 2 parts of curing agent, 0.2 to 1 parts of tackifier, 1 to 3 parts of artificial fiber, 0.5 to 5 parts of active diluent, 0.1 to 0.4 parts of curing accelerator and 30 to 60 parts of solvent.

2. The damping glue for bonding metals according to claim 1, characterized in that: The rubber filler is at least one of butyl rubber, brominated butyl rubber, nitrile rubber, emulsion polystyrene butadiene rubber, and rare earth isoprene rubber.

3. The damping adhesive according to claim 1, characterized in that: The epoxy resin is a multifunctional bisphenol A epoxy resin with an epoxy value of 0.43 to 0.

7.

4. The damping glue for bonding metals according to claim 1, characterized in that: The curing agent is at least one of ethylenediamine, hexamethylenediamine, diethylenetriamine, triethylenetetramine, diaminodiphenyl sulfone, diaminodiphenylmethane and metaphenylenediamine.

5. The damping glue for bonding metals according to claim 1, characterized in that: The tackifier is at least one of phenolic resin, urea-formaldehyde resin, C5 petroleum resin and terpene resin.

6. The damping glue for bonding metals according to claim 1, characterized in that: The artificial fiber is at least one of glass fiber, carbon fiber, polyester fiber and asbestos fiber.

7. The damping glue for bonding metals according to claim 1, characterized in that: The active diluent is at least one of butyl glycidyl ether, benzyl glycidyl ether, isopropyl glycidyl ether, nonylphenol and dodecylphenol.

8. The damping glue for bonding metals according to claim 1, characterized in that: The curing accelerator is 2,4,6-tris(dimethylaminomethyl)phenol or polyetheramine.

9. The damping adhesive according to claim 1, characterized in that: The solvent is at least one of methylcyclohexane, ethyl acetate and butanone.

10. A method for preparing the damping glue for bonding metals according to any one of claims 1 to 9, characterized in that: The steps include: (1) Weigh the following raw materials according to weight: 10-30 parts of rubber filler, 10-30 parts of epoxy resin, 0.5-2 parts of curing agent, 0.2-1 parts of tackifier, 1-3 parts of artificial fiber, 0.5-5 parts of active diluent, 0.1-0.4 parts of curing accelerator, and 30-60 parts of solvent; (2) placing the rubber filler, epoxy resin and artificial fiber in an internal mixer for internal mixing, wherein the internal mixing temperature is controlled at 100 to 120° C., the internal mixing roller speed is controlled at 30 to 50 rpm, and the internal mixing time is 20 to 30 minutes, and then rolling out a thin sheet using an open mill; (3) placing the flakes obtained in step (2), the curing agent, the tackifier, the reactive diluent and the curing accelerator in a solvent, stirring and dissolving them, and discharging the material.

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