Sputtering target and method for producing sputtering target
By using a combined structure of tubular liner and cylindrical target segment in the sputtering target, combined with tongue-grooved fit and bonding materials, the problem of solder leaking when temperature rises is solved, the assembly accuracy and stability are improved, and high-quality and efficient production is achieved.
Patent Information
- Application Number
- CN202510233574.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2021-09-16
- Publication Date
- 2025-05-06
AI Technical Summary
When the temperature of existing sputtering targets rises, solder is prone to leak from the target joints, resulting in a decrease in assembly accuracy and stability, affecting product quality and yield.
Using a combined structure of a tubular liner and a cylindrical target segment, a tongue-grooved fit is formed at the end of the target segment and a bonding material is provided between the target segments to ensure that the solder is not easily leaked when the temperature changes.
It significantly improves assembly accuracy and assembly stability, prevents solder leakage, and achieves stable quality, high yield and cost saving effects.
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Figure CN119932496A_ABST
Abstract
Description
[0001] This application is a divisional application of the Chinese invention patent application with the application date of September 16, 2021, application number 202111086210.3, and name “Sputtering target and method for manufacturing sputtering target”. Technical Field
[0002] The invention relates to a sputtering target and a method for producing the sputtering target. Background Art
[0003] Sputtering is a physical vapor deposition technology, which refers to the physical process in which atoms in a solid target are hit by high-energy ions (usually from plasma) and leave the solid and enter the gas. Sputtering is generally carried out in a vacuum system filled with inert gas. Through the action of a high-voltage electric field, argon gas is ionized to generate an argon ion flow, which bombards the target cathode. The sputtered target material atoms or molecules are precipitated and accumulated on semiconductor chips or glass and ceramics to form a thin film. The advantage of sputtering is that it can prepare thin films of high-melting-point materials at lower temperatures, and keep the original composition unchanged in the process of preparing alloy and compound films, so it has been widely used in the manufacture of semiconductor devices and integrated circuits.
[0004] Sputtering targets are materials that form thin films by sputtering and are made from metals and ceramics. In recent years, there has been a demand for lower power consumption and higher speeds for electronic components. In order to achieve these demands, various high-quality sputtering targets are needed.
[0005] Generally speaking, sputtering targets are mainly composed of target blanks, backing plates and other parts. Among them, the target blank is the target material bombarded by high-speed ion beams and is the core part of the sputtering target. During the sputtering coating process, after the target blank is hit by ions, its surface atoms are sputtered and scattered and deposited on the substrate to form an electronic thin film. Due to the low strength of high-purity metals, the sputtering target needs to be installed in a dedicated machine to complete the sputtering process. The machine is in a high-voltage, high-vacuum environment. Therefore, the sputtering target blank of ultra-high purity metal needs to be joined to the backing plate through different welding processes. The backing plate plays the main role of fixing the sputtering target and needs to have good electrical and thermal conductivity.
[0006] In the prior art, there is a tubular target material having a tubular target body and two connecting pieces. The tubular target body has a notch, the connecting piece has a flange, the flange is engaged with the notch, the connecting piece has a recessed portion, and solder is contained in the recessed portion to connect the tubular target body and the connecting piece. However, if this target material is used, as the temperature rises, the solder is likely to leak from the target material joints.
[0007] In the prior art, there is also a target assembly and a target unit, wherein the target assembly has a plurality of target units and a plurality of connecting parts, each of the plurality of target units has a cylindrical target and a cylindrical base, and the cylindrical base is joined to the inner side of the cylindrical target. The connecting part is located inside the plurality of target units, and each of the plurality of target units has a gap between them. However, if such a target is used, as the temperature rises, the solder is also likely to leak from the target joint.
[0008] In the prior art, there is also a target mounting mechanism, which mounts a cylindrical target. The target has a cylindrical support tube and a target material covering the support tube, and has a connecting area. The target is connected to the clamp. However, if this target material is used, as the temperature rises, the solder is also prone to leak from the target material joints.
[0009] In the prior art, there is also an interlocking cylindrical magnetron cathode and target. The magnetron assembly has a first unit that allows the target to be removed from the cathode body. However, with this target, as the temperature rises, solder is also prone to leaking from the target joint.
[0010] In the prior art, there is also a tubular target, which is composed of a supporting tube and a sputtering material tube. The supporting tube is connected to the sputtering material tube by a threaded connection, and an O-ring is located between the supporting tube and the sputtering material tube. However, if this target material is used, as the temperature rises, the solder is also prone to leak from the target material joints.
[0011] It can be seen that whether it is possible to provide an improved sputtering target based on the deficiencies in the prior art to prevent solder leakage from the target material joints, significantly improve assembly accuracy and assembly stability, achieve stable quality, high yield rate, and save costs has become a technical problem that needs to be urgently solved by technical personnel in this field. Summary of the invention
[0012] Problems to be solved by the invention
[0013] The purpose of the present invention is to overcome the defects of the prior art and provide an improved sputtering target and a method for manufacturing a sputtering target. The improved sputtering target and the method for manufacturing a sputtering target provided by the present invention achieve stable quality, high yield rate and cost saving.
[0014] Methods for solving problems
[0015] A first aspect of the present invention relates to a sputtering target, comprising:
[0016] For a tubular liner, the axis is defined as the axial direction, and the plane where the radial direction lies is perpendicular to the axial direction;
[0017] At least two cylindrical target segments are disposed side by side on the tubular liner along the axial direction;
[0018] a bonding material disposed between the tubular liner and the at least two cylindrical target segments,
[0019] At least two ends of at least two cylindrical target segments facing each other form a tongue-and-groove fit with each other in such a way that, when viewed in the radial and / or axial direction, at least one tongue of one end overlaps with at least one groove of the respective other end of two adjacent cylindrical target segments, the overlap extending at least around a portion of the circumference of the respective end.
[0020] Preferably, at least two ends of at least two cylindrical target segments facing each other form a tongue-and-groove fit with each other in such a way that a tongue of one end overlaps a groove of the corresponding other end of two adjacent cylindrical target segments when viewed in the radial and / or axial direction.
[0021] Preferably, at least two ends of at least two cylindrical target segments facing each other form a tongue-and-groove fit with each other in such a way that, when viewed in radial direction, one end having more than one tongue and / or groove overlaps with another end having more than one tongue and / or groove, so that each tongue overlaps with a corresponding facing groove, or each groove overlaps with a corresponding facing tongue.
[0022] Preferably, at least one tongue of one end and respectively at least one groove of the other end are arranged within 75% of the maximum thickness in a radial plane of the respective ends of two adjacent cylindrical target segments when viewed in radial direction.
[0023] Preferably, the overlap extends along the entire circumference of two adjacent target segments when viewed in a radial plane so as to provide a tongue-and-groove fit.
[0024] Preferably, the tongue is a ridge with a rectangular cross section and two parallel side walls, and the groove is a slot with a rectangular cross section and two parallel side walls.
[0025] Preferably, the tongue-and-groove fit is established segmentally along the circumference of two adjacent target segments when viewed in radial and / or axial direction.
[0026] Preferably, a protrusion is provided on one of the tongue and groove, and a corresponding groove is provided on the other of the tongue and groove, so that the protrusion is engaged with the groove by relative rotation between two adjacent target segments.
[0027] Preferably, the invention further comprises a circumferential sealing member, which extends circumferentially along the gap between two adjacent target segments.
[0028] Preferably, the circumferential sealing member is arranged in a groove formed in two adjacent target segments.
[0029] Preferably, the target segment is made of a metallic material.
[0030] Preferably, the target segment is made of a molybdenum and / or tungsten based material.
[0031] Preferably, the bonding material is solder.
[0032] Preferably, the bonding material is indium solder or indium alloy solder.
[0033] Preferably, the invention further comprises at least one cylindrical target segment arranged on the tubular liner, wherein the tubular liner extends axially through at least 90% of the total length of the at least one cylindrical target segment.
[0034] The sputtering target also includes:
[0035] a stop member for a target segment adjacent to the stop member, the stop member being integrally formed with the tubular liner at an axial end region of the tubular liner and projecting radially from the tubular liner and extending around at least a portion of the circumference of the tubular liner,
[0036] A circumferential sealing member is inserted between the stop member and the adjacent target segment to prevent leakage of the bonding material.
[0037] A second aspect of the present invention relates to a method for manufacturing a sputtering target, comprising the following steps:
[0038] A tubular liner and at least two cylindrical target segments are provided, wherein the axis of the tubular liner is defined as an axial direction, a radial plane is perpendicular to the axial direction, and ends of the target segments have at least one tongue or at least one groove;
[0039] providing a bonding material disposed between the tubular liner and at least two cylindrical target segments;
[0040] Arranging cylindrical target segments side by side in the axial direction on the tubular liner, at least two ends of at least two cylindrical target segments facing each other form a tongue-and-groove fit with each other in such a way that at least one tongue of one end overlaps with at least one groove of the respective other end of two adjacent cylindrical target segments when viewed in radial and / or axial direction, the overlap extending at least around a part of the circumference of the respective end;
[0041] At least two cylindrical target segments are bonded to a tubular liner.
[0042] Effects of the Invention
[0043] According to the sputtering target involved in the first aspect of the present invention, leakage of solder from the target material joint is prevented, assembly accuracy and assembly stability are significantly improved, and stable quality, high yield rate and cost saving are achieved.
[0044] According to the method for manufacturing a sputtering target involved in the second aspect of the present invention, stable product quality, high yield rate and cost saving are achieved. BRIEF DESCRIPTION OF THE DRAWINGS
[0045] Figure 1 This is a schematic diagram of a sputtering target according to a first embodiment of the present invention.
[0046] Figure 2 for Figure 1 A local enlarged view of point B in the sputtering target.
[0047] Figure 3 for Figure 1 A local enlarged view of point A in the sputtering target.
[0048] Figure 4 This is a flowchart of a method for producing a sputtering target according to a second embodiment of the present invention. DETAILED DESCRIPTION
[0049] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0050] In the description of the present invention, it should be noted that the orientations or positional relationships indicated by terms such as "center", "up", "down", "top", "bottom", "inside" and "outside" are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.
[0051] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0052] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.
[0053] Figure 1FIG. 1 is a schematic diagram of a sputtering target according to a first embodiment of the present invention. Figure 1 As shown, the sputtering target includes a tubular liner 1 and cylindrical target segments 2 and 3. The number of target segments is not limited to two, but may be three or more. The axis of the liner 1 is defined as the axial direction (in Figure 1 The radial direction of the liner 1 (in Figure 1 The surface where the target segments 2 and 3 are located (left and right in the middle) is perpendicular to the axial direction. The cylindrical target segments 2 and 3 are arranged on the liner 1, and the liner 1 extends axially through the entire total length of the target segments 2 and 3. The target segments 2 and 3 are preferably made of metal materials, and more preferably made of materials based on molybdenum and / or tungsten. A bonding material is provided between the liner 1 and the target segments 2 and 3, and the bonding material is preferably solder, and more preferably indium solder or indium alloy solder. On the lower side of the target segment 3 ( Figure 1 A stop member is provided at point A in the figure.
[0054] Figure 2 for Figure 1 A partial enlarged view of point B in the figure. Figure 2 As shown, the two ends of the target segments 2 and 3 facing each other form a tongue-and-groove fit with each other in the following manner, when viewed in the radial and / or axial direction, so that a tongue 6 of the end of the target segment 2 overlaps with a groove 7 of the corresponding other end of the target segment 3, and the overlap extends around a portion of the circumference of the corresponding end. The number of tongues 6 and grooves 7 is not limited to one, and there may also be multiple tongues 6 and grooves 7. Preferably, the tongue-and-groove fit is established section by section along the circumference of two adjacent target segments (especially in combination with the bayonet mechanism described below). Preferably, the overlap extends around the entire circumference of the corresponding end. The tongue 6 is preferably a ridge with a rectangular cross section and two parallel side walls, and the groove 7 is preferably a groove with a rectangular cross section and two parallel side walls, but is not limited thereto. The tongue 6 and groove 7 may also be other suitable structures, such as a tongue with a tapered cross section and a corresponding tapered groove. Preferably, a protrusion is provided on the tenon 6 and a corresponding groove is provided on the groove 7, or a groove is provided on the tenon 6 and a corresponding protrusion is provided on the groove 7, so that the protrusion is engaged with the groove through relative rotation between the target segments 2 and 3, that is, combined with the bayonet structure, but not limited to this, the tenon 6 and the groove 7 may also be provided with grooves / grooves / steps.
[0055] Preferably, the tongue 6 and the groove 7 are arranged within the inner range of 75% of the maximum thickness in the radial plane of each corresponding end of the target segments 2, 3, but are not limited thereto and may also be arranged at other appropriate positions.
[0056] Figure 3 for Figure 1 A partial enlarged view of the middle A. Figure 3As shown, the stop member 4 is formed integrally with the liner 1 at the axial end region of the liner 1 and protrudes radially along the liner 1 and extends around at least a portion of the circumference of the liner 1, that is, the stop member 4 is an integral part of the liner 1, and the stop member 4 and the adjacent target segment 3 form a tongue-and-groove fit. "Integrally formed" should include one-step molding with the same material or joining by welding, glue connection, etc. A circumferential sealing member 5 is inserted between the stop member 4 and the target segment 3 to prevent leakage of the bonding material. Preferably, the stop member 4 extends continuously around the circumference of the liner 1. Preferably, the sealing member 5 is an O-ring made of elastic material and is compressed between the target segment 3 and the stop member 4, but it is not limited thereto and can also be other applicable structures.
[0057] Preferably, the stop member 4 is a protruding step portion, but is not limited thereto, and may be other applicable structures. The protruding step portion may be a protruding ridge with two parallel side walls, which includes a substantially rectangular cross section with two parallel side walls, but is not limited thereto, and may be other applicable structures, for example, a step portion with a tapered cross section and a corresponding tapered groove.
[0058] Preferably, the stop member 4 is a circumferential member having a lip protruding in the radial direction and pressing against the stop member 4 and / or the target segment 3 to provide a sealing function, but it is not limited thereto and may be other applicable structures. That is, the circumferential seal extends circumferentially along the gap between two adjacent target segments, such as a lip, a T-shaped profile, a foil, an annular metal member with a spring function, etc.
[0059] Preferably, the stopping member 4 includes, for example, a groove or a tenon extending in the axial direction, but is not limited thereto and may also be other applicable structures.
[0060] The existing sputtering targets generally have flat seams at the joints of multiple target segments, and no fixed target boss is provided on the back tube surface. Compared with the existing cutting method, the sputtering target of the present invention forms a tongue-and-groove fit at the two ends of the target segments facing each other, which can significantly improve the assembly accuracy and assembly stability, and in the process of target application, as the temperature rises, it can also prevent the solder from leaking from the target joint.
[0061] Hereinafter, suitable embodiments of the present invention will be described, but the implementation forms of the present invention are not limited thereto.
[0062] <Example 1>
[0063] The sputtering target in Example 1 includes: a tubular liner 1, cylindrical target segments 2 and 3 made of molybdenum, a stopper 4, and a sealing member 5. The target segments 2 and 3 are arranged on the liner 1, and the liner 1 extends through the entire total length of the target segments 2 and 3 in the axial direction. Indium solder is arranged between the liner 1 and the target segments 2 and 3, and the two ends of the target segments 2 and 3 facing each other form a tongue-and-groove fit with each other in the following manner, when viewed in the radial and axial directions, so that a tongue 6 of the end of the target segment 2 overlaps with a groove 7 of the corresponding other end of the target segment 3, and the overlap extends around a part of the circumference of the corresponding end, the tongue 6 is a ridge with a rectangular cross section and two parallel side walls, and the groove 7 is a groove portion with a rectangular cross section and two parallel side walls. A protrusion is provided on the tongue 6, and a corresponding groove portion is provided on the groove 7, so that the protrusion is engaged with the groove portion through relative rotation between the target segments 2 and 3. The stopper 4 is provided on the target segment 3. The stopper member 4 is formed integrally with the liner 1 at the axial end region of the liner 1 using the same material as the liner 1, protrudes radially along the liner 1, and continuously extends around the circumference of the liner 1. The stopper member 4 is a protruding step portion, a protruding ridge with two parallel side walls, and includes a substantially rectangular cross section with two parallel side walls. After the sputtering target of the present invention is applied, the solder is prevented from leaking from the lowermost end of the target material, the assembly accuracy and assembly stability are significantly improved, and the production efficiency is greatly improved.
[0064] <Example 2>
[0065] The sputtering target in Example 2 includes: a tubular liner 1, cylindrical target segments 2 and 3 made of tungsten, a stopper 4, and a sealing member 5. The target segments 2 and 3 are arranged on the liner 1, and the liner 1 extends through the entire total length of the target segments 2 and 3 in the axial direction. A plurality of target segments may be provided between the target segments 2 and 3. The two ends of the target segments facing each other form a tongue-and-groove fit with each other in the following manner. When viewed in the radial direction, the two tongues at the end of one target segment overlap with the two grooves at the corresponding other end of the other target segment, and the overlap extends around the entire circumference of the corresponding end. An indium alloy solder is provided between the liner 1 and the target segments 2 and 3. The stopper 4 is provided on the target segment 3. The stopper 4 is formed integrally with the liner 1 in the axial end region of the liner 1 by welding and protrudes radially along the liner 1, and extends continuously around the circumference of the liner 1. The stopper 4 is a circumferential member having a radially protruding lip and pressing against the stopper 4 and / or the target segment 3 to provide a sealing function. After the sputtering target of the present invention is applied, the solder is prevented from leaking from the lowermost end of the target material, the assembly accuracy and assembly stability are significantly improved, and the production efficiency is greatly improved.
[0066] <Example 3>
[0067] The sputtering target in Example 3 includes: a tubular liner 1, cylindrical target segments 2 and 3 made of tantalum, a stopper 4, and a sealing member 5. The target segments 2 and 3 are arranged on the liner 1, and the liner 1 extends through the entire total length of the target segments 2 and 3 in the axial direction. A plurality of target segments can also be arranged between the target segments 2 and 3. The two ends of the target segments facing each other form a tongue-and-groove fit with each other in the following manner, so that when viewed in the radial axial direction, the three tongues of the end of one target segment overlap with the three grooves of the corresponding other end of the other target segment, and the overlap extends around the entire circumference of the corresponding end. An indium alloy solder is arranged between the liner 1 and the target segments 2 and 3. A stopper 4 is arranged on the target segment 3. The stopper 4 is formed integrally with the liner 1 in the axial end region of the liner 1 by glue connection, protrudes radially along the liner 1, and extends continuously around the circumference of the liner 1. The stopper 4 is an annular metal part with a spring function. After the sputtering target of the present invention is applied, the solder is prevented from leaking from the lowermost end of the target material, the assembly accuracy and assembly stability are significantly improved, and the production efficiency is greatly improved.
[0068] Next, the method for producing a sputtering target according to the present invention will be described in detail.
[0069] The method for manufacturing a sputtering target according to the second embodiment of the present invention is a method for manufacturing the sputtering target according to the first embodiment of the present invention. Figure 4 As shown, in step S101, a tubular liner and at least two cylindrical target segments are first provided, the axis of the tubular liner is defined as the axial direction, the plane where the radial direction is located is perpendicular to the axial direction, and the ends of the target segments have at least one tongue or at least one groove. Then, in step S102, a bonding material is provided to be arranged between the tubular liner and the at least two cylindrical target segments. Next, in step S103, the cylindrical target segments are arranged side by side on the tubular liner in the axial direction, and at least two ends of at least two cylindrical target segments facing each other form a tongue-and-groove fit (tongue-and-groove fit) with each other in the following manner, when viewed in the radial and / or axial direction, so that at least one tongue of one end overlaps with at least one groove of the corresponding other end of two adjacent cylindrical target segments, and the overlap extends at least around a portion of the circumference of the corresponding end. Finally, in step S104, the at least two cylindrical target segments are bonded to the tubular liner.
[0070] The sputtering target of the first embodiment is prepared by adopting the manufacturing method of the second embodiment, which effectively solves the problem that during the application of the target material, as the temperature rises, the solder is easy to leak from the target material joints. Compared with the previous existing processes, the manufactured sputtering target has stable quality and high yield rate.
[0071] The silver tungsten contact material of the second embodiment of the present invention is an embodiment corresponding to the sputtering target of the first embodiment. Therefore, various implementation points in the first embodiment are also applicable to the second embodiment, and will not be described in detail here.
[0072] Industrial Applicability
[0073] The sputtering target and the method for manufacturing the sputtering target involved in the present invention effectively solve the problem that solder easily leaks from the target material joints as the temperature rises during the target material application process, thereby achieving stable quality, high yield rate and cost savings.
[0074] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed by the present invention should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.
Claims
1. A sputtering target, characterized in that: include: For a tubular liner, the axis is defined as the axial direction, and the plane where the radial direction lies is perpendicular to the axial direction; At least two cylindrical target segments are disposed side by side on the tubular liner along the axial direction; a bonding material disposed between the tubular liner and the at least two cylindrical target segments, at least two ends of at least two cylindrical target segments facing each other form a tongue-and-groove fit with each other in such a way that, when viewed in said radial and / or said axial direction, at least one tongue of one end overlaps with at least one groove of the respective other end of two adjacent cylindrical target segments, said overlap extending along the entire circumference of the two adjacent target segments, when viewed in a radial plane, The bonding material is indium solder or indium alloy solder.
2. The sputtering target according to claim 1, characterized in that At least two ends of at least two cylindrical target segments facing each other form a tongue-and-groove fit with each other in such a way that a tongue of one end overlaps a groove of the respective other end of two adjacent cylindrical target segments when viewed in the radial and / or axial direction.
3. The sputtering target according to claim 1, characterized in that At least two ends of at least two cylindrical target segments facing each other form a tongue-and-groove fit with each other in such a way that, when viewed in radial direction, one end having more than one tongue and / or groove overlaps with another end having more than one groove and / or tongue, so that each tongue overlaps with a corresponding facing groove, or each groove overlaps with a corresponding facing tongue.
4. The sputtering target according to claim 1, characterized in that When viewed in radial direction, at least one tongue of one end and respectively at least one groove of the other end are arranged within 75% of the maximum thickness in a radial plane of the respective ends of two adjacent cylindrical target segments.
5. The sputtering target according to claim 1, wherein: The tongue is a ridge with a rectangular cross section and two parallel side walls, and the groove is a slot with a rectangular cross section and two parallel side walls.
6. The sputtering target according to claim 1, characterized in that When viewed in the radial and / or axial direction, the tongue-and-groove fit is established segment by segment along the circumference of two adjacent target segments.
7. The sputtering target according to claim 1, characterized in that A protrusion is provided on one of the tongue and groove, and a corresponding groove is provided on the other of the tongue and groove, so that the protrusion is engaged with the groove by relative rotation between two adjacent target segments.
8. The sputtering target according to claim 1, wherein: Also included is a circumferential sealing member extending circumferentially along the gap between two adjacent target segments.
9. The sputtering target according to claim 8, characterized in that The circumferential sealing member is arranged in a groove formed in two adjacent target segments.
10. The sputtering target according to claim 1, wherein: The target segment is made of metal material.
11. The sputtering target according to claim 10, characterized in that The target segments are made of molybdenum and / or tungsten based materials.
12. The sputtering target according to claim 1, wherein: Also comprising at least one cylindrical target segment disposed on the tubular liner, the tubular liner extending axially through at least 90% of the total length of the at least one cylindrical target segment, The sputtering target also includes: a stop member for a target segment adjacent to the stop member, the stop member being integrally formed with the tubular liner at an axial end region of the tubular liner and projecting radially along the tubular liner and extending around at least a portion of the circumference of the tubular liner, A circumferential sealing member is inserted between the stop member and the adjacent target segment to prevent leakage of the bonding material.
13. A method for manufacturing a sputtering target, characterized in that: The following steps are involved: A tubular liner and at least two cylindrical target segments are provided, wherein the axis of the tubular liner is defined as an axial direction, a radial plane is perpendicular to the axial direction, and ends of the target segments have at least one tongue or at least one groove; providing a bonding material disposed between the tubular liner and at least two cylindrical target segments; Arranging cylindrical target segments side by side in the axial direction on the tubular liner, at least two ends of at least two cylindrical target segments facing each other form a tongue-and-groove fit with each other in such a way that, when viewed in the radial and / or axial direction, at least one tongue of one end overlaps with at least one groove of the respective other end of two adjacent cylindrical target segments, and when viewed in a radial plane, the overlap extends along the entire circumference of the two adjacent target segments; bonding at least two cylindrical target segments to a tubular liner, The bonding material is indium solder or indium alloy solder.