Slide glass boat supporting rod, electrode introduction assembly and semiconductor processing equipment

Abstract

The invention provides a slide glass boat supporting rod, an electrode introduction assembly and semiconductor processing equipment. The slide glass boat supporting rod comprises a plurality of conductive supporting sections which are sequentially connected in series, and every two adjacent conductive supporting sections are connected through an insulating part; each conductive support section is used for supporting and electrically conducting a slide boat; and the leading-in channel sequentially penetrates through at least one conductive supporting section from the conductive supporting section at the end part, and is used for allowing an electrode leading-in assembly to penetrate, so that the electrode leading-in assembly can be electrically connected with any one of the conductive supporting sections which the leading-in channel penetrates through and is adjacent to the leading-in channel.

Description

Technical Field

[0001] The present disclosure relates to the field of semiconductor manufacturing, and in particular, to a wafer boat support rod, an electrode introduction assembly, and semiconductor processing equipment. Background Art

[0002] One of the processes in the solar silicon wafer processing is to use the plasma enhanced chemical vapor deposition (PECVD) process to make an anti-reflection film to improve the light conversion rate of solar cells. At present, most of the mainstream photovoltaic technologies use single-boat PECVD equipment. With the development of technology and the increase in production capacity demand, dual-boat and multi-boat PECVD equipment is the main development direction for matching equipment production capacity in the future.

[0003] In the existing double-boat PECVD equipment, in order to solve the problem of the difference in RF fields at the furnace head and furnace tail of the double boats, it is necessary to introduce two RF power supply signals into the respective feeding structures of the two carrier boats (i.e., graphite boats), so as to improve the production capacity and uniformity between wafers. The carrier boat (front boat) adjacent to the furnace mouth end of the two carrier boats is electrically connected to the RF power supply at the furnace mouth end, while the carrier boat (rear boat) adjacent to the furnace tail end is electrically connected to the RF power supply at the furnace tail end. The above-mentioned equipment introduces RF power supply signals from the RF power supplies in two directions, namely, the furnace mouth end and the furnace tail end, and the required wiring is complex. During maintenance, it is necessary to remove the wiring required for the RF power supply from the furnace mouth end and the furnace tail end respectively before carrying out the subsequent maintenance process, which makes the disassembly and installation process complicated. Summary of the invention

[0004] The present disclosure aims to solve at least one of the technical problems existing in the prior art, and proposes a wafer boat support rod, an electrode introduction assembly and a semiconductor processing equipment, which can solve the problem in the prior art that the cloth required for the RF power signal needs to be disassembled from the furnace mouth end and the furnace tail end respectively, thereby saving maintenance time.

[0005] In order to achieve the purpose of the present disclosure, a wafer boat support rod is provided, which is applied to semiconductor processing equipment, including:

[0006] A plurality of conductive support segments connected in series, each two adjacent conductive support segments being connected via an insulating component; each conductive support segment being used to support and electrically conduct a wafer boat; and

[0007] An introduction channel penetrates at least one of the conductive support segments in sequence from the conductive support segment at the end, for allowing the electrode introduction component to penetrate, so that the electrode introduction component can be electrically connected to any one of the conductive support segments penetrated by the introduction channel and adjacent to the conductive support segment.

[0008] In some embodiments, the conductive support segment through which the introduction channel passes includes a conductive rod body and a conductive support structure, the introduction channel is arranged in the conductive rod body, the conductive support structure is fixedly connected to the outer side of the conductive rod body and is electrically connected to the conductive rod body, and the conductive support structure has at least one supporting surface for supporting and electrically contacting the wafer boat.

[0009] In some embodiments, the conductive support segment is configured to be rotatable around its own axis, and the conductive support structure has a plurality of the support surfaces, which are sequentially distributed along the circumference of the conductive support segment.

[0010] In some embodiments, the wafer boat support rod also includes an outer insulating sleeve that is sleeved around the conductive support segment, the outer insulating sleeve is provided with a receiving opening, the conductive support structure is disposed in the receiving opening, and the supporting surface of the conductive support structure extends from the receiving opening.

[0011] In some embodiments, the insulating component is annular and is sleeved on two adjacent conductive support segments, and an annular insulating isolation portion is formed on the inner circumference of the insulating component. The insulating isolation portion is located between two end surfaces opposite to each other of the two adjacent conductive support segments, and the space enclosed by the insulating isolation portion is used for the electrode introduction assembly to pass through.

[0012] In some embodiments, the insulating component is provided with a supporting portion, and the supporting portion is used to provide support for the insulating component when the wafer boat supporting rod is installed in the process chamber of the semiconductor processing equipment.

[0013] In some embodiments, a mounting hole is formed on the conductive support segment, and the mounting hole passes through from the inner wall of the conductive support segment to the outer wall of the conductive support segment.

[0014] As another technical solution, the present disclosure also provides an electrode introduction assembly, which is adapted to the above-mentioned wafer boat support rod; the electrode introduction assembly includes a plurality of electrode introduction structures, the number of the electrode introduction structures is the same as the number of the conductive support segments, and they are electrically connected one by one; wherein, at least part of the electrode introduction structures can be electrically connected via the introduction channel to the corresponding conductive support segments that are penetrated by or adjacent to the introduction channel.

[0015] In some embodiments, one of the electrode introduction structures is electrically connected to the outer wall of the conductive support segment at the endmost portion; the remaining electrode introduction structures are electrically connected to the corresponding conductive support segments via the introduction channel.

[0016] In some embodiments, the electrode introduction assembly further includes: an electrical connection portion, which is used to electrically connect one end of the electrode introduction assembly to the inner wall of the corresponding conductive support segment and keep it stationary.

[0017] In some embodiments, a mounting hole is formed on the conductive support segment, and the mounting hole passes through from the inner wall of the conductive support segment to the outer wall of the conductive support segment; the electrical connection portion includes a threaded mating component, and the threaded mating component is arranged in the mounting hole for threaded connection with one end of the electrode introduction component.

[0018] In some embodiments, each of the electrode introduction structures electrically connected to the corresponding conductive support segment via the introduction channel includes a flexible introduction segment, one end of the flexible introduction segment is used to be electrically connected to the RF power supply, and the other end of the flexible introduction segment is electrically connected to the corresponding conductive support segment; the flexible introduction segment is configured to be rotatable relative to the wafer boat support rod.

[0019] In some embodiments, each of the electrode introduction structures electrically connected to the corresponding conductive support segment via the introduction channel further includes a rigid introduction segment, and the other end of the flexible introduction segment is electrically connected to the corresponding conductive support segment via the rigid introduction segment.

[0020] In some embodiments, the electrode introduction assembly further includes: an inner insulating sleeve, which is sleeved around at least one of the electrode introduction structures and is used to be arranged in the introduction channel.

[0021] As another technical solution, the present disclosure further provides a semiconductor processing device, comprising a process chamber and a first chamber door and a second chamber door arranged on both sides of the chamber body of the process chamber, wherein the first chamber door can be opened and closed, and comprises at least two wafer boat support rods and at least two electrode introduction assemblies, wherein the wafer boat support rod adopts the above-mentioned wafer boat support rod, and the electrode introduction assembly adopts the above-mentioned electrode introduction assembly,

[0022] At least two of the wafer boat support rods are disposed in the cavity, and are used to jointly support at least two wafer boats;

[0023] At least two of the electrode introduction assemblies are used to electrically connect at least two of the wafer boat support rods to the radio frequency power supply in a one-to-one correspondence.

[0024] The present disclosure has the following beneficial effects:

[0025] The wafer boat support rod provided by the present disclosure includes a plurality of conductive support segments connected in series in sequence, and each adjacent two conductive support segments are connected by an insulating component; each conductive support segment is used to support and electrically conduct a wafer boat, so as to support multiple wafer boats through the wafer boat support rod. On this basis, the wafer boat support rod also includes an introduction channel, and the introduction channel sequentially penetrates at least one conductive support segment from the conductive support segment at the end, so as to allow the electrode introduction component to penetrate, so that the electrode introduction component can be electrically connected to any one of the conductive support segments penetrated by the introduction channel and adjacent to the conductive support segment. Thus, the RF power supply arranged on one side of the end can be introduced into the wafer boat on all the conductive support segments through the electrode introduction component, so that the wiring related to the RF power supply is concentrated at the end, reducing the complexity of the wiring. In this way, during maintenance, it is only necessary to disassemble the wiring required for all RF power supplies (including the electrode introduction component) at the end, without having to disassemble from the other end opposite to the end, thereby shortening the maintenance time and improving the production capacity.

[0026] The electrode introduction assembly provided by the present disclosure is adapted to the above-mentioned wafer boat support rod provided by the present disclosure, and the electrode introduction assembly includes a plurality of electrode introduction structures, the number of which is the same as the number of conductive support segments, and they are electrically connected one by one; wherein, at least part of the electrode introduction structures can be electrically connected to the corresponding conductive support segments that are penetrated or adjacent to the introduction channels via the introduction channels. In this way, the RF power source arranged on one side of the end can be respectively introduced into the wafer boat on all the conductive support segments through the plurality of electrode introduction structures, so the wiring related to the RF power source is concentrated at the end, reducing the complexity of the wiring. In this way, during maintenance, it is only necessary to disassemble the wiring required for all RF power sources at the end, without having to disassemble from the other end opposite to the end, thereby shortening the maintenance time and improving the production capacity.

[0027] The semiconductor processing equipment provided by the present disclosure includes a process chamber and a first chamber door and a second chamber door arranged on both sides of the chamber body of the process chamber, the first chamber door can be opened and closed, and at least two of the above-mentioned wafer boat support rods and at least two of the above-mentioned electrode introduction assemblies provided by the present disclosure are adopted, and at least two wafer boat support rods are arranged in the chamber body, used to jointly carry at least two wafer boats; at least two electrode introduction assemblies are used to electrically connect at least two wafer boat support rods with radio frequency power supplies in a one-to-one correspondence. In this way, the radio frequency power supply arranged on one side of the end (for example, at the first chamber door) can be respectively introduced into the wafer boats on all the conductive support segments through multiple electrode introduction assemblies, so that the wiring related to the radio frequency power supply is concentrated at the first chamber door, reducing the complexity of the wiring. In this way, during maintenance, it is only necessary to disassemble the wiring required for all radio frequency power supplies at the first chamber door, without having to disassemble from the other end opposite to the end (for example, at the second chamber door), thereby shortening the maintenance time and improving the production capacity. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 A structural diagram of a semiconductor processing device provided by an embodiment of the present disclosure at an angle when the cavity is not shown;

[0029] Figure 2 A structural diagram of a semiconductor processing device provided by an embodiment of the present disclosure at a certain angle when showing a cavity;

[0030] Figure 3 A structural diagram of a semiconductor processing device provided by an embodiment of the present disclosure without showing a chamber and a wafer boat;

[0031] Figure 4 A side view of the wafer boat support rod and electrode introduction assembly used in the embodiment of the present disclosure Figure 1 ;

[0032] Figure 5 A side view of the wafer boat support rod and electrode introduction assembly used in the embodiment of the present disclosure Figure 2 ;

[0033] Figure 6 A schematic top view of a wafer boat support rod and an electrode introduction assembly used in an embodiment of the present disclosure;

[0034] Figure 7 A partial cross-sectional view of a wafer boat support rod used in an embodiment of the present disclosure, taken along its extension direction when the electrode introduction assembly is not shown;

[0035] Figure 8 A partial structural diagram of a wafer boat support rod used in an embodiment of the present disclosure at a certain angle;

[0036] Fig. 9 A cross-sectional view of a wafer boat support rod and an electrode introduction assembly used in an embodiment of the present disclosure, taken along the extending direction of the wafer boat support rod;

[0037] Fig.10 for Fig. 9 Enlarged view of the middle I area;

[0038] Fig.11 for Fig. 9 Enlarged view of the middle II region;

[0039] Fig.12 for Fig. 9 Enlarged view of the middle III region;

[0040] Fig.13 A partial cross-sectional view of an introduction channel and an electrode introduction assembly of a wafer boat support rod used in an embodiment of the present disclosure, taken along the extension direction of the wafer boat support rod;

[0041] Fig.14It is a partial cross-sectional view of the introduction channel and electrode introduction assembly of the wafer boat support rod used in the embodiment of the present disclosure, cut along the radial direction of the wafer boat support rod at the insulating component.

[0042] List of reference numerals:

[0043] 10. Process chamber; 100. Cavity; 101. Furnace mouth flange; 102. Furnace tail flange;

[0044] 104, wafer boat; 104a, first wafer boat; 104b, second wafer boat; 1041, first boat foot; 1042, second boat foot; 105, electrical connection structure; 106, fixing bracket; 20, wafer boat support rod; 201, first end; 202, second end; 210, conductive support section; 211, first conductive support section; 212, second conductive support section; 230, introduction channel; 214, conductive rod body; 215, conductive support structure; 216, support surface; 21 7. Mounting hole; 220. Insulating component; 221. Insulating isolation portion; 222. Support portion; 224. Outer insulating sleeve; 225. Limiting portion; 226. Accommodating opening; 30. Electrode introduction assembly; 300. Electrode introduction structure; 301. Flexible introduction section; 302. Rigid introduction section; 303. First joint; 304. Second joint; 305. Inner insulating sleeve; 310. Electrical connection portion; 311. First threaded structure; 312. Second threaded structure; 400. Electrode connection assembly. DETAILED DESCRIPTION

[0045] In order to enable those skilled in the art to better understand the technical solution of the present disclosure, the temperature control device provided by the present disclosure and the reaction chamber using the same are described in detail below with reference to the accompanying drawings.

[0046] In the description of the present disclosure, unless otherwise specified, expressions in the singular form may include plural concepts.

[0047] Furthermore, the terms “first”, “second”, etc. are only used to distinguish the descriptions and should not be understood as indicating or implying relative importance or order.

[0048] In addition, it should be noted that, unless there is any conflict, the features in the embodiments of the present disclosure may be arbitrarily combined with each other.

[0049] The present disclosure provides a wafer boat support rod, which is applied to semiconductor processing equipment, such as a Plasma Enhanced Chemical Vapor Deposition (PECVD) equipment, and the PECVD equipment can be a single-boat PECVD equipment or a double-boat or more-boat PECVD equipment. Figure 1 and Figure 2The PECVD equipment mainly includes a process chamber 10, which is used to provide a vacuum process environment. The chamber body 100 of the process chamber 10 is, for example, a quartz tube, which can be horizontal or vertical. The quartz tube is provided with a first chamber door (not shown in the figure) and a second chamber door (not shown in the figure) at both ends of the quartz tube in its axial direction (for example, parallel to the horizontal plane), respectively, for sealing the internal space of the quartz tube to form a sealed space. In addition, the first chamber door (also called the furnace door at the furnace mouth end) is sealedly connected to the quartz tube, for example, through a furnace mouth flange 101, and the first chamber door is configured to be able to open and close to open or close the furnace mouth. When the furnace mouth is opened, the wafer boat 104 can be moved from the furnace mouth into the process chamber 10 or moved out of the process chamber 10.

[0050] The wafer boat support rod 20 provided in the embodiment of the present disclosure is used to be installed in the above-mentioned process chamber 10. Figures 3 to 14 , and combined with Figure 1 and Figure 2 The wafer boat support rod 20 includes a plurality of conductive support segments 210 connected in series in sequence. The conductive support segments 210 are made of, for example, a conductive material such as stainless steel, and compared with insulating support rods made of insulating materials (for example, ceramics, etc.), the wafer boat support rod 20 with the conductive support segments 210 as the main body has better load-bearing capacity and support strength. Each adjacent two conductive support segments 210 are connected by an insulating component 220. The insulating component 220 is made of, for example, an insulating material with good load-bearing capacity such as silicon. The wafer boat support rod 20 is used to support at least one wafer boat 104 in the process chamber 10, wherein each conductive support segment 210 can be used to support and electrically conduct a wafer boat 104. Each wafer boat 104 generally has four boat feet, which are, for example, respectively located at the four corners of the rectangular outline of the wafer boat 104. In this case, two wafer boat support rods 20 need to be installed in the process chamber 10. The two wafer boat support rods 20 are arranged opposite to each other in a direction parallel to the horizontal plane, and are used to jointly support at least one wafer boat 104. The number of conductive support segments 210 included in each wafer boat support rod 20 can be, for example, the same, and are arranged one by one. The conductive support segments 210 corresponding to the two wafer boat support rods 20 are used to jointly support one wafer boat 104, that is, each conductive support segment 210 is used to directly or indirectly support two of the boat feet of the wafer boat 104. Figure 1 and Figure 2It is shown that two wafer boat support rods 20 are used to jointly support two wafer boats 104. The two wafer boats 104 are arranged in sequence along the extension direction of the wafer boat support rods 20 (i.e., the axial direction of the wafer boat support rods 20). The wafer boat 104 close to the first chamber door (also known as the furnace door at the furnace mouth end) of the two wafer boats 104 is the first wafer boat 104a, and the wafer boat 104 close to the second chamber door (also known as the furnace door at the furnace tail end) is the second wafer boat 104b. However, the disclosed embodiment is not limited to this. In actual applications, the two wafer boat support rods 20 can also be used to jointly support one wafer boat 104, or more than three wafer boats 104. In addition, according to the specific structure of the wafer boat in practice, the number of the wafer boat support rods 20 installed in the process chamber can also be three, four or more, and two wafer boat support rods 20 can jointly support at least one wafer boat, or three, four or more wafer boat support rods 20 can jointly support at least one wafer boat, and in the case where two wafer boat support rods 20 jointly support at least one wafer boat, four, six or more even number of wafer boat support rods 20 can also be set, and every two adjacent wafer boat support rods 20 jointly support at least one wafer boat, and the disclosed embodiment has no limitation on this. In the prior art, with long-term use and temperature changes in the process chamber, the position and angle of the conductive support member on the insulating support rod for supporting and electrically contacting the boat foot of the wafer boat will shift and deflect, and the conductive support member needs to be frequently maintained and corrected. In comparison, the conductive support section 210 of the wafer boat support rod 20 of the present embodiment is in direct electrical contact with the boat foot of the wafer boat, reducing the technical problem that the separate support member will shift and deflect.

[0051] like Figures 4 to 7 , Figures 9 to 14 As shown, the wafer boat support rod 20 also includes an introduction channel 230. The introduction channel 230 sequentially penetrates at least one conductive support segment 210 from the endmost conductive support segment 210, for allowing the electrode introduction assembly 30 to penetrate, so that the electrode introduction assembly 30 can be electrically connected to any one of the conductive support segments 210 penetrated by the introduction channel 230 and adjacent to it. For example, in the case where the wafer boat support rod 20 is applied to semiconductor processing equipment, the conductive support segment 210 at the endmost can be the conductive support segment closest to the first chamber door, and the conductive support segment 210 at the other end opposite to the endmost can be the conductive support segment closest to the second chamber door. For ease of description, the first end 201 is used hereinafter to refer to the endmost end, and the second end 202 is used to refer to the other end opposite to the endmost end. For example, in an embodiment in which two conductive support segments are provided, the first conductive support segment 211 located at the first end 201 is the conductive support segment at the endmost portion, and the second conductive support segment 212 located at the second end 202 is the conductive support segment at the other end opposite to the endmost portion, and the first conductive support segment 211 and the second conductive support segment 212 are connected via an insulating component 220.

[0052] In this embodiment, since the introduction channel 230 sequentially penetrates at least one conductive support segment 210 from the conductive support segment 210 at the first end 201 (the endmost end), the electrode introduction component 30 that penetrates the introduction channel 230 from the first end 201 can be electrically connected to any one of the conductive support segments 210 penetrated by the introduction channel 230 and adjacent to the conductive support segment 210 via the introduction channel 230. In the embodiment of the present disclosure, the wiring related to the RF power supply can be set on the side of the first end 201 to reduce the complexity of the wiring, thereby reducing the difficulty of maintenance and reducing the maintenance time. For example, in an example in which the wafer boat support rod 20 includes a first conductive support segment 211 located at the first end 201 and a second conductive support segment 212 located at the second end 202, the introduction channel 230 passes through the first conductive support segment 211, and the electrode introduction assembly 30 inserted into the introduction channel 230 can be electrically connected to the second conductive support segment 212, so that the wiring related to the RF power supply for the first conductive support segment 211 and the second conductive support segment 212 can be set on the side of the first end 201.

[0053] In this embodiment, the electrode introduction assembly 30 of the introduction channel 230 can be electrically connected to the conductive support segment 210 adjacent to the introduction channel 230 via the introduction channel 230. In some embodiments, the conductive support segment 210 adjacent to the introduction channel 230 can be a solid structure, and the electrode introduction assembly 30 can be electrically connected to the end surface of the adjacent conductive support segment 210 facing the introduction channel 230 via the introduction channel 230. For example, in an embodiment in which two conductive support segments are provided, the second conductive support segment 212 can be a solid structure, and the electrode introduction assembly 30 can be electrically connected to the corresponding end surface of the second conductive support segment 212, at which time the second conductive support segment 212 can be exposed at the end surface to the introduction channel 230 that passes through the first conductive support segment 211, so that the electrode introduction assembly 30 can be directly electrically connected to the end surface of the second conductive support segment 212 after passing through the introduction channel 230. In some embodiments, the conductive support segment 210 adjacent to the introduction channel 230 may include an opening facing the introduction channel 230, the opening having a blind end, and the electrode introduction assembly 30 may be electrically connected to the blind end of the opening of the adjacent conductive support segment 210 via the introduction channel 230 and the opening. For example, in an embodiment in which two conductive support segments are provided, the introduction channel 230 may be electrically connected to the blind end of the opening of the second conductive support segment 212 via the introduction channel 230 and the opening of the adjacent second conductive support segment 212. In some embodiments, the introduction channel 230 may pass through all the conductive support segments 210. In this case, the electrode introduction assembly 30 may be electrically connected to all the conductive support segments 210 passed through by the introduction channel 230. For example, the electrode introduction assembly 30 may be electrically connected to the inner wall of the corresponding conductive support segment 210 via the introduction channel 230. For example, in an embodiment in which two conductive support segments 210 are provided, the introduction channel 230 passes through the second conductive support segment 212 , and the electrode introduction assembly 30 can be electrically connected to the inner wall of the second conductive support segment 212 via the introduction channel 230 .

[0054] In some embodiments, the number of the conductive support segments 210 may be three or more. According to the distance from the end (the first end 201), the three conductive support segments 210 connected in series may be divided into a first end conductive support segment located at the first end 201, a second end conductive support segment located at the second end 202, and at least one intermediate conductive support segment located between the first end conductive support segment and the second end conductive support segment. The introduction channel 230 may at least penetrate the first end conductive support segment and at least one intermediate conductive support segment. The electrode introduction assembly 30 may be electrically connected to any one of the first end conductive support segment and the intermediate conductive support segment penetrated by the introduction channel 230 via the introduction channel 230, and the electrode introduction assembly 30 may be electrically connected to the second end conductive support segment adjacent to the introduction channel 230 via the introduction channel 230. In some embodiments, the introduction channel 230 may also penetrate the second end conductive support segment. In this case, the electrode introduction assembly 30 may be electrically connected to the second end conductive support segment penetrated by the introduction channel 230 via the introduction channel 230.

[0055] In some embodiments, a mounting hole 217 is formed on the conductive support segment 210, and the mounting hole 217 passes through the inner wall of the conductive support segment 210 to the outer wall of the conductive support segment 210. By providing the mounting hole 217, the electrode introduction assembly 30 can cooperate with the mounting hole 217 to be connected (for example, electrically connected and / or fixed through the electrical connection portion 310 to be described in detail below) to the conductive support segment 210. It should be noted that in the case where the electrode introduction assembly 30 of the introduction channel 230 can be electrically connected to the conductive support segment 210 adjacent to the introduction channel 230 via the introduction channel 230, the electrode introduction assembly 30 can be directly electrically connected to the conductive support segment 210 adjacent to the introduction channel 230 via the introduction channel 230, and therefore, in this case, the conductive support segment 210 may not be provided with a mounting hole 217. For example, in an embodiment in which two conductive support segments are provided, the electrode introduction assembly 30 can be directly electrically connected to the second conductive support segment 212 via the introduction channel 230 (for example, to the end face or the blind end of the opening of the second conductive support segment 212). Therefore, in this case, the second conductive support segment 212 may not be provided with a mounting hole 217.

[0056] In some embodiments, Figure 7 , Figure 8 and Fig.11As shown, the conductive support section 210 through which the introduction channel 230 passes may include a conductive rod body 214 and a conductive support structure 215. The introduction channel 230 is disposed in the conductive rod body 214; the conductive support structure 215 is fixedly connected to the outer side of the conductive rod body 214 (i.e., the side away from the inside of the introduction channel 230), and is electrically connected to the conductive rod body 214. The conductive support structure 215 has at least one supporting surface 216 for supporting and electrically contacting the wafer boat 104. The conductive support structure 215 can be electrically connected to the boat foot corresponding to the wafer boat. By fixedly connecting the conductive rod body 214 and the conductive support structure 215, it is possible to ensure that there is good electrical contact between the two, and the conductive support structure 215 will not be relatively displaced and deflected with the conductive rod body 214 due to heat or external force, which will cause the conductive support structure 215 to be unable to align with the wafer boat 104. In some embodiments, in order to further strengthen the fixed connection relationship between the conductive rod body 214 and the conductive support structure 215, the conductive rod body 214 and the conductive support structure 215 can be made by integral molding. In some embodiments, the conductive support segment 210 can include multiple conductive support structures 215 to support the boat feet of the same wafer carrier boat 104. The conductive rod body 214 and multiple conductive support structures 215 made by integral molding can ensure that the support surfaces of each conductive support structure are aligned. It should be noted that the conductive rod body 214 and the conductive support structure 215 can also be fixedly connected by welding or the like. Therefore, since the positions of the conductive support structure 215 and the conductive rod body 214 are relatively fixed, in the maintenance process of calibrating the conductive support structure 215, it is only necessary to adjust the corresponding conductive support segment 210 near the furnace mouth flange 101 and the furnace tail flange 102 to complete the calibration of the conductive support structure 215, thereby reducing the maintenance difficulty and improving the production capacity.

[0057] The conductive rod 214 may be tubular, which is convenient for processing. Of course, in practical applications, the conductive rod 214 may also be partially tubular, that is, the portion through which the introduction channel 230 passes is tubular, and the rest is a solid cylinder. For example, the conductive rod 214 of the first conductive support segment 211 is tubular as a whole, and the conductive rod 214 of the second conductive support segment 212 may be partially tubular. In some embodiments, all conductive support segments 210 are tubular, so that the conductive support segments 210 can be manufactured using the same processing method, reducing processing costs.

[0058] The wafer boat 104 is usually provided with four boat feet. Two of the four boat feet are made of conductive materials (hereinafter referred to as first boat feet 1041), and the remaining two boat feet are made of insulating materials (hereinafter referred to as second boat feet 1042). The two first boat feet 1041 are configured to be placed on different wafer boat support rods 20 to avoid short circuit. Figure 1 Taking the first wafer boat 104a shown in the figure as an example, which is close to the furnace flange 101 (i.e., close to the first chamber door), its two first boat legs 1041 are directly supported by the first conductive support segments 211 on the two wafer boat support rods 20, or directly supported by the supporting surfaces 216 of the conductive support structures 215 of the first conductive support segments 211 on the two wafer boat support rods 20, that is, the two wafer boat support rods 20 directly support the two first boat legs 1041. The second boat legs 1042 of the first wafer boat 104a are also directly supported by the two wafer boat support rods 20, or supported by the supporting surfaces 216 of the conductive support structures 215 of the first conductive support segments 211 on the two wafer boat support rods 20, but are electrically insulated. If the two wafer boat support rods 20 are used to support the two wafer boats 104, the two first boat legs 1041 are directly supported by the two wafer boat support rods 20, or supported by the supporting surfaces 216 of the conductive support structures 215 of the first conductive support segments 211 on the two wafer boat support rods 20, but are electrically insulated. Figure 6 Taking the first wafer boat 104a and the second wafer boat 104b shown in the figure as examples, two of the four boat feet of the first wafer boat 104a are first boat feet 1041, which are directly supported and electrically contacted by two first conductive support sections 211, respectively, and the other two are second boat feet 1042, which are directly supported by two first conductive support sections 211 of wafer boat support rods 20, respectively. Two of the four boat feet of the second wafer boat 104b are first boat feet 1041, and the two second boat feet 1042 are supported in the same manner as the first wafer boat 104a, which will not be described in detail here.

[0059] The first conductive support segment 211 and the second conductive support segment 212 each electrically contacts one of the first boat feet 1041 of one of the wafer boats 104; the first boat foot 1041 refers to the boat foot among the four boat feet of the wafer boat 104 which is supported and electrically contacted by the conductive support structure 215 through the support surface 216, a part of the wafer boat 104 is electrically connected to the support surface 216 of one of the conductive support structures 215 through one of the first boat feet 1041, and another part of the wafer boat 104 is electrically connected to the support surface 216 of another conductive support structure 215 through another first boat foot 1041. By setting the electrode introduction component 30 for electrically connecting with the first conductive support segment 211 and the second conductive support segment 212 at the first end 201 or passing through the introduction channel 230 from the first end 201, the connection end of the electrode introduction component 30 can be located at the first end 201 and electrically connected with the positive and negative electrodes of the RF power supply respectively, thereby realizing that the two first boat feet 1041 are electrically connected with the positive and negative electrodes of the RF power supply respectively.

[0060] Specifically, each wafer carrier boat 104 includes a plurality of boat sheets (graphite boat sheets) arranged in sequence in a direction perpendicular to the extension direction of the wafer carrier boat support rod 20, and there is a certain interval between each two adjacent boat sheets, and each two adjacent boat sheets carry wafers (such as silicon wafers) on both sides of the interval. In addition, the plurality of boat sheets are divided into two groups of boat sheets, and each two adjacent boat sheets are located in different boat sheets groups, that is, the boat sheets with odd serial numbers in the queue of the plurality of boat sheets are located in one group of boat sheets, and the boat sheets with even serial numbers are located in the other group of boat sheets. On this basis, as Figure 1 As shown, the wafer boat 104 has electrical connection structures 105 on both sides in the extension direction of the wafer boat support rod 20. The two electrical connection structures 105 are used to electrically connect the boats in each boat group, and different boat groups are not electrically connected. The two first boat feet 1041 are electrically connected to the two electrical connection structures 105, or the two first boat feet 1041 are electrically connected to one of the electrical connection structures 105, so that the two first boat feet 1041 are electrically connected to the boats in the two boat groups. The specific structure of the electrical connection structure 105 to achieve the above function belongs to the well-known technology in the art and will not be repeated here.

[0061] By setting the conductive support segment 210 from the first end 201 to sequentially penetrate the introduction channel 230 in at least one conductive support segment 210, so that the electrode introduction component 30 can be inserted from the first end 201 and can be electrically connected to any one of the conductive support segments 210 penetrated by the introduction channel 230 and adjacent to each other, the RF power supply arranged at the first end 201 can be introduced into the wafer boat 104 on all the conductive support segments 210 through the electrode introduction component 30. Therefore, the wiring related to the RF power supply (for example, cables, etc.) is concentrated at the first end 201 (that is, the first chamber door side), reducing the complexity of the wiring. In this way, during maintenance, it is only necessary to remove the wiring required for all RF power supplies (including the electrode introduction component 30) at the first end 201 without removing it from the second end 202, thereby shortening the maintenance time and improving the production capacity.

[0062] In some embodiments, Figure 8 and Fig.14As shown, the conductive support segment 210 can be configured to rotate around its own axis. The conductive support structure 215 has a plurality of support surfaces 216. The plurality of support surfaces 216 are sequentially distributed along the circumference of the conductive support segment 210. In other words, the distance between each support surface 216 and the axis of the conductive support segment 210 is the same. In the prior art, after the support structure in contact with the first boat foot 1041 is used in a high temperature environment and a coating environment for a period of time, an insulating process film will adhere to the support surface of the support structure, resulting in poor conductivity, reduced contact surface, and arcing. This may cause problems such as poor contact between the electrode introduction structure and the boat foot of the wafer carrier boat or even a short circuit, affecting the process effect. Each of the multiple support surfaces 216 of the conductive support structure 215 is suitable for making electrical contact with the first boat foot 1041 of the wafer boat 104. When the surface conductivity of one of the support surfaces 216 deteriorates and the contact surface is reduced due to long-term use, the orientation of the conductive support structure 215 can be adjusted by rotating the wafer boat support rod 20, and other support surfaces 216 can be used to make electrical contact with the first boat foot 1041 of the wafer boat 104, thereby increasing the service life of the conductive support structure 215. In some embodiments, the radial cross-sections of the multiple support surfaces 216 of the conductive support structure 215 can be regular polygonal structures, for example, Fig.14 As shown, it can be a regular hexagonal structure. It should be noted that the multiple support surfaces 216 can also be constructed in other shapes, and the embodiments of the present disclosure are not limited to this. During maintenance, the maintenance personnel can rotate the wafer boat support rod 20 at the furnace mouth flange 101 or the furnace tail flange 102 to calibrate or replace the support surface without removing the wafer boat support rod 20 from the process chamber 10.

[0063] In some embodiments, Figure 7 and Fig.10As shown, the insulating component 220 is annular. The insulating component 220 is sleeved on two adjacent conductive support segments 210. An annular insulating isolation portion 221 is formed on the inner circumference of the insulating component 220, and the insulating isolation portion 221 is located between the two end surfaces of the two adjacent conductive support segments 210 that are opposite to each other, and the space surrounded by the insulating isolation portion 221 is used for the electrode introduction assembly 30 to pass through. The annular shape of the insulating component 220 makes it easy to process. In addition, in some embodiments, the annular insulating component 220 can allow the conductive support segment 210 to rotate relative to the insulating component 220 to individually correct the support surface 216 of the conductive support segment 210, and in some embodiments, the conductive support segment 210 can be rotated individually to replace the support surface 216 with other support surfaces among the multiple support surfaces 216. For example, in an example having a first conductive support segment 211 and a second conductive support segment 212, during maintenance, the first conductive support segment 211 can be rotated at the furnace mouth flange 101, and the second conductive support segment 212 can be rotated at the furnace tail flange 102 to calibrate or replace the support surface without removing the wafer boat support rod 20 from the process chamber 10.

[0064] In some embodiments, Figure 4 and Figures 7 to 10 As shown, the insulating component 220 may be provided with a support portion 222. The support portion 222 is used to provide support for the insulating component 220 when the wafer boat support rod is installed in the process chamber 10 of the semiconductor processing equipment, so as to more stably support the wafer boat support rod in the process chamber 10. In some embodiments, through the support cooperation between the support portion 222 and the process chamber 10, the insulating component 220 can rotate without rotating with the wafer boat support rod 20 when the wafer boat support rod 20 rotates, so that the insulating component 220 bears the torque generated when the individual conductive support segment 210 rotates, and does not transmit the torque to other conductive support segments 210, so as to avoid affecting the support surface of other conductive support segments 210.

[0065] In some embodiments, Figure 7 and Fig.10 As shown, the insulating component 220 of the wafer boat support rod 20 may include a radial limiting portion 225 for supporting the electrode introduction assembly 30 and limiting the radial movement of the electrode introduction assembly 30 .

[0066] In some embodiments, Figure 3 , Figure 7 , Figure 8 , Fig.11 and Fig.14As shown, the wafer boat support rod also includes an outer insulating sleeve 224 sleeved around the conductive support section 210, and a receiving opening 226 is provided on the outer insulating sleeve 224. The conductive support structure 215 is disposed in the receiving opening 226, and the supporting surface 216 of the conductive support structure 215 extends out from the receiving opening. For example, in the circumferential direction, the height of the supporting surface 216 is higher than the outer circumferential surface of the receiving opening 226 to fully support the wafer boat. By providing the outer insulating sleeve 224, unnecessary electrical contact between the conductive support section 210 and the wafer boat 104 can be avoided. In some embodiments, the outer insulating sleeve 224 is sleeved around other parts of the conductive support section 210 except the part where the conductive support structure 215 is located.

[0067] As another technical solution, Figures 4 to 6 and Figures 9 to 14 As shown, the embodiment of the present disclosure also provides an electrode introduction assembly 30, which is adapted to the above-mentioned wafer boat support rod provided in the embodiment of the present disclosure, and the electrode introduction assembly 30 includes a plurality of electrode introduction structures 300. The number of electrode introduction structures 300 is the same as the number of conductive support segments 210, and they are electrically connected one by one. At least part of the electrode introduction structures 300 can be electrically connected to the corresponding conductive support segments 210 that are penetrated or adjacent to the introduction channel 230 via the introduction channel 230. The plurality of electrode introduction structures 300 penetrate the introduction channel 230 from the first end 201 and are electrically connected to the conductive support segments 210 that are penetrated or adjacent to the introduction channel 230 via the introduction channel 230, so that the electrode introduction structure 300 can be used as the connection end of the electrode introduction assembly 30, and be electrically connected to the positive or negative pole of the RF power supply located on one side of the first end 201.

[0068] By adopting the electrode introduction assembly 30 provided by the present disclosure, the RF power source arranged at the first end 201 can be respectively introduced into the wafer boat 104 on all the conductive support segments 210 through multiple electrode introduction structures 300, so that the wiring related to the RF power source is concentrated at the first end 201, reducing the complexity of the wiring. During maintenance, it is only necessary to remove the wiring required for all RF power sources at the first end 201, without having to remove it from the second end 202, thereby shortening the maintenance time and improving the production capacity.

[0069] In some embodiments, Figures 4 to 6 , Fig. 9 and Fig.13As shown, one of the electrode introduction structures 300 is electrically connected to the outer wall of the conductive support segment 210 at the endmost portion. The remaining electrode introduction structures 300 are electrically connected to the corresponding conductive support segment 210 via the introduction channel 230. For example, in an embodiment in which two conductive support segments 210 are provided, one of the electrode introduction structures 300 can be directly electrically connected to the outer wall of the first conductive support segment 211 at the first end 201 without passing through the introduction channel 230, which greatly simplifies the electrode introduction structure 300. It should be noted that the electrode introduction structure 300 electrically connected to the first conductive support segment 211 can also be electrically connected to the first conductive support segment 211 via the introduction channel 230, and the embodiments of the present disclosure are not limited to this.

[0070] In the embodiment where the number of the conductive support segments 210 is three or more, one of the electrode introduction structures 300 is electrically connected to the outer wall of the first end conductive support segment, and the remaining electrode introduction structures 300 are electrically connected to the corresponding intermediate conductive support segment and the second end conductive support segment via the introduction channel 230. For example, in some embodiments, the remaining electrode introduction structures 300 can be electrically connected to any one of the at least one intermediate conductive support segment penetrated by the introduction channel 230 via the introduction channel 230, and electrically connected to the second end conductive support segment adjacent to the introduction channel 230. In some embodiments, the introduction channel 230 can also penetrate the second end conductive support segment, in which case the remaining electrode introduction structures 300 can be electrically connected to any one of the at least one intermediate conductive support segment penetrated by the introduction channel 230 and the second end conductive support segment via the introduction channel 230.

[0071] In some embodiments, Figures 4 to 6 and Fig.10As shown, the electrode introduction component 30 may be provided with an electrical connection portion 310, which is used to electrically connect one end of the electrode introduction component 30 to the inner wall of the corresponding conductive support segment 210, and is fixed to limit the position of the end of the electrode introduction component 30 in the introduction channel 230. The electrode introduction component 30 of this embodiment only needs to be provided with the electrical connection portion 310 to be electrically connected to the conductive support segment 210, and has a simple structure and convenient processing. When the electrode introduction component 30 is located in the introduction channel 230, the electrical connection portion 310 can extend to an area that can form an electrical connection with the conductive support segment 210. For example, in an embodiment in which a mounting hole 217 is formed on the conductive support segment 210, and the mounting hole 217 passes through from the inner wall of the conductive support segment 210 to the outer wall of the conductive support segment 210, the electrical connection portion 310 can cooperate with the mounting hole 217 to form an electrical connection. The structure of the electrical connection part 310 that realizes the above functions can be various. For example, the electrical connection part 310 can include a first thread structure 311 and a second thread structure 312 to form a threaded fit for threaded connection with one end of the electrode introduction assembly 30. The first thread structure 311 can be arranged in the mounting hole 217 and electrically connected to the conductive area of ​​the conductive support segment 210. The first thread structure 311 can have a first external thread, and the second thread structure 312 can have a second internal thread, and the first external thread and the second internal thread can match. The first thread structure 311, for example, adopts the same material as the conductive support segment 210, such as a conductive material with good load-bearing capacity such as stainless steel. The first thread structure 311 is arranged in the mounting hole 217 in such a manner that, for example, the first thread structure 311 further includes a stud having a first external thread and a stud head arranged at one end of the stud, the outer diameter of the stud head is larger than the aperture of the mounting hole 217, and is located on the side of the mounting hole 217 away from the inside of the introduction channel 230, and is used to restrict the stud in the mounting hole 217; the other end of the stud away from the stud head passes through the mounting hole 217, extends to the inside of the introduction channel 230, and is threadedly connected with the second thread structure 312. Thus, while ensuring that the electrode introduction assembly 30 can be firmly installed in the wafer boat support rod 20, the installation and disassembly process can be made more convenient.

[0072] like Figures 4 to 6As shown, taking the installation of two wafer boat support rods 20 in the process chamber 10 as an example, the second conductive support segments 212 of the two wafer boat support rods 20 can respectively apply two electrode introduction assemblies 30. The electrode introduction assembly 30 is provided with an electrical connection portion 310, and the electrode introduction assembly 30 penetrates from the first conductive support segment 211 of the first end 201 and passes through the first conductive support segment 211 and the second conductive support segment 212, and is electrically connected to the second conductive support segment 212 through the electrical connection portion 310. For example, the electrode introduction assembly 30 can be electrically connected to the conductive rod body 214 of the second conductive support segment 212 through the electrical connection portion 310. In the case where the introduction channel 230 is provided in the first conductive support segment 211 and the second conductive support segment 212, the mounting hole 217 formed on the second conductive support segment 212 passes through the channel wall of the introduction channel 230 at the second conductive support segment 212, and the first thread structure 311 is installed in the mounting hole 217 and forms a threaded connection with the second thread structure 312. Thus, the electrical connection portion 310 electrically connects one end of the electrode introduction assembly 30 to the inner wall of the corresponding conductive support segment 210 and fixes it. In the case where the electrode introduction assembly 30 of the introduction channel 230 can be electrically connected to the conductive support segment 210 adjacent to the introduction channel 230 via the introduction channel 230, the electrode introduction assembly 30 can be directly electrically connected to the conductive support segment 210 adjacent to the introduction channel 230 via the introduction channel 230, so in this case, the conductive support segment 210 may not be provided with a mounting hole 217. For example, in an embodiment in which two conductive support segments are provided, the electrode introduction assembly 30 can be directly electrically connected to the second conductive support segment 212 via the introduction channel 230 (for example, to the end face of the second conductive support segment 212 or the blind end of the opening), so in this case, the electrical connection portion 310 may not be provided.

[0073] In some embodiments, Figures 9 to 13 As shown, each electrode introduction structure 300 electrically connected to the corresponding conductive support segment 210 via the introduction channel 230 may include a flexible introduction segment 301. One end of the flexible introduction segment 301 is used to be electrically connected to the RF power supply, and the other end of the flexible introduction segment 301 is electrically connected to the corresponding conductive support segment 210 (for example, the inner wall of the conductive support segment 210). The flexible introduction segment 301 is configured to be rotatable relative to the wafer boat support rod 20. Through the flexible introduction segment 301, the electrode introduction structure 300 can be fixed and electrically connected to the RF power supply while being able to rotate with the wafer boat support rod 20. In some embodiments, the flexible introduction segment 301 includes a first joint 303, which is fixed and electrically connected to the RF power supply.

[0074] In some embodiments, Figures 9 to 13As shown, each electrode introduction structure 300 electrically connected to the corresponding conductive support segment 210 via the introduction channel 230 may also include a rigid introduction segment 302. The other end of the flexible introduction segment 301 is electrically connected to the corresponding conductive support segment 210 (for example, the inner wall of the conductive support segment 210) through the rigid introduction segment 302, so that the electrode introduction structure 300 can stably rotate with the wafer boat support rod 20. For example, the other end of the flexible introduction segment 301 can be electrically connected to the inner wall of the second conductive support segment 212 through the rigid introduction segment 302. In some embodiments, the rigid introduction segment 302 can be fixed to the wafer boat support rod 20 through the insulating component 220. In some embodiments, the flexible introduction segment 301 includes a second joint 304, and the second joint 304 is fixed and electrically connected to the rigid introduction segment 302. In some embodiments where the electrical connection portion 310 includes a first thread structure 311 and a second thread structure 312, the second thread structure 312 can be provided on the rigid introduction segment 302.

[0075] In some embodiments, Figures 4 to 6 , Fig.10 , Fig.11 , Fig.13 and Fig.14 As shown, the electrode introduction assembly 30 may further include an inner insulating sleeve 305, which is sleeved around at least one electrode introduction structure 300 and is used to be arranged in the introduction channel 230. By providing the inner insulating sleeve 305, the electrode introduction assembly 30 and the conductive support segment 210, especially the conductive support segment 210 located at the first end 201 (for example, the first conductive support segment 211) can be prevented from being electrically contacted in the introduction channel 230. In some embodiments, one end of the electrical connection portion 310 may extend through the inner insulating sleeve 305. In some embodiments, the inner insulating sleeve 305 may be arranged in the introduction channel 230 that passes through the conductive support segment 210 at the first end 201.

[0076] As another technical solution, please also refer to Figure 1 and Figure 2 The present disclosure also provides a semiconductor processing device, including a process chamber 10 and a first chamber door (not shown in the figure) and a second chamber door (not shown in the figure) disposed on both sides of a cavity body 100 of the process chamber 10, wherein the first chamber door can be opened and closed. The semiconductor processing device is, for example, a Plasma Enhanced Chemical Vapor Deposition (PECVD) device, and the PECVD device can be a single-boat PECVD device or a dual-boat or multi-boat PECVD device. Please refer to Figure 1 and Figure 2The PECVD equipment mainly includes a process chamber 10, which is used to provide a vacuum process environment. The chamber body 100 of the process chamber 10 is, for example, a quartz tube, which can be horizontal or vertical. The quartz tube is provided with a first chamber door (not shown in the figure) and a second chamber door (not shown in the figure) at both ends of the quartz tube in its axial direction (for example, parallel to the horizontal plane), respectively, for sealing the internal space of the quartz tube to form a sealed space. In addition, the first chamber door (also called the furnace door at the furnace mouth end) is sealedly connected to the quartz tube, for example, through a furnace mouth flange 101, and the first chamber door is configured to be able to open and close to open or close the furnace mouth. When the furnace mouth is opened, the wafer boat 104 can be moved from the furnace mouth into the process chamber 10 or moved out of the process chamber 10.

[0077] The semiconductor processing equipment provided by the embodiment of the present disclosure also includes at least two of the above-mentioned wafer boat support rods provided by the embodiment of the present disclosure, and at least two of the above-mentioned electrode introduction assemblies 30 provided by the embodiment of the present disclosure. At least two wafer boat support rods are arranged in the cavity 100, and are used to carry at least two wafer boats together. At least two electrode introduction assemblies 30 are used to electrically connect at least two wafer boat support rods to the RF power supply in a one-to-one correspondence.

[0078] In some embodiments, Figures 1 to 3 As shown, two fixed brackets 106 are respectively arranged on the furnace mouth flange 101 of the first chamber door and the furnace tail flange 102 of the second chamber door. The two fixed brackets 106 on the furnace mouth flange 101 are used to respectively support one end of the two wafer boat support rods 20 (for example, supporting the first conductive support segment 211 of the first end 201), and the two fixed brackets 106 on the furnace tail flange 102 are used to respectively support the other end of the two wafer boat support rods 20 (for example, supporting the second conductive support segment 212 of the second end 202).

[0079] In some embodiments, Figures 1 to 3 As shown, an electrode connection assembly 400 is provided on the furnace mouth flange 101 of the first chamber door, and each electrode connection assembly 400 is used to electrically connect the electrode introduction assembly 30 with the radio frequency power supply.

[0080] The semiconductor processing equipment provided by the embodiment of the present disclosure adopts the above-mentioned wafer boat support rod 20 and electrode introduction assembly 30 provided by the embodiment of the present disclosure, and the RF power source arranged on the furnace mouth flange 101 can be respectively introduced into the wafer boat 104 on all the conductive support sections 210 through multiple electrode introduction structures 300, so that the wiring related to the RF power source is concentrated on the furnace mouth flange 101, reducing the complexity of the wiring. During maintenance, it is only necessary to disassemble the wiring required for all RF power sources at the furnace mouth flange 101, without disassembly from the furnace tail flange 102, thereby shortening the maintenance time and improving the production capacity.

[0081] It is to be understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present disclosure, but the present disclosure is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and substance of the present disclosure, and these modifications and improvements are also considered to be within the scope of protection of the present disclosure.

Claims

1. A wafer boat support rod, used in semiconductor processing equipment, characterized in that: include: A plurality of conductive support segments connected in series, each two adjacent conductive support segments are connected via an insulating component; each conductive support segment is used to support and electrically conduct a wafer boat; as well as An introduction channel penetrates at least one of the conductive support segments in sequence from the conductive support segment at the end, for allowing the electrode introduction component to penetrate, so that the electrode introduction component can be electrically connected to any one of the conductive support segments penetrated by the introduction channel and adjacent to the conductive support segment.

2. The wafer boat support rod according to claim 1, characterized in that: The conductive support section through which the introduction channel passes includes a conductive rod body and a conductive support structure, wherein the introduction channel is arranged in the conductive rod body, the conductive support structure is fixedly connected to the outer side of the conductive rod body and is electrically connected to the conductive rod body, and the conductive support structure has at least one supporting surface for supporting and electrically contacting the wafer boat.

3. The wafer boat support rod according to claim 2, characterized in that: The conductive support segment is configured to be rotatable around its own axis, and the conductive support structure has a plurality of support surfaces, which are sequentially distributed along the circumference of the conductive support segment.

4. The wafer boat support rod according to claim 2, characterized in that: The wafer boat support rod also includes an outer insulating sleeve sleeved around the conductive support section, the outer insulating sleeve is provided with a receiving opening, the conductive support structure is arranged in the receiving opening, and the supporting surface of the conductive support structure extends out from the receiving opening.

5. The wafer boat support rod according to claim 1, characterized in that: The insulating component is annular and is sleeved on two adjacent conductive support segments, and an annular insulating isolation portion is formed on the inner circumference of the insulating component. The insulating isolation portion is located between two end surfaces of the two adjacent conductive support segments that are opposite to each other, and the space enclosed by the insulating isolation portion is used for the electrode introduction assembly to pass through.

6. The wafer boat support rod according to any one of claims 1 to 5, characterized in that: The insulating component is provided with a supporting portion, and the supporting portion is used to provide support for the insulating component when the wafer boat supporting rod is installed in the process chamber of the semiconductor processing equipment.

7. The wafer boat support rod according to any one of claims 1 to 5, characterized in that: A mounting hole is formed on the conductive support segment, and the mounting hole passes through from the inner wall of the conductive support segment to the outer wall of the conductive support segment.

8. An electrode introduction assembly, characterized in that: Adapted to the wafer boat support rod as claimed in any one of claims 1 to 7; The electrode introduction assembly includes a plurality of electrode introduction structures, the number of the electrode introduction structures is the same as the number of the conductive support segments, and they are electrically connected one-to-one; wherein at least some of the electrode introduction structures can be electrically connected via the introduction channel to the corresponding conductive support segments that are penetrated by or adjacent to the introduction channel.

9. The electrode introduction assembly according to claim 8, characterized in that: One of the electrode introduction structures is electrically connected to the outer wall of the conductive support segment at the end; The rest of the electrode introduction structures are electrically connected to the corresponding conductive support segments via the introduction channels.

10. The electrode introduction assembly according to claim 8, characterized in that: Also includes: The electrical connection part is used to electrically connect one end of the electrode introduction component to the inner wall of the corresponding conductive support segment and fix it immovably.

11. The electrode introduction assembly according to claim 10, characterized in that: A mounting hole is formed on the conductive support segment, and the mounting hole passes through from the inner wall of the conductive support segment to the outer wall of the conductive support segment; The electrical connection portion includes a threaded fitting component, which is disposed in the mounting hole and is used for threaded connection with one end of the electrode introduction component.

12. The electrode introduction assembly according to claim 8, characterized in that: Each of the electrode introduction structures electrically connected to the corresponding conductive support segment via the introduction channel includes a flexible introduction segment, one end of which is used to be electrically connected to a radio frequency power supply, and the other end of which is electrically connected to the corresponding conductive support segment; the flexible introduction segment is configured to be rotatable relative to the wafer boat support rod.

13. The electrode introduction assembly according to claim 12, characterized in that: Each of the electrode introduction structures electrically connected to the corresponding conductive support segment via the introduction channel further includes a rigid introduction segment, and the other end of the flexible introduction segment is electrically connected to the corresponding conductive support segment via the rigid introduction segment.

14. The electrode introduction assembly according to any one of claims 8 to 13, characterized in that: Also includes: The inner insulating sleeve is sleeved around at least one of the electrode introduction structures and is used to be arranged in the introduction channel.

15. A semiconductor processing device, comprising a process chamber and a first chamber door and a second chamber door arranged on both sides of a chamber body of the process chamber, wherein: The first chamber door can be opened and closed, and is characterized in that it comprises at least two wafer boat support rods and at least two electrode introduction assemblies, wherein the wafer boat support rods are the wafer boat support rods as described in any one of claims 1 to 7, and the electrode introduction assemblies are the electrode introduction assemblies as described in any one of claims 8 to 14. At least two of the wafer boat support rods are disposed in the cavity, and are used to jointly support at least two wafer boats; At least two of the electrode introduction assemblies are used to electrically connect at least two of the wafer boat support rods to the radio frequency power supply in a one-to-one correspondence.

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