Ceramic copper-clad plate automatic processing device and control method thereof

Abstract

The invention provides a ceramic copper-clad plate automatic machining device and a control method thereof.The device comprises a copper block box arranged on a base body, the copper block box contains a copper-clad block conforming to a first preset specification, one side of the copper block box is provided with a first opening communicating with a containing space, and the top face of a mold plate is provided with multiple sets of copper groove units; each copper groove unit comprises a plurality of copper grooves corresponding to a preset pattern, and the structure of each copper groove is matched with the structure of the copper-clad block; the mold plate can move in the containing space so that the copper-clad block can be embedded into the copper groove. The sheet grabbing assembly is used for grabbing a ceramic sheet conforming to a second preset specification and pressing the ceramic sheet on a copper groove unit, located under the sheet grabbing assembly, of a mold plate with copper-clad blocks embedded in all copper grooves, so that the corresponding copper-clad blocks are pasted on offset printing of the ceramic sheet; according to the method, the labor cost is reduced through automatic production, and meanwhile raw material waste caused by a traditional etching mode is overcome.

Description

Technical Field

[0001] The present application relates to the technical field of ceramic copper clad laminates, and in particular to an automatic processing device for ceramic copper clad laminates and a control method thereof. Background Art

[0002] In the field of processing of ceramic copper-clad laminates, traditional processing methods have significant disadvantages. In the prior art, the entire ceramic sheet is usually covered with copper on the entire surface, and then the desired pattern is etched by etching, and finally high-temperature sintering is performed to make the copper and ceramic completely integrated to form a ceramic copper-clad laminate. Although this process can achieve certain processing purposes, it exposes serious material waste problems during actual operation. On the one hand, a large amount of copper material is used in the process of copper coating the entire surface, and a large part of the unnecessary copper will be removed in the subsequent etching process. This part of the removed copper becomes a waste of material, increasing production costs. On the other hand, the etching process is relatively complicated, not only requiring the investment of professional equipment and manpower, but also some environmental pollution problems may occur during the etching process. With the increasing market demand for ceramic copper-clad laminates, and the increasingly stringent requirements for production cost control and environmental protection, it is urgent to develop a new, more efficient and environmentally friendly ceramic copper-clad laminate processing technology. Summary of the invention

[0003] In view of the above-mentioned defects or deficiencies in the prior art, the present application aims to provide a ceramic copper-clad laminate automatic processing device and a control method thereof to reduce production costs and avoid material waste.

[0004] In a first aspect, the present application proposes an automatic processing device for a ceramic copper clad laminate, comprising: Base body; A copper block box, the copper block box is arranged on the base body, the copper block box has a storage space, the storage space contains copper-clad blocks that meet the first preset specifications, and one side of the copper block box has a first opening that is connected to the storage space, and the opening direction of the first opening is a first direction; A processing assembly, the processing assembly is arranged on the first opening side of the copper block box, and the processing assembly includes: A mold plate, wherein a plurality of copper groove units are provided on the top surface of the mold plate, each of the copper groove units comprises a plurality of copper grooves corresponding to a preset pattern, and the structure of each copper groove is adapted to the structure of the copper-clad block; the mold plate has a first processing state and a second processing state, wherein in the first processing state, the mold plate moves along the first direction in the accommodation space so that the copper-clad block is embedded in the copper groove; and in the second processing state, the mold plate is placed in an initial processing position outside the accommodation space; A first driving assembly, the first driving assembly is connected to the mold plate and is used to drive the mold plate to switch between a first processing state and a second processing state; A ceramic sheet assembly, the ceramic sheet assembly comprising a plurality of gripping sheet assemblies, the gripping sheet assemblies corresponding one to one with the copper trough units, the gripping sheet assemblies being used to grip a ceramic sheet meeting a second preset specification, the ceramic sheet having an offset printing corresponding to the preset pattern on the side away from the gripping sheet assembly; the gripping sheet assembly being further used to press the gripped ceramic sheet onto the copper trough unit located directly below the gripping sheet assembly of the mold plate which is in the initial processing position and in which all the copper troughs are embedded with the copper clad blocks, so that the corresponding copper clad block is pasted on the offset printing of the ceramic sheet.

[0005] According to the technical solution provided in the embodiment of the present application, two first guide rails arranged in parallel are provided on the top of the initial processing position, each of the first guide rails is slidably connected with a first slider, the two first sliders are commonly connected to a first mounting plate, a plurality of first telescopic rods are vertically provided on the first mounting plate, and a grabbing piece assembly is connected to the end of each first telescopic rod away from the first slider.

[0006] According to the technical solution provided in the embodiment of the present application, the grabbing piece assembly is a suction cup, and the suction cup has a blowing state and a vacuum state. In the vacuum state, the suction cup is used to grab the ceramic piece, and in the blowing state, the suction cup is used to press the ceramic piece onto the mold plate.

[0007] According to the technical solution provided in the embodiment of the present application, a collection component is provided between the two first guide rails, and the collection component is used to collect an image of the mold plate located at the initial processing position to determine whether the copper clad blocks are embedded in all the copper grooves; A second slider is also slidably connected to each of the first guide rails, and the two second sliders are commonly connected to a second mounting plate. A patch assembly is provided on the second mounting plate. When there is a copper groove in which the copper clad block is not embedded, the patch assembly is used to fill the copper clad block into the copper groove in which the copper clad block is not embedded.

[0008] According to the technical solution provided in the embodiment of the present application, the mold plate includes an upper plate and a lower plate hinged to the upper plate, the copper trough unit is arranged on the top surface of the upper plate, and the mold plate has a flat state and a flipped state. In the flat state, the upper plate and the lower plate are on the same plane, and in the flipped state, the upper plate flips onto the lower plate.

[0009] According to the technical solution provided in the embodiment of the present application, the first driving assembly is connected to the mold plate through a first connecting member, and the first connecting member is used to drive the mold plate to rotate around the first direction.

[0010] In a second aspect, the present application proposes a control method for an automatic processing device for ceramic copper clad laminates, which is implemented based on the automatic processing device for ceramic copper clad laminates as described above, and includes the following steps: Controlling the mold plate to be inserted into the containing space through the first opening, and starting timing; Controlling the mold plate to reciprocate along the first direction in the accommodating space, and controlling the mold plate to rotate around the first direction after a first preset time; After a second preset time, controlling the mold plate to leave the accommodating space through the first opening and move toward the initial processing position; After determining that the mold plate has reached the initial processing position, determining whether each of the copper grooves in each group of copper groove units is embedded with the copper clad block; If yes, control the grabbing piece assembly to grab the ceramic piece and move it to just above the copper slot unit corresponding thereto; Controlling the grabbing piece assembly to move downward, and determining in real time whether the ceramic piece is placed on the corresponding copper slot unit; If yes, controlling the gripping sheet assembly to apply pressure to the ceramic sheet; If the ceramic sheet is pressed against the mold plate, the upper plate is controlled to flip onto the lower plate, and after the mold plate and the ceramic sheet are dumped, the upper plate is controlled to rotate away from the lower plate to the flat state.

[0011] According to the technical solution provided in the embodiment of the present application, after determining whether each of the copper slots in each group of copper slot units is embedded with the copper clad block, the following steps are also included: If not, control the patch block assembly to fill the empty copper slot with the copper-clad block, where the empty copper slot is the copper slot without the copper-clad block embedded therein; The step of judging whether each copper slot in each group of copper slot units is embedded with the copper clad block specifically comprises the following steps: Controlling the acquisition component to take a picture of the mold plate to obtain at least one actual copper-clad image; Compare the actual copper-clad image with the standard copper-clad image. If the grayscale value of each copper slot position in the actual copper-clad image is the same as the grayscale value of the corresponding position in the standard copper-clad image, it is determined that the copper-clad block is embedded in each copper slot in each group of copper slot units. If the grayscale value of at least one copper slot position in the actual copper-clad image is different from the grayscale value of the corresponding position in the standard copper-clad image, it is determined that the copper slot in each group of copper slot units is not embedded in the copper-clad block, and the coordinates to be supplemented of each empty copper slot are calibrated. The controlling the patch block assembly to fill the empty copper slot with the copper-clad block specifically comprises the following steps: The patch block assembly is controlled to move according to the coordinates to be patched, and the empty copper slots are filled into the copper-clad blocks in sequence.

[0012] According to the technical solution provided in the embodiment of the present application, a pressure sensor is provided near the edge of the suction cup; The controlling the grabbing piece assembly to move downward specifically comprises the following steps: Controlling the grabbing piece assembly to move downward, and acquiring a first pressure reading collected by the pressure sensor in real time to obtain a first pressure change rate; The method of determining in real time whether the ceramic sheet is placed on the corresponding copper slot unit specifically comprises the following steps: If the first pressure change rate is greater than a first preset change rate, it is determined that the ceramic sheet is placed on the corresponding copper slot unit.

[0013] According to the technical solution provided in the embodiment of the present application, controlling the gripping sheet assembly to apply pressure to the ceramic sheet specifically includes the following steps: Obtaining a target pressure and obtaining a blowing time and a blowing flow rate corresponding to the target pressure, wherein the target pressure is at least related to the thickness, size and offset printing characteristics of the ceramic sheet; Controlling the suction cup to apply pressure to the ceramic sheet according to the blowing time and the blowing flow rate, and obtaining a second pressure reading of the pressure sensor in real time; If the ceramic sheet is pressed tightly against the mold plate, the method specifically includes the following steps: If the second pressure reading is greater than or equal to the target pressure, it is determined that the ceramic sheet is pressed against the mold plate.

[0014] Compared with the prior art, the beneficial effect of the present application is that the automatic processing device for ceramic copper-clad boards has many significant advantages. First, in terms of material utilization, by directly embedding the copper-clad block that meets the first preset specification into the copper groove corresponding to the preset pattern on the mold plate, and then using the grabbing piece assembly to press the ceramic sheet with the corresponding offset printing on the copper-clad block, the material waste of first copper-cladding the entire surface and then etching in the traditional process is avoided, which greatly improves the material utilization rate and reduces the production cost. Secondly, from the perspective of processing efficiency, the device adopts an automated processing component, such as a first drive component driving the mold plate to switch between different processing states, and multiple groups of grabbing piece assemblies work simultaneously, which can quickly and accurately complete the bonding operation of the ceramic sheet and the copper-clad block, and compared with the traditional complex etching process, the processing time is greatly shortened and the production efficiency is improved. In addition, due to the reduction of the etching process, the dependence on professional etching equipment and manpower is reduced, and the environmental pollution that may be generated during the etching process is also reduced, which is more in line with the concept of environmental protection and has good economic and social benefits. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A schematic diagram of the structure of an automatic processing device for a ceramic copper-clad laminate provided in an embodiment of the present application; Figure 2 A schematic diagram of the top view of the structure of the automatic processing device for ceramic copper-clad laminates provided in an embodiment of the present application; Figure 3 Provided in the embodiments of this application Figure 1 The structural diagram of the part A in the middle; Figure 4 A schematic structural diagram of a front view (with the first drive component hidden) of an automatic processing device for a ceramic copper-clad laminate provided in an embodiment of the present application; Figure 5 A schematic diagram of the structure of the upper plate and the lower plate provided in the embodiment of the present application; Figure 6 A flow chart of the steps of a control method for an automatic processing device for ceramic copper-clad laminates provided in an embodiment of the present application.

[0016] The text annotations in the figure represent: 1. Copper block box; 2. First opening; 3. Extension part; 4. Arc boss; 5. Mold plate; 6. First drive assembly; 7. Patch assembly; 8. First telescopic rod; 9. First guide rail; 10. First mounting plate; 11. Second mounting plate; 12. Collection assembly; 13. Suction cup; 14. Mechanical gripper; 15. First connecting piece; 16. First rotating shaft; 51. Lower plate; 52. Upper plate. DETAILED DESCRIPTION

[0017] The present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the relevant invention, rather than to limit the invention. It is also necessary to explain that, for ease of description, only the parts related to the invention are shown in the accompanying drawings.

[0018] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0019] Example 1 As mentioned in the background technology, in view of the problems in the prior art, this application proposes an automatic processing device for ceramic copper clad laminates, such as Figure 1 As shown, including: Base body; A copper block box 1, the copper block box 1 is arranged on the base body, the copper block box 1 has a storage space, the storage space contains copper-clad blocks that meet the first preset specifications, and one side of the copper block box 1 has a first opening 2 connected to the storage space, and the opening direction of the first opening 2 is a first direction; like Figure 4 , 5 As shown, optionally, the copper block box 1 is a rectangular box body, and a rectangular first opening 2 is opened on one side. The bottom of the first opening 2 has an extension part 3 integrally formed with the copper block box 1, and an arc-shaped boss 4 is provided on the extension part 3; the arc-shaped boss 4 supports the mold plate 5 to a certain extent; the first direction is Figure 1 The horizontal direction in , that is, the left and right direction.

[0020] Specifically, the first preset specification is the specification of the copper-clad block required by the product, including shape and size. If the produced copper-clad block meets the first preset specification, it can be transported to the copper block box 1 for standby. The extension portion 3 extends from the bottom of the first opening 2 to the side away from the copper block box 1, and an arc-shaped boss 4 is provided on its top surface.

[0021] A processing assembly, which is arranged on the side of the copper block box 1 having the first opening 2, and includes: A mold plate 5, wherein a plurality of copper groove units are provided on the top surface of the mold plate 5, each of the copper groove units comprises a plurality of copper grooves corresponding to a preset pattern, and the structure of each copper groove is adapted to the structure of the copper-clad block; the mold plate 5 has a first processing state and a second processing state, wherein in the first processing state, the mold plate 5 moves along the first direction in the accommodation space so that the copper-clad block is embedded in the copper groove; in the second processing state, the mold plate 5 is placed in an initial processing position outside the accommodation space; Specifically, the size and shape of the mold plate 5 are related to product requirements, and are usually rectangular. For example, along the long side of the rectangle, there are 6 groups of copper groove units on the top surface of the rectangular mold plate 5. Taking a rectangular ceramic sheet as an example, the preset pattern is a small rectangle above and below the rectangular ceramic sheet, each small rectangle is composed of 8 rows of copper groove groups, and each copper groove group includes a plurality of smaller rectangular copper grooves. Among them, the first processing state can be understood as the state of entering the accommodation space for copper coating, and the second processing state is the initial state or the state of waiting for the ceramic plate to be covered after copper coating. In the first processing state, the mold plate 5 moves back and forth in the accommodating space along the first direction, and many copper-clad blocks in the accommodating space will be shoveled onto the mold plate 5. The back and forth movement makes the copper-clad blocks roll back and forth on the surface. Due to the structural adaptation, when the copper-clad block happens to enter a copper groove during the rolling process, the copper-clad block can be partially embedded in the copper groove (if it is a rectangular copper-clad block, a part of the copper-clad block is embedded in the copper groove along the height direction, and the other part is exposed outside the copper groove, which is convenient for sticking to the offset printing of the ceramic sheet later).

[0022] A first driving assembly 6, wherein the first driving assembly 6 is connected to the mold plate 5 and is used to drive the mold plate 5 to switch between a first processing state and a second processing state; Specifically, the first driving component 6 is a telescopic cylinder, the output end of the telescopic cylinder is connected to the mold plate 5, the fixed end is fixed on the base body, and the driving direction of the telescopic cylinder is the first direction.

[0023] A ceramic sheet assembly, the ceramic sheet assembly includes multiple groups of grab sheet assemblies, the grab sheet assemblies correspond one-to-one to the copper trough units, the grab sheet assemblies are used to grab ceramic sheets that meet the second preset specifications, and the ceramic sheets have an offset printing corresponding to the preset pattern on the side away from the grab sheet assembly; the grab sheet assembly is also used to press the grabbed ceramic sheets onto the copper trough unit located directly below the grab sheet assembly, which is in the initial processing position and in which all the copper grooves are embedded with the copper clad blocks, so that the corresponding copper clad block is pasted on the offset printing of the ceramic sheet.

[0024] In a preferred embodiment, two first guide rails 9 are arranged in parallel on the top of the initial processing position, each of the first guide rails 9 is slidably connected to a first slider, the two first sliders are commonly connected to a first mounting plate 10, a plurality of first telescopic rods 8 are vertically arranged on the first mounting plate 10, and a grabbing piece assembly is connected to the end of each first telescopic rod 8 away from the first slider.

[0025] Specifically, Figure 2 As shown, the first guide rail 9 can be a high-precision linear guide rail, which is fixed to the top frame of the initial processing position by bolts. The first guide rail 9 extends along the second direction, which is perpendicular to the first direction. Figure 2 The first mounting plate 10 is made of metal and is fixed to the two first sliders by welding or bolting. The first telescopic rod 8 can be an electric push rod, and its driving direction is the third direction, which is perpendicular to the first direction and the second direction. One end of the first telescopic rod 8 is vertically mounted on the first mounting plate 10, and the other end is connected to the grabbing piece assembly. The two first guide rails 9 are arranged in parallel and side by side at the top of the initial processing position. The first slider is mounted on the first guide rail 9, the first mounting plate 10 spans the two first sliders, and the first telescopic rod 8 is arranged downward perpendicular to the first mounting plate 10. When the grabbing piece assembly needs to be moved, the control system drives the first slider to slide on the first guide rail 9, thereby driving the first mounting plate 10 and the first telescopic rod 8 and the grabbing piece assembly thereon to move in the horizontal direction. At the same time, the control system controls the extension and retraction of the first telescopic rod 8, so that the grabbing piece assembly rises or falls in the vertical direction and reaches a suitable position to carry out the grabbing and placing operations of the ceramic sheet.

[0026] In a preferred embodiment, the grabbing piece assembly is a suction cup 13, and the suction cup 13 has a blowing state and a vacuum state. In the vacuum state, the suction cup 13 is used to grab the ceramic piece, and in the blowing state, the suction cup 13 is used to press the ceramic piece onto the mold plate 5.

[0027] Specifically, Figure 3 As shown, the suction cup 13 is made of materials such as rubber or silicone, and has good sealing and adsorption properties. The suction cup 13 is connected to the air pump through an air pipe, and the air pump can switch between the blowing and exhausting states by controlling the valve. The suction cup 13 is installed at the end of the first telescopic rod 8 and fixed by means of threads or buckles. The suction cup 13 is connected to the air pump through an air pipe, and the working state of the air pump determines whether the suction cup 13 is in the blowing state or the exhausting state. When it is necessary to grab the ceramic piece, the air pump is in the exhausting state, so that a negative pressure is formed in the suction cup 13, thereby adsorbing the ceramic piece. After the first telescopic rod 8 moves the suction cup 13 adsorbed with the ceramic piece to a suitable position above the mold plate 5, the air pump switches to the blowing state, blows air into the suction cup 13, generates positive pressure, and presses the ceramic piece against the mold plate 5.

[0028] This embodiment cleverly uses the same component to achieve different process effects, and uses the blowing and exhausting states of the suction cup 13 to grasp and press the ceramic sheet, which is simple and reliable to operate. In the exhausting state, the ceramic sheet can be firmly grasped to prevent it from falling during the movement; in the blowing state, the ceramic sheet can be evenly pressed on the mold plate 5 to ensure the bonding quality of the copper-clad block and the ceramic sheet.

[0029] In a preferred embodiment, a collection component 12 is provided between the two first guide rails 9, and the collection component 12 is used to collect an image of the mold plate 5 located at the initial processing position to determine whether the copper-clad blocks are embedded in all the copper grooves; Each of the first guide rails 9 is also slidably connected to a second slider, and the two second sliders are commonly connected to a second mounting plate 11. A patch assembly 7 is provided on the second mounting plate 11. When there is a copper groove in which the copper clad block is not embedded, the patch assembly 7 is used to fill the copper clad block into the copper groove in which the copper clad block is not embedded.

[0030] Specifically, the acquisition component 12 may be an industrial camera, which is mounted on a fixed bracket between the two first guide rails 9. The lens of the industrial camera faces the mold plate 5 in the initial processing position, and the shooting position and range can be adjusted by adjusting the height and angle of the bracket. The patch assembly 7 includes a second guide rail arranged on the second mounting plate 11, the second guide rail extends along the first direction, a third slider is slidably connected in the second guide rail, a second telescopic rod is arranged on the third slider, the driving direction of the second telescopic rod is the third direction, that is, the vertical direction, and a mechanical clamp 14 is arranged at the end of the second telescopic rod, which is driven by a motor to realize the clamping and releasing actions.

[0031] Specifically, the first slider and the second slider are equivalent to sharing the same guide rail. For example, the first slider slides on the left half of the first guide rail 9. The leftmost end of the first guide rail 9 is provided with a first box body for placing ceramic sheets. After ensuring that all copper grooves are successfully embedded with copper-clad blocks, the control system controls the first slider to slide to the top of the first box body, and the first telescopic rod 8 descends. After sucking the ceramic sheet, the first telescopic rod 8 rises and controls the first slider to move to the middle. When it moves to the top of the initial processing position, the first telescopic rod 8 descends, thereby completing the action of placing the ceramic sheet on the mold plate 5, that is, completing the pasting of the ceramic sheet and the corresponding copper-clad blocks. The second slider slides on the right half of the first guide rail 9. The rightmost end of the first guide rail 9 is provided with a second box body for placing the copper-clad blocks of the patch material. When it is found that the copper-clad blocks are not successfully embedded in some copper grooves, the patch block assembly 7 is controlled to accurately reach the top of the empty copper groove, and then the grabbed copper-clad blocks are placed in the empty copper groove by the mechanical clamp 14. Specifically, the second slider is controlled to slide to the top of the second box body, and the second telescopic rod is lowered. After the copper-clad blocks are clamped by the mechanical clamp 14, the second telescopic rod rises, and the second slider is controlled to move toward the middle, so that the mechanical clamp 14 clamping the copper-clad blocks moves to the top of the empty copper groove. When it reaches the top of the empty copper groove, the second telescopic rod is controlled to descend to embed the copper-clad blocks into the empty copper groove.

[0032] In a preferred embodiment, the mold plate 5 includes an upper plate 52 and a lower plate 51 hinged to one end of the upper plate 52, and the copper trough unit is arranged on the top surface of the upper plate 52. The mold plate 5 has a flat state and a flipped state. In the flat state, the upper plate 52 and the lower plate 51 are on the same plane. In the flipped state, the upper plate 52 flips onto the lower plate 51.

[0033] Specifically, an elastic buffer layer may be laid on the top surface of the lower plate 51 to prevent the copper-coated ceramic sheet from being damaged during tipping over.

[0034] Specifically, the upper plate 52 and the lower plate 51 are made of metal materials (such as stainless steel) or ceramic materials with certain strength and wear resistance. Figure 5 As shown, the two are connected by hinges or other articulated parts, or by a second rotating shaft (in this case, the second rotating shaft is installed at the output end of the rotating motor, and can automatically control the upper plate 52 to flip toward or away from the lower plate 51) to ensure that the upper plate 52 can rotate flexibly relative to the lower plate 51. The copper trough unit is made on the top surface of the upper plate 52 by precision machining technology (such as CNC milling, electric spark machining, etc.) to ensure the dimensional accuracy and surface quality of the copper trough. In order to accurately control the position of the upper plate 52 and the lower plate 51 in the flat state and the flipped state, corresponding limit devices (such as limit blocks, sensors, etc.) can also be set. After completing the pasting process of the ceramic sheet and the copper-clad block, the operator or the automated equipment triggers the flipping action of the upper plate 52. The upper plate 52 rotates relative to the lower plate 51 around the hinge point, and gradually flips from the flat state to the lower plate 51, so that the pasted ceramic sheet is exposed upward, that is, the ceramic sheet pasted with the copper-clad block is transferred from the upper plate 52 to the lower plate 51, and the side of the ceramic sheet pasted with the copper-clad block faces upward. At this point, the ceramic pieces can be easily picked up manually and placed together for subsequent sintering and other processing.

[0035] In a preferred embodiment, the first driving assembly 6 is connected to the mold plate 5 via a first connecting member, and the first connecting member is used to drive the mold plate 5 to rotate around the first direction.

[0036] Specifically, the reciprocating movement of the first driving assembly 6 can make the redundant copper-clad blocks slide from the surface of the mold plate 5 back into the copper block box 1. This embodiment can further be used to realize a multi-angle rotation and shaking function. The first connecting member 15 can be selected as a servo motor. The fixed end of the servo motor is fixed to the moving end of the first driving assembly 6. The output end of the servo motor is connected to the first rotating shaft 16. The first rotating shaft 16 is connected to the side of the lower plate 51 away from the upper plate 52. During the copper block groove copper coating process, the mold plate 5 can realize the rotation and shaking function through the first connecting member and the first rotating shaft, so that the redundant copper-clad blocks can slide from the surface of the mold plate 5 back into the copper block box 1.

[0037] Example 2 A control method for an automatic processing device for a ceramic copper-clad laminate is implemented based on the automatic processing device for a ceramic copper-clad laminate as described above. Figure 6 As shown, the following steps are included: S1, controlling the mold plate 5 to be inserted into the accommodation space through the first opening 2, and starting timing; S2, controlling the mold plate 5 to reciprocate along the first direction in the accommodation space, and controlling the mold plate 5 to rotate around the first direction after a first preset time; Specifically, when rotating around the first direction, a forward and reverse rotation method is adopted, and the rotation angle cannot be too large to prevent the copper-clad blocks embedded in the copper grooves from sliding back into the copper block box 1.

[0038] S3, after a second preset time, controlling the mold plate 5 to leave the accommodating space through the first opening 2 and move toward the initial processing position; Specifically, after the second preset time, the mold plate 5 rotated around the first direction by a certain angle in step S2 is first rotated back to a horizontal state, and then the mold plate 5 is controlled to leave the accommodating space through the first opening 2 and move toward the initial processing position.

[0039] S4, after determining that the mold plate 5 has reached the initial processing position, determining whether each copper groove in each group of copper groove units is embedded with the copper clad block; S5. If yes, control the grabbing piece assembly to grab the ceramic piece and move it to the top of the corresponding copper slot unit; S6, controlling the grabbing piece assembly to move downward, and determining in real time whether the ceramic piece is placed on the corresponding copper slot unit; S7: If yes, control the gripping sheet assembly to apply pressure to the ceramic sheet; S8. If the ceramic sheet is pressed against the mold plate 5, the upper plate 52 is controlled to flip onto the lower plate 51, and after the mold plate 5 and the ceramic sheet are tilted down, the upper plate 52 is controlled to rotate away from the lower plate 51 to the flat state.

[0040] The control method is based on the automatic processing device for ceramic copper clad laminates and is implemented with the help of a programmable logic controller (PLC) or an industrial computer. By writing a corresponding control program, control signals are sent to various driving components (such as motors, cylinders, etc.) in the device, thereby accurately controlling the movements of the mold plate 5, the gripper assembly, etc.

[0041] Furthermore, after determining whether each copper slot in each group of copper slot units is embedded with the copper clad block, the following steps are also included: If not, control the patching block component 7 to fill the empty copper slot with the copper-clad block, where the empty copper slot is the copper slot without the copper-clad block embedded therein; The step of judging whether each copper slot in each group of copper slot units is embedded with the copper clad block specifically comprises the following steps: Controlling the acquisition component 12 to take a picture of the mold plate 5 to obtain at least one actual copper-clad image; Compare the actual copper-clad image with the standard copper-clad image. If the grayscale value of each copper slot position in the actual copper-clad image is the same as the grayscale value of the corresponding position in the standard copper-clad image, it is determined that the copper-clad block is embedded in each copper slot in each group of copper slot units. If the grayscale value of at least one copper slot position in the actual copper-clad image is different from the grayscale value of the corresponding position in the standard copper-clad image, it is determined that the copper slot in each group of copper slot units is not embedded in the copper-clad block, and the coordinates to be supplemented of each empty copper slot are calibrated. The controlling the patch block assembly 7 to fill the empty copper slot with the copper-clad block specifically comprises the following steps: The patch block assembly 7 is controlled to move according to the coordinates to be patched, and the empty copper slots are filled into the copper-clad blocks in sequence.

[0042] Specifically, after the mold plate 5 reaches the initial processing position, the control acquisition component 12 (such as an industrial camera) takes a photo of the mold plate 5 to obtain an actual copper-clad image. The actual copper-clad image is transmitted to the control system and compared with the pre-stored standard copper-clad image (before processing, all the copper grooves on the mold plate 5 are respectively embedded in the corresponding copper-clad blocks, and a clear photo is taken directly above as a standard copper-clad image). If it is found that there are copper grooves with different grayscale values, calibrate their coordinates to be supplemented, and then control the patch block component 7 to move according to the coordinates to be supplemented, and fill the empty copper groove with the copper-clad block. Exemplarily, the grayscale value of a copper groove position in the standard copper-clad image is 150, and the grayscale value of the corresponding position in the actual copper-clad image is 200. The system determines that the copper groove is an empty copper groove and records its coordinates as (X1, Y1). After receiving the instruction, the patch block component 7 moves to the coordinate position and fills the copper-clad block into the copper groove.

[0043] This embodiment can timely detect the missing copper block in the copper slot and automatically perform the block filling operation, thereby ensuring the integrity and quality of the product. The image gray value comparison method is used to make accurate and rapid judgments, thereby improving the reliability of the production process.

[0044] Further, controlling the patch block assembly 7 to move according to the coordinates to be patched, and sequentially filling the empty copper slots into the copper-clad blocks, specifically includes the following steps: Determine the number of empty copper slots, and organize the coordinates to be filled corresponding to each empty copper slot into a list of coordinates to be filled; If the number of empty copper slots is less than or equal to a first preset value, randomly selecting a coordinate to be filled from the coordinate list to be filled; Specifically, if the first preset value is 6 and there are 5 empty copper slots, a random number generator can be used to generate a random integer between 0 and 5. If it is 1, the first coordinate in the list of coordinates to be completed is the coordinate to be completed this time, and so on until all the coordinates to be completed in the list of coordinates to be completed are completed.

[0045] If the number of empty copper slots is greater than a first preset value, a distance matrix is ​​constructed; the distance matrix is ​​obtained by calculating the Euclidean distance between any two coordinate points in the coordinate list to be supplemented; Use the nearest neighbor algorithm for path planning, randomly select a coordinate to be filled in the list of coordinates to be filled as the starting point, and move it to the path list as the first coordinate to be filled in the path list; Based on the distance matrix, find the point closest to the starting point in the list of coordinates to be completed except the starting point, and move it to the path list as the second coordinate to be completed in the path list; Continue to find the point closest to the second coordinate to be completed, and repeat this process until all the coordinates to be completed in the coordinate list are moved to the path list through the above rules; The patch block component 7 is controlled to fill the empty copper slots into the copper-clad blocks in sequence according to the order of the coordinates to be filled in the path list.

[0046] In a preferred embodiment, a pressure sensor is provided near the edge of the suction cup 13; The controlling the grabbing piece assembly to move downward specifically comprises the following steps: Controlling the grabbing piece assembly to move downward, and acquiring a first pressure reading collected by the pressure sensor in real time to obtain a first pressure change rate; The method of determining in real time whether the ceramic sheet is placed on the corresponding copper slot unit specifically comprises the following steps: If the first pressure change rate is greater than a first preset change rate, it is determined that the ceramic sheet is placed on the corresponding copper slot unit.

[0047] Specifically, the pressure sensor is installed near the edge of the suction cup 13, and its function is to monitor in real time the pressure exerted on the suction cup 13 during the downward movement. When the gripping piece assembly (sucking cup 13) does not contact the ceramic sheet, the pressure reading collected by the pressure sensor is relatively stable, which may be close to zero or a small constant value generated by factors such as the gravity of the suction cup 13 itself. When the gripping piece assembly is controlled to move downward, and the suction cup 13 gradually approaches the ceramic sheet until it begins to contact the ceramic sheet, the pressure reading collected by the pressure sensor will begin to change. Before the moment of contact, the pressure reading remains basically unchanged; once in contact, the pressure reading will rise rapidly due to the reaction force exerted by the ceramic sheet on the suction cup 13. The first pressure change rate refers to the rate of change of the pressure reading over time, that is, the increase in pressure per unit time. During the downward movement of the gripping piece assembly, when the suction cup 13 does not contact the ceramic sheet, the pressure change rate is extremely small, almost zero. When the suction cup 13 contacts the ceramic sheet, the pressure will increase rapidly in a short period of time, resulting in a significant increase in the first pressure change rate.

[0048] In a preferred embodiment, controlling the gripping sheet assembly to apply pressure to the ceramic sheet specifically comprises the following steps: Obtaining a target pressure and obtaining a blowing time and a blowing flow rate corresponding to the target pressure, wherein the target pressure is at least related to the thickness, size and offset printing characteristics of the ceramic sheet; Controlling the suction cup 13 to apply pressure to the ceramic sheet according to the blowing time and the blowing flow rate, and obtaining a second pressure reading of the pressure sensor in real time; If the ceramic sheet is pressed tightly against the mold plate 5, the steps specifically include: If the second pressure reading is greater than or equal to the target pressure, it is determined that the ceramic sheet is pressed against the mold plate 5 .

[0049] Specifically, through the preset model, the target pressure is determined according to parameters such as the thickness, size and offset printing characteristics of the ceramic sheet, and the blowing time and blowing flow rate corresponding to the target pressure are obtained (the input of the first preset model is parameters such as the thickness, size and offset printing characteristics of the ceramic sheet, and the output is the target pressure, and the input of the second preset model is the target pressure, and the output is the blowing time and blowing flow rate).

[0050] For example, for a ceramic sheet with a thickness of 2 mm, a size of 100 mm×100 mm, and a medium viscosity offset printing characteristic, after experiments and data analysis, the target pressure is determined to be 20 N, the corresponding blowing time is 5 s, and the blowing flow rate is 10 L / min. During the pressure application process, when the second pressure reading of the pressure sensor reaches 20 N, the system determines that the ceramic sheet has been compressed.

[0051] This embodiment can accurately control the pressure application process according to the different characteristics of the ceramic sheet, ensure that the ceramic sheet and the copper-clad block are closely attached, and improve the product's bonding quality. By real-time monitoring of the pressure readings and timely judging the compaction situation, the problem of excessive or insufficient pressure is avoided, ensuring the stability of the processing quality.

[0052] This article uses specific examples to illustrate the principles and implementation methods of this application. The description of the above embodiments is only used to help understand the method and its core ideas of this application. The above is only the preferred implementation method of this application. It should be pointed out that due to the limitations of textual expression and the objective existence of infinite specific structures, ordinary technicians in this technical field can make several improvements, modifications or changes without departing from the principles of the present invention, and can also combine the above technical features in an appropriate manner; these improvements, modifications, changes or combinations, or the direct application of the inventive concept and technical solution to other occasions without improvement, should be regarded as the scope of protection of this application.

Claims

1. A ceramic copper-clad laminate automatic processing device, characterized in that: include: Base body; A copper block box (1), the copper block box (1) being arranged on the base body, the copper block box (1) having a storage space therein, the storage space containing copper-clad blocks meeting a first preset specification, the copper block box (1) having a first opening (2) on one side thereof communicating with the storage space, the opening direction of the first opening (2) being a first direction; A processing assembly, the processing assembly being arranged on the side of the copper block box (1) having the first opening (2), the processing assembly comprising: A mold plate (5), wherein a plurality of groups of copper groove units are provided on the top surface of the mold plate (5), each of the copper groove units comprising a plurality of copper grooves corresponding to a preset pattern, and the structure of each of the copper grooves is adapted to the structure of the copper-clad block; the mold plate (5) is in a first processing state and a second processing state, wherein in the first processing state, the mold plate (5) moves along the first direction within the accommodation space so that the copper-clad block is embedded in the copper groove; and in the second processing state, the mold plate (5) is placed in an initial processing position outside the accommodation space; A first driving assembly (6), the first driving assembly (6) being connected to the mold plate (5) and being used to drive the mold plate (5) to switch between a first processing state and a second processing state; A ceramic sheet assembly, the ceramic sheet assembly comprising a plurality of gripping sheet assemblies, the gripping sheet assemblies corresponding one to one with the copper slot units, the gripping sheet assemblies being used to grip a ceramic sheet meeting a second preset specification, the ceramic sheet having an offset print corresponding to the preset pattern on the side away from the gripping sheet assembly; the gripping sheet assembly is also used to press the gripped ceramic sheet onto the copper slot unit located directly below the gripping sheet assembly of the mold plate (5) which is at the initial processing position and in which all the copper slots are embedded with the copper clad blocks, so that the offset print of the ceramic sheet is pasted with the corresponding copper clad block.

2. The automatic processing device for ceramic copper-clad laminate according to claim 1 is characterized in that: Two first guide rails (9) arranged in parallel are provided at the top of the initial processing position, each of the first guide rails (9) is slidably connected to a first slider, the two first sliders are commonly connected to a first mounting plate (10), a plurality of first telescopic rods (8) are vertically provided on the first mounting plate (10), and each of the first telescopic rods (8) is connected to a grabbing piece assembly at an end away from the first slider.

3. The automatic processing device for ceramic copper-clad laminate according to claim 2 is characterized in that: The grabbing piece assembly is a suction cup (13), and the suction cup (13) has a blowing state and an exhaust state. In the exhaust state, the suction cup (13) is used to grab the ceramic piece, and in the blowing state, the suction cup (13) is used to press the ceramic piece onto the mold plate (5).

4. The automatic processing device for ceramic copper-clad laminate according to claim 3 is characterized in that: A collection component (12) is provided between the two first guide rails (9), and the collection component (12) is used to collect an image of the mold plate (5) located at the initial processing position to determine whether the copper-clad blocks are embedded in all the copper grooves; Each of the first guide rails (9) is also slidably connected to a second slider, and the two second sliders are commonly connected to a second mounting plate (11). A patch assembly (7) is provided on the second mounting plate (11). When there is a copper groove in which the copper clad block is not embedded, the patch assembly (7) is used to insert the copper clad block into the copper groove in which the copper clad block is not embedded.

5. The automatic processing device for ceramic copper-clad laminate according to claim 4 is characterized in that: The mold plate (5) comprises an upper plate (52) and a lower plate (51) hinged to the upper plate (52); the copper trough unit is arranged on the top surface of the upper plate (52); the mold plate (5) has a flat state and a flipped state; in the flat state, the upper plate (52) and the lower plate (51) are on the same plane; in the flipped state, the upper plate (52) flips onto the lower plate (51).

6. The automatic processing device for ceramic copper-clad laminate according to claim 1 is characterized in that: The first driving assembly (6) is connected to the mold plate (5) via a first connecting member (15), and the first connecting member (15) is used to drive the mold plate (5) to rotate around the first direction.

7. A control method for an automatic processing device for a ceramic copper-clad laminate, implemented based on the automatic processing device for a ceramic copper-clad laminate as claimed in claim 6, characterized in that: The following steps are involved: Controlling the mold plate (5) to be inserted into the accommodating space through the first opening (2), and starting timing; Controlling the mold plate (5) to move back and forth in the first direction within the accommodating space, and controlling the mold plate (5) to rotate around the first direction after a first preset time period; After a second preset time, controlling the mold plate (5) to leave the accommodating space through the first opening (2) and move toward the initial processing position; After determining that the mold plate (5) has reached the initial processing position, determining whether each of the copper grooves in each group of copper groove units is embedded with the copper clad block; If yes, control the grabbing piece assembly to grab the ceramic piece and move it to just above the copper slot unit corresponding thereto; Controlling the grabbing piece assembly to move downward, and determining in real time whether the ceramic piece is placed on the corresponding copper slot unit; If yes, controlling the gripping sheet assembly to apply pressure to the ceramic sheet; If the ceramic sheet is pressed tightly against the mold plate (5), the upper plate (52) is controlled to flip onto the lower plate (51), and after the mold plate (5) and the ceramic sheet are tilted down, the upper plate (52) is controlled to rotate in a direction away from the lower plate (51) to the flat state.

8. The control method of the automatic processing device for ceramic copper clad laminate according to claim 7 is characterized in that: After determining whether each copper slot in each group of copper slot units is embedded with the copper clad block, the following steps are also included: If not, controlling the patch block component (7) to fill the empty copper slot with the copper-clad block, wherein the empty copper slot is the copper slot that is not embedded with the copper-clad block; The step of judging whether each copper slot in each group of copper slot units is embedded with the copper clad block specifically comprises the following steps: Controlling the acquisition component (12) to take a photo of the mold plate (5) to obtain at least one actual copper-clad image; Compare the actual copper-clad image with the standard copper-clad image. If the grayscale value of each copper slot position in the actual copper-clad image is the same as the grayscale value of the corresponding position in the standard copper-clad image, it is determined that the copper-clad block is embedded in each copper slot in each group of copper slot units. If the grayscale value of at least one copper slot position in the actual copper-clad image is different from the grayscale value of the corresponding position in the standard copper-clad image, it is determined that the copper slot in each group of copper slot units is not embedded in the copper-clad block, and the coordinates to be supplemented of each empty copper slot are calibrated. The controlling of the patch block assembly (7) to fill the empty copper slot with the copper-clad block specifically comprises the following steps: The patch block assembly (7) is controlled to move according to the coordinates to be patched, and the empty copper slots are sequentially patched into the copper-clad blocks.

9. The control method of the automatic processing device for ceramic copper clad laminate according to claim 7, characterized in that: A pressure sensor is provided near the edge of the suction cup (13); The controlling the grabbing piece assembly to move downward specifically comprises the following steps: Controlling the grabbing piece assembly to move downward, and acquiring a first pressure reading collected by the pressure sensor in real time to obtain a first pressure change rate; The method of determining in real time whether the ceramic sheet is placed on the corresponding copper slot unit specifically comprises the following steps: If the first pressure change rate is greater than a first preset change rate, it is determined that the ceramic sheet is placed on the corresponding copper slot unit.

10. The control method of the automatic processing device for ceramic copper clad laminate according to claim 9, characterized in that: The controlling the gripping sheet assembly to apply pressure to the ceramic sheet specifically comprises the following steps: Obtaining a target pressure and obtaining a blowing time and a blowing flow rate corresponding to the target pressure, wherein the target pressure is at least related to the thickness, size and offset printing characteristics of the ceramic sheet; Controlling the suction cup (13) to apply pressure to the ceramic sheet according to the blowing time and the blowing flow rate, and obtaining a second pressure reading of the pressure sensor in real time; If the ceramic sheet is pressed tightly onto the mold plate (5), the steps specifically include: If the second pressure reading is greater than or equal to the target pressure, it is determined that the ceramic sheet is pressed against the mold plate (5).

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