Novel pressure sensor and packaging method thereof

Abstract

The invention discloses a novel pressure sensor which comprises a metal shell, a connector is arranged at the top of the metal shell, a spring seat is arranged in the connector, a plurality of springs are arranged on the spring seat, a PCBA board is arranged in the metal shell, a supporting ring is arranged at the bottom of the PCBA board, and a pressure sensing element is arranged at the bottom of the supporting ring. Compared with the prior art, the novel pressure sensor has the remarkable advantages that the stainless steel shell and the strain gauge in the pressure sensing element are matched through glass cement, pressure signals can be accurately converted, high-precision measurement is achieved through efficient processing and transmission of a PCBA board, and in the aspect of the structure, the novel pressure sensor is simple in structure, convenient to use and high in practicability. The structure is compact and stable through the injection molding / press riveting connection of the metal shell and the connector and the welding process of all the parts, the stability of the spring and the PCBA board is ensured through the spring seat and the supporting ring, and the reliability is improved.

Description

Technical Field

[0001] The invention belongs to the technical field of sensors, and in particular relates to a novel pressure sensor and a packaging method thereof. Background Art

[0002] Pressure sensors are the most commonly used sensors in industrial practice. They are widely used in various industrial automatic control environments, involving many industries such as water conservancy and hydropower, railway transportation, intelligent buildings, production automatic control, aerospace, military industry, petrochemicals, oil wells, electricity, ships, machine tools, pipelines, etc.

[0003] In the automotive industry, pressure sensors are mostly used in automotive braking systems and chassis suspension systems. However, there are some shortcomings in current related products. The sensor structure of the existing technology is relatively simple and has large size restrictions. Although the external structure mostly uses spring contact, the internal fixed structure design is unreasonable, which greatly limits the application end's selectivity of the sensor boundary size and cannot meet the diverse needs in different scenarios. To a certain extent, it restricts the further improvement and optimization of the performance of automotive-related systems. Summary of the invention

[0004] The object of the present invention is to provide a novel pressure sensor to solve the problem raised in the above background technology that the internal fixed structure is not designed reasonably, which greatly limits the selectivity of the sensor boundary size at the application end.

[0005] In a first aspect, the present invention provides a novel pressure sensor, comprising:

[0006] It comprises a metal shell, a connector is arranged on the top of the metal shell, a spring seat is arranged inside the connector, a plurality of springs are arranged on the spring seat, a PCBA board is arranged inside the metal shell, a support ring is arranged at the bottom of the PCBA board, a pressure-sensitive element is arranged at the bottom of the support ring, and the support ring and the pressure-sensitive element are both fixedly installed inside the metal shell.

[0007] In a possible implementation manner of the first aspect, a plurality of through holes are formed on the metal shell, and the spring is used in conjunction with the through holes.

[0008] In a possible implementation manner of the first aspect, the pressure-sensitive element includes a stainless steel shell, a surface of the stainless steel shell is covered with glass glue, and a strain gauge is bonded to the glass glue.

[0009] In a possible implementation manner of the first aspect, welding points are provided on the surface of the stainless steel shell.

[0010] In a possible implementation manner of the first aspect, the support ring is fixed to the PCBA board through reflow soldering SMT, and the outer ring of the bottom of the support ring is fixed to the step surface of the pressure-sensitive element through a welding point.

[0011] In a possible implementation manner of the first aspect, the metal shell and the connector are fixedly connected by a riveting process.

[0012] Compared with the prior art, the present invention provides a new type of pressure sensor, which has the following beneficial effects:

[0013] 1. Compared with the prior art, the novel pressure sensor of the present invention has significant advantages. The stainless steel shell and strain gauge in the pressure-sensitive element are matched with glass glue, which can accurately convert the pressure signal, and the PCBA board is efficiently processed and transmitted to achieve high-precision measurement. In terms of structure, the injection molding / pressure riveting connection between the metal shell and the connector and the welding process between the components make the structure compact and stable. The spring seat and the support ring respectively ensure the stability of the spring and the PCBA board, thereby improving reliability.

[0014] 2. The stainless steel shell in the pressure-sensing element has good mechanical properties and chemical stability, and can accurately sense pressure changes and transmit them to the strain gauge. The strain gauge is bonded to the surface of the stainless steel shell with glass glue. The glass glue not only ensures the close bonding between the strain gauge and the stainless steel shell, but also has good insulation properties to prevent signal interference, so that the strain gauge can accurately convert the deformation caused by pressure into an electrical signal, and the change in the electrical signal has a highly linear relationship with the pressure change, achieving high-precision measurement of pressure.

[0015] In a second aspect, the present invention provides a novel packaging method for a pressure sensor, comprising:

[0016] Acquire packaging equipment and packaging molds of the pressure sensor, collect sensitive elements of the pressure sensor and physical characteristic data thereof, and perform packaging operations on the pressure sensor using the packaging equipment based on the packaging process parameters to obtain a preliminary packaging body;

[0017] Performing performance testing on the preliminary package to obtain performance testing data, extracting packaging features corresponding to the preliminary package from the performance testing data, and calculating a packaging quality coefficient corresponding to the pressure sensor based on the packaging features;

[0018] Based on the packaging quality coefficient, a packaging optimization strategy corresponding to the pressure sensor is planned, and the relative position relationship between the pressure sensor and the packaging mold is determined. In combination with the relative position relationship and the packaging optimization strategy, an operation control program of the packaging device is edited. Based on the operation control program, the packaging device is used to perform packaging processing on the pressure sensor to obtain a packaging result.

[0019] In a possible implementation manner of the second aspect, setting packaging process parameters corresponding to the packaging equipment based on the physical property data includes:

[0020] Identify the characteristic category corresponding to the physical characteristic data, and obtain the device working module corresponding to the packaging device;

[0021] Analyze the module functional characteristics corresponding to the working module of the device, and query the packaging principle of the packaging device;

[0022] Based on the packaging principle, identifying packaging quality-related characteristics in the module functional characteristics;

[0023] Performing vectorization processing on the characteristic category and the packaging quality-related characteristic respectively to obtain a characteristic category vector and a related characteristic vector;

[0024] Calculating a vector matching index between the characteristic category vector and the associated characteristic vector;

[0025] Based on the vector matching index, determining a working module to be adjusted in the working module of the device;

[0026] According to the physical characteristic data, setting the module control parameters corresponding to the working module to be adjusted;

[0027] Based on the module control parameters, packaging process parameters corresponding to the packaging equipment are generated.

[0028] In a possible implementation manner of the second aspect, performing performance detection processing on the preliminary package to obtain performance detection data includes:

[0029] Querying the multi-dimensional performance indicators corresponding to the preliminary package, and configuring the performance detection conditions of the preliminary package according to the multi-dimensional performance indicators;

[0030] Based on the multi-dimensional performance indicators and the performance testing conditions, performing a multi-dimensional performance test on the preliminary package to obtain multi-dimensional performance test data;

[0031] Performing data cleaning processing on the multidimensional performance test data to obtain target multidimensional performance data;

[0032] The target multi-dimensional performance data is subjected to data integration processing to obtain performance test data.

[0033] In a possible implementation manner of the second aspect, calculating a packaging quality coefficient corresponding to the pressure sensor based on the packaging feature includes:

[0034] Querying a reference packaging feature corresponding to the pressure sensor, and assigning a feature importance coefficient corresponding to the packaging feature;

[0035] Standardizing the package feature and the reference package feature to obtain a package feature value and a reference package feature value;

[0036] Based on the package characteristic value, respectively calculating a package characteristic mean and a package characteristic variance of the package characteristic;

[0037] Based on the reference package characteristic value, respectively calculating a reference package characteristic mean and a reference package characteristic variance of the reference package characteristic;

[0038] In combination with the feature importance coefficient, the package feature value, the reference package feature value, the package feature mean, the reference package feature mean, the package feature variance and the reference package feature variance, the package quality coefficient corresponding to the pressure sensor can be calculated by the following formula:

[0039]

[0040] Among them, G represents the packaging quality coefficient corresponding to the pressure sensor, ω a A represents the feature importance coefficient corresponding to the ath feature in the package feature, a represents the feature sequence number corresponding to the package feature, m represents the number of features of the package feature, and A a Indicates the package feature value corresponding to the ath feature in the package feature, A , a represents the reference package feature value corresponding to the ath feature in the package feature, β represents the mean value of the package feature, β , represents the mean of the reference package characteristics, γ represents the package characteristic variance, and γ , Represents the reference package characteristic variance.

[0041] It can be seen that the present invention can improve the packaging quality of the pressure sensor, ensure the stability and reliability of its performance by setting the packaging process parameters corresponding to the packaging equipment based on the physical characteristic data, and help optimize the packaging process, reduce the waste of packaging materials and packaging time, and improve production efficiency and cost-effectiveness. The present invention can comprehensively evaluate the packaging effect by performing performance detection on the preliminary packaging body, and provide data basis for subsequently extracting the packaging characteristics corresponding to the preliminary packaging body from the performance detection data, so as to accurately judge the quality of the packaging. The present invention can improve and perfect the packaging process in a targeted manner by planning the packaging optimization strategy corresponding to the pressure sensor based on the packaging quality coefficient, thereby improving the packaging quality. In combination with the relative position relationship and the packaging optimization strategy, the operation control program of the packaging equipment is edited, thereby improving the packaging accuracy and stability of the packaging equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0043] Figure 1 A schematic diagram of the three-dimensional structure of a new type of pressure sensor proposed in one embodiment of the present invention;

[0044] Figure 2 A schematic cross-sectional view of a novel pressure sensor structure proposed in one embodiment of the present invention;

[0045] Figure 3 A schematic diagram of the structure of a pressure-sensitive element of a novel pressure sensor proposed in one embodiment of the present invention;

[0046] Figure 4 A flow chart of a novel packaging method for a pressure sensor proposed in one embodiment of the invention;

[0047] In the figure: 1. Spring; 2. Connector; 3. Metal shell; 4. Spring seat; 5. PCBA board; 6. Support ring; 7. Pressure sensing element; 8. Welding point; 9. Strain gauge; 10. Glass glue; 11. Stainless steel shell. DETAILED DESCRIPTION

[0048] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0049] See also Figure 1 , which is a schematic diagram of the three-dimensional structure of the new type of pressure sensor proposed in the present invention, including a metal shell 3, a connector 2 is provided on the top of the metal shell 3, and the metal shell 3 and the connector 2 are fixedly connected by a riveting process, which can improve the connection stability between the metal shell 3 and the connector 2.

[0050] See also Figure 2 , is a schematic cross-sectional view of a novel pressure sensor structure proposed in an embodiment of the present invention. A spring seat 4 is provided inside the connector 2, and a plurality of springs 1 are provided on the spring seat 4. A PCBA board 5 is provided inside the metal shell 3. Various precise circuit components are integrated on the PCBA board 5, which is responsible for processing and converting weak signals transmitted from the pressure-sensitive element 7. A support ring 6 is provided at the bottom of the PCBA board 5. The support ring 6 provides stable support for the PCBA board 5 to ensure that it maintains a good physical state during operation. A pressure-sensitive element 7 is provided at the bottom of the support ring 6. The support ring 6 and the pressure-sensitive element 7 are both fixedly mounted inside the metal shell 3. A plurality of through holes are provided on the metal shell 3. The spring 1 is used in combination with the through holes. When external pressure acts on the connector 2, the spring 1 will deform, and the degree of deformation is related to the pressure. At the same time, through the cooperation with the through holes, the deformation signal is transmitted to the PCBA board 5, thereby realizing accurate conversion of the pressure signal to the electrical signal, and finally transmitting the pressure data to the external device for analysis and processing, so as to realize accurate monitoring and control of the pressure.

[0051] See also Figure 3 , is a schematic diagram of the structure of a pressure-sensitive element of a new type of pressure sensor proposed in an embodiment of the present invention, the pressure-sensitive element 7 includes a stainless steel shell 11, the surface of the stainless steel shell 11 is covered with glass glue 10, and a strain gauge 9 is bonded to the glass glue 10. The glass glue 10 has excellent insulation performance and chemical stability, which can not only provide a reliable bonding basis for the strain gauge 9, but also prevent external moisture, dust and other impurities from corroding the strain gauge 9 and the connection between the stainless steel shell 11 and the strain gauge 9, thereby ensuring the accuracy and stability of sensor signal transmission. A welding point 8 is provided on the surface of the stainless steel shell 11, the support ring 6 and the PCBA board 5 are fixed by reflow soldering SMT, and the outer ring at the bottom of the support ring 6 and the step surface of the pressure-sensitive element 7 are fixed by the welding point 8, so that the internal structure of the entire pressure sensor forms a tight and stable whole, which can effectively transmit and convert signals when under pressure, and provides a solid structural foundation for accurately measuring pressure. It can be widely used in fields with high requirements for pressure monitoring accuracy, such as automobile braking systems and chassis suspension systems, and provides strong support for safe driving and performance optimization of automobiles.

[0052] The working principle and use process of a new type of pressure sensor of the present invention are as follows: before use, the pressure sensor is installed at the corresponding position of the automobile braking system or chassis suspension system to ensure that the components are firmly connected. When the automobile braking or chassis suspension system is working, the pressure change acts on the sensor, and the pressure is first transmitted to the connector 2. The connector 2 transmits the pressure to the spring 1, and the spring 1 undergoes elastic deformation, and the degree of deformation is related to the pressure. The deformation of the spring 1 is transmitted to the PCBA board 5 through the specific structure on the metal shell 3. At the same time, the stainless steel shell 11 in the pressure-sensitive element 7 directly senses the pressure, and its surface is slightly deformed due to the pressure. The strain gauge 9 bonded to the stainless steel shell 11 by glass glue 10 senses this deformation, and the resistance value of the strain gauge 9 changes accordingly, converting the pressure signal into an electrical signal, which is transmitted to the PCBA board 5 through the binding wire. The circuit integrated on the PCBA board 5 processes, amplifies and integrates the signals from the spring 1 and the strain gauge 9 The processed signal contacts the spring 1 through the solder pad on the surface of the PCBA board 5, and is then transmitted to the external port by the spring 1 to realize real-time monitoring of the pressure. During the whole process, the metal shell 3 is firmly connected to the connector 2 through the injection molding / riveting process to provide protection and stable structural support for the internal components. The spring seat 4 limits the spring 1 to ensure the stability and reliability of the spring 1 during operation. The support ring 6 is fixed to the PCBA board 5 through the reflow soldering SMT, and is fixed by three-point welding using the welding point 8 through the bottom outer circle and the step surface of the pressure-sensitive element 7, thereby ensuring the stability and accuracy of the connection between the components. The laser ring welding of the bottom outer circle of the metal shell 3 and the step surface of the pressure-sensitive element 7 further strengthens the packaging of the overall structure, prevents external factors from interfering with the internal components and signal transmission, and enables the pressure sensor to operate stably in a complex automotive working environment, providing accurate pressure data for the automotive braking system and chassis suspension system, and ensuring the safe driving and performance optimization of the vehicle.

[0053] See also Figure 4 FIG. 1 is a packaging method of a novel pressure sensor according to an embodiment of the present invention, comprising:

[0054] S1. Obtain packaging equipment and packaging molds for the pressure sensor, collect sensitive elements of the pressure sensor and their physical property data, set packaging process parameters corresponding to the packaging equipment based on the physical property data, and perform packaging operations on the pressure sensor using the packaging equipment based on the packaging process parameters to obtain a preliminary package body.

[0055] The present invention can improve the packaging quality of the pressure sensor, ensure the stability and reliability of its performance by setting the packaging process parameters corresponding to the packaging equipment based on the physical property data, and help optimize the packaging process, reduce the waste of packaging materials and packaging time, and improve production efficiency and cost-effectiveness.

[0056] Among them, the packaging equipment and the packaging mold are respectively used to seal, fix and integrate the components of the pressure sensor. The pressure sensor is an electronic component used to measure pressure. The sensitive element is a component in the pressure sensor that can sense pressure changes and convert them into electrical signals. The physical property data is the relevant information corresponding to the sensitive element reflecting its physical properties, such as the strain coefficient of the strain gauge, the elastic modulus of the spring and other parameters. The packaging process parameters are various set values ​​corresponding to the packaging equipment for regulating the packaging operation to achieve a good packaging effect, such as packaging temperature, packaging pressure, packaging time and other parameters. The preliminary package body is a semi-finished product obtained after the packaging equipment performs preliminary packaging on the pressure sensor. Furthermore, the collection of the sensitive element of the pressure sensor and its physical property data can be achieved through professional testing instruments, such as high-precision resistance measuring instruments, material elasticity testers, etc.

[0057] As an embodiment of the present invention, the step of setting packaging process parameters corresponding to the packaging equipment based on the physical property data includes:

[0058] Identify the characteristic category corresponding to the physical characteristic data, and obtain the device working module corresponding to the packaging device;

[0059] Analyze the module functional characteristics corresponding to the working module of the device, and query the packaging principle of the packaging device;

[0060] Based on the packaging principle, identifying packaging quality-related characteristics in the module functional characteristics;

[0061] Performing vectorization processing on the characteristic category and the packaging quality-related characteristic respectively to obtain a characteristic category vector and a related characteristic vector;

[0062] Calculating a vector matching index between the characteristic category vector and the associated characteristic vector;

[0063] Based on the vector matching index, determining a working module to be adjusted in the working module of the device;

[0064] According to the physical characteristic data, setting the module control parameters corresponding to the working module to be adjusted;

[0065] Based on the module control parameters, packaging process parameters corresponding to the packaging equipment are generated.

[0066] Among them, the characteristic category is the classification corresponding to the physical characteristic data for describing the physical characteristics of the sensitive element; the equipment working module is the function execution part corresponding to the packaging equipment, the module functional characteristics are the functions and characteristics corresponding to the equipment working module, the packaging principle is the working method of the packaging equipment based on the principle to realize packaging, the characteristic category vector and the associated characteristic vector are respectively mathematical expressions of the characteristic category and the packaging quality associated characteristics in vector form for quantitative representation and analysis, the vector matching index represents the degree of matching between the characteristic category vector and the associated characteristic vector, the working module to be adjusted is the part of the equipment working module that needs to adjust parameters, and the module control parameter is the specific adjustment content corresponding to the working module to be adjusted.

[0067] Optionally, the characteristic category corresponding to the physical characteristic data can be identified through a data classification algorithm, and the equipment working module corresponding to the packaging equipment can be obtained through the equipment manual; the module functional characteristics corresponding to the equipment working module can be analyzed through engineering principles; the query of the packaging principle of the packaging equipment can be achieved through the equipment technical documentation; the principle influencing factors in the packaging principle are queried, and the packaging quality-related characteristics in the module functional characteristics are identified based on the principle influencing factors. For example, in the hot pressing packaging principle, the temperature uniformity of the hot plate is a principle influencing factor that affects the sealing and stability of the packaging. Then, in the module functional characteristics related to the hot plate in the equipment working module, the temperature control-related characteristics belong to the packaging quality-related characteristics; the characteristic category and the packaging quality-related characteristics can be vectorized by a coding method to obtain a characteristic category vector and a related characteristic vector; the characteristic category can be calculated by a Euclidean distance algorithm. The vector matching index between the vector and the associated characteristic vector; when the vector matching index is greater than the preset matching index, the working module to be adjusted in the working module of the device is determined, and the preset matching index can be set to 0.7, or it can be set according to the actual application scenario; according to the physical characteristic data, the module control parameters corresponding to the working module to be adjusted are set. If the physical characteristic data shows that the strain coefficient of the strain gauge is high, when setting the hot pressing working module parameters, the hot plate temperature can be appropriately increased to about 180°C to enhance the curing effect of the packaging material and ensure a good combination of the strain gauge and the PCBA board. If the physical characteristic data shows that the elastic modulus of the spring is large, when the elastic modulus is large, the packaging pressure holding time can be appropriately extended to about 60 seconds to ensure that the spring is stable in position during the packaging process and is reliably connected to other components. If the elastic modulus is small, the pressure holding time can be shortened to about 40 seconds to avoid damage to the spring caused by excessive extrusion and optimize the packaging efficiency.

[0068] Furthermore, based on the packaging process parameters and the corresponding packaging process, the packaging equipment is used to perform a packaging operation on the pressure sensor to obtain a preliminary packaging body.

[0069] S2. Performing performance testing on the preliminary package to obtain performance testing data, extracting packaging features corresponding to the preliminary package from the performance testing data, and calculating a packaging quality coefficient corresponding to the pressure sensor based on the packaging features.

[0070] The present invention can comprehensively evaluate the packaging effect by performing performance testing on the preliminary packaging body, and provide a data basis for subsequently extracting the packaging characteristics corresponding to the preliminary packaging body from the performance testing data, so as to accurately judge the quality of the packaging, wherein the performance testing data is the data results obtained by performing various performance tests on the preliminary packaging body.

[0071] As an embodiment of the present invention, the performing performance testing on the preliminary package to obtain performance testing data includes:

[0072] Querying the multi-dimensional performance indicators corresponding to the preliminary package, and configuring the performance detection conditions of the preliminary package according to the multi-dimensional performance indicators;

[0073] Based on the multi-dimensional performance indicators and the performance testing conditions, performing a multi-dimensional performance test on the preliminary package to obtain multi-dimensional performance test data;

[0074] Performing data cleaning processing on the multidimensional performance test data to obtain target multidimensional performance data;

[0075] The target multi-dimensional performance data is subjected to data integration processing to obtain performance test data.

[0076] Among them, the multi-dimensional performance index is a quantitative reference standard corresponding to the preliminary package for measuring the quality of its performance in electrical, mechanical, sealing and other aspects; the performance test conditions are various environments, parameters and other related requirements that need to be set when the preliminary package is subjected to multi-dimensional performance testing; the multi-dimensional performance test data are specific data obtained after the preliminary package is subjected to multi-dimensional performance testing, including various performance performance conditions; these data include electrical performance test data (such as electrical parameters such as resistance, capacitance, inductance, and insulation performance related data), mechanical performance test data (such as compressive strength, tensile strength, vibration resistance and other mechanical mechanics related data) and sealing performance test data (such as leakage rate and other data reflecting the sealing of the package) and other information in multiple dimensions; these data can comprehensively and comprehensively reflect the performance of the preliminary package in different performance aspects, and provide an important data basis for the subsequent evaluation of the packaging quality; the target multi-dimensional performance data are the data obtained after the invalid data in the multi-dimensional performance test data is removed, and the invalid data includes duplicate data, error data and the like.

[0077] Optionally, the multidimensional performance indicators corresponding to the preliminary package body can be queried through the packaging standard database, and the intelligent control system configures the performance detection conditions of the preliminary package body according to the multidimensional performance indicators; based on the multidimensional performance indicators and the performance detection conditions, the preliminary package body can be subjected to multidimensional performance testing by automated detection equipment to obtain multidimensional performance test data, such as electrical testing instruments, pressure testing machines, and high and low temperature test chambers; the multidimensional performance test data can be cleaned by a box plot method to obtain target multidimensional performance data; the target multidimensional performance data can be integrated by a data fusion algorithm to obtain performance detection data.

[0078] The present invention calculates the packaging quality coefficient corresponding to the pressure sensor based on the packaging characteristics, and can intuitively reflect the packaging quality level of the pressure sensor through the packaging quality coefficient, thereby facilitating the optimization and improvement of the packaging process, wherein the packaging characteristics are various characteristics corresponding to the preliminary package body that reflect the packaging quality, such as electrical connection reliability, mechanical stability, sealing integrity and other characteristics, and the packaging quality coefficient represents the quality of the packaging of the pressure sensor. Furthermore, extracting the packaging characteristics corresponding to the preliminary package body from the performance test data can be achieved through a data mining algorithm.

[0079] As an embodiment of the present invention, the step of calculating a packaging quality coefficient corresponding to the pressure sensor based on the packaging feature includes:

[0080] Querying a reference packaging feature corresponding to the pressure sensor, and assigning a feature importance coefficient corresponding to the packaging feature;

[0081] Standardizing the package feature and the reference package feature to obtain a package feature value and a reference package feature value;

[0082] Based on the package characteristic value, respectively calculating a package characteristic mean and a package characteristic variance of the package characteristic;

[0083] Based on the reference package characteristic value, respectively calculating a reference package characteristic mean and a reference package characteristic variance of the reference package characteristic;

[0084] In combination with the feature importance coefficient, the package feature value, the reference package feature value, the package feature mean, the reference package feature mean, the package feature variance and the reference package feature variance, the package quality coefficient corresponding to the pressure sensor can be calculated by the following formula:

[0085]

[0086] Among them, G represents the packaging quality coefficient corresponding to the pressure sensor, ω a A represents the feature importance coefficient corresponding to the ath feature in the package feature, a represents the feature sequence number corresponding to the package feature, m represents the number of features of the package feature, and A a Indicates the package feature value corresponding to the ath feature in the package feature, A , a represents the reference package feature value corresponding to the ath feature in the package feature, β represents the mean value of the package feature, β , represents the mean of the reference package characteristics, γ represents the package characteristic variance, and γ , Represents the reference package characteristic variance.

[0087] Among them, the reference packaging feature is the standard packaging reference feature of the pressure sensor under an ideal packaging state, the feature importance coefficient represents the influence of the packaging feature on the overall packaging quality, the packaging feature value and the reference packaging feature value are respectively the specific quantitative performance values ​​corresponding to the packaging feature and the reference packaging feature, which are used to intuitively reflect the actual situation of the corresponding features; the packaging feature mean is the average level of the values ​​of the packaging feature in multiple measurements or multiple groups of samples, and the packaging feature variance is the degree of dispersion of each value of the packaging feature relative to its mean; the reference packaging feature mean is the average level of the values ​​of the reference packaging feature in multiple considerations or multiple groups of standard samples under an ideal packaging state, and the reference packaging feature variance is the degree of dispersion of each value of the reference packaging feature relative to its ideal mean.

[0088] Furthermore, the query of the reference packaging feature corresponding to the pressure sensor can be achieved through the internal packaging standard database of the enterprise, which is constructed by collecting feature data of a large number of verified high-quality packaging samples; the allocation of feature importance coefficients corresponding to the packaging features can be achieved through the expert scoring method, which involves convening packaging experts in the industry to score the importance of different packaging features to the overall packaging quality based on their experience, and then performing normalization to obtain the feature importance coefficients; the packaging features and the reference packaging features can be standardized respectively through the Z-score normalization method to obtain a first standardized value and a second standardized value; the packaging feature mean and the packaging feature variance of the packaging feature can be calculated through the average function and the variance formula.

[0089] S3. Based on the packaging quality coefficient, plan the packaging optimization strategy corresponding to the pressure sensor, determine the relative position relationship between the pressure sensor and the packaging mold, and edit the operation control program of the packaging equipment in combination with the relative position relationship and the packaging optimization strategy. Based on the operation control program, use the packaging equipment to perform packaging processing on the pressure sensor to obtain a packaging result.

[0090] The present invention plans the packaging optimization strategy corresponding to the pressure sensor based on the packaging quality coefficient, and can improve and perfect the packaging process in a targeted manner, thereby improving the packaging quality. In combination with the relative position relationship and the packaging optimization strategy, the operation control program of the packaging equipment is edited, thereby improving the packaging accuracy and stability of the packaging equipment.

[0091] Among them, the packaging optimization strategy is a specific improvement plan for improving the packaging quality of the pressure sensor, the relative position relationship is the mutual correlation between the pressure sensor and the packaging mold in spatial position, and the operation control program is the program code of the operation instruction of the packaging equipment. Further, based on the packaging quality coefficient and past packaging process data and successful cases, the packaging optimization strategy corresponding to the pressure sensor is planned; the relative position relationship between the pressure sensor and the packaging mold can be determined by a machine vision system combined with a coordinate positioning algorithm; combined with the relative position relationship and the packaging optimization strategy, the operation control program of the packaging equipment is edited, and the control program of the mold positioning device is set according to the relative position relationship, such as adjusting the translation, rotation and other action parameters of the mold; according to the packaging optimization strategy, the control program of the heating module, the pressurizing module and the material conveying module is set, and the specific temperature setting, pressure size and material supply amount can be calculated and determined according to the actual process requirements and quality feedback data, and then the corresponding control program is edited to generate the operation control program corresponding to the packaging equipment, and finally the packaging equipment is used to perform the packaging processing of the pressure sensor according to the program to obtain the packaging result.

[0092] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A new type of pressure sensor, characterized in that: The invention comprises a metal shell (3), a connector (2) is arranged on the top of the metal shell (3), a spring seat (4) is arranged inside the connector (2), a plurality of springs (1) are arranged on the spring seat (4), a PCBA board (5) is arranged inside the metal shell (3), a support ring (6) is arranged at the bottom of the PCBA board (5), a pressure-sensitive element (7) is arranged at the bottom of the support ring (6), and the support ring (6) and the pressure-sensitive element (7) are both fixedly mounted inside the metal shell (3).

2. A novel pressure sensor as claimed in claim 1, characterized in that: The metal shell (3) is provided with a plurality of through holes, and the spring (1) is used in conjunction with the through holes.

3. A novel pressure sensor as claimed in claim 1, characterized in that: The pressure-sensitive element (7) comprises a stainless steel shell (11), the surface of the stainless steel shell (11) is covered with glass glue (10), and a strain gauge (9) is bonded to the glass glue (10).

4. A novel pressure sensor as claimed in claim 3, characterized in that: The surface of the stainless steel housing (11) is provided with welding points (8).

5. A novel pressure sensor as claimed in claim 1, characterized in that: The support ring (6) and the PCBA board (5) are fixed by reflow soldering SMT, and the outer ring at the bottom of the support ring (6) and the step surface of the pressure-sensitive element (7) are fixed by welding points (8).

6. A novel pressure sensor as claimed in claim 1, characterized in that: The metal shell (3) and the connector (2) are fixedly connected by a riveting process.

7. A packaging method for a novel pressure sensor, wherein the packaging method is performed according to the novel pressure sensor according to any one of claims 1 to 6, characterized in that: The method comprises: Acquire packaging equipment and packaging molds of the pressure sensor, collect sensitive elements of the pressure sensor and physical characteristic data thereof, and perform packaging operations on the pressure sensor using the packaging equipment based on the packaging process parameters to obtain a preliminary packaging body; Performing performance testing on the preliminary package to obtain performance testing data, extracting packaging features corresponding to the preliminary package from the performance testing data, and calculating a packaging quality coefficient corresponding to the pressure sensor based on the packaging features; Based on the packaging quality coefficient, a packaging optimization strategy corresponding to the pressure sensor is planned, and the relative position relationship between the pressure sensor and the packaging mold is determined. In combination with the relative position relationship and the packaging optimization strategy, an operation control program of the packaging device is edited. Based on the operation control program, the packaging device is used to perform packaging processing on the pressure sensor to obtain a packaging result.

8. The method according to claim 7, characterized in that The step of setting packaging process parameters corresponding to the packaging equipment based on the physical characteristic data includes: Identify the characteristic category corresponding to the physical characteristic data, and obtain the device working module corresponding to the packaging device; Analyze the module functional characteristics corresponding to the working module of the device, and query the packaging principle of the packaging device; Based on the packaging principle, identifying packaging quality-related characteristics in the module functional characteristics; Performing vectorization processing on the characteristic category and the packaging quality-related characteristic respectively to obtain a characteristic category vector and a related characteristic vector; Calculating a vector matching index between the characteristic category vector and the associated characteristic vector; Based on the vector matching index, determining a working module to be adjusted in the working module of the device; According to the physical characteristic data, setting the module control parameters corresponding to the working module to be adjusted; Based on the module control parameters, packaging process parameters corresponding to the packaging equipment are generated.

9. The method according to claim 7, characterized in that: The performing performance testing on the preliminary package to obtain performance testing data includes: Querying the multi-dimensional performance indicators corresponding to the preliminary package, and configuring the performance detection conditions of the preliminary package according to the multi-dimensional performance indicators; Based on the multi-dimensional performance indicators and the performance testing conditions, performing a multi-dimensional performance test on the preliminary package to obtain multi-dimensional performance test data; Performing data cleaning processing on the multidimensional performance test data to obtain target multidimensional performance data; The target multi-dimensional performance data is subjected to data integration processing to obtain performance test data.

10. The method according to claim 7, characterized in that The calculating, based on the packaging feature, a packaging quality coefficient corresponding to the pressure sensor includes: Querying a reference packaging feature corresponding to the pressure sensor, and assigning a feature importance coefficient corresponding to the packaging feature; Standardizing the package feature and the reference package feature to obtain a package feature value and a reference package feature value; Based on the package characteristic value, respectively calculating a package characteristic mean and a package characteristic variance of the package characteristic; Based on the reference package characteristic value, respectively calculating a reference package characteristic mean and a reference package characteristic variance of the reference package characteristic; In combination with the feature importance coefficient, the package feature value, the reference package feature value, the package feature mean, the reference package feature mean, the package feature variance and the reference package feature variance, the package quality coefficient corresponding to the pressure sensor can be calculated by the following formula: Among them, G represents the packaging quality coefficient corresponding to the pressure sensor, ω a A represents the feature importance coefficient corresponding to the ath feature in the package feature, a represents the feature sequence number corresponding to the package feature, m represents the number of features of the package feature, and A a Indicates the package feature value corresponding to the ath feature in the package feature, A , a represents the reference package feature value corresponding to the ath feature in the package feature, β represents the mean value of the package feature, β , represents the mean of the reference package characteristics, γ represents the package characteristic variance, and γ , Represents the reference package characteristic variance.

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