A wafer defect detection device and method for wafer production

Abstract

The present invention discloses a wafer defect detection device and method for wafer production, belonging to the technical field of wafer detection. It includes a detection cabinet and a camera assembled on the inner top wall of the detection cabinet. The inner bottom wall of the detection cabinet is assembled with a rotation unit through an installation groove opened. The rotation unit includes an annular frame rotatably connected in the installation groove. Through the arranged camera, rotation unit and cam member, the automatic rotation and inclination of the wafer during the detection process are realized, so that the defects on the surface and edge of the wafer can be detected simultaneously, significantly improving the detection efficiency. At the same time, during the process of the wafer gradually inclining from a flat state to a vertical state during the detection process, different detection perspectives can be presented, and during the process of continuing to revolve with the annular frame in the vertical state, the vacuum chuck will drive the wafer to rotate under the drive of the face gear, so that all positions on the edge of the wafer can be photographed by the camera. With the combined use, the camera can more comprehensively capture the defect scattering signals on the surface and edge of the wafer.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer detection, and particularly relates to a wafer defect detection device and method for wafer production. Background Art

[0002] Wafer defect detection is a crucial part in semiconductor manufacturing. During the manufacturing process, various defects may occur on the wafer, such as surface defects, structural defects, and chemical defects, etc. These defects will affect the function and performance of the chip, and even cause the chip to fail. Therefore, it is very necessary to effectively detect and analyze wafer defects.

[0003] Traditional defect detection methods mainly rely on visual detection means. However, in actual operation, this method usually requires separate detection of the wafer surface and the edge, which undoubtedly reduces the overall detection efficiency. Notably, when detecting the wafer surface, although the wafer only needs to be placed flat and fixed, there are various types of defects on the wafer surface, such as scratches, burrs, damages, and bubbles, etc. These different types of defects exhibit different optical scattering characteristics, including significant differences in aspects such as the intensity and angular distribution of scattered light. Since the wafer remains flat during the detection process, this fixed detection angle may not be able to comprehensively capture the scattered signals of all defects, thus increasing the risk of missed detection or false detection. Summary of the Invention

[0004] The purpose of the present invention is to propose a wafer defect detection device and method for wafer production to solve the problem that during the detection process, the wafer always remains flat, and this fixed detection angle may not be able to comprehensively capture the scattered signals of all defects, thus increasing the risk of missed detection or false detection.

[0005] To achieve the above purpose, the present invention adopts the following technical solutions:

[0006] A wafer defect detection device for wafer production includes a detection cabinet and a camera assembled on the inner top wall of the detection cabinet. The inner bottom wall of the detection cabinet is assembled with a rotation unit through an installation groove. The rotation unit includes an annular frame rotatably connected in the installation groove, and a plurality of mounting seats are installed at the opening of the annular frame;

[0007] The wafer to be detected is fixed during the detection process by being adsorbed by a vacuum chuck rotatably connected in the mounting seat;

[0008] An angle adjustment frame is assembled on the inner bottom wall of the annular frame, and the angle adjustment frame is connected to the mounting seat through an inclined crank;

[0009] A support base is assembled at the bottom of the detection cabinet, and a cam member is assembled inside the support base. During the rotation of the angle adjustment frame following the ring frame, the cam member drives the mounting seat to drive the wafer on the surface of the vacuum chuck to gradually tilt from a horizontal state to a vertical state, so as to realize the detection of the surface and edge of the wafer.

[0010] As a further description of the above technical solution:

[0011] The angle adjustment frame includes a slide rail fixed to the inner bottom wall of the ring frame. A slider is slidably mounted on the slide rail. The top of the slider is fixed with a guide rod whose one end is in contact with the outer wall of the cam member. A roller is rotatably connected to the end of the guide rod in contact with the cam member, so that the guide rod moves more smoothly on the cam member.

[0012] As a further description of the above technical solution:

[0013] A guide groove is formed on the outer wall of the inclined crank. The other end of the guide rod is rotatably connected with a guide post adapted to the guide groove. The other end of the guide rod is slidably mounted in the guide groove through the guide post.

[0014] As a further description of the above technical solution:

[0015] A connecting seat is fixed at the center of the bottom of the mounting seat. Shaft columns are fixed on both sides of the connecting seat. One end of each shaft column is rotatably connected with a holding seat. One end of the holding seat is fixed at the opening of the ring frame, so that the mounting seat can be rotatably connected with the ring frame. One end of the inclined crank is fixed to the connecting seat. When the inclined crank moves towards the edge under the drive of the guide rod, it can drive the mounting seat to gradually tilt to a vertical state.

[0016] As a further description of the above technical solution:

[0017] An expansion link is assembled on one side of the slider. One end of the expansion link is fixed to the inner wall of the ring frame. A spring is sleeved on the outer surface of the expansion link, so that the expansion link can reset itself after contraction.

[0018] As a further description of the above technical solution:

[0019] The rotation unit further includes a vacuum pump fixed to the inner wall of the ring frame. One end of the vacuum pump is fixed with a connecting pipe. One end of the connecting pipe is fixedly connected with an annular pipe. The annular pipe is fixed to the inner wall of the ring frame through a pipe clamp. The bottom of the vacuum chuck is fixed with a rotary joint. The bottom end of the rotary joint is fixed with an air pipe. One end of the air pipe penetrates through the mounting seat and is fixedly connected with the annular pipe.

[0020] As a further description of the above technical solution:

[0021] The rotating unit further includes a driving assembly. The driving assembly includes a motor fixed to one side of the inner bottom wall of the detection cabinet. A cage is fixed to one side of the motor, and a driving gear is rotatably connected to the cage.

[0022] As a further description of the above technical solution:

[0023] The output end of the motor is splined to one end of the driving gear. An external gear ring meshing with the driving gear is fixedly sleeved on the outer wall of the ring frame, so that the ring frame can rotate under the drive of the motor.

[0024] As a further description of the above technical solution:

[0025] An internal gear ring is fixedly sleeved on the outer wall of the vacuum chuck. A face gear meshing with the vertically placed internal gear ring is detachably fixed to the top of the outer wall of the cam member, so that the vacuum chuck can rotate to the vertical state under the cooperation of the guide rod and the cam member and then rotate self - driven under the drive of the face gear during the process of revolving with the ring frame.

[0026] A method for detecting wafer defects in wafer production includes the following steps:

[0027] S1. Preparation stage: Place the wafer to be detected on the surface of the vacuum chuck, start the vacuum pump, evacuate the vacuum chuck through the connecting pipe, the annular pipe and the air pipe, so that the wafer is adsorbed and fixed on the vacuum chuck. Then ensure that the camera is correctly installed and debugged and can clearly capture the wafer.

[0028] S2. Start the rotating unit: Start the motor to drive the driving gear to rotate, driving the ring frame and the wafer to start rotating.

[0029] S3. Wafer tilting and detection: During the rotation of the ring frame, the guide rod rotates along the outer wall of the cam member. The shape of the cam member is designed such that the guide rod gradually moves towards the edge of the ring frame during rotation. The movement of the guide rod, through the cooperation of the inclined crank and the guide groove, drives the mounting seat together with the vacuum chuck to gradually tilt downwards to the vertical state. During the tilting of the wafer, the camera takes pictures of the wafer from multiple angles to capture the scattering signals of defects with different scattering characteristics.

[0030] S4. Wafer self - rotation and edge detection: When the wafer tilts to the vertical state, during the continuous rotation of the ring frame, the internal gear ring and the face gear gradually come into contact and mesh. Driven by the face gear, the internal gear ring drives the vacuum chuck to rotate, causing the wafer to rotate self - driven in the vertical state. During the self - rotation of the wafer, the camera takes pictures of the edge of the wafer to ensure that the defects at the edge can also be detected.

[0031] S5. Wafer resetting and re-inspection: When the ring frame continues to rotate to a certain angle, the trajectory of the cam part becomes concave inward, reducing the resistance to the spring. Under the action of the spring restoring force, the telescopic rod gradually unfolds, driving the guide rod and the inclined crank to gradually move toward the center of the ring frame. The movement of the inclined crank drives the mounting seat and the vacuum suction cup to gradually return to a horizontal state. During the wafer resetting process, the camera can re-inspect the wafer surface to further improve the accuracy of the inspection;

[0032] S6, end of detection: turn off the power of the motor and vacuum pump, release the adsorption force of the vacuum suction cup, remove the wafer after detection, and proceed to the next step of processing or analysis.

[0033] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are:

[0034] The camera, rotating unit and cam are set up to realize automatic rotation and tilt of the wafer during the inspection process, so that defects on the surface and edge of the wafer can be detected at the same time, avoiding the cumbersome steps of separate inspection in traditional methods and significantly improving the inspection efficiency;

[0035] At the same time, during the inspection process, the wafer can present different inspection angles as it gradually tilts from a flat state to a vertical state. In addition, when the wafer continues to follow the orbital rotation of the ring frame in a vertical state, the vacuum suction cup drives the wafer to rotate under the drive of the face gear, so that all positions on the edge of the wafer can be photographed by the camera. When used in conjunction, the camera can more comprehensively capture the defect scattering signals on the surface and edge of the wafer, thereby reducing the risk of missed detection and false detection.

[0036] In the process of restoring from the vertical state to the horizontal state, the camera can be used to re-inspect the surface of the wafer after inspection, further improving the accuracy of the inspection results. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 It shows a schematic diagram of the overall structure provided by an embodiment of the present invention;

[0038] Figure 2 It shows a schematic diagram of the internal structure of the ring frame after being cut open according to an embodiment of the present invention;

[0039] Figure 3 The embodiment of the present invention provides Figure 2 The enlarged view of point A in the middle;

[0040] Figure 4 A schematic structural diagram of a ring frame provided in an embodiment of the present invention is shown;

[0041] Figure 5 It shows a schematic structural diagram of a vacuum suction cup in a horizontal state provided by an embodiment of the present invention;

[0042] Figure 6 shows an enlarged view at position B in Figure 2 ;

[0043] Figure 7 shows a schematic structural view of the mounting base and the vacuum suction cup after being cut open according to an embodiment of the present invention;

[0044] Figure 8 shows a schematic view of the mounting position of the support base according to an embodiment of the present invention;

[0045] Figure 9 shows a schematic structural view of the cam member according to an embodiment of the present invention;

[0046] Figure 10 shows a schematic structural view of the vacuum suction cup from the first perspective in the vertical state according to an embodiment of the present invention;

[0047] Figure 11 shows a schematic structural view of the vacuum suction cup from the second perspective in the vertical state according to an embodiment of the present invention.

[0048] Legend description:

[0049] 10. Detection cabinet;

[0050] 20. Camera;

[0051] 30. Rotating unit; 31. Ring frame; 32. Mounting base; 33. Angle adjusting frame; 331. Slide rail; 332. Slide block; 333. Guide rod; 334. Telescopic rod; 335. Spring; 336. Oblique crank; 337. Guide groove; 34. Vacuum pump; 35. Vacuum suction cup; 36. Rotary joint; 37. Air pipe; 38. Driving assembly; 381. Motor; 382. Driving gear; 383. Outer tooth ring; 384. Inner tooth ring; 385. Face gear; 39. Annular pipe;

[0052] 40. Support base;

[0053] 50. Cam member. Detailed implementation manners

[0054] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0055] Such as Figure 1 - Figure 11As shown, the present invention provides:

[0056] A wafer defect detection device for wafer production, including a detection cabinet 10 and a camera 20 assembled on the inner top wall of the detection cabinet 10. The inner bottom wall of the detection cabinet 10 is assembled with a rotating unit 30 through an opening installation groove;

[0057] The rotating unit 30 includes an annular frame 31 rotatably connected in the installation groove. A plurality of mounting seats 32 are installed at the opening of the annular frame 31. The wafer to be detected is fixed during the detection process by being adsorbed by a vacuum chuck 35 rotatably connected in the mounting seat 32;

[0058] The rotating unit 30 further includes a vacuum pump 34 fixed on the inner wall of the annular frame 31. One end of the vacuum pump 34 is fixed with a connecting pipe. One end of the connecting pipe is fixedly connected with an annular pipe 39. The annular pipe 39 is fixed on the inner wall of the annular frame 31 through a pipe clamp. The bottom of the vacuum chuck 35 is fixed with a rotary joint 36. The bottom end of the rotary joint 36 is fixed with an air pipe 37. One end of the air pipe 37 penetrates through the mounting seat 32 and is fixedly connected with the annular pipe 39. Preferably, a solenoid valve is provided on the connecting pipe for opening and closing the connecting pipe, and a power supply box is provided on one side of the inner wall of the annular frame 31 close to the vacuum pump 34. A battery for supplying power to the vacuum pump 34 is provided in the power supply box;

[0059] More specifically, the camera 20 is located at a position corresponding to the axis center of the annular frame 31 on the inner top wall of the detection cabinet 10, so that the camera 20 can completely photograph the wafer during the movement of the wafer. In particular, a plurality of balls are embedded in the lower surface of the annular frame 31, and the bottom of the balls is in contact with the support seat 40, which can provide a certain supporting force for the annular frame 31, making the rotation of the annular frame 31 more stable and not affecting the rotation of the annular frame 31 at the same time;

[0060] Specifically, before detection, the sampled wafer to be detected is placed on the surface of the vacuum chuck 35, and then the vacuum pump 34 is started to evacuate the vacuum chuck 35, so that the wafer is adsorbed and fixed on the surface of the vacuum chuck 35. The design of the rotary joint 36 enables the wafer to maintain the vacuum adsorption state during the self-rotation process following the vacuum chuck 35, ensuring the stability of the detection. When the detection is completed, the power supply of the vacuum pump 34 is turned off, the adsorption force of the vacuum chuck 35 is released, and then the wafer is taken off;

[0061] It should be noted that the vacuum pumping force of the vacuum pump 34 and the shooting parameters of the camera 20 need to be adjusted in advance according to the material and size of the wafer to obtain the best detection effect.

[0062] Such as Figure 2 、 Figure 8 and Figure 9As shown, the rotating unit 30 further includes a driving component 38. The driving component 38 includes a motor 381 fixed to one side of the inner bottom wall of the detection cabinet 10. A cage is fixed to one side of the motor 381, and a driving gear 382 is rotatably connected to the cage.

[0063] The output end of the motor 381 is splined to one end of the driving gear 382. An external gear ring 383 meshing with the driving gear 382 is fixedly sleeved on the outer wall of the ring frame 31, so that the ring frame 31 can rotate under the drive of the motor 381.

[0064] An internal gear ring 384 is fixedly sleeved on the outer wall of the vacuum chuck 35. A face gear 385 meshing with the vertically positioned internal gear ring 384 is detachably fixed to the top of the outer wall of the cam member 50. Preferably, the type of the internal gear ring 384 is a cylindrical gear, so that after the vacuum chuck 35 rotates to the vertical state under the cooperation of the guide rod 333 and the cam member 50, it can rotate automatically under the drive of the face gear 385 during the process of following the revolution of the ring frame 31.

[0065] More specifically, after the wafer is adsorbed and fixed on the surface of the vacuum chuck 35, the motor 381 is started to drive the driving gear 382 to rotate, and then drive the external gear ring 383 to drive the ring frame 31 and the wafer to rotate. During the rotation process, the wafer is gradually driven from a flat state to a vertical state by the angle adjustment frame 33 cooperating with the cam member 50. There is no need for manual adjustment or step-by-step operation, realizing continuous detection of surface and edge defects, reducing the time loss of traditional step-by-step detection, significantly improving the efficiency, and during the gradual inclination process, the angle is constantly changing, enabling the camera 20 to capture the scattering signals of defects with different scattering characteristics, avoiding missed detection or misdetection caused by a fixed viewing angle.

[0066] It should be noted that when the wafer just inclines to the vertical state, the internal gear ring 384 and the face gear 385 are in a non-meshing state, and they will gradually come into contact and mesh during the continued rotation process. The automatic meshing design of the face gear 385 and the internal gear ring 384 enables the wafer to rotate automatically in the vertical state, and no additional drive is required for edge detection. The vacuum chuck 35 is connected to the annular pipe 39 through a rotary joint 36 to ensure stable adsorption of the wafer during rotation and inclination.

[0067] As Figure 2 、 Figure 3 、 Figure 4 and Figure 5 shown, an angle adjustment frame 33 is assembled on the inner bottom wall of the ring frame 31. The angle adjustment frame 33 is connected to the mounting seat 32 through an inclined crank 336. A support seat 40 is assembled at the bottom of the detection cabinet 10, and a cam member 50 is assembled in the support seat 40. During the rotation process of the angle adjustment frame 33 following the ring frame 31, under the drive of the cam member 50, the mounting seat 32 is driven to drive the wafer on the surface of the vacuum chuck 35 from a horizontal state to a vertical state, realizing the detection of the surface and edge of the wafer.

[0068] More specifically, the angle adjustment frame 33 includes a slide rail 331 fixed to the inner bottom wall of the ring frame 31. A slider 332 is slidably mounted on the slide rail 331. The top of the slider 332 is fixed with a guide rod 333 whose one end is in contact with the outer wall of the cam member 50. A roller is rotatably connected to the end of the guide rod 333 in contact with the cam member 50, making the movement of the guide rod 333 on the cam member 50 smoother;

[0069] A guide groove 337 is formed on the outer wall of the inclined crank 336. The other end of the guide rod 333 is rotatably connected with a guide post adapted to the guide groove 337. The other end of the guide rod 333 is slidably mounted in the guide groove 337 through the guide post;

[0070] A connecting seat is fixed at the center of the bottom of the mounting seat 32. Shaft columns are fixed on both sides of the connecting seat. One end of each shaft column is rotatably connected with a holding seat. One end of the holding seat is fixed at the opening of the ring frame 31, enabling the mounting seat 32 to be rotatably connected with the ring frame 31. One end of the inclined crank 336 is fixed to the connecting seat. When the inclined crank 336 moves towards the edge under the drive of the guide rod 333, it can drive the mounting seat 32 to gradually tilt to the vertical state;

[0071] Specifically, during the rotation of the ring frame 31, the guide rod 333 rotates along the cam member 50 and gradually moves towards the edge of the ring frame 31 under the drive of the cam member 50. During the movement towards the edge, it simultaneously pushes the inclined crank 336 towards the edge, thereby driving the mounting seat 32 and the vacuum chuck 35 to gradually tilt downwards to the vertical state. During the tilting process, the wafer at multiple angles is photographed by the camera 20 to avoid missed inspection or misjudgment caused by a fixed viewing angle;

[0072] Meanwhile, during the continuous rotation in the vertical state, when the internal gear ring 384 meshes with the face gear 385, under the drive of the stationary face gear 385, the internal gear ring 384 will drive the vacuum chuck 35 to rotate, causing the wafer on the suction cup surface to rotate, so that the entire edge of the wafer can be exposed during the rotation. Then, it is photographed by the camera 20, and finally analyzed through image processing technology, enabling the surface and edge of the wafer to be inspected, avoiding the situation of missed inspection of defects.

[0073] As Figure 5 、 Figure 10 and Figure 11 shown, one side of the slider 332 is equipped with a telescopic rod 334. One end of the telescopic rod 334 is fixed to the inner wall of the ring frame 31. A spring 335 is sleeved on the outer surface of the telescopic rod 334, enabling the telescopic rod 334 to reset itself after contraction;

[0074] Specifically, during the process of the guide rod 333 moving towards the edge, it will drive the telescopic rod 334 to contract and gradually compress the spring 335. When the guide rod 333 rotates 270°, when it continues to rotate at this time, since the trajectory of the cam member 50 is concave inward at this time, the abutting force on the spring 335 will be gradually reduced. During this process, under the action of the restoring force of the spring 335, the telescopic rod 334 is driven to gradually expand, and then the guide rod 333 is driven to drive the inclined crank 336 to gradually move towards the center of the ring frame 31, thereby gradually driving the vertically placed wafer to gradually return to the horizontal state. It should be noted that during this process, the surface of the wafer can be re-inspected through the camera 20 to further improve the accuracy of detection.

[0075] A method for detecting wafer defects in wafer production, comprising the following steps:

[0076] S1. Preparation stage: Place the wafer to be detected on the surface of the vacuum chuck 35, start the vacuum pump 34, and evacuate the vacuum chuck 35 through the connecting pipe, the annular pipe 39 and the air pipe 37, so that the wafer is adsorbed and fixed on the vacuum chuck 35. Then ensure that the camera 20 is correctly installed and debugged, and can clearly capture the wafer;

[0077] S2. Start the rotating unit 30: Start the motor 381 to drive the driving gear 382 to rotate, driving the ring frame 31 and the wafer to start rotating;

[0078] S3. Wafer tilting and detection: During the rotation of the ring frame 31, the guide rod 333 rotates along the outer wall of the cam member 50. The shape design of the cam member 50 causes the guide rod 333 to gradually move towards the edge of the ring frame 31 during rotation. The movement of the guide rod 333, through the cooperation of the inclined crank 336 and the guide groove 337, drives the mounting seat 32 and the vacuum chuck 35 to gradually tilt downward to the vertical state. During the tilting process of the wafer, the camera 20 takes pictures of the wafer at multiple angles to capture the scattering signals of defects with different scattering characteristics;

[0079] S4. Wafer self-rotation and edge detection: When the wafer tilts to the vertical state, during the continuous rotation of the ring frame 31, the internal gear ring 384 and the face gear 385 gradually come into contact and mesh. Driven by the face gear 385, the internal gear ring 384 drives the vacuum chuck 35 to rotate, so that the wafer rotates in the vertical state. During the self-rotation process of the wafer, the camera 20 takes pictures of the edge of the wafer to ensure that the defects at the edge can also be detected;

[0080] S5. Wafer reset and reinspection: When the turntable 31 continues to rotate by a certain angle, the trajectory of the cam member 50 is concave inward, reducing the pressing force on the spring 335. Under the action of the restoring force of the spring 335, the telescopic rod 334 gradually expands, driving the guide rod 333 and the inclined crank 336 to gradually move towards the center of the turntable 31. The movement of the inclined crank 336 drives the mounting seat 32 and the vacuum chuck 35 to gradually return to the horizontal state. During the wafer reset process, the camera 20 can reinspect the wafer surface to further improve the detection accuracy;

[0081] S6. End of detection: Turn off the power of the motor 381 and the vacuum pump 34, release the adsorption force of the vacuum chuck 35, remove the inspected wafer, and proceed to the next step of processing or analysis.

[0082] The above is only a preferred specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution and inventive concept of the present invention, makes equivalent substitutions or changes, and should be covered by the protection scope of the present invention.

Claims

1. A wafer defect detection device for wafer production, comprising a detection cabinet and a camera mounted on the top wall of the detection cabinet, characterized in that: The inner bottom wall of the detection cabinet is equipped with a rotating unit by opening a mounting groove, and the rotating unit includes a ring frame rotatably connected to the mounting groove, and a plurality of mounting seats are installed at the opening of the ring frame; The wafer to be inspected is fixed during the inspection process by being rotated and adsorbed by the vacuum suction cup in the mounting seat; An angle adjustment frame is mounted on the inner bottom wall of the ring frame, and the angle adjustment frame is connected to the mounting seat through an inclined crank; A support seat is installed at the bottom of the inspection cabinet, and a cam is installed in the support seat. When the angle adjustment frame follows the rotation of the ring frame, the cam drives the mounting seat to drive the wafer on the surface of the vacuum suction cup to gradually tilt from a horizontal state to a vertical state, thereby realizing the inspection of the wafer surface and edge; The angle adjustment frame includes a slide rail fixed on the inner bottom wall of the ring frame, a slider is slidably mounted on the slide rail, a guide rod having one end in contact with the outer wall of the cam member is fixed on the top of the slider, and a roller is rotatably connected to the end of the guide rod in contact with the cam member, so that the guide rod moves more smoothly on the cam member; A guide groove is provided on the outer wall of the inclined crank, and the other end of the guide rod is rotatably connected to a guide column adapted to the guide groove, and the other end of the guide rod is slidably installed in the guide groove through the guide column; A connecting seat is fixed at the center of the bottom of the mounting seat, and shaft columns are fixed on both sides of the connecting seat. One end of the shaft column is rotatably connected to a retaining seat, and one end of the retaining seat is fixed to the opening of the ring frame so that the mounting seat can be rotatably connected to the ring frame. One end of the inclined crank is fixed to the connecting seat, and when the inclined crank moves toward the edge under the drive of the guide rod, it can drive the mounting seat to gradually tilt to a vertical state; A telescopic rod is installed on one side of the slider, one end of which is fixed to the inner wall of the ring frame, and a spring is sleeved on the outer surface of the telescopic rod so that the telescopic rod can reset itself after contraction; An inner gear ring is fixedly sleeved on the outer wall of the vacuum suction cup, and a face gear meshing with the inner gear ring in a vertical state is detachably fixed on the top of the outer wall of the cam member, so that the vacuum suction cup can rotate to a vertical state under the cooperation of the guide rod and the cam member and can rotate on its own under the drive of the face gear while following the revolution of the ring frame.

2. The wafer defect detection device for wafer production according to claim 1, characterized in that: The rotating unit also includes a vacuum pump fixed on the inner wall of the ring frame, a connecting pipe is fixed on one end of the vacuum pump, one end of the connecting pipe is fixedly connected to an annular pipe, the annular pipe is fixed to the inner wall of the ring frame through a pipe clamp, a rotating joint is fixed on the bottom of the vacuum suction cup, an air pipe is fixed on the bottom end of the rotating joint, and one end of the air pipe passes through the mounting seat and is fixedly connected to the annular pipe.

3. The wafer defect detection device for wafer production according to claim 2, characterized in that: The rotating unit also includes a driving assembly, which includes a motor fixed to one side of the bottom wall of the detection cabinet, a retaining frame fixed to one side of the motor, and a driving gear rotatably connected to the retaining frame.

4. The wafer defect detection device for wafer production according to claim 3, characterized in that: The output end of the motor is spline-connected with one end of the driving gear, and an outer gear ring meshing with the driving gear is fixedly sleeved on the outer wall of the ring frame, so that the ring frame can rotate under the drive of the motor.

5. A method for detecting wafer defects for wafer production, using a wafer defect detection device for wafer production as claimed in claim 4, characterized in that: The detection method includes the following steps: S1, preparation stage: Place the wafer to be inspected on the surface of the vacuum chuck, start the vacuum pump, evacuate the vacuum chuck through the connecting pipe, annular pipe and air pipe, so that the wafer is adsorbed and fixed on the vacuum chuck, and then ensure that the camera has been correctly installed and debugged, and can clearly capture the wafer; S2, start the rotation unit: start the motor to drive the active gear to rotate, and drive the ring frame and the wafer to start rotating; S3. Wafer tilting and inspection: During the rotation of the ring frame, the guide rod rotates along the outer wall of the cam member. The shape of the cam member is designed so that the guide rod gradually moves toward the edge of the ring frame during the rotation. The movement of the guide rod drives the mounting seat together with the vacuum suction cup to gradually tilt downward to a vertical state through the cooperation of the inclined crank and the guide groove. During the wafer tilting process, the camera shoots the wafer at multiple angles to capture the scattering signals of defects with different scattering characteristics. S4. Wafer rotation and edge detection: When the wafer is tilted to a vertical state, the ring frame continues to rotate, and the inner gear ring gradually contacts and meshes with the face gear. Driven by the face gear, the inner gear ring drives the vacuum suction cup to rotate, causing the wafer to rotate in a vertical state. During the wafer rotation, the camera takes pictures of the edge of the wafer to ensure that defects at the edge can also be detected; S5. Wafer resetting and re-inspection: When the ring frame continues to rotate to a certain angle, the trajectory of the cam part becomes concave inward, reducing the resistance to the spring. Under the action of the spring restoring force, the telescopic rod gradually unfolds, driving the guide rod and the inclined crank to gradually move toward the center of the ring frame. The movement of the inclined crank drives the mounting seat and the vacuum suction cup to gradually return to a horizontal state. During the wafer resetting process, the camera can re-inspect the wafer surface to further improve the accuracy of the inspection; S6, end of detection: turn off the power of the motor and vacuum pump, release the adsorption force of the vacuum suction cup, remove the wafer after detection, and proceed to the next step of processing or analysis.

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