Packaging method and device for prolonging service life of power module, equipment and storage medium

Abstract

The invention belongs to the technical field of chip packaging, and discloses a packaging method and device for prolonging the service life of a power module, equipment and a storage medium, and the method comprises the steps: measuring a preset performance parameter value of each chip in a target power module; the value range to which the preset performance parameter value of each chip belongs is determined, each chip is divided into grades corresponding to the value range to which the chip belongs, and the number of the grades is equal to the phase number of the target power module; determining a dynamic association rule between the preset performance parameter and the calorific value; according to the dynamic association rule, sorting the calorific value corresponding to each grade of chip to form a target sequence of each grade of chip; and according to the target sequence, the chips of all grades are sequentially welded to all phases, arranged according to the preset cooling liquid circulation direction, of the target power module. According to the invention, the problem that the service life of the power module is shortened due to performance failure of the power module caused by over-high temperature during working of the power module in the prior art is solved.

Description

Technical Field

[0001] The present invention belongs to the technical field of chip packaging, and in particular relates to a packaging method, device, equipment and storage medium for improving the life of a power module. Background Art

[0002] A power module is a module that packages power electronic devices and their associated circuits together. It is mainly used for power conversion and control in power electronic equipment and has functions such as power conversion, power amplification, and motor drive and control. The power module used to drive the motor generally includes a single phase or multiple phases, corresponding to each phase of the motor.

[0003] However, the power density of the power module is relatively high. When the power module is working, the current density is large, the heat generated is large, and the module temperature rises. If the heat cannot be dissipated in time, the junction temperature of the chip inside the module will rise, causing the performance of the module to decrease as the junction temperature rises, and even causing the module to fail, affecting the service life of the entire power module. Summary of the invention

[0004] The present invention provides a packaging method, device, equipment and storage medium for improving the service life of a power module, so as to solve the problem in the prior art that the power module performance fails and the service life of the power module is reduced due to the over-high temperature of the power module during operation.

[0005] In order to solve the above technical problems, in a first aspect, the present invention provides a packaging method for improving the life of a power module, comprising:

[0006] Measuring preset performance parameter values ​​of each chip in the target power module;

[0007] Determine a value range to which a preset performance parameter value of each chip belongs, and classify each chip into a level corresponding to the value range, wherein the number of the levels is equal to the number of phases of the target power module;

[0008] Determining a dynamic correlation between the preset performance parameter and the heat value;

[0009] According to the dynamic association rule, the heat values ​​corresponding to the chips of each level are sorted to form a target sorting of the chips of each level;

[0010] The chips of each grade are sequentially welded according to the target sequence on the phases arranged according to the preset coolant flow direction on the target power module.

[0011] Optionally, the preset performance parameter is the drain-source on-resistance of the chip, and the dynamic correlation between the drain-source on-resistance of the chip and the heat generation is that the value of the drain-source on-resistance is proportional to the heat generation value.

[0012] Optionally, after ranking the heat outputs of the chips of each level according to the dynamic association rule to form a target ranking of the chips of each level, and before sequentially welding the chips of each level according to the target ranking on the phases arranged according to the preset coolant flow direction on the target power module, the method further includes:

[0013] Classifying the chips of each level in accordance with the target ranking and sequentially placing them in each phase arranged in accordance with the preset coolant flow direction on the target power module;

[0014] Determine a target patch area in a target phase of the target power module that is most severely affected by heat radiation from chips in other patch areas;

[0015] The chip with the lowest heat generation among the target-level chips corresponding to the target phase is attached to the target chip area.

[0016] Optionally, the determining of a target patch area in the target phase of the target power module that is most severely affected by the heat radiation of chips in other patch areas includes:

[0017] In a target phase of the target power module, a patch area having the most adjacent patch areas is determined as a target patch area.

[0018] Optionally, after ranking the heat outputs of the chips of each level according to the dynamic association rule to form a target ranking of the chips of each level, and before sequentially welding the chips of each level according to the target ranking on the phases arranged according to the preset coolant flow direction on the target power module, the method further includes:

[0019] Determining a sequence phase group arranged along a preset coolant flow direction on the target power module;

[0020] Based on the order of the sequence phase groups, the heat dissipation efficiency of each phase in the sequence phase groups is increased in sequence.

[0021] Optionally, sequentially increasing the heat dissipation efficiency of each phase in the sequence phase group based on the order of the sequence phase group includes:

[0022] Based on the ranking of the sequential phase groups, the thickness of the welding sheet of each phase in the sequential phase group is reduced in sequence.

[0023] Optionally, sequentially increasing the heat dissipation efficiency of each phase in the sequence phase group based on the order of the sequence phase group includes:

[0024] Based on the order of the sequential phase groups, the thermal conductivity of the solder sheet material of each phase in the sequential phase group is increased in sequence.

[0025] In a second aspect, the present invention provides a packaging device for improving the life of a power module, comprising:

[0026] A measuring module, used to measure a preset performance parameter value of each chip in the target power module;

[0027] A division module, used to determine the value range of the preset performance parameter value of each chip, and divide each chip into a level corresponding to the value range, wherein the number of the levels is equal to the number of phases of the target power module;

[0028] A determination module, used to determine the dynamic correlation between the preset performance parameter and the heat value;

[0029] A sorting module, used to sort the heat values ​​corresponding to the chips of each level according to the dynamic association rule, so as to form a target sorting for the chips of each level;

[0030] The welding module is used to weld the chips of each level in sequence according to the target sequence on the phases arranged according to the preset coolant flow direction on the target power module.

[0031] In a third aspect, the present invention provides a device for improving the life of a power module, comprising a memory and a processor, wherein:

[0032] The memory is used to store computer programs;

[0033] The processor is used to read the program in the memory and execute the steps of the packaging method for increasing the life of the power module as provided in the first aspect above.

[0034] In a fourth aspect, the present invention provides a computer-readable storage medium having a readable computer program stored thereon, which, when executed by a processor, implements the steps of the packaging method for improving the life of a power module as provided in the first aspect above.

[0035] Compared with the prior art, the packaging method for improving the life of a power module provided by the present invention has the following beneficial effects:

[0036] In the present invention, when chips of various levels are welded on the target power module in sequence according to the target order and arranged in the phases according to the preset coolant flow direction, chips of various levels are arranged in the phases in the coolant flow direction according to the amount of heat generated. Since the closer the chip is located to the front phases in the coolant flow direction, the higher the cooling degree is, and the closer the chip is located to the end phases in the coolant flow direction, the lower the cooling degree is, when chips of various levels are arranged in the phases in the coolant flow direction according to the amount of heat generated, chips that generate more heat can be arranged in the front phases in the coolant flow direction with a higher cooling degree, and chips that generate less heat can be arranged in the end phases in the coolant flow direction with a lower cooling degree. This ensures that each chip can be cooled to a suitable temperature, avoids the problem of overheating of local chip temperature, and avoids the problem of overheating of power module temperature, resulting in a short life. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only part of the embodiments of the present invention, rather than all of the embodiments. For ordinary technicians in this field, without paying creative work, other drawings obtained based on these drawings all fall within the scope of protection of the present invention.

[0038] Figure 1 The present invention provides a flow chart of a packaging method for improving the life of a power module according to an embodiment of the present invention.

[0039] Figure 2 This is another flow chart of a packaging method for improving the life of a power module provided by an embodiment of the present invention.

[0040] Figure 3 It is a schematic diagram of the structure of a power module provided in an embodiment of the present invention.

[0041] Figure 4 This is another flow chart of a packaging method for improving the life of a power module provided in an embodiment of the present invention.

[0042] Figure 5 This is another flow chart of a packaging method for improving the life of a power module provided in an embodiment of the present invention.

[0043] Figure 6 It is a schematic diagram of the chip mounting area of ​​each chip on the ceramic copper clad circuit substrate provided by an embodiment of the present invention.

[0044] Figure 7 It is a schematic diagram of the structure of a packaging device for improving the life of a power module provided by an embodiment of the present invention.

[0045] Figure 8 It is a structural schematic diagram of a computer device provided by an embodiment of the present invention.

[0046] Fig. 9 It is a schematic diagram of the structure of a computer-readable storage medium in an embodiment of the present invention. DETAILED DESCRIPTION

[0047] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0048] In order to make the description of the disclosed content more detailed and complete, the following is an illustrative description of the implementation mode and specific examples of the present invention; however, this is not the only form of implementing or applying the specific embodiments of the present invention. The implementation mode covers the features of multiple specific embodiments and the method steps and their sequence for constructing and operating these specific embodiments. However, other specific embodiments can also be used to achieve the same or equal functions and step sequences. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0049] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein.

[0050] In addition, in the description of the embodiments of the present invention, "multiple" means two or more than two, and other quantifiers are similar and should be understood. The preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention. In addition, the embodiments of the present invention and the features therein may be combined with each other without conflict.

[0051] Figure 1 A flowchart of a packaging method for improving the life of a power module provided by an embodiment of the present invention, such as Figure 1 As shown, a flowchart of a packaging method for improving the life of a power module provided by an embodiment of the present invention includes the following steps.

[0052] Step S110, measuring a preset performance parameter value of each chip in the target power module.

[0053] Specifically, the preset performance parameter value in step S110 is a parameter value that can affect the heat generation of the chip. For example, the preset performance parameter can be the number of transistors. It can be understood that the more transistors there are, the more heat the chip generates when it is working. The target power module may have one or more chips. In step S110, the preset performance parameter value needs to be measured for each chip in the target power module.

[0054] Step S120, determining the value range of the preset performance parameter value of each chip, and classifying each chip into a level corresponding to the value range, wherein the number of the levels is equal to the number of phases of the target power module.

[0055] In step S120, it can be understood that the number of phases of the target power module is equal to the number of phases of the motor driven by the target power module. For example, if the target power module drives a three-phase motor, the number of phases of the target power module is three-phase. Further, since the number of levels in step S120 is equal to the number of phases of the target power module, and each level corresponds to a value range, the number of value ranges in step S120 is equal to the number of phases of the target power module. It should be noted that when setting the value range in step S120, it is necessary to determine the maximum and minimum values ​​of all preset performance parameter values ​​after measuring the preset performance parameter values ​​of all chips in the target power module, forming the total value range of the preset performance parameter values ​​of all chips, and then divide the total value range into the value range of the number of phases of the target power module, and then determine the value range to which the preset performance parameter values ​​of each chip belong. Specifically, when dividing the value range, it is only necessary to ensure that the number of value ranges is equal to the number of phases of the target power module. As for the specific division rules of the value range, it can be set according to the needs of the application, and it is not limited in detail here.

[0056] As a specific example, there are 6 chips in the target power module, and the preset performance parameter values ​​of the 6 chips are 1, 2, 3, 4, 5 and 6 respectively. In this way, the total value range of the preset performance parameter values ​​of all chips in the target power module is determined to be 1-6, and the number of phases of the target power module is three phases, so the total value range needs to be divided into three value ranges. For example, when dividing these three value ranges, they can be divided equally, that is, the three value ranges finally divided are 1 and 2 as a value range, 3 and 4 as a value range, 5 and 6 as a value range, and each value range can correspond to a level, for example, 1 and 2 correspond to the first level, 3 and 4 correspond to the second level, and 5 and 6 correspond to the third level.

[0057] Step S130, determining the dynamic correlation between the preset performance parameter and the heat value.

[0058] Specifically, the dynamic correlation law between the preset performance parameter and the heat value in step S130 refers to the law of change of the heat value with the preset performance parameter value. Therefore, the dynamic correlation law between the preset performance parameter and the heat value in step S130 is determined by the specific preset performance parameter. The dynamic change law can be a fixed value or a relationship in which the output value changes at any time according to the specific preset performance parameter, which is not limited in detail here. When determining the dynamic correlation law between the preset performance parameter and the heat, the determination method can be any feasible method, for example, multiple preset performance parameter values ​​can be determined, and the heat value of the chip when it is at each preset performance parameter value can be measured, and then the corresponding curves can be drawn for multiple preset performance parameter values ​​and the heat value corresponding to each preset performance parameter value to obtain the dynamic correlation law between the preset performance parameter and the heat value; the dynamic correlation law between the preset performance parameter and the heat value can also be determined according to the physical properties of the preset performance parameter.

[0059] Optionally, the preset performance parameter is the drain-source on-resistance of the chip, and the dynamic correlation between the drain-source on-resistance of the chip and the heat is that the value of the drain-source on-resistance is proportional to the heat value.

[0060] It should be noted that since the drain-source on-resistance of the chip is a major factor in the heat generated by the chip, considering the preset performance parameter as the value of the drain-source on-resistance of the chip can effectively evaluate the heat generated by the chip. In addition, when it is necessary to know the heat generated by the chip, judging the heat of the chip based on the drain-source on-resistance value of the chip is more efficient than directly measuring the heat of the chip, because the drain-source on-resistance of the chip will be directly marked when leaving the factory.

[0061] It is understandable that the preset performance parameter is the drain-source on-resistance of the chip. Based on the physical properties of the resistor, it can be known that the heat value of the chip is proportional to the drain-source on-resistance of the chip.

[0062] Step S140, sorting the heat values ​​corresponding to the chips of each level according to the dynamic association rule to form a target sorting for the chips of each level.

[0063] In step S140, when the preset performance parameter values ​​of each chip in the target power module are known, the calorific value of each chip can be obtained based on the dynamic association law between the preset performance parameter values ​​and the calorific value. Since each level of chip corresponds to a value range of the preset performance parameter value, the heat corresponding to each level will also correspond to a value range. The heat corresponding to each level of chip is further sorted, and the heat can be sorted from high to low. For example, the target power module has three levels of chips, namely the first level, the second level and the third level, and after the heat of each level of chip is determined based on the preset performance parameter value of each chip, it is determined that the heat generated by the chip of the first level is greater than the heat generated by the chip of the second level, and the heat generated by the chip of the second level is greater than the heat generated by the chip of the third level, so that the target sorting of the chips of each level formed in the end is the first level-the second level-the third level.

[0064] Optional, Figure 2 A flowchart of another packaging method for improving the life of a power module provided by an embodiment of the present invention, such as Figure 2 As shown, after step S140 and before step 170, the following further includes:

[0065] Step S151, determining a sequence phase group arranged along a preset coolant flow direction on the target power module;

[0066] Step S152: based on the order of the sequence phase groups, sequentially increase the heat dissipation efficiency of each phase in the sequence phase group.

[0067] It should be noted that the preset coolant flow direction mentioned in the embodiment of the present invention is a preset coolant flow direction, and the coolant is a coolant for the target power module, which can be implemented based on the structure of the power module provided in the embodiment of the present invention. Figure 3 As shown, the power module may include three phases U, V, and W (only for example, it can be a single phase or any multi-phase), and the longitudinal structure of the power module includes: a pin assembly 310; a chip assembly, including a ceramic copper-clad substrate 321, a chip 322, and a lead 323; a heat dissipation assembly, including a metal heat dissipation base plate 331 with fins, a coolant tank 332, a coolant inlet 333, and a coolant outlet 334, and the coolant flows in a direction from the W phase to the U phase; and a welding piece 340 between the metal heat dissipation base plate 331 and the ceramic copper-clad substrate 321.

[0068] It can be understood that in step S151, in the coolant flow direction, after the coolant enters the target power module to cool the target power module, the coolant temperature gradually increases as the time of entering the target power module increases. Therefore, the coolant has the lowest temperature when it first enters the target power module, that is, when the coolant first enters the target power module, the cooling degree of the chip on the first phase of the target power module being cooled is the highest. The coolant has the highest temperature when it is about to leave the target power module, that is, when the coolant is about to leave the target power module, the cooling degree of the Nth phase of the target power module being cooled is the lowest. Therefore, the sequence phase group determined in step S151 is each phase in the target power module with cooling degree from high to low.

[0069] Furthermore, since the sequence phase group in step S151 is the phases in the target power module with cooling degree from high to low, the heat dissipation efficiency of each phase in the sequence phase group is increased in sequence according to the order of the sequence phase group in step S152, so that the phase of the target power with lower cooling degree has higher heat dissipation efficiency, thereby avoiding the problem of overheating of the power module and resulting in too short life.

[0070] Specifically, the method of increasing the heat dissipation efficiency of each phase in the sequential phase group in step S152 may be any feasible method, such as filling each phase with phase change material and using its phase change latent heat to absorb heat to achieve the effect of increasing the heat dissipation efficiency, or installing multiple heat pipes on each phase in a certain arrangement and combination to increase the heat dissipation area and heat dissipation efficiency.

[0071] Optionally, step S152 includes:

[0072] Step S1521, based on the order of the sequence phase groups, sequentially reduce the thickness of the welding sheet of each phase in the sequence phase group.

[0073] It can be understood that since the welding sheet of each phase is located between the chip of each phase of the target power module and the coolant, the thinner the welding sheet is, the easier it is for the heat of the chip to be transferred to the coolant, so that the coolant can quickly cool the chip and increase the heat dissipation efficiency.

[0074] Optionally, step S152 includes:

[0075] Step S1522: based on the order of the sequence phase groups, sequentially increase the thermal conductivity of the solder sheet material of each phase in the sequence phase group.

[0076] It can be understood that the higher the thermal conductivity of the solder sheet material, the faster it conducts heat, which can increase the heat dissipation efficiency.

[0077] Optional, Figure 4 A flowchart of another packaging method for improving the life of a power module provided by an embodiment of the present invention is shown in FIG. Figure 4 As shown, after step S140 and before step S170, the following further includes:

[0078] Step S161, classifying the chips of each level in accordance with the target ranking in order and arranged in each phase on the target power module according to the preset coolant flow direction;

[0079] Step S162, determining a target patch area in a target phase of the target power module that is most severely affected by heat radiation from chips in other patch areas;

[0080] Step S163, attaching the chip with the lowest heat generation among the target-level chips corresponding to the target phase to the target chip-attaching area.

[0081] In each phase of the target power module, there may be a situation where multiple chips need to be welded in one phase. In this case, the heating conditions of multiple chips may be different. Therefore, in this case, in the target phase of the target power module, the target patch area that is most seriously affected by the heat radiation of chips in other patch areas is determined, and the chip with the lowest heat is attached to the target patch area. This can make the heat received by each chip in the patch area belonging to the target phase more balanced, avoiding the problem that the chip with higher heat generation is further affected by the most heat radiation from other chips, which accelerates the damage of the chip.

[0082] Optional, Figure 5 FIG. 1 is a flow chart of another packaging method for improving the life of a power module according to an embodiment of the present invention. Figure 5 As shown, step S162 includes:

[0083] Step S1621 : in the target phase of the target power module, determining a patch area having the most adjacent patch areas as a target patch area.

[0084] It can be understood that when the target patch area has the most adjacent patch areas, the target chip has the most adjacent patch areas when it is pasted with the target chip, that is, it has the most adjacent chips (chips pasted on the patch area). Naturally, it is exposed to the most heat radiation from the chips. At this time, if the chip with the smallest heat generation is placed at this position, the total heat of the chip will naturally be more balanced than that of other chips, thereby balancing the lifespan of each chip.

[0085] As a specific example, Figure 6 FIG. 3 is a schematic diagram showing the chip mounting area of ​​each chip on the ceramic copper-clad substrate 321 (corresponding to one phase of the target power module). Figure 6It can be seen that the ceramic copper clad circuit substrate has 12 patch areas 610 (patch area No. 1 to patch area No. 12 respectively), among which patch area No. 2 has two adjacent patch areas, namely patch area No. 1 and patch area No. 3. Similarly, patch area No. 8, patch area No. 5 and patch area No. 11 all have two adjacent patch areas, while other patch areas have only one patch area. Therefore, patch area No. 2, patch area No. 8, patch area No. 5 and patch area No. 11 can be used as target patch areas.

[0086] Step S170, soldering the chips of each level in sequence according to the target sequence on the phases arranged according to the preset coolant flow direction on the target power module.

[0087] In step S170, when chips of various levels are welded in sequence on the target power module in each phase arranged in the preset coolant flow direction according to the target order, chips of various levels are arranged on each phase in the coolant flow direction according to the amount of heat generated. As stated above, the closer the chip is located to the front phases in the coolant flow direction, the higher the cooling degree is, and the closer the chip is located to the end phases in the coolant flow direction, the lower the cooling degree is. Therefore, when chips of various levels are arranged on each phase in the coolant flow direction according to the amount of heat generated, chips that generate more heat can be arranged in the front phases in the coolant flow direction with a higher cooling degree, and chips that generate less heat can be arranged in the end phases in the coolant flow direction with a lower cooling degree. This ensures that each chip can be cooled to a suitable temperature, avoids the problem of overheating of local chip temperature, and avoids the problem of overheating of power module temperature resulting in a short life.

[0088] Optionally, each level of chip can be treated as a separate production batch and mounted (i.e., soldered) on the ceramic copper clad circuit substrate of the target power module, and wired, and the QR code information of the ceramic copper clad circuit substrate of the target power module can be bound to the production batch, and the production batch grade code (corresponding to the chip of this grade) is assigned; further, before reflow soldering of the ceramic copper clad circuit substrate and the metal heat dissipation base plate with fins, it is necessary to scan and verify the code to ensure that the ceramic copper clad circuit substrates with different grade codes are fixedly soldered to the designated position of the metal heat dissipation base plate with fins, and then the ceramic copper clad circuit substrate with completed mounting and wire binding is reflow soldered with the metal heat dissipation base plate with fins, and then conventionally packaged into a finished module.

[0089] Based on the above packaging method for improving the life of a power module, an embodiment of the present invention provides a packaging device for improving the life of a power module, such as Figure 7 As shown, the packaging device for improving the life of the power module includes:

[0090] A measuring module 710 is used to measure a preset performance parameter value of each chip in the target power module;

[0091] A division module 720 is used to determine the value range of the preset performance parameter value of each chip, and divide each chip into a level corresponding to the value range, where the number of levels is equal to the number of phases of the target power module;

[0092] A determination module 730 is used to determine a dynamic correlation rule between the preset performance parameter and the heat value;

[0093] A sorting module 740 is used to sort the heat values ​​corresponding to the chips of each level according to the dynamic association rule to form a target sorting for the chips of each level;

[0094] The welding module 750 is used to weld the chips of each level in sequence according to the target sequence on the target power module in each phase arranged according to the preset coolant flow direction.

[0095] For other details about the implementation of the above technical solution by each module in the packaging device for improving the life of the power module, please refer to the description of the packaging method for improving the life of the power module provided in the above invention embodiment, which will not be repeated here. Each module in the packaging device for improving the life of the power module can be implemented in whole or in part by software, hardware and a combination thereof. Each of the above modules can be embedded in or independent of the processor in the computer device in the form of hardware, or can be stored in the memory of the computer device in the form of software, so that the processor can call and execute the operations corresponding to each of the above modules.

[0096] Based on the above methods to improve the life of the power module, such as Figure 8 As shown, an embodiment of the present invention further provides a schematic diagram of the structure of a packaging device for improving the life of a power module, the packaging device comprising a processor 81 and a memory 82 coupled to the processor 81. The memory 82 stores a computer program, and when the computer program is executed by the processor 81, the processor 81 executes the steps of the packaging method for improving the life of a power module in the above embodiment.

[0097] For other details about the processor 81 in the packaging device for improving the life of the power module to implement the above technical solution, please refer to the description of the packaging method for improving the life of the power module provided in the above invention embodiment, which will not be repeated here.

[0098] Among them, the processor 81 can also be called a CPU (Central Processing Unit), and the processor 81 may be an integrated circuit chip with signal processing capabilities; the processor 81 can also be a general-purpose processor, DSP (Digital Signal Process), ASIC (Application Specific Integrated Circuit), FPGA (Field Programmable Gate Array) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, among which the general-purpose processor can be a microprocessor or the processor 81 can also be any conventional processor, etc.

[0099] like Fig. 9 As shown, an embodiment of the present invention also provides a schematic diagram of the structure of a computer-readable storage medium, on which a readable computer program 91 is stored; wherein the computer program 91 can be stored in the above storage medium in the form of a software product, including a number of instructions for enabling a computer device (which can be a personal computer, a server, or a network device, etc.) or a processor to execute all or part of the steps of the method described in each embodiment of the present invention. The aforementioned storage medium includes: U disk, mobile hard disk, magnetic disk or optical disk, ROM (Read-Only Memory), RAM (Random Access Memory) and other media that can store program codes, or terminal devices such as computers, servers, mobile phones, and tablets.

[0100] In the several embodiments provided by the present invention, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of the modules is only a logical function division. There may be other division methods in actual implementation, such as multiple modules or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be an indirect coupling or communication connection through some interfaces, devices or modules, which can be electrical, mechanical or other forms.

[0101] The modules described as separate components may or may not be physically separated, and the components shown as modules may or may not be physical modules, that is, they may be located in one place or distributed on multiple network modules. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0102] In addition, each functional module in each embodiment of the present invention may be integrated into a processing module, or each module may exist physically separately, or two or more modules may be integrated into one module. The above-mentioned integrated module may be implemented in the form of hardware or in the form of a software functional module. If the integrated module is implemented in the form of a software functional module and sold or used as an independent product, it may be stored in a computer-readable storage medium.

[0103] In the above embodiments, all or part of the embodiments may be implemented by software, hardware, firmware or any combination thereof. When implemented by software, all or part of the embodiments may be implemented in the form of a computer program product.

[0104] The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, the process or function described in the embodiment of the present invention is generated in whole or in part. The computer may be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions may be stored in a computer-readable storage medium, or transmitted from one computer-readable storage medium to another computer-readable storage medium. For example, the computer instructions may be transmitted from one website site, computer, server or data center to another website site, computer, server or data center by wired (e.g., coaxial cable, optical fiber, digital subscriber line) or wireless (e.g., infrared, wireless, microwave, etc.) means. The computer-readable storage medium may be any available medium that a computer can store or a data storage device such as a server or data center that includes one or more available media integrated. The available medium may be a magnetic medium (e.g., a floppy disk, a hard disk, a tape), an optical medium), or a semiconductor medium (e.g., an SSD (solid state disk, solid state hard disk)).

[0105] The technical solution provided by the present invention is introduced in detail above. The present invention applies specific examples to illustrate the principle and implementation mode of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. At the same time, for those skilled in the art, according to the idea of ​​the present invention, there will be changes in the specific implementation mode and application scope. In summary, the content of this specification should not be understood as limiting the present invention.

[0106] Those skilled in the art will appreciate that embodiments of the present invention may be provided as methods, systems, or computer program products. Therefore, the present invention may take the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware. Moreover, the present invention may take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage, optical storage, etc.) containing computer-usable program code.

[0107] The present invention is described with reference to flowcharts and / or block diagrams of methods, devices (systems), and computer program products according to the present invention. It should be understood that each process and / or block in the flowchart and / or block diagram, as well as the combination of processes and / or blocks in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0108] These computer program instructions may also be stored in a computer-readable memory capable of directing a computer or other programmable data processing device to operate in a specific manner, so that the instructions stored in the computer-readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 A process or multiple processes and / or boxes Figure 1 A function specified in one or more boxes.

[0109] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operating steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing instructions for implementing the process. Figure 1 A process or multiple processes and / or boxes Figure 1 The steps for the functions specified in one or more boxes.

[0110] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A packaging method for improving the life of a power module, characterized in that: include: Measuring preset performance parameter values ​​of each chip in the target power module; Determine a value range to which a preset performance parameter value of each chip belongs, and classify each chip into a level corresponding to the value range, wherein the number of the levels is equal to the number of phases of the target power module; Determining a dynamic correlation between the preset performance parameter and the heat value; According to the dynamic association rule, the heat values ​​corresponding to the chips of each level are sorted to form a target sorting of the chips of each level; The chips of each grade are sequentially welded according to the target sequence on the phases arranged according to the preset coolant flow direction on the target power module.

2. The packaging method for improving the life of a power module according to claim 1, characterized in that: The preset performance parameter is the drain-source on-resistance of the chip, and the dynamic correlation between the drain-source on-resistance of the chip and the heat generation is that the value of the drain-source on-resistance is proportional to the heat generation value.

3. The packaging method for improving the life of a power module according to claim 1, characterized in that: After ranking the heat outputs of the chips of each level according to the dynamic association rule to form a target ranking of the chips of each level, and before sequentially welding the chips of each level according to the target ranking on the phases arranged according to the preset coolant flow direction on the target power module, the method further includes: Classifying the chips of each level in accordance with the target ranking and sequentially placing them in each phase arranged in accordance with the preset coolant flow direction on the target power module; Determine a target patch area in a target phase of the target power module that is most severely affected by heat radiation from chips in other patch areas; The chip with the lowest heat generation among the target-level chips corresponding to the target phase is attached to the target chip area.

4. The packaging method for improving the life of a power module according to claim 1, characterized in that: The step of determining, in the target phase of the target power module, a target patch area that is most severely affected by the heat radiation of chips in other patch areas, comprises: In a target phase of the target power module, a patch area having the most adjacent patch areas is determined as a target patch area.

5. The packaging method for improving the life of a power module according to claim 1, characterized in that: After ranking the heat outputs of the chips of each level according to the dynamic association rule to form a target ranking of the chips of each level, and before sequentially welding the chips of each level according to the target ranking on the phases arranged according to the preset coolant flow direction on the target power module, the method further includes: Determining a sequence phase group arranged along a preset coolant flow direction on the target power module; Based on the order of the sequence phase groups, the heat dissipation efficiency of each phase in the sequence phase groups is increased in sequence.

6. The packaging method for improving the life of a power module according to claim 5, characterized in that: The step of sequentially increasing the heat dissipation efficiency of each phase in the sequence phase group based on the order of the sequence phase group includes: Based on the ranking of the sequential phase groups, the thickness of the welding sheet of each phase in the sequential phase group is reduced in sequence.

7. The packaging method for improving the life of a power module according to claim 5, characterized in that: The step of sequentially increasing the heat dissipation efficiency of each phase in the sequence phase group based on the order of the sequence phase group includes: Based on the order of the sequential phase groups, the thermal conductivity of the solder sheet material of each phase in the sequential phase group is increased in sequence.

8. A packaging device for improving the life of a power module, characterized in that: include: A measurement module, used to measure the preset performance parameter value of each chip in the target power module; A division module, used to determine the value range of the preset performance parameter value of each chip, and divide each chip into a level corresponding to the value range, wherein the number of the levels is equal to the number of phases of the target power module; A determination module, used to determine the dynamic correlation between the preset performance parameter and the heat value; A sorting module, used to sort the heat values ​​corresponding to the chips of each level according to the dynamic association rule, so as to form a target sorting for the chips of each level; The welding module is used to weld the chips of each level in sequence according to the target sequence on the phases arranged according to the preset coolant flow direction on the target power module.

9. A computer device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that: When the processor executes the computer program, the steps of the packaging method for improving the life of a power module as claimed in any one of claims 1 to 7 are implemented.

10. A computer-readable storage medium storing a computer program, characterized in that: When the computer program is executed by a processor, the steps of the packaging method for improving the life of a power module as claimed in any one of claims 1 to 7 are implemented.

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