Chip packaging positioning fixture and use method thereof

Abstract

The present invention relates to the field of chip packaging positioning technology, and in particular to a chip packaging positioning jig and a method for using the same. A working groove is provided on one side wall of the positioning base; a chip positioning mechanism is provided in the working groove. The present invention controls the adjacent connecting magnetic columns to move toward the opposite side, so that the elastic sheet is compressed. Since the elastic sheet is wavy, its width increases during the compression process and extends out of the connecting groove, so that the corresponding contact sheet can contact the connection point of the chip and reduce the size of the outlet to prevent the chip from falling. At the same time, when the two groups of connecting magnetic columns move to the bottom of the detection cavity, the lifting magnetic plate is pushed by magnetism to drive several groups of detection probes to extend from the four groups of telescopic through grooves and contact the pins of the packaging substrate, thereby realizing functional detection when the chip and the packaging substrate are pasted, and improving the working stability of the positioning jig while improving the use effect of the positioning jig on chip packaging.

Description

Technical Field

[0001] The present invention belongs to the technical field of chip packaging and positioning, and in particular relates to a chip packaging and positioning jig and a method for using the same. Background Art

[0002] Chip packaging is the fundamental level of integrated circuit packaging. It refers to the process of electrically connecting a single chip to the package substrate or lead frame, physically protecting it, and forming external pins. During chip packaging, a positioning fixture is usually required to position the chip and package substrate.

[0003] After searching, in the prior art, Chinese patent announcement number: CN114068378A, announcement date: 2022-02-18, discloses a chip packaging positioning jig, including a control base, a main platform fixedly installed on the control base, a positioning platform and a vertical plate fixedly installed on the main platform, and a positioning column fixedly installed on the positioning platform, a positioning groove provided on the positioning platform, and an air vent provided on the positioning groove, a through-hole hanging rope installed in the air vent, an air intake pipe fixedly connected to the control base, and a main through pipe fixedly connected to the air intake pipe, a diversion pipe connected to the main through pipe, and a positioning structure with a segmented working function connected to the diversion pipe; the invention adds a positioning structure around the positioning groove on the surface of the jig, and uses the positioning structure to position the chip placed in the positioning groove, ensuring the smooth progress of the chip packaging process. Through a chip packaging positioning method, the operating process of the positioning jig can be standardized, the coordinated work of the positioning structure in the jig can be ensured, and the stable packaging of the chip can be completed.

[0004] However, the positioning fixture still has the following defects:

[0005] When the chip is pasted on the packaging substrate, it is impossible to immediately detect whether the chip can work normally. Functional testing needs to be performed after the chip is packaged, which reduces the effectiveness of the positioning fixture in chip packaging. Summary of the Invention

[0006] In response to the above problems, the present invention provides a chip packaging positioning fixture, comprising a positioning base, a working groove being formed on one side wall of the positioning base; a chip positioning mechanism being provided in the working groove; and a substrate positioning mechanism for calibrating and positioning a packaging substrate being provided directly below the chip positioning mechanism.

[0007] The chip positioning mechanism includes several groups of auxiliary positioning components;

[0008] The auxiliary positioning assembly includes a second mounting frame for calibrating the positioning chip; a group of connecting grooves are respectively formed on the inner walls of the four sides of the second mounting frame; each group of the connecting grooves is provided with two groups of connecting magnetic pillars; a group of elastic sheets are provided between the two corresponding groups of connecting magnetic pillars; the elastic sheets are wavy, and a plurality of groups of connecting contact sheets capable of connecting to the chip are evenly spaced on a side wall close to the second positioning plate;

[0009] Four groups of detection cavities are provided in the second mounting frame; each group of the detection cavities is connected to a group of lifting magnetic plates in a vertical sliding direction; each group of the lifting magnetic plates is provided with a group of guide blocks on the top; each group of the guide blocks is provided with several groups of detection probes connected to the packaging substrate on the top.

[0010] Furthermore, the top of the working groove is an open structure; the chip positioning mechanism and the substrate positioning mechanism are transmission connected; a circulating motor is provided on one side wall of the positioning base; the output end of the circulating motor is transmission connected to the chip positioning mechanism; a mounting groove is provided on one side wall of the positioning base; an auxiliary unloading mechanism is movable through the mounting groove; two groups of limiting magnets are symmetrically provided at the two side edges of the top of the mounting groove.

[0011] Furthermore, a first working groove is provided on one side wall of the positioning base; an air guide cavity is provided on an inner wall of one side of the mounting groove; several groups of first electric push rods are provided on the inner wall of the air guide cavity away from the auxiliary unloading mechanism; the output ends of several groups of the first electric push rods are transmission-connected with air guide plates; several groups of limiting connecting pipes are provided at equal intervals on a side wall of the air guide plate close to the auxiliary unloading mechanism; one end of each group of limiting connecting pipes away from the air guide plate is movable and passes through the auxiliary unloading mechanism; a refrigerator is provided on the inner wall of the air guide cavity away from the auxiliary unloading mechanism.

[0012] Furthermore, the chip positioning mechanism also includes a rotating shaft; a plurality of groups of mounting blocks are distributed in a circular array on the outer wall of the rotating shaft; a plurality of groups of chip positioning grooves are evenly spaced on the side wall of each group of mounting blocks away from the rotating shaft; each group of auxiliary positioning components is installed in a corresponding group of chip positioning grooves; and a group of telescopic suction cups is provided in each group of chip positioning grooves.

[0013] Furthermore, the substrate positioning mechanism includes a rotating column; a plurality of groups of substrate positioning grooves are distributed in a circular array on the outer wall of the rotating column; a group of first positioning plates capable of calibrating and positioning the packaged substrate are provided on the four inner walls of each group of substrate positioning grooves; a group of adsorption holes are provided on the inner wall of one side of each group of substrate positioning grooves close to the axis of the rotating column; an adsorption chamber is provided in the rotating column; the adsorption chamber is connected to the plurality of groups of adsorption holes; and a closed magnetic plate is provided in the adsorption chamber.

[0014] Furthermore, the auxiliary unloading mechanism includes a first mounting frame; the first mounting frame is U-shaped; a conveyor belt is provided on the bottom inner wall of the first mounting frame; a cooling groove and a second working groove are respectively provided on the inner walls on both sides of the first mounting frame; the second working groove is connected to the first working groove.

[0015] Furthermore, a plurality of groups of air guide holes are provided at equal intervals on a side wall of the cooling tank away from the second working tank; each group of the limiting connecting tubes is movable through a corresponding group of air guide holes; a plurality of groups of second electric push rods are symmetrically provided on the inner walls on both sides of the first mounting frame; a group of guide plates are transmission-connected to the output ends of the plurality of groups of the second electric push rods on the same side; a plurality of groups of guide rollers are respectively provided at equal intervals on the side walls opposite to each other of the two groups of guide plates.

[0016] Furthermore, the second mounting frame is in the shape of a U-shaped character; a group of second positioning plates are respectively provided on the inner walls of the four sides of the bottom of the second mounting frame; a group of telescopic slots are respectively provided on the edges of the four sides of the top of the second mounting frame; each group of the detection cavities is connected to a corresponding group of telescopic slots.

[0017] Furthermore, several groups of reset springs are symmetrically provided on the top of each group of lifting magnetic plates; the top of each group of reset springs is connected to the top of a corresponding group of detection cavities; the top of each group of lifting magnetic plates is provided with a group of guide blocks; the top of each group of guide blocks is damped and slidingly connected with several groups of detection probes; each group of detection probes is electrically connected to a corresponding group of connecting contacts.

[0018] A method for using a chip packaging positioning fixture, the method comprising:

[0019] Placing several groups of chips in a chip positioning mechanism;

[0020] placing a plurality of groups of package substrates in a substrate positioning mechanism;

[0021] Controlling the chip positioning mechanism to drive the substrate positioning mechanism to rotate so that the chip is transferred to the top of the packaging substrate;

[0022] Controlling two adjacent groups of connecting magnetic columns to move toward opposite sides, compressing the elastic sheet, so that several groups of connecting contact sheets are connected to the chip;

[0023] The two adjacent groups of connecting magnetic pillars move to the bottom of the corresponding lifting magnetic plate, and the lifting magnetic plate is pushed by magnetic force to drive several groups of detection probes to extend and connect to the packaging substrate;

[0024] Controlling the chip positioning mechanism to stick the chip on the packaging substrate;

[0025] Complete chip packaging positioning work.

[0026] The beneficial effects of the present invention are:

[0027] 1. By controlling the adjacent connecting magnetic columns to move toward the opposite side, the elastic sheet is compressed. Since the elastic sheet is wavy, its width increases during the compression process and extends out of the connecting slot, so that the corresponding contact piece can contact the connection point of the chip and reduce the outlet size to prevent the chip from falling. At the same time, when the two groups of connecting magnetic columns move to the bottom of the detection cavity, the magnetic lifting magnetic plate drives several groups of detection probes to extend from the four groups of telescopic slots and contact the pins of the packaging substrate, realizing functional detection when the chip and the packaging substrate are pasted, while improving the working stability of the positioning fixture and the use effect of the positioning fixture on the chip packaging work.

[0028] 2. Since the chip usually needs to be heated when it is pasted on the packaging substrate, when the corresponding groups of packaging substrates and chips are rotated to face the cooling groove, cold air is introduced through the corresponding groups of air guide holes to cool the packaging substrates and chips, so that the packaging substrates and chips can be directly unloaded when they are rotated to the bottom, avoiding the need for static cooling. At the same time, the guide plates on both sides are controlled to drive several groups of guide rollers to perform slow reciprocating motion, which can correct the position of the packaging substrates and chips, so that the unloading positions of several groups of packaging substrates and chips remain consistent, thereby improving the unloading efficiency and quality of the positioning fixture.

[0029] 3. By controlling the circulating motor to drive the rotating shaft to rotate, the rotating shaft will drive the rotating column to rotate at the same time, exposing the corresponding groups of substrate positioning grooves in the first working groove, and then placing the corresponding groups of packaging substrates in the corresponding substrate positioning grooves for calibration and positioning. When the corresponding groups of chips rotate to the bottom of the rotating shaft, the corresponding groups of packaging substrates rotate to the top of the rotating column. Since the corresponding groups of chips and the packaging substrates are correctly aligned at this time, the corresponding telescopic suction cups stick the chips to the packaging substrates, thereby realizing continuous chip packaging positioning work and improving the working efficiency of the positioning fixture.

[0030] 4. When the auxiliary unloading mechanism needs to be disassembled, several groups of first electric push rods can be controlled to drive the air guide plate to move toward the side away from the auxiliary unloading mechanism, so that several groups of limiting connecting pipes are disengaged from the corresponding groups of air guide holes. Then the first mounting frame can be directly pulled out from the side of the mounting groove to carry out corresponding repairs or maintenance work, thereby ensuring the cooling efficiency and improving the maintenance efficiency of the positioning fixture.

[0031] Other features and advantages of the present invention will be described in the following description, and in part will become apparent from the description, or will be understood by practicing the present invention. The purpose and other advantages of the present invention can be realized and obtained by the structures pointed out in the description, claims and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following is a brief introduction to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0033] Figure 1 A schematic structural diagram of a positioning fixture according to an embodiment of the present invention is shown;

[0034] Figure 2 shows a cross-sectional schematic diagram of a positioning fixture according to an embodiment of the present invention;

[0035] Figure 3 A schematic structural diagram of a chip positioning mechanism according to an embodiment of the present invention is shown;

[0036] Figure 4 A schematic structural diagram of an auxiliary positioning assembly according to an embodiment of the present invention is shown;

[0037] Figure 5 shows a cross-sectional schematic diagram of an auxiliary positioning assembly according to an embodiment of the present invention;

[0038] Figure 6 A schematic structural diagram of an elastic sheet according to an embodiment of the present invention is shown;

[0039] Figure 7 It shows a structural schematic diagram of a substrate positioning mechanism according to an embodiment of the present invention;

[0040] Figure 8 shows a schematic cross-sectional view of a substrate positioning mechanism according to an embodiment of the present invention;

[0041] Figure 9 A structural schematic diagram of an auxiliary unloading mechanism according to an embodiment of the present invention is shown.

[0042] In the figure: 1. Positioning base; 2. Working groove; 3. Chip positioning mechanism; 4. Substrate positioning mechanism; 5. Circulation motor; 6. Mounting groove; 7. Auxiliary unloading mechanism; 8. Limiting magnet; 9. First working groove; 10. Air guide cavity; 11. First electric push rod; 12. Air guide plate; 13. Limiting connecting pipe; 14. Refrigerator; 301. Rotating shaft; 302. Mounting block; 303. Chip positioning groove; 304. Auxiliary positioning assembly; 305. Telescopic suction cup; 401. Rotating column; 402. Substrate positioning groove; 403. First positioning plate; 404. Adsorption hole; 405. Adsorption cavity; 406. Enclosed magnetic plate; 701. First mounting frame; 702. Conveyor Belt; 703, cooling groove; 704, second working groove; 705, air guide hole; 706, second electric push rod; 707, guide plate; 708, guide roller; 30401, second mounting frame; 30402, second positioning plate; 30403, telescopic through groove; 30404, power chamber; 30405, third electric push rod; 30406, lead screw; 30407, transmission block; 30408, connecting groove; 30409, connecting magnetic column; 30410, elastic sheet; 30411, detection chamber; 30412, lifting magnetic plate; 30413, reset spring; 30414, guide block; 30415, detection probe; 30416, connecting contact piece. DETAILED DESCRIPTION

[0043] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0044] The embodiment of the present invention provides a chip packaging positioning fixture, including a positioning base 1. For example, Figure 1 and Figure 2As shown, a working groove 2 is provided on one side wall of the positioning base 1; the top of the working groove 2 is an open structure; a chip positioning mechanism 3 is provided in the working groove 2; a substrate positioning mechanism 4 is provided just below the chip positioning mechanism 3; the chip positioning mechanism 3 and the substrate positioning mechanism 4 are transmission-connected; a circulating motor 5 is provided on one side wall of the positioning base 1; the output end of the circulating motor 5 is transmission-connected to the chip positioning mechanism 3; a mounting groove 6 is provided on one side wall of the positioning base 1; an auxiliary blanking mechanism 7 is movably passed through the mounting groove 6; two sets of limiting magnets 8 are symmetrically provided on both side edges of the top of the mounting groove 6 ; A first working groove 9 is provided on one side wall of the positioning base 1; an air guide cavity 10 is provided on the inner wall of one side of the mounting groove 6; a plurality of groups of first electric push rods 11 are provided on the inner wall of the air guide cavity 10 away from the auxiliary unloading mechanism 7; an air guide plate 12 is connected to the output end of the plurality of first electric push rods 11 in a transmission manner; a plurality of groups of limiting connecting tubes 13 are provided at equal intervals on the side wall of the air guide plate 12 close to the auxiliary unloading mechanism 7; an end of each group of the limiting connecting tubes 13 away from the air guide plate 12 is movable and penetrates into the auxiliary unloading mechanism 7; a refrigerator 14 is provided on the inner wall of the air guide cavity 10 away from the auxiliary unloading mechanism 7.

[0045] When performing chip packaging positioning work, several groups of chips and packaging substrates are placed in the chip positioning mechanism 3 and the substrate positioning mechanism 4 for positioning respectively, and then the chip positioning mechanism 3 is controlled to stick the chip on the packaging substrate, and then the substrate positioning mechanism 4 is controlled to drive the packaging substrate and chips to perform unloading work, which facilitates the subsequent protective shell injection molding work.

[0046] For example, Figure 3 As shown, the chip positioning mechanism 3 includes a rotating shaft 301; a plurality of mounting blocks 302 are arranged in a circular array on the outer wall of the rotating shaft 301; a plurality of chip positioning grooves 303 are evenly spaced on a side wall of each mounting block 302 away from the rotating shaft 301; a group of auxiliary positioning components 304 are arranged in each group of chip positioning grooves 303; and a group of retractable suction cups 305 are arranged in each group of chip positioning grooves 303.

[0047] For example, Figure 4 and Figure 5As shown, the substrate positioning mechanism 4 includes a rotating column 401; the rotating column 401 is transmission-connected to the rotating shaft 301; a plurality of groups of substrate positioning grooves 402 are arranged in a circular array on the outer wall of the rotating column 401; a group of first positioning plates 403 are provided on the four inner walls of each group of substrate positioning grooves 402; a group of adsorption holes 404 are provided on the inner wall of one side of each group of substrate positioning grooves 402 close to the axis of the rotating column 401; an adsorption chamber 405 is provided in the rotating column 401; the adsorption chamber 405 is communicated with the plurality of groups of adsorption holes 404; a closed magnetic plate 406 is provided in the adsorption chamber 405.

[0048] When performing chip packaging positioning work, several groups of chips are placed in the chip positioning groove 303, and the corresponding groups of auxiliary positioning components 304 are controlled to calibrate and position the chips. Then, the circulating motor 5 is controlled to drive the rotating shaft 301 to rotate. At the same time, the rotating shaft 301 will drive the rotating column 401 to rotate, exposing the corresponding groups of substrate positioning grooves 402 to the first working groove 9. Then, several groups of packaging substrates are placed in the corresponding substrate positioning grooves 402. First, the adsorption holes 404 generate a slight adsorption force on the packaging substrate to prevent the packaging substrate from falling. Then, the four groups of first positioning plates 403 in each group of substrate positioning grooves 402 calibrate and position the corresponding packaging substrate. When the corresponding groups of chips rotate to the bottom of the rotating shaft 301, the corresponding groups of packaging substrates rotate to the top of the rotating column 401. Since the corresponding groups of chips and the packaging substrates are correctly aligned at this time, the auxiliary positioning components 304 are controlled to release the restriction on the chips, and the corresponding telescopic suction cups 305 stick the chips to the packaging substrates, thereby realizing continuous chip packaging positioning work and improving the working efficiency of the positioning fixture. Under the magnetic action of the two sets of limiting magnets 8, the closed magnetic plate 406 always remains at the bottom of the adsorption chamber 405. When the corresponding groups of packaging substrates and chips rotate to the bottom of the rotating column 401, the closed magnetic plate 406 will close the corresponding groups of adsorption holes 404, so that the corresponding packaging substrates and chips will fall into the auxiliary unloading mechanism 7 for unloading.

[0049] For example, Figure 6As shown, the auxiliary unloading mechanism 7 includes a first mounting frame 701; the first mounting frame 701 is U-shaped; a conveyor belt 702 is provided on the bottom inner wall of the first mounting frame 701; a cooling groove 703 and a second working groove 704 are respectively provided on the inner walls on both sides of the first mounting frame 701; the second working groove 704 is connected to the first working groove 9; a plurality of groups of air guide holes 705 are equally spaced on the side wall of the cooling groove 703 away from the second working groove 704; each group of the limiting connecting tubes 13 are movable through the corresponding group of air guide holes 705; a plurality of groups of second electric push rods 706 are symmetrically provided on the inner walls on both sides of the first mounting frame 701; a group of guide plates 707 are transmission-connected to the output ends of the plurality of groups of the second electric push rods 706 on the same side; a plurality of groups of guide rollers 708 are equally spaced on the opposite side walls of the two groups of guide plates 707.

[0050] During chip packaging and positioning, since the chip typically needs to be heated when attached to the packaging substrate, when the corresponding plurality of packaging substrates and chips rotate toward the cooling slot 703, cold air is introduced through the corresponding plurality of air guide holes 705 to cool the packaging substrates and chips. This allows the packaging substrates and chips to be directly unloaded when they rotate downward, avoiding the need for static cooling. Simultaneously, the guide plates 707 on both sides are controlled to drive the plurality of guide rollers 708 to perform slow reciprocating motion, which can correct the position of the packaging substrates and chips, ensuring that the unloading positions of the plurality of packaging substrates and chips remain consistent, thereby improving the unloading efficiency and quality of the positioning jig. When the auxiliary unloading mechanism 7 needs to be disassembled, the plurality of first electric push rods 11 can be controlled to drive the air guide plates 12 to move toward the side away from the auxiliary unloading mechanism 7, allowing the plurality of limit connecting tubes 13 to disengage from the corresponding plurality of air guide holes 705. Subsequently, the first mounting frame 701 can be directly pulled out from the side of the mounting slot 6 for corresponding repair or maintenance work, thereby ensuring cooling efficiency while improving the maintenance efficiency of the positioning jig.

[0051] For example, Figure 7 、 Figure 8 and Figure 9As shown, the auxiliary positioning component 304 includes a second mounting frame 30401; the second mounting frame 30401 is in a shape of a Chinese character 'hui'; on the inner walls of the four sides of the bottom of the second mounting frame 30401, a set of second positioning plates 30402 are respectively provided; at the edges of the four sides of the top of the second mounting frame 30401, a set of telescopic through grooves 30403 are respectively provided; four power chambers 30404 are provided inside the second mounting frame 30401; on the inner wall of each power chamber 30404 close to the second positioning plate 30402, a number of third electric push rods 30405 are provided; the output end of each third electric push rod 30405 is in transmission connection with a corresponding set of second positioning plates 30402; two sets of screw rods 30406 are provided in each power chamber 30404; one ends of the corresponding two sets of screw rods 30406 are fixedly connected, and the other ends are respectively rotatably connected to the inner walls on both sides of the corresponding power chamber 30404; the thread directions of the corresponding two sets of screw rods 30406 are opposite, and the central axes are on the same straight line; two sets of transmission blocks 30407 are slidably connected to the top inner wall of each power chamber 30404; each transmission block 30407 is threadedly connected to a corresponding set of screw rods 30406; a set of connection grooves 30408 are respectively formed on the inner walls of the four sides of the second mounting frame 30401; one end of each transmission block 30407 extends into a corresponding set of connection grooves 30408 and is in transmission connection with a set of connection magnetic columns 30409; a set of elastic sheets 30410 are provided between the corresponding two sets of connection magnetic columns 30409; the elastic sheet 30410 is in a wave shape, and a number of connection contact pieces 30416 are evenly arranged on the side wall close to the second positioning plate 30402; four detection chambers 30411 are provided inside the second mounting frame 30401; each detection chamber 30411 is communicated with a corresponding set of telescopic through grooves 30403; a set of lifting magnetic plates 30412 are slidably connected in each detection chamber 30411 along the vertical direction; a number of reset springs 30413 are symmetrically provided on the top of each lifting magnetic plate 30412; the top of each reset spring 30413 is connected to the top of the corresponding detection chamber 30411; a set of guiding blocks 30414 are provided on the top of each lifting magnetic plate 30412; a number of detection probes 30415 are damping slidably connected to the top of each guiding block 30414; each detection probe 30415 is electrically connected to a corresponding set of connection contact pieces 30416.

[0052] When performing chip packaging and positioning work, several groups of chips are placed in the second mounting frame 30401, and several groups of third electric push rods 30405 drive four groups of second positioning plates 30402 to calibrate and position the chips. Then, when several groups of chips are rotated to the bottom, the screw rod 30406 is controlled to rotate. Under the threaded connection relationship between the screw rod 30406 and the transmission block 30407, the two adjacent groups of transmission blocks 30407 can drive the adjacent connecting magnetic columns 30409 to move toward the opposite side, so that the elastic sheet 30410 is compressed. Since the elastic sheet 30410 is wavy, its width changes during the compression process. The large connecting groove 30408 is extended, so that the corresponding contact piece can contact the connection point of the chip. At the same time, when the two groups of connecting magnetic pillars 30409 move to the bottom of the detection cavity 30411, the lifting magnetic plate 30412 is pushed by magnetism to drive several groups of detection probes 30415 to extend from the four groups of telescopic grooves 30403 and contact the pins of the packaging substrate. This not only realizes the functional detection when the chip and the packaging substrate are pasted, but also the extension of the elastic piece 30410 can reduce the size of the outlet to prevent the chip from falling during transfer, thereby improving the working stability of the positioning fixture and the use effect of the positioning fixture on the chip packaging work.

[0053] By controlling the adjacent connecting magnetic pillars 30409 to move toward the opposite side, the elastic sheet 30410 is compressed. Since the elastic sheet 30410 is wavy, its width increases during the compression process and extends out of the connecting groove 30408, so that the corresponding contact piece can contact the connection point of the chip. At the same time, when the two groups of connecting magnetic pillars 30409 move to the bottom of the detection cavity 30411, the magnetic lifting magnetic plate 30412 is used to drive several groups of detection probes 30415 to extend from the four groups of telescopic through grooves 30403 and contact the pins of the packaging substrate. This not only realizes the functional detection of the chip and the packaging substrate when they are pasted, but also the extension of the elastic sheet 30410 can reduce the size of the outlet to prevent the chip from falling during transfer, thereby improving the working stability of the positioning fixture and the use effect of the positioning fixture on the chip packaging work.

[0054] Since the chip usually needs to be heated when it is pasted on the packaging substrate, when the corresponding groups of packaging substrates and chips rotate to face the cooling groove 703, cold air is introduced through the corresponding groups of air guide holes 705 to cool the packaging substrates and chips, so that the packaging substrates and chips can be directly unloaded when they rotate to the bottom, avoiding the need for static cooling. At the same time, the guide plates 707 on both sides are controlled to drive the groups of guide rollers 708 to perform slow reciprocating motion, which can correct the position of the packaging substrates and chips, so that the unloading positions of the groups of packaging substrates and chips remain consistent, thereby improving the unloading efficiency and quality of the positioning fixture.

[0055] By controlling the circulating motor 5 to drive the rotating shaft 301 to rotate, the rotating shaft 301 will drive the rotating column 401 to rotate, and the corresponding groups of substrate positioning grooves 402 will be exposed in the first working groove 9. Then, the corresponding groups of packaging substrates will be placed in the corresponding substrate positioning grooves 402 for calibration and positioning. When the corresponding groups of chips rotate to the bottom of the rotating shaft 301, the corresponding groups of packaging substrates rotate to the top of the rotating column 401. Since the corresponding groups of chips and the packaging substrates are correctly aligned at this time, the corresponding telescopic suction cup 305 will stick the chips to the packaging substrate, thereby realizing continuous chip packaging positioning work and improving the working efficiency of the positioning fixture.

[0056] When the auxiliary unloading mechanism 7 needs to be disassembled, several groups of first electric push rods 11 can be controlled to drive the air guide plate 12 to move toward the side away from the auxiliary unloading mechanism 7, so that several groups of limiting connecting tubes 13 are disengaged from the corresponding groups of air guide holes 705. Then the first mounting frame 701 can be directly pulled out from the side of the mounting groove 6 to carry out corresponding repairs or maintenance work, thereby improving the maintenance efficiency of the positioning fixture while ensuring the refrigeration efficiency.

[0057] Based on the above-mentioned chip packaging positioning fixture, an embodiment of the present invention further provides a method for using the chip packaging positioning fixture. Exemplarily, the method includes:

[0058] Placing several groups of chips in a chip positioning mechanism;

[0059] placing a plurality of groups of package substrates in a substrate positioning mechanism;

[0060] Controlling the chip positioning mechanism to drive the substrate positioning mechanism to rotate so that the chip is transferred to the top of the packaging substrate;

[0061] Controlling two adjacent groups of connecting magnetic columns to move toward opposite sides, compressing the elastic sheet, so that several groups of connecting contact sheets are connected to the chip;

[0062] The two adjacent groups of connecting magnetic pillars move to the bottom of the corresponding lifting magnetic plate, and the lifting magnetic plate is pushed by magnetic force to drive several groups of detection probes to extend and connect to the packaging substrate;

[0063] Controlling the chip positioning mechanism to stick the chip on the packaging substrate;

[0064] Complete chip packaging positioning work.

[0065] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A chip packaging positioning fixture, comprising a positioning base, characterized in that: A working groove is provided on one side wall of the positioning base; a chip positioning mechanism is provided in the working groove; and a substrate positioning mechanism for calibrating and positioning the packaging substrate is provided directly below the chip positioning mechanism. The chip positioning mechanism includes several groups of auxiliary positioning components; The auxiliary positioning assembly includes a second mounting frame for calibrating the positioning chip; a group of connecting grooves are respectively formed on the inner walls of the four sides of the second mounting frame; each group of the connecting grooves is provided with two groups of connecting magnetic pillars; a group of elastic sheets are provided between the two corresponding groups of connecting magnetic pillars; the elastic sheets are wavy, and a plurality of groups of connecting contact sheets capable of connecting to the chip are evenly spaced on a side wall close to the second positioning plate; Four groups of detection chambers are provided in the second mounting frame; a group of lifting magnetic plates is vertically slidably connected to each group of detection chambers; a group of guide blocks is provided on the top of each group of lifting magnetic plates; a plurality of groups of detection probes connected to the packaging substrate are provided on the top of each group of guide blocks; each group of detection probes is electrically connected to a corresponding group of connection contacts; The adjacent connecting magnetic pillars move toward the opposite side, causing the elastic sheet to be compressed. Since the elastic sheet is wavy, its width increases during the compression process and extends out of the connecting slot, so that the corresponding contact piece can contact the connection point of the chip. At the same time, when the two groups of connecting magnetic pillars move to the bottom of the detection cavity, the magnetic lifting magnetic plate drives several groups of detection probes to extend from the four groups of telescopic slots and contact the pins of the packaging substrate.

2. The chip packaging positioning jig according to claim 1, characterized in that: The top of the working tank is an open structure; the chip positioning mechanism and the substrate positioning mechanism are transmission connected; a circulating motor is provided on one side wall of the positioning base; the output end of the circulating motor is transmission connected to the chip positioning mechanism; a mounting slot is provided on one side wall of the positioning base; an auxiliary unloading mechanism is movably inserted into the mounting slot; two sets of limiting magnets are symmetrically provided at the two side edges of the top of the mounting slot.

3. The chip packaging positioning jig according to claim 2, characterized in that: A first working groove is provided on one side wall of the positioning base; an air guide cavity is provided on an inner wall of one side of the mounting groove; a plurality of groups of first electric push rods are provided on an inner wall of the air guide cavity away from the auxiliary unloading mechanism; an air guide plate is transmission-connected to the output ends of the plurality of first electric push rods; a plurality of groups of limiting connecting tubes are provided at equal intervals on a side wall of the air guide plate close to the auxiliary unloading mechanism; an end of each group of limiting connecting tubes away from the air guide plate is movable and passes through the auxiliary unloading mechanism; a refrigerator is provided on an inner wall of the air guide cavity away from the auxiliary unloading mechanism.

4. The chip packaging positioning jig according to claim 1, characterized in that: The chip positioning mechanism also includes a rotating shaft; a plurality of groups of mounting blocks are distributed in a circular array on the outer wall of the rotating shaft; a plurality of groups of chip positioning grooves are evenly spaced on a side wall of each group of mounting blocks away from the rotating shaft; each group of auxiliary positioning components is installed in a corresponding group of chip positioning grooves; and a group of telescopic suction cups is provided in each group of chip positioning grooves.

5. The chip packaging positioning jig according to claim 1, characterized in that: The substrate positioning mechanism includes a rotating column; a number of groups of substrate positioning grooves are arranged in a circular array on the outer wall of the rotating column; a set of first positioning plates capable of calibrating and positioning the packaged substrate are provided on the inner walls of the four sides of each group of substrate positioning grooves; a set of adsorption holes are opened on the inner wall of each group of substrate positioning grooves close to the axis of the rotating column; an adsorption cavity is arranged inside the rotating column; the adsorption cavity is communicated with a number of groups of adsorption holes; a closed magnetic plate is arranged inside the adsorption cavity.

6. The chip packaging positioning jig according to claim 3, characterized in that: The auxiliary blanking mechanism includes a first installation frame; the first installation frame is U-shaped; a conveyor belt is provided on the bottom inner wall of the first installation frame; cooling grooves and second working grooves are respectively opened on the inner walls of the two sides of the first installation frame; the second working groove is communicated with the first working groove.

7. The chip packaging positioning jig according to claim 6, characterized in that: A number of groups of air guide holes are equidistantly opened on one side wall of the cooling groove away from the second working groove; each group of limit connecting pipes movably penetrates through a corresponding group of air guide holes; a number of groups of second electric push rods are symmetrically arranged on the inner walls of the two sides of the first installation frame; a guide plate is传动连接 with the output ends of a number of groups of second electric push rods on the same side; a number of groups of guide rollers are respectively arranged on the opposite side walls of the two guide plates at equal intervals.

8. The chip packaging positioning jig according to claim 1, characterized in that: The second installation frame is in a shape of a Chinese character 'hui'; a set of second positioning plates are respectively arranged on the bottom inner walls of the four sides of the second installation frame; a set of telescopic through grooves are respectively arranged at the four side edges of the top of the second installation frame; each group of detection cavities is communicated with a corresponding group of telescopic through grooves.

9. The chip packaging positioning jig according to claim 8, characterized in that: A number of groups of reset springs are symmetrically arranged on the top of each group of lifting magnetic plates; the tops of each group of reset springs are connected to the top of the corresponding group of detection cavities.

10. A method for using the chip packaging positioning fixture according to any one of claims 1 to 9, characterized in that: The usage method includes: Placing a number of groups of chips in the chip positioning mechanism; Placing a number of groups of packaged substrates in the substrate positioning mechanism; Controlling the chip positioning mechanism to drive the substrate positioning mechanism to rotate so that the chips are transferred to directly above the packaged substrates; Controlling adjacent two groups of connecting magnetic columns to move towards the opposite sides, compressing the elastic sheets, so that a number of groups of connecting contact pieces are connected with the chips; The adjacent two groups of connecting magnetic columns move to directly below the corresponding lifting magnetic plates, and the lifting magnetic plates are pushed by magnetic force to drive a number of groups of detection probes to extend out and be connected with the packaged substrates; Controlling the chip positioning mechanism to paste the chips on the packaged substrates; Completing the chip packaging and positioning work.

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