Positioning device for semiconductor equipment

Abstract

The invention relates to the field of semiconductor equipment, and particularly discloses a positioning device for semiconductor equipment, which comprises a packaging testboard mechanism and a transfer mechanism, the packaging testboard mechanism comprises a packaging testboard assembly, and the upper side of the packaging testboard assembly is provided with a clamping assembly and an adsorption assembly; the transfer mechanism comprises a transfer assembly mounted on the outer side of the packaging test board assembly, and a driving assembly is further mounted on the transfer assembly; the clamping assembly comprises a first clamping piece and a second clamping piece; through cooperative work of the transfer assembly and the driving assembly, the device can automatically remove the abnormal wafer from the packaging test bench and guide the abnormal wafer to slide to a designated position for scrap treatment, and the design not only simplifies the wafer scrap process, but also reduces the difficulty and cost of manual operation; through dual effects of the clamping assembly and the adsorption assembly, the wafer is stably and reliably fixed in a packaging test process.

Description

Technical Field

[0001] The invention belongs to the field of semiconductor equipment, in particular to a positioning device for semiconductor equipment. Background Art

[0002] Semiconductor equipment is an indispensable key component of the semiconductor industry. They are used to manufacture, process and test semiconductor materials to produce various integrated circuits and chips. With the rapid development of science and technology, semiconductor equipment is also constantly evolving, from early simple processing equipment to today's high-precision, automated, and intelligent production equipment. These devices require not only high precision and high efficiency, but also high reliability and stability to ensure the quality and reliability of semiconductor products.

[0003] In the traditional wafer packaging test process, when an abnormal wafer is detected, manual intervention is required to remove it from the test bench and scrap it. This process is not only time-consuming and labor-intensive, but also prone to errors, resulting in inefficient abnormal wafer processing. Summary of the invention

[0004] In order to solve the above technical problems, the present invention provides a positioning device for semiconductor equipment to solve the problem in the prior art that when an abnormal wafer is detected during the wafer packaging test process, manual intervention is required to remove it from the test bench and scrap it. The process is not only time-consuming and labor-intensive, but also prone to errors, resulting in inefficient abnormal wafer processing.

[0005] A positioning device for semiconductor equipment, comprising a packaging test bench mechanism and a transfer mechanism:

[0006] The packaging test bench mechanism comprises a packaging test bench assembly, and a clamping assembly and an adsorption assembly are installed on the upper side of the packaging test bench assembly;

[0007] The transfer mechanism comprises a transfer assembly installed outside the packaging test bench assembly, and a drive assembly is also installed on the transfer assembly;

[0008] The clamping assembly comprises a first clamping member and a second clamping member, and the first clamping member and the second clamping member are both fixedly mounted on the packaging test bench assembly;

[0009] The adsorption assembly includes a cylinder lifting component, and an adsorption component is fixedly mounted on the cylinder lifting component;

[0010] The cylinder lifting member comprises a cylinder 2 and a connecting frame 4;

[0011] The adsorption member comprises a connecting tube, the lower end of the connecting tube is fixedly connected with a connecting nozzle, and the upper end of the connecting tube is fixedly connected with an adsorption plate;

[0012] The connecting pipe is fixedly mounted on a connecting frame four, the connecting frame four is fixedly mounted on a cylinder two, and the cylinder two is fixedly mounted on the outer side of the packaging test bench assembly.

[0013] Preferably, a driving frame is also fixedly mounted on the outer side of the connecting frame 4;

[0014] The transfer assembly includes a mounting plate, a shaft frame and a torsion spring, a guide rod is fixedly mounted on the upper side of the shaft frame, and an oblique push block is also fixedly connected to the outer side of the shaft frame;

[0015] The shaft frame is rotatably embedded in the mounting plate, one end of the torsion spring is embedded in the shaft frame, and the other end of the torsion spring is embedded in the mounting plate, and the mounting plate is fixedly installed on the outer side of the packaging test bench assembly;

[0016] The driving assembly includes a motor 2 and a set of sliders 3, one end of the slider 3 is fixedly connected to a rack, and the other end of the slider 3 is fixedly connected to a support bar on the upper side;

[0017] The second motor is fixedly mounted on the shaft frame, the third slider is slidably embedded on the guide rod, the second motor can drive the rack to drive the third slider to move, and the driving frame can drive the oblique push block to drive the shaft frame to rotate.

[0018] Preferably, the packaging test bench assembly comprises a packaging test bench body, a slide rail frame 1 is fixedly installed on the upper side of the packaging test bench body, and a group of sliders 1 are slidably connected to the slide rail frame 1;

[0019] The first clamping member comprises a double-headed cylinder, and a connecting frame 1 is fixedly installed on both output ends of the double-headed cylinder, and a connecting frame 2 is also fixedly installed on the outer side of the connecting frame 1;

[0020] The second clamping member comprises a cylinder 1, and a connecting frame 3 is fixedly mounted on the output end of the cylinder 1;

[0021] The double-head cylinder is fixedly mounted on the packaging test bench body, and the second connecting frame is slidably embedded on the first sliding block.

[0022] Preferably, an L-shaped frame is fixedly installed on the outer side of the packaging test bench body, and a set of sliders 2 are fixedly installed on both sides of the packaging test bench body;

[0023] The first cylinder is fixedly mounted on the L-shaped frame, and the second slide block is slidably embedded in the support member.

[0024] Preferably, a support assembly is also fixedly mounted on the bottom of the packaging test bench assembly;

[0025] The support assembly comprises a support member, a detection member is fixedly mounted on the upper side of the support member, and a motor lifting member is mounted on the bottom of the support member;

[0026] The second slide block is slidably mounted on the support member, and the motor lifting member can drive the packaging test bench body to move up and down.

[0027] Preferably, the support member comprises a bottom plate, a second slide rail frame is fixedly mounted on the upper end of the bottom plate, and a bottom bracket is fixedly mounted on the bottom of the bottom plate;

[0028] The second slide block is slidably embedded in the second slide rail frame.

[0029] Preferably, the detection member comprises a long frame, and a reflective sensor is fixedly mounted on the upper end of the long frame;

[0030] The long frame is fixedly mounted on the bottom plate.

[0031] Preferably, the motor lifting member comprises a motor 1 and a screw rod, the output end of the motor 1 is fixedly connected to a pulley 1, the end of the screw rod is fixedly connected to a pulley 2, the pulley 1 and the pulley 2 are connected by a belt, and a matching sliding block is also provided on the outer side of the screw rod;

[0032] The screw rod is fixedly mounted on the bottom plate through a bearing, the motor 1 is fixedly mounted on the bottom plate, and the sliding block is fixedly mounted on the packaging test bench body and can drive the packaging test bench body to move up and down.

[0033] Compared with the prior art, the present invention has the following beneficial effects:

[0034] Through the coordinated work of the transfer component and the drive component, the device can automatically remove abnormal wafers from the packaging test bench and guide them to slide to a designated position for scrapping. This design not only simplifies the wafer scrapping process, but also reduces the difficulty and cost of manual operation.

[0035] Through the dual functions of the clamping component and the adsorption component, the wafer is stably and reliably fixed during the packaging and testing process. This design not only improves the accuracy and efficiency of the packaging and testing, but also ensures the safety of the wafer during the processing process, avoiding test errors or damage caused by wafer movement or deviation. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0037] Figure 2 It is a schematic diagram of the decomposition structure of the present invention;

[0038] Figure 3 It is a structural schematic diagram of the packaging test bench mechanism of the present invention;

[0039] Figure 4 It is a structural schematic diagram of the adsorption assembly of the present invention;

[0040] Figure 5 It is a structural schematic diagram of the transfer mechanism of the present invention;

[0041] Figure 6 It is a structural schematic diagram of the packaging test bench assembly of the present invention;

[0042] Figure 7 It is a schematic diagram of the structure of the clamping assembly of the present invention;

[0043] Figure 8 It is a schematic structural diagram of the support assembly of the present invention.

[0044] In the figure: 1. packaging test bench mechanism; 11. packaging test bench assembly; 111. packaging test bench body; 112. slide rail frame 1; 113. slider 1; 114. L-shaped frame; 115. slider 2; 12. clamping assembly; 121. first clamping piece; 1211. double-headed cylinder; 1212. connecting frame 1; 1213. connecting frame 2; 122. second clamping piece; 1221. cylinder 1; 1222. connecting frame 3; 13. adsorption assembly; 131. cylinder lifting piece; 1311. cylinder 2; 1312. connecting frame 4; 132. adsorption piece; 1321. connecting pipe; 1322. connecting nozzle; 132 3. Adsorption plate; 133. Drive frame; 14. Support assembly; 141. Support member; 1411. Bottom plate; 1412. Slide frame 2; 1413. Bottom bracket; 142. Detection member; 1421. Long frame; 1422. Reflective sensor; 143. Motor lifting member; 1431. Motor 1; 1432. Screw rod; 1433. Sliding block; 2. Transfer mechanism; 21. Transfer assembly; 211. Mounting plate; 212. Axle frame; 213. Torsion spring; 214. Guide rod; 215. Oblique push block; 22. Drive assembly; 221. Motor 2; 222. Slider 3; 223. Rack; 224. Support bar. DETAILED DESCRIPTION

[0045] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0046] like Figures 1 to 5 As shown:

[0047] Embodiment 1: The present invention provides a positioning device for semiconductor equipment, including a packaging test bench mechanism 1 and a transfer mechanism 2:

[0048] The packaging test bench mechanism 1 comprises a packaging test bench assembly 11, and a clamping assembly 12 and an adsorption assembly 13 are installed on the upper side of the packaging test bench assembly 11;

[0049] The transfer mechanism 2 includes a transfer assembly 21 installed outside the packaging test bench assembly 11, and a driving assembly 22 is also installed on the transfer assembly 21;

[0050] The clamping assembly 12 includes a first clamping member 121 and a second clamping member 122, and the first clamping member 121 and the second clamping member 122 are both fixedly mounted on the packaging test bench assembly 11;

[0051] The adsorption assembly 13 includes a cylinder lifting member 131, and an adsorption member 132 is fixedly mounted on the cylinder lifting member 131;

[0052] The cylinder lifting member 131 includes a cylinder 2 1311 and a connecting frame 4 1312;

[0053] The adsorption member 132 includes a connecting tube 1321, a connecting nozzle 1322 is fixedly connected to the lower end of the connecting tube 1321, and an adsorption plate 1323 is fixedly connected to the upper end of the connecting tube 1321;

[0054] The connecting pipe 1321 is fixedly mounted on the connecting frame 4 1312, the connecting frame 4 1312 is fixedly mounted on the cylinder 2 1311, and the cylinder 2 1311 is fixedly mounted on the outer side of the packaging test bench assembly 11;

[0055] Wherein, the connection nozzle 1322 is connected to an external vacuum pump;

[0056] When the wafer is transferred to the clamping assembly 12, the clamping assembly 12 is started, and the first clamping member 121 and the second clamping member 122 are simultaneously actuated to clamp the wafer from both sides of the wafer, thereby achieving a centering effect;

[0057] After the wafer is clamped, the second cylinder 1311 is controlled to make the connecting frame 4 1312 drive the adsorption member 132 to move upward and attach to the lower side of the wafer, and the vacuum pump is started to make the adsorption plate 1323 generate suction, so that the bottom of the wafer is adsorbed on the adsorption plate 1323;

[0058] After the wafer is stably clamped and adsorbed, the packaging test operation begins;

[0059] When it is detected that there is no abnormality in the wafer, the clamping assembly 12 and the suction plate 1323 are controlled to loosen and release the wafer at the same time, and the staff can move the wafer to the next processing position or storage position through an external transfer device.

[0060] Specifically, a driving frame 133 is also fixedly mounted on the outer side of the connecting frame 1312;

[0061] The transfer assembly 21 includes a mounting plate 211, a shaft frame 212 and a torsion spring 213. A guide rod 214 is fixedly mounted on the upper side of the shaft frame 212, and an oblique push block 215 is also fixedly connected to the outer side of the shaft frame 212.

[0062] The shaft frame 212 is rotatably embedded in the mounting plate 211, one end of the torsion spring 213 is embedded in the shaft frame 212, and the other end of the torsion spring 213 is embedded in the mounting plate 211. The mounting plate 211 is fixedly installed on the outer side of the packaging test bench assembly 11;

[0063] The driving assembly 22 includes a motor 221 and a set of sliders 222. One end of the slider 222 is fixedly connected to a rack 223, and the other end of the slider 222 is fixedly connected to a support bar 224.

[0064] The second motor 221 is fixedly mounted on the shaft frame 212, and the third slider 222 is slidably embedded in the guide rod 214. The second motor 221 can drive the rack 223 to drive the third slider 222 to move, and the driving frame 133 can drive the inclined push block 215 to drive the shaft frame 212 to rotate.

[0065] As can be seen from the above, when an abnormality is detected in the wafer, the clamping assembly 12 and the adsorption plate 1323 are controlled to loosen and release the wafer at the same time, and the cylinder 2 1311 is controlled to make the connecting frame 4 1312 drive the adsorption member 132 to move upward;

[0066] The control motor 221 works so that the rack 223 drives the slider 3 222 to slide along the guide rod 214. The sliding of the slider 3 222 can make a group of support bars 224 approach each other and move to the lower side of the wafer.

[0067] The control cylinder 2 1311 causes the connecting frame 4 1312 to drive the adsorption member 132 to continue to move upward. At this time, the connecting frame 4 1312 drives the driving frame 133 to move upward. The upward movement of the driving frame 133 causes the oblique push block 215 to be pushed.

[0068] When the oblique push block 215 is pushed, the shaft frame 212 rotates around the mounting plate 211 and the torsion spring 213 is twisted;

[0069] When the shaft frame 212 rotates, the driving assembly 22 rotates, and the rotation of the driving assembly 22 can cause a set of support bars 224 to flip, and the flipping of a set of support bars 224 can cause the wafer to slide to a specified position for scrapping;

[0070] When the connecting frame 1312 drives the driving frame 133 to move downward, the torsion spring 213 is reset, which drives the shaft frame 212 to reset, so that a group of support bars 224 are reset and keep balanced.

[0071] like Figure 6 and Figure 7 As shown:

[0072] Embodiment 2: This embodiment is basically the same as the previous embodiment, except that the packaging test bench assembly 11 includes a packaging test bench body 111, a slide rail frame 112 is fixedly installed on the upper side of the packaging test bench body 111, and a group of sliders 113 are slidably connected to the slide rail frame 112;

[0073] The first clamping member 121 includes a double-headed cylinder 1211, and a connecting frame 1212 is fixedly installed on both output ends of the double-headed cylinder 1211, and a connecting frame 2 1213 is also fixedly installed on the outer side of the connecting frame 1 1212;

[0074] The second clamping member 122 includes a cylinder 1221, and a connecting frame 3 1222 is fixedly installed on the output end of the cylinder 1221;

[0075] The double-head cylinder 1211 is fixedly installed on the packaging test bench body 111 , and the second connecting frame 1213 is slidably embedded on the sliding block 113 .

[0076] Specifically, an L-shaped frame 114 is fixedly installed on the outer side of the packaging test bench body 111, and a set of sliders 115 are fixedly installed on both sides of the packaging test bench body 111;

[0077] The cylinder 1 1221 is fixedly mounted on the L-shaped frame 114, and the slider 2 115 is slidably embedded in the support member 141;

[0078] Among them, both the connecting frame 2 1213 and the connecting frame 3 1222 are provided with push rods capable of pushing the wafer and the wafer ring to move.

[0079] As can be seen from the above, controlling the operation of the double-headed cylinder 1211 can enable the connecting frame 1212 to drive the connecting frame 2 1213 to slide along the slide rail frame 112 through the slider 113. When the connecting frame 2 1213 slides, it will push the wafer and the wafer ring to the center line at the same time. At the same time, the operation of the cylinder 1221 can move the connecting frame 3 1222 to push the wafer and the wafer ring to the center position, thereby achieving a centering effect.

[0080] like Figure 2 , 3 and Figure 8 As shown:

[0081] Embodiment 3: This embodiment is basically the same as the previous embodiment, except that a support assembly 14 is fixedly mounted on the bottom of the packaging test bench assembly 11;

[0082] The support assembly 14 includes a support member 141, a detection member 142 is fixedly mounted on the upper side of the support member 141, and a motor lifting member 143 is mounted on the bottom of the support member 141;

[0083] The second slide block 115 is slidably mounted on the support member 141 , and the motor lifting member 143 can drive the packaging test bench body 111 to move up and down.

[0084] Specifically, the support member 141 includes a bottom plate 1411, a second slide rail frame 1412 is fixedly installed on the upper end of the bottom plate 1411, and a bottom bracket 1413 is fixedly installed on the bottom of the bottom plate 1411;

[0085] The second slide block 115 is slidably embedded in the second slide rail frame 1412 .

[0086] Specifically, the detection member 142 includes a long frame 1421, and a reflective sensor 1422 is fixedly mounted on the upper end of the long frame 1421;

[0087] The long frame 1421 is fixedly mounted on the bottom plate 1411 .

[0088] Specifically, the motor lifting member 143 includes a motor 1431 and a screw rod 1432. The output end of the motor 1431 is fixedly connected to a pulley 1, and the end of the screw rod 1432 is fixedly connected to a pulley 2. The pulley 1 and the pulley 2 are connected by a belt. A matching sliding block 1433 is also provided on the outer side of the screw rod 1432.

[0089] The screw rod 1432 is fixedly mounted on the bottom plate 1411 through a bearing, the motor 1431 is fixedly mounted on the bottom plate 1411, and the sliding block 1433 is fixedly mounted on the packaging test bench body 111 and can drive the packaging test bench body 111 to move up and down.

[0090] As can be seen from the above, the control motor 1431 can make the pulley 1 drive the belt to work, and then the pulley 2 drives the screw rod 1432 to rotate. The rotation of the screw rod 1432 can make the sliding block 1433 drive the packaging test bench body 111 to move up and down. When the packaging test bench body 111 moves up and down, the sliding block 115 will move along the slide rail frame 1412, thereby playing a guiding role.

[0091] The number of wafers can be detected by the reflective sensor 1422 .

[0092] The standard parts used in the present invention can all be purchased from the market, and the special-shaped parts can be customized according to the description and the drawings. The specific connection methods of each part adopt conventional means such as mature bolts, rivets, welding, etc. in the prior art. The machinery, parts and equipment all adopt conventional models in the prior art, and the circuit connection adopts the conventional connection method in the prior art, which will not be described in detail here. The contents not described in detail in this specification belong to the prior art known to professional and technical personnel in this field.

[0093] In the description of the present invention, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. "Multiple" means two or more, unless otherwise clearly and specifically defined.

[0094] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0095] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0096] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example" or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, unless they are contradictory.

[0097] In the drawings of the embodiments disclosed in the present invention, only the structures related to the embodiments disclosed in the present invention are involved, and other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of the present invention can be combined with each other.

[0098] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A positioning device for semiconductor equipment, characterized in that: It includes a packaging test bench mechanism (1) and a transfer mechanism (2): The packaging test bench mechanism (1) comprises a packaging test bench component (11), and a clamping component (12) and an adsorption component (13) are installed on the upper side of the packaging test bench component (11); The transfer mechanism (2) comprises a transfer component (21) installed outside the packaging test bench component (11), and a drive component (22) is also installed on the transfer component (21); The clamping assembly (12) comprises a first clamping member (121) and a second clamping member (122), wherein the first clamping member (121) and the second clamping member (122) are both fixedly mounted on the packaging test bench assembly (11); The adsorption assembly (13) comprises a cylinder lifting component (131), and a suction component (132) is fixedly mounted on the cylinder lifting component (131); The cylinder lifting component (131) comprises a second cylinder (1311) and a fourth connecting frame (1312); The adsorption member (132) comprises a connecting tube (1321), the lower end of the connecting tube (1321) is fixedly connected to a connecting nozzle (1322), and the upper end of the connecting tube (1321) is fixedly connected to an adsorption disk (1323); The connecting pipe (1321) is fixedly mounted on the connecting frame four (1312), the connecting frame four (1312) is fixedly mounted on the cylinder two (1311), and the cylinder two (1311) is fixedly mounted on the outside of the packaging test bench assembly (11).

2. A semiconductor device positioning device as claimed in claim 1, characterized in that: A driving frame (133) is also fixedly mounted on the outer side of the connecting frame 4 (1312); The transfer assembly (21) comprises a mounting plate (211), a shaft frame (212) and a torsion spring (213); a guide rod (214) is fixedly mounted on the upper side of the shaft frame (212); and an oblique push block (215) is also fixedly connected to the outer side of the shaft frame (212); The shaft frame (212) is rotatably embedded in the mounting plate (211), one end of the torsion spring (213) is embedded in the shaft frame (212), and the other end of the torsion spring (213) is embedded in the mounting plate (211), and the mounting plate (211) is fixedly mounted on the outside of the packaging test bench assembly (11); The driving assembly (22) comprises a second motor (221) and a group of third sliders (222), one end of the third slider (222) is fixedly connected to a rack (223), and the other end of the third slider (222) is fixedly connected to a support bar (224) on the upper side; The second motor (221) is fixedly mounted on the shaft frame (212), and the third slider (222) is slidably engaged on the guide rod (214). The second motor (221) can drive the rack (223) to drive the third slider (222) to move, and the driving frame (133) can drive the inclined push block (215) to drive the shaft frame (212) to rotate.

3. A semiconductor device positioning device as claimed in claim 2, characterized in that: The packaging test bench assembly (11) comprises a packaging test bench body (111), a slide rail frame (112) is fixedly mounted on the upper side of the packaging test bench body (111), and a group of slide blocks (113) are slidably connected to the slide rail frame (112); The first clamping member (121) comprises a double-headed cylinder (1211), and a connecting frame 1 (1212) is fixedly mounted on both output ends of the double-headed cylinder (1211), and a connecting frame 2 (1213) is also fixedly mounted on the outer side of the connecting frame 1 (1212); The second clamping member (122) comprises a cylinder one (1221), and a connecting frame three (1222) is fixedly mounted on the output end of the cylinder one (1221); The double-head cylinder (1211) is fixedly mounted on the packaging test bench body (111), and the second connecting frame (1213) is slidably engaged on the first sliding block (113).

4. A semiconductor device positioning device as claimed in claim 3, characterized in that: An L-shaped frame (114) is also fixedly installed on the outer side of the packaging test bench body (111), and a set of sliding blocks (115) are fixedly installed on both sides of the packaging test bench body (111); The cylinder 1 (1221) is fixedly mounted on the L-shaped frame (114), and the slide block 2 (115) is slidably engaged on the support member (141).

5. A semiconductor device positioning device as claimed in claim 4, characterized in that: A support assembly (14) is also fixedly mounted on the bottom of the packaging test bench assembly (11); The support assembly (14) comprises a support member (141), a detection member (142) is fixedly mounted on the upper side of the support member (141), and a motor lifting member (143) is mounted on the bottom of the support member (141); The second slide block (115) is slidably mounted on the support member (141), and the motor lifting member (143) can drive the packaging test bench body (111) to move up and down.

6. A semiconductor device positioning device as claimed in claim 5, characterized in that: The support member (141) comprises a bottom plate (1411), a second slide rail frame (1412) is fixedly mounted on the upper end of the bottom plate (1411), and a bottom bracket (1413) is fixedly mounted on the bottom of the bottom plate (1411); The second slide block (115) is slidably embedded on the second slide rail frame (1412).

7. A semiconductor device positioning device as claimed in claim 5, characterized in that: The detection member (142) comprises a long frame (1421), and a reflective sensor (1422) is fixedly mounted on the upper end of the long frame (1421); The long frame (1421) is fixedly mounted on the bottom plate (1411).

8. A semiconductor device positioning device as claimed in claim 5, characterized in that: The motor lifting member (143) comprises a motor 1 (1431) and a screw rod (1432), the output end of the motor 1 (1431) is fixedly connected to a pulley 1, the end of the screw rod (1432) is fixedly connected to a pulley 2, the pulley 1 and the pulley 2 are connected via a belt, and a matching sliding block (1433) is also provided on the outer side of the screw rod (1432); The screw rod (1432) is fixedly mounted on the bottom plate (1411) via a bearing, the motor 1 (1431) is fixedly mounted on the bottom plate (1411), and the sliding block (1433) is fixedly mounted on the packaging test bench body (111) and can drive the packaging test bench body (111) to move up and down.

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