Energy storage converter

Abstract

The invention relates to the technical field of energy storage, and discloses an energy storage converter. The energy storage converter comprises a box body, a liquid cooling plate and a circuit board assembly. The box body is provided with a containing cavity, a first opening and a second opening, the liquid cooling plate is arranged in the containing cavity, and a flow channel for cooling liquid to flow and a first cooling space and a second cooling space formed in the flow channel are formed in the liquid cooling plate. The liquid cooling plate is connected with a liquid inlet pipeline and a liquid outlet pipeline, one end of the liquid inlet pipeline communicates with the first end of the flow channel, and the other end of the liquid inlet pipeline penetrates out of the containing cavity from the first opening. One end of the liquid outlet pipeline communicates with the second end of the flow channel, and the other end of the liquid outlet pipeline penetrates out of the containing cavity from the second opening. The circuit board assembly is connected with the liquid cooling plate and located on one side of the liquid cooling plate. The circuit board assembly comprises a circuit board, and a first heating device and a second heating device which are electrically connected with the circuit board. According to the energy storage converter provided by the invention, the heat dissipation effect of the liquid cooling plate in the energy storage converter can be ensured.

Description

Technical Field

[0001] The present application relates to the field of energy storage technology, and in particular to an energy storage converter. Background Art

[0002] With the continuous development of new energy technologies, energy storage equipment is being used more and more widely. Energy storage equipment stores electrical energy through battery modules formed by battery cells and outputs it to the outside world when needed. In addition to battery modules, energy storage equipment also includes battery management devices, energy management devices, and energy storage inverters that cooperate with battery modules. Energy storage inverters can control the charging and discharging process of battery modules and are key components for realizing the two-way flow of electrical energy between energy storage equipment and the power grid.

[0003] Energy storage inverters include numerous electronic components, some of which generate heat during operation, causing the internal temperature of the energy storage inverter to rise. Usually, energy storage inverters are equipped with liquid cooling plates for heat dissipation. The heat dissipation effect of the liquid cooling plate affects the normal operation of the energy storage inverter. Therefore, how to ensure the heat dissipation effect of the liquid cooling plate in the energy storage inverter is an important issue. Summary of the invention

[0004] The purpose of the embodiments of the present application is to provide an energy storage converter, which can help ensure the heat dissipation effect of the liquid cooling plate in the energy storage converter.

[0005] In order to solve the above technical problems, an embodiment of the present application provides an energy storage converter. The energy storage converter includes a box, a liquid cooling plate and a circuit board assembly. The box has a receiving cavity, and a first opening and a second opening connected to the receiving cavity. The liquid cooling plate is arranged in the receiving cavity, and a flow channel for the flow of coolant is arranged in the liquid cooling plate, and a first cooling space and a second cooling space are formed on the flow channel. The liquid cooling plate is connected with a liquid inlet pipeline and a liquid outlet pipeline, one end of the liquid inlet pipeline is connected with the first end of the flow channel, and the other end of the liquid inlet pipeline passes through the receiving cavity from the first opening. One end of the liquid outlet pipeline is connected with the second end of the flow channel, and the other end of the liquid outlet pipeline passes through the receiving cavity from the second opening. The circuit board assembly is connected to the liquid cooling plate and is located on one side of the liquid cooling plate. The circuit board assembly includes a circuit board and a first heating device and a second heating device electrically connected to the circuit board, the first heating device is attached to the liquid cooling plate and faces the first cooling space, and the second heating device is attached to the liquid cooling plate and faces the second cooling space.

[0006] The energy storage inverter provided by the embodiment of the present application uses a liquid cooling plate in the box to perform liquid cooling on the circuit board assembly. The liquid cooling plate is provided with a flow channel inside, as well as cooling spaces corresponding to different electronic components. During the circulation of the coolant in the flow channel, it will pass through different cooling spaces in turn, thereby taking away the heat conducted to the surface of the liquid cooling plate from different electronic components and the entire circuit board assembly. By forming cooling spaces at different locations inside the liquid cooling plate, a wide space can be provided for the flow of coolant, thereby effectively taking away the heat conducted to the surface of the liquid cooling plate from the electronic components. This ensures the heat dissipation effect of the liquid cooling plate in the energy storage inverter.

[0007] In some embodiments, the liquid cooling plate includes a base plate and a cover plate, the base plate includes a flow channel area that is recessed from one side toward the other side to form a flow channel, forming a first area of ​​a first cooling space, and a second area of ​​a second cooling space, the cover plate is connected to the base plate and covers the flow channel area, the first area, and the second area, and the first heating device and the second heating device are attached to the cover plate.

[0008] In some embodiments, the area of ​​the first region is larger than that of the second region. In this way, the structural strength of the location of the first cooling space can be ensured by making the area of ​​the first region larger than that of the second region.

[0009] In some embodiments, there are multiple first heating devices, and the multiple first heating devices are attached to the liquid cooling plate in the same direction and face the same first cooling space. The first cooling space is provided with multiple shunt structures corresponding to the multiple first heating devices one by one, and the shunt structures are used to make the cooling liquid flow along the arrangement direction of the multiple first heating devices. In this way, by making the multiple first heating devices correspond to the same first cooling space, the heat dissipation effect of the first heating device with a larger volume can be ensured.

[0010] In some embodiments, the flow-dividing structure includes a plurality of ribs spaced apart from each other, each rib extending along the arrangement direction of the plurality of first heating devices, and the arrangement direction of the plurality of ribs being perpendicular to the arrangement direction of the plurality of first heating devices. In this way, the flow-dividing structure formed by the ribs can improve the structural strength of the first cooling space while guiding the coolant.

[0011] In some embodiments, there are multiple second heating devices and multiple second cooling spaces, and the multiple second heating devices are arranged in a one-to-one correspondence with the multiple second cooling spaces. In this way, each second heating device can be cooled by the independently arranged second cooling space, which can ensure the cooling effect of the second heating device with a smaller volume.

[0012] In some embodiments, a plurality of spoiler columns are disposed in each second cooling space, and the plurality of spoiler columns are distributed in an array in the second cooling space. In this way, the heat dissipation effect of the second heating element can be improved by disposing the spoiler columns.

[0013] In some embodiments, the plurality of second cooling spaces include a plurality of first subspaces and a plurality of second subspaces, the plurality of first subspaces and the plurality of second subspaces correspond to each other, and each first subspace is spaced apart from and connected to the corresponding second subspace. In this way, by arranging the plurality of second cooling spaces in groups, the flow channel structure can be simplified and the length of the flow path can be reduced.

[0014] In some embodiments, at least part of the plurality of first subspaces is in communication with the first cooling space. Thus, by making at least part of the first subspaces in communication with the first cooling space at the same time, different first subspaces can be connected in parallel in the flow channel structure.

[0015] In some embodiments, a separator is provided in the flow channel, the extension direction of the separator is the same as the extension direction of the flow channel, and the separator is provided with a notch facing the first cooling space or the second cooling space. In this way, the flow channel can be divided by the separator, thereby increasing the flow rate of the coolant in the flow channel.

[0016] In some embodiments, the box includes a first inner wall surface facing one side of the liquid cooling plate, and a second inner wall surface facing the other side of the liquid cooling plate, and there is a gap between the liquid cooling plate and the first inner wall surface and the second inner wall surface, and the liquid cooling plate is provided with a through hole that penetrates the liquid cooling plate in the thickness direction. In this way, by reserving a gap between the liquid cooling plate and the inner wall surface of the box, different spaces can be formed on both sides of the liquid cooling plate, and air convection-assisted heat dissipation can be achieved through the through holes.

[0017] In some embodiments, there are multiple through holes, and the multiple through holes are distributed between the first cooling space and the second cooling space. In this way, the air convection effect can be improved by increasing the number of through holes.

[0018] In some embodiments, the flow channel includes an inlet flow channel, an outlet flow channel, and a series flow channel, one end of the inlet flow channel is connected to the inlet pipeline, the other end of the inlet flow channel is connected to the first cooling space, one end of the outlet flow channel is connected to the outlet pipeline, the other end of the outlet flow channel is connected to the second cooling space, and the series flow channel connects the first cooling space and the second cooling space. In this way, a complete flow channel structure can be formed in the liquid cooling plate through different flow channels to ensure that the flow path of the coolant is complete.

[0019] In some embodiments, the liquid inlet channel and the liquid outlet channel are located on opposite sides of the first cooling space or the second cooling space. In this way, the influence between the liquid inlet end and the liquid outlet end can be reduced, and the space occupied can be reduced.

[0020] In some embodiments, the liquid cooling plate includes a first edge and a second edge that are arranged opposite to each other, a plurality of first heating devices are arranged along the first edge, and a liquid inlet pipeline and a liquid outlet pipeline are connected to the second edge. In this way, the liquid inlet pipeline and the liquid outlet pipeline can be centrally connected at the second edge, thereby optimizing the pipeline layout and improving the convenience of connection.

[0021] In some embodiments, the energy storage converter further includes a liquid detection component, which is disposed in the accommodating cavity and adjacent to the liquid inlet pipeline or the liquid outlet pipeline. In this way, liquid leakage in the accommodating cavity can be detected by the liquid detection component. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] One or more embodiments are exemplarily described by pictures in the corresponding drawings, and these exemplified descriptions do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings represent similar elements, and unless otherwise stated, the figures in the drawings do not constitute proportional limitations.

[0023] Figure 1 is a schematic diagram of the three-dimensional structure of an energy storage converter provided in some embodiments of the present application; Figure 2 is a schematic diagram of the internal structure of an energy storage converter provided in some embodiments of the present application; Figure 3 It is a schematic diagram of a partial assembly structure of a box in an energy storage converter provided in some embodiments of the present application; Figure 4 It is a schematic diagram of the coordination structure of the liquid cooling plate and the heating device in the energy storage converter provided in some embodiments of the present application; Figure 5 is a schematic diagram of the three-dimensional structure of a liquid cooling plate in an energy storage converter provided in some embodiments of the present application; Figure 6 is a schematic diagram of the three-dimensional structure of the bottom plate of the liquid cooling plate in the energy storage converter provided in some embodiments of the present application; Figure 7 is a schematic diagram of a top view of the bottom plate of a liquid cooling plate in an energy storage converter provided in some embodiments of the present application; Figure 8 is a schematic diagram of the three-dimensional structure of the bottom plate of the liquid cooling plate in the energy storage converter provided in some embodiments of the present application from another perspective; Fig. 9It is a schematic diagram of the bottom structure of the liquid cooling plate in the energy storage converter provided in some embodiments of the present application. DETAILED DESCRIPTION

[0024] To make the purpose, technical scheme and advantages of the embodiments of the present application clearer, each embodiment of the present application will be described in detail below in conjunction with the accompanying drawings. However, it will be appreciated by those skilled in the art that in each embodiment of the present application, many technical details are proposed in order to enable the reader to better understand the present application. However, even without these technical details and various changes and modifications based on the following embodiments, the technical scheme claimed in the present application can also be implemented. The division of the following embodiments is for the convenience of description, and the specific implementation of the present application should not constitute any limitation, and the various embodiments can be combined with each other and referenced to each other without contradiction.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" in the specification and claims of this application and the above-mentioned figure descriptions and any variations thereof are intended to cover non-exclusive inclusions.

[0026] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installed", "connected", "connected" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0027] As the amount of electricity generated by renewable energy continues to increase, the importance of energy storage is also increasing. Energy storage equipment uses battery cells as energy storage units to form an electrochemical energy storage system. The energy storage converter (PCS; Power Conversion System) is the part of the energy storage device that controls the AC / DC bidirectional conversion of the charging and discharging process, and is the core device of the energy storage device.

[0028] As the battery capacity of energy storage equipment continues to increase, the power of energy storage inverters is also getting higher and higher. During the operation of the energy storage inverter, the internal electrical components will also generate high heat, causing the internal temperature of the energy storage inverter to rise, affecting the normal operation of the energy storage inverter. The heat dissipation forms currently used in energy storage inverters mainly include air cooling and liquid cooling. Due to the low heat exchange efficiency of the air cooling form, the heat dissipation effect on the electronic components inside the energy storage inverter is limited, which is not conducive to controlling the temperature of electronic components with large heat generation. The liquid cooling form dissipates heat through a liquid cooling plate. A cooling medium circulates inside the liquid cooling plate, which can continuously take away the heat generated by the electronic components during the operation of the energy storage inverter. The liquid cooling plate can effectively improve the heat exchange efficiency. However, in the face of the numerous electronic components in the energy storage inverter, it is necessary to design a heat dissipation coordination form between the electronic components and the liquid cooling plate to ensure the heat dissipation effect of different electronic components.

[0029] In order to ensure the heat dissipation effect of the liquid cooling plate in the energy storage inverter, some embodiments of the present application provide an energy storage inverter. The liquid cooling plate in the energy storage inverter is designed with different cooling spaces for different electronic components. When the cooling medium circulates in the liquid cooling plate, it will spread in different cooling spaces. Electronic components with higher heat generation are arranged in the area corresponding to the cooling space in the liquid cooling plate, and the electronic components are in contact with the surface of the cooling space corresponding to the liquid cooling plate. The heat generated by the electronic components during operation can be promptly conducted to the cooling medium circulating in the liquid cooling plate. In this way, different electronic components can be effectively dissipated by the cooling medium circulating in the liquid cooling plate, thereby ensuring the heat dissipation effect of different electronic components.

[0030] Combine the following Figures 1 to 9 The structure of the energy storage converter provided in some embodiments of the present application is described.

[0031] like Figures 1 to 9As shown, the energy storage converter provided by some embodiments of the present application includes a housing 11, a liquid cooling plate 12 and a circuit board assembly 13. The housing 11 has a housing 101, and a first opening 102 and a second opening 103 communicating with the housing 101. The liquid cooling plate 12 is arranged in the housing 101, and a flow channel 121 for the flow of coolant, and a first cooling space 122 and a second cooling space 123 formed on the flow channel 121 are arranged in the liquid cooling plate 12. The liquid cooling plate 12 is connected with a liquid inlet pipeline 124 and a liquid outlet pipeline 125, one end of the liquid inlet pipeline 124 is communicated with the first end 1211 of the flow channel 121, and the other end of the liquid inlet pipeline 124 passes through the housing 101 from the first opening 102. One end of the liquid outlet pipeline 125 is communicated with the second end 1212 of the flow channel 121, and the other end of the liquid outlet pipeline 125 passes through the housing 101 from the second opening 103. The circuit board assembly 13 is connected to the liquid cooling plate 12 and is located on one side of the liquid cooling plate 12. The circuit board assembly 13 includes a circuit board 131 and a first heating device 132 and a second heating device 133 electrically connected to the circuit board 131. The first heating device 132 is attached to the liquid cooling plate 12 and faces the first cooling space 122. The second heating device 133 is attached to the liquid cooling plate 12 and faces the second cooling space 123.

[0032] The box body 11 forms a packaging shell of the energy storage inverter, which can protect the internal circuit board assembly 13. The box body 11 has a accommodating cavity 101 inside, which is used to provide an accommodating space for the circuit board assembly 13 that plays a control role. The first opening 102 and the second opening 103 provided on the box body 11 can provide an installation channel for the entry and outflow of the coolant. At the same time, a circuit interface can be provided on the box body 11 to connect the energy storage inverter to the circuit of the energy storage device. The box body 11 can adopt a split structure combining a bottom shell and a top cover, the bottom shell forms an inner cavity, and the top cover closes the opening on the top of the bottom shell. The box body 11 can also adopt an enclosed structure spliced ​​by plates, and the side walls of the box body 11 are Figure 3 The multiple strips 111 shown are connected end to end and are connected on both sides by Figure 3 The substrate 112 and Figure 1 The top cover 113 is shown to be spliced.

[0033] The liquid cooling plate 12 is a part that plays a role in heat dissipation in the energy storage inverter. The liquid cooling plate 12 can be installed in the accommodating cavity 101 of the box body 11. A plurality of through holes can be set on the liquid cooling plate 12, and it is fixed to the side wall of the box body 11 by fasteners. The liquid cooling plate 12 includes an installation side and a non-installation side that are relatively arranged, and the installation side has a flat installation surface, which can be used to install different electronic components. The liquid cooling plate 12 is provided with a mounting hole 1201, and the electronic components can be fixed at the position of the mounting hole 1201 by fasteners. The non-installation side of the liquid cooling plate 12 faces the bottom of the box body 11, and no electronic components are arranged. By concentrating a large number of electronic components on one side of the liquid cooling plate 12, the device integration can be ensured, which is conducive to the miniaturization of the energy storage inverter.

[0034] The liquid cooling plate 12 has a complete flow channel 121 and different cooling spaces formed on the flow channel 121. The cooling space is opposite to the area on the surface of the liquid cooling plate 12 where electronic components are arranged. The cooling space can be set to a regular shape such as a cuboid, a cylindrical shape or a prism shape, or it can be set to an irregular shape. The size of the projection area of ​​the cooling space on the surface of the liquid cooling plate 12 is consistent with the size of the projection area of ​​the heating device attached to the surface of the liquid cooling plate 12 on the surface of the liquid cooling plate 12, or the projection area of ​​the cooling space on the surface of the liquid cooling plate 12 is larger than the projection area of ​​the heating device attached to the surface of the liquid cooling plate 12 on the surface of the liquid cooling plate 12. For example, the first cooling space 122 is set corresponding to the inductor, so that the projection area of ​​the first cooling space 122 on the surface of the liquid cooling plate 12 is larger than the projection area of ​​the inductor on the surface of the liquid cooling plate 12. The second cooling space 123 is set corresponding to the IGBT power module, so that the projection area of ​​the second cooling space 123 on the surface of the liquid cooling plate 12 is larger than the projection area of ​​the IGBT power module on the surface of the liquid cooling plate 12.

[0035] After entering the flow channel 121, the coolant can flow through different cooling spaces in the liquid cooling plate 12. It can take away the heat generated by the electronic components during operation and flow out of the box body 11 along the complete passage. The complete passage of the coolant includes an inlet pipeline 124 and an outlet pipeline 125. The inlet pipeline 124 is used to introduce the external coolant into the box body 11. One end of the inlet pipeline 124 is connected to the first end 1211 of the flow channel 121, that is, the end where the coolant inlet in the liquid cooling plate 12 is located, and the other end of the inlet pipeline 124 passes through the first opening 102 to the outside of the accommodating cavity 101, forming an inlet channel for the coolant. The outlet pipeline 125 is used to guide the coolant flowing in the liquid cooling plate 12 out of the box body 11. One end of the liquid outlet pipeline 125 is connected to the second end 1212 of the flow channel 121, that is, the end where the coolant outlet is located in the liquid cooling plate 12, and the other end of the liquid outlet pipeline 125 passes through the second opening 103 to reach the outside of the accommodating cavity 101, forming a liquid outlet channel for the coolant. The coolant can be water, deionized water, propylene glycol aqueous solution, ethylene glycol aqueous solution, or other coolants.

[0036] The circuit board assembly 13 is the part of the energy storage converter that controls the charging and discharging process. The circuit board 131 in the circuit board assembly 13 is provided with a circuit that plays a control role, and the circuit board 131 is arranged with IGBT (Insulated Gate Bipolar Transistor) power module, capacitors, inductors and other electronic components. The circuit board assembly 13 is connected to the installation side of the liquid cooling plate 12, and at the same time, the electronic components with large heat generation are attached to the installation surface of the installation side of the liquid cooling plate 12. The first heating device 132 and the second heating device 133 are electronic components with large heat generation in the circuit board assembly 13, and the electronic components with large heat generation include inductors and IGBT power modules. The inductors and IGBT power modules are respectively arranged at the areas corresponding to the cooling space on the surface of the liquid cooling plate 12. The first heating device 132 and the second heating device 133 can be the same electronic components, or different electronic components. In actual situations, according to the positions of the IGBT power module and the inductor, the liquid cooling plate 12 is provided with a heat dissipation space large enough to accommodate the coolant under the surface mounted heat source. For example, each IGBT power module and inductor has a convex heat dissipation space under it, so that sufficient coolant can flow under each heat source.

[0037] The energy storage inverter provided in some embodiments of the present application uses a liquid cooling plate 12 in the housing 11 to perform liquid cooling on the circuit board assembly 13. A flow channel 121 and cooling spaces corresponding to different electronic components are provided inside the liquid cooling plate 12. During the circulation of the coolant in the flow channel 121, it will pass through different cooling spaces, thereby taking away the heat from different electronic components and the entire circuit board assembly 13 that is conducted to the surface of the liquid cooling plate 12. By forming cooling spaces at different locations inside the liquid cooling plate 12, a wide space can be provided for the coolant to flow and diffuse, thereby effectively taking away the heat from electronic components with higher heat generation that is conducted to the surface of the liquid cooling plate 12. This ensures the heat dissipation effect of the liquid cooling plate 12 in the energy storage inverter.

[0038] In some embodiments, the liquid cooling plate 12 may include a bottom plate 126 and a cover plate 127, the bottom plate 126 includes a flow channel region 1261 that is recessed from one side toward the other side to form the flow channel 121, a first region 1262 that forms the first cooling space 122, and a second region 1263 that forms the second cooling space 123. The cover plate 127 is connected to the bottom plate 126 and covers the flow channel region 1261, the first region 1262, and the second region 1263, and the first heating device 132 and the second heating device 133 are attached to the cover plate 127.

[0039] In other words, the liquid cooling plate 12 adopts a split structure. The bottom plate 126 is close to the bottom side of the liquid cooling plate 12, and the cover plate 127 is close to the top side of the liquid cooling plate 12. The flow channel 121 and the cooling space on the flow channel 121 are formed on the bottom plate 126. The bottom plate 126 is formed by being recessed from one side toward the other side to form the flow channel 121 for the coolant to flow, as well as cooling spaces of the same size or different sizes. The cover plate 127 can be connected to the bottom plate 126, and cover the flow channel 121 and the cooling space on the flow channel 121. In order to form a flow channel 121 and a cooling space isolated from the outside world.

[0040] By forming the liquid cooling plate 12 in the form of combining the bottom plate 126 with the cover plate 127, the structure of the liquid cooling plate 12 can be simplified, and at the same time, the production of the liquid cooling plate 12 can be facilitated. In actual situations, the bottom plate 126 and the cover plate 127 can be made of sheet metal parts of regular shapes such as square, rectangular or circular, or of irregular shapes. The recessed area on the bottom plate 126 can be formed by a stamping process. The bottom plate 126 and the cover plate 127 can be combined by welding to ensure the sealing of the flow channel 121 and the cooling space. In order to facilitate the installation of the liquid cooling plate 12, a folded edge 1264 can be formed at at least part of the edge around the bottom plate 126, and the folded edge 1264 can be overlapped on the side wall of the box body 11. At the same time, the liquid cooling plate 12 is fixed to the inside of the box body 11 by fasteners. The electronic components with high heat generation are fixed to the cover 127 by fasteners, and the circuit board 131 is fixed to the cover 127 by fasteners and is spaced apart from the surface of the cover 127 to provide space for the first heating device 132 and the second heating device 133 to be attached.

[0041] In addition, the area of ​​the first region 1262 on the bottom plate 126 may be made larger than the area of ​​the second region 1263 .

[0042] Setting areas of different areas for forming the cooling space can adapt to the installation and loading of different electronic components. The first area 1262 is the location where the first cooling space 122 is formed, which can correspond to the heat dissipation of the larger inductor. The second area 1263 is the location where the second cooling space 123 is formed, which can correspond to the heat dissipation of the smaller IGBT power module. By making the area of ​​the first area 1262 larger than the area of ​​the second area 1263, a convex hump with a larger area can be formed on the side of the bottom plate 126 away from the cover plate 127, so as to improve the structural strength of the first cooling space 122 and adapt to the fitting installation of the inductor.

[0043] like Figure 4 and Figure 6As shown, there may be multiple first heating devices 132, and the multiple first heating devices 132 are attached to the liquid cooling plate 12 along the same direction and face the same first cooling space 122. A plurality of shunt structures 128 corresponding to the multiple first heating devices 132 are arranged in the first cooling space 122, and the shunt structures 128 are used to make the coolant flow along the arrangement direction of the multiple first heating devices 132.

[0044] The first heating device 132 is an electronic component with a larger volume but lower heat generation than the second heating device 133. Multiple first heating devices 132 can be arranged corresponding to the same first cooling space 122. The partitions on the flow path of the coolant inside the liquid cooling plate 12 can be reduced, so that the coolant can pass through the installation positions corresponding to the multiple first heating devices 132 quickly and at a basically consistent speed. While the multiple first heating devices 132 are cooled, they will not encounter large resistance during the flow process.

[0045] In addition, a shunt structure 128 corresponding to the first heating device 132 is provided in the first cooling space 122. The area where each shunt structure 128 is located is opposite to the installation position of the corresponding first heating device 132. The shunt structure 128 can guide the flow of the coolant, and the coolant can flow along the arrangement direction of the plurality of first heating devices 132 under the action of the shunt structure 128. Thus, the coolant entering the first cooling space 122 can pass through the areas where different first heating devices 132 are located in sequence, and flow more smoothly in the first cooling space 122.

[0046] The flow-dividing structure 128 can be formed by a columnar structure distributed in a dotted manner, or by a convex structure extending in a straight line, or by a continuously distributed water drop-shaped structure. The flow-dividing structure 128 can be fixed in the cooling space, or movably arranged in the cooling space to change the position of the flow-dividing. The flow-dividing structure 128 can also adopt the same-size flow-dividing to achieve the flow-dividing effect with a constant flow velocity, or adopt the variable-size flow-dividing to achieve the flow-dividing effect with a changed flow velocity.

[0047] As for the formation method of the first cooling space 122 on the flow channel 121, it can be connected in series in the structure of the flow channel 121. Specifically, the first cooling space 122 can be connected to different parts of the flow channel 121 in various forms. Since the first cooling space 122 occupies a large area in the liquid cooling plate 12, one or more inlets can be set for the coolant to enter the first cooling space 122, and one or more outlets can be set for the coolant to flow out of the first cooling space 122. That is, the flow channel 121 can have a main channel to supply coolant to the first cooling space 122, and can also have multiple branch flow channels to synchronously supply coolant to the first cooling space 122. At the same time, the flow channel 121 can have a main channel to discharge the coolant in the first cooling space 122, and can also have multiple branch flow channels to synchronously discharge the coolant in the first cooling space 122. Figure 6 and Figure 7 1 shows a flow channel 121 in which the coolant enters from one side of the first cooling space 122 and is discharged from the other side. In actual situations, the coolant can also enter from the surroundings of the first cooling space 122 and be discharged from the center bottom of the first cooling space 122.

[0048] In some embodiments, the diversion structure 128 may include a plurality of ribs 1281 spaced apart from each other, each rib 1281 extending along the arrangement direction of the plurality of first heating devices 132 , and the arrangement direction of the plurality of ribs 1281 is perpendicular to the arrangement direction of the plurality of first heating devices 132 .

[0049] The ribs 1281 are protrudingly arranged in the first cooling space 122, and the multiple ribs 1281 can guide the coolant entering the first cooling space 122 to different flow paths. The ribs 1281 extend along the arrangement direction of the multiple first heating devices 132, so that the coolant can flow through the areas corresponding to different first heating devices 132 along the extension direction of the ribs 1281. At the same time, the arrangement direction of the multiple ribs 1281 is perpendicular to the arrangement direction of the multiple first heating devices 132, so that the coolant can form multiple flow paths after entering the first cooling space 122. The coolant on different flow paths can dissipate heat for the first heating device 132.

[0050] In actual situations, the rib 1281 may have a uniform thickness in the extension direction, or may be set to a variable thickness, that is, the rib 1281 may be set to have one end wider or narrower than the other end, or may be set to have two ends wider or narrower than the middle. At the same time, the cross-sectional shape of the rib 1281 may be set to a regular shape such as a square, rectangle, or trapezoid, or may be set to an irregular shape.

[0051] like Figure 4 and Figure 6As shown, there can be a plurality of second heating devices 133 and a plurality of second cooling spaces 123 , and the plurality of second heating devices 133 and the plurality of second cooling spaces 123 are arranged in a one-to-one correspondence.

[0052] That is to say, each second heating device 133 can be provided corresponding to a different second cooling space 123. By providing an independent second cooling space 123 for each second heating device 133, each second heating device 133 can be fully and effectively cooled. This is to adapt to the heat dissipation of the second heating device 133 with a larger heat output. The plurality of second cooling spaces 123 can be distributed in different areas of the same size, or in different areas of different sizes.

[0053] As for the formation method of the second cooling space 123 on the flow channel 121, it can be connected in series in the structure of the flow channel 121. Specifically, the second cooling space 123 can be connected to different parts of the flow channel 121 in various forms. Since the second cooling space 123 also occupies a large area in the liquid cooling plate 12, one or more inlets can be set for the coolant to enter the second cooling space 123, and one or more outlets can be set for the coolant to flow out of the second cooling space 123. That is, the flow channel 121 can have a main channel to supply coolant to the second cooling space 123, and can also have multiple branch flow channels to synchronously supply coolant to the second cooling space 123. At the same time, the flow channel 121 can have a main channel to discharge the coolant in the second cooling space 123, and can also have multiple branch flow channels to synchronously discharge the coolant in the second cooling space 123. Figure 6 and Figure 7 1 shows a flow channel 121 in which the coolant enters from one side of the second cooling space 123 and is discharged from the other side. In actual situations, the coolant can also enter from the surroundings of the second cooling space 123 and be discharged from the central bottom of the second cooling space 123.

[0054] In addition, the second cooling space 123 and the first cooling space 122 can be distributed on the same plane, and the same depth dimension can be set for different cooling spaces. The second cooling space 123 and the first cooling space 122 can also be distributed on different planes, and different depth dimensions can be set for different cooling spaces. For example, the second cooling space 123 can have a certain height difference with the first cooling space 122, and can be partially staggered with the first cooling space 122 in the thickness direction of the liquid cooling plate 12, or completely staggered with the first cooling space 122 in the thickness direction of the liquid cooling plate 12. The height difference between different cooling spaces can be used to enable the coolant to accelerate the flow speed with the help of gravity, thereby improving the heat dissipation effect.

[0055] like Figure 6 and Figure 7As shown, a plurality of spoiler columns 129 may be disposed in each second cooling space 123 , and the plurality of spoiler columns 129 are distributed in an array in the second cooling space 123 .

[0056] The spoiler column 129 can control the flow rate of the coolant in the second cooling space 123, so that the coolant can fully contact the inner wall surface of the part of the liquid cooling plate 12 corresponding to the second cooling space 123. The heat conducted to the liquid cooling plate 12 by the second heating device 133 can be taken away by the coolant entering the second cooling space 123. The number of spoiler columns 129 can be set to ten to twenty, distributed in an array in the second cooling space 123. After entering the second cooling space 123, the coolant passes through the spoiler effect of the spoiler column 129 and flows between different spoiler columns 129. Thereby controlling the flow rate of the coolant in the second cooling space 123, ensuring the heat dissipation effect of the second heating device 133. In actual situations, the spoiler column 129 can be set to a regular shape such as a cylinder, a prism or a pyramid, or it can be set to an irregular shape.

[0057] By setting the spoiler column 129 in the cooling space, the heat dissipation effect can be effectively improved. The spoiler column 129 can divert the coolant, forming a turbulent effect with a local flow rate acceleration in the cooling space, so that the heat conducted to the surface of the liquid cooling plate 12 can be quickly transferred to the coolant in the cooling space, thereby improving the heat exchange effect. At the same time, the setting of the spoiler column 129 can increase the contact surface area with the coolant, which is also conducive to improving the heat exchange effect.

[0058] In some embodiments, the plurality of second cooling spaces 123 may include a plurality of first subspaces 1231 and a plurality of second subspaces 1232 , the plurality of first subspaces 1231 and the plurality of second subspaces 1232 correspond one to one, and each first subspace 1231 is spaced apart from the corresponding second subspace 1232 and are interconnected.

[0059] The first subspace 1231 and the second subspace 1232 are respectively arranged corresponding to different second heating devices 133. The corresponding first subspace 1231 and the second subspace 1232 maintain a communication relationship and can be arranged in parallel on the complete coolant flow path. When the number of second heating devices 133 is large, the flow length of the coolant flow path can be simplified by grouping different subspaces in a corresponding manner. Some subspaces maintain a corresponding communication relationship, and under the diversion effect of the flow channel 121, they simultaneously receive the input of the coolant, and the coolant flows to the rear end of the coolant flow path at the same time.

[0060] In addition, at least part of the plurality of first subspaces 1231 is in communication with the first cooling space 122 .

[0061] By making at least part of the multiple first subspaces 1231 connected to the first cooling space 122, two or more first subspaces 1231 can simultaneously receive the coolant flowing out of the first cooling space 122. That is, part of the first subspaces 1231 can be arranged in parallel on the coolant flow path. So that the coolant can be diverted to the second cooling space 123 in different areas, reducing the flow path of the coolant. Ensure the heat dissipation effect of the coolant on the second heating device 133 located close to the coolant outlet. In actual situations, it is also possible to only connect in parallel the first subspace 1231 and the corresponding second subspace 1232, and connect multiple first subspaces 1231 in series in sequence on the coolant flow path.

[0062] like Figure 4 As shown, six second heating devices 133 are provided. Six second cooling spaces 123 corresponding to the second heating devices 133 are provided. The six second cooling spaces 123 can be divided into three groups, each group including a first subspace 1231 and a second subspace 1232. Two of the three groups of second cooling spaces 123 are concentrated in the middle area of ​​the liquid cooling plate 12, and the other group is arranged in an area away from the first cooling space 122. The two groups of second cooling spaces 123 located in the middle area of ​​the liquid cooling plate 12 are in a parallel relationship on the coolant flow path. Another group of second cooling spaces 123 is connected in series on the coolant flow path, and is connected to the first two groups of second cooling spaces 123. Adopting Figure 6 The arrangement of the flow channel 121 shown can simplify the structure of the flow channel 121, and the coolant can flow separately and dissipate heat for different second heating devices 133 after entering different second cooling spaces 123, thereby ensuring the overall flow rate of the coolant.

[0063] In some embodiments, a partition 14 may be disposed in the flow channel 121 . The extending direction of the partition 14 is the same as the extending direction of the flow channel 121 . The partition 14 is provided with a notch 141 facing the first cooling space 122 or the second cooling space 123 .

[0064] The partition 14 can separate the coolant in the flow channel 121 so that the coolant can flow along both sides of the partition 14. The flow rate of the coolant can be increased by reducing the cross-sectional area of ​​the flow channel 121. At the same time, the partition 14 is provided with a notch 141 at the position corresponding to different cooling spaces, which can provide a reserved discontinuous area for the coolant to flow toward the cooling space, so that the coolant flowing on the side of the partition 14 away from the cooling space can enter the cooling space. In addition, the position and size of the notch 141 can be set according to the diversion requirements of the coolant.

[0065] In addition, the separator 14 can also expand the welding surface between the cover plate 127 and the bottom plate 126 to improve the overall structural strength of the liquid cooling plate 12. The bottom plate 126 can be provided with a screw hole column 1202, and the screw hole column 1202 of the bottom plate 126 can be stamped synchronously with the cooling space. The screw hole column 1202 is used to set the screw hole to provide a basis for the connection of the fastener.

[0066] In some embodiments, the box body 11 includes a first inner wall surface facing one side surface of the liquid cooling plate 12, and a second inner wall surface facing the other side surface of the liquid cooling plate 12. There is a gap between the liquid cooling plate 12 and the first inner wall surface and the second inner wall surface, and the liquid cooling plate 12 is provided with a through hole 15 that penetrates the liquid cooling plate 12 in the thickness direction.

[0067] That is to say, there is a gap between the liquid cooling plate 12 and the inner surface of the box body 11 in the thickness direction, so that a certain space is formed on both sides of the liquid cooling plate 12. The space on the installation side of the liquid cooling plate 12 can be used to install the circuit board assembly 13, and the circuit board 131 can be fixed to the liquid cooling plate 12 by fasteners such as screws. The space on the non-installation side of the liquid cooling plate 12 forms a reserved area. During the circulation of the coolant in the liquid cooling plate 12, no electronic components are working on the non-installation side of the liquid cooling plate 12, so the temperature is relatively low. A cooling chamber with a lower temperature can be formed on the non-installation side of the liquid cooling plate 12, and an electrical chamber can be formed on the installation side of the liquid cooling plate 12. The through hole 15 can provide a channel for air convection on both sides of the liquid cooling plate 12. Through air convection, the temperature of the area where the circuit board assembly 13 is located can also be reduced, and the circuit board assembly 13 can be dissipated. The shape of the through hole 15 can be set to a regular shape such as a square, rectangle or circle, or it can be set to an irregular shape.

[0068] like Figure 5 As shown, there may be a plurality of through holes 15 , and the plurality of through holes 15 are distributed between the first cooling space 122 and the second cooling space 123 .

[0069] By increasing the number of through holes 15, the air convection effect on both sides of the liquid cooling plate 12 can be ensured, thereby improving the heat dissipation effect. Multiple through holes 15 can be arranged along the same direction to simplify the manufacturing process of the through holes 15. By centrally arranging multiple through holes 15 in the reserved area between different cooling spaces, it is possible to prevent the through holes 15 from affecting the manufacturing of the cooling space.

[0070] In some embodiments, the flow channel 121 may include a liquid inlet flow channel 1213, a liquid outlet flow channel 1214, and a series flow channel 1215. One end of the liquid inlet flow channel 1213 is connected to the liquid inlet pipeline 124, and the other end of the liquid inlet flow channel 1213 is connected to the first cooling space 122. One end of the liquid outlet flow channel 1214 is connected to the liquid outlet pipeline 125, and the other end of the liquid outlet flow channel 1214 is connected to the second cooling space 123. The series flow channel 1215 connects the first cooling space 122 with the second cooling space 123.

[0071] Different flow channels 121 can play different roles. The inlet flow channel 1213 can be used as the inflow part of the coolant, so that the coolant can flow from the inlet pipeline 124 into the cooling space. The outlet flow channel 1214 can be used as the outflow part of the coolant, so that the coolant can flow from the cooling space to the outlet pipeline 125. The series flow channel 1215 can be connected in series between different cooling spaces, so that the coolant can flow through different cooling spaces in sequence. Thus, a complete series flow channel is formed in the liquid cooling plate 12, simplifying the flow path of the coolant.

[0072] In actual situations, the liquid inlet channel 1213 and the liquid outlet channel 1214 may be located on opposite sides of the first cooling space 122 or the second cooling space 123 .

[0073] That is, the liquid inlet and the liquid outlet of the flow channel 121 are separately arranged on both sides of the cooling space, which can reduce the mutual influence between the coolant flowing in the liquid inlet flow channel 1213 and the coolant flowing in the liquid outlet flow channel 1214. In addition, the liquid cooling plate 12 may include a first edge and a second edge that are arranged opposite to each other, a plurality of first heating devices 132 are arranged along the first edge, and the liquid inlet pipeline 124 and the liquid outlet pipeline 125 are connected to the second edge.

[0074] The liquid cooling plate 12 can be used to arrange different components near different edges. For the first heating device 132 with a larger volume, it can be arranged along the first edge. That is, the first cooling space 122 with a larger occupied area is arranged along the position close to the edge, which can help improve the space utilization of the liquid cooling plate 12. At the same time, the liquid inlet pipeline 124 and the liquid outlet pipeline 125 are connected to the second edge, which can realize the centralized arrangement of the liquid inlet pipeline 124 and the liquid outlet pipeline 125. It is beneficial to improve the integration of components and facilitate the connection of different components.

[0075] In some embodiments, the energy storage converter may further include a liquid detection component 104 , which is disposed in the accommodating cavity 101 and adjacent to the liquid inlet pipeline 124 or the liquid outlet pipeline 125 .

[0076] By arranging the liquid detection component 104 at the position where the coolant enters the liquid cooling plate 12 or flows out from the liquid cooling plate 12, the position where the liquid cooling plate 12 is prone to leakage can be detected. When leakage occurs, the leakage situation in the liquid cooling plate 12 can be promptly known. Thus, when leakage occurs, timely processing can be carried out to protect the electronic components in the box 11.

[0077] In actual situations, the liquid cooling plate assembly is a key component in the heat dissipation system of the liquid-cooled PCS, and the liquid cooling plate assembly accounts for 85% to 90% of the cost of the heat dissipation system of the liquid-cooled PCS. By improving the design and processing technology of the liquid cooling plate assembly, the cost of the heat dissipation system of the liquid-cooled PCS can be reduced. At present, the liquid cooling plate assembly is made by first performing separate CNC (Computer Numerical Control) processing on the upper cover plate and the lower bottom plate of the cold plate, and then processing by welding. The upper cover plate, the lower bottom plate of the cold plate, and the internal flow channel and heat dissipation fins are also formed by CNC milling of aluminum ingots, which wastes both materials and working hours. This leads to low production efficiency and high cost of liquid cooling plates. In response to the problem of high cost of liquid cooling plates of existing liquid-cooled PCS, some embodiments of the present application design and process liquid cooling plates by stamping and welding of sheet metal parts. This design and processing scheme has many advantages. For example, the wall thickness of the stamped parts is uniform, the weight is lower than that of aluminum ingot milling, and the processing efficiency of stamping is 95% higher than that of aluminum ingot milling. In addition, the stamped liquid cooling plate has a larger gas-liquid heat exchange area, a higher heat exchange effect, and a higher heat dissipation efficiency than the traditional aluminum milling liquid cooling plate.

[0078] Specifically, the upper cover of the liquid cooling plate can be made of a flat aluminum plate with a length of 629.8mm, a width of 629.5mm, and a thickness of 2mm. The upper cover mainly carries the power board, that is, the circuit board and the inductor. Because the IGBT power module and the inductor have high requirements for installation flatness, the upper cover of the liquid cooling plate is made of 2mm aluminum plate. The holes in the upper part of the upper cover correspond to the installation holes of the inductor, and the holes in the lower part correspond to the installation holes of the IGBT power module. Figure 4 As shown, three inductors are installed in the upper part of the liquid cooling plate, and six IGBT power modules are installed in the lower part. The bottom plate of the liquid cooling plate is made of a stamped aluminum plate with a length of 629.75mm, a width of 629.5mm, and a thickness of 26mm. The inlet and outlet nozzles are welded on the bottom plate of the liquid cooling plate.

[0079] The upper cover of the liquid cooling plate has high requirements for flatness, and can be formed by direct punching or laser punching of aluminum plates. The lower base plate of the liquid cooling plate is mainly used to process the flow channel that carries the coolant, and can be directly stamped by aluminum plates. The flow channel can be stamped according to a V-groove or a semicircular groove. In order to facilitate demolding, the draft angle of the V-groove stamping of the lower base plate can be greater than 5°. According to the actual flow rate and structural size restrictions, the draft angle of the V-groove stamping of the lower base plate can be designed to be 10°, and the depth direction of the flow channel is 26mm. According to the requirements for coolant flow in the PCS's own cooling requirements and the requirements for system interface consistency, the water inlet 105 and the water outlet 106 can be selected as standard water nozzles with a diameter of 22mm and an inner diameter of 14mm. To reduce material waste rate, improve production efficiency, and save processing costs. Reduce the weight of the liquid cooling plate assembly and save transportation costs. Increase the heat dissipation surface of the outer surface of the liquid cooling plate assembly to improve heat dissipation efficiency.

[0080] Welding is a core process in the entire liquid cooling plate assembly processing. Poor welding is very likely to cause leakage, resulting in reduced product life or scrapping. The welding process involves the reliability and safety of the liquid cooling plate assembly. Therefore, the coolant flow channel in the liquid cooling plate is designed in series, and the cross-sectional shape of each part of the flow channel except the cooling space is as simple as possible without sudden changes in area.

[0081] The electrical components are installed on one side above the liquid cooling channel of the liquid cooling plate, which is called the electrical compartment. All electrical components are installed on the surface of the upper cover of the liquid cooling plate. Since the heat-generating components have high requirements for heat dissipation, the heat-generating components are placed close to the surface of the liquid cooling plate. The upper cover of the liquid cooling plate needs to have a certain flatness. Since stamping will have a rebound force that affects the flatness, sheet metal stamping can be performed only on the bottom plate of the liquid cooling plate.

[0082] There is no heating device arranged on the side below the liquid cooling channel of the liquid cooling plate, which is called the cooling bin. A leakage detector and a drain hole can be designed. The leakage detector can be a point leakage sensor or a strip leakage sensor. Leakage detection can be achieved by electrical principles such as resistance or capacitance, or by optical principles. The leakage detector is placed outside the liquid cooling channel, in the cooling bin, and is connected to the control circuit in the electrical bin through a communication line. The drain port is located near the water inlet and outlet of the lower bottom plate of the liquid cooling channel. Under normal circumstances, the drain port is locked with bolts. When the leakage detector sounds an alarm, loosen the bolts to drain the liquid.

[0083] The liquid cooling plate is designed with different cooling spaces according to the heat dissipation requirements of different areas. The heat dissipation area of ​​the liquid cooling plate includes the inductor area and the IGBT power module area. The IGBT power module heats up quickly and concentratedly, and the flow and velocity of the coolant flowing through the 6 IGBT power modules need to be strictly controlled. Because the IGBT power module has high requirements for temperature uniformity, a spoiler column is added in the cooling space of the IGBT power module to control the flow and velocity of this area, ensuring that the 6 IGBT power modules have approximately the same volume of coolant flow and velocity.

[0084] The three inductors generate a lot of heat, but their own heat dissipation area is also large, so the overall temperature rise is not fast, and the temperature uniformity requirement is not high. The main concern is how to quickly remove the heat generated by the inductor to avoid excessive heat accumulation and affect the operation of other surrounding electrical components. Therefore, a guide groove is reserved under the liquid cooling plate cover under the inductor to facilitate the coolant to flow through the area quickly. At the same time, in order to remove the heat of the inductor, the convex bulge of the liquid cooling plate cover under the inductor is made large enough to accommodate enough coolant. In this way, the coolant under the inductor can maintain a large flow and high flow rate.

[0085] During the operation of the liquid cooling plate, the coolant can be adjusted dynamically. That is, the flow rate and flow rate of the coolant can be adjusted by detecting the temperature rise of the IGBT power module and the inductor area. Specifically, in the initial startup stage of the PCS, the temperature of the electrical compartment area is low, and the flow rate and flow velocity of the coolant are very low or even 0. When the PCS runs stably, usually when the temperature of the detection area reaches 50℃-55℃ (degrees Celsius), the flow rate and flow rate of the coolant in the flow channel reach the rated value. When the temperature of the detection area exceeds 65℃, the flow rate and flow velocity of the coolant are controlled to reach 1.1 times the excess output. When the temperature of the detection area exceeds 75℃, an early warning will appear, the equipment will begin to derate, and the heat generation of the equipment itself will begin to decrease until the temperature reaches 50℃-55℃.

[0086] Those skilled in the art will appreciate that the above-mentioned embodiments are specific examples for implementing the present application, and in actual applications, various changes may be made thereto in form and detail without departing from the spirit and scope of the present application.

Claims

1. An energy storage converter, characterized in that: include: The box body has a containing cavity, and a first opening and a second opening communicating with the containing cavity; A liquid cooling plate is arranged in the accommodating cavity, wherein a flow channel for cooling liquid to flow is arranged in the liquid cooling plate, and a first cooling space and a second cooling space are formed on the flow channel, and the liquid cooling plate is connected with a liquid inlet pipeline and a liquid outlet pipeline, wherein one end of the liquid inlet pipeline is communicated with the first end of the flow channel, and the other end of the liquid inlet pipeline passes through the accommodating cavity from the first opening, and one end of the liquid outlet pipeline is communicated with the second end of the flow channel, and the other end of the liquid outlet pipeline passes through the accommodating cavity from the second opening; A circuit board assembly is connected to the liquid cooling plate and is located on one side of the liquid cooling plate. The circuit board assembly includes a circuit board and a first heating device and a second heating device electrically connected to the circuit board. The first heating device is attached to the liquid cooling plate and faces the first cooling space. The second heating device is attached to the liquid cooling plate and faces the second cooling space.

2. The energy storage converter according to claim 1, characterized in that: The liquid cooling plate includes a base plate and a cover plate, the base plate includes a flow channel area that is recessed from one side toward the other side to form the flow channel, forming a first area of ​​the first cooling space, and a second area of ​​the second cooling space, the cover plate is connected to the base plate and covers the flow channel area, the first area and the second area, and the first heating device and the second heating device are attached to the cover plate.

3. The energy storage converter according to claim 2, characterized in that: The area of ​​the first region is greater than the area of ​​the second region.

4. The energy storage converter according to claim 1, characterized in that: There are multiple first heating devices, and the multiple first heating devices are arranged on the liquid cooling plate along the same direction and face the same first cooling space. The first cooling space is provided with multiple diversion structures corresponding to the multiple first heating devices one by one, and the diversion structures are used to make the cooling liquid flow along the arrangement direction of the multiple first heating devices.

5. The energy storage converter according to claim 4, characterized in that: The diversion structure includes a plurality of ribs spaced apart from each other, each of the ribs extending along an arrangement direction of the plurality of first heating elements, and an arrangement direction of the plurality of ribs being perpendicular to an arrangement direction of the plurality of first heating elements.

6. The energy storage converter according to claim 1, characterized in that: There are a plurality of the second heating devices and a plurality of the second cooling spaces, and the plurality of the second heating devices and the plurality of the second cooling spaces are arranged in a one-to-one correspondence.

7. The energy storage converter according to claim 6, characterized in that: A plurality of spoiler columns are arranged in each of the second cooling spaces, and the spoiler columns are distributed in an array in the second cooling space.

8. The energy storage converter according to claim 6, characterized in that: The plurality of second cooling spaces include a plurality of first subspaces and a plurality of second subspaces. The plurality of first subspaces and the plurality of second subspaces correspond to each other one by one. Each of the first subspaces is spaced apart from the corresponding second subspace and are connected to each other.

9. The energy storage converter according to claim 8, characterized in that: At least part of the plurality of first subspaces is in communication with the first cooling space.

10. The energy storage converter according to claim 1, characterized in that: A partition is arranged in the flow channel, the extension direction of the partition is the same as the extension direction of the flow channel, and the partition is provided with a notch facing the first cooling space or the second cooling space.

11. The energy storage converter according to claim 1, characterized in that: The box body includes a first inner wall surface facing one side surface of the liquid cooling plate, and a second inner wall surface facing the other side surface of the liquid cooling plate. There is a gap between the liquid cooling plate and the first inner wall surface and the second inner wall surface. The liquid cooling plate is provided with a through hole that penetrates the liquid cooling plate in the thickness direction.

12. The energy storage converter according to claim 11, characterized in that: There are a plurality of through holes, and the plurality of through holes are distributed between the first cooling space and the second cooling space.

13. The energy storage converter according to claim 1, characterized in that: The flow channel includes a liquid inlet flow channel, a liquid outlet flow channel, and a series flow channel. One end of the liquid inlet flow channel is connected to the liquid inlet pipeline, and the other end of the liquid inlet flow channel is connected to the first cooling space. One end of the liquid outlet flow channel is connected to the liquid outlet pipeline, and the other end of the liquid outlet flow channel is connected to the second cooling space. The series flow channel connects the first cooling space and the second cooling space.

14. The energy storage converter according to claim 13, characterized in that: The liquid inlet channel and the liquid outlet channel are located at two opposite sides of the first cooling space or the second cooling space.

15. The energy storage converter according to claim 1, characterized in that: The liquid cooling plate includes a first edge and a second edge that are arranged opposite to each other, a plurality of the first heating devices are arranged along the first edge, and the liquid inlet pipeline and the liquid outlet pipeline are connected to the second edge.

16. The energy storage converter according to claim 1, characterized in that: It also includes a liquid detection component, which is arranged in the accommodating cavity and adjacent to the liquid inlet pipeline or the liquid outlet pipeline.

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